Multilayer embedded heat-conducting silica gel gasket

Abstract

The invention provides a multilayer embedded heat-conducting silica gel gasket, which comprises a heat-conducting cushion layer and a clamping assembly, and is characterized in that the heat-conducting cushion layer comprises a first silica gel layer, a middle layer and a second silica gel layer which are sequentially stacked along a first direction; the clamping assembly comprises a clamping piece and an expansion compression piece, the clamping piece comprises a main body and two extrusion parts, the main body is embedded in the heat conduction cushion layer, the two extrusion parts are arranged on the two opposite side faces of the main body in the second direction and are arranged at the upper end and the lower end of the main body in the first direction, and the heat conduction cushion layer is located between the two clamping parts; the expansion compression pieces are arranged on the extrusion parts and make contact with the first silica gel layer and the second silica gel layer. According to the heat-conducting silica gel gasket, the clamping pieces are embedded in the heat-conducting cushion layer, the main body is embedded in the heat-conducting cushion layer, stable connection is formed, the clamping parts are arranged at the two ends of the main body and make contact with the silica gel layer, and the expansion compression pieces are arranged on the extrusion parts, so that the heat-conducting silica gel gasket is not prone to deformation when heated to expand. One end of the expansion compression piece abuts against the extrusion part and can extrude the heat conduction cushion layer inwards.

Description

Technical Field

[0001] The present application relates to the technical field of thermal conductive silicone, and particularly to a multi-layer embedded thermal conductive silicone gasket. Background Art

[0002] As an important thermal management material, due to its excellent thermal conductivity, flexibility, and electrical insulation properties, the thermal conductive silicone gasket can effectively conduct the heat generated by electronic components, prevent the electronic components from overheating, and ensure the stable operation of the equipment. With the increase in the power density of electronic components, the heat dissipation demand is increasing day by day, and the importance of the thermal conductive silicone gasket in these applications is becoming more and more prominent.

[0003] In order to enhance the heat dissipation effect, in the prior art, a thermal conductive silicone gasket with a multi-layer structure design is usually adopted. The setting of the multi-layer structure can optimize the heat conduction path and improve the overall heat dissipation effect through the combination of different materials and thickness levels. The common multi-layer structure includes adding different types of high thermal conductivity materials in the thermal conductive silicone layer to further improve the thermal conductivity efficiency. In addition, some technical solutions also provide reinforcing ribs in the thermal conductive silicone gasket to enhance the mechanical strength and durability of the gasket.

[0004] However, although the existing multi-layer thermal conductive silicone gasket design can effectively improve the heat dissipation effect, there are still some defects in actual applications. The thermal conductive silicone will expand when heated and contract when cooled. When different materials in the multi-layer structure experience multiple thermal expansions and contractions, gaps will be generated in the multi-layer structure, and the existence of gaps between layers will lead to a decrease in heat dissipation efficiency and an inability to efficiently conduct heat. Summary of the Invention

[0005] In view of this, it is necessary to provide a multi-layer embedded thermal conductive silicone gasket that prevents gaps from being generated between layers to solve the above problems.

[0006] An embodiment of the present application provides a multi-layer embedded thermal conductive silicone gasket, including:

[0007] A thermal conductive cushion layer, defining the thickness direction of the thermal conductive cushion layer as the first direction, and the second direction is perpendicular to the first direction. The thermal conductive cushion layer includes a first silicone layer, an intermediate layer, and a second silicone layer stacked in sequence along the first direction;

[0008] A clamping assembly, including a clamping member and an expansion and compression member. The clamping member includes a main body and two extrusion parts. The main body is embedded in the thermal conductive cushion layer. The two extrusion parts are arranged on opposite side surfaces of the main body along the second direction, and the two extrusion parts are arranged at the upper and lower ends of the main body along the first direction. The thermal conductive cushion layer is located between the two extrusion parts;

[0009] The expansion and compression member is disposed on each of the extrusion portions and contacts the first silicone layer and the second silicone layer. When the silicone gasket is heated, the two extrusion portions abut against the expansion and compression member and squeeze inward relatively to clamp the heat conduction cushion layer.

[0010] In at least one embodiment of the present application, the silicone gasket further includes a contraction structure. Grooves are formed on both sides of the main body along the second direction, and the contraction structure is disposed in the grooves and fits the intermediate layer.

