Heat-conducting silica gel gasket as well as preparation method and application thereof

Abstract

The invention provides a heat-conducting silica gel gasket and a preparation method and application thereof, the prepared heat-conducting silica gel gasket is applied to heat dissipation of electronic equipment, the problem that the heat conductivity coefficient of an existing heat-conducting silica gel gasket lacks temperature responsiveness can be effectively solved, it is ensured that the electronic equipment is always in a proper working temperature range, and the service life of the electronic equipment is prolonged. And the problems of performance reduction, crash, element damage and the like caused by overheating are avoided, so that the reliability and the stability of the electronic equipment are improved, and the service life of the equipment is prolonged.

Description

Technical Field

[0001] The present disclosure relates to the technical field of thermal interface materials, and particularly, to a thermal conductive silicone gasket, a preparation method thereof, and an application thereof. Background Art

[0002] In the current era of rapid development of electronic technology, various electronic devices are constantly moving towards miniaturization and high performance, which makes heat dissipation management a key link to ensure the stable operation of the devices. Taking smart phones, laptops, and core components in new energy vehicles such as on-board charger (OBC) chips as examples, they generate a large amount of heat during operation. If the heat cannot be dissipated in a timely and effective manner, serious performance problems will occur.

[0003] With the increasing emphasis on environmental protection and low carbon, the development pace of new energy vehicles has also accelerated significantly. The automotive industry is witnessing an accelerated integration of technologies related to energy, transportation, information and communication, etc., with electrification, networking, and intelligence becoming the development trends of the automotive industry. New technologies for new energy vehicles are emerging like bamboo shoots after a spring rain. For example: Application No. CN202410658157.7, Publication No. CN118238797B, Invention Title: New Energy Vehicle Energy Intelligent Management System, Control Method and Related Equipment; Application No. CN202410672579.X, Publication No. CN118597091A, Invention Title: New Energy Vehicle Energy Intelligent Management Method, System and Related Equipment; Application No. CN202010470247.5, Publication No. CN113734146B, Invention Title: Vehicle Driving Mode Selection Method, Device, Equipment and Medium; all describe hybrid technologies mainly based on electricity, which have multiple advantages such as fast speed, economy, quietness, smoothness, and environmental friendliness. Application No. CN202211678720.4, Publication No. CN117382629B, Invention Title: Vehicle Power Control Method, Device, Medium, Vehicle Controller and Vehicle; Application No. CN202311164098.X, Publication No. CN116890770B, Invention Title: Vehicle Control System, Method and Vehicle; Application No. CN202311170393.6, Publication No. CN117533292B, Invention Title: Vehicle Control System, Control Method, Controller and Vehicle; all describe new energy power systems centered around independent drive of four in-wheel motors, which have greatly improved the safety and power performance of new energy vehicles. While new energy vehicle technologies are constantly innovating, their heat dissipation problems cannot be ignored. As mentioned earlier, the on-board charger (OBC) chip generates a large amount of heat during operation that requires efficient heat dissipation. As one of the widely used heat dissipation materials, the early research and development of traditional thermal conductive silicone pads mainly focused on improving static thermal conductivity, that is, simply pursuing a higher thermal conductivity coefficient. Through various means in the industry, such as optimizing the types of fillers and improving the filling ratios, some thermal conductive silicone pads have shown good thermal conductivity under conventional test conditions, with considerable thermal conductivity coefficient values. However, as the working environment of electronic devices becomes increasingly complex and changeable, the shortcomings of existing technologies are becoming increasingly prominent, especially in terms of temperature adaptability. Many traditional thermal conductive silicone pads have a fatal defect - the lack of temperature responsiveness of the thermal conductivity coefficient. Specifically, the thermal conductivity coefficients of these materials hardly change with temperature. When in a low-temperature environment, in order to achieve the best performance, the chip needs to reduce heat dissipation so as to quickly warm up to the appropriate working temperature range. But at this time, due to the inherent characteristics of the high thermal conductivity coefficient of traditional heat dissipation materials, they will continuously and rapidly dissipate heat uncontrollably, which will significantly reduce the working temperature of the chip, making it far from the best operating condition, and ultimately resulting in the device being unable to operate stably and efficiently.The problem that the heat dissipation efficiency cannot be flexibly adjusted according to the dynamically changing actual working environment temperature seriously restricts the performance of electronic devices under complex working conditions.

