Metasurface chip clamping and positioning structure and optical detection device

Abstract

A metasurface chip clamping and positioning structure comprises clamping plates and an opening and closing plate assembly, two movable clamping plates in the clamping plates are in transmission connection through a linkage rotating shaft, the opening and closing plate assembly pushes the two movable clamping plates to move reversely to complete opening and closing of corresponding clamping grooves, product clamping, placing and taking are achieved, and the clamping and positioning can achieve self-centering positioning of products. The stability is high, the opening and closing stroke is short, and the chip is prevented from being damaged by friction caused by clamping and supporting; the metasurface chip optical detection device comprises the clamping and positioning structure, a clamping and positioning structure moving module, a detection light source module, a receiving module, a power calibration module and a detection light source fine adjustment module, is designed based on an innovative detection method, and integrates detection and calibration; the defects of domestic metasurface chip optical performance detection are overcome, the data calibration precision is high, the detection result precision is high, a plurality of sets of detection assemblies can synchronously perform optical detection on a plurality of products, and the detection efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip quality detection, and specifically relates to a clamping and positioning structure for a metasurface chip and an optical detection device. Background Art

[0002] A metasurface chip is a chip with a metal superlens coated on its surface. The chip consists of three parts: a metasurface layer, a microlens, and an image sensor. Among them, the metasurface layer is composed of multiple different metasurface units, which have different spectral modulation effects on incident light; the microlens focuses the modulated light onto the image sensor for detection, and the spectral information of the incident light can be reconstructed from the detected light intensity. Traditional spectral imaging technologies generally adopt spatial scanning or wavelength scanning modes and cannot obtain the spectral information of each pixel point in the field of view scene in real time. Based on the snapshot spectral imaging technology solution of the metasurface, by designing metasurface units with different structures, broadband modulation of the incident light spectrum at each point in space can be achieved. An image sensor is used to collect the modulated optical signal, and the spectral information of the incident light is reconstructed through calculation. Spectral imaging can be realized by spatially arraying the computational spectrometer.

[0003] The metal superlens on the surface of the metasurface chip needs to be subjected to quality inspection. The parameters for performance detection of the metal superlens also have significant differences from those of traditional lenses. Traditional lenses mainly detect performance by measuring data such as refractive index, light transmittance, focal length, and distortion. However, the structure of the superlens is complex, and its performance is affected by various factors. It is mainly judged by detecting parameters such as light transmittance and scattering angle. There is no device suitable for detecting the performance of the superlens in the prior art. More importantly, the chip is small in size, and during the optical detection process, it needs to be positioned and then moved to the alignment position of the optical detection line. The positioning operations in the prior art are often completed by negative pressure adsorption and edge positioning, with low positioning accuracy, and it is impossible to detect in time when the negative pressure adsorption air path is disconnected, resulting in the chip deviating from the detection line and inaccurate detection data.

[0004] The present invention proposes a clamping and positioning structure for a metasurface chip and an optical detection device to solve the above technical problems. Summary of the Invention

[0005] A clamping and positioning structure for a metasurface chip, comprising: a clamping plate, the clamping plate includes a clamping plate mounting plate, a first movable clamping plate, a second movable clamping plate, a locking spring, a chip guiding plate, and a linkage rotating shaft. The chip guiding plate is fixed on the upper plate surface of the clamping plate mounting plate. One end of the second movable clamping plate is fixed to the locking spring, and the middle position is linked to the first movable clamping plate through the linkage rotating shaft. The central position of the linkage rotating shaft is rotatably connected to the clamping plate mounting plate, and both ends of the linkage rotating shaft are respectively limited in the plate surface grooves of the first movable clamping plate and the second movable clamping plate. The first movable clamping plate and the second movable clamping plate are both processed with clamping grooves. The other end of the locking spring is fixed to the clamping plate mounting plate. The chip guiding plate is located above the first movable clamping plate and the second movable clamping plate. The plate surface of the chip guiding plate is processed with chip guiding holes, and the positions of the chip guiding holes correspond to those of the clamping grooves.

