Polishing, cleaning and drying all-in-one machine

Abstract

The invention provides a polishing, cleaning and drying all-in-one machine, and relates to the technical field of polishing, the polishing, cleaning and drying all-in-one machine comprises a rough polishing device, a fine polishing device, a cleaning and drying device and a polishing driving device, the rough polishing device comprises a plurality of rough polishing discs distributed in sequence; the fine polishing device comprises a plurality of fine polishing discs which are sequentially distributed, and the fine polishing discs are correspondingly arranged on the rear sides of the rough polishing discs; the cleaning and drying device is arranged on the rear side of the fine polishing device; the polishing driving device comprises a driving mechanism and a plurality of polishing heads, and the driving mechanism is connected with the polishing heads; and the plurality of polishing heads can correspondingly place a plurality of wafers on the plurality of rough polishing discs and the plurality of fine polishing discs for rough polishing and fine polishing respectively, and the plurality of polishing heads also feed the plurality of wafers into the cleaning and drying device. Compared with the prior art, the polishing, cleaning and drying all-in-one machine provided by the embodiment of the invention can realize multi-line polishing, is high in polishing efficiency, can realize integration of polishing, cleaning and drying, and simplifies the manufacturing process.

Description

Technical Field

[0001] The present invention relates to the technical field of polishing, and in particular, to a polishing, cleaning and drying integrated machine. Background Art

[0002] The existing CMP polishing machine usually adopts a single-line process, that is, when polishing, a single polishing head adsorbs the wafer on the polishing pad for polishing, and after polishing, cleaning and drying are carried out. This single-line polishing method has low efficiency.

[0003] At the same time, the existing polishing equipment, the cleaning and drying equipment are separate and independent equipment, and the overall integration degree is poor. It is necessary to temporarily store the polished wafers and then re-transport them to the cleaning and drying equipment, and it is impossible to realize the integration of polishing, cleaning and drying, and the process is complex. Summary of the Invention

[0004] The purpose of the present invention is to provide a polishing, cleaning and drying integrated machine, which can realize multi-line polishing, has high polishing efficiency, and at the same time can realize the integration of polishing, cleaning and drying, and simplifies the manufacturing process.

[0005] In a first aspect, the present invention provides a polishing, cleaning and drying integrated machine, including: A rough polishing device, the rough polishing device includes a plurality of rough polishing discs distributed in sequence, and the rough polishing discs are used to perform rough polishing on the wafers; A fine polishing device, the fine polishing device includes a plurality of fine polishing discs distributed in sequence, and the plurality of fine polishing discs are correspondingly arranged behind the plurality of rough polishing discs, and the fine polishing discs are used to perform fine polishing on the wafers; A cleaning and drying device, the cleaning and drying device is arranged behind the fine polishing device, and the cleaning and drying device is used to perform cleaning and drying on the wafers; A polishing driving device, the polishing driving device includes a driving mechanism and a plurality of polishing heads, the driving mechanism is connected to the plurality of polishing heads, and is used to synchronously drive the plurality of polishing heads to move synchronously; Wherein, the plurality of polishing heads are used to respectively adsorb the plurality of wafers, and under the drive of the drive mechanism, place the plurality of wafers on the plurality of rough polishing discs for rough polishing and then place them on the plurality of fine polishing discs for fine polishing, and the plurality of polishing heads are also used to send the plurality of wafers after fine polishing into the cleaning and drying device under the drive of the drive mechanism.

[0006] In an optional embodiment, the plurality of rough polishing discs include a first rough polishing disc and a second rough polishing disc, the horizontal height of the first rough polishing disc is greater than the horizontal height of the second rough polishing disc, and a first drainage pipeline is further arranged between the first rough polishing disc and the second rough polishing disc, and the first drainage pipeline is used to send the polishing liquid polished by the first rough polishing disc into the second rough polishing disc; The multiple fine polishing discs include a first fine polishing disc and a second fine polishing disc. The horizontal height of the first fine polishing disc is greater than that of the second fine polishing disc, and a second liquid discharge pipe is further arranged between the first fine polishing disc and the second fine polishing disc. The second liquid discharge pipe is used to send the polishing liquid after polishing by the second fine polishing disc into the second fine polishing disc.

[0007] In an optional embodiment, the rough polishing device further includes a rough polishing recovery barrel. The rough polishing recovery barrel is arranged below the second rough polishing disc and is used to collect the polishing liquid after polishing by the second rough polishing disc. A first filtering port is further arranged on the rough polishing recovery barrel. A first delivery pump is arranged at the first filtering port and is connected with a first circulation pipe. The first circulation pipe is connected to the first rough polishing disc and is used to circularly deliver the filtered polishing liquid to the first rough polishing disc. The fine polishing device further includes a fine polishing recovery barrel. The fine polishing recovery barrel is arranged below the second fine polishing disc and is used to collect the polishing liquid after polishing by the second fine polishing disc. A second filtering port is further arranged on the fine polishing recovery barrel. A second delivery pump is arranged at the second filtering port and is connected with a second circulation pipe. The second circulation pipe is connected to the second rough polishing disc and is used to circularly deliver the filtered polishing liquid to the second rough polishing disc.

