Electronic device

Abstract

An electronic device is provided. An electronic device may include a display layer and a sensor layer. The sensor layer may include a plurality of row sensing electrodes extending in a first direction, a plurality of column sensing electrodes extending in a second direction, a plurality of first traces electrically connected to the row sensing electrodes, and a plurality of second traces electrically connected to the column sensing electrodes. The first traces may be arranged in the sensing area and overlap the row sensing electrodes and the column sensing electrodes. Each of the column sensing electrodes may include an opening extending in the second direction and overlapping one of the first traces.

Description

Technical Field

[0001] Embodiments of the present disclosure described herein relate to an electronic device having improved visibility. Background Art

[0002] Multimedia electronic devices such as televisions, mobile phones, tablet computers, navigation systems, gaming consoles, and vehicle displays can display images, and in addition to typical input devices such as buttons, keyboards, and mice, can also provide a touch-based input scheme that allows a user to input information or commands intuitively, conveniently, and easily. Summary of the Invention

[0003] Embodiments of the present disclosure provide an electronic device having improved visibility and improved sensing performance of an input sensor.

[0004] According to an embodiment, an electronic device may include a display layer in which a display area and a non-display area adjacent to the display area are defined, and a sensor layer in which a sensing area corresponding to the display area and a non-sensing area adjacent to the sensing area are defined.

[0005] The sensor layer may include a plurality of row sensing electrodes arranged in the sensing area and including a plurality of sub-sensing electrodes arranged in a first direction, a plurality of first traces electrically connected to the plurality of row sensing electrodes and overlapping the sensing area, a plurality of column sensing electrodes arranged in the sensing area and extending in a second direction intersecting the first direction, a plurality of second traces electrically connected to the plurality of column sensing electrodes, and a bridging electrode electrically connecting a first sub-sensing electrode and a second sub-sensing electrode among the plurality of sub-sensing electrodes that are spaced apart from each other in the first direction.

[0006] Each of the plurality of column sensing electrodes may include an opening extending in the second direction and overlapping one of the plurality of first traces.

[0007] According to an embodiment, a boundary opening may be defined between two column sensing electrodes spaced apart from each other among the plurality of column sensing electrodes.

[0008] According to an embodiment, the first sub-sensing electrode may overlap the opening, and the second sub-sensing electrode may overlap the boundary opening.

[0009] According to an embodiment, each of the plurality of column sensing electrodes may include a first sensing portion disposed between the first sub-sensing electrode and the second sub-sensing electrode in the first direction and a second sensing portion extending from the first sensing portion in the second direction and having a width greater than the width of the first sensing portion, and the first sensing portion and the second sensing portion may be integral with each other.

[0010] According to an embodiment, the bridging electrode may overlap the first sensing portion.

[0011] According to an embodiment, each of the plurality of row sensing electrodes may include a first sub-row sensing electrode and a second sub-row sensing electrode spaced apart from the first sub-row sensing electrode in a second direction, and the first sub-row sensing electrode and the second sub-row sensing electrode may be electrically connected to each other.

[0012] According to an embodiment, each of the plurality of first traces may be electrically connected to the first sub-row sensing electrode through a first sub-contact hole and may be electrically connected to the second sub-row sensing electrode through a second sub-contact hole.

[0013] According to an embodiment, each of the plurality of row sensing electrodes may further include a connection electrode disposed in a non-sensing region and electrically connecting the first sub-row sensing electrode and the second sub-row sensing electrode to each other.

[0014] According to an embodiment, the sensor layer may further include a plurality of dummy traces electrically connected to the plurality of row sensing electrodes and overlapping the sensing region.

[0015] According to an embodiment, one of the plurality of dummy traces may overlap a boundary opening.

[0016] According to an embodiment, the sensing region may include a first sub-sensing region and a second sub-sensing region spaced apart from each other in a first direction, and the plurality of row sensing electrodes may include first side row sensing electrodes arranged in the first sub-sensing region and second side row sensing electrodes arranged in the second sub-sensing region.

[0017] According to an embodiment, the first side row sensing electrodes may be spaced apart and electrically isolated from the second side row sensing electrodes in the first direction, and the plurality of first traces may include first side traces overlapping the first sub-sensing region and electrically connected to the first side row sensing electrodes and second side traces overlapping the second sub-sensing region and electrically connected to the second side row sensing electrodes.

[0018] According to an embodiment, the sensing region may include: a first sub-sensing region and a second sub-sensing region spaced apart from each other in a first direction, and a third sub-sensing region and a fourth sub-sensing region spaced apart from each other in the first direction and spaced apart from the first sub-sensing region and the second sub-sensing region in a second direction, and the plurality of row sensing electrodes may include first side row sensing electrodes arranged in the first sub-sensing region, second side row sensing electrodes arranged in the second sub-sensing region, third side row sensing electrodes arranged in the third sub-sensing region, and fourth side row sensing electrodes arranged in the fourth sub-sensing region.

[0019] According to an embodiment, the first lateral sensing electrode may be spaced apart and electrically isolated from the second lateral sensing electrode in a first direction, the third lateral sensing electrode may be spaced apart and electrically isolated from the fourth lateral sensing electrode in the first direction, and the plurality of first traces may include a 1-1 trace overlapping with a first sub-sensing region and electrically connected to the first lateral sensing electrode, a 1-2 trace overlapping with a second sub-sensing region and electrically connected to the second lateral sensing electrode, a 1-3 trace overlapping with a third sub-sensing region and electrically connected to the third lateral sensing electrode, and a 1-4 trace overlapping with a fourth sub-sensing region and electrically connected to the fourth lateral sensing electrode.

[0020] According to an embodiment, the plurality of column sensing electrodes may include a first side column sensing electrode arranged in a first sub-sensing region, a second side column sensing electrode arranged in a second sub-sensing region, a third side column sensing electrode arranged in a third sub-sensing domain and spaced apart from the first side column sensing electrode in a second direction, and a fourth side column sensing electrode arranged in a fourth sub-sensing region and spaced apart from the second side column sensing electrode in the second direction.

[0021] According to an embodiment, the plurality of second traces may include a 2-1 side trace electrically connected to the first side column sensing electrode, a 2-2 side trace electrically connected to the second side column sensing electrode, a 2-3 side trace overlapping with the first sub-sensing region and electrically connected to the third side column sensing electrode, and a 2-4 side trace overlapping with the second sub-sensing region and electrically connected to the fourth side column sensing electrode.

[0022] According to an embodiment, each of the 2-3 side trace and the 2-4 side trace may include a first line portion and a second line portion. The first line portion and the plurality of first traces may be provided in the same layer, and the second line portion and the plurality of column sensing electrodes may be provided in the same layer.

[0023] According to an embodiment, each of the plurality of row sensing electrodes and each of the plurality of column sensing electrodes may include grid lines, and in the sensing region, each of the plurality of first traces may have a width smaller than the width of the grid lines.

[0024] According to an embodiment, each of the plurality of first traces may have a multi-layer structure.

[0025] According to an embodiment, the electronic device may include a display layer, a sensor layer, and a sensor driving unit. A display region and a non-display region adjacent to the display region are defined in the display layer. A sensing region corresponding to the display region and a non-sensing region adjacent to the sensing region are defined in the sensor layer. The sensor driving unit is electrically connected to the sensor layer and includes a differential amplifier.

[0026] The sensor layer may include a first segment of sensing electrodes arranged in a sensing region, a second segment of sensing electrodes arranged in the sensing region and alternately arranged with the first segment of sensing electrodes in a first direction, a plurality of first traces overlapping the sensing region and electrically connecting the first segment of sensing electrodes to a first terminal of a differential amplifier, a plurality of second traces overlapping the sensing region and electrically connecting the second segment of sensing electrodes to a second terminal of the differential amplifier, a plurality of column sensing electrodes arranged in the sensing region and extending in a second direction intersecting the first direction, and a plurality of second traces electrically connected to the plurality of column sensing electrodes.

[0027] A first column sensing electrode among the plurality of column sensing electrodes may include a first opening extending in the second direction and overlapping one of the plurality of first traces, and a second column sensing electrode among the plurality of column sensing electrodes may include a second opening extending in the second direction and overlapping one of the plurality of second traces.

[0028] According to an embodiment, the sensor layer may further include a first connection wiring and a second connection wiring. The first connection wiring electrically connects the 1-1 segment sensing electrode arranged in the first row among the first segment sensing electrodes, and the second connection wiring electrically connects the 2-1 segment sensing electrode arranged in the first row among the second segment sensing electrodes. And in a plan view, the first connection wiring and the second connection wiring may extend in the first direction and may intersect the plurality of column sensing electrodes.

[0029] According to an embodiment, each of the plurality of first traces and the plurality of second traces may include an intersecting portion intersecting the first connection wiring and the second connection wiring and a non-intersecting portion not intersecting the first connection wiring and the second connection wiring, and the intersecting portion and the non-intersecting portion may be arranged in different layers.

[0030] According to an embodiment, the non-intersecting portion, the first connection wiring, and the second connection wiring may be arranged on a first sensor insulating layer, and the intersecting portion, the first segment sensing electrodes, and the second segment sensing electrodes may be arranged on a second sensor insulating layer.

[0031] According to an embodiment, each of the first segment sensing electrodes may include a plurality of first sub-segment electrodes and a first sub-bridging electrode electrically connecting the plurality of first sub-segment electrodes, and each of the second segment sensing electrodes may include a plurality of second sub-segment electrodes and a second sub-bridging electrode electrically connecting the plurality of second sub-segment electrodes.

[0032] According to an embodiment, the first sub-bridging electrode and the second sub-bridging electrode may be arranged in a layer different from the layer of the first sub-segment electrodes and the second sub-segment electrodes, and the first sub-bridging electrode, the second sub-bridging electrode, the first connection wiring, and the second connection wiring may be arranged in the same layer.

[0033] According to an embodiment, the sensor driving unit may be configured to provide a first transmission signal to a first column sensing electrode among a plurality of column sensing electrodes, and provide a second transmission signal to a second column sensing electrode adjacent to the first column sensing electrode among the plurality of column sensing electrodes, and the first transmission signal and the second transmission signal may have opposite phases to each other. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The above and other objects and features of the present disclosure will become apparent by describing embodiments of the present disclosure in detail with reference to the accompanying drawings.

[0035] Figure 1 is a perspective view of an electronic device according to an embodiment of the present disclosure.

[0036] Figure 2A and Figure 2B is a schematic cross-sectional view of an electronic device according to an embodiment of the present disclosure.

[0037] Figure 2C and Figure 2D is a schematic cross-sectional view of a display module according to an embodiment of the present disclosure.

[0038] Figure 3 is a view for describing the operation of an electronic device according to an embodiment of the present disclosure.

[0039] Figure 4 is a schematic cross-sectional view of a display module according to an embodiment of the present disclosure.

[0040] Figure 5 is a plan view of an input sensor according to an embodiment of the present disclosure.

[0041] Figure 6 is a view showing Figure 5 an enlarged plan view of a portion BB of the input sensor shown in

[0042] Figure 7 is a schematic cross-sectional view taken along the cutting line I-I' shown in Figure 6

[0043] Figure 8 is a plan view of an input sensor further including dummy traces according to an embodiment of the present disclosure.

[0044] Figure 9 is a plan view of an input sensor including a first sub-sensing region and a second sub-sensing region according to an embodiment of the present disclosure.

[0045] Figure 10 is a plan view of an input sensor including first to fourth sub-sensing regions according to an embodiment of the present disclosure.

[0046] ​Figure 11A is an enlarged plan view of part CC of the input sensor shown in Figure 10 .

[0047] Figure 11B is a schematic sectional view along the cutting line II-II' shown in Figure 11A .

[0048] Figure 12 is a plan view showing row sensing electrodes driven by a differential driving method according to an embodiment of the present disclosure.

[0049] Figure 13A is an enlarged plan view of part EE of the input sensor shown in Figure 12 .

[0050] Figure 13B is a schematic sectional view along the cutting line III-III' shown in Figure 13A .

[0051] Figure 14 is a plan view showing column sensing electrodes driven by a differential driving method according to an embodiment of the present disclosure.

[0052] Figure 15 is an enlarged plan view of part FF of the input sensor shown in Figure 6 .

[0053] Figure 16 is a schematic sectional view along the cutting line IV-IV' shown in Figure 15 . DETAILED DESCRIPTION

[0054] In the following description, for the purpose of explanation, numerous specific details are set forth in order to provide a thorough understanding of various embodiments or implementations of the present disclosure. As used herein, "embodiment" and "implementation" are interchangeable words and are non-limiting examples of the devices or methods disclosed herein. However, it is obvious that various embodiments can be practiced without these specific details or in one or more equivalent arrangements. Here, the various embodiments are not necessarily exclusive and do not limit the present disclosure. For example, the specific shapes, configurations, and characteristics of an embodiment can be used or implemented in another embodiment.

[0055] Unless otherwise specified, the embodiments shown are understood to provide features of the present disclosure. Therefore, unless otherwise specified, without departing from the inventive concept, the features, components, modules, layers, films, panels, regions, and / or aspects, etc. (hereinafter, collectively or individually referred to as "elements") of the various embodiments can be combined, separated, interchanged, and / or rearranged in other ways.

[0056] The use of cross-hatching and / or shading in the drawings is generally provided to clarify the boundaries between adjacent elements. Thus, unless stated otherwise, the presence or absence of cross-hatching or shading does not convey or indicate any preference or requirement for a particular material, material property, dimension, scale, commonality between the elements shown, and / or any other characteristic, attribute, property, etc. of the elements. Further, in the drawings, for clarity and / or descriptive purposes, the sizes and relative sizes of elements may be exaggerated. When embodiments may be implemented differently, the specific process orders may be performed in a different order than described. For example, two consecutively described processes may be performed substantially simultaneously or in an order opposite to the described order. Additionally, like reference numerals and / or reference characters denote like elements.

[0057] When an element or layer is referred to as being "on", "connected to", or "coupled to" another element or layer, it can be directly on, directly connected to, or directly coupled to the other element or layer, or intervening elements or intervening layers may be present. However, when an element or layer is referred to as being "directly on", "directly connected to", or "directly coupled to" another element or layer, there are no intervening elements or intervening layers. For this reason, the term "connected" can refer to physical, electrical, and / or fluid connection with or without intervening elements. Further, the first direction DR1, the second direction DR2, and the third direction DR3 are not limited to directions corresponding to the three axes of a rectangular coordinate system (such as the x-axis, the y-axis, and the z-axis), and can be interpreted in a broader sense. For example, the first direction DR1, the second direction DR2, and the third direction DR3 can be perpendicular to each other, or can be different directions that are not perpendicular to each other.

[0058] For the purposes of the present disclosure, "at least one of A and B" can be interpreted as only A, only B, or any combination of A and B. Further, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" can be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0059] Although the terms "first", "second", etc. may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Thus, without departing from the teachings of the present disclosure, the first element discussed below may be referred to as the second element.