[0006] Preferably, for the clamping and positioning structure of the metasurface chip, the plate surface of the chip guiding plate is further processed with a communicating gourd-shaped mounting hole. One end of the mounting hole is provided with a communicating groove and a spring piece. After the chip guiding plate first passes through a screw from the large diameter of the mounting hole, the chip guiding plate is pushed on one side so that the screw is stuck in the small diameter hole of the mounting hole, and the spring piece below undergoes a slight deformation to clamp the screw, completing the installation of the chip guiding plate.

[0007] Preferably, for the clamping and positioning structure of the metasurface chip, a guiding sleeve is sleeved on the screw for installing the chip guiding plate, and the outer side of the guiding sleeve contacts the plate surface of the second movable clamping plate to complete the moving contact type guiding.

[0008] Preferably, the clamping and positioning structure of the metasurface chip further includes an opening and closing plate assembly. The opening and closing plate assembly includes an opening and closing plate and an opening and closing cylinder. The power output end of the opening and closing cylinder is fixedly connected to the opening and closing plate. During the translation process of the opening and closing plate, the first movable clamping plate and the second movable clamping plate are directly or indirectly pushed to move in opposite directions, so that the distance between the clamping grooves in the first movable clamping plate and the second movable clamping plate becomes larger. When the opening and closing plate returns to its original position, under the restoring force of the locking spring, the first movable clamping plate and the second movable clamping plate return to their original positions, and the metasurface chip is clamped in the clamping grooves.

[0009] Preferably, for the clamping and positioning structure of the metasurface chip, the opening and closing plate assembly further includes an opening and closing transmission plate. The opening and closing transmission plate is fixedly connected to the end of the second movable clamping plate. The plate surface of the opening and closing plate is processed with a transmission plate positioning groove / and a transmission plate linkage inclined surface. During the translation process of the opening and closing transmission plate, the transmission plate positioning groove and the transmission plate linkage inclined surface respectively contact the opening and closing transmission plates at the ends of two adjacent second movable clamping plates.

[0010] The working principle of the clamping and positioning structure of the metasurface chip is as follows: Before placing the metasurface chip to be optically detected, the second moving clamping plate is pushed by the opening and closing plate assembly, so that the first and second moving clamping plates move in the opposite direction first. After the chip is placed in the clamping slot, the reverse thrust of the moving clamping plate is removed, and the first and second moving clamping plates are reset by the locking spring and fix the product in the slot; wherein, during the movement of the second moving clamping plate, the first moving clamping plate and the second moving clamping plate can move synchronously in the opposite direction through the action of the linkage rotating shaft to complete the opening and closing actions of the two ends of the slot.

[0011] A metasurface chip optical detection device includes: a clamping and positioning structure, a clamping and positioning structure moving module, a detection light source module, and a receiving module. The clamping and positioning structure is used for positioning and clamping the metasurface chip to be detected. The clamping and positioning structure is moved to directly above the detection light source module through the clamping and positioning structure moving module. The receiving module is used to receive the light after passing through the metasurface chip. The structure of the clamping and positioning structure includes the clamping plate / and the opening and closing plate assembly.

[0012] Preferably, for the metasurface chip optical detection device, the clamping and positioning structure moving module includes an X-axis motor-ball screw, and the moving end of the X-axis motor-ball screw is connected to the clamping plate; the detection light source module is a laser, and the receiving module is a CCD camera. The receiving module is located above the detection light source module, and both the detection light source module and the receiving module are provided with moving modules.

[0013] Preferably, for the metasurface chip optical detection device, the moving modules of the detection light source module and the receiving module both include an X-axis motor-ball screw and a Y-axis motor-ball screw. The power output ends of the X-axis motor-ball screw and the Y-axis motor-ball screw are connected, and the moving end of the X-axis motor-ball screw is connected to the CCD mounting plate / laser mounting plate.

[0014] Preferably, the metasurface chip optical detection device further includes a detection light source fine adjustment module. The detection light source fine adjustment module includes a dial indicator lifting table / and a translation screw. The upper plate surface of the laser mounting plate is provided with a Z-direction slide rail, and the dial indicator lifting table is slidably connected to the laser mounting plate through this slide rail. The translation screws are arranged on both sides of the laser, and the ends of the translation screws abut against both side surfaces of the dial indicator lifting table. The lifting end of the dial indicator lifting table is connected to the laser.

