Assembly method of encoder

Abstract

The invention provides an assembly method of an encoder. The encoder comprises a PCB (printed circuit board) card and an encoder chip mounted on the PCB card. The assembling method comprises the following steps of: mounting an encoder chip on a PCB (Printed Circuit Board) card through a chip mounter by taking a positioning hole in the PCB card as a datum point for chip mounting; and assembling the PCB board card on which the encoder chip is mounted on a fixed base by utilizing the positioning hole on the PCB board card. According to the invention, the assembly precision of the encoder can be improved.

Description

Technical Field

[0001] This application relates to the technical field of encoders, and particularly to an assembly method for an encoder. Background Art

[0002] Optoelectronic encoders have the advantages of high resolution, good stability, long working life, high precision, etc. In addition, optoelectronic encoders are easy to install, have low power consumption, high reliability, and are insensitive to temperature and humidity changes. Therefore, they are widely used in various occasions that require real-time monitoring of motion states and positions, such as industrial automation, medical equipment and other fields.

[0003] An optoelectronic encoder includes a PCB board and an optoelectronic encoder chip mounted on the PCB board (Printed Circuit Board). When assembling the optoelectronic encoder, the optoelectronic encoder chip needs to be pasted onto the PCB board by a mounter, and then the PCB board is fixed to the structure to be installed through positioning holes. Generally, after the PCB board with the optoelectronic encoder chip assembled is completed, the tolerance of the position of the optoelectronic encoder chip relative to the above-mentioned structure to be installed is required to be controlled within 0.05 mm. However, the current assembly accuracy of optoelectronic encoders is not high, and it is difficult to meet the above-mentioned tolerance requirements for high-precision assembly occasions. Summary of the Invention

[0004] The purpose of this application is to provide an assembly method for an encoder, which can improve the assembly accuracy of the encoder.

[0005] One aspect of this application provides an assembly method for an encoder. The encoder includes a PCB board and an encoder chip mounted on the PCB board. The assembly method includes: using the positioning holes on the PCB board as the reference points for chip installation, and pasting the encoder chip onto the PCB board through a mounter; and using the positioning holes on the PCB board, assembling the PCB board with the encoder chip pasted thereon onto a fixed base.

[0006] Further, there are non-metallized mechanical mounting holes on the PCB board, and the assembly method further includes: pre-metallizing the non-metallized mechanical mounting holes on the PCB board to form the positioning holes that can be used as the reference points on the PCB board.

[0007] Further, the positioning holes have surface metal rings formed on the surface of the PCB board.

[0008] Further, a predetermined area outside the surface metal ring of the positioning hole on the PCB board is a blank area.

[0009] Further, using the positioning holes on the PCB board as the reference points for chip installation includes: using at least two positioning holes on the PCB board as the reference points for chip installation.

[0010] Further, the at least two positioning holes include a first positioning hole and a second positioning hole. Using the positioning holes on the PCB board as the reference points for chip installation, and mounting the encoder chip onto the PCB board by a mounter includes: obtaining the actual coordinates of the first positioning hole and the second positioning hole on the PCB board; determining the coordinates of the actual mounting position of the encoder chip based on the actual coordinates of the first positioning hole and the second positioning hole; and mounting the encoder chip onto the PCB board according to the determined coordinates of the actual mounting position of the encoder chip by the mounter.

[0011] Further, obtaining the actual coordinates of the first positioning hole and the second positioning hole on the PCB board includes: using the optical system of the mounter to perform image acquisition on the first positioning hole and the second positioning hole of the PCB board; and obtaining the actual coordinates of the first positioning hole and the second positioning hole based on the actual images of the first positioning hole and the second positioning hole collected.

[0012] Further, using the positioning holes on the PCB board as the reference points for chip installation, and mounting the encoder chip onto the PCB board by a mounter further includes: comparing the actual images of the first positioning hole and the second positioning hole collected with the standard images of the first positioning hole and the second positioning hole pre - stored in the image library; in the case where the actual images match the standard images, further comparing the central coordinates of the line connecting the first positioning hole and the second positioning hole with the central coordinates of the line connecting the first positioning hole and the second positioning hole in the standard image; when there is no offset between the central coordinates of the line connecting the first positioning hole and the second positioning hole and the central coordinates in the standard image, using the original coordinates of the mounting position of the encoder chip during design pre - stored as the coordinates of the actual mounting position of the encoder chip; when there is an offset between the central coordinates of the line connecting the first positioning hole and the second positioning hole and the central coordinates in the standard image, correcting the original coordinates of the mounting position of the encoder chip during design based on the offset amount of the central coordinates to obtain the coordinates of the actual mounting position of the encoder chip.

