Wafer clamping device and chuck equipment

Abstract

The invention provides a wafer clamping device and chuck equipment, and the device comprises a plurality of clamping pins which are disposed on a chuck; the plurality of driving mechanisms are respectively connected with the plurality of clamping pins; the plurality of pressure detection assemblies are respectively arranged on the plurality of clamping pins; the controller is respectively connected with the plurality of pressure detection assemblies and the plurality of driving mechanisms, and is used for judging whether the wafer is inclined or not according to pressure detection signals of the plurality of pressure detection assemblies when the wafer is clamped by the clamping pin, obtaining a lifting adjustment value of the to-be-adjusted clamping pin according to the pressure detection signals when the wafer is judged to be inclined, and adjusting the lifting adjustment value of the to-be-adjusted clamping pin according to the lifting adjustment value. And according to the lifting adjustment value, a corresponding driving mechanism is controlled to drive the to-be-adjusted clamping pin to carry out lifting adjustment, and the wafer is adjusted to a horizontal state. According to the invention, after the wafer is clamped, the state of the wafer is judged, and the inclined wafer is adjusted, so that the problems of wafer fragmentation, wafer pattern damage and the like are avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment, and particularly relates to a wafer clamping device and a chuck device. Background Art

[0002] In the chamber of a wafer chuck device, a wafer is first placed on a chuck. Nitrogen is ejected through Bernoulli nitrogen holes on the chuck to suspend the wafer, and then clamping pins will clamp the wafer. Subsequently, the wafer can rotate with the chuck during subsequent processes. Under high-speed rotation, the clamping pins only play a fixing role, and the Bernoulli nitrogen gas flow plays a role in protecting and supporting the wafer to protect the wafer pattern from being scratched and contaminated.

[0003] In actual processes, if the Bernoulli nitrogen gas flow is unstable at the beginning or the position of the wafer is slightly offset when placed above the Bernoulli nitrogen, the wafer will shake. At this time, when the clamping pins clamp the wafer, the wafer will tilt. When the tilted wafer rotates, problems such as unbalanced force will occur, and in severe cases, wafer fragmentation and damage to the wafer pattern will occur.

[0004] In view of this, it is necessary to provide a wafer clamping device and a chuck device to solve the above problems. Summary of the Invention

[0005] The purpose of the present invention is to provide a wafer clamping device and a chuck device to avoid problems such as wafer fragmentation and damage to the wafer pattern caused by the rotation of a clamped tilted wafer.

[0006] The present invention provides a wafer clamping device, including: A plurality of clamping pins, arranged on the chuck and used for clamping the wafer; A plurality of driving mechanisms, respectively connected to the plurality of clamping pins. The driving mechanisms are arranged in one-to-one correspondence with the clamping pins and are used to drive the corresponding clamping pins to perform lifting and lowering adjustments; A plurality of pressure detection components, respectively arranged on the plurality of clamping pins and used to detect the pressure between the clamping pins and the wafer; A controller, respectively connected to the plurality of pressure detection components and the plurality of driving mechanisms. When the clamping pins clamp the wafer, the controller is used to judge whether the wafer is tilted according to the pressure detection signals of the plurality of pressure detection components. When it is judged that the wafer is tilted, the lifting and lowering adjustment value of the clamping pin to be adjusted is obtained according to the pressure detection signal, and the corresponding driving mechanism is controlled according to the lifting and lowering adjustment value to drive the clamping pin to be adjusted to perform lifting and lowering adjustments, so as to adjust the wafer to a horizontal state.

[0007] The beneficial effects of the wafer clamping device provided by the present invention are as follows: After the clamping pins clamp the wafer, the pressure between the clamping pins and the wafer is detected by the pressure detection component. The controller determines whether the wafer is tilted according to the pressure detection signals of several pressure detection components. When it is determined that the wafer is tilted, the controller calculates the lifting adjustment value of the clamping pins to be adjusted, and controls the clamping pins to be adjusted to lift according to the lifting adjustment value, so as to adjust the wafer to a horizontal state, enabling the wafer to rotate safely and avoiding problems such as wafer fragmentation and damage to the wafer pattern.

[0008] In a possible embodiment, the pressure detection component includes a plurality of sub-pressure detection elements arranged vertically on the clamping pins, and two adjacent sub-pressure detection elements are arranged in contact with each other.

[0009] The beneficial effects are as follows: Each sub-pressure detection element can perform pressure detection independently, so as to facilitate determining which sub-pressure detection element is in contact with the wafer.

[0010] In a possible embodiment, the controller includes a position judgment module connected to a plurality of pressure detection components. The position judgment module is used to obtain the contact position between each clamping pin and the wafer according to the change of the pressure detection signals of the sub-pressure detection elements on the clamping pins.

