An integrated LED chip and light guide rod construction method and system

Abstract

The application provides an integrated LED chip and light guide rod construction method and system, light source light is guided into a short light path light guide column through a light guide incident surface, the light path is shortened, the light is emitted to a lighting space to form a circular light cone; an ultra-thin circular ring light core is used to enhance and uniformly mix the light of the LED light source, and is integrally packaged with a conductive circuit; a plastic non-light-transmitting shell and a protective shell are used to connect a substrate mechanism, light guide protection is performed, and the plastic non-light-transmitting shell and an electronic circuit substrate are connected; a low-haze frosted sheet and an ultra-thin circular ring light core are used to connect and integrally package, the light path is shortened, the light efficiency and luminous flux are enhanced, and the LED chip and the light guide rod are integrally packaged to uniformly mix and illuminate the light.

Description

Technical Field

[0001] This invention relates to the field of electronic control signal processing lighting technology, and more specifically, to a method and system for integrating an LED chip and a light guide rod into one unit. Background Technology

[0002] Improving the luminous efficacy and luminous flux of LED light sources is a crucial technology in the lighting field. However, issues remain to be addressed, such as how to shorten the optical path of the light source in the light guide medium and control the light cone emitted into the lighting space; how to further improve the uniformity of light mixing and the integration of the LED light source; how to perform light guide protection and light dispersion blocking; how to reduce the haze of the frosted glass and improve light mixing, luminous efficacy, and luminous flux; and how to achieve strong luminous efficacy, uniform light mixing, and circular lighting. Therefore, it is necessary to propose a method and system for integrating LED chips and light guide rods to at least partially solve the problems existing in the current technology. Summary of the Invention

[0003] The summary of this invention introduces a series of simplified concepts, which will be further explained in detail in the detailed description section. The summary of this invention does not mean that it attempts to limit the key features and essential technical features of the claimed technical solution, nor does it mean that it attempts to determine the scope of protection of the claimed technical solution.

[0004] To at least partially solve the above problems, the present invention provides a method for integrating an LED chip and a light guide rod into a single structure, comprising:

[0005] S10 guides the light source into the short-path light guide column through the light-guiding incident surface, shortens the light guide path, and guides the light to be emitted into the illumination space, forming a circular light cone;

[0006] S20 uses an ultra-thin circular ring-connected light core to enhance the uniform mixing of LED light sources and integrates it with conductive circuitry into a single package.

[0007] S30, through the plastic non-transparent shell and protective shell connecting substrate mechanism, provides light guiding protection and connects the plastic non-transparent shell and electronic circuit board;

[0008] The S40 integrates a low-haze frosted sheet and an ultra-thin circular ring light core, reducing the optical path and enhancing luminous efficiency and luminous flux. It achieves strong light efficiency, uniform light mixing, and circular light illumination by integrating the LED chip and light guide rod.

[0009] Preferably, S10 includes:

[0010] S101 guides the light from the light source into the short optical path light guide column through the light-guiding incident surface;

[0011] S102, through a short optical path light guide post, guides the light from the light source to the light guide emitting surface, shortens the optical path, and reduces the optical path loss; the short optical path light guide post includes: a short optical path circular light guide post, a short optical path polygonal light guide post, or a short optical path combined light guide post; the short optical path combined light guide post is formed by combining a cylinder and a polygonal post, which is suitable for the type of light source chip and the type of frosted sheet;

[0012] S103 guides the light from the short-path light guide column into the illumination space through the light-emitting surface.

[0013] Preferably, S20 includes:

[0014] S201 enhances uniform light mixing of LED light source through the tight connection and arrangement of ultra-thin circular ring light cores;

[0015] S202 integrates the ultra-thin circular ring-shaped optical core and conductive lines into a single package through a chip packaging layer.

[0016] The ultra-thin circular ring-type LED core includes: an ultra-thin LED chipset, a chip mounting layer, an adjacent spacing strip group, a light-mixing reflective ring, and a chip encapsulation layer. The ultra-thin LED chipset includes multiple sets of primary color ultra-thin LED chips, mounted on the chip mounting layer. The primary color ultra-thin LED chips are arranged in a circular integrated chipet with straight edges adjacent to each other, and the light-emitting surface is thinned, replacing the triangular arrangement of square three-primary color LED chips. The multiple sets of primary color ultra-thin LED chips have various colors or color combinations, and the brightness of each set of primary color ultra-thin LED chips is controlled individually. The adjacent spacing strip group includes multiple insulating dividing strips to isolate adjacent fan-shaped primary color LED chips. The light-mixing reflective ring is set outside the circular integrated chipet, and the reflective surface is a concave reflective surface, reflecting part of the LED chip light to the center of the circle, forming primary color light reflection superposition to enhance the uniformity of light mixing, luminous efficiency, and luminous flux. The chip encapsulation layer integrates the LED chipset and conductive circuitry into a single package.

[0017] Preferably, S30 includes:

[0018] S301 is protected by a plastic non-transparent shell that encloses the trapezoidal cylinder of the short-range light guide assembly for light guiding protection.

[0019] S302 connects the plastic non-transparent shell and the electronic circuit board through the protective shell connecting substrate mechanism;

[0020] The protective shell connecting substrate mechanism includes: substrate clip claws, substrate connecting part and shell connecting part; the substrate clip claws are provided at one end of the substrate connecting part and are clipped into the card interface provided on the electronic circuit substrate; the other end of the substrate connecting part is provided with the shell connecting part; the shell connecting part is a light-proof and sealed plastic non-light-proof shell.

