Substrate mounting method, substrate, and image forming apparatus

Abstract

A substrate mounting method, a substrate, and an image forming apparatus. The substrate mounting method includes: a step for applying a first paste solder on a solder surface for a chip component by using a first mask plate; a step for installing jumper wires; a step for applying a second paste solder for the jumper wire by using a second mask plate; a step for mounting the chip component on the first paste solder; a step for soldering the jumper wire and the chip component by melting the first paste solder and the second paste solder by means of a reflow process; a step for mounting a lead component from a surface opposite to the soldering surface; a step for attaching a cover member covering at least a portion of the solder surface including the jumper wire and the chip component soldered in the reflow process; and a step for soldering the lead component by conveying the substrate in the flow soldering groove in a state in which the cover member is attached.

Description

Technical Field

[0001] The present invention relates to a substrate mounting method, a substrate, and an imaging device, and relates to an electrical substrate mounting method for providing a conductive pattern on one surface, for example. Background Art

[0002] Conventionally, in some electrical substrates, when lead components and chip components are mounted together, flow soldering mounting (soldering) is performed. Figure 9 Parts (A) and (B) are views showing solder bridges of chip components in a conventional soldering method. The upper view is a top view and the lower view is a cross-sectional view. Figure 9 Part (A) is a view showing the state of a solder bridge. Chip components 1 are mounted adjacent to each other on a substrate 2 on which components are mounted. In flow soldering mounting, the chip components 1 in the solder bath may leave solder between each component, and cause a solder bridge 3 when the chip components 1 leave the solder bath. In order to suppress the occurrence of the solder bridge 3, it is necessary to ensure a wide space between each component, as Figure 9 shown in part (B). However, by ensuring a wide space between each component, a larger substrate area is required for these spaces. In addition, many patterns for transmitting signals (signal patterns) are laid around a CPU or the like, and many lead jumpers are provided across the signal patterns. The lead jumpers also need to be spaced apart from the chip components 1 to suppress the occurrence of the solder bridge 3. In a conventional example, since there is a trade-off relationship between the solder bridge and substrate miniaturization, there is a problem that it is difficult to solve these two problems together.

[0003] In view of the above problems, an object of the present invention is to suppress solder bridges and miniaturize the substrate. Summary of the Invention

[0004] To solve the above problems, the present invention provides the following configuration:

[0005] (1) A substrate mounting method for mounting components on a substrate including a conductive pattern, the substrate mounting method comprising: a first application step of covering a soldering surface of the substrate provided with the conductive pattern through a first mask and applying a first paste solder for soldering a chip component on the soldering surface; a first mounting step of mounting a jumper wire connected between the patterns of the conductive pattern; a second application step of covering the soldering surface through a second mask and applying a second paste solder for soldering the jumper wire mounted on the soldering surface; a second mounting step of mounting the chip component on the first paste solder applied in the first application step; a reflow step of soldering the mounted jumper wire and chip component by melting the first paste solder and the second paste solder by means of a reflow process; a third mounting step of mounting a lead component from a surface opposite to the soldering surface; a protection step of attaching a cover member that covers at least a part of an area of the soldering surface including the jumper wire and the chip component soldered in the reflow process; and a flow step of soldering the lead component by conveying the substrate in a flow solder bath in a state where the cover member is attached.

[0006] (2) A substrate including a soldering surface provided with a conductive pattern, the substrate comprising: a first mounting area where a lead component is soldered on a surface opposite to the soldering surface; a second mounting area where a chip component is soldered on the soldering surface; and a jumper wire that is soldered on the second mounting area through a reflow process.

[0007] (3) An imaging device for forming an image on a recording material, the imaging device including the substrate according to (2) above.

[0008] With reference to the accompanying drawings, other features of the present invention will become apparent from the following description of exemplary embodiments. Description of the Drawings

[0009] Figure 1 is a schematic cross-sectional view showing the configuration of an imaging device according to an embodiment.