[0004] Therefore, there is an urgent need to provide a new thermal conductive silicone pad to solve the defect that the thermal conductivity coefficient of the existing thermal conductive silicone pad lacks temperature responsiveness. Summary of the Invention

[0005] The purpose of the present disclosure is to provide a new thermal conductive silicone gasket and its preparation method and application to solve the defect that the thermal conductivity coefficient of the existing thermal conductive silicone gasket lacks temperature responsiveness.

[0006] To achieve the above purpose, in the first aspect of the present disclosure, a thermal conductive silicone gasket is provided. The thermal conductive silicone gasket includes methyl vinyl siloxane, nano-ceramics, a thermistor, silicon, a catalyst, an antioxidant, and a cross-linking agent; Among them, the weight ratio of the siloxane compound, nano-ceramics, thermistor, silicon, catalyst, antioxidant, and cross-linking agent is (8-10):(2-3):(1-2):(80-89):(0.8-1.2):(0.8-1.2):(0.8-1.2).

[0007] Optionally, the weight ratio of the siloxane compound, nano-ceramics, thermistor, silicon, catalyst, antioxidant, and cross-linking agent is (9-10):(2.5-3):(1.2-2):(82-86):(1-1.2):(1-1.2):(1-1.2).

[0008] Optionally, the siloxane compound includes at least one of methyl vinyl siloxane, methyl silicone, fluorosilicone, and phenyl methyl silicone; The nano-ceramics include alumina and / or silicon carbide; The thermistor includes E-hBN; The catalyst includes platinum(0)-1,3-divinyl-1,1,3,3-tetramethyldisiloxane; The antioxidant includes 2,6-di-tert-butyl-4-methylphenol; The cross-linking agent includes Pt and / or di-tert-butyl peroxide.

[0009] Optionally, the purity of the siloxane compound is not less than 98%; the purity of the nano-ceramics is not less than 98.5%; the purity of the thermistor, silicon, catalyst, antioxidant, and cross-linking agent is independently not less than 99.9%.

[0010] Optionally, the siloxane compound is methyl vinyl siloxane, and the molecular weight of the methyl vinyl siloxane is 1000-1400.

[0011] On the other hand, the present disclosure provides a method for preparing a thermal conductive silicone gasket, and the preparation method includes the following steps: S1. First mix a siloxane compound, a nano-ceramic, a thermistor, silicon, and an antioxidant to obtain a first mixture; S2. Second mix a first solvent containing a catalyst with the first mixture to obtain a second mixture; S3. Subject the second mixture to exhaust, crosslinking, coagulation, shaping, and curing treatments in sequence; The crosslinking treatment includes adding a crosslinking agent to the second mixture; Wherein, the weight ratio of the siloxane compound, the nano-ceramic, the thermistor, silicon, the catalyst, the antioxidant, and the crosslinking agent is (8 - 10):(2 - 3):(1 - 2):(80 - 89):(0.8 - 1.2):(0.8 - 1.2):(0.8 - 1.2).

[0012] Preferably, the weight ratio of the siloxane compound, the nano-ceramic, the thermistor, silicon, the catalyst, the antioxidant, and the crosslinking agent is (9 - 10):(2.5 - 3):(1.2 - 2):(82 - 86):(1 - 1.2):(1 - 1.2):(1 - 1.2).

[0013] Optionally, the method for preparing the thermal conductive silicone gasket provided by the present disclosure is a method commonly used in the art, and the conditions for the first mixing and the second mixing are the mixing conditions commonly used in the art. The first mixing includes mechanically stirring a siloxane compound, a nano-ceramic, a thermistor, silicon, and an antioxidant in a planetary mixer or a kneader until the materials are evenly mixed. The second mixing includes mechanically stirring the first solvent containing a catalyst with the first mixture to make them fully mixed.

