Wafer processing film pasting equipment

Abstract

A wafer processing film pasting device is used for conducting film pasting processing on a semiconductor wafer and comprises a machine frame, a supporting base installed on the machine frame and a positioning device installed on the machine frame and stretching into the periphery of the upper portion of the supporting base, the machine frame comprises a first face cover, and the first face cover is further provided with a plurality of auxiliary positioning columns. After the position of the crystal source is corrected on the supporting seat, the auxiliary positioning column is tangent to the peripheral surface of the wafer; the positioning device comprises a guide plate, a driving assembly matched with the guide plate, a sleeve set installed on the upper end face of the guide plate, a positioning rod set installed on the sleeve set, a first limiting block, a second limiting block, a first magnetic attraction assembly and a second magnetic attraction assembly. The guide plate is moved to the first position or the second position, when the guide plate moves to the first position, the wafer is limited through the positioning rod set, position deviation correction and fixing can be conducted on the wafer, the film pasting quality is guaranteed, and the machining quality of a product in the follow-up procedure is effectively improved.

Description

Technical Field

[0001] The present invention relates to a semiconductor processing device, and in particular to a wafer processing film attaching device. Background Art

[0002] A wafer refers to a silicon wafer used for manufacturing semiconductor integrated circuits. Its shape is circular, so it is called a wafer. The raw material of the wafer is high-purity polysilicon. After processes such as dissolution, doping with a silicon crystal seed, pulling a single-crystal silicon rod, grinding, polishing, and slicing, a silicon wafer is formed.

[0003] After the wafer completes the mother block processing, it still needs to be further cut to form microcrystals. Moreover, before cutting the wafer, a film attaching process is required. By attaching a film to the wafer, on the one hand, it can protect the surface of the wafer and prevent the cutting edge from directly contacting the surface of the wafer during the cutting process, thereby reducing surface scratches and other damages; secondly, it can effectively reduce the generation of fragments and avoid the splashing of fragments, improving safety; in addition, the film attached to the wafer can also fix the crystals, prevent uneven stress on the crystals during the cutting process from resulting in poor cutting quality, and ensure that the crystals will not fall off or collide with each other during transportation.

[0004] The existing wafer film attaching process is usually completed on a device. Among them, Patent CN202211362951.4 discloses a manual wafer film attaching machine, which enables the film attaching table to have the ability to adsorb the wafer during film attaching through a vacuum air inlet and a vacuum groove.

[0005] For the above-mentioned integrated wafer automatic film attaching machine, the overall structure is complex, increasing the equipment cost. When fixing the wafer, it relies on the air source, which limits the use scenarios of the equipment. Moreover, it has high requirements for the airtightness of the air path and requires frequent maintenance. Once the air path is not sealed well, it is easy to cause the failure of wafer fixation. Summary of the Invention

[0006] Based on this, it is necessary to provide a wafer processing film attaching device to address the deficiencies in the prior art.

[0007] A wafer processing film pasting device is used for pasting film on a semiconductor wafer. It includes a frame, a support seat installed on the frame, and a positioning device installed on the frame and extending into the outer periphery above the support seat. The frame includes a first cover, and the first cover is also provided with a plurality of auxiliary positioning posts. The auxiliary positioning posts are arc-shapedly distributed in the horizontal plane direction. After the crystal source completes position deviation correction on the support seat, the auxiliary positioning posts are tangent to the outer peripheral surface of the wafer. The positioning device includes a guide plate, a driving component cooperating with the guide plate, a sleeve group installed on the upper end surface of the guide plate, a positioning rod group installed on the sleeve group, a first limit block and a second limit block arranged on both sides of the guide plate, a first magnetic attraction component and a second magnetic attraction component. The positioning rod group includes a first positioning rod, a second positioning rod and a third positioning rod. The driving component drives the guide plate to adjust its position so that the guide plate moves to a first position where it fits with the first limit block or a second position where it fits with the second limit block. When the guide plate moves to the first position, the first magnetic attraction component locks the guide plate, and the first positioning rod, the second positioning rod and the third positioning rod limit the wafer. When the guide plate moves to the second position, the second magnetic attraction component locks the guide plate, and the first positioning rod, the second positioning rod and the third positioning rod release the wafer.