[0011] Define the direction towards the main body of the heat conduction cushion layer as the third direction. When the intermediate layer expands due to heat, the contraction structure contracts, and part of the intermediate layer enters the grooves, and the intermediate layer pulls the first silicone layer and the second silicone layer along the third direction.

[0012] In at least one embodiment of the present application, the contraction structure includes an elastic layer and a contraction block. The elastic layer is welded to the main body and encloses a first inner cavity with the groove, and the contraction block is disposed in the first inner cavity.

[0013] The main body further defines a second inner cavity communicating with the first inner cavity. When the intermediate layer expands due to heat, it pushes the elastic layer and squeezes the contraction block into the second inner cavity. When cooled, the elastic layer resumes its original state, a negative pressure is generated in the first inner cavity, and the contraction block moves to the first inner cavity.

[0014] In at least one embodiment of the present application, a first through hole is formed at the upper end of the first inner cavity along the first direction, and the first through hole is located on the side away from the elastic layer.

[0015] A second through hole is formed at the lower end of the second inner cavity along the first direction. The second inner cavity is located above the first inner cavity along the first direction, and the first through hole communicates with the second through hole.

[0016] In at least one embodiment of the present application, the intermediate layer includes a flexible buffer layer and a heat conduction plate embedded in the flexible buffer layer. Opposite sides of the flexible buffer layer respectively contact the first silicone layer and the second silicone layer.

[0017] The first silicone layer and the second silicone layer squeeze the flexible buffer layer relatively inward, and the flexible buffer layer compresses to increase the deformation margin.

[0018] In at least one embodiment of the present application, along the first direction, define the opening size of the groove as a, and the thickness of the flexible buffer layer as b, a = b.

[0019] In at least one embodiment of the present application, the silicone gasket further includes a first fiber layer and a second fiber layer.

[0020] The first fiber layer is disposed between the flexible buffer layer and the first silicone layer, and the second fiber layer is disposed between the flexible buffer layer and the second silicone layer to enhance the interlayer strength of the heat-conducting cushion layer.

[0021] In at least one embodiment of the present application, both the first fiber layer and the second fiber layer are arranged in a net shape;

[0022] Both sides of the first fiber layer along the first direction are respectively embedded in the flexible buffer layer and the first silicone layer, and both sides of the second fiber layer along the first direction are respectively embedded in the flexible buffer layer and the second silicone layer.

[0023] In at least one embodiment of the present application, the silicone gasket further includes heat-conducting adhesive layers disposed on opposite sides of the flexible buffer layer, and the first fiber layer and the second fiber layer are respectively embedded in each heat-conducting adhesive layer.

[0024] In at least one embodiment of the present application, the silicone gasket further includes a heat-conducting tape. The main body and the extrusion part are integrally provided and have a fitting surface. The fitting surface fits the heat-generating plane of the rigid single-element component. The heat-conducting tape is disposed between the fitting surface and the heat-generating plane to fix the clamping member.

[0025] In the above-provided multi-layer embedded heat-conducting silicone gasket, by embedding the main body and the extrusion part inside the heat-conducting cushion layer, the main body is embedded in the heat-conducting cushion layer to form a stable connection. The extrusion part is arranged at both ends of the main body to contact the silicone layer, forming a preliminary clamping effect. An expansion and compression member is arranged on the extrusion part of the clamping member. When the heat-conducting silicone gasket expands due to heat, one end of the expansion and compression member abuts against the extrusion part and can inwardly extrude the heat-conducting cushion layer, actively applying a clamping force to ensure that the gasket structure is always tightly fitted, so that the layers inside the heat-conducting cushion layer are in close contact, reducing the interfacial thermal resistance, optimizing the heat conduction path, preventing poor heat transfer caused by interlayer gaps, and thus improving the overall heat dissipation efficiency. Description of the Drawings

[0026] Figure 1 It is a perspective view of a multi-layer embedded heat-conducting silicone gasket in an embodiment of the present application.

[0027] Figure 2 is Figure 1 A sectional view of the described multi-layer embedded heat-conducting silicone gasket.

[0028] Figure 3 is Figure 1 A main sectional view of the described multi-layer embedded heat-conducting silicone gasket.

