Wedge-shaped manifold micro-channel radiator with micro pin fins
By setting up multiple rows of microneedle ribs on the microchannel layer substrate and designing wedge-shaped liquid inlet channels on the manifold substrate, the problems of uneven flow distribution and poor temperature uniformity of traditional microchannel radiators are solved, and more efficient heat dissipation effect and lower pressure drop are achieved.
Patent Information
- Application Number
- CN202510083285.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-20
- Publication Date
- 2025-05-30
AI Technical Summary
Traditional microchannel radiators have problems such as uneven flow distribution, poor temperature uniformity, high pressure drop and poor flow stability, which makes it difficult to improve the heat dissipation ability and efficiency.
A wedge-shaped manifold microchannel radiator with microneedle ribs is designed. By setting up multiple rows of microneedle ribs on the microchannel layer substrate and opening a manifold layer liquid inlet wedge channel on the manifold substrate, the microchannel layer forms a vertical liquid inlet, which has the function of a microjet, avoids flow dead zones, and improves flow distribution uniformity.
The advantages of uniform flow distribution, reduced pressure, small thermal resistance, and not easy to block the channels are achieved, and the heat dissipation efficiency and temperature uniformity are significantly improved.
Smart Images
Figure CN120076248A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of heat dissipation and cooling of electronic chips, and particularly to a wedge-shaped manifold microchannel radiator with micro pin fins. Background Art
[0002] With the development of electronic devices towards high power density and high performance, the heat generated during their operation has increased significantly, resulting in an increase in device temperature and affecting performance stability, service life, and safety. Effective cooling technology has become the key to the normal operation of electronic devices. Especially in high heat flux density scenarios such as data centers, 5G communication devices, aerospace, and electric vehicles, traditional natural cooling methods are difficult to meet the requirements, and there is an urgent need to develop efficient and reliable thermal management solutions to address the increasingly severe heat dissipation challenges.
[0003] Microchannel liquid-cooled radiators have a high surface area to volume ratio, enabling efficient heat transfer and remarkable heat exchange performance. In addition, compared with single-phase liquid cooling, flow boiling synergistically exchanges heat through the sensible heat and latent heat of the working fluid, further enhancing the heat transfer coefficient and demonstrating higher cooling efficiency. However, due to the long flow path, flow boiling in traditional microchannel radiators has drawbacks such as large temperature, high pressure drop, poor flow uniformity, and poor flow stability. This makes it difficult to further improve the heat dissipation capacity and efficiency of microchannel radiators, hindering their application. Summary of the Invention
[0004] Embodiments of this application provide a wedge-shaped manifold microchannel radiator with micro pin fins, which solves the technical problems of uneven flow distribution, poor temperature uniformity, high pressure drop, and poor flow stability in traditional microchannel radiators.
[0005] To achieve the above object, embodiments of this application provide a wedge-shaped manifold microchannel radiator with micro pin fins, including an inlet layer cover plate, an outlet layer cover plate, a manifold layer substrate, and a microchannel layer substrate arranged in sequence from top to bottom; an inlet layer liquid inlet channel is provided on the inlet layer cover plate; an outlet layer liquid inlet channel and an outlet layer liquid outlet channel are provided on the outlet layer cover plate; a manifold layer liquid inlet channel and a manifold layer liquid outlet channel are provided on the manifold layer substrate; multiple rows of micro pin fins are provided on the microchannel layer substrate; microchannels are formed between adjacent micro pin fins; the inlet layer liquid inlet channel, the outlet layer liquid inlet channel, the manifold layer liquid inlet channel, and the microchannels are connected in sequence from top to bottom, and the microchannels, the manifold layer liquid outlet channel, and the outlet layer liquid outlet channel are connected in sequence from bottom to top.
[0006] Further, the inlet layer liquid inlet channel includes a coolant inlet, an inlet liquid distribution tank, and an inlet layer liquid inlet tank that are connected in sequence; the coolant inlet is opened on the side surface of the inlet layer cover plate; the inlet liquid distribution tank and the inlet layer liquid inlet tank are opened on the lower surface of the inlet layer cover plate; the coolant inlet is a round hole; the inlet layer liquid inlet tank is a rectangular tank; the inlet liquid distribution tank is a gradually expanding tank, the small end of which is adapted to the size of the coolant inlet, and the large end of which is adapted to the size of the inlet layer liquid inlet tank.