[0008] In one embodiment, after the wafer is placed on the support seat and the position deviation correction is completed, the projection of the wafer in the vertical direction coincides with the support seat. At this time, the positions of the frontmost, rearmost, rightmost and leftmost sides of the outer periphery of the wafer are the first fixed position, the second fixed position, the third fixed position and the fourth fixed position respectively. The first positioning rod, the second positioning rod and the third positioning rod respectively move to the first fixed position, the second fixed position and the third fixed position to limit the wafer.

[0009] In one embodiment, the number of the auxiliary positioning posts is two, and the two auxiliary positioning posts are symmetrically arranged along the connection line between the third fixed position and the fourth fixed position.

[0010] In one embodiment, the first cover is also provided with two first function grooves, two second function grooves, a first function hole, a second function hole and a third function hole. The first function hole is located below the first fixed position, the second function hole is located below the second fixed position, and the third function hole is located below the third fixed position. The first positioning rod, the second positioning rod and the third positioning rod respectively pass through the first function hole, the second function hole and the third function hole.

[0011] In one embodiment, the middle part of the first face cover is concave to form a mounting groove for mounting the support seat. The first functional groove and the second functional groove are respectively arranged on the left and right sides of the mounting groove. The first functional groove and the second functional groove extend downward from the upper end face of the first face cover, and the first functional groove and the second functional groove communicate with the mounting groove in the horizontal direction. The first functional hole and the second functional hole are arranged on the front and rear sides of the functional groove, and the third functional hole is arranged between the two second functional grooves. The hole shapes of the first functional hole, the second functional hole, and the third functional hole are all elongated holes extending in the horizontal direction. The auxiliary positioning post is vertically connected to the bottom of the second functional groove.

[0012] In one embodiment, the driving assembly includes a first driving rod and a driving block mounted on the first driving rod. Two driving strips are further arranged at the bottom of the guide plate. The two driving strips are arranged side by side, and the two driving strips are arranged along the guide plate in the adjustment direction of the guiding assembly. The driving block is arranged between the two driving strips. Among them, the interval between the two driving strips is L, and the distance between the axis of the first driving rod and the end of the driving block is R, where R < L < 2R. During the rotation of the driving strip, the driving block pushes one driving strip to shift, and the other driving strip enters the rotation path of the driving block.

[0013] In one embodiment, when the driving block pushes the guide plate to shift to the maximum positions on both sides, the guide plate moves to the first position where it fits with the first limiting block or the second position where it fits with the second limiting block.

[0014] In one embodiment, the driving assembly further includes a gearbox, a second driving rod mounted at the input end of the gearbox, and a handwheel connected to the end of the second driving rod. The first driving rod is mounted at the output end of the gearbox, and the driving block is connected to the end of the first driving rod. The second driving rod is mounted on the gearbox in the horizontal direction, and the first driving rod is mounted on the gearbox in the vertical direction. The gearbox connects the first driving rod and the second driving rod to realize the linkage between the first driving rod and the second driving rod.

[0015] In one embodiment, the positioning device further includes a guiding assembly, and the guide plate is mounted on the guiding assembly, and the guiding assembly guides the guide plate.

[0016] In one embodiment, the first magnetic attraction assembly is composed of two groups of magnetic attraction members. The two groups of magnetic attraction members of the first magnetic attraction assembly are respectively mounted on the sides of the first limiting block and the guide plate that are close to each other. The magnetic attraction members of different groups on the first magnetic attraction assembly correspond to each other and are aligned with each other. The second magnetic attraction assembly is also composed of two groups of magnetic attraction members. The two groups of magnetic attraction members of the second magnetic attraction assembly are respectively mounted on the sides of the second limiting block and the guide plate that are close to each other. The magnetic attraction members of different groups on the second magnetic attraction assembly correspond to each other and are aligned with each other.

