Light-emitting structure and light-emitting module comprising same

Abstract

The present disclosure relates to a light emitting structure comprising: a substrate; the light-emitting element is arranged on the substrate, and the light-emitting element comprises a top surface and a side surface; the light reflecting layer is arranged on the top surface of the light-emitting element and is used for reflecting part of light from the top surface of the light-emitting element to the side surface of the light-emitting element; and the reflecting microstructure is arranged on the substrate, surrounds the side surface of the light-emitting element and is used for reflecting emergent light from the side surface of the light-emitting element.

Description

Technical Field

[0001] The present disclosure relates to a light-emitting structure, and particularly to a light-emitting structure with a reflective microstructure and a light-emitting module including the same. Background Art

[0002] Light emitting diodes (LEDs) have the characteristics of small size and high light emission directivity. However, for applications that require uniform light on the light-emitting surface of the light emitter, LEDs usually need to be combined with some optical designs to achieve uniform overall light emission.

[0003] Taking the LED backlight module of a liquid crystal display as an example, when multiple LEDs are arranged in an array on the lamp board, since the light emission pattern is close to the Lambertian distribution, when the spacing between the LEDs becomes larger, uniform illuminance cannot be achieved. Therefore, other optical elements are needed to change the light emission pattern of the LEDs so that even when the spacing between the LEDs increases, the light beam angle of each LED can also be widened simultaneously to achieve uniformity. However, as the size of the LEDs becomes smaller, it becomes difficult to control the light emission pattern of the micro-LEDs, making the design of the optical elements also difficult. Summary of the Invention

[0004] The purpose of the present disclosure is to provide a light-emitting structure and a light-emitting module including the same to solve at least one of the above problems.

[0005] One aspect of the present disclosure relates to a light-emitting structure, including: a substrate; a light-emitting element disposed on the substrate, and the light-emitting element includes a top surface and a side surface; a light reflection layer disposed on the top surface of the light-emitting element for reflecting part of the light emitted from the top surface of the light-emitting element to the side surface of the light-emitting element; and a reflective microstructure disposed on the substrate and surrounding the light-emitting element for reflecting the light emitted from the side surface of the light-emitting element.

[0006] According to one embodiment of the present disclosure, the reflective microstructure is serrated in a cross-sectional view.

[0007] According to one embodiment of the present disclosure, the reflective microstructure includes: a plurality of concentric structures, each having an inclined surface facing the light-emitting element; and a reflection layer disposed on the concentric structures.

[0008] According to one embodiment of the present disclosure, the reflectivity of the reflection layer to the emission wavelength of the light-emitting element is greater than 96%.

[0009] According to one embodiment of the present disclosure, the included angle between the inclined surface of the concentric structure and the upper surface of the substrate is 10 to 30 degrees.

[0010] According to one embodiment of the present disclosure, the angles between each of the inclined surfaces of the concentric structure and the substrate are different from each other.

[0011] According to one embodiment of the present disclosure, the ratio of the maximum height of the concentric structure to the height of the light-emitting element is less than 1 / 3.

[0012] According to one embodiment of the present disclosure, in a top view, the concentric structure is a concentric circle, a concentric triangle, a concentric quadrilateral, a concentric polygon, or composed of discrete line segments.

[0013] According to one embodiment of the present disclosure, the light-emitting element includes a light-emitting diode, and the light-reflecting layer is disposed on the top surface of the light-emitting diode.

[0014] According to one embodiment of the present disclosure, the light-emitting structure further includes a package, and the package encapsulates the light-emitting diode and the light-reflecting layer.

[0015] According to one embodiment of the present disclosure, the light-emitting element includes a light-emitting diode, and the light-emitting structure further includes a package encapsulating the light-emitting diode, wherein the light-reflecting layer is disposed on the top surface of the package.

[0016] According to one embodiment of the present disclosure, the package includes a wavelength conversion material.

[0017] Another aspect of the present disclosure relates to a light-emitting module, including: a plurality of the light-emitting structures as described above, arranged in an array on a substrate.

[0018] According to one embodiment of the present disclosure, the array is a hexagonal array. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The various aspects of the present disclosure will be described in detail below with reference to the accompanying drawings. It should be noted that, in accordance with standard practice in the industry, the various components are not drawn to scale and are for illustrative purposes only. In fact, the dimensions of the elements can be arbitrarily enlarged or reduced to clearly show the components of the embodiments of the present invention. It should also be noted that the accompanying drawings only illustrate typical embodiments of the present disclosure and should not be considered as limiting its scope. The present disclosure is equally applicable to other embodiments.

