Method for removing adhesive member, method for regenerating polishing pad using same, and polishing pad manufactured using method for regenerating polishing pad

Abstract

The adhesive member removal method of the present application may comprise the steps of: providing an adhesive member attached to a pad member and composed of an adhesive and a film member; and chemically removing the adhesive member from the pad member. The adhesive member may comprise a double-sided tape, and the double-sided tape is formed by applying the adhesive to both surfaces of the film member. The process of removing the adhesive of the adhesive member may include immersing the pad member in an organic solvent to place the film member in a state in which the film member can be easily removed from the pad member.

Description

Technical Field

[0001] The present application relates to a method for regenerating a worn polishing pad, and more particularly, to a method for chemically removing an adhesive member from a pad member of a polishing pad, a method for regenerating a polishing pad using the same, and a polishing pad manufactured using the method for regenerating a polishing pad. Background Art

[0002] Generally, semiconductor devices can be manufactured through processes such as exposure, etching, diffusion, and deposition. At this time, when the deposition process and the etching process are repeatedly performed on a wafer, a topological structure appears on the wafer surface, and this surface topological structure (non-uniformity of film thickness) can cause process defects during the photolithography process, making it difficult to perform subsequent processes. Therefore, there is a problem of reduced production yield of the device.

[0003] As the number of layers stacked on the wafer increases, the topological structure on the wafer surface gradually deepens, making the above problems more serious. Therefore, in order to prevent process defects and facilitate subsequent processes, it is necessary to perform a planarization process on the wafer surface having a topological structure to planarize the wafer surface.

[0004] One of the planarization processes for planarizing the wafer surface is the Chemical Mechanical Polishing (CMP) process. The above CMP process is a process for planarizing the wafer surface chemically and mechanically using a polishing pad and a slurry. In a state where the surface of the polishing pad attached to the platen is in contact with the surface of the wafer to be polished, while chemically polishing the wafer surface by supplying the slurry, mechanical polishing is performed through the polishing pad, thereby enabling the wafer surface to be planarized.

[0005] Generally, the polishing pad is formed with grooves of various shapes on the surface (for example, the polishing surface) in contact with the surface of the wafer to be polished, so as to easily remove reaction products generated between the film chemically etched by the slurry during the CMP process. As the CMP process progresses, not only the slurry supplied to the polishing pad adheres in the above grooves, but also polishing residues such as reaction products accumulate. These polishing residues can cause scratches on the surface of the semiconductor wafer to be polished during the CMP process, resulting in defects and thus reducing the production yield.

[0006] In addition, as the CMP process is repeated, the polishing pad is worn, the pad thickness gradually decreases, and the groove depth of the polishing pad also gradually decreases. When the depth of the above grooves is less than a set standard depth, the grooves are partially damaged, resulting in a problem of reduced polishing efficiency of the polishing pad. Due to these problems, the damaged polishing pad is discarded.

[0007] At present, in the CMP process, the usage of polishing pads is increasing continuously, while the worn polishing pads are discarded without being reused. Therefore, a regeneration technology for worn polishing pads is required. In order to regenerate worn polishing pads, it is necessary to first remove the bonding member from the pad member of the worn polishing pad.

[0008] In the past, the bonding member was physically removed from the above-mentioned pad member. For example, when a jig was used to remove the bonding member, surface roughness occurred on the bonding member, resulting in deterioration of surface uniformity. Due to the surface roughness of the bonding member, there is a problem that it is difficult to regenerate worn polishing pads. In addition, when the bonding member is physically removed, the pad member is damaged, so the worn polishing pad must be discarded. Summary of the Invention

[0009] Technical Problem

[0010] This application is developed to solve the above problems, and its purpose is to provide a method for easily removing the bonding member without damaging the pad member, a polishing pad regeneration method using this method, and a polishing pad manufactured using this polishing pad regeneration method.

[0011] In addition, another object of this application is to provide a method for removing the bonding member, a polishing pad regeneration method using this method, and a polishing pad manufactured using this polishing pad regeneration method, which can chemically remove the bonding member from the pad member by using an organic solvent, thereby preventing damage to the polishing pad and increasing the reuse rate of the polishing pad.

[0012] In addition, another object of this application is to provide a method for removing the bonding member, which can easily remove the above-mentioned bonding member from the pad member without causing damage by using an organic solvent when the depth of the groove becomes lower than the standard depth capable of performing the CMP process due to continuous CMP processes, so as to be able to re-groove the pad member.

[0013] In addition, another object of this application is to provide a polishing pad regeneration method and a polishing pad manufactured using the same, which re-groove the pad member from which the bonding member has been removed by using the method of removing the bonding member with an organic solvent, so as to re-form grooves with a depth capable of polishing on the above-mentioned pad member, thereby extending the service life of the polishing pad.

[0014] In addition, another object of the present application is to provide a polishing pad regeneration method and a polishing pad manufactured using the same, which can extend the reuse rate and service life of the polishing pad by attaching an auxiliary pad member to a pad member from which an adhesive member has been removed by impregnation with an organic solvent to supplement the thickness of the pad member when the worn polishing pad due to the continuous CMP process has a thickness such that a groove deeper than a standard depth capable of performing the CMP process cannot be formed any more, and then forming a groove having a standard depth capable of performing CMP.

[0015] Solution to the problem

[0016] To achieve the above object, the present application provides a method for removing an adhesive member, which includes the following steps: providing an adhesive member attached to a pad member and composed of an adhesive and a film member; and chemically removing the adhesive member from the pad member.

[0017] The adhesive member may include a double-sided tape formed by coating the adhesive on both surfaces of the film member. The adhesive may include a polyacrylic acid-based adhesive or an epoxy-based material, and the film member may include a polyethylene-based film.

[0018] The step of removing the adhesive member may include immersing the pad member in an organic solvent at room temperature for 1 minute to 5 minutes. The organic solvent may be composed of two polar organic solvents, one non-polar organic solvent, and a nonionic surfactant. The contents of the two polar organic solvents may be 10% by weight to 30% by weight and 50% by weight to 80% by weight, respectively, the content of the non-polar organic solvent may be 1% by weight to 20% by weight, and the content of the nonionic surfactant may be 0.1% by weight to 1% by weight.

[0019] The step of removing the adhesive member may include immersing the pad member in the organic solvent such that the adhesive of the adhesive member is substantially completely removed and the film member of the adhesive member is separated from the pad member.

[0020] The step of removing the adhesive member may include the following steps: immersing the pad member in the organic solvent to partially remove the adhesive of the film member such that the film member is in a state where it can be easily removed from the pad member; and physically separating the film member from the pad member. The step of physically separating the film member may include physically separating the film member using a jig or physically separating the film member by a cutting method using a skiving device.

[0021] The steps of removing the above-mentioned bonding member may include the following steps: immersing the above-mentioned pad member in the above-mentioned organic solvent so that the adhesive of the above-mentioned bonding member is removed only from the edge portion of the above-mentioned pad member; and physically separating the above-mentioned film member from the above-mentioned pad member using a jig.

[0022] After removing the above-mentioned bonding member by immersing the above-mentioned pad member in an organic solvent, the above-mentioned bonding member removing method may further include a step of further immersing the above-mentioned pad member in an organic solvent to remove the adhesive remaining on the surface of the above-mentioned pad member from which the above-mentioned bonding member has been removed.

[0023] After removing the above-mentioned bonding member from the above-mentioned pad member, the above-mentioned bonding member removing method may further include a step of cleaning the above-mentioned pad member from which the above-mentioned bonding member has been removed. The above-mentioned cleaning step may be performed by using at least one of a physical cleaning method, a dry cleaning method, and a wet cleaning method.

[0024] The above-mentioned physical cleaning method may include brush scrubbing cleaning, the above-mentioned dry cleaning method may include blowing cleaning, tornado cleaning, or plasma cleaning, and the above-mentioned wet cleaning method may include water jet cleaning, jet cleaning, bubble jet cleaning, ultrasonic cleaning, or megasonic cleaning.