[0015] Preferably, the optical detection device for metasurface chips further includes a power calibration module. The power calibration module includes a first laser power meter, a first ranging sensor, a first slide rail, a second laser power meter, an attenuation sheet, a second slide rail, and a third slide rail. The first laser power meter and the first ranging sensor are fixedly connected to the slider of the first slide rail through a connecting plate. Multiple holes are machined on the mounting plate surface of the first slide rail, and the positions of the first laser power meter and the first ranging sensor are fixed by spring plungers. The second laser power meter is fixedly connected to the slider of the second slide rail through a connecting plate. Multiple holes are machined on the mounting plate surface of the second slide rail. After pushing the second laser power meter above different lasers, the position of the second laser power meter is fixed by a spring plunger. A third slide rail is arranged on the support plate surface of the attenuation sheet. The slider of the second slide rail is fixed to the slider of the third slide rail, and the positions of the mounting plates of the second slide rail and the third slide rail are fixed by side screws.

[0016] The working principle of the optical detection device for metasurface chips is as follows: After the metasurface chip is placed in the clamping and positioning structure, under the action of the moving module, the chip is moved directly above the laser. At this time, the laser, the chip, and the CCD camera are in a straight line. The light emitted by the laser passes through the metasurface chip and the attenuation sheet and is captured by the CCD camera. The CCD camera transmits the captured light information to the background software for analysis and calculation, and judges whether the performance of the optical metasurface chip is qualified according to the calibration information. The attenuation sheet is an optical lens with a certain selected light transmittance to prevent the CCD camera from being damaged due to excessive optical power of the laser.

[0017] The advantages are as follows: The clamping and positioning structure for metasurface chips involved in the present invention performs self-centering positioning through two linked moving clamping plates, replacing the traditional edge positioning structure. The positioning action is simple and the positioning stability is good, which can effectively avoid product deviation during edge movement and avoid wear caused by friction between the metasurface chip and the clamping structure, providing guarantee for subsequent concentricity optical detection; In the clamping and positioning structure for metasurface chips involved in the present invention, a single action of the opening and closing cylinder can simultaneously complete the opening and closing of the card slots of multiple groups of first and second moving clamping plates through the structural design of the opening and closing plate, with high working efficiency and simplified structural design; In the clamping and positioning structure for metasurface chips involved in the present invention, the second moving clamping plate is provided with a pin shaft for translation guidance. The second moving clamping plate realizes indirect guidance through the linked connection with the first moving clamping plate, and the moving guidance can ensure the centering of the product in the card slot and stable clamping; The optical detection device for metasurface chips involved in the present invention is designed according to the creative optical detection method for metasurface chips, with novel working principle and accurate detection results; In the optical detection device for metasurface chips according to the present invention, a calibration structure is provided to calibrate the light spot after emission, and the calibration result is used for the detection and judgment of the final product, improving the detection accuracy. The use of an attenuation sheet avoids damage to the CCD camera caused by high-intensity laser light; In the optical detection device for metasurface chips according to the present invention, the accuracy of chip clamping and positioning guarantees the position alignment and detection efficiency for subsequent detections, avoiding the phenomenon of frequent fine-tuning required due to inaccurate clamping and positioning, enabling the optical detection of batch products, and greatly reducing the optical detection cost; The optical detection device for metasurface chips according to the present invention calibrates each laser, and multiple lasers can set the power according to actual needs. The attenuation sheet can also set the light transmittance according to needs. The optical detection of multiple chips is completed in one operation, which is suitable for the batch detection of chips. Brief Description of the Drawings

[0018] The following further describes the specific embodiments in conjunction with the drawings, where: Figure 1 、 2 are schematic structural diagrams of different perspectives of the structure of an optical detection device for metasurface chips according to the present invention; Figure 3 is a schematic assembly structure diagram of a detection light source module and a detection light source fine-tuning module according to the present invention; Figure 4 、 5 is a schematic structural diagram of a clamping plate according to the present invention; Figure 6 is a schematic structural diagram of a clamping and positioning structure according to the present invention; The specific structures corresponding to the numbers are as follows: Clamping and positioning structure 1, clamping plate 11, clamping plate mounting plate 111, first moving clamping plate 112, second moving clamping plate 113, locking spring 114, chip guide plate 115, chip guide hole 1151, mounting hole 1152, elastic piece 1153, linkage rotating shaft 116, card slot 117, opening and closing plate assembly 12, opening and closing plate 121, drive plate positioning groove 1211, drive plate linkage inclined surface 1212, opening and closing cylinder 122, opening and closing drive plate 123, clamping and positioning structure moving module 2, detection light source module 3, receiving module 4, power calibration module 5, first laser power meter 51, first distance measuring sensor 52, second laser power meter 53, attenuation sheet 54, detection light source fine-tuning module 6, dial indicator lifting table 61, translation screw 62, The following specific embodiments will further illustrate the present invention in conjunction with the above drawings. Specific Embodiments