[0017] The beneficial effects of the wafer processing and film - attaching equipment of the present invention are as follows: By setting a positioning device and arranging auxiliary positioning posts on the first cover, the positioning device includes a guide plate, a driving component, a sleeve group, a positioning rod group, a first limit block, a second limit block, a first magnetic attraction component and a second magnetic attraction component. When correcting the position and positioning the wafer, the auxiliary positioning posts limit and initially correct the position of the wafer on one side. The driving component drives the guide plate to adjust its position, so that the guide plate moves from the other side to the first position. During the movement of the guide plate, the positioning rod group performs secondary correction on the wafer. When the guide plate moves to the first position, the first magnetic attraction component locks the guide plate, and the positioning rod group limits the wafer. The present invention can correct the position and fix the wafer without using a gas source, eliminating the dependence on the gas source during the use of the equipment, effectively simplifying the internal structure, reducing the equipment cost, increasing the service life of the equipment, ensuring the film - attaching quality, and effectively improving the processing quality of the product in subsequent processes. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a schematic structural diagram of the wafer processing and film - attaching equipment of the present invention;

[0019] Figure 2 is Figure 1 an exploded view of the wafer processing and film - attaching equipment shown;

[0020] Figure 3 is a top view of the wafer;

[0021] Figure 4 is Figure 1 a top view of the wafer processing and film - attaching equipment shown after removing the upper cover and the first cutting device;

[0022] Figure 5 is Figure 4 a top view of the positioning device and the first cover shown when they are assembled;

[0023] Figure 6 and Figure 7 are schematic structural diagrams of different angles of the positioning device of the wafer processing and film - attaching equipment of the present invention, wherein the guide plate is in the first position;

[0024] Figure 8 is a schematic structural diagram of the positioning device of the wafer processing and film - attaching equipment of the present invention, wherein the guide plate is in the second position;

[0025] Figure 9 is a sectional view of the second cutting device of the wafer processing and film - attaching equipment of the present invention;

[0026] Figure 10 is a sectional view of the first cutting device of the wafer processing and film - attaching equipment of the present invention;

[0027] Figure 11This is a schematic structural diagram when the upper cover of the wafer processing film pasting device of the present invention is cooperatively installed with the first cutting device. Detailed implementation manners

[0028] To make the above objects, features, and advantages of the present invention more obvious and understandable, the following will describe the detailed implementation manners of the present invention with reference to the accompanying drawings. Many specific details are set forth in the following description to fully understand the present invention. However, the present invention can be implemented in many other ways different from those described herein. Those skilled in the art can make similar improvements without departing from the connotation of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed below.

[0029] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of the present invention.

[0030] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present invention, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0031] In the present invention, unless otherwise clearly defined and limited, the terms "installed", "connected", "connected to", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. It can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0032] In the present invention, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "below" and "beneath" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply indicates that the horizontal height of the first feature is less than that of the second feature.

[0033] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are only for the purpose of illustration and do not represent the only implementation.

[0034] Please refer to Figures 1 to 11 , the present invention provides a wafer processing film pasting device for pasting a film on a semiconductor wafer 100. When performing film pasting processing, a patch ring 200 is arranged around the periphery of the wafer 100, and the wafer film is simultaneously pasted on the wafer 100 and the patch ring 200. The wafer processing film pasting device includes a frame 10, an upper cover 20 movably installed on the frame 10, a first cutting device 30 installed on the upper cover 20, a guide die holder 40 installed at a rear position on the frame 10, a support seat 50 installed at a middle position on the frame 10, a first guiding device 61 arranged at both side positions on the frame 10, a pressing die device 70 installed on the first guiding device 61 and arranged above the support seat 50, a second guiding device 62 installed on the pressing die device 70, a second cutting device 80 installed on the second guiding device 62, and a positioning device 90 installed on the frame 10 and extending into the outer periphery above the support seat 50. Among them, the positioning device 90 is used to correct the position and position the wafer to be pasted with a film. The guide die holder 40 is used to install a cylindrical wafer film. After pulling the front end of the wafer film above the wafer 100, the wafer film is pasted on the patch ring 200 and the wafer 100 through the pressing die device 70. After covering the upper cover 20, the wafer film covering the patch ring 200 and a part of the wafer 100 is separately cut through the first cutting device 30, so that this part of the wafer film is separated from the main body of the wafer film, and then the wafer film behind the patch ring 200 is cut off through the second cutting device 80.