[0025] In addition, in a polishing pad regeneration method of the present application, the above-mentioned polishing pad is a worn polishing pad including a pad member and a bonding member, a plurality of grooves having a depth less than or equal to a standard depth capable of performing a polishing process are formed on one surface of the above-mentioned pad member, the above-mentioned bonding member is attached to the other surface of the above-mentioned pad member and is composed of an adhesive and a film member, and the above-mentioned polishing pad regeneration method may include the following steps: chemically removing the above-mentioned bonding member from the above-mentioned pad member; removing a damaged portion on the upper surface of the above-mentioned pad member; determining whether the thickness of the above-mentioned pad member is a thickness capable of reforming grooves having a depth greater than or equal to the above-mentioned standard depth; reforming grooves on the upper surface of the above-mentioned pad member according to the above-mentioned determination result; and attaching a new bonding member to the lower surface of the above-mentioned pad member on which the above-mentioned grooves are formed.

[0026] The above-mentioned adhesive may include a polyacrylic acid-based adhesive or an epoxy-based material, and the above-mentioned film member may include a polyethylene-based film. The above-mentioned bonding member may include a double-sided tape, and the double-sided tape is formed by coating the above-mentioned adhesive on both surfaces of the above-mentioned film member.

[0027] The above-mentioned organic solvent may be composed of two polar organic solvents, one non-polar organic solvent, and a nonionic surfactant. The contents of the two polar organic solvents may be 10% by weight to 30% by weight and 50% by weight to 80% by weight, respectively, the content of the non-polar organic solvent may be 1% by weight to 20% by weight, and the content of the nonionic surfactant may be 0.1% by weight to 1% by weight.

[0028] The step of removing the above-mentioned adhesive member may include immersing the above-mentioned pad member in an organic solvent at room temperature for 1 minute to 5 minutes.

[0029] The step of removing the above-mentioned adhesive member may include immersing the above-mentioned pad member in the above-mentioned organic solvent so that the adhesive of the above-mentioned adhesive member is actually completely removed and the film member of the above-mentioned adhesive member is separated from the above-mentioned pad member.

[0030] The step of removing the above-mentioned adhesive member may include the following steps: immersing the above-mentioned pad member in the above-mentioned organic solvent to partially remove the adhesive of the above-mentioned film member so that the above-mentioned film member is in a state where it can be easily removed from the above-mentioned pad member; and physically separating the above-mentioned film member from the above-mentioned pad member. The step of physically separating the above-mentioned film member may include physically separating the above-mentioned film member from the above-mentioned pad member using a jig or physically separating the above-mentioned film member by a cutting method using a cutting device.

[0031] The step of removing the above-mentioned adhesive member may include the following steps: immersing the above-mentioned pad member in the above-mentioned organic solvent so that the adhesive of the above-mentioned adhesive member is removed only from the edge portion of the above-mentioned pad member; and physically separating the above-mentioned film member from the above-mentioned pad member using a jig.

[0032] After the step of removing the above-mentioned adhesive member by immersing the above-mentioned pad member in an organic solvent, the step of removing the adhesive member may further include immersing the above-mentioned pad member in an organic solvent to remove the adhesive remaining on the surface of the above-mentioned pad member from which the above-mentioned adhesive member has been removed.

[0033] The step of removing the damaged portion of the above-mentioned pad member may include removing the damaged portion of the above-mentioned pad member in a manner that retains a part of the above-mentioned groove or removing the damaged portion of the above-mentioned pad member in a manner that completely removes the above-mentioned groove.

[0034] In the above-mentioned determination step, if the thickness of the above-mentioned pad member is a thickness that can re-form a groove with a depth greater than or equal to the above-mentioned standard depth, then in the above-mentioned step of re-forming the groove, a re-grooving operation is performed on the upper surface of the above-mentioned pad member from which the above-mentioned damaged portion has been removed to form a groove with a depth greater than or equal to the standard depth in the above-mentioned pad member.

[0035] In the above determination step, if the thickness of the above cushion member is not a thickness capable of reforming a groove with a depth greater than or equal to the above standard depth, the above step of reforming the groove may include the following steps: attaching an auxiliary cushion member to the other surface of the above cushion member from which the above adhesive member has been removed to supplement the thickness of the above cushion member; and performing a surface re-grooving operation on the upper surface of the above cushion member from which the above damaged portion has been removed to form a groove with a depth greater than or equal to the standard depth in the above cushion member.

[0036] The above cushion member may be made of a polyurethane-based material, and the above auxiliary cushion member may be made of a polyurethane-based material having a recovery coefficient characteristic the same as or similar to that of the above cushion member.

[0037] The above polishing pad regeneration method may further include a step of performing a cleaning process before and after removing the above adhesive member to remove foreign matters accumulated on the upper surface of the cushion member of the above worn polishing pad and in the above groove. The above cleaning process may be performed by using at least one of a physical cleaning method, a dry cleaning method, and a wet cleaning method.

[0038] The above polishing pad regeneration method may further include the following steps: performing a cleaning process before and after removing the above adhesive member to remove foreign matters accumulated on the upper surface of the cushion member of the above worn polishing pad and in the above groove; and removing the above film member from the above cushion member and then performing a cleaning process on the above cushion member to remove process residues of the above adhesive member.

[0039] For the upper surface and the groove of the above cushion member, a cleaning process for removing the above foreign matters may be performed first, and then a cleaning process for removing the process residues of the above adhesive member may be performed, or, for the upper surface and the groove of the above cushion member, a cleaning process for removing the process residues of the above adhesive member may be performed first, and then a cleaning process for removing the above foreign matters may be performed. In addition, a cleaning process for removing the above foreign matters and a cleaning process for removing the process residues of the above adhesive member may be performed simultaneously on the upper surface and the groove of the above cushion member. The above cleaning process may be performed by using at least one of a physical cleaning method, a dry cleaning method, and a wet cleaning method, and the same cleaning method or different cleaning methods may be used.

[0040] The above polishing pad regeneration method may further include the following steps: performing a cleaning process before and after removing the above-mentioned adhesive member to remove foreign substances accumulated on the upper surface of the pad member of the worn polishing pad and in the above-mentioned grooves; removing the above-mentioned film member from the pad member, and then performing a cleaning process on the pad member to remove the process residues of the above-mentioned adhesive member; removing the damaged part of the pad member, and then performing a cleaning process on the pad member; and reforming grooves on the upper surface of the pad member, and then performing a cleaning process on the pad member. The above-mentioned cleaning processes may be performed sequentially or simultaneously at one time. The above-mentioned cleaning process may be performed by using at least one of a physical cleaning method, a dry cleaning method, and a wet cleaning method, and the same or different cleaning methods may be used.

[0041] In addition, the present application provides a polishing pad regenerated by the above-mentioned adhesive member removal method and a polishing pad regeneration method using the same.

[0042] Effects of the Invention

[0043] As described above, according to this embodiment, the adhesive member composed of a double-sided adhesive can be easily chemically removed from the pad member, so damage to the polishing pad caused by the removal of the adhesive member can be prevented. Therefore, the reuse rate of the worn polishing pad can be increased.

[0044] In addition, if the depth of the groove becomes lower than the standard depth capable of performing the CMP process due to the continuous progress of the CMP process, the adhesive member is removed from the pad member using an organic solvent, and then a part of the upper surface of the pad member or the entire damaged groove is removed, and the pad member is re-grooved so that a groove with a standard depth can be formed in the pad member. Therefore, since the expensive polishing pad can be reused instead of being discarded, the service life of the polishing pad can be extended.

