Determination method, adjustment method and article manufacturing method
By measuring and estimating the impact of environmental changes on the projection optical system, adjusting the inclination of optical components, solving the problem of optical performance differences caused by environmental changes, and achieving effective correction and adjustment in different environments.
Patent Information
- Application Number
- CN202411724333.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-11-30
- Filing Date
- 2024-11-28
- Publication Date
- 2025-05-30
AI Technical Summary
When moving the exposure device from one environment to another, it may be possible to vary the optical performance of the projection optics due to environmental changes such as changes in air pressure and elevation, which makes it difficult to precisely adjust to meet the desired specifications.
By measuring and estimating the difference in optical performance in different environments, the amount of inclination of the optical components installed in the second environment is determined, so that the difference in measured and estimated optical performance is reduced, thereby achieving effective correction of the projection optical system.
In the case of environmental changes, it is possible to easily adjust the exposure device to meet the desired specifications of optical performance, and improve the efficiency and accuracy of the equipment after the shifting.
Smart Images

Figure CN120065637A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a method for determining an adjustment amount of an exposure device, an adjustment method for an exposure device, and an article manufacturing method. Background Art
[0002] An exposure device having a projection optical system is used in the manufacturing process of semiconductor devices and MEMS (Micro Electro Mechanical System) devices, i.e., the photolithography process. In the exposure device, the optical performance of the projection optical system can change in conjunction with changes in the external environment, and is therefore arranged in a constant temperature chamber that controls temperature and humidity in a semiconductor device factory. However, it is difficult to control the air pressure in the constant temperature chamber with good precision. Therefore, in the exposure device, a correction mechanism for correcting the optical performance of the projection optical system is provided, and the correction mechanism can correct the optical performance of the projection optical system according to changes in air pressure. Patent document 1 discloses a technology for correcting the optical performance (magnification) of the projection optical system by displacing the lens in the projection optical system in the direction of the optical axis.
[0003] Prior art literature
[0004] Patent Literature
[0005] Patent document 1: Japanese Patent Application Laid-Open No. 62-35620. Summary of the invention
[0006] Problem that the invention aims to solve
[0007] The environment (e.g., elevation, air pressure) of the location where the exposure device is to be relocated (shipping destination) is sometimes different from the environment of the location before relocation (before shipment) where the exposure device is equipped with a projection optical system and the like for manufacturing the exposure device. In this case, there may be a difference in the optical performance of the projection optical system at the location before relocation and at the location of the relocation destination. As a method of reducing such a difference in optical performance, there is a method of replacing optical components installed in the projection optical system. However, if only the optical components are replaced, sometimes the optical performance of the projection optical system at the location of the relocation destination does not meet the desired specifications, and when installing the optical components in the projection optical system, it is necessary to adjust the inclination of the optical components relative to the projection optical system, etc.
[0008] Therefore, an object of the present invention is to provide a technique advantageous for facilitating adjustment of an exposure apparatus at a transfer destination having an environment different from that before transfer.
[0009] Solutions for solving problems
[0010] In order to achieve the above object, as a determination method according to one aspect of the present invention, an adjustment amount of the exposure apparatus is determined when the exposure apparatus having a projection optical system is transferred from a first environment to a second environment. The determination method is characterized by including: a measurement step of measuring optical performance of the projection optical system in the reference state in which a first optical component having a first light transmissive member is mounted, in the first environment; an estimation step of estimating optical performance of the projection optical system in the reference state in which a second optical component having a second light transmissive member with a thickness different from that of the first light transmissive member is mounted, in the second environment; and a determination step of determining an inclination amount of the second light transmissive member when the second optical component is mounted on the projection optical system in the second environment, so as to reduce a difference between the optical performance measured in the measurement step and the optical performance estimated in the estimation step. The projection optical system includes a lens and a drive mechanism for driving the lens, and the reference state is a state in which the lens is disposed at a reference position within a stroke range in which the drive mechanism can drive the lens.
[0011] The following preferred embodiments described with reference to the drawings clarify another object or other aspects of the present invention.
[0012] Effects of the Invention
[0013] According to the present invention, for example, it is possible to provide an advantageous technique for easily adjusting an exposure apparatus at a transfer destination different from the environment before transfer. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a schematic diagram showing a structural example of an exposure apparatus.
[0015] Figure 2 It is a diagram for explaining adjustment of a projection optical system in the first embodiment.
[0016] Figure 3 It is a diagram for explaining stroke prediction of a lens in a projection optical system.
[0017] Figure 4 It is a diagram for explaining stroke prediction of a lens in a projection optical system.
[0018] Figure 5 It is a schematic diagram showing a structural example 1 of a second optical component in the first embodiment.
[0019] Figure 6 It is a schematic diagram showing a structural example of a first holding portion for holding a planar glass.
[0020] Figure 7 It is a schematic diagram showing a structural example 2 of a second optical component in the first embodiment.
[0021] Figure 8 It is a diagram for explaining the stroke prediction of the lens in the projection optical system.
[0022] Figure 9 It is a flowchart showing a method for determining the adjustment amount of the exposure apparatus.
[0023] Figure 10 It is a diagram for explaining the adjustment of the exposure apparatus in the second embodiment.
[0024] Figure 11 It is a diagram for explaining the stroke prediction of the lens in the projection optical system.
[0025] Figure 12 It is a schematic diagram showing a structural example of the first holding portion of the second optical component in the third embodiment.
[0026] Figure 13 It is a schematic diagram when observing the first holding member and its periphery in the first holding portion of the third embodiment from above.
[0027] Figure 14 It is a diagram for explaining the movement of the leaf spring and the adjustment stud in the first holding portion of the third embodiment.
[0028] Figure 15 It is a schematic diagram showing a structural example of the first holding portion of the second optical component in the fifth embodiment.
[0029] Figure 16 It is a schematic diagram showing a structural example of the change mechanism in the first holding portion of the fifth embodiment.
[0030] Figure 17 It is a schematic diagram showing a cross-section of the first holding portion of the fifth embodiment.
[0031] Figure 18 It is a diagram for explaining the movement of the change mechanism in the first holding portion of the fifth embodiment.
[0032] Figure 19 It is a schematic diagram showing a structural example of the first holding portion of the second optical component in the sixth embodiment.
[0033] Figure 20 It is a schematic diagram showing a modified example of the first holding portion of the second optical component in the sixth embodiment.
[0034] Explanation of reference numerals
[0035] EXP: Exposure apparatus; 3: Illumination optical system; 6: Mask; 7: Mask stage; 8: Projection optical system; 9: Substrate; 10: Chuck; 11: Substrate stage; 12: Surface position detection unit; 13: Alignment locator; 14: Reference substrate; 15: Wavefront measurement unit. Detailed implementation mode
[0036] Hereinafter, the implementation mode will be described in detail with reference to the accompanying drawings. Moreover, the following implementation mode is not used to limit the invention related to the claims. A plurality of features are described in the implementation mode, but the present invention is not limited to the need for all of these plurality of features. In addition, the plurality of features can be arbitrarily combined. Further, in the drawings, the same or similar structures are given the same reference numerals, and repeated descriptions are omitted.
[0037] <First implementation mode>
[0038] The first implementation mode related to the present invention will be described. The exposure apparatus is a lithography apparatus used in the manufacturing process of devices such as semiconductor elements, liquid crystal display elements, and magnetic storage media, that is, the lithography process. The exposure apparatus performs an exposure process, exposes the substrate via the mask, and transfers (forms) the pattern formed on the mask to the substrate.
[0039] The exposure apparatus adopts the step and repeat method (step and repeat), the step and scan method (step and scan), and transfers the pattern of the mask to a plurality of regions (projection grid regions, shots) of the substrate in sequence while moving the substrate step by step. An exposure apparatus that transfers the pattern of the mask all at once is called a stepper, and an exposure apparatus that transfers the pattern of the mask while scanning (scan) the mask and the substrate relative to each other is called a scanner. Moreover, regarding the basic operation of transferring the pattern of the mask to the substrate while moving the substrate step by step, this is common to both the stepper and the scanner. In addition, as the exposure light (exposure wavelength), the exposure apparatus can use, for example, i-line with a wavelength of 365 nm, KrF excimer laser with a wavelength of 248 nm, ArF excimer laser with a wavelength of 193 nm, extreme ultraviolet light (EUV) with a wavelength of several nm to several hundred nm, and the like.
[0040] Figure 1 It is a schematic diagram showing a structural example of the exposure apparatus EXP of the present implementation mode. As Figure 1 shown, the exposure apparatus EXP has: an illumination optical system 3 that illuminates the mask 6 with light 2 from a light source 1; and a mask stage 7 that holds the mask 6. In addition, the exposure apparatus EXP has: a projection optical system 8 that projects the pattern of the mask 6 onto the substrate 9; a substrate stage 11 that holds the substrate 9; and a control unit CU.