[0021] Preferably, S400 includes:

[0022] S401 uses a low-haze frosted sheet to scatter the light emitted by the ultra-thin circular ring-shaped optical core and guide it into the light guide rod.

[0023] The S402 integrates a low-haze frosted sheet and an ultra-thin circular ring light core, reducing the optical path and enhancing luminous efficiency and luminous flux. It achieves strong light effect, uniform light mixing, and circular light illumination by integrating the LED chip and light guide rod.

[0024] This invention provides an integrated LED chip and light guide rod construction system, comprising:

[0025] The trapezoidal cylindrical short-path light guide subsystem guides light from the light source into the short-path light guide column through the light-guiding incident surface, shortening the light guide path and guiding the light to be emitted into the illumination space, forming a circular light cone;

[0026] The circular ring-connected chip subsystem enhances and uniformly mixes LED light sources through an ultra-thin circular ring-connected light core, and is integrated and packaged with conductive lines.

[0027] The light-guiding and protective housing subsystem provides light guidance and protection as well as connects the plastic non-transparent housing and the electronic circuit board through a plastic non-transparent housing and a protective housing connecting substrate mechanism.

[0028] The integrated subsystem of light core bonding is achieved by connecting and integrating a low-haze frosted sheet and an ultra-thin circular ring light core, which reduces the optical path and enhances the light efficiency and luminous flux, and integrates the LED chip and light guide rod to achieve strong light efficiency, light mixing and uniform circular light illumination.

[0029] Preferably, the trapezoidal cylindrical short-range optical guide system includes:

[0030] The light-guiding incident module guides the light from the light source into the short optical path light guide column through the light-guiding incident surface;

[0031] The short-path light guide trapezoidal module transmits light from the light source to the light-emitting surface through short-path light guide pillars, shortening the light guide path and reducing light guide path loss. The short-path light guide pillars include: short-path circular light guide pillars, short-path polygonal light guide pillars, or short-path combined light guide pillars. The short-path combined light guide pillars are formed by combining cylinders and polygonal pillars, adapting to the type of light source chip and the type of frosted sheet.

[0032] The light-guiding emission module guides and emits light from a short-path light guide column into the illumination space through the light-guiding emission surface.

[0033] Preferably, the circular ring-connected chip subsystem includes:

[0034] The ultra-thin circular ring-connected light source module enhances the uniform mixing of LED light sources through the tight connection and arrangement of ultra-thin circular ring-connected light cores.

[0035] The ring-type optical chip packaging module integrates an ultra-thin circular ring-type optical core and conductive lines into a single package through a chip packaging layer.

[0036] The ultra-thin circular ring-type LED core includes: an ultra-thin LED chipset, a chip mounting layer, an adjacent spacing strip group, a light-mixing reflective ring, and a chip encapsulation layer. The ultra-thin LED chipset includes multiple sets of primary color ultra-thin LED chips, mounted on the chip mounting layer. The primary color ultra-thin LED chips are arranged in a circular integrated chipet with straight edges adjacent to each other, and the light-emitting surface is thinned, replacing the triangular arrangement of square three-primary color LED chips. The multiple sets of primary color ultra-thin LED chips have various colors or color combinations, and the brightness of each set of primary color ultra-thin LED chips is controlled individually. The adjacent spacing strip group includes multiple insulating dividing strips to isolate adjacent fan-shaped primary color LED chips. The light-mixing reflective ring is set outside the circular integrated chipet, and the reflective surface is a concave reflective surface, reflecting part of the LED chip light to the center of the circle, forming primary color light reflection superposition to enhance the uniformity of light mixing, luminous efficiency, and luminous flux. The chip encapsulation layer integrates the LED chipset and conductive circuitry into a single package.

[0037] Preferably, the light-guiding protective housing subsystem includes:

[0038] The light guide protection cavity module is enclosed and wrapped by a plastic non-transparent shell around the trapezoidal cylinder of the trapezoidal cylindrical short-range light guide assembly for light guide protection.

[0039] The protective shell connection module connects the plastic non-transparent shell and the electronic circuit board through the protective shell connection substrate mechanism;

[0040] The protective shell connecting substrate mechanism includes: substrate clip claws, substrate connecting part and shell connecting part; the substrate clip claws are provided at one end of the substrate connecting part and are clipped into the card interface provided on the electronic circuit substrate; the other end of the substrate connecting part is provided with the shell connecting part; the shell connecting part is a light-proof and sealed plastic non-light-proof shell.

[0041] Preferably, the integrated subsystem for bonding optical cores includes:

[0042] The frosted light guide module uses a low-haze frosted sheet to scatter the light emitted by the ultra-thin circular ring light core through the frosted surface and guide it into the light guide rod.

[0043] The core-column connection integrated module integrates a low-haze frosted sheet and an ultra-thin circular ring light core, reducing the optical path and enhancing the light efficiency and luminous flux. It achieves strong light efficiency, uniform light mixing, and circular light illumination by integrating the LED chip and light guide rod.

[0044] Compared with the prior art, the present invention has at least the following beneficial effects:

[0045] This invention discloses an integrated method and system for constructing an integrated LED chip and light guide rod. The system guides light from a light source into a short-path light guide column via a light-incident surface, shortening the light path and emitting the light into the illumination space to form a circular light cone. An ultra-thin circular ring-connected light core enhances the uniform mixing of the LED light source and integrates it with conductive circuitry. A plastic opaque shell and protective shell are used to connect the substrate, providing light protection and connecting the plastic opaque shell and the electronic circuit board. A low-haze frosted sheet and an ultra-thin circular ring-connected light core are used for integrated connection, reducing the light path and enhancing luminous efficiency and flux, resulting in a highly efficient, uniformly mixed, circular light illumination achieved through the integrated construction of the LED chip and light guide rod.

