Heat dissipation system, heat dissipation control method and device, electronic equipment and storage medium

Abstract

The invention provides a heat dissipation system, a heat dissipation control method and device, electronic equipment and a storage medium, and is applied to the technical field of electric signal processing. The system comprises a heat dissipation device, a heating sheet and a substrate management controller; the substrate management controller is used for acquiring the power consumption, the first temperature information, the second temperature information and the third temperature information of the chip; controlling the temperature of the heating sheet based on the power consumption of the chip, the first temperature information, the second temperature information and the third temperature information so as to control the temperature of the heat dissipation device; and under the condition that the superheat degree of the surface of the heat dissipation device reaches the boiling starting condition of the condensate, the at least one chip is cooled through boiling of the condensate. Thus, under the condition that the temperature of the chip rises but is not transmitted to the heat dissipation device, the heat dissipation device is heated based on the heating sheet in advance to trigger the boiling reaction, the temperature of the chip is reduced, and damage caused by too high internal temperature of the chip is avoided.

Description

Technical Field

[0001] The present disclosure relates to the technical field of electrical signal processing, and in particular, to a heat dissipation system, a heat dissipation control method, a device, an electronic device, and a storage medium. Background Art

[0002] Liquid cooling technology, especially immersion liquid cooling technology, will gradually become the mainstream heat dissipation technology for future data centers. The immersion liquid cooling technology adopts the method of directly immersing the server in the condensate, and the heat on the surface of the component is taken away by the heat exchange between the heating element of the server and the condensate, so as to reduce the temperature of the heating element and ensure the normal operation of the server system. The immersion liquid cooling technology is further divided into single-phase immersion liquid cooling technology and two-phase immersion liquid cooling technology according to the differences in the boiling point of the condensate used and the heat transfer method. The condensate of the single-phase immersion cooling system mainly takes away the heat of the heating device through circulating convection heat transfer, and the two-phase immersion cooling system mainly relies on the boiling and vaporization of the condensate with a lower boiling point to take away the heat of the device. The two-phase immersion liquid cooling technology relies on boiling heat transfer and has a higher heat flux density and heat dissipation limit, which is the focus of the future development of the immersion liquid cooling technology.

[0003] In a two-phase immersion liquid cooled server, when the loads of chips such as the Central Processing Unit (CPU) and the Graphics Processing Unit (GPU) increase sharply, the power consumption increases instantaneously, and the Die temperatures of the CPU, GPU and other chips increase sharply. However, the temperature rise from the chip Die to the chip housing and the surface of the radiator does not increase as fast as the chip power consumption and the internal Die temperature of the chip, and there is a lag in the increase of the radiator surface temperature. After the chip load increases sharply, the temperature conducted to the radiator surface does not rise in time. At this time, the superheat degree on the surface of the radiator in the two-phase immersion liquid cooled server is relatively low, the thermal resistance of the radiator is very high, and the temperature of the chip Die will accumulate very high in a short time. If boiling has not occurred at this time, the heat of the chip cannot be conducted out in time, and the high temperature may cause chip damage. Summary of the Invention

[0004] The present disclosure provides a heat dissipation system, a heat dissipation control method, a device, an electronic device, and a storage medium to at least solve the above technical problems existing in the prior art.

[0005] According to a first aspect of the present disclosure, a heat dissipation system is provided, and the system includes: a cavity (1); Inside the cavity 1, there are condensate 2, a printed circuit board 11, a chip 12, a heat dissipation device 13, a heating sheet 14, and a baseboard management controller 15; the condensate 2 submerges the printed circuit board 11, at least one chip 12, the heat dissipation device 13, the heating sheet 14, and the baseboard management controller 15; The printed circuit board 11 is arranged on the inner wall of the cavity 1, and the baseboard management controller 15 and at least one chip 12 are arranged thereon; The first side of the heat dissipation device 13 is attached to at least one chip 12, and is used to dissipate heat for at least one chip 12 through heat transfer with at least one chip 12; the second side of the heat dissipation device 13 is in contact with the condensate 2; The heating sheet 14 is partially attached to the second side of the heat dissipation device 13, and the heat dissipation device 13 includes a first temperature sensor 101, a second temperature sensor 102, and a third temperature sensor 103; The first temperature sensor 101 and the second temperature sensor 102 are arranged inside the heat dissipation device 13, in different vertical planes, and the distances from the first side of the heat dissipation device 13 are the first distance and the second distance respectively. The first temperature information obtained by the first temperature sensor 101 and the second temperature information obtained by the second temperature sensor 102 are used to determine the thermal resistance of the heat sink 135 corresponding to the heat dissipation device; The third temperature sensor is arranged inside the heat dissipation device 13, and the distance from the heating sheet 14 is less than the first preset threshold, and is used to obtain the third temperature information of the heating sheet 14; The baseboard management controller 15 is used to obtain the power consumption of the chip 12, the first temperature information, the second temperature information, and the third temperature information; control the temperature of the heating sheet 14 based on the power consumption of the chip 12, the first temperature information, the second temperature information, and the third temperature information, so as to control the temperature of the heat dissipation device 13; when the surface temperature of the second side of the heat dissipation device 13 reaches the boiling start condition of the condensate 2, cool down the heat dissipation device 13 through the boiling of the condensate 2.

[0006] In the above solution, the system further includes a condensate pipe 203, a condensate pipe liquid outlet 201, and a condensate pipe liquid inlet 202; The condensate pipe 203 includes a coolant 3.

[0007] In the above solution, the condensate 2 is in direct contact with the heat dissipation device 13; After the condensate 2 absorbs the heat on the surface of the heat dissipation device 13, it undergoes a phase change to generate steam; after the steam contacts the condensate pipe 203, it cools down and condenses into droplets and falls back.

[0008] In the above solution, the coolant 3 includes water or ethanol.

[0009] In the above solution, the condensate 2 includes a fluorinated liquid.

[0010] In the above solution, a soft thermal conductor is provided between the surfaces of the fitting portions of the heat dissipation device 13 and the chip 12, including one of thermal paste, thermal graphite sheet, thermal gel, phase change thermal pad or soft metal.

[0011] In the above solution, the heat dissipation device includes a heat sink 135; The heat sink 135 includes a rectangular recess, and the heating sheet 14 is embedded in the rectangular recess.

[0012] In the above solution, the area of the first region where the heating sheet 14 is in contact with the heat dissipation device is smaller than the area of the second side of the heat dissipation device; The distance between the first temperature sensor 101 and the first region is greater than the first distance threshold; The distance between the second temperature sensor 102 and the first region is greater than the second distance threshold.