[0011] The beneficial effects are as follows: By monitoring the change of the pressure detection signals of each sub-pressure detection element, the position judgment module can accurately identify which sub-pressure detection elements are in contact with the wafer. Once the contact positions between the wafer and each clamping pin are determined, the controller can use this information to evaluate the tilt state of the wafer.

[0012] In a possible embodiment, the controller includes a tilt judgment module connected to the position judgment module. The tilt judgment module is used to calculate the difference between each pair of all the contact positions to determine whether the absolute value of the difference is greater than or equal to a set difference. If so, it is determined that the wafer is tilted; if not, it is determined that the wafer is horizontal.

[0013] The beneficial effects are as follows: The calculation process of the tilt judgment module is relatively simple and efficient. Only by comparing and calculating the differences between each pair of contact positions can the state of the wafer be quickly and accurately judged.

[0014] In a possible embodiment, the controller includes a lifting calculation module connected to the position determination module. If the wafer is tilted, the lifting calculation module is configured to compare all the contact positions, determine the highest contact position and the lowest contact position therefrom, and calculate the difference between the highest contact position and the lowest contact position to obtain the lifting adjustment value.

[0015] The beneficial effect is that once the wafer tilt is detected, the lifting calculation module will automatically calculate the lifting adjustment value based on the highest contact position and the lowest contact position to guide the subsequent lifting adjustment of the clamping pins.

[0016] In a possible embodiment, the controller further includes an adjustment determination module connected to the lifting calculation module. The adjustment determination module is configured to: When the lowest contact position is lower than a first preset position and the highest contact position is lower than or equal to a second preset position (where the second preset position is higher than the first preset position), determine the clamping pin at the lowest contact position as the clamping pin to be adjusted; When the lowest contact position is higher than or equal to the first preset position and the highest contact position is higher than the second preset position, determine the clamping pin at the highest contact position as the clamping pin to be adjusted; When the lowest contact position is higher than or equal to the first preset position and the highest contact position is lower than or equal to the second preset position, calculate a first vertical distance between the lowest contact position and the first preset position and a second vertical distance between the highest contact position and the second preset position. If the first vertical distance and the second vertical distance are not equal, determine the clamping pin corresponding to the larger of the first vertical distance and the second vertical distance as the clamping pin to be adjusted. If the first vertical distance and the second vertical distance are equal, determine the clamping pin at the lowest contact position or the clamping pin at the highest contact position as the clamping pin to be adjusted; When the lowest contact position is lower than the first preset position and the highest contact position is higher than the second preset position, calculate a first vertical distance between the lowest contact position and the first preset position and a second vertical distance between the highest contact position and the second preset position. If the first vertical distance and the second vertical distance are not equal, determine the clamping pin corresponding to the larger of the first vertical distance and the second vertical distance as the clamping pin to be adjusted. If the first vertical distance and the second vertical distance are equal, determine the clamping pin at the lowest contact position or the clamping pin at the highest contact position as the clamping pin to be adjusted.

[0017] The beneficial effects are as follows: The adjustment determination module determines the clamping pin to be adjusted by comparing and judging the lowest contact position and the highest contact position, ensuring that the height of the wafer after adjustment is appropriate.

[0018] In a possible embodiment, the controller further includes a feedback adjustment module connected to the adjustment determination module and several of the driving mechanisms; When the clamping pin to be adjusted is the clamping pin at the lowest contact position, the feedback adjustment module is used to control the driving mechanism corresponding to the clamping pin at the lowest contact position to raise the clamping pin at the lowest contact position by the lifting adjustment value, so as to adjust the wafer to a horizontal state; When the clamping pin to be adjusted is the clamping pin at the highest contact position, the feedback adjustment module is used to control the driving mechanism corresponding to the clamping pin at the highest contact position to lower the clamping pin at the highest contact position by the lifting adjustment value, so as to adjust the wafer to a horizontal state.

[0019] The beneficial effects are as follows: The feedback adjustment module specifically controls the corresponding driving mechanism to drive the clamping pin to be adjusted to perform lifting adjustment according to the clamping pin to be adjusted, so as to adjust the wafer to a horizontal state, thereby preventing problems such as wafer fragmentation and wafer pattern damage during rotation.

[0020] In a possible embodiment, the controller includes a judgment adjustment module connected to the position judgment module and several of the driving mechanisms, which is used to calculate the deviation value between each contact position and the reference position respectively, judge whether the absolute value of the deviation value is greater than or equal to a preset deviation value. If so, it is judged that the wafer is tilted, the clamping pin corresponding to the deviation value greater than or equal to the preset deviation value is determined as the clamping pin to be adjusted, the deviation value of the clamping pin to be adjusted is determined as the lifting adjustment value of the clamping pin to be adjusted, and the corresponding driving mechanism is controlled according to the lifting adjustment value of the clamping pin to be adjusted to drive the clamping pin to be adjusted to perform lifting adjustment, so as to adjust the clamping pin to be adjusted to the reference position; if not, it is judged that the wafer is horizontal.

