Electronic equipment
Patent Information
- Application Number
- CN202311552966.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-11-20
- Publication Date
- 2025-05-30
Smart Images
Figure CN120076238A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of communication devices, and particularly to an electronic device. Background Art
[0002] The power consumption and heat generation of mobile phones are key performance concerns for consumers. During use, components such as the main board and power supply inside the mobile phone will generate heat. The heat is dissipated through the vapor chambers (VC) plates set inside the mobile phone to prevent the local temperature of the mobile phone from being too high, which may cause damage to the electronic device. At the same time, it can also avoid the situation where the user experience is poor due to the failure to timely dissipate the heat of the mobile phone.
[0003] With the design requirements for the thinness and lightness of electronic devices such as mobile phones, taking mobile phones as an example, the internal space of electronic devices is limited, and the installation space for vapor chambers is also limited. How to maximize the heat dissipation performance of vapor chambers in a limited space, improve the heat dissipation performance and user experience of electronic devices, and at the same time reduce costs is a technical problem that needs to be urgently solved by those skilled in the art. Summary of the Invention
[0004] The embodiments of this application provide an electronic device that can maximize the heat dissipation performance of the vapor chamber in a limited space, improve the heat dissipation performance and user experience of the electronic device, and at the same time can effectively reduce costs.
[0005] In the first aspect of the embodiments of this application, an electronic device is provided, which includes a middle frame, a vapor chamber, and an insulating layer; the vapor chamber includes at least two plate parts with different thicknesses, and the front surfaces of each plate part are coplanar. The front surface of the middle frame is provided with an installation area corresponding to the vapor chamber; the insulating layer is fixed between the vapor chamber and the installation area and covers the front surface of the vapor chamber. The vapor chamber has an unequal thickness structure, which can make full use of the internal space of the electronic device, ensure the heat dissipation performance, avoid local overheating, improve the user experience, and achieve insulation between the middle frame and the vapor chamber through the insulating layer, which can effectively reduce the production cost, facilitate mass production, and at the same time can also avoid affecting the performance of the electronic device, such as heat dissipation performance, RSE performance, etc.
[0006] In a possible implementation manner, the vapor chamber includes two plate parts, and the two plate parts include a first plate part and a second plate part; the installation area includes a first area corresponding to the first plate part and a second area corresponding to the second plate part; the insulating layer includes a first insulating layer and a second insulating layer, the first insulating layer is fixed between the first plate part and the first area, and the second insulating layer is fixed between the second plate part and the second area. The setting of the two plate parts can simplify the structure of the vapor chamber and the middle frame and simplify the processing technology.
[0007] In a possible implementation, the first insulating layer is an insulating adhesive layer, and the first region and the first plate portion are adhesively fixed through the first insulating layer. With this arrangement, the overall structure can be simplified, and the installation operation between the middle frame and the heat sink can also be simplified.
[0008] In a possible implementation, when the first region and the first plate portion are adhesively fixed through the first insulating layer, the distance between the second region and the second plate portion is greater than the thickness of the second insulating layer. The second insulating layer is provided with a through hole in the thickness direction, and the second region and the second plate portion are fixed by dispensing glue into the through hole. With this arrangement, it can be avoided that during the processing, due to processing errors or other reasons, after the first region and the first plate portion are adhesively fixed through the insulating adhesive layer, the second region and the second plate portion cannot be firmly adhesively bonded, ensuring the bonding stability between the first region and the first plate portion and between the second region and the second plate portion. At the same time, the fixing flexibility between the second region and the second plate portion can also be ensured.
[0009] In a possible implementation, the second insulating layer is an insulating adhesive layer, and the second insulating layer is adhesively fixed to the second region or the second plate portion. With this arrangement, the structure can be simple and have good stability.
[0010] In a possible implementation, the heat sink further includes a transition section provided between the first plate portion and the second plate portion, the installation area further includes a transition area located between the first region and the second region, and the insulating layer further includes a transition layer provided between the first insulating layer and the second insulating layer. The transition layer is located between the transition area and the transition section; the transition section includes an inclined surface or an arc surface connecting between the first plate portion and the second plate portion; the transition area includes an inclined surface or an arc surface connecting between the first region and the second region. With this arrangement, it can be avoided that due to the existence of sharp corners at the positions where the thickness of the heat sink or the middle frame changes, the middle frame and the heat sink are electrically connected, and the insulation effect is good.
