Equipment heat dissipation method and device and storage medium

Abstract

The invention relates to a device heat dissipation method and device and a storage medium, and the device heat dissipation method comprises the steps: determining a heat dissipation mode of a heat dissipation device in response to the determination that the heat dissipation device needs to carry out heat dissipation on a to-be-cooled device; on the basis of the determined heat dissipation mode, heat dissipation is conducted on the equipment to be subjected to heat dissipation; wherein the heat dissipation mode at least comprises a first heat dissipation mode or a second heat dissipation mode; in the first heat dissipation mode, the working voltage of heat dissipation equipment is dynamically adjusted, and heat dissipation is conducted on the equipment to be subjected to heat dissipation; and in the second heat dissipation mode, the target temperature difference between the first face and the second face of the heat dissipation equipment is dynamically adjusted, heat dissipation is conducted on the equipment to be subjected to heat dissipation, the first face is used for absorbing heat, and the second face is used for releasing heat. The heat dissipation efficiency of the heat dissipation equipment is improved, and the user experience is improved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of electronic device accessory systems, and particularly to a device heat dissipation method, apparatus, and storage medium. Background Art

[0002] With the continuous development of electronic devices, the performance of electronic devices has also been continuously improved, and the phenomenon of heat generation in electronic devices has become a common phenomenon.

[0003] In related technologies, the purpose of adjusting an electronic device is achieved according to a method of controlling a fixed voltage or a fixed temperature. However, neither the method of fixed voltage nor the method of fixed temperature can achieve the optimal heat dissipation amount, and thus the user experience cannot be improved. Summary of the Invention

[0004] To overcome the problems existing in related technologies, the present disclosure provides a device heat dissipation method, apparatus, and storage medium.

[0005] According to a first aspect of an embodiment of the present disclosure, a device heat dissipation method is provided, including: in response to determining that a heat dissipation device needs to dissipate heat from a device to be cooled, determining a heat dissipation mode of the heat dissipation device; based on the determined heat dissipation mode, dissipating heat from the device to be cooled; wherein the heat dissipation mode includes at least a first heat dissipation mode or a second heat dissipation mode; in the first heat dissipation mode, dissipating heat from the device to be cooled by dynamically adjusting the working voltage of the heat dissipation device; in the second heat dissipation mode, dissipating heat from the device to be cooled by dynamically adjusting a target temperature difference between a first surface and a second surface of the heat dissipation device, where the first surface is used to absorb heat and the second surface is used to release heat.

[0006] In one implementation, the step of, in the first heat dissipation mode, dissipating heat from the device to be cooled by dynamically adjusting the working voltage of the heat dissipation device includes: dynamically adjusting the working voltage of the heat dissipation device to make the heat dissipation amount of the heat dissipation device reach the maximum heat dissipation amount in the current working state; based on the maximum heat dissipation amount, dissipating heat from the heat dissipation device.

[0007] In one implementation, the step of dynamically adjusting the working voltage of the heat dissipation device to make the heat dissipation amount of the heat dissipation device reach the maximum heat dissipation amount in the current working state includes: controlling the heat dissipation device to start under a preset working condition and perform initial heat dissipation, where the preset working condition is to start with the lowest working voltage that satisfies the normal operation of the heat dissipation device and a fixed fan speed of the heat dissipation device; gradually increasing the working voltage of the heat dissipation device, and real-time detecting the input power and working state of the heat dissipation device; based on the input power and the working state, adjusting the heat dissipation amount of the heat dissipation device to make the heat dissipation amount of the heat dissipation device reach the maximum heat dissipation amount in the current working state.

[0008] In one embodiment, adjusting the heat dissipation amount of the heat dissipation device based on the input power and the working state includes: in response to detecting that the input voltage reaches the rated input power, and / or the working voltage reaches the rated voltage, and the working state of the heat dissipation device meets the conditions, continuously increasing the input power of the heat dissipation device so that the heat dissipation amount of the heat dissipation device reaches the maximum heat dissipation amount in the current working state.

[0009] In one embodiment, continuously increasing the working voltage of the heat dissipation device so that the heat dissipation amount of the heat dissipation device reaches the maximum heat dissipation amount in the current working state includes: determining the first heat dissipation amount of the heat dissipation device; increasing the input power of the heat dissipation device, and when the working state of the heat dissipation device meets the conditions, re-determining the second heat dissipation amount of the heat dissipation device; in response to the second heat dissipation amount being greater than the first heat dissipation amount, continuing to increase the input power of the heat dissipation device and re-determining the second heat dissipation amount of the heat dissipation device, and repeating the above process until the second heat dissipation amount is less than the first heat dissipation amount.

[0010] In one embodiment, the method further includes: in response to the second heat dissipation amount being less than the first heat dissipation amount, continuously decreasing the input power of the heat dissipation device so that the heat dissipation amount of the heat dissipation device reaches the maximum heat dissipation amount in the current working state.

[0011] In one embodiment, continuously decreasing the input power of the heat dissipation device so that the heat dissipation amount of the heat dissipation device reaches the maximum heat dissipation amount in the current working state includes: decreasing the input power of the heat dissipation device, and when the working state of the heat dissipation device meets the conditions, re-determining the third heat dissipation amount of the heat dissipation device; in response to the third heat dissipation amount being greater than the second heat dissipation amount, continuing to decrease the input power of the heat dissipation device and re-determining the third heat dissipation amount of the heat dissipation device, and repeating the above process until the third heat dissipation amount is less than the second heat dissipation amount; if the third heat dissipation amount is less than the second heat dissipation amount, adjusting the input power of the heat dissipation device to the input power before the most recent adjustment, waiting for a set time period, and then re-executing the step of increasing the input power of the heat dissipation device.

[0012] In one embodiment, adjusting the heat dissipation amount of the heat dissipation device based on the input power and the working state includes: in response to the input power of the heat dissipation device not reaching the rated input power and the working voltage not reaching the rated voltage, continuously increasing the input voltage.

[0013] In one implementation, in the second heat dissipation mode, dissipating heat from the device to be heat-dissipated by dynamically adjusting the target temperature difference between the first surface and the second surface of the heat dissipation device includes: in response to the temperature of the first surface being greater than a first threshold and the temperature difference between the temperature of the first surface and the temperature of the second surface reaching a temperature difference threshold, maintaining the temperature difference between the temperature of the first surface and the temperature of the second surface of the heat dissipation device at the temperature difference threshold.

[0014] In one implementation, in the second heat dissipation mode, dissipating heat from the device to be heat-dissipated by dynamically adjusting the target temperature difference between the first surface and the second surface of the heat dissipation device includes: in response to the temperature of the first surface being greater than a first threshold and the temperature difference between the temperature of the first surface and the temperature of the second surface being less than the temperature difference threshold, increasing the target temperature difference.

[0015] In one implementation, in the second heat dissipation mode, dissipating heat from the device to be heat-dissipated by dynamically adjusting the target temperature difference between the first surface and the second surface of the heat dissipation device includes: in response to the temperature of the first surface being lower than a second threshold, decreasing the target temperature difference.

[0016] In one implementation, determining the heat dissipation mode of the heat dissipation device by using at least one of the following methods includes: determining the heat dissipation mode of the heat dissipation device based on an instruction sent by the device to be heat-dissipated, where the instruction is determined based on the data information of the device to be heat-dissipated, or based on the operation information of the user on the device to be heat-dissipated, or based on the temperature information of the device to be heat-dissipated; determining the heat dissipation mode of the heat dissipation device based on the data information obtained from the device to be heat-dissipated; determining the heat dissipation mode of the heat dissipation device based on the operation information of the user on the device to be heat-dissipated; determining the heat dissipation mode of the heat dissipation device based on the temperature information of the device to be heat-dissipated detected by the heat dissipation device or based on the temperature information sent by the device to be heat-dissipated.

[0017] In one implementation, the data information includes at least one of the following: the load data of the processor of the device to be heat-dissipated; the process data of the device to be heat-dissipated; the type of the device to be heat-dissipated; determining the heat dissipation mode of the heat dissipation device includes at least one of the following: in response to the load data being greater than a third threshold, determining the heat dissipation mode of the heat dissipation device as the first heat dissipation mode; in response to the load data being less than the third threshold, determining the heat dissipation mode of the heat dissipation device as the second heat dissipation mode; in response to the process data being the process data of a first type of application program, determining the heat dissipation mode of the heat dissipation device as the first heat dissipation mode; in response to the process data being the process data of a second type of application program, determining the heat dissipation mode of the heat dissipation device as the second heat dissipation mode; determining the heat dissipation mode corresponding to the type of the device to be heat-dissipated from a preset table.

[0018] In one implementation, the temperature information includes at least one of the following: the temperature of the device to be cooled; the temperature change trend of the device to be cooled; The method for determining the cooling mode of the cooling device includes at least one of the following: determining that the cooling mode of the cooling device is the first cooling mode in response to the temperature of the device to be cooled being higher than a fourth threshold; determining that the cooling mode of the cooling device is the second cooling mode in response to the temperature of the device to be cooled being lower than the fourth threshold; determining that the cooling mode of the cooling device is the first cooling mode in response to the temperature of the device to be cooled showing an increasing trend; determining that the cooling mode of the cooling device is the second cooling mode in response to the temperature of the device to be cooled showing a decreasing trend.

[0019] According to a second aspect of the embodiments of the present disclosure, there is provided a device cooling method, including: sending an instruction, data information, and / or temperature information to a cooling device, where the instruction, data information, and / or temperature information are used for the cooling device to determine a cooling mode; where the cooling mode includes at least a first cooling mode or a second cooling mode; in the first cooling mode, cooling the device to be cooled by dynamically adjusting the working voltage of the cooling device; in the second cooling mode, cooling the device to be cooled by dynamically adjusting the target temperature difference between a first surface and a second surface of the cooling device, where the first surface is used to absorb heat and the second surface is used to release heat.

[0020] In one implementation, the instruction is determined in the following manner: determining an instruction based on the data information of the device to be cooled, or determining an instruction based on the operation information of a user on the device to be cooled, or determining an instruction based on the temperature information of the device to be cooled.

[0021] In one implementation, the data information includes at least one of the following: the load data of the processor of the device to be cooled; the process data of the device to be cooled; the type of the device to be cooled; The method for determining an instruction based on the data information of the device to be cooled includes at least one of the following: determining a first instruction in response to the load data being greater than a third threshold, where the first instruction is used to instruct that the cooling mode of the cooling device is the first cooling mode; determining a second instruction in response to the load data being less than the third threshold, where the second instruction is used to instruct that the cooling mode of the cooling device is the second cooling mode; determining a first instruction in response to the process data being the process data of a first type of application program, where the first instruction is used to instruct that the cooling mode of the cooling device is the first cooling mode; determining a second instruction in response to the process data being the process data of a second type of application program, where the second instruction is used to instruct that the cooling mode of the cooling device is the second cooling mode; determining, from a preset table, an instruction corresponding to the type of the device to be cooled, where the instruction is used to instruct the cooling mode of the device to be cooled.

[0022] In one implementation, determining an instruction based on operation information of a user on a device to be cooled includes: in response to receiving first operation information on the device to be cooled, determining a first instruction for instructing the cooling mode of the cooling device to be the first cooling mode, where the first operation information is used to indicate generating the first instruction; or in response to receiving second operation information on the device to be cooled, determining a second instruction for instructing the cooling mode of the cooling device to be the second cooling mode, where the second operation information is used to indicate generating the second instruction.

[0023] In one implementation, the temperature information includes at least one of the following: the temperature of the device to be cooled; the temperature change trend of the device to be cooled; determining an instruction based on the temperature information of the device to be cooled includes: in response to the temperature of the device to be cooled being higher than a fourth threshold, determining a first instruction for instructing the cooling mode of the cooling device to be the first cooling mode; in response to the temperature of the device to be cooled being lower than the fourth threshold, determining a second instruction for instructing the cooling mode of the cooling device to be the first cooling mode; in response to the temperature of the device to be cooled showing an increasing trend, determining a first instruction for instructing the cooling mode of the cooling device to be the first cooling mode; in response to the temperature of the device to be cooled showing a decreasing trend, determining a second instruction for instructing the cooling mode of the cooling device to be the second cooling mode.