[0008] In an optional embodiment, the driving mechanism includes a hanging frame and a driving component. The hanging frame extends from above the rough polishing device to above the cleaning and drying device. The driving component is arranged on the hanging frame. The multiple polishing heads include a first polishing head and a second polishing head. The driving component is simultaneously drivingly connected to the first polishing head and the second polishing head. The first polishing head is used to adsorb a first wafer and, driven by the driving component, send the first wafer to the first rough polishing disc, the first fine polishing disc, and the cleaning and drying device respectively. The second polishing head is used to adsorb a second wafer and, driven by the driving component, send the second wafer to the second rough polishing disc, the second fine polishing disc, and the cleaning and drying device respectively.

[0009] In an optional embodiment, the driving component includes a displacement driving member, a driving lead screw, a driving sleeve, and a cross bar. The displacement driving member is arranged on the hanging frame and is drivingly connected to the driving lead screw for driving the driving lead screw to rotate. The driving sleeve is threadedly sleeved on the driving lead screw and can move along the driving lead screw. The cross bar is connected to the driving sleeve. The first polishing head and the second polishing head are both connected to the cross bar and are respectively located on both sides of the driving sleeve. Sliders are arranged at both ends of the cross bar. Slide rails are arranged on the hanging frame. The sliders are slidably arranged on the slide rails.

[0010] In an optional embodiment, the first polishing head includes a first telescopic drive member, a first seat body, a first rotating drive member and a first adsorption head body, one end of the first telescopic drive member is connected to the cross bar, and the other end is connected to the first seat body, and is used to drive the first seat body to rise or fall, the first rotating drive member is arranged on the first seat body and is connected to the first adsorption head body, and is used to drive the first adsorption head body to rotate, and the first adsorption head body is used to adsorb the first wafer.

[0011] In an optional embodiment, the cleaning and drying device includes a cleaning box, a cleaning platform, a lifting assembly and a lifting assembly. The cleaning box is filled with cleaning liquid and is provided with a hinged seat on one side of the bottom. The cleaning platform is arranged in the cleaning box, and one end of the cleaning platform is rotatably connected to the hinged seat, and the other end is provided with a plurality of wafer placement positions, and the plurality of wafer placement positions are used to place a plurality of wafers. The lifting assembly is transmission-connected to one end of the cleaning platform away from the hinged seat, and is used to drive the cleaning platform to rotate relative to the hinged seat to lift the wafer placement position. The lifting assembly is at least partially arranged on the cleaning platform, and is used to drive the wafer on the wafer placement position to separate from the cleaning liquid for drying.

[0012] In an optional embodiment, a vacuum adsorption plate is provided on each of the chip placement positions, and the vacuum adsorption plate is used to adsorb the chip. The lifting assembly includes a lifting drive component, which is hinged to the bottom side of the cleaning platform and corresponds to the vacuum adsorption plate, and is used to lift the cleaning platform to a preset inclination angle.

[0013] In an optional embodiment, the lifting assembly includes a lifting drive, a guide block and a first suction block, the lifting drive is arranged on one end of the cleaning platform close to the hinged seat, the guide block is slidably arranged on the cleaning platform and is connected to the lifting drive, the guide block is used to slide along the cleaning platform under the drive of the lifting drive, the first suction block is connected to the guide block, and is used to adsorb one side edge of the chip and move the chip obliquely upward along the cleaning platform under the drive of the guide block.

[0014] In an optional embodiment, the lifting assembly also includes a second suction block and an auxiliary driving component. A support frame is also provided on the side of the cleaning box away from the hinged seat. The auxiliary driving component is provided on the support frame. The second suction block is connected to the auxiliary driving component and is used to absorb the edge of one side of the chip away from the hinged seat and move the chip upward along the cleaning platform inclined by the auxiliary driving component.

[0015] The beneficial effects of the embodiments of the present invention are: The integrated polishing, cleaning and drying machine provided by the embodiment of the present invention is provided with a plurality of rough polishing disks and a plurality of fine polishing disks respectively, and a plurality of polishing production lines are formed by a plurality of polishing heads. Each polishing production line adsorbs a corresponding wafer by a corresponding polishing head for rough polishing and fine polishing, and finally sends it to a cleaning and drying device for cleaning and drying. Among them, the driving mechanism can realize the synchronous movement of a plurality of polishing heads, so that multi-line polishing can be realized, greatly improving the polishing efficiency. And, since the driving mechanism is used to drive the polishing head to move, the polishing head can move between the polishing station and the cleaning and drying station, so that polishing, cleaning and drying can be integrated in one process, with higher integration. Compared with the prior art, the integrated polishing, cleaning and drying machine provided by the embodiment of the present invention can realize multi-line polishing, has high polishing efficiency, and can realize the integration of polishing, cleaning and drying at the same time, simplifying the manufacturing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for use in the embodiments. It should be understood that the following drawings only show some embodiments of the present invention, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0017] Figure 1 is a schematic structural diagram of the integrated polishing, cleaning and drying machine provided by the embodiment of the present invention; Figure 2 is Figure 1 a schematic structural diagram of the rough polishing device and the fine polishing device in Figure 3 is Figure 1 a front view of the polishing driving device in Figure 4 is Figure 1 a top view of the polishing driving device in Figure 5 is Figure 4 a schematic structural diagram of the first polishing head in Figure 6 is Figure 1 a schematic structural diagram of the cleaning and drying device in

