Wafer bonding machine for grinding and polishing

Abstract

The present invention relates to the field of wafer processing technology, and discloses a wafer bonding machine for grinding and polishing, comprising a fixing mechanism, wherein a fixing component is fixedly provided inside the fixing mechanism, and a closing component is fixedly provided on the inner wall of the fixing mechanism. Before use, the wafer is first placed on the top of a microporous ceramic vacuum suction cup, wherein a plurality of arc-shaped plates are in a stacked state. When the arc-shaped plates rotate, a circular clamping area is formed at the center position of the plurality of arc-shaped plates, which clamps and limits the side wall of the top wafer of the microporous ceramic vacuum suction cup. While clamping and limiting the wafer, the push of the plurality of arc-shaped plates will ensure that the wafer is in the center position of the microporous ceramic vacuum suction cup, and then the microporous ceramic vacuum suction cup generates an adsorption force. Under the influence of the adsorption force and the side wall clamping force, the equipment is ensured to be able to perform clamping and adsorption processing on wafers of different specifications.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer processing equipment, in particular to a wafer bonding machine for grinding and polishing. Background Art

[0002] This equipment is involved in the manufacturing of specialized equipment for semiconductor devices. In integrated circuit manufacturing, it is manufactured through machine tool fieldbus control systems and other metalworking machinery. Due to the abundant resources of semiconductor wafers, low manufacturing costs, and excellent processability, they are an important substrate material for integrated circuits. The wafer's dimensional accuracy, geometric precision, surface cleanliness, and surface microlattice structure directly determine the quality of the integrated circuit manufacturing process.

[0003] When grinding and polishing wafers, they need to be limited by clamping tools, and vacuum suction cups are conventional limiting components. However, when using them, corresponding suction cup specifications need to be selected according to different wafer sizes, which will increase the cost of using the equipment. To address the above problems, the following solutions are proposed. Summary of the Invention

[0004] To solve the above technical problems, the present invention provides a wafer bonding machine for grinding and polishing, comprising a fixing mechanism, a fixing assembly fixedly provided inside the fixing mechanism, a closing assembly fixedly provided on the inner wall of the fixing mechanism, and the closing assembly being used to clamp and limit the position of the wafer;

[0005] The adsorption mechanism is fixedly installed on the inner wall of the fixed component and is used to adsorb the wafer to ensure that the wafer will not be dislocated due to external forces during the grinding process;

[0006] The limiting mechanism is fixedly mounted on the inner wall of the adsorption mechanism, and is used to provide power for the adsorption of the adsorption mechanism and to limit the operation of the adsorption mechanism;

[0007] Before use, the wafer is first restricted on the top of the fixing mechanism by the fixing mechanism, and then the limiting mechanism applies external negative pressure to the inside of the adsorption mechanism, so that the adsorption mechanism adsorbs the wafer.

[0008] Preferably, a cylinder is provided inside the fixing mechanism, a bracket is fixedly connected to the inner wall of the cylinder, and a mounting ring is fixedly connected to the top of the bracket. The fixing mechanism includes:

[0009] The fixing component is fixedly arranged on the inner wall of the cylinder, provides an installation position for the adsorption mechanism and the restriction mechanism, and provides driving power;

[0010] The closing component is fixedly mounted on the inner wall of the cylinder, and the power generated by the fixed component is transmitted to the closing component;

[0011] The power generated by the fixing component will be transmitted to the closing component, so that the closing component can clamp and limit the external wafer, limiting the left and right lateral movement of the wafer.

[0012] Preferably, the adsorption mechanism comprises:

[0013] The adsorption component is fixedly arranged inside the fixed component through the adsorption piece, and is used for negative pressure adsorption of the external wafer;

[0014] The adsorption component includes a fixed bracket fixedly connected to the inner wall of the mounting ring, a microporous ceramic vacuum suction cup fixedly connected to the inner wall of the fixed bracket, and a transmission tube slidably connected to the inner wall of the through hole of the bracket;

[0015] An exhaust assembly is fixed to the inner wall of the bracket through a transmission member to provide a path for the transmission of negative pressure;

[0016] The transmission member includes a fixed disk fixedly connected to the inner wall of the transmission pipe;

[0017] Among them, the external negative pressure enters from the transmission tube and acts on the inner wall of the microporous ceramic vacuum suction cup to realize the transmission of the external negative pressure.

[0018] Preferably, the limiting mechanism includes:

[0019] A limit assembly is fixed to the inner wall of the fixed plate through a support member to limit the efficiency of negative pressure transmission;

[0020] The support member includes four fixing rods fixedly connected to the bottom of the bracket, and the inner walls of the four fixing rods are provided with limiting grooves;

[0021] An obstruction component is fixed on the top of the fixed bracket by a hydraulic component, and uses a compressive force to limit the sliding of the transmission pipe;

[0022] The hydraulic component includes a hydraulic telescopic rod connected to the top of the fixed bracket, and a spring 1 is fixedly connected to the outer wall of the hydraulic telescopic rod;

[0023] Among them, when the external negative pressure enters the inner wall of the transmission tube, the negative pressure will pass through the inner wall of the through hole of the fixed disk. At this time, the blocking component will drive the limit component to operate and limit the sliding of the transmission tube through the application of the fixed rod.

[0024] Preferably, the fixing assembly includes a plurality of through holes opened on the top of the mounting ring, an L-shaped frame is fixedly connected to the outer wall of the cylinder, an end of the L-shaped frame away from the cylinder is fixedly connected to the fixing ring, and the top of the fixing ring is fixedly connected to the motor;

[0025] Among them, when the equipment is in operation, the motor transmits power to drive the closing components to operate and clamp and restrict the wafer.