[0024] According to a third aspect of the embodiments of the present disclosure, there is provided a device cooling apparatus, including: an execution unit configured to, in response to determining that a cooling device needs to cool a device to be cooled, determine the cooling mode of the cooling device; and cool the device to be cooled based on the determined cooling mode; where the cooling mode at least includes a first cooling mode or a second cooling mode; in the first cooling mode, the device to be cooled is cooled by dynamically adjusting the operating voltage of the cooling device; in the second cooling mode, the device to be cooled is cooled by dynamically adjusting the target temperature difference between a first surface and a second surface of the cooling device, where the first surface is used to absorb heat and the second surface is used to release heat.

[0025] In one implementation, in the first cooling mode, the execution unit cools the device to be cooled by dynamically adjusting the operating voltage of the cooling device in the following manner: dynamically adjusting the operating voltage of the cooling device to make the heat dissipation of the cooling device reach the maximum heat dissipation in the current operating state; and cooling the cooling device based on the maximum heat dissipation.

[0026] In one implementation, the execution unit dynamically adjusts the working voltage of the heat dissipation device in the following manner to make the heat dissipation amount of the heat dissipation device reach the maximum heat dissipation amount in the current working state: control the heat dissipation device to start under preset working conditions and perform initial heat dissipation, where the preset working conditions are to start with the lowest working voltage that satisfies the normal operation of the heat dissipation device and the fixed fan speed of the heat dissipation device; gradually increase the working voltage of the heat dissipation device and detect the input power and working state of the heat dissipation device in real time; based on the input power and the working state, adjust the heat dissipation amount of the heat dissipation device to make the heat dissipation amount of the heat dissipation device reach the maximum heat dissipation amount in the current working state.

[0027] In one implementation, the execution unit adjusts the heat dissipation amount of the heat dissipation device based on the input power and the working state in the following manner: in response to detecting that the input voltage reaches the rated input power, and / or the working voltage reaches the rated voltage, and the working state of the heat dissipation device meets the conditions, continuously increase the input power of the heat dissipation device to make the heat dissipation amount of the heat dissipation device reach the maximum heat dissipation amount in the current working state.

[0028] In one implementation, the execution unit continuously increases the working voltage of the heat dissipation device to make the heat dissipation amount of the heat dissipation device reach the maximum heat dissipation amount in the current working state in the following manner: determine the first heat dissipation amount of the heat dissipation device; increase the input power of the heat dissipation device, and when the working state of the heat dissipation device meets the conditions, re-determine the second heat dissipation amount of the heat dissipation device; in response to the second heat dissipation amount being greater than the first heat dissipation amount, continue to increase the input power of the heat dissipation device and re-determine the second heat dissipation amount of the heat dissipation device, and repeat the above process until the second heat dissipation amount is less than the first heat dissipation amount.

[0029] In one implementation, the execution unit is further configured to: in response to the second heat dissipation amount being less than the first heat dissipation amount, continuously decrease the input power of the heat dissipation device to make the heat dissipation amount of the heat dissipation device reach the maximum heat dissipation amount in the current working state.

[0030] In one implementation, the execution unit continuously reduces the input power of the heat dissipation device in the following manner to make the heat dissipation amount of the heat dissipation device reach the maximum heat dissipation amount in the current working state: reduce the input power of the heat dissipation device, and when the working state of the heat dissipation device meets the conditions, re-determine the third heat dissipation amount of the heat dissipation device; in response to the third heat dissipation amount being greater than the second heat dissipation amount, continue to reduce the input power of the heat dissipation device and re-determine the third heat dissipation amount of the heat dissipation device, and repeat the above process until the third heat dissipation amount is less than the second heat dissipation amount; if the third heat dissipation amount is less than the second heat dissipation amount, adjust the input power of the heat dissipation device to the input power before the most recent adjustment, and after waiting for a set duration, re-execute the step of increasing the input power of the heat dissipation device.

[0031] In one implementation, the execution unit adjusts the heat dissipation amount of the heat dissipation device based on the input power and the working state in the following manner: in response to the input power of the heat dissipation device not reaching the rated input power and the working voltage not reaching the rated voltage, continue to increase the input voltage.

[0032] In one implementation, the execution unit dissipates heat from the device to be cooled by dynamically adjusting the target temperature difference between the first surface and the second surface of the heat dissipation device in the second heat dissipation mode: in response to the temperature of the first surface being greater than the first threshold and the temperature difference between the temperature of the first surface and the temperature of the second surface reaching the temperature difference threshold, maintain the temperature difference between the first surface and the second surface of the heat dissipation device at the temperature difference threshold.

[0033] In one implementation, the execution unit dissipates heat from the device to be cooled by dynamically adjusting the target temperature difference between the first surface and the second surface of the heat dissipation device in the second heat dissipation mode: in response to the temperature of the first surface being greater than the first threshold and the temperature difference between the temperature of the first surface and the temperature of the second surface being less than the temperature difference threshold, increase the target temperature difference.

[0034] In one implementation, the execution unit dissipates heat from the device to be cooled by dynamically adjusting the target temperature difference between the first surface and the second surface of the heat dissipation device in the second heat dissipation mode: in response to the temperature of the first surface being lower than the second threshold, reduce the target temperature difference.

[0035] In one implementation, the execution unit determines the heat dissipation mode of the heat dissipation device in at least one of the following ways: determining the heat dissipation mode of the heat dissipation device based on an instruction sent by the device to be cooled, where the instruction is determined based on the data information of the device to be cooled, or based on the operation information of the user on the device to be cooled, or based on the temperature information of the device to be cooled; determining the heat dissipation mode of the heat dissipation device based on the data information obtained from the device to be cooled; determining the heat dissipation mode of the heat dissipation device based on the operation information of the user on the device to be cooled; determining the heat dissipation mode of the heat dissipation device based on the temperature information of the device to be cooled detected by the heat dissipation device or based on the temperature information sent by the device to be cooled. In one implementation, the data information includes at least one of the following: the load data of the processor of the device to be cooled; the process data of the device to be cooled; the type of the device to be cooled; the execution unit determines the heat dissipation mode of the heat dissipation device in at least one of the following ways: in response to the load data being greater than a third threshold, determining that the heat dissipation mode of the heat dissipation device is the first heat dissipation mode; in response to the load data being less than the third threshold, determining that the heat dissipation mode of the heat dissipation device is the second heat dissipation mode; in response to the process data being the process data of a first type of application program, determining that the heat dissipation mode of the heat dissipation device is the first heat dissipation mode; in response to the process data being the process data of a second type of application program, determining that the heat dissipation mode of the heat dissipation device is the second heat dissipation mode; determining, from a preset table, the heat dissipation mode corresponding to the type of the device to be cooled.

[0036] In one implementation, the temperature information includes at least one of the following: the temperature of the device to be cooled; the temperature change trend of the device to be cooled; the execution unit determines the heat dissipation mode of the heat dissipation device in at least one of the following ways: in response to the temperature of the device to be cooled being higher than a fourth threshold, determining that the heat dissipation mode of the heat dissipation device is the first heat dissipation mode; in response to the temperature of the device to be cooled being lower than the fourth threshold, determining that the heat dissipation mode of the heat dissipation device is the second heat dissipation mode; in response to the temperature of the device to be cooled showing an increasing trend, determining that the heat dissipation mode of the heat dissipation device is the first heat dissipation mode; in response to the temperature of the device to be cooled showing a decreasing trend, determining that the heat dissipation mode of the heat dissipation device is the second heat dissipation mode.

[0037] According to a fourth aspect of the embodiments of the present disclosure, there is provided a device heat dissipation device, including: a sending unit configured to send instructions, data information, and / or temperature information to the heat dissipation device, where the instructions, data information, and / or temperature information are used for the heat dissipation device to determine a heat dissipation mode; wherein the heat dissipation mode at least includes a first heat dissipation mode or a second heat dissipation mode; in the first heat dissipation mode, the device to be dissipated is dissipated by dynamically adjusting the operating voltage of the heat dissipation device; in the second heat dissipation mode, the device to be dissipated is dissipated by dynamically adjusting the target temperature difference between the first surface and the second surface of the heat dissipation device, where the first surface is used to absorb heat and the second surface is used to release heat.

[0038] In one implementation, the device includes: an execution unit configured to determine an instruction in the following manner: determining an instruction based on the data information of the device to be dissipated, or determining an instruction based on the operation information of the user on the device to be dissipated, or determining an instruction based on the temperature information of the device to be dissipated.

[0039] In one implementation, the data information includes at least one of the following: the load data of the processor of the device to be dissipated; the process data of the device to be dissipated; the type of the device to be dissipated; the execution unit is configured to determine an instruction based on the data information of the device to be dissipated in the following manner: in response to the load data being greater than a third threshold, determining a first instruction for instructing the heat dissipation mode of the heat dissipation device to be the first heat dissipation mode; in response to the load data being less than the third threshold, determining a second instruction for instructing the heat dissipation mode of the heat dissipation device to be the second heat dissipation mode; in response to the process data being the process data of a first type of application program, determining a first instruction for instructing the heat dissipation mode of the heat dissipation device to be the first heat dissipation mode; in response to the process data being the process data of a second type of application program, determining a second instruction for instructing the heat dissipation mode of the heat dissipation device to be the second heat dissipation mode; determining, from a preset table, an instruction corresponding to the type of the device to be dissipated, where the instruction is used to instruct the heat dissipation mode of the device to be dissipated.

[0040] In one implementation, the execution unit is configured to determine an instruction based on the operation information of the user on the device to be dissipated in the following manner, including: in response to receiving first operation information on the device to be dissipated, determining a first instruction for instructing the heat dissipation mode of the heat dissipation device to be the first heat dissipation mode, where the first operation information is used to indicate the generation of the first instruction; or, in response to receiving second operation information on the device to be dissipated, determining a second instruction for instructing the heat dissipation mode of the heat dissipation device to be the second heat dissipation mode, where the second operation information is used to indicate the generation of the second instruction.

[0041] In one implementation, the temperature information includes at least one of the following: the temperature of the device to be cooled; the temperature change trend of the device to be cooled; the execution unit is configured to determine an instruction based on the temperature information of the device to be cooled in the following manner: in response to the temperature of the device to be cooled being higher than a fourth threshold, determining a first instruction for instructing the cooling mode of the cooling device to be the first cooling mode; in response to the temperature of the device to be cooled being lower than the fourth threshold, determining a second instruction for instructing the cooling mode of the cooling device to be the first cooling mode; in response to the temperature of the device to be cooled showing an increasing trend, determining a first instruction for instructing the cooling mode of the cooling device to be the first cooling mode; in response to the temperature of the device to be cooled showing a decreasing trend, determining a second instruction for instructing the cooling mode of the cooling device to be the second cooling mode.

[0042] According to a fifth aspect of the embodiments of the present disclosure, there is provided a device cooling apparatus, including: a processor; a memory for storing processor-executable instructions; wherein, the processor is configured to execute the executable instructions to be able to execute the device cooling method in the first aspect or any one of the implementations in the first aspect, or execute the device cooling method in the second aspect or any one of the implementations in the second aspect.

[0043] According to a sixth aspect of the embodiments of the present disclosure, there is provided a storage medium storing instructions, which when executed by a processor of a terminal, enable the terminal device to execute the device cooling method in the first aspect or any one of the implementations in the first aspect, or execute the device cooling method in the second aspect or any one of the implementations in the second aspect.

[0044] The technical solutions provided by the embodiments of the present disclosure may include the following beneficial effects: By determining different cooling modes of the cooling device, for example, by dynamically adjusting the working voltage of the cooling device in the first cooling mode, the cooling capacity of the cooling device is fully utilized, the cooling efficiency of the cooling device is improved, or by controlling the temperature difference between the second surface temperature and the second surface temperature, the user experience is enhanced.

[0045] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] The accompanying drawings herein are incorporated into the specification and form a part of the specification, showing embodiments consistent with the present disclosure, and are used together with the specification to explain the principles of the present disclosure.

[0047] Figure 1It is a flowchart of a device heat dissipation method shown according to an exemplary embodiment.

[0048] Figure 2 It is a flowchart of a method for determining a heat dissipation mode shown according to an exemplary embodiment.