[0029] Figure 4 isFigure 3 Enlarged view of part A of a multi-layer embedded thermal conductive silicone gasket

[0030] Figure 5 For Figure 4 Schematic diagram of the inward movement of the intermediate layer of a multi-layer embedded thermal conductive silicone gasket

[0031] Figure 6 For Figure 1 Exploded perspective view of a multi-layer embedded thermal conductive silicone gasket

[0032] Figure 7 For Figure 6 Enlarged view of part B of a multi-layer embedded thermal conductive silicone gasket

[0033] Figure 8 For Figure 1 Cross-sectional view of a multi-layer embedded thermal conductive silicone gasket in the horizontal direction

[0034] Description of main component symbols

[0035] 100. A multi-layer embedded thermal conductive silicone gasket; 10. Thermal conductive cushion layer; 11. First silicone layer; 12. Intermediate layer; 121. Flexible buffer layer; 122. Thermal conductive plate; 13. Second silicone layer; 20. Clamping assembly; 21. Clamping member; 211. Main body; 211a. Groove; 212. Extrusion part; 213. First inner cavity; 213a. First through hole; 214. Second inner cavity; 214a. Second through hole; 215. Fitting surface; 22. Expansion and compression member; 30. Shrinkage structure; 31. Elastic layer; 40. First fiber layer; 50. Second fiber layer; 60. Thermal conductive adhesive layer Detailed implementation manners

[0036] Next, the embodiments of the present application will be described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments

[0037] It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be an intermediate component at the same time. When a component is considered to be "disposed on" another component, it can be directly disposed on the other component or there may be an intermediate component at the same time. The terms "top", "bottom", "upper", "lower", "left", "right", "front", "rear", and similar expressions used herein are only for the purpose of illustration

[0038] The embodiments of the present application provide a multi-layer embedded thermal conductive silicone gasket, including:

[0039] Thermal conductive cushion layer. Define the thickness direction of the thermal conductive cushion layer as the first direction, and the second direction is perpendicular to the first direction. The thermal conductive cushion layer includes a first silicone layer, an intermediate layer, and a second silicone layer stacked in sequence along the first direction;

[0040] Clamping assembly, including a clamping member and an expansion and compression member. The clamping member includes a main body and two extrusion parts. The main body is embedded in the thermal conductive cushion layer. The two extrusion parts are arranged on opposite side surfaces of the main body along the second direction, and the two extrusion parts are arranged at the upper and lower ends of the main body along the first direction. The thermal conductive cushion layer is located between the two extrusion parts;

[0041] The expansion and compression member is arranged on each extrusion part and contacts the first silicone layer and the second silicone layer. When the silicone gasket is heated, the two extrusion parts abut against the expansion and compression member and squeeze inward relatively to clamp the thermal conductive cushion layer.

[0042] The provided multi-layer embedded thermal conductive silicone gasket enables the expansion and compression member to squeeze the thermal conductive cushion layer inward when the thermal conductive silicone gasket expands due to heat, actively applying a clamping force to ensure that the gasket structure is always tightly fitted, enabling the layers inside the thermal conductive cushion layer to be in close contact, reducing the interfacial thermal resistance, optimizing the heat conduction path, and preventing poor heat transfer caused by interlayer gaps, thereby improving the overall heat dissipation efficiency by embedding a clamping member inside the thermal conductive cushion layer and arranging an expansion and compression member on the extrusion part of the clamping member.

[0043] The following will describe in detail some embodiments of the present application with reference to the accompanying drawings. Without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0044] Please refer to Figures 1-8 , the embodiments of the present application provide a multi-layer embedded thermal conductive silicone gasket 100, including:

[0045] Thermal conductive cushion layer. Define the thickness direction of the thermal conductive cushion layer as the first direction, and the second direction is perpendicular to the first direction. The thermal conductive cushion layer includes a first silicone layer 11, an intermediate layer 12, and a second silicone layer 13 stacked in sequence along the first direction;

[0046] Clamping assembly 20, including a clamping member 21 and an expansion and compression member 22. The clamping member 21 includes a main body 211 and two extrusion parts 212. The main body 211 is embedded in the thermal conductive cushion layer. The two extrusion parts 212 are arranged on opposite side surfaces of the main body 211 along the second direction, and the two extrusion parts 212 are arranged at the upper and lower ends of the main body 211 along the first direction. The thermal conductive cushion layer is located between the two extrusion parts 212;

[0047] The expansion and compression member 22 is disposed on each of the extrusion portions 212 and contacts the first silicone layer 11 and the second silicone layer 13. When the silicone gasket is heated, the two extrusion portions 212 abut against the expansion and compression member 22 and relatively squeeze inward to clamp the heat-conducting cushion layer.