[0013] In the above solution, the baseboard management controller 15 is specifically configured to: In response to the power consumption rising rate of the chip 12 being greater than the second preset threshold and the thermal resistance of the heat sink 135 being greater than the preset boiling thermal resistance, obtain the third temperature information of the heating sheet 14, and control the temperature of the heating sheet 14 to rise, so as to increase the temperature of the heat sink 135 through heat transfer; Obtain the fourth temperature information of the heating sheet 14; In response to determining that the temperature dropping rate of the heating sheet 14 based on the third temperature information and the fourth temperature information is greater than the third preset threshold, disconnect the temperature control of the heating sheet 14.

[0014] According to the second aspect of the present disclosure, a heat dissipation control method is provided, which is applied to the baseboard management controller. The method includes: In response to the power consumption rising rate of the chip being greater than the second preset threshold and the thermal resistance of the heat sink being greater than the preset boiling thermal resistance, control the temperature of the heating sheet to rise; Determine the temperature dropping rate of the heating sheet; In response to the temperature dropping rate of the heating sheet being greater than the third preset threshold, disconnect the temperature control of the heating sheet.

[0015] In the above solution, the method further includes: Obtain the first power consumption of the chip at the first moment; Obtain the second power consumption of the chip at the second moment; Based on the first moment, the first power consumption, the second moment and the second power consumption, determine the rising rate of the chip power consumption from the first moment to the second moment.

[0016] In the above solution, the method further includes: Obtain the first temperature information collected by the first temperature sensor; Obtain the second temperature information collected by the second temperature sensor; Determine the thermal resistance of the heat sink 135 based on the first temperature information and the second temperature information.

[0017] In the above solution, the method further includes: If the power consumption rising rate of the chip is less than or equal to the second preset threshold, or the thermal resistance of the heat sink is less than or equal to the preset boiling thermal resistance, then obtain the third power consumption of the chip at the third moment; The third moment is a moment after the first moment or the second moment.

[0018] In the above solution, the method further includes: In response to the temperature decreasing rate of the heating sheet being less than or equal to the third preset threshold, continue to control the temperature of the heating sheet to rise, and obtain the fifth temperature information of the heating sheet.

[0019] According to a third aspect of the present disclosure, there is provided a heat dissipation control device applied to the baseboard management controller. The device includes: A first control unit, configured to control the temperature of the heating sheet to rise in response to the power consumption rising rate of the chip being greater than the second preset threshold and the thermal resistance of the heat sink being greater than the preset boiling thermal resistance; A determination unit, configured to determine the temperature decreasing rate of the heating sheet; A second control unit, configured to disconnect the temperature control of the heating sheet in response to the temperature decreasing rate of the heating sheet being greater than the third preset threshold.

[0020] In the above solution, the device further includes a storage unit, and the storage unit is configured to: Store the second preset threshold, the preset boiling thermal resistance, and the third preset threshold.

[0021] According to a fourth aspect of the present disclosure, there is provided an electronic device, including: At least one processor; and a memory communicatively connected to the at least one processor; wherein, the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute the method of the present disclosure.

[0022] According to a fifth aspect of the present disclosure, there is provided a non-transitory computer-readable storage medium storing computer instructions, and the computer instructions are used to cause the computer to execute the method of the present disclosure.

[0023] The heat dissipation system and heat dissipation control method of the present disclosure can obtain the power consumption, first temperature information, second temperature information, and third temperature information of the chip; control the temperature of the heating sheet based on the power consumption, first temperature information, second temperature information, and third temperature information of the chip to control the temperature of the heat dissipation device; when the superheat degree on the surface of the heat dissipation device reaches the boiling start condition of the condensate, cool down the heat dissipation device through the boiling of the condensate. In this way, when the chip temperature rises but has not been transferred to the heat dissipation device, the heating sheet can be used to heat the heat dissipation device in advance to trigger the boiling reaction, reduce the chip temperature, and avoid damage caused by excessive internal temperature of the chip.

[0024] It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of the present disclosure, nor is it used to limit the scope of the present disclosure. Other features of the present disclosure will become easily understandable through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] By referring to the drawings and reading the following detailed description, the above and other objects, features, and advantages of the exemplary embodiments of the present disclosure will become easily understandable. In the drawings, several embodiments of the present disclosure are shown in an exemplary rather than restrictive manner, where: In the drawings, the same or corresponding reference numerals represent the same or corresponding parts.

[0026] Figure 1 shows an optional structural schematic diagram of the heat dissipation system provided by an embodiment of the present disclosure; Figure 2 shows an optional structural schematic diagram of the heat dissipation device provided by an embodiment of the present disclosure; Figure 3 shows a first optional flowchart of the heat dissipation control method provided by an embodiment of the present disclosure; Figure 4 shows a second optional flowchart of the heat dissipation control method provided by an embodiment of the present disclosure; Figure 5 shows a third optional flowchart of the heat dissipation control method provided by an embodiment of the present disclosure; Figure 6 shows a first optional structural schematic diagram of the heat dissipation control device provided by an embodiment of the present disclosure; Figure 7 shows a second optional structural schematic diagram of the heat dissipation control device provided by an embodiment of the present disclosure; Figure 8 shows a composition structural schematic diagram of an electronic device according to an embodiment of the present disclosure; In the figure, 1 - cavity, 2 - condensate, 3 - coolant, 11 - printed circuit board, 12 - chip, 13 - heat dissipation device, 14 - heating element, 15 - baseboard management controller, 101 - first temperature sensor, 102 - second temperature sensor, 103 - third temperature sensor, 135 - heat sink, 201 - condensate outlet of the condenser tube, 202 - condensate inlet of the condenser tube, 203 - condenser tube. Detailed implementation manners

[0027] To make the objectives, features, and advantages of the present disclosure more apparent and understandable, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present disclosure. Apparently, the described embodiments are only a part rather than all of the embodiments of the present disclosure. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present disclosure.

[0028] In the following description, reference is made to "some embodiments", which describe a subset of all possible embodiments. However, it can be understood that "some embodiments" can be the same subset or different subsets of all possible embodiments, and can be combined with each other without conflict.

[0029] Unless otherwise defined, all technical and scientific terms used in the present disclosure have the same meaning as commonly understood by those skilled in the technical field to which the present disclosure belongs. The terms used in the present disclosure are only for the purpose of describing the embodiments of the present disclosure and are not intended to limit the present disclosure.

[0030] It should be understood that in various embodiments of the present disclosure, the magnitudes of the serial numbers of the various implementation processes do not mean the order of execution, and the order of execution of each process should be determined by its function and internal logic, and should not constitute any limitation to the implementation processes of the embodiments of the present disclosure.

[0031] Figure 1 The optional structural schematic diagram of the heat dissipation system provided by the embodiment of the present disclosure is shown, and will be described according to each part.