[0049] Figure 3 It is a flowchart of a device heat dissipation method shown according to an exemplary embodiment.

[0050] Figure 4 It is a flowchart of a device heat dissipation method shown according to an exemplary embodiment.

[0051] Figure 5 It is a flowchart of a device heat dissipation method shown according to an exemplary embodiment.

[0052] Figure 6 It is a flowchart of determining the maximum heat dissipation amount shown according to an exemplary embodiment.

[0053] Figure 7 It is a flowchart of controlling the temperature difference shown according to an exemplary embodiment.

[0054] Figure 8 It is a block diagram of a device heat dissipation device shown according to an exemplary embodiment.

[0055] Figure 9 It is a block diagram of a device heat dissipation device shown according to an exemplary embodiment.

[0056] Figure 10 It is a block diagram of a device heat dissipation device shown according to an exemplary embodiment.

[0057] Figure 11 It is a block diagram of a device heat dissipation device shown according to an exemplary embodiment. Detailed implementation manners

[0058] Here, the exemplary embodiments will be described in detail, and the examples are shown in the drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementation manners described in the following exemplary embodiments do not represent all implementation manners consistent with the present disclosure.

[0059] The device heat dissipation method provided by the embodiments of the present disclosure is applied to the external device application scenario of an electronic device. The device heat dissipation method involved in the embodiments of the present disclosure is mainly applied to the electronic device heat dissipation scenario.

[0060] In the related art, with the continuous improvement of the performance of electronic devices, the phenomenon of electronic devices getting hot has become a common phenomenon. The temperature of the electronic device is controlled according to a fixed input voltage, or the temperature of the electronic device is adjusted by fixing the temperature. However, whether the temperature of the electronic device is adjusted by fixing the voltage or by fixing the temperature, the optimal heat dissipation cannot be achieved, and the fan speed cannot be adjusted to improve the user experience.

[0061] In view of this, the present disclosure adjusts the temperature of the electronic device by adjusting the voltage or by adjusting the temperature of the second surface according to the temperature of the first surface, so as to achieve the optimal heat dissipation and improve the user experience.

[0062] Figure 1 It is a flowchart of a device heat dissipation method shown according to an exemplary embodiment. As Figure 1 shown, the device heat dissipation method is used in a terminal and includes the following steps:

[0063] In step S11, in response to determining that the heat dissipation device needs to dissipate heat from the device to be dissipated, the heat dissipation mode of the heat dissipation device is determined.

[0064] In one implementation, it can be determined that the heat dissipation device needs to dissipate heat from the device to be dissipated. The determination method can be, for example, that the heat dissipation device responds to being close to the device to be dissipated, or the heat dissipation device establishes a connection with the device to be dissipated. The connection can be in various ways such as wired connection and wireless connection. The heat dissipation mode includes a first heat dissipation mode or a second heat dissipation mode. The first heat dissipation mode dissipates heat from the device to be dissipated by dynamically adjusting the working voltage of the scattering device. The second heat dissipation mode dissipates heat from the device to be dissipated by dynamically adjusting the target temperature difference between the first surface and the second surface of the heat dissipation device. Among them, the first surface can also be called the cold surface, and the first surface is used to absorb heat. That is, the first surface of the heat dissipation device is close to the device to be dissipated to absorb the heat of the device to be dissipated, so as to dissipate heat from the device to be dissipated and reduce the temperature of the device to be dissipated. The second surface can also be called the hot surface, and the second surface is used to release heat.

[0065] In step S12, based on the determined heat dissipation mode, the device to be dissipated is dissipated.

[0066] In one implementation, according to the determined heat dissipation mode, the heat dissipation device can be dissipated. Different heat dissipation modes can correspond to different effects. For example, the first heat dissipation mode can make full use of the heat dissipation capacity of the heat dissipation device. The second heat dissipation mode can reduce noise and improve the user experience while ensuring the basic heat dissipation effect.

[0067] The present disclosure determines different heat dissipation modes of a heat dissipation device. For example, in a first heat dissipation mode of dynamically adjusting the operating voltage of the heat dissipation device, the heat dissipation capacity of the heat dissipation device is fully utilized to improve the heat dissipation efficiency of the heat dissipation device. Or, by controlling the temperature difference between the second surface temperature and the second surface temperature, the user experience is enhanced.

[0068] Figure 2 It is a flowchart of a method for determining a heat dissipation mode shown according to an exemplary embodiment. As Figure 2 shown, the specific steps are as follows:

[0069] In step S21, the operating voltage of the heat dissipation device is dynamically adjusted so that the heat dissipation amount of the heat dissipation device reaches the maximum heat dissipation amount in the current operating state.

[0070] In some embodiments, the operating voltage of the heat dissipation device can be dynamically adjusted so that the heat dissipation amount of the device to be cooled reaches the maximum heat dissipation amount in the current operating state. It can be understood that the maximum heat dissipation amount is not a fixed value. In different operating states, the maximum heat dissipation amount. By dynamically adjusting the operating voltage, the device to be cooled can dissipate heat at the maximum heat dissipation amount in any state.

[0071] In step S22, based on the maximum heat dissipation amount, the heat dissipation device is cooled.

[0072] In some embodiments, the heat dissipation device can be cooled based on the maximum heat dissipation amount. Among them, the heat dissipation amount is related to the operating current of the heat dissipation device and the temperature difference between the first surface and the second surface of the heat dissipation device. For example, a table can be pre-configured in the heat dissipation device, and there is a corresponding relationship between the operating current, the temperature difference, and the heat dissipation amount in the table.

[0073] The present disclosure dynamically adjusts the operating voltage of the heat dissipation device so that the heat dissipation amount of the heat dissipation device reaches the maximum value as much as possible, so as to improve the utilization of the heat dissipation capacity of the heat dissipation device.

[0074] Figure 3 It is a flowchart of a device heat dissipation method shown according to an exemplary embodiment. As Figure 3 shown, the specific steps are as follows:

[0075] In step S31, the heat dissipation device is controlled to start with the initial operating conditions and perform initial heat dissipation.

[0076] In one implementation, the heat dissipation device is controlled to start with the lowest operating voltage and the maximum fan speed. Under this condition, initial heat dissipation starts.

[0077] Among them, the initial operating conditions are the lowest voltage that can maintain the normal operation of the heat dissipation device, and the maximum adjustable speed of the fan.

[0078] In step S32, gradually increase the operating voltage of the heat dissipation device, and detect the input power and operating state of the heat dissipation device in real time.

[0079] In one implementation, under the conditions of the lowest operating voltage that currently satisfies the normal operation of the heat dissipation device and the fixed fan speed of the heat dissipation device, start adjusting step by step from the lowest operating voltage, and detect the input power of the heat dissipation device and the operating state of the heat dissipation device in real time.

[0080] Among them, the operating state can be understood as maintaining the heat dissipation device in a stable operating state. For example, in this state, the detected current of the heat dissipation device is in a non-changing state, or the temperature difference between the first surface temperature and the second surface temperature of the heat dissipation device is in a non-changing state.

[0081] In step S33, adjust the heat dissipation amount of the heat dissipation device based on the input power and the operating state.

[0082] In one implementation, adjust the heat dissipation amount of the heat dissipation device in real time according to the detected input power and the operating state of the heat dissipation device to ensure that the heat dissipation amount of the heat dissipation device is in an optimal heat dissipation state.

[0083] Among them, adjusting the heat dissipation amount of the heat dissipation device can be understood as, according to the different heat dissipation amounts measured by the heat dissipation device in different operating environments, adjusting the maximum heat dissipation amount measured by the heat dissipation device in real time.

[0084] In one implementation, according to different operating environments of the heat dissipation device, for example, under the condition of a fixed fan speed, continuously adjust the input power of the heat dissipation device to reach the maximum heat dissipation amount, and ensure that the heat dissipation device reaches the optimal efficiency in adapting to different external environments. In one implementation, the present disclosure provides a method for adjusting the heat dissipation amount according to the input power and the operating state, including: in response to detecting that the input voltage reaches the rated input power, and / or the operating voltage reaches the rated voltage, and the operating state of the heat dissipation device meets the conditions, continuously increase the input power of the heat dissipation device so that the heat dissipation amount of the heat dissipation device reaches the maximum heat dissipation amount in the current operating state.

[0085] In one implementation, the rated input power is the maximum input power that supports the normal operation of the heat dissipation device, and the rated voltage is the rated voltage that protects the heat dissipation device to operate normally at a fixed temperature.

[0086] In one embodiment, the operating voltage of the heat dissipation device can be continuously increased. If increasing the voltage of the heat dissipation device results in an increase in the heat dissipation amount, then the operating voltage of the heat dissipation device is continuously increased until the heat dissipation device reaches the maximum heat dissipation amount under the current operating state. For example, when the heat dissipation device is in a stable state, the heat dissipation amount of the heat dissipation device can be determined. The operating voltage is increased, and when the heat dissipation device reaches a stable state again, the heat dissipation amount of the heat dissipation device is determined. If the heat dissipation amounts determined twice before and after show an increasing trend, then the operating voltage can be continuously increased to make the heat dissipation amount of the heat dissipation device reach the maximum heat dissipation amount. Among them, the stable state can be determined by whether the operating current of the heat dissipation device or the temperature difference between the first surface and the second surface changes. For example, if the operating current of the heat dissipation device does not change within a period of time, or the change amount is less than the threshold value, then it can be determined that the heat dissipation device is in a stable state. Or, if the temperature difference between the first surface and the second surface of the heat dissipation device does not change within a period of time, or the change amount is less than the threshold value, then it can be determined that the heat dissipation device is in a stable state. When the heat dissipation device is in a stable state.

[0087] Figure 4 is a flowchart of a device heat dissipation method shown according to an exemplary embodiment. As Figure 4 shown, the specific steps are as follows:

[0088] In step S41, the first heat dissipation amount of the heat dissipation device is determined.

[0089] In one embodiment, when it is detected that the adapter currently equipped with the heat dissipation device reaches the maximum input power that the adapter can reach, or when it is detected that the operating voltage of the heat dissipation device reaches the rated voltage at a certain temperature, and it is detected that the operating state of the heat dissipation device meets the required working conditions, that is, the heat dissipation device is in a stable operating state, then, in this state, the current heat dissipation amount is confirmed through the corresponding working current heat dissipation amount table at different temperature differences.

[0090] In step S42, the input power of the heat dissipation device is increased, and when the operating state of the heat dissipation device meets the conditions, the second heat dissipation amount of the heat dissipation device is re-determined.

[0091] In one embodiment, on the premise of detecting the current heat dissipation amount, the input power of the heat dissipation device is increased, such as by increasing the voltage, to increase the input power of the heat dissipation device. On the premise of increasing the power of the heat dissipation device, the heat dissipation amount after increasing the power of the heat dissipation device is detected, and the heat dissipation amount at this time is determined as the second heat dissipation amount.

[0092] In step S43, in response to the second heat dissipation amount being greater than the first heat dissipation amount, the input power of the heat dissipation device is continuously increased, and the second heat dissipation amount of the heat dissipation device is re-determined, and the above process is repeated until the second heat dissipation amount is less than the first heat dissipation amount.

[0093] In one implementation, based on the increased input power, the second heat dissipation amount is determined. The second heat dissipation amount is compared with the first heat dissipation amount. If the second heat dissipation amount is greater than the first heat dissipation amount measured in the adjacent state, it indicates that the state in which the first heat dissipation amount is measured is not the state where the optimal heat dissipation amount of the heat dissipation device is located. Then, the input power is continuously increased until the second heat dissipation amount is lower than the first heat dissipation amount.

[0094] In one implementation, when the state where the second heat dissipation amount is lower than the first heat dissipation amount is detected for the first time, the maximum second heat dissipation amount measured previously is regarded as the maximum heat dissipation amount.

[0095] The present disclosure provides a method for adjusting the heat dissipation amount according to the input power and the working state, including: in response to the second heat dissipation amount being less than the first heat dissipation amount, continuously reducing the input power of the heat dissipation device to make the heat dissipation amount of the heat dissipation device reach the maximum heat dissipation amount in the current working state.