[0010] Figure 2 Parts (A) and (B) are views showing the substrate according to the embodiment.

[0011] Figure 3Parts (A), (B), (C) and (D) are views showing the steps of applying the paste solder and the mounting steps of the chip component according to this embodiment.

[0012] Figure 4 Parts (A), (B), (C) and (D) are views showing the steps of applying the paste solder according to this embodiment.

[0013] Figure 5 Parts (A) and (B) are a cross-sectional view showing the mounting state according to this embodiment and a cross-sectional view showing the reflow soldering state according to this embodiment.

[0014] Figure 6 is a cross-sectional view showing the state of mounting the lead component according to this embodiment.

[0015] Figure 7 Parts (A) and (B) are a perspective view showing the flow region and the reflow region according to this embodiment and a perspective view of the substrate with a frame jig mounted thereon.

[0016] Figure 8 is a cross-sectional view showing the details of the state of mounting the frame jig according to this embodiment.

[0017] Figure 9 Parts (A) and (B) are views showing the solder bridges of the chip component according to the conventional example. Detailed Description

[0018] <First Embodiment>

[0019] [Imaging Device]

[0020] In an embodiment of the present invention, a laser beam printer (hereinafter simply referred to as a printer) will be described as an example of an electronic device for an application substrate. In Figure 1Among them, a schematic configuration of a laser beam printer is shown as an example of an imaging device. A laser beam printer 1000 (hereinafter referred to as printer 1000) is provided with a photosensitive drum 1010, a charging section 1020, and a developing section 1030. The photosensitive drum 1010 is an image bearing member on which an electrostatic latent image is formed. The charging section 1020 uniformly charges the photosensitive drum 1010. An optical scanning device 1025, as an exposure member, forms an electrostatic latent image by scanning a laser beam on the photosensitive drum 1010 according to image data. The developing section 1030 forms a toner image by developing the electrostatic latent image formed on the photosensitive drum 1010 with toner. The toner image formed on the photosensitive drum 1010 (on the image bearing member) is transferred to a sheet P, which is a recording material supplied from a cassette 1040, by a transfer section 1050, and the unfixed toner image transferred to the sheet P is fixed by a fixing device 1060 and discharged to a tray 1070. The imaging section is composed of the photosensitive drum 1010, the charging section 1020, the developing section 1030, and the transfer section 1050. In addition, the printer 1000 is also provided with a power supply device 1080, and the power supply device 1080 supplies power to drive sections (such as motors) and a control section 5000. The control unit 5000 includes a CPU (Central Processing Unit) (not shown) and controls the imaging operation of the imaging section, the conveyance operation of the sheet P, etc. Based on the required voltage accuracy of the CPU, the voltage accuracy standard in this embodiment is, for example, 5V ± 5% (Vmin = 4.75V, Vmax = 5.25V). After a predetermined period of time from when the printer 1000 finishes the printing operation, the printer 1000 transitions to a standby state in which printing operations can be immediately executed. After another predetermined period of time, the printer 1000 transitions from the standby state to a sleep state, which is a low power consumption mode in order to reduce power consumption during the waiting time. The printer 1000 is capable of transitioning among three states, namely, the standby state and the sleep state as the second mode and the printing state as the first mode, and the control section 5000 transitions the printer 1000 to each state. Incidentally, the imaging device of the substrate to which the present invention can be applied is not limited to Figure 1 the configuration shown.

[0021] [Circuit board]

[0022] Printer 1000 is mainly provided with a circuit board which will be described below. The circuit board is mounted in, for example, a low-voltage power supply device that generates DC voltage from AC voltage, a DC controller that controls printer 1000, and a high-voltage power supply device that generates high voltage used in the electrophotographic process. In addition, they are mounted in, for example, a drive circuit that supplies power to an actuator that conveys sheet P and drives a toner cartridge and a fixing roller, a sensor circuit that detects various states, and the like. In this embodiment, as an example, the process of mounting the low-voltage power supply device (the power supply device 1080 described above) and the DC controller (the control section 5000 described above) on a single substrate will be described.