[0020] Figure 1A is a top view schematic diagram showing a light-emitting structure according to various embodiments of the present disclosure.

[0021] Figure 1B is according to various embodiments of the present disclosure, showing along Figure 1ASchematic cross-sectional view of the light-emitting structure cut along the line A-A'.

[0022] Figures 2A - 2C According to other embodiments of the present disclosure, a schematic cross-sectional view of the light-emitting structure is shown, wherein the light-emitting structure further includes a package body.

[0023] Figure 3A and Figure 3B According to other embodiments of the present disclosure, a schematic top view of the light-emitting structure is shown, wherein the concentric structure has different shapes.

[0024] Figures 4A - 4C According to other embodiments of the present disclosure, a schematic top view of the light-emitting structure is shown, wherein the concentric structure is composed of discrete line segments.

[0025] Figure 5A and Figure 5B According to various embodiments of the present disclosure, a schematic top view of the light-emitting module is shown.

[0026] Figure 6 According to various embodiments of the present disclosure, a schematic diagram of simulating the spot size of the light-emitting structure is shown.

[0027] Figures 7A - 7D According to various embodiments of the present disclosure, the simulation results of the spot size are shown.

[0028] Description of reference numerals:

[0029] 100, 100': Light-emitting structure

[0030] 102: Substrate

[0031] 102T: Upper surface

[0032] 104: Light-emitting element

[0033] 104H, 108H: Height

[0034] 104T: Top surface

[0035] 104S: Side surface

[0036] 105: Light-emitting diode

[0037] 105T: Top surface

[0038] 105S: Side surface

[0039] 106: Light reflection layer

[0040] 106T: Top surface

[0041] 107: Package body

[0042] 107T: Top surface

[0043] 108: Concentric structure

[0044] 108S: Inclined surface

[0045] 109: Flat part

[0046] 110: Reflective microstructure

[0047] 112: Reflective layer

[0048] 120, 140, 160, 200, 200’, 300, 300’: Light-emitting structure

[0049] 400, 500: Light-emitting module

[0050] 502: Light-emitting surface

[0051] D: Distance

[0052] L1, L2, L3: Light path

[0053] OD: Distance

[0054] W: Outer diameter

[0055] θ: Included angle Detailed implementation manners

[0056] The following discloses and provides many embodiments or examples for implementing different elements of the provided subject matter. Specific examples of each element and its configuration are described below to simplify the description of the embodiments of the present invention. Of course, these are only examples and are not intended to limit the embodiments of the present invention. For example, when it is mentioned in the description that the first element is formed on the second element, it may include an embodiment where the first and second elements are in direct contact, or it may include an embodiment where additional elements are formed between the first and second elements so that they are not in direct contact. In addition, the embodiments of the present invention may repeat reference numerals and / or letters in various examples. Such repetition is for the purpose of simplicity and clarity, and is not intended to indicate the relationship between the different embodiments and / or configurations discussed.

[0057] Furthermore, relative terms related to space may be used herein, such as "under", "below", "lower", "above", "higher", etc. Such terms are used to facilitate the description of the relationship between one or more components or parts and another or other components or parts in the drawings. Relative terms related to space are intended to include different orientations of the device in use or operation, as well as the orientations described in the drawings. When the device is turned to a different orientation (rotated 90 degrees or other orientations), the relative adjectives related to space used therein will also be interpreted according to the turned orientation. When relative terms related to space such as those listed above are used to describe a first component relative to a second component, the first component may be directly on the other component, or may be between components or layers. When a component or layer is referred to as being "on" another component, it will be directly on the other component or layer and in direct contact with the other component or layer.

[0058] The terms used herein are only for the purpose of explaining specific embodiments and are not intended to limit the concept of the present invention. Unless the expression has a clearly different meaning in the context, the expressions used in the singular form also cover multiple forms. In this specification, it should be understood that terms such as "comprising", "having", and "including" are intended to indicate the existence of the features, numbers, steps, actions, components, parts, or combinations thereof disclosed in this specification, and are not intended to exclude the possibility of the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0059] In addition, when using terms such as "about" or "approximate" to describe a number or a range of numbers, such terms are intended to cover numbers within a reasonable range, which is considered based on the variations inherently occurring in the manufacturing process as understood by those skilled in the art. For example, based on the known manufacturing tolerances for manufacturing components with features related to that number, the quantity or range of numbers covers a reasonable range including the said number, such as within + / - 10% of the said number.