[0013] Further, there are positioning posts on the fixed base. Among them, using the positioning holes on the PCB board to assemble the PCB board with the encoder chip mounted onto a fixed base includes: clamping the positioning holes on the PCB board with the encoder chip mounted onto the positioning posts on the fixed base.

[0014] Further, the PCB board also has fixing holes, and the assembling method further includes: locking the PCB board to the fixed base through the fixing holes on the PCB board.

[0015] Further, the shape of the positioning holes includes circular holes or groove-shaped holes.

[0016] Further, the PCB board includes a single PCB board. Using the positioning holes on the PCB board as the reference points for chip mounting, the process of mounting the encoder chip onto the PCB board by a pick-and-place machine includes: selecting a panel with multiple such single PCB boards, each single PCB board having the positioning holes; on the panel, using the positioning holes on each single PCB board as the reference points, and mounting the encoder chips onto each single PCB board correspondingly by the pick-and-place machine. Wherein, the assembling method further includes: cutting the single PCB board from the panel.

[0017] Further, the assembling method further includes: mounting a code disk onto a rotating component that can rotate relative to the fixed base, and the fixed base and the code disk are concentrically mounted.

[0018] In the assembling method of the encoder according to one or more embodiments of the present application, by using the positioning holes on the PCB board as the reference points during the chip pasting of the encoder, therefore, in the encoder assembling process, the error removes the position tolerance of the reference points relative to the positioning holes on the PCB board, reduces the tolerance accumulation in the encoder assembling process, and can improve the assembling accuracy. Description of the Drawings

[0019] Figure 1 It is a schematic diagram of a surgical robot.

[0020] Figure 2 It is a schematic diagram of the master manipulator of a surgical robot.

[0021] Figure 3 It is a schematic plan view of a panel.

[0022] Figure 4 It is a schematic plan view of a panel according to an embodiment of the present application.

[0023] Figure 5 It is a flowchart of the assembling method of the encoder according to an embodiment of the present application.

[0024] Figure 6 It is a schematic assembly structure diagram of the encoder according to an embodiment of the present application.

[0025] Figure 7Schematic diagram of chip mounting with the positioning holes on the PCB board as the reference points for an embodiment of this application. Detailed implementation mode

[0026] Here, the exemplary embodiments will be described in detail, and the examples are shown in the drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. On the contrary, they are merely examples of devices consistent with some aspects of this application as detailed in the appended claims.

[0027] The terms used in this application are only for the purpose of describing specific embodiments and are not intended to limit this application. Unless otherwise defined, the technical terms or scientific terms used in this application should have the ordinary meaning understood by those of ordinary skill in the field to which this application belongs. The terms "first", "second" and similar words used in the specification and claims of this application do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "a" or "an" do not indicate a quantity limitation, but indicate that there is at least one. "Multiple" or "several" means two or more. Unless otherwise indicated, words such as "front part", "rear part", "lower part" and / or "upper part" are only for convenience of description and are not limited to one position or a spatial orientation. The words "including" or "comprising" and similar words mean that the elements or objects appearing before "including" or "comprising" cover the elements or objects listed after "including" or "comprising" and their equivalents, and do not exclude other elements or objects. The words "connected" or "coupled" and similar words are not limited to physical or mechanical connections, and may include electrical connections, whether direct or indirect. The singular forms "a", "the" and "said" used in the specification and claims of this application are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0028] Existing medical devices may include, for example Figure 1 the surgical robot 1 shown as follows, which is used to remotely manipulate and complete surgeries. The surgical robot 1 may include a control system 2, an imaging system 3 and a robotic arm system 4, and the three can communicate with each other.

[0029] The control system 2 is also called the doctor's console. The control system 2 has a display unit for displaying surgical instruments or the endoscope environment, a control mechanism for the doctor to operate, armrests, etc. The control mechanism here can be called an input device. The control mechanism usually includes Figure 2At least one main operating handle 10 as shown is provided. The doctor controls the movement of the robotic arm system 4 by operating the main operating handle 10 to achieve surgical operations. That is to say, the main operating handle 10 serves as one of the input devices of the doctor's console. The display unit is provided with an observation window for the doctor to observe. The control mechanism is configured to perform various actions corresponding to the actions of surgical instruments or endoscopes. The armrest is used to place the doctor's arm. In addition, on the doctor's console, there are also other control switches that are convenient for the hands or feet to touch or press, used for various functional operations to complete human-machine interaction.

