Sensor device in high-voltage strong magnetic field environment and use method thereof

Abstract

The invention belongs to the technical field of sensors, and particularly relates to a sensor device in a high-voltage strong magnetic field environment and a using method thereof, the sensor device comprises an outer shell, the outer shell is of a cylindrical structure, the outer shell is made of an aluminum oxide ceramic matrix composite material, and the two ends of the outer shell are sealed by sealing covers; the metasurface protection layer is located on the outermost layer of the outer shell and is provided with an electromagnetic shielding layer and an insulating layer, the electromagnetic shielding layer is a grid-shaped body formed by weaving a conductive material, and the conductive material is copper, aluminum, gold-plated and silver-plated alloy. According to the invention, by introducing the metasurface technology, the problems that a traditional sensor is easy to damage and signal interference is serious in an extreme environment are effectively solved, and powerful support is provided for technical progress in related fields. The sensor device disclosed by the invention has the advantages of high precision, high stability, low power consumption, easiness in maintenance and the like, and has wide application prospect and market value.

Description

Technical Field

[0001] The present invention relates to the technical field of sensors, and particularly to a sensor device and a using method thereof under a high-voltage and strong-magnetic-field environment. Background Art

[0002] With the rapid development of technology, the applications of high-voltage and strong-magnetic-field environments are becoming increasingly widespread, such as high-voltage transmission line monitoring, particle accelerator control, nuclear magnetic resonance imaging, etc. However, these extreme environments pose extremely harsh requirements on sensors. Traditional sensors are easily damaged by electric shock under high voltage, and strong magnetic fields will cause serious signal interference, affecting the accuracy and reliability of data. Therefore, developing a sensor device that can work stably under a high-voltage and strong-magnetic-field environment has become an urgent problem to be solved.

[0003] Some research institutions at home and abroad have conducted relevant research on sensor electromagnetic shielding technology. Wang Lei et al. selected appropriate plating materials as the research object by analyzing the basic theory of electromagnetic field interference and combining the basic characteristics of common metal materials. Different metal materials were plated on the plastic shell of the sensor, and the shielding effects of different metal coatings were compared and analyzed through zero-point testing of the sensor in an electromagnetic field environment. Compared with the traditional use of a metal shell, plating a metal coating on a plastic part can save production costs and improve product reliability. Chen Xiaofang et al. analyzed the characteristics and working principles of current sensors based on the sensor element structure. Aiming at the ground loop interference suffered by current sensors, an anti-interference technology based on longitudinal choke coils for transmitting signals was proposed, and an electromagnetic shielding structure was designed to isolate external electromagnetic radiation interference, providing necessary technical support for the application of high-precision current sensors in smart grids. Li Ying selected graphene as the basic material, prepared and designed graphene-based nanocomposites and superstructures, and analyzed their electromagnetic and acoustic shielding mechanisms, with obvious acoustic shielding effects. To sum up, some research has considered the anti-electromagnetic interference research of sensors, but it is still relatively preliminary, and there are no effective theoretical and technical achievements, lacking mature technologies that can be applied. At the same time, the above shielding technologies are all full-band shielding technology research, lacking consideration of the communication signals of sensors. While shielding external magnetic field interference, the communication signals of the sensors themselves are also shielded inside, resulting in unstable communication and data transmission. Currently, in industrial production, a "window" is usually opened in the shielding material for the signal transmission of communication antennas. This solution will greatly reduce the shielding effect, and the internal components of the sensor are still affected by electromagnetic fields, and the communication signals will also be unstable, sacrificing both the shielding effect and not achieving stable communication. Therefore, it is urgent to improve this lose-lose situation in the current sensor shielding technology, so it is necessary to develop a sensor device and a using method thereof under a high-voltage and strong-magnetic-field environment. Summary of the Invention

[0004] The purpose of this section is to outline some aspects of the embodiments of the present invention and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section, as well as in the abstract and title of the present application, to avoid obscuring the purpose of this section, the abstract, and the title. However, such simplifications or omissions shall not be used to limit the scope of the present invention.