[0011] In a possible implementation, the transition area and the transition section are separated from each other. This can avoid the situation of generating noise during use due to unreliable bonding between the transition area and the transition section.
[0012] In a possible implementation, the first insulating layer and the second insulating layer are an integral insulating adhesive layer, and the transition layer further includes a spacer layer, and the spacer layer is adhesively bonded to the surface of the insulating adhesive layer. With this arrangement, the overall structure and the installation operation can be simplified, and reliable insulation can be ensured.
[0013] In a possible implementation, the spacer layer is adhesively bonded to the front surface of the insulating adhesive layer. With this arrangement, the overall installation operation is convenient.
[0014] In a possible implementation, the spacer layer is a Mylar sheet, a graphite sheet, or a foam layer. With such a setting, the materials are easily obtainable and the cost is low.
[0015] In a possible implementation, the first insulating layer and the second insulating layer are independent of each other. The two side ends of the transition layer are respectively joined or lapped with the first insulating layer and the second insulating layer, and are fixed to the transition area or the transition section by bonding. The transition layer can merely achieve the insulating effect, and with such a setting, the flexibility is better.
[0016] In a possible implementation, the heat pipe includes a main body portion and a skirt provided along the circumference of the main body portion. Each plate portion is disposed on the main body portion. The installation area is provided with an edge area adapted to the skirt. The insulating layer includes a fitting layer fixed between the skirt and the edge area. This further ensures the overall insulation between the heat pipe and the middle frame.
[0017] In a possible implementation, the fitting layer is fixedly bonded to the edge area, and the fitting layer is fixed to the skirt by dispensing glue. With such a setting, it is convenient to realize the fixing operation of the fitting layer between the edge area and the skirt.
[0018] In a possible implementation, the main body portion is an integral structure. With such a setting, the overall structure can be simplified and the installation operation can be simplified.
[0019] In a possible implementation, the main body portion includes a bottom plate and at least one fitting plate. A part of the bottom plate forms a plate portion, and each fitting plate is respectively fixed to the bottom plate and forms a plate portion. With such a setting, the forming of the heat pipe can be more flexible.
[0020] In a possible implementation, it further includes a display screen and a rear shell. The display screen and the rear shell are respectively fixed on both sides of the middle frame and enclose to form a housing. The heat pipe is located between the middle frame and the display screen. The overall heat dissipation performance of the electronic device is ensured by the heat pipe, thereby ensuring the normal operation of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 is a three-dimensional structural schematic diagram of the electronic device provided by the embodiment of the present application;
[0022] Figure 2 is a structural schematic diagram of the internal middle frame and the insulating layer of the electronic device in an assembled state;
[0023] Figure 3 is a structural schematic diagram of the internal heat pipe and the middle frame of the electronic device in an assembled state;
[0024] Figure 4 is Figure 3 a structural schematic diagram of A-A in, wherein the first insulating layer and the second insulating layer are an integral insulating adhesive layer;
[0025] Figure 5 is Figure 3 The schematic structural diagram of A-A in
[0026] Figure 6 is Figure 3 The schematic structural diagram of A-A in
[0027] Figure 7 is Figure 3 The schematic structural diagram of A-A in
[0028] Figure 8 is Figure 3 The schematic structural diagram of A-A in
[0029] Figure 9 is Figure 3 The schematic structural diagram of A-A in
[0030] Figure 10 is Figure 3 The schematic structural diagram of A-A in
[0031] Appendix Figures 1 - 10 In
[0032] 1 Middle frame, 11 First area, 12 Second area, 13 Transition area;
[0033] 2 Heat sink, 21 First plate part, 22 Second plate part, 23 Transition section, 24 Skirt, 25 Main body part, 26 Bottom plate, 27 Matching plate;
[0034] 3 Insulating layer, 31 First insulating layer, 32 Second insulating layer, 321 Through hole, 33 Transition layer, 34 Spacer layer, 35 Extension section, 36 Matching layer, 37 Exhaust structure;
[0035] 4 Glue dispensing;
[0036] 5 Gap;
[0037] 6 Display screen;
[0038] 7 Rear shell. Specific implementation mode
[0039] Embodiments of the present application provide an electronic device, including but not limited to mobile or fixed terminals with a middle frame such as mobile phones, tablet computers, laptop computers, ultra-mobile personal computers (UMPCs), handheld computers, walkie-talkies, netbooks, POS machines, personal digital assistants (PDAs), dash cams, wearable devices, virtual reality devices, wireless USB flash drives, Bluetooth speakers / headphones, or in-vehicle pre-installed devices.