[0060] Spatial relative terms such as "beneath", "below", "under", "lower", "above", "upper", "on", "over", "higher", "side" (e.g., as in "sidewall") and like terms may be used herein for descriptive purposes and thus to describe the relationship of one element to another(s) as illustrated in the figures. In addition to the orientation depicted in the figures, the spatial relative terms are also intended to encompass different orientations of the device in use, operation, and / or manufacture. For example, if the device in the figures is turned over, an element described as "beneath" or "below" another element or feature will then be oriented "above" the other element or feature. Thus, the term "beneath" can encompass both an orientation above and below. Further, the device may be otherwise oriented (e.g., rotated 90 degrees or at other orientations), and as such, the spatial relative descriptors used herein are to be interpreted accordingly.

[0061] The terminology used herein is for the purpose of describing particular embodiments and is not intended to be limiting. As used herein, unless the context clearly dictates otherwise, the singular forms "a", "an", and "the" are also intended to include the plural forms. Additionally, the terms "comprises", "comprising", "includes", and / or "including", when used in this specification, specify the presence of the stated features, integers, steps, operations, elements, components, and / or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. It should also be noted that, as used herein, the terms "substantially", "about", and other similar terms are used as approximate terms and not as terms of degree, and thus are used to interpret the inherent deviations in measured, calculated, and / or provided values recognized by one of ordinary skill in the art.

[0062] Various embodiments are described herein with reference to sectional illustrations and / or exploded illustrations that are schematic illustrations of embodiments and / or intermediate structures. As such, variations in the shape of the illustrations due to, for example, manufacturing techniques and / or tolerances are to be expected. Accordingly, the embodiments disclosed herein should not necessarily be construed as limited to the particular shapes shown in the regions, but will include deviations in shape resulting from, for example, manufacturing. In this manner, the regions shown in the figures are schematic in nature and the shapes of these regions may not reflect the actual shape of the regions of the device, and thus are not necessarily intended to be limiting.

[0063] As is conventional in the art, some embodiments are described in terms of functional blocks, portions, and / or modules and illustrated in the figures. Those skilled in the art will appreciate that these blocks, portions, and / or modules are physically implemented by electronic (or optical) circuits (such as logic circuits, discrete components, microprocessors, hardwired circuits, memory elements, wiring connections, and the like) that can be formed using semiconductor-based fabrication techniques or other manufacturing techniques. In cases where the blocks, portions, and / or modules are implemented by a microprocessor or other similar hardware, they can be programmed and controlled using software (e.g., microcode) to perform the various functions discussed herein and, optionally, can be driven by firmware and / or software. It is also contemplated that each block, portion, and / or module can be implemented by dedicated hardware or as a combination of dedicated hardware that performs some functions and a processor (e.g., one or more programmed microprocessors and associated circuitry) that performs other functions. Moreover, without departing from the scope of the inventive concept, each block, portion, and / or module of some embodiments can be physically separated into two or more interacting and discrete blocks, portions, and / or modules. Additionally, without departing from the scope of the inventive concept, the blocks, portions, and / or modules of some embodiments can be physically combined into more complex blocks, portions, and / or modules.

[0064] Unless otherwise defined or implied herein, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will also be understood that terms (such as those defined in common dictionaries) should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and this disclosure, and should not be interpreted in an idealized or overly dogmatic sense unless expressly so defined herein.

[0065] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings.

[0066] Figure 1 is a perspective view of an electronic device according to an embodiment of the present disclosure.

[0067] Referring to Figure 1 , the electronic device ELD can be a device that can be activated according to an electrical signal. For example, the electronic device ELD can be a mobile phone (such as a portable mobile phone), a laptop computer, a television, a tablet personal computer (PC), a vehicle navigation system, a gaming console, or a wearable device, but the present disclosure is not limited thereto. Figure 1 Illustratively, the electronic device ELD can be a tablet PC.

[0068] The electronic device ELD can display an image and sense an input applied from the outside. The external input can be an input from a user. The user's input can include various types of external inputs, such as a part US_F of the user's body, a pen PN, light, heat, or pressure. The user's input can include all inputs that can change the capacitance of the input sensor.

[0069] An active area AA and a peripheral area NAA can be defined in the electronic device ELD. The electronic device ELD can display an image through the active area AA. The active area AA can include a surface defined by a first direction DR1 and a second direction DR2. The peripheral area NAA can surround the active area AA. In an embodiment of the present disclosure, the peripheral area NAA can be omitted.

[0070] The thickness direction of the electronic device ELD can be parallel to a third direction DR3 that intersects the first direction DR1 and the second direction DR2. Therefore, the front surface (or upper surface) and the rear surface (or lower surface) of the components constituting the electronic device ELD can be defined based on the third direction DR3.

[0071] In Figure 1 an example of the electronic device ELD that can be bar-shaped is shown, but the present disclosure is not limited thereto. For example, the following description can be applied to various electronic devices ELD such as foldable electronic devices, rollable electronic devices, or slidable electronic devices.

[0072] Figure 2A and Figure 2B are schematic cross-sectional views of an electronic device according to an embodiment of the present disclosure.

[0073] Referring to Figure 2A , the electronic device ELD can include a display module DM and a window WM. The display module DM generates an image and senses an external input. The display module DM can include a display panel DP and an input sensor ISP. In the specification, the display panel DP can be referred to as a "display layer", and the input sensor ISP can be referred to as a "sensor layer".

[0074] The display panel DP can include a display area and a non-display area corresponding to the active area AA (see Figure 1 ) and the peripheral area NAA (see Figure 1 ) of the electronic device ELD, respectively.

[0075] The display panel DP is not particularly limited, and for example, can be a light-emitting display panel such as an organic light-emitting display panel or an inorganic light-emitting display panel.

[0076] The input sensor ISP can be disposed (e.g., directly disposed) on the display panel DP. According to an embodiment of the present disclosure, the input sensor ISP can be formed on the display panel DP through a continuous process. When the input sensor ISP is disposed (e.g., directly disposed) on the display panel DP, an internal adhesive layer IAL may not be disposed between the input sensor ISP and the display panel DP. However, as Figure 2B shown, the internal adhesive layer IAL can be disposed between the input sensor ISP and the display panel DP. The input sensor ISP may not be manufactured together with the display panel DP through a continuous process, may be manufactured through a process separate from the display panel DP, and may be fixed to the upper surface of the display panel DP through the internal adhesive layer IAL.

[0077] The electronic device ELD may further include an optical member disposed on the display module DM. The optical member may be an anti-reflection layer that can reduce the external light reflectance. The optical member may include a polarizer and a phase retarder. The polarizer and the phase retarder may be of a stretched type or a coated type. In the coated optical film, the optical axis may be defined according to the stretching direction of the functional film. The coated optical film may include liquid crystal molecules disposed on a base film.

[0078] In an embodiment of the present disclosure, the optical member may be omitted. The display module DM may further include a color filter and a black matrix instead of the optical member. The color filter and the black matrix may be disposed (e.g., directly disposed) on the upper surface of the input sensor ISP through a continuous process. The upper surface of the input sensor ISP may be provided by an insulating layer disposed on the uppermost side of the input sensor ISP.

[0079] The window WM may provide the outer surface of the electronic device ELD. The window WM may include a base substrate and may further include functional layers such as an anti-reflection layer and an anti-fingerprint layer. An adhesive layer ADL may be disposed between the window WM and the display module DM.

[0080] Although not shown separately, the display module DM may further include at least one adhesive layer. The adhesive layer may couple the components of the display module DM. The adhesive layer may be an optically transparent adhesive layer or a pressure-sensitive adhesive layer.

[0081] As Figure 2A shown, the window WM may include a light-shielding pattern WBM for defining a peripheral area NAA (see Figure 1 ). The light-shielding pattern WBM may be a colored organic film and may be formed on the surface of the window base layer WM-BS using, for example, a coating method.

[0082] Figure 2C and Figure 2D are schematic cross-sectional views of a display module according to an embodiment of the present disclosure.

[0083] Referring to Figure 2C, the display module DM may include a display panel DP and an input sensor ISP. The display panel DP may include a base layer BL, a circuit element layer DP-CL and a display element layer DP-ED that can be disposed on the base layer BL, a packaging substrate ES, and a sealant SM that couples the base layer BL and the packaging substrate ES. The input sensor ISP may be disposed (e.g., directly disposed) on the packaging substrate ES.

[0084] The base layer BL may include at least one plastic film. The base layer BL may include a plastic substrate, a glass substrate, a metal substrate, an organic / inorganic composite substrate, or a combination thereof. In an embodiment, the base layer BL may be a thin film glass substrate having a thickness of dozens to hundreds of micrometers. The base layer BL may have a multi-layer structure. For example, the base layer BL may include an organic layer (e.g., a polyimide layer) / at least one inorganic layer / an organic layer (e.g., a polyimide layer).

[0085] The circuit element layer DP-CL may include at least one insulating layer and circuit elements. The insulating layer may include at least one inorganic layer and at least one organic layer. The circuit elements may include signal lines, pixel circuits, etc. Details thereof will be described below.

[0086] The display element layer DP-ED may at least include light-emitting elements. The display element layer DP-ED may further include an organic layer such as a pixel defining film.

[0087] The packaging substrate ES may be spaced apart from the display element layer DP-ED with a gap (e.g., a predetermined or optional gap) GP therebetween. The base layer BL and the packaging substrate ES may include a plastic substrate, a glass substrate, a metal substrate, an organic / inorganic composite substrate, or a combination thereof. The sealant SM may include an organic adhesive or frit. The gap GP may be filled with a material (e.g., a predetermined or optional material). A moisture absorbent or a resin material may be filled in the gap GP.

[0088] As Figure 2D shown, the display panel DP may include a base layer BL, a circuit element layer DP-CL and a display element layer DP-ED disposed on the base layer BL, and an upper protection layer TFL. The upper protection layer TFL may include a plurality of thin films. The upper protection layer TFL may include a cover layer for protecting the light-emitting elements. The upper protection layer TFL may further include a packaging layer including at least an inorganic layer / an organic layer / an inorganic layer. The packaging layer may be disposed on the cover layer. The input sensor ISP may be disposed (e.g., directly disposed) on the upper protection layer TFL.

[0089] Figure 3 is a view for describing the operation of an electronic device according to an embodiment of the present disclosure.

[0090] Referring to Figure 3, the electronic device ELD may include a display panel DP, an input sensor ISP, a display driving unit 100C, a sensor driving unit 200C, a main driving unit 1000C, and a power supply circuit 1000P.

[0091] The input sensor ISP may sense a first input 2000 or a second input 3000 applied from the outside. Each of the first input 2000 and the second input 3000 may be an input unit capable of providing a capacitance change to the input sensor ISP or an input unit capable of inducing a current in the input sensor ISP. For example, the first input 2000 may be a passive input unit such as a user's body. The second input 3000 may be an input made by a pen PN or an input made by a radio frequency integrated circuit (RFIC) tag. For example, the pen PN may be a passive pen or an active pen.

[0092] In an embodiment of the present disclosure, the pen PN may be a device that generates a magnetic field having a resonance frequency (e.g., a predetermined or selectable resonance frequency). The pen PN may be configured to transmit an output signal based on an electromagnetic resonance method. The pen PN may be referred to as an input device, an input pen, a magnetic pen, a stylus, or an electromagnetic resonance pen.

[0093] The pen PN may include an RLC resonance circuit, and the RLC resonance circuit may include an inductor "L" and a capacitor "C". In an embodiment of the present disclosure, the RLC resonance circuit may be a variable resonance circuit that changes the resonance frequency. The inductor "L" may be a variable inductor and / or the capacitor "C" may be a variable capacitor. However, the present disclosure is not particularly limited thereto.

[0094] The inductor "L" generates a current through the magnetic field formed in the input sensor ISP. However, the present disclosure is not particularly limited thereto. For example, in the case where the pen PN operates in an active type, even when no magnetic field is provided from the outside, the pen PN may generate a current. The generated current may be sent to the capacitor "C". The capacitor "C" charges with the current input from the inductor "L" and discharges the charged current to the inductor "L". Thereafter, the inductor "L" may emit a magnetic field having a resonance frequency. An induced current may flow in the input sensor ISP due to the magnetic field emitted by the pen PN, and the induced current may be sent to the sensor driving unit 200C as a received signal (or a sensed signal or a signal).

[0095] The main driving unit 1000C may control the overall operation of the electronic device ELD. For example, the main driving unit 1000C may control the operations of the display driving unit 100C and the sensor driving unit 200C. The main driving unit 1000C may include at least one microprocessor and may also include a graphics processor. The main driving unit 1000C may be referred to as an application processor, a central processing unit, or a main processor.

[0096] The display driving unit 100C can drive the display panel DP. The display driving unit 100C can receive image data and control signals from the main driving unit 1000C. The control signals can include various signals. For example, the control signals can include an input vertical synchronization signal, an input horizontal synchronization signal, a main clock, a data enable signal, etc.

[0097] The sensor driving unit 200C can drive the input sensor ISP. The sensor driving unit 200C can receive control signals from the main driving unit 1000C. The control signals can include a clock signal for the sensor driving unit 200C. In addition, the control signals can further include a mode determination signal for determining the driving modes of the sensor driving unit 200C and the input sensor ISP.

[0098] The sensor driving unit 200C can be implemented in an integrated circuit (IC) and electrically connected to the input sensor ISP. For example, the sensor driving unit 200C can be mounted (e.g., directly mounted) on an area (e.g., a predetermined or optional area) of the display panel DP, or mounted on a separate printed circuit board by a chip on film (COF) method and electrically connected to the input sensor ISP.

[0099] The sensor driving unit 200C and the input sensor ISP can selectively operate in a first mode or a second mode. For example, the first mode can be a mode in which a touch input (e.g., the first input 2000) can be sensed. The second mode can be a mode in which a pen PN (e.g., the second input 3000) can be sensed. The first mode can be referred to as a touch sensing mode, and the second mode can be referred to as a pen sensing mode.

[0100] The switching between the first mode and the second mode can be performed in various ways. For example, the sensor driving unit 200C and the input sensor ISP can be driven in time division in the first mode and the second mode, and can sense the first input 2000 and the second input 3000. For example, the switching between the first mode and the second mode can be performed by a user's selection or a user's specific action, can be activated or deactivated by activating or deactivating a specific application, or can switch the current mode from one mode to another mode. For example, during the period when the sensor driving unit 200C and the input sensor ISP can operate alternately in the first mode and the second mode, when the first input 2000 is sensed, the first mode can be maintained, and when the second input 3000 is sensed, the second mode can be maintained.