[0021] The beneficial effects are as follows: By judging and comparing each contact position with the reference position, the clamping pin to be adjusted with deviation and its lifting adjustment value are determined, and the clamping pin with deviation is adjusted according to the lifting adjustment value, so as to adjust the wafer to a horizontal state.

[0022] In a possible embodiment, the width of the sub-pressure detection member in the vertical direction is greater than or equal to the thickness of the wafer; and / or, the sub-pressure detection member is a flexible pressure sensor.

[0023] The beneficial effects are as follows: The flexible pressure sensor can be better attached to the clamping pin, adapting to the requirements of the clamping pin for the wafer.

[0024] The present invention also provides a chuck device, including: a chuck and the wafer clamping device described in any of the above embodiments. Description of the Drawings

[0025] Figure 1 It is the front view when the wafer clamping device of the present invention clamps the wafer.

[0026] Figure 2 It is a schematic diagram of the clamping pin, the driving mechanism, and the pressure detection component in the wafer clamping device of the present invention.

[0027] Figure 3 It is the top view when the wafer clamping device of the present invention clamps the wafer.

[0028] Figure 4 It is the logic block diagram of the controller in one embodiment of the wafer clamping device of the present invention.

[0029] Figure 5 It is the logic block diagram of the controller in another embodiment of the wafer clamping device of the present invention.

[0030] Figure 6 It is a schematic diagram of a clamping pin of the wafer clamping device of the present invention when clamping a wafer in a horizontal state.

[0031] Figure 7 It is the state diagram of the clamping pin at the highest contact position of the wafer clamping device of the present invention when clamping a wafer in an inclined state.

[0032] Figure 8 It is the state diagram of the clamping pin at the highest contact position of the wafer clamping device of the present invention after adjustment.

[0033] Figure 9 It is the state diagram of the clamping pin at the lowest contact position of the wafer clamping device of the present invention when clamping a wafer in an inclined state.

[0034] Figure 10 It is the state diagram of the clamping pin at the lowest contact position of the wafer clamping device of the present invention after adjustment.

[0035] Description of the Reference Numerals: 110, clamping pin; 120, driving mechanism; 130, pressure detection component; 131, sub-pressure detection piece; 140, controller; 141, position judgment module; 142, inclination judgment module; 143, lifting calculation module; 144, adjustment determination module; 145, feedback adjustment module; 146, judgment adjustment module; 200, wafer; 300, chuck. Detailed implementation manners

[0036] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Apparently, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0037] In view of the problems existing in the prior art, an embodiment of the present invention provides a wafer clamping device, which is applied to any device for clamping wafers in semiconductor equipment, for example, a single-wafer cleaning device. Refer to Figure 1 、 Figure 2 and Figure 3 , the wafer clamping device includes: a plurality of clamping pins 110, a plurality of driving mechanisms 120, a plurality of pressure detection components 130 and a controller 140. The plurality of clamping pins 110 are arranged on a chuck 300 and used for clamping a wafer 200. The plurality of clamping pins 110 are spaced apart along the circumferential direction of the chuck 300. The plurality of driving mechanisms 120 are respectively connected to the plurality of clamping pins 110. The driving mechanisms 120 and the clamping pins 110 are arranged in one-to-one correspondence and used for driving the corresponding clamping pins 110 to perform lifting adjustment. The driving mechanisms 120 are located inside the chuck 300. The plurality of pressure detection components 130 are respectively arranged on the plurality of clamping pins 110 and used for detecting the pressure between the clamping pins 110 and the wafer 200. The controller 140 is respectively connected to the plurality of pressure detection components 130 and the plurality of driving mechanisms 120. When the clamping pins 110 clamp the wafer 200, the controller 140 is used to judge whether the wafer 200 is tilted according to the pressure detection signals of the plurality of pressure detection components 130. When it is judged that the wafer 200 is tilted, the lifting adjustment value of the clamping pin 110 to be adjusted is obtained according to the pressure detection signal, and the corresponding driving mechanism 120 is controlled according to the lifting adjustment value to drive the clamping pin 110 to be adjusted to perform lifting adjustment, so as to adjust the wafer 200 to a horizontal state.