[0035] As Figures 2 to 5As shown in the figure, the frame 10 includes two support plates 11 arranged oppositely, a first face cover 13 disposed at the front side position between the two support plates 11, and a second face cover 14 disposed at the rear side position between the two support plates 11. There is a height difference between the first face cover 13 and the second face cover 14. An operation space 12 is formed above the first face cover 13. The die pressing device 70, the first cutting device 30, and the second cutting device 80 respectively complete corresponding operations within the operation space 12. When pasting the film, the front end of the wafer film is pulled into the operation space 12.

[0036] The middle part of the first face cover 13 is concave to form a mounting groove 131. The support seat 50 is mounted on the mounting groove 131. The support seat 50 is arranged in a disc shape. After the wafer 100 is placed on the support seat 50 and the position is corrected, the projection of the wafer 100 in the vertical direction coincides with the support seat 50. At this time, the positions of the frontmost, rearmost, rightmost, and leftmost sides of the outer periphery of the wafer 100 are the first fixed position 101, the second fixed position 102, the third fixed position 103, and the fourth fixed position 104 respectively.

[0037] The first face cover 13 is further provided with two first functional grooves 132, two second functional grooves 133, a first functional hole 134, a second functional hole 135, and a third functional hole 136. The first functional grooves 132 and the second functional grooves 133 are respectively arranged on the left and right sides of the mounting groove 131. The first functional grooves 132 and the second functional grooves 133 are horizontally aligned with each other. The first functional grooves 132 and the second functional grooves 133 extend downward from the upper end surface of the first face cover 13, and the first functional grooves 132 and the second functional grooves 133 are horizontally connected to the mounting groove 131. The first functional hole 134 and the second functional hole 135 are arranged on the front and rear sides of the functional grooves. The third functional hole 136 is arranged between the two second functional grooves 133. The hole shapes of the first functional hole 134, the second functional hole 135, and the third functional hole are all elongated holes extending in the horizontal direction. The first functional hole 134 is located below the first fixed position 101, the second functional hole 135 is located below the second fixed position 102, and the third functional hole 136 is arranged between the two second functional grooves 133 and is located below the third fixed position 103. In addition, the first face cover 13 is further provided with a plurality of auxiliary positioning columns 137. The auxiliary positioning columns 137 are vertically connected to the bottom of the second functional groove 133. The auxiliary positioning columns 137 are arc-shapedly distributed in the horizontal plane direction. After the crystal source is positioned and corrected on the support seat 50, the auxiliary positioning columns 137 are tangent to the outer peripheral surface of the wafer 100.

[0038] In this embodiment, the number of the auxiliary positioning posts 137 is two. The two auxiliary positioning posts 137 are symmetrically arranged along the connection line between the third fixing position 103 and the fourth fixing position 104. The top surface height of the auxiliary positioning posts 137 is flush with the top surface height of the patch ring 200 mounted on the support base 50. In addition, the wafer processing and film attaching device further includes a plurality of limiting heads 15. The limiting heads are mounted on the support base 50, and the limiting heads 15 are used to limit the patch ring 200, facilitating the user to place the patch ring 200 in the correct position.