[0030] The imaging system 3 includes a display screen, an endoscope controller, system electronics, an image processor, etc. Thus, the internal organs of the patient can be presented to the operator more clearly.

[0031] The robotic arm system 4 is arranged beside the patient, and a surgical instrument or an endoscope 6 is provided at its distal end for performing various surgical operations on the patient. The robotic arm system 4 may include at least one robotic arm 5, for example Figure 1 Four robotic arms 5 are schematically shown in [the figure]. The robotic arm 5 has a number of connecting arms 7. Two adjacent connecting arms 7 are pivotally connected and relatively movable with specific degrees of freedom, so that the end or the distal end of the robotic arm 5 can achieve movements with multiple degrees of freedom, such as movements with seven degrees of freedom. A device support frame 8 is installed at the end of the robotic arm 5, which can also be called an instrument holding arm. The surgical instrument or the endoscope 6 is detachably installed on the device support frame 8.

[0032] The above-mentioned main operating handle 10 may include an input handle 11. The input handle 11 is symmetrically arranged with respect to the R axis. The opening and closing angle of the input handle 11 is an important input parameter for controlling the robotic arm system 4, and the measurement accuracy and stability thereof are extremely important. Specifically, the doctor directly controls the execution of the actions at the instrument end by operating the main operating handle 10. Therefore, high requirements are imposed on the action detection accuracy, reliability, etc. of the main operating handle 10, especially the input handle 11 part. Inside the main operating handle 10, there is a PCB board and a code disk with an optical encoder chip mounted thereon, which can be used to measure the opening and closing angle of the input handle 11. Ensuring the accurate measurement of the opening and closing angle of the input handle 11 is one of the important conditions for realizing precise control of the robotic arm and the surgical instrument to successfully complete the surgical operation. Usually, the assembly requirement is that the accuracy of the position from the code disk to the optical encoder chip read head is controlled within ±0.1 mm, and the accuracy of the code disk installed on a structural member can be controlled within ±0.05 mm. Therefore, after the PCB board with the optical encoder chip mounted is assembled, the tolerance of the position of the optical encoder chip relative to the structural member needs to be controlled below 0.05 mm. However, the current assembly accuracy of the optical encoder is not high and it is difficult to meet the tolerance requirements required for high-precision assembly occasions.

[0033] When assembling an optoelectronic encoder, the optoelectronic encoder chip (IC) needs to be surface-mounted onto a PCB board by a pick-and-place machine first, and then the PCB board is fixed to a structural member through the positioning holes on the PCB board.

[0034] Figure 3 Disclosed is a schematic plan view of a panel 20 for a panelized board. As Figure 3 shown, at least two fiducial (mark) points 22 are provided on the panel 20 including a plurality of PCB boards 21. In the chip mounting technology, the pick-and-place machine uses the mark points 22 on the panel 20 as the reference for the optoelectronic encoder chip 23 to pick and place the optoelectronic encoder chip 23. However, when assembling the optoelectronic encoder in this way, the error of the optoelectronic encoder chip 23 will consist of three parts: one is the chip mounting accuracy tolerance of the pick-and-place machine itself with the mark point 22 as the reference coordinate; the second is the position tolerance of the mark point 23 relative to the positioning holes 211 on the PCB board; the third is the tolerance of the PCB board 21 after mounting the optoelectronic encoder chip 23 being assembled to the structural member through the positioning holes 211. The cumulative tolerance of the three times is very large and it is difficult to meet the requirements of high-precision assembly. More than 50% of the samples will exceed the tolerance requirement of ±0.05 after assembly.

[0035] In view of this, the present application provides an improved assembly method to improve the assembly accuracy.

[0036] The present application provides an assembly method for an encoder. The encoder may include, for example, but not limited to, an optoelectronic encoder, etc. The encoder includes a PCB board and an encoder chip mounted on the PCB board. Figure 4 Disclosed is a schematic plan view of a panel for a panelized board including a plurality of PCB boards according to an embodiment of the present application. As Figure 4 shown, different from Figure 3 , the original mark points provided on the panel are cancelled on the panel including a plurality of PCB boards in Figure 4 .