[0019] Specific Embodiment 1: A clamping and positioning structure for a metasurface chip, comprising: a clamping plate 11, the clamping plate 11 includes a clamping plate mounting plate 111, a first movable clamping plate 112, a second movable clamping plate 113, a locking spring 114, a chip guide plate 115, and a linkage rotating shaft 116. The chip guide plate 115 is fixed on the upper plate surface of the clamping plate mounting plate 111. One end of the second movable clamping plate 113 is fixed to the locking spring 114, and the middle position is linked to the first movable clamping plate 112 through the linkage rotating shaft 116. The central position of the linkage rotating shaft 116 is rotatably connected to the clamping plate mounting plate 111, and both ends of the linkage rotating shaft 116 are respectively limited in the plate surface grooves of the first movable clamping plate 112 and the second movable clamping plate 113. The first movable clamping plate 112 and the second movable clamping plate 113 are both processed with clamping grooves 117. The other end of the locking spring 114 is fixed to the clamping plate mounting plate 111. The chip guide plate 115 is located above the first movable clamping plate 112 and the second movable clamping plate 113. The plate surface of the chip guide plate 115 is processed with a chip guide hole 1151, and the position of the chip guide hole 1151 corresponds to that of the clamping groove 117.

[0020] Specific implementation case 2: Based on specific implementation case 1, the clamping and positioning structure for a metasurface chip can also select one or more of the following preferred technical solutions. Optionally, the plate surface of the chip guide plate 115 is also processed with a communicating gourd-shaped mounting hole 1152. One end of the mounting hole 1152 is provided with a communicating groove and a spring piece 1153. After the chip guide plate 115 first passes through the pin shaft from the large diameter of the mounting hole 1152, the chip guide plate 115 is pushed on one side so that the pin shaft is stuck in the small diameter hole of the mounting hole 1152, and the spring piece 1153 below will undergo a slight deformation to clamp the pin shaft, completing the installation of the chip guide plate 115.

[0021] Optionally, the pin shaft for installing the chip guide plate 115 contacts the side plate surface of the second movable clamping plate 113 to complete the moving contact type guiding and improve the moving accuracy.

[0022] Optionally, it further includes an opening and closing plate assembly 12. The opening and closing plate assembly 12 includes an opening and closing plate 121 and an opening and closing cylinder 122. The power output end of the opening and closing cylinder 122 is fixedly connected to the opening and closing plate 121. During the translation process of the opening and closing plate 121, it directly or indirectly pushes the first moving clamping plate 112 and the second moving clamping plate 113 to move in the opposite direction, so that the distance between the clamping slots 117 in the first moving clamping plate 112 and the second moving clamping plate 113 becomes larger, facilitating the picking and placing of the metasurface chip. When the opening and closing plate 121 resets, under the restoring force of the locking spring 114, the first moving clamping plate 112 and the second moving clamping plate 113 reset, and the metasurface chip is clamped in the clamping slot 117.

[0023] Optionally, the opening and closing plate assembly 12 further includes an opening and closing transmission plate 123. The opening and closing transmission plate 123 is fixedly connected to the end of the second moving clamping plate 113. The plate surface of the opening and closing plate 121 is processed with a transmission plate positioning groove 1211 / and a transmission plate linkage inclined surface 1212. During the translation process of the opening and closing transmission plate 123, the transmission plate positioning groove 1211 and the transmission plate linkage inclined surface 1212 respectively abut against the opening and closing transmission plates 123 at the ends of two adjacent second moving clamping plates 113, and then push the first moving clamping plate 112 and the second moving clamping plate 113 to move in the opposite direction. As shown in the figure, there are four groups of product clamping and positioning structures, and only two opening and closing plates and one opening and closing cylinder can complete the opening and closing operations of the 4 groups of clamping and positioning structures.