[0039] As Figure 2 , Figures 5 to 8 shown, the positioning device 90 includes a guiding component 91, a guiding plate 92 mounted on the guiding component 91, a driving component 93 cooperating with the guiding plate 92, a sleeve group 94 mounted on the upper end surface of the guiding plate 92, a positioning rod group 95 mounted on the sleeve group 94, a first limiting block 96 and a second limiting block 97 arranged on the left and right sides of the guiding plate 92, a first magnetic attraction component 98 and a second magnetic attraction component 99. The sleeve group 94 is composed of a plurality of sleeves 941. The positioning rod group 95 includes a first positioning rod 951, a second positioning rod 952 and a third positioning rod 953. The driving component 93 drives the guiding plate 92 to adjust its position, so that the guiding plate 92 moves to a first position in contact with the first limiting block 96 or a second position in contact with the second limiting block 97. When the guiding plate 92 moves to the first position, the first magnetic attraction component 98 locks the guiding plate 92, and the first positioning rod 951, the second positioning rod 952 and the third positioning rod 953 respectively move to the first fixing position 101, the second fixing position 102 and the third fixing position 103 to limit the wafer 100. When the guiding plate 92 moves to the second position, the second magnetic attraction component 99 locks the guiding plate 92, and the first positioning rod 951, the second positioning rod 952 and the third positioning rod 953 release the wafer 100.

[0040] Specifically, the guiding component 91 includes two guide rails 911 arranged oppositely, and two sliders 912 respectively sliding on the two guide rails 911. The guiding plate 92 is mounted on the two sliders 912. The first limiting block 96 and the second limiting block 97 are both mounted on the two guide rails 911. The guiding plate 92 is arranged between the first limiting block 96 and the second limiting block 97. The sliders 912 and the guiding plate 92 mounted on the sliders 912 can adjust their positions along the guide rails 911. During the position adjustment of the guiding plate 92, the guiding plate 92 approaches the first limiting block 96 or the second limiting block 97, and simultaneously drives the first positioning rod 951, the second positioning rod 952 and the third positioning rod 953 to adjust their positions synchronously. The first positioning rod 951, the second positioning rod 952 and the third positioning rod 953 are all mounted on different sleeves 941 in the vertical direction, and the distribution positions of the first positioning rod 951, the second positioning rod 952 and the third positioning rod 953 correspond to the first functional hole 134, the second functional hole 135 and the third functional hole 136.

[0041] The first magnetic attraction assembly 98 is composed of two sets of magnetic attraction members (for example: magnets, magnetic stones, etc.). The two sets of magnetic attraction members of the first magnetic attraction assembly 98 are respectively installed on the mutually close sides of the first limit block 96 and the guide plate 92. The magnetic attraction members of different sets on the first magnetic attraction assembly 98 are in one-to-one correspondence and aligned with each other. The second magnetic attraction assembly 99 is also composed of two sets of magnetic attraction members (for example: magnets, magnetic stones, etc.). The two sets of magnetic attraction members of the second magnetic attraction assembly 99 are respectively installed on the mutually close sides of the second limit block 97 and the guide plate 92. The magnetic attraction members of different sets on the second magnetic attraction assembly 99 are in one-to-one correspondence and aligned with each other.

[0042] The driving assembly 93 includes a gear box 931, a first driving rod 932 installed at the output end of the gear box 931, a second driving rod 933 installed at the input end of the gear box 931, a driving block 934 connected to the end of the first driving rod 932, a hand wheel 935 connected to the end of the second driving rod 933, and a positioning sleeve 936 sleeved outside the second driving rod 933. Among them, the second driving rod 933 is installed on the gear box 931 in the horizontal direction, the first driving rod 932 is installed on the gear box 931 in the vertical direction, and the gear box 931 connects the first driving rod 932 and the second driving rod 933 to realize the linkage of the first driving rod 932 and the second driving rod 933. During the process of manually driving the second driving rod 933 to rotate, the gear box 931 drives the first driving rod 932 and the driving block 934 installed on the first driving rod 932 to rotate.

[0043] In addition, one end of the driving block 934 is installed on the first driving rod 932, and two driving strips 921 are further provided at the bottom of the guide plate 92. The two driving strips 921 are arranged side by side, and the two driving strips 921 are arranged along the guide plate 92 in the position adjustment direction of the guiding assembly 91.