[0045] On the other hand, when the thickness of the pad member becomes too thin to form a groove with a standard depth, the adhesive member is removed from the pad member using an organic solvent, and then the thickness capable of forming a groove is ensured by attaching an auxiliary pad member to the pad member, and the pad member is re-grooved so that a groove with a standard depth can be formed in the pad member. Therefore, the expensive polishing pad can be reused, thereby extending the service life of the polishing pad. Brief Description of the Drawings

[0046] Figure 1 is a schematic perspective view of a CMP apparatus as a semiconductor manufacturing apparatus according to an embodiment of the present application.

[0047] Figure 2a and Figure 2bShows an example of the cross-sectional structure of a polishing pad used in a CMP process before and after use according to an embodiment of the present application.

[0048] Figures 3a to 3g Is a cross-sectional view showing a method for regenerating a polishing pad used in a CMP process according to an embodiment of the present application.

[0049] Figures 4a to 4h Is a cross-sectional view showing a method for regenerating a polishing pad used in a CMP process according to another embodiment of the present application.

[0050] Figure 5 Is a flowchart showing a method for regenerating a polishing pad used in a CMP process according to another embodiment of the present application.

[0051] Figures 6a to 6c Is a diagram showing the states before and after removing the bonding member according to an embodiment of the present application.

[0052] Reference numerals:

[0053] 201, 201a, 201b, 201c, 201e, 201f, 201g: polishing pad

[0054] 211: pad member

[0055] 215, 219: bonding member

[0056] 213, 213a, 213a', 213a", 213b, 213c, 213e, 213f, 213g: groove

[0057] 217: auxiliary pad member Detailed description

[0058] The present application can be variously deformed and can have various embodiments, and the embodiments will be described in detail below. However, it should be understood that the present application is not limited to a specific disclosure, and includes all changes, equivalents, or substitutes belonging to the spirit and technical scope of the present application.

[0059] The terms used in this specification are used to describe specific embodiments, but are not intended to limit the scope of the present application. As long as it is not clearly distinguished in the text, the description indicating the singular should be understood to include the plural. In the present application, terms such as "including" or "consisting of" are intended to specify the presence of the features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, and should not be construed as excluding the presence or additional possibility of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0060] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. Terms that are the same as those defined in a commonly used dictionary shall be interpreted as having a meaning consistent with the meaning in the context of the relevant art, and if not explicitly defined in this specification, shall not be interpreted as having an abnormal or overly formal meaning.

[0061] Terms such as "first", "second", etc. may be used to describe various structural elements, but the above terms do not limit the above structural elements. The above terms are used to distinguish one structural element from another. For example, without exceeding the scope of this application, the first component element may be named the second component element, and similarly, the second component element may be named the first component element.

[0062] Terms such as upper end, lower end, upper surface, lower surface, or upper and lower parts are used to distinguish the relative positions of structural elements. For example, for the sake of convenience in description, when the upper side of a figure is named the upper part and the lower side of the figure is named the lower part, in fact, without exceeding the scope of the claims of this application, the upper part may be named the lower part, and the lower part may be named the upper part.

[0063] The terms used in this application are only used to describe specific embodiments and are not intended to limit this application. As long as it is not explicitly distinguished in the text, a description indicating the singular should be understood to include the plural. In this application, terms such as "including" or "having" are used to specify the presence of features, numbers, steps, operations, component elements, partial components, or combinations thereof described in the specification, and it should be understood that one or more other features or numbers, steps, operations, component elements, partial components, or combinations thereof are not precluded from existing or being added in advance.

[0064] Hereinafter, a method for removing an adhesive member according to an embodiment of the present application and a method for regenerating a polishing pad using the same will be described in detail with reference to the accompanying drawings.

[0065] The polishing pad regeneration method according to an embodiment of the present application can be roughly divided into two steps. The first step is a process of removing a double-sided tape, which is an adhesive member used to attach a polishing pad (for example, a pad member) to a platen, and the second step may be a process of regenerating the polishing pad by re-grooving the pad member from which the adhesive member has been removed using the adhesive member removal process of the first step.

[0066] Figure 1 A diagram schematically showing an example of a CMP apparatus according to an embodiment of the present application.

[0067] Refer to Figure 1, the CMP apparatus 100 according to an embodiment of the present application includes a polishing pad 20 disposed on a platen 10 which is a disk-shaped rotating table. The above-mentioned platen 10 is mounted on a central axis 15 and can rotate about the central axis 15. The above-mentioned polishing pad 20 can be attached to the above-mentioned platen 10 through an adhesive member 30. For example, a pad member (to be described later) of the above-mentioned polishing pad 20 can be attached to the above-mentioned platen 10 through the above-mentioned adhesive member 30.

[0068] In addition, the above-mentioned CMP apparatus 100 can be provided with a wafer head 40 to which the wafer W is attached such that the surface to be polished of the wafer W as the polishing object faces the polishing surface of the above-mentioned polishing pad 20. The above-mentioned CMP apparatus 100 can also include a slurry supply device 50 for supplying slurry 55 to the polishing surface of the above-mentioned polishing pad 20.

[0069] In the CMP process using the above-mentioned CMP apparatus 100, in a state where the surface to be polished of the wafer W attached to the above-mentioned wafer head 40 is in contact with the polishing surface of the above-mentioned polishing pad 20 attached to the above-mentioned platen 10, slurry 55 is injected onto the polishing surface of the above-mentioned polishing pad 20 through the above-mentioned slurry supply device 50, and then the above-mentioned wafer head 40 and the above-mentioned platen 10 are rotated to simultaneously perform chemical reaction and physical polishing, so as to flatten the wafer surface.

[0070] Figure 2a and Figure 2b FIGS. are diagrams showing a polishing pad before and after a CMP process according to an embodiment of the present application, Figure 2a FIG. is a cross-sectional view showing a polishing pad before a CMP process, i.e., before wear, according to an embodiment of the present application, Figure 2b FIG. is a cross-sectional view showing a polishing pad after a CMP process, i.e., after wear, according to an embodiment of the present application.

[0071] Referring to Figure 2a and Figure 2b , a polishing pad according to an embodiment of the present application will be described as follows.

[0072] Referring to Figure 2a , a polishing pad 201 according to an embodiment can include a pad member 211 and an adhesive member 215. The above-mentioned polishing pad 201 can be attached to the upper surface of a platen ( Figure 1 10 in

[0073] In the CMP process, the above-mentioned pad member 211 contacts the surface to be polished of the above-mentioned wafer W, and is from Figure 1Together with the slurry 55 supplied by the slurry supply unit 50, chemical and mechanical planarization of the above-mentioned wafer W is performed.

[0074] A plurality of grooves 213 may be formed on the polishing surface of the above-mentioned pad member 211 that faces the surface of the above-mentioned wafer W to be polished. As Figure 2a shown, before performing the CMP process, the above-mentioned pad member 211 may have a thickness T 0 , and each groove 213 may have a depth D 0 . The above-mentioned depth D 0 may be greater than or equal to the standard depth. The above-mentioned standard depth may refer to the minimum depth at which each of the above-mentioned grooves 213 can perform the CMP process.

[0075] The above-mentioned bonding member 215 may be composed of an adhesive and a film member. For example, the above-mentioned adhesive may include polyacrylic adhesives, epoxy materials, etc., and the above-mentioned film member may include polyethylene films, etc. The above-mentioned bonding member 215 may include double-sided tape, which is formed by coating the above-mentioned bonding material on both surfaces of the above-mentioned polyethylene film. The above-mentioned bonding member 215 is not necessarily limited to this, but may be composed of various bonding materials.

[0076] The above-mentioned polishing pad 201 may be attached to the upper surface of the platen ( Figure 1 10 in). That is, the above-mentioned pad member 211 may be attached to the upper surface of the above-mentioned rotating platen 10 through the above-mentioned bonding member 215. One surface of the above-mentioned bonding member 215 is attached to the above-mentioned pad member 211, and the other surface is attached to the surface of the above-mentioned rotating platen 10 so as to be able to attach the above-mentioned polishing pad 201 to the above-mentioned rotating platen 10.

