Ultrasonic cleaning device, powder coating component for implementing the ultrasonic

By using ultrasonic energy in the ultrasonic cleaning device of powder-coated components, the problems of large air consumption and high manual interaction in the prior art are solved, and a more efficient and energy-saving powder-coated components cleaning process is achieved.

CN120076875APending Publication Date: 2025-05-30NORDSON CORP
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Patent Information

Application Number
CN202380076155.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2022-10-31
Filing Date
2023-10-23
Publication Date
2025-05-30

AI Technical Summary

Technical Problem

The prior art consumes a lot of air during the cleaning of powder coated components, requiring highly complex automation solutions and a lot of manual interactions, resulting in high costs, high energy consumption and low production efficiency.

Method used

Ultrasonic cleaning device is adopted to apply ultrasonic energy to the components of the powder application system through the excitation device to reduce powder accumulation and contamination, and to realize the application of ultrasonic vibration through ultrasonic corners and ultrasonic controllers.

Benefits of technology

It realizes reducing air consumption, shortening cleaning time, reducing manual interaction requirements, improving production efficiency, and reducing energy consumption and costs during the cleaning process of powder-coated components.

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Abstract

A powder application system cleaning device includes an excitation device (104). The powder application system cleaning device further comprises an excitation device configured to apply ultrasonic energy to a component (292) of the powder application system to minimize powder build-up and / or contamination.
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Description

Cross - Reference to Related Applications

[0001] This application claims the benefit of U.S. Provisional Application No. 63 / 420,802, filed on October 31, 2022, the entire content of which is incorporated herein by reference for all purposes as if fully set forth herein. Technical Field

[0002] The present disclosure relates to an ultrasonic cleaning device. In particular, an ultrasonic cleaning device configured to clean powder - coated components. The present disclosure also relates to powder - coated components that implement the ultrasonic cleaning device for cleaning powder - coated components. In addition, the present disclosure relates to methods of implementing the ultrasonic cleaning device. In particular, methods of implementing an ultrasonic cleaning device configured to clean powder - coated components. The present disclosure also relates to methods of implementing powder - coated components that implement the ultrasonic cleaning device for cleaning powder - coated components. Background Art

[0003] Powder coating materials are typically applied to an object or workpiece by spraying application equipment and methods. These spraying application equipment and methods include electrostatic and non - electrostatic methods. The spraying application of powder coating materials from a feed center or supply source to a workpiece is typically carried out in a spray booth that is used to contain and recover powder overspray that does not adhere to the workpiece during the powder coating operation. A powder supply system for such powder facilities is used to fluidize the powder and supply the fluidized powder to a powder spraying device, such as a powder gun, etc. In a typical high - performance industrial powder coating facility, multiple powder spraying devices or groups thereof can be supplied by a common powder supply system, which is commonly referred to as a so - called powder feed center.

[0004] Such a powder feed center typically includes a powder supply hopper for supplying powder to the spraying device. The powder in the hopper is fluidized by means of a powder fluidizing device associated with the hopper. A powder pump transports the powder from the hopper to the spraying device. When a color change is required, an operator needs to initiate a purge procedure to purge and clean the hopper, the powder supply lines of the system, including, for example, the powder supply lines connecting the hopper, the spraying device, and / or other powder application components. Generally, it is desirable to carry out cleaning and other processing operations as quickly, reliably, and completely as possible during powder changeover.

[0005] However, typical methods require highly complex automated solutions that consume a large amount of air and involve a highly intensive manual maintenance process for each powder application component to be cleaned. In particular, typical powder application components are cleaned using pressurized air. For example, the inner wall of a hopper is cleaned using compressed air (6 - 7 bar, 150 - 200 Nm³ / h), followed by manual interaction by an operator using a blow gun. In this regard, the time required to clean the hopper can take 4 - 6 minutes or longer. Additionally, the pressurized air consumes a large amount of energy. Moreover, during cleaning, the powder application system may have to be partially or even completely non - operational, which reduces productivity and thus increases costs. Therefore, typical methods are costly, energy - consuming, require manual interaction, and so on.

[0006] Accordingly, there is a need for a device and method that is faster, less costly, more energy - efficient, requires less manual interaction, etc., for implementing the cleaning of powder application components. SUMMARY OF THE INVENTION

[0007] The above needs are largely met by the present disclosure, which in one aspect provides a technology and device, the disclosed ultrasonic cleaning device, the disclosed ultrasonic cleaning device configured to clean a powder coating component, the disclosed powder coating component implementing an ultrasonic cleaning device for cleaning a powder coating component, the disclosed method of implementing an ultrasonic cleaning device, the disclosed method of implementing an ultrasonic cleaning device configured to clean a powder coating component, the disclosed method of implementing a powder coating component (which implements an ultrasonic cleaning device for cleaning a powder coating component), etc.

[0008] In a general aspect, a powder application system cleaning device includes an excitation device. The powder application system cleaning device further includes that the excitation device is configured to emit ultrasonic energy to a component of the powder application system, thereby minimizing powder accumulation and / or contamination.

[0009] In a general aspect, a powder application system cleaning device includes an excitation device. The powder application system cleaning device further includes an ultrasonic horn. Additionally, the powder application system cleaning device further includes an ultrasonic controller. The powder application system cleaning device further includes that the excitation device is configured to emit ultrasonic energy to a component of the powder application system, thereby minimizing powder accumulation and / or contamination.

[0010] In a general aspect, a method includes providing an excitation device. The method further includes configuring the excitation device to emit ultrasonic energy to a component of the powder application system, thereby minimizing powder accumulation and / or contamination.

[0011] In one general aspect, a method includes providing an excitation device. The method further includes providing an ultrasonic horn. The method still further includes providing an ultrasonic controller. The method also includes configuring the excitation device to deliver ultrasonic energy to components of a powder application system so as to minimize powder accumulation and / or contamination.

[0012] Accordingly, certain aspects of the present disclosure have been outlined rather broadly in order that the detailed description thereof herein may be better understood, and so that the contribution to the art may be better appreciated. Of course, additional aspects of the present disclosure will be described hereinafter, which will form the subject matter of the appended claims.

[0013] In this regard, before explaining at least one aspect of the present disclosure in detail, it is to be understood that the application of the present disclosure is not limited to the construction details and component arrangements set forth in the following description or illustrated in the drawings. The present disclosure is capable of other aspects and of being practiced and carried out in various ways. Further, it is to be understood that the phraseology and terminology used herein, as well as the abstract, are for the purpose of description and should not be regarded as limiting.

[0014] Accordingly, those skilled in the art will appreciate that the concepts upon which this disclosure is based can readily be utilized as a basis for designing other structures, methods and systems for carrying out several purposes of the present disclosure. It is, therefore, important that the claims be regarded as including such equivalent constructions insofar as they do not depart from the spirit and scope of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A powder application system cleaning device implemented in components of a powder application system in accordance with aspects of the present disclosure is shown.

[0016] Figure 2 A powder application system cleaning device implemented in accordance with aspects of the present disclosure is shown.

[0017] Figure 3 An exemplary embodiment of a powder application system cleaning device implemented in a spray booth in accordance with aspects of the present disclosure is shown.

[0018] Figure 4 An exemplary embodiment of a powder application system cleaning device implemented in a powder supply hopper in accordance with aspects of the present disclosure is shown.

[0019] Figure 5 An exemplary embodiment of a powder application system cleaning device implemented in a Figure 4 powder supply hopper in accordance with [the present disclosure] is shown.

[0020] Figure 6 An exemplary embodiment of a powder application system cleaning device implemented in a filtering device in accordance with aspects of the present disclosure is shown.

[0021] Figure 7 Shows an exemplary embodiment of a powder application system cleaning device implemented in a powder recovery system 214 in accordance with aspects of the present disclosure.

[0022] Figure 8 Shows a method of implementing a powder application system cleaning device in accordance with aspects of the present disclosure. Detailed Description

[0023] The present disclosure will now be described with reference to the accompanying drawings, in which like reference numerals always refer to like components. Aspects of the present disclosure advantageously provide an apparatus and method for cleaning components of a powder application system that are faster, less costly, more energy efficient, require less manual interaction, and so on.

[0024] The powder supply center may include one or more hoppers for receiving and fluidizing powder coating material from a first powder coating material supply source or a raw powder coating material supply source. Additionally, the one or more hoppers of the powder supply center may also receive and fluidize previously unused powder coating material from a second powder coating material supply source or from a recycled powder coating material supply source. The first powder coating material supply source may be a box of new powder coating material, and the second powder coating material supply source may be from a powder splash recovery system associated with a spray chamber or other powder center components. For example, a cyclone separator that provides reformed powder coating material.

[0025] At the lower part of the powder supply hopper may be a fluidized bed or plate that may be spaced from the bottom wall or floor of the hopper to provide a plenum. Pressurized fluidizing air is supplied from an air source to the plenum. In this regard, the fluidized bed may be porous to air, and the fluidizing air creates a volume of fluidized material within the hopper. The hopper may include a plurality of powder outlet ports, each of which may be connected to a gun pump via a feed hose. Each gun pump draws fluidized powder (e.g., dense-phase powder) from the hopper and moves the powder to a spray gun in a spray chamber.

[0026] The powder supply center may have different operating modes, such as a color change operation. In this regard, during a color change operation, the powder coating material must be completely cleaned from the internal volume and surface of the hopper. This operation is typically accomplished by applying an additional supply of pressurized air in the form of a pulsed or continuous air flow within the powder hopper for a short period of time. The supply of pressurized air may be achieved through a fixed connection to the hopper or an automated air purge mechanism that enters and exits within the powder hopper. Thereafter, the powder hopper is typically inspected by an operator and further manual cleaning is performed using an additional air purge gun.

[0027] The disclosed apparatus and method are configured to minimize, during color change operations and / or other cleaning operations, the following actions: the application pressure air used to remove powder from powder application system components (such as the inner wall of the powder hopper and the fluidized bed); the energy usage associated with the cleaning process; the cleaning time of the powder application system components (such as the hopper) to enable rapid powder material change; and / or the amount of manual interaction by the operator to clean the powder application system components.

[0028] In particular, the disclosed apparatus and method can implement one or more ultrasonic probes, also known as transducers. Additionally, the one or more ultrasonic probes can be mechanically assembled to powder application system components, such as a powder hopper. Further, the one or more ultrasonic probes can be connected to an ultrasonic controller, also known as a generator. Additionally, the generator can provide high-frequency energy, which is converted by the transducer into ultrasonic vibrations that are applied to the powder application system components, such as to the inner wall of one or more powder hoppers, and these ultrasonic vibrations can be applied continuously or intermittently. In some aspects, the powder coating control system can apply different parameters during operation, various cleaning operations, color change mode operations, and / or similar operations to achieve energy savings. Further, the applied ultrasonic vibrations will keep the powder application system components cleaner, requiring a minimum amount of pressure air to clean or purge the inner surface of the powder application system components during cleaning operations (such as color change mode operations). Additionally, the disclosed apparatus and method will also minimize the cleaning operation time, color change time, etc. Additionally, the disclosed apparatus and method will also minimize manual interaction.

[0029] In some aspects, the disclosed apparatus and method can use ultrasonic application devices and methods to continuously provide cleaning of the powder application system components (such as the hopper wall of the powder feeder hopper), thereby preventing powder from accumulating on the surface, which will allow for a shortened color change time as well as other cleaning operations and a minimum or reduced use of pressure air for cleaning the powder application system components (such as hopper cleaning). In some aspects, ultrasonic devices, ultrasonic probes, etc. can be directly attached to the powder application system components, such as a powder feeder hopper. In some aspects, the ultrasonic device can operate during any operation, during color change operations, etc. In some aspects, the ultrasonic device can have different settings for cleaning.

[0030] In some aspects, the disclosed apparatus and methods for cleaning components of a powder application system, such as a powder feed hopper, address the problems of high air consumption and long color change times. In some aspects, the disclosed apparatus and methods for cleaning components of a powder application system may include a powder cleaning chamber, a floor of the powder chamber, chamber walls of the powder chamber, and / or the like. The disclosed apparatus and methods for cleaning components of a powder application system address the problems of high air consumption and long color change times. Additionally, the disclosed apparatus and methods for cleaning components of a powder application system may also allow for the implementation of different powder chamber materials, different powder chamber design concepts, and the like.

[0031] In addition, in most powder coating systems, such as electrostatic coating systems, powder is ejected from the gun nozzle in the form of a cloud. This allows the powder coating to envelop the object and coat all surfaces of the object, even if the geometry of the object is irregular. Additionally, one or more guns may be positioned on different sides of the object and / or pointed at different angles to increase the uniformity of the powder applied to the object. However, due to the inherent nature of the powder coating pattern, a significant amount of powder does not adhere to the object and ultimately lands on the floor, accumulates on other objects and structures in the nearby area, and so on. This unadhered powder residue is commonly referred to as powder overspray.

[0032] Since powder overspray is generated during each coating operation, the coating operation is typically performed within a coating chamber. The coating chamber is used for the containment of the powder and may be only partially enclosed. Most coating chambers have an air flow system that confines the powder overspray within the structure of the coating chamber by creating a negative pressure zone that draws air, along with the powder overspray entrained in the air flow, out of the powder chamber. The air with the powder is then transferred to a cartridge filtration system, a cyclone separation system, etc., that may be located outside the coating chamber to recover the powder. However, in known coating chamber systems, powder overspray still tends to accumulate on the chamber walls of the coating chamber, the ceiling of the coating chamber, the floor of the coating chamber, and / or the like. Particularly in electrostatic systems, powder overspray also tends to be attracted to and accumulate on any electrically grounded structures. The powder particles tend to be very small and well dispersed and can thus accumulate in the smallest of grooves, seams, cracks, irregular coating chamber wall structures, and / or the like.

[0033] In addition to the challenge of recycling powder overspray for subsequent use or disposal, powder overspray that accumulates in the spray booth must be removed from the spray booth when changing the powder coating color. To switch from one color to another, the spray gun, spray booth, powder recovery system, and other powder application system components must be cleared of the previous color powder as completely as possible to prevent contamination of the subsequent color powder. In the manufacture of "quick color change" spray systems, the color change operation is an ongoing challenge in the art, meaning the goal is to continuously reduce the downtime when the spray system is offline to clean the spray equipment and system. Thus, the amount of powder in the process and the amount of powder overspray retained in the spray booth significantly affect the time and effort required to perform the color change operation.

[0034] In a typical powder coating system, to minimize the accumulation of powder on the floor surface of the spray booth during a cleaning operation, color change operation, and / or similar operations, a floor purge system or an air wash system can be integrated to remove the powder from the floor surface by applying pressurized air through air nozzles in different sequences. This increases the pressurized air consumption of the system. Additionally, in a powder coating system, during a color change mode operation or other cleaning operations, one or more operators are required to clean the inner walls and floor of the powder booth with a blow gun, pipe, spray gun, and / or similar tools by applying pressurized air to the surface. This increases the pressurized air consumption of the system, prolongs the color change time, increases the risk of previous color contamination, is not ergonomic enough for the operator, and / or similar issues.

[0035] Accordingly, the disclosed apparatus and method can apply ultrasonic energy continuously, intermittently, temporarily, and / or similarly to powder application system components, such as the inner walls of the powder booth, the floor surface of the powder booth, and / or similar components, to minimize powder accumulation and contamination. In some aspects, the disclosed apparatus and method can minimize the pressurized air applied to remove powder from powder application system components, such as the inner walls of the powder booth, the floor of the powder booth, etc. In some aspects, the disclosed apparatus and method can minimize the cleaning time of the entire system including the various powder application system components described herein. In some aspects, the disclosed apparatus and method can minimize the risk of contamination. In some aspects, the disclosed apparatus and method can minimize the manual interaction of the operator. In some aspects, the disclosed apparatus and method can allow the use of different powder system component materials, such as less costly materials. In some aspects, the disclosed apparatus and method can allow the use of different powder booth materials, such as less costly materials. In some aspects, the disclosed apparatus and method can further avoid additional floor cleaning mechanisms, floor purge systems, and / or similar devices.

[0036] Figure 1A powder application system cleaning device implemented in components of a powder application system according to aspects of the present disclosure is shown.

[0037] In particular, Figure 1 A powder application system cleaning device 100 implemented in components of a powder application system 200 according to aspects of the present disclosure is shown. Additionally, Figure 1 Aspects shown and described in relation thereto may include any other aspects of the powder application system 200 and the powder application system cleaning device 100 described herein. Additionally, Figure 1 Aspects shown and described in relation hereto may be implemented in any other aspects of the powder application system 200 and the powder application system cleaning device 100 described and shown herein.

[0038] In this regard, the powder application system cleaning device 100 may be configured to be implemented in one or more components of the powder application system 200. Additionally, the powder application system 200 may implement one or more embodiments of the powder application system cleaning device 100. In certain aspects, the powder application system cleaning device 100 may continuously, intermittently, temporarily, and / or similarly apply ultrasonic energy to components of the powder application system 200 to minimize powder accumulation, contamination, and / or similar problems. In certain aspects, the powder application system cleaning device 100 may minimize the need for application pressure air for removing powder from components of the powder application system 200. In certain aspects, the powder application system cleaning device 100 may minimize the cleaning time of components of the powder application system 200. In certain aspects, the powder application system cleaning device 100 may minimize the contamination risk associated with the powder application system 200. In certain aspects, the powder application system cleaning device 100 may minimize the manual interaction of an operator to clean various aspects of the powder application system 200. In certain aspects, the powder application system cleaning device 100 may allow for the use of different component materials for the powder application system 200, such as less costly materials.

[0039] Referring to Figure 1 , the powder application system 200 may include a spray chamber 212, a powder recovery system 214, a powder supply hopper 204, a powder feeding center 202, a filtering device 230, a powder pipeline 232, and / or similar components.

[0040] In some aspects, the powder application system cleaning device 100 can be configured for implementation in the spray chamber 212. In some aspects, the spray chamber 212 can implement one or more embodiments of the powder application system cleaning device 100. More specifically, the powder application system cleaning device 100 can continuously, intermittently, temporarily, and / or similarly apply ultrasonic energy to components of the spray chamber 212 to minimize powder accumulation and contamination. In some aspects, the powder application system cleaning device 100 can minimize the need for application pressure air to remove powder from components of the spray chamber 212. In some aspects, the powder application system cleaning device 100 can minimize the cleaning time of components of the spray chamber 212. In some aspects, the powder application system cleaning device 100 can minimize the risk of contamination associated with the spray chamber 212. In some aspects, the powder application system cleaning device 100 can minimize the manual interaction of an operator to clean various aspects of the spray chamber 212. In some aspects, the powder application system cleaning device 100 can allow for the use of different component materials for the spray chamber 212, such as less costly materials.

[0041] In some aspects, the powder application system cleaning device 100 can be configured for implementation in the powder recovery system 214. In some aspects, the powder recovery system 214 can implement one or more embodiments of the powder application system cleaning device 100. More specifically, the powder application system cleaning device 100 can continuously, intermittently, temporarily, and / or similarly apply ultrasonic energy to components of the powder recovery system 214 to minimize powder accumulation and contamination. In some aspects, the powder application system cleaning device 100 can minimize the need for application pressure air to remove powder from components of the powder recovery system 214. In some aspects, the powder application system cleaning device 100 can minimize the cleaning time of components of the powder recovery system 214. In some aspects, the powder application system cleaning device 100 can minimize the risk of contamination associated with the powder recovery system 214. In some aspects, the powder application system cleaning device 100 can minimize the manual interaction of an operator to clean various aspects of the powder recovery system 214. In some aspects, the powder application system cleaning device 100 can allow for the use of different component materials for the powder recovery system 214, such as less costly materials.

[0042] In some aspects, the powder application system cleaning device 100 can be configured for implementation in the powder supply hopper 204. In some aspects, the powder supply hopper 204 can implement one or more embodiments of the powder application system cleaning device 100. More specifically, the powder application system cleaning device 100 can continuously, intermittently, temporarily, and / or similarly apply ultrasonic energy to the components of the powder supply hopper 204 to minimize powder accumulation and contamination. In some aspects, the powder application system cleaning device 100 can minimize the need for application pressure air for removing powder from the components of the powder supply hopper 204. In some aspects, the powder application system cleaning device 100 can minimize the cleaning time of the components of the powder supply hopper 204. In some aspects, the powder application system cleaning device 100 can minimize the risk of contamination associated with the powder supply hopper 204. In some aspects, the powder application system cleaning device 100 can minimize the manual interaction of the operator for cleaning various aspects of the powder supply hopper 204. In some aspects, the powder application system cleaning device 100 can allow different component materials to be used for the powder supply hopper 204, such as less costly materials.

[0043] In some aspects, the powder application system cleaning device 100 can be configured for implementation in the feed center 202. In some aspects, the powder feed center 202 can implement one or more embodiments of the powder application system cleaning device 100. More specifically, the powder application system cleaning device 100 can continuously, intermittently, temporarily, and / or similarly apply ultrasonic energy to the components of the powder feed center 202 to minimize powder accumulation and contamination. In some aspects, the powder application system cleaning device 100 can minimize the need for application pressure air for removing powder from the components of the powder feed center 202. In some aspects, the powder application system cleaning device 100 can minimize the cleaning time of the components of the powder feed center 202. In some aspects, the powder application system cleaning device 100 can minimize the risk of contamination associated with the powder feed center 202. In some aspects, the powder application system cleaning device 100 can minimize the manual interaction of the operator for cleaning various aspects of the powder feed center 202. In some aspects, the powder application system cleaning device 100 can enable different component materials to be used for the powder feed center 202, such as less costly materials.

[0044] In some aspects, the powder application system cleaning device 100 can be configured for implementation in the filtration device 230. In some aspects, the filtration device 230 can implement one or more embodiments of the powder application system cleaning device 100. More specifically, the powder application system cleaning device 100 can continuously, intermittently, temporarily, and / or similarly apply ultrasonic energy to components of the filtration device 230 to minimize powder accumulation and contamination. In some aspects, the powder application system cleaning device 100 can minimize the need for applied pressurized air to remove powder from components of the filtration device 230. In some aspects, the powder application system cleaning device 100 can minimize the cleaning time of components of the filtration device 230. In some aspects, the powder application system cleaning device 100 can minimize the risk of contamination associated with the filtration device 230. In some aspects, the powder application system cleaning device 100 can minimize the manual interaction of an operator to clean various aspects of the filtration device 230. In some aspects, the powder application system cleaning device 100 can allow for the use of different component materials for the filtration device 230, such as less costly materials.

[0045] In some aspects, the powder application system cleaning device 100 can be configured for implementation in the powder line 232. In some aspects, the powder line 232 can implement one or more embodiments of the powder application system cleaning device 100. More specifically, the powder application system cleaning device 100 can continuously, intermittently, temporarily, and / or similarly apply ultrasonic energy to components of the powder line 232 to minimize powder accumulation and contamination. In some aspects, the powder application system cleaning device 100 can minimize the need for applied pressurized air to remove powder from components of the powder line 232. In some aspects, the powder application system cleaning device 100 can minimize the cleaning time of components of the powder line 232. In some aspects, the powder application system cleaning device 100 can minimize the risk of contamination associated with the powder line 232. In some aspects, the powder application system cleaning device 100 can minimize the manual interaction of an operator to clean various aspects of the powder line 232. In some aspects, the powder application system cleaning device 100 can allow for the use of different component materials for the powder line 232, such as less costly materials.

[0046] Figure 2 A powder application system cleaning device implemented in accordance with aspects of the present disclosure is shown.

[0047] In particular, Figure 2 A powder application system cleaning device 100 implemented in accordance with aspects of the present disclosure is shown. Additionally, Figure 2 Aspects shown and described in connection therewith can include any other aspects of the powder application system 200 and the powder application system cleaning device 100 described herein. Additionally, Figure 2The aspects shown and described in connection therewith can be implemented in any other aspects of the powder application system 200 and the powder application system cleaning device 100 described and shown herein.

[0048] The powder application system cleaning device 100 can include an ultrasonic horn 102, an excitation device 104, an ultrasonic controller 106, and / or similar components. The ultrasonic horn 102 can be located on the component 292 of the powder application system 200, within the component 292 of the powder application system 200, adjacent to the component 292 of the powder application system 200, and / or similar locations.

[0049] In some aspects, the ultrasonic horn 102 can be attached to the surface 290 of the component of the powder application system 200 by an adhesive, welding, mechanical fasteners, one or more magnets, and / or similar means. In some aspects, the ultrasonic horn 102 can be directly attached to the surface 290. In some aspects, the ultrasonic horn 102 can be attached to the surface 290 through one or more intermediate attachment structures 108. The one or more intermediate attachment structures 108 can be attached to the ultrasonic horn 102 by an adhesive, welding, mechanical fasteners, one or more magnets, and / or similar means. The one or more intermediate attachment structures 108 can be attached to the surface 290 by an adhesive, welding, mechanical fasteners, one or more magnets, and / or similar means.

[0050] In some aspects, when excited by the ultrasonic energy of the powder application system cleaning device 100, the powder application system cleaning device 100 can be configured to apply ultrasonic energy to the surface 290 of the component of the powder application system 200. The excitation device 104 can be implemented as a piezoelectric transducer, a magnetostrictive transducer, and / or similar devices. In some aspects, the excitation device 104 can be implemented as a piezoelectric device made of lead zirconate titanate (PZT), barium titanate, and / or similar materials. The excitation device 104 can be coupled to the ultrasonic horn 102 along its longitudinal axis. This coupling can be a direct coupling, through an extended waveguide, and / or similar means. In some aspects, the ultrasonic horn 102 can be attached to the excitation device 104 by an adhesive, welding, mechanical fasteners, one or more magnets, and / or similar means. In some aspects, the ultrasonic horn 102 can be directly attached to the excitation device 104. In some aspects, the ultrasonic horn 102 can be attached to the excitation device 104 through one or more intermediate attachment structures by an adhesive, welding, mechanical fasteners, one or more magnets, and / or similar means.

[0051] Applying an excitation frequency between 15 kHz and 500 kHz generated by the powder application system cleaning device 100 and / or the ultrasonic controller 106 through the ultrasonic horn 102 will cause the vibration and focusing of ultrasonic energy at the desired area of the component 292 of the powder application system 200. Various alternative techniques for implementing ultrasonic transducers or horns are also within the scope of the present disclosure.

[0052] The powder application system cleaning device 100 can be configured to convert the acoustic energy of the excitation device 104 into mechanical vibration through the ultrasonic horn 102. The vibration generated by the ultrasonic horn 102 and / or the excitation device 104 can generate ultrasonic waves, which can be transmitted to the component 292 of the powder application system cleaning device 100 under the action of sound waves, so that the powder on the surface 290 of the component 292 of the powder application system cleaning device 100 is separated from the surface 290 of the component 292 of the powder application system cleaning device 100.

[0053] In some aspects, the ultrasonic controller 106 can be configured to supply energy to the powder application system cleaning device 100 to provide a continuous predetermined ultrasonic frequency to the surface 290 of the component 292. In some aspects, the ultrasonic controller 106 can be configured to supply energy to the powder application system cleaning device 100 to provide an intermittent predetermined ultrasonic frequency to the surface 290 of the component 292.

[0054] In some aspects, the ultrasonic controller 106 can be configured to supply energy to the powder application system cleaning device 100 to provide a controllable ultrasonic frequency to the surface 290 of the component 292. In some aspects, the ultrasonic controller 106 can be configured to supply energy to the powder application system cleaning device 100 to provide a varying or swept ultrasonic frequency to the surface 290 of the component 292.

[0055] In particular, the powder application system cleaning device 100 can implement one or more ultrasonic probes, also known as transducers. Additionally, the powder application system cleaning device 100 can be mechanically assembled to components of the powder application system 200. Further, the powder application system cleaning device 100 can be connected to an excitation device 104, also known as a generator. Additionally, the excitation device 104 can provide high-frequency energy to be converted into ultrasonic vibrations by the ultrasonic horn 102, and these vibrations are applied to components of the powder application system 200. In some aspects, the powder application system cleaning device 100 and / or the ultrasonic controller 106 can apply different parameters during operation, various cleaning operations, color change mode operations, and / or similar operations to achieve energy savings. Moreover, the applied ultrasonic vibrations from the powder application system cleaning device 100 can keep the components of the powder application system 200 cleaner, and during cleaning operations (such as color change mode operations), a minimum amount of pressurized air is required to clean or purge the inner surfaces of the components of the powder application system 200. Additionally, the powder application system cleaning device 100 will also minimize the cleaning operation time, color change time, etc. Further, the powder application system cleaning device 100 will also minimize manual interaction.

[0056] Figure 3 An exemplary embodiment of a powder application system cleaning device implemented in a spray booth is shown in accordance with aspects of the present disclosure.

[0057] In some aspects, the powder application system cleaning device 100 can be configured for implementation in a spray booth 212. In particular, Figure 3 An exemplary embodiment of a powder application system cleaning device implemented in a spray booth 212 is shown in accordance with aspects of the present disclosure. Additionally, Figure 3 Aspects shown and described in connection therewith can include any other aspects of the powder application system 200 and the powder application system cleaning device 100 described herein. Additionally, Figure 3 Aspects shown and described in connection therewith can be implemented in any other aspects of the powder application system 200 and the powder application system cleaning device 100 described and shown herein.

[0058] In some aspects, the powder application system cleaning device 100 can be attached to any part or component of the spray chamber 212 at multiple locations. For example, the powder application system cleaning device 100 can be attached to an external part, an external surface, an internal part, an internal surface, and / or a similar location of the spray chamber 212. The powder application system cleaning device 100 can be attached to the spray chamber 212 through the ultrasonic horn 102 and / or one or more intermediate attachment structures 108. Additionally, there can be embodiments of multiple powder application system cleaning devices 100 attached to the spray chamber 212 at multiple locations. Each embodiment of the powder application system cleaning device 100 can be connected to and controlled by the ultrasonic controller 106. Thus, the powder temporarily adhered to the spray chamber 212 can be subjected to the ultrasonic energy from the powder application system cleaning device 100, and thus the powder can be cleaned off and / or removed from the spray chamber 212.

[0059] In particular, Figure 3 An exemplary embodiment of the powder application system cleaning device 100 implemented in the spray chamber 212 according to aspects of the present disclosure is shown. In this regard, the spray chamber 212 can include a chamber ceiling 302, a floor 304, one or more chamber walls 306, and / or similar components.

[0060] In some aspects, the powder application system cleaning device 100 can be attached to the chamber ceiling 302 of the spray chamber 212 at multiple locations. For example, the powder application system cleaning device 100 can be attached to an external part, an external surface, an internal part, an internal surface, and / or a similar location of the chamber ceiling 302 of the spray chamber 212. The powder application system cleaning device 100 can be attached to the chamber ceiling 302 through the ultrasonic horn 102 and / or one or more intermediate attachment structures 108. Additionally, there can be embodiments of multiple powder application system cleaning devices 100 attached to the chamber ceiling 302 of the spray chamber 212 at multiple locations. Each embodiment of the powder application system cleaning device 100 can be connected to and controlled by the ultrasonic controller 106. Thus, the powder temporarily adhered to the chamber ceiling 302 can be subjected to the ultrasonic energy from the powder application system cleaning device 100, and thus the powder can be cleaned off and / or removed from the chamber ceiling 302 of the spray chamber 212.

[0061] In some aspects, the powder application system cleaning device 100 can be attached to the floor 304 of the spray chamber 212 at multiple locations. For example, the powder application system cleaning device 100 can be attached to an outer portion, outer surface, inner portion, inner surface, and / or similar locations of the floor 304 of the spray chamber 212. The powder application system cleaning device 100 can be attached to the floor 304 via the ultrasonic horn 102 and / or one or more intermediate attachment structures 108. Additionally, there can be embodiments of multiple powder application system cleaning devices 100 attached to the floor 304 of the spray chamber 212 at multiple locations. Each embodiment of the powder application system cleaning device 100 can be connected to and controlled by the ultrasonic controller 106. Thus, the powder temporarily adhered to the floor 304 can be acted upon by the ultrasonic energy from the powder application system cleaning device 100, and thus the powder can be cleaned off and / or removed from the floor 304 of the spray chamber 212.

[0062] In some aspects, the powder application system cleaning device 100 can be attached to one or more chamber walls 306 of the spray chamber 212 at multiple locations. For example, the powder application system cleaning device 100 can be attached to an outer portion, outer surface, inner portion, inner surface, and / or similar locations of one or more chamber walls 306 of the spray chamber 212. The powder application system cleaning device 100 can be attached to the one or more chamber walls 306 via the ultrasonic horn 102 and / or one or more intermediate attachment structures 108. Additionally, there can be embodiments of multiple powder application system cleaning devices 100 attached to the one or more chamber walls 306 of the spray chamber 212 at multiple locations. Each embodiment of the powder application system cleaning device 100 can be connected to and controlled by the ultrasonic controller 106. Thus, the powder temporarily adhered to the one or more chamber walls 306 can be acted upon by the ultrasonic energy from the powder application system cleaning device 100, and thus the powder can be cleaned off and / or removed from the one or more chamber walls 306 of the spray chamber 212, as indicated by the arrows.

[0063] Figure 4 An exemplary embodiment of a powder application system cleaning device implemented in a powder supply hopper is shown in accordance with aspects of the present disclosure.

[0064] Figure 5 An exemplary embodiment of a powder application system cleaning device implemented in a powder supply hopper in accordance with Figure 4 is shown.

[0065] In particular, Figure 4 an exemplary embodiment of a powder application system cleaning device 100 implemented in a powder supply hopper 204 is shown in accordance with aspects of the present disclosure. Additionally, Figure 4Aspects shown and described in connection therewith may include any other aspects of the powder application system 200 and the powder application system cleaning device 100 described herein. Additionally, Figure 4 Aspects shown and described in connection therewith may be implemented in any other aspects of the powder application system 200 and the powder application system cleaning device 100 described and shown herein.

[0066] In some aspects, the powder application system cleaning device 100 may be configured to be attached to any portion or component of the powder supply hopper 204 at multiple locations. For example, the powder application system cleaning device 100 may be attached to an external portion, external surface, internal portion, internal surface, and / or similar locations of the powder supply hopper 204. The powder application system cleaning device 100 may be attached to the powder supply hopper 204 via the ultrasonic horn 102 and / or one or more intermediate attachment structures 108, as Figure 5 shown. Additionally, there may be embodiments of multiple powder application system cleaning devices 100 attached to the powder supply hopper 204 at multiple locations. Each embodiment of the powder application system cleaning device 100 may be connected to and controlled by the ultrasonic controller 106. Thus, the powder temporarily adhered to the powder supply hopper 204 may be subjected to ultrasonic energy from the powder application system cleaning device 100, and thus the powder may be cleaned off and / or removed from the powder supply hopper 204.

[0067] Referring to Figure 4 , the powder supply hopper 204 may include a hopper wall 242, a lid 240, an outlet port 238, an outlet port 280, a top opening 228, and / or similar components.

[0068] In some aspects, the powder application system cleaning device 100 may be configured to be attached to the hopper wall 242 of the powder supply hopper 204 at multiple locations, as Figure 4 and Figure 5 shown. For example, the powder application system cleaning device 100 may be attached to an external portion, external surface, internal portion, internal surface, and / or similar locations of the hopper wall 242. As Figure 4 and Figure 5As shown, the powder application system cleaning device 100 can be attached to the outer surface of the hopper wall 242 of the powder supply hopper 204. The powder application system cleaning device 100 can be attached to the hopper wall 242 through the ultrasonic horn 102 and / or one or more intermediate attachment structures 108. Additionally, there can be embodiments of multiple powder application system cleaning devices 100 attached to the hopper wall 242 of the powder supply hopper 204 at multiple positions. Each embodiment of the powder application system cleaning device 100 can be connected to and controlled by the ultrasonic controller 106. Thus, the powder temporarily adhered to the hopper wall 242 can be subjected to the ultrasonic energy from the powder application system cleaning device 100, and thus the powder can be cleaned off and / or removed from the hopper wall 242 of the powder supply hopper 204. In this regard, the hopper wall 242 of the powder supply hopper 204 can have a cylindrical structure, as Figure 4 shown. In other aspects, the hopper wall 242 of the powder supply hopper 204 can have a square structure, a rectangular structure, and / or a similar structure.

[0069] In some aspects, the powder application system cleaning device 100 can be configured to be attached to the lid 240 of the powder supply hopper 204 at multiple positions. For example, the powder application system cleaning device 100 can be attached to the outer portion, outer surface, inner portion, inner surface, and / or similar positions of the lid 240. The powder application system cleaning device 100 can be attached to the lid 240 through the ultrasonic horn 102 and / or one or more intermediate attachment structures 108. Additionally, there can be embodiments of multiple powder application system cleaning devices 100 attached to the lid 240 of the powder supply hopper 204 at multiple positions. Each embodiment of the powder application system cleaning device 100 can be connected to and controlled by the ultrasonic controller 106. Thus, the powder temporarily adhered to the lid 240 can be subjected to the ultrasonic energy from the powder application system cleaning device 100, and thus the powder can be cleaned off and / or removed from the lid 240 of the powder supply hopper 204.

[0070] Inside the lid 240 of the powder supply hopper 204, a sieve or filter can be provided inside the housing of the powder supply hopper 204. The sieve can be provided at the lower section of the housing of the powder supply hopper 204. The new powder or raw powder entering the powder supply hopper 204 can flow downward towards the sieve. The sieve makes the powder particles in the powder supply hopper 204 evenly distributed.

[0071] The powder application system 200 and / or the powder supply hopper 204 may further include a powder fluidization device for fluidizing the powder within the powder supply hopper 204. The powder fluidization device is not shown in detail. The powder fluidization device may include a source of pressurized gas and at least one pressurized gas line connected to an inlet port through which pressurized gas (particularly air) flows into the powder supply hopper 204. The pressurized gas flows into a fluidization gas chamber formed between the bottom of the powder supply hopper 204 and a porous fluidization plate located above the bottom. The gas is distributed through the fluidization plate into the powder supply hopper 204 and flows upward, thereby fluidizing the powder that has been supplied to the powder supply hopper 204. During operation, the gas may flow out through the outlet opening of the powder supply hopper 204 and out of the powder supply hopper 204 through the outlet port 238.

[0072] Figure 6 An exemplary embodiment of a powder application system cleaning device implemented in a filtration device in accordance with aspects of the present disclosure is shown.

[0073] In particular, Figure 6 An exemplary embodiment of a powder application system cleaning device 100 implemented in a filtration device 230 in accordance with aspects of the present disclosure is shown. Additionally, Figure 6 Aspects shown and described in connection therewith may include any other aspects of the powder application system 200 and the powder application system cleaning device 100 described herein. Additionally, Figure 6 Aspects shown and described in connection therewith may be implemented in any other aspects of the powder application system 200 and the powder application system cleaning device 100 described and shown herein.

[0074] In certain aspects, the powder application system cleaning device 100 may be configured to be attached to any part or component of the filtration device 230 at multiple locations. For example, the powder application system cleaning device 100 may be attached to an external portion, an external surface, an internal portion, an internal surface, and / or similar locations of the filtration device 230. The powder application system cleaning device 100 may be attached to the filtration device 230 by ultrasonic horns 102 and / or one or more intermediate attachment structures 108. Additionally, there may be embodiments of multiple powder application system cleaning devices 100 attached to the filtration device 230 at multiple locations. Each embodiment of the powder application system cleaning device 100 may be connected to and controlled by an ultrasonic controller 106. Thus, powder temporarily adhered to the filtration device 230 may be subjected to ultrasonic energy from the powder application system cleaning device 100 and may thus be cleaned off and / or removed from the filtration device 230.

[0075] The filtering device 230 can be connected to a vacuum source (not shown), such as a vacuum pump or a blower, so that the powder flowing out of the powder supply hopper 204 is pneumatically conveyed through the powder pipeline 232 into the filtering element of the filtering device 230. The powder collected in the filtering element can be taken out of the filtering device 230 through the outlet 234.

[0076] In some aspects, the powder application system cleaning device 100 can be configured to be attached to any part or component of the powder pipeline 232 at multiple locations. For example, the powder application system cleaning device 100 can be attached to the external part, external surface, internal part, internal surface and / or similar locations of the powder pipeline 232. The powder application system cleaning device 100 can be attached to the powder pipeline 232 through the ultrasonic horn 102 and / or one or more intermediate attachment structures 108. In addition, there can be embodiments of multiple powder application system cleaning devices 100 attached to the powder pipeline 232 at multiple locations. Each embodiment of the powder application system cleaning device 100 can be connected to and controlled by the ultrasonic controller 106. Therefore, the powder temporarily adhered to the powder pipeline 232 can be subjected to the ultrasonic energy from the powder application system cleaning device 100, and thus the powder can be cleaned off and / or removed from the powder pipeline 232.

[0077] Figure 7 An exemplary embodiment of the powder application system cleaning device implemented in the powder recovery system 214 according to an aspect of the present disclosure is shown.

[0078] In particular, Figure 7 An exemplary embodiment of the powder application system cleaning device 100 implemented in the powder recovery system 214 according to an aspect of the present disclosure is shown. In addition, Figure 7 The aspects shown and described in relation thereto can include any other aspects of the powder application system 200 and the powder application system cleaning device 100 described herein. In addition, Figure 7 The aspects shown and described in relation thereto can be implemented in any other aspects of the powder application system 200 and the powder application system cleaning device 100 described and shown herein.

[0079] The powder recovery system 214 may include a powder cyclone 270, a blower, and an aspirator, which are fluidly connected to the exhaust outlet of the powder cyclone 270 through pipes and provide the energy and air flow required to generate a vortex within the powder cyclone 270 for the operation of the powder recovery system 214. The fan generates suction that draws a large amount of air flow (in the form of a large amount of air flow with entrained powder inhaled from inside the spray chamber 212) into the powder cyclone 270 and reaches the intake pipe 272 of the powder cyclone 270. The powder cyclone 270 may include a tangential powder inlet (relative to the vertical axis of the cyclone) to generate a familiar cyclone circulation or vortex to separate the powder coating material from the air. The powder splash separated by the powder cyclone 270 can be recovered from the cyclone outlet and returned to the powder supply center 202.

[0080] In some aspects, the powder application system cleaning device 100 may be configured to be attached to any part or component of the powder recovery system 214 at multiple locations. For example, the powder application system cleaning device 100 may be attached to an external part, an external surface, an internal part, an internal surface, and / or similar locations of the powder recovery system 214. The powder application system cleaning device 100 may be attached to the powder recovery system 214 through the ultrasonic horn 102 and / or one or more intermediate attachment structures 108. Additionally, there may be embodiments of multiple powder application system cleaning devices 100 attached to the powder recovery system 214 at multiple locations. Each embodiment of the powder application system cleaning device 100 may be connected to and controlled by the ultrasonic controller 106. Thus, the powder temporarily adhered to the powder recovery system 214 can be subjected to the ultrasonic energy from the powder application system cleaning device 100, and thus the powder can be cleaned off and / or removed from the powder recovery system 214.

[0081] In some aspects, the powder application system cleaning device 100 can be configured to be attached to the powder cyclone 270 of the powder recovery system 214 at multiple locations. For example, the powder application system cleaning device 100 can be attached to an external portion, an external surface, an internal portion, an internal surface, and / or similar locations of the powder cyclone 270 of the powder recovery system 214. The powder application system cleaning device 100 can be attached to the powder cyclone 270 through the ultrasonic horn 102 and / or one or more intermediate attachment structures 108. Additionally, there can be embodiments of multiple powder application system cleaning devices 100 attached to the powder cyclone 270 of the powder recovery system 214 at multiple locations. Each embodiment of the powder application system cleaning device 100 can be connected to and controlled by the ultrasonic controller 106. Thus, the powder temporarily adhered to the powder cyclone 270 can be subjected to the ultrasonic energy from the powder application system cleaning device 100, and thus the powder can be cleaned off and / or removed from the powder cyclone 270 of the powder recovery system 214.

[0082] In some aspects, the powder application system cleaning device 100 can be configured to be attached to the intake duct 272 of the powder recovery system 214 at multiple locations. For example, the powder application system cleaning device 100 can be attached to an external portion, an external surface, an internal portion, an internal surface, and / or similar locations of the intake duct 272 of the powder recovery system 214. The powder application system cleaning device 100 can be attached to the intake duct 272 through the ultrasonic horn 102 and / or one or more intermediate attachment structures 108. Additionally, there can be embodiments of multiple powder application system cleaning devices 100 attached to the intake duct 272 of the powder recovery system 214 at multiple locations. Each embodiment of the powder application system cleaning device 100 can be connected to and controlled by the ultrasonic controller 106. Thus, the powder temporarily adhered to the intake duct 272 can be subjected to the ultrasonic energy from the powder application system cleaning device 100, and thus the powder can be cleaned off and / or removed from the intake duct 272 of the powder recovery system 214.

[0083] Figure 8 A method of implementing a powder application system cleaning device according to aspects of the present disclosure is shown.

[0084] In particular, Figure 8 A method of implementing the powder application system cleaning device 100 according to aspects of the present disclosure is shown. Additionally, Figure 8 The aspects shown and described in relation thereto can include any other aspects of the powder application system 200 and the powder application system cleaning device 100 described herein. Additionally, Figure 8Aspects shown and described in connection therewith may be implemented in any other aspect of the powder application system 200 and the powder application system cleaning device 100 described and shown herein.

[0085] In particular, Figure 8 is an exemplary method of implementing the powder application system cleaning device 400 of the present disclosure. In particular, it should be noted that the method of implementing the powder application system cleaning device 400 is merely exemplary and may be modified in accordance with various aspects disclosed herein. In addition, the method of implementing the powder application system cleaning device 400 of the present disclosure may include a method of manufacturing the powder application system cleaning device 100 and / or the powder application system 200. It should be noted that the method of implementing the powder application system cleaning device 400 may be carried out in a different order according to the above aspects. In addition, the method of implementing the powder application system cleaning device 400 may be modified in accordance with various aspects disclosed herein to add or subtract method steps.

[0086] The method of the present disclosure for implementing the powder application system cleaning device 400 may include configuring at least one component of the powder application system to have one or more embodiments of the powder application system cleaning device 402. In this regard, configuring at least one component of the powder application system to have one or more embodiments of the powder application system cleaning device 402 may include any one or more of the materials, structures, arrangements, methods, etc. described herein. In addition, according to the present disclosure, with respect to configuring at least one component of the powder application system to have one or more embodiments of the powder application system cleaning device 402, one or more pre - or post - method steps may also be implemented. In this regard, configuring at least one component of the powder application system to have one or more embodiments of the powder application system cleaning device 402 may include configuring at least one component of the powder application system 200 to have one or more embodiments of the powder application system cleaning device 100, as described herein.

[0087] Methods of implementing a powder application system cleaning device 400 of the present disclosure may include: generating ultrasonic waves within at least one component of the powder application system through one or more embodiments of the powder application system cleaning device in response to an ultrasonic controller 404. In this regard, generating ultrasonic waves within at least one component of the powder application system through one or more embodiments of the powder application system cleaning device in response to an ultrasonic controller 404 may include any one or more of the materials, structures, arrangements, methods, etc. described herein. Additionally, according to the present disclosure, with regard to generating ultrasonic waves within at least one component of the powder application system through one or more embodiments of the powder application system cleaning device in response to an ultrasonic controller 404, one or more pre - or post - sequence methods may also be implemented. In this regard, generating ultrasonic waves within at least one component of the powder application system through one or more embodiments of the powder application system cleaning device in response to an ultrasonic controller 404 may include: generating ultrasonic waves within at least one component of a powder application system 200 through one or more embodiments of a powder application system cleaning device 100 in response to an ultrasonic controller 106, as described herein.

[0088] Accordingly, a powder application system 200 implementing a powder application system cleaning device 100 is configured to minimize, during a color change operation and / or other cleaning operations: the application pressure air for removing powder from components of the powder application system, such as the inner wall of the powder hopper and the fluidized bed; the energy usage associated with the cleaning process; the cleaning time of components of the powder application system, such as the hopper, to enable rapid powder material change; and / or the amount of manual interaction of an operator in cleaning components of the powder application system. Additionally, the applied ultrasonic vibrations provided by the powder application system cleaning device 100 will keep the components of the powder application system 200 cleaner, and during a cleaning operation (such as a color change mode operation), minimal pressure air is required to clean or purge the inner surfaces of the components of the powder application system. Additionally, a powder application system 200 implementing a powder application system cleaning device 100 will also minimize the cleaning operation time, color change time, etc. Additionally, the disclosed devices and methods will also minimize manual interaction.

[0089] Some non - limiting examples of aspects of the present disclosure are provided below.

[0090] One example includes: a powder application system cleaning device including an excitation device. The powder application system cleaning device further includes that the excitation device is configured to emit ultrasonic energy to components of the powder application system, thereby minimizing powder accumulation and / or contamination.

[0091] The above examples may also include any one of the following examples or a combination of more than one example: The powder application system cleaning device in the above examples, wherein the excitation device is configured to provide continuous, intermittent, and / or transient ultrasonic energy emissions to components