[0046] The present invention provides an integrated method and system for constructing an integrated LED chip and light guide rod. Other advantages, objectives and features of the present invention will be partly apparent from the following description, and partly understood by those skilled in the art through study and practice of the present invention. Attached Figure Description

[0047] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings:

[0048] Figure 1 This is a diagram of an embodiment of the integrated LED chip and light guide rod construction system described in this invention.

[0049] Figure 2 This is a diagram of another embodiment of the integrated LED chip and light guide rod construction system described in this invention.

[0050] Figure 3 This figure shows an embodiment of the integrated LED chip and light guide rod construction system and method described in this invention. Detailed Implementation

[0051] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments, so that those skilled in the art can implement it based on the specification; as shown in the figures, the present invention provides a method for integrating an LED chip and a light guide rod into one piece, including:

[0052] S10 guides the light source into the short-path light guide column through the light-guiding incident surface, shortens the light guide path, and guides the light to be emitted into the illumination space, forming a circular light cone;

[0053] S20 uses an ultra-thin circular ring-connected light core to enhance the uniform mixing of LED light sources and integrates it with conductive circuitry into a single package.

[0054] S30, through the plastic non-transparent shell and protective shell connecting substrate mechanism, provides light guiding protection and connects the plastic non-transparent shell and electronic circuit board;

[0055] The S40 integrates a low-haze frosted sheet and an ultra-thin circular ring light core, reducing the optical path and enhancing luminous efficiency and luminous flux. It achieves strong light efficiency, uniform light mixing, and circular light illumination by integrating the LED chip and light guide rod.

[0056] The principle and effect of the above technical solution are as follows: This invention provides a method for integrating an LED chip and a light guide rod into one piece, including: guiding the light source light into a short-path light guide column 10 through a light-guiding incident surface to shorten the light guide path and guide the light to be emitted into the illumination space to form a circular light cone; enhancing the uniform mixing of the LED light source through an ultra-thin circular ring light core 20 and integrating it with the conductive circuit into a single package; providing light guidance protection and connecting the plastic non-transparent shell and the electronic circuit board through a plastic non-transparent shell 30 and a protective shell connecting substrate mechanism; and integrating the low-haze frosted sheet 40 and the ultra-thin circular ring light core into one piece to reduce the light path, enhance the light efficiency and luminous flux, and achieve strong light efficiency, uniform light mixing, and circular light illumination by integrating the LED chip and the light guide rod into one piece.

[0057] In one embodiment, S10 includes:

[0058] S101 guides the light from the light source into the short optical path light guide column through the light-guiding incident surface;

[0059] S102, through a short optical path light guide post, guides the light from the light source to the light guide emitting surface, shortens the optical path, and reduces the optical path loss; the short optical path light guide post includes: a short optical path circular light guide post, a short optical path polygonal light guide post, or a short optical path combined light guide post; the short optical path combined light guide post is formed by combining a cylinder and a polygonal post, which is suitable for the type of light source chip and the type of frosted sheet;

[0060] S103 guides the light from the short-path light guide column into the illumination space through the light-emitting surface.

[0061] The principle and effect of the above technical solution are as follows: The light source light is guided into the short-path light guide column through the light-incident surface; the light source light is transmitted to the light-emitting surface through the short-path light guide column, shortening the light-guiding optical path and reducing light-guiding optical path loss; the short-path light guide column includes: a short-path circular light guide column, a short-path polygonal light guide column, or a short-path combined light guide column; the short-path combined light guide column is formed by combining cylinders and polygonal columns, adapting to the type of light source chip and the type of frosted wafer; the light is guided and emitted into the illumination space through the light-emitting surface; the light emitted from the short-path light guide column into the illumination space through the light-emitting surface includes: the light-emitting surface is set as a circular light-emitting surface, the circular light-emitting surface is set at the light-emitting end of the short-path light guide column, emitting the light from the short-path light guide column into the illumination space, forming a circular light cone in the illumination space and a circular light spot on the front illumination surface.

[0062] In one embodiment, S20 includes:

[0063] S201 enhances uniform light mixing of LED light source through the tight connection and arrangement of ultra-thin circular ring light cores;

[0064] S202 integrates the ultra-thin circular ring-shaped optical core and conductive lines into a single package through a chip packaging layer.

[0065] The ultra-thin circular ring-type LED core includes: an ultra-thin LED chipset, a chip mounting layer, an adjacent spacing strip group, a light-mixing reflective ring, and a chip encapsulation layer. The ultra-thin LED chipset includes multiple sets of primary color ultra-thin LED chips, mounted on the chip mounting layer. The primary color ultra-thin LED chips are arranged in a circular integrated chipet with straight edges adjacent to each other, and the light-emitting surface is thinned, replacing the triangular arrangement of square three-primary color LED chips. The multiple sets of primary color ultra-thin LED chips have various colors or color combinations, and the brightness of each set of primary color ultra-thin LED chips is controlled individually. The adjacent spacing strip group includes multiple insulating dividing strips to isolate adjacent fan-shaped primary color LED chips. The light-mixing reflective ring is set outside the circular integrated chipet, and the reflective surface is a concave reflective surface, reflecting part of the LED chip light to the center of the circle, forming primary color light reflection superposition to enhance the uniformity of light mixing, luminous efficiency, and luminous flux. The chip encapsulation layer integrates the LED chipset and conductive circuitry into a single package.