[0041] Light 2 (exposure light) in a predetermined wavelength region emitted from light source 1 is incident on illumination optical system 3, guided to condenser lens 5 via mirror 4, and illuminates the pattern (pattern surface) of reticle 6 with uniform illuminance. A measurer for measuring the cumulative light amount (exposure amount) of light 2 irradiated on substrate 9 can be provided in illumination optical system 3.
[0042] Reticle 6 is transported by a reticle transport device (not shown) to a predetermined position within the exposure apparatus (specifically, on reticle stage 7) and is held (attracted and fixed) by reticle stage 7. Light 2 passing through reticle 6 is incident on projection optical system 8. Projection optical system 8 projects an image of the pattern of reticle 6 onto a predetermined region (one projection cell region) of substrate 9. Here, adjustment shims 7SP for adjusting the position and attitude of the surface (object surface) of the reticle are arranged at the fixing portion of reticle stage 7. In addition, the position of reticle stage 7 is measured at any time by a measuring device including a laser interferometer and a movable mirror, and is controlled (positioned) by control unit CU.
[0043] Substrate 9 is held by substrate stage 11 via chuck 10. The position of substrate stage 11 is measured at any time by a measuring device including a laser interferometer and a movable mirror, and is controlled (positioned) by control unit CU. When exposure apparatus EXP is a scanner, the movement (scanning) of reticle stage 7 and the movement (scanning) of substrate stage 11 are synchronously controlled by control unit CU. Here, on substrate stage 11, one or more reference substrates 14 are fixedly provided on or near chuck 10. The surface (upper surface) of reference substrate 14 is arranged to be substantially the same height as the upper surface of substrate 9. A plurality of reference marks formed of Cr, Al, etc. are provided on the surface of reference substrate 14.
[0044] In addition, exposure apparatus EXP may include: a surface position detection unit 12 that detects the position (height) of the surface of substrate 9 (or the surface of reference substrate 14); and an alignment locator 13 (Alignment Scope, alignment detection unit) that detects alignment marks provided on substrate 9 (or reference substrate 14).
[0045] The surface position detection unit 12 employs a position detection method of oblique incidence. The surface position detection unit 12 irradiates the surface of the substrate 9 (or the reflection surface of the reference substrate 14) on which the pattern of the original plate 6 is to be transferred by the projection optical system 8 with non-exposure light from an oblique direction, and detects the reflected light obliquely reflected from the surface of the substrate 9 (or the surface of the reference substrate 14). The surface position detection unit 12 has light-receiving elements for position detection corresponding to one or more light beams reflected from the surface of the substrate 9 (or the surface of the reference substrate 14), and the light-receiving surfaces of these light-receiving elements are arranged substantially conjugately with the surface of the substrate 9 (the reflection points of the respective light beams). Therefore, the position deviation of the substrate 9 (or the reference substrate 14) in the optical axis direction of the projection optical system 8 is measured as the position deviation of the reflected light on the light-receiving surface of the light-receiving element. In addition, an adjustment shim 12SP is provided in the fixing portion of the surface position detection unit 12, and this adjustment shim 12SP is used to adjust the focal position of the surface position detection unit 12 to the height of the surface of the substrate 9 during the manufacture of the exposure apparatus EXP.
[0046] The alignment locator 13 has a locator reference mark inside. The alignment marks provided on the substrate 9 or the reference substrate 14 are arranged within the detection range (detection field of view) of the alignment locator 13 by the drive of the substrate stage 11. Moreover, the alignment locator 13 measures the relative deviation amount between the alignment marks provided on the substrate 9 or the reference substrate 14 and the locator reference mark. Based on this measurement result, the control unit CU can perform alignment and baseline correction of the substrate 9. In addition, an adjustment shim 13SP is provided in the fixing portion of the alignment locator 13, and this adjustment shim 13SP is used to adjust the focal position of the alignment locator 13 to the height of the surface of the substrate 9 during the manufacture of the exposure apparatus EXP.
[0047] A wavefront measurement unit 15 is provided below the reference substrate 14. The wavefront measurement unit 15 measures the aberration of the projection optical system 8 generated on the reference substrate 14. The measurement result of the aberration of the projection optical system 8 generated by the wavefront measurement unit 15 is sent to the control unit CU.
[0048] The control unit CU is constituted by a computer (information processing apparatus) including a processor such as a CPU (Central Processing Unit, central processing unit) and a storage unit such as a memory, for example. The control unit CU controls each part of the exposure apparatus EXP in accordance with a program stored in the storage unit or the like to operate the exposure apparatus EXP. The control unit CU controls the exposure process of transferring the pattern of the original plate 6 onto the substrate 9 and various processes related to the exposure process.
[0049] Next, the adjustment of the exposure apparatus EXP (projection optical system 8) in the present embodiment will be described. Figure 2 This is a diagram for explaining the adjustment of the projection optical system 8. As Figure 2As shown, the projection optical system 8 includes: a lens 8a; and a drive mechanism 8b that drives the lens 8a in the optical axis direction (Z direction) along the optical axis of the projection optical system 8. By driving the lens 8a in the optical axis direction by the drive mechanism 8b, it is possible to correct the optical performance (such as aberration) of the projection optical system 8. Here, in the specification and the drawings, the optical axis direction along the optical axis of the projection optical system 8 is set as the Z direction (first direction), and the two directions perpendicular to the Z direction and perpendicular to each other are set as the X and Y directions (second direction). In addition, the rotation directions around the X axis, around the Y axis, and around the Z axis are set as ωx, ωy, and ωz, respectively.
[0050] As Figure 3 shown, the drive mechanism 8b of the projection optical system 8 also drives the position of the lens 8a in the lens adjustment process, the device mounting process, and the transfer and installation process. In Figure 3 the lens adjustment process is a process of adjusting the position of the lens 8a in the projection optical system 8. The device mounting process is a process of mounting the projection optical system 8 that has undergone the lens adjustment process on the exposure apparatus EXP. The transfer and installation process is a process of transferring the exposure apparatus EXP that has undergone the device mounting process to the transfer destination (shipping destination) and installing it. The device manufacturing process is a process of actually performing an exposure process in the exposure apparatus EXP that has undergone the transfer and installation process and has been installed to manufacture a device.
[0051] In each process, the stroke in which the drive mechanism 8b can drive the lens 8a can be managed within the stroke estimate (stroke budget, within the stroke range) set at the time of development. Even when the adjustment position of the lens 8a deviates within the stroke estimate during the period from the lens adjustment process to the transfer and installation process, the stroke that can be used in device manufacturing is estimated as the upper stroke and the lower stroke as the stroke for device manufacturing.
[0052] Here, it is desirable that in the exposure apparatus EXP, in the state (reference state) where the lens 8a is arranged at the lens design position (reference position) within the stroke estimate, the optical performance of the projection optical system 8 satisfies the desired specifications. The lens design position (reference position) can be set, for example, at the middle position between the upper limit and the lower limit of the stroke estimate (stroke range). In this case, by making the distance from the lens design position to the upper limit of the stroke estimate (upper stroke) the same as the distance from the lens design position to the lower limit of the stroke estimate (lower stroke), it is possible to appropriately adjust the position of the lens 8a according to changes in the external environment.
[0053] However, the external environment (second environment) of the transfer destination for the transfer setting process and the device manufacturing process may be different from the external environment (first environment) before the transfer for the lens adjustment process and the device mounting process. For example, the elevation of the location of the transfer destination for the transfer setting process and the device manufacturing process may be different from the elevation of the location before the lens adjustment process and the device mounting process. Therefore, it is necessary to newly consider the change in the optical performance of the projection optical system 8 due to the elevation difference (air pressure difference). When the lens 8a of the projection optical system 8 is driven by the drive mechanism 8b to correspond to the change in the optical performance of the projection optical system 8, as Figure 4 shown, the position of the lens 8a that can satisfy the desired specifications of the optical performance of the projection optical system 8 will deviate from the lens design position (reference position). That is, the central position of the lens 8a in the stroke prediction table moves, and the upper stroke and the lower stroke change. Since the upper limit and the lower limit of the stroke prediction are fixed with respect to the position of the lens 8a before the lens adjustment process, there are problems in the case of a change in the external environment. For example, as Figure 4 shown, the upper stroke is narrow, and the upper stroke available in the device manufacturing process is insufficient. As a result, there may be problems such as when using the device manufacturing process determined in the external environment before transfer (e.g., low elevation) at the transfer destination (e.g., high elevation), the upper stroke is insufficient. That is, there may be a problem that the device manufacturing process established in the external environment before transfer cannot be used in the external environment of the transfer destination.
[0054] Therefore, an optical component (optical assembly) for correcting the optical performance of the projection optical system 8 is installed in the projection optical system 8 of the exposure apparatus EXP of the present embodiment. This optical component is installed (externally mounted) in the projection optical system 8, for example, in a manner of being disposed in the lower part of the projection optical system 8, that is, in the optical path of the light emitted from the projection optical system 8.