[0048] Specifically, the heat-conducting cushion layer is stacked by a first silicone layer 11, an intermediate layer 12, and a second silicone layer 13 along the first direction (thickness direction). The first silicone layer 11 and the second silicone layer 13 provide good heat-conducting performance to ensure that heat can be effectively transferred from the heating element to the heat-dissipating element. The intermediate layer 12 has a buffering effect and is used to absorb and disperse stress. The multi-layer structure enhances the mechanical strength and heat-conducting efficiency of the heat-conducting cushion layer, while improving its durability and stability.

[0049] Furthermore, through the design of the main body 211 and the extrusion portions 212, the heat-conducting cushion layer is fixed to prevent it from shifting or deforming when heated or pressed. When the silicone gasket is heated, the expansion and compression member 22 will expand, pushing the extrusion portions 212 to squeeze inward, thereby clamping the heat-conducting cushion layer. The clamping assembly 20 ensures the stability of the heat-conducting cushion layer in a high-temperature environment and prevents the gaps generated by its thermal expansion.

[0050] Still further, the expansion and compression member 22 is disposed on each extrusion portion 212 and contacts the first silicone layer 11 and the second silicone layer 13. When the silicone gasket is heated, the expansion and compression member 22 expands, pushing the extrusion portions 212 to apply a clamping force inward. When the temperature decreases, the expansion and compression member 22 contracts, and the extrusion portions 212 relax, and the gasket returns to its original state. The expansion and compression member 22 expands according to the change of temperature. Through the dynamic clamping force, the interlayer gap is reduced, the heat conduction path is optimized, and the heat dissipation efficiency is improved.

[0051] In a specific embodiment, the silicone layer can be silicone rubber, filled silicone rubber, fluorosilicone rubber, liquid silicone rubber, etc.

[0052] Even further, the main body 211 and the extrusion portions 212 are made of a high heat-conducting hard material and are embedded in the heat-conducting cushion layer. The main body 211, as the core part of the clamping assembly 20, provides a firm connection; the extrusion portions 212 are located on both sides of the main body 211 and are used to squeeze the heat-conducting cushion layer inward when heated. The main body 211 and the extrusion portions 212 made of hard materials provide rigid support for the heat-conducting cushion layer to prevent the gasket from deforming as a whole when heated or pressed. The hard extrusion portions 212 can also apply a certain clamping force through their rigid structures when the silicone layer thermally expands to ensure the close fit of the heat-conducting cushion layer in the initial state. When the expansion and compression member 22 expands, the hard extrusion portions 212 can more effectively transfer the clamping force to ensure that the heat-conducting cushion layer remains closely fitted when heated.

[0053] Furthermore, the clamping member 21 is embedded in the heat-conducting cushion layer, which can more effectively transfer heat from the heating element to the entire heat-conducting cushion layer, avoiding local overheating. By evenly distributing the heat, the clamping member 21 reduces the problem of inconsistent expansion caused by excessive local temperature, ensuring that the heat-conducting cushion layer expands evenly when heated. Avoid local hot spots from being too high.

[0054] In summary, the silicone gasket is in a normal temperature state. The clamping member 21 is embedded in the heat-conducting cushion layer and is in close contact with the heat-conducting cushion layer. The clamping member 21 provides rigid support through its hard material and serves as part of the heat conduction. When the heating element works, the heat in the local high-temperature area is quickly transferred to the entire heat-conducting cushion layer through the clamping member 21, avoiding local overheating. The expansion and compression member 22 expands when heated, pushing the extrusion part 212 to squeeze inward, ensuring that the heat-conducting cushion layer expands evenly and fits tightly when heated. When the temperature drops, the expansion and compression member 22 shrinks, and the extrusion part 212 relaxes, and the heat-conducting cushion layer returns to its original state.

[0055] In a specific embodiment, the silicone gasket further includes a shrinkage structure 30. Grooves 211a are formed on both sides of the main body 211 along the second direction. The shrinkage structure 30 is arranged in the grooves 211a and fits the intermediate layer 12.

[0056] Define the direction of the heat-conducting cushion layer facing the main body 211 as the third direction. When the intermediate layer 12 expands when heated, the shrinkage structure 30 shrinks, and part of the intermediate layer 12 enters the grooves 211a. The intermediate layer 12 pulls the first silicone layer 11 and the second silicone layer 13 along the third direction.