[0023] Figure 2 Part (A) and part (B) are views showing a substrate according to an embodiment to which the present invention can be applied. Figure 2 Part (A) of is a top view showing substrate 2 according to this embodiment. Substrate 2 is a single-sided mounting substrate having a conductive pattern provided only on one side, and is advantageous in terms of cost. In a conventional single-sided mounting substrate, only the flow process is performed, and the substrate is not miniaturized in order to prevent the occurrence of solder bridges. In this embodiment, even when it is a single-sided mounting substrate, miniaturization can be achieved by the method described below. Incidentally, the side on which the conductive pattern is provided is called the soldering surface, and the side opposite to the soldering surface is called the mounting surface, on which lead components described below are mounted. On substrate 2, there are a flow area 14 as a first mounting area, a reflow area 13 as a second mounting area, and a frame jig mounting area 15. The flow area 14 is an area where components are mounted by flow soldering, and the reflow area 13 is an area where components are mounted by reflow soldering. The frame jig mounting area 15 is an area for providing a frame jig in the case of flow soldering to prevent solder from entering the reflow area 13. Here, flow soldering is a soldering step applicable to mounting large components and is a highly productive mounting method. On the other hand, reflow soldering is a soldering step applicable to mounting chip components described below and is a highly accurate mounting method.

[0024] In the flow area 14, large lead components 12 (first lead components), such as AC connectors, power semiconductors, power transformers (transformers), electrolytic capacitors, and AC filters (primary filters), are mainly installed. Here, a lead component is a component including a lead, and is a component soldered on a soldering surface opposite to the mounting surface by inserting the lead from one side of the mounting surface into a hole (via hole) provided in the substrate 2. On the other hand, in the reflow area 13, lead jumpers 9 as jumper wires for bridging signal lines (connected between conductive patterns), chip components 1 (first chip components) (such as CPUs, resistors, and capacitors), and small lead components 21 (second lead components) (such as connectors and quartz crystals) are installed. Here, a chip component is a component directly soldered to the soldering surface of the substrate 2, and is also referred to as a component for surface mounting. In the reflow area 13, components can be installed at a higher density than in the flow area 14.

[0025] Figure 2 Part (B) of is a cross-sectional view showing the substrate 2. Incidentally, 23 is a reflow soldering corner and 22 is a flow soldering corner, and only some reference numerals are shown. The substrate 2 is divided into a flow area 14 and a reflow area 13, and each component is installed. As described above, in the reflow area 13, since components can be installed at a high density and the occurrence of solder bridges occurring in flow soldering can be greatly suppressed, miniaturization of the substrate and improvement in quality can be expected.

[0026] [Partition of Components]

[0027] Hereinafter, a specific manufacturing method according to this embodiment will be described. In the substrate 2 according to this embodiment, since it includes a low-voltage power supply circuit and uses many large lead components 12, a cheap phenolic paper material having copper foil on one side is used. In addition, generally, since the heat capacity of lead components is large, there are problems such as the solder not melting even when the soldering portion of the lead component is heated by reflow soldering, or the coating of the electrolytic capacitor melting due to heat and the component being damaged. Therefore, for a substrate including lead components, flow soldering is applied.

[0028] In addition, in the DC controller circuit, since there are many patterns (further referred to as signal patterns) for transmitting signals connected from the CPU, the connection between the patterns is made by using lead jumpers that can cross multiple signal patterns. In addition, in the DC controller circuit, there are many chip components in addition to the lead jumpers.

[0029] For this reason, in this embodiment, by reflow soldering the lead jumper 9 with a small heat capacity in the reflow area 13, the power supply circuit is mounted in the flow area 14 and the DC controller circuit is mounted in the reflow area 13, so that each of them is separately mounted. In addition, by applying a kink (bend) to the lead, the small lead component 21 is also mounted on the reflow area 13.

