Circuit board structure based on efficient combination of independent hard PCB and independent soft board

Abstract

The invention relates to the technical field of circuit board production, in particular to a circuit board structure based on efficient combination of an independent hard board PCB and an independent soft board. The manufacturing process of the circuit board structure comprises the following steps: S1, feeding materials; s2, cutting rubber; s3, rubberizing; s4, pre-pressing: fixing the soft PCB and the hard PCB together by adopting a nail sleeving jig, putting the soft PCB and the hard PCB into a pre-pressing machine for pressing, then pre-pressing at a preset temperature, and taking down the nail sleeving jig after pre-pressing; s5, pressing: adding release films into the upper part and the lower part of the pre-pressed combination plate, and flatly placing the combination plate in a pressing machine for pressing; s6, appearance inspection; and S7, packaging. According to the circuit board structure based on the efficient combination of the independent hard board PCB and the independent soft board, the independent hard board PCB and the independent soft board PCB are separately manufactured and then are subjected to a press-fit connection process to prepare the circuit board structure, so that the usability of a product can be effectively ensured, and meanwhile, the cost is greatly reduced; and material resources can be saved.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board production, and specifically to a circuit board structure based on the efficient combination of an independent rigid PCB and an independent flexible PCB. Background Art

[0002] A circuit board can be called a printed wiring board or a printed circuit board. A rigid-flex board forms an electrical connection by printing a flexible circuit board and a printed circuit board to form an electronic product for connecting and transmitting electrical signals.

[0003] With the increasing growth of new energy vehicles, the personalization and diversification of new energy vehicle headlights have led to an increased demand for rigid-flex boards. Traditional rigid-flex boards are formed by laminating a flexible board and a rigid board together, resulting in a relatively high cost and affecting the market competitiveness of products.

[0004] Based on this, the present invention provides a circuit board structure based on the efficient combination of an independent rigid PCB and an independent flexible PCB to solve the above-mentioned technical problems. Summary of the Invention

[0005] The purpose of the present invention is to provide a circuit board structure based on the efficient combination of an independent rigid PCB and an independent flexible PCB, which can effectively ensure the usability of the product. At the same time, the cost is greatly reduced, and the conservation of material resources can be achieved.

[0006] To achieve the above purpose, the present invention provides the following technical solutions:

[0007] The present invention provides a circuit board structure based on the efficient combination of an independent rigid PCB and an independent flexible PCB. The manufacturing process of the circuit board structure is as follows:

[0008] S1. Incoming materials: Take the finished products of the rigid PCB and the flexible PCB and place them on the production table.

[0009] S2. Glue cutting: Die-cut the fixing glue.

[0010] S3. Glue pasting: Paste the fixing glue at the overlapping part of the rigid PCB or the flexible PCB, and use a jig to accurately align the positioning holes of the flexible PCB and the rigid PCB.

[0011] S4. Pre-pressing: Fix the flexible PCB and the rigid PCB together with a sleeve nail jig, put them into a pre-press for pressing, and then pre-press at a preset temperature. After pre-pressing, remove the sleeve nail jig.

[0012] S5. Laminating: Add release films to the upper and lower sides of the pre-pressed combined board and place it flat in a laminator for lamination.

[0013] S6. Appearance inspection: Inspect the appearance of the combined board, and select the products that do not meet the requirements for repair or scrapping.

[0014] S7. Packaging: Protect the qualified products by packaging.

[0015] The present invention is further configured such that in the step S2, any one of AD glue and thermal conductive glue is selected as the fixing glue.

[0016] The present invention is further configured such that in the step S2, any one of a laser cutting machine and a punching machine is selected as the equipment used for die-cutting.

[0017] The present invention is further configured such that in the step S2, the die-cutting is performed by cutting and forming according to a 1:1 size.

[0018] The present invention is further configured such that in the step S4, the pressure of the pre-press is 4 - 6 KG.

[0019] The present invention is further configured such that in the step S4, the preset temperature is 110 - 130 °C.

[0020] The present invention is further configured such that in the step S4, the pre-press time is 55 - 65 s.

[0021] The present invention is further configured such that in the step S5, the pressure of the lamination is 5 - 13 KG, the temperature is 140 - 160 °C, and the lamination time is 150 - 170 s.

[0022] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0023] The circuit board structure based on the efficient combination of an independent rigid PCB and an independent flexible PCB provided by the present invention, after separately manufacturing the independent rigid PCB and the independent flexible PCB and then performing the lamination connection process, prepares a circuit board structure based on the efficient combination of an independent rigid PCB and an independent flexible PCB, thereby effectively ensuring the usability of the product. At the same time, the cost is greatly reduced, and the conservation of material resources can be achieved. The circuit board structure based on the efficient combination of an independent rigid PCB and an independent flexible PCB provided by the present invention has a broader market prospect and is more suitable for promotion. Specific Embodiments

[0024] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present invention.