[0007] Further, the outlet layer liquid inlet channel includes a plurality of outlet layer liquid inlet wedge-shaped channels that penetrate the outlet layer cover plate in the thickness direction; the plurality of outlet layer liquid inlet wedge-shaped channels are evenly distributed along the width direction of the outlet layer cover plate, and the width of the flow cross-section of the outlet layer liquid inlet wedge-shaped channel gradually decreases along the flow direction of the coolant; the outlet layer liquid inlet wedge-shaped channel is located directly below the inlet layer liquid inlet tank.
[0008] Further, the outlet layer liquid outlet channel includes an outlet layer liquid outlet wedge-shaped groove group, an outlet liquid collection tank, and a coolant outlet that are connected in sequence; the outlet layer liquid outlet wedge-shaped groove group is opened on the lower surface of the outlet layer cover plate; the outlet liquid collection tank penetrates the outlet layer cover plate in the thickness direction; the coolant outlet is opened on the side surface of the outlet layer cover plate; the outlet layer liquid outlet wedge-shaped groove group includes a plurality of outlet layer liquid outlet wedge-shaped grooves that are evenly distributed along the width direction of the outlet layer cover plate, and the outlet layer liquid outlet wedge-shaped grooves are arranged at intervals from the outlet layer liquid inlet wedge-shaped channels; the width of the flow cross-section of the outlet layer liquid outlet wedge-shaped groove gradually increases along the flow direction of the coolant.
[0009] Further, the manifold layer liquid inlet channel includes a plurality of manifold layer liquid inlet wedge-shaped channels that penetrate the manifold layer substrate in the thickness direction; the plurality of manifold layer liquid inlet wedge-shaped channels are evenly distributed along the width direction of the manifold layer substrate, and the width of the flow cross-section of the manifold layer liquid inlet wedge-shaped channel gradually decreases along the flow direction of the coolant; the manifold layer liquid inlet wedge-shaped channel is located directly below the outlet layer liquid inlet wedge-shaped channel.
[0010] Further, the manifold layer liquid outlet channel includes a plurality of manifold layer liquid outlet wedge-shaped channels that penetrate the manifold layer substrate in the thickness direction; the plurality of manifold layer liquid outlet wedge-shaped channels are also evenly distributed along the width direction of the manifold layer substrate, and the manifold layer liquid outlet wedge-shaped channels are arranged at intervals from the manifold layer liquid inlet wedge-shaped channels; the width of the flow cross-section of the manifold layer liquid outlet wedge-shaped channel gradually increases along the flow direction of the coolant; the manifold layer liquid outlet wedge-shaped channel is located below the outlet layer liquid outlet wedge-shaped groove.
[0011] Further, grooves are opened on the microchannel layer substrate, and multiple rows of the micro needle ribs are arranged in a rectangular array in the grooves; microchannels are formed between adjacent two rows of micro needle ribs; the microchannels are located directly below the manifold layer liquid inlet wedge-shaped channel and the manifold layer liquid outlet wedge-shaped channel.
[0012] Furthermore, the inlet layer cover plate, the outlet layer cover plate, and the manifold layer substrate are all made of non-metallic materials; the microchannel layer substrate is made of silicon nitride, silicon, copper, or aluminum; the inlet layer cover plate, the outlet layer cover plate, the manifold layer substrate, and the microchannel layer substrate are connected by bolts.
[0013] Furthermore, the inlet layer cover plate, the outlet layer cover plate, the manifold layer substrate, and the microchannel layer substrate are all made of metallic materials; the inlet layer cover plate, the outlet layer cover plate, the manifold layer substrate, and the microchannel layer substrate are welded by brazing.
[0014] Furthermore, the inlet layer cover plate, the outlet layer cover plate, the manifold layer substrate, and the microchannel layer substrate are all made of copper or aluminum.