[0014] Optionally, the exhaust treatment adopts the conventional conditions and operation methods in the art, such as using a vacuum degassing machine, and within a reasonable vacuum degree, treatment time, and appropriate temperature range, effectively discharge the gas in the material to ensure the product quality.

[0015] Optionally, the conditions for the crosslinking treatment include: adding a crosslinking agent to the second mixture after the exhaust treatment, and crosslinking at 140 - 160 °C for 25 - 35 min; The conditions for the coagulation treatment include: coagulating at -22 ~ -18 °C for 25 - 35 min; The conditions for the shaping treatment include: shaping at 140 - 160 °C and 8 - 12 bar for 8 - 12 min; The conditions for the curing treatment include: curing at 140 - 160 °C for 25 - 35 min.

[0016] Optionally, the siloxane compound includes at least one of methylvinyl siloxane, methyl silicone, fluorosilicone, and phenylmethyl silicone; The nano-ceramics include alumina and / or silicon carbide; The thermistor includes E-hBN; The catalyst includes platinum(0)-1,3-divinyl-1,1,3,3-tetramethyldisiloxane; The antioxidant includes 2,6-di-tert-butyl-4-methylphenol; The crosslinking agent includes Pt and / or di-tert-butyl peroxide; The first solvent includes toluene and / or xylene.

[0017] Optionally, the purity of the siloxane compound is not less than 98%; The purity of the nano-ceramics is not less than 98.5%; The purities of the thermistor, silicon, catalyst, antioxidant, and crosslinking agent are each independently not less than 99.9%.

[0018] Optionally, the siloxane compound is methylvinyl siloxane, and the molecular weight of the methylvinyl siloxane is 1000 - 1400.

[0019] On the other hand, the present disclosure provides a thermally conductive silicone gasket prepared by the above preparation method.

[0020] On the other hand, the present disclosure provides an application of the above thermally conductive silicone gasket in heat dissipation of electronic devices.

[0021] Through the above technical solutions, the present disclosure provides a thermally conductive silicone gasket, a preparation method thereof, and an application. Applying the thermally conductive silicone gasket prepared by the present disclosure to heat dissipation of electronic devices can effectively solve the problem that the thermal conductivity coefficient of the existing thermally conductive silicone gasket lacks temperature responsiveness, ensure that the electronic device is always within a suitable working temperature range, and avoid problems such as performance degradation, crashing, and component damage caused by overheating, thereby improving the reliability and stability of the electronic device and extending the service life of the device.

[0022] Other features and advantages of the present disclosure will be described in detail in the subsequent specific implementation section. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The drawings are used to provide a further understanding of the present invention and constitute a part of the specification. They are used together with the following specific implementation to explain the present invention, but do not constitute a limitation to the present invention. In the drawings: Figure 1 It is the heat dissipation simulation analysis result of the thermally conductive silicone gasket prepared in Example 1 of the present disclosure.

[0024] Figure 2 It is the heat dissipation simulation analysis result of the thermal conductive silicone gasket prepared in Example 2 of the present disclosure.

[0025] Figure 3 It is the heat dissipation simulation analysis result of the thermal conductive silicone gasket prepared in Example 3 of the present disclosure.

[0026] Figure 4 It is the heat dissipation simulation analysis result of the ordinary silicone prepared in Comparative Example 1 of the present disclosure. Detailed Description of the Invention

[0027] The following provides a detailed description of the specific embodiments of the present disclosure. It should be understood that the specific embodiments described herein are only for the purpose of illustrating and explaining the present disclosure, and are not intended to limit the present disclosure.

[0028] The present disclosure provides a thermal conductive silicone gasket, which includes a siloxane compound, nano-ceramics, a thermistor, silicon, a catalyst, an antioxidant, and a cross-linking agent; Among them, the weight ratio of the siloxane compound, nano-ceramics, thermistor, silicon, catalyst, antioxidant, and cross-linking agent is (8-10):(2-3):(1-2):(80-89):(0.8-1.2):(0.8-1.2):(0.8-1.2).