[0040] When the electronic device is a mobile phone or a tablet computer, as Figures 1 - 3 shown, the electronic device includes a middle frame 1, a display screen 6, and a rear case 7. The display screen 6 can be fixed to the front side of the middle frame 1 by means of adhesion, snap connection, etc. The rear case 7 can be fixed to the rear side of the middle frame 1 by means of adhesion, snap connection, fastener connection, etc. The middle frame 1, the display screen 6, and the rear case 7 enclose to form a housing. The electronic device further includes components such as a main board, a battery, and a vapor chamber (VC) plate 2 disposed inside the housing. The electronic device can improve the heat dissipation performance through the vapor chamber plate 2.
[0041] Among them, the main board is fixed to the rear side of the middle frame 1, and the vapor chamber plate 2 is fixed to the front side of the middle frame 1 and located between the middle frame 1 and the display screen 6. During the use of the electronic device, components such as the main board and the battery will generate heat. The vapor chamber plate 2 can dissipate the heat generated by the main board, the battery, etc., avoiding the situation that the local temperature is too high and causing the electronic device to burn out. At the same time, it can also provide protection for the main board and the battery.
[0042] In this article, Figure 1 as indicated by the arrow in the figure, "front" refers to the side facing the display screen 6, and "rear" refers to the side facing the rear case 7.
[0043] When the electronic device is a laptop computer, the electronic device further includes a keyboard. Both the keyboard and the vapor chamber plate 2 are fixed to the middle frame 1, and the vapor chamber plate 2 is located between the middle frame 1 and the keyboard. The setting of the vapor chamber plate 2 can avoid the situation that the local heat generation is too high during the use of the user, affecting the user experience.
[0044] For the convenience of description, hereinafter, taking the electronic device as a mobile phone as an example, the present solution will be described in detail.
[0045] In the assembled state of the electronic device, the outer peripheral portion of the middle frame 1 can be seen from the outside, and the material of this portion can be plastic or metal. When the material of the outer peripheral portion of the middle frame 1 is metal, anodic oxidation needs to be performed on it to make it have good appearance performance and insulation performance. The material of the installation area of the middle frame 1 in the housing for cooperating with the heat sink plate 2 is metal, and the material of the heat sink plate 2 is metal (such as stainless steel, copper, etc.). Therefore, after the heat sink plate 2 is fixed to the middle frame 1, the insulation between the two needs to be ensured.
[0046] The thickness of the heat sink plate 2 can be set according to the space between the middle frame 1 and the display screen 6. It is not difficult to understand that the greater the thickness of the heat sink plate 2, the better the heat dissipation effect. Therefore, in order to make full use of the internal space of the electronic device and ensure the heat dissipation performance, in this embodiment, as Figure 3 shown, the heat sink plate 2 is set to a structure including two plate parts, namely a first plate part 21 and a second plate part 22, and the thicknesses of the first plate part 21 and the second plate part 22 are different, that is to say, the heat sink plate 2 is a structure with unequal thicknesses.
[0047] Of course, in this embodiment, the heat sink plate 2 may further include a third plate part. The first plate part 21, the second plate part 22, and the third plate part are arranged in sequence, and the thicknesses of the second plate part 22 are different from those of both the first plate part 21 and the third plate part. The thicknesses of the first plate part 21 and the third plate part may be the same or different, and can be specifically set according to the actual space layout. Or, the heat sink plate 2 may further include more plate parts, that is to say, the heat sink plate 2 includes at least two plate parts with different thicknesses, which can be specifically set according to the actual space and heat dissipation requirements.
[0048] Setting the heat sink plate 2 to a structure with unequal thicknesses, compared with the solution of using a heat sink plate 2 with an equal thickness structure, can make full use of the internal space of the electronic device without affecting the volume of the electronic device. At the same time, it can improve the heat dissipation ability of the heat sink plate 2, ensure the overall heat dissipation performance of the electronic device, avoid local overheating, and improve the user experience.
[0049] The setting of the two plate parts can simplify the structures of the heat sink plate 2 and the middle frame 1 and simplify the processing technology. For the convenience of description, in the following, an example in which the heat sink plate 2 includes two plate parts, namely a first plate part 21 and a second plate part 22, will be used for expansion and description.