[0060] Since general light-emitting elements are directly disposed on a lamp board, for example, on the surface of a printed circuit board (PCB), in order to change the light pattern of the light-emitting elements, it is necessary to control the light rays on five light-emitting surfaces of the light-emitting elements. However, considering material savings and process simplification, it becomes difficult in design. To solve the above problems, the present disclosure achieves the goal of light homogenization by disposing a light reflection layer on the top surface of the light-emitting element to reflect part of the light emitted from the top surface of the light-emitting element to the side surface of the light-emitting element, and then reflecting the light emitted from the side surface of the light-emitting element to above the lamp board through the reflection microstructures around the light-emitting element.

[0061] The present disclosure can be applied to a lighting light-emitting module or a backlight module used in a liquid crystal display, such as a direct-lit submillimeter light-emitting diode (mini LED) backlight module. Generally, when a smaller number of light-emitting diodes are arranged on a lamp board, the spacing between the light-emitting diodes on the lamp board will become larger, and it is easy to have a problem of poor light uniformity. However, if the number of light-emitting diodes on the lamp board is increased, there will be a problem of increased cost. Therefore, by changing the light shape of the light-emitting diodes, even when a smaller number of light-emitting diodes are used on the lamp board and the spacing between the light-emitting diodes becomes larger, the light beam angle of each light-emitting diode can be simultaneously widened, thereby achieving preferable light uniformity.

[0062] Figure 1A and Figure 1B are a top view schematic diagram and a cross-sectional schematic diagram showing a light-emitting structure 100 according to various embodiments of the present disclosure, wherein Figure 1B is shown by cutting along the A-A' line in Figure 1A .

[0063] In some embodiments, the light-emitting structure 100 includes a substrate 102, a light-emitting element 104 disposed on the substrate 102, a light reflection layer 106 disposed on top of the top surface 104T of the light-emitting element 104, and a reflection microstructure 110 disposed on the substrate 102 and surrounding the side surface 104S of the light-emitting element 104. In some embodiments, the substrate 102 can be a substrate having conductive lines, such as a rigid substrate, a flexible substrate, a sapphire substrate, a transparent substrate, an opaque substrate, a silicon substrate, a glass substrate, a printed circuit board (PCB), a metal substrate, a ceramic substrate, the like or a combination thereof, but the present disclosure is not limited thereto. The substrate 102 is used to carry electronic components (such as the light-emitting element 104 and the driving IC, etc.) located thereon, and the electronic components are electrically connected to the conductive lines of the substrate.

[0064] In some embodiments, the light-emitting element 104 is disposed on the substrate 102, and the light-emitting element 104 includes a top surface 104T and a side surface 104S. In some embodiments, the light-emitting element 104 includes four side surfaces 104S, as shown in Figure 1AAs shown. In addition, the light-emitting element 104 may include a light emitting diode (LED), such as a mini light emitting diode (miniLED) or a micro light emitting diode (micro LED), and is disposed on the substrate 102 in a flip-chip form. Alternatively, the light-emitting element 104 may be a light-emitting diode package, such as a chip scale package light emitting diode (CSP LED), but the present disclosure is not limited thereto. In some embodiments, the height 104H of the light-emitting element 104 is 0.4 mm to 2 mm (for example, 0.8 mm, 1.0 mm, 1.1 mm). In some embodiments, a light reflection layer 106 is disposed above the top surface 104T of the light-emitting element 104 to reflect at least a portion of the light emitted from the top surface 104T of the light-emitting element 104 to the side surface 104S of the light-emitting element for lateral light emission. As Figure 1B shown, the light reflection layer 106 is disposed on the top surface 104T of the light-emitting element 104 (for example, the light reflection layer 106 is in direct contact with the top surface 104T of the light-emitting element 104), but the present disclosure is not limited thereto. In other embodiments, the light reflection layer 106 may not be in direct contact with the top surface 104T of the light-emitting element 104, and this part will be described in detail later in conjunction with Figure 2C . The light reflection layer 106 is used to suppress the light emitted from the top surface 104T to prevent the light-emitting beam from concentrating directly above the light-emitting element 104 and causing uneven light distribution. In some embodiments, the top surface 104T of the light-emitting element 104 does not emit light or substantially does not emit light. That is to say, substantially all of the light emitted from the top surface 104T of the light-emitting element 104 is reflected by the light reflection layer 106 to the four side surfaces 104S for light emission, and the light path will be described in detail below.