[0024] When multiple sets of the first moving clamping plate 112, the second moving clamping plate 113, the locking spring 114, the chip guiding plate 115, and the linkage rotating shaft 116 are installed on the upper plate surface of the clamping plate mounting plate 111, the above-mentioned structure of the opening and closing plate and the opening and closing transmission plate can be used for the opening and closing pushing operation, improving the work efficiency and reducing the number of opening and closing cylinders used.

[0025] The working principle of the metasurface chip clamping and positioning structure is as follows: Before the metasurface chip to be optically detected is placed, the first and second moving clamping plates first move in the opposite direction. After being placed through the chip guiding holes of the chip guiding plate, the reverse thrust of the moving clamping plates is removed, and the first and second moving clamping plates reset to clamp the product in the clamping slot; among them, during the movement of the second moving clamping plate, the first moving clamping plate and the second moving clamping plate can move synchronously in the opposite direction through the action of the linkage rotating shaft, completing the opening and closing actions of the clamping slots at both ends.

[0026] Specific implementation case 3: A super-surface chip optical detection device, comprising: a clamping and positioning structure 1, a clamping and positioning structure moving module 2, a detection light source module 3, and a receiving module 4. The clamping and positioning structure 1 is used for positioning and clamping the super-surface chip to be detected. The clamping and positioning structure 1 is moved to directly above the detection light source module 3 through the clamping and positioning structure moving module 2. The receiving module 4 is used for receiving the light after passing through the super-surface chip. The clamping and positioning structure 1 includes a clamping plate 11 and a opening and closing plate assembly 2, as described in the structures of specific implementation cases 1 to 2.

[0027] Optionally, the detection light source module 3 can be a laser, and the receiving module 4 can be a CCD camera. The CCD camera compares the received optical information with the optical information emitted by the laser. Through background software analysis and calculation, the light transmittance of the super-surface chip is obtained, and then the scattering angle is calculated based on the distances between the laser, the super-surface chip, and the CCD camera. After comparing with the set value, it is determined whether the performance of the super-surface chip is qualified. For the convenience of description below, it is directly described by the laser and the CCD camera, but it should not be considered as a limitation to the detection light source module 3 and the receiving module 4.

[0028] The clamping and positioning structure moving module 2 includes an X-axis motor-ball screw. The moving end (screw nut) of the X-axis motor-ball screw is connected to the clamping plate 11 (specifically, connected to the clamping plate mounting plate 111). Optionally, the clamping and positioning structure moving module 2 further includes a moving guide rail 21. The clamping plate 11 is guided and slides through the moving guide rail 21. The detection light source module 3 is a laser, and the receiving module 4 is a CCD camera. The receiving module 4 is located above the detection light source module 3. Both the detection light source module 3 and the receiving module 4 are provided with moving modules.

[0029] The moving modules of the detection light source module 3 and the receiving module 4 both include an X-axis motor-ball screw and a Y-axis motor-ball screw. The power output ends of the X-axis motor-ball screw and the Y-axis motor-ball screw are connected. The moving end of the X-axis motor-ball screw is fixedly connected to the CCD mounting plate and connected to the laser mounting plate. The motor-ball screw is a relatively mature existing technology and will not be elaborated here.

[0030] The above moving module can be implemented by various moving structures in the existing technology to meet the moving requirements, specifically selected according to the implementation accuracy. This is not a limitation to the moving module.

[0031] Specific implementation case 4: Based on specific implementation case 3, the super-surface chip optical detection device further includes one or more of the following preferred technical solutions: Optionally, it further includes a detection light source fine-tuning module 6. The detection light source fine-tuning module 6 includes a dial indicator lifting table 61 and a translation screw 62. The upper plate surface of the laser mounting plate is provided with a Z-direction slide rail, and the dial indicator lifting table 61 is slidably connected to the laser mounting plate through this slide rail. The translation screws 62 are arranged on both sides of the laser. The end of the translation screw 62 abuts against both side surfaces of the dial indicator lifting table 61, and the laser is guided by a pin shaft in the Y-axis direction during the Y-axis adjustment process. The lifting end of the dial indicator lifting table 61 is connected to the laser. The dial indicator lifting table 61 is a prior art and will not be described in detail here.