[0077] In the CMP process, in a state where the above-mentioned polishing pad 201 is attached to the rotating platen 10 through the above-mentioned bonding member 215, the above-mentioned pad member 211 contacts the surface of the above-mentioned wafer W to be polished, so that it can be combined with the slurry 55 supplied from Figure 1 the slurry supply unit 50 to perform chemical and mechanical planarization of the above-mentioned wafer W.

[0078] When the above-mentioned groove 213 has a depth D greater than or equal to the standard depth 0 and the above-mentioned pad member 211 has a thickness T 0 and the polishing pad 201 is repeatedly subjected to the CMP process for a long time, the above-mentioned polishing pad 201 may gradually wear. Therefore, the depth D 0 of the above-mentioned groove 213 gradually decreases, and the thickness T 0 of the above-mentioned pad member 211 also gradually decreases. As described above, when the CMP process is repeatedly performed, the above-mentioned polishing pad 201 may be worn or damaged.

[0079] As shown Figure 2b in the polishing pad 201a worn due to repeated CMP processes, the depth of each groove 213a of the pad member 211 gradually decreases, so that it can have a depth D less than the minimum depth (standard depth) capable of performing the CMP process 1 , and the above depth can be less than the depth D of each groove 213 of the pad member 211 of the polishing pad 201 before the CMP process 0 . In addition, the pad member 211 of the polishing pad 201 can have a thickness T less than the thickness T of the pad member 211 of the polishing pad 201 before the CMP process 0 of the thickness T 1 . Furthermore, due to repeated CMP processes, the shape of the groove 213 may be partially damaged

[0080] Therefore, the polishing efficiency and polishing performance of the worn polishing pad 201 deteriorate, making it difficult to perform a normal polishing process, resulting in it possibly being discarded. However, embodiments of the present application can provide a method for regenerating and reusing a polishing pad with a depth less than the standard depth without discarding it. The polishing pad regeneration method mainly includes: a first-step process of removing the bonding member for attaching the polishing pad to the rotating platen 10 from the pad member; and a second-step process of removing the damaged portion of the polishing pad from which the bonding member has been removed, and then re-forming grooves above the standard depth by performing a grooving operation on the polishing pad, thereby manufacturing a reusable polishing pad

[0081] Figures 3a to 3g FIG. is a cross-sectional view for explaining a method for regenerating a worn polishing pad according to an embodiment of the present application Figure 5 FIG. is a flowchart for explaining a method for regenerating a polishing pad according to another embodiment of the present application

[0082] Hereinafter, reference will be made to Figures 3a to 3g and Figure 5 to describe in detail a method for regenerating a polishing pad according to an embodiment of the present application

[0083] First, a cleaning process (S510) can be performed on the polishing pad, such as Figure 2b the worn polishing pad 201a. Various foreign substances such as reaction products and process residues generated during repeated CMP processes accumulate on the upper surface of the pad member 211 and the groove 213a. Therefore, the above cleaning process can be performed to remove the foreign substances accumulated on the polishing pad 201a

[0084] In an embodiment of the present application, the polishing pad 201a can be cleaned by physical cleaning, dry cleaning, wet cleaning, chemical cleaning, etc. The physical cleaning can include brush scrubbing cleaning, etc. The dry cleaning can include air blowing cleaning, tornado cleaning, plasma cleaning, etc. The wet cleaning can include water jet cleaning, stream jet cleaning, bubble jet cleaning, ultrasonic cleaning, or mega sonic cleaning, etc. The chemical cleaning can include Dilute HF (DHF) cleaning, Buffered Oxide Etch (BOE) cleaning, Sulfuric Acid Peroxide Mixture (SPM) cleaning, Ammonium Peroxide Mixture (APM) cleaning, and Hydrochloric Peroxide Mixture (HPM) cleaning, etc. In addition to the above cleaning processes, various cleaning methods can also be used to perform the cleaning process of the polishing pad 201a.

[0085] Referring to Figure 3a , after performing the cleaning process of the polishing pad, the bonding member 215 is separated from the pad member 211 of the above polishing pad ( Figure 2b 201a in). (S520).

[0086] In an embodiment of the present application, an organic solvent can be used to chemically remove the bonding member 215 from the pad member 211. The method of chemically removing the bonding member 215 can include dipping the polishing pad 201a into an organic solvent and removing the polyethylene film of the bonding member 215 from the pad member 211.

[0087] For example, the bonding member 215 can be removed by dipping it into an organic solvent at room temperature for 1 minute to 5 minutes.

[0088] The method of chemically removing the bonding member 215 can include dipping the pad member into the organic solvent such that the adhesive of the bonding member is actually completely removed and the film member of the bonding member is separated from the pad member.

[0089] In the method of chemically removing the adhesive member 215 described above, after removing the adhesive member 215 from the pad member 211, the pad member 211 can be immersed in an organic solvent a second time to further remove any adhesive that may remain on the surface of the pad member 211.

[0090] The method of chemically removing the adhesive member 215 described above may further include removing the adhesive member 215 from the pad member 211 and then cleaning the pad member 211 of the polishing pad from which the adhesive member 215 has been removed. The cleaning process in S520 can be performed in the same manner as the cleaning process in S510.

[0091] For example, the organic solvent may consist of two polar organic solvents, one non-polar organic solvent, and a non-ionic surfactant. The content of the two polar organic solvents may be 10 wt% to 30 wt% and 50 wt% to 80 wt% respectively, the content of the non-polar organic solvent may be 1 wt% to 20 wt%, and the content of the non-ionic surfactant may be 0.1 wt% to 1 wt%. Additionally, the polar organic solvents may include dimethyl sulfoxide, acetonitrile, tetrahydrofuran, methanol, ethanol, isopropanol, ethyl acetate, acetone, dimethyl carbonate, dimethylformamide, dimethylacetamide, etc. The non-polar organic solvents may include 1,4-dioxane, hexane, toluene, diethyl ether, petroleum ether, cyclohexane, chloroform, hydrofluorocarbon, etc. By immersing the polishing pad in the organic solvent under the above conditions to remove the adhesive of the adhesive member 215, the adhesive member 215 can be easily removed from the pad member 211. Therefore, the polyethylene film of the adhesive member 215 can be easily and simply removed from the pad member 211 without damaging the polishing pad 201a, specifically, the pad member 211.

[0092]

[0093] Referring to FIG. 6, it can be seen that the adhesive of the adhesive member has been successfully removed through the above cleaning process. Specifically, as​Figure 6a As shown, when the polishing pad is immersed in an organic solvent at room temperature for 1 minute to 5 minutes, as Figure 6b shown, the adhesive of the bonding member is removed, such that the film member is in a state where it can be easily removed. Figure 6c The pad member from which the bonding member is separated without damage is shown.

[0094] Examples of removing the bonding member are shown in embodiments of the present application: by sufficiently immersing the above-mentioned bonding member 215 in an organic solvent such that the adhesive of the above-mentioned bonding member 215 is actually completely removed. However, in another embodiment, the above-mentioned polishing pad 201a can be immersed in the above-mentioned organic solvent for a period of time to form a state where the polyethylene-based film of the above-mentioned bonding member 215 can be easily removed from the above-mentioned pad member 211, and then the above-mentioned bonding member 215 is physically removed from the above-mentioned pad member 211.

[0095] As an example, the above-mentioned pad member 211 can be immersed in an organic solvent to partially remove the above-mentioned adhesive, and then the above-mentioned bonding member 215 is physically separated from the above-mentioned pad member 211 using a jig or physically separated from the above-mentioned pad member 211 by a cutting method using a skiving device.