[0005] To solve the above technical problems, according to one aspect of the present invention, the following technical solutions are provided:

[0006] A sensor device in a high-voltage and strong-magnetic-field environment, which includes:

[0007] An outer housing, the outer housing having a cylindrical structure, the outer housing being made of an alumina ceramic matrix composite material, and both ends of the outer housing being closed with sealing caps;

[0008] A metasurface protective layer, the metasurface protective layer being located on the outermost layer of the outer housing, having an electromagnetic shielding layer and an insulating layer. The electromagnetic shielding layer is a grid-like structure woven from a conductive material, and the conductive material is an alloy of copper, aluminum, gold-plated, or silver-plated. The insulating layer is formed by pressing multiple layers of non-conductive composite materials, and the pressing thickness of the insulating layer is uniform. The metasurface is a micro-nano structure;

[0009] A circuit board, the circuit board being located inside the outer housing, and a highly sensitive sensing element and a microprocessor being installed on the circuit board. The microprocessor is electrically connected to the sensing element, and the sensing element is used to detect the target physical quantity;

[0010] A signal processing circuit, the signal processing circuit being provided on the circuit board and located inside the outer housing, and the signal processing circuit including an amplifier, a filter, and an A / D converter body.

[0011] As a preferred solution of the sensor device in a high-voltage and strong-magnetic-field environment according to the present invention, wherein, the amplifier amplifies the weak signal output by the sensor body, and the filter is used to filter out noise and interference signals; the A / D converter is used to convert the analog signal into a digital signal, and the amplifier enhances the weak signal output by the sensor body.

[0012] As a preferred solution of the sensor device in a high-voltage and strong-magnetic-field environment according to the present invention, wherein, a communication interface is further included, the communication interface being an optical fiber interface provided on the outer side of the outer housing, the optical fiber interface being electrically connected to the sensor body, and the optical fiber interface being connected to an external device through a dedicated optical fiber connector.

[0013] As a preferred embodiment of the sensor device in a high-voltage and strong magnetic field environment according to the present invention, an installation bracket is provided at the bottom of each sealing cover, and installation holes are opened at both ends of each installation bracket.

[0014] As a preferred embodiment of the sensor device in a high-voltage and strong magnetic field environment according to the present invention, a buffer cushion plate is fixedly installed on the inner side wall of the outer housing, and the circuit board is fixed on the buffer cushion plate; the interior of the outer housing is filled with inert gas.

[0015] As a preferred embodiment of the sensor device in a high-voltage and strong magnetic field environment according to the present invention, a power supply system is further included. The power supply system is arranged inside the outer housing, and the power supply system is spaced from the circuit board. The power supply system uses an isolated DC / DC converter to convert an external DC power supply into a stable operating voltage required by the sensor device; the power supply system further includes overvoltage protection and overcurrent protection circuit modules.

[0016] As a preferred embodiment of the sensor device in a high-voltage and strong magnetic field environment according to the present invention, the power supply system is further equipped with a low-voltage alarm function, and when the input voltage is lower than a set threshold, it automatically alarms to prompt the user to replace the battery or repair the power supply fault.

[0017] As a preferred embodiment of the method for using the sensor in a high-voltage and strong magnetic field environment according to the present invention, the following steps are included:

[0018] Step 1: Fix the device at the position to be measured through a fixture or bolt, select a bolt suitable for the installation hole to ensure that the device is in contact with the object to be measured and is not affected by external forces; calibrate the sensor using a standard calibration device, record and adjust the output characteristic curve of the sensitive element to ensure the measurement accuracy;

[0019] Step 2: Start the sensor device, amplify, filter, and perform analog-to-digital conversion on the original signal output by the sensitive element through the built-in signal processing circuit; the microprocessor further processes the digital signal according to a preset algorithm, such as denoising, linearization, etc., to improve the accuracy and reliability of the data;

[0020] Step 3: The processed data is transmitted to an external system through a dedicated fiber optic connector. The external system includes a data acquisition terminal and a computer for storage, analysis, and display; the user can remotely monitor and set the sensor through dedicated software to achieve real-time monitoring and fault diagnosis;

[0021] As a preferred solution for the usage method of a sensor in a high-voltage and strong magnetic field environment according to the present invention, it further includes step 4: regularly check the shell tightness, electrical connection, and signal stability of the sensor device. For sensors working in harsh environments for a long time, the metasurface protection layer or circuit board needs to be replaced regularly to extend the service life and maintain the measurement accuracy.