[0050] Since the thicknesses of the first plate part 21 and the second plate part 22 are different and the front side surfaces of each plate part are coplanar, the rear side surfaces of the first plate part 21 and the second plate part 22 can form a stepped structure. Correspondingly, the installation area on the front side surface of the middle frame 1 includes a first area 11 and a second area 12. The first area 11 is correspondingly arranged with the first plate part 21, the second area 12 is correspondingly arranged with the second plate part 22, and the surfaces of the first area 11 and the second area 12 are not coplanar and form a stepped structure.
[0051] To achieve insulation between the middle frame 1 and the heat sink 2, an insulating coating can be formed on the front surface of the middle frame 1 or on the rear surface of the heat sink 2 to ensure insulation between the middle frame 1 and the heat sink 2. Specifically, anodic oxidation or insulating spraying can be used to form an insulating coating on the front surface of the middle frame 1 or on the rear surface of the heat sink 2. Then, the middle frame 1 and the heat sink 2 can be bonded and fixed with back glue. However, forming an insulating coating on the front surface of the middle frame 1 or on the rear surface of the heat sink 2 has a relatively high cost.
[0052] As Figure 2 shown, in this embodiment, an insulating layer 3 is provided between the middle frame 1 and the heat sink 2. The insulating layer 3 can cover the rear surface of the heat sink 2 to ensure the overall insulation between the middle frame 1 and the heat sink 2. At the same time, the setting of the insulating layer 3 does not affect the reliability, heat dissipation performance, and RSE (Radiation Spurious Emission) performance of the electronic device. Moreover, there is no need to perform anodic oxidation treatment or insulating spraying treatment on the surface of the middle frame 1 or the heat sink 2. By using the insulating layer 3 to achieve insulation, the production cost can be effectively reduced, which is beneficial to mass production. At the same time, it can also avoid the influence of the insulating coating formed on the surface of the heat sink 2 on the heat dissipation performance of the heat sink 2.
[0053] Specifically, as Figure 2 shown, the insulating layer 3 includes a first insulating layer 31 and a second insulating layer 32. Among them, the first insulating layer 31 is located between the first region 11 and the first plate portion 21, and the second insulating layer 32 is located between the second region 12 and the second plate portion 22.
[0054] As Figures 4 - 9 shown, the first plate portion 21 and the second plate portion 22 are connected through a transition section 23. The first region 11 and the second region 12 are also connected through a transition area 13. The transition section 23 and the transition area 13 are correspondingly arranged. The insulating layer 3 further includes a transition layer 33 located between the first insulating layer 31 and the second insulating layer 32, and the transition layer 33 is located between the transition section 23 and the transition area 13.
[0055] It is not difficult to understand that if the vapor chamber 2 further includes a third plate portion, the front surface of the third plate portion is coplanar with the front surfaces of the first plate portion 21 and the second plate portion 22, and the rear surface of the third plate portion forms a stepped structure with the rear surface of the first plate portion 21 or the rear surface of the second plate portion 22. The installation area of the middle frame 1 further includes a third area, the insulating layer 3 further includes a third insulating layer 3 located between the third area and the third plate portion. A transition section 23 is provided on the rear surface of the vapor chamber 2 between two adjacent plate portions with different thicknesses, a transition area 13 is provided on the middle frame 1 between two adjacent different areas, and the insulating layer 3 further includes a transition layer 33 corresponding to each transition area 13.
[0056] Specifically, the rear surface of the transition section 23 can be an arc surface as shown in Figure 4 or an inclined surface as shown in Figure 5 , both of which can make the rear surfaces of the first plate portion 21 and the second plate portion 22 smoothly transition, and there is no sharp corner structure at the position between the first plate portion 21 and the second plate portion 22. The front surface of the transition area 13 can be an arc surface as shown in Figures 4 - 9 or the front surface of the transition area 13 can also be an inclined surface, both of which can make the first area 11 and the second area 12 smoothly transition through the connection of the transition area 13, and there is no sharp corner structure at the position between the first area 11 and the second area 12. In this way, it can avoid the situation that the middle frame 1 and the vapor chamber 2 are conducted due to the existence of sharp corners at the position where the thickness of the vapor chamber 2 changes, and the insulation effect is good.