[0015] The present application has the following beneficial effects compared with the prior art:
[0016] 1. The wedge-shaped manifold microchannel radiator with micro-pin fins in the embodiment of the present application, by setting the manifold substrate and opening a manifold layer inlet wedge-shaped channel on the manifold substrate that is located directly above the microchannel and communicates with the microchannel, enables the microchannel layer to have vertical liquid inlet, with the effect of micro-jet flow, avoiding the existence of flow dead zones, making the flow distribution uniform, effectively shortening the flow path, having advantages such as low pressure drop, small thermal resistance, and not easily blocking the channel.
[0017] 2. The outlet layer inlet wedge-shaped channel, the outlet layer outlet wedge-shaped groove, the manifold layer inlet wedge-shaped channel, and the manifold layer outlet wedge-shaped channel in the wedge-shaped manifold microchannel radiator with micro-pin fins in the embodiment of the present application all adopt wedge-shaped structures, and along the flow direction of the fluid, the inlet channel of the wedge-shaped structure becomes narrower and the outlet channel becomes wider. Therefore, in the wedge-shaped flow direction, the liquid volume gradually decreases and the gas volume gradually increases, which can promote the transformation of the two-phase flow pattern, improve the fluid transportation efficiency and the steam discharge efficiency, and reduce the flow pressure drop while improving the heat transfer performance.
[0018] 3. The wedge-shaped manifold microchannel radiator with micro-pin fins in the embodiment of the present application, by setting multiple rows of micro-pin fins on the microchannel layer substrate, increases the heat transfer area, provides a large number of nucleation sites, helps to advance the boiling onset point, and significantly improves the critical heat flux density. While increasing the heat transfer area, the flow cross-sectional area of the working fluid is also expanded, thereby reducing the pressure drop.
[0019] 4. The fluid flow distribution in each flow channel of the wedge-shaped manifold microchannel radiator with micro-pin fins in the embodiment of the present application is uniform, with good temperature uniformity. The presence of the micro-pin fins also destroys the thermal boundary layer, increases the perturbation of the flow field, and improves the heat transfer performance. Description of the Drawings
[0020] To more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the accompanying drawings required for the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can also be obtained based on these drawings.
[0021] Figure 1 It is an exploded view of the wedge-shaped manifold microchannel radiator with micro-pin fins according to an embodiment of the present application;
[0022] Figure 2 It is a cross-sectional view of the wedge-shaped manifold microchannel radiator with micro-pin fins according to an embodiment of the present application;
[0023] Figure 3 It is a bottom view of the inlet layer cover plate in the wedge-shaped manifold microchannel radiator with micro-pin fins according to an embodiment of the present application;
[0024] Figure 4 It is a top view of the outlet layer cover plate in the wedge-shaped manifold microchannel radiator with micro-pin fins according to an embodiment of the present application;
[0025] Figure 5 It is a bottom view of the outlet layer cover plate in the wedge-shaped manifold microchannel radiator with micro-pin fins according to an embodiment of the present application;
[0026] Figure 6 It is a structural schematic diagram of the manifold layer substrate in the wedge-shaped manifold microchannel radiator with micro-pin fins according to an embodiment of the present application;
[0027] Figure 7 It is a structural schematic diagram of the microchannel layer substrate in the wedge-shaped manifold microchannel radiator with micro-pin fins according to an embodiment of the present application. Detailed implementation manners
[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, rather than all embodiments. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present application.
[0029] In the description of the present application, it should be understood that the terms "center", "upper", "lower",
[0030] "front", "rear", "left", "right", "vertical", "horizontal", "top",
[0031] The orientation or positional relationship indicated by "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.
[0032] In the description of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "install", "connect", and "couple" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.
[0033] The terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" can explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise stated, the meaning of "a plurality" is two or more.
[0034] Referring to Figures 1 to 7 , an embodiment of the present application provides a wedge-shaped manifold microchannel radiator with micro-needle ribs, including an inlet layer cover plate 1, an outlet layer cover plate 2, a manifold layer substrate 3, and a microchannel layer substrate 4 arranged in sequence from top to bottom. The inlet layer cover plate 1, the outlet layer cover plate 2, the manifold layer substrate 3, and the microchannel layer substrate 4 are all rectangular plates, and positioning holes 5 are provided at the four corners of the four rectangular plates to facilitate the installation and fixation of the manifold microchannel radiator.