[0096] As another example, the above-mentioned pad member 211 can be immersed in an organic solvent such that only the adhesive is removed from the edge portion of the above-mentioned pad member 211, and then the above-mentioned bonding member 215 can be physically separated from the above-mentioned pad member 211 using a jig.

[0097] As described above, the adhesive is removed by the above-mentioned organic solvent impregnation to form a state where the ethylene-based film can be easily removed, and then the above-mentioned bonding member 215 can be physically removed from the above-mentioned pad member 211. Therefore, the above-mentioned bonding member can be easily separated from the pad member without damaging the pad member.

[0098] Examples of performing a cleaning process (S510) to remove foreign matter accumulated on the upper surface and grooves of the polishing pad and then performing a process (S520) to remove the bonding member 215 are shown in an embodiment of the present application, but the present application is not limited thereto. In another embodiment, the above-mentioned process (S520) for removing the bonding member 215 can be performed, and then the above-mentioned cleaning process (S510) can be performed.

[0099] For example, in the S520 process, the above-mentioned bonding member 215 is removed, and a cleaning process is performed on the surface of the pad member 211 (the surface opposite to the surface on which the grooves are formed) from which the bonding member 215 has been removed. Subsequently, in the S510 process, a cleaning process for removing foreign matter accumulated on the upper surface and grooves 213 of the above-mentioned pad member 211 can be sequentially performed.

[0100] In another example, in the S520 process, the above-mentioned bonding member 215 is removed. While processing the surface of the pad member 211 from which the bonding member 215 has been removed (the surface opposite to the surface on which the groove is formed), a cleaning process (S510) for removing foreign matter accumulated on the upper surface and the groove of the above-mentioned pad member 211 can be performed.

[0101] Since the upper shape of the above-mentioned groove 213a is damaged due to repeated CMP processes, the upper side portion of the above-mentioned pad member 211, that is, the damaged portion, can be partially removed by a planarization process (S530).

[0102] Next, in order to determine whether the thickness of the above-mentioned pad member 211 is a thickness capable of forming a groove with a depth greater than or equal to the standard depth, that is, to determine whether a groove with a depth greater than or equal to the standard depth can be formed on the upper surface of the above-mentioned pad member 211, the thickness of the above-mentioned pad member 211 can be measured (S540). The thickness of the above-mentioned pad member 211 can be measured using a surface detector of a laser 3D displacement measuring device, but the present application is not limited thereto.

[0103] It can be determined whether the measured thickness of the above-mentioned pad member 211 is a thickness capable of forming a groove with a depth greater than or equal to the standard depth, that is, it can be determined whether a groove with a depth greater than or equal to the standard depth can be formed (S550).

[0104] As a result of the determination in step S550, as Figure 3b shown, the thickness T of the pad member 211 of the polishing pad from which the damaged portion of the groove has been removed 1 ' is a thickness capable of forming a groove with a depth greater than or equal to the standard depth (S550: Yes), and a re-grooving process is performed to be able to form a groove with a depth greater than or equal to the standard depth in the above-mentioned pad member 211.

[0105] Specifically, as Figure 3b shown, in the damaged portion removal process (S530), the upper side portion of the above-mentioned pad member 211 of the polishing pad is partially removed, so the above-mentioned groove 213a' of the above-mentioned pad member 211 can have a depth D 1 less than the above depth D 1 ', and the above-mentioned pad member 211 can have a thickness T 1 less than the above thickness T 1 '. The thickness T of the pad member 211 of the polishing pad from which the damaged portion has been partially removed 1 ' can have a size capable of forming a groove with a depth greater than or equal to the standard depth. Specifically, the thickness a of the portion of the pad member 211 in which the above-mentioned groove 213a' is formed 0It may have a size capable of forming a groove having a depth greater than or equal to the standard depth.

[0106] Subsequently, since the thickness T of the pad member 211 of the polishing pad from which the damaged portion of the groove has been partially removed in step S530, 1 ' is the thickness of the groove that can form a depth greater than or equal to the standard depth, so, if Figure 3c As shown, the pad member 211 may be regrooved to form a groove 213b in the pad member 211 (S575). Therefore, the pad member 211 has the thickness (T 2 =T 1 '), and can form a depth D greater than or equal to the standard depth 2 The groove 213b is provided.

[0107] After the pad member 211 forms the groove 213b having the depth D2, a cleaning process may be performed on the pad member 211. The cleaning process performed after the groove is formed may be performed in the same manner as at least one of the cleaning process for removing the residue of the adhesive member in step S520 and the cleaning process for removing foreign matter in the groove in step S510. The cleaning process may be performed sequentially or simultaneously at once after the groove is formed.

[0108] Next, if Figure 3d As shown, a groove 213b is formed on the upper surface, and a new adhesive member 219 is attached to the upper surface having a thickness T 2 The lower surface of the pad member 211 is regenerated to regenerate the polishing pad 201b (S585). Therefore, the regenerated polishing pad 201b may include a layer having a depth D greater than or equal to the standard depth formed on the upper surface. 2 The pad member 211 has the groove 213b formed therein and the adhesive member 219 is attached to the lower surface of the pad member 211. The adhesive member 219 may be made of the same material as the adhesive member 215.

[0109] As a result of the determination in step S550, Figure 3e As shown, when the thickness T of the pad member 211 of the polishing pad from which the damaged portion of the groove has been removed is 1 " is less than the thickness capable of forming a groove having a depth greater than or equal to the standard depth (S550: No), a groove having a depth greater than or equal to the standard depth cannot be formed in the pad member 211 through the re-grooving process. Therefore, in the present application, after the thickness of the pad member 211 is supplemented, a re-grooving process may be performed to form a groove having a depth greater than or equal to the standard depth in the pad member 211.

[0110] Specifically,Figure 3e As shown, in the process (S530) of removing the damaged portion of the above-described pad member 211 of the polishing pad, the upper portion of the above-described pad member 211 is partially removed. Therefore, the above-described groove 213a" of the above-described pad member 211 may have a depth D smaller than the above-described depth D 1 of depth D 1 ", and the above-described pad member 211 may have a thickness T smaller than the above-described thickness T 1 of thickness T 1 ". The thickness T of the pad member 211 of the polishing pad from which the damaged portion has been partially removed 1 " may be smaller than the size capable of forming a groove with a depth greater than or equal to the standard depth. Specifically, the thickness a of the pad member 211 of the portion where the above-described groove 213a' is formed 0 " may be smaller than the sufficient thickness capable of forming a groove with a depth greater than or equal to the standard depth.

[0111] Subsequently, since the pad member 211 of the polishing pad from which the damaged portion of the groove has been partially removed in step S530 has a thickness T that cannot form a groove with a depth greater than or equal to the standard depth 1 ", thus, as Figure 3f shown, an auxiliary pad member 217 for supplementing the thickness of the pad member is attached to the lower surface of the above-described pad member 211 (S560). Therefore, the above-described pad member 211 including the above-described auxiliary pad member 217 may have a thickness T capable of forming a groove with a depth greater than or equal to the standard depth 3 .

[0112] The above-described pad member 211 may be made of a polyurethane-based material. The above-described auxiliary pad member 217 may be made of a polyurethane-based material having a coefficient of restitution characteristic the same as or similar to that of the above-described pad member. The above-described auxiliary pad member 217 may have a size greater than or equal to the size of the groove removed in step S530. For example, the above-described auxiliary pad member 217 may have a thickness of 700 μm to 2000 μm. As an example, the above-described auxiliary pad member 217 may be attached to the above-described pad member 211 by a pressing method. As another example, the above-described auxiliary pad member 217 may be attached to the above-described pad member 211 using a double-sided tape such as the adhesive member 215. In an embodiment of the present application, the above-described auxiliary pad member 217 is shown to be made of the same material as the above-described pad member 211, but the present application is not necessarily limited thereto.