[0066] The principle and effect of the above technical solution are as follows: the LED light source is enhanced and uniformly mixed by the close connection and arrangement of ultra-thin circular ring-shaped light cores; the ultra-thin circular ring-shaped light cores and conductive lines are integrated and packaged in one piece by the chip packaging layer. The ultra-thin circular ring-type light core includes: an ultra-thin LED chip group 021, a chip mounting layer 022, an adjacent spacing strip group 023, a light mixing and reflection ring 024, and a chip encapsulation layer 025. The ultra-thin LED chip group includes multiple sets of primary color ultra-thin LED chips, which are mounted on the chip mounting layer. The primary color ultra-thin LED chips are arranged in a circular integrated chip group with straight edges adjacent to each other, and the light-emitting surface is thinned, replacing the triangular arrangement of square three-primary color LED chips. The multiple sets of primary color ultra-thin LED chips have multiple colors or color combinations, and the brightness of each set of primary color ultra-thin LED chips is controlled individually. The adjacent spacing strip group includes multiple insulating dividing strips to isolate adjacent fan-shaped primary color LED chips. The light mixing and reflection ring is set outside the circular integrated chip group, and the reflective surface is a concave reflective surface, which reflects part of the LED chip light to the center of the circle, forming a primary color light reflection superposition to enhance the uniformity of light mixing, light efficiency, and luminous flux. The chip encapsulation layer integrates the LED chip group and conductive circuitry into a single package.

[0067] In one embodiment, S30 includes:

[0068] S301 is protected by a plastic non-transparent shell that encloses the trapezoidal cylinder of the short-range light guide assembly for light guiding protection.

[0069] S302 connects the plastic non-transparent shell and the electronic circuit board through the protective shell connecting substrate mechanism;

[0070] The protective shell connecting substrate mechanism includes: substrate clip claws, substrate connecting part and shell connecting part; the substrate clip claws are provided at one end of the substrate connecting part and are clipped into the card interface provided on the electronic circuit substrate; the other end of the substrate connecting part is provided with the shell connecting part; the shell connecting part is a light-proof and sealed plastic non-light-proof shell.

[0071] The principle and effect of the above technical solution are as follows: A plastic, opaque shell is used to enclose and protect the light guide of the trapezoidal cylindrical short-range light guide assembly. A protective shell connecting substrate mechanism connects the plastic, opaque shell and the electronic circuit board. The protective shell connecting substrate mechanism includes: substrate clips, a substrate connecting part, and a shell connecting part. The substrate clips are located at one end of the substrate connecting part and engage with the card interface on the electronic circuit board. The other end of the substrate connecting part has a shell connecting part. The shell connecting part is opaque and seals the plastic, opaque shell. The inner layer of the plastic, opaque shell is coated with a material that adheres to the surface of the light guide column. A uniform reflective layer is incorporated to significantly reduce light absorption by the plastic material and reflect any light leakage from the side of the light guide pillar back into the light path, thus significantly enhancing the light efficiency. The plastic, opaque shell has a multi-layered structure, with the plastic material density gradually decreasing from the inner to the outer layers, forming a microporous honeycomb structure on the outer layer. The inner layer has higher photothermal absorption and thermal conductivity for the light guide pillar, dissipating heat layer by layer towards the outer layer. The microporous honeycomb structure on the outer layer significantly increases the surface area, resulting in significantly improved heat dissipation performance. Fine longitudinal and transverse channels connect adjacent microporous honeycombs, promoting accelerated flow of longitudinal and transverse micro-airflow on the surface, significantly improving heat dissipation efficiency.

[0072] In one embodiment, S400 includes:

[0073] S401 uses a low-haze frosted sheet to scatter the light emitted by the ultra-thin circular ring-shaped optical core and guide it into the light guide rod.

[0074] The S402 integrates a low-haze frosted sheet and an ultra-thin circular ring light core, reducing the optical path and enhancing luminous efficiency and luminous flux. It achieves strong light effect, uniform light mixing, and circular light illumination by integrating the LED chip and light guide rod.

[0075] The principle and effect of the above technical solution are as follows: The light emitted by the ultra-thin circular ring-shaped light core is scattered and guided into the light guide rod through the frosted surface using a low-haze frosted sheet; the low-haze frosted sheet and the ultra-thin circular ring-shaped light core are integrated together, reducing the optical path and enhancing luminous efficiency and flux, achieving strong light effect, uniform light mixing, and circular light illumination through integrated LED chip and light guide rod; the low-haze frosted sheet reduces haze and increases transparency compared to existing frosted sheets; the low-haze frosted sheet and the ultra-thin circular ring-shaped light core are integrated together, reducing the optical path and enhancing luminous flux. To achieve high-efficiency, uniform, and mixed-light circular lighting by integrating LED chips and light guide rods, one side of a low-haze frosted sheet is mounted on the light-guiding incident surface, and the other side of the low-haze frosted sheet is connected to the ultra-thin circular ring-connected light core packaging surface for integrated connection. This reduces the optical path and enhances luminous efficiency and luminous flux, forming a high-efficiency, uniform, and mixed-light circular lighting system that integrates LED chips and light guide rods to achieve high-efficiency, uniform, and mixed-light circular lighting.

[0076] This invention provides an integrated LED chip and light guide rod construction system, comprising:

[0077] The trapezoidal cylindrical short-path light guide subsystem guides light from the light source into the short-path light guide column through the light-guiding incident surface, shortening the light guide path and guiding the light to be emitted into the illumination space, forming a circular light cone;

[0078] The circular ring-connected chip subsystem enhances and uniformly mixes LED light sources through an ultra-thin circular ring-connected light core, and is integrated and packaged with conductive lines.