[0035] An inlet layer liquid inlet channel is provided on the inlet layer cover plate 1. An outlet layer liquid inlet channel and an outlet layer liquid outlet channel are provided on the outlet layer cover plate 2. A manifold layer liquid inlet channel and a manifold layer liquid outlet channel are provided on the manifold layer substrate 3. Multiple rows of micro-needle ribs are provided on the microchannel layer substrate 4, and microchannels are formed between the micro-needle ribs. The inlet layer liquid inlet channel, the outlet layer liquid inlet channel, the manifold layer liquid inlet channel, and the microchannels are connected in sequence from top to bottom, and the microchannels, the manifold layer liquid outlet channel, and the outlet layer liquid outlet channel are connected in sequence from bottom to top.
[0036] Referring to Figure 1 and Figure 3, the inlet layer liquid inlet channel includes a coolant inlet 11, an inlet liquid distribution tank 12, and an inlet layer liquid inlet tank 13 that are connected in sequence. Among them, the coolant inlet 11 is opened on the right side surface of the inlet layer cover plate 1. The inlet liquid distribution tank 12 and the inlet layer liquid inlet tank 13 are both opened on the lower surface of the inlet layer cover plate 1, and the groove depths are equal. The coolant inlet 11 is a round hole. The inlet layer liquid inlet tank 13 is a rectangular tank. The inlet liquid distribution tank 12 is a gradually expanding tank, the small end of which is adapted to the size of the coolant inlet 11, and the large end is adapted to the size of the inlet layer liquid inlet tank 13. In this way, the coolant enters the inlet liquid distribution tank 12 from the coolant inlet 11 and then is distributed in the inlet layer liquid inlet tank 13. The existence of the gradually expanding structure of the inlet liquid distribution tank 12 enables the coolant to be more evenly distributed in the inlet layer liquid inlet tank 13.
[0037] Refer to Figure 1 and Figure 4 , the outlet layer liquid inlet channel is located directly below the inlet layer liquid inlet tank 13. The outlet layer liquid inlet channel includes a plurality of outlet layer liquid inlet wedge-shaped channels 21 that penetrate the outlet layer cover plate 2 in the thickness direction. For example, four. The plurality of outlet layer liquid inlet wedge-shaped channels 21 are evenly distributed along the width direction of the outlet layer cover plate 2, and the width of the flow cross-section of the outlet layer liquid inlet wedge-shaped channels 21 gradually decreases along the flow direction of the coolant. That is, the inlet channel gradually narrows. In this way, by setting a plurality of outlet layer liquid inlet wedge-shaped channels 21, the flow distribution through this layer can be made uniform. Compared with traditional microchannel radiators, it can effectively shorten the flow path, has the advantages of low pressure drop, small thermal resistance, and is not easy to block the channel.
[0038] Refer to Figure 6 , the manifold layer liquid inlet channel is located directly below the outlet layer liquid inlet wedge-shaped channel 21. The manifold layer liquid inlet channel includes a plurality of manifold layer liquid inlet wedge-shaped channels 31 that penetrate the manifold layer substrate 3 in the thickness direction. For example, four. The plurality of manifold layer liquid inlet wedge-shaped channels 31 are evenly distributed along the width direction of the manifold layer substrate 3, and the width of the flow cross-section of the manifold layer liquid inlet wedge-shaped channels 31 gradually decreases along the flow direction of the coolant. In this way, the flow cross-section from large to small in the flow direction can be further maintained. On the one hand, the flow distribution is made uniform, and on the other hand, the coolant can enter the liquid vertically, with the effect of micro-jet flow, avoiding the existence of flow dead zones.
[0039] Refer to Figure 7 , grooves 41 are opened on the microchannel layer substrate 4, and multiple rows of micro pin fins 42 are arranged in a rectangular array in the grooves 41. Microchannels 43 are formed between two adjacent rows of micro pin fins 42. The microchannels 43 are located directly below the manifold layer liquid inlet wedge-shaped channels 31 and the manifold layer liquid outlet wedge-shaped channels 32.