[0025] Embodiment 1

[0026] This embodiment provides a circuit board structure based on the efficient combination of an independent rigid PCB and an independent flexible PCB. The manufacturing process of this circuit board structure is as follows:

[0027] S1. Incoming materials: Obtain the finished products of the rigid PCB and the flexible PCB, and place them on the production table.

[0028] S2. Glue cutting: Punch the fixing glue.

[0029] Among them, the fixing glue is selected as AD glue.

[0030] In this embodiment, it should be noted that the AD glue is purchased from Shanghai Changzheng Plastic Co., Ltd.

[0031] The equipment used for punching is a laser cutting machine.

[0032] The punching is carried out for cutting and forming according to a 1:1 size.

[0033] S3. Glue pasting: Paste the fixing glue at the overlapping part of the rigid PCB or the flexible PCB, and use a jig to sleeve the positioning holes of the flexible PCB and the rigid PCB for precision docking.

[0034] In this embodiment, it should be noted that the precision control of the precision docking is within ±0.05 mm.

[0035] S4. Pre-pressing: Fix the flexible PCB and the rigid PCB together with a sleeve nail jig, put them into a pre-pressing machine to be pressed tightly, and then pre-press at a preset temperature. After pre-pressing, remove the sleeve nail jig.

[0036] Among them, the pressure of the pre-pressing machine is 4KG.

[0037] The preset temperature is 110 °C.

[0038] The pre-pressing time is 55 s.

[0039] S5. Laminating: Add release films to the upper and lower parts of the pre-pressed combined board and place it flat in the laminating machine for laminating.

[0040] Among them, the pressure of the lamination is 5KG, the temperature is 14 °C, and the lamination time is 150 s.

[0041] S6. Appearance inspection: Conduct an appearance inspection on the combined board, and select the products that do not meet the requirements for repair or scrapping.

[0042] S7. Packaging: Protect the qualified products by packaging.

[0043] Embodiment 2

[0044] This embodiment provides a circuit board structure based on the efficient combination of an independent rigid PCB and an independent flexible PCB. The manufacturing process of this circuit board structure is as follows:

[0045] S1. Incoming materials: Take the finished rigid PCB and flexible PCB, and place them on the production table.

[0046] S2. Glue cutting: Die-cut the fixing glue.

[0047] Among them, the fixing glue is selected as thermal conductive glue.

[0048] In this embodiment, it should be noted that the thermal conductive glue is purchased from Huizhou Sandao New Materials Co., Ltd.

[0049] The equipment used for die-cutting is a punching machine.

[0050] The die-cutting is carried out according to the size of 1:1 for cutting and forming.

[0051] S3. Glue pasting: Paste the fixing glue at the overlapping part of the rigid PCB or flexible PCB, and use a jig to sleeve the positioning holes of the flexible PCB and the rigid PCB for precise docking.

[0052] In this embodiment, it should be noted that the precision control of the precise docking is within ±0.05 mm.

[0053] S4. Pre-pressing: Use a sleeve nail jig to fix the flexible PCB and the rigid PCB together, put them into a pre-pressing machine to be pressed tightly, and then pre-press at a preset temperature. After pre-pressing, remove the sleeve nail jig.

[0054] Among them, the pressure of the pre-pressing machine is 5KG.

[0055] The preset temperature is 120 °C.

[0056] The pre-pressing time is 60 s.

[0057] S5. Laminating: Add release films to the top and bottom of the combined board obtained by pre-pressing, and place it flat in the laminating machine for lamination.

[0058] Among them, the pressure of the lamination is 9KG, the temperature is 150 °C, and the lamination time is 160 s.

[0059] S6. Appearance inspection: Conduct an appearance inspection on the combined board, and select the products that do not meet the requirements for repair or scrapping.

[0060] S7. Packaging: Package and protect the qualified products.

[0061] Embodiment 3

[0062] This embodiment provides a circuit board structure based on the efficient combination of an independent rigid PCB and an independent flexible PCB. The manufacturing process of this circuit board structure is as follows:

[0063] S1. Incoming materials: Take the finished rigid PCB and flexible PCB, and place them on the production table.

[0064] S2. Glue cutting: Die-cut the fixed glue.

[0065] Among them, the fixed glue is selected as AD glue.

[0066] In this embodiment, it should be noted that the AD glue is purchased from Shanghai Changzheng Plastic Co., Ltd.