[0065] In some embodiments, the reflectivity of the light reflection layer 106 to the emission wavelength of the light-emitting element 104 is greater than 80%. In some embodiments, the light reflection layer 106 may be a distributed Bragg reflection mirror (DBR) formed by alternately stacking two or more dielectric materials with different refractive indices. In some embodiments, the DBR includes a material selected from zinc selenide (ZnSe), magnesium fluoride (MgF 2 ), silicon (Si), silicon nitride (SiN x ), titanium dioxide (TiO 2 ), tantalum pentoxide (Ta 2 O 5 ), hafnium dioxide (HfO 2 ), silicon dioxide (SiO 2 ), zirconium dioxide (ZrO 2) and two or more dielectric materials selected from the group consisting of aluminum oxide (Al 2 O 3 ) are alternately stacked. In some embodiments, the DBR includes two or more materials selected from the group consisting of aluminum gallium nitride (AlGaN), gallium nitride (GaN), aluminum nitride (AlN), indium gallium nitride (InGaN), aluminum arsenide (AlAs), aluminum gallium arsenide (AlGaAs), gallium phosphide (GaP), aluminum indium phosphide (AlInP), and aluminum indium gallium phosphide (AlInGaP) alternately stacked. In some embodiments, the light reflecting layer 106 can be a white reflecting layer, which includes a resin (such as silica gel or epoxy resin) and reflective metal oxide particles (such as titanium dioxide, aluminum oxide, silicon oxide, etc.) dispersed in the resin. In some embodiments, the light reflecting layer 106 can be a metal layer (such as a silver layer or an aluminum layer, etc.).

[0066] In some embodiments, the light emitting element 104 can be a light emitting diode, and the light reflecting layer 106 is directly disposed on the top surface of the light emitting diode, as Figures 1A - 1B shown.

[0067] In some embodiments, as Figures 2A - 2C shown, the light emitting structures 120, 140 and 160 further include a package 107. The light emitting element 104 includes a light emitting diode 105. Therefore, the light emitting element 104 and the package 107 can form a light emitting diode package. In Figure 2A and Figure 2B , the light reflecting layer 106 is disposed on the top surface 105T of the light emitting diode 105, and the package 107 covers the light emitting diode 105 and the light reflecting layer 106. Specifically, the package 107 covers the top surface 106T of the light reflecting layer 106 and the four side surfaces 105S of the light emitting diode 105. In addition, the package 107 can have an approximate or the same profile as the light emitting element 104( Figure 2A ) or have a semi-circular cross-sectional profile( Figure 2B ), but the present disclosure is not limited thereto. In other embodiments, the package 107 can have other shaped cross-sectional profiles. In some embodiments, the package 107 can cover the light emitting diode 105, and the light reflecting layer 106 is disposed on the top surface 107T of the package 107, as Figure 2C shown. In other words, the light reflecting layer 106 directly contacts the top surface 107T of the package 107. Therefore, the light reflecting layer 106 does not directly contact the top surface 105T of the light emitting diode 105.

[0068] In some embodiments, the encapsulant 107 is a light-transmissive material, such as epoxy resin, silicone, or glass, etc. In some embodiments, the encapsulant 107 may further include a wavelength conversion substance, such as quantum dot materials, phosphors, other suitable materials, or a combination of the foregoing. The light-emitting structures 120, 140, and 160 can serve as the backlight of the display. Taking the white light emitted by the light-emitting structures 120, 140, and 160 as an example, the light-emitting element 104 can be a blue light-emitting diode for emitting blue light. The encapsulant 107 contains yellow phosphors, which absorb part of the blue light and convert it into yellow light. The yellow light is mixed with part of the blue light to produce white light. Alternatively, the encapsulant 107 contains red and green wavelength conversion substances that absorb part of the blue light and convert it into red light and green light respectively. The red light, green light, and part of the blue light are mixed to produce white light. The red wavelength conversion substance can be a red phosphor or a red quantum dot, and the green wavelength conversion substance can be a green phosphor or a green quantum dot.