[0032] As Figure 1 shown, the heat dissipation system includes a cavity 1, a condensate 2 is arranged in the cavity 1, a printed circuit board 11, a chip 12, a heat dissipation device 13, a heating element 14, and a baseboard management controller 15; the condensate 2 submerges the printed circuit board 11, at least one chip 12, the heat dissipation device 13, the heating element 14, and the baseboard management controller 15.

[0033] In some embodiments, the printed circuit board 11 is disposed on one inner wall of the cavity 1 close to it, and a baseboard management controller 15 and at least one chip 12 are arranged thereon. The printed circuit board 11 can be vertically attached to one inner wall of the cavity 1, and it can be attached to one inner wall of the cavity 1 or there can be a certain gap between it and one inner wall of the cavity 1. The at least one chip 12 can be fixed on the printed circuit board 11 by means such as welding.

[0034] In some embodiments, the first side of the heat dissipation device 13 is in contact with the at least one chip 12, and is used for dissipating heat from the at least one chip 12 through heat transfer with the at least one chip 12.

[0035] In some embodiments, after the temperature of the at least one chip 12 rises, heat is transferred to the heat dissipation device 13. The second side surface of the heat dissipation device 13 is in contact with the condensate 2. When the temperature of the second side surface of the heat dissipation device 13 is greater than the boiling temperature of the condensate 2, the condensate 2 boils and vaporizes to generate steam, taking away the heat of the heat dissipation device 13, and further taking away the heat of the at least one chip 12 to reduce the temperature of the at least one chip 12.

[0036] In some embodiments, the heating sheet 14 is attached to a partial area of the second side of the heat dissipation device 13, and the area of the heating sheet 14 is smaller than the area of the second side of the heat dissipation device 13; that is, the heating sheet only partially heats the second side of the heat dissipation device 13. When the heating sheet 14 heats a partial area of the second side of the heat dissipation device 13, the heat will be transferred to other parts of the heat dissipation device 13 through the part where the heating sheet 14 is in contact with the heat dissipation device 13, so that its temperature rises; in other parts, when the temperature of the part in contact with the condensate 2 is greater than the boiling temperature of the condensate, the condensate 2 boils and vaporizes to generate steam, taking away the heat of the heat dissipation device 13; at the same time, it will also take away the heat of the heating sheet 14, and the temperature of the heating sheet 14 will show a downward trend. When the baseboard management control determines that the temperature of the heating sheet 14 has dropped through a third point near the heating sheet 14, it is determined that the boiling reaction has been triggered, and then the heating of the heat dissipation device 13 by the heating sheet 14 is stopped; subsequently, the temperature of the at least one chip 12 will be transferred to the heat dissipation device 13 to maintain the boiling reaction between the surface of the heat dissipation device 13 and the condensate 2 and continue to dissipate heat.

[0037] Figure 2 The optional structural schematic diagram of the heat dissipation device provided by the embodiment of the present disclosure is shown.

[0038] As Figure 2As shown, the heat dissipation device 13 includes a first temperature sensor 101, a second temperature sensor 102, a third temperature sensor 103, and a heat sink 135; the heat sink 135 is a cuboid including a rectangular recess, the rectangular recess is located on the second side of the heat sink 135, and a heating sheet 14 is arranged at the recess. The heating sheet 14 can be exactly embedded into the rectangular recess, and the area of the first region where the heating sheet 14 contacts the rectangular recess is smaller than the area of the second side of the heat dissipation device; optionally, the area of the first region can be equal to the area where the heating sheet 14 fits with the heat dissipation device 13.

[0039] The first temperature sensor 101, the second temperature sensor 102, and the third temperature sensor 103 are arranged inside the heat sink 135 and are used to collect temperature information at different points inside the heat sink 135. The heat dissipation device 13 is in direct contact with the condensate 2.

[0040] In some embodiments, the distance between the first temperature sensor 101 and the first region is greater than a first distance threshold; the distance between the second temperature sensor 102 and the first region is greater than a second distance threshold. The first distance threshold and the second distance threshold can be set according to actual requirements.

[0041] In some embodiments, as Figure 1 shown, the first point where the first temperature sensor 101 collects temperature information and the second point where the second temperature sensor 102 collects temperature information are arranged on different vertical planes; optionally, the first point and the second point can be arranged on the same horizontal plane, the distance between the first point and the first side of the heat dissipation device 13 is a first distance, and the distance between the second point and the first side of the heat dissipation device 13 is a second distance; and the horizontal planes where the first point and the second point are located are above the horizontal plane corresponding to the highest point of the heating sheet in the vertical direction. Optionally, the minimum distance between the horizontal planes corresponding to the first point and the second point and the horizontal plane corresponding to the highest point of the heating sheet in the vertical direction is greater than a third distance threshold; to reduce the influence of the heating sheet on the temperature information measured by the first temperature sensor 101 and the second temperature sensor 102. The third distance threshold can be set according to actual requirements.

[0042] In some embodiments, the first temperature sensor 101 and the second temperature sensor 102 are used to measure the temperature information at different distances between the heat dissipation device 13 and the chip respectively, and calculate the thermal resistance of the corresponding heat sink 135 of the heat dissipation device based on the temperature information at different distances.

[0043] In some embodiments, the third temperature sensor 103 is disposed inside the heat dissipation device 13, and the distance between the third point at which it collects temperature information and the heating plate 14 is less than a first preset threshold value; optionally, the highest point of the heating plate in the vertical direction corresponds to the first horizontal plane, and the lowest point corresponds to the second horizontal plane, and the third point at which the third temperature sensor 103 collects temperature information is disposed between the first horizontal plane and the second horizontal plane, for obtaining third temperature information of the heating plate 14.

[0044] In some embodiments, the first temperature sensor 101 and the second temperature sensor 102 are used to measure the temperature of the heat sink 13 near the chip. The third temperature sensor 103 is used to measure the temperature of the heat sink 13 near the heating plate 14. The temperature information collected by the first temperature sensor 101, the second temperature sensor 102 and the third temperature sensor 103 are all collected in the baseboard management controller 15.

[0045] In some embodiments, the baseboard management controller 15 obtains the power consumption, first temperature information, second temperature information and third temperature information of any chip in the at least one chip 12; controls the temperature of the heating plate 14 based on the power consumption, first temperature information, second temperature information and third temperature information of the at least one chip 12 to control the temperature of the heat sink 13; when the second side surface temperature of the heat sink 13 (i.e., the heat sink temperature) reaches the boiling starting condition of the condensate 2, the heat sink 13 is cooled by boiling the condensate 2, thereby achieving the heat dissipation of at least one chip 12 by the heat sink 13.