[0113] Subsequently, as Figure 3f shown, the pad member 211 having a thickness T capable of forming a groove with a depth greater than or equal to the standard depth by attaching the above-described auxiliary pad member 217 is re-grooved, so that a depth D greater than or equal to the standard depth can be formed on the upper surface of the above-described pad member 211 3 ", and 3The groove 213c (S570).

[0114] As Figure 3g shown, after forming the groove 213c on the upper surface of the above-mentioned pad member 211, the polishing pad 201c is regenerated (S580) by attaching a new adhesive member 219 to the above-mentioned auxiliary pad member 217. Therefore, the above-mentioned polishing pad 201c may include a pad member 211 having a groove 213c with a depth D greater than or equal to the standard depth formed on the upper surface, an auxiliary pad member 217 attached to the lower surface of the above-mentioned pad member 211, and an adhesive member 219 attached to the above-mentioned auxiliary pad member 217. 3 The groove 213c of the above-mentioned pad member 211, the auxiliary pad member 217 attached to the lower surface of the above-mentioned pad member 211, and the adhesive member 219 attached to the above-mentioned auxiliary pad member 217.

[0115] According to Figures 3a to 3g The polishing pad regeneration method according to an embodiment shown in the figure shows an example of regenerating a damaged polishing pad by partially removing the damaged part of the above-mentioned groove 213a and then performing a re-grooving operation on the polishing pad, but it is also possible to regenerate a damaged polishing pad by completely removing the groove of the pad member and then performing a re-grooving operation on the pad member.

[0116] Figures 4a to 4h It is a cross-sectional view for explaining the regeneration method of a polishing pad according to another embodiment of the present application. Figures 4a to 4h The regeneration method of the worn polishing pad according to another embodiment of the present application includes, as in an embodiment, a first step process of removing the adhesive member from the pad member and a second step process of performing a re-grooving operation on the pad member to regenerate the polishing pad, but the difference from an embodiment is that the pad member is flattened to completely remove the above-mentioned groove of the pad member, and then a re-grooving operation is performed to regenerate the polishing pad.

[0117] Next, it will be described with reference to Figures 4a to 4h and Figure 5 in detail the regeneration method of a polishing pad according to another embodiment of the present application.

[0118] First, as Figure 4a shown, the worn polishing pad 201e may include the above-mentioned pad member 211 and the adhesive member 215. The above-mentioned groove 213e formed on the upper surface of the above-mentioned pad member 211 may have a depth D 5 , and the above-mentioned pad member 211 may have a thickness T 5 . Since the above-mentioned groove 213e has a depth D less than the standard depth 5 , the above-mentioned pad member 211 cannot perform a normal CMP process. Therefore, a regeneration process can be performed on the worn polishing pad 201e.

[0119] First, a cleaning process (S510) can be performed on the worn polishing pad 201e described above, and then a process of removing the adhesive member 215 from the pad member 211 (S520) can be carried out. As described above, various cleaning methods such as physical cleaning, dry cleaning, wet cleaning, and chemical cleaning can be used to perform the above-mentioned cleaning process (S510).

[0120] As described above, in the above-mentioned adhesive member removing process (S520), the adhesive member 215 can be chemically removed from the pad member 211. The adhesive member removing method can include dipping the polishing pad 201a into an organic solvent and removing the polyethylene film of the adhesive member 215 from the pad member 211.

[0121] As described above, the above-mentioned adhesive member removing method can be carried out at room temperature for 1 minute to 5 minutes. As an example, the pad member 211 can be fully immersed in the organic solvent to completely remove the adhesive of the adhesive member 215, so as to separate the adhesive member 251 from the pad member 211. As another example, the polishing pad 201a can be immersed in the organic solvent for a period of time to partially remove the adhesive of the adhesive member 215, so as to form a state where the polyethylene film of the adhesive member 215 can be easily removed from the pad member 211, and then the adhesive member 215 can be physically removed from the pad member 211.

[0122] In addition, as described above, after the primary step of separating the film member from the pad member 211 in the above-mentioned adhesive member removing method, a secondary step of dipping the pad member 211 into an organic solvent to remove the adhesive components that may remain on the pad member 211 can be further included.

[0123] For example, the above-mentioned organic solvent can be composed of two polar organic solvents, one non-polar organic solvent, and a non-ionic surfactant. The contents of the two polar organic solvents can be 10% by weight to 30% by weight and 50% by weight to 80% by weight respectively, the content of the non-polar organic solvent can be 1% by weight to 20% by weight, and the content of the non-ionic surfactant can be 0.1% by weight to 1% by weight. In addition, the polar organic solvents can include dimethyl sulfoxide, acetonitrile, tetrahydrofuran, methanol, ethanol, isopropanol, ethyl acetate, acetone, dimethyl carbonate, dimethylformamide, dimethylacetamide, etc. The non-polar organic solvents can include 1,4-di ane, hexane, toluene, diethyl ether, petroleum ether, cyclohexane, chloroform, hydrofluorocarbon, etc.

[0124] The method of removing the adhesive member 215 may further include cleaning the pad member 211 of the polishing pad from which the adhesive member 215 has been removed after removing the adhesive member 215 from the pad member 211. The cleaning process in S520 may be performed in the same manner as the cleaning process in S510. Additionally, in the same manner as described above, the cleaning process (S510) may be performed after performing the adhesive member 215 removal process (S520), or the cleaning process in the adhesive member 215 removal process (S520) and the cleaning process (S510) may be performed simultaneously.

[0125] As shown in an embodiment described with reference to FIG. 6, it can be seen that the adhesive of the adhesive member is well removed by the organic solvent impregnation method, so that the adhesive member is separated from the pad member.

[0126] Subsequently, since the upper portion of the pad member 211, that is, the upper shape of the groove 213e is damaged due to repeated CMP processes, the upper portion of the pad member 211 may be removed by a planarization process (S530). In this embodiment, the damaged portion of the upper portion of the pad member 211 is removed. At this time, the damaged portion is removed in such a way as to completely remove the groove 213e, so that the surface of the pad member 211 can be planarized.

[0127] Next, in order to determine whether the thickness of the pad member 211 is a thickness capable of forming a groove having a depth greater than or equal to a standard depth, that is, to determine whether a groove having a depth greater than or equal to a standard depth can be formed on the upper surface of the pad member 211, the thickness of the pad member 211 may be measured (S540). A surface detector using a laser 3D displacement measuring device may be used to measure the thickness of the pad member 211, but the present application is not limited thereto.

[0128] It is determined whether the measured thickness of the pad member 211 is a thickness capable of forming a groove having a depth greater than or equal to a standard depth, that is, it can be determined whether it is a thickness capable of forming a groove having a depth greater than or equal to a standard depth (S550).

[0129] As a result of the determination in step S550, the thickness of the pad member 211 of the polishing pad from which the damaged portion of the groove has been removed is a thickness capable of forming a groove having a depth greater than or equal to a standard depth (S550: Yes), and a re-grooving process is performed to be able to form a groove having a depth greater than or equal to a standard depth on the pad member 211.

[0130] Specifically, as Figure 4bAs shown, a planarization process is performed on the pad member 211 from which the bonding member 215 has been removed, so as to be able to completely remove the groove 213e of the pad member 211. The pad member 211 may have a flat upper surface and a thickness (a 5 less than the above thickness T 5 = T 5 ').

[0131] Subsequently, as Figure 4c shown, a re-grooving operation may be performed on the pad member 211 to form a groove 213f in the pad member 211 (S575). Accordingly, the pad member 211 has the above thickness (T 6 = T 5 '), and a groove 213f having a depth D greater than or equal to a standard depth may be formed 6 .