[0079] The light-guiding and protective housing subsystem provides light guidance and protection as well as connects the plastic non-transparent housing and the electronic circuit board through a plastic non-transparent housing and a protective housing connecting substrate mechanism.

[0080] The integrated subsystem of light core bonding is achieved by connecting and integrating a low-haze frosted sheet and an ultra-thin circular ring light core, which reduces the optical path and enhances the light efficiency and luminous flux, and integrates the LED chip and light guide rod to achieve strong light efficiency, light mixing and uniform circular light illumination.

[0081] The principle and effect of the above technical solution are as follows: This invention provides an integrated LED chip and light guide rod system, including: a trapezoidal cylindrical short-path light guide subsystem, which guides the light source into the short-path light guide column 10 through the light guide incident surface, shortens the light guide path, and guides the light to be emitted into the illumination space to form a circular light cone; a circular ring-connected chip subsystem, which enhances the uniform mixing of LED light source through an ultra-thin circular ring-connected light core 20, and integrates it with the conductive circuitry; a light guide protective shell subsystem, which provides light guide protection and connects the plastic non-transparent shell and the electronic circuit board through a plastic non-transparent shell 30 and a protective shell connecting substrate mechanism; and a light core bonding integrated subsystem, which integrates the low-haze frosted sheet 40 and the ultra-thin circular ring-connected light core, reduces the light path, enhances the light efficiency and luminous flux, and provides integrated high-efficiency light mixing and uniform circular light illumination of the LED chip and light guide rod.

[0082] In one embodiment, the trapezoidal cylindrical short-range optical guide subsystem includes:

[0083] The light-guiding incident module guides the light from the light source into the short optical path light guide column through the light-guiding incident surface;

[0084] The short-path light guide trapezoidal module transmits light from the light source to the light-emitting surface through short-path light guide pillars, shortening the light guide path and reducing light guide path loss. The short-path light guide pillars include: short-path circular light guide pillars, short-path polygonal light guide pillars, or short-path combined light guide pillars. The short-path combined light guide pillars are formed by combining cylinders and polygonal pillars, adapting to the type of light source chip and the type of frosted sheet.

[0085] The light-guiding emission module guides and emits light from a short-path light guide column into the illumination space through the light-guiding emission surface.

[0086] The principle and effect of the above technical solution are as follows: A trapezoidal cylindrical short-path light guide subsystem includes: a light-guiding incident module, which guides light from the source into a short-path light guide column through a light-guiding incident surface; a short-path trapezoidal light guide module, which transmits light from the source to the light-guiding emitting surface through the short-path light guide column, shortening the light guide path and reducing light guide path loss; the short-path light guide column includes: a short-path circular light guide column, a short-path polygonal light guide column, or a short-path combined light guide column; the short-path combined light guide column consists of a cylinder and... The light is formed by the combination of prisms, which is suitable for light source chip types and frosted wafer types; the light guide emission module guides and emits light from the short optical path light guide column into the illumination space through the light guide emission surface; the light emission from the short optical path light guide column into the illumination space through the light guide emission surface includes: the light guide emission surface is set as a circular light emission surface, the circular light emission surface is set at the light emission end of the short optical path light guide column, and the light from the short optical path light guide column is emitted into the illumination space, forming a circular light cone in the illumination space and a circular light spot on the front illumination surface.

[0087] In one embodiment, the circular loop-connected chip subsystem includes:

[0088] The ultra-thin circular ring-connected light source module enhances the uniform mixing of LED light sources through the tight connection and arrangement of ultra-thin circular ring-connected light cores.

[0089] The ring-type optical chip packaging module integrates an ultra-thin circular ring-type optical core and conductive lines into a single package through a chip packaging layer.

[0090] The ultra-thin circular ring-type LED core includes: an ultra-thin LED chipset, a chip mounting layer, an adjacent spacing strip group, a light-mixing reflective ring, and a chip encapsulation layer. The ultra-thin LED chipset includes multiple sets of primary color ultra-thin LED chips, mounted on the chip mounting layer. The primary color ultra-thin LED chips are arranged in a circular integrated chipet with straight edges adjacent to each other, and the light-emitting surface is thinned, replacing the triangular arrangement of square three-primary color LED chips. The multiple sets of primary color ultra-thin LED chips have various colors or color combinations, and the brightness of each set of primary color ultra-thin LED chips is controlled individually. The adjacent spacing strip group includes multiple insulating dividing strips to isolate adjacent fan-shaped primary color LED chips. The light-mixing reflective ring is set outside the circular integrated chipet, and the reflective surface is a concave reflective surface, reflecting part of the LED chip light to the center of the circle, forming primary color light reflection superposition to enhance the uniformity of light mixing, luminous efficiency, and luminous flux. The chip encapsulation layer integrates the LED chipset and conductive circuitry into a single package.