[0067] The equipment used for die-cutting is selected as a laser cutting machine.

[0068] Die-cutting is carried out according to a 1:1 size for cutting and forming.

[0069] S3. Glue pasting: Paste the fixed glue at the overlapping part of the rigid PCB and the flexible PCB, and use a jig to accurately align the positioning holes of the flexible PCB and the rigid PCB.

[0070] In this embodiment, it should be noted that the accuracy control of the accurate alignment is within ±0.05 mm.

[0071] S4. Pre-pressing: Use a stud jig to fix the flexible PCB and the rigid PCB together, put them into a pre-pressing machine to be pressed tightly, and then pre-press at a preset temperature. After pre-pressing, remove the stud jig.

[0072] Among them, the pressure of the pre-pressing machine is 6KG.

[0073] The preset temperature is 130 °C.

[0074] The pre-pressing time is 65 s.

[0075] S5. Laminating: Add release films above and below the combined board obtained by pre-pressing and place it flat in a laminating machine for laminating.

[0076] Among them, the pressure for laminating is 13KG, the temperature is 160 °C, and the laminating time is 170 s.

[0077] S6. Appearance inspection: Conduct an appearance inspection on the combined board, and select the products that do not meet the requirements for repair or scrapping.

[0078] S7. Packaging: Protect the qualified products by packaging.

[0079] The circuit board structure based on the efficient combination of an independent rigid PCB and an independent flexible PCB provided by the present invention separates the independent rigid PCB and the independent flexible PCB and then performs a lamination connection process to prepare a circuit board structure based on the efficient combination of an independent rigid PCB and an independent flexible PCB, thereby effectively ensuring the usability of the product. At the same time, the cost is greatly reduced, and the conservation of material resources can be achieved. This shows that the circuit board structure based on the efficient combination of an independent rigid PCB and an independent flexible PCB provided by the present invention has a broader market prospect and is more suitable for promotion.

[0080] In the description of this specification, the descriptions referring to terms such as "one embodiment", "example", "specific example", etc. mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0081] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific embodiments described. Obviously, according to the content of this specification, many modifications and changes can be made. These embodiments are selected and specifically described in this specification in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can well understand and utilize the present invention. The present invention is only limited by the claims and their full scope and equivalents.

Claims

1. A circuit board structure based on the efficient combination of an independent hard board PCB and an independent soft board, characterized in that: The manufacturing process of the circuit board structure is as follows: S1. Incoming materials: Take the finished hard PCB and soft PCB and place them on the production table; S2, glue cutting: punching the fixed glue; S3, Glue pasting: Paste the fixing glue on the overlapped part of the rigid PCB or the flexible PCB, and use the jig to cover the positioning holes of the flexible PCB and the rigid PCB for precision docking; S4, pre-pressing: Use a nailing jig to fix the soft board PCB and the hard board PCB together, put them into the pre-pressing machine and press them tightly, then pre-press them at a preset temperature, and remove the nailing jig after pre-pressing; S5, pressing: adding release films to the pre-pressed combined plate from top to bottom and placing them flat in a press for pressing; S6. Appearance inspection: Carry out appearance inspection on the combined board, and select the products that do not meet the requirements for repair or scrapping; S7. Packaging: Packaging protection for qualified products.

2. A circuit board structure based on efficient combination of independent hard board PCB and independent soft board according to claim 1, characterized in that: In the step S2, the fixing glue is selected from any one of AD glue and thermal conductive glue.

3. A circuit board structure based on efficient combination of independent hard board PCB and independent soft board according to claim 1, characterized in that: In the step S2, the punching equipment is selected from any one of a laser cutting machine and a punching machine.

4. The circuit board structure based on the efficient combination of an independent hard board PCB and an independent soft board according to claim 1, characterized in that: In the step S2, the punch is cut and formed according to a 1:1 size.

5. The circuit board structure based on efficient combination of independent hard board PCB and independent soft board according to claim 1, characterized in that: In the step S4, the pressure of the pre-pressing machine is 4-6KG.

6. The circuit board structure based on efficient combination of independent hard board PCB and independent soft board according to claim 1, characterized in that: In the step S4, the preset temperature is 110-130°C.

7. The circuit board structure based on efficient combination of independent hard board PCB and independent soft board according to claim 1, characterized in that: In the step S4, the pre-pressing time is 55 to 65 seconds.

8. The circuit board structure based on efficient combination of independent hard board PCB and independent soft board according to claim 1, characterized in that: In the step S5, the pressing pressure is 5-13KG, the temperature is 140-160°C, and the pressing time is 150-170s.