[0026] Preferably, the closing component includes a rotating column rotatably connected to the inner walls of several through holes, the upper and lower ends of the rotating column are fixedly connected to gear 1, a rotating ring is rotatably connected to the inner wall of the cylinder, a gear ring is fixedly connected to the inner wall of the rotating ring, the inner wall of the gear ring is meshed with the side wall of gear 1, an arc plate is fixedly connected to the outer wall of the rotating column, the output shaft of the motor is fixedly connected to the outer wall of gear 1, and several arc plates 2 are fixedly connected to the side wall of the rotating column. Before use, the wafer is placed on the top of the microporous ceramic vacuum suction cup, wherein several arc plates are in a stacked state. When the arc plates rotate, the center positions of the several arc plates will form a circular clamping area, so that the arc plates can be moved from Figure 5 The status of F in Figure 4 The state transition of G in the middle;

[0027] Among them, after the motor transmits power to the mounting ring, the mounting ring ensures that the remaining gears rotate in the same direction through the gear ring. While clamping and restricting the wafer, the push of multiple arc plates will ensure that the wafer is in the center position of the microporous ceramic vacuum suction cup. Then the microporous ceramic vacuum suction cup generates adsorption force. Under the influence of the adsorption force and the side wall clamping force, the equipment can clamp and adsorb wafers of different specifications.

[0028] Preferably, the adsorption assembly includes an input tube connected to the bottom of the transmission tube, an end of the transmission tube away from the input tube is connected to a rubber tube, and an end of the rubber tube away from the transmission tube is sealed and fixedly connected to the bottom of the fixed bracket. When the curved plate restrains the wafer, the curved plate 2 at the bottom will continue to rotate synchronously. At this time, the side wall of the rotating curved plate 2 will contact the side wall of the rubber tube and compress the rubber tube to cause deformation.

[0029] Among them, the external negative pressure is transmitted to the inside of the transmission tube through the input tube, and is transmitted to the microporous ceramic vacuum suction cup through the rubber tube, so that the microporous ceramic vacuum suction cup generates adsorption force, and the deformed part of the rubber tube will be in the gap between the arc plate 2 and the microporous ceramic vacuum suction cup. At this time, the contraction of the rubber tube will force the transmission tube to slide upward along the inner wall of the bracket, and the rubber tube will block the outer circle holes of the microporous ceramic vacuum suction cup, limiting the transmission path of the external holes of the microporous ceramic vacuum suction cup. Through the application of the above components, when the crystal disk specification is smaller than the microporous ceramic vacuum suction cup, the arc plate 2 will drive the rubber tube to seal the redundant position of the microporous ceramic vacuum suction cup, so as to avoid the redundant holes causing the adsorption force at the center position to decrease, affecting the adsorption effect of the microporous ceramic vacuum suction cup.

[0030] Preferably, the exhaust assembly includes a sliding plate slidably connected to the inner wall of the through-hole of the fixed disk, the bottom of the sliding plate is fixedly connected to a hollow bracket, and one end of the hollow bracket away from the sliding plate is fixedly connected to a limit plate. An obstruction assembly is provided inside the device. When the input pipe transmits negative pressure, the force of the negative pressure will enter the interior of the transmission pipe and force the hollow bracket and the sliding plate to slide downward along the inner wall of the through-hole of the fixed disk. At this time, a gap is formed between the top of the sliding plate and the inner wall of the through-hole of the fixed disk. The negative pressure will be transmitted to the top of the fixed disk through the above gap and act on the bottom of the microporous ceramic vacuum suction cup through the rubber tube;

[0031] When negative pressure enters the interior of the transmission tube, the force of the negative pressure will force the sliding plate and the hollow bracket to slide downward along the inner wall of the fixed plate.

[0032] When the cam is in a closed position, the piston plate is moved in an L-shaped manner, and the inner wall of the L-shaped groove is connected to the inner wall of the hydraulic telescopic rod. When the cam is in a closed position, the piston plate is moved in an L-shaped manner, and the inner wall of the L-shaped groove is connected to the inner wall of the hydraulic telescopic rod. When the cam is in a closed position, the piston plate is moved in an L-shaped manner, and the inner wall of the L-shaped groove is connected to the inner wall of the hydraulic telescopic rod. When the cam is in a closed position, the piston plate is moved in an L-shaped manner, and the inner wall of the L-shaped groove is connected to the inner wall of the hydraulic telescopic rod.

[0033] Among them, when the negative pressure forces the sliding plate to slide downward, the spring is compressed, so that the internal hydraulic oil is transmitted to the inside of the L-shaped slide through the L-shaped slide, forcing the piston plate to slide outward along the inner wall of the L-shaped slide, inserting the limiting rod into the inner wall of the limit groove, and limiting the upward movement of the transmission pipe.

