Composite material liquid cooling plate and manufacturing method thereof

Through laser etching technology, the processing accuracy and environmental protection of liquid-cooled plate microchannels are solved, and high-precision, environmentally friendly and low-cost liquid-cooled microchannel processing is achieved.

CN120072772APending Publication Date: 2025-05-30KUNSHAN MEIXING MICROELECTRONICS CO LTD
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Patent Information

Application Number
CN202510310040.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-03-17
Publication Date
2025-05-30

AI Technical Summary

Technical Problem

The existing liquid-cooled plate microchannel processing technology is difficult to meet the requirements of miniaturization, thinning and high density. There are problems such as stress caused by inconsistent tooth height and channel width, while chemical etching has heavy metal pollution and poor environmental protection.

Method used

The composite material is etched by laser beams to form liquid-cooled microchannels. The accuracy of the laser beam avoids stress from mechanical processing, and does not use chemicals, which avoids environmental pollution.

Benefits of technology

It realizes high-precision processing of liquid-cooled microchannels, with high consistency of upper and lower groove widths, no deformation influence of the tooth column, and processing microchannels less than 5-100 microns, which are environmentally friendly, efficient in work and low cost.

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Abstract

The invention discloses a composite material liquid cooling plate and a manufacturing method thereof. The composite material liquid cooling plate comprises a composite material composed of a base material layer and an etching layer. A liquid cooling micro-channel is etched on the etching layer; during processing, the composite material is firstly placed on a laser equipment processing platform, and the surface of an etching layer in the composite material faces upwards; and according to the prepared pattern processing program, laser equipment is started, and laser beams emitted by the laser equipment are used for carrying out laser etching on the upward etching layer on the composite material. According to the composite material liquid cooling plate and the manufacturing method thereof, laser beams are adopted to etch the composite material, machining stress is avoided, the groove body width of the liquid cooling micro-channel is high in upper and lower consistency, meanwhile, the tooth columns of the liquid cooling micro-channel are not affected by deformation, micro-channels with the width and depth smaller than 5-100 micrometers can be machined through laser spots, and the machining precision of the micro-channels is improved. And moreover, the phenomenon that chemicals are used to pollute the environment does not exist in laser processing, the environmental protection property is good, the work is efficient, and the cost is low.
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Description

Technical Field

[0001] The present invention relates to the processing of liquid cooling plates, and particularly to a composite liquid cooling plate and a manufacturing method thereof. Background Art

[0002] With the rise of AI, the chip power of various terminal devices is getting higher and higher. For the microchannel structure of the liquid cooling plate in the chip, the requirements are gradually developing towards characteristics such as miniaturization, thinness, and high density. However, the existing processing technology of the liquid cooling plate microchannel is difficult to meet the further structural processing requirements of the liquid cooling plate microchannel.

[0003] Currently, the processing technology of the microchannel structure on the liquid cooling plate mainly includes the following two types:

[0004] Process 1: Adopt the method of mechanical tooth shoveling and CNC machining. Due to the existence of stress in this processing method, the ratio of the tooth height of the channel to the channel width of the groove body cannot be made large, and the stress causes the processed channel teeth to deform, affecting the accuracy. At the same time, there are problems of low efficiency and high cost.

[0005] Process 2: Adopt the method of chemically etching the microchannel. However, due to the problem of the etching factor, the width of the groove body of the etched microchannel is seriously inconsistent up and down, and the taper of the tooth column is very obvious, resulting in a smaller total capacity of the channel. At the same time, the etching solution has a serious problem of heavy metal pollution to the environment, and the processing environmental protection is poor. Summary of the Invention

[0006] The technical problem to be solved by the present invention is to provide a composite liquid cooling plate with high processing accuracy for liquid cooling microchannels and a manufacturing method thereof.