[0030] [Method of mounting the substrate]

[0031] Hereinafter, each step of the method of mounting the substrate 2 will be described. Figure 3 Parts (A), (B), (C), and (D) are cross-sectional views of the substrate 2 in a side view. Initially, by using a thin mask, the paste solder 7a is applied to the chip component 1 for reflow mounting to apply the paste solder 7a to the soldering surface of the substrate 2 provided with the conductive pattern (first application step). The paste solder 7a is the solder for reflow soldering. The thin mask 8 (first mask) is a thin mask for applying only the paste solder 7a (first paste solder) to the target chip component 1. On the thin mask 8, there are holes at the positions where the paste solder 7a is applied (i.e., at the positions corresponding to the pads), so that the paste solder 7a can be applied to the soldering surface of the substrate 2. In other words, in the first application step, the soldering surface of the substrate 2 provided with the conductive pattern is covered with the first mask, and in addition, the first paste solder is applied to mount the chip component 1.

[0032] First, as Figure 3 shown in part (A), the thin mask 8 is mounted on the copper foil surface (soldering surface) of the substrate 2, and as Figure 3 shown in part (B), the paste solder 7a is coated (smeared) only on the target area. Then, as Figure 3 shown in part (C), when the thin mask 8 is removed from the substrate 2, the paste solder 7a is applied to the pads of the chip component 1.

[0033] Figure 3 Part (D) is a view showing the mounting step (first mounting step) for mounting the lead jumper 9 and the small lead component 21 on the substrate 2 according to this embodiment. First, the substrate 2 to which the paste solder 7a has been applied is turned over, and as Figure 3 shown in part (D), the lead jumper 9 is mounted and bent (twisted) so that the lead jumper 9 is not removed from the substrate 2. Then, the small lead component 21 is mounted. Incidentally, a kink is applied to the lead of the small lead component 21 to prevent the small lead component 21 from falling off the substrate 2.

[0034] Subsequently, a paste solder 7b (second application step) is applied by using a thick mask template 10 (second mask template) to apply the paste solder 7b (second paste solder) to the lead jumper 9 and the small lead component 21. On the thick mask template 10, there are holes at the positions where the paste solder 7b is applied (i.e., at the positions corresponding to the pads), so that the paste solder 7b can be applied to the soldering surface of the substrate 2. That is, the soldering surface is covered by the second mask template, and in addition, the paste solder 7b is applied to mount the installed jumper wiring. Figure 4 Parts (A), (B), (C), and (D) show views of the steps of applying the paste solder 7b to the lead jumper 9 and the small lead component 21. First, as Figure 4 shown in part (A), the substrate 2 is flipped, and as Figure 4 shown in part (B), the thick mask template 10 for applying the paste solder 7b to the lead jumper 9 and the small lead component 21 is installed.

[0035] Here, a thick mask template 10 with a relatively thick thickness is used so that a larger amount of the paste solder 7b is applied to the lead jumper 9 and the small lead component 21 compared to the amount of the paste solder 7a applied to the chip component 1. When the thickness of the thin mask template 8 is defined as Th1 (see Figure 3 part (A)) and the thickness of the thick mask template 10 is defined as Th2, the relationship between Th1 and Th2 is Th1 < Th2. Incidentally, the thickness refers to the thickness in the direction perpendicular to the plane of the substrate 2. In addition, the thick mask template 10 is provided with a hollow portion 10a as a recessed portion. The hollow portion 10a is provided such that it is located at a position (in the area) opposite to the paste solder 7a for the chip component 1, and such that the hollow portion is provided to avoid the paste solder 7a when the thick mask template 10 is mounted on the substrate 2 to protect the paste solder 7a for the chip component 1.

[0036] And as Figure 4 shown in part (C), the paste solder 7b is only scraped and applied to the target area. And as Figure 4 shown in part (D), when the thick mask template 10 is removed from the substrate 2, it becomes a state where the paste solder 7b is applied to the pads of the lead jumper 9 and the small lead component 21. Incidentally, since kinks are applied to the small lead components 21 to prevent them from falling off, the paste solder 7b can be applied in the same manner as the lead jumper 9.