[0034] Preferably, the obstruction component includes a limit plate 2 fixedly connected to the hollow bracket away from the limit plate 1 end, the top of the hydraulic telescopic rod is fixedly connected to a sliding rod, the outer wall of the sliding rod is slidably connected to the inner wall of the through hole of the limit plate 2, and the bottom of the limit plate 2 is contacted with the top of the hydraulic telescopic rod. After the grinding is completed, the input pipe will transmit high-pressure gas to the rubber cylinder. At this time, the high-pressure gas will force the sliding plate to move upward. At this time, the spring 1 will drive the hydraulic telescopic rod to reset. At this time, the limit rod will be away from the fixed rod, and the hollow bracket will drive the limit plate 2 to move upward. At this time, the high-pressure gas will be ejected outward through the gap formed by the bottom of the sliding plate and the top of the fixed plate, and the ejected gas will be ejected outward through the holes of the microporous ceramic vacuum suction cup, and at this time the motor will flip, causing the arc plate to move outward. Figure 4 The state of G in Figure 5 The state transition of F in the middle;

[0035] Among them, when negative pressure is generated, the sliding rod will compress the hydraulic telescopic rod to cause deformation, and when high-pressure gas appears inside the transmission tube, the high-pressure gas will push the sliding plate up, so that the high-pressure gas is discharged upward through the gap between the bottom of the sliding plate and the inner wall of the through hole of the fixed plate. Since the arc plates are in a stacked state, during the contraction of the arc plates, impurities accumulated on the top of the arc plates will be scraped off and eventually fall down through the gap between the fixed brackets. When excess impurities fall on the surface of the microporous ceramic vacuum suction cup, the pressure of the external spray of the microporous ceramic vacuum suction cup will push the impurities to spray out and fall down from the gap of the fixed bracket. Through the application of the above components, the input pipe can shield the unused area of ​​the microporous ceramic vacuum suction cup when in use, and after grinding is completed, the impurities on the outer wall of the arc plate are removed again, thereby reducing the probability of blockage of the holes of the microporous ceramic vacuum suction cup and extending the service life of the equipment.

[0036] The present invention has the following beneficial effects:

[0037] (1) The present invention addresses the problem of the need to replace the adsorption mold due to the different sizes of wafers. An adsorption mechanism and a limiting mechanism are set inside the device. Before use, the wafer is placed on the top of the microporous ceramic vacuum suction cup, wherein several arc plates are in a stacked state. When the arc plates rotate, the center positions of the several arc plates will form a circular clamping area, so that the arc plates can be adjusted from the center of the device to the top of the device. Figure 5 The status of F in Figure 4 The state of middle G changes, and this area will clamp and limit the side wall of the top wafer of the microporous ceramic vacuum suction cup. While clamping and limiting the wafer, the push of multiple arc plates will ensure that the wafer is in the center position of the microporous ceramic vacuum suction cup. Then the microporous ceramic vacuum suction cup generates adsorption force. Under the influence of the adsorption force and the side wall clamping force, the equipment can clamp and adsorb wafers of different specifications.

[0038] (2) The present invention utilizes the characteristic that the rotating ring drives the gear 1 to rotate, and an arc plate 2 and a rubber tube are provided inside the equipment. When the arc plate restricts the wafer, the arc plate 2 at the bottom will continue to rotate synchronously. At this time, the side wall of the rotating arc plate 2 will contact the side wall of the rubber tube and compress the rubber tube to deform. The deformed part of the rubber tube will be in the gap between the arc plate 2 and the microporous ceramic vacuum suction cup. At this time, the contraction of the rubber tube will force the transmission tube to slide upward along the inner wall of the bracket. The rubber tube will block the outer ring holes of the microporous ceramic vacuum suction cup and limit the transmission path of the external holes of the microporous ceramic vacuum suction cup. Through the application of the above components, when the crystal disk specification is smaller than the microporous ceramic vacuum suction cup, the arc plate 2 will drive the rubber tube to seal the redundant position of the microporous ceramic vacuum suction cup to avoid the redundant holes causing the adsorption force of the center position to decrease, affecting the adsorption effect of the microporous ceramic vacuum suction cup.

[0039] (3) The present invention utilizes the characteristic that the above-mentioned rubber tube is deformed by the operation of the arc plate 2, and an obstruction component is set inside the equipment. When the input pipe transmits negative pressure, the force of the negative pressure will enter the inside of the transmission tube and force the hollow bracket and the sliding plate to slide downward along the inner wall of the through hole of the fixed disk. At this time, a gap is formed between the top of the sliding plate and the inner wall of the through hole of the fixed disk. The negative pressure will be transmitted to the top of the fixed disk through the above gap and act on the bottom of the microporous ceramic vacuum suction cup through the rubber tube; and when the hollow bracket moves downward under the negative pressure, the hollow bracket will drive the limiting plate 2 to press the hydraulic telescopic rod, so that the hydraulic oil inside the hydraulic telescopic rod enters the inside of the L-shaped slide groove and forces the piston plate to move outward along the horizontal inner wall of the L-shaped slide groove. The outward-moving piston plate drives the limiting rod to insert into the inner wall of the limiting groove. At this time, the limiting groove limits the upward movement of the transmission tube through the limiting rod. Through the application of the above-mentioned components, it is ensured that when negative pressure occurs inside the rubber tube, the transmission tube is restricted and no longer moves, thereby avoiding the negative pressure causing a large deformation of the rubber tube and affecting the adsorption force of the microporous ceramic vacuum suction cup.