[0055] As Figure 2 shown, in the exposure apparatus EXP of the present embodiment, a plurality of optical components are prepared (stored, housed), and these optical components can be replaced with respect to the projection optical system 8 even after the assembly of the exposure apparatus EXP is completed. Hereinafter, as the plurality of optical components, the first optical component UnitA and the second optical component UnitB are exemplified for explanation, but the number of optical components is not limited to two, and may be three or more.
[0056] The first optical component UnitA has a plurality of first light transmissive members. In the case of the present embodiment, the plurality of first light transmissive members may include two transparent planar glasses 22 and 23 (glass plates) having substantially the same refractive index and thickness. The planar glasses are not limited to two, and may be three or more if the number, thickness, and refractive index that can be inclined in opposite directions are equal to each other. The first optical component UnitA can be used when the difference between the external environment (first environment) at the assembly location and the external environment (second environment) at the installation location is within a threshold value that allows the specifications of the optical performance of the exposure apparatus EXP (projection optical system 8) to be satisfied. Moreover, the assembly location refers to the location where the projection optical system 8 and the exposure apparatus EXP are assembled, and is the location before the relocation of the exposure apparatus EXP. The installation location refers to the location where the exposure apparatus EXP is installed and operated, and is the destination location of the relocation of the exposure apparatus EXP. The external environment may include, for example, the elevation (air pressure) of the location.
[0057] The second optical component UnitB has a plurality of second light transmissive members. In the case of the present embodiment, the plurality of second light transmissive members may include two transparent planar glasses 24 and 25 (glass plates) having substantially the same refractive index and thickness. The planar glasses are not limited to two, and may be three or more if the number, thickness, and refractive index that can be inclined in opposite directions are equal to each other. The thicknesses of the planar glasses 24 and 25 of the second optical component UnitB in the optical axis direction are different from those of the planar glasses 22 and 23 of the first optical component UnitA, so that it is possible to correct the optical performance of the projection optical system 8 due to the environmental difference (elevation difference, air pressure difference) between the assembly location and the installation location. The second optical component UnitB can be used when the environmental difference (elevation difference, air pressure difference) between the assembly location and the installation location exceeds a threshold value that allows the specifications of the optical performance of the exposure apparatus EXP (projection optical system 8) to be satisfied. The second optical component UnitB is provided with planar glasses whose thicknesses are changed according to the environment (elevation) of the installation location.
[0058] In addition, the first optical component UnitA includes a first changing mechanism for mechanically changing the inclination of each of the plurality of first light transmissive members (two planar glasses 22 and 23). Similarly, the second optical component UnitB includes a second changing mechanism for mechanically changing the inclination of each of the plurality of second light transmissive members (two planar glasses 24 and 25). Hereinafter, a structural example of the optical component will be described. Since the first changing mechanism of the first optical component UnitA and the second changing mechanism of the second optical component UnitB may have the same structure, a structural example of the second optical component UnitB will be described here.
[0059] Figure 5This is a schematic diagram showing a first structural example of the second optical component UnitB. Figure 5 Figures (a) to (b) of Figure 5 show the postures (postures with respect to the optical axis of the projection optical system 8) of the two planar glasses 24 and 25 in the second optical component UnitB. Figure 5 Figure (a) of Figure 5 shows the state before changing the postures of the planar glasses 24 and 25. Figure 5 Figure (b) of Figure 5 shows the state after changing the postures of the planar glasses 24 and 25.
[0060] The planar glass 24 is held (fixed) by the first holding portion 20 (first holding member 26). The planar glass 25 is held (fixed) by the second holding portion 21 (second holding member 27). The holding structures of the planar glasses in the first holding portion 20 and the second holding portion 21 are the same. Therefore, a structural example of the first holding portion 20 will be described here. Figure 6 This is a schematic diagram showing a structural example of the first holding portion 20 that holds the planar glass 24. Figure 6 Figure (a) of Figure 6 is a view when observing the first holding portion 20 from above (+Z direction). Figure 6 Figure (b) of Figure 6 is a view when observing the pressing ring 28 mounted on the first holding member 26 from above (+Z direction). Figure 6 Figure (c) of Figure 6 is a view when observing the first holding member 26 with the pressing ring 28 mounted thereon from the side (+X direction).
[0061] The planar glass 24 is mounted on the protrusion 26a (protrusion surface) of the first holding member 26. The protrusions 26a are arranged, for example, at three positions on a circumference outside the exposure beam diameter at intervals of 120°. The pressing ring 28 has protrusions 28a (protrusion surfaces) at three positions facing the protrusions 26a of the first holding member 26 with the planar glass 24 interposed therebetween. In addition, an annular leaf spring 29 for applying a force to the pressing ring 28 is provided on the upper surface of the first holding member 26. The planar glass 24 is held by the first holding portion 20 by being sandwiched between the first holding member 26 (protrusion 26a) and the pressing ring 28 (protrusion 28a) due to the action of the leaf spring 29. Here, the holding of the planar glass 24 by the first holding portion 20 is not limited to using the pressing ring 28 and the leaf spring 29, and can also be performed by bonding and fixing the side surface of the planar glass 24 to the inner surface of the first holding member 26. In addition, the holding of the planar glass 25 by the second holding portion 21 can be performed in the same manner as the holding of the planar glass 24 by the first holding portion 20.
[0062] As Figure 5As shown, the first holding part 20 and the second holding part 21 are held by the third holding part 30. The third holding part 30 is configured to be able to rotate the first holding part 20 and the second holding part 21 respectively about the optical axis of the projection optical system 8. Moreover, the contact surfaces between the first holding part 20 and the third holding part 30 and between the second holding part 21 and the third holding part 30 are inclined respectively. Thereby, the first holding part 20 and the second holding part 21 can be rotated individually relative to the third holding part 30, and thus the two planar glasses 24, 25 can be inclined individually relative to the optical axis of the projection optical system 8. In addition, by rotating the first holding part 20 and the second holding part 21 relative to the third holding part 30 by only the same amount, the relative inclination between the planar glass 24 and the planar glass 25 can be changed (adjusted).
[0063] Here, as described above, the first holding part 20 holds the planar glass 24 by three protruding parts 26a arranged at 120° intervals in the first holding member 26. Similarly, the second holding part 21 holds the planar glass 25 by three protruding parts arranged at 120° intervals in the second holding member 27. Moreover, the protruding parts 26a of the first holding member 26 in the first holding part 20 and the protruding parts of the second holding member 27 in the second holding part 21 are offset by 60°. Thereby, the aberration generated by the self-weight deformation of the planar glasses 24, 25 held by the first holding part 20 and the second holding part 21 respectively can be reduced.
[0064] The third holding part 30 is mounted on the fourth holding part 31, and the fourth holding part 31 is rotatably mounted on the fifth holding part 32. The fifth holding part 32 is mounted on the lower part of the projection optical system 8. Alternatively, the fifth holding part 32 can be mounted on the lower part of the projection optical system 8 via an adjustment spacer. The contact surface between the fourth holding part 31 and the fifth holding part 32 is inclined, and the fourth holding part 31 is configured to be able to rotate about the optical axis of the projection optical system 8 and relative to the fifth holding part 32. By rotating the fourth holding part 31 relative to the fifth holding part 32, the third holding part 30 connected to the fourth holding part 31 can also be rotated. Thereby, in the integrated state where the relative inclination between the planar glass 24 and the planar glass 25 is maintained, the inclination of the integrated state of the two planar glasses 24, 25 can be changed (adjusted) relative to the optical axis of the projection optical system 8. In addition, the fifth holding part 32 is configured to be detachable from the projection optical system 8. That is, the optical component mounted on the projection optical system 8 can be replaced without removing the projection optical system 8 from the main body of the exposure apparatus EXP.
[0065] The first optical component UnitA and the second optical component UnitB can also be used Figure 7 the structure shown. Figure 7 is a schematic diagram showing a second structural example of the second optical component UnitB.Figure 7 Figures (a) to (b) show the postures (postures with respect to the optical axis of the projection optical system 8) of the two planar glasses 24 and 25 in the second optical component UnitB. Figure 7 Figure (a) shows the state before the postures of the planar glasses 24 and 25 are changed. Figure 7 Figure (b) shows the state after the postures of the planar glasses 24 and 25 are changed. Figure 7 Compared with the structure of the second optical component UnitB shown in Figure 5 the structure of the second optical component UnitB shown, the holding structures of the planar glasses 24 and 25 are the same, but the structures for changing the postures of the first holding portion 20 and the second holding portion 21 are different. Moreover, the first holding component UnitA can have the same structure as the second optical component UnitB.