[0037] Subsequently, as Figure 5 shown in part (A), the chip component 1 is mounted on the surface of the substrate 2 to which the paste solder 7a is applied (second mounting step). Subsequently, as Figure 5As shown in part (B), the paste solder 7a and the paste solder 7b are melted in a reflow oven, and the chip component 1, the small lead component 21, and the lead jumper 9 are mounted through a reflow process (reflow step). Then, the paste solder 7a and the paste solder 7b become angular shapes 23 and are soldered. Subsequently, the reflow-soldered substrate 2 is flipped, and as Figure 6 shown, the large lead component 12 is mounted from the opposite surface of the soldering surface, as Figure 6 shown (third mounting step).

[0038] (Frame fixture)

[0039] Subsequently, a frame fixture is used during flow soldering to prevent solder from entering the reflow area 13. Figure 7 Part (A) is a perspective view of the substrate 2 when viewed from the bottom (soldering surface side), and the bottom side is the soldering surface. As Figure 7 shown in part (B), before performing flow soldering, a frame fixture 16 is mounted as a protective member (cover member) to prevent flow solder from entering the reflow area 13 (protection step). That is, a cover member is mounted to cover at least a part of the area of the soldering surface including the jumper wiring and the chip component soldered in the reflow step. The frame fixture 16 protects at least a part of the area of the soldering surface including the jumper wiring 9 and the chip component 21 soldered through the above-described reflow step.

[0040] Figure 8 is a cross-sectional view showing the substrate 2 with the frame fixture mounted thereon and the flow solder bath 25. The large lead component 12 is mounted in the flow area 14. Incidentally, the lead jumper 9, the chip component 1, and the small lead component 21 have been mounted in the reflow area 13. The frame fixture 16 is mounted on the frame fixture mounting area 15 to enclose the reflow area 13. And the substrate 2 with components mounted thereon is conveyed (flowed) in the flow solder bath 25 in the direction indicated by the flow direction 24 along which the substrate 2 moves, and the large lead component 12 is flow soldered (flow soldering step).

[0041] By performing the above-described soldering steps, it is possible to densely solder in the reflow area 13 of reflow soldering without the occurrence of solder bridges. Therefore, the occurrence of solder bridges can be suppressed and the substrate can be miniaturized.

[0042] Incidentally, since the chip component and the lead jumper can be soldered by flow soldering, even when some of the chip component and the lead jumper are flow soldered, the same effect as in this configuration can be obtained. Further, in this configuration, the lead jumper is installed in the reflow region 13. However, even when one of the lead jumpers (the first jumper) is installed in the reflow region 13 and the other (the second jumper) is installed in the flow region 14, the same effect as in this configuration can be obtained. Further, not only can the first lead component and the second jumper wiring installed by the flow process be provided in the flow region 14, but also the second chip component can be provided. Further, in this configuration, a phenolic paper material is used for the substrate 2. However, as long as the substrate uses a lead jumper, even when any other material is used, the same effect as in this configuration can be obtained.

[0043] As described above, according to this embodiment, the occurrence of solder bridges can be suppressed and the substrate can be miniaturized.

[0044] The disclosure of this embodiment includes the following method and construction examples.

[0045] (Method 1)

[0046] A substrate mounting method for mounting components on a substrate including a conductive pattern, the substrate mounting method comprising:

[0047] A first application step of covering a soldering surface of the substrate provided with the conductive pattern by a first mask and applying a first pasty solder for soldering a chip component on the soldering surface;

[0048] A first mounting step of mounting a jumper wiring connected between the patterns of the conductive pattern;

[0049] A second application step of covering the soldering surface by a second mask and applying a second pasty solder for soldering the jumper wiring mounted on the soldering surface;

[0050] A second mounting step of mounting the chip component on the first pasty solder applied in the first application step;

[0051] A reflow step of soldering the mounted jumper wiring and the chip component by melting the first pasty solder and the second pasty solder by means of a reflow process;

[0052] A third mounting step of mounting a lead component from a surface opposite to the soldering surface;

[0053] a protecting step for attaching a cover member that covers at least a portion of an area of ​​the soldering surface including the jumper wires and the chip components soldered during the reflow process; and

[0054] A flowing step of soldering the lead parts by conveying the substrate in a flow solder bath in a state where the cover member is attached.