[0029] In the thermal conductive silicone gasket provided by the present disclosure, the siloxane compound lays the foundation performance, endowing the gasket with flexibility and chemical stability; the nano-ceramics, with high thermal conductivity, build an efficient heat conduction path in the matrix, greatly improving the thermal conductivity coefficient; the thermistor enables the gasket to have temperature response characteristics and can intelligently adjust heat dissipation with temperature; silicon enhances stability and mechanical properties and assists in heat conduction; the catalyst accelerates cross-linking, builds a stable structure and improves performance; the antioxidant prevents oxidation and extends the service life; the cross-linking agent promotes cross-linking of molecular chains, enhancing strength, heat resistance, etc.; each component complements each other and synergistically realizes efficient heat dissipation and stable durability.

[0030] Preferably, the weight ratio of the siloxane compound, nano-ceramics, thermistor, silicon, catalyst, antioxidant, and cross-linking agent is (9-10):(2.5-3):(1.2-2):(82-86):(1-1.2):(1-1.2):(1-1.2).

[0031] The present disclosure finds a balance among various properties such as thermal conductivity, mechanical properties, flexibility, and stability by optimizing the weight ratio of each component to meet the requirements of gasket performance in different application scenarios.

[0032] Optionally, the siloxane compound includes at least one of methyl vinyl siloxane, methyl silicone, fluorosilicone, and phenyl methyl silicone; The nano-ceramics include alumina and / or silicon carbide; The thermistor includes E-hBN; The catalyst includes platinum(0)-1,3-divinyl-1,1,3,3-tetramethyldisiloxane; The antioxidant includes 2,6-di-tert-butyl-4-methylphenol; The crosslinking agent includes Pt and / or di-tert-butyl peroxide.

[0033] Under this preferred condition, the co-action of each component further improves the thermal conductivity of the thermal conductive silicone gasket.

[0034] Preferably, the purity of the siloxane compound is not less than 98%; the purity of the nano-ceramics is not less than 98.5%; the purities of the thermistor, silicon, catalyst, antioxidant and crosslinking agent are each independently not less than 99.9%.

[0035] When the purity of the siloxane compound is not less than 98%, the stability and consistency of the material properties can be ensured. The high-purity siloxane compound reduces the interference of impurities on its chemical structure and physical properties. For example, impurities may affect the crosslinking reaction of the siloxane compound, resulting in incomplete crosslinking or the formation of an uneven crosslinked structure. While the high-purity material can ensure that the siloxane compound can react as expected during the preparation of the thermal conductive silicone gasket, thereby obtaining a gasket with good flexibility, elasticity and chemical stability.

[0036] The purity of the nano-ceramics not less than 98.5% helps to improve its thermal conductivity and stability in the thermal conductive silicone gasket. The high-purity nano-ceramics can avoid the adsorption of impurities on the surface of ceramic particles or the reaction with ceramic particles, thus ensuring that more efficient thermal conduction paths can be formed in the siloxane compound matrix.

[0037] The purity of the thermistor, silicon, catalyst, antioxidant, and crosslinking agent is independently not less than 99.9%, which is crucial for the function of the thermal conductive silicone gasket. When the temperature changes, the high-purity thermistor can accurately change its own resistance value, thereby effectively adjusting the thermal conductivity coefficient of the thermal conductive silicone gasket and achieving an intelligent response to temperature. For silicon, high purity ensures that it can better cooperate with other components, enhancing the stability and mechanical properties of the thermal conductive silicone gasket while assisting in heat conduction. During the interaction between high-purity silicon and siloxane compounds, it can more effectively optimize the microstructure of the material, avoid structural defects caused by impurities, and ensure the stability and efficiency of the gasket during the heat dissipation process. In addition, high-purity catalyst can ensure the stability and high efficiency of its catalytic activity. If the catalyst contains impurities, it may lead to a decrease in catalytic activity, a slowdown in the reaction rate, and even the occurrence of side reactions, affecting the performance of the final material. For example, during the synthesis of organosilicon rubber, high-purity catalyst can ensure that siloxane monomers polymerize more quickly and completely, forming a silicone rubber matrix with excellent properties, thus affecting the overall performance of the thermal conductive silicone gasket. During the use of the material, especially under conditions such as high temperature and light, the material is prone to oxidation reaction, aging, and performance degradation. High-purity antioxidant can more effectively capture free radicals and inhibit the occurrence of oxidation reactions. In the thermal conductive silicone gasket, the purity of the crosslinking agent affects the degree and uniformity of the crosslinking reaction. High-purity crosslinking agent can ensure the smooth progress of the crosslinking reaction and form a uniform and stable crosslinking network.