[0057] Specifically, the shrinkage structure 30 shrinks when heated and restores when cooled, dynamically adjusting the interlayer gap to ensure close fitting of the heat-conducting cushion layer at different temperatures. The grooves 211a provide additional deformation space for the intermediate layer 12, enabling it to partially enter the grooves when heated and expanding, reducing the extrusion stress on the upper and lower silicone layers. After the intermediate layer 12 enters the grooves 211a, a force is generated to pull inward (the third direction), pulling the upper and lower silicone layers tightly to ensure close interlayer fitting.

[0058] Furthermore, when the expansion and compression member 22 expands, it pushes the extrusion part 212 to apply a clamping force inward, squeezing the silicone layer towards the middle. The shrinkage structure 30 and the grooves 211a combined with the expansion and compression member 22 work together to ensure close fitting of the heat-conducting cushion layer at different temperatures. The combined action of the expansion and compression member 22 + the shrinkage structure 30 + the grooves 211a is equivalent to the pinching action of a finger and the deformation of the intermediate material, jointly ensuring the stability of the clamping effect.

[0059] In a specific embodiment, the contraction structure 30 includes an elastic layer 31 and a contraction block (not shown in the figure). The elastic layer 31 is welded to the main body 211 and encloses a first inner cavity 213 with the groove 211a. The contraction block is disposed in the first inner cavity 213.

[0060] The main body 211 further defines a second inner cavity 214 communicating with the first inner cavity 213. When the intermediate layer 12 expands due to heat, it pushes the elastic layer 31 and squeezes the contraction block into the second inner cavity 214. When cooled, the elastic layer 31 resumes its original shape, generating negative pressure in the first inner cavity 213, and the contraction block moves back to the first inner cavity 213.

[0061] Specifically, the elastic layer 31 provides elastic support and can deform when heated and resume its original shape when cooled. The contraction block moves within the first inner cavity 213, is squeezed into the second inner cavity 214 when heated, and returns to the first inner cavity 213 when cooled. The combination of the elastic layer 31 and the contraction block realizes the dynamic adjustment function of the contraction structure 30, ensuring the tight fit of the heat-conducting cushion layer at different temperatures. The elastic support of the elastic layer 31 enhances the mechanical stability of the contraction structure 30, preventing it from deforming or being damaged during the thermal cycle. The groove 211a provides an installation space for the contraction structure 30. The elastic layer 31 and the groove 211a enclose the first inner cavity 213, providing a moving space for the contraction block.

[0062] Furthermore, the second inner cavity 214 provides an additional moving space for the contraction block, ensuring that it can smoothly enter when heated. Through the movement of the contraction block between the first inner cavity 213 and the second inner cavity 214, the dynamic adjustment function of the contraction structure 30 is realized. The movement of the contraction block between the first inner cavity 213 and the second inner cavity 214 realizes the dynamic adjustment of the interlayer gap. Through the contraction effect of the contraction structure 30, the intermediate layer 12 pulls the first silicone layer 11 and the second silicone layer 13 along the third direction, enhancing the pressing effect between the upper and lower silicone layers and reducing the possibility of generating gaps due to thermal expansion.

[0063] In a specific embodiment, the contraction block is made of paraffin wax.

[0064] Specifically, at normal temperature (not heated), the paraffin wax remains solid and fills the first inner cavity 213, preventing the intermediate layer 12 from entering the groove 211a and ensuring the overall structural stability of the gasket. When heated, the paraffin wax melts into a liquid state with enhanced fluidity and can be pushed into the second inner cavity 214 when the intermediate layer 12 expands, providing additional expansion space for the intermediate layer 12 and avoiding excessive expansion of the gasket that may affect the fit. After cooling, the paraffin wax solidifies again, refilling the first inner cavity 213 and restoring its initial state, ensuring the integrity of the gasket structure and functioning again during the next temperature change.

[0065] Furthermore, when the intermediate layer 12 expands due to heat, the elastic layer 31 deforms and expands, allowing the intermediate layer 12 to push the liquid paraffin into the second inner cavity 214. When cooled, the elastic layer 31 returns to its original shape, creating a negative pressure in the first inner cavity 213, which actively draws the liquid paraffin back from the second inner cavity 214 into the first inner cavity 213, causing the paraffin to solidify again and fill the first inner cavity 213. Utilizing the phase change characteristics of paraffin and combining the elastic layer 31 with the negative pressure recovery mechanism, a heat-conducting gasket that adapts to temperature changes is formed. It can provide flexible expansion space when heated and return to its initial shape after cooling, ensuring stability during long-term use.