[0091] The principle and effect of the above technical solution are as follows: The circular ring-connected chip subsystem includes: an ultra-thin circular ring-connected light source module, which enhances the uniform mixing of LED light sources through the tight connection and arrangement of ultra-thin circular ring-connected light cores; a ring-connected light chip packaging module, which integrates the ultra-thin circular ring-connected light core and conductive circuitry into a single package through a chip packaging layer; the ultra-thin circular ring-connected light core includes: an ultra-thin LED chip group, a chip mounting layer, an adjacent spacing strip group, a light mixing reflection ring, and a chip packaging layer; the ultra-thin LED chip group includes multiple sets of primary color ultra-thin LED chips, which are mounted on the chip mounting layer; the primary color ultra-thin LED chips are configured as sector-block primary color LEDs. The circular integrated chipset features a straight-edge adjacent arrangement with a thinner light-emitting surface, replacing the triangular arrangement of square three-color LED chips. Multiple groups of ultra-thin primary-color LED chips offer various colors or color combinations, with each group's brightness individually controlled. The adjacent spacing strips include multiple insulating dividers to isolate adjacent sector primary-color LED chips. A light-mixing reflection ring is positioned outside the circular integrated chipset, with a concave reflective surface that reflects some of the LED chip light back to the center, creating a primary-color light reflection superposition that enhances light mixing uniformity, luminous efficiency, and luminous flux. The chip encapsulation layer integrates the LED chipset with the conductive circuitry into a single package.

[0092] In one embodiment, the light guide protective housing subsystem includes:

[0093] The light guide protection cavity module is enclosed and wrapped by a plastic non-transparent shell around the trapezoidal cylinder of the trapezoidal cylindrical short-range light guide assembly for light guide protection.

[0094] The protective shell connection module connects the plastic non-transparent shell and the electronic circuit board through the protective shell connection substrate mechanism;

[0095] The protective shell connecting substrate mechanism includes: substrate clip claws, substrate connecting part and shell connecting part; the substrate clip claws are provided at one end of the substrate connecting part and are clipped into the card interface provided on the electronic circuit substrate; the other end of the substrate connecting part is provided with the shell connecting part; the shell connecting part is a light-proof and sealed plastic non-light-proof shell.

[0096] The principle and effect of the above technical solution are as follows: The light guide protective shell subsystem includes: a light guide protective cavity module, which is enclosed and wrapped around the trapezoidal cylinder of the trapezoidal cylindrical short-range light guide assembly by a plastic non-transparent shell for light guide protection; a protective shell connecting module, which connects the plastic non-transparent shell and the electronic circuit board through a protective shell connecting substrate mechanism; the protective shell connecting substrate mechanism includes: substrate clips, substrate connecting part, and shell connecting part; the substrate clips are set at one end of the substrate connecting part and are clipped into the clip interface set on the electronic circuit board; the other end of the substrate connecting part is set with the shell connecting part; the shell connecting part is opaque and sealed to the plastic non-transparent shell; the plastic non-transparent shell... A uniform reflective layer is applied to the inner layer of the optical shell and the bonding surface of the light guide post; this significantly reduces the light absorption of the plastic material and reflects the light leaking from the side of the light guide post back into the light path, significantly enhancing the light efficiency of the light path; the plastic non-transparent shell has a multi-layer structure in the middle, with the plastic material compression density gradually decreasing from the inner layer to the outer layer, and the outer layer forming a microporous honeycomb structure; the inner layer has a higher photothermal absorption rate and thermal conductivity for the light guide post, and dissipates heat layer by layer to the outer layer, while the microporous honeycomb structure of the outer layer significantly increases the surface area of ​​the outer layer, significantly improving the heat dissipation performance; longitudinal and transverse fine channels are set on the outside of the microporous honeycomb structure to connect adjacent microporous honeycombs, and the longitudinal and transverse fine channels promote the accelerated flow of longitudinal and transverse micro-airflow on the surface, significantly improving the heat dissipation efficiency.

[0097] In one embodiment, the integrated subsystem for bonding optical cores includes:

[0098] The frosted light guide module uses a low-haze frosted sheet to scatter the light emitted by the ultra-thin circular ring light core through the frosted surface and guide it into the light guide rod.

[0099] The core-column connection integrated module integrates a low-haze frosted sheet and an ultra-thin circular ring light core, reducing the optical path and enhancing the light efficiency and luminous flux. It achieves strong light efficiency, uniform light mixing, and circular light illumination by integrating the LED chip and light guide rod.

[0100] The principle and effect of the above technical solution are as follows: The integrated subsystem for bonding the light core includes: a frosted light guide connection module, which uses a low-haze frosted sheet to scatter the emitted light from the ultra-thin circular ring-connected light core through the frosted surface and guide it into the light guide rod; a core-pillar connection integration module, which integrates the low-haze frosted sheet and the ultra-thin circular ring-connected light core, reducing the optical path and enhancing luminous efficiency and luminous flux, achieving strong luminous efficiency, uniform light mixing, and circular light illumination through integrated LED chip and light guide rod; the low-haze frosted sheet has lower haze and higher transparency compared to existing frosted sheets; the low-haze frosted sheet and the ultra-thin circular ring-connected light core... The process involves integrating LED chips and light guide rods to achieve high-efficiency, uniform, and mixed-light circular lighting. This includes mounting one side of a low-haze frosted sheet onto the light-guiding incident surface, and connecting the other side of the low-haze frosted sheet to the ultra-thin circular ring-connected light core packaging surface. This integration reduces the optical path and enhances luminous efficiency and luminous flux, forming a high-efficiency, uniform, and mixed-light circular lighting system that integrates LED chips and light guide rods to achieve this.

[0101] Although embodiments of the present invention have been disclosed above, they are not limited to the applications listed in the specification and embodiments. They can be applied to various fields suitable for the present invention. Other modifications can be easily made by those skilled in the art. Therefore, without departing from the general concept defined by the claims and their equivalents, the present invention is not limited to the specific details and illustrations shown and described herein.