[0038] The present invention designs a technical solution for judging the state of the wafer 200 and adjusting the tilted wafer 200 after the clamping pin 110 clamps the wafer 200. The pressure detection component 130 detects the pressure between the clamping pin 110 and the wafer 200, and the controller 140 judges whether the wafer 200 is tilted according to the pressure signal. When it is judged that the wafer 200 is tilted, the clamping pin 110 to be adjusted is determined according to the pressure detection signal, and the lifting adjustment value of the clamping pin 110 to be adjusted is calculated. The controller 140 can control the driving mechanism 120 to accurately adjust the height of the clamping pin 110 to be adjusted according to the lifting adjustment value, and adjust the wafer 200 to a horizontal state, thereby avoiding problems such as poor etching uniformity, fragments, and damage to the pattern of the wafer 200 caused by the tilted rotation of the wafer 200.

[0039] In one embodiment, referring to Figure 2 , the pressure detection component 130 includes a plurality of sub-pressure detection members 131 arranged on the clamping pin 110 along the vertical direction, and two adjacent sub-pressure detection members 131 are arranged in abutting contact. In this embodiment, a plurality of sub-pressure detection members 131 are closely arranged on each clamping pin 110 in the vertical direction to ensure that there are sub-pressure detection members 131 at any height position where the wafer 200 abuts against the clamping pin 110. Each sub-pressure detection member 131 can perform pressure detection independently, and the contact position of the wafer 200 can be calculated through the position of the sub-pressure detection member 131.

[0040] It should be noted that the sizes of the clamping pins 110 are the same, the widths of the sub-pressure detection members 131 in the vertical direction are the same, and the heights of the clamping pins 110 in the vertical direction are the same when initially clamping the wafer 200. That is, in this initial clamping state, the heights of each pressure detection component 130 in the vertical direction are the same. It can be understood that, from top to bottom, the heights of the first sub-pressure detection members 131 on each clamping pin 110 are the same, the heights of the second sub-pressure detection members 131 on each clamping pin 110 are the same, and so on. The heights of the Nth sub-pressure detection members 131 on each clamping pin 110 are the same, where N is the number of sub-pressure detection members 131 on the clamping pin 110.

[0041] In a preferred embodiment, referring to Figure 4 and Figure 6, the controller 140 includes a position determination module 141 connected to a plurality of pressure detection components 130. The position determination module 141 is configured to obtain the contact position of each chuck pin 110 with the wafer 200 according to the change in the pressure detection signal of the sub-pressure detection component 131 on the chuck pin 110. In this embodiment, if the sub-pressure detection component 131 contacts the wafer 200, the pressure detection signal of the sub-pressure detection component 131 will change. Thus, it can be determined which position of the sub-pressure detection component 131 on each chuck pin 110 contacts the wafer 200, so as to obtain the contact position of each chuck pin 110 with the wafer 200 for subsequent tilt judgment and adjustment.

[0042] In one embodiment, referring to Figure 4 , Figure 7 and Figure 8 , the controller 140 includes a tilt judgment module 142 connected to the position determination module 141. The tilt judgment module 142 is configured to calculate the difference between each pair of all the contact positions to determine whether the absolute value of the difference is greater than or equal to a set difference. If so, it is determined that the wafer 200 is tilted; if not, it is determined that the wafer 200 is horizontal. In this embodiment, the tilt judgment module 142 calculates the difference between each pair of all the contact positions. If the difference is very small, the contact positions of the wafer 200 with each chuck pin 110 are approximately at the same height position, and it can be considered that the wafer 200 is horizontal; if the contact positions of the wafer 200 with each chuck pin 110 deviate greatly, it can be considered that the wafer 200 is tilted, so that the state of the wafer 200 can be quickly and accurately judged.

[0043] In a preferred embodiment, referring to Figure 4 and Figure 7 , the controller 140 includes a lifting calculation module 143 connected to the position determination module 141. If the wafer 200 is tilted, the lifting calculation module 143 is configured to compare all the contact positions and determine the highest contact position and the lowest contact position therefrom, and calculate the difference between the highest contact position and the lowest contact position to obtain a lifting adjustment value. In this embodiment, if the wafer 200 is tilted, the highest contact position and the lowest contact position of the wafer 200 with the chuck pin 110 reflect the tilt state of the wafer 200. The lifting calculation module 143 calculates a lifting adjustment value according to the highest contact position and the lowest contact position, and adjusts the wafer 200 to a horizontal state during subsequent adjustment operations according to this lifting adjustment value.