[0040] (4) After the present invention is used, the impurities remaining from grinding will accumulate on the top of the arc plate. After grinding is completed, the input pipe will transmit high-pressure gas to the rubber cylinder. At this time, the high-pressure gas will force the sliding plate to move upward. At this time, the spring 1 will drive the hydraulic telescopic rod to reset. At this time, the limit rod will move away from the fixed rod, and the hollow bracket will drive the limit plate 2 to move upward. At this time, the high-pressure gas will be ejected outward through the gap formed by the bottom of the sliding plate and the top of the fixed plate. The ejected gas will be ejected outward through the holes of the microporous ceramic vacuum suction cup, and the motor will flip, causing the arc plate to move upward. Figure 4 The state of G in Figure 5 In the state transition of F, since the arc plates are in a stacked state, during the contraction of the arc plates, the impurities accumulated on the top of the arc plates will be scraped off and eventually fall down through the gaps between the fixed brackets. When excess impurities fall on the surface of the microporous ceramic vacuum suction cup, the pressure of the microporous ceramic vacuum suction cup will push the impurities to be ejected outwards and fall down from the gaps of the fixed brackets. Through the application of the above components, the input pipe can shield the unused area of ​​the microporous ceramic vacuum suction cup when in use, and remove impurities on the outer wall of the arc plate again after grinding is completed, thereby reducing the probability of clogging of the holes of the microporous ceramic vacuum suction cup and extending the service life of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0042] Figure 1It is a schematic cross-sectional view of the overall structure of the present invention;

[0043] Figure 2 It is a schematic diagram of the overall structure of the present invention;

[0044] Figure 3 It is a cross-sectional schematic diagram of the fixing assembly of the present invention;

[0045] Figure 4 is a schematic cross-sectional view of a closure assembly of the present invention;

[0046] Figure 5 This is a schematic diagram of the adsorption component of the present invention;

[0047] Figure 6 Schematic diagram of the curved plate of the present invention;

[0048] Figure 7 It is a cross-sectional schematic diagram of the limiting group of the present invention;

[0049] Figure 8 is a schematic cross-sectional view of an exhaust assembly of the present invention;

[0050] Figure 9 For the present invention Figure 8 A is an enlarged schematic diagram.

[0051] In the accompanying drawings, the components represented by the reference numerals are as follows:

[0052] In the figure: 1. Fixing mechanism; 11. Fixing assembly; 12. Closing assembly; 13. Cylinder; 111. Bracket; 112. Mounting ring; 113. Through hole; 114. Motor; 115. L-shaped frame; 116. Fixing ring; 121. Rotating column; 122. Gear 1; 123. Rotating ring; 124. Gear ring; 125. Arc plate; 126. Arc plate 2; 2. Adsorption mechanism; 21. Adsorption assembly; 22. Exhaust assembly; 211. Fixing bracket; 212. Micropore Ceramic vacuum suction cup; 213, transmission tube; 214, rubber tube; 215, input tube; 221, fixed plate; 222, sliding plate; 223, hollow bracket; 224, limit plate 1; 3, limiting mechanism; 31, limit assembly; 32, obstruction assembly; 311, fixed rod; 312, limit groove; 313, L-shaped slide; 314, piston plate; 315, limit rod; 321, hydraulic telescopic rod; 322, spring 1; 323, limit plate 2; 324, sliding rod. DETAILED DESCRIPTION

[0053] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0054] For example 1, please refer to Figure 1 - Figure 6 The present invention is a wafer bonding machine for grinding and polishing, comprising a fixing mechanism 1, a fixing component 11 being fixedly provided inside the fixing mechanism 1, and a closing component 12 being fixedly provided on the inner wall of the fixing mechanism 1, the closing component 12 being used for clamping and limiting the position of the wafer;

[0055] The adsorption mechanism 2 is fixedly mounted on the inner wall of the fixed component 11 and is used to adsorb the wafer to ensure that the wafer will not be dislocated due to external forces during the grinding process;

[0056] The limiting mechanism 3 is fixedly mounted on the inner wall of the adsorption mechanism 2 and is used to provide power for the adsorption of the adsorption mechanism 2 and to limit the operation of the adsorption mechanism 2;

[0057] Before use, the wafer is first restricted on the top of the fixing mechanism 1 by the fixing mechanism 1 , and then the limiting mechanism 3 applies external negative pressure to the inside of the adsorption mechanism 2 , so that the adsorption mechanism 2 adsorbs the wafer.

[0058] The fixing mechanism 1 is provided with a cylinder 13 inside, a bracket 111 is fixedly connected to the inner wall of the cylinder 13, and a mounting ring 112 is fixedly connected to the top of the bracket 111. The fixing mechanism 1 includes:

[0059] The fixing assembly 11 is fixedly arranged on the inner wall of the cylinder 13, provides a mounting position for the adsorption mechanism 2 and the limiting mechanism 3, and provides driving power;

[0060] The closing component 12 is fixedly mounted on the inner wall of the cylinder 13, and the power generated by the fixing component 11 is transmitted to the closing component 12;

[0061] The power generated by the fixing assembly 11 is transmitted to the closing assembly 12 , so that the closing assembly 12 clamps and limits the external wafer, limiting the left and right lateral movement of the wafer.

[0062] The adsorption mechanism 2 includes:

[0063] The adsorption component 21 is fixedly arranged inside the fixed component 11 through an adsorption member, and is used to perform negative pressure adsorption on the external wafer;

[0064] The adsorption member includes a fixed bracket 211 fixedly connected to the inner wall of the mounting ring 112, a microporous ceramic vacuum suction cup 212 fixedly connected to the inner wall of the fixed bracket 211, and a transmission tube 213 slidably connected to the inner wall of the through hole of the bracket 111;

[0065] The exhaust assembly 22 is fixed to the inner wall of the bracket 111 through a transmission member to provide a path for the transmission of negative pressure;

[0066] The transmission member includes a fixed plate 221 fixedly connected to the inner wall of the transmission pipe 213;

[0067] The external negative pressure enters from the transmission tube 213 and acts on the inner wall of the microporous ceramic vacuum chuck 212 to realize the transmission of the external negative pressure.