[0069] In some embodiments, the encapsulant 107 can be formed on the substrate 102 by, for example, compression molding, injection molding, or dispensing, etc., and cover the light-emitting element 104 and / or the light-reflecting layer 106.

[0070] Return reference Figure 1A and Figure 1B , in some embodiments, the reflective microstructure 110 is disposed on the substrate 102 and surrounds the light-emitting element 104 to reflect the light emitted from the side surface 104S of the light-emitting element upward. In some embodiments, the material of the reflective microstructure 110 is polyethylene terephthalate (PET), ultraviolet (UV) curable glue, poly(methyl methacrylate) (PMMA), polycarbonate (PC), silicone, or a combination of the foregoing. In some embodiments, the reflective microstructure 110 can be formed by, for example, embossing.

[0071] In some embodiments, the reflective microstructure 110 is serrated in a cross-sectional view, as Figure 1B shown. In some embodiments, the reflective microstructure 110 includes a plurality of concentric structures 108, and each concentric structure 108 has an inclined surface 108S facing the light-emitting element 104. Although Figure 1A and Figure 1B only 7 concentric structures 108 are shown, the present disclosure is not limited thereto, and various numbers of concentric structures 108 can be provided according to requirements. In some embodiments, the reflective microstructure 110 further includes a flat portion 109 around the concentric structures 108.

[0072] Specifically, first, at least part (or total reflection) of the light emitted from the top surface 104T of the light-emitting element 104 is reflected by the light reflection layer 106 provided on the top surface 104T of the light-emitting element 104 to the four side surfaces 104S for lateral light emission. After the light emitted from the side surfaces 104S reaches the reflection microstructure 110, it is reflected upward toward the substrate 102 via the inclined surfaces 108S of the respective concentric structures 108, as shown by the light paths L1 and L2, to obtain a wider light-emitting beam and improve light uniformity.

[0073] In some embodiments, the angle θ between the inclined surface 108S of the concentric structure 108 and the upper surface 102T of the substrate 102 is 10 degrees to 30 degrees (for example, 15 degrees to 25 degrees), which depends on the height 104H of the light-emitting element. If the angle θ is less than 10 degrees or greater than 30 degrees, the light emitted from the side surface 104S of the light-emitting element 104 cannot be effectively reflected upward toward the substrate 102. In some embodiments, the angle θ between each inclined surface 108S of the concentric structure 108 and the substrate 102 is the same, as Figure 1B shown, but the present disclosure is not limited thereto. The angle θ can also gradually increase or decrease from the inner circle to the outer circle, and the angle θ is controlled between 10 degrees and 30 degrees. In some embodiments, the angle θ between each inclined surface 108S of the concentric structure 108 and the substrate can be different. The term "different" here means that each inclined surface 108S has a different angle θ, rather than gradually increasing or decreasing from the inside to the outside. Therefore, the shape of the light-emitting beam (or spot) can be controlled by adjusting the angle θ of each inclined surface 108S, thereby achieving excellent light uniformity.

[0074] In some embodiments, the pitch between each inclined surface 108S is 0.1 mm to 1 mm (for example, 0.2 mm, 0.4 mm). If the pitch is less than 0.1 mm, although better light uniformity can be achieved, the fabrication of the concentric structure 108 is more difficult. On the contrary, if the pitch is greater than 1 mm, the control ability of the reflected light is poor because the number of inclined surfaces 108S of the concentric structure 108 is too small.

[0075] In some embodiments, the outer diameter W of the outermost concentric structure 108 in the reflection microstructure 110 is 8 mm to 16 mm (for example, 10 mm, 13.4 mm). In some embodiments, there is at least a distance D (for example, 0.6 mm, 1 mm) between the innermost concentric structure 108 and the light-emitting element 104. Here, the "distance D" is the shortest distance between the light-emitting element 104 and the concentric structure 108. In other words, in the top view schematic diagram, the concentric structure 108 and the light-emitting element 104 are spaced apart by the substrate 102, but the larger this distance D is, the worse the light uniformity after reflection.