[0044] In a specific embodiment, referring to Figure 4 and Figure 7, the controller 140 further includes an adjustment determination module 144 connected to the lifting calculation module 143. The adjustment determination module 144 is configured to: when the lowest contact position is lower than the first preset position and the highest contact position is lower than or equal to the second preset position, determine the clamping pin 110 at the lowest contact position as the clamping pin 110 to be adjusted. When the lowest contact position is higher than or equal to the first preset position and the highest contact position is higher than the second preset position, determine the clamping pin 110 at the highest contact position as the clamping pin 110 to be adjusted, where the second preset position is higher than the first preset position. When the lowest contact position is higher than or equal to the first preset position and the highest contact position is lower than or equal to the second preset position, calculate the first vertical distance between the lowest contact position and the first preset position and the second vertical distance between the highest contact position and the second preset position. If the first vertical distance and the second vertical distance are not equal, determine the clamping pin 110 corresponding to the larger of the first vertical distance and the second vertical distance as the clamping pin 110 to be adjusted. If the first vertical distance and the second vertical distance are equal, determine the clamping pin 110 at the lowest contact position or the clamping pin 110 at the highest contact position as the clamping pin 110 to be adjusted. When the lowest contact position is lower than the first preset position and the highest contact position is higher than the second preset position, calculate the first vertical distance between the lowest contact position and the first preset position and the second vertical distance between the highest contact position and the second preset position. If the first vertical distance and the second vertical distance are not equal, determine the clamping pin 110 corresponding to the larger of the first vertical distance and the second vertical distance as the clamping pin 110 to be adjusted. If the first vertical distance and the second vertical distance are equal, determine the clamping pin 110 at the lowest contact position or the clamping pin 110 at the highest contact position as the clamping pin 110 to be adjusted.

[0045] In this embodiment, when the lowest contact position is lower than the first preset position and the highest contact position is lower than or equal to the second preset position, the deviation of the lowest contact position between the wafer 200 and the clamping pin 110 is relatively large. By raising the clamping pin 110 at the lowest contact position, the lowest contact position between the wafer 200 and the clamping pin 110 can be raised, avoiding the position of the wafer 200 after adjustment being too low. When the lowest contact position is higher than or equal to the first preset position and the highest contact position is higher than the second preset position, the deviation of the highest contact position between the wafer 200 and the clamping pin 110 is relatively large. By lowering the clamping pin 110 at the highest contact position of the wafer 200, the highest contact position between the wafer 200 and the clamping pin 110 can be lowered, avoiding the position of the wafer 200 after adjustment being too high. When the lowest contact position is higher than or equal to the first preset position and the highest contact position is lower than or equal to the second preset position, if the first vertical distance and the second vertical distance are not equal, select the larger one of the first vertical distance and the second vertical distance as the clamping pin 110 to be adjusted, so that the position of the wafer 200 after adjustment is closer to the appropriate position; if the first vertical distance and the second vertical distance are equal, select the clamping pin 110 at the lowest contact position or the clamping pin 110 at the highest contact position as the clamping pin 110 to be adjusted. When the lowest contact position is lower than the first preset position and the highest contact position is higher than the second preset position, if the first vertical distance and the second vertical distance are not equal, select the larger one of the first vertical distance and the second vertical distance as the clamping pin 110 to be adjusted, so that the position of the wafer 200 after adjustment is closer to the appropriate position; if the first vertical distance and the second vertical distance are equal, select the clamping pin 110 at the lowest contact position or the clamping pin 110 at the highest contact position as the clamping pin 110 to be adjusted. Therefore, the adjustment determination module 144 automatically judges and determines the suitable clamping pin 110 to be adjusted to ensure that the wafer 200 after being adjusted to horizontal is at an appropriate height.

[0046] In one embodiment, refer to Figure 4 and Figure 7, the controller 140 further includes a feedback adjustment module 145 connected to the adjustment determination module 144 and a plurality of driving mechanisms 120; when the clamping pin 110 to be adjusted is the clamping pin 110 at the lowest contact position, the feedback adjustment module 145 is configured to control the driving mechanism 120 corresponding to the clamping pin 110 at the lowest contact position to raise the clamping pin 110 at the lowest contact position by a lifting adjustment value, so as to adjust the wafer 200 to a horizontal state; when the clamping pin 110 to be adjusted is the clamping pin 110 at the highest contact position, the feedback adjustment module 145 is configured to control the driving mechanism 120 corresponding to the clamping pin 110 at the highest contact position to lower the clamping pin 110 at the highest contact position by a lifting adjustment value, so as to adjust the wafer 200 to a horizontal state. In this embodiment, after the adjustment determination module 144 determines the clamping pin 110 to be adjusted, the feedback adjustment module 145 performs corresponding lifting adjustment according to the clamping pin 110 to be adjusted. For the clamping pin 110 at the lowest contact position, the driving mechanism 120 raises the clamping pin 110 at the lowest contact position by a lifting adjustment value, so as to adjust the inclined wafer 200 to a horizontal state at a suitable height; for the clamping pin 110 at the highest contact position, the driving mechanism 120 lowers the clamping pin 110 at the highest contact position by a lifting adjustment value, so as to adjust the inclined wafer 200 to a horizontal state at a suitable height, avoiding problems such as poor etching uniformity, fragments, and damage to the wafer 200 pattern caused by the inclined rotation of the wafer 200.