[0101] The sensor driving unit 200C may calculate input coordinate information based on a signal received from the input sensor ISP, and may provide a coordinate signal having the coordinate information to the main driving unit 1000C. The main driving unit 1000C may perform an operation corresponding to a user input based on the coordinate signal. For example, the main driving unit 1000C may operate the display driving unit 100C such that a new application image may be displayed on the display panel DP.

[0102] The power supply circuit 1000P may include a power management integrated circuit (PMIC). The power supply circuit 1000P may generate a plurality of driving voltages for driving the display panel DP, the input sensor ISP, the display driving unit 100C, and the sensor driving unit 200C. For example, the driving voltages may include a first driving voltage (e.g., ELVSS voltage), a second driving voltage (e.g., ELVDD voltage), an initialization voltage, etc., but the present disclosure is not particularly limited thereto.

[0103] Figure 4 is an enlarged schematic cross-sectional view of a display module according to an embodiment of the present disclosure. Figure 4 is based on Figure 2D of the display module.

[0104] Referring to Figure 4 , the display module DM may include a display panel DP and an input sensor ISP disposed (e.g., directly disposed) on the display panel DP. The display panel DP may include a base layer BL, a circuit element layer DP-CL, a display element layer DP-ED, and an upper protection layer TFL. The input sensor ISP may be disposed (e.g., directly disposed) on the upper protection layer TFL.

[0105] The display panel DP may include a display area on which an image may be displayed and a non-display area adjacent to the display area. Figure 4 A part of the display area is shown in an enlarged manner.

[0106] The base layer BL may provide a base surface on which the circuit element layer DP-CL may be disposed. The circuit element layer DP-CL may be disposed on the base layer BL. The circuit element layer DP-CL may include an insulating layer, a semiconductor pattern, a conductive pattern, signal lines, etc. The insulating layer, the semiconductor layer, and the conductive layer may be formed on the base layer BL by means such as coating and deposition, and thereafter, the insulating layer, the semiconductor layer, and the conductive layer may be selectively patterned through a plurality of lithography processes. Thereafter, the semiconductor pattern, the conductive pattern, and the signal lines included in the circuit element layer DP-CL may be formed.

[0107] At least one inorganic layer may be formed on the upper surface of the base layer BL. In an embodiment, it is shown that the circuit element layer DP-CL may include a buffer layer BFL. The buffer layer BFL may improve the bonding force between the base layer BL and the semiconductor pattern. The buffer layer BFL may include a silicon oxide layer and a silicon nitride layer, and the silicon oxide layer and the silicon nitride layer may be alternately stacked.

[0108] The semiconductor pattern may be disposed on the buffer layer BFL. The semiconductor pattern may include polysilicon. However, the present disclosure is not limited thereto, and the semiconductor pattern may include amorphous silicon or metal oxide.

[0109] Figure 4 Only a part of the semiconductor pattern is shown, and the semiconductor pattern may also be disposed in another region. The semiconductor pattern may be disposed across multiple pixels in a specific pattern. Depending on whether the semiconductor pattern is doped, the semiconductor pattern may have different electrical properties. The semiconductor pattern may include a first region having a higher conductivity and a second region having a lower conductivity. The first region may be doped with an N-type dopant or a P-type dopant. The P-type transistor may include a doped region doped with a P-type dopant. The second region may be an undoped region or may be doped with a concentration lower than that of the first region.

[0110] The conductivity of the first region may be greater than that of the second region, and the first region substantially serves as an electrode or a signal line. The second region may substantially correspond to the channel region of the pixel transistor TR-P. In other words, a part of the semiconductor pattern may be the channel region of the transistor, and another part thereof may be the source region or the drain region of the transistor.

[0111] Each pixel may have an equivalent circuit including seven transistors, one capacitor, and a light-emitting element, and the schematic diagram of the equivalent circuit of the pixel may be modified into various forms. Figure 4 Illustratively, one pixel transistor TR-P and one light-emitting element ED included in the pixel are shown.

[0112] The source region SR, the channel region CHR, and the drain region DR of the pixel transistor TR-P may be formed of the semiconductor pattern. In cross-section, the source region SR and the drain region DR may extend from the channel region CHR in opposite directions. Figure 4 A part of the signal transmission region SCL formed as the first region of the semiconductor pattern is shown. Although not shown separately, the signal transmission region SCL may be electrically connected to the pixel transistor TR-P in a plan view.

[0113] A first insulating layer IL1 may be provided on the buffer layer BFL. The first insulating layer IL1 may overlap with the pixel common electrode and cover the semiconductor pattern. The first insulating layer IL1 may be an inorganic layer and / or an organic layer, and may have a single-layer structure or a multi-layer structure. The first insulating layer IL1 may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. In an embodiment, the first insulating layer IL1 may be a single-layer silicon oxide layer. Except for the first insulating layer IL1, the insulating layers of the circuit element layer DP-CL described below may be an inorganic layer and / or an organic layer, and may have a single-layer structure or a multi-layer structure. The inorganic layer may include at least one of the above materials, but the present disclosure is not limited thereto.

[0114] A gate GE of the pixel transistor TR-P may be provided on the first insulating layer IL1. The gate GE may be a part of a metal pattern. The gate GE overlaps with the channel region CHR. The gate GE may be used as a mask in the process of doping the semiconductor pattern.

[0115] A second insulating layer IL2 may be provided on the first insulating layer IL1 and cover the gate GE. The second insulating layer IL2 may overlap with the pixel common electrode. The second insulating layer IL2 may be an inorganic layer and / or an organic layer, and may have a single-layer structure or a multi-layer structure. In an embodiment, the second insulating layer IL2 may be a single-layer silicon oxide layer.

[0116] A third insulating layer IL3 may be provided on the second insulating layer IL2, and in an embodiment, the third insulating layer IL3 may be a single-layer silicon oxide layer. A first connection electrode CNE1 may be provided on the third insulating layer IL3. The first connection electrode CNE1 may be electrically connected to the signal transmission region SCL through a contact hole CNT1 that penetrates the first insulating layer IL1, the second insulating layer IL2, and the third insulating layer IL3.

[0117] A fourth insulating layer IL4 may be provided on the third insulating layer IL3. The fourth insulating layer IL4 may be a single-layer silicon oxide layer. A fifth insulating layer IL5 may be provided on the fourth insulating layer IL4. The fifth insulating layer IL5 may be an organic layer. The fourth insulating layer IL4 may be omitted, and the fifth insulating layer IL5 may be provided on the third insulating layer IL3.

[0118] A second connection electrode CNE2 may be provided on the fifth insulating layer IL5. The second connection electrode CNE2 may be electrically connected to the first connection electrode CNE1 through a contact hole CNT2 that penetrates the fourth insulating layer IL4 and the fifth insulating layer IL5.

[0119] The sixth insulating layer IL6 may be disposed on the fifth insulating layer IL5 and cover the second connection electrode CNE2. The sixth insulating layer IL6 may be an organic layer. The display element layer DP-ED may be disposed on the circuit element layer DP-CL. The display element layer DP-ED may include a light-emitting element ED. The light-emitting element ED may include a first electrode AE, a light-emitting layer EL, and a second electrode CE. For example, the light-emitting layer EL may include an organic light-emitting material, quantum dots, quantum rods, micro LEDs, or nano LEDs.

[0120] The first electrode AE may be disposed on the sixth insulating layer IL6. The first electrode AE may be electrically connected to the second connection electrode CNE2 through a contact hole CNT3 passing through the sixth insulating layer IL6.

[0121] The pixel defining film IL7 may be disposed on the sixth insulating layer IL6 and cover a part of the first electrode AE. An opening OP7 may be defined in the pixel defining film IL7. The opening OP7 of the pixel defining film IL7 exposes at least a part of the first electrode AE. In an embodiment, the light-emitting region PXA may be defined to correspond to a partial region of the first electrode AE that can be exposed by the opening OP7. The non-light-emitting region NPXA may surround the light-emitting region PXA.

[0122] The light-emitting layer EL may be disposed on the first electrode AE. The light-emitting layer EL may be disposed corresponding to the opening OP7. The light-emitting layer EL may be formed separately for each pixel. In the case where the light-emitting layer EL is formed separately for each pixel, each of the light-emitting layers EL may emit light having at least one of blue, red, and green. However, the present disclosure is not limited thereto, and the light-emitting layers EL of the pixels may be electrically connected to each other and provided in common. The light-emitting layer EL may provide blue light or may provide white light.

[0123] The second electrode CE may be disposed on the light-emitting layer EL. The second electrode CE may have an integral shape and may be provided in common in the pixel. A common voltage may be provided to the second electrode CE, and the second electrode CE may be referred to as a common electrode.

[0124] Although not shown, a hole control layer may be disposed between the first electrode AE and the light-emitting layer EL. The hole control layer may be provided in common in the light-emitting region PXA and the non-light-emitting region NPXA. The hole control layer may include a hole transport layer and may further include a hole injection layer. An electron control layer may be disposed between the light-emitting layer EL and the second electrode CE. The electron control layer may include an electron transport layer and may further include an electron injection layer. By using an opening mask, the hole control layer and the electron control layer may be formed in common in the pixel. The second electrode CE may be covered by an upper protective layer TFL.

[0125] The input sensor ISP can be formed on the upper surface of the upper protection layer TFL through a continuous process (e.g., directly formed thereon). The input sensor ISP can include a first sensor insulating layer IIL1, a first sensor conductive layer ICL1, a second sensor insulating layer IIL2, a second sensor conductive layer ICL2, and a third sensor insulating layer IIL3. In the specification, the first sensor insulating layer IIL1 can be referred to as the "base insulating layer"

[0126] Each of the first sensor conductive layer ICL1 and the second sensor conductive layer ICL2 can include a plurality of patterns having a single-layer structure or a multi-layer structure in which layers can be stacked in a third direction DR3. The conductive layer having a single-layer structure can include a metal layer or a transparent conductive layer. The metal layer can include molybdenum, silver, titanium, copper, aluminum, their alloys, or a combination thereof. The transparent conductive layer can include transparent conductive oxides such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium zinc tin oxide (IZTO), or a combination thereof. The transparent conductive layer can include conductive polymers such as poly(3,4-ethylenedioxythiophene) (PEDOT), metal nanowires, graphene, etc., or a combination thereof.

[0127] The conductive layer having a multi-layer structure can include a metal layer. The metal layer can have, for example, a three-layer structure of titanium / aluminum / titanium. The conductive layer having a multi-layer structure can include at least one metal layer and at least one transparent conductive layer.

[0128] The second sensor insulating layer IIL2 can cover the first sensor conductive layer ICL1, and the third sensor insulating layer IIL3 can cover the second sensor conductive layer ICL2. It is shown that the first sensor insulating layer IIL1 to the third sensor insulating layer IIL3 have a single layer, but the present disclosure is not limited thereto.

[0129] At least one of the first sensor insulating layer IIL1 and the second sensor insulating layer IIL2 can include an inorganic film. The inorganic film can include at least one of alumina, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, hafnium oxide, and their combinations.

[0130] At least one of the second sensor insulating layer IIL2 and the third sensor insulating layer IIL3 can include an organic film. The organic film can include at least one of acrylic-based resins, methacrylate-based resins, polyisoprene-based resins, vinyl resins, epoxy resins, urethane-based resins, cellulose-based resins, silicone-based resins, polyimide-based resins, polyamide-based resins, perylene-based resins, and their combinations.

[0131] Figure 5 is a plan view of an input sensor according to an embodiment of the present disclosure. Figure 6 is shown Figure 5An enlarged plan view of a portion BB of the input sensor shown in Figure 7 is a schematic cross-sectional view taken along the Figure 6 cutting line I-I' shown in

[0132] Referring to Figures 5 to 7 , the input sensor ISP may include a sensing area SA and a non-sensing area NSA adjacent to the sensing area SA. The sensing area SA and the non-sensing area NSA may be areas corresponding to the display area and the non-display area of the display panel DP (see Figure 3 ), respectively. The sensing area SA may be an area that can be activated according to an electrical signal. A sensing controller TIC may be provided in the non-sensing area NSA. The sensing controller TIC may be Figure 3 a component included in the sensor driving unit 200C shown in

[0133] The input sensor ISP may include a plurality of row sensing electrodes RE and a plurality of column sensing electrodes TE. The row sensing electrodes RE and the column sensing electrodes TE may be electrically insulated from each other and intersect each other.

[0134] Each of the row sensing electrodes RE may extend in a first direction DR1. The row sensing electrodes RE may be spaced apart from each other in a second direction DR2. For example, the row sensing electrodes RE may include a first row sensing electrode RE1 to a fifth row sensing electrode RE5. Figure 5 It is shown in Figure 5 that the number of the row sensing electrodes RE may be five, but the number of the row sensing electrodes RE is not limited thereto. Each of the first row sensing electrode RE1 to the fifth row sensing electrode RE5 may include one or more sub-row sensing electrodes.

[0135] Illustratively, a structure is shown in which each of the first row sensing electrode RE1 to the fifth row sensing electrode RE5 may include two sub-row sensing electrodes, but the present disclosure is not limited thereto.

[0136] The first row sensing electrode RE1 may further include a first connection electrode RCL1 connecting the first sub-row sensing electrode RE1-1 and the second sub-row sensing electrode RE1-2 to each other, and the second row sensing electrode RE2 may further include a second connection electrode RCL2 connecting the third sub-row sensing electrode RE2-1 and the fourth sub-row sensing electrode RE2-2 to each other. The third row sensing electrode RE3 may further include a third connection electrode RCL3 connecting the fifth sub-row sensing electrode RE3-1 and the sixth sub-row sensing electrode RE3-2 to each other, and the fourth row sensing electrode RE4 may further include a fourth connection electrode RCL4 connecting the seventh sub-row sensing electrode RE4-1 and the eighth sub-row sensing electrode RE4-2 to each other. The fifth row sensing electrode RE5 may further include a fifth connection electrode RCL5 connecting the ninth sub-row sensing electrode RE5-1 and the tenth sub-row sensing electrode RE5-2 to each other. As an example of the present disclosure, each of the first connection electrode RCL1 to the fifth connection electrode RCL5 may be disposed in the non-sensing area NSA and electrically connected to the ends of the corresponding two sub-row sensing electrodes.

[0137] Each of the first sub-row sensing electrode RE1-1 to the tenth sub-row sensing electrode RE5-2 may extend in the first direction DR1. The first sub-row sensing electrode RE1-1 to the tenth sub-row sensing electrode RE5-2 may be spaced apart from each other in the second direction DR2. Each of the first sub-row sensing electrode RE1-1 to the tenth sub-row sensing electrode RE5-2 includes a plurality of sub-sensing electrodes arranged in the first direction DR1. Each of the sub-sensing electrodes may have a quadrilateral shape including two horizontal sides parallel to the first direction DR1 and two vertical sides parallel to the second direction DR2. Among the sub-sensing electrodes, two adjacent sub-sensing electrodes may be electrically connected to each other through a bridging electrode BE.