[0057] As shown in Figure 4 , both the first insulating layer 31 and the second insulating layer 32 are insulating adhesive layers. The first area 11 and the first plate portion 21 are adhesively fixed through the first insulating layer 31, and the second area 12 and the second plate portion 22 are adhesively fixed through the second insulating layer 32. With such a setting, it can simplify the overall structure and at the same time simplify the installation operation between the middle frame 1 and the vapor chamber 2.
[0058] Moreover, as shown in Figure 4 , the first insulating layer 31 and the second insulating layer 32 are an integral insulating adhesive layer structure, and a transition layer 33 is formed in the part between the first insulating layer 31 and the second insulating layer 32. The overall structure is simple and the installation is convenient.
[0059] Or, it can also be as shown in Figures 5 - 9As shown, the first insulating layer 31 is an insulating adhesive layer. The first region 11 and the first plate portion 21 are adhesively fixed through the first insulating layer 31. And when the first region 11 and the first plate portion 21 are adhesively fixed through the first insulating layer 31, the distance between the second region 12 and the second plate portion 22 should be greater than the thickness of the second insulating layer 32. In the installed state, there is a gap 5 between the second insulating layer 32 and the second region 12, or between the second insulating layer 32 and the second plate portion 22.
[0060] As Figure 2 shown, the second insulating layer 32 is provided with a through hole 321 along the thickness direction. Then the second region 12 and the second plate portion 22 are fixed by dispensing glue 4 at the through hole 321 (as Figures 5 - 9 shown). That is to say, the first region 11 and the first plate portion 21 are fixed by adhesion, and the second region 12 and the second plate portion 22 are fixed by dispensing glue 4.
[0061] With such a setting, it can be avoided that during the processing, due to processing errors and other reasons, after the first region 11 and the first plate portion 21 are adhesively fixed through the insulating adhesive layer, the second region 12 and the second plate portion 22 cannot be firmly adhesively bonded. This ensures the bonding stability between the first region 11 and the first plate portion 21, and between the second region 12 and the second plate portion 22. At the same time, it can also reduce the processing precision of the middle frame 1 and the heat sink 2, thereby reducing the production cost. And when fixed by dispensing glue 4, it can also ensure the fixing flexibility between the second region 12 and the second plate portion 22, with good applicability.
[0062] In addition, when the first region 11 and the first plate portion 21 are adhesively fixed through the insulating adhesive layer, and the second region 12 and the second plate portion 22 are fixed by dispensing glue 4, there is no limitation on the specific material of the second insulating layer 32. The second insulating layer 32 can be an insulating adhesive layer, which is convenient for directly adhesively fixing it to the second region 12 or the second plate portion 22, with a simple structure and good stability. Or, the second insulating layer 32 can also be a mylar sheet, a graphite sheet or a foam, etc., and it can be fixed to the second region 12 or the second plate portion 22 by adhesion.
[0063] In this embodiment, there is no limitation on the number, size, shape, arrangement, etc. of the through holes 321 provided in the second insulating layer 32. As Figure 2 shown, along the width direction of the middle frame 1, there is a row of through holes 321. This row includes four through holes 321 arranged at intervals. Or, two rows or more rows of through holes 321 can also be provided, and the number of through holes 321 in each row can be the same or different. The through hole 321 can be a long hole as Figure 2 shown, or it can also be a circular hole, etc.
[0064] Between the first region 11 and the first plate portion 21, and between the second region 12 and the second plate portion 22, there is a planar fit, which is fixed by bonding or dispensing 4, ensuring the bonding stability. The fit between the transition region 13 and the transition section 23 is non-planar. In this embodiment, there is no bonding and fixing between the transition region 13 and the transition section 23, but they are separated from each other. That is to say, at least one side between the front side of the transition layer 33 and the transition section 23, and between the rear side of the transition layer 33 and the transition region 13 is not bonded and fixed.
[0065] Specifically, there are the following three cases:
[0066] In the first case, there is no bonding between the transition layer 33 and the transition section 23, and there is bonding between the transition layer 33 and the transition region 13.
[0067] In the second case, there is bonding between the transition layer 33 and the transition section 23, and there is no bonding between the transition layer 33 and the transition region 13.
[0068] In the third case, there is no bonding between the transition layer 33 and the transition section 23, and there is no bonding between the transition layer 33 and the transition region 13.