[0032] Lasers with the same quantity as the product loading move simultaneously under the action of the moving module. However, due to processing and installation errors, the lasers may not be on the same straight line as the product and the CCD camera, and it is necessary to finely adjust the position through the detection light source fine-tuning module 6.

[0033] Optionally, it further includes a power calibration module 5. The power calibration module 5 includes a first laser power meter 51, a first distance sensor 52, a first slide rail, a second laser power meter 53, an attenuation sheet 54, a second slide rail, and a third slide rail. The first laser power meter 51 and the first distance sensor 52 are fixedly connected to the slider of the first slide rail through a connecting plate. The plate surface of the mounting plate of the first slide rail 54 is processed with multiple holes. After pushing the first laser power meter 51 and the first distance sensor 52 above different lasers, the first laser power meter 51 and the first distance sensor 52 are fixed through spring plungers; the second laser power meter 53 is fixedly connected to the slider of the second slide rail through a connecting plate. The plate surface of the mounting plate of the second slide rail is processed with multiple holes. After pushing the second laser power meter 53 above different lasers, the position of the second laser power meter 53 is fixed through a spring plunger. The plate surface of the support plate of the attenuation sheet 54 is provided with a third slide rail. The second slide rail is fixedly connected to the slider of the third slide rail, and the positions of the mounting plates of the second slide rail and the third slide rail are fixed through side screws.

[0034] Use the lower calibration module (the first laser power meter 51, the first distance measuring sensor 52, the first slide rail, the CCD camera. During the calibration process, the laser, the power meter, the attenuation sheet, and the CCD camera should be on the same straight line) to calibrate the laser power and the gray scale of the spot detected by the CCD camera at a certain distance for each laser; during the optical detection of the chip, use the upper calibration module (the second laser power meter 53, the attenuation sheet 54, the second slide rail, the third slide rail. First, move the second laser power meter 53 directly above the attenuation sheet to make the laser, the attenuation sheet, the second laser power meter, the metasurface chip, and the CCD camera on a straight line) to detect the power of the laser transmitted through the metasurface chip and the attenuation sheet and the gray scale of the spot detected by the CCD camera at a certain distance. The attenuation sheet is an optical lens with a certain light transmittance, mainly used to attenuate the light brightness to avoid damage to the CCD camera caused by the laser.

[0035] The above embodiments only represent several implementation manners of the present invention. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patent of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several deformations and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention should be subject to the appended claims.

Claims

1. A clamping and positioning structure for a metasurface chip, characterized in that: It includes a clamping plate, and the clamping plate includes a clamping plate mounting plate, a first movable clamping plate, a second movable clamping plate, a locking spring, a chip guide plate, and a linkage rotating shaft. The chip guide plate is fixed on the upper plate surface of the clamping plate mounting plate. One end of the second movable clamping plate is fixed to the locking spring, and the middle position is linked to the first movable clamping plate through the linkage rotating shaft. The central position of the linkage rotating shaft is rotatably connected to the clamping plate mounting plate, and both ends of the linkage rotating shaft are respectively limited in the plate surface grooves of the first movable clamping plate and the second movable clamping plate. The first movable clamping plate and the second movable clamping plate are both processed with clamping grooves. The other end of the locking spring is fixed to the clamping plate mounting plate. The chip guide plate is located above the first movable clamping plate and the second movable clamping plate. The plate surface of the chip guide plate is processed with chip guide holes, and the positions of the chip guide holes correspond to those of the clamping grooves.

2. The clamping and positioning structure for a metasurface chip according to claim 1, characterized in that: The plate surface of the chip guide plate is also processed with a communicating gourd-shaped mounting hole. One end of the mounting hole is provided with a communicating groove and a spring piece. After the chip guide plate first passes through the pin shaft from the large diameter of the mounting hole, the chip guide plate is pushed on one side so that the pin shaft is stuck in the small diameter hole of the mounting hole, and the spring piece below is slightly deformed to clamp the pin shaft, completing the installation of the chip guide plate.