[0066] In a specific embodiment, the side of the main body 211 has an arc surface connecting the upper and lower extrusion parts 212, and one side of the first silicone layer 11 and the second silicone layer 13 both contacts the arc surface.

[0067] Specifically, the arc surface is a concave arc surface. When the first silicone layer 11 and the second silicone layer 13 expand due to heat, they should fit the arc surface, and the expansion direction is perpendicular to the arc surface. Due to the characteristics of the arc surface, the expansion direction of one side of the silicone layer is inclined inward, which can further strengthen the inward extrusion force during expansion. Further, due to the characteristics of the arc surface, the expansion compression member 22 is located on the side of the extrusion part 212 away from the main body 211. Combining with the contraction structure 30, the expansion compression member 22 can better apply an inward extrusion force.

[0068] In a specific embodiment, a first through hole 213a is provided at the upper end of the first inner cavity 213 along the first direction, and the first through hole 213a is located on the side away from the elastic layer 31;

[0069] A second through hole 214a is provided at the lower end of the second inner cavity 214 along the first direction. The second inner cavity 214 is located above the first inner cavity 213 along the first direction, and the first through hole 213a communicates with the second through hole 214a.

[0070] Specifically, the first inner cavity 213 is the main storage space for solid paraffin. In the unused or low-temperature state, the paraffin is in a solid state and remains filled. The first through hole 213a is a flow channel for liquid paraffin, ensuring that after the paraffin melts due to heat, it can flow smoothly to the second inner cavity 214 without being blocked. This through hole is opened on the side away from the elastic layer 31, which can reduce the interference of the elastic layer 31 and ensure the smooth flow of paraffin after heating.

[0071] Further, the second inner cavity 214 is a temporary storage space for the paraffin to flow after being heated and melted. The connectivity of the first through-hole 213a and the second through-hole 214a ensures the reversible flow of the paraffin between different inner cavities. The second inner cavity 214 is located above the first inner cavity 213, enabling the paraffin to flow under the influence of gravity after being heated and liquefied, thereby optimizing the transfer efficiency of the paraffin.

[0072] In a specific embodiment, the intermediate layer 12 includes a flexible buffer layer 121 and a heat-conducting plate 122 embedded in the flexible buffer layer 121. The two opposite sides of the flexible buffer layer 121 are respectively in contact with the first silica gel layer 11 and the second silica gel layer 13.

[0073] The first silica gel layer 11 and the second silica gel layer 13 relatively squeeze the flexible buffer layer 121 inward, and the flexible buffer layer 121 is compressed to increase the deformation margin.

[0074] Specifically, the flexible buffer layer 121 provides the ability of elastic deformation to buffer the thermal expansion stress. The embedded heat-conducting plate 122 enhances the overall heat-conducting ability and enables the heat to be evenly transferred. The two sides are in contact with the first silica gel layer 11 and the second silica gel layer 13 to ensure close fitting with the heat dissipation system. The deformation of the first and second silica gel layers 13 can be directly transmitted to the flexible buffer layer 121 to form a complete thermal expansion-deformation adjustment system. When the silica gel layer expands due to heat, it will squeeze the flexible buffer layer 121 inward, causing it to be compressed, thereby absorbing the deformation pressure brought by the expansion. Further, the addition of the heat-conducting plate 122 enables the heat to be more evenly distributed within the entire gasket, avoiding local hot spots and improving the heat-conducting efficiency.

[0075] In a specific embodiment, the heat-conducting plate 122 is made of a hard heat-conducting material such as silicon-based ceramic or graphite.

[0076] In a specific embodiment, along the first direction, the opening size of the groove 211a is defined as a, and the thickness of the flexible buffer layer 121 is b, and a = b.

[0077] Specifically, in the normal working state, when the first silica gel layer 11 and the second silica gel layer 13 expand or contract due to heat, they will generate pressure on the intermediate flexible buffer layer 121. Since a = b, the thickness of the flexible buffer layer 121 decreases after being pressed. At this time, the opening size of the groove 211a covers the intermediate layer 12 and the upper and lower silica gel layers. The groove 211a covering the three-layer structure prevents the first intermediate layer 12 from entering the groove 211a, resulting in the lateral cutting force between the intermediate layer 12 and the upper and lower silica gel layers.

[0078] In a specific embodiment, the silica gel gasket further includes a first fiber layer 40 and a second fiber layer 50.