[0138] Each of the column sensing electrodes TE may extend in the second direction DR2. The column sensing electrodes TE may be spaced apart from each other in the first direction DR1. For example, the column sensing electrodes TE may include a first column sensing electrode TE1 to a sixth column sensing electrode TE6. Figure 5 The number of the column sensing electrodes TE is shown as six, but the number of the column sensing electrodes TE is not limited thereto.

[0139] Each of the first column sensing electrode TE1 to the sixth column sensing electrode TE6 may include an opening T_OP extending in the second direction DR2. A boundary opening T_BOP may be defined between two column sensing electrodes spaced apart from each other among the first column sensing electrode TE1 to the sixth column sensing electrode TE6.

[0140] As an example of the present disclosure, the sub-sensing electrodes may be arranged to correspond to the opening T_OP and the boundary opening T_BOP. Hereinafter, among the sub-sensing electrodes, the sub-sensing electrode arranged to correspond to the opening T_OP may be referred to as the first sub-sensing electrode S_RE1, and the sub-sensing electrode arranged to correspond to the boundary opening T_BOP may be referred to as the second sub-sensing electrode S_RE2. As an example of the present disclosure, the first sub-sensing electrode S_RE1 and the second sub-sensing electrode S_RE2 may have different shapes or different areas. However, the present disclosure is not limited thereto, and for example, the first sub-sensing electrode S_RE1 and the second sub-sensing electrode S_RE2 may have the same shape or the same area.

[0141] Each of the first column sensing electrodes TE1 to the sixth column sensing electrodes TE6 may include a first sensing part TP1 and a second sensing part TP2. The first sensing part TP1 may be disposed between the first sub-sensing electrode S_RE1 and the second sub-sensing electrode S_RE2 in the first direction DR1. The second sensing part TP2 may extend from the first sensing part TP1 in the second direction DR2 and have a width greater than the width of the first sensing part TP1. As an example of the present disclosure, the first sensing part TP1 and the second sensing part TP2 may be integral with each other. The bridging electrode BE may overlap the first sensing part TP1.

[0142] In an embodiment, the row sensing electrode RE may be longer than the column sensing electrode TE, and the number of row sensing electrodes RE may be less than the number of column sensing electrodes TE, but the embodiment is not limited thereto.

[0143] The input sensor ISP may obtain information about a user's input through a change in the mutual capacitance between the row sensing electrode RE and the column sensing electrode TE.

[0144] The input sensor ISP may include a first trace SL1 electrically connected to the row sensing electrode RE and a second trace SL2 electrically connected to the column sensing electrode TE. In a plan view, at least one of the first traces SL1 may overlap the sensing area SA. The second trace SL2 may not overlap the sensing area SA and may overlap the non-sensing area NSA.

[0145] The row sensing electrode RE may be electrically connected to the sensing controller TIC through the first trace SL1, and the column sensing electrode TE may be electrically connected to the sensing controller TIC through the second trace SL2. The column sensing electrode TE may receive a transmission signal from the sensing controller TIC through the second trace SL2. A change in the mutual capacitance between the column sensing electrode TE and the row sensing electrode RE may occur at a position where a user's input is provided. The sensing controller TIC may generate coordinate values for the position where the user's input is provided based on the received signal received from the first trace SL1.

[0146] Each of the first row sensing electrodes RE1 to the fifth row sensing electrodes RE5 can be electrically connected to one or more first traces SL1. As an example of the present disclosure, each of the first row sensing electrodes RE1 to the fifth row sensing electrodes RE5 can be electrically connected to a first trace SL1. The first trace SL1 includes a 1-1 trace SL1-1, a 1-2 trace SL1-2, a 1-3 trace SL1-3, a 1-4 trace SL1-4, and a 1-5 trace SL1-5 that are electrically connected to the first row sensing electrode RE1 to the fifth row sensing electrodes RE5, respectively. Each of the 1-1 trace SL1-1 to the 1-5 trace SL1-5 can extend in the second direction DR2.

[0147] Figure 5 It is shown that all of the 1-1 trace SL1-1 to the 1-5 trace SL1-5 overlap with the sensing area SA. However, the present disclosure is not limited thereto. Alternatively, at least one of the 1-1 trace SL1-1 to the 1-5 trace SL1-5 can be arranged to overlap with the non-sensing area NSA. The 1-1 trace SL1-1 to the 1-5 trace SL1-5 can be electrically connected to the sensing controller TIC in the non-sensing area NSA.

[0148] The 1-1 trace SL1-1 can be arranged to correspond to (or overlap with) the opening T_OP of the fifth column sensing electrode TE5, and the 1-2 trace SL1-2 can be arranged to correspond to (or overlap with) the opening T_OP of the fourth column sensing electrode TE4. The 1-3 trace SL1-3 can be arranged to correspond to (or overlap with) the opening T_OP of the third column sensing electrode TE3, and the 1-4 trace SL1-4 can be arranged to correspond to (or overlap with) the opening T_OP of the second column sensing electrode TE2. The 1-5 trace SL1-5 can be arranged to correspond to (or overlap with) the opening T_OP of the first column sensing electrode TE1. Alternatively, at least one of the 1-1 trace SL1-1 to the 1-5 trace SL1-5 can be arranged to correspond to (or overlap with) the boundary opening T_BOP.

[0149] The first - 1 trace SL1 - 1 can partially overlap with the first row sensing electrode RE1 to the fifth row sensing electrode RE5 inside the opening T_OP of the fifth column sensing electrode TE5. The first - 2 trace SL1 - 2 can partially overlap with the first row sensing electrode RE1 to the fifth row sensing electrode RE5 inside the opening T_OP of the fourth column sensing electrode TE4. The first - 3 trace SL1 - 3 can partially overlap with the first row sensing electrode RE1 to the fifth row sensing electrode RE5 inside the opening T_OP of the third column sensing electrode TE3. The first - 4 trace SL1 - 4 can partially overlap with the first row sensing electrode RE1 to the fifth row sensing electrode RE5 inside the opening T_OP of the second column sensing electrode TE2. The first - 5 trace SL1 - 5 can partially overlap with the first row sensing electrode RE1 to the fifth row sensing electrode RE5 inside the opening T_OP of the first column sensing electrode TE1.

[0150] The first - 1 trace SL1 - 1 to the first - 5 trace SL1 - 5 can be arranged below the first row sensing electrode RE1 to the fifth row sensing electrode RE5 in the third direction DR3. An insulating layer (e.g., the second sensor insulating layer IIL2) can be provided between the first - 1 trace SL1 - 1 to the first - 5 trace SL1 - 5 and the first row sensing electrode RE1 to the fifth row sensing electrode RE5 (see Figure 4 ).

[0151] The first row sensing electrode RE1 can be electrically connected to the first - 1 trace SL1 - 1 through the first contact hole CH1. As an example of the present disclosure, the first contact hole CH1 can include a first sub - contact hole CH1 - 1 and a second sub - contact hole CH1 - 2. The first sub - row sensing electrode RE1 - 1 of the first row sensing electrode RE1 can be electrically connected to the first - 1 trace SL1 - 1 through the first sub - contact hole CH1 - 1, and the second sub - row sensing electrode RE1 - 2 of the first row sensing electrode RE1 can be electrically connected to the first - 1 trace SL1 - 1 through the second sub - contact hole CH1 - 2.

[0152] The second row sensing electrode RE2 can be electrically connected to the first - 2 trace SL1 - 2 through the second contact hole CH2. As an example of the present disclosure, the second contact hole CH2 can include a third sub - contact hole CH2 - 1 and a fourth sub - contact hole CH2 - 2. The third sub - row sensing electrode RE2 - 1 of the second row sensing electrode RE2 can be electrically connected to the first - 2 trace SL1 - 2 through the third sub - contact hole CH2 - 1, and the fourth sub - row sensing electrode RE2 - 2 of the second row sensing electrode RE2 can be electrically connected to the first - 2 trace SL1 - 2 through the fourth sub - contact hole CH2 - 2.

[0153] The third row sensing electrode RE3 can be electrically connected to the 1st - 3rd traces SL1 - 3 through the third contact hole CH3. As an example of the present disclosure, the third contact hole CH3 can include a fifth sub - contact hole CH3 - 1 and a sixth sub - contact hole CH3 - 2. The fifth sub - row sensing electrode RE3 - 1 of the third row sensing electrode RE3 can be electrically connected to the 1st - 3rd traces SL1 - 3 through the fifth sub - contact hole CH3 - 1, and the sixth sub - row sensing electrode RE3 - 2 of the third row sensing electrode RE3 can be electrically connected to the 1st - 3rd traces SL1 - 3 through the sixth sub - contact hole CH3 - 2.

[0154] The fourth row sensing electrode RE4 can be electrically connected to the 1st - 4th traces SL1 - 4 through the fourth contact hole CH4. As an example of the present disclosure, the fourth contact hole CH4 can include a seventh sub - contact hole CH4 - 1 and an eighth sub - contact hole CH4 - 2. The seventh sub - row sensing electrode RE4 - 1 of the fourth row sensing electrode RE4 can be electrically connected to the 1st - 4th traces SL1 - 4 through the seventh sub - contact hole CH4 - 1, and the eighth sub - row sensing electrode RE4 - 2 of the fourth row sensing electrode RE4 can be electrically connected to the 1st - 4th traces SL1 - 4 through the eighth sub - contact hole CH4 - 2.

[0155] The fifth row sensing electrode RE5 can be electrically connected to the 1st - 5th traces SL1 - 5 through the fifth contact hole CH5. As an example of the present disclosure, the fifth contact hole CH5 can include a ninth sub - contact hole CH5 - 1 and a tenth sub - contact hole CH5 - 2. The ninth sub - row sensing electrode RE5 - 1 of the fifth row sensing electrode RE5 can be electrically connected to the 1st - 5th traces SL1 - 5 through the ninth sub - contact hole CH5 - 1, and the tenth sub - row sensing electrode RE5 - 2 of the fifth row sensing electrode RE5 can be electrically connected to the 1st - 5th traces SL1 - 5 through the tenth sub - contact hole CH5 - 2.

[0156] The first sub - contact hole CH1 - 1 to the tenth sub - contact hole CH5 - 2 can be formed to penetrate through the second sensor insulating layer IIL2.

[0157] The first column sensing electrode TE1 to the sixth column sensing electrode TE6 can be electrically connected to the second trace SL2. Each of the first column sensing electrode TE1 to the sixth column sensing electrode TE6 can be electrically connected to the second trace SL2. As an example of the present disclosure, the second trace SL2 includes the 2 - 1 trace SL2 - 1, the 2 - 2 trace SL2 - 2, the 2 - 3 trace SL2 - 3, the 2 - 4 trace SL2 - 4, the 2 - 5 trace SL2 - 5, and the 2 - 6 trace SL2 - 6 that can be electrically connected to the first column sensing electrode TE1 to the sixth column sensing electrode TE6 respectively. The 2 - 1 trace SL2 - 1 to the 2 - 6 trace SL2 - 6 can be arranged in the non - sensing area NSA and be electrically connected to the sensing controller TIC in the non - sensing area NSA.

[0158] AsFigure 6 As shown in Figure 6 , the row sensing electrodes RE and the column sensing electrodes TE may include a plurality of grid lines intersecting each other, and may have a grid shape in which a plurality of grid openings M_OP are defined by the grid lines. The grid openings M_OP may respectively correspond to the light emitting regions PXA of the pixels provided in the display panel DP (see Figure 4 ).

[0159] The bridging electrodes BE may be disposed below the row sensing electrodes RE and the column sensing electrodes TE in a third direction DR3. The bridging electrodes BE and the first to fifth traces SL1-1 to SL1-5 may be disposed on the same insulating layer (e.g., the first sensor insulating layer IIL1) (see Figure 4 ). In a plan view, the bridging electrodes BE may overlap the grid lines of the row sensing electrodes RE and / or the grid lines of the column sensing electrodes TE.

[0160] As an example of the present disclosure, each of the first to fifth traces SL1-1 to SL1-5 may include a plurality of grid lines intersecting each other, and have a grid shape in which grid openings M_OP may be defined by the grid lines.

[0161] In this way, the sides defining each of the row sensing electrodes RE and the column sensing electrodes TE may be arranged parallel to the first direction DR1 and the second direction DR2. Therefore, when the pen PN (see Figure 3 ) moves in the first direction DR1, the capacitance with the row sensing electrode RE may remain constant without change, and as a result, the position and slope of the pen PN may be accurately sensed.

[0162] In addition, when the first trace SL1 is arranged to overlap with the sensing region SA, the width of the non-sensing region NSA may be reduced, and as a result, the border width of the electronic device ELD (see Figure 1 ) (i.e., the width of the peripheral region NAA (see Figure 1 )) may be reduced as a whole.

[0163] Figure 8 is a plan view of an input sensor further including dummy traces according to an embodiment of the present disclosure.

[0164] Referring to Figure 5 and Figure 8 , the input sensor ISPa further includes dummy traces DSL. As an example of the present disclosure, the dummy traces DSL may be electrically connected to the row sensing electrodes RE. The dummy traces DSL may overlap with the sensing region SA in a plan view.

[0165] The dummy traces DSL may be electrically connected to the sensing controller TIC in the non-sensing region NSA (see Figure 5)。Therefore, the row sensing electrode RE can be electrically connected to the sensing controller TIC through the first trace SL1 and through the dummy trace DSL.

[0166] Each of the first row sensing electrode RE1 to the fifth row sensing electrode RE5 can be electrically connected to one or more dummy traces DSL. As an example of the present disclosure, each of the first row sensing electrode RE1 to the fifth row sensing electrode RE5 can be electrically connected to one dummy trace DSL. The dummy trace DSL can include a first dummy trace DSL1, a second dummy trace DSL2, a third dummy trace DSL3, a fourth dummy trace DSL4, and a fifth dummy trace DSL5 that can be electrically connected to the first row sensing electrode RE1 to the fifth row sensing electrode RE5, respectively. Each of the first dummy trace DSL1 to the fifth dummy trace DSL5 can extend in the second direction DR2.

[0167] Figure 8 It is shown that all of the first dummy trace DSL1 to the fifth dummy trace DSL5 overlap with the sensing region SA. However, the present disclosure is not limited thereto. Alternatively, at least one of the first dummy trace DSL1 to the fifth dummy trace DSL5 can be arranged to overlap with the non-sensing region NSA.