[0055] (Method 2)

[0056] The substrate mounting method according to method 1, wherein a thickness of the first mask plate in a direction perpendicular to the substrate is thinner than a thickness of the second mask plate in a direction perpendicular to the substrate.

[0057] (Method 3)

[0058] The substrate mounting method according to method 1 or 2, wherein when the second cream solder is applied in the second applying step, the second mask plate includes a concave portion in a region opposing the first cream solder applied in the first applying step.

[0059] (Method 4)

[0060] The substrate mounting method according to any one of methods 1 to 3, wherein the substrate is a single-sided substrate on which the conductive pattern is provided on a single side.

[0061] (Construction 1)

[0062] A substrate comprising a soldering surface provided with a conductive pattern, the substrate comprising:

[0063] a first mounting region in which a lead component is welded on a surface opposite to the welding surface;

[0064] a second mounting region in which a chip component is soldered on the soldering surface; and

[0065] A jumper wire is soldered on the second mounting area through a reflow process.

[0066] (Construction 2)

[0067] The substrate according to Configuration 1, wherein the lead member soldered on the first mounting area is defined as a first lead member, and the substrate further includes:

[0068] A second lead component is welded to the second mounting area.

[0069] (Construction 3)

[0070] The substrate according to Structure 2 further includes a CPU and a crystal oscillator soldered on the second mounting area.

[0071] (Structure 4)

[0072] The substrate according to Structure 1, wherein the jumper wiring is defined as the first jumper wiring, and the substrate further includes:

[0073] A second jumper wiring soldered on the first mounting area through a flowing process.

[0074] (Structure 5)

[0075] The substrate according to Structure 1, wherein the chip component is defined as the first chip component and the jumper wiring is defined as the first jumper wiring, and the substrate further includes:

[0076] A second jumper wiring and a second chip component soldered on the first mounting area through a flowing process.

[0077] (Structure 6)

[0078] The substrate according to Structure 5 further includes an AC connector, a transformer, a primary filter, an electrolytic capacitor, and a power semiconductor soldered on the first mounting area through a flowing process.

[0079] (Structure 7)

[0080] The substrate according to Structure 1, wherein the lead component soldered on the first mounting area is defined as the first lead component, the chip component and the jumper wiring soldered on the second mounting area are respectively defined as the first chip component and the first jumper wiring, and the substrate further includes:

[0081] A second lead component soldered on the second mounting area; and

[0082] A second jumper wiring and a second chip component soldered on the first mounting area through a flowing process.

[0083] (Structure 8)

[0084] The substrate according to Structure 1 further includes: a CPU and a crystal oscillator soldered on the second mounting area; and

[0085] An AC connector, a transformer, a primary filter, an electrolytic capacitor, and a power semiconductor soldered on the first mounting area through a flowing process.

[0086] (Configuration 9)

[0087] The substrate according to any one of Configurations 1 to 8, wherein the substrate is a single-sided substrate, and on the single-sided substrate, the conductive pattern is provided on a single surface.

[0088] (Configuration 10)

[0089] An imaging device for forming an image on a recording material, the imaging device including the substrate according to any one of Configurations 1 to 9.

[0090] (Configuration 11)

[0091] The imaging device according to Configuration 10, wherein a power circuit for generating a DC voltage from an AC voltage is soldered on the first mounting area, and

[0092] wherein a DC controller for controlling the imaging device is soldered on the second mounting area.