[0046] Specifically, in order to avoid the situation that the temperature of at least one chip 12 has begun to rise but has not been transferred to the heat sink 13 in time, resulting in a hysteresis in heat dissipation, and the heat of at least one chip 12 cannot be transferred out in time, causing damage to the chip, the baseboard management controller 15 determines that the chip has been heated up based on the power consumption of any chip and the thermal resistance of the heat sink 135, and the condensate 2 has not boiled, and then heats the heat sink 13 through the heating plate 14 to increase the surface overheat of the heat sink 13, reduce the thermal resistance of the heat sink 13, and make the surface temperature of the heat sink 13 reach the boiling start condition of the condensate 2, so that bubbles are generated to take away the heat of at least one chip 12. So that before the chip temperature exceeds the boiling temperature or saturation temperature of the condensate 2, the heat sink enters the phase change boiling low thermal resistance mode in advance, and the heat of the chip is transferred out in time, so as to avoid the CPU, GPU and other high-power and high-value chips from being damaged by the sudden and rapid increase in load and the heat cannot be transferred out in time.

[0047] In some embodiments, the heat dissipation system further includes a condensate pipe liquid outlet 201, a condensate pipe liquid inlet 202, and a condensate pipe 203; the condensate pipe contains a coolant 3; after the condensate liquid 2 boils and vaporizes into steam, the steam contacts the condensate pipe 203 and cools down, condensing into droplets and falling back, so that the liquid level of the condensate liquid 2 in the cavity 1 is maintained within a certain range and completely covers the printed circuit board 11.

[0048] In some embodiments, the condensate liquid 2 can be a fluorinated liquid; after the fluorinated liquid absorbs the heat on the surface of the heat dissipation device 13 and undergoes a phase change to generate steam and becomes high-temperature fluorinated liquid steam, the high-temperature fluorinated liquid steam contacts the condensate pipe 203 above the cavity 1 and cools down, and part of it condenses into droplets and falls back.

[0049] In some embodiments, the coolant 3 can include media such as water or ethanol that are easy to obtain and have low costs.

[0050] In some embodiments, a soft thermal conductor is provided between the surfaces of the heat dissipation device 13 and the part in contact with the chip 12, including one of thermal paste, thermal graphite sheet, thermal gel, phase change thermal pad, or soft metal such as indium.

[0051] In some embodiments, all the materials in contact with the condensate liquid 2, such as the cavity 1, the printed circuit board 11, at least one chip 12, the heat dissipation device 13, the heating sheet 14, the condensate pipe 203, and the pipelines in the heat dissipation system, are compatible with the condensate liquid 2.

[0052] In this way, through the heat dissipation system provided by the embodiments of the present disclosure, by fitting and setting a heating sheet on the heat sink, in the case where the chip starts to run but the heat of the chip has not been transferred to the heat sink and the boiling reaction of the condensate liquid cannot be triggered, the heat sink is heated by the heating sheet to trigger the boiling reaction of the condensate liquid in advance, reduce the chip temperature, and avoid damage caused by too high internal temperature of the chip.

[0053] Figure 3 Fig. 1 shows a first optional flowchart of the heat dissipation control method provided by the embodiments of the present disclosure, which will be described according to each part.

[0054] Figure 3 The shown process, that is, steps S301 to S303 are implemented by the baseboard management controller 15.

[0055] In step S301, in response to the power consumption rising rate of the chip being greater than a second preset threshold and the thermal resistance of the heat sink being greater than a preset boiling thermal resistance, control the temperature of the heating sheet to increase.

[0056] In some embodiments, the baseboard management controller may sample the chip, determine the power consumption rising rate of the chip based on the power consumption of the chip obtained by sampling at different times; in response to the power consumption rising rate of the chip being greater than a second preset threshold, it indicates that the chip is in a working state and the temperature is continuously rising. The second preset threshold can be set according to actual requirements or experimental results.

[0057] In some embodiments, the baseboard management controller determines the thermal resistance of the heat sink based on the temperature information collected by the first temperature sensor 101 and the second temperature sensor 102. The heat sink is a part of the heat dissipation device and is in contact with the condensate 2 in the cavity 1.

[0058] In some embodiments, in response to the power consumption rising rate of the chip being greater than a second preset threshold and the thermal resistance of the heat sink being greater than a preset boiling thermal resistance, it indicates that the chip is in a working state, the temperature is continuously rising, but the heat of the chip has not been conducted to the heat sink yet, the temperature of the heat sink is not sufficient to trigger the boiling of the condensate 2, and thus not sufficient to trigger heat dissipation. The temperature of the chip cannot drop and cannot be quickly transferred to the heat dissipation device; then the baseboard management controller controls the temperature of the heating sheet to rise. The heating sheet is attached to the heat sink. After the temperature of the heating sheet rises, heat will be transferred from the heating sheet to the heat sink, raising the temperature of the heat sink, and further making the temperature on the surface of the heat sink higher than the saturation temperature of the condensate 2, causing the part of the condensate 2 in contact with the heat sink to boil, generating bubbles and taking away the heat of the heat sink at the same time; the heat sink is attached to the chip, which will further reduce the temperature of the chip. This enables heat dissipation to be triggered before the temperature of the chip is transferred to the heat sink, achieving the effect of early heat dissipation.

[0059] Step S302, determine the temperature drop rate of the heating sheet.

[0060] In some embodiments, the baseboard management controller collects the temperature information of the heating sheet corresponding to different times through the third temperature sensor, and determines the temperature drop rate of the heating sheet based on the temperature information corresponding to different times.

[0061] Step S303, in response to the temperature drop rate of the heating sheet being greater than a third preset threshold, disconnect the temperature control of the heating sheet.

[0062] In some embodiments, in response to the temperature drop rate of the heating sheet being greater than a third preset threshold, it indicates that the temperature of the heating sheet drops rapidly, a boiling reaction has occurred on the surface of the heat sink, and heat dissipation of the chip has started. The baseboard management controller disconnects the temperature control of the heating sheet. Optionally, the disconnection of the temperature control of the heating sheet may include stopping heating the heating sheet to avoid waste of electric energy caused by excessive heat generation. The fourth temperature threshold can be set according to actual requirements or experimental results.

[0063] In some embodiments, the temperature drop rate of the heating sheet is greater than a third preset threshold, which also indicates that the heat dissipation device enters the boiling phase change low thermal resistance mode. Without heating the heating sheet, the heat generated by the chip can also maintain the boiling state on the surface of the radiator.

[0064] Thus, through the heat dissipation control method provided by the embodiments of the present disclosure, by responding to the power consumption rise rate of the chip being greater than a second preset threshold and the thermal resistance of the heat sink being greater than a preset boiling thermal resistance, the temperature of the heating sheet is controlled to rise; the temperature drop rate of the heating sheet is determined; in response to the temperature drop rate of the heating sheet being greater than a third preset threshold, the temperature control of the heating sheet is disconnected; it is possible to trigger a boiling reaction of the heat dissipation device in advance based on the heating sheet when the chip temperature rises but has not been transferred to the heat dissipation device, reduce the chip temperature, and avoid damage caused by excessive internal temperature of the chip.