[0096] In one implementation, the working voltage of the heat dissipation device can be continuously reduced. For example, if increasing the voltage of the heat dissipation device reduces the heat dissipation amount, the working voltage of the heat dissipation device can be reduced to make the heat dissipation amount of the heat dissipation device reach the maximum heat dissipation amount in the current working state.

[0097] Figure 5 It is a flowchart of a device heat dissipation method shown according to an exemplary embodiment. As Figure 5 shown, the specific steps are as follows:

[0098] In step S51, reduce the input power of the heat dissipation device, and when the working state of the heat dissipation device meets the conditions, re-determine the third heat dissipation amount of the heat dissipation device, adjust the input power of the heat dissipation device based on the third heat dissipation amount, and determine the heat dissipation amount based on the adjusted input power.

[0099] In one implementation, based on the increased input power, the second heat dissipation amount is determined. The second heat dissipation amount is compared with the first heat dissipation amount. If the second heat dissipation amount is less than the first heat dissipation amount measured in the adjacent state, it indicates that the state in which the first heat dissipation amount is measured is the state where the optimal heat dissipation amount of the heat dissipation device is located. At this time, reduce the power. After reducing the power, detect the heat dissipation amount again. If the heat dissipation amount increases at this time, compare it with the first heat dissipation amount to obtain the optimal heat dissipation amount.

[0100] In one implementation, calculate the heat dissipation amount during the process of continuously adjusting the input power. If the obtained heat dissipation amount is less than the heat dissipation amount obtained in the adjacent previous time when the input power is increased, then reduce the input power. If the obtained heat dissipation amount is less than the heat dissipation amount obtained in the adjacent previous time when the input power is reduced, then increase the input power.

[0101] In one implementation, whether the input power is increased or decreased, it is adaptively adjusted according to the input power of the previous time and the heat dissipation obtained the previous time, so as to ensure that the maximum heat dissipation is obtained during the continuous change of the heat dissipation.

[0102] In step S52, in response to the third heat dissipation being greater than the second heat dissipation, continue to reduce the input power of the heat dissipation device, and re-determine the third heat dissipation of the heat dissipation device, and repeat the above process until the third heat dissipation is less than the second heat dissipation.

[0103] In one implementation, the reduced input power is determined as the third heat dissipation, and the third heat dissipation is compared with the second heat dissipation. If the third heat dissipation is greater than the second heat dissipation measured in the adjacent state, it indicates that the state of measuring the second heat dissipation is not the state where the best heat dissipation of the heat dissipation device is located. Therefore, continue to reduce the input power until the third heat dissipation is lower than the second heat dissipation.

[0104] In step S53, in response to the third heat dissipation being less than the second heat dissipation, adjust the input power of the heat dissipation device to the input power before the most recent adjustment, and after waiting for a set duration, re-execute the step of increasing the input power of the heat dissipation device.

[0105] In one implementation, based on the measured third heat dissipation being less than the second heat dissipation, adjust the input power of the heat dissipation device to the input power before the most recent adjustment, and wait for a period of time for the adjusted input power until the system is in a stable state, and then re-adjust the input power of the heat dissipation device only according to the current heat dissipation.

[0106] Among them, the set duration can be understood as the duration when the system is in a stable state after changing the input power.

[0107] In one implementation, compare the third heat dissipation with the second heat dissipation. If the third heat dissipation is greater than the second heat dissipation, it indicates that the power needs to be reduced in the current state. At this time, adjust the reduced power to the input power corresponding to the third heat dissipation after reducing the power, and continue to re-enter the process of adjusting the input power when the heat dissipation device is not in a stable state. During the continuous adjustment of the input power, determine the maximum heat dissipation corresponding to the maximum input power.

[0108] In one implementation, adjust the heat dissipation of the heat dissipation device according to the input power and the working state.

[0109] In one embodiment, if the current input power does not reach the maximum input power of the cooling device adapter, or the current working voltage does not reach the rated voltage of the cooling device at a certain temperature, it indicates that the working current of the cooling device is not in a stable state, and / or the temperature difference between the first surface temperature and the second surface temperature of the cooling device is not in a stable state. Then, increase the input voltage and continuously calculate the heat dissipation of the cooling device.

[0110] Among them, the rated voltage of the cooling device at a certain temperature can be understood as the voltage at which the cooling device will not be damaged at this temperature.

[0111] In one embodiment, determine that the input power of the cooling device is in an adjustable state according to the current input power and working state, so as to ensure that the cooling device can achieve the best heat dissipation in a stable working environment during operation.

[0112] In one embodiment, perform heat dissipation control according to the temperature difference between the first surface temperature and the second surface temperature of the cooling device.

[0113] In one embodiment, determine the change threshold of the first surface temperature and the maximum temperature difference.

[0114] Among them, the change threshold of the first surface temperature can be understood as the temperature change range within which the cooling device can dissipate heat with high efficiency, that is, including the first threshold and the second threshold. The maximum temperature difference can be understood as the maximum temperature difference that can be achieved between the first surface temperature and the second surface temperature set according to the change attributes of the cooling device. The cooling device can operate normally and efficiently within this maximum temperature difference range.

[0115] In one embodiment, detect the first surface temperature of the cooling device. When it is detected that the first surface temperature is greater than the first threshold and the temperature difference between the first surface temperature and the second surface temperature reaches the temperature difference threshold, keep the temperature difference between the first surface temperature and the second surface temperature of the cooling device at the current maximum temperature difference.

[0116] In one embodiment, monitor the first surface temperature, and at the same time control the second surface temperature and the temperature difference between the second surface temperatures, so that the system is in a high-efficiency state and the user experience is improved.

[0117] In one embodiment, it is detected that the first surface temperature is greater than the first threshold and the temperature difference between the first surface temperature and the second surface temperature does not reach the temperature difference threshold, then increase the target temperature difference.

[0118] Among them, the target temperature difference can be understood as a variable temperature difference value used to adjust the temperature difference between the first surface temperature and the second surface temperature according to the first surface temperature.

[0119] In one implementation, when it is detected that the temperature of the first surface is higher than the set first threshold, it indicates that the temperature of the first surface of the current heat dissipation device is in a state of relatively high temperature. Similarly, since the temperature of the second surface reduces the current heat according to the temperature of the first surface, it will also be in a state of relatively high temperature. Then, at this time, the target temperature difference is increased to ensure that the temperature difference between the first surface temperature and the second surface temperature is in a stable state, thereby ensuring that the heat dissipation device is in an efficient working state.

[0120] In one implementation, when it is detected that the temperature of the first surface is lower than the second threshold, then the target temperature difference is decreased.

[0121] In one implementation, if the temperature of the first surface is lower than the second threshold, it indicates that the current heat dissipation device is in a normal working state. However, since the temperature of the second surface of the heat dissipation device is relatively high, the target temperature difference is adjusted downward, thereby ensuring that the temperature difference between the first surface temperature and the second surface temperature is in a relatively stable temperature difference environment, reducing the fan speed, and improving the user experience.

[0122] In one implementation, at least one of the following methods is used to determine the heat dissipation mode of the heat dissipation device, including: determining the heat dissipation mode of the heat dissipation device based on an instruction sent by the device to be cooled, where the instruction is determined based on the data information of the device to be cooled, or based on the operation information of the user on the device to be cooled, or based on the temperature information of the device to be cooled; determining the heat dissipation mode of the heat dissipation device based on the data information obtained from the device to be cooled; determining the heat dissipation mode of the heat dissipation device based on the operation information of the user on the device to be cooled; determining the heat dissipation mode of the heat dissipation device based on the temperature information of the device to be cooled detected by the heat dissipation device, or based on the temperature information sent by the device to be cooled. In one implementation, the heat dissipation mode of the heat dissipation device can be determined based on an instruction sent by the device to be cooled. For example, when the user selects a heat dissipation mode on the device to be cooled, the device to be cooled can generate an instruction and send the instruction to the heat dissipation device. For another example, when the data of the device to be cooled meets the conditions, the heat dissipation mode is determined, and an instruction corresponding to the determined heat dissipation mode is sent to the heat dissipation device. For still another example, the device to be cooled generates an instruction according to the user's manipulation information and sends the instruction to the heat dissipation device. Among them, the user's manipulation information can be, for example, that the user selects a heat dissipation mode in the application program of the device to be cooled.

[0123] In one implementation, the heat dissipation device can determine the heat dissipation mode based on the data information obtained from the device to be cooled.

[0124] Among them, the data includes at least one of the following: the load data of the processor of the device to be cooled; the process data of the device to be cooled; the type of the device to be cooled.

[0125] In one implementation, the heat dissipation device determines the heat dissipation mode of the heat dissipation device based on the acquired data information, including at least one of the following: determining that the heat dissipation mode of the heat dissipation device is the first heat dissipation mode in response to the load data being greater than a third threshold; determining that the heat dissipation mode of the heat dissipation device is the second heat dissipation mode in response to the load data being less than the third threshold; determining that the heat dissipation mode of the heat dissipation device is the first heat dissipation mode in response to the process data being the process data of a first type of application program; determining that the heat dissipation mode of the heat dissipation device is the second heat dissipation mode in response to the process data being the process data of a second type of application program; determining the heat dissipation mode corresponding to the type of the device to be cooled from a preset table.

[0126] In one implementation, the heat dissipation device can acquire the load data of the processor of the device to be cooled and determine that the heat dissipation mode is the first heat dissipation mode in response to the load data being greater than a third threshold. It can be understood that if the load data exceeds the third threshold, the device to be cooled is currently in a state of urgently needing heat dissipation and requires a relatively large degree of heat dissipation. By determining the heat dissipation mode as the first heat dissipation mode, the heat dissipation capacity of the heat dissipation device can be fully utilized to dissipate heat from the device to be cooled to a relatively large extent. In response to the load data being less than the third threshold, the heat dissipation mode is determined to be the second heat dissipation mode. It can be understood that if the load data does not exceed the third threshold, it can be considered that the device to be cooled is not in a state of urgently needing heat dissipation and does not require a relatively large degree of heat dissipation. By determining the heat dissipation mode as the second heat dissipation mode, the fan speed of the heat dissipation device can be reduced, that is, the noise can be reduced, and the user experience can be improved. Among them, the load data can be the average value of the processor load over a period of time. That is, the heat dissipation device can acquire multiple load values of the device to be cooled over a period of time and calculate the average value. In response to the average value being greater than the third threshold, the heat dissipation mode is determined to be the first heat dissipation mode, and in response to the average value being less than the third threshold, the heat dissipation mode is determined to be the second heat dissipation mode. The heat dissipation mode is determined based on the average value to avoid inaccurate determination of the heat dissipation mode when the processor load is in a continuously changing state. Alternatively, the heat dissipation device can also directly receive the average value of multiple load values of the device to be cooled over a period of time. The period of time in this implementation can be set according to the actual situation, and the present disclosure does not make any limitation.

[0127] In one implementation, the heat dissipation device may obtain the process data of the device to be cooled, and in response to the process data including the process data of the first type of application, determine the heat dissipation mode as the first heat dissipation mode. The first type of application represents an application that causes a relatively high load on the device to be cooled. For example, when a certain application is running, if the average value of the processor load is higher than a third threshold within a period of time, it is determined that the application is of the first type. However, the above-described method for determining the first type of application in the present disclosure is only exemplary, and how to determine the first type of application can be set according to the actual situation. For example, the first type of application is a game application, a live broadcast application, etc. In response to the process data including the process data of the second type of application, determine the heat dissipation mode as the second heat dissipation mode. The second type of application represents an application that causes a relatively low load on the heat dissipation device. For example, when a certain application is running, if the average value of the processor load is lower than a third threshold within a period of time, it is determined that the application is of the second type. However, the above-described method for determining the second type of application in the present disclosure is only exemplary, and how to determine the second type of application can be set according to the actual situation. For example, the second type of application is a video playback application, a chat application, etc. However, the first type of application and the second type of application exemplified in this implementation are only exemplary and are not limited. The heat dissipation device may record which applications are included in the first type of application and which applications are included in the second type of application. Since the process data contains the names of the applications, the heat dissipation device can determine whether the applications currently running on the device to be cooled include the first type of application and / or the second type of application according to the process data. If the process data includes the process data of the first type of application, determine the heat dissipation mode as the first heat dissipation mode. If the process data includes the process data of the second type of application, determine the heat dissipation mode as the second heat dissipation mode. It can be understood that when the process data includes both the process data of the first type of application and the process data of the second type of application, the heat dissipation mode can be determined as the first heat dissipation mode or the second heat dissipation mode, or a prompt message can be displayed to the user, and the user can select the heat dissipation mode. The heat dissipation device may update the application names included in the stored first type of application and the application names included in the second type of application. The update includes operations such as modification, addition, deletion, replacement, etc.