[0066] The planar glass 24 is held (fixed) by the first holding portion 20 (first holding member 33). The first holding member 33 of the first holding portion 20 has the same structure as the first holding member 26 described above. The first holding portion 20 is held by the third holding portion 36 via the angle changing mechanism 35. In order to reduce the influence of the force generated when the third holding portion 36 holds the first holding portion 20 (first holding member 33) on the planar glass 24, the angle changing mechanism 35 can be arranged at three positions offset by 60° with respect to the protrusion of the first holding member 33 that holds the planar glass 24. Alternatively, an elastic hinge or a spherical washer can be provided at the fixing portion of the first holding portion 20, and the elastic hinge or the spherical washer is used to reduce the influence of deformation, etc. on the planar glass 24 when the first holding portion 20 is held by the third holding portion 36 in an inclined state.
[0067] The planar glass 25 is held (fixed) by the second holding portion 21 (second holding member 34). The second holding member 34 of the second holding portion 21 has the same structure as the second holding member 27 described above. The second holding portion 21 is held by the third holding portion 36 via the angle changing mechanism 37. In order to reduce the influence of the force generated when the third holding portion 36 holds the second holding portion 21 (second holding member 34) on the planar glass 25, the angle changing mechanism 37 can be arranged at three positions offset by 60° with respect to the protrusion of the second holding member 34 that holds the planar glass 25. Alternatively, an elastic hinge or a spherical washer can be provided at the fixing portion of the second holding portion 21, and the elastic hinge or the spherical washer is used to reduce the influence of deformation, etc. on the planar glass 25 when the second holding portion 21 is held by the third holding portion 36 in an inclined state.
[0068] The three protrusions in the first holding member 33 that hold the planar glass 24 and the three protrusions in the second holding member 34 that hold the planar glass 25 are arranged in the third holding portion 36 with a 60° stagger from each other. Thereby, the influence of the self-weight deformation of the planar glass 24 and the planar glass 25 can be reduced.
[0069] Here, the optical component of Structural Example 1 is such that both the first holding portion 20 and the second holding portion 21 are inclined with respect to the optical axis of the projection optical system 8. In contrast, in the optical component of Structural Example 2, after one of the first holding portion 20 and the second holding portion 21 is inclined with respect to the optical axis of the projection optical system 8, the other is inclined in the opposite direction to the inclination direction of the one by only the same amount. The angle change mechanisms 35 and 37 in the optical component of Structural Example 2 can be configured to change the inclination angle by adjusting the thickness difference of the shims, or to change the inclination angle by the difference in the protruding amount of the top push bolts. Alternatively, the angle change mechanisms 35 and 37 can be configured to adjust the inclination angle by being driven by a driving element such as a piezoelectric element, or to change the inclination angle by a driving mechanism composed of a combination of a driving element and an elastic hinge that changes the magnification of the applied force and changes the direction of the applied force.
[0070] Next, an example of the attitude change process of the planar glasses 24 and 25 in the optical component of Structural Example 2 will be described. The required inclination amounts for the planar glasses 24 and 25 are measured or calculated in advance. First, the angle change mechanism 35 inclines the first holding portion 20 with respect to the optical axis of the projection optical system 8. Then, the angle change mechanism 37 inclines the second holding portion 21 in the opposite direction to the first holding portion 20 by only the same amount. Finally, similar to the optical component of Structural Example 1, the fourth holding portion 31 is rotated with respect to the fifth holding portion 32 mounted on the projection optical system 8 so that the two planar glasses 24 and 25 are inclined integrally with respect to the optical axis of the projection optical system 8.
[0071] Figure 8 This is a diagram for explaining the stroke prediction when using the optical component. In the present embodiment, a plurality of optical components (first optical component UnitA, second optical component UnitB) are stored in the exposure apparatus EXP, and the optical components are replaced according to the environmental differences (elevation difference, air pressure difference) between the assembly location and the installation location. Thereby, the change in the optical performance of the projection optical system 8 caused by this environmental difference can be corrected (reduced). That is, the influence of the environmental difference between the assembly location and the installation location on the stroke of the lens 8a that can be driven by the driving mechanism 8b of the projection optical system 8 in the device manufacturing process can be reduced. Therefore, regardless of the installation location of the exposure apparatus EXP, the device manufacturing process established at the assembly location can be used jointly at the assembly location and the installation location.
[0072] When the driving mechanism 8b of the projection optical system 8 corrects the change in the optical performance of the projection optical system 8 caused by the environmental difference between the assembly location and the installation location, a decrease in the resolution of the projection optical system 8 may occur along with the redevelopment of the driving mechanism 8b and the expansion of the stroke. Therefore, it is difficult to expand the correction range of this change in optical performance in advance. However, according to the above method of replacing optical components, the change in the optical performance of the projection optical system 8 caused by the environmental difference can be corrected by the thickness of the flat glass that constitutes the optical component installed (externally) on the projection optical system 8. Therefore, compared with the case corresponding to the stroke of the lens 8a achieved by the driving mechanism 8b, the correction range can be expanded with a simple structure. Thus, the elevation limit (environmental difference correction limit) of the installation location of the exposure apparatus EXP can be made large, and the area where the exposure apparatus EXP can be installed can be expanded.
[0073] According to the above method of replacing optical components, the effect of reducing the influence on the manufacturing equipment and processes of the exposure apparatus EXP caused by environmental differences (air pressure differences) can also be achieved. When the environmental difference between the assembly location and the installation location is large, similar to exceeding the air pressure correction limit of the exposure apparatus EXP, the inspectable range of the manufacturing equipment is also exceeded. Therefore, although it is difficult to inspect the optical performance of the projection optical system 8 with the structure of the exposure apparatus EXP at the installation location, by replacing the optical components during the assembly and installation of the exposure apparatus EXP as in the above method, it is possible to easily respond.
[0074] The above method of replacing optical components can also achieve effects in the projection optical system 8 alone. Since the manufacturing period of the projection optical system 8 is long, when an abnormality occurs in the projection optical system 8 mounted on the exposure apparatus EXP, there is a risk that the exposure apparatus EXP cannot be used for a long time until the replacement projection optical system 8 is completed. The projection optical system 8 is expensive, and the environment for storing the projection optical system 8 also requires a high degree of stability. Therefore, from the perspective of cost, it is not realistic to stock replacement projection optical systems according to the elevation of each installation location. However, according to the above method, only one replacement projection optical system 8 needs to be stocked, and the optical components can be replaced according to the malfunction occurring at the installation location of the exposure apparatus EXP to respond.
[0075] In addition, assuming that exposure apparatuses EXP are respectively arranged at a plurality of different locations with a large environmental difference (elevation difference), a method of coping with a defective exposure apparatus EXP by loading and replacing the projection optical system 8 of the exposure apparatus EXP with a low usage frequency is adopted. In such a loading and replacement operation of the projection optical system 8, the transportation of the projection optical system 8 as a heavy object and the loading onto the exposure apparatus EXP are large-scale and complicated, and it may also be disadvantageous in terms of the cost required for this loading and replacement operation. According to the above method, by only replacing the optical components installed in the projection optical system 8 of the exposure apparatus EXP, it is possible to quickly recover (cope with) the defective conditions caused by the optical performance of the projection optical system 8.
[0076] <Second Embodiment>
[0077] The second embodiment of the present invention will be described. The difference between this embodiment and the first embodiment lies in the following aspects: not only the change in the optical performance of the projection optical system 8 caused by the elevation difference (air pressure difference) is accurately corrected, but also the change in the optical performance of the projection optical system 8 generated during the assembly, transportation, and loading onto the exposure apparatus EXP of the projection optical system 8 is accurately corrected. That is, in this embodiment, as the manufacturing parameters of the second optical component UnitB, in addition to the thickness of the flat glass, parameters for adjusting the attitude of the flat glass are also given. Moreover, this embodiment basically inherits the first embodiment and can follow the first embodiment except for the matters mentioned below.
[0078] If only the optical components are replaced according to the environmental difference (elevation difference, air pressure difference) between the assembly location and the installation location, sometimes the optical performance of the projection optical system 8 at the installation location does not meet the desired specifications. Specifically, even if the optical component is replaced from the first optical component UnitA to the second optical component UnitB, sometimes the optical performance of the projection optical system 8 in the reference state where the lens 8a is arranged at the lens design position within the travel estimation at the installation location does not meet the desired specifications. In this case, when the second optical component UnitB (second light transmission member) is installed on the projection optical system 8, such as being inclined relative to the projection optical system 8, it is necessary to adjust the exposure apparatus EXP. Moreover, if the adjustment amount of the exposure apparatus EXP for making the optical performance of the projection optical system 8 at the installation location meet the desired specifications is determined at the assembly location, it is possible to easily adjust the exposure apparatus EXP at the installation location.
[0079] Hereinafter, a method for determining the adjustment amount of the exposure apparatus EXP when the exposure apparatus EXP is transferred from the assembly location (first environment) to the installation location (second environment) will be described. Figure 9 It is a flowchart showing a method for determining the adjustment amount of the exposure apparatus EXP. Figure 9The flowchart of can be carried out at the assembly location. Figure 9 The flowchart of can be carried out either by the control unit CU of the exposure apparatus EXP or by an information processing apparatus (computer) provided outside the exposure apparatus EXP.