[0018] Icons: 100 - Integrated Polishing, Cleaning and Drying Machine; 110 - Coarse Polishing Device; 111 - First Coarse Polishing Disc; 112 - Second Coarse Polishing Disc; 113 - First Drain Pipe; 114 - Coarse Polishing Recycling Bucket; 115 - First Delivery Pump; 116 - First Circulation Pipe; 120 - Fine Polishing Device; 121 - First Fine Polishing Disc; 122 - Second Fine Polishing Disc; 123 - Second Drain Pipe; 124 - Fine Polishing Recycling Bucket; 125 - Second Delivery Pump; 126 - Second Circulation Pipe; 130 - Cleaning and Drying Device; 131 - Cleaning Tank; 132 - Cleaning Platform; 133 - Hinge Seat; 134 - Vacuum Suction Disc; 135 - Lifting Assembly; 136 - Support Frame; 140 - Polishing Driving Device; 150 - Driving Mechanism; 151 - Hanger; 152 - Driving Assembly; 153 - Displacement Driving Member; 154 - Driving Lead Screw; 155 - Driving Sleeve; 156 - Cross Bar; 157 - Slide Block; 158 - Slide Rail; 160 - First Polishing Head; 161 - First Telescopic Driving Member; 162 - First Base Body; 163 - First Rotary Driving Member; 164 - First Suction Head Body; 170 - Second Polishing Head; 180 - Lifting Assembly; 181 - Lifting Driving Member; 182 - Guide Block; 183 - First Suction Block; 184 - Second Suction Block; 185 - Auxiliary Driving Member. Detailed Implementation Manner

[0019] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. Usually, the components of the embodiments of the present invention described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0020] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed present invention, but merely represents selected embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts fall within the scope of protection of the present invention.

[0021] It should be noted that: Similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0022] In the description of the present invention, it should be noted that if terms such as "upper", "lower", "inner", "outer", etc. are used to indicate the orientation or positional relationship, it is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the invention is usually placed during use. This is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention.

[0023] In addition, if terms such as "first", "second", etc. are only used for distinguishing descriptions, they cannot be understood as indicating or implying relative importance.

[0024] As disclosed in the background art, in the existing CMP polishing machine, a single polishing head is usually used to adsorb the wafer on the polishing pad for polishing, and a single-line process is adopted, that is, only one wafer can be polished at a time. This single-line polishing method has low efficiency. Further, in the prior art, a multi-wafer polishing technology has also emerged, that is, multi-wafer ceramic disk polishing, which polishes multiple wafers using the same polishing pad. However, this polishing method has great difficulty in disk matching, and the thickness difference of the polished wafers needs to meet within 3 μm, with poor applicability and inflexibility. Moreover, in the conventional multi-wafer ceramic polishing scheme, the polishing quality is limited, the cost of broken pieces is high. If one piece is broken, the whole disk is scrapped, or if there is a problem with the polishing pad / polishing liquid, there will be problems with the entire batch of wafers, resulting in huge losses. At the same time, in the conventional multi-wafer ceramic polishing scheme, due to the simultaneous polishing of multiple wafers, it is difficult to control the temperature, and orange peel phenomenon is likely to occur during polishing.

[0025] Furthermore, in the existing polishing equipment, since the polishing head usually uses a robotic arm to achieve displacement, and the displacement distance of the robotic arm is limited, the polishing action and the cleaning and drying actions cannot be completed in one process. Therefore, the conventional polishing equipment and the cleaning and drying equipment are usually independent equipment, with poor overall integration. It is necessary to temporarily store the polished wafers and then re-transport them to the cleaning and drying equipment, and it is impossible to achieve integration of polishing, cleaning and drying. The process is complex and the efficiency is low. Moreover, in the existing polishing disk, due to the single-disk structure or multiple polishing disks being on the same horizontal plane, it is difficult to recycle the polishing liquid, resulting in waste of the polishing liquid. Finally, in the existing cleaning and drying equipment, it usually uses a robotic arm to place or grab the wafer, and when the wafer is immersed in the cleaning liquid, it will cause difficulty in grabbing, and it is difficult to quickly and harmlessly take out the wafer for drying.

[0026] To solve the above problems, an embodiment of the present invention provides a new type of integrated polishing, cleaning and drying machine. It should be noted that, without conflict, the features in the embodiments of the present invention can be combined with each other.

[0027] The object of the present invention is to provide a polishing, cleaning and drying integrated machine, which can achieve multi-line polishing with high polishing efficiency, and at the same time can integrate polishing, cleaning and drying, simplifying the manufacturing process.

[0028] See Figure 1 and Figure 2 As shown in and, the polishing, cleaning and drying integrated machine 100 provided by the embodiment of the present invention includes a rough polishing device 110, a fine polishing device 120, a cleaning and drying device 130 and a polishing driving device 140. The rough polishing device 110 includes a plurality of rough polishing discs arranged in sequence, and the rough polishing discs are used for rough polishing of the wafers; the fine polishing device 120 includes a plurality of fine polishing discs arranged in sequence, and the plurality of fine polishing discs are correspondingly arranged at the rear sides of the plurality of rough polishing discs, and the fine polishing discs are used for fine polishing of the wafers; the cleaning and drying device 130 is arranged at the rear side of the fine polishing device 120, and the cleaning and drying device 130 is used for cleaning and drying the wafers; the polishing driving device 140 includes a driving mechanism 150 and a plurality of polishing heads, the driving mechanism 150 is connected to the plurality of polishing heads and is used for synchronously driving the plurality of polishing heads to move synchronously; wherein, the plurality of polishing heads are used for respectively adsorbing a plurality of wafers, and under the drive of the driving mechanism 150, placing the plurality of wafers on the plurality of rough polishing discs for rough polishing and then placing them on the plurality of fine polishing discs for fine polishing, and the plurality of polishing heads are also used for sending the plurality of wafers after fine polishing into the cleaning and drying device 130 under the drive of the driving mechanism 150.