[0079] The first fiber layer 40 is disposed between the flexible buffer layer 121 and the first silicone layer 11, and the second fiber layer 50 is disposed between the flexible buffer layer 121 and the second silicone layer 13, for enhancing the interlayer strength of the heat-conducting cushion layer.

[0080] Specifically, the first fiber layer 40 and the second fiber layer 50 are located between the flexible buffer layer 121 and the upper and lower silicone layers. By adding fiber materials, the bonding force between the layers is enhanced, avoiding tearing or separation caused by uneven stress distribution between different layers. The fiber layer can withstand large tensile stresses, effectively preventing interlayer tearing or separation and ensuring the overall structural stability of the heat-conducting gasket.

[0081] Furthermore, the introduction of the fiber layer can help maintain the shape of the gasket under thermal expansion or external pressure, preventing the flexible buffer layer 121 and the silicone layer from losing their functions due to excessive deformation. The structure of the fiber layer provides a certain rigidity, making the entire gasket more stable during expansion and contraction, and the deformation amount is controlled within a reasonable range. So that the heat-conducting gasket can maintain its good physical properties and stable shape during multiple thermal expansion and cooling processes, extending its service life.

[0082] In a specific embodiment, the flexible buffer layer 121 is a ceramic-reinforced silicone foam, a boron nitride-filled PU foam, etc.

[0083] In a specific embodiment, both the first fiber layer 40 and the second fiber layer 50 are arranged in a net shape;

[0084] On both sides of the first fiber layer 40 along the first direction, it is respectively embedded in the flexible buffer layer 121 and the first silicone layer 11, and on both sides of the second fiber layer 50 along the first direction, it is respectively embedded in the flexible buffer layer 121 and the second silicone layer 13.

[0085] Specifically, the design of the net structure can effectively disperse the stress generated under heat or external pressure, avoiding tearing or separation of the material caused by excessive local stress. The net structures of the first fiber layer 40 and the second fiber layer 50 can make the entire gasket withstand external forces and temperature changes more evenly, preventing damage caused by excessive stretching or compression of a certain part.

[0086] Furthermore, by embedding the net-shaped fiber layer between the flexible buffer layer 121 and the upper and lower silicone layers, a stable bonding force can be provided between the multi-layer structures. The embedding design of the first fiber layer 40 and the second fiber layer 50 effectively enhances the bonding force between the layers, avoiding interlayer tearing or separation caused by external forces or thermal expansion.

[0087] In a specific embodiment, the silica gel gasket further includes heat-conducting adhesive layers 60 provided on opposite sides of the flexible buffer layer 121, and the first fiber layer 40 and the second fiber layer 50 are respectively embedded in each heat-conducting adhesive layer 60.

[0088] Specifically, the heat-conducting adhesive layers 60 are located on both sides of the flexible buffer layer 121 and play the role of a heat conduction bridge between the first silica gel layer 11 and the second silica gel layer 13. It has high thermal conductivity and can efficiently conduct heat from a high-temperature area to a low-temperature area. The fiber layer further enhances the performance of the heat-conducting adhesive layer 60 through its mesh structure. During the heat transfer process, the fiber layer can ensure that the heat-conducting adhesive layer 60 does not deform when expanding or under stress.

[0089] In a specific embodiment, the silica gel gasket further includes a heat-conducting tape. The main body 211 and the extrusion part 212 are integrally provided and have a fitting surface 215. The fitting surface 215 fits the heat-generating plane of the hard single element, and the heat-conducting tape is provided between the fitting surface 215 and the heat-generating plane to fix the clamping member 21.

[0090] Specifically, the integral setting of the extrusion part 212 and the main body 211 makes the overall rigidity of the extrusion part 212 stronger. When the silica gel layer expands due to heat, its volume will increase. If the structure does not have sufficient rigid support, the expanded silica gel layer may displace or slide, thereby reducing the heat conduction efficiency or causing poor heat transfer. The heat-conducting tape firmly adheres to the hard element through its adhesion characteristics, preventing poor heat transfer caused by loosening or poor contact. It can effectively fill the tiny gaps on the surface with irregularities, increase the contact area, and enhance the heat conduction effect.

[0091] The above are only the implementation manners of the present application. It should be noted here that for those of ordinary skill in the art, without departing from the creative concept of the present application, improvements can still be made, but these all fall within the protection scope of the present application.