[0168] The first dummy trace DSL1 can be arranged to correspond to the boundary opening T_BOP between the second column sensing electrode TE2 and the third column sensing electrode TE3 (see Figure 6 ), and the second dummy trace DSL2 can be arranged to correspond to the boundary opening T_BOP between the third column sensing electrode TE3 and the fourth column sensing electrode TE4. The third dummy trace DSL3 can be arranged to correspond to the boundary opening T_BOP between the fourth column sensing electrode TE4 and the fifth column sensing electrode TE5, and the fourth dummy trace DSL4 can be arranged to correspond to the boundary opening T_BOP between the fifth column sensing electrode TE5 and the sixth column sensing electrode TE6. The fifth dummy trace DSL5 can be arranged to correspond to the opening T_OP of the sixth column sensing electrode TE6 (see Figure 6 ).

[0169] The first dummy trace DSL1 to the fifth dummy trace DSL5 can be arranged below the first row sensing electrode RE1 to the fifth row sensing electrode RE5 in the third direction DR3. An insulating layer (e.g., the second sensor insulating layer IIL2) can be provided between the first dummy trace DSL1 to the fifth dummy trace DSL5 and the first row sensing electrode RE1 to the fifth row sensing electrode RE5 (see Figure 4 ).

[0170] The first row of sensing electrodes RE1 can be electrically connected to the first dummy trace DSL1 through the first dummy contact hole DCH1. As an example of the present disclosure, the first dummy contact hole DCH1 may include a first sub-dummy contact hole DCH1-1 and a second sub-dummy contact hole DCH1-2. The first sub-row of sensing electrodes RE1-1 of the first row of sensing electrodes RE1 can be electrically connected to the first dummy trace DSL1 through the first sub-dummy contact hole DCH1-1, and the second sub-row of sensing electrodes RE1-2 of the first row of sensing electrodes RE1 can be electrically connected to the first dummy trace DSL1 through the second sub-dummy contact hole DCH1-2.

[0171] The second row of sensing electrodes RE2 can be electrically connected to the second dummy trace DSL2 through the second dummy contact hole DCH2. As an example of the present disclosure, the second dummy contact hole DCH2 may include a third sub-dummy contact hole DCH2-1 and a fourth sub-dummy contact hole DCH2-2. The third sub-row of sensing electrodes RE2-1 of the second row of sensing electrodes RE2 can be electrically connected to the second dummy trace DSL2 through the third sub-dummy contact hole DCH2-1, and the fourth sub-row of sensing electrodes RE2-2 of the second row of sensing electrodes RE2 can be electrically connected to the second dummy trace DSL2 through the fourth sub-dummy contact hole DCH2-2.

[0172] The third row of sensing electrodes RE3 can be electrically connected to the third dummy trace DSL3 through the third dummy contact hole DCH3. As an example of the present disclosure, the third dummy contact hole DCH3 may include a fifth sub-dummy contact hole DCH3-1 and a sixth sub-dummy contact hole DCH3-2. The fifth sub-row of sensing electrodes RE3-1 of the third row of sensing electrodes RE3 can be electrically connected to the third dummy trace DSL3 through the fifth sub-dummy contact hole DCH3-1, and the sixth sub-row of sensing electrodes RE3-2 of the third row of sensing electrodes RE3 can be electrically connected to the third dummy trace DSL3 through the sixth sub-dummy contact hole DCH3-2.

[0173] The fourth row of sensing electrodes RE4 can be electrically connected to the fourth dummy trace DSL4 through the fourth dummy contact hole DCH4. As an example of the present disclosure, the fourth dummy contact hole DCH4 may include a seventh sub-dummy contact hole DCH4-1 and an eighth sub-dummy contact hole DCH4-2. The seventh sub-row of sensing electrodes RE4-1 of the fourth row of sensing electrodes RE4 can be electrically connected to the fourth dummy trace DSL4 through the seventh sub-dummy contact hole DCH4-1, and the eighth sub-row of sensing electrodes RE4-2 of the fourth row of sensing electrodes RE4 can be electrically connected to the fourth dummy trace DSL4 through the eighth sub-dummy contact hole DCH4-2.

[0174] The fifth row sensing electrode RE5 can be electrically connected to the fifth dummy trace DSL5 through the fifth dummy contact hole DCH5. As an example of the present disclosure, the fifth dummy contact hole DCH5 can include a ninth sub-dummy contact hole DCH5-1 and a tenth sub-dummy contact hole DCH5-2. The ninth sub-row sensing electrode RE5-1 of the fifth row sensing electrode RE5 can be electrically connected to the fifth dummy trace DSL5 through the ninth sub-dummy contact hole DCH5-1, and the tenth sub-row sensing electrode RE5-2 of the fifth row sensing electrode RE5 can be electrically connected to the fifth dummy trace DSL5 through the tenth sub-dummy contact hole DCH5-2.

[0175] The first sub-dummy contact hole DCH1-1 to the tenth sub-dummy contact hole DCH5-2 can be formed to pass through the second sensor insulating layer IIL2 (see Figure 4 ).

[0176] The sensing controller TIC can detect a touch input based on a received signal received through the first trace SL1 and a dummy received signal received through the dummy trace DSL. For example, the sensing controller TIC can identify a touch input as a normal touch only when both the received signal and the dummy received signal are different from a preset reference value. However, when only one of the received signal and the dummy received signal is different from the reference value, the sensing controller TIC can identify the touch input as an abnormal touch (e.g., ghost touch). In this way, the sensing controller TIC can also receive the dummy received signal through the dummy trace DSL, and thus can improve the sensing accuracy of the electronic device ELD (see Figure 1 ) for external inputs (especially touch inputs).

[0177] Figure 9 is a plan view of an input sensor including a first sub-sensing area and a second sub-sensing area according to an embodiment of the present disclosure.

[0178] Referring to Figure 9 , the input sensor ISPb can include a first sub-sensing area SA1, a second sub-sensing area SA2, and a non-sensing area NSA. The first sensing area SA1 and the second sub-sensing area SA2 can be arranged adjacent to each other in a first direction DR1.

[0179] The input sensor ISPb can include a plurality of first side row sensing electrodes L_RE, a plurality of first side column sensing electrodes L_TE, a plurality of second side row sensing electrodes R_RE, and a plurality of second side column sensing electrodes R_TE. The first side row sensing electrodes L_RE and the first side column sensing electrodes L_TE can be arranged in the first sub-sensing area SA1, and the second side row sensing electrodes R_RE and the second side column sensing electrodes R_TE can be arranged in the second sub-sensing area SA2. The first side row sensing electrodes L_RE can be spaced apart from the second side row sensing electrodes R_RE in the first direction DR1.

[0180] The first side row sensing electrode L_RE may include a first sub-row sensing electrode RE11-1 to a tenth sub-row sensing electrode RE15-2, and the second side row sensing electrode R_RE may include an eleventh sub-row sensing electrode RE21-1 to a twentieth sub-row sensing electrode RE25-2. The first sub-row sensing electrode RE11-1 to the tenth sub-row sensing electrode RE15-2 may extend in a first direction DR1 and may be arranged in a second direction DR2. The first sub-row sensing electrode RE11-1 and the second sub-row sensing electrode RE11-2 may be electrically connected to each other through a first connection electrode RCL1-1, and the third sub-row sensing electrode RE12-1 and the fourth sub-row sensing electrode RE12-2 may be electrically connected to each other through a second connection electrode RCL1-2. The fifth sub-row sensing electrode RE13-1 and the sixth sub-row sensing electrode RE13-2 may be electrically connected to each other through a third connection electrode RCL1-3, and the seventh sub-row sensing electrode RE14-1 and the eighth sub-row sensing electrode RE14-2 may be electrically connected to each other through a fourth connection electrode RCL1-4. The ninth sub-row sensing electrode RE15-1 and the tenth sub-row sensing electrode RE15-2 may be electrically connected to each other through a fifth connection electrode RCL1-5, and the eleventh sub-row sensing electrode RE21-1 and the twelfth sub-row sensing electrode RE22-2 may be electrically connected to each other through a sixth connection electrode RCL2-1. The thirteenth sub-row sensing electrode RE22-1 and the fourteenth sub-row sensing electrode RE22-2 may be electrically connected to each other through a seventh connection electrode RCL2-2, and the fifteenth sub-row sensing electrode RE23-1 and the sixteenth sub-row sensing electrode RE23-2 may be electrically connected to each other through an eighth connection electrode RCL2-3. The seventeenth sub-row sensing electrode RE24-1 and the eighteenth sub-row sensing electrode RE24-2 may be electrically connected to each other through a ninth connection electrode RCL2-4, and the nineteenth sub-row sensing electrode RE25-1 and the twentieth sub-row sensing electrode RE25-2 may be electrically connected to each other through a tenth connection electrode RCL2-5.

[0181] The first side column sensing electrode L_TE includes a first column sensing electrode TE1 to a fourth column sensing electrode TE4, and the second side column sensing electrode R_TE includes a fifth column sensing electrode TE5 to an eighth column sensing electrode TE8. The first column sensing electrode TE1 to the eighth column sensing electrode TE8 may extend in a second direction DR2 and may be arranged in a first direction DR1. An opening T_OP (see Figure 6 ) extending in the second direction DR2 may be defined in each of the first column sensing electrode TE1 to the eighth column sensing electrode TE8, and a boundary opening T_BOP (see Figure 6)It can be limited between two column sensing electrodes spaced apart from each other among the first column sensing electrode TE1 to the eighth column sensing electrode TE8. The first column sensing electrode TE1 to the fourth column sensing electrode TE4 are respectively electrically connected to the first sensing controller TIC1 through the 2-1 trace SL2-1 to the 2-4 trace SL2-4, and the fifth column sensing electrode TE5 to the eighth column sensing electrode TE8 are respectively electrically connected to the second sensing controller TIC2 through the 2-5 trace SL2-5 to the 2-8 trace SL2-8.

[0182] The first sensing controller TIC1 and the second sensing controller TIC2 can be arranged in the non-sensing area NSA. As an example of the present disclosure, the first sensing controller TIC1 can be electrically connected to the first side row sensing electrode L_RE and the first side column sensing electrode L_TE, and the second sensing controller TIC2 can be electrically connected to the second side row sensing electrode R_RE and the second side column sensing electrode R_TE.

[0183] The first side row sensing electrode L_RE can be electrically connected to the first sensing controller TIC1 through the 1-1 side traces SL11-1 to SL11-5, and the second side row sensing electrode R_RE can be electrically connected to the second sensing controller TIC2 through the 1-2 side traces SL12-1 to SL12-5. The 1-1 side traces SL11-1 to SL11-5 overlap with the first sub-sensing area SA1, and the 1-2 side traces SL12-1 to SL12-5 overlap with the second sub-sensing area SA2.

[0184] The 1-1 side traces SL11-1 to SL11-5 can be arranged to correspond (or overlap) with the opening T_OP defined inside the column sensing electrodes of the first side column sensing electrode L_TE or the boundary opening T_BOP between two column sensing electrodes spaced apart from each other among the column sensing electrodes of the first side column sensing electrode L_TE in the first sub-sensing area SA1. The 1-2 side traces SL12-1 to SL12-5 can be arranged to correspond (or overlap) with the opening T_OP defined inside the column sensing electrodes of the second side column sensing electrode R_TE or the boundary opening T_BOP between two column sensing electrodes spaced apart from each other among the column sensing electrodes of the second side column sensing electrode R_TE in the second sub-sensing area SA2.

[0185] Figure 10 is a plan view of an input sensor including a first sub-sensing area to a fourth sub-sensing area according to an embodiment of the present disclosure. Figure 11A is a view showing Figure 10 an enlarged plan view of a part CC of the input sensor shown in Figure 11B and Figure 11A is a schematic cross-sectional view along the cutting line II-II' shown in

[0186] Reference Figure 10 The input sensor ISPc may include a first sub-sensing region SA1, a second sub-sensing region SA2, a third sub-sensing region SA3, a fourth sub-sensing region SA4, and a non-sensing region NSA. The first sub-sensing region SA1 and the second sub-sensing region SA2 may be arranged adjacent to each other in a first direction DR1, and the third sub-sensing region SA3 and the fourth sub-sensing region SA4 may be arranged adjacent to each other in the first direction DR1. The first sub-sensing region SA1 and the third sub-sensing region SA3 may be arranged adjacent to each other in a second direction DR2, and the second sub-sensing region SA2 and the fourth sub-sensing region SA4 may be arranged adjacent to each other in the second direction DR2.

[0187] The input sensor ISPc may include a plurality of first-1 side row sensing electrodes L_RE1, a plurality of first-1 side column sensing electrodes L_TE1, a plurality of second-1 side row sensing electrodes R_RE1, a plurality of second-1 side column sensing electrodes R_TE1, a plurality of first-2 side row sensing electrodes L_RE2, a plurality of first-2 side column sensing electrodes L_TE2, a plurality of second-2 side row sensing electrodes R_RE2, and a plurality of second-2 side column sensing electrodes R_TE2. The first-1 side row sensing electrodes L_RE1 and the first-1 side column sensing electrodes L_TE1 may be arranged in the first sub-sensing region SA1, and the second-1 side row sensing electrodes R_RE1 and the second-1 side column sensing electrodes R_TE1 may be arranged in the second sub-sensing region SA2. The first-2 side row sensing electrodes L_RE2 and the first-2 side column sensing electrodes L_TE2 may be arranged in the third sub-sensing region SA3, and the second-2 side row sensing electrodes R_RE2 and the second-2 side column sensing electrodes R_TE2 may be arranged in the fourth sub-sensing region SA4.

[0188] The first-1 side row sensing electrodes L_RE1 include first sub-row sensing electrodes RE11-1 to sixth sub-row sensing electrodes RE13-2 and a first connection electrode RCL1-1, a second connection electrode RCL1-2, and a third connection electrode RCL1-3, and the first-2 side row sensing electrodes L_RE2 include seventh sub-row sensing electrodes RE14-1 to twelfth sub-row sensing electrodes RE16-2 and a fourth connection electrode RCL1-4, a fifth connection electrode RCL1-5, and a sixth connection electrode RCL1-6. The second-1 side row sensing electrodes R_RE1 include thirteenth sub-row sensing electrodes RE21-1 to eighteenth row sensing electrodes RE23-2 and a seventh connection electrode RCL2-1, an eighth connection electrode RCL2-2, and a ninth connection electrode RCL2-3, and the second-2 side row sensing electrodes R_RE2 include nineteenth sub-row sensing electrodes RE24-1 to twenty-fourth sub-row sensing electrodes RE26-2 and a tenth connection electrode RCL2-4, an eleventh connection electrode RCL2-5, and a twelfth connection electrode RCL2-6.

[0189] The first sub-row sensing electrodes RE11-1 to the twenty-fourth sub-row sensing electrodes RE26-2 may extend in a first direction DR1 and may be arranged in a second direction DR2.