[0029] In this embodiment, the plurality of rough polishing discs include a first rough polishing disc 111 and a second rough polishing disc 112. The horizontal height of the first rough polishing disc 111 is greater than the horizontal height of the second rough polishing disc 112, and a first liquid discharge pipe 113 is further arranged between the first rough polishing disc 111 and the second rough polishing disc 112. The first liquid discharge pipe 113 is used for sending the polishing liquid polished by the first rough polishing disc 111 into the second rough polishing disc 112; the plurality of fine polishing discs include a first fine polishing disc 121 and a second fine polishing disc 122. The horizontal height of the first fine polishing disc 121 is greater than the horizontal height of the second fine polishing disc 122, and a second liquid discharge pipe 123 is further arranged between the first fine polishing disc 121 and the second fine polishing disc 122. The second liquid discharge pipe 123 is used for sending the polishing liquid polished by the second fine polishing disc 122 into the second fine polishing disc 122.

[0030] It should be noted that the first rough polishing disc 111 and the second rough polishing disc 112 are arranged on the first machine table, the first fine polishing disc 121 and the second fine polishing disc 122 are arranged on the second machine table, the first rough polishing disc 111 and the first fine polishing disc 121 are arranged corresponding to each other in the front-rear direction, and the first fine polishing disc 121 is located behind the first rough polishing disc 111; the second rough polishing disc 112 and the second fine polishing disc 122 are arranged corresponding to each other in the front-rear direction, and the second fine polishing disc 122 is located behind the second rough polishing disc 112. By providing the first liquid discharge pipe 113 and the second liquid discharge pipe 123, the recycling of the rough polishing liquid and the fine polishing liquid can be realized, avoiding the waste of the polishing liquid.

[0031] Furthermore, the rough polishing device 110 further includes a rough polishing recovery barrel 114. The rough polishing recovery barrel 114 is arranged below the second rough polishing disc 112 for collecting the polishing liquid after polishing by the second rough polishing disc 112. A first filtering port is provided on the rough polishing recovery barrel 114. A first delivery pump 115 is provided at the first filtering port and is connected to a first circulation pipe 116. The first circulation pipe 116 is connected to the first rough polishing disc 111 for circulating and delivering the filtered polishing liquid to the first rough polishing disc 111. The fine polishing device 120 further includes a fine polishing recovery barrel 124. The fine polishing recovery barrel 124 is arranged below the second fine polishing disc for collecting the polishing liquid after polishing by the second fine polishing disc 122. A second filtering port is provided on the fine polishing recovery barrel 124. A second delivery pump 125 is provided at the second filtering port and is connected to a second circulation pipe 126. The second circulation pipe 126 is connected to the second rough polishing disc 112 for circulating and delivering the filtered polishing liquid to the second rough polishing disc 112.

[0032] It is worth noting that in this embodiment, the rough polishing recovery barrel 114 is arranged on the first machine table and is located below the second rough polishing disc 112. The waste liquid generated after polishing by the second rough polishing disc 112 is sent into the rough polishing recovery barrel 114 by using the first liquid discharge pipe 113. A filtering structure is provided at the first filtering port, which can filter the waste liquid and then pump it back to the first rough polishing disc 111 for secondary use. Similarly, the fine polishing recovery barrel 124 is arranged on the second machine table and is located below the second fine polishing disc 122. The waste liquid generated after polishing by the second fine polishing disc 122 is sent into the fine polishing recovery barrel 124 by using the second liquid discharge pipe 123. Similarly, a filtering structure is provided at the second filtering port, which can filter the waste liquid and then pump it back to the first fine polishing disc 121 for secondary use. The recycling of the rough polishing liquid and the fine polishing liquid is realized.

[0033] See Figures 3 to 5, in some embodiments, the driving mechanism 150 includes a hanger 151 and a driving component 152. The hanger 151 extends from above the rough polishing device 110 to above the cleaning and drying device 130. The driving component 152 is disposed on the hanger 151. The plurality of polishing heads include a first polishing head 160 and a second polishing head 170. The driving component 152 is simultaneously drivingly connected to the first polishing head 160 and the second polishing head 170. The first polishing head 160 is used to adsorb the first wafer and, driven by the driving component 152, send the first wafer to the first rough polishing disc 111, the first fine polishing disc 121, and the cleaning and drying device 130 respectively. The second polishing head 170 is used to adsorb the second wafer and, driven by the driving component 152, send the second wafer to the second rough polishing disc 112, the second fine polishing disc 122, and the cleaning and drying device 130 respectively. Specifically, the hanger 151 can be disposed on the top side of the external frame, so as to ensure that the hanger 151 is disposed above the rough polishing device 110, the fine polishing device 120, and the cleaning and drying device 130, facilitating the driving component 152 to drive the first polishing head 160 and the second polishing head 170 to move between the rough polishing device 110, the fine polishing device 120, and the cleaning and drying device 130.