[0038] More preferably, the siloxane compound is methyl vinyl siloxane, and the molecular weight of the methyl vinyl siloxane is 1000 - 1400.

[0039] In this preferred embodiment, using methyl vinyl siloxane as an important component in the thermal conductive silicone gasket effectively improves the ozone resistance aging and cold resistance flexibility of the thermal conductive silicone gasket, and further improves the thermal conductivity of the thermal conductive silicone gasket.

[0040] On the other hand, the present disclosure provides a preparation method of a thermal conductive silicone gasket, and the preparation method includes the following steps: S1. First mix the siloxane compound, nano-ceramics, thermistor, silicon, and antioxidant to obtain a first mixture; S2. Second mix the first solvent containing the catalyst with the first mixture to obtain a second mixture; S3. Sequentially perform degassing, crosslinking, condensation, forming, and curing treatments on the second mixture; The crosslinking treatment includes adding a crosslinking agent to the second mixture; Among them, the weight ratio of the siloxane compound, nano-ceramic, thermistor, silicon, catalyst, antioxidant, and cross-linking agent is (8 - 10):(2 - 3):(1 - 2):(80 - 89):(0.8 - 1.2):(0.8 - 1.2):(0.8 - 1.2).

[0041] The siloxane compound, nano-ceramic, thermistor, silicon, and antioxidant are subjected to a first mixing. The siloxane compound serves as the base polymer, providing flexibility and chemical stability to the gasket. The nano-ceramic constructs a heat conduction path by virtue of its high thermal conductivity. The thermistor imparts temperature response characteristics to the gasket. Silicon enhances stability and aids in heat conduction. The antioxidant prevents the material from oxidizing and aging. This step initially blends these key raw materials, laying the foundation for the subsequent formation of a uniform and excellent-performance mixture. Through specific mixing methods, such as controlling conditions like stirring speed and time, the raw materials begin to come into contact and disperse at the microscopic level, initially forming a stable system.

[0042] Preferably, the weight ratio of the siloxane compound, nano-ceramic, thermistor, silicon, catalyst, antioxidant, and cross-linking agent is (9 - 10):(2.5 - 3):(1.2 - 2):(82 - 86):(1 - 1.2):(1 - 1.2):(1 - 1.2).

[0043] The present disclosure finds a balance among various properties such as thermal conductivity, mechanical properties, flexibility, and stability by optimizing the weight ratios of the components to meet the requirements of gasket performance in different application scenarios.

[0044] Optionally, the siloxane compound includes at least one of methyl vinyl siloxane, methyl silicone, fluorosilicone, and phenyl methyl silicone; The nano-ceramic includes alumina and / or silicon carbide; The thermistor includes E-hBN; The catalyst includes platinum(0)-1,3-divinyl-1,1,3,3-tetramethyldisiloxane; The antioxidant includes 2,6-di-tert-butyl-4-methylphenol; The cross-linking agent includes Pt and / or di-tert-butyl peroxide; The first solvent includes toluene and / or xylene.

[0045] Optionally, the purity of the siloxane compound is not less than 98%; The purity of the nano-ceramic is not less than 98.5%; The purities of the thermistor, silicon, catalyst, antioxidant, and cross-linking agent are each independently not less than 99.9%.

[0046] Optionally, the siloxane compound is methylvinylsiloxane, and the molecular weight of the methylvinylsiloxane is 1000 - 1400.