[0190] The 1-1 side column sensing electrodes L_TE1 include the first column sensing electrodes TE11 to the fourth column sensing electrodes TE14, and the 2-1 side column sensing electrodes R_TE1 include the fifth column sensing electrodes TE15 to the eighth column sensing electrodes TE18. The 1-2 side column sensing electrodes L_TE2 include the ninth column sensing electrodes TE21 to the twelfth column sensing electrodes TE24, and the 2-2 side column sensing electrodes R_TE2 include the thirteenth column sensing electrodes TE25 to the sixteenth column sensing electrodes TE28.

[0191] The first column sensing electrodes TE11 to the eighth column sensing electrodes TE18 and the ninth column sensing electrodes TE21 to the sixteenth column sensing electrodes TE28 may extend in the second direction DR2 and may be arranged in the first direction DR1. An opening T_OP (see Figure 6 ) extending in the second direction DR2 may be defined in each of the first column sensing electrodes TE11 to the eighth column sensing electrodes TE18 and the ninth column sensing electrodes TE21 to the sixteenth column sensing electrodes TE28, and a boundary opening T_BOP (see Figure 6 ) may be defined between two column sensing electrodes spaced apart from each other among the first column sensing electrodes TE11 to the eighth column sensing electrodes TE18 and the ninth column sensing electrodes TE21 to the sixteenth column sensing electrodes TE28.

[0192] A first sensing controller TIC1 and a second sensing controller TIC2 (see Figure 9 ) may be provided in a non-sensing area NSA. As an example of the present disclosure, the first sensing controller TIC1 may be electrically connected to the 1-1 side row sensing electrodes L_RE1, the 1-2 side row sensing electrodes L_RE2, the 1-1 side column sensing electrodes L_TE1, and the 1-2 side column sensing electrodes L_TE2. The second sensing controller TIC2 may be electrically connected to the 2-1 side row sensing electrodes R_RE1, the 2-2 side row sensing electrodes R_RE2, the 2-1 side column sensing electrodes R_TE1, and the 2-2 side column sensing electrodes R_TE2.

[0193] The first side row sensing electrodes L_RE1 and the second side row sensing electrodes L_RE2 can be electrically connected to the first sensing controller TIC1 through the first side traces SL11-1 to SL11-6. The second side row sensing electrodes R_RE1 and the second side row sensing electrodes R_RE2 can be electrically connected to the second sensing controller TIC2 through the second side traces SL12-1 to SL12-6. The first side traces SL11-1 to SL11-6 can overlap with the first sub-sensing region SA1 and the third sub-sensing region SA3, and the second side traces SL12-1 to SL12-6 can overlap with the second sub-sensing region SA2 and the fourth sub-sensing region SA4.

[0194] The first side traces SL11-1 to SL11-6 can be arranged to correspond (or overlap) with an opening T_OP (see Figure 6 ) defined inside the column sensing electrodes of the first side column sensing electrodes L_TE1 or a boundary opening T_BOP (see Figure 6 ) between two column sensing electrodes spaced apart from each other of the first side column sensing electrodes L_TE1 in the first sub-sensing region SA1. The first side traces SL11-1 to SL11-6 can be arranged to correspond (or overlap) with an opening T_OP defined inside the column sensing electrodes of the second side column sensing electrodes L_TE2 or a boundary opening T_BOP between two column sensing electrodes spaced apart from each other of the second side column sensing electrodes L_TE2 in the third sub-sensing region SA3.

[0195] The second side traces SL12-1 to SL12-6 can be arranged to correspond (or overlap) with an opening T_OP defined inside the column sensing electrodes of the first side column sensing electrodes R_TE1 or a boundary opening T_BOP between two column sensing electrodes spaced apart from each other of the first side column sensing electrodes R_TE1 in the second sub-sensing region SA2. The second side traces SL12-1 to SL12-6 can be arranged to correspond (or overlap) with an opening T_OP defined inside the column sensing electrodes of the second side column sensing electrodes R_TE2 or a boundary opening T_BOP between two column sensing electrodes spaced apart from each other of the second side column sensing electrodes R_TE2 in the fourth sub-sensing region SA4.

[0196] The first - first side - column sensing electrodes L_TE1 can be electrically connected to the first sensing controller TIC1 through the second - first traces SL21 - 1 to the second - fourth traces SL21 - 4. The second - first side - column sensing electrodes R_TE1 can be electrically connected to the second sensing controller TIC2 through the second - fifth traces SL21 - 5 to the second - eighth traces SL21 - 8. The first - second side - column sensing electrodes L_TE2 can be electrically connected to the first sensing controller TIC1 through the second - ninth traces SL22 - 1 to the second - twelfth traces SL22 - 4. The second - second side - column sensing electrodes R_TE2 can be electrically connected to the second sensing controller TIC2 through the second - thirteenth traces SL22 - 5 to the second - sixteenth traces SL22 - 8. The second - first traces SL21 - 1 to the second - fourth traces SL21 - 4 can be referred to as the second - first side traces, and the second - fifth traces SL21 - 5 to the second - eighth traces SL21 - 8 can be referred to as the second - second side traces. The second - ninth traces SL22 - 1 to the second - twelfth traces SL22 - 4 can be referred to as the second - third side traces, and the second - thirteenth traces SL22 - 5 to the second - sixteenth traces SL22 - 8 can be referred to as the second - fourth side traces.

[0197] The second - first traces SL21 - 1 to the second - eighth traces SL21 - 8 can be electrically connected to the first - column sensing electrodes TE11 to the eighth - column sensing electrodes TE18 respectively, and the second - ninth traces SL22 - 1 to the second - sixteenth traces SL22 - 8 can be electrically connected to the ninth - column sensing electrodes TE21 to the sixteenth - column sensing electrodes TE28 respectively. The second - first traces SL21 - 1 to the second - eighth traces SL21 - 8 can be arranged in the non - sensing area NSA and do not overlap with the first sub - sensing area SA1 and the second sub - sensing area SA2. The second - ninth traces SL22 - 1 to the second - sixteenth traces SL22 - 8 overlap with the non - sensing area NSA and the first sub - sensing area SA1 and the second sub - sensing area SA2.

[0198] Trace lines 2-9 SL22-1 to 2-12 SL22-4 can extend to the third sub-sensing area SA3 via the non-sensing area NSA and the first sub-sensing area SA1. Trace lines 2-13 SL22-5 to 2-16 SL22-8 can extend to the fourth sub-sensing area SA4 via the non-sensing area NSA and the second sub-sensing area SA2. In the present disclosure, trace lines 2-9 SL22-1 to 2-12 SL22-4 can overlap with the first column of sensing electrodes TE11 to the fourth column of sensing electrodes TE14 arranged in the first sub-sensing area SA1. Trace lines 2-13 SL22-5 to 2-16 SL22-8 can overlap with the fifth column of sensing electrodes TE15 to the eighth column of sensing electrodes TE18 arranged in the second sub-sensing area SA2. Each of trace lines 2-9 SL22-1 to 2-16 SL22-8 can include a first line portion LP1 and a second line portion LP2. The first line portion LP1 and the second line portion LP2 can be electrically connected to each other and can be arranged in different layers.

[0199] Referring Figure 10 , Figure 11A and Figure 11B , trace line 2-9 SL22-1 overlaps with the first column of sensing electrodes TE11 arranged in the first sub-sensing area SA1 and can be electrically connected to the ninth column of sensing electrodes TE21 in the third sub-sensing area SA3 through the contact hole TCNT. The first line portion LP1 of trace line 2-9 SL22-1 can be arranged below the first column of sensing electrodes TE11 and the ninth column of sensing electrodes TE21 in the third direction DR3. The first line portion LP1 of trace line 2-9 SL22-1 and the 1-1 side trace lines SL11-1 to SL11-6 can be arranged on the same insulating layer (e.g., the first sensor insulating layer IIL1).

[0200] The first line portion LP1 of trace line 2-9 SL22-1 and the 1-1 side trace lines SL11-1 to SL11-6 can be covered by the second sensor insulating layer IIL2. The second line portion LP2 of trace line 2-9 SL22-1 and the first column of sensing electrodes TE11 and the ninth column of sensing electrodes TE21 can be arranged on the second sensor insulating layer IIL2. The second sensor insulating layer IIL2 can be provided with a first line contact hole BCNT1 and a second line contact hole BCNT2 through which the first line portion LP1 of trace line 2-9 SL22-1 can be exposed. The second line portion LP2 of trace line 2-9 SL22-1 can be electrically connected to the first line portion LP1 of trace line 2-9 SL22-1 through the first line contact hole BCNT1 and the second line contact hole BCNT2.

[0201] The first column sensing electrodes TE11 may be provided with line opening portions TE-OP corresponding to second line portions LP2 of the 2nd - 9th traces SL22-1. The first column sensing electrodes TE11 and the second line portions LP2 of the 2nd - 9th traces SL22-1 are spaced apart from each other through the line opening portions TE-OP. Accordingly, even when the first column sensing electrodes TE11 and the second line portions LP2 are arranged in the same layer, the first column sensing electrodes TE11 and the second line portions LP2 of the 2nd - 9th traces SL22-1 may be electrically isolated from each other.

[0202] Figure 10 Structures in which the 2nd - 9th traces SL22-1 to the 2nd - 16th traces SL22-8 overlap with the first sub-sensing region SA1 or the second sub-sensing region SA2 are illustratively shown, but the present disclosure is not limited thereto. For example, the 2nd - 9th traces SL22-1 to the 2nd - 16th traces SL22-8 may not overlap with the first sub-sensing region SA1 or the second sub-sensing region SA2 and may be arranged only in the non-sensing region NSA. However, when the 2nd - 9th traces SL22-1 to the 2nd - 16th traces SL22-8 are arranged to overlap with the first sub-sensing region SA1 or the second sub-sensing region SA2, the width of the non-sensing region NSA may be reduced, and as a result, the border width (i.e., the peripheral region NAA) of the electronic device ELD (see Figure 1 ) (see Figure 1 ) may be reduced as a whole.

[0203] Figure 12 is a plan view showing row sensing electrodes driven by a differential driving method according to an embodiment of the present disclosure. Figure 13A is a view showing Figure 12 an enlarged plan view of a part EE of the input sensor shown in Figure 13B is a schematic cross-sectional view taken along the cutting line III-III' shown in Figure 13A .

[0204] Referring to Figures 12 to 13B , the input sensor ISPd may include first-stage sensing electrodes SME11, SME21, SME31, SME41, and SME51, second-stage sensing electrodes SME12, SME22, SME32, SME42, and SME52, and column sensing electrodes TE1 to TE6.

[0205] Each of the column sensing electrodes TE1 to TE6 may extend in the second direction DR2. The column sensing electrodes TE1 to TE6 may be spaced apart from each other in the first direction DR1. For example, the column sensing electrodes TE1 to TE6 may include first column sensing electrodes TE1 to sixth column sensing electrodes TE6. Figure 12The number of column sensing electrodes TE1 to TE6 shown may be six, but the number of column sensing electrodes TE1 to TE6 is not limited thereto.

[0206] Each of the first column sensing electrode TE1 to the sixth column sensing electrode TE6 may include opening portions T_OP1 and T_OP2 extending in the second direction DR2. A boundary opening portion T_BOP may be defined between two column sensing electrodes spaced apart from each other among the first column sensing electrode TE1 to the sixth column sensing electrode TE6. For convenience of description, among the first column sensing electrode TE1 to the sixth column sensing electrode TE6, the opening portion defined in each of the odd-numbered column sensing electrodes TE1, TE3, and TE5 may be referred to as a first opening portion T_OP1, and the opening portion defined in each of the even-numbered column sensing electrodes TE2, TE4, and TE6 may be referred to as a second opening portion T_OP2.

[0207] The first-stage sensing electrodes SME11, SME21, SME31, SME41, and SME51 include a 1-1 stage sensing electrode SME11, a 1-2 stage sensing electrode SME21, a 1-3 stage sensing electrode SME31, a 1-4 stage sensing electrode SME41, and a 1-5 stage sensing electrode SME51. The second-stage sensing electrodes SME12, SME22, SME32, SME42, and SME52 include a 2-1 stage sensing electrode SME12, a 2-2 stage sensing electrode SME22, a 2-3 stage sensing electrode SME32, a 2-4 stage sensing electrode SME42, and a 2-5 stage sensing electrode SME52.

[0208] Each of the 1-1 stage sensing electrode SME11 to the 1-5 stage sensing electrode SME51 may include a plurality of first sub-stage sensing electrodes (or first sub-stage electrodes) S_SME1 spaced apart from each other in the first direction DR1 and the second direction DR2. Figure 12 Illustratively, six first sub-stage sensing electrodes S_SME1 are shown, but the present disclosure is not limited thereto. For example, each of the 1-1 stage sensing electrode SME11 to the 1-5 stage sensing electrode SME51 may include two first sub-stage sensing electrodes S_SME1 spaced apart in the second direction DR2. The first sub-stage sensing electrodes S_SME1 may be electrically connected to each other through a first sub-bridging electrode SBE1. Each of the first sub-stage sensing electrodes S_SME1 may have a rectangular shape including two horizontal sides parallel to the first direction DR1 and two vertical sides parallel to the second direction DR2.

[0209] Each of the 2-1 stage sensing electrode SME12 to the 2-5 stage sensing electrode SME52 may include a plurality of second sub-stage sensing electrodes (or second sub-stage electrodes) S_SME2 spaced apart from each other in the first direction DR1 and the second direction DR2.Figure 12 Six second sub-segment sensing electrodes S_SME2 are illustratively shown, but the present disclosure is not limited thereto. For example, each of the 2-1 segment sensing electrode SME12 to the 2-5 segment sensing electrode SME52 may include two second sub-segment sensing electrodes S_SME2 spaced apart from each other in the second direction DR2. The second sub-segment sensing electrodes S_SME2 may be electrically connected to each other through the second sub-bridging electrodes SBE2. Each of the second sub-segment sensing electrodes S_SME2 may have a rectangular shape including two horizontal sides parallel to the first direction DR1 and two vertical sides parallel to the second direction DR2.

[0210] In the first row, the 1-1 segment sensing electrode SME11 and the 2-1 segment sensing electrode SME12 may be alternately arranged in the first direction DR1, and in the second row, the 1-2 segment sensing electrode SME21 and the 2-2 segment sensing electrode SME22 may be alternately arranged in the first direction DR1. In the third row, the 1-3 segment sensing electrode SME31 and the 2-3 segment sensing electrode SME32 may be alternately arranged in the first direction DR1, and in the fourth row, the 1-4 segment sensing electrode SME41 and the 2-4 segment sensing electrode SME42 may be alternately arranged in the first direction DR1. In the fifth row, the 1-5 segment sensing electrode SME51 and the 2-5 segment sensing electrode SME52 may be alternately arranged in the first direction DR1. As an example of the present disclosure, the 1-1 segment sensing electrode SME11 to the 1-5 segment sensing electrode SME51 may be arranged to correspond to the first opening T_OP1 of the odd-numbered column sensing electrodes TE1, TE3, and TE5, and the 2-1 segment sensing electrode SME12 to the 2-5 segment sensing electrode SME52 may be arranged to correspond to the second opening T_OP2 of the even-numbered column sensing electrodes TE2, TE4, and TE6.

