Display panel and display device

Abstract

The invention discloses a display panel and a display device, the display panel comprises a screen body and a hard circuit board, the screen body comprises a display surface and a non-display surface which are arranged oppositely, and the non-display surface is provided with a first bonding pad; the hard circuit board is arranged on one side of the screen body and faces the non-display face, and the hard circuit board is connected with the first bonding pad in a bonding mode. Through the mode, the preparation efficiency can be improved, the display effect is guaranteed, and meanwhile the narrow frame width is guaranteed.

Description

Technical Field

[0001] The present application belongs to the field of display technology, and specifically relates to a display panel and a display device. Background Art

[0002] Medium and large-sized display devices, such as laptops, tablet computers or car displays, are usually driven by PCBs (printed circuit boards), and the screen and PCB are usually bridged by FPCs (flexible circuit boards) to achieve signal transmission.

[0003] However, the structure of the existing display device is prone to reliability problems, resulting in poor display. Summary of the invention

[0004] The present application provides a display panel and a display device, which can improve the manufacturing efficiency, ensure the display effect, and ensure a narrow frame width.

[0005] In order to solve the above technical problems, a technical solution adopted in the present application is: providing a display panel, including: a screen body and a rigid circuit board, the screen body including a display surface and a non-display surface arranged back to back, and a first bonding pad is provided on the non-display surface; the rigid circuit board is arranged on one side of the screen body and faces the non-display surface, and the rigid circuit board is bonded and connected to the first bonding pad.

[0006] Preferably, the screen body includes a main body and a bonding part, the bonding part is located on one side of the main body, the first bonding pad is arranged on the bonding part, and the display panel also includes a supporting buffer layer, and the supporting buffer layer is stacked on the non-display surface of the screen body, wherein the supporting buffer layer and the bonding part are spaced apart from each other with respect to their orthographic projection on the screen body.

[0007] Preferably, the bonding portion comprises a transparent film layer.

[0008] Preferably, one end of the rigid circuit board is bonded to the first bonding pad, and the other end extends in a direction away from the supporting buffer layer.

[0009] Preferably, the first end of the rigid circuit board is bonded to the first bonding pad, and the second end extends to a side of the supporting buffer layer away from the screen body.

[0010] Preferably, the display panel also includes a transition portion connected between the main body and the bonding portion, and the transition portion, the hard circuit board and an end of the supporting buffer layer facing the bonding portion together form a buffer cavity; the display panel also includes a buffer portion, and the buffer portion is filled in the buffer cavity.

[0011] Preferably, the material of the buffer portion includes epoxy resin.

[0012] Preferably, the support buffer layer includes a support sub-layer and a buffer sub-layer arranged in a stacked manner, and the buffer sub-layer is arranged on a side of the support sub-layer facing away from the screen body.

[0013] Preferably, the material of the buffer sub-layer includes one or more of foam, polyethylene terephthalate or aerogel.

[0014] Preferably, the screen body includes a main body portion, a bent portion and a bonding portion. The main body portion and the bonding portion are arranged at intervals, the bent portion connects the main body portion and the bonding portion, and the non-display surfaces of the main body portion and the bonding portion face each other. Wherein, the first bonding pad is arranged on the non-display surface of the bonding portion, and the rigid circuit board is arranged between the bonding portion and the main body portion.

[0015] Preferably, the display panel further includes a support buffer layer which is arranged in a stacked manner on the non-display surface of the main body portion, and the rigid circuit board is arranged between the support buffer layer and the bonding portion.

[0016] Preferably, the screen body includes a wiring layer, and via holes are further provided on the screen body. Two ends of each via hole are respectively communicated with the wiring layer and the non-display surface, and a conductive structure is filled in the via hole to electrically connect the wiring layer and the first bonding pad.

[0017] Preferably, the screen body includes a wiring layer and a second bonding pad located on the display surface. The wiring layer is electrically connected to the second bonding pad. The screen body further includes a side surface, two ends of the side surface are respectively connected to the display surface and the non-display surface, a side wiring is provided on the side surface, two ends of the side wiring are respectively connected to the first bonding pad and the second bonding pad, and a protective layer is provided on a side of the side wiring facing away from the screen body.

[0018] To solve the above technical problems, another technical solution adopted by this application is: to provide a display device including the display panel according to any one of the embodiments.

[0019] Differing from the prior art, the beneficial effects of the present application are as follows: The display panel provided by the present application directly bonds a rigid circuit board, i.e., a PCB, to the non-display surface of the screen body. Since the rigid circuit board of the present application is directly bonded to the screen body, there is no need to bridge through an FPC between the rigid circuit board and the screen body. Since only one bonding step is required, on the one hand, the preparation efficiency can be improved and the material of the FPC can be saved; on the other hand, the influence of expansion and contraction caused by bonding the FPC on the bonding accuracy can be avoided, ensuring the display effect. At the same time, the rigid circuit board can be bonded to the non-display surface of the screen body without bending the screen body. This design enables the rigid circuit board to extend towards the non-display surface of the screen body to expand the usage area of the rigid circuit board, and the rigid circuit board does not block the display area and does not increase the width of the lower border of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0021] Among them:

[0022] Figure 1 is a schematic structural diagram of an embodiment of the display panel of the present application;

[0023] Figure 2 is Figure 1 the right view of;

[0024] Figure 3 is a schematic structural diagram of another embodiment of the display panel of the present application;

[0025] Figure 4 is Figure 3 the right view of;

[0026] Figure 5 is a schematic structural diagram of another embodiment of the display panel of the present application;

[0027] Figure 6 is a schematic structural diagram of another embodiment of the display panel of the present application;

[0028] Figure 7 is a schematic structural diagram of an embodiment of the screen body of the present application;

[0029] Figure 8 is a schematic structural diagram of another embodiment of the screen body of the present application. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0030] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts shall fall within the scope of protection of the present application.

[0031] In the related art, the screen body in the display panel and the PCB (printed circuit board) are usually bridged through an FPC (flexible printed circuit board). The bonding steps of the display panel usually include the bonding between the screen body and the FPC and the bonding between the FPC and the PCB. The inventor has found through research that after the screen body and the FPC are bonded, shrinkage occurs, resulting in misalignment of the bonding between the PCB and the FPC, affecting the bonding accuracy, and further causing poor display.

[0032] In view of this, the present application provides a display panel 10. Refer to Figure 1 and Figure 2 , Figure 1 which is a schematic structural diagram of an embodiment of the display panel of the present application. Figure 2 is Figure 1 the right view of. The display panel 10 includes a screen body 11 and a rigid circuit board 12. The screen body 11 includes a display surface 11a and a non-display surface 11b arranged opposite to each other. A first bonding pad 111 is provided on the non-display surface 11b. As shown in Figure 2 , a plurality of first bonding pads 111 can be arranged along the second direction X; the rigid circuit board 12 is disposed on one side of the screen body 11 and faces the non-display surface 11b, and the rigid circuit board 12 is bonded and connected to the first bonding pad 111.

[0033] In the display panel 10 provided by the present application, the rigid circuit board 12, that is, the PCB, is directly bonded to the non-display surface 11b of the screen body 11. Since the rigid circuit board 12 of the present application is directly bonded to the screen body 11, there is no need to bridge the rigid circuit board 12 and the screen body 11 through an FPC. Since only one bonding step is required, on the one hand, the preparation efficiency can be improved and the material of the FPC can be saved; on the other hand, the influence of the expansion and contraction caused by bonding the FPC on the bonding accuracy can be avoided, ensuring the display effect. At the same time, the rigid circuit board 12 can be bonded to the non-display surface 11b of the screen body 11 without bending the screen body 11. This design enables the rigid circuit board 12 to extend along the non-display surface 11b of the screen body 11 (i.e., in the first direction Y) to expand the usage area of the rigid circuit board 12, and the rigid circuit board 12 does not block the display area and does not increase the width of the lower border of the display panel 10.

[0034] Optionally, continue to refer to Figure 1The screen body 11 includes a main body 101 and a bonding part 102, wherein the main body 101 can be used for display, and the bonding part 102 is used for bonding the driver chip 15 and the rigid circuit board 12, etc. The bonding part 102 is located on one side of the main body 101, and the first bonding pad 111 is arranged on the bonding part 102. The display panel 10 also includes a supporting buffer layer 13, and the supporting buffer layer 13 is stacked on the non-display surface 11b of the screen body 11, wherein the supporting buffer layer 13 and the positive projection of the bonding part 102 on the screen body 11 are arranged at intervals. The supporting buffer layer 13 is used to support the screen body 11 to keep the screen body 11 flat, and is also used to buffer the impact from the outside to ensure the display effect. Specifically, the film layer materials of the bonding part 102 can be transparent materials. For example, except for the metal wiring layer, the other film layers can all be transparent film layers, which is convenient for the CCD camera and the like to be aligned through the bonding part 102, and ensure the accuracy of the bonding between the screen body 11 and the rigid circuit board 12.

[0035] Optionally, in Figure 1 In the illustrated embodiment, the rigid circuit board 12 is spaced apart from the supporting buffer layer 13, the screen body 11 is a straight screen, and the bonding portion 102 and the main body 101 are sequentially arranged along the first direction Y. In this embodiment, the screen body 11 may be a rigid display screen or a flexible display screen, and the rigid circuit board 12 can be directly bonded to the non-display surface 11b of the screen body 11 without bending the screen body 11, which facilitates preparation while ensuring a low border width.

[0036] Alternatively, see Figure 3 and Figure 4 , Figure 3 This is a schematic structural diagram of another embodiment of the display panel of the present application. Figure 4 yes Figure 3 The right side view of the display panel 10 is shown in FIG. The first end of the rigid circuit board 12 is bonded to the first bonding pad 111, and the second end extends to the side of the support buffer layer 13 away from the screen body 11. In this embodiment, the rigid circuit board 12 extends along the first direction Y to the back side of the support buffer layer 13. Since the rigid circuit board 12 overlaps with the screen body 11, the area of ​​the rigid circuit board 12 can be expanded as much as possible without affecting the normal display and without expanding the frame of the display panel 10, and more components can be integrated on the rigid circuit board 12. And since there is a support buffer layer 13 between the rigid circuit board 12 and the screen body 11, the force of the rigid circuit board 12 on the screen body 11 can be buffered to ensure the display effect.

[0037] Further, see Figure 3, the display panel 10 further includes a transition portion 103 connected between the main body portion 101 and the bonding portion 102. One end of the transition portion 103, the rigid circuit board 12, and the support buffer layer 13 facing the bonding portion 102 enclose to form a buffer cavity 104; the display panel 10 further includes a buffer portion 14, and the buffer portion 14 is filled in the buffer cavity 104. In this embodiment, since the support buffer layer 13 protrudes on the non-display surface 11b of the screen body 11, a step difference is formed between the screen body 11 and the support buffer layer 13. In order to enable the rigid circuit board 12 to be fixed to both the screen body 11 and the support buffer layer 13 at the same time, the screen body 11 can be a flexible screen body, and the transition portion 103 and the bonding portion 102 can be bent toward the rigid circuit board 12 side, so that the surface of the bonding portion 102 facing away from the display surface 11a is flush with the surface of the support buffer layer 13 facing away from the display surface 11a. At this time, an obtuse angle is formed between the transition portion 103 and the main body portion 101, and the transition portion 103, the rigid circuit board 12, and the support buffer layer 13 enclose to form a buffer cavity 104 with a triangular cross-section. In this embodiment, the buffer portion 14 is filled in the buffer cavity 104 to buffer and protect the transition portion 103, reducing the influence of the step difference on the display effect. Specifically, the material of the buffer portion 14 includes epoxy resin, which can bond the transition portion 103 and the rigid circuit board 12 while buffering the transition portion 103, ensuring the reliability of the connection of the rigid circuit board 12. During the preparation process, after the bonding of the rigid circuit board 12 and the screen body 11 is completed, epoxy resin glue can be injected into the buffer cavity 104 to form the buffer portion 14, avoiding the failure of the glue caused by the high temperature of the bonding process. In other embodiments, the buffer portion 14 can also be integrally provided with the support buffer layer 13. Specifically, the shape of the buffer portion 14 can be set to have a triangular cross-section, and glue layers can be provided on both sides of the buffer portion 14 to achieve bonding with the transition portion 103 and the rigid circuit board 12.

[0038] Optionally, continue to refer to Figure 1 and Figure 3 , the support buffer layer 13 can include a support sub-layer 131 and a buffer sub-layer 132 arranged in a stacked manner, and the buffer sub-layer 132 is arranged on the side of the support sub-layer 131 facing away from the screen body 11. Specifically, the material of the support sub-layer 131 can include a steel plate for supporting the screen body 11, and the material of the buffer sub-layer 132 can include one or more of foam, polyethylene terephthalate PET, or aerogel for buffering.

[0039] Further, refer to Figure 5 , Figure 5 is a schematic structural diagram of another embodiment of the display panel of the present application. In this embodiment, the buffer portion 14 is integrally provided with the buffer sub-layer 132, the cross-section of the buffer portion 14 is triangular, and glue layers can be provided on the surfaces of the buffer portion 14 facing the transition portion 103 and the rigid circuit board 12 to achieve bonding with the transition portion 103 and the rigid circuit board 12.

[0040] Alternatively, referring to Figure 6 , Figure 6 which is a schematic structural view of another embodiment of the display panel of the present application. The screen body 11 includes a main body portion 101, a bending portion 105, and a bonding portion 102. The main body portion 101 and the bonding portion 102 are spaced apart in the thickness direction Z. The bending portion 105 connects the main body portion 101 and the bonding portion 102, and the non-display surface 11b of the main body portion 101 faces the non-display surface 11b of the bonding portion 102. Among them, the first bonding pad 111 is disposed on the non-display surface 11b of the bonding portion 102, and the rigid circuit board 12 is disposed between the bonding portion 102 and the main body portion 101. In this embodiment, the screen body 11 is a flexible screen body. By bending the screen body 11, the bonding portion 102 is bent to the side facing the non-display surface 11b of the main body portion 101. At this time, the rigid circuit board 12 bonded to the bonding portion 102 is synchronously bent to the side of the non-display surface 11b of the main body portion 101. The rigid circuit board 12 does not block the display surface 11a and does not affect the frame width of the display panel 10.

[0041] Furthermore, continuing to refer to Figure 6 , in this embodiment, the display panel 10 further includes a support buffer layer 13, which is stacked on the non-display surface 11b of the main body portion 101, and the rigid circuit board 12 is disposed between the support buffer layer 13 and the bonding portion 102. The support buffer layer 13 is used to support and buffer the screen body 11 and the rigid circuit board 12 on both sides simultaneously to ensure the display effect.

[0042] The present application can electrically connect the first bonding pad 111 disposed on the non-display surface 11b to the wiring layer 112 in the screen body 11 in various ways. The wiring layer 112 may include wiring layers 112 such as a touch wiring layer and an active layer that need to be electrically connected to the rigid circuit board 12, and the present application does not make specific limitations.

[0043] In some embodiments, referring to Figure 7 , Figure 7 which is a schematic structural view of an embodiment of the screen body of the present application. The screen body 11 includes a wiring layer 112. The screen body 11 is further provided with a via hole 113. Both ends of the via hole 113 are respectively communicated with the wiring layer 112 and the non-display surface 11b. The via hole 113 is filled with a conductive structure to electrically connect the wiring layer 112 and the first bonding pad 111. In this embodiment, by providing the via hole 113 inside the screen body 11, the bonding position of the wiring layer 112 is led to the non-display surface 11b.

[0044] In other embodiments, referring to Figure 8 , Figure 8It is a schematic structural diagram of another embodiment of the screen body of the present application. The screen body 11 includes a wiring layer 112 and a second bonding pad 116 located on the display surface 11a. The wiring layer 112 is electrically connected to the second bonding pad 116. The screen body 11 further includes a side surface 11c. Two ends of the side surface 11c are respectively connected to the display surface 11a and the non-display surface 11b. A side wiring 114 is provided on the side surface 11c. Two ends of the side wiring 114 are respectively connected to the first bonding pad 111 and the second bonding pad 116. A protective layer 115 is provided on a side of the side wiring 114 facing away from the screen body 11. In this embodiment, the structure of arranging the bonding pads on the non-display surface 11b of the original screen body 11 can be not changed, and the bonding position of the wiring layer 112 is led to the non-display surface 11b through the side wiring 114 located on the side surface 11c of the screen body 11. The protective layer 115 can prevent the external static electricity from affecting the conductivity of the side wiring 114.

[0045] In the present application, the driving chip 15 can be bonded on the display surface 11a as in the embodiments shown in Figure 1 , Figure 3 and Figure 5 , which is the same as the related art, or can be bonded on the non-display surface 11b like the rigid circuit board 12 of the present application.

[0046] The present application further provides a display device, including the display panel 10 in any embodiment. The display device can be a large or medium-sized display device such as a tablet computer, a notebook computer or a vehicle-mounted display screen, etc. The display device provided by the present application can omit the bonding step of the FPC and the materials of the FPC, improve the preparation efficiency, ensure the display effect, and have a relatively narrow frame at the same time.

[0047] The above are only the embodiments of the present application, and do not limit the patent scope of the present application accordingly. Any equivalent structural or equivalent process transformation made by using the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present application.

Claims

1. A display panel, characterized in that: include: The screen body comprises a display surface and a non-display surface which are arranged opposite to each other, and a first bonding pad is arranged on the non-display surface; A hard circuit board is arranged on one side of the screen body and faces the non-display surface. The hard circuit board is bonded and connected to the first bonding pad.

2. The display panel according to claim 1, characterized in that: The screen body includes a main body and a bonding part, the bonding part is located at one side of the main body, the first bonding pad is arranged on the bonding part, and the display panel further includes: A supporting buffer layer is stacked on the non-display surface of the screen body, wherein the supporting buffer layer is spaced apart from the orthographic projection of the bonding portion on the screen body; Preferably, the bonding portion comprises a transparent film layer.

3. The display panel according to claim 2, characterized in that: The hard circuit board is spaced apart from the supporting buffer layer.

4. The display panel according to claim 2, characterized in that: The first end of the rigid circuit board is bonded to the first bonding pad, and the second end extends to a side of the supporting buffer layer away from the screen body.

5. The display panel according to claim 4, characterized in that: The display panel further includes a transition portion connected between the main body and the bonding portion, wherein the transition portion, the rigid circuit board and one end of the support buffer layer facing the bonding portion together form a buffer cavity; The display panel further includes a buffer portion, and the buffer portion is filled in the buffer cavity; Preferably, the material of the buffer portion includes epoxy resin.

6. The display panel according to claim 2, characterized in that: The supporting buffer layer comprises: A supporting sublayer and a buffer sublayer are stacked, wherein the buffer sublayer is arranged on a side of the supporting sublayer away from the screen body; Preferably, the material of the buffer sublayer includes one or more of foam, polyethylene terephthalate or aerogel.

7. The display panel according to claim 1, characterized in that: The screen body comprises a main body, a bending part and a bonding part, the main body and the bonding part are arranged at intervals, the bending part connects the main body and the bonding part, and the non-display surface of the main body and the non-display surface of the bonding part are arranged facing each other, wherein the first bonding pad is arranged on the non-display surface of the bonding part, and the hard circuit board is arranged between the bonding part and the main body; Preferably, the display panel further comprises a supporting buffer layer stacked on the non-display surface of the main body, and the rigid circuit board is arranged between the supporting buffer layer and the bonding portion.

8. The display panel according to claim 1, characterized in that: The screen body includes a wiring layer, and a via hole is provided on the screen body. Two ends of the via hole are connected to the wiring layer and the non-display surface respectively. The via hole is filled with a conductive structure to electrically connect the wiring layer and the first bonding pad.

9. The display panel according to claim 1, characterized in that: The screen body comprises a wiring layer and a second bonding pad located on the display surface, and the wiring layer is electrically connected to the second bonding pad; The screen body also includes a side surface, two ends of which are respectively connected to the display surface and the non-display surface, the side surface is provided with a side routing, two ends of which are respectively connected to the first bonding pad and the second bonding pad, and a protective layer is provided on the side of the side routing away from the screen body.

10. A display device, characterized in that: Comprising a display panel as described in any one of claims 1-9.

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