[0068] Restriction agencies 3 include:

[0069] The limiting assembly 31 is fixed to the inner wall of the fixed plate 221 through a support member to limit the efficiency of negative pressure transmission;

[0070] The support member includes four fixing rods 311 fixedly connected to the bottom of the bracket 111, and the inner walls of the four fixing rods 311 are provided with limiting grooves 312;

[0071] The obstruction component 32 is fixed to the top of the fixed bracket 211 by a hydraulic component, and uses a compressive force to limit the sliding of the transmission tube 213;

[0072] The hydraulic component includes a hydraulic telescopic rod 321 connected to the top of the fixed bracket 211, and a spring 1 322 is fixedly connected to the outer wall of the hydraulic telescopic rod 321;

[0073] When the external negative pressure enters the inner wall of the transmission tube 213, the negative pressure will pass through the inner wall of the through hole of the fixed disk 221. At this time, the blocking component 32 will drive the limiting component 31 to operate, and through the application of the fixing rod 311, limit the sliding of the transmission tube 213.

[0074] For example 2, please refer to Figure 7 - Figure 9 The present invention is a wafer bonding machine for grinding and polishing. Based on Example 1, the fixing assembly 11 includes a plurality of through holes 113 formed on the top of the mounting ring 112. An L-shaped frame 115 is fixedly connected to the outer wall of the cylinder 13. A fixing ring 116 is fixedly connected to the end of the L-shaped frame 115 away from the cylinder 13. A motor 114 is fixedly connected to the top of the fixing ring 116.

[0075] When the device is in operation, the motor 114 transmits power to drive the closing assembly 12 to operate and clamp the wafer.

[0076] The closing component 12 includes a rotating column 121 rotatably connected to the inner walls of several through holes 113, and the upper and lower ends of the rotating column 121 are fixedly connected to gear 122. A rotating ring 123 is rotatably connected to the inner wall of the cylinder 13, and a gear ring 124 is fixedly connected to the inner wall of the rotating ring 123. The inner wall of the gear ring 124 is meshed with the side wall of gear 122. An arc plate 125 is fixedly connected to the outer wall of the rotating column 121, and the output shaft of the motor 114 is fixedly connected to the outer wall of gear 122. Several arc plates 2 126 are fixedly connected to the side wall of the rotating column 121. Before use, the wafer is placed on the top of the microporous ceramic vacuum suction cup 212, wherein several arc plates 125 are in a stacked state. When the arc plates 125 rotate, the center positions of the several arc plates 125 will form a circular clamping area, so that the arc plates 125 can be moved from Figure 5 The status of F in Figure 4 The state transition of G in the middle;

[0077] Among them, after the motor 114 transmits power to the mounting ring 112, the mounting ring 112 ensures that the remaining gears 122 rotate in the same direction through the gear ring 124. While clamping and restricting the wafer, the push of multiple arc plates 125 will ensure that the wafer is in the center position of the microporous ceramic vacuum suction cup 212. Then the microporous ceramic vacuum suction cup 212 generates an adsorption force. Under the influence of the adsorption force and the side wall clamping force, the equipment can be guaranteed to clamp and adsorb wafers of different specifications.

[0078] The adsorption assembly 21 includes an input tube 215 connected to the bottom of the transmission tube 213. The end of the transmission tube 213 away from the input tube 215 is connected to a rubber tube 214. The end of the rubber tube 214 away from the transmission tube 213 is sealed and fixedly connected to the bottom of the fixed bracket 211. When the curved plate 125 restrains the wafer, the curved plate 126 at the bottom will continue to rotate synchronously. At this time, the side wall of the rotating curved plate 126 will contact the side wall of the rubber tube 214, pressing the rubber tube 214 to deform.

[0079] Among them, the external negative pressure is transmitted to the inside of the transmission tube 213 through the input tube 215, and is transmitted to the microporous ceramic vacuum suction cup 212 through the rubber tube 214, so that the microporous ceramic vacuum suction cup 212 generates an adsorption force. The deformed part of the rubber tube 214 will be in the gap between the arc plate 216 and the microporous ceramic vacuum suction cup 212. At this time, the contraction of the rubber tube 214 will force the transmission tube 213 to slide upward along the inner wall of the bracket 111. The rubber tube 214 will block the outer circle holes of the microporous ceramic vacuum suction cup 212, limiting the transmission path of the external holes of the microporous ceramic vacuum suction cup 212. Through the application of the above components, when the crystal disk specification is smaller than the microporous ceramic vacuum suction cup 212, the arc plate 216 will drive the rubber tube 214 to block the redundant position of the microporous ceramic vacuum suction cup 212, thereby preventing the redundant holes from causing the adsorption force at the center position to decrease, affecting the adsorption effect of the microporous ceramic vacuum suction cup 212.

[0080] The exhaust assembly 22 includes a sliding plate 222 that is slidably connected to the inner wall of the through-hole of the fixed disk 221. The bottom of the sliding plate 222 is fixedly connected to a hollow bracket 223. The end of the hollow bracket 223 away from the sliding plate 222 is fixedly connected to a limit plate 224. An obstruction assembly 32 is provided inside the device. When the input pipe 215 transmits negative pressure, the force of the negative pressure will enter the inside of the transmission pipe 213 and force the hollow bracket 223 and the sliding plate 222 to slide downward along the inner wall of the through-hole of the fixed disk 221. At this time, a gap is formed between the top of the sliding plate 222 and the inner wall of the through-hole of the fixed disk 221. The negative pressure will be transmitted to the top of the fixed disk 221 through the above gap and act on the bottom of the microporous ceramic vacuum suction cup 212 through the rubber tube 214;

[0081] When negative pressure enters the interior of the transmission tube 213 , the force of the negative pressure will force the sliding plate 222 and the hollow bracket 223 to slide downward along the inner wall of the fixed plate 221 .