[0047] In another embodiment, referring to Figure 5 and Figure 7 , the controller 140 includes a judgment adjustment module 146 connected to the position judgment module 141 and a plurality of driving mechanisms 120, which is configured to calculate the deviation value between each contact position and the reference position respectively, and judge whether there is an absolute value of the deviation value greater than or equal to a preset deviation value. If so, it is judged that the wafer 200 is inclined, the clamping pin 110 corresponding to the deviation value greater than or equal to the preset deviation value is determined as the clamping pin to be adjusted, the deviation value of the clamping pin 110 to be adjusted is determined as the lifting adjustment value of the clamping pin to be adjusted, and the corresponding driving mechanism 120 is controlled according to the lifting adjustment value of the clamping pin to be adjusted to drive the clamping pin 110 to be adjusted to perform lifting adjustment, so as to adjust the clamping pin 110 to be adjusted to the reference position; if not, it is judged that the wafer 200 is horizontal.

[0048] By calculating the deviation of each contact position from the reference position, comparing the deviation value between the contact position and the reference position with a preset deviation value, accurately identifying which contact positions have deviated, thereby determining the clamping pins 110 to be adjusted and their lifting adjustment values, and according to the lifting adjustment values, correspondingly controlling the corresponding drive mechanism 120 to drive the clamping pins 110 to be adjusted with deviations to the reference position, so as to adjust the wafer 200 to a horizontal state, thereby preventing problems such as wafer 200 fragmentation and damage to the wafer 200 pattern during rotation.

[0049] In one embodiment, referring to Figure 2 , the sub-pressure detection member 131 is a flexible pressure sensor, for example, a micro sensor such as a thin-film pressure sensor. In this embodiment, the flexible pressure sensor has good flexibility and is relatively thin, can adapt to the surface profile of the clamping pin 110 and closely fit the surface of the clamping pin 110. After modification, it will not make the volume of the clamping pin 110 too large or the shape change too much, and can still meet the original adjustment and clamping functions of the clamping pin 110. In addition, the flexible pressure sensor has high sensitivity and can accurately sense minute pressure changes. This high sensitivity enables the sub-pressure detection member 131 to accurately detect the contact pressure between the wafer 200 and the clamping pin 110, and even small pressure differences can be detected.

[0050] In one embodiment, referring to Figure 2 , the width of the sub-pressure detection member 131 in the vertical direction is greater than or equal to the thickness of the wafer 200. Preferably, the difference between the width of the sub-pressure detection member 131 in the vertical direction and the thickness of the wafer 200 is small. By reasonably setting the width of the sub-pressure detection member 131 in the vertical direction, when the wafer 200 contacts a certain sub-pressure detection member 131, it can ensure that the sub-pressure detection member 131 has sufficient contact area with the wafer 200 to more accurately detect the contact pressure between the wafer 200 and the clamping pin 110, and since the width and height of each sub-pressure detection member 131 in the vertical direction are determined, and the initial heights of the sub-pressure detection members 131 on the clamping pin 110 are the same, the contact position can be determined more accurately.

[0051] In some specific embodiments, the drive mechanism 120 is a linear module, a cylinder, etc. The specific type of the drive mechanism 120 is not specifically limited here, as long as it can drive the clamping pin 110 to lift and adjust.

[0052] The present invention also provides a chuck device, including: a chuck 300 and a wafer clamping device as described in any of the above embodiments.

[0053] The adjustment principle of the wafer clamping device of the present invention will be explained below in conjunction with specific embodiments.

[0054] After a plurality of clamping pins 110 clamp the wafer 200, the position judgment module 141 obtains the contact position between each clamping pin 110 and the wafer 200 according to the change of the pressure detection signal of the sub-pressure detection member 131 on the clamping pin 110.