[0022] The beneficial effects of the present invention are as follows: by introducing the metasurface technology, the problems that traditional sensors are easily damaged and seriously interfered by signals in extreme environments are effectively solved, providing strong support for the technological progress in related fields. The sensor device of the present invention has the advantages of high precision, high stability, low power consumption, and easy maintenance, and has broad application prospects and market value. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the present invention will be described in detail below in conjunction with the drawings and detailed embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts. Among them,

[0024] Figure 1 is the structural schematic diagram of the present invention;

[0025] Figure 2 is the structural schematic diagram after the sealing cover and the outer shell of the present invention are disassembled;

[0026] Figure 3 is the step schematic diagram of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0027] In order to make the above objects, features, and advantages of the present invention more obvious and understandable, the specific embodiments of the present invention will be described in detail below in conjunction with the drawings.

[0028] Many specific details are set forth in the following description in order to provide a thorough understanding of the present invention. However, the present invention may be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the connotation of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed below.

[0029] Secondly, the present invention will be described in detail with reference to the schematic diagrams. When describing the embodiments of the present invention in detail, for the convenience of explanation, the cross-sectional views showing the device structure will be enlarged locally out of proportion, and the schematic diagrams are only examples and should not limit the scope of protection of the present invention herein. In addition, in actual production, three-dimensional spatial dimensions including length, width, and depth should be included.

[0030] To make the objectives, technical solutions and advantages of the present invention clearer, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

[0031] Please refer to Figures 1 - 3 , which shows a schematic diagram of an embodiment of a sensor device and its usage method in a high-voltage and strong magnetic field environment. Please refer to Figures 1 - 3 , and a detailed introduction will be given to a sensor device and its usage method in a high-voltage and strong magnetic field environment.

[0032] A sensor device in a high-voltage and strong magnetic field environment includes:

[0033] An outer housing 100, the outer housing 100 has a cylindrical structure, and the outer housing 100 is made of an alumina ceramic matrix composite material. This material has excellent insulation performance and mechanical strength and can withstand a high voltage of up to several hundred kilovolts without breakdown. Both ends of the outer housing 100 are closed with sealing caps 110 to ensure the tightness of the internal environment; it also includes a communication interface 120. The communication interface 120 is an optical fiber interface provided on the outer side of the housing of the outer housing 100. The optical fiber interface is electrically connected to the sensor body, and the optical fiber interface is connected to an external device through a dedicated optical fiber connector to achieve fast and stable data transmission; Optical fiber communication has the advantages of strong anti-electromagnetic interference ability and long transmission distance, and is very suitable for use in a high-voltage and strong magnetic field environment; At the bottom of each sealing cap 110, there is an installation bracket 130, and installation holes 140 are opened at both ends of each installation bracket 130.

[0034] Metasurface protective layer 200, the metasurface protective layer 200 is located on the outermost layer of the outer housing 100, and has an electromagnetic shielding layer and an insulating layer. The electromagnetic shielding layer prevents or weakens the interference of the electromagnetic field on the internal circuit or components, and at the same time prevents the internal electromagnetic radiation from leaking into the external environment. It is a grid-like body woven from a conductive material, which can ensure good conductivity while reducing the overall weight and cost. The conductive material is an alloy of copper, aluminum, gold-plated, or silver-plated, and can effectively reflect or absorb electromagnetic waves. The main function of the insulating layer is to isolate electrical components and prevent current leakage or short circuits, thereby protecting the safety and stability of the circuit. The insulating layer is composed of non-conductive multi-layer composite materials laminated together, such as rubber, plastic, ceramic, or glass, etc., and has good insulation performance and mechanical strength. The laminated thickness of the insulating layer is uniform, which can ensure good insulation performance, and the uniform thickness distribution helps to prevent breakdown phenomena caused by local electric field concentration. By using multi-layer composite materials with different physical and chemical properties, the layers are stacked and combined to jointly isolate and protect electrical components. The metasurface is a micro-nano structure, which can effectively guide electromagnetic waves to bypass, reduce the direct impact of the magnetic field on the internal components of the sensor, and at the same time provide high-strength electrical insulation to prevent electric shock damage under high voltage.