[0128] In one implementation, the heat dissipation device may obtain the type of the device to be cooled. For example, different types correspond to different heat dissipation modes. A preset table may be stored in the heat dissipation device, and the heat dissipation mode corresponding to the type of the device to be cooled is determined from the preset table.

[0129] In one implementation, the heat dissipation device can monitor the operation information of the user. For example, the user can click a button on the heat dissipation device, etc., to generate operation information. When the heat dissipation device monitors the operation information of the user, it determines the heat dissipation mode. For example, the heat dissipation device can be configured with buttons, and based on the user clicking the buttons, the heat dissipation mode is determined. Different buttons correspond to different heat dissipation modes. Alternatively, the operation information of the user can also be a voice command, and when the heat dissipation device receives the user voice command, it determines the heat dissipation mode. Of course, the above are just examples. The user can generate operation information through other operations, enabling the heat dissipation device to determine the heat dissipation mode based on the operation information. The present disclosure does not make any limitations in this regard.

[0130] In one implementation, the heat dissipation device can determine the heat dissipation mode based on detecting the temperature information of the device to be cooled, or it can also obtain the temperature information sent by the device to be cooled to determine the heat dissipation mode.

[0131] In one implementation, the heat dissipation device can obtain the temperature of the device to be cooled. In response to the temperature being higher than the fourth threshold, it can determine the heat dissipation mode as the first heat dissipation mode to make full use of the heat dissipation capacity of the heat dissipation device and reduce the temperature as soon as possible. In response to the temperature being lower than the fourth threshold, it can determine the heat dissipation mode as the second heat dissipation mode to reduce noise and improve the user experience.

[0132] In one implementation, the heat dissipation parameters corresponding to the determined heat dissipation mode can be determined, such as determining the first threshold, the second threshold, etc. Based on the determined heat dissipation mode, heat dissipation is performed on the device to be cooled, including: in the determined heat dissipation mode, heat dissipation is performed on the device to be cooled according to the heat dissipation parameters. Different relevant parameters of the heat dissipation mode result in different heat dissipation effects. For example, by adjusting the relevant parameters of the heat dissipation mode, it is possible to achieve a relatively large heat dissipation amount but also a relatively large fan speed, or a relatively small heat dissipation amount but also a relatively small fan speed. The heat dissipation amount can make the best use of the functions of the heat dissipation device. A large fan speed means a large noise, which affects the user experience.

[0133] The present disclosure determines the heat dissipation mode through different methods, can flexibly determine the heat dissipation mode according to different situations, and improve efficiency.

[0134] In one implementation, before the heat dissipation device determines the heat dissipation mode of the heat dissipation device based on the instruction sent by the device to be cooled, the present disclosure provides a device heat dissipation method, including: receiving the instruction sent by the device to be cooled.

[0135] In one implementation, the heat dissipation device can receive instructions sent by the device to be cooled based on a wired or wireless connection method. For example, the wired connection method can be connecting a data cable between the heat dissipation device and the device to be cooled. The wireless connection methods can be a wireless network (WiFi), Bluetooth, Near Field Communication (NFC), etc. Of course, the above examples of wired and wireless connection methods are exemplary, and the present disclosure does not limit this.

[0136] In one implementation, the data obtained by the heat dissipation device can be data detected by the heat dissipation device through components such as sensors, or data received by the heat dissipation device from the device to be cooled. Therefore, before determining the heat dissipation mode of the heat dissipation device based on the obtained data, the present disclosure provides a method for obtaining data, including: receiving data sent by the device to be cooled.

[0137] In one implementation, the heat dissipation device can receive data sent by the device to be cooled based on a wired or wireless connection method. For specific implementation manners, refer to the above embodiments, and the present disclosure will not elaborate here.

[0138] In one implementation, different heat dissipation modes and / or parameters of the heat dissipation mode are determined according to different instructions. This ensures the efficient operation of the heat dissipation device, achieving the purpose of cooling the device to be cooled in different ways under different heat dissipation modes, with stronger pertinence, higher heat dissipation efficiency, and better meeting the different cooling requirements of the user for the device to be cooled.

[0139] Figure 6 It is a flowchart showing a method for determining the maximum heat dissipation amount according to an exemplary embodiment. As Figure 6 shown, the specific steps are as follows:

[0140] In step S61, a first instruction is received.

[0141] In one implementation, the user's demand for controlling the temperature of the electronic device is received, such as ensuring that the heat dissipation device can reach the maximum heat dissipation amount in the current environment.

[0142] Among them, the first instruction can be understood as an instruction for controlling the heat dissipation amount of the heat dissipation device by adjusting the voltage and tracking the heat dissipation amount.

[0143] In step S62, the minimum operating voltage of the TEC and the maximum rotational speed of the fan.

[0144] In one implementation, during the process of controlling the TEC to be at the lowest operating voltage at which it can operate normally and the fan inside the TEC to be at the maximum rotational speed.

[0145] Among them, the TEC can be understood as a device for cooling electronic devices.

[0146] In step S63, gradually increase the TEC voltage.

[0147] In one implementation, based on the lowest operating voltage of the TEC, gradually increase the TEC voltage.

[0148] In step S64, is the maximum input power reached?

[0149] In one implementation, during the process of gradually increasing the TEC operating voltage, determine whether the maximum input power of the TEC adapter is reached.

[0150] Since different adapters are required for the TEC in different operating environments, when adjusting the TEC operating voltage, determine whether the maximum input power required by the current TEC adapter is reached, that is, whether the rated power of the TEC adapter is reached.

[0151] In step S65, reach the built-in maximum power voltage at 25 degrees.

[0152] In one implementation, during the process of gradually increasing the TEC operating voltage, if the maximum input power of the TEC adapter is not reached, then determine whether the current TEC temperature protection point, such as 25 degrees, is reached, and whether the power voltage at the temperature protection point, that is, the built-in maximum power voltage, is reached.

[0153] In step S66, is the system stable?

[0154] In one implementation, determine whether the system is in a stable state based on reaching the maximum input power of the adapter and / or reaching the maximum power voltage of the TEC.

[0155] Since when reaching the maximum input power of the adapter and / or reaching the maximum power voltage of the TEC, at this time, the current is in a stable state and / or the difference between the temperature of the first side and the second side of the heat dissipation device is in a stable state, it is determined that the system is in a stable state, otherwise, the system is not stable.

[0156] When the system is not currently in a stable state, continuously loop until the system is stable.

[0157] In step S67, calculate Qc at this time.

[0158] In one implementation, since when the system is stable, the current is in a stable state and / or the temperature difference between the temperature of the first side and the second side of the heat dissipation device is in a stable state, then confirm the current heat dissipation amount according to the corresponding working current heat dissipation amount table at different temperature differences.

[0159] Among them, Qc can be understood as the current heat dissipation obtained, such as the current heat dissipation confirmed by querying the heat dissipation table of the working current corresponding to different temperature differences, or the calculated heat dissipation.

[0160] In step S68, can the power be increased?

[0161] In one implementation, it is determined whether the current state allows the power to be increased.

[0162] Since there is still a phenomenon that the power can be adjusted when the system is in a stable state. For example, the reason for the system stability is that the maximum input power of the adapter has not been reached, but the power of the heat dissipation device itself is in an adjustable state; or the reason for the system stability is that the built-in maximum power voltage of the heat dissipation device at the temperature protection node has been reached, but the input power of the adapter is in an adjustable state, etc., which are states where the power can be increased.

[0163] In step S69, increase the power.

[0164] In one implementation, when it is determined that the current power is in a state where it can be increased, then increase the power. For example, increase the power by controlling the voltage.

[0165] In step S610, wait for the system to stabilize.

[0166] In one implementation, it is determined whether the current system is in a stable state. The determination conditions for determining whether the current system is in a stable state are the same as those in step S66 and will not be elaborated here.

[0167] In step S611, calculate Qc.

[0168] In one implementation, on the premise that the current system is in a stable state, calculate the current heat dissipation.

[0169] Among them, at this time, Qc is calculated according to the current and / or the difference between the temperature of the first side and the temperature of the second side when the current system is stable.

[0170] In step S612, Qc increases.

[0171] In one implementation, if the currently calculated Qc is larger than the Qc obtained in the previous adjacent calculation, if Qc increases, then increase the power.

[0172] In one implementation, if the currently obtained Qc increases, it indicates that the power of the heat dissipation device is still in a state where it can be increased. Then, at this time, by increasing the power, Qc is further increased.

[0173] In step S613, reduce the power.

[0174] In one embodiment, if the currently calculated Qc does not increase compared to the Qc obtained in the previous instance, the power is reduced. For example, the voltage is adjusted downward.

[0175] In one embodiment, if the currently obtained Qc does not increase, it indicates that increasing the input power of the heat dissipation device does not increase the heat dissipation of the heat dissipation device, or it indicates that the purpose of increasing the heat dissipation cannot be achieved by increasing the power. Then, the power is reduced at this time.

[0176] In step S614, wait for the system to stabilize.

[0177] In one embodiment, it is determined whether the current system is in a stable state. The determination conditions and steps for determining whether the current system is in a stable state are the same as those in step S66, and will not be elaborated here.

[0178] In step S615, Qc is calculated.

[0179] In one embodiment, on the premise that the current system is in a stable state, the current heat dissipation is calculated.

[0180] Among them, at this time, Qc is calculated based on the current and / or the difference between the first surface temperature and the second surface temperature when the current system is stable.

[0181] In step S616, Qc increases.

[0182] In one embodiment, if the currently calculated Qc increases compared to the Qc obtained in the previous instance, the power is reduced if Qc increases.

[0183] In one embodiment, when the heat dissipation of the heat dissipation device does not increase after increasing the power, the increased power is reduced. At this time, the calculated heat dissipation increases, which indicates that the purpose of increasing the heat dissipation can be achieved by reducing the power.

[0184] In step S617, adjust back to the previous power.

[0185] In one embodiment, when the currently calculated Qc does not increase, the power is adjusted to the power of the previous instance.

[0186] Among them, adjusting back to the previous power can be understood as adjusting to the input power of the heat dissipation device adjacent to that before reducing the power.

[0187] In step S618, wait for a period of time.

[0188] In one embodiment, on the premise of adjusting the current power to the power of the previous instance, wait for a period of time to ensure that the system is in a stable state.

[0189] In one implementation, during the process of continuously adjusting the power, it is determined that the current is in a stable state, and the temperature difference between the first surface temperature and the second surface temperature is in a stable state. Then, it is judged whether the system is in a stable state. On the premise that the system is in a stable state, the heat dissipation amount is tracked, and according to the heat dissipation amount table, the current heat dissipation amount is determined until the heat dissipation amounts obtained multiple times reach the state of the maximum heat dissipation amount, so that the electronic device is in a low-temperature environment.

[0190] In the embodiments of the present disclosure, according to the instruction received by the heat dissipation device to control the temperature difference target by adjusting the second surface temperature, the temperature is adjusted.

[0191] Figure 7 It is a flowchart of controlling the temperature difference shown according to an exemplary embodiment. As Figure 7 shown, the specific steps are as follows:

[0192] In one implementation, a range value of the first surface temperature and a maximum temperature difference are set.

[0193] The current first surface temperature is detected, and adjustment starts according to the detected current first surface temperature. When it is detected that the first surface temperature is lower than the lower limit value of the set first surface temperature range value, the temperature difference target is adjusted downward.

[0194] In one implementation, if the first surface temperature is lower than the lower limit of the set first surface temperature range, then the second surface temperature is reduced. By reducing the second surface temperature, the purpose of lowering the target temperature difference is achieved, ensuring that the fan runs at a low speed, thereby reducing the noise generated by the fan and improving the user experience.