[0034] It should be noted that the first polishing head 160 and the second polishing head 170 can implement two polishing, cleaning, and drying production lines. Specifically, the first polishing head 160 and the second polishing head 170 respectively adsorb the first wafer and the second wafer. At the same time, the first polishing head 160 and the second polishing head 170 are driven by the driving component 152 to sequentially move to the rough polishing device 110, the fine polishing device 120, and the cleaning and drying device 130. The first wafer is first pressed against the first rough polishing disc 111 by the first polishing head 160 for rough polishing, then pressed against the first fine polishing disc 121 by the first polishing head 160 for fine polishing, and finally sent to the cleaning and drying device 130 by the first polishing head 160 for cleaning and drying. Synchronously, the second wafer is sequentially pressed against the second rough polishing disc 112, the second fine polishing disc 122, and the cleaning and drying device 130.

[0035] It should be further noted that in this embodiment, the first polishing head 160 and the second polishing head 170 are of a synchronous motion structure, and the first polishing head 160 and the second polishing head 170 have the function of vacuum-adsorbing wafers, which is convenient for fixing the first wafer and the second wafer.

[0036] In some embodiments, the driving assembly 152 includes a displacement driving member 153, a driving lead screw 154, a driving sleeve 155, and a cross bar 156. The displacement driving member 153 is disposed on the hanger 151 and is in transmission connection with the driving lead screw 154 for driving the driving lead screw 154 to rotate. The driving sleeve 155 is threadedly sleeved on the driving lead screw 154 and can move along the driving lead screw 154. The cross bar 156 is connected to the driving sleeve 155. Both the first polishing head 160 and the second polishing head 170 are connected to the cross bar 156 and are respectively located on both sides of the driving sleeve 155. Sliders 157 are provided at both ends of the cross bar 156, and slide rails 158 are provided on the hanger 151. The sliders 157 are slidably disposed on the slide rails 158. Specifically, both ends of the driving lead screw 154 can be connected to the hanger 151 through bearings. The slide rails 158 are parallel to the driving lead screw 154 and both extend in the front-rear direction. There are two slide rails 158, which are respectively on both sides of the driving lead screw 154. The two sliders 157 are slidably disposed on the slide rails 158. Through the arrangement of the sliders 157 and the slide rails 158, the stability and reliability of the movement process of the first polishing head 160 and the second polishing head 170 can be ensured.

[0037] Further, the displacement driving member 153 can be a driving motor, which can drive the driving lead screw 154 to rotate. The driving sleeve 155 is provided with an internal thread. By rotating the driving lead screw 154, the driving sleeve 155 can be driven to move in the front-rear direction, so that the first polishing head 160 and the second polishing head 170 on the cross bar 156 can move synchronously back and forth.

[0038] In some embodiments, the first polishing head 160 includes a first telescopic driving member 161, a first base body 162, a first rotational driving member 163, and a first suction head body 164. One end of the first telescopic driving member 161 is connected to the cross bar 156, and the other end is connected to the first base body 162 for driving the first base body 162 to rise or fall. The first rotational driving member 163 is disposed on the first base body 162 and is connected to the first suction head body 164 for driving the first suction head body 164 to rotate. The first suction head body 164 is used for sucking the first wafer. Specifically, the first telescopic driving member 161 can be a telescopic cylinder, and the first rotational driving member 163 can be a driving motor. By the driving motor, the first suction head body 164 can be driven to rotate, so as to drive the first wafer to rotate on the first rough polishing disc 111 or the first fine polishing disc 121 to achieve polishing. The first telescopic driving member 161 can drive the first base body 162 and the first suction head body 164 to move up and down, so as to ensure that the first wafer can be pressed against the first rough polishing disc 111 or the first fine polishing disc 121.

[0039] Specifically, the structure of the second polishing head 170 is the same as that of the first polishing head 160, and will not be introduced in detail here. Specifically, the second polishing head 170 includes a second telescopic driving member, a second seat body, a second rotational driving member, and a second suction head body. One end of the second telescopic driving member is connected to the cross bar 156, and the other end is connected to the second seat body, and is used to drive the second seat body to rise or fall. The second rotational driving member is disposed on the second seat body and is connected to the second suction head body, and is used to drive the second suction head body to rotate. The second suction head body is used to adsorb the second wafer.

[0040] It should be noted that both the first suction head body 164 and the second suction head body here have a vacuum suction function, and can stably adsorb the wafers.

[0041] It is worth noting that during polishing, the first wafer and the second wafer can be adsorbed by the first suction head body 164 and the second suction head body respectively. Then, the first telescopic driving member 161 and the second telescopic driving member contract upward, and the displacement driving member 153 is used to move the cross bar 156 and the first polishing head 160 body and the second polishing head 170 body below it to the rough polishing device 110. The first telescopic driving member 161 and the second telescopic driving member expand downward, driving the first polishing head 160 body and the second polishing head 170 body to move toward the first rough polishing disc 111 and the second rough polishing disc 112 respectively. At this time, the expansion extension length of the second telescopic driving member is greater than that of the first telescopic driving member 161, so that the first wafer and the second wafer can be respectively pressed against the first rough polishing disc 111 and the second rough polishing disc 112 to complete rough polishing. After rough polishing, the first telescopic driving member 161 and the second telescopic driving member are reset, and then moved to the fine polishing device 120 under the drive of the displacement driving member 153 again. The above actions are repeated, so that the first wafer and the second wafer can be pressed against the first fine polishing disc 121 and the second fine polishing disc 122 to complete fine polishing. Finally, it is sent to the cleaning and drying device 130.