[0082] The limiting assembly 31 includes an L-shaped groove 313 provided on the inner wall of the fixed plate 221. The inner wall of the L-shaped groove 313 is connected to the inner wall of the hydraulic telescopic rod 321. A piston plate 314 is slidably connected to the inner wall of the L-shaped groove 313. A limiting rod 315 is fixedly connected to the inner wall of the piston plate 314. When the hollow bracket 223 moves downward under negative pressure, the hollow bracket 223 will drive the limiting plate 323 to press the hydraulic telescopic rod 321, so that the hydraulic oil inside the hydraulic telescopic rod 321 enters the L-shaped groove 313. 13, and forces the piston plate 314 to move outward along the lateral inner wall of the L-shaped slide groove 313. The outward-moving piston plate 314 drives the limiting rod 315 to insert into the inner wall of the limiting groove 312. At this time, the limiting groove 312 limits the upward movement of the transmission tube 213 through the limiting rod 315. Through the application of the above components, when negative pressure occurs inside the rubber cylinder 214, the transmission tube 213 is restricted and no longer moves, thereby preventing the negative pressure from causing significant deformation of the rubber cylinder 214 and affecting the adsorption strength of the microporous ceramic vacuum chuck 212.

[0083] When the negative pressure forces the sliding plate 222 to slide downward, the spring 1 322 is compressed, so that the internal hydraulic oil is transmitted to the inside of the L-shaped slide 313 through the L-shaped slide 313, forcing the piston plate 314 to slide outward along the inner wall of the L-shaped slide 313, inserting the limiting rod 315 into the inner wall of the limiting groove 312, and limiting the upward movement of the transmission pipe 213.

[0084] When the cam 324 is in the closed position, the cam 324 is in the closed position, and the cam 324 is in the open position, so that the cam 324 can be turned off. Figure 4 The state of G in Figure 5 The state transition of F in the middle;

[0085] When negative pressure is generated, the sliding rod 324 will compress the hydraulic telescopic rod 321 to produce deformation, and when high-pressure gas appears inside the transmission pipe 213, the high-pressure gas will push the sliding plate 222 to move upward, so that the high-pressure gas is discharged upward through the gap between the bottom of the sliding plate 222 and the inner wall of the through hole of the fixed plate 221. Since the curved plates 125 are in a stacked state, during the contraction process of the curved plates 125, the impurities accumulated on the top of the curved plates 125 will be scraped off and finally pass through the gap of the fixed bracket 211. The gap falls downward, and when excess impurities fall on the surface of the microporous ceramic vacuum suction cup 212, the pressure of the microporous ceramic vacuum suction cup 212 will push the impurities to be ejected outward and fall downward from the gap of the fixed bracket 211. Through the application of the above components, the input pipe 215 can shield the unused area of ​​the microporous ceramic vacuum suction cup 212 when in use, and after the grinding is completed, the impurities on the outer wall of the arc plate 125 are removed again, thereby reducing the probability of clogging of the holes of the microporous ceramic vacuum suction cup 212 and extending the service life of the equipment.

[0086] A specific application of this embodiment is as follows: before use, the cylinder 13 is installed at the desired position, and the wafer is placed on the top of the microporous ceramic vacuum chuck 212, wherein a plurality of arc-shaped plates 125 are in a stacked state. When the arc-shaped plates 125 rotate, the center positions of the plurality of arc-shaped plates 125 will form a circular clamping area, so that the arc-shaped plates 125 can be clamped from the center of the wafer. Figure 5 The status of F in Figure 4 The state of middle G changes, and this area will clamp and limit the side wall of the top wafer of the microporous ceramic vacuum suction cup 212. While clamping and limiting the wafer, the push of multiple arc plates 125 will ensure that the wafer is in the center position of the microporous ceramic vacuum suction cup 212. Then the microporous ceramic vacuum suction cup 212 generates adsorption force. Under the influence of the adsorption force and the side wall clamping force, the equipment can clamp and adsorb wafers of different specifications.

[0087] Taking advantage of the characteristic that the rotating ring 123 drives the gear 122 to rotate, an arc plate 2 126 and a rubber cylinder 214 are provided inside the device. When the arc plate 125 restricts the wafer, the arc plate 2 126 at the bottom will continue to rotate synchronously. At this time, the side wall of the rotating arc plate 2 126 will contact the side wall of the rubber cylinder 214 and compress the rubber cylinder 214 to deform. The deformed part of the rubber cylinder 214 will be in the gap between the arc plate 2 126 and the microporous ceramic vacuum suction cup 212, and at this time the rubber cylinder 214 will shrink. The transmission tube 213 is forced to slide upward along the inner wall of the bracket 111, and the rubber tube 214 will block the outer circle holes of the microporous ceramic vacuum suction cup 212, limiting the transmission path of the external holes of the microporous ceramic vacuum suction cup 212. Through the application of the above components, when the crystal disk specification is smaller than the microporous ceramic vacuum suction cup 212, the arc plate 2 126 will drive the rubber tube 214 to seal the redundant position of the microporous ceramic vacuum suction cup 212, avoiding the redundant holes causing the adsorption force at the center position to decrease, affecting the adsorption effect of the microporous ceramic vacuum suction cup 212.