[0069] In this way, compared with the solution of bonding and fixing the two sides of the transition layer 33 to the transition section 23 and the transition region 13 respectively, it can avoid the situation where the bonding between the transition layer 33 and the transition section 23 or between the transition layer 33 and the transition region 13 is not firm. During use, when the user presses the position corresponding to the transition layer 33 on the display screen 6, it reaches the bonding state under pressure and will become detached when not pressed, resulting in noise during use, thus improving the user experience.
[0070] As Figures 5 - 7 shown, the first insulating layer 31 and the second insulating layer 32 can be an integral insulating adhesive layer. At this time, the vapor chamber 2 and the middle frame 1 are bonded and fixed through a whole insulating adhesive layer, which can simplify the overall structure and installation operation and ensure reliable insulation. At the same time, a spacer layer 34 is provided between the vapor chamber 2 and the middle frame 1. The spacer layer 34 has no bonding ability and is located between the transition section 23 and the transition region 13. The spacer layer 34 is bonded to the insulating adhesive layer to form the above-mentioned transition layer 33. At this time, the insulating layer 3 includes the insulating adhesive layer and the spacer layer 34.
[0071] As Figure 5As shown, the spacer layer 34 is disposed on the front surface of the insulating adhesive layer. At this time, the insulating adhesive layer is bonded to the transition region 13, and the spacer layer 34 is not bonded to the transition section 23, forming the first case described above. During the installation process, before fixing the heat sink 2 to the middle frame 1, the insulating adhesive layer is first bonded to the middle frame 1 so that the insulating adhesive layer covers and bonds to the first region 11, the second region 12, and the transition region 13. Then, the spacer layer 34 is bonded to the position corresponding to the transition region 13 of the insulating adhesive layer. Finally, the heat sink 2 is bonded and fixed to the insulating adhesive layer, which is convenient for the installation operation.
[0072] Of course, the spacer layer 34 can also be disposed on the rear surface of the insulating adhesive layer, as Figure 6 shown. At this time, the insulating adhesive layer is bonded to the transition section 23, and the spacer layer 34 is not bonded to the transition region 13, forming the second case described above.
[0073] Alternatively, spacer layers 34 can be respectively disposed on the front and rear surfaces of the insulating adhesive layer, as Figure 7 shown. At this time, the spacer layer 34 is not bonded to the transition section 23, and the spacer layer 34 is not bonded to the transition region 13, forming the third case described above.
[0074] When the spacer layer 34 is disposed only on one side of the insulating adhesive layer, the overall structure can be simplified, the thickness of the insulating transition layer 33 can be reduced, and the space requirement can be decreased. Moreover, when the spacer layer 34 is disposed on the front surface of the insulating adhesive layer, it is convenient for the overall installation operation.
[0075] In this embodiment, the spacer layer 34 can be a sheet material such as a mylar sheet, a graphite sheet, or a foam layer that has insulation but no bonding effect. The material is convenient to obtain and the cost is low.
[0076] As Figures 5 - 7 shown, extension segments 35 are respectively disposed on both sides of the spacer layer 34. One extension segment 35 is clamped between the first region 11 and the first plate portion 21, and the other extension segment 35 is clamped between the second region 12 and the second plate portion 22. That is to say, the extension segments 35 can extend to the planar structures on both sides to ensure that the transition layer 33 can completely cover the transition region 13 and the transition section 23, and ensure that the transition region 13 and the transition section 23 are not bonded at all.
[0077] At least part of the glue dots 4 between the second region 12 and the second plate portion 22 also penetrate through the extension segments 35. That is to say, at least part of the through holes 321 of the second insulating layer 32 penetrate through the extension segments 35. In this way, the stability of the spacer layer 34 can be further ensured.
[0078] As Figure 8 and Figure 9As shown, the first insulating layer 31 and the second insulating layer 32 can also be independent insulating adhesive layers. At this time, two large insulating adhesive layers can be provided between the heat sink 2 and the middle frame 1. The transition layer 33 is located between these two large insulating adhesive layers. The two sides of the transition layer 33 are respectively connected or overlapped with the first insulating layer 31 and the second insulating layer 32 to ensure the overall insulation. The transition layer 33 only needs to play an insulating role, and such a setting has better flexibility.
[0079] As Figure 8 shown, the transition layer 33 can be fixed to the transition area 13 by means of bonding, dispensing 4, etc. Or, as Figure 9 shown, the transition layer 33 can be fixed to the transition section 23 by means of bonding, dispensing, etc. The transition layer 33 can be a sheet material such as a mylar sheet, a graphite sheet or a foam layer that has insulation but no bonding effect.