[0065] Figure 4 FIG. shows a second optional flowchart of the heat dissipation control method provided by the embodiments of the present disclosure, which will be described according to each step.

[0066] Step S401: Based on the first moment, the first power consumption, the second moment, and the second power consumption, determine the rise rate of the chip power consumption from the first moment to the second moment.

[0067] In some embodiments, the baseboard management controller obtains the first power consumption of the chip at the first moment and the second power consumption of the chip at the second moment; based on the first moment, the first power consumption, the second moment, and the second power consumption, determine the rise rate of the chip power consumption from the first moment to the second moment.

[0068] In some embodiments, the baseboard management controller can sample the power consumption of the chip at a certain frequency, and the frequency can be set according to actual requirements or experimental results.

[0069] In some embodiments, the baseboard management controller can determine the power consumption difference between the second power consumption and the first power consumption, and the first time difference between the second moment and the first moment, and determine the rise rate of the chip power consumption from the first moment to the second moment based on the quotient of the power consumption difference and the first time difference.

[0070] Step S402: Determine the thermal resistance of the heat sink based on the first temperature information and the second temperature information.

[0071] In some embodiments, the baseboard management controller respectively obtains the first temperature information based on the first temperature sensor, obtains the second temperature information based on the second temperature sensor, and determines the thermal resistance of the heat sink based on the first temperature information and the second temperature information.

[0072] In some embodiments, such as Figure 1As shown, the first temperature sensor and the second temperature sensor are used to obtain temperature information at different distances from the chip, respectively.

[0073] In some embodiments, the baseboard management controller determines the heat flux (in watts) based on the first temperature information, the second temperature information, the thermal conductivity of the heat sink, the distance between the first point where the first temperature sensor collects temperature information and the second point where the second temperature sensor collects temperature information, and the cross-sectional area perpendicular to the heat flow direction; and determines the thermal resistance of the heat sink based on the ratio of the difference between the second temperature information and the first temperature information to the heat flux.

[0074] Step S403: In response to the power consumption rising rate of the chip being greater than the second preset threshold and the thermal resistance of the heat sink being greater than the preset boiling thermal resistance, control the temperature of the heating sheet to increase.

[0075] In some embodiments, when the baseboard management controller responds to the power consumption rising rate of the chip being greater than the second preset threshold and the thermal resistance of the heat sink being greater than the preset boiling thermal resistance, it indicates that the chip is in a working state and the temperature is continuously rising. However, the heat of the chip has not been conducted to the heat sink yet, the temperature of the heat sink is not sufficient to trigger the boiling of the condensate 2, and thus not sufficient to trigger heat dissipation. The temperature of the chip cannot decrease and cannot be quickly transferred to the heat dissipation device. Then the baseboard management controller controls the temperature of the heating sheet to increase. The heating sheet is attached to the heat sink. After the temperature of the heating sheet increases, heat will be transferred from the heating sheet to the heat sink, raising the temperature of the heat sink. Furthermore, the temperature on the surface of the heat sink is made higher than the saturation temperature of the condensate 2, causing the part of the condensate 2 in contact with the heat sink to boil, generating bubbles and taking away the heat of the heat sink at the same time. The heat sink is attached to the chip, which will further reduce the temperature of the chip. This enables heat dissipation to be triggered before the temperature of the chip is transferred to the heat sink, achieving the effect of early heat dissipation.

[0076] In other embodiments, in response to the power consumption rising rate of the chip being less than or equal to the second preset threshold, or the thermal resistance of the heat sink being less than or equal to the preset boiling thermal resistance, obtain the third power consumption of the chip at the third moment, and determine the thermal resistance of the heat sink based on the temperature information collected by the first temperature sensor and the second temperature sensor; until the power consumption rising rate of the chip is greater than the second preset threshold and the thermal resistance of the heat sink is greater than the preset boiling thermal resistance, execute step S403. The third moment is a moment after the first moment or the second moment.

[0077] Step S404: Determine the temperature decrease rate of the heating sheet based on the third temperature sensor.

[0078] In some embodiments, after the base control manager heats the heating sheet, it obtains the temperature collected by the third temperature sensor at a certain sampling frequency, and determines the temperature decrease rate of the heating sheet based on the temperature information collected at any two moments.

[0079] In some embodiments, the baseboard management controller may respectively obtain the temperature information T1 collected by the third temperature sensor at the fourth moment and the temperature information T2 collected at the fifth moment; based on the difference between the temperature information T1 and the temperature information T2, and the time difference between the fourth moment and the fifth moment, determine the temperature drop rate of the heating sheet from the fourth moment to the fifth moment.

[0080] Step S405, determine whether the temperature drop rate of the heating sheet is greater than a third preset threshold.

[0081] In some embodiments, if the temperature drop rate of the heating sheet is greater than the third preset threshold, then step S406 is executed; if the temperature drop rate of the heating sheet is less than or equal to the third preset threshold, the baseboard management controller continues to heat the heat sink based on the heating sheet and executes step S404: that is, in response to the temperature drop rate of the heating sheet being less than or equal to the third preset threshold, continue to control the temperature of the heating sheet to rise, and obtain the fifth temperature information of the heating sheet, where the fifth temperature information is used to determine the temperature drop rate of the heating sheet.

[0082] Step S406, disconnect the temperature control of the heating sheet.

[0083] In some embodiments, in response to the temperature drop rate of the heating sheet being greater than the third preset threshold, it indicates that the temperature of the heating sheet drops rapidly, a boiling reaction has occurred on the surface of the heat sink, and the chip starts to be cooled. The baseboard management controller disconnects the temperature control of the heating sheet. Optionally, the disconnecting the temperature control of the heating sheet may include stopping heating the heating sheet to avoid waste of electric energy caused by excessive heat generation. The fourth temperature threshold can be set according to actual needs or experimental results.

[0084] In some embodiments, that the temperature drop rate of the heating sheet is greater than the third preset threshold also indicates that the heat dissipation device enters the boiling phase change low thermal resistance mode, and there is no need to heat the heating sheet, and the heat generated by the chip can also maintain the boiling state on the surface of the radiator.

[0085] In this way, through the heat dissipation control method provided by the embodiments of the present disclosure, by responding to the power consumption increase rate of the chip being greater than the second preset threshold and the thermal resistance of the heat sink being greater than the preset boiling thermal resistance, control the temperature of the heating sheet to rise; determine the temperature drop rate of the heating sheet; in response to the temperature drop rate of the heating sheet being greater than the third preset threshold, disconnect the temperature control of the heating sheet; it is possible to trigger a boiling reaction in advance based on the heating sheet for the heat dissipation device to reduce the chip temperature and avoid damage caused by too high internal temperature of the chip when the chip temperature rises but has not been transferred to the heat dissipation device.