[0007] To solve the above technical problem, the present invention is realized through the following technical solutions:

[0008] A composite liquid cooling plate includes a composite material composed of a base material layer and an etching layer. The etching layer is arranged on the top of the base material layer; liquid cooling microchannels are etched on the etching layer, and the cross-section of the liquid cooling microchannels is in a rectangular structure, and a tooth column with a rectangular cross-section is formed between two adjacent liquid cooling microchannels.

[0009] Further, the base material layer is any metal material.

[0010] Further, the base material layer is a non-metallic inorganic material with good thermal conductivity.

[0011] Further, the etching layer is a metal material, and its hardness is lower than that of the base material layer.

[0012] A manufacturing method of a composite liquid cooling plate includes the following steps:

[0013] Step A. Place the composite material on the processing platform of the laser device with the surface of the etching layer in the composite material facing upward.

[0014] Step B. According to the prepared processing graphic program, start the laser device and use the emitted laser beam to perform laser etching on the upward-facing etching layer of the composite material.

[0015] Further, the laser beam uses a laser beam with a wavelength of 121 nanoseconds or more.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows: This composite material liquid cooling plate and its manufacturing method use a laser beam to etch the composite material, without the stress of mechanical processing. The width of the groove body of the liquid cooling microchannel is highly consistent up and down. At the same time, the tooth columns of the liquid microchannel are not affected by deformation. The laser spot can process microchannels with a width and depth less than 5 - 100 microns, with high processing accuracy. Moreover, laser processing does not cause environmental pollution by using chemicals, has good environmental protection, high work efficiency, and low cost. Brief Description of the Drawings

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for use in the embodiments. It should be understood that the following drawings only show some embodiments of the present invention, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0018] Figure 1 is a schematic process flow diagram of a composite material liquid cooling plate of the present invention;

[0019] Figure 2 is a schematic structural diagram of a composite material liquid cooling plate of the present invention.

[0020] In the figure: 100, composite material; 101, substrate layer; 102, etching layer; 200, laser beam; 300, liquid cooling microchannel; 301, tooth column; 400, liquid cooling microchannel plate. Detailed Embodiments

[0021] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. Usually, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0022] Accordingly, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts fall within the scope of protection of the present invention. It should be noted that similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not require further definition and explanation in subsequent drawings. In the description of the embodiments of the present invention, it should be noted that if terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the invention product is usually placed during use, it is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation of the present invention. In addition, terms such as "first", "second", etc. are only used for distinguishing descriptions and cannot be construed as indicating or implying relative importance.

[0023] In addition, if terms such as "horizontal" and "vertical" appear, it does not mean that the components are required to be absolutely horizontal or vertical, but they can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and it does not mean that the structure or component must be completely horizontal, but it can be slightly inclined.

[0024] In the description of the embodiments of the present invention, "a plurality of" represents at least two.

[0025] In the description of the embodiments of the present invention, it should also be noted that unless otherwise clearly specified and defined, if terms such as "set", "installed", "connected", "connected to" are understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0026] Embodiment

[0027] Please refer to the accompanying Figure 2 as shown in the accompanying Figure 1 As shown in the accompanying drawings of the specification, a composite liquid cooling plate of the present invention is provided. The composite liquid cooling plate includes a composite material 100 composed of a base material layer 101 and an etching layer 102 (refer to the accompanying Figure 1As shown in the figure, the etching layer 102 is disposed on top of the substrate layer 101. The substrate layer 101 can be any metal material, such as stainless steel, nickel, copper, aluminum, etc., or can also be a non-metallic inorganic material with good thermal conductivity, such as ceramics and other substances. The etching layer 102 is a metal material, mainly including: copper, aluminum, titanium, stainless steel, zinc, etc. The combination of the substrate layer 101 and the etching layer 102 can be copper and stainless steel, copper and nickel, aluminum and copper, zinc and copper, zinc and stainless steel, zinc and aluminum, copper and ceramics, etc., which is diverse. It should be noted that the hardness of the etching layer 102 needs to be lower than that of the substrate layer 101. Refer to the attached Figure 1 description. As described, a liquid-cooled microchannel 300 is etched on the etching layer 102 by a laser beam 200. The cross-section of the liquid-cooled microchannel 300 is a rectangular structure. The width of the groove body of the liquid-cooled microchannel 300 is highly consistent up and down. A tooth post 301 with a rectangular cross-section is formed between two adjacent liquid-cooled microchannels 300, and the tooth post 301 is not affected by deformation.