[0042] See Figure 6In some embodiments, the cleaning and drying device 130 includes a cleaning box 131, a cleaning platform 132, a lifting assembly 135 and a lifting assembly 180. The cleaning box 131 is filled with cleaning liquid and is provided with an articulated seat 133 on one side of the bottom. The cleaning platform 132 is arranged in the cleaning box 131, and one end of the cleaning platform 132 is rotatably connected to the articulated seat 133, and the other end is provided with a plurality of wafer placement positions, and the plurality of wafer placement positions are used to place a plurality of wafers. The lifting assembly 135 is transmission-connected to one end of the cleaning platform 132 away from the articulated seat 133, and is used to drive the cleaning platform 132 to rotate relative to the articulated seat 133 to lift the wafer placement position. The lifting assembly 180 is at least partially arranged on the cleaning platform 132, and is used to drive the wafer on the wafer placement position to separate from the cleaning liquid for drying. Specifically, the cleaning platform 132 is in the shape of a flat plate, and there are two wafer placement positions, and the two wafer placement positions are used to place the first wafer and the second wafer, respectively. During actual placement, the first adsorption head body 164 and the second adsorption head body can be used to place the first wafer and the second wafer in the wafer placement position and then release the adsorption, so that the first wafer and the second wafer can be placed in the wafer placement position for cleaning.

[0043] It should be noted that a bubbling and ultrasonic device is also provided at the bottom of the cleaning box 131, and the first wafer and the second wafer are cleaned by bubbling and ultrasonic cleaning in combination with washing with the cleaning liquid. After cleaning, the cleaning platform 132 is lifted by the lifting assembly 135, and the wafer is taken out of the cleaning liquid for drying by the lifting assembly 180. Preferably, the lifting assembly 135 can lift the cleaning platform 132 to a position with an inclination of 30° with the horizontal direction, so as to facilitate the subsequent removal of the wafer.

[0044] Furthermore, a vacuum adsorption plate 134 is provided on each wafer placement position, and the vacuum adsorption plate 134 is used to adsorb the wafer. The lifting assembly 135 includes a lifting drive member, which is hinged to the bottom side of the cleaning platform 132 and corresponds to the vacuum adsorption plate 134, and is used to lift the cleaning platform 132 to a preset tilt angle. Specifically, the lifting drive member can be a cylinder or a servo motor, which can lift the cleaning platform 132 to a tilt, and the tilt angle can be adjusted, preferably 30°. The vacuum adsorption plate 134 can vacuum adsorb and fix the first wafer or the second wafer placed down, thereby avoiding displacement of the wafer during cleaning and lifting. When the lifting assembly 180 takes out the wafer, the vacuum adsorption plate 134 can also release the adsorption for easy removal. The setting position of the lifting drive member corresponds to the vacuum adsorption plate 134, which can accurately lift the vacuum adsorption plate 134 upward and make the cleaning platform 132 tilted.

[0045] The lifting assembly 180 includes a lifting driver 181, a guiding block 182, a first suction block 183, a second suction block 184 and an auxiliary driver 185. The lifting driver 181 is disposed at one end of the cleaning platform 132 close to the hinge seat 133. The guiding block 182 is slidably disposed on the cleaning platform 132 and connected to the lifting driver 181. The guiding block 182 is configured to slide along the cleaning platform 132 driven by the lifting driver 181. The first suction block 183 is connected to the guiding block 182 and is used to adsorb one side edge of the wafer and drive the wafer to move obliquely upward along the cleaning platform 132 driven by the guiding block 182. A support frame 136 is further disposed on one side of the cleaning tank 131 away from the hinge seat 133. The auxiliary driver 185 is disposed on the support frame 136. The second suction block 184 is connected to the auxiliary driver 185 and is used to adsorb one side edge of the wafer away from the hinge seat 133 and drive the wafer to move obliquely upward along the cleaning platform 132 driven by the auxiliary driver 185. The lifting driver 181 and the auxiliary driver 185 can both adopt air cylinders and can realize the pushing of the wafer.

[0046] It should be noted that there are two lifting assemblies 180, and the two lifting assemblies 180 respectively realize the lifting of the first wafer and the second wafer. In the embodiment of the present invention, by adopting the structure in which the hinge seat 133 is rotatably connected to the cleaning platform 132, the cleaning platform 132 only needs to be lifted by the lifting driver to be inclined. The lifting height is low, avoiding the process of using a long-stroke lifting air cylinder in the conventional technology. The stroke requirement for the lifting driver is lower, and more space is saved.