[0080] Here, in the following, an example of determining the tilt amount of the second optical component UnitB (second light transmissive member) with respect to the projection optical system 8 as an adjustment amount for the exposure apparatus EXP will be described. The tilt amount of the second optical component UnitB (second light transmissive member) with respect to the projection optical system 8 may include the amount of tilting (rotation) of the second optical component UnitB (second light transmissive member) with respect to the projection optical system 8 in at least one of the ωx direction, ωy direction, and ωz direction. For example, it may also be that the tilt amount is expressed as the tilt angle with respect to each of the X, Y, and Z axes. The adjustment (change) of the tilt degree of the second optical component UnitB with respect to the projection optical system 8 may include changing at least one of the relative tilt degree of the flat glasses 24 and 25 in the second optical component UnitB and the tilt degree of the flat glasses 24 and 25 integrally with respect to the optical axis of the projection optical system 8. As described above, by relatively rotating the first holding portion 20 and the second holding portion 21, the relative tilt degree (relative angle) of the flat glasses 24 and 25 can be changed. By rotating the fourth holding portion 31 with respect to the fifth holding portion 32 mounted on the projection optical system 8, the change in the tilt degree of the flat glasses 24 and 25 integrally with respect to the optical axis of the projection optical system 8 can be adjusted.
[0081] In step S11, for the projection optical system 8 in the reference state in which the first optical component UnitA is installed, the optical performance in the environment (first environment) at the assembly location is measured. As the measurement of the optical performance of the projection optical system 8, the measurement of the aberration of the projection optical system 8 can be cited. For example, the measurement of the aberration of the projection optical system 8 can be carried out by the wavefront measurement unit 15 provided below the reference substrate 14. In addition, as described above, the reference state means a state in which the lens 8a is arranged at the lens design position (reference position) within the stroke prediction, and the stroke prediction means the stroke range that the lens 8a can be driven by the drive mechanism 8b. The lens design position (reference position) can be, for example, the position of the lens 8a where the upper stroke and the lower stroke are the same.
[0082] In step S12, for the projection optical system 8 in the reference state with the second optical component UnitB installed, the optical performance in the environment (second environment) at the installation location is estimated (calculated). For example, this estimation can be performed based on the measurement results of step S11, the air pressure difference (elevation difference) between the environment at the assembly location and the environment at the installation location, and the difference in thickness between the planar glasses 22, 23 of the first optical component UnitA and the planar glasses 24, 25 of the second optical component UnitB. Specifically, the corresponding relationships between the air pressure (elevation) and the optical performance of the projection optical system 8 in the reference state and the thickness of the planar glasses of the optical components are obtained in advance using calculation formulas and the like. Then, based on this corresponding relationship, the change in the optical performance of the projection optical system 8 corresponding to the air pressure difference (elevation difference) between the environment at the assembly location and the environment at the installation location and the difference in thickness between the planar glasses of the first optical component UnitA and the planar glasses of the second optical component UnitB is calculated. Thus, based on the calculated change in optical performance and the measurement results of step S11, the optical performance of the projection optical system 8 in the reference state with the second optical component UnitB installed can be estimated in the environment (second environment) at the installation location.
[0083] In step S13, the tilt amount when installing the second optical component UnitB in the projection optical system 8 in the environment (second environment) at the installation location is determined so as to reduce the difference between the optical performance measured in step S11 and the optical performance estimated in step S12. As described above, the tilt amount is the amount by which the second optical component UnitB (second light transmission member) is tilted relative to the projection optical system 8 when installing the second optical component UnitB in the projection optical system 8. It can also be understood that the tilt amount is the adjustment amount for the exposure apparatus EXP when installing the second optical component UnitB in the projection optical system 8 at the installation location. Additionally, when obtaining the adjustment amount (tilt amount) for the exposure apparatus EXP determined by the determination method shown in the Figure 9 flowchart, the exposure apparatus EXP is adjusted in the environment (second environment) at the installation location based on this adjustment amount.
[0084] In this way, in the present embodiment, the adjustment amount for the exposure apparatus EXP is determined at the assembly location so that the optical performance of the projection optical system 8 with the second optical component UnitB installed at the installation location meets the desired specifications. Thus, the exposure apparatus can be adjusted at the installation location based on the adjustment amount for the exposure apparatus EXP determined at the assembly location. That is, it is possible to easily adjust the exposure apparatus EXP at the installation location.
[0085] Hereinafter, the adjustment of the exposure apparatus EXP (projection optical system 8) in the present embodiment will be described. Figure 10 This is a diagram for explaining the adjustment of the exposure apparatus EXP in the present embodiment.
[0086] First, the first optical component UnitA is installed in the projection optical system 8. Moreover, the projection optical system 8 with the first optical component UnitA installed thereon is mounted on an inspection device to evaluate the optical performance of the projection optical system 8. The inspection device records and stores the evaluation data 1 of the optical performance of the projection optical system 8 with the first optical component UnitA installed thereon. The evaluation data 1 includes data obtained by separating the optical performance of the first optical component UnitA from the optical performance of the projection optical system 8.
[0087] Then, the projection optical system 8 with the first optical component UnitA installed thereon is mounted on the exposure device EXP. Moreover, an inspection of the optical performance of the exposure device EXP is performed, and the evaluation data 2 of the optical performance of the exposure device EXP is recorded and stored. Based on the evaluation data 1 and the evaluation data 2, for the second optical component UnitB installed in the projection optical system 8, the attitude change of the optical elements (plane glasses 24, 25) during the period from assembling the projection optical system 8 to mounting it on the exposure device EXP is calculated. Moreover, the correction amount of the attitudes of the plane glasses 24, 25 when the lens 8a is arranged at the lens design position (reference position) by the drive mechanism 8b is calculated.
[0088] In the second optical component UnitB, based on the correction value calculated as described above, the attitude change of the optical elements is corrected during the manufacture of the exposure device EXP. In addition, in the second optical component UnitB, the attitudes of the plane glasses 24, 25 are adjusted using the change mechanism of the second optical component UnitB or the like so that the optical performance of the projection optical system 8 at the installation location satisfies the specifications. The second optical component UnitB is configured as an incoming component of the exposure device EXP. When the exposure device EXP is installed at the installation location, the second optical component UnitB is replaced with the first optical component UnitA.
[0089] Figure 11 This is a diagram for explaining the stroke prediction in the projection optical system 8 of the present embodiment. In the second optical component UnitB of the present embodiment, the attitudes of the plane glasses 24, 25 are adjusted to a state corrected based on the evaluation data 1 to the evaluation data 2 and the like. Therefore, when the second optical component UnitB is mounted on the exposure device EXP (i.e., when it is installed in the projection optical system 8), the position of the lens 8a inside the projection optical system 8 can be arranged at the lens design position (reference position) by the drive mechanism 8b. As a result, it is possible to return, that is, reduce, the deviation between the upper stroke and the lower stroke of the lens 8a generated from the lens adjustment process to the exposure device mounting. Moreover, the lens design position (reference position) can also be understood as the initial position before the lens position adjustment.
[0090] According to this embodiment, in addition to the effects of the first embodiment described above, there is also an effect of improving the error response ability of the exposure apparatus EXP in the case where an unknown error occurs in the device manufacturing process at the installation location (e.g., high elevation).
[0091] <Third Embodiment>
[0092] This third embodiment of the present invention will be described. In this embodiment, a modified example of the optical component mounted on the projection optical system 8 will be described. Moreover, this embodiment basically inherits the first embodiment and can follow the first embodiment except for the matters mentioned below. Alternatively, this embodiment may also apply the second embodiment.
[0093] Hereinafter, a structural example of the second optical component UnitB in this embodiment will be described, but the first optical component UnitA may also have the same structure as the second optical component UnitB. Figure 12 It is a schematic diagram showing a structural example of the first holding portion 40 of the second optical component UnitB in this embodiment. Figure 13 It is a schematic diagram when observing the first holding member 42 and its periphery in the first holding portion 40 of this embodiment from above (+Z direction). Figure 14 It is a diagram for explaining the movement of the leaf spring 44 and the adjusting stud 46 in the first holding portion 40 of this embodiment.
[0094] The planar glass 41 is fixed to the first holding member 42. Specifically, the planar glass 41 is mounted on the protrusion 42a (protrusion surface) of the first holding member 42. The protrusions 42a are arranged at three positions on the circumference outside the exposure beam diameter at an interval of 120°, for example. The annular leaf spring pressing member 43 forms protrusions at three positions facing the protrusions 42a of the first holding member 42 with the planar glass 41 interposed therebetween. The planar glass 41 is clamped by the protrusions 42a of the first holding member 42 and the leaf spring pressing member 43 and thus fixed to the first holding member 42. As the material of the first holding member 42, an elastically deformable raw material is used, and for example, nickel alloys such as carbon steel, stainless steel, and invar, copper alloys such as aluminum alloy and brass, and ceramic materials are preferably used.