Claims

1. A method for integrating LED chip and light guide rod, characterized in that, Comprise: S10, through the light guide incident surface, the light source light is guided into the short light path light guide stick, shortens the light path, and the light emission is emitted to the lighting space to form a circular light cone; S20, through the super-thin circular ring light core, the LED light source is enhanced and uniformly mixed, and is integrally integrated with the conductive circuit; S30, through the plastic non-light transmission shell and the protection shell, the light guide protection and the connection of the plastic non-light transmission shell and the electronic circuit board are carried out; S40, through the low haze frosted sheet and the super-thin circular ring light core, the light path is integrated, the light efficiency and the luminous flux are reduced, the LED chip and the short light path light guide stick are integrally integrated, the light efficiency is enhanced, and the uniform circular light illumination is carried out; S10 comprises: S102, the light source light is transmitted to the light emission surface through the short light path light guide stick, the light path is shortened, and the light path loss is reduced; the short light path light guide stick comprises: a short light path circular light guide stick or a short light path multi-ribbed polygonal light guide stick or a short light path combined light guide stick; the short light path combined light guide stick is formed by combination of a cylinder and a rib column, which is suitable for the type of light source chip and the type of frosted sheet; the light emission surface is provided as a circular light emission surface, the circular light emission surface is arranged at the light emission end of the short light path light guide stick, the light in the short light path light guide stick is emitted to the lighting space, a circular light cone is formed in the lighting space, and a circular light spot is formed on the normal irradiation surface; The super-thin circular ring light core comprises: a super-thin LED chip group, a chip mounting layer, an adjacent interval strip group, a light mixing reflection ring and a chip packaging layer; the super-thin LED chip group comprises a plurality of groups of base color super-thin LED chips mounted on the chip mounting layer; the base color super-thin LED chip is arranged as a fan-shaped base color LED chip straight edge adjacent combination circular integrated chip group, and the light emitting surface is thinned; the plurality of groups of base color super-thin LED chips have a plurality of colors or color combinations, and each group of base color super-thin LED chips is controlled in brightness; the adjacent interval strip group comprises a plurality of insulating partition strips for isolating adjacent fan-shaped base color LED chips; the light mixing reflection ring is arranged outside the circular integrated chip group, the reflection surface is an inward concave reflection surface, the LED chip light is partially reflected to the center, the base color light reflection is superimposed to enhance the light mixing uniformity, the light efficiency and the luminous flux; the chip packaging layer integrally packages the LED chip group and the conductive circuit; S30 comprises: S301, the plastic non-light transmission shell is closed and wrapped outside the trapezoidal column of the short light path light guide stick to guide the light protection; S302, the protection shell connects the board mechanism, and the plastic non-light transmission shell and the electronic circuit board are connected; The protection shell connecting the board mechanism comprises: a board clamping claw, a board connecting part and a shell connecting part; the board clamping claw is arranged at one end of the board connecting part and is clamped in the clamping port arranged on the electronic circuit board; the other end of the board connecting part is provided with the shell connecting part; the shell connecting part is light-tight and seals the plastic non-light transmission shell. The inner layer of the plastic non-light-transmitting shell is coated with a uniform light-reflecting layer on the surface adhered to the short light path light guide rod. The middle layer of the plastic non-light-transmitting shell is a multi-layer structure, and the compression density of the plastic material gradually decreases from the inner layer to the outer layer. The outer layer forms a microporous honeycomb structure. The inner layer has a higher light and heat absorption rate and thermal conductivity, and the heat is dissipated layer by layer to the outer layer. The microporous honeycomb structure significantly increases the surface area of the outer layer. The microporous honeycomb structure is externally provided with longitudinal and transverse fine channels that communicate with adjacent microporous honeycombs. The longitudinal and transverse fine channels promote the accelerated flow of the surface longitudinal and transverse micro air flow.

2. The method according to claim 1, wherein, S10 comprises: S101, guiding the light source light into the short light path light guide rod through the light guide incident surface; S103, emitting the light guided by the short light path light guide rod to the lighting space through the light guide emission surface.

3. The method of claim 1, wherein the method further comprises: S20 comprises: S201, arranging the super-thin circular ring light core in close connection to enhance the uniform mixing of LED light sources; S202, integrating the super-thin circular ring light core and the conductive circuit by chip packaging layer.

4. The method of claim 1, wherein the method further comprises: S40 comprises: S401, emitting the light emitted by the super-thin circular ring light core through the frosted surface of the low-haze frosted sheet to the short light path light guide rod; S402, integrating the low-haze frosted sheet and the super-thin circular ring light core to reduce the light path and enhance the light efficiency and luminous flux, and integrating the LED chip and the short light path light guide rod to form a uniform circular light illumination with strong light efficiency.