[0047] After the actual cleaning is completed, first, the lifting driver lifts the cleaning platform 132. The cleaning platform 132 drives the vacuum chuck to rotate and lift around the hinge seat 133 until the lifting stops after the cleaning platform 132 is inclined by 30°. At this time, the lifting driver 181 first drives the guiding block 182 and the first suction block 183 to move obliquely upward along the surface of the cleaning platform 132, so that the first suction block 183 can just contact the bottom side edge of the wafer and adsorb the wafer, and the vacuum adsorption table releases the adsorption. At this time, the lifting driver 181 continues to lift, so as to obliquely upward send the wafer out of the liquid surface of the cleaning liquid from the vacuum adsorption table. After the wafer is sent out of the liquid surface, the auxiliary driver 185 drives the second suction block 184 to move obliquely downward and just contact the top side edge of the wafer and adsorb the wafer. At this time, the first suction block 183 releases the adsorption, and the auxiliary driver 185 resets and drives the second suction block 184 to continue to move upward and makes the wafer completely out of the liquid surface for drying.

[0048] It should be noted that a gas inlet is further disposed on the top side of the support frame 136, and isopropyl alcohol (IPA) and N can be introduced through the gas inlet 2Drying is carried out. During drying, the Marangoni effect can be utilized to make the liquid be pulled from the area with low surface tension (IPA) to the area with high surface tension (cleaning liquid), and the liquid on the wafer surface will be pulled towards the water surface below, thus achieving the drying effect, N 2 It is used to assist in drying. At the same time, when drying with IPA, the particles adsorbed on the wafer surface can also be removed, further improving the cleaning effect.

[0049] In summary, for the integrated polishing, cleaning and drying machine 100 provided by the embodiment of the present invention, it is provided with a plurality of rough polishing discs and a plurality of fine polishing discs respectively, and a plurality of polishing lines are formed by using a plurality of polishing heads. Each polishing line is adsorbed by the corresponding polishing head to polish the corresponding wafer roughly and finely, and finally sent to the cleaning and drying device 130 for cleaning and drying. Among them, the driving mechanism 150 can realize the synchronous movement of a plurality of polishing heads, so that multi-line polishing can be realized, greatly improving the polishing efficiency. And because the driving mechanism 150 is used to drive the polishing head to move, the polishing head can move between the polishing station and the cleaning and drying station. Therefore, polishing and cleaning and drying can be integrated in one process, with a higher degree of integration. It can realize multi-line polishing, with high polishing efficiency, and at the same time can realize the integration of polishing, cleaning and drying, simplifying the manufacturing process. In addition, the embodiment of the present invention can realize the recycling of the polishing liquid, saving raw materials and reducing costs. And the cleaning and drying effect is better.

[0050] The above is only the specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed by the present invention should be covered by the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Claims

1. A polishing, cleaning and drying machine, characterized in that: include: A rough polishing device (110), the rough polishing device (110) comprising a plurality of sequentially distributed rough polishing discs, the rough polishing discs being used to perform rough polishing on a wafer; A fine polishing device (120), the fine polishing device (120) comprising a plurality of fine polishing discs distributed in sequence, the plurality of fine polishing discs being correspondingly arranged at the rear sides of the plurality of rough polishing discs, the fine polishing discs being used to achieve fine polishing of the wafer; a cleaning and drying device (130), the cleaning and drying device (130) being arranged at the rear side of the fine polishing device (120), the cleaning and drying device (130) being used to clean and dry the wafer; A polishing drive device (140), the polishing drive device (140) comprising a drive mechanism (150) and a plurality of polishing heads, the drive mechanism (150) being connected to the plurality of polishing heads and being used to synchronously drive the plurality of polishing heads to move synchronously; The plurality of polishing heads are used to absorb the plurality of wafers respectively, and under the drive of the driving mechanism (150), the plurality of wafers are placed on the plurality of rough polishing discs for rough polishing and then placed on the plurality of fine polishing discs for fine polishing. The plurality of polishing heads are also used to send the plurality of wafers after fine polishing into the cleaning and drying device (130) under the drive of the driving mechanism (150).

2. The polishing, cleaning and drying machine according to claim 1, characterized in that: The plurality of rough polishing discs comprise a first rough polishing disc (111) and a second rough polishing disc (112); the horizontal height of the first rough polishing disc (111) is greater than the horizontal height of the second rough polishing disc (112); and a first liquid drainage pipe (113) is provided between the first rough polishing disc (111) and the second rough polishing disc (112); the first liquid drainage pipe (113) is used to deliver polishing liquid after polishing by the first rough polishing disc (111) to the second rough polishing disc (112); The plurality of fine polishing discs comprise a first fine polishing disc (121) and a second fine polishing disc (122); the horizontal height of the first fine polishing disc (121) is greater than the horizontal height of the second fine polishing disc (122); and a second liquid drainage pipe (123) is provided between the first fine polishing disc (121) and the second fine polishing disc (122); the second liquid drainage pipe (123) is used to deliver polishing liquid after polishing the second fine polishing disc (122) to the second fine polishing disc (122).

3. The polishing, cleaning and drying all-in-one machine according to claim 2, characterized in that: The rough polishing device (110) further comprises a rough polishing recovery barrel (114), the rough polishing recovery barrel (114) being arranged below the second rough polishing disc (112) and being used to collect the polishing liquid after polishing by the second rough polishing disc (112), and the rough polishing recovery barrel (114) being further provided with a first filter port, the first filter port being provided with a first delivery pump (115) and being connected to a first circulation pipe (116), the first circulation pipe (116) being connected to the first rough polishing disc (111) and being used to circulate the filtered polishing liquid to the first rough polishing disc (111); The fine polishing device (120) further comprises a fine polishing recovery barrel (124), wherein the fine polishing recovery barrel (124) is arranged below the second fine polishing disc (122) and is used to collect the polishing liquid after polishing by the second fine polishing disc (122), and the fine polishing recovery barrel (124) is also provided with a second filter port, wherein the second filter port is provided with a second delivery pump (125) and is connected to a second circulation pipe (126), and the second circulation pipe (126) is connected to the second rough polishing disc (112) and is used to circulate the filtered polishing liquid to the second rough polishing disc (112).