[0095] The leaf spring 44 is an annular elastic body. The leaf spring 44 is fixed to the first holding member 42 at three positions on the circumference at an interval of 120° by the leaf spring pressing member 45. As the material of the leaf spring 44, spring parts such as a stainless steel plate for springs and a phosphor bronze plate for springs are preferably used.
[0096] The adjustment stud 46 is a mechanism for adjusting the attitude of the planar glass 41 as an optical element. The adjustment stud 46 is disposed in the tap of the first holding member 42 and is circumferentially disposed at the same angular phase as the protrusion 42a and on the lower side of the leaf spring 44. By rotating the adjustment stud 46, the leaf spring 44 can be displaced up and down. When the leaf spring 44 is displaced upward, an upward spring force acts on the leaf spring 44. At this time, a downward spring force is generated in the first holding member 42. The upward spring force is equal to the downward spring force, and the movement amount of the adjustment stud 46 is the sum of the displacement of the leaf spring 44 and the displacement of the first holding member 42.
[0097] Both ends of the leaf spring 44 are fixed by the leaf spring pressing members 45, so it flexes between the leaf spring pressing members 45, causing a downward reaction force to be generated. Due to this reaction force, the protrusion 42a of the first holding member 42 is displaced downward. Preferably, both sides of the protrusion 42a are of a cut-away configuration so that the protrusion 42a of the first holding member 42 can be easily displaced. Since each of the three protrusions 42a is displaced, the attitude of the planar glass 41 can be adjusted. The adjustment stud 46 receives a downward spring force from the leaf spring 44, so the adjustment stud 46 is configured not to move due to vibrations of the mounting table or the like.
[0098] The first holding member 42 is fastened by the second holding member 47. The second holding member 47 and the third holding member 49 are connected by a connecting member 48. By loosening the fixing bolt 49a with respect to the third holding member 49, the portion inside the connecting member 48 can be integrally rotated with respect to the optical axis of the projection optical system 8. The first holding portion 40 can be attached to and detached from the projection optical system 8 on the upper surface of the third holding member 49. The first holding portion 40 is configured such that the optical component can be replaced with the device stored in the warehouse without removing the projection optical system 8 from the main body of the exposure apparatus EXP.
[0099] As described in the second embodiment, the surface of the planar glass 41 can be stored in the exposure apparatus EXP in a state of being aspherically processed according to the evaluation data 1 to the evaluation data 2. In addition, in the third embodiment, as compared with the first to second embodiments, the attitude correction of the optical element (planar glass) can be performed according to the environmental differences (elevation difference, air pressure difference) between the assembly location and the installation location.
[0100] <Fourth Embodiment>
[0101] Description of the fourth embodiment of the present invention. The feature of this embodiment is to optimize the position of the optical components in the exposure device EXP for each incoming optical component. In the fourth embodiment, the following method is adopted. According to the adjustment of the first optical component UnitA and the second optical component UnitB, at least one of the shim 12SP of the surface position detection unit 12 and the shim 13SP of the alignment locator 13 can be replaced. Moreover, this embodiment basically inherits the first embodiment and can follow the first embodiment except for the matters mentioned below. Alternatively, this embodiment may also apply at least one of the second to third embodiments.
[0102] Next, the adjustment of the exposure device EXP (projection optical system 8) in this embodiment will be described. First, as described in the second embodiment, the evaluation data 1 to the evaluation data 2 are obtained. The optimization calculation of the calculation items with the following three parameters is performed on the second optical component UnitB. The first parameter is the optical performance of the preferred projection optical system 8 at the installation location. The second parameter is to correct the attitude change of the optical element (plane glass) during the period from the assembly of the projection optical system 8 to its installation on the exposure device EXP. The third parameter is the image plane position of the preferred projection optical system 8 at the installation location. According to the optimal calculation result, the attitude of the optical element (plane glass) is corrected using the change mechanism of the second optical component UnitB, and the attitudes of the plane glasses 24 and 25 are adjusted so that the optical performance of the projection optical system 8 meets the specifications at the installation location.
[0103] In addition, in this embodiment, the preferred thicknesses of the shim 12SP and the shim 13SP are calculated so that the image plane position of the projection optical system 8 at the installation location coincides with the image plane positions of the surface position detection unit 12 and the alignment locator 13. The shims 12SP and 13SP are stored (inventoried) in the exposure device EXP in association with the optical components installed in the projection optical system 8. For example, the shims 12SP and 13SP used when the first optical component UnitA is installed in the projection optical system 8 are stored (inventoried) in the exposure device EXP in association with the first optical component UnitA. In addition, the shims 12SP and 13SP used when the second optical component UnitB is installed in the projection optical system 8 are stored (inventoried) in the exposure device EXP in association with the second optical component UnitB.
[0104] Here, in this embodiment, it is also possible to add an adjustment item for the reticle plane position (object plane) to the calculation items for the optimization calculation during the manufacture of the second optical component UnitB. The adjustment of the reticle plane position can be performed by replacing Figure 1 the shim 7SP described.
[0105] <Fifth Embodiment>
[0106] This describes the fifth embodiment of the present invention. In this embodiment, a modified example of the optical component mounted on the projection optical system 8 is described. Moreover, this embodiment substantially inherits the first embodiment and can follow the first embodiment except for the matters mentioned below. Alternatively, this embodiment may also apply at least one of the second to fourth embodiments.
[0107] Hereinafter, a structural example of the second optical component UnitB in this embodiment is described, but the first optical component UnitA may also have the same structure as the second optical component UnitB. Figure 15 FIG. is a schematic diagram showing a structural example of the first holding portion 50 of the second optical component UnitB in this embodiment. Figure 16 FIG. is a schematic diagram showing a structural example of the changing mechanism in the first holding portion 50 of this embodiment. Figure 17 FIG. is a schematic cross-sectional view of the first holding portion 50 of this embodiment. Figure 18 FIG. is a diagram for explaining the movement of the changing mechanism in the first holding portion 50 of this embodiment.
[0108] The planar glass 51 is fixed to the first holding member 52. The holding structure of the planar glass 51 by the first holding member 52 is the same as that described in the first embodiment or the third embodiment, and thus the description thereof is omitted here. The first holding member 52 is substantially made of a material having a linear expansion rate equal to that of the planar glass 51. For example, when the planar glass 51 is quartz, a super-invar alloy material can be used as the material of the first holding member 52. With such a structure, when the ambient temperature changes, the generation of the following external force can be reduced, which is caused by the relative thermal movement between the first holding member 52 and the planar glass 51 due to the difference in linear thermal expansion.
[0109] The elastic members 53 are arranged at three places on the outer peripheral portion of the first holding member 52 at 120° intervals to apply an elastic force to the first holding member 52. For example, as Figure 16 shown, the elastic member 53 is composed of a first leaf spring 54 and a second leaf spring 55. The first leaf spring 54 can be bent in the radial direction of the planar glass 51 (elastic coefficient k1) and is connected to the first holding member 52 and the second leaf spring 55. The first leaf spring 54 generates a first elastic force F1 from the second elastic force F2 applied by the second leaf spring 55 and applies the first elastic force F1 to the first holding member 52. Moreover, as Figure 16 shown, the first leaf spring 54 and the second leaf spring 55 may also be of an integral structure.
[0110] The second leaf spring 55 can be bent in the radial direction of the flat glass 51 (elastic coefficient k2), and is connected to the first leaf spring 54 and a later-described urging portion 56. The second leaf spring 55 generates a second elastic force F2 from the pressing force F applied by the urging portion 56, and applies the second elastic force F2 to the first leaf spring 54.
[0111] From the viewpoint of the position reproducibility when contacting the urging portion 56, the elastic member 53 has a spherical portion 57. As Figures 16 to 17 shown, the spherical portion 57 is disposed at the central portion of the elastic member 53 in the radial direction (horizontal direction), and is disposed at a position deviated from the central portion of the elastic member 53 in the optical axis direction (vertical direction) of the projection optical system 8.
[0112] The urging portion 56 is connected to the elastic member 53 and applies a pressing force to the elastic member 53. One of the preferred embodiments of the urging portion 56 has a micrometer. The urging portion 56 constituted by a micrometer is supported by a second holding member 58, and can adjust the press-fitting amount with a resolution of 10 μm or less, for example. Further, the urging portion 56 may have a push stud structure.
[0113] Then, with reference to Figure 18 , the operation of the adjustment mechanism in the first holding portion 50 of the present embodiment will be described. The pressing force F is applied to the second leaf spring 55 by the urging portion 56 supported by the second holding member 58. The second leaf spring 55 to which the pressing force F is applied deforms in the radial direction of the flat glass 51. On the other hand, in the optical axis direction of the projection optical system 8, since the application point (spherical portion 57) of the urging portion 56 is deviated from the center, the pressing force F is also applied deviating from the center, and the second leaf spring 55 moves in a manner of rotating around the tangent axis.