[0035] Circuit board 300, the circuit board 300 is located inside the outer housing 100. High-sensitivity sensitive components and a microprocessor are installed on the circuit board 300. The microprocessor is electrically connected to the sensitive components. The sensitive components are piezoresistive, capacitive, or magnetoresistive, and are used to detect target physical quantities, such as pressure, magnetic field strength. A buffer pad 310 is fixedly installed on the inner side wall of the outer housing 100, and the circuit board 300 is fixed on the buffer pad 310 to reduce stress concentration and improve the stability of the overall structure. The inside of the outer housing 100 is filled with inert gas to prevent oxidation and corrosion.

[0036] Signal processing circuit 400, the signal processing circuit 400 is arranged on the circuit board 300 and is located inside the outer housing 100. The signal processing circuit 400 includes an amplifier, a filter, and an A / D converter body. The amplifier amplifies the weak signal output by the sensor body. The filter is used to filter out noise and interference signals to ensure the purity of the signal. The A / D converter is used to convert the analog signal into a digital signal for subsequent processing. The amplifier enhances the weak signal output by the sensor body to improve the strength and quality of the signal.

[0037] It also includes a power supply system 500. The power supply system 500 is arranged inside the outer housing 100, and is spaced from the circuit board 300. The power supply system 500 uses an isolated DC / DC converter to convert the external DC power supply into a stable operating voltage required by the sensor device. The power supply system 500 also includes overvoltage protection and overcurrent protection circuit modules to ensure the stability and safety of the power supply. The power supply system 500 is also equipped with a low-voltage alarm function, which automatically alarms to prompt the user to replace the battery or repair the power supply fault when the input voltage is lower than the set threshold.

[0038] A sensor device in a high-voltage and strong magnetic field environment includes the following steps:

[0039] Step 1: Fix this device at the position to be measured through a fixture or bolts, and select bolts suitable for the mounting holes 140 to ensure that this device is in contact with the object to be measured and is not affected by external forces. Calibrate the sensor using a standard calibration device, record and adjust the output characteristic curve of the sensitive element to ensure the measurement accuracy.

[0040] Step 2: Start the sensor device, amplify, filter, and perform analog-to-digital conversion on the original signal output by the sensitive element through the built-in signal processing circuit 400. The microprocessor further processes the digital signal according to the preset algorithm, such as denoising, linearization, etc., to improve the accuracy and reliability of the data.

[0041] Step 3: The processed data is transmitted to the external system through a dedicated optical fiber connector. The external system includes a data acquisition terminal and a computer for storage, analysis, and display. The user can remotely monitor and set the sensor through dedicated software to achieve real-time monitoring and fault diagnosis.

[0042] It also includes Step 4: Regularly check the shell tightness, electrical connection, and signal stability of the sensor device. For sensors working in harsh environments for a long time, it is necessary to regularly replace the metasurface protection layer 200 or the circuit board 300 to extend the service life and maintain the measurement accuracy.

[0043] Although the present invention has been described above with reference to the embodiments, various improvements can be made to it and components therein can be replaced with equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the features in the embodiments disclosed in the present invention can be combined with each other in any way. The exhaustive description of these combinations is not given in this specification only for the sake of saving space and resources. Therefore, the present invention is not limited to the specific embodiments disclosed in the text, but includes all technical solutions falling within the scope of the claims.