[0037] Next, in combination with Figures 4 to 6 , how the present application assembles the encoder to improve the assembly accuracy of the encoder will be introduced in detail.

[0038] Figure 5 Disclosed is a flowchart of an assembly method for an encoder according to an embodiment of the present application, Figure 6 Disclosed is a schematic assembly structure view of an encoder according to an embodiment of the present application. With reference to Figure 5 and Figure 6 shown, the assembly method for an encoder according to an embodiment of the present application may include step S1 and step S2.

[0039] In step S1, taking the positioning holes 311 on the PCB board 31 as the reference points for chip installation, the encoder chip 33 is mounted on the PCB board 31 by a chip mounter.

[0040] Since the reference points for chip installation need to meet certain design requirements, in order to enable the positioning holes 311 on the PCB board to be used as mark points for chip installation, in some embodiments, the PCB board 31 has non-metallized mechanical mounting holes, and the assembly method of the present application further includes: pre-metallizing the non-metallized mechanical mounting holes on the PCB board 31 to form positioning holes 311 that can be used as reference points on the PCB board 31.

[0041] As Figure 4 shown, in some embodiments, the positioning hole 311 has a surface metal ring 3110 formed on the surface of the PCB board, such as a surface copper ring, so that it can be used to reflect light when used as a mark point. Optionally, the PCB board 31 is a blank area within a predetermined area outside the surface metal ring 3110 of the positioning hole 311, so as to prevent other surrounding metals from affecting the detection when the positioning hole 311 is used as a reference point.

[0042] As Figure 6 shown, in step S2, using the positioning holes 311 on the PCB board 31, the PCB board 31 with the encoder chip 33 mounted is assembled onto a fixed base 40.

[0043] In some embodiments, the fixed base 40 has positioning posts (not shown). In step S2, the positioning holes 311 on the PCB board 31 with the encoder chip mounted can be clamped on the positioning posts on the fixed base 40, so that the PCB board 31 with the encoder chip 33 mounted can be assembled onto the fixed base 40 by using the positioning holes 311 on the PCB board 31.

[0044] As Figure 4 shown, the PCB board 31 also has fixing holes 312. Continuing to refer to Figure 5 , in some embodiments, the assembly method of the present application may further include step S3. In step S3, the PCB board 31 can be locked to the fixed base 40 by using a locking member (not shown) through the fixing holes 312 on the PCB board 31.

[0045] In a preferred embodiment, in step S1, at least two positioning holes 311 on the PCB board 31 are used as the reference points for chip installation. The shape of the positioning hole 311 may include, for example, a circular hole or a slot-shaped hole, etc. Of course, it can be understood that the shape of the positioning hole 311 is not limited to a circular hole or a slot-shaped hole, and other shapes can also be applicable.

[0046] As shown Figure 4 in the figure, at least two positioning holes 311 may include a first positioning hole and a second positioning hole. In Figure 4 the figure, the two positioning holes 311 are respectively shown as a circular hole and a slot-shaped hole. However, the present application does not limit this. The first positioning hole and the second positioning hole may have the same shape or different shapes.

[0047] In some embodiments, taking the positioning holes 311 on the PCB board 31 as the reference points for chip installation in step S1, and mounting the encoder chip 33 on the PCB board 31 by a mounter may further include steps S11 to S13.

[0048] In step S11, the actual coordinates of the first positioning hole and the second positioning hole on the PCB board 31 may be obtained.

[0049] In some embodiments, the optical system of the mounter may be used to collect images of the first positioning hole and the second positioning hole of the PCB board 31, and then, based on the actual images of the first positioning hole and the second positioning hole collected, the actual coordinates of the first positioning hole and the second positioning hole may be obtained.

[0050] In step S12, the coordinates of the actual mounting position of the encoder chip 33 may be determined based on the actual coordinates of the first positioning hole and the second positioning hole obtained in step S11.

[0051] In step S13, the encoder chip 33 may be mounted on the PCB board 31 by the mounter according to the coordinates of the actual mounting position of the encoder chip 33 determined in step S12.

[0052] Figure 7 Disclosed is a schematic diagram of chip mounting with the positioning holes 311 on the PCB board 31 as the reference points according to an embodiment of the present application. As Figure 7 shown, since there will be some processing errors in the PCB board 31 after processing, therefore, the PCB board 31 needs to be calibrated for reference during high-precision mounting.