[0195] In one implementation, when it is detected that the first surface temperature exceeds the upper limit value of the set first surface temperature range value, it is judged whether the temperature difference between the current first surface temperature and the second surface temperature reaches the maximum value of the temperature difference. If it does not reach the maximum value of the temperature difference, the temperature difference target is adjusted upward. If it reaches the maximum value of the temperature difference, the maximum value of the temperature difference is maintained.

[0196] In one implementation, when it is detected that the first surface temperature exceeds the temperature upper limit value and does not reach the maximum temperature difference, according to the adjusted target temperature difference, the first surface temperature and the second surface temperature are further brought within a certain range to ensure that the heat dissipation device is in a high-efficiency operating state.

[0197] In one implementation, when it is detected that the first surface temperature exceeds the temperature upper limit value and reaches the maximum temperature difference, the maximum value of the temperature difference is maintained to ensure that the temperature difference of the heat dissipation device is in a stable state, and further ensure that the heat dissipation device is in a high-efficiency operating state.

[0198] In one implementation, the target temperature difference is continuously adjusted according to the detected temperature of the first surface, so as to ensure that the temperature difference between the first surface temperature and the second surface temperature is in a stable state, ensure that the heat dissipation device can work at high efficiency, reduce the noise generated due to the high rotation speed of the fan, and improve the user experience.

[0199] Based on the same concept, the present disclosure provides a device heat dissipation method, including: sending instructions, data information, and / or temperature information to a heat dissipation device, where the instructions, data information, and / or temperature information are used for the heat dissipation device to determine a heat dissipation mode; wherein, the heat dissipation mode at least includes a first heat dissipation mode or a second heat dissipation mode; in the first heat dissipation mode, the heat dissipation device is dynamically adjusted to dissipate heat from the device to be cooled; in the second heat dissipation mode, the target temperature difference between the first surface and the second surface of the heat dissipation device is dynamically adjusted to dissipate heat from the device to be cooled, the first surface is used to absorb heat, and the second surface is used to release heat.

[0200] In one implementation, the heat dissipation device can send instructions to the device to be cooled. For example, the instructions can be determined based on at least one of the following: determining the instructions based on the data information of the device to be cooled, or determining the instructions based on the operation information of the user on the device to be cooled, or determining the instructions based on the temperature information of the device to be cooled.

[0201] In one implementation, determining the instructions based on the data information of the device to be cooled includes at least one of the following: in response to the load data being greater than a third threshold, determining a first instruction, where the first instruction is used to indicate that the heat dissipation mode of the heat dissipation device is the first heat dissipation mode; in response to the load data being less than the third threshold, determining a second instruction, where the second instruction is used to indicate that the heat dissipation mode of the heat dissipation device is the second heat dissipation mode; in response to the process data being the process data of a first type of application program, determining a first instruction, where the first instruction is used to indicate that the heat dissipation mode of the heat dissipation device is the first heat dissipation mode; in response to the process data being the process data of a second type of application program, determining a second instruction, where the second instruction is used to indicate that the heat dissipation mode of the heat dissipation device is the second heat dissipation mode; determining, from a preset table, an instruction corresponding to the type of the device to be cooled, where the instruction is used to indicate the heat dissipation mode of the device to be cooled. For specific implementation manners, reference can be made to the manner in which the heat dissipation device determines the heat dissipation mode based on data in the above embodiments. For example, the heat dissipation device determines the first heat dissipation mode in response to the load data of the processor being greater than the third threshold, and the device to be cooled can determine a first instruction in response to the load data of the processor being greater than the third threshold, where the first instruction is used to indicate that the heat dissipation mode is the first heat dissipation mode. The present disclosure will not elaborate here.

[0202] In one implementation, determining an instruction based on the user's manipulation information includes: in response to receiving first operation information on the device to be cooled, determining a first instruction for instructing the cooling device to operate in a first cooling mode, where the first operation information is used to indicate the generation of the first instruction; or, in response to receiving second operation information on the device to be cooled, determining a second instruction for instructing the cooling device to operate in a second cooling mode, where the second operation information is used to indicate the generation of the second instruction. For example, there is an application program corresponding to the cooling device in the device to be cooled, and the user can select a cooling mode in the application program. The user can generate operation information through various operation methods such as touch clicks and air gestures, enabling the device to be cooled to determine an instruction based on the user's operation information. Alternatively, the user can control the device to be cooled by voice to determine an instruction. For example, when the user selects the first cooling mode, a first instruction can be generated to indicate the first cooling mode. When the user selects the second cooling mode, a second instruction can be generated to indicate the second cooling mode.

[0203] In one implementation, the temperature information includes at least one of the following: the temperature of the device to be cooled; the temperature change trend of the device to be cooled; determining an instruction based on the temperature information of the device to be cooled includes: in response to the temperature of the device to be cooled being higher than a fourth threshold, determining a first instruction for instructing the cooling device to operate in a first cooling mode; in response to the temperature of the device to be cooled being lower than the fourth threshold, determining a second instruction for instructing the cooling device to operate in a first cooling mode; in response to the temperature of the device to be cooled showing an increasing trend, determining a first instruction for instructing the cooling device to operate in a first cooling mode; in response to the temperature of the device to be cooled showing a decreasing trend, determining a second instruction for instructing the cooling device to operate in a second cooling mode. For specific implementation manners, reference may be made to the above embodiments.

[0204] Based on the same concept, an embodiment of the present disclosure also provides a device cooling apparatus.

[0205] It can be understood that, in order to implement the above functions, the device cooling apparatus provided in the embodiments of the present disclosure includes corresponding hardware structures and / or software modules for executing each function. Combining the units and algorithm steps of the examples disclosed in the embodiments of the present disclosure, the embodiments of the present disclosure can be implemented in the form of hardware or a combination of hardware and computer software. Whether a certain function is executed in the form of hardware or computer software driving the hardware depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of the technical solutions of the embodiments of the present disclosure.

[0206] Figure 8It is a block diagram of a device heat dissipation device 100 shown according to an exemplary embodiment. Refer to Figure 8 , the device 100 includes an execution unit 101 and an acquisition unit 102.

[0207] The execution unit 101 is configured to determine a heat dissipation mode of the heat dissipation device in response to determining that the heat dissipation device needs to dissipate heat from the device to be cooled. Based on the determined heat dissipation mode, dissipate heat from the device to be cooled. Wherein, the heat dissipation mode includes at least a first heat dissipation mode or a second heat dissipation mode. In the first heat dissipation mode, the heat dissipation device is dissipated by dynamically adjusting the working voltage of the heat dissipation device. In the second heat dissipation mode, the heat dissipation device is dissipated by dynamically adjusting the target temperature difference between the first surface and the second surface of the heat dissipation device, the first surface is used to absorb heat, and the second surface is used to release heat.

[0208] In one implementation, in the first heat dissipation mode, the execution unit 101 dissipates heat from the device to be cooled by dynamically adjusting the working voltage of the heat dissipation device in the following manner: Dynamically adjust the working voltage of the heat dissipation device so that the heat dissipation amount of the heat dissipation device reaches the maximum heat dissipation amount in the current working state. Based on the maximum heat dissipation amount, dissipate heat from the heat dissipation device.

[0209] In one implementation, the execution unit 101 dynamically adjusts the working voltage of the heat dissipation device in the following manner so that the heat dissipation amount of the heat dissipation device reaches the maximum heat dissipation amount in the current working state: Control the heat dissipation device to start under preset working conditions and perform initial heat dissipation. The preset working conditions are to start with the lowest working voltage that satisfies the normal operation of the heat dissipation device and the fixed fan speed of the heat dissipation device. Gradually increase the working voltage of the heat dissipation device, and continuously detect the input power and working state of the heat dissipation device. Based on the input power and the working state, adjust the heat dissipation amount of the heat dissipation device so that the heat dissipation amount of the heat dissipation device reaches the maximum heat dissipation amount in the current working state.

[0210] In one implementation, the execution unit 101 adjusts the heat dissipation amount of the heat dissipation device based on the input power and the working state in the following manner: Continuously increase the working voltage of the heat dissipation device so that the heat dissipation amount of the heat dissipation device reaches the maximum heat dissipation amount in the current working state. Or, continuously decrease the working voltage of the heat dissipation device so that the heat dissipation amount of the heat dissipation device reaches the maximum heat dissipation amount in the current working state.

[0211] In one implementation, the execution unit 101 continuously increases the working voltage of the heat dissipation device in the following manner to make the heat dissipation amount of the heat dissipation device reach the maximum heat dissipation amount in the current working state: In response to detecting that the input power reaches the rated input power, and / or the working voltage reaches the rated voltage, and the working state of the heat dissipation device meets the conditions, determine the first heat dissipation amount of the heat dissipation device. Increase the input power of the heat dissipation device, and when the working state of the heat dissipation device meets the conditions, re-determine the second heat dissipation amount of the heat dissipation device. In response to the second heat dissipation amount being greater than the first heat dissipation amount, continue to increase the input power of the heat dissipation device and re-determine the second heat dissipation amount of the heat dissipation device, and repeat the above process until the second heat dissipation amount is less than the first heat dissipation amount. The execution unit 101 continuously decreases the working voltage of the heat dissipation device in the following manner to make the heat dissipation amount of the heat dissipation device reach the maximum heat dissipation amount in the current working state, including: In response to the second heat dissipation amount being less than the first heat dissipation amount, reduce the input power of the heat dissipation device, and when the working state of the heat dissipation device meets the conditions, re-determine the third heat dissipation amount of the heat dissipation device, adjust the input power of the heat dissipation device based on the third heat dissipation amount, and determine the heat dissipation amount based on the adjusted input power.

[0212] In one implementation, the execution unit 101 is further configured to: If the third heat dissipation amount is greater than the second heat dissipation amount, continue to reduce the input power of the heat dissipation device and re-determine the third heat dissipation amount of the heat dissipation device, and repeat the above process until the third heat dissipation amount is less than the second heat dissipation amount. If the third heat dissipation amount is less than the second heat dissipation amount, adjust the input power of the heat dissipation device to the input power before the most recent adjustment, and after waiting for a set duration, re-execute the step of increasing the input power of the heat dissipation device.

[0213] In one implementation, the execution unit 101 adjusts the heat dissipation amount of the heat dissipation device based on the input power and the working state in the following manner: In response to the input power of the heat dissipation device not reaching the rated input power and the working voltage not reaching the rated voltage, continue to increase the input voltage.

[0214] In one implementation, the execution unit 101 performs heat dissipation control based on the temperature difference between the first surface temperature and the second surface temperature of the heat dissipation device in the following manner: In response to the first surface temperature being greater than the first threshold and the temperature difference between the first surface temperature and the second surface temperature reaching the temperature difference threshold, maintain the temperature difference between the first surface temperature and the second surface temperature of the heat dissipation device at the temperature difference threshold.

[0215] In one implementation, the execution unit 101 performs heat dissipation control based on the temperature difference between the first surface temperature and the second surface temperature of the heat dissipation device in the following manner: In response to the first surface temperature being greater than the first threshold and the temperature difference between the first surface temperature and the second surface temperature being less than the temperature difference threshold, increase the target temperature difference.

[0216] In one implementation, the execution unit 101 controls heat dissipation based on the temperature difference between the first surface temperature and the second surface temperature of the heat dissipation device in the following manner: in response to the first surface temperature being lower than the second threshold, the target temperature difference is reduced.

[0217] In one implementation, the execution unit 101 determines the heat dissipation mode of the heat dissipation device by using at least one of the following methods: determining the heat dissipation mode of the heat dissipation device based on an instruction sent by the device to be cooled, where the instruction is determined based on the data information of the device to be cooled, or based on the operation information of the user on the device to be cooled, or based on the temperature information of the device to be cooled; determining the heat dissipation mode of the heat dissipation device based on the data information obtained from the device to be cooled; determining the heat dissipation mode of the heat dissipation device based on the operation information of the user on the device to be cooled; determining the heat dissipation mode of the heat dissipation device based on the temperature information of the device to be cooled detected by the heat dissipation device or based on the temperature information sent by the device to be cooled.