Claims

1. A sensor device in a high voltage and strong magnetic field environment, characterized in that: include: An outer shell (100), the outer shell (100) is in a cylindrical structure, the outer shell (100) is made of an alumina ceramic-based composite material, and both ends of the outer shell (100) are sealed with sealing covers (110); A super surface protective layer (200), the super surface protective layer (200) being located at the outermost layer of the outer shell (100), and comprising an electromagnetic shielding layer and an insulating layer, the electromagnetic shielding layer being a mesh-like body woven from a conductive material, the conductive material being an alloy of copper, aluminum, gold plating or silver plating; the insulating layer being formed by laminating a non-conductive multi-layer composite material, the lamination thickness of the insulating layer being uniform; the super surface being a micro-nano structure; A circuit board (300), the circuit board (300) being located inside the outer shell (100), a highly sensitive sensing element and a microprocessor being mounted on the circuit board (300), the microprocessor being electrically connected to the sensitive element, and the sensitive element being used to detect a target physical quantity; A signal processing circuit (400) is provided on a circuit board (300) and is located inside an outer shell (100). The signal processing circuit (400) comprises an amplifier, a filter, and an A / D converter body.

2. A sensor device for high voltage and strong magnetic field environment according to claim 1, characterized in that: The amplifier amplifies the weak signal output by the sensor body, and the filter is used to filter out noise and interference signals; the A / D converter is used to convert analog signals into digital signals, and the weak signal output by the sensor body is enhanced by the amplifier.

3. The sensor device for high voltage and strong magnetic field environment according to claim 1, characterized in that: It also includes a communication interface (120), which is an optical fiber interface arranged on the outside of the outer shell (100), the optical fiber interface is electrically connected to the sensor body, and the optical fiber interface is connected to an external device via a dedicated optical fiber connector.

4. The sensor device for high voltage and strong magnetic field environment according to claim 1, characterized in that: A mounting frame (130) is provided at the bottom of each sealing cover (110), and mounting holes (140) are opened at both ends of each mounting frame (130).

5. The sensor device for high voltage and strong magnetic field environment according to claim 1, characterized in that: A buffer plate (310) is fixedly mounted on the inner side wall of the outer shell (100), and the circuit board (300) is fixed on the buffer plate (310); the interior of the outer shell (100) is filled with an inert gas.

6. The sensor device for high voltage and strong magnetic field environment according to claim 1, characterized in that: It also includes a power supply system (500), the power supply system (500) is arranged inside the outer shell (100), and the power supply system (500) is arranged at a distance from the circuit board (300), and the power supply system (500) uses an isolated DC / DC converter to convert an external direct current power supply into a stable working voltage required by the sensor device; the power supply system (500) also includes an overvoltage protection and overcurrent protection circuit module.

7. A sensor device for high voltage and strong magnetic field environment according to claim 6, characterized in that: The power supply system (500) is also equipped with a low voltage alarm function, which automatically alarms when the input voltage is lower than a set threshold to prompt the user to replace the battery or repair the power failure.

8. A method for using a sensor in a high voltage and strong magnetic field environment, using a sensor device in a high voltage and strong magnetic field environment as claimed in claims 1 to 7, characterized in that: The following steps are included: Step 1, fix the device at the position to be measured by a clamp or bolt, and select bolts that are suitable for the mounting hole (140) to ensure that the device is in contact with the object to be measured and is not affected by external forces; use standard calibration equipment to calibrate the sensor, record and adjust the output characteristic curve of the sensitive element, and ensure measurement accuracy; Step 2: Start the sensor device, and amplify, filter and perform analog-to-digital conversion on the original signal output by the sensitive element through the built-in signal processing circuit (400); the microprocessor further processes the digital signal according to a preset algorithm, such as denoising and linearization, to improve the accuracy and reliability of the data; Step 3: The processed data is transmitted to the external system through a dedicated optical fiber connector. The external system includes a data acquisition terminal and a computer for storage, analysis and display. Users can remotely monitor and set the sensor through dedicated software to achieve real-time monitoring and fault diagnosis.

9. The method for using a sensor in a high voltage and strong magnetic field environment according to claim 8, characterized in that: The method further comprises step 4 of regularly checking the sealing performance of the housing, the electrical connection and the signal stability of the sensor device. For sensors that work in harsh environments for a long time, the super-surface protective layer (200) or the circuit board (300) needs to be replaced regularly to extend the service life and maintain the measurement accuracy.

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