[0086] Figure 5The third alternative process schematic diagram of the heat dissipation control method provided by the embodiments of the present disclosure is shown, and will be described according to each step.

[0087] S501, the BMC calculates the power consumption rising rate k of the chip and the thermal resistance Rt of the heat sink.

[0088] In some embodiments, when the load of high-power chips such as the CPU and GPU suddenly increases, the power consumption and temperature of the chips increase accordingly; the baseboard management controller reads the power consumption of at least one chip, compares it with the power consumption at the previous moment, and calculates the power consumption rising rate k; reads the temperature information of the first temperature sensor and the second temperature sensor in the heat dissipation device where the acquisition point is close to the chip, and calculates the thermal resistance Rt of the heat sink.

[0089] Step S502, determine whether the power consumption rising rate is greater than the second preset threshold and whether the thermal resistance is greater than the preset boiling thermal resistance.

[0090] In some embodiments, when the power consumption rising rate k is greater than the second preset threshold k0 and the thermal resistance Rt is greater than the preset boiling thermal resistance Rt0, step S503 is executed; otherwise, if the condition that the power consumption rising rate k is greater than the second preset threshold k0 and the thermal resistance Rt is greater than the preset boiling thermal resistance Rt0 is not satisfied, the BMC continues to read the power consumption, and the preheating sheet is not started, that is, step S501 is executed.

[0091] Step S503, start the heating sheet to preheat the surface of the radiator.

[0092] In some embodiments, the baseboard management controller starts the heating sheet on the lower side of the heat dissipation device to preheat the surface of the heat dissipation device.

[0093] Step S504, the baseboard management controller obtains the temperature information collected by the third temperature sensor.

[0094] Boiling heat transfer is closely related to the generation and detachment of bubbles. The conditions for bubble formation are: the cooling medium must be superheated; there must be a vaporization core. The superheating of the cooling medium means that the temperature of the heating wall surface must be higher than the saturation temperature of the condensate (the saturation temperature of the condensate is a physical property of the condensate and is a fixed value). That is, the temperature of the wall surface of the heat sink in contact with the condensate must be higher than the saturation temperature of the condensate; the saturation temperature of the condensate is a physical characteristic and is a fixed value.

[0095] Specifically, the condensate needs a certain degree of superheat to form bubbles on the solid surface it contacts (usually 1–10°C, depending on the condensate and the surface characteristics). For example, if the saturation temperature of the condensate is 50°C, the surface of the heat sink must reach above 51°C before boiling begins. When the surface superheat of the heat sink is insufficient (e.g., only 0.5°C), only natural convection occurs, and the heat transfer capacity is low. When the surface superheat of the heat sink is within a certain range, that is, a moderate superheat (e.g., 5–30°C), efficient nucleate boiling occurs, and bubbles are quickly generated and detached, taking away a large amount of heat.

[0096] Among them, surface superheat = heating wall temperature - condensate liquid saturation temperature.

[0097] In some embodiments, the baseboard management controller reads temperature information read by the third temperature sensor at a third point to obtain the temperature of the heating plate.

[0098] In some embodiments, as the heating plate heats the heat sink, the surface superheat of the heat sink increases, vaporization cores begin to appear, and a boiling reaction occurs.

[0099] Then, the surface of the heat sink comes into contact with the condensate, which boils. The boiling and vaporization of the electronic fluoride liquid will quickly take away a large amount of heat from the heat sink, causing the temperature of the heat sink to drop sharply. At this time, the heat dissipation process has been started and the heating plate can be stopped from heating the heat sink.

[0100] Step S505 : the baseboard management controller reads the temperature information acquired by the third temperature sensor, and in response to a sharp drop in temperature, the baseboard management controller controls the heating plate to stop heating.

[0101] In this way, excessive heat generation and energy waste can be avoided.

[0102] In some embodiments, the heat sink is heated by a heating plate to enter a boiling phase change low thermal resistance mode, and the heat generated by the chip is also transferred to the heat sink to maintain the boiling state on the surface of the heat sink.

[0103] In other embodiments, if the baseboard management controller reads the temperature information obtained by the third temperature sensor and finds that there is no sharp drop, it means that large-scale boiling has not occurred, the heating plate continues to work, and the baseboard management controller continues to read the temperature information obtained by the third temperature sensor.

[0104] In this way, through the heat dissipation control method provided by the embodiment of the present invention, when the high-power consumption chips such as CPU and GPU in the two-phase immersion liquid cooling server are rapidly and dynamically load adjusted, the pre-heating plate is started to heat the heat dissipation device in advance, so that before the chip temperature exceeds the saturation temperature of the fluorinated liquid, the phase change boiling low thermal resistance mode is entered in advance, so that bubbles are quickly generated on the surface of the radiator to take away the heat from the chip surface, so that the temperature inside the chip is transmitted evenly, thereby suppressing the rapid dynamic load adjustment of the chip, and causing damage to the chip due to the delayed boiling response, which leads to a rapid increase in the temperature of computing chips such as CPU and GPU.

[0105] Figure 6 A first optional structural schematic diagram of the heat dissipation control device provided in an embodiment of the present disclosure is shown and will be described according to each part.

[0106] In some embodiments, the heat dissipation control device 600 is applied to a baseboard management controller, and the heat dissipation control device 600 includes a first control unit 601 , a determination unit 602 , and a second control unit 603 .

[0107] The first control unit 601 is used to control the temperature of the heating plate to increase in response to the power consumption increase rate of the chip being greater than a second preset threshold value and the thermal resistance of the heat sink being greater than a preset boiling thermal resistance; The determining unit 602 is used to determine the temperature drop rate of the heating plate; The second control unit 603 is used to disconnect the temperature control of the heating plate in response to the temperature drop rate of the heating plate being greater than a third preset threshold.

[0108] In some embodiments, the heat dissipation control device 600 may further include a storage unit 604 for storing the second preset threshold, the preset boiling thermal resistance and the third preset threshold.

[0109] The first control unit 601 is further configured to obtain a first power consumption of the chip at a first moment; Obtaining a second power consumption of the chip at a second moment; Based on the first moment, the first power consumption, the second moment, and the second power consumption, a rising rate of the chip power consumption from the first moment to the second moment is determined.

[0110] The first control unit 601 is further used to obtain first temperature information collected by the first temperature sensor; Acquire second temperature information collected by a second temperature sensor; A thermal resistance of a heat sink is determined based on the first temperature information and the second temperature information.