5. An integrated LED chip and light guide rod construction system, comprising: It comprises: The trapezoidal cylindrical short light path light guide subsystem guides the light source light into the short light path light guide rod through the light guide incident surface, shortens the light guide path, emits the light to the lighting space, and forms a circular light cone; The circular ring chip subsystem enhances the uniform mixing of LED light sources through the super-thin circular ring light core, and is integrally packaged with the conductive circuit; The light guide protection shell subsystem connects the plastic non-light-transmitting shell and the electronic circuit substrate through the plastic non-light-transmitting shell and the protection shell connection substrate mechanism to guide the light and protect the connection; The light core integrated subsystem integrates the low-haze frosted sheet and the super-thin circular ring light core to reduce the light path and enhance the light efficiency and luminous flux, and integrates the LED chip and the short light path light guide rod to form a uniform circular light illumination with strong light efficiency; The short light path light guide rod comprises: a short light path circular light guide rod or a short light path multi-ribbed polygonal light guide rod or a short light path combined light guide rod. The short light path combined light guide rod is formed by combining a cylindrical and a ribbed column to adapt to the type of light source chip and the type of frosted sheet. The light emitted from the short light path light guide rod to the lighting space through the light guide emission surface comprises: the light guide emission surface is set as a circular light emission surface, the circular light emission surface is arranged at the light emission end of the short light path light guide rod, the light emitted from the short light path light guide rod to the lighting space forms a circular light cone in the lighting space and a circular light spot on the normal illumination surface. ​ The ultra-thin circular ring light core comprises an ultra-thin LED chip group, a chip mounting layer, an adjacent interval strip group, a mixed light reflection ring and a chip packaging layer; the ultra-thin LED chip group comprises a plurality of groups of primary color ultra-thin LED chips mounted on the chip mounting layer; the primary color ultra-thin LED chips are arranged in a fan-shaped primary color LED chip straight edge adjacent combination circular integrated chip group, and the light emitting surface is thinned; the plurality of groups of primary color ultra-thin LED chips have a plurality of colors or color combinations, and each group of primary color ultra-thin LED chips is controlled in brightness; the adjacent interval strip group comprises a plurality of insulating partition strips for isolating adjacent fan-shaped primary color LED chips; the mixed light reflection ring is arranged outside the circular integrated chip group, the reflection surface is a concave reflection surface, LED chip light is partially reflected to the center of the circle, primary color light reflection is superimposed to enhance mixed light uniformity, light efficiency and luminous flux; and the chip packaging layer is integrated and packaged with the conductive circuit. The light guide protection shell subsystem comprises: The light guide protection cavity module is closed and wrapped around the trapezoidal column of the short light path light guide rod by the plastic non-light transmission shell to guide light; The protection shell connection module connects the plastic non-light transmission shell and the electronic circuit substrate through the protection shell connection substrate mechanism; The protection shell connection substrate mechanism comprises a substrate clamping claw, a substrate connection part and a shell connection part; the substrate clamping claw is arranged at one end of the substrate connection part and clamped in the clamping port arranged on the electronic circuit substrate through the substrate clamping claw; the other end of the substrate connection part is provided with the shell connection part; the shell connection part is sealed and connected with the plastic non-light transmission shell; the inner layer of the plastic non-light transmission shell is coated with a uniform light reflection layer; the middle layer of the plastic non-light transmission shell is a multi-layer structure, and the compression density of the plastic material gradually decreases from the inner layer to the outer layer, and the outer layer forms a microporous honeycomb structure; the inner layer has higher light and heat absorption rate and thermal conductivity to the short light path light guide rod, and the outer layer gradually dissipates heat layer by layer, and the microporous honeycomb structure significantly increases the surface area of the outer layer; the microporous honeycomb structure is provided with longitudinal and transverse fine channels to communicate adjacent microporous honeycombs, and the longitudinal and transverse fine channels promote the acceleration of the longitudinal and transverse micro air flow on the surface.

6. The integrated LED chip and light guide rod system of claim 5, wherein, The trapezoidal cylindrical short path light guide subsystem comprises: The light guide incidence module guides the light source light into the short light path light guide rod through the light guide incidence surface; The light guide emission module emits the light guided by the short light path light guide rod to the lighting space through the light guide emission surface.

7. The integrated LED chip and light guide rod system of claim 5, wherein the light guide rod is made of a material selected from the group consisting of: acrylic, polycarbonate, and polyethylene. The circular ring chip connection subsystem comprises: The ultra-thin circular ring light source module enhances the uniform mixed light of the LED light source through the close connection and arrangement of the ultra-thin circular ring light core; The ring light chip packaging module integrally packages the ultra-thin circular ring light core and the conductive circuit through the chip packaging layer. The ultra-thin circular ring light core comprises an ultra-thin LED chip group, a chip mounting layer, an adjacent interval strip group, a mixed light reflection ring and a chip packaging layer. The ultra-thin LED chip group comprises a plurality of groups of primary color ultra-thin LED chips mounted on the chip mounting layer. The primary color ultra-thin LED chips are arranged in a fan-shaped primary color LED chip straight edge adjacent combination circular integrated chip group, the light emitting surface is thinned, and the square three primary color LED chip herringbone combination arrangement is replaced. The plurality of groups of primary color ultra-thin LED chips have multiple colors or color combinations, and each group of primary color ultra-thin LED chips is controlled in brightness. The adjacent interval strip group comprises a plurality of insulating partition strips for isolating adjacent fan-shaped primary color LED chips. The mixed light reflection ring is arranged outside the circular integrated chip group, the reflection surface is a concave reflection surface, the LED chip light is partially reflected to the center of the circle, the primary color light reflection is superimposed to enhance the mixed light uniformity, the light efficiency and the luminous flux, and the chip packaging layer is integrated and packaged with the conductive circuit.

8. The integrated LED chip and light guide rod system of claim 5, wherein, The light core adhering integrated subsystem comprises: The frosted light guide connection module is used for scattering and guiding the emitted light of the ultra-thin circular ring light core into the short light path light guide rod through a low-haze frosted sheet. The core column connection integrated module is used for connecting and integrating the low-haze frosted sheet and the ultra-thin circular ring light core, reducing the light path, enhancing the light efficiency and the luminous flux, and integrally packaging the LED chip and the short light path light guide rod to realize the uniform circular light illumination of the high-efficiency mixed light.

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