[0076] In some embodiments, the height 108H of the concentric structure 108 is from 0.05 mm to 0.5 mm (e.g., 0.2 mm, 0.25 mm). The height 108H is the distance between the topmost part of the concentric structure 108 and the substrate 102. Since the light shape adjustment is related to the angle θ of each concentric structure 108, when a certain range of the angle θ is fixed, if the height 108H is less than 0.05 mm, a larger number of concentric structures 108 are required for the same substrate 102 area, which will increase the manufacturing precision of the mold microstructure and the control of the transfer shrinkage rate. On the contrary, when the height 108H is greater than 0.5 mm, there are two disadvantages. One is that when the height 104H is from 1 to 1.5 mm, the inner concentric structures 108 will reflect most of the light, thus blocking the reflected light reaching the outer concentric structures 108. The other is that a height 108H greater than 0.5 mm also means a smaller number of concentric structures 108, so the number of concentric structures 108 capable of adjusting the light shape is insufficient, and the light shape cannot be effectively controlled. In some embodiments, the height 108H of each of the concentric structures 108 is the same.

[0077] In some embodiments, the ratio of the maximum height 108H of the concentric structure 108 to the height 104H of the light-emitting element 104 is less than 1 / 3 (e.g., 0.18, 0.25), preferably in the range of 1 / 10 to 1 / 5, so as to achieve the purpose of expanding the light-emitting beam angle of the light-emitting element 104. If the ratio is greater than 1 / 3, the light path from the side 104S of the light-emitting element 104 to the outer concentric structure 108 will be blocked due to the excessive height 108H of the inner concentric structure 108, thereby reducing the reflection effect upward toward the substrate 102.

[0078] In some embodiments, the reflective microstructure 110 further includes a reflective layer 112 disposed on the surface of the concentric structure 108 (i.e., not disposed on the flat portion 109). In some embodiments, the reflectivity of the reflective layer 112 to the emission wavelength of the light-emitting element 104 is greater than 96% (e.g., the reflectivity is 97%, the reflectivity is 98%, the reflectivity is 99%), so as to effectively reflect the light emitted from the four sides 104S of the light-emitting element 104 upward toward the substrate 102. In some embodiments, the reflective layer 112 can be a metal material (such as silver or aluminum), which can be formed on the concentric structure 108 by electroplating or the like. In some embodiments, the reflective layer 112 can be a polymer material doped with reflective particles, which can be disposed on the concentric structure 108 by coating or the like. The above-mentioned reflective particles include titanium oxide, aluminum oxide, zirconium oxide, silicon oxide, and other suitable metal oxides. The above-mentioned polymers include silicone, epoxy resin, acrylic glue, or a combination of the foregoing. In some embodiments, the reflective layer 112 can be a reflective layer doped with hollow particle structures.

[0079] Specifically, in the present disclosure, at least a part (or total reflection) of the light emitted from the top surface 104T of the light-emitting element 104 is reflected by the light reflection layer 106 provided on the top surface 104T of the light-emitting element 104 to the side surface 104S for light emission, and then the light emitted from the side surface 104S of the light-emitting element is reflected upward from the substrate 102 by the reflection microstructure 110 provided on the substrate 102 and surrounding the light-emitting element 104. Moreover, by adjusting the included angle θ between the inclined surface 108S of the concentric structure 108 and the upper surface 102T of the substrate 102, the light-emitting beam of the light-emitting element 104 can be expanded, so that when the distance between the light-emitting elements 104 becomes larger, a certain light uniformity can still be maintained.

[0080] Figure 3A and Figure 3B are top view schematic diagrams showing the light-emitting structures 200 and 300 according to other embodiments of the present disclosure. In some embodiments, the concentric structure 108 is a concentric circle (as shown in Figure 1A ), a concentric triangle (as shown in Figure 3A ), a concentric quadrilateral (as shown in Figure 3B ), or a concentric polygon in a top view, but the present disclosure is not limited thereto. Except for the shape of the concentric structure 108, the other configurations are as described above and will not be elaborated herein.

[0081] Figures 4A - 4C are top view schematic diagrams showing the light-emitting structures 100', 200', and 300' according to other embodiments of the present disclosure. In the embodiments of Figures 4A - 4C , the concentric structure 108 is formed by discrete line segments in a top view, and adjacent concentric structure 108 line segments are separated by a flat portion 109. Figure 4A The light-emitting structure 100' in Figure 1A is similar to the light-emitting structure 100 in Figure 4B The light-emitting structure 200' in Figure 3A is similar to the light-emitting structure 200 in Figure 4C The light-emitting structure 300' in Figure 3B is similar to the light-emitting structure 300 in

[0082] Figure 5A and Figure 5B are top view schematic diagrams showing the light-emitting modules 400 and 500 according to various embodiments of the present disclosure.