[0218] In one implementation, the data information includes at least one of the following: the load data of the processor of the device to be cooled; the process data of the device to be cooled; the type of the device to be cooled. The execution unit 101 determines the heat dissipation mode of the heat dissipation device by using at least one of the following methods: in response to the load data being greater than the third threshold, determining the heat dissipation mode of the heat dissipation device as the first heat dissipation mode; in response to the load data being less than the third threshold, determining the heat dissipation mode of the heat dissipation device as the second heat dissipation mode; in response to the process data being the process data of the first type of application program, determining the heat dissipation mode of the heat dissipation device as the first heat dissipation mode; in response to the process data being the process data of the second type of application program, determining the heat dissipation mode of the heat dissipation device as the second heat dissipation mode; determining the heat dissipation mode corresponding to the type of the device to be cooled from a preset table.

[0219] In one implementation, the temperature information includes at least one of the following: the temperature of the device to be cooled; the temperature change trend of the device to be cooled. The execution unit 101 determines the heat dissipation mode of the heat dissipation device by using at least one of the following methods: in response to the temperature of the device to be cooled being higher than the fourth threshold, determining the heat dissipation mode of the heat dissipation device as the first heat dissipation mode; in response to the temperature of the device to be cooled being lower than the fourth threshold, determining the heat dissipation mode of the heat dissipation device as the second heat dissipation mode; in response to the temperature of the device to be cooled showing an increasing trend, determining the heat dissipation mode of the heat dissipation device as the first heat dissipation mode; in response to the temperature of the device to be cooled showing a decreasing trend, determining the heat dissipation mode of the heat dissipation device as the second heat dissipation mode.

[0220] In one implementation, the acquisition unit 102 is used to acquire at least one of the following: the data information sent by the device to be cooled, the temperature information sent by the device to be cooled, the instruction sent by the device to be cooled.

[0221] Figure 9It is a block diagram of a device heat dissipation device 200 shown according to an exemplary embodiment. Refer to Figure 9 The device 200 includes: a sending unit 201, configured to send instructions, send instructions, data information, and / or temperature information to the heat dissipation device, where the instructions, data information, and / or temperature information are used for the heat dissipation device to determine a heat dissipation mode; wherein, the heat dissipation mode includes at least a first heat dissipation mode or a second heat dissipation mode; in the first heat dissipation mode, the heat dissipation device is cooled by dynamically adjusting the operating voltage of the heat dissipation device; in the second heat dissipation mode, the heat dissipation device is cooled by dynamically adjusting the target temperature difference between the first surface and the second surface of the heat dissipation device, the first surface is used to absorb heat, and the second surface is used to release heat.

[0222] In an implementation manner, the device includes: an execution unit 202, and the execution unit 202 is configured to determine an instruction in the following manner: determine an instruction based on the data information of the device to be cooled, or determine an instruction based on the operation information of the user on the device to be cooled, or determine an instruction based on the temperature information of the device to be cooled.

[0223] In an implementation manner, the data information includes at least one of the following: the load data of the processor of the device to be cooled; the process data of the device to be cooled; the type of the device to be cooled; the execution unit 202 is configured to determine an instruction based on the data information of the device to be cooled in the following manner: in response to the load data being greater than a third threshold, determine a first instruction, where the first instruction is used to indicate that the heat dissipation mode of the heat dissipation device is the first heat dissipation mode; in response to the load data being less than the third threshold, determine a second instruction, where the second instruction is used to indicate that the heat dissipation mode of the heat dissipation device is the second heat dissipation mode; in response to the process data being the process data of the first type of application program, determine a first instruction, where the first instruction is used to indicate that the heat dissipation mode of the heat dissipation device is the first heat dissipation mode; in response to the process data being the process data of the second type of application program, determine a second instruction, where the second instruction is used to indicate that the heat dissipation mode of the heat dissipation device is the second heat dissipation mode; determine, from a preset table, an instruction corresponding to the type of the device to be cooled, where the instruction is used to indicate the heat dissipation mode of the device to be cooled.

[0224] In an implementation manner, the execution unit 202 is configured to determine an instruction based on the operation information of the user on the device to be cooled in the following manner, including: in response to receiving first operation information on the device to be cooled, determine a first instruction, where the first instruction is used to indicate that the heat dissipation mode of the heat dissipation device is the first heat dissipation mode, and the first operation information is used to indicate the generation of the first instruction; or, in response to receiving second operation information on the device to be cooled, determine a second instruction, where the second instruction is used to indicate that the heat dissipation mode of the heat dissipation device is the second heat dissipation mode, and the second operation information is used to indicate the generation of the second instruction.

[0225] In one implementation, the temperature information includes at least one of the following: the temperature of the device to be cooled; the temperature change trend of the device to be cooled. The execution unit 202 is configured to determine an instruction based on the temperature information of the device to be cooled in the following manner: in response to the temperature of the device to be cooled being higher than a fourth threshold, determining a first instruction, where the first instruction is used to indicate that the cooling mode of the cooling device is a first cooling mode; in response to the temperature of the device to be cooled being lower than the fourth threshold, determining a second instruction, where the second instruction is used to indicate that the cooling mode of the cooling device is the first cooling mode; in response to the temperature of the device to be cooled showing an increasing trend, determining a first instruction, where the first instruction is used to indicate that the cooling mode of the cooling device is the first cooling mode; in response to the temperature of the device to be cooled showing a decreasing trend, determining a second instruction, where the second instruction is used to indicate that the cooling mode of the cooling device is a second cooling mode.

[0226] Regarding the device in the above embodiments, the specific manners in which each module performs operations have been described in detail in the embodiments related to the method, and will not be elaborated here.

[0227] Figure 10 FIG. is a block diagram of a device cooling apparatus 300 shown according to an exemplary embodiment. For example, the apparatus 300 may be a mobile phone, a computer, a digital broadcast terminal, a messaging device, a game console, a tablet device, a medical device, a fitness device, a personal digital assistant, etc.

[0228] Referring to Figure 10 , the apparatus 300 may include one or more of the following components: a processing component 302, a memory 304, a power component 306, a multimedia component 308, an audio component 310, an input / output (I / O) interface 312, a sensor component 314, and a communication component 316.

[0229] The processing component 302 generally controls the overall operation of the apparatus 300, such as operations associated with display, telephone calls, data communication, camera operations, and recording operations. The processing component 302 may include one or more processors 320 to execute instructions to complete all or part of the steps of the above method. In addition, the processing component 302 may include one or more modules to facilitate the interaction between the processing component 302 and other components. For example, the processing component 302 may include a multimedia module to facilitate the interaction between the multimedia component 308 and the processing component 302.

[0230] The memory 304 is configured to store various types of data to support the operation of the device 300. Examples of such data include instructions for any application or method operating on the device 300, contact data, phone book data, messages, pictures, videos, and the like. The memory 304 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, a magnetic disk, or an optical disk.

[0231] The power component 306 provides power to the various components of the device 300. The power component 306 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power for the device 300.

[0232] The multimedia component 308 includes a screen that provides an output interface between the device 300 and the user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen can be implemented as a touch screen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touches, swipes, and gestures on the touch panel. The touch sensors can not only sense the boundaries of the touch or swipe actions but also detect the duration and pressure associated with the touch or swipe operation. In some embodiments, the multimedia component 308 includes a front camera and / or a rear camera. When the device 300 is in an operating mode, such as a shooting mode or a video mode, the front camera and / or the rear camera can receive external multimedia data. Each of the front camera and the rear camera can be a fixed optical lens system or have focal length and optical zoom capabilities.

[0233] The audio component 310 is configured to output and / or input audio signals. For example, the audio component 310 includes a microphone (MIC) that is configured to receive external audio signals when the device 300 is in an operating mode, such as a call mode, a recording mode, and a voice recognition mode. The received audio signals can be further stored in the memory 304 or transmitted via the communication component 316. In some embodiments, the audio component 310 further includes a speaker for outputting audio signals.

[0234] The I / O interface 312 provides an interface between the processing component 302 and a peripheral interface module, which can be a keyboard, a click wheel, buttons, etc. These buttons can include, but are not limited to: a home button, a volume button, a power button, and a lock button.

[0235] The sensor assembly 314 includes one or more sensors for providing a status assessment of various aspects of the device 300. For example, the sensor assembly 314 can detect the on / off state of the device 300, the relative positioning of components, such as the display and keypad of the device 300. The sensor assembly 314 can also detect a change in the position of the device 300 or a component of the device 300, the presence or absence of user contact with the device 300, the orientation or acceleration / deceleration of the device 300, and the temperature change of the device 300. The sensor assembly 314 can include a proximity sensor configured to detect the presence of nearby objects without any physical contact. The sensor assembly 314 can also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, the sensor assembly 314 can also include an acceleration sensor, a gyroscope sensor, a magnetic sensor, a pressure sensor, or a temperature sensor.

[0236] The communication component 316 is configured to facilitate communication between the device 300 and other devices in a wired or wireless manner. The device 300 can access a wireless network based on communication standards, such as WiFi, 2G, or 3G, or a combination thereof. In an exemplary embodiment, the communication component 316 receives a broadcast signal or broadcast-related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, the communication component 316 further includes a near field communication (NFC) module to facilitate short-range communication. For example, the NFC module can be implemented based on radio frequency identification (RFID) technology, infrared data association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.

[0237] In an exemplary embodiment, the device 300 can be implemented by one or more application specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components for performing the above method.

[0238] In an exemplary embodiment, a non-transitory computer-readable storage medium including instructions is also provided, such as a memory 304 including instructions, and the above instructions can be executed by a processor 320 of the device 300 to complete the above method. For example, the non-transitory computer-readable storage medium can be a ROM, a random access memory (RAM), a CD-ROM, a magnetic tape, a floppy disk, and an optical data storage device, etc.

[0239] Figure 11 is a block diagram of a device heat dissipation device 1100 shown according to an exemplary embodiment. For example, the device 1100 can be provided as a server. Refer to Figure 10, the apparatus 1100 includes a processing component 1122, which further includes one or more processors, and memory resources represented by a memory 1132 for storing instructions executable by the processing component 1122, such as application programs. The application programs stored in the memory 1132 may include one or more modules each corresponding to a set of instructions. In addition, the processing component 1122 is configured to execute instructions to perform the above-described device heat dissipation method.

[0240] The apparatus 1100 may further include a power component 1126 configured to perform power management of the apparatus 1100, a wired or wireless network interface 1150 configured to connect the apparatus 1100 to a network, and an input / output (I / O) interface 1152. The apparatus 1100 may operate based on an operating system stored in the memory 1132, such as Windows ServerTM, MacOS XTM, UnixTM, LinuxTM, FreeBSDTM or the like.

[0241] It can be understood that the term "a plurality of" in the present disclosure means two or more, and other quantifiers are similar thereto. "And / or" describes the association relationship of associated objects and indicates that three relationships may exist. For example, A and / or B may represent: A exists alone, A and B exist simultaneously, and B exists alone. The character " / " generally represents an "or" relationship between the associated objects before and after. The singular forms of "a", "the" and "said" are also intended to include the plural forms unless the context clearly indicates otherwise.

[0242] It can be further understood that the terms "first", "second", etc. are used to describe various information, but this information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other and do not represent a specific order or importance. In fact, the expressions such as "first" and "second" can be used interchangeably. For example, without departing from the scope of the present disclosure, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information.

[0243] It can be further understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "lateral", "front", "rear", "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present embodiment and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation.

[0244] It can be further understood that, unless otherwise specified, "connection" includes both direct connection without other components between the two and indirect connection with other elements between the two.

[0245] It can be further understood that although the operations are described in a specific order in the drawings in the embodiments of the present disclosure, it should not be construed as requiring these operations to be performed in the specific order or serial order shown, or requiring all the operations shown to obtain the desired result. In certain environments, multitasking and parallel processing may be advantageous.

[0246] Those skilled in the art will readily conceive of other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include known common knowledge or conventional technical means in the technical field not disclosed in the present disclosure.

[0247] It should be understood that the present disclosure is not limited to the exact structures described above and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of the present disclosure is only limited by the appended claims.