[0080] Taking the mylar sheet as an example, when the first insulating layer 31 and the second insulating layer 32 are an integral insulating adhesive layer and a spacer layer 34 is adhesively bonded to the surface of the insulating adhesive layer, the spacer layer 34 formed by the mylar sheet only needs to play a role in preventing adhesion. When the first insulating layer 31 and the second insulating layer 32 are independent insulating adhesive layers, the insulating layer 3 formed by the mylar sheet needs to play both insulating and anti-bonding roles at the same time. At this time, the thickness of the mylar sheet is greater than the thickness of the above-mentioned spacer layer 34.
[0081] As Figure 2 shown, the insulating layer 3 is also provided with an exhaust structure 37, and the exhaust structure 37 can achieve exhaust to ensure the performance of the electronic device. Specifically, the exhaust structure 37 is a linear structure opened in the insulating layer 3, which can achieve exhaust while ensuring insulation between the middle frame 1 and the heat sink 2. Specifically, the length, quantity and arrangement of the linear structure can be arranged according to specific conditions and are not specifically limited here.
[0082] An insulating isolation layer is also clamped between the heat sink 2 and the display screen 6. The insulating isolation layer can be a mylar sheet, a graphite sheet or a foam. And when the insulating isolation layer is set as a graphite sheet, it is more conducive to heat dissipation.
[0083] As Figure 3As shown, the heat pipe 2 includes a main body portion 25 and a skirt 24. Among them, each plate portion is disposed on the main body portion 25. That is to say, the main body portion 25 includes a first plate portion 21, a second plate portion 22, and a transition section 23. The skirt 24 is arranged along the circumference of the main body portion 25. Correspondingly, the installation area further includes an edge area arranged along the circumference. The first area 11, the second area 12, and the transition area 13 are all located within the space enclosed by the edge area. The insulating layer 3 further includes a mating layer 36 disposed between the skirt 24 and the edge area. Specifically, the mating layer 36 can be an insulating adhesive layer, or a mylar layer, a graphite layer, or a foam layer. The mating layer 36 and the edge area can be fixed by back glue, and the mating layer 36 and the skirt 24 can be fixed by dot glue 4.
[0084] As Figures 4 - 9 shown, the main body portion 25 is an integral structure. The main body portion 25 itself does not require assembly operations. Specifically, it can be processed and formed from a single plate body, as long as the thicknesses of the respective plate portions are different. Such a setting can simplify the overall structure and assembly operations.
[0085] Alternatively, as Figure 10 shown, the main body portion 25 can also be a structure including a bottom plate 26 and a mating plate 27. The front side surface of the bottom plate 26 is a planar structure. The mating plate 27 can be fixed to the rear side surface of the bottom plate 26 (such as by adhesive fixing), and the bottom plate 26 is locally thickened to form the second plate portion 22. The portion of the bottom plate 26 where the mating plate 27 is not fixed forms the first plate portion 21. The thicknesses of the first plate portion 21 and the second plate portion 22 are different. The side of the second plate portion 22 facing the first plate portion 21 is processed to form an inclined surface or an arc surface to form the transition section 23.
[0086] The number of mating plates 27 can be set according to the number of plate portions, such as one, two, or more. The thickness of each mating plate 27 can be set according to the specific installation space. Forming the main body portion 25 through the bottom plate 26 and the mating plate 27 can make the forming of the heat pipe 2 more flexible.
[0087] In addition, in this embodiment, there is no restriction on the specific positions of the first plate portion 21 and the second plate portion 22 inside the electronic device. Specifically, it can be arranged according to the actual space situation inside the electronic device. For example, the thickness of the first plate portion 21 is greater than the thickness of the second plate portion 22, the first plate portion 21 corresponds to the main board, and the second plate portion 22 corresponds to the battery. Or it can also be that the thickness of the first plate portion 21 is less than the thickness of the second plate portion 22, the first plate portion 21 corresponds to the battery, and the second plate portion 22 corresponds to the main board.
[0088] In this article, specific examples are used to elaborate on the principles and implementation manners of the present application. The description of the above embodiments is only used to help understand the method and its core idea of the present application. It should be noted that for those of ordinary skill in the art in this technical field, without departing from the principles of the present application, several improvements and modifications can still be made to the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.