[0083] In some embodiments, the light-emitting module 400 or 500 includes a plurality of the light-emitting structures 100 as described above, arranged in an array on the substrate 102. When the light-emitting elements 104 of the light-emitting module 400 or 500 are arranged periodically in an array, when the spacing distance between the light-emitting elements 104 becomes larger, it will cause the light-emitting surface of the illumination light source or the backlight source (for example: the light-emitting surface 502 in FIG. 6) to exhibit light non-uniformity. In order to make the light-emitting beam angle of the light-emitting elements 104 also widen simultaneously when the spacing between the light-emitting elements 104 becomes larger, the present disclosure provides a light reflection layer 106 on the top surface of the light-emitting elements 104 and reflection microstructures 110 around the light-emitting elements 104 to form the light-emitting structure 100 to achieve the purpose of light uniformity.

[0084] Figure 5A The light-emitting module 400 in [reference] shows a rectangular array composed of 9 light-emitting structures 100, and Figure 5B shows a hexagonal array composed of 7 light-emitting structures 100. It should be noted that the number of the light-emitting structures 100 and the arrangement pattern of the array are not limited thereto, and any suitable arrangement pattern can be used according to requirements.

[0085] In some embodiments, in the assembly, a plurality of light-emitting elements 104 are first formed on the substrate 102, and then a plurality of reflection microstructures 110 are provided on the substrate 102 to form the light-emitting module 400 or 500, wherein the plurality of reflection microstructures 110 are a continuous structure connected to each other through the flat portions 109.

[0086] In addition, the light-emitting structures arranged in the light-emitting modules 400 and 500 are not limited to Figure 1A the light-emitting structure 100 in [reference], and can be Figures 3A - 3B the light-emitting structure 200, 300 in [reference] or Figures 4A - 4C any one of the light-emitting structures 100', 200', 300' in [reference] or a combination of the foregoing.

[0087] Figure 6According to various embodiments of the present disclosure, a schematic diagram of simulating the spot size of the light-emitting structure 100 is shown. In the case where there is no light reflection layer 106 on the top surface 104T of the light-emitting element 104, light can exit from the side surface 104S of the light-emitting element 104 (as shown by the light paths L1 and L2) or from the top surface 104T of the light-emitting element 104 (as shown by the light path L3) to reach the light exit surface 502. However, in the case where a light reflection layer 106 is provided on the top surface 104T of the light-emitting element 104, most (or all) of the light exits from the side surface 104S of the light-emitting element 104 (as shown by the light paths L1 and L2) and is reflected by the plurality of reflection microstructures 110 provided on the substrate 102 to reach the light exit surface 502. In some embodiments, the light exit surface 502 can be, for example, an optical film of a backlight module, such as a diffusion plate or a diffusion film composed of scattering particles.

[0088] During the simulation process, the optical distance (OD) between the light-emitting element 104 and the light exit surface 502 is fixed at 12 mm, and the size conditions of the light-emitting element 104, the concentric structure 108, and the light reflection layer 106 are shown in Table 1.

[0089] [Table 1]

[0090]

[0091] The comparative example is the case where there is no light reflection layer 106, while in Example 1, Example 2, and Example 3, a light reflection layer 106 with a thickness of 0.1 mm is provided on the top surface 104T of the light-emitting element 104. The outer diameter W, height 108H, included angle θ, and the distance D from the light-emitting element 104 to the concentric structure 108 of the concentric structure 108 are adjusted according to the height 104H of the light-emitting element 104 to simulate the spot size.

[0092] In some embodiments, the optical analysis software TracePro and LightTools are used to simulate the spot size of the light-emitting structure 100, and the simulation results are as Figures 7A - 7D and Table 2 show.