[0055] In one embodiment, the tilt judgment module 142 calculates the difference between every two of all the contact positions. If the absolute value of the difference is less than or equal to the set difference, that is, all the contact positions are approximately equal, it is determined that the wafer 200 is horizontal. As Figure 5 shown, there is no need to perform tilt adjustment and subsequent processes can be directly executed. If the absolute value of the difference is greater than or equal to the set difference, it is determined that the wafer 200 is tilted. The lift calculation module 143 calculates the difference between the highest contact position and the lowest contact position to obtain the lift adjustment value. The adjustment determination module 144 determines the clamping pins 110 that need to be adjusted. The feedback adjustment module 145 controls the driving mechanism 120 corresponding to the clamping pins 110 that need to be adjusted according to the lift adjustment value to adjust the height of the clamping pins 110 that need to be adjusted, so as to adjust the wafer 200 to a horizontal state, and then execute subsequent processes. Taking the example that there are three sub-pressure detection members 131 on each clamping pin 110, the first preset position is the lower position of the middle sub-pressure detection member 131, and the second preset position is the upper position of the middle sub-pressure detection member 131. Refer to Figure 7 , the highest contact position is on the upper sub-pressure detection member 131, and the lowest contact position is on the middle sub-pressure detection member 131, which belongs to the situation where the lowest contact position is higher than or equal to the first preset position and the highest contact position is higher than the second preset position. The adjustment determination module 144 determines the clamping pin 110 at the highest contact position as the clamping pin 110 to be adjusted. Refer to Figure 8 , the feedback adjustment module 145 controls the driving mechanism 120 corresponding to the clamping pin 110 at the highest contact position to lower the clamping pin 110 at the highest contact position by the lift adjustment value, so as to adjust the wafer 200 to a horizontal state. Refer to Figure 9 , the lowest contact position is on the lower sub-pressure detection member 131, and the highest contact position is on the middle sub-pressure detection member 131, which belongs to the situation where the lowest contact position is lower than the first preset position and the highest contact position is lower than or equal to the second preset position. The adjustment determination module 144 determines the clamping pin 110 at the lowest contact position as the clamping pin 110 to be adjusted. Refer to Figure 10 , the feedback adjustment module 145 controls the driving mechanism 120 corresponding to the clamping pin 110 at the lowest contact position to raise the clamping pin 110 at the lowest contact position by the lift adjustment value, so as to adjust the wafer 200 to a horizontal state.

[0056] In another embodiment, taking the example that there are three sub-pressure detectors 131 on each clamping pin 110, the thickness of the sub-pressure detector 131 is equal to or approximately equal to the thickness of the wafer 200. Taking the sub-pressure detector 131 in the middle as the reference position, see Figure 6 , for each clamping pin 110, the sub-pressure detector 131 in the middle is the contact position, that is, the contact position is the same as the reference position, and it is determined that the wafer is horizontal. See Figure 7 , for one of the clamping pins 110, the sub-pressure detector 131 in the middle is the contact position, and for the remaining clamping pins 110, the contact positions are higher than the sub-pressure detector 131 in the middle. It is determined that the wafer 200 is tilted. Adjust the driving mechanism 120 of the remaining clamping pins 110 to lower the remaining clamping pins 110 to the reference position so as to adjust the wafer 200 to a horizontal state, as Figure 8 shown. See Figure 9 , for one of the clamping pins 110, the sub-pressure detector 131 in the middle is the contact position, and for the remaining clamping pins 110, the contact positions are lower than the sub-pressure detector 131 in the middle. It is determined that the wafer 200 is tilted. Adjust the driving mechanism 120 of the remaining clamping pins 110 to raise the remaining clamping pins 110 to the reference position so as to adjust the wafer 200 to a horizontal state, as Figure 10 shown.

[0057] In the description of the present invention, it should be understood that the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that comprises a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0058] It should be understood that the orientation or positional relationships indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present invention.

[0059] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, the meaning of "a plurality" is two or more.

[0060] Although the embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations are all within the scope and spirit of the present invention as described in the claims. Moreover, the present invention described herein may have other embodiments and can be implemented or realized in various ways. Unless otherwise defined, the technical terms or scientific terms used herein should have the ordinary meaning as understood by those of ordinary skill in the art to which the present invention pertains.

Claims

1. A wafer clamping device, characterized in that: include: A plurality of clamping pins are provided on the chuck and used for clamping the wafer; A plurality of driving mechanisms are respectively connected to the plurality of clamping pins, the driving mechanisms are arranged in one-to-one correspondence with the clamping pins and are used to drive the corresponding clamping pins to be raised and lowered; A plurality of pressure detection components, respectively disposed on a plurality of the clamping pins and used to detect the pressure between the clamping pins and the wafer; The controller is respectively connected to several of the pressure detection components and several of the driving mechanisms. When the clamping pins clamp the wafer, the controller is used to determine whether the wafer is tilted based on the pressure detection signals of the several pressure detection components. When it is determined that the wafer is tilted, the lifting and lowering adjustment value of the clamping pin to be adjusted is obtained according to the pressure detection signal, and the corresponding driving mechanism is controlled according to the lifting and lowering adjustment value to drive the clamping pin to be adjusted to perform lifting and lowering adjustment, so as to adjust the wafer to a horizontal state.