[0040] The microchannel layer substrate 4 is the main component for enhancing heat transfer. The presence of multiple rows of micro pin fins 42 can increase the contact area between the coolant and the solid material, thereby increasing the heat transfer area. This provides a large number of nucleation sites, helps to advance the boiling onset point, and significantly increases the critical heat flux density. In addition, the secondary channels between the multiple rows of micro pin fins 42 can also increase the flow cross-sectional area of the working fluid, provide development space for the two-phase working fluid, avoid gas blockage, and thus reduce the pressure drop. In this way, the microchannel layer substrate 4 can achieve higher heat transfer efficiency at a lower pressure drop.
[0041] Referring to Figure 6 , the manifold layer outlet channel is located directly above the microchannel 43. The manifold layer outlet channel includes a plurality of manifold layer outlet wedge-shaped channels 32 that penetrate the manifold layer substrate 3 in the thickness direction. The plurality of manifold layer outlet wedge-shaped channels 32 are also evenly distributed in the width direction of the manifold layer substrate 3, and the manifold layer outlet wedge-shaped channels 32 are arranged at intervals with the manifold layer inlet wedge-shaped channels 31. The width of the flow cross-section of the manifold layer outlet wedge-shaped channels 32 gradually increases along the flow direction of the coolant.
[0042] The manifold layer inlet wedge-shaped channels 31 and the manifold layer outlet wedge-shaped channels 32 form several microchannel heat dissipation units in the manifold microchannel radiator, effectively shortening the flow path, having the advantages of low pressure drop, small thermal resistance, and not easily blocking the channels. The flow rate is evenly distributed within each heat dissipation unit, having a substantially consistent convective heat transfer coefficient, which can ensure the temperature uniformity of the device to be cooled, avoid stress concentration of the device to be cooled caused by temperature difference, and cause device damage problems. The cooperation of the micro pin fins 42 and the microchannels 43 enables the fluid inside different heat dissipation units to communicate with each other, the flow velocity to remain relatively stable, and to be evenly distributed. At the same time, the presence of the micro pin fins 42 destroys the thermal boundary layer, increases the disturbance of the flow field, and improves the heat transfer performance.
[0043] The manifold layer substrate 3 can effectively isolate the upper coolant, avoiding the coolant collected in the outlet liquid collecting tank 23 from directly contacting the microchannel layer substrate 4, resulting in uneven temperature distribution on the microchannel layer substrate 4.
[0044] Referring to Figure 1 and Figure 5 , the outlet layer outlet channel includes an outlet layer outlet wedge-shaped groove group 22, an outlet liquid collecting tank 23, and a coolant outlet 24 that are connected in sequence. The outlet layer outlet wedge-shaped groove group 22 is opened on the lower surface of the outlet layer cover plate 2. The outlet liquid collecting tank 23 penetrates the outlet layer cover plate 2 in the thickness direction. The coolant outlet 24 is opened on the left side surface of the outlet layer cover plate 2.
[0045] The liquid outlet wedge-shaped groove group 22 of the outlet layer is located directly above the liquid outlet channel of the manifold layer. The liquid outlet wedge-shaped groove group 22 of the outlet layer includes a plurality of liquid outlet wedge-shaped grooves 25 of the outlet layer evenly distributed along the width direction of the outlet layer cover plate 2, for example, five. The liquid outlet wedge-shaped grooves 25 of the outlet layer are arranged at intervals from the liquid inlet wedge-shaped channel 21 of the outlet layer. The outlet liquid collecting tank 23 is a triangular channel, and the coolant outlet 24 is located at the vertex on the left side of the triangular channel. The liquid outlet wedge-shaped grooves 25 of the outlet layer are aligned with the liquid outlet wedge-shaped channels 32 of the manifold layer, providing a larger discharge channel for the two-phase coolant after heat exchange.
[0046] In addition, the liquid outlet wedge-shaped groove group 22 of the outlet layer and the liquid outlet wedge-shaped channels 32 of the manifold layer are designed as wedge-shaped structures. Since the liquid volume gradually decreases and the gas volume gradually increases in the wedge-shaped flow direction, and the outlet channel becomes wider along the flow direction, it can promote the transformation of the two-phase flow pattern, improve the fluid transportation efficiency and the steam discharge efficiency, and reduce the flow pressure drop while improving the heat exchange performance.