[0211] The input sensor ISPd may further include a 1-1 connection wiring SCL11 electrically connected to the 1-1 segment sensing electrode SME11 and a 2-1 connection wiring SCL12 electrically connected to the 2-1 segment sensing electrode SME12. The input sensor ISPd may further include a 1-2 connection wiring SCL21 electrically connected to the 1-2 segment sensing electrode SME21 and a 2-2 connection wiring SCL22 electrically connected to the 2-2 segment sensing electrode SME22.

[0212] The input sensor ISPd may further include a first to third connection wiring SCL31 electrically connecting the first to third segment sensing electrodes SME31 and a second to third connection wiring SCL32 electrically connecting the second to third segment sensing electrodes SME32. The input sensor ISPd may further include a first to fourth connection wiring SCL41 electrically connecting the first to fourth segment sensing electrodes SME41 and a second to fourth connection wiring SCL42 electrically connecting the second to fourth segment sensing electrodes SME42. The input sensor ISPd may further include a first to fifth connection wiring SCL51 electrically connecting the first to fifth segment sensing electrodes SME51 and a second to fifth connection wiring SCL52 electrically connecting the second to fifth segment sensing electrodes SME52.

[0213] The first to first segment sensing electrodes SME11 to the first to fifth segment sensing electrodes SME51 may be electrically connected to the first to first connection wiring SCL11 to the first to fifth connection wiring SCL51 respectively through a first connection contact hole CCH1, and the second to first segment sensing electrodes SME12 to the second to fifth segment sensing electrodes SME52 may be electrically connected to the second to first connection wiring SCL12 to the second to fifth connection wiring SCL52 respectively through a second connection contact hole CCH2. The first to first connection wiring SCL11 to the first to fifth connection wiring SCL51 may extend in a first direction DR1, and the second to first connection wiring SCL12 to the second to fifth connection wiring SCL52 may extend in the first direction DR1. The first to first connection wiring SCL11 to the first to fifth connection wiring SCL51 and the second to first connection wiring SCL12 to the second to fifth connection wiring SCL52 may be spaced apart from each other in a second direction DR2.

[0214] The input sensor ISPd may further include a first trace electrically connected to the first segment sensing electrodes SME11, SME21, SME31, SME41, and SME51 and a second trace electrically connected to the second segment sensing electrodes SME12, SME22, SME32, SME42, and SME52. As an example of the present disclosure, the first trace includes a first to first segment trace to a first to fifth segment trace, and the second trace may include a second to first segment trace to a second to fifth segment trace. However, for convenience of description, Figure 12 the first to third segment trace SSL31, the first to fourth segment trace SSL41, and the first to fifth segment trace SSL51 among the first to first segment trace to the first to fifth segment trace and the second to third segment trace SSL32, the second to fourth segment trace SSL42, and the second to fifth segment trace SSL52 among the second to first segment trace to the second to fifth segment trace are shown.

[0215] The first to third trace lines SSL31, the first to fourth trace lines SSL41, and the first to fifth trace lines SSL51, as well as the second to third trace lines SSL32, the second to fourth trace lines SSL42, and the second to fifth trace lines SSL52, may extend in the second direction DR2. The first to third trace lines SSL31, the first to fourth trace lines SSL41, and the first to fifth trace lines SSL51, as well as the second to third trace lines SSL32, the second to fourth trace lines SSL42, and the second to fifth trace lines SSL52, may be arranged in the sensing region SA. As an example of the present disclosure, the first to third trace lines SSL31, the first to fourth trace lines SSL41, and the first to fifth trace lines SSL51 may be arranged to correspond to the first openings T_OP1 of the odd-numbered sensing electrodes TE1, TE3, and TE5, and the second to third trace lines SSL32, the second to fourth trace lines SSL42, and the second to fifth trace lines SSL52 may be arranged to correspond to the second openings T_OP2 of the even-numbered sensing electrodes TE2, TE4, and TE6.

[0216] The first to third trace line SSL31 may be electrically connected to one of the first to third segment sensing electrodes SME31 through the first to third segment contact hole SCH31. The first to third trace line SSL31 may be electrically connected to the other of the first to third segment sensing electrodes SME31 through the first to third connection wiring SCL31. The second to third trace line SSL32 may be electrically connected to one of the second to third segment sensing electrodes SME32 through the second to third segment contact hole SCH32. The second to third trace line SSL32 may be electrically connected to the other of the second to third segment sensing electrodes SME32 through the second to third connection wiring SCL32.

[0217] The first to fourth trace line SSL41 may be electrically connected to one of the first to fourth segment sensing electrodes SME41 through the first to fourth segment contact hole SCH41. The first to fourth trace line SSL41 may be electrically connected to the other of the first to fourth segment sensing electrodes SME41 through the first to fourth connection wiring SCL41. The second to fourth trace line SSL42 may be electrically connected to one of the second to fourth segment sensing electrodes SME42 through the second to fourth segment contact hole SCH42. The second to fourth trace line SSL42 may be electrically connected to the other of the second to fourth segment sensing electrodes SME42 through the second to fourth connection wiring SCL42.

[0218] The 1st - 5th segment traces SSL51 can be electrically connected to one of the 1st - 5th segment sensing electrodes SME51 through the 1st - 5th segment contact holes SCH51. The 1st - 5th segment traces SSL51 can be electrically connected to the other of the 1st - 5th segment sensing electrodes SME51 through the 1st - 5th connection wirings SCL51. The 2nd - 5th segment traces SSL52 can be electrically connected to one of the 2nd - 5th segment sensing electrodes SME52 through the 2nd - 5th segment contact holes SCH52. The 2nd - 5th segment traces SSL52 can be electrically connected to the other of the 2nd - 5th segment sensing electrodes SME52 through the 2nd - 5th connection wirings SCL52.

[0219] Alternatively, some of the first - segment traces and some of the second - segment traces can be arranged to correspond to the boundary opening T_BOP.

[0220] Each of the first - segment trace and the second - segment trace can include an intersecting portion and a non - intersecting portion. The intersecting portion can be the portion that intersects with the 1st - 1 connection wiring SCL11 to the 1st - 5 connection wiring SCL51 and the 2nd - 1 connection wiring SCL12 to the 2nd - 5 connection wiring SCL52, and the non - intersecting portion can be the portion that does not intersect with the 1st - 1 connection wiring SCL11 to the 1st - 5 connection wiring SCL51 and the 2nd - 1 connection wiring SCL12 to the 2nd - 5 connection wiring SCL52. As Figure 13A shown, as an example of the present disclosure, the intersecting portion SLP2 of the 1st - 5th segment trace SSL51 can intersect with the 1st - 5 connection wiring SCL51 and the 2nd - 4 connection wiring SCL42, and the intersecting portion SLP2 of the 2nd - 5th segment trace SSL52 can intersect with the 1st - 5 connection wiring SCL51 and the 2nd - 4 connection wiring SCL42. The non - intersecting portion SLP1 of the 1st - 5th segment trace SSL51 and the non - intersecting portion SLP1 of the 2nd - 5th segment trace SSL52 can be the portions that do not intersect with the 1st - 5 connection wiring SCL51 and the 2nd - 4 connection wiring SCL42.

[0221] The intersection portion of each trace line can be provided on a layer different from the layer of the non-intersection portion. The non-intersection portions of the first trace line and the second trace line, the 1-1 connection wirings SCL11 to 1-5 connection wirings SCL51, and the 2-1 connection wirings SCL12 to 2-5 connection wirings SCL52 can be arranged on the same layer (e.g., the first sensor insulating layer IIL1). The intersection portion of the first trace line and the second trace line and the first sensing electrode and the second sensing electrode can be arranged on the same layer (e.g., the second sensor insulating layer IIL2). For example, the intersection portion SLP2 of the 2-5 trace line SSL52 can be arranged on the second sensor insulating layer IIL2, and the second sensor insulating layer IIL2 can be provided with a third wire contact hole BCNT3 and a fourth wire contact hole BCNT4 through which the non-intersection portion SLP1 of the 2-5 trace line SSL52 can be exposed. Therefore, the intersection portion SLP2 of the 2-5 trace line SSL52 can be electrically connected to the non-intersection portion SLP1 of the 2-5 trace line SSL52 through the third wire contact hole BCNT3 and the fourth wire contact hole BCNT4.

[0222] Therefore, even when the trace line intersects with the 1-1 connection wirings SCL11 to 1-5 connection wirings SCL51 and the 2-1 connection wirings SCL12 to 2-5 connection wirings SCL52, the trace line may not be electrically connected to the 1-1 connection wirings SCL11 to 1-5 connection wirings SCL51 and the 2-1 connection wirings SCL12 to 2-5 connection wirings SCL52 at the intersection portion.

[0223] The sensing controller TIC (see Figure 5 ) can include a plurality of differential amplifiers. As an example of the present disclosure, the sensing controller TIC can include five differential amplifiers (i.e., the first differential amplifier to the fifth differential amplifier). Figure 12 Illustratively, only three of the five differential amplifiers are shown (i.e., the third differential amplifier DAMP3, the fourth differential amplifier DAMP4, and the fifth differential amplifier DAMP5). The 1-3 trace line SSL31, the 1-4 trace line SSL41, and the 1-5 trace line SSL51 can be electrically connected to the first terminals (e.g., negative terminals) of the third differential amplifier DAMP3, the fourth differential amplifier DAMP4, and the fifth differential amplifier DAMP5, respectively. The 2-3 trace line SSL32, the 2-4 trace line SSL42, and the 2-5 trace line SSL52 can be electrically connected to the second terminals (e.g., positive terminals) of the third differential amplifier DAMP3, the fourth differential amplifier DAMP4, and the fifth differential amplifier DAMP5, respectively.

[0224] The signal input to the first terminal of each of the third differential amplifier DAMP3, the fourth differential amplifier DAMP4, and the fifth differential amplifier DAMP5 may be referred to as a first received signal, and the signal input to the second terminal of each of the third differential amplifier DAMP3, the fourth differential amplifier DAMP4, and the fifth differential amplifier DAMP5 may be referred to as a second received signal. Each of the third differential amplifier DAMP3, the fourth differential amplifier DAMP4, and the fifth differential amplifier DAMP5 may generate a difference between the first received signal and the second received signal as an output signal. The sensing controller TIC (see Figure 5 ) may use the difference between the first received signal and the second received signal to obtain touch information in the sensing area SA.

[0225] The first-stage sensing electrodes SME11, SME21, SME31, SME41, and SME51 and the second-stage sensing electrodes SME12, SME22, SME32, SME42, and SME52 may be alternately arranged in a row, and the first-stage sensing electrodes SME11, SME21, SME31, SME41, and SME51 and the second-stage sensing electrodes SME12, SME22, SME32, SME42, and SME52 may provide signals sensed at the positions (i.e., the first received signal and the second received signal) to the corresponding differential amplifiers. The sensing controller TIC may compensate the touch detection signal based on the difference between the first received signal and the second received signal received through the differential amplifiers DAMP3, DAMP4, and DAMP5, and as a result, noise included in the first received signal or the second received signal may be removed by the other received signal. Accordingly, the signal-to-noise ratio may be increased, and the overall sensing sensitivity of the input sensor ISPd may be improved.

[0226] Figure 14 is a plan view showing column sensing electrodes driven by a differential driving method according to an embodiment of the present disclosure. Figure 14 shown in Figure 12 The components that may be the same as the components shown in may be identified by the same reference numerals / symbols, and thus additional descriptions will be omitted to avoid redundancy.

[0227] Referring to Figure 14 , the input sensor ISPd may include first-stage sensing electrodes SME11, SME21, SME31, SME41, and SME51, second-stage sensing electrodes SME12, SME22, SME32, SME42, and SME52, and column sensing electrodes TE1 to TE6.

[0228] Each of the column sensing electrodes TE1 to TE6 may extend in the second direction DR2. The column sensing electrodes TE1 to TE6 may be spaced apart from each other in the first direction DR1. For example, the column sensing electrodes TE1 to TE6 may include a first column sensing electrode TE1 to a sixth column sensing electrode TE6.

[0229] The first transmission signal TS1, the second transmission signal TS2, the third transmission signal TS3, the fourth transmission signal TS4, the fifth transmission signal TS5, and the sixth transmission signal TS6 may be applied to the first column sensing electrode TE1 to the sixth column sensing electrode TE6, respectively. The first transmission signal TS1 to the sixth transmission signal TS6 may be applied to the first column sensing electrode TE1 to the sixth column sensing electrode TE6 simultaneously (i.e., at the same time). Alternatively, in the first scan cycle, the first transmission signal TS1 and the second transmission signal TS2 may be applied to the first column sensing electrode TE1 and the second column sensing electrode TE2 simultaneously, respectively, and in the second scan cycle, the third transmission signal TS3 and the fourth transmission signal TS4 may be applied to the third column sensing electrode TE3 and the fourth column sensing electrode TE4 simultaneously, respectively.

[0230] As an example of the present disclosure, among the first transmission signal TS1 to the sixth transmission signal TS6, two transmission signals applied to two adjacent column sensing electrodes may have opposite phases to each other. For example, the first transmission signal TS1, the third transmission signal TS3, and the fifth transmission signal TS5 applied to the odd column sensing electrodes TE1, TE3, and TE5 may have a phase swing opposite to the phases of the second transmission signal TS2, the fourth transmission signal TS4, and the sixth transmission signal TS6 applied to the even column sensing electrodes TE2, TE4, and TE6. The first transmission signal TS1, the third transmission signal TS3, and the fifth transmission signal TS5 may have the same phase, and the second transmission signal TS2, the fourth transmission signal TS4, and the sixth transmission signal TS6 may have the same phase.

[0231] In the case where the first transmission signal TS1 to the sixth transmission signal TS6 having opposite phases are supplied to the first column sensing electrode TE1 to the sixth column sensing electrode TE6, even when a ripple appears in the potential of the second electrode CE due to the parasitic capacitance between the input sensor ISP and the second electrode CE (see Figure 4 ), the ripple may be canceled. Therefore, the flicker caused by the parasitic capacitance can be removed, and as a result, in the case of sensing an external input, the deterioration of the display quality of the display panel DP (see Figure 4 ) caused by the parasitic capacitance can be improved.

[0232] Figure 15 is a magnified plan view showing a partial FF of the input sensor shown in Figure 6 shown therein.Figure 16 is a schematic cross-sectional view along the cutting line IV-IV' shown in Figure 15 .