[0111] The first control unit 601 is further configured to obtain the third power consumption of the chip at a third moment if the power consumption rising rate of the chip is less than or equal to a second preset threshold, or the thermal resistance of the heat sink is less than or equal to a preset boiling thermal resistance. The third moment is a moment after the first moment or the second moment.

[0112] The second control unit 603 is further configured to continue to control the temperature of the heating sheet to rise and obtain the fifth temperature information of the heating sheet in response to the temperature dropping rate of the heating sheet being less than or equal to the third preset threshold.

[0113] Figure 7 FIG. shows a second alternative structural schematic diagram of the heat dissipation control device provided by the embodiments of the present disclosure, and will be described according to each part.

[0114] In some embodiments, the heat dissipation control device 600 includes a storage unit 604, a measurement unit 605, a calculation unit 606, a judgment unit 607, and a control unit 608.

[0115] The storage unit 604 is configured to store the second preset threshold corresponding to the power consumption rising rate and the preset boiling thermal resistance.

[0116] The measurement unit 605 is configured to measure the real-time power consumption of the chip and the temperature information of the first point, the second point, and the third point. The measurement unit may include a first temperature sensor 101, a second temperature sensor 102, and a third temperature sensor 103.

[0117] The calculation unit 606 is configured to calculate the power consumption rising rate of the chip based on the real-time power consumption of the chip, and calculate the thermal resistance of the heat sink based on the temperature information of the first point and the second point.

[0118] The judgment unit 607 is configured to compare the real-time power consumption rising rate of the chip with the preset power consumption rising rate k0 in the storage module to judge whether to start the heating sheet; compare the thermal resistance of the real-time heat dissipation device with the preset boiling thermal resistance Rt0 to judge whether the surface of the heat dissipation device is boiling.

[0119] When the control unit 608 judges that preheating needs to be started, it controls the heating sheet to work to heat the heat dissipation device; when it judges that the surface of the heat dissipation device has reached the boiling state, it controls the heating sheet to stop working.

[0120] According to the embodiments of the present disclosure, the present disclosure also provides an electronic device and a readable storage medium.

[0121] Figure 8FIG. 0 shows a schematic block diagram of an exemplary electronic device 800 that can be used to implement embodiments of the present disclosure. The electronic device is intended to represent various forms of digital computers, such as, for example, laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device may also represent various forms of mobile devices, such as, for example, personal digital processors, cellular telephones, smart phones, wearable devices, and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely exemplary and are not intended to limit the implementations of the present disclosure described and / or claimed herein.

[0122] As Figure 8 shown, the electronic device 800 includes a computing unit 801 that can perform various appropriate actions and processes in accordance with a computer program stored in a read-only memory (ROM) 802 or a computer program loaded from a storage unit 808 into a random access memory (RAM) 803. In the RAM 803, various programs and data required for the operation of the electronic device 800 can also be stored. The computing unit 801, the ROM 802, and the RAM 803 are connected to each other via a bus 804. An input / output (I / O) interface, namely the I / O interface 805, is also connected to the bus 804.

[0123] Multiple components in the electronic device 800 are connected to the I / O interface 805, including: an input unit 806, such as a keyboard, a mouse, etc.; an output unit 807, such as various types of displays, speakers, etc.; a storage unit 808, such as a magnetic disk, an optical disc, etc.; and a communication unit 809, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 809 allows the electronic device 800 to exchange information / data with other devices via a computer network such as the Internet and / or various telecommunication networks.

[0124] The computing unit 801 can be various general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of the computing unit 801 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various dedicated artificial intelligence (AI) computing chips, various computing units running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. The computing unit 801 executes the various methods and processes described above, such as the heat dissipation control method. For example, in some embodiments, the heat dissipation control method can be implemented as a computer software program tangibly embodied in a machine-readable medium, such as the storage unit 808. In some embodiments, part or all of the computer program can be loaded and / or installed onto the electronic device 800 via the ROM 802 and / or the communication unit 809. When the computer program is loaded into the RAM 803 and executed by the computing unit 801, one or more steps of the heat dissipation control method described above can be executed. Alternatively, in other embodiments, the computing unit 801 can be configured to execute the heat dissipation control method in any other suitable manner (e.g., by means of firmware).

[0125] The various embodiments of the systems and techniques described above in this document can be implemented in digital electronic circuit systems, integrated circuit systems, field-programmable gate arrays (FPGA), application-specific integrated circuits (ASIC), application-specific standard products (ASSP), system-on-chip systems (SOC), complex programmable logic devices (CPLD), computer hardware, firmware, software, and / or combinations thereof. These various embodiments can include: being implemented in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which can be a dedicated or general-purpose programmable processor, and can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit the data and instructions to the storage system, the at least one input device, and the at least one output device.

[0126] The program code for implementing the methods of the present disclosure can be written in any combination of one or more programming languages. These program codes can be provided to the processor or controller of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when the program codes are executed by the processor or controller, the functions / operations specified in the flowcharts and / or block diagrams are implemented. The program codes can be executed entirely on the machine, partially on the machine, as an independent software package partially on the machine and partially on a remote machine, or entirely on a remote machine or server.

[0127] In the context of this disclosure, a machine-readable medium can be a tangible medium that can contain or store a program for use by or in connection with an instruction execution system, apparatus, or device. A machine-readable medium can be a machine-readable signal medium or a machine-readable storage medium. A machine-readable medium can include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination of the foregoing. More specific examples of a machine-readable storage medium would include an electrical connection based on one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or Flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0128] To provide for interaction with a user, the systems and techniques described herein can be implemented on a computer having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or a trackball) by which the user can provide input to the computer. Other kinds of devices can also be used to provide for interaction with the user; for example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic, speech, or tactile input).

[0129] The systems and techniques described herein can be implemented in a computing system that includes back-end components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes front-end components (e.g., a user computer having a graphical user interface or a web browser through which the user can interact with an implementation of the systems and techniques described herein), or a computing system that includes any combination of such back-end components, middleware components, or front-end components. The components of the system can be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), and the Internet.

[0130] A computer system can include a client and a server. The client and the server are generally remote from each other and typically interact through a communication network. The client-server relationship is generated by computer programs running on the respective computers and having a client-server relationship to each other. The server can be a cloud server, a server of a distributed system, or a server incorporating a blockchain.

[0131] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps recited in this disclosure can be executed in parallel, sequentially, or in a different order, as long as the desired results of the technical solution disclosed in this disclosure can be achieved, and no limitation is made herein.

[0132] In addition, the terms "first" and "second" are used only for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of this disclosure, "a plurality of" means two or more, unless otherwise specifically defined.