[0053] Before the mounter mounts the chip, the standard images of the first positioning hole M11 and the second positioning hole M12 as the mark points on the design file of the PCB board 31 are stored in the image library, and the original coordinates D1 of the first positioning hole and the second positioning hole M11 and M12 on the design file of the PCB board 31 and the mounting position of the encoder chip to be mounted during design are entered into the mounting program.

[0054] When pasting, when the conveyor belt conveys the actual PCB board 31 to be used, first use the optical system of the mounter to collect images of the first positioning hole M21 and the second positioning hole M22 of the actually used PCB board 31. After the actual images of the collected first positioning hole M21 and second positioning hole M22 are processed for image processing and feature extraction, they are compared with the standard images of the first positioning hole M11 and second positioning hole M12 pre-stored in the image library. First, it is compared whether the images of the two positioning holes on the PCB board 31 match. If the images do not match, the mounter will consider that the model of the PCB board 31 is incorrect and will alarm and stop working.

[0055] In the case where the actual image matches the standard image, it is further compared whether the central coordinate C2 of the line connecting the first positioning hole M21 and the second positioning hole M22 on the actually used PCB board is consistent with the central coordinate C1 of the line connecting the first positioning hole M11 and the second positioning hole M12 in the standard image.

[0056] When there is no offset between the central coordinate C2 of the line connecting the first positioning hole M21 and the second positioning hole M22 and the central coordinate C1 of the line connecting the first positioning hole M11 and the second positioning hole M12 in the standard image, the original coordinate D1 of the mounting position of the encoder chip at the time of pre-stored design is used as the coordinate of the actual mounting position of the encoder chip.

[0057] When there is an offset between the central coordinate C2 of the line connecting the first positioning hole M21 and the second positioning hole M22 and the central coordinate C1 of the line connecting the first positioning hole M11 and the second positioning hole M12 in the standard image, the original coordinate D1 of the mounting position of the encoder chip at the time of design is corrected based on the offset amounts of the central coordinates C2 and C1, that is, the coordinate of the encoder chip is corrected from the original coordinate D1 at the time of design to the coordinate D2 as the coordinate of the actual mounting position of the encoder chip. Thus, it is possible to ensure accurate mounting of components and improve the pasting accuracy of the encoder chip onto the PCB board.

[0058] In some embodiments, the PCB board 31 for mounting the encoder chip in the present application is a single PCB board. As Figure 4 shown, there are multiple PCB single boards on a panel 30. In Figure 4 it is shown that the panel 30 includes two PCB single boards. Each PCB single board has the above-mentioned positioning holes 311.

[0059] Therefore, in some embodiments, in step S1, a panel 30 having the plurality of PCB single boards may be selected; taking the positioning holes 31 on each PCB single board as reference points, the encoder chips 33 are correspondingly mounted on each PCB single board through a mounter, and then the PCB single boards are cut from the panel 30. Thus, the PCB boards 31 mounted with the encoder chips 33 can be obtained.

[0060] Return to reference Figure 5 As shown, in some embodiments, the assembly method of the present application may further include step S4. With reference to Figure 6 As shown, in step S4, a code disk 35 is mounted on a rotating member (not shown) that can rotate relative to the fixed base 40, and the fixed base 40 and the code disk 35 are concentrically mounted.

[0061] The assembly method of the encoder of the present application uses the positioning holes 311 on the PCB board 31 as the reference (mark) points during the chip mounting of the encoder chip 33. Therefore, the error in the encoder assembly process eliminates the part of the positional tolerance of the reference (mark) point relative to the positioning holes 311 on the PCB board 31, reduces the tolerance accumulation in the encoder assembly process, the assembly tolerance of the encoder chip 33 meets within ±0.05 mm, and improves the assembly accuracy.

[0062] The above has introduced in detail the assembly method of the encoder provided by the embodiments of the present application. Specific examples are used herein to elaborate on the assembly method of the encoder in the embodiments of the present application. The description of the above embodiments is only used to help understand the core idea of the present application and is not intended to limit the present application. It should be noted that for those of ordinary skill in the art, without departing from the spirit and principle of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications should also fall within the protection scope of the appended claims of the present application.