Claims

1. A multi-layer embedded thermally conductive silicone gasket, characterized in that: include: A thermally conductive pad layer, wherein the thickness direction of the thermally conductive pad layer is defined as a first direction, a second direction is perpendicular to the first direction, and the thermally conductive pad layer comprises a first silicone layer, an intermediate layer, and a second silicone layer stacked in this order along the first direction; A clamping assembly, comprising a clamping member and an expansion and compression member, wherein the clamping member comprises a main body and two extrusion parts, wherein the main body is embedded in the thermal pad layer, the two extrusion parts are arranged at two opposite side surfaces of the main body along the second direction, and the two extrusion parts are arranged at upper and lower ends of the main body along the first direction, and the thermal pad layer is located between the two extrusion parts; The expansion compression member is arranged on each of the extrusion parts and contacts the first silicone layer and the second silicone layer, and is used for the two extrusion parts to abut against the expansion compression member and press inwardly relative to each other when the silicone gasket is heated, so as to clamp the thermal conductive pad layer.

2. The multi-layer embedded thermally conductive silicone gasket according to claim 1, characterized in that: The silicone gasket further comprises a shrinkage structure, grooves are provided on both sides of the main body along the second direction, and the shrinkage structure is arranged in the grooves and adheres to the middle layer; The direction of the thermal pad layer toward the main body is defined as a third direction. When the middle layer expands due to heat, the shrinkage structure shrinks, and a portion of the middle layer enters the groove. The middle layer tightens the first silicone layer and the second silicone layer along the third direction.

3. The multi-layer embedded thermally conductive silicone gasket according to claim 2, characterized in that: The shrinkage structure comprises an elastic layer and a shrinkage block, wherein the elastic layer is welded to the main body and enclosed with the groove to form a first inner cavity, and the shrinkage block is arranged in the first inner cavity; The main body is further provided with a second inner cavity connected to the first inner cavity. The intermediate layer expands when heated to push the elastic layer and squeeze the shrink block into the second inner cavity. When cooled, the elastic layer recovers, the first inner cavity generates negative pressure, and the shrink block moves to the first inner cavity.

4. The multi-layer embedded thermally conductive silicone gasket according to claim 3, characterized in that: A first through hole is formed at the upper end of the first inner cavity along the first direction, and the first through hole is located at a side away from the elastic layer; A second through hole is formed at a lower end of the second inner cavity along the first direction. The second inner cavity is located above the first inner cavity along the first direction. The first through hole is connected to the second through hole.

5. The multi-layer embedded thermally conductive silicone gasket according to claim 2, characterized in that: The middle layer includes a flexible buffer layer and a heat conducting plate embedded in the flexible buffer layer, and opposite sides of the flexible buffer layer are in contact with the first silicone layer and the second silicone layer respectively; The first silicone layer and the second silicone layer relatively press the flexible buffer layer inwardly, and the flexible buffer layer is compressed to increase the deformation margin.

6. The multi-layer embedded thermally conductive silicone gasket according to claim 5, characterized in that: Along the first direction, the opening size of the groove is defined as a, the thickness of the flexible buffer layer is defined as b, and a=b.

7. The multi-layer embedded thermally conductive silicone gasket according to claim 5, characterized in that: The silica gel gasket also includes a first fiber layer and a second fiber layer; The first fiber layer is disposed between the flexible buffer layer and the first silicone layer, and the second fiber layer is disposed between the flexible buffer layer and the second silicone layer, so as to enhance the interlayer strength of the thermal conductive pad layer.

8. The multi-layer embedded thermally conductive silicone gasket according to claim 7, characterized in that: The first fiber layer and the second fiber layer are both arranged in a mesh shape; The first fiber layer is embedded in the flexible buffer layer and the first silicone layer at two sides along the first direction, and the second fiber layer is embedded in the flexible buffer layer and the second silicone layer at two sides along the first direction.

9. The multi-layer embedded thermally conductive silicone gasket according to claim 8, characterized in that: The silicone gasket further includes heat-conducting adhesive layers disposed on opposite sides of the flexible buffer layer, and the first fiber layer and the second fiber layer are respectively embedded in each of the heat-conducting adhesive layers.

10. The multi-layer embedded thermally conductive silicone gasket according to claim 1, characterized in that: The silicone gasket also includes a thermally conductive tape. The main body is integrally arranged with the extrusion portion and has a fitting surface. The fitting surface fits the heating plane of the hard single element. The thermally conductive tape is arranged between the fitting surface and the heating plane to fix the clamp.

Images