[0047] The inlet layer cover plate 1, the outlet layer cover plate 2, and the manifold layer substrate 3 can be made of non-metallic materials such as transparent acrylic. The microchannel layer substrate 4 is made of materials such as silicon nitride, silicon, copper, or aluminum. The inlet layer cover plate 1, the outlet layer cover plate 2, the manifold layer substrate 3, and the microchannel layer substrate 4 are tightly connected by bolts. It is applicable to general atmospheric pressure coolants.
[0048] The inlet layer cover plate 1, the outlet layer cover plate 2, the manifold layer substrate 3, and the microchannel layer substrate 4 are all made of metallic materials such as copper or aluminum and are welded by brazing. It is applicable to coolants with higher pressures.
[0049] The working principle of the embodiment of the present application is as follows:
[0050] The inlet layer liquid inlet groove 13 is aligned with the liquid inlet channel of the outlet layer. The coolant sequentially enters the inlet liquid distribution tank 12 and the inlet layer liquid inlet groove 13 from the coolant inlet 11 on the inlet layer cover plate 1, then enters the liquid inlet wedge-shaped channel 21 of the outlet layer and finally vertically enters the microchannel layer substrate 4 through the liquid inlet wedge-shaped channel 31 of the manifold layer. The manifold layer substrate 3 is closely attached to the microchannel layer substrate 4. After the coolant exchanges heat through the microchannel layer substrate 4, it vertically flows upward from the liquid outlet wedge-shaped channel 32 of the manifold layer into the liquid outlet wedge-shaped grooves 25 of the outlet layer, and flows out through the outlet liquid collecting tank 23 and the coolant outlet 24 in sequence. After experiencing the above process, one heat exchange cycle is completed.
[0051] In summary, the manifold microchannel radiator of the embodiment of the present application optimizes and improves the traditional microchannel radiator, and has the advantages of strong heat exchange ability, good flow uniformity, good temperature uniformity, and low pressure drop. In addition, the manifold microchannel radiator of the present application has a simple manufacturing process, easy-to-obtain materials, and can be commercially produced.
[0052] The above is only the specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present application shall be covered by the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims
1. A wedge-shaped manifold microchannel heat sink with micro-needle fins, characterized in that: It comprises an inlet layer cover plate, an outlet layer cover plate, a manifold layer substrate and a microchannel layer substrate which are arranged in sequence from top to bottom; the inlet layer cover plate is provided with an inlet layer liquid inlet channel; the outlet layer cover plate is provided with an outlet layer liquid inlet channel and an outlet layer liquid outlet channel; the manifold layer substrate is provided with a manifold layer liquid inlet channel and a manifold layer liquid outlet channel; the microchannel layer substrate is provided with a plurality of rows of microneedle ribs; microchannels are formed between adjacent microneedle ribs; the inlet layer liquid inlet channel, the outlet layer liquid inlet channel, the manifold layer liquid inlet channel and the microchannel are connected in sequence from top to bottom, and the microchannel, the manifold layer liquid outlet channel and the outlet layer liquid outlet channel are connected in sequence from bottom to top.
2. The wedge-shaped manifold microchannel heat sink with micro-needle fins according to claim 1, characterized in that: The inlet layer liquid inlet channel includes a coolant inlet, an inlet liquid separation groove and an inlet layer liquid inlet groove which are connected in sequence; the coolant inlet is arranged on the side of the inlet layer cover plate; the inlet liquid separation groove and the inlet layer liquid inlet groove are arranged on the lower surface of the inlet layer cover plate; the coolant inlet is a circular hole; the inlet layer liquid inlet groove is a rectangular groove; the inlet liquid separation groove is a gradually expanding groove, the small end of which is adapted to the size of the coolant inlet, and the large end is adapted to the size of the inlet layer liquid inlet groove.