[0133] As described above, the above are only specific embodiments of this disclosure, but the protection scope of this disclosure is not limited thereto. Any person skilled in the art within the technical scope disclosed in this disclosure can easily think of changes or substitutions, which should all be covered within the protection scope of this disclosure. Therefore, the protection scope of this disclosure should be subject to the protection scope of the claims.

Claims

1. A heat dissipation system, characterized in that: The system comprises: a cavity (1); Condensate (2), a printed circuit board (11), a chip (12), a heat sink (13), a heating plate (14), and a substrate management controller (15) are arranged in the cavity (1); the condensate (2) immerses the printed circuit board (11), at least one chip (12), the heat sink (13), the heating plate (14), and the substrate management controller (15); The printed circuit board (11) is arranged on the inner wall of the cavity (1), and a substrate management controller (15) and at least one chip (12) are arranged on the printed circuit board; The first side of the heat dissipation device (13) is attached to at least one chip (12) and is used to dissipate heat for the at least one chip (12) through heat transfer between the heat dissipation device (13) and the at least one chip (12); the second side of the heat dissipation device (13) is in contact with the condensate (2); The heating plate (14) is partially attached to a second side of the heat dissipation device (13); the heat dissipation device (13) comprises a first temperature sensor (101), a second temperature sensor (102) and a third temperature sensor (103); The first temperature sensor (101) and the second temperature sensor (102) are arranged inside the heat dissipation device (13), on different vertical planes, and are respectively at a first distance and a second distance from a first side of the heat dissipation device (13); first temperature information acquired by the first temperature sensor (101) and second temperature information acquired by the second temperature sensor (102) are used to determine a thermal resistance of a heat sink (135) corresponding to the heat dissipation device; The third temperature sensor is arranged inside the heat dissipation device (13), and the distance between the third temperature sensor and the heating plate (14) is less than a first preset threshold value, and is used to obtain third temperature information of the heating plate (14); The baseboard management controller (15) is used to obtain the power consumption, first temperature information, second temperature information and third temperature information of at least one chip (12); control the temperature of the heating plate (14) based on the power consumption, first temperature information, second temperature information and third temperature information of at least one chip (12) to control the temperature of the heat dissipation device (13); and dissipate heat from the at least one chip (12) by boiling the condensate (2) when the temperature of the second side surface of the heat dissipation device (13) reaches a boiling start condition for the condensate (2).

2. The system according to claim 1, characterized in that The system further comprises a condenser (203), a condenser liquid outlet (201) and a condenser liquid inlet (202); The condenser tube (203) contains cooling liquid (3).

3. The system according to claim 2, characterized in that The condensate (2) is in direct contact with the heat dissipation device (13); The condensate (2) absorbs heat from the surface of the heat dissipation device (13) and undergoes a phase change to generate steam; the steam is cooled after contacting the condenser tube (203), condenses into liquid droplets and falls back.

4. The system according to claim 2, characterized in that The cooling liquid (3) includes water or ethanol.

5. The system according to claim 1, characterized in that The condensate (2) comprises a fluorinated liquid.

6. The system according to claim 1, characterized in that A soft heat conductor is arranged between the surface of the bonding portion of the heat dissipation device (13) and the chip (12), including one of a heat conductive paste, a heat conductive graphite sheet, a heat conductive gel, a phase-changing heat conductive pad or a soft metal.

7. The system according to claim 1, characterized in that The heat dissipation device comprises a heat sink (135); The heat sink (135) comprises a rectangular recess, and the heating plate (14) is arranged in the rectangular recess.

8. The system according to claim 1 or 7, characterized in that: The area of ​​the first region where the heating plate (14) and the heat dissipation device (13) are in contact is smaller than the area of ​​the second side of the heat dissipation device; The distance between the first temperature sensor (101) and the first area is greater than a first distance threshold; The distance between the second temperature sensor (102) and the first area is greater than a second distance threshold.

9. The system according to claim 1, characterized in that The baseboard management controller (15) is specifically used for: In response to the power consumption increase rate of the chip (12) being greater than a second preset threshold value, and the thermal resistance of the heat sink (135) being greater than a preset boiling thermal resistance, controlling the temperature of the heating plate (14) to increase; Determining the temperature drop rate of the heating plate (14); In response to the temperature drop rate of the heating plate (14) being greater than a third preset threshold, the temperature control of the heating plate (14) is disconnected.

10. A heat dissipation control method, characterized in that: Applied to the heat dissipation system according to any one of claims 1 to 9 above, the method comprises: In response to the power consumption increase rate of the chip being greater than a second preset threshold value, and the thermal resistance of the heat sink being greater than a preset boiling thermal resistance, controlling the temperature of the heating plate to increase; Determine the temperature drop rate of the heating plate; In response to the temperature drop rate of the heating plate being greater than a third preset threshold, the temperature control of the heating plate is disconnected.

11. The method according to claim 10, characterized in that The method further comprises: Obtaining a first power consumption of the chip at a first moment; Obtaining a second power consumption of the chip at a second moment; Based on the first moment, the first power consumption, the second moment, and the second power consumption, a rising rate of the chip power consumption from the first moment to the second moment is determined.

12. The method according to claim 10, characterized in that The method further comprises: Acquire first temperature information collected by a first temperature sensor; Acquire second temperature information collected by a second temperature sensor; A thermal resistance of a heat sink is determined based on the first temperature information and the second temperature information.

13. The method according to claim 10, characterized in that The method further comprises: If the power consumption increase rate of the chip is less than or equal to the second preset threshold, or the thermal resistance of the heat sink is less than or equal to the preset boiling thermal resistance, obtaining a third power consumption of the chip at a third moment; The third moment is a moment after the first moment or the second moment.

14. The method according to claim 10, characterized in that The method further comprises: In response to the temperature drop rate of the heating plate being less than or equal to the third preset threshold, the temperature of the heating plate continues to be controlled to increase, and fifth temperature information of the heating plate is obtained.

15. A heat dissipation control device, characterized in that: Applicable to the heat dissipation system according to any one of claims 1 to 9 above, the device comprising: A first control unit, configured to control the temperature of the heating plate to increase in response to the power consumption increase rate of the chip being greater than a second preset threshold value and the thermal resistance of the heat sink being greater than a preset boiling thermal resistance; A determination unit, used to determine the temperature drop rate of the heating plate; The second control unit is used to disconnect the temperature control of the heating plate in response to the temperature drop rate of the heating plate being greater than a third preset threshold.

16. The device according to claim 15, characterized in that The device further comprises a storage unit, wherein the storage unit is configured to: The second preset threshold value, the preset boiling thermal resistance, and the third preset threshold value are stored.

17. An electronic device, characterized in that: include: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute the method described in any one of claims 10-14.

18. A non-transitory computer-readable storage medium storing computer instructions, characterized in that: The computer instructions are used to make a computer execute the method according to any one of claims 10-14.

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