[0044] During assembly, the two guide rails 911 of the guide assembly 91 are installed on the frame 10. The extending direction of the guide rails 911 and the adjusting direction of the guide plate 92 on the guide assembly 91 are both consistent with the hole shapes of the first functional hole 134, the second functional hole 135, and the third functional hole. The first positioning rod 951, the second positioning rod 952, and the third positioning rod 953 respectively pass through the first functional hole 134, the second functional hole 135, and the third functional hole 136. The positioning sleeve 936 is installed on the frame 10. The second driving rod 933 passes through the positioning sleeve 936 from inside the frame 10 and extends outside the frame 10 to be cooperatively installed with the handwheel 935. The driving block 934 is arranged between the two driving strips 921. Among them, the interval between the two driving strips 921 is L, and the distance between the axis of the first driving rod 932 and the end of the driving block 934 is R, where R < L < 2R. During the 360° rotation of the driving strip 921, the two driving strips 921 alternately enter the rotation path of the driving block 934. When the driving block 934 pushes one driving strip 921 to shift, the other driving strip 921 enters the rotation path of the driving block 934. The driving strip 921 reciprocally adjusts the position of the guide plate 92 by alternately entering the two driving strips 921 on its rotation path. In this embodiment, when the driving block 934 pushes the guide plate 92 to shift to the two maximum positions on both sides, the guide plate 92 moves to the first position where it fits with the first limiting block 96 or the second position where it fits with the second limiting block 97.

[0045] When correcting the deviation and positioning the wafer 100, initially place the wafer 100 on the support base 50. The auxiliary positioning posts 137 are tangent to the outer peripheral surface of the wafer 100. The arc-shaped distributed auxiliary positioning posts 137 can initially correct the deviation of the wafer 100, enabling the wafer 100 to be completely or basically placed in the correct position. Rotate the handwheel 935 to make the driving block 934 on the driving assembly 93 push the guide plate 92 to shift to the first position. The upper ends of the first positioning rod 951, the second positioning rod 952, and the third positioning rod 953 respectively move to the first fixed position 101, the second fixed position 102, and the third fixed position 103 to limit the wafer 100. The first fixed position 101, the second fixed position 102, and the third fixed position 103 further correct the deviation of the wafer 100 from different directions during the movement. The first magnetic attraction assembly 98 locks the guide plate 92 to prevent the first positioning rod 951, the second positioning rod 952, and the third positioning rod 953 from shifting. After completing the deviation correction and positioning of the wafer 100, then install the patch ring 200. At this time, the wafer 100 can be subjected to the film pasting process. Conversely, when it is necessary to take out the wafer 100 after completing the film pasting, rotate the handwheel 935 to make the driving block 934 on the driving assembly 93 push the guide plate 92 to shift to the second position, and the first positioning rod 951, the second positioning rod 952, and the third positioning rod 953 are separated from the wafer 100. The second magnetic attraction assembly 99 locks the guide plate 92.

[0046] As Figure 2, Figure 4 As shown, the number of the first guiding devices 61 is two groups, and the two groups of first guiding devices 61 are respectively installed on the two support plates 11. The pressing die device 70 includes two mounting seats 71 and pressing rollers 72 mounted on the two mounting seats 71, and the two mounting seats 71 of the pressing die device 70 are mounted on the two first guiding devices 61.

[0047] The second guiding device 62 is installed on the two mounting seats 71. Among them, both the first guiding device 61 and the second guiding device 62 adopt a structure similar to the cooperation of a guide rail and a slider. The main difference is that the first guiding device 61 guides the pressing die device 70 in the front - rear direction, and the second guiding device 62 guides the second cutting device 80 in the left - right direction.

[0048] As Figure 9 shown, the second cutting device 80 includes a second tool holder 81, a second pressing head 82 movably installed on the second tool holder 81 in the vertical direction and arranged in a T - shape, a second cutting knife 83 installed on the second pressing head 82, and a second spring 84 elastically abutted against the second tool holder 81 and the second pressing head 82. When pressing down the second pressing head 82, the second cutting knife 83 further extends out from the second tool holder 81 to cut the wafer film, and the second spring 84 contracts. When releasing the second pressing head 82, the second spring 84 elastically returns to its original position, and the second cutting knife 83 is received in the second tool holder 81 to prevent interference when the pressing die device 70 pastes the wafer film on the wafer 100.