[0132] Specifically, in another embodiment, since the groove 213e in the pad member 211 is completely removed, the thickness (a 5 = T 5 ) of the pad member 211 after the above planarization may be a thickness that can form a groove having a depth greater than or equal to the standard depth through a re-grooving process

[0133] In Figures 3a to 3d one embodiment shown, only the damaged portion on the upper side of the pad member 211 is removed, such that the groove 213a' partially exists in the pad member 211, and then the groove 213b is re-formed through a re-grooving operation. Accordingly, in one embodiment, the sum of the depth D 1 ' of the groove 213a' remaining after partial removal of the damaged portion and the thickness a 0 of the portion of the pad member 211 where the groove is to be re-formed, i.e., the thickness (T 1 ' = T 2 ) of the pad member 211 may be large enough to form a groove having a depth greater than or equal to the above standard depth

[0134] On the other hand, in another embodiment, since the damaged groove 213e is completely removed, the thickness (a 5 = T 5 ) of the pad member 211 may be large enough to form a groove having a depth greater than or equal to the above standard depth

[0135] Next, as Figure 4d shown, a groove 213f having a depth D 6 is formed on the upper surface, and a new bonding member 219 is attached to the pad member having a thickness T 6The lower surface of the above-mentioned pad member 211, so that the polishing pad 201f can be regenerated (S585). Therefore, the regenerated polishing pad 201f may include a groove 213f having a depth D greater than or equal to a standard depth formed on the upper surface 6 of the above-mentioned pad member 211 and an adhesive member 219 attached to the lower surface of the above-mentioned pad member 211.

[0136] On the other hand, as a result of the judgment in step S550, as Figure 4e shown, if the thickness (T 5 "=a 5 ") of the pad member 211 of the polishing pad from which the damaged part of the groove has been removed is not the thickness capable of forming a groove with a depth greater than or equal to the standard depth (S550: No), then a groove with a depth greater than or equal to the standard depth cannot be formed in the above-mentioned pad member 211 by performing the re-grooving process. Therefore, the thickness of the above-mentioned pad member 211 can be supplemented first, and then the re-grooving process can be performed, so that a groove with a depth greater than or equal to the standard depth can be formed in the above-mentioned pad member 211.

[0137] Specifically, as Figure 4e shown, in the above-mentioned pad member 211 of the polishing pad, the groove is completely removed in the damaged part removal process (S530). Therefore, the above-mentioned pad member 211 can have the above-mentioned thickness (T 5 "=a 5 ").

[0138] Subsequently, as Figure 4f shown, the pad member 211 of the polishing pad from which the groove has been completely removed in step S530 has a thickness (T 5 ") that cannot form a groove with a depth greater than or equal to the standard depth. In order to supplement the thickness of the above-mentioned pad member 211, an auxiliary pad member 217 is attached to the lower surface of the above-mentioned pad member 211 (S560). Therefore, the above-mentioned pad member 211 including the above-mentioned auxiliary pad member 217 can have a thickness T capable of forming a groove with a depth greater than or equal to the standard depth 7 .

[0139] The above-mentioned cushion member 211 may be made of a polyurethane-based material. The above-mentioned auxiliary cushion member 217 may be made of a polyurethane-based material having a coefficient of restitution characteristic that is the same as or similar to that of the above-mentioned cushion member 211. The above-mentioned auxiliary cushion member 217 may have a thickness greater than or equal to the thickness of the groove removed in step S530. For example, the above-mentioned auxiliary cushion member 217 may have a thickness of 700 μm to 2000 μm. As an example, the above-mentioned auxiliary cushion member 217 may be attached to the above-mentioned cushion member 211 by a pressing method. As another example, the above-mentioned auxiliary cushion member 217 may be attached to the above-mentioned cushion member 211 using a double-sided tape such as the adhesive member 215. In an embodiment of the present application, the above-mentioned auxiliary cushion member 217 is shown to be made of the same material as the above-mentioned cushion member 211, but the present application is not necessarily limited thereto.

[0140] Subsequently, as Figure 4g shown, a re-grooving operation is performed on the cushion member 211 having a thickness T7 capable of forming a groove with a depth greater than or equal to the standard depth by attaching the above-mentioned auxiliary cushion member 217, so that a depth D greater than or equal to the standard depth can be formed on the upper surface of the above-mentioned cushion member 211 7 of the groove 213g (S570).

[0141] As Figure 4h shown, a new adhesive member 219 can be attached to the above-mentioned auxiliary cushion member 217 attached to the lower surface of the above-mentioned cushion member 211 having the groove 213g formed on the upper surface to regenerate the polishing pad 201g (S580). Therefore, the above-mentioned polishing pad 201g may include the above-mentioned cushion member 211 having a groove 213g with a depth D greater than or equal to the standard depth formed on the upper surface, the auxiliary cushion member 217 attached to the lower surface of the above-mentioned cushion member 211, and the adhesive member 219 attached to the above-mentioned auxiliary cushion member 217. 7 of the groove 213g.

[0142] In an embodiment of the present application, a cleaning process may be performed after the groove forming process as described above. The above-mentioned cleaning process may be performed in the same manner as at least one of the cleaning process performed in step S510, the cleaning process performed in the above-mentioned adhesive member removing process (S520), and the cleaning process performed in the damaged part removing process (S530) of the cushion member. The above-mentioned cleaning process may be performed sequentially or simultaneously at one time after the re-grooving process.

[0143] In another embodiment of the present application, an example of a process for removing the bonding member from the pad member before and after the cleaning process of the worn polishing pad described above is shown, but the present application is not limited thereto. For example, the process of removing the above bonding member can be carried out in the process before attaching the above auxiliary pad member to the above pad member. It can be carried out either before or after the process of removing the damaged part of the above pad member, the process of measuring the thickness of the above pad member, and the process of determining whether the measured thickness of the above pad member is greater than the standard thickness.

[0144] As described above, according to this embodiment, the bonding member composed of a double-sided adhesive can be easily removed from the pad member, so damage to the polishing pad caused by the removal of the bonding member can be prevented. Therefore, the reuse rate of the worn polishing pad can be improved.

[0145] In addition, if the depth of the groove becomes lower than the standard depth at which the CMP process can be carried out due to the continuous progress of the CMP process, a part or the entire damaged groove on the upper surface of the pad member is removed, and then a groove with a standard depth can be formed on the upper surface of the pad member. Therefore, the service life of the expensive CMP pad can be extended.

[0146] On the other hand, if the thickness of the pad member becomes too thin to form a groove with a standard depth, an auxiliary pad can be attached to the above pad member so that the above pad member has a thickness capable of forming a groove with a standard depth. As a result, the expensive CMP pad can be reused for a long time.

[0147] As described above, the present application has been described in detail with reference to the preferred embodiments of the present application, but those skilled in the art will understand that various modifications and changes can be made to these embodiments without departing from the spirit and scope of the present application described in the appended claims.

Claims

1. A method for removing an adhesive member, characterized in that: The steps include: providing an adhesive member attached to the pad member and composed of an adhesive and a film member; and The bonding member is chemically removed from the pad member.

2. The adhesive member removal method according to claim 1, characterized in that: The adhesive member includes a double-sided tape obtained by applying the adhesive on both sides of the film member.

3. The adhesive member removal method according to claim 1, characterized in that: The adhesive comprises a polyacrylic adhesive or an epoxy material. The film member includes a polyethylene film.

4. The adhesive member removal method according to claim 1, characterized in that: The step of removing the bonding member includes immersing the pad member in an organic solvent at room temperature for 1 minute to 5 minutes.

5. The adhesive member removal method according to claim 4, characterized in that: The organic solvent consists of two polar organic solvents, a non-polar organic solvent and a non-ionic surfactant.

6. The adhesive member removal method according to claim 5, characterized in that: The contents of the two polar organic solvents are 10 to 30 wt % and 50 to 80 wt % respectively, the content of the non-polar organic solvent is 1 to 20 wt %, and the content of the nonionic surfactant is 0.1 to 1 wt %.