[0093] Although the present invention has been described with reference to exemplary embodiments, it should be understood that the present invention is not limited to the disclosed exemplary embodiments. The scope of the appended claims will be given the broadest interpretation so as to cover all such modifications as well as equivalent structures and functions.

Claims

1. A substrate mounting method for mounting a component on a substrate including a conductive pattern, the substrate mounting method comprising: a first applying step for covering the soldering surface of the substrate on which the conductive pattern is provided through a first mask plate and applying a first cream solder for soldering a chip component on the soldering surface; a first installation step, the first installation step being used to install a jumper connection connected between patterns of the conductive patterns; a second applying step for covering the soldering surface with a second mask sheet and applying a second paste solder for soldering the jumper wires mounted on the soldering surface; a second mounting step for mounting the chip component on the first cream solder applied in the first applying step; a reflow step for soldering the mounted jumper wires and the chip component by melting the first solder paste and the second solder paste by a reflow process; a third mounting step for mounting the lead component from a surface opposite to the welding surface; a protecting step for attaching a cover member that covers at least a portion of an area of ​​the soldering surface including the jumper wires and the chip components soldered during the reflow process; as well as A flowing step of soldering the lead parts by conveying the substrate in a flow solder bath in a state where the cover member is attached. 2 . The substrate mounting method according to claim 1 , wherein a thickness of the first mask plate in a direction perpendicular to the substrate is thinner than a thickness of the second mask plate in a direction perpendicular to the substrate. 3 . The substrate mounting method according to claim 1 , wherein when the second cream solder is applied in the second applying step, the second mask plate includes a concave portion in a region opposing the first cream solder applied in the first applying step. 4 . The substrate mounting method according to claim 1 , wherein the substrate is a single-sided substrate on which the conductive pattern is provided on a single side.

5. A substrate comprising a soldering surface provided with a conductive pattern, the substrate comprising: a first mounting region in which a lead component is welded on a surface opposite to the welding surface; a second mounting area in which the chip component is soldered on the soldering surface; as well as A jumper wire is soldered on the second mounting area through a reflow process.

6. The substrate according to claim 5, wherein the lead part soldered on the first mounting area is defined as a first lead part, and the substrate further comprises: A second lead component is welded to the second mounting area. 7 . The substrate according to claim 6 , further comprising a CPU and a crystal oscillator soldered on the second mounting area.

8. The substrate of claim 5, wherein the jumper connection is defined as a first jumper connection, and the substrate further comprises: A second jumper connection is soldered to the first mounting area through a flow process.

9. The substrate of claim 5, wherein the chip component is defined as a first chip component and the jumper connection is defined as a first jumper connection, and the substrate further comprises: A second jumper connection and a second chip component are soldered on the first mounting area through a flow process.

10. The substrate of claim 9, further comprising an AC connector, a transformer, a primary filter, an electrolytic capacitor, and a power semiconductor soldered on the first mounting area by a flow process.

11. The substrate according to claim 5, wherein the lead component soldered on the first mounting area is defined as a first lead component, the chip component and the jumper connection soldered on the second mounting area are defined as a first chip component and a first jumper connection, respectively, and the substrate further comprises: a second lead component, the second lead component being welded on the second mounting area; as well as A second jumper connection and a second chip component are soldered on the first mounting area through a flow process.

12. The substrate according to claim 5, further comprising: A CPU and a crystal oscillator soldered on the second mounting area; as well as The AC connector, transformer, primary filter, electrolytic capacitors and power semiconductors are soldered on the first mounting area by a flow process. 13 . The substrate according to claim 5 , wherein the substrate is a single-sided substrate on which the conductive pattern is provided on a single side.

14. An image forming apparatus for forming an image on a recording material, the image forming apparatus comprising the substrate according to claim 5.

15. The imaging device according to claim 14, wherein a power supply circuit for generating a DC voltage from an AC voltage is soldered on the first mounting area, and A DC controller for controlling the imaging device is welded on the second mounting area.

Images