3. The clamping and positioning structure for a metasurface chip according to claim 2, characterized in that: The outside of the pin shaft for installing the chip guide plate contacts the side surface of the second movable clamping plate to complete the moving contact type guiding.

4. The clamping and positioning structure for a metasurface chip according to claim 1, characterized in that: It further includes an opening and closing plate assembly. The opening and closing plate assembly includes an opening and closing plate and an opening and closing cylinder. The power output end of the opening and closing cylinder is fixedly connected to the opening and closing plate. During the translation process of the opening and closing plate, the first movable clamping plate and the second movable clamping plate are directly or indirectly pushed to move in the opposite direction, so that the distance between the clamping grooves in the first movable clamping plate and the second movable clamping plate becomes larger. When the opening and closing plate returns to its original position, under the restoring force of the locking spring, the first movable clamping plate and the second movable clamping plate return to their original positions, and the metasurface chip is clamped in the clamping grooves.

5. The clamping and positioning structure for a metasurface chip according to claim 4, characterized in that: The opening and closing plate assembly further includes an opening and closing transmission plate. The opening and closing transmission plate is fixedly connected to the end of the second movable clamping plate. The plate surface of the opening and closing plate is processed with a transmission plate positioning groove / and a transmission plate linkage inclined surface. During the translation process of the opening and closing transmission plate, the transmission plate positioning groove and the transmission plate linkage inclined surface respectively abut against the opening and closing transmission plates at the ends of two adjacent second movable clamping plates.

6. A metasurface chip optical detection device, characterized in that: It includes a clamping and positioning structure, a moving module for the clamping and positioning structure, a detection light source module, and a receiving module. The clamping and positioning structure is used for positioning and clamping the metasurface chip to be detected. The clamping and positioning structure is moved to directly above the detection light source module through the moving module for the clamping and positioning structure. The receiving module is used for receiving the light after passing through the metasurface chip. The structure of the clamping and positioning structure is as described in any one of claims 1 to 5.

7. An optical detection device for a metasurface chip as described in claim 6, characterized in that: The moving module for the clamping and positioning structure includes an X-axis motor-ball screw. The moving end of the X-axis motor-ball screw is connected to the clamping plate. The detection light source module is a laser, and the receiving module is a CCD camera. The receiving module is located above the detection light source module. Moving modules are provided for both the detection light source module and the receiving module.

8. An optical detection device for a metasurface chip as described in claim 7, characterized in that: The moving modules for the detection light source module and the receiving module both include an X-axis motor-ball screw and a Y-axis motor-ball screw. The power output ends of the X-axis motor-ball screw and the Y-axis motor-ball screw are connected. The moving end of the X-axis motor-ball screw is connected to the CCD mounting plate / laser mounting plate.

9. An optical detection device for a metasurface chip as described in claim 8, characterized in that: It further includes a fine-tuning module for the detection light source. The fine-tuning module for the detection light source includes a dial indicator lifting table / and translation screws. The upper plate surface of the laser mounting plate is provided with a Z-direction slide rail, and the dial indicator lifting table is slidably connected to the laser mounting plate through this slide rail. Translation screws are provided on both sides of the laser. The ends of the translation screws abut against both side surfaces of the dial indicator lifting table. The lifting end of the dial indicator lifting table is connected to the laser.

10. An optical detection device for a metasurface chip as described in claim 6, characterized in that: It further includes a power calibration module. The power calibration module includes a first laser power meter, a first distance sensor, a first slide rail, a second laser power meter, an attenuation sheet, a second slide rail, and a third slide rail. The first laser power meter and the first distance sensor are fixedly connected to the slider of the first slide rail through a connecting plate. Multiple holes are machined on the plate surface of the mounting plate of the first slide rail, and the positions of the first laser power meter and the first distance sensor are fixed through spring plungers. The second laser power meter is fixedly connected to the slider of the second slide rail through a connecting plate. Multiple holes are machined on the plate surface of the mounting plate of the second slide rail. After pushing the second laser power meter above different lasers, the position of the second laser power meter is fixed through spring plungers. The plate surface of the support plate of the attenuation sheet is provided with a third slide rail. The second slide rail is fixedly connected to the slider of the third slide rail, and the positions of the mounting plates of the second slide rail and the third slide rail are fixed through side screws.

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