7. The adhesive member removal method according to claim 4, characterized in that: In the step of removing the bonding member, the pad member is immersed in the organic solvent so that the adhesive of the bonding member is substantially completely removed and the film member of the bonding member is separated from the pad member.

8. The adhesive member removal method according to claim 4, characterized in that: The step of removing the bonding member comprises the following steps: immersing the pad member in the organic solvent to partially remove the adhesive of the film member so that the film member is in a state that can be easily removed from the pad member; and The film member is physically separated from the pad member.

9. The adhesive member removal method according to claim 8, characterized in that: The step of physically separating the film member includes physically separating the film member from the pad member using a jig or physically separating the film member by cutting using a cutting device.

10. The adhesive member removal method according to claim 4, characterized in that: The step of removing the bonding member comprises the following steps: immersing the pad member in the organic solvent so that the adhesive of the adhesive member is removed only from the edge portion of the pad member; and The film member is physically separated from the pad member using a clamp.

11. The adhesive member removal method according to claim 4, characterized in that: After removing the adhesive member by immersing the pad member in an organic solvent, further immersing the pad member in an organic solvent to remove the adhesive remaining on the surface of the pad member from which the adhesive member has been removed.

12. The adhesive member removal method according to claim 1, characterized in that: After removing the adhesive member from the pad member, the method further includes cleaning the pad member from which the adhesive member has been removed.

13. The adhesive member removal method according to claim 12, characterized in that: The cleaning step is performed by using at least one of a physical cleaning method, a dry cleaning method, and a wet cleaning method.

14. The adhesive member removal method according to claim 13, characterized in that: The physical cleaning method includes brush scrubbing cleaning, The dry cleaning method includes air blowing cleaning, tornado cleaning or plasma cleaning. The wet cleaning method includes water jet cleaning, jet cleaning, bubble jet cleaning, ultrasonic cleaning or megasonic cleaning.

15. A method for regenerating a polishing pad, wherein the polishing pad is a worn polishing pad comprising a pad member and an adhesive member, wherein a plurality of grooves having a depth less than or equal to a standard depth capable of performing a polishing process are formed on one surface of the pad member, and the adhesive member is attached to the other surface of the pad member, wherein the method for regenerating the polishing pad comprises the following steps: chemically removing the bonding member from the pad member; removing a damaged portion of the upper surface of the pad member; determining whether the thickness of the pad member is a thickness capable of reforming a groove having a depth greater than or equal to the standard depth; re-forming a groove on the upper surface of the pad member according to a result of the determination; and A new adhesive member is attached to the lower surface of the pad member where the groove is formed.

16. The polishing pad regeneration method according to claim 15, characterized in that: The adhesive comprises a polyacrylic adhesive or an epoxy material. The film member comprises a polyethylene film, The adhesive member includes a double-sided tape obtained by applying the adhesive on both sides of the film member.

17. The polishing pad regeneration method according to claim 16, characterized in that: The organic solvent consists of two polar organic solvents, a non-polar organic solvent and a non-ionic surfactant.

18. The polishing pad regeneration method according to claim 17, characterized in that: The contents of the two polar organic solvents are 10 to 30 wt % and 50 to 80 wt % respectively, the content of the non-polar organic solvent is 1 to 20 wt %, and the content of the nonionic surfactant is 0.1 to 1 wt %.

19. The polishing pad regeneration method according to claim 15, characterized in that: The step of removing the bonding member includes immersing the pad member in an organic solvent at room temperature for 1 minute to 5 minutes.

20. The polishing pad regeneration method according to claim 19, characterized in that: In the step of removing the bonding member, the pad member is immersed in the organic solvent so that the adhesive of the bonding member is substantially completely removed and the film member of the bonding member is separated from the pad member.

21. The polishing pad regeneration method according to claim 19, characterized in that: The step of removing the bonding member comprises the following steps: immersing the pad member in the organic solvent to partially remove the adhesive of the film member so that the film member is in a state that can be easily removed from the pad member; and The film member is physically separated from the pad member.

22. The polishing pad regeneration method according to claim 21, characterized in that: The step of physically separating the film member includes physically separating the film member from the pad member using a jig or physically separating the film member by cutting using a cutting device.

23. The polishing pad regeneration method according to claim 19, characterized in that: The step of removing the bonding member comprises the following steps: immersing the pad member in the organic solvent so that the adhesive of the adhesive member is removed only from the edge portion of the pad member; and The film member is physically separated from the pad member using a clamp.

24. The polishing pad regeneration method according to claim 19, characterized in that: The step of removing the bonding member further includes, after removing the bonding member by immersing the pad member in an organic solvent, a step of further immersing the pad member in an organic solvent to remove the adhesive remaining on the surface of the pad member from which the bonding member has been removed.

25. The polishing pad regeneration method according to claim 15, characterized in that: In the step of removing the damaged portion of the pad member, the damaged portion of the pad member is removed in a manner that a portion of the groove remains, or the damaged portion of the pad member is removed in a manner that the groove is completely removed.

26. The polishing pad regeneration method according to claim 15, characterized in that: In the judging step, if the thickness of the pad member is such that a groove having a depth greater than or equal to the standard depth can be reformed, then in the reforming groove step, a re-grooving operation is performed on the upper surface of the pad member from which the damaged portion has been removed to form a groove having a depth greater than or equal to the standard depth in the pad member.

27. The polishing pad regeneration method according to claim 15, characterized in that: In the judging step, if the thickness of the pad member is not a thickness capable of reforming a groove having a depth greater than or equal to the standard depth, the reforming groove step includes the following steps: attaching an auxiliary pad member to the other surface of the pad member from which the adhesive member has been removed to supplement the thickness of the pad member; and A surface regrooving operation is performed on the upper surface of the pad member from which the damaged portion has been removed, so as to form a groove having a depth greater than or equal to a standard depth in the pad member.

28. The polishing pad regeneration method according to claim 27, characterized in that: The pad component is made of polyurethane material. The auxiliary pad member is made of a polyurethane-based material having the same or similar coefficient of restitution characteristics as the pad member.

29. The polishing pad regeneration method according to claim 15, characterized in that: The method further includes performing a cleaning process before and after removing the bonding member to remove foreign matter accumulated on the upper surface of the pad member of the worn polishing pad and the groove.

30. The polishing pad regeneration method according to claim 29, characterized in that: The cleaning process is performed by using at least one of a physical cleaning method, a dry cleaning method, and a wet cleaning method.

31. The polishing pad regeneration method according to claim 30, characterized in that: The following steps are also included: performing a cleaning process before and after removing the bonding member to remove foreign matter accumulated on the upper surface of the pad member of the worn polishing pad and the groove; and The film member is removed from the pad member, and then the pad member is subjected to a cleaning process to remove process residues of the adhesive member.

32. The polishing pad regeneration method according to claim 31, characterized in that: A cleaning process for removing the foreign matter and a cleaning process for removing process residues of the bonding member are sequentially performed on the upper surface and the groove of the pad member, or A cleaning process for removing the foreign substances and a cleaning process for removing process residues of the bonding member are simultaneously performed with respect to the upper surface and the groove of the pad member.

33. The polishing pad regeneration method according to claim 19, characterized in that: The following steps are also included: performing a cleaning process before and after removing the bonding member to remove foreign matter accumulated on the upper surface of the pad member of the worn polishing pad and the groove; removing the film member from the pad member and then subjecting the pad member to a cleaning process to remove process residues of the adhesive member; removing a damaged portion of the pad member and then subjecting the pad member to a cleaning process; and The grooves are re-formed on the upper surface of the pad member, and then the pad member is subjected to a cleaning process.

34. The polishing pad regeneration method according to claim 33, characterized in that: The cleaning processes are performed sequentially or simultaneously at one time.

35. A polishing pad, characterized in that: The polishing pad is produced by regenerating the polishing pad using the polishing pad regeneration method according to any one of claims 15 to 34.

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