[0114] Accordingly, the second elastic force F2 generated from the second leaf spring 55 is also applied to the first leaf spring 54 deviating from the center. The first leaf spring 54 to which the second elastic force F2 is applied deforms in the radial direction of the flat glass 51, but like the second leaf spring 55, the second elastic force F2 is applied deviating from the center, and thus is twisted in a manner of rotating around the tangent axis. Accordingly, the first elastic force F1 generated from the first leaf spring 54 is applied to the first holding member 52 from an inclined direction, and the flat glass 51 fixed to the first holding member 52 is inclined. By synthesizing the press-fitting amounts of the urging portions 56 arranged at three locations at intervals of 120°, the flat glass 51 can be adjusted to have a desired inclination angle in an arbitrary direction.
[0115] In this way, the optical component of the present embodiment can adjust the attitude of the planar glass 51 with high precision from the outside of the projection optical system 8. Therefore, after the second optical component UnitB is installed in the projection optical system 8, the wavefront measurement unit 15 measures the aberration of the projection optical system 8. The control unit CU determines whether the aberration measurement data sent from the wavefront measurement unit 15 is within the allowable range. When the aberration is outside the allowable range, the tilt angle of the second optical unit UnitB is calculated so that the aberration is within the allowable range. Thus, based on the calculation result, the press-in amount of the biasing unit 56 can be adjusted to adjust the optical performance of the projection optical system 8 within the allowable range. Alternatively, without using the wavefront measurement unit 15, the substrate is exposed, and the aberration is measured based on the exposure result.
[0116] <Sixth Embodiment>
[0117] The sixth embodiment of the present invention is described. This embodiment is basically inherited from the fifth embodiment and can follow the fifth embodiment except for the matters mentioned below.
[0118] Figure 19 It is a schematic diagram showing a structural example of the first holding unit 50 of the second optical component UnitB in the present embodiment. Compared with the fifth embodiment, the first holding unit 50 in the present embodiment is provided with an actuator 59a in the biasing unit 56 and a detection unit 59b for detecting the press-in amount of the biasing unit 56. Preferred examples of the actuator 59a include a pulse motor and a piezoelectric element. Preferred examples of the detection unit 59b include a rotary encoder for detecting the rotation angle of the pulse motor and a linear encoder for detecting the axial position of the biasing unit 56.
[0119] In addition, in the second optical component UnitB of the present embodiment, a component control unit CUa for controlling the attitude of the planar glass 51 is provided. The component control unit CUa has a parameter file for controlling the attitude of the planar glass for each optical component. Alternatively, the component control unit CUa may be included in the control unit CU of the exposure apparatus EXP.
[0120] According to the present embodiment, when manufacturing the second optical component UnitB, a parameter file related to correcting the attitude of the optical element (flat glass) and controlling the attitude of the optical element to satisfy the specifications of the optical performance of the projection optical system 8 at the installation location is created. This parameter file is stored in the control unit CU of the exposure apparatus EXP. When replacing the second optical component UnitB stored in the exposure apparatus EXP, the parameter file used by the component control unit CUa is replaced with the parameter file for the second optical component UnitB to control the attitude of the optical element (flat glass) of the second optical component UnitB. Then, the wavefront measurement unit 15 measures the aberration of the projection optical system 8. The control unit CU determines whether the result of the aberration measurement is within the allowable range. If the aberration is outside the allowable range, the tilt angle of the second optical component UnitB is calculated so that the aberration is within the allowable range. The component control unit CUa controls the adjustment mechanism of the second optical component UnitB so that it becomes the tilt angle calculated by the control unit CU, thereby adjusting the tilt of the second optical component UnitB (i.e., the tilt of the flat glass).
[0121] Next, a modified example of the second optical component UnitB in the present embodiment will be described. Figure 20 It is a schematic diagram showing a modified example of the first holding part 60 of the second optical component UnitB in the present embodiment. Figure 20 (a) is a top surface view when observing the first holding part 60 from above (+Z direction). The first holding part 60 may include: a flat glass 61; a first holding member 62; a plurality of (four) holding parts 63a to 63d, which are fixed to the first holding member 62 to hold the outer peripheral part of the flat glass 61; and a biasing part 64 that biases the first holding member 62. Figure 20 (b) shows a structural example of the holding part 63a, Figure 20 (c) shows structural examples of each of the holding parts 63c to 63d, Figure 20 (d) shows a structural example of the holding part 63b.
[0122] The first holding member 62 is composed of a first support member 62a and a second support member 62b located at a position below the first support member 62a. The first support member 62a and the second support member 62b are fixed via four holding parts 63a to 63d that are evenly arranged with respect to the center position of the ring.
[0123] As Figure 20As shown in FIG. (b), in the holding part 63a, the end of the first clamping part 65 contacts the inner side surface of the first support member 62a, and the first clamping part 65 is fixed to the first support member 62a. The first clamping part 65 that contacts the upper surface of the edge part 61a (cut surface) formed at the outer peripheral part of the planar glass 61 and the second clamping part 66 that contacts the lower surface of the edge part 61a clamp the edge part 61a with a load not exceeding the fracture tolerance of the planar glass 61. An elastic member 67 that generates a clamping force is disposed between the first clamping part 65 and the second clamping part 66. A hinge member 68 is disposed between the first support member 62a and the second support member 62b in the holding part 63a. The hinge member 68 can be configured to enable the first support member 62a and the second support member 62b to rotate slightly.
[0124] As Figure 20 As shown in FIG. (c), in each of the holding parts 63c to 63d, the end of the second clamping part 66 contacts the inner side surface of the second support member 62b, and the second clamping part 66 is fixed to the second support member 62b. The other parts of the holding structure of the planar glass 61 in each of the holding parts 63c to 63d are the same as those in the holding part 63a, but the hinge member 68 is not formed in each of the holding parts 63c to 63d.
[0125] As Figure 20 As shown in FIG. (d), in the holding part 63b, the end of the first clamping part 65 contacts the inner side surface of the first support member 62a, and the first clamping part 65 is fixed to the first support member 62a. A boosting part 64 is disposed between the first support member 62a and the second support member 62b. The boosting part 64 may include: a hinge mechanism 69 that serves as a changing mechanism for changing the displacement direction in order to relatively displace the first support member 62a and the second support member 62b; and an actuator 70 that applies a force to the hinge mechanism 69. The displacement output of the actuator 70 is converted by the hinge mechanism 69 into a displacement in the optical axis direction of the projection optical system 8.
[0126] In addition, a gap sensor (not shown) may be disposed between the first support member 62a and the second support member 62b. The gap sensor successively measures the relative displacement amount between the first support member 62a and the second support member 62b. Thereby, the control unit CU (or the component control unit CUa) can control the actuator 70 based on the measurement result of the gap sensor.
[0127] When a force is applied to the hinge mechanism 69 from the actuator 70, the first support member 62a and the second support member 62b are displaced in the vertical direction in the optical axis direction of the projection optical system 8 relative to each other. Then, the hinge member 68 rotates the first support member 62a and the second support member 62b slightly about the vicinity of the center of the hinge member 68. The holding portions 63a to 63b are fixed to the first support member 62a side, and the holding portions 63c to 63d are fixed to the second support member 62b side. Since only the first support member 62a is fixed to the projection optical system 8 which is a high-rigidity structure, the peripheral portions of the flat glass 61 held by the holding portions 63c to 63d all receive a load below in the optical axis direction of the projection optical system 8. This load is transmitted inside the flat glass 61, and the peripheral portions of the flat glass 61 held by the holding portions 63a to 63b all receive a load above in the optical axis direction of the projection optical system 8. Thus, according to the displacement output of the actuator 70, a shape change convex from the holding portion 63a toward the holding portion 63b and concave from the holding portion 63c toward the holding portion 63d may occur in the flat glass 61.
[0128] When the first optical component UnitA or the second optical component UnitB is mounted on the projection optical system 8, correlation data between the output value of the gap sensor during driving of the actuator 70 and the amount of shape change of the flat glass 61 obtained by the wavefront measurement unit 15 is acquired. This correlation data is stored in the parameter file of each optical component of the exposure apparatus EXP. Moreover, the difference in the amount of deformation due to the difference in the thickness of the flat glass between the first optical component UnitA and the second optical component UnitB can be corresponded by the parameter file configured for each optical component. Thus, the control unit CU of the exposure apparatus EXP can quickly converge the amount of aberration of the entire projection optical system 8 to a desired amount based on the parameter file.
[0129] <Seventh Embodiment>
[0130] The seventh embodiment of the present invention will be described. This embodiment basically inherits the sixth embodiment and can follow the sixth embodiment except for the matters mentioned below. The feature of this embodiment is that each optical component has a parameter file of the entire projection optical system 8.