2. The wafer clamping device according to claim 1, characterized in that: The pressure detection assembly includes a plurality of sub-pressure detection components which are arranged on the clamping pin and in a vertical direction, and two adjacent sub-pressure detection components are arranged close to each other.

3. The wafer clamping device according to claim 2, characterized in that: The controller includes a position judgment module connected to several of the pressure detection components, and the position judgment module is used to obtain the contact position of each clamping pin and the wafer according to the change of the pressure detection signal of the sub-pressure detection component on the clamping pin.

4. The wafer clamping device according to claim 3, characterized in that: The controller includes a tilt judgment module connected to the position judgment module, and the tilt judgment module is used to perform pairwise difference calculations on all the contact positions to determine whether there is an absolute value of the difference greater than or equal to a set difference. If so, it is determined that the wafer is tilted; if not, it is determined that the wafer is horizontal.

5. The wafer clamping device according to claim 4, characterized in that: The controller includes a lifting and lowering calculation module connected to the position judgment module. If the wafer is tilted, the lifting and lowering calculation module is used to compare all the contact positions and determine the highest contact position and the lowest contact position therefrom, and calculate the difference between the highest contact position and the lowest contact position to obtain the lifting and lowering adjustment value.

6. The wafer clamping device according to claim 5, characterized in that: The controller further includes an adjustment determination module connected to the lifting calculation module, and the adjustment determination module is used to: When the lowest contact position is lower than the first preset position and the highest contact position is lower than or equal to the second preset position, the clamping pin at the lowest contact position is determined to be the clamping pin to be adjusted, and the second preset position is higher than the first preset position; When the lowest contact position is higher than or equal to the first preset position and the highest contact position is higher than the second preset position, determining that the clamping pin at the highest contact position is the clamping pin to be adjusted; When the lowest contact position is higher than or equal to the first preset position and the highest contact position is lower than or equal to the second preset position, a first vertical distance between the lowest contact position and the first preset position and a second vertical distance between the highest contact position and the second preset position are calculated; if the first vertical distance is not equal to the second vertical distance, the clamping pin corresponding to the larger of the first vertical distance and the second vertical distance is determined as the clamping pin to be adjusted; if the first vertical distance is equal to the second vertical distance, the clamping pin at the lowest contact position or the clamping pin at the highest contact position is determined as the clamping pin to be adjusted; When the lowest contact position is lower than the first preset position and the highest contact position is higher than the second preset position, calculate the first vertical distance between the lowest contact position and the first preset position, and the second vertical distance between the highest contact position and the second preset position; if the first vertical distance is not equal to the second vertical distance, determine the clamping pin corresponding to the larger of the first vertical distance and the second vertical distance as the clamping pin to be adjusted; if the first vertical distance is equal to the second vertical distance, determine the clamping pin at the lowest contact position or the clamping pin at the highest contact position as the clamping pin to be adjusted.

7. The wafer clamping device according to claim 6, characterized in that: The controller further comprises a feedback adjustment module connected to the adjustment determination module and a plurality of the driving mechanisms; When the clamping pin to be adjusted is the clamping pin at the lowest contact position, the feedback adjustment module is used to control the driving mechanism corresponding to the clamping pin at the lowest contact position to make the clamping pin at the lowest contact position rise by the lifting adjustment value, so as to adjust the wafer to a horizontal state; When the clamping pin to be adjusted is the clamping pin at the highest contact position, the feedback adjustment module is used to control the driving mechanism corresponding to the clamping pin at the highest contact position to make the clamping pin at the highest contact position drop by the lifting adjustment value to adjust the wafer to a horizontal state.

8. The wafer clamping device according to claim 3, characterized in that: The controller includes a judgment and adjustment module connected to the position judgment module and a plurality of the driving mechanisms, and is used to respectively calculate the deviation value between each of the contact positions and the reference position, and judge whether there is an absolute value of the deviation value greater than or equal to a preset deviation value. If so, the wafer is judged to be tilted, and a clamping pin corresponding to a value greater than or equal to the preset deviation value is determined as a clamping pin to be adjusted, and the deviation value of the clamping pin to be adjusted is determined as a lifting adjustment value of the clamping pin to be adjusted. According to the lifting adjustment value of the clamping pin to be adjusted, the corresponding driving mechanism is controlled to drive the clamping pin to be adjusted to perform lifting adjustment, so as to adjust the clamping pin to be adjusted to the reference position; If not, the wafer level is determined.

9. The wafer clamping device according to any one of claims 2 to 8, characterized in that: The width of the sub-pressure detection member in the vertical direction is greater than or equal to the thickness of the wafer; and / or the sub-pressure detection member is a flexible pressure sensor.

10. A chuck device, characterized in that: include: A chuck and a wafer clamping device as claimed in any one of claims 1 to 9.

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