Claims

1. An assembly method for an encoder, the encoder including a PCB board and an encoder chip mounted on the PCB board, characterized in that: the assembly method includes: using the positioning holes on the PCB board as the reference points for chip installation, and mounting the encoder chip on the PCB board through a mounter; and utilizing the positioning holes on the PCB board to assemble the PCB board with the mounted encoder chip onto a fixed base.

2. The assembly method according to claim 1, characterized in that: there are non-metallized mechanical mounting holes on the PCB board, and the assembly method further includes: pre-metallizing the non-metallized mechanical mounting holes on the PCB board to form the positioning holes that can be used as the reference points on the PCB board.

3. The assembly method according to claim 2, characterized in that: the positioning holes have surface metal rings formed on the surface of the PCB board.

4. The assembly method according to claim 3, characterized in that: a predetermined area outside the surface metal rings of the positioning holes on the PCB board is a blank area.

5. The assembly method according to claim 1, characterized in that: using the positioning holes on the PCB board as the reference points for chip installation includes: using at least two positioning holes on the PCB board as the reference points for chip installation.

6. The assembly method according to claim 5, characterized in that: the at least two positioning holes include a first positioning hole and a second positioning hole, and using the positioning holes on the PCB board as the reference points for chip installation and mounting the encoder chip on the PCB board through a mounter includes: acquiring the actual coordinates of the first positioning hole and the second positioning hole on the PCB board; determining the coordinates of the actual mounting position of the encoder chip based on the actual coordinates of the first positioning hole and the second positioning hole; mounting the encoder chip on the PCB board through the mounter according to the determined coordinates of the actual mounting position of the encoder chip.

7. The assembly method according to claim 6, characterized in that: acquiring the actual coordinates of the first positioning hole and the second positioning hole on the PCB board includes: using the optical system of the mounter to perform image acquisition on the first positioning hole and the second positioning hole of the PCB board; acquiring the actual coordinates of the first positioning hole and the second positioning hole based on the actual images of the first positioning hole and the second positioning hole collected.

8. The assembly method according to claim 7, characterized in that: using the positioning holes on the PCB board as the reference points for chip installation and mounting the encoder chip on the PCB board through a mounter further includes: comparing the actual images of the first positioning hole and the second positioning hole collected with the standard images of the first positioning hole and the second positioning hole pre-stored in the image library; In the case where the actual image matches the standard image, the central coordinates of the line connecting the first positioning hole and the second positioning hole are further compared with the central coordinates of the line connecting the first positioning hole and the second positioning hole in the standard image; When there is no offset between the central coordinates of the line connecting the first positioning hole and the second positioning hole and the central coordinates in the standard image, the original coordinates of the mounting position of the encoder chip during design stored in advance are used as the coordinates of the actual mounting position of the encoder chip; When there is an offset between the central coordinates of the line connecting the first positioning hole and the second positioning hole and the central coordinates in the standard image, the original coordinates of the mounting position of the encoder chip during design are corrected based on the offset amount of the central coordinates to obtain the coordinates of the actual mounting position of the encoder chip.

9. The assembly method according to claim 1, characterized in that: There are positioning posts on the fixed base. Among them, the method of assembling the PCB board with the encoder chip mounted thereon to a fixed base by using the positioning holes on the PCB board card includes: The positioning holes on the PCB board with the encoder chip mounted thereon are clamped on the positioning posts on the fixed base.

10. The assembly method according to claim 9, characterized in that: There are also fixing holes on the PCB board card, and the assembly method further includes: The PCB board card is locked to the fixed base through the fixing holes on the PCB board card.

11. The assembly method according to claim 1, characterized in that: The shape of the positioning hole includes a circular hole or a groove-shaped hole.

12. The assembly method according to any one of claims 1 to 11, characterized in that: The PCB board card includes a single PCB board. Using the positioning holes on the PCB board card as the reference points for chip installation, the method of mounting the encoder chip on the PCB board card by a mounter includes: Select a panel with multiple PCB single boards, and each PCB single board has the positioning holes; On the panel, using the positioning holes on each PCB single board as the reference points, the encoder chips are correspondingly mounted on each PCB single board by a mounter, wherein, the assembly method further includes: cutting the PCB single board from the panel.

13. The assembly method according to any one of claims 1 to 11, characterized in that: It further includes: Installing a code disk on a rotating member that can rotate relative to the fixed base, and the fixed base and the code disk are concentrically installed.

Images