[0088] Taking advantage of the fact that the rubber tube 214 is deformed by the operation of the arc-shaped plate 216, an obstruction component 32 is provided inside the device. When the input pipe 215 transmits negative pressure, the force of the negative pressure will enter the transmission pipe 213 and force the hollow bracket 223 and the sliding plate 222 to slide downward along the inner wall of the through hole of the fixed disk 221. At this time, a gap is formed between the top of the sliding plate 222 and the inner wall of the through hole of the fixed disk 221. The negative pressure will be transmitted to the top of the fixed disk 221 through the above gap and act on the bottom of the microporous ceramic vacuum suction cup 212 through the rubber tube 214; and when the hollow bracket 223 moves downward under the negative pressure, the hollow bracket 223 The limit plate 2 323 will be driven to press the hydraulic telescopic rod 321, so that the hydraulic oil inside the hydraulic telescopic rod 321 enters the L-shaped slide 313 and forces the piston plate 314 to move outward along the horizontal inner wall of the L-shaped slide 313. The outward-moving piston plate 314 drives the limit rod 315 to insert into the inner wall of the limit groove 312. At this time, the limit groove 312 limits the upward movement of the transmission tube 213 through the limit rod 315. Through the application of the above components, when negative pressure occurs inside the rubber cylinder 214, the transmission tube 213 is restricted and no longer moves, thereby avoiding the negative pressure causing a large deformation of the rubber cylinder 214, which affects the adsorption strength of the microporous ceramic vacuum suction cup 212.

[0089] After use is completed, the impurities remaining from grinding will accumulate on the top of the curved plate 125. After grinding is completed, the input pipe 215 will transmit high-pressure gas to the rubber cylinder 214. At this time, the high-pressure gas will force the sliding plate 222 to move upward. At this time, the spring 1 322 will drive the hydraulic telescopic rod 321 to reset. At this time, the limiting rod 315 will move away from the fixed rod 311, and the hollow bracket 223 will drive the limiting plate 2 323 to move upward. At this time, the high-pressure gas will be ejected outward through the gap formed by the bottom of the sliding plate 222 and the top of the fixed plate 221. The ejected gas will be ejected outward through the holes of the microporous ceramic vacuum suction cup 212, and at this time the motor 114 will flip, causing the curved plate 125 to move away from the bottom of the sliding plate 222. Figure 4 The state of G in Figure 5 The state transition of F in the middle, since the arc plates 125 are in a stacked state, during the contraction process of the arc plates 125, the impurities accumulated on the top of the arc plates 125 will be scraped off and eventually fall down through the gap of the fixed bracket 211. When the excess impurities fall on the surface of the microporous ceramic vacuum suction cup 212, the pressure of the microporous ceramic vacuum suction cup 212 will push the impurities to be sprayed out and fall down from the gap of the fixed bracket 211. Through the application of the above components, the input pipe 215 can shield the unused area of ​​the microporous ceramic vacuum suction cup 212 when in use, and after grinding is completed, remove the impurities on the outer wall of the arc plate 125 again, reduce the probability of clogging of the holes of the microporous ceramic vacuum suction cup 212, and extend the service life of the equipment.

[0090] The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the present invention to the specific embodiments described. Obviously, many modifications and variations are possible based on the content of this specification. These embodiments are selected and described in detail in this specification to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better understand and utilize the present invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A wafer bonding machine for grinding and polishing, characterized in that: Also includes: A fixing mechanism (1), wherein a fixing component (11) is fixedly provided inside the fixing mechanism (1), and a closing component (12) is fixedly provided on the inner wall of the fixing mechanism (1), and the closing component (12) is used to clamp and limit the position of a wafer; An adsorption mechanism (2), the adsorption mechanism (2) being fixedly mounted on the inner wall of the fixed component (11) and being used to adsorb the wafer to ensure that the wafer will not be dislocated due to the influence of external forces during the grinding process; A limiting mechanism (3), wherein the limiting mechanism (3) is fixedly mounted on the inner wall of the adsorption mechanism (2) and is used to provide power for adsorption of the adsorption mechanism (2); Before use, the wafer is first restricted on the top of the fixing mechanism (1) by the fixing mechanism (1), and then the limiting mechanism (3) applies external negative pressure to the inside of the adsorption mechanism (2), so that the adsorption mechanism (2) adsorbs the wafer; A cylinder (13) is provided inside the fixing mechanism (1), a bracket (111) is fixedly connected to the inner wall of the cylinder (13), and a mounting ring (112) is fixedly connected to the top of the bracket (111). The fixing mechanism (1) comprises: A fixing assembly (11), wherein the fixing assembly (11) is fixedly arranged on the inner wall of the cylinder (13), provides an installation position for the adsorption mechanism (2) and the restriction mechanism (3), and provides driving power; A closing component (12), wherein the closing component (12) is fixedly mounted on the inner wall of the cylinder (13), and the power generated by the fixing component (11) is transmitted to the closing component (12); The power generated by the fixing component (11) is transmitted to the closing component (12), so that the closing component (12) clamps and limits the external wafer; The adsorption mechanism (2) comprises: An adsorption component (21), the adsorption component (21) being fixedly arranged inside the fixed component (11) via an adsorption member, and being used for negative pressure adsorption of external wafers; The adsorption member comprises a fixed bracket (211) fixedly connected to the inner wall of the mounting ring (112), a microporous ceramic vacuum suction cup (212) fixedly connected to the inner wall of the fixed bracket (211), and a transmission tube (213) slidably connected to the inner wall of the through hole of the bracket (111); An exhaust assembly (22), the exhaust assembly (22) being fixedly mounted on the inner wall of the bracket (111) via a transmission member, providing a path for transmission of negative pressure; The transmission member comprises a fixed disk (221) fixedly connected to the inner wall of the transmission pipe (213); Wherein, external negative pressure enters from the transmission tube (213) and acts on the inner wall of the microporous ceramic vacuum suction cup (212), thereby realizing the transmission of external negative pressure; The limiting mechanism (3) comprises: A limiting assembly (31), wherein the limiting assembly (31) is fixedly arranged on the inner wall of the fixed disk (221) via a support member, and limits the efficiency of negative pressure transmission; The support member comprises four fixing rods (311) fixedly connected to the bottom of the bracket (111), and limiting grooves (312) are provided on the inner walls of the four fixing rods (311); An obstruction component (32), the obstruction component (32) being fixedly arranged on the top of the fixed bracket (211) by a hydraulic component, and utilizing a compression force to restrict the sliding of the transmission pipe (213); The hydraulic component includes a hydraulic telescopic rod (321) connected to the top of the fixed bracket (211), and a spring 1 (322) is fixedly connected to the outer wall of the hydraulic telescopic rod (321); When the external negative pressure enters the inner wall of the transmission tube (213), the negative pressure will pass through the inner wall of the through hole of the fixed disk (221). At this time, the blocking component (32) will drive the limiting component (31) to operate, and through the application of the fixing rod (311), the sliding of the transmission tube (213) is limited.