[0093] [Table 2]

[0094]

[0095] Figures 7A - 7D According to various embodiments of the present disclosure, the simulation results of the spot size are shown, where the X-axis is the position (mm) and the Y-axis is the intensity (arbitrary unit). Figure 7A is the simulation result of the comparative example, and Figures 7B - 7DRespectively, they are the simulation results of Example 1, Example 2, and Example 3. It can be seen from the simulation results that compared with Example 1 (34.0 mm), Example 2 (36.2 mm), and Example 3 (40.0 mm), the spot size of the comparative example is the smallest at the 50% intensity diameter (21.0 mm). That is to say, when the light reflection layer 106 is provided on the top surface 104T of the light-emitting element 104, the light-emitting structure 100 has a wider light-emitting beam angle. In addition, when the light reflection layer 106 is provided on the top surface 104T of the light-emitting element 104 (reflecting at least part of the light emitted from the top surface 104T to the side surface 104S), the outer diameter W, height 108H, included angle θ of the concentric structure 108, and the distance D from the light-emitting element 104 to the concentric structure 108 can be adjusted according to the height 104H of the light-emitting element 104 to widen the light-emitting beam angle so as to achieve the purpose of light homogenization.

[0096] The light-emitting structure and the light-emitting module including the same of the present disclosure provide many advantages. For example, in the present disclosure, providing a light reflection layer on the top surface of the light-emitting element can effectively control the light rays of the five light-emitting surfaces of the light-emitting element. The reflection microstructure provided on the substrate and surrounding the light-emitting element of the present disclosure can widen the light-emitting beam angle of the light-emitting element, not only enabling good light uniformity when the distance between the light-emitting elements becomes larger, but also reducing the number of light-emitting elements and thus reducing the cost.

[0097] The components of several embodiments are outlined above so that those skilled in the art in the technical field to which the present invention pertains can more easily understand the viewpoints of the embodiments of the present invention. Those skilled in the art in the technical field to which the present invention pertains should understand that they can design or modify other processes and structures based on the embodiments of the present invention to achieve the same purposes and / or advantages as those introduced in the embodiments herein. Those skilled in the art in the technical field to which the present invention pertains should also understand that such equivalent processes and structures do not depart from the concept and scope of the present invention, and they can make various changes, substitutions, and replacements without departing from the concept and scope of the present invention.

Claims

1. A light-emitting structure, comprising: a substrate; A light emitting element is disposed on the substrate, and the light emitting element includes a top surface and a side surface; a light reflecting layer, disposed on the top surface of the light emitting element, for reflecting part of the light emitted from the top surface of the light emitting element to the side surface of the light emitting element; as well as A reflective microstructure is disposed on the substrate and surrounds the side surface of the light emitting element to reflect the light emitted from the side surface of the light emitting element. 2 . The light-emitting structure as claimed in claim 1 , wherein the reflective microstructure is sawtooth-shaped in a cross-sectional view.

3. The light emitting structure as claimed in claim 1, wherein the reflective microstructure comprises: A plurality of concentric structures, each having an inclined surface facing the light emitting element; as well as A reflective layer is disposed on the surfaces of the concentric structures. 4 . The light-emitting structure as claimed in claim 3 , wherein the reflectivity of the reflective layer to the light-emitting wavelength of the light-emitting element is greater than 96%. 5 . The light emitting structure as claimed in claim 3 , wherein an angle between the inclined surfaces of the concentric structures and the upper surface of the substrate is 10 to 30 degrees. 6 . The light-emitting structure as claimed in claim 5 , wherein the angles between each of the inclined surfaces of the concentric structures and the substrate are different. 7 . The light-emitting structure as claimed in claim 3 , wherein a ratio of a maximum height of the concentric structures to a height of the light-emitting element is less than 1 / 3. 8 . The light-emitting structure as claimed in claim 3 , wherein the concentric structures are concentric circles, concentric triangles, concentric squares, concentric polygons, or are composed of discrete line segments in a top view. 9 . The light emitting structure as claimed in claim 1 , wherein the light emitting element comprises a light emitting diode, and the light reflecting layer is disposed on a top surface of the light emitting diode. 10 . The light emitting structure as claimed in claim 9 , further comprising a packaging body, wherein the packaging body covers the light emitting diode and the light reflecting layer. 11 . The light emitting structure as claimed in claim 1 , wherein the light emitting element comprises a light emitting diode, and the light emitting structure further comprises a package body encapsulating the light emitting diode, and the light reflecting layer is disposed on a top surface of the package body. 12 . The light emitting structure as claimed in claim 10 , wherein the encapsulation body comprises a wavelength conversion material.

13. A light emitting module, comprising: A plurality of light emitting structures as claimed in claim 1 are arranged in an array on the substrate. The lighting module as claimed in claim 13 , wherein the array is a hexagonal array.

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