3. The wedge-shaped manifold microchannel heat sink with micro-needle fins according to claim 2, characterized in that: The outlet layer liquid inlet channel includes a plurality of outlet layer liquid inlet wedge-shaped channels that penetrate the outlet layer cover plate along the thickness direction; the plurality of outlet layer liquid inlet wedge-shaped channels are evenly distributed along the width direction of the outlet layer cover plate, and the width of the flow cross-section of the outlet layer liquid inlet wedge-shaped channels gradually decreases along the flow direction of the coolant; the outlet layer liquid inlet wedge-shaped channels are located directly below the inlet groove of the inlet layer.
4. The wedge-shaped manifold microchannel heat sink with micro-needle fins according to claim 3, characterized in that: The outlet layer liquid outlet channel comprises an outlet layer liquid outlet wedge groove group, an outlet liquid collecting groove and a coolant outlet which are connected in sequence; the outlet layer liquid outlet wedge groove group is arranged on the lower surface of the outlet layer cover plate; the outlet liquid collecting groove penetrates the outlet layer cover plate in the thickness direction; the coolant outlet is arranged on the side of the outlet layer cover plate; The outlet layer liquid outlet wedge groove group includes a plurality of outlet layer liquid outlet wedge grooves evenly distributed along the width direction of the outlet layer cover plate, and the outlet layer liquid outlet wedge grooves are arranged at intervals from the outlet layer liquid inlet wedge channels; the width of the flow section of the outlet layer liquid outlet wedge grooves gradually increases along the flow direction of the coolant.
5. The wedge-shaped manifold microchannel heat sink with micro-needle fins according to claim 4, characterized in that: The manifold layer liquid inlet channel includes a plurality of manifold layer liquid inlet wedge-shaped channels that penetrate the manifold layer substrate along the thickness direction; the plurality of manifold layer liquid inlet wedge-shaped channels are evenly distributed along the width direction of the manifold layer substrate, and the width of the flow cross-section of the manifold layer liquid inlet wedge-shaped channels gradually decreases along the flow direction of the coolant; the manifold layer liquid inlet wedge-shaped channel is located directly below the outlet layer liquid inlet wedge-shaped channel.
6. The wedge-shaped manifold microchannel heat sink with micro-needle fins according to claim 5, characterized in that: The manifold layer liquid outlet channel includes a plurality of manifold layer liquid outlet wedge channels that penetrate the manifold layer substrate along the thickness direction; the plurality of manifold layer liquid outlet wedge channels are also evenly distributed along the width direction of the manifold layer substrate, and the manifold layer liquid outlet wedge channels are spaced apart from the manifold layer liquid inlet wedge channels; the width of the flow cross-section of the manifold layer liquid outlet wedge channels gradually increases along the flow direction of the coolant; the manifold layer liquid outlet wedge channels are located below the outlet layer liquid outlet wedge grooves.
7. The wedge-shaped manifold microchannel heat sink with micro-needle fins according to claim 6, characterized in that: A groove is provided on the microchannel layer substrate, and multiple rows of microneedle ribs are arranged in a rectangular array in the groove; a microchannel is formed between two adjacent microneedle ribs; and the microchannel is located directly below the manifold layer liquid inlet wedge channel and the manifold layer liquid outlet wedge channel.
8. The wedge-shaped manifold microchannel heat sink with micro-needle fins according to claim 7, characterized in that: The inlet layer cover plate, outlet layer cover plate and manifold layer substrate are all made of non-metallic materials; the microchannel layer substrate is made of silicon nitride, silicon, copper or aluminum; the inlet layer cover plate, outlet layer cover plate, manifold layer substrate and microchannel layer substrate are connected by bolts.
9. The wedge-shaped manifold microchannel heat sink with micro-needle fins according to claim 7, characterized in that: The inlet layer cover plate, the outlet layer cover plate, the manifold layer substrate and the microchannel layer substrate are all made of metal materials; the inlet layer cover plate, the outlet layer cover plate, the manifold layer substrate and the microchannel layer substrate are welded by brazing.
10. The wedge-shaped manifold microchannel heat sink with micro-needle fins according to claim 9, characterized in that: The inlet layer cover plate, the outlet layer cover plate, the manifold layer substrate and the microchannel layer substrate are all made of copper or aluminum.