[0131] In this embodiment, each optical component has a parameter file for the position and orientation of a lens 8a that can be moved by one or more drive mechanisms 8b provided in the projection optical system 8. As types of the drive mechanism 8b, there are a drive mechanism that performs translational driving of the lens in the optical axis direction (Z direction) of the projection optical system 8; and a drive mechanism that performs rotational driving of the lens about ωx and ωy. In addition, as types of the drive mechanism 8b, there are a drive mechanism that performs translational driving of the lens in a direction (XY direction) perpendicular to the optical axis direction of the projection optical system 8; and a drive mechanism that performs rotational driving of the lens about ωz. Moreover, the combination of the orientations in which the lens is driven by the drive mechanism is not limited to the above, and multiple orientation axes can be combined. For example, it is also possible to configure a drive mechanism that uses a parallel link mechanism in one drive mechanism and can drive up to six-axis orientations.
[0132] <Eighth Embodiment>
[0133] The eighth embodiment of the present invention will be described. This embodiment basically inherits the first embodiment and can follow the first embodiment except for the matters mentioned below. Alternatively, this embodiment may also apply at least one of the second to seventh embodiments.
[0134] This embodiment is characterized in that the exposure apparatus EXP and the equipment of the device manufacturing factory are used to perform the adjustment of the second optical component UnitB and the adjustment of the exposure apparatus EXP. For example, the following describes the process when the exposure apparatus EXP is transferred from the first environment (e.g., a location with a low elevation) to the second environment (e.g., a location with a high elevation).
[0135] First, in the exposure apparatus EXP before transfer, the exposure apparatus EXP is brought into a state where it can calculate the optical characteristics of the projection optical system 8 after transfer. For example, one or more lenses 8a in the projection optical system 8 are driven by the drive mechanism 8b so as to be moved to a position where the optical characteristics after transfer can be estimated. The position where the optical characteristics after transfer can be estimated may be the lens design position (reference position). Moreover, as long as the optical characteristics of the projection optical system 8 after transfer can be calculated, the products manufactured using the exposure apparatus EXP may not meet the specifications.
[0136] Next, calculate the optical performance of the relocated projection optical system 8, and estimate (calculate) the adjustment amount of the second optical component Unit B installed in the projection optical system 8 and the displacement amount of the image plane position so that the optical performance of the projection optical system 8 meets the established specifications. This estimation is performed using the wavefront measurement unit 15 of the exposure apparatus EXP and an application program for predicting the exposure result built in the exposure apparatus EXP. Alternatively, this estimation may be performed using a device (a device for measuring the optical performance of the projection optical system 8) provided outside the exposure apparatus EXP. Further, based on the estimation result, determine the thickness of the adjustment shim 12SP for adjusting the focal position (image plane position) of the surface position detection unit 12 and the thickness of the adjustment shim 13SP for adjusting the focal position (image plane position) of the alignment locator 13. Thus, it is possible to prepare the adjustment shims 12SP and 13SP having the determined thicknesses before relocating the exposure apparatus EXP.
[0137] When relocating the exposure apparatus EXP, replace the optical component installed in the projection optical system 8 from the first optical component Unit A with the second optical component Unit B. Further, the prepared adjustment shim 12SP is disposed between the surface position detection unit 12 and its support member, and the prepared adjustment shim 13SP is disposed between the alignment locator 13 and its support member.
[0138] In the relocated exposure apparatus EXP, measure the optical performance of the projection optical system 8 in the same manner as before relocation. Based on the measurement result, finely adjust the adjustment mechanism attached to the second optical component Unit B manually or automatically by the control unit CU of the exposure apparatus EXP. Further, in the relocated exposure apparatus EXP, it is possible to use a TTL (Through The Lens) type focus measurement system provided in the apparatus to measure the deviation amount of the focal position between the object plane (reticle plane) and the image plane (wafer plane). If the measured deviation amount of the focal position is less than a predetermined threshold value, tilt the parallel plane glass inside the optical system of the surface position detection unit 12 to correct the image plane position of the surface position detection unit 12. Further, if the measured deviation amount of the focal position is less than a predetermined threshold value, shift the lens position of the focus drive mechanism in the optical system of the alignment locator 13 to correct the image plane position. Moreover, the structure of the parallel plane glass and the structure of the focus drive mechanism can be appropriately selected. On the other hand, if the measured deviation amount of the focal position is equal to or greater than the predetermined threshold value, apply the prepared adjustment shims 12SP and 13SP.
[0139] <Embodiment of the method for manufacturing an article>
[0140] The method for manufacturing an article according to an embodiment of the present invention is suitable for manufacturing micro-devices such as semiconductor devices, articles such as elements having a fine structure, and the like. The method for manufacturing an article according to the present embodiment includes: an exposure step (a step of forming a pattern on a substrate), in which the substrate is exposed using an exposure apparatus adjusted by the above adjustment method; a processing step of processing the substrate exposed in the exposure step; and a manufacturing step of manufacturing an article from the substrate processed by the processing step. Alternatively, the processing step may include a step of developing the substrate exposed in the exposure step. Further, the method for manufacturing an article includes other well-known steps (oxidation, film formation, evaporation, doping, planarization, etching, resist stripping, cutting, bonding, packaging, etc.). Compared with the conventional method, the method for manufacturing an article according to the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article.
[0141] <Other Embodiments>
[0142] The present invention can also be achieved by a process in which a program that implements one or more functions of the above-described embodiment is supplied to a system or apparatus via a network or a storage medium, and one or more processors in a computer of the system or apparatus read and execute the program. Alternatively, it can also be implemented by a circuit (e.g., ASIC) that implements one or more functions.
[0143] <cn>
[0144] Other embodiments
[0145] Embodiments of the present invention can also be implemented by the following method, that is, software (program) that executes the functions of the above embodiments is provided to the system or device through a network or various storage media, and the computer or central processing unit (CPU) or microprocessing unit (MPU) of the system or device reads and executes the program.
[0146] The present invention is not limited to the above embodiments, and various changes and modifications can be made without departing from the spirit and scope of the present invention. Therefore, in order to disclose the scope of the invention, claims are added.< / cn>
Claims
1. A method for determining an adjustment amount of an exposure device having a projection optical system when the exposure device is moved from a first environment to a second environment, the method comprising: A measuring step of measuring the optical performance of the projection optical system in the first environment in a reference state in which a first optical component having a first light-transmitting member is installed; An estimation step of estimating optical performance in the second environment of the projection optical system in the reference state in which a second optical component having a second light-transmitting member having a thickness different from that of the first light-transmitting member is mounted; as well as a determining step of determining an inclination amount of the second light transmitting member when the second optical component is installed in the projection optical system in the second environment so that a difference between the optical performance measured in the measuring step and the optical performance estimated in the estimating step is reduced, The projection optical system includes a lens and a driving mechanism for driving the lens. The reference state is a state in which the lens is arranged at a reference position within a stroke range in which the lens can be driven by the drive mechanism.
2. The determination method according to claim 1, characterized in that: In the estimation process, based on the measurement results of the measurement process, the air pressure difference between the first environment and the second environment, and the difference in thickness between the first light-transmitting component and the second light-transmitting component, the optical performance of the projection optical system in the reference state in which the second optical component is installed in the second environment is estimated.
3. The determination method according to claim 1, characterized in that: The tilt amount includes an amount of tilting the second light transmitting member relative to the projection optical system in a rotation direction around an axis in at least one of a first direction along an optical axis of the projection optical system and a second direction perpendicular to the first direction.
4. The determination method according to claim 1, characterized in that: The air pressure of the second environment is different from the air pressure of the first environment.
5. The determination method according to claim 1, characterized in that: The elevation of the second environment is different from the elevation of the first environment.
6. The determination method according to claim 1, characterized in that: The first optical component includes: a plurality of the first light-transmitting members; and a first changing mechanism for changing the inclination of each of the plurality of the first light-transmitting members. The second optical component includes: a plurality of the second light-transmitting members; and a second changing mechanism for changing the inclination of each of the plurality of the second light-transmitting members.
7. The determination method according to claim 1, characterized in that: The first light-transmitting member and the second light-transmitting member are glass plates respectively.
8. An adjustment method, characterized in that: An exposure device moved from a first environment to a second environment is adjusted, and the adjustment method includes: an acquisition step of acquiring an adjustment amount for the exposure device determined by the determination method according to any one of claims 1 to 7; and An adjustment step of adjusting the exposure device in the second environment based on the adjustment amount acquired in the acquisition step.
9. A method for manufacturing an article, characterized in that: include: an exposure step of exposing the substrate using an exposure device adjusted by the adjustment method according to claim 8; a processing step of processing the substrate exposed in the exposure step; as well as A manufacturing step is to manufacture an article using the substrate processed in the processing step.
Citation Information
Patent Citations
Optical magnifying power correcting device
JP1987035620A