[0028] Refer to the attached Figure 1 description. As shown, a method for manufacturing a composite liquid-cooled plate of the present invention includes the following steps:

[0029] Step A. Place the composite material 100 on the processing platform of the laser device, with the surface of the etching layer 102 in the composite material 100 facing upward.

[0030] Step B. According to the prepared processing graphic program, start the laser device and use the emitted laser beam 200 to perform laser etching on the upward-facing etching layer 102 of the composite material 100. The laser beam 200 uses a laser beam with a wavelength of more than 121 nanoseconds (usually 121 - 106400 nanoseconds), and can process microchannels with a width and depth of less than 5 - 100 microns, so that the composite material 100 is processed into a Figure 2 liquid-cooled microchannel plate 400 as shown.

[0031] The laser device includes a nanosecond laser, a picosecond laser, a femtosecond laser, a sub-nanosecond laser, and an optical fiber laser. The light source of the laser beam 200 covers ultraviolet, blue, green, infrared, optical fiber, etc. During the processing of the laser beam 200, by utilizing the characteristic that the hardness of the etching layer 102 in the composite material 100 is lower than that of the substrate layer 10, through adjusting the parameters of the laser beam 200, when the laser processes materials with lower density and hardness, compared with materials with higher hardness, the required energy and power are smaller. Therefore, it is very easy to etch the etching layer 102 without damaging the substrate layer 101 with higher material density or hardness, thereby ensuring the control of the product depth.

[0032] This composite material liquid cooling plate and its manufacturing method etch the composite material with a laser beam, without the stress of mechanical processing. The width of the groove body of the liquid cooling microchannel has high upper and lower consistency. At the same time, the tooth columns of the liquid microchannel are not affected by deformation. The laser spot can process microchannels with widths and depths less than 5 - 100 microns, with high processing accuracy. Moreover, laser processing does not cause environmental pollution by using chemicals, has good environmental protection, high work efficiency, and low cost.

[0033] It should be emphasized that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A composite liquid cooling plate, characterized by: The invention comprises a composite material (100) consisting of a substrate layer (101) and an etching layer (102), wherein the etching layer (102) is arranged on the top of the substrate layer (101); a liquid cooling microchannel (300) is etched on the etching layer (102), the cross section of the liquid cooling microchannel (300) is a rectangular structure, and a tooth column (301) with a rectangular cross section is formed between two adjacent liquid cooling microchannels (300).

2. The composite liquid cooling plate according to claim 1, characterized in that: The substrate layer (101) is any metal material.

3. The composite liquid cooling plate according to claim 1, characterized in that: The substrate layer (101) is a non-metallic inorganic material with good thermal conductivity.

4. The composite liquid cooling plate according to claim 1, characterized in that: The etching layer (102) is made of a metal material, and its hardness is lower than that of the substrate layer (101).

5. A method for manufacturing a composite liquid cooling plate according to claim 1, characterized in that: The following steps are involved: Step A: placing the composite material (100) on a laser equipment processing platform, with the surface of the etched layer (102) in the composite material (100) facing upward; Step B: according to the prepared processing graphic program, start the laser equipment to use the laser beam (200) emitted by the laser equipment to perform laser etching on the upward etching layer (102) of the composite material (100).

6. The method for manufacturing a composite liquid cooling plate according to claim 5, characterized in that: The laser beam (200) uses a laser beam with a wavelength of more than 121 nanoseconds.