Claims
1. An electronic device, characterized in that, it includes a middle frame (1), a heat pipe (2) and an insulating layer (3); the heat pipe (2) includes at least two plate parts with different thicknesses, the front surfaces of the plate parts are coplanar, and an installation area corresponding to the heat pipe (2) is provided on the front surface of the middle frame (1); the insulating layer (3) is fixedly arranged between the heat pipe (2) and the installation area and covers the front surface of the heat pipe (2).
2. The electronic device according to claim 1, characterized in that, the heat pipe (2) includes two plate parts, and the two plate parts include a first plate part (21) and a second plate part (22); the installation area includes a first area (11) corresponding to the first plate part (21) and a second area (12) corresponding to the second plate part (22); the insulating layer (3) includes a first insulating layer (31) and a second insulating layer (32), the first insulating layer (31) is fixedly arranged between the first plate part (21) and the first area (11), and the second insulating layer (32) is fixed between the second plate part (22) and the second area (12).
3. The electronic device according to claim 2, characterized in that, the first insulating layer (31) is an insulating adhesive layer, and the first area (11) and the first plate part (21) are adhesively fixed through the first insulating layer (31).
4. The electronic device according to claim 3, characterized in that, when the first area (11) and the first plate part (21) are adhesively fixed through the first insulating layer (31), the distance between the second area (12) and the second plate part (22) is greater than the thickness of the second insulating layer (32), the second insulating layer (32) is provided with a through hole (321) in the thickness direction, and the second area (12) and the second plate part (22) are fixed through a glue dot (4) arranged in the through hole (321).
5. The electronic device according to claim 4, characterized in that, the second insulating layer (32) is an insulating adhesive layer, and the second insulating layer (32) is adhesively fixed to the second area (12) or the second plate part (22).
6. The electronic device according to any one of claims 2-5, characterized in that, the heat pipe (2) further includes a transition section (23) arranged between the first plate part (21) and the second plate part (22), the installation area further includes a transition area (13) located between the first area (11) and the second area (12), the insulating layer (3) further includes a transition layer (33) arranged between the first insulating layer (31) and the second insulating layer (32), and the transition layer (33) is located between the transition area (13) and the transition section (23); the transition section (23) includes an inclined surface or an arc surface connecting between the first plate part (21) and the second plate part (22); The transition region (13) includes an inclined surface or an arc surface connected between the first region (11) and the second region (12).
7. The electronic device according to claim 6, wherein, the transition region (13) and the transition section (23) are separated from each other.
8. The electronic device according to claim 7, wherein, the first insulating layer (31) and the second insulating layer (32) are an integral insulating adhesive layer, and the transition layer (33) further includes a spacer layer (34), and the spacer layer (34) is bonded to the surface of the insulating adhesive layer.
9. The electronic device according to claim 8, wherein, the spacer layer (34) is bonded to the front surface of the insulating adhesive layer.
10. The electronic device according to claim 8 or 9, wherein, the spacer layer (34) is a mylar sheet, a graphite sheet or a foam layer.
11. The electronic device according to claim 7, wherein, the first insulating layer (31) and the second insulating layer (32) are independent of each other, and both ends of the transition layer (33) are respectively joined or overlapped with the first insulating layer (31) and the second insulating layer (32), and are fixed to the transition region (13) or the transition section (23) by bonding.
12. The electronic device according to any one of claims 1-11, wherein, the heat pipe (2) includes a main body portion (25) and a skirt (24) arranged along the circumference of the main body portion (25), each plate portion is arranged on the main body portion (25), the installation area is provided with an edge area adapted to the skirt (24), and the insulating layer (3) includes a mating layer (36) fixed between the skirt (24) and the edge area.
13. The electronic device according to claim 12, wherein, the mating layer (36) is fixedly bonded to the edge area, and the mating layer (36) is fixed to the skirt (24) by dispensing glue (4).
14. The electronic device according to claim 12, wherein, the main body portion (25) is an integral structure.
15. The electronic device according to claim 12, wherein, the main body portion (25) includes a bottom plate (26) and at least one mating plate (27), a part of the bottom plate (26) forms one of the plate portions, and each mating plate (27) is respectively fixed to the bottom plate (26) and forms one of the plate portions.
16. The electronic device according to any one of claims 1-15, wherein, it further includes a display screen (6) and a rear shell (7), the display screen (6) and the rear shell (7) are respectively fixed on both sides of the middle frame (1), and enclose to form a housing, and the heat pipe (2) is located between the middle frame (1) and the display screen (6).