Claims

1. A method for device heat dissipation, characterized in that, the method includes: responding to determining that a heat dissipation device needs to dissipate heat from a device to be cooled, determining the heat dissipation mode of the heat dissipation device; based on the determined heat dissipation mode, dissipating heat from the device to be cooled; wherein the heat dissipation mode at least includes a first heat dissipation mode or a second heat dissipation mode; in the first heat dissipation mode, dissipating heat from the device to be cooled by dynamically adjusting the working voltage of the heat dissipation device; in the second heat dissipation mode, dissipating heat from the device to be cooled by dynamically adjusting the target temperature difference between the first surface and the second surface of the heat dissipation device, the first surface being used to absorb heat and the second surface being used to release heat.

2. The method according to claim 1, characterized in that, the dissipating heat from the device to be cooled by dynamically adjusting the working voltage of the heat dissipation device in the first heat dissipation mode includes: dynamically adjusting the working voltage of the heat dissipation device to make the heat dissipation amount of the heat dissipation device reach the maximum heat dissipation amount in the current working state; based on the maximum heat dissipation amount, dissipating heat from the heat dissipation device.

3. The method according to claim 2, characterized in that, the dynamically adjusting the working voltage of the heat dissipation device to make the heat dissipation amount of the heat dissipation device reach the maximum heat dissipation amount in the current working state includes: controlling the heat dissipation device to start under preset working conditions and perform initial heat dissipation, the preset working conditions being starting with the lowest working voltage that satisfies the normal operation of the heat dissipation device and the fixed fan speed of the heat dissipation device; gradually increasing the working voltage of the heat dissipation device and real-time detecting the input power and working state of the heat dissipation device; based on the input power and the working state, adjusting the heat dissipation amount of the heat dissipation device to make the heat dissipation amount of the heat dissipation device reach the maximum heat dissipation amount in the current working state.

4. The method according to claim 3, characterized in that, the adjusting the heat dissipation amount of the heat dissipation device based on the input power and the working state includes: responding to detecting that the input voltage reaches the rated input power, and / or, the working voltage reaches the rated voltage, and the working state of the heat dissipation device meets the conditions, continuously increasing the input power of the heat dissipation device to make the heat dissipation amount of the heat dissipation device reach the maximum heat dissipation amount in the current working state.

5. The method according to claim 4, characterized in that, the continuously increasing the working voltage of the heat dissipation device to make the heat dissipation amount of the heat dissipation device reach the maximum heat dissipation amount in the current working state includes: determining the first heat dissipation amount of the heat dissipation device; increasing the input power of the heat dissipation device and, when the working state of the heat dissipation device meets the conditions, re-determining the second heat dissipation amount of the heat dissipation device; responding to the second heat dissipation amount being greater than the first heat dissipation amount, continuously increasing the input power of the heat dissipation device and re-determining the second heat dissipation amount of the heat dissipation device, repeating the above process until the second heat dissipation amount is less than the first heat dissipation amount.

6. The method according to claim 5, characterized in that, the method further includes: In response to the second heat dissipation amount being less than the first heat dissipation amount, continuously reduce the input power of the heat dissipation device so that the heat dissipation amount of the heat dissipation device reaches the maximum heat dissipation amount in the current working state.

7. The method according to claim 6, wherein, the continuously reducing the input power of the heat dissipation device so that the heat dissipation amount of the heat dissipation device reaches the maximum heat dissipation amount in the current working state includes: reducing the input power of the heat dissipation device, and after the working state of the heat dissipation device meets the conditions, re-determining the third heat dissipation amount of the heat dissipation device; in response to the third heat dissipation amount being greater than the second heat dissipation amount, continuously reducing the input power of the heat dissipation device and re-determining the third heat dissipation amount of the heat dissipation device, and repeating the above process until the third heat dissipation amount is less than the second heat dissipation amount; in response to the third heat dissipation amount being less than the second heat dissipation amount, adjusting the input power of the heat dissipation device to the input power before the most recent adjustment, and after waiting for a set time period, re-executing the step of increasing the input power of the heat dissipation device.

8. The method according to claim 4, wherein, the adjusting the heat dissipation amount of the heat dissipation device based on the input power and the working state includes: in response to the input power of the heat dissipation device not reaching the rated input power and the working voltage not reaching the rated voltage, continuously increasing the input voltage.

9. The method according to claim 1, wherein, the dissipating heat from the device to be cooled by dynamically adjusting the target temperature difference between the first surface and the second surface of the heat dissipation device in the second heat dissipation mode includes: in response to the temperature of the first surface being greater than the first threshold and the temperature difference between the temperature of the first surface and the temperature of the second surface reaching the temperature difference threshold, maintaining the temperature difference between the first surface and the second surface of the heat dissipation device at the temperature difference threshold.

10. The method according to claim 1, wherein, the dissipating heat from the device to be cooled by dynamically adjusting the target temperature difference between the first surface and the second surface of the heat dissipation device in the second heat dissipation mode includes: in response to the temperature of the first surface being greater than the first threshold and the temperature difference between the temperature of the first surface and the temperature of the second surface being less than the temperature difference threshold, increasing the target temperature difference.

11. The method according to claim 1, wherein, the dissipating heat from the device to be cooled by dynamically adjusting the target temperature difference between the first surface and the second surface of the heat dissipation device in the second heat dissipation mode includes: in response to the temperature of the first surface being lower than the second threshold, reducing the target temperature difference.

12. The method according to claim 1, wherein, adopting at least one of the following methods to determine the heat dissipation mode of the heat dissipation device, including: determining the heat dissipation mode of the heat dissipation device based on an instruction sent by the device to be cooled, where the instruction is determined based on the data information of the device to be cooled, or based on the operation information of the user on the device to be cooled, or based on the temperature information of the device to be cooled; determining the heat dissipation mode of the heat dissipation device based on the data information obtained from the device to be cooled sent; Determine the heat dissipation mode of the heat dissipation device based on the operation information of the device to be cooled by the user; Determine the heat dissipation mode of the heat dissipation device based on the temperature information of the device to be cooled detected by the heat dissipation device or based on the temperature information sent by the device to be cooled.

13. The method according to claim 12, wherein, The data information includes at least one of the following: The load data of the processor of the device to be cooled; The process data of the device to be cooled; The type of the device to be cooled; The determination of the heat dissipation mode of the heat dissipation device includes at least one of the following: In response to the load data being greater than a third threshold, determine that the heat dissipation mode of the heat dissipation device is the first heat dissipation mode; In response to the load data being less than a third threshold, determine that the heat dissipation mode of the heat dissipation device is the second heat dissipation mode; In response to the process data being the process data of the first type of application program, determine that the heat dissipation mode of the heat dissipation device is the first heat dissipation mode; In response to the process data being the process data of the second type of application program, determine that the heat dissipation mode of the heat dissipation device is the second heat dissipation mode; Determine the heat dissipation mode corresponding to the type of the device to be cooled from a preset table.

14. The method according to claim 12 or 13, wherein, The temperature information includes at least one of the following: The temperature of the device to be cooled; The temperature change trend of the device to be cooled; The determination of the heat dissipation mode of the heat dissipation device includes at least one of the following: In response to the temperature of the device to be cooled being higher than a fourth threshold, determine that the heat dissipation mode of the heat dissipation device is the first heat dissipation mode; In response to the temperature of the device to be cooled being lower than a fourth threshold, determine that the heat dissipation mode of the heat dissipation device is the second heat dissipation mode; In response to the temperature of the device to be cooled showing an increasing trend, determine that the heat dissipation mode of the heat dissipation device is the first heat dissipation mode; In response to the temperature of the device to be cooled showing a decreasing trend, determine that the heat dissipation mode of the heat dissipation device is the second heat dissipation mode.

15. A method for device heat dissipation, wherein, The method includes: Send instructions, data information, and / or temperature information to the heat dissipation device, and the instructions, data information, and / or temperature information are used for the heat dissipation device to determine the heat dissipation mode; wherein, the heat dissipation mode includes at least the first heat dissipation mode or the second heat dissipation mode; In the first heat dissipation mode, dissipate heat from the device to be cooled by dynamically adjusting the operating voltage of the heat dissipation device; In the second heat dissipation mode, dissipate heat from the device to be cooled by dynamically adjusting the target temperature difference between the first surface and the second surface of the heat dissipation device, where the first surface is used to absorb heat and the second surface is used to release heat.

16. The method according to claim 15, wherein, The instruction is determined in the following manner: Determine the instruction based on the data information of the device to be cooled, or determine the instruction based on the operation information of the user on the device to be cooled, or determine the instruction based on the temperature information of the device to be cooled.

17. The method according to claim 16, wherein, The data information includes at least one of the following: The load data of the processor of the device to be cooled; The process data of the device to be cooled; The type of the device to be cooled; The instruction determined based on the data information of the device to be cooled, including at least one of the following: In response to the load data being greater than a third threshold, determining a first instruction for instructing the cooling mode of the cooling device to be the first cooling mode; In response to the load data being less than a third threshold, determining a second instruction for instructing the cooling mode of the cooling device to be the second cooling mode; In response to the process data being the process data of a first type of application program, determining a first instruction for instructing the cooling mode of the cooling device to be the first cooling mode; In response to the process data being the process data of a second type of application program, determining a second instruction for instructing the cooling mode of the cooling device to be the second cooling mode; Determining, from a preset table, an instruction corresponding to the type of the device to be cooled, the instruction being used to instruct the cooling mode of the device to be cooled.

18. The method according to claim 16, characterized in that the instruction determined based on the operation information of the user on the device to be cooled includes: In response to receiving first operation information on the device to be cooled, determining a first instruction for instructing the cooling mode of the cooling device to be the first cooling mode, the first operation information being used to indicate generating the first instruction; or, In response to receiving second operation information on the device to be cooled, determining a second instruction for instructing the cooling mode of the cooling device to be the second cooling mode, the second operation information being used to indicate generating the second instruction.

19. The method according to claim 16, characterized in that the temperature information includes at least one of the following: The temperature of the device to be cooled; The temperature change trend of the device to be cooled; The instruction determined based on the temperature information of the device to be cooled includes: In response to the temperature of the device to be cooled being higher than a fourth threshold, determining a first instruction for instructing the cooling mode of the cooling device to be the first cooling mode; In response to the temperature of the device to be cooled being lower than a fourth threshold, determining a second instruction for instructing the cooling mode of the cooling device to be the first cooling mode; In response to the temperature of the device to be cooled showing an increasing trend, determining a first instruction for instructing the cooling mode of the cooling device to be the first cooling mode; In response to the temperature of the device to be cooled showing a decreasing trend, determining a second instruction for instructing the cooling mode of the cooling device to be the second cooling mode.

20. A device cooling apparatus, characterized in that it includes: An execution unit, configured to, in response to determining that the cooling device needs to cool the device to be cooled, determine the cooling mode of the cooling device; and based on the determined cooling mode, cool the device to be cooled. Among them, the heat dissipation mode at least includes a first heat dissipation mode or a second heat dissipation mode; in the first heat dissipation mode, the device to be heat dissipated is heat dissipated by dynamically adjusting the working voltage of the heat dissipation device; in the second heat dissipation mode, the device to be heat dissipated is heat dissipated by dynamically adjusting the target temperature difference between the first surface and the second surface of the heat dissipation device, where the first surface is used to absorb heat and the second surface is used to release heat.

21. An apparatus heat dissipation device Characterized in that Comprising: A sending unit, configured to send an instruction and / or data to the heat dissipation device in response to the need for heat dissipation of the device to be heat dissipated, where the instruction and / or data is used for the heat dissipation device to determine the heat dissipation mode; Among them, the heat dissipation mode at least includes a first heat dissipation mode or a second heat dissipation mode; In the first heat dissipation mode, the device to be heat dissipated is heat dissipated by dynamically adjusting the working voltage of the heat dissipation device; In the second heat dissipation mode, the device to be heat dissipated is heat dissipated by dynamically adjusting the target temperature difference between the first surface and the second surface of the heat dissipation device, where the first surface is used to absorb heat and the second surface is used to release heat.

22. An apparatus heat dissipation device Characterized in that Comprising: A processor; A memory for storing processor-executable instructions; Among them, the processor is configured to execute the apparatus heat dissipation method according to any one of claims 1-14 or 15-19.

23. A storage medium Characterized in that Instructions are stored in the storage medium, and when the instructions in the storage medium are executed by a processor of a terminal, the terminal is enabled to execute the method according to any one of claims 1-14 or 15-19.

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