[0233] Referring to Figure 15 and Figure 16 , each of the row sensing electrodes RE may include a plurality of grid lines intersecting each other and may have a grid shape in which a plurality of grid openings M_OP1, M_OP2, and M_OP3 are defined by the grid lines. The grid openings M_OP1, M_OP2, and M_OP3 may correspond to the light emitting regions R-PXA, G-PXA, and B-PXA of each of the pixels provided in the display panel DP (see Figure 4 ).

[0234] As an example of the present disclosure, the grid openings M_OP1, M_OP2, and M_OP3 may include three grid openings having different sizes (i.e., a first grid opening M_OP1, a second grid opening M_OP2, and a third grid opening M_OP3). Among the light emitting regions R-PXA, G-PXA, and B-PXA, the first grid opening M_OP1 may correspond to the first light emitting region (i.e., the red light emitting region R-PXA), the second grid opening M_OP2 may correspond to the second light emitting region (i.e., the green light emitting region G-PXA), and the third grid opening M_OP3 may correspond to the third light emitting region (i.e., the blue light emitting region B-PXA). As an example of the present disclosure, the third grid opening M_OP3 may have a size larger than that of the second grid opening M_OP2, and the second grid opening M_OP2 may have a size larger than that of the first grid opening M_OP1.

[0235] A cutting area M_CA may be provided in the grid lines. The grid lines may be spaced apart (separated) from the cutting area M_CA.

[0236] As Figure 16 shown, the row sensing electrodes RE may be arranged in a layer different from the layer of the first trace SL1. The first trace SL1 may be arranged on the first sensor insulating layer IIL1, and the row sensing electrodes RE may be arranged on the second sensor insulating layer IIL2. As an example of the present disclosure, the first width W1 of the first trace SL1 may be smaller than the second width W2 of each of the grid lines. Thus, even when the first trace SL1 is arranged below the row sensing electrodes RE inside the sensing area SA (see Figure 5 ), the first trace SL1 may not be visually recognized.

[0237] Each of the first traces SL1 may have a single-layer structure or a structure in which in the third direction DR3 (see Figure 4)A multilayer structure in which multiple films can be stacked. In the case of a multilayer structure where the first trace SL1 has the same width, the wiring resistance of each of the first traces SL1 can be reduced. As an example of the present disclosure, each of the first traces SL1 can have a three-layer structure. For example, each of the first traces SL1 can include a first metal film ML1, a second metal film ML2, and a third metal film ML3 that can be sequentially stacked. The first metal film ML1 and the third metal film ML3 can include titanium, and the second metal film ML2 can include aluminum. As an example of the present disclosure, in order to reduce the wiring resistance of each of the first traces SL1, the second metal film ML2 can have a thickness of about or greater. Therefore, even in the case where the first width W1 of each of the first traces SL1 is smaller than the second width W2, an increase in wiring resistance can be prevented.

[0238] Figure 16 Only the first trace SL1 is shown, but in Figures 5 to 14 , wirings (e.g., bridge electrodes BE, connection wirings SCL11 to SCL52, second traces SL2, and first sub-bridge electrodes SBE1 and second sub-bridge electrodes SBE2) arranged on the first sensor insulating layer IIL1 can be designed to have a width smaller than the width of the grid lines, and thus visibility can be improved.

[0239] The second sensor insulating layer IIL2 can include an organic film. The organic film can include at least one of an acrylic-based resin, a methacrylate-based resin, a polyisoprene-based resin, a vinyl resin, an epoxy resin, a urethane-based resin, a cellulose-based resin, a silicone-based resin, a polyimide-based resin, a polyamide-based resin, a perylene-based resin, and combinations thereof.

[0240] The grid lines of the row sensing electrodes RE can be arranged on the second sensor insulating layer IIL2 and can have a single-layer structure or a multilayer structure. As an example of the present disclosure, each of the grid lines can have a three-layer structure. For example, each of the grid lines can include a fourth metal film ML4, a fifth metal film ML5, and a sixth metal film ML6 that can be sequentially stacked. The fourth metal film ML4 and the sixth metal film ML6 can include titanium, and the fifth metal film ML5 can include aluminum.

[0241] According to the above description, the sides defining the row sensing electrodes and the column sensing electrodes can be arranged parallel to the first direction and the second direction. Therefore, in the case where the pen moves in the first direction, the capacitance with the row sensing electrodes can be kept constant without change, and as a result, the position and slope of the pen can be accurately sensed.

[0242] In addition, traces electrically connected to the row sensing electrodes may be arranged to overlap with the sensing regions. Accordingly, the width of the non-sensing regions may be reduced, and as a result, the bezel width of the electronic device may be reduced overall.

[0243] Although the above has been described with reference to embodiments of the present disclosure, it will be understood that various modifications and changes can be made to the present disclosure by those skilled in the art or those of ordinary skill in the art without departing from the spirit and technical scope of the present disclosure described in the appended claims. Accordingly, the technical scope of the present disclosure is not limited to the detailed description of the specification, but should be defined by the appended claims.

Claims

1. An electronic device, comprising: a display layer, wherein a display area and a non-display area adjacent to the display area are defined in the display layer; as well as a sensor layer, in which a sensing area corresponding to the display area and a non-sensing area adjacent to the sensing area are defined, Wherein, the sensor layer comprises: a plurality of row sensing electrodes, the plurality of row sensing electrodes being arranged in the sensing area and comprising a plurality of sub-sensing electrodes arranged in a first direction; a plurality of first traces electrically connected to the plurality of row sensing electrodes and overlapping the sensing region; a plurality of column sensing electrodes, the plurality of column sensing electrodes being arranged in the sensing region and extending in a second direction intersecting the first direction; a plurality of second traces electrically connected to the plurality of column sensing electrodes; and a bridging electrode electrically connecting a first sub-sensing electrode and a second sub-sensing electrode spaced apart from each other in the first direction among the plurality of sub-sensing electrodes, and Each of the plurality of column sensing electrodes includes an opening portion extending in the second direction and overlapping one of the plurality of first traces.

2. The electronic device according to claim 1, wherein: A boundary opening portion is defined between two column sensing electrodes that are spaced apart from each other among the plurality of column sensing electrodes.

3. The electronic device according to claim 2, wherein: The first sub-sensing electrode overlaps with the opening, and The second sub-sensing electrode overlaps the boundary opening portion.

4. The electronic device according to claim 2, wherein: Each of the plurality of column sensing electrodes comprises: a first sensing portion, the first sensing portion being disposed between the first sub-sensing electrode and the second sub-sensing electrode in the first direction; and a second sensing portion extending from the first sensing portion in the second direction and having a width greater than that of the first sensing portion, and The first sensing portion and the second sensing portion are integrated with each other.

5. The electronic device according to claim 4, wherein: The bridge electrode overlaps with the first sensing portion.

6. The electronic device according to claim 2, wherein: Each of the plurality of row sensing electrodes comprises: a first sub-row of sensing electrodes; and a second sub-row sensing electrode, the second sub-row sensing electrode being spaced apart from the first sub-row sensing electrode in the second direction, and The first sub-row sensing electrodes and the second sub-row sensing electrodes are electrically connected to each other.

7. The electronic device according to claim 6, wherein: Each of the plurality of first traces is electrically connected to the first sub-row sensing electrode through a first sub-contact hole, and is electrically connected to the second sub-row sensing electrode through a second sub-contact hole.

8. The electronic device according to claim 6, wherein: Each of the plurality of row sensing electrodes further includes a connection electrode disposed in the non-sensing region and electrically connecting the first sub-row sensing electrode and the second sub-row sensing electrode to each other.

9. The electronic device according to claim 2, wherein: The sensor layer further comprises: A plurality of dummy traces are electrically connected to the plurality of row sensing electrodes and overlap the sensing region.

10. The electronic device according to claim 9, wherein: One of the plurality of dummy traces overlaps the boundary opening.

11. The electronic device according to claim 1, wherein: The sensing region includes a first sub-sensing region and a second sub-sensing region spaced apart from each other in the first direction, and The plurality of row sensing electrodes include first side row sensing electrodes arranged in the first sub sensing region and second side row sensing electrodes arranged in the second sub sensing region.

12. The electronic device according to claim 11, wherein: The first side row sensing electrode is spaced apart and electrically isolated from the second side row sensing electrode in the first direction, and The plurality of first traces include: a first side trace overlapping the first sub-sensing region and electrically connected to the first side row sensing electrode; and A second side trace overlaps the second sub-sensing region and is electrically connected to the second side row sensing electrode.

13. The electronic device according to claim 1, wherein: The sensing area includes: the first sub-sensing region and the second sub-sensing region, the first sub-sensing region and the second sub-sensing region being spaced apart from each other in the first direction; and a third sub-sensing region and a fourth sub-sensing region, the third sub-sensing region and the fourth sub-sensing region being spaced apart from each other in the first direction and being spaced apart from the first sub-sensing region and the second sub-sensing region in the second direction, and The plurality of row sensing electrodes include: first side row sensing electrodes, the first side row sensing electrodes are arranged in the first sub sensing area; second side row sensing electrodes, the second side row sensing electrodes are arranged in the second sub sensing area; third side row sensing electrodes, the third side row sensing electrodes are arranged in the third sub sensing area; and The fourth lateral row sensing electrodes are arranged in the fourth sub-sensing region.

14. The electronic device according to claim 13, wherein: The first side row sensing electrode is spaced apart and electrically isolated from the second side row sensing electrode in the first direction, The third side row sensing electrode is spaced apart from and electrically isolated from the fourth side row sensing electrode in the first direction, and The plurality of first traces include: a 1-1th trace line, the 1-1th trace line overlapping the first sub-sensing region and electrically connected to the first side row sensing electrode; a 1-2 trace, the 1-2 trace overlapping the second sub-sensing region and electrically connected to the second side row sensing electrode; a 1-3 trace, the 1-3 trace overlapping the third sub-sensing region and electrically connected to the third side row sensing electrode; and The 1-4th traces overlap the fourth sub-sensing region and are electrically connected to the fourth side row sensing electrodes.

15. The electronic device according to claim 13, wherein: The plurality of column sensing electrodes include: first side-column sensing electrodes, the first side-column sensing electrodes are arranged in the first sub-sensing area; second side column sensing electrodes, the second side column sensing electrodes are arranged in the second sub-sensing area; third side column sensing electrodes, the third side column sensing electrodes being arranged in the third sub-sensing area and spaced apart from the first side column sensing electrodes in the second direction; and A fourth side column sensing electrode is arranged in the fourth sub sensing region and is spaced apart from the second side column sensing electrode in the second direction.

16. The electronic device according to claim 15, wherein: The plurality of second traces include: a 2-1st side trace line, the 2-1st side trace line being electrically connected to the first side column sensing electrode; a 2-2 side trace electrically connected to the second side column sensing electrode; a 2-3rd side trace, the 2-3rd side trace overlapping the first sub-sensing region and electrically connected to the third side column sensing electrode; and A 2-4th side trace overlaps the second sub-sensing region and is electrically connected to the fourth side column sensing electrode.

17. The electronic device according to claim 16, wherein: Each of the 2-3rd side trace and the 2-4th side trace comprises: a first line portion, the first line portion and the plurality of first traces being disposed on a same layer; and The second line portion and the plurality of column sensing electrodes are disposed on the same layer.

18. The electronic device according to claim 1, wherein: Each of the plurality of row sensing electrodes and each of the plurality of column sensing electrodes comprises a grid line, and In the sensing region, each of the plurality of first traces has a width that is smaller than a width of the grid lines.

19. The electronic device according to claim 18, wherein: Each of the plurality of first traces has a multi-layer structure.

20. An electronic device comprising: a display layer, wherein a display area and a non-display area adjacent to the display area are defined in the display layer; a sensor layer, in which a sensing area corresponding to the display area and a non-sensing area adjacent to the sensing area are defined; as well as a sensor driving section electrically connected to the sensor layer and including a differential amplifier, Wherein, the sensor layer comprises: A first section of sensing electrodes, wherein the first section of sensing electrodes is arranged in the sensing area; second-segment sensing electrodes, the second-segment sensing electrodes are arranged in the sensing region and are arranged alternately with the first-segment sensing electrodes in the first direction; a plurality of first trace segments, the plurality of first trace segments overlapping the sensing area, and electrically connecting the first segment sensing electrode to a first terminal of the differential amplifier; a plurality of second trace segments, the plurality of second trace segments overlapping the sensing area, and electrically connecting the second segment sensing electrode to a second terminal of the differential amplifier; a plurality of column sensing electrodes arranged in the sensing region and extending in a second direction intersecting the first direction; and a plurality of second traces electrically connected to the plurality of column sensing electrodes, A first column sensing electrode among the plurality of column sensing electrodes includes a first opening portion extending in the second direction and overlapping one of the plurality of first segment traces, and A second column sensing electrode among the plurality of column sensing electrodes includes a second opening portion extending in the second direction and overlapping one of the plurality of second segment traces.

21. The electronic device according to claim 20, wherein: The sensor layer further comprises: a first connection wiring electrically connecting a 1-1 segment of sensing electrodes arranged in a first row among the first segment of sensing electrodes; and a second connection wiring electrically connecting a 2-1 segment of sensing electrodes arranged in the first row among the second segment of sensing electrodes, and In a plan view, the first connection wiring and the second connection wiring extend in the first direction and intersect the plurality of column sensing electrodes.

22. The electronic device according to claim 21, wherein: Each of the plurality of first trace segments and the plurality of second trace segments comprises: an intersection portion that intersects the first connection wiring and the second connection wiring; and a non-intersecting portion that does not intersect the first connection wiring and the second connection wiring, and The intersecting portion and the non-intersecting portion are arranged in different layers.

23. The electronic device according to claim 22, wherein: The non-intersecting portion, the first connection wiring, and the second connection wiring are arranged on a first sensor insulating layer, and The intersection portion, the first segment sensing electrode, and the second segment sensing electrode are disposed on a second sensor insulating layer.

24. The electronic device according to claim 21, wherein: Each of the first segment sensing electrodes comprises: a plurality of first sub-segment electrodes; and a first sub-bridging electrode electrically connecting the plurality of first sub-segment electrodes, and Each of the second segment sensing electrodes comprises: a plurality of second sub-segment electrodes; and The second sub-bridge electrode is electrically connected to the plurality of second sub-segment electrodes.

25. The electronic device according to claim 24, wherein: The first sub-bridge electrode and the second sub-bridge electrode are arranged at a layer different from a layer of the first sub-segment electrode and the second sub-segment electrode, and The first sub-bridge electrode, the second sub-bridge electrode, the first connection wiring, and the second connection wiring are arranged in the same layer.

26. The electronic device according to claim 20, wherein: The sensor driving unit is configured as follows: providing a first transmission signal to the first column sensing electrode among the plurality of column sensing electrodes; as well as providing a second transmission signal to the second column sensing electrode adjacent to the first column sensing electrode among the plurality of column sensing electrodes, and The first transmission signal and the second transmission signal have opposite phases to each other.

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