[0049] As Figure 2 , Figure 10 , Figure 11 shown, the upper cover 20 includes a main body portion 21, a limiting member 23 installed at the bottom of the main body portion 21, and a guiding disk 82 installed on the limiting member 23. The main body portion 21 is provided with a guiding hole 211. The number of the limiting members 23 is multiple, and the limiting members 23 surround the outer circumference of the guiding hole 211. The limiting member 23 is provided with an arc - shaped groove 231, the edge of the guiding disk 82 is stuck in the arc - shaped groove 231, the guiding disk 82 is coaxial with the guiding hole 211, and the guiding disk 82 can rotate around its axis.

[0050] The first cutting device 30 includes a housing 35, a first tool holder 31 clamped on the housing 35, a first pressing head 32 movably installed on the first tool holder 31 in the vertical direction and arranged in a T - shape, a first cutting knife 33 installed on the first pressing head 32, and a first spring 34 elastically abutted against the first tool holder 31 and the first pressing head 32. During cutting, cover the upper cover 20 and press down the first pressing head 32, the first spring 34 contracts, and the first cutting knife 33 is further adjusted downward. Press down the first pressing head 32 and rotate the first cutting device 30 in the circumferential direction to cut the wafer film, and the guiding disk 82 rotates synchronously. When releasing the first pressing head 32, the first spring 34 elastically returns to its original position, and the first cutting knife 33 moves upward to avoid interference.

[0051] The beneficial effects of the wafer processing film attaching device of the present invention are as follows: By providing a positioning device 90 and auxiliary positioning posts 137 on the first cover 13, the positioning device 90 includes a guide plate 92, a driving component 93, a sleeve group 94, a positioning rod group 95, a first limiting block 96, a second limiting block 97, a first magnetic attraction component 98 and a second magnetic attraction component 99. When correcting the position and positioning the wafer, the auxiliary positioning posts 137 limit and initially correct the position of the wafer 100 on one side. The driving component 93 drives the guide plate 92 to adjust its position, so that the guide plate 92 moves from the other side to the first position. During the movement of the guide plate 92, the positioning rod group 95 performs secondary correction on the wafer 100. When the guide plate 92 moves to the first position, the first magnetic attraction component 98 locks the guide plate 92, and the positioning rod group 95 limits the wafer 100. The present invention can correct the position and fix the wafer without using a gas source, eliminating the dependence on the gas source during the use of the device, effectively simplifying the internal structure, reducing the device cost, increasing the service life of the device, ensuring the film attaching quality, and effectively improving the processing quality of the product in subsequent processes.

[0052] The technical features of the above embodiments can be combined arbitrarily. For the sake of concise description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0053] The above embodiments only represent several implementation manners of the present invention. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the invention patent should be subject to the appended claims.

Claims

1. A wafer processing film laminating device, used for laminating semiconductor wafers, characterized in that: The invention comprises a frame, a support seat mounted on the frame, and a positioning device mounted on the frame and extending into the outer periphery above the support seat, wherein the frame comprises a first surface cover, and the first surface cover is also provided with a plurality of auxiliary positioning columns, and the auxiliary positioning columns are distributed in an arc shape in the horizontal plane direction, and after the crystal source completes position correction on the support seat, the auxiliary positioning columns are tangent to the outer peripheral surface of the wafer; the positioning device comprises a guide plate, a driving component matched with the guide plate, a sleeve group mounted on the upper end surface of the guide plate, a positioning rod group mounted on the sleeve group, and a first limit block and a second limit block arranged on both sides of the guide plate. The guide plate is provided with a first magnetic suction component and a second magnetic suction component, the positioning rod group includes a first positioning rod, a second positioning rod and a third positioning rod, the driving component drives the guide plate to adjust the position, so that the guide plate moves to a first position in contact with the first limit block or a second position in contact with the second limit block. When the guide plate moves to the first position, the first magnetic suction component locks the guide plate, and the first positioning rod, the second positioning rod and the third positioning rod limit the wafer. When the guide plate moves to the second position, the second magnetic suction component locks the guide plate, and the first positioning rod, the second positioning rod and the third positioning rod release the wafer.