2. The wafer bonding machine for grinding and polishing according to claim 1, characterized in that: The fixing assembly (11) includes a plurality of through holes (113) formed on the top of the mounting ring (112); an L-shaped frame (115) is fixedly connected to the outer wall of the cylinder (13); an end of the L-shaped frame (115) away from the cylinder (13) is fixedly connected to a fixing ring (116); and a motor (114) is fixedly connected to the top of the fixing ring (116); When the device is in operation, the motor (114) transmits power to drive the closing component (12) to operate and clamp the wafer.

3. The wafer bonding machine for grinding and polishing according to claim 2, characterized in that: The closing assembly (12) includes a rotating column (121) rotatably connected to the inner walls of the plurality of through holes (113), the upper and lower ends of the rotating column (121) are fixedly connected to a gear 1 (122), the inner wall of the cylinder (13) is rotatably connected to a rotating ring (123), the inner wall of the rotating ring (123) is fixedly connected to a gear ring (124), the inner wall of the gear ring (124) is meshedly connected to the side wall of the gear 1 (122), the outer wall of the rotating column (121) is fixedly connected to an arc plate (125), the output shaft of the motor (114) is fixedly connected to the outer wall of the gear 1 (122), and the side wall of the rotating column (121) is fixedly connected to a plurality of arc plates 2 (126); After the motor (114) transmits power to the mounting ring (112), the mounting ring (112) ensures that the remaining gears (122) rotate in the same direction through the gear ring (124).

4. The wafer bonding machine for grinding and polishing according to claim 3, characterized in that: The adsorption assembly (21) comprises an input tube (215) connected to the bottom of the transmission tube (213); an end of the transmission tube (213) away from the input tube (215) is connected to a rubber tube (214); and an end of the rubber tube (214) away from the transmission tube (213) is sealed and fixedly connected to the bottom of the fixed bracket (211); The external negative pressure is transmitted to the inside of the transmission tube (213) through the input tube (215), and is transmitted to the microporous ceramic vacuum suction cup (212) through the rubber tube (214), so that the microporous ceramic vacuum suction cup (212) generates an adsorption force.

5. The wafer bonding machine for grinding and polishing according to claim 4, characterized in that: The exhaust assembly (22) comprises a sliding plate (222) slidably connected to the inner wall of the through hole of the fixed plate (221); a hollow bracket (223) is fixedly connected to the bottom of the sliding plate (222); and one end of the hollow bracket (223) away from the sliding plate (222) is fixedly connected to a limiting plate (224). When negative pressure enters the interior of the transmission tube (213), the force of the negative pressure will force the sliding plate (222) and the hollow bracket (223) to slide downward along the inner wall of the fixed plate (221).

6. The wafer bonding machine for grinding and polishing according to claim 5, characterized in that: The limiting assembly (31) includes an L-shaped chute (313) provided on the inner wall of the fixed plate (221), the inner wall of the L-shaped chute (313) being connected to the inner wall of the hydraulic telescopic rod (321), a piston plate (314) being slidably connected to the inner wall of the L-shaped chute (313), and a limiting rod (315) being fixedly connected to the inner wall of the piston plate (314); When the negative pressure forces the sliding plate (222) to slide downward, the spring 1 (322) is compressed, so that the internal hydraulic oil is transmitted to the inside of the L-shaped slide groove (313) through the L-shaped slide groove (313), forcing the piston plate (314) to slide outward along the inner wall of the L-shaped slide groove (313).

7. The wafer bonding machine for grinding and polishing according to claim 6, characterized in that: The obstruction assembly (32) includes a second limiting plate (323) fixedly connected to an end of the hollow bracket (223) away from the first limiting plate (224), the top of the hydraulic telescopic rod (321) is fixedly connected to a sliding rod (324), the outer wall of the sliding rod (324) is slidably connected to the inner wall of the through hole of the second limiting plate (323), and the bottom of the second limiting plate (323) is arranged in contact with the top of the hydraulic telescopic rod (321); When negative pressure is generated, the sliding rod (324) will compress the hydraulic telescopic rod (321) to cause deformation, and when high-pressure gas appears inside the transmission tube (213), the high-pressure gas will push the sliding plate (222) upward, so that the high-pressure gas is discharged upward through the gap between the bottom of the sliding plate (222) and the inner wall of the through hole of the fixed plate (221).

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