4. The polishing, cleaning and drying integrated machine according to claim 2, characterized in that: The driving mechanism (150) comprises a hanger (151) and a driving assembly (152); the hanger (151) extends from above the rough polishing device (110) to above the cleaning and drying device (130); the driving assembly (152) is arranged on the hanger (151); the plurality of polishing heads comprises a first polishing head (160) and a second polishing head (170); the driving assembly (152) is simultaneously connected to the first polishing head (160) and the second polishing head (170) by transmission; the first polishing head (160) is used to absorb a first wafer and, driven by the driving assembly (152), delivers the first wafer to the first rough polishing disk (111), the first fine polishing disk (121) and the cleaning and drying device (130); the second polishing head (170) is used to absorb a second wafer and, driven by the driving assembly (152), delivers the second wafer to the second rough polishing disk (112), the second fine polishing disk (122) and the cleaning and drying device (130).

5. The polishing, cleaning and drying all-in-one machine according to claim 4, characterized in that: The driving assembly (152) comprises a displacement driving member (153), a driving screw (154), a driving sleeve (155) and a cross bar (156); the displacement driving member (153) is arranged on the hanger (151) and is drivingly connected to the driving screw (154) for driving the driving screw (154) to rotate; the driving sleeve (155) is threadedly sleeved on the driving screw (154) and can move along the driving screw (154); the cross bar (156) is connected to the driving sleeve (155); the first polishing head (160) and the second polishing head (170) are both connected to the cross bar (156) and are respectively located on both sides of the driving sleeve (155); sliders (157) are arranged at both ends of the cross bar (156); the hanger (151) is provided with a slide rail (158); the slider (157) is slidably arranged on the slide rail (158).

6. The polishing, cleaning and drying integrated machine according to claim 5, characterized in that: The first polishing head (160) includes a first telescopic driving member (161), a first seat body (162), a first rotating driving member (163) and a first adsorption head body (164), one end of the first telescopic driving member (161) is connected to the cross bar (156), and the other end is connected to the first seat body (162), and is used to drive the first seat body (162) to rise or fall, the first rotating driving member (163) is arranged on the first seat body (162), and is connected to the first adsorption head body (164), and is used to drive the first adsorption head body (164) to rotate, and the first adsorption head body (164) is used to adsorb the first wafer.

7. The polishing, cleaning and drying integrated machine according to claim 1, characterized in that: The cleaning and drying device (130) comprises a cleaning box (131), a cleaning platform (132), a lifting assembly (135) and a lifting assembly (180). The cleaning box (131) is filled with cleaning liquid and is provided with a hinge seat (133) on one side of the bottom. The cleaning platform (132) is arranged in the cleaning box (131), and one end of the cleaning platform (132) is rotatably connected to the hinge seat (133), and the other end is provided with a plurality of wafer placement positions, and the plurality of wafer placement positions are used to place a plurality of wafers. The lifting assembly (135) is transmission-connected to one end of the cleaning platform (132) away from the hinge seat (133), and is used to drive the cleaning platform (132) to rotate relative to the hinge seat (133) to lift the wafer placement position. The lifting assembly (180) is at least partially arranged on the cleaning platform (132), and is used to drive the wafers on the wafer placement positions to separate from the cleaning liquid for drying.

8. The polishing, cleaning and drying integrated machine according to claim 7, characterized in that: A vacuum adsorption plate (134) is arranged on each wafer placement position, and the vacuum adsorption plate (134) is used to adsorb the wafer. The lifting assembly (135) includes a lifting drive component, and the lifting drive component is hinged to the bottom side of the cleaning platform (132) and corresponds to the vacuum adsorption plate (134), and is used to lift the cleaning platform (132) to a preset inclination angle.

9. The polishing, cleaning and drying machine according to claim 7, characterized in that: The lifting assembly (180) includes a lifting drive member (181), a guide block (182) and a first suction block (183); the lifting drive member (181) is arranged on one end of the cleaning platform (132) close to the hinge seat (133); the guide block (182) is slidably arranged on the cleaning platform (132) and is connected to the lifting drive member (181); the guide block (182) is used to slide along the cleaning platform (132) driven by the lifting drive member (181); the first suction block (183) is connected to the guide block (182) and is used to absorb one side edge of the wafer and move the wafer upward along the cleaning platform (132) in an inclined manner under the drive of the guide block (182).

10. The polishing, cleaning and drying all-in-one machine according to claim 9, characterized in that: The lifting assembly (180) further comprises a second suction block (184) and an auxiliary driving member (185). A support frame (136) is further provided on the side of the cleaning box (131) away from the hinge seat (133). The auxiliary driving member (185) is provided on the support frame (136). The second suction block (184) is connected to the auxiliary driving member (185) and is used for adsorbing the edge of one side of the chip away from the hinge seat (133) and moving the chip upward along the cleaning platform (132) at an angle driven by the auxiliary driving member (185).

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