2. The wafer processing film bonding equipment according to claim 1, characterized in that: After the wafer is placed on the support seat and the position correction is completed, the projection of the wafer in the vertical direction coincides with the support seat. At this time, the frontmost, rearmost, rightmost and leftmost positions of the wafer periphery are the first fixed position, the second fixed position, the third fixed position and the fourth fixed position respectively. The first positioning rod, the second positioning rod and the third positioning rod are respectively moved to the first fixed position, the second fixed position and the third fixed position to limit the wafer.

3. The wafer processing film bonding equipment according to claim 2, characterized in that: The number of the auxiliary positioning posts is two, and the two auxiliary positioning posts are symmetrically arranged along the line between the third fixing position and the fourth fixing position.

4. The wafer processing film bonding equipment according to claim 2, characterized in that: The first surface cover is also provided with two first functional grooves, two second functional grooves, a first functional hole, a second functional hole and a third functional hole. The first functional hole is located below the first fixed position, the second functional hole is located below the second fixed position, and the third functional hole is located below the third fixed position. The first positioning rod, the second positioning rod and the third positioning rod pass through the first functional hole, the second functional hole and the third functional hole respectively.

5. The wafer processing film bonding equipment according to claim 4, characterized in that: The middle part of the first surface cover is concave to form an installation groove for installing the support seat. The first functional groove and the second functional groove are respectively arranged on the left and right sides of the installation groove. The first functional groove and the second functional groove extend downward from the upper end surface of the first surface cover, and the first functional groove and the second functional groove are connected with the installation groove in the horizontal direction. The first functional hole and the second functional hole are arranged on the front and rear sides of the functional groove, and the third functional hole is arranged between the two second functional grooves. The hole shapes of the first functional hole, the second functional hole and the third functional hole are all long holes extending in the horizontal direction, and the auxiliary positioning column is vertically connected to the bottom of the second functional groove.

6. The wafer processing film bonding equipment according to claim 1, characterized in that: The driving assembly includes a first driving rod and a driving block installed on the first driving rod. Two driving bars are also provided at the bottom of the guide plate. The two driving bars are distributed side by side, and the two driving bars are arranged along the guide plate in the adjustment direction of the guide assembly. The driving block is arranged between the two driving bars, wherein the interval between the two driving bars is L, and the distance between the axis of the first driving rod and the end of the driving block is R, wherein R<L<2R, and when the driving bars rotate, the driving block pushes one driving bar to shift, and the other driving bar enters the rotation path of the driving block.

7. The wafer processing film bonding equipment according to claim 6, characterized in that: When the driving block pushes the guide plate to shift to the maximum positions on both sides, the guide plate moves to the first position abutting against the first limit block or the second position abutting against the second limit block.

8. The wafer processing film bonding equipment according to claim 6, characterized in that: The driving assembly also includes a gearbox, a second driving rod installed at the input end of the gearbox, and a handwheel connected to the end of the second driving rod. The first driving rod is installed at the output end of the gearbox, the driving block is connected to the end of the first driving rod, the second driving rod is installed on the gearbox in the horizontal direction, and the first driving rod is installed on the gearbox in the vertical direction. The gearbox connects the first driving rod and the second driving rod to realize the linkage between the first driving rod and the second driving rod.

9. The wafer processing film bonding equipment according to claim 1, characterized in that: The positioning device also includes a guide assembly, the guide plate is mounted on the guide assembly, and the guide assembly guides the guide plate.

10. The wafer processing film bonding equipment according to claim 1, characterized in that: The first magnetic attraction component is composed of two groups of magnetic parts, and the two groups of magnetic parts of the first magnetic attraction component are respectively installed on the side of the first limit block and the guide plate close to each other, and the different groups of magnetic parts on the first magnetic attraction component correspond to each other and are aligned with each other; the second magnetic attraction component is also composed of two groups of magnetic parts, and the two groups of magnetic parts of the second magnetic attraction component are respectively installed on the side of the second limit block and the guide plate close to each other, and the different groups of magnetic parts on the second magnetic attraction component correspond to each other and are aligned with each other.

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