[0047] The conditions for the first mixing and the second mixing in the present disclosure are the mixing conditions commonly used in the art, enabling the components such as siloxane compounds, nano-ceramics, thermistors, silicon, and antioxidants to quickly and fully contact and disperse with each other. The first mixing includes mechanically stirring siloxane compounds, nano-ceramics, thermistors, silicon, and antioxidants in a planetary mixer or a kneader until the materials are evenly mixed. The second mixing includes mechanically stirring the first solvent containing a catalyst with the first mixture to make them fully mixed.

[0048] Optionally, the exhaust treatment adopts the conventional conditions and operation methods in the art. For example, by using a vacuum degassing machine, within a reasonable vacuum degree, treatment time, and appropriate temperature range, it is possible to avoid the accumulation of materials at the bottom of the container and ensure the exhaust uniformity.

[0049] Optionally, the conditions for the cross-linking treatment include: adding a cross-linking agent to the second mixture after the exhaust treatment and cross-linking at 140 - 160 °C for 25 - 35 min; within this defined range, it can ensure that the cross-linking reaction proceeds at an appropriate rate, forming sufficient cross-linking structures between the molecular chains of siloxane compounds, etc., and enhancing the mechanical properties and thermal stability of the gasket.

[0050] Optionally, the conditions for the condensation treatment include: condensing at -22 ~ -18 °C for 25 - 35 min; within this defined range, it can make the molecular chains in the mixture gradually arrange in an orderly manner, preparing for subsequent molding.

[0051] Optionally, the conditions for the molding treatment include: molding at 140 - 160 °C and 8 - 12 bar for 8 - 12 min; within this defined range, it can ensure that the gasket is fully shaped in the mold and avoid deformation problems after demolding.

[0052] Optionally, the conditions for the curing treatment include: molding at 140 - 160 °C and 8 - 12 bar for 8 - 12 min; within this defined range, it can ensure that the curing reaction is fully completed, enabling the gasket to reach the best physical and chemical properties.

[0053] On the other hand, the present disclosure provides a thermally conductive silicone gasket prepared by the above preparation method.

[0054] On the other hand, the present disclosure provides the application of the above thermally conductive silicone gasket in the preparation of heat dissipation devices for electronic devices.

[0055] On the other hand, the present disclosure provides the application of the above thermally conductive silicone gasket in the preparation of in-vehicle charging power devices.

[0056] The present invention will be further described in detail by way of examples below.

[0057] The materials used in this disclosure are all commercially available. Specifically, the CAS number of methylvinylsiloxane is 68037-59-2; the CAS numbers of nano-ceramics (SiC / Al 2 O 3 ) are SiC: 409-21-2 and Al 2 O 3 : 1344-28-1; the CAS number of the thermistor E-hBN is 10043-11-5; the CAS number of silicon is 7440-21-3; the CAS number of the catalyst (platinum(0)-1,3-divinyl-1,1,3,3-tetramethyldisiloxane) is 68478-92-2; the CAS number of the antioxidant (2,6-di-tert-butyl-4-methylphenol) is 128-37-0; the CAS number of the crosslinking agent (platinum) is 7440-06-4.

[0058] Example 1 This example provides a thermally conductive silicone gasket and its preparation method. The preparation process is as follows: S1. First, mix methylvinylsiloxane, SiC / Al 2 O 3 , E-hBN, silicon, and the antioxidant to obtain a first mixture. S2. Second, mix the first mixture with a first solvent (toluene) containing the catalyst to obtain a second mixture. S3. Then, perform degassing, crosslinking, condensation, molding, and curing treatments on the second mixture in sequence. The crosslinking treatment includes: adding a Pt crosslinking agent to the second mixture after degassing treatment, and crosslinking at 150°C for 30 minutes. The condensation treatment includes: condensing at -20°C for 30 minutes. The molding treatment includes: molding at 150°C and 10 bar for 10 minutes. The curing treatment includes: curing at 150°C for 30 minutes. A composite silicone thermally conductive gasket is prepared. The specific components and their ratios are shown in Table 1 as follows: Table 1 Components and Their Ratios

[0059] Example 2 This example has the same preparation process as Example 1, except that the component ratios are different. The specific components and their ratios are shown in Table 2 as follows: Table 2 Components and Their Ratios

[0060] Example 3 This example has the same preparation process as Example 1, except that the component ratios of each group are different. The specific components and their ratios of each group are shown in Table 3: Table 3 Components and Their Ratios

[0061] Comparative Example 1 The formula of the thermal conductive silicone gasket in this comparative example is as follows: vinyl-terminated silicone oil: 7%; hydrogen-containing silicone oil: 6%; silicon: 86.20%, inhibitor butylated hydroxytoluene: 0.3%, Pt catalyst: 0.5%. Ordinary silicone was prepared.

[0062] Test Example 1 This test example carried out the thermal conductivity test according to the standard of ASTM D5470. The results are shown in Table 4: Table 4 Determination of Thermal Conductivity

[0063] Test Example 2 This test example carried out the thermal conduction performance test and heat dissipation simulation test on the thermal conductive silicone gaskets prepared in Examples 1-3 and Comparative Example 1, simulating the working conditions in the actual application scenario. The chip heating power is 22W, the thickness of the thermal conductive pad is 0.4mm, the bottom is a water-cooled plate with a thickness of 1.5mm, the flow rate is 3L / min, and its fluid is a water-ethylene glycol aqueous solution. The internal water circuit is shown in the following figure. Under the same simulated working conditions, the heat dissipation analysis of the thermal conductive silicone gaskets prepared in the above Examples 1-3 and Comparative Example 1 was carried out, and the measurement was carried out at 30°C to 150°C. The results are shown in Table 5 and Figures 1-4 as shown below.

[0064] Table 5 Heat Dissipation Analysis

[0065] From the above Table 5 and Figures 1-4 It can be seen that from the analysis of the temperature distribution level of the thermal conductive silicone gasket prepared in the embodiments of the present disclosure, the surface temperature distribution of the gasket is relatively uniform, and there is only a small range of high-temperature areas near the heat source. Moreover, as the distance from the heat source increases, the temperature drops rapidly, indicating that it has good heat conduction ability, can quickly and evenly spread the heat, and effectively avoid the local accumulation of heat.

[0066] In addition, the heat flux density distributions of different materials are different, and the heat dissipation performances of the formulation schemes of Embodiments 1-3 of the present disclosure are all higher than those of ordinary silicone pads; from the perspective of material formulation, as the formulation of the positive temperature coefficient material increases, the thermal conductivity also increases; the temperature rise shows a gradually decreasing trend from the product of Embodiment 1 to the product of Embodiment 3. Generally speaking, the thermally conductive silicone gasket prepared in the embodiments of the present disclosure exhibits excellent heat dissipation performance under the simulated heat source and environmental conditions.

[0067] The preferred embodiments of the present disclosure have been described in detail above. However, the present disclosure is not limited to the specific details in the above embodiments. Within the scope of the technical concept of the present disclosure, various simple modifications can be made to the technical solutions of the present disclosure, and these simple modifications all fall within the protection scope of the present disclosure. In addition, it should be noted that, among the various specific technical features described in the above specific embodiments, they can be combined in any suitable manner without conflict. To avoid unnecessary repetition, the present disclosure will not separately describe various possible combination methods.

[0068] In addition, any combination can be made among various different embodiments of the present disclosure as long as it does not violate the idea of the present disclosure, and it should also be regarded as the content disclosed by the present disclosure.

Claims

1. A thermally conductive silicone gasket, characterized in that: The thermally conductive silicone gasket comprises a siloxane compound, nano-ceramics, a thermistor, silicon, a catalyst, an antioxidant and a cross-linking agent; The weight ratio of the siloxane compound, nano-ceramic, thermistor, silicon, catalyst, antioxidant and cross-linking agent is (8-10): (2-3): (1-2): (80-89): (0.8-1.2): (0.8-1.2): (0.8-1.2).

2. The thermally conductive silicone gasket according to claim 1, wherein: The weight ratio of the siloxane compound, nano-ceramic, thermistor, silicon, catalyst, antioxidant and cross-linking agent is (9-10): (2.5-3): (1.2-2): (82-86): (1-1.2): (1-1.2): (1-1.2).

3. The thermally conductive silicone gasket according to claim 1, wherein: The siloxane compound includes at least one of methylvinylsiloxane, methylsilicone, fluorosilicone and phenylmethylsilicone; The nano-ceramic includes aluminum oxide and / or silicon carbide; The thermistor comprises E-hBN; The catalyst includes platinum (0)-1,3-divinyl-1,1,3,3-tetramethyldisiloxane; The antioxidant includes 2,6-di-tert-butyl-4-methylphenol; The cross-linking agent includes Pt and / or di-tert-butyl peroxide.

4. The thermally conductive silicone gasket according to claim 3, wherein: The purity of the siloxane compound is not less than 98%; The purity of the nano-ceramic is not less than 98.5%; The purity of the thermistor, silicon, catalyst, antioxidant and cross-linking agent is independently not less than 99.9%.

5. The thermally conductive silicone gasket according to claim 3, wherein: The siloxane compound is methylvinylsiloxane, and the molecular weight of the methylvinylsiloxane is 1000-1400.

6. A method for preparing a thermally conductive silicone gasket, characterized in that: The preparation method comprises the following steps: S1, first mixing a siloxane compound, a nano-ceramic, a thermistor, silicon and an antioxidant to obtain a first mixture; S2, performing a second mixing of the first solvent containing the catalyst and the first mixture to obtain a second mixture; S3, sequentially performing exhaust, cross-linking, coagulation, molding, and curing treatments on the second mixture; The cross-linking treatment comprises adding a cross-linking agent to the second mixture; The weight ratio of the siloxane compound, nano-ceramic, thermistor, silicon, catalyst, antioxidant and cross-linking agent is (8-10): (2-3): (1-2): (80-89): (0.8-1.2): (0.8-1.2): (0.8-1.2).

7. The preparation method according to claim 6, wherein: The weight ratio of the siloxane compound, nano-ceramic, thermistor, silicon, catalyst, antioxidant and cross-linking agent is (9-10): (2.5-3): (1.2-2): (82-86): (1-1.2): (1-1.2): (1-1.2).

8. The preparation method according to claim 6, wherein: The cross-linking treatment conditions include: adding a cross-linking agent to the second mixture after the exhaust gas treatment, and cross-linking at 140-160° C. for 25-35 minutes; The condensation treatment conditions include: condensation at -22 to -18°C for 25 to 35 minutes; The molding treatment conditions include: molding treatment at 140-160°C and 8-12 bar for 8-12 minutes; The curing conditions include: curing at 140-160° C. for 25-35 minutes.

9. The preparation method according to claim 6, wherein: The siloxane compound includes at least one of methylvinylsiloxane, methylsilicone, fluorosilicone and phenylmethylsilicone; The nano-ceramic includes aluminum oxide and / or silicon carbide; The thermistor comprises E-hBN; The catalyst includes platinum (0)-1,3-divinyl-1,1,3,3-tetramethyldisiloxane; The antioxidant includes 2,6-di-tert-butyl-4-methylphenol; The cross-linking agent includes Pt and / or di-tert-butyl peroxide; The first solvent includes toluene and / or xylene.

10. The preparation method according to claim 9, wherein: The purity of the siloxane compound is not less than 98%; The purity of the nano-ceramic is not less than 98.5%; The purity of the thermistor, silicon, catalyst, antioxidant and cross-linking agent is independently not less than 99.9%.

11. The preparation method according to claim 9, wherein: The siloxane compound is methylvinylsiloxane, and the molecular weight of the methylvinylsiloxane is 1000-1400.

12. The thermally conductive silicone gasket prepared by the preparation method according to any one of claims 6 to 11.

13. Use of the thermally conductive silicone gasket described in any one of claims 1 to 5 and / or claim 12 in preparing a heat dissipation device for electronic equipment.

14. Use of the thermally conductive silicone gasket described in any one of claims 1 to 5 and / or claim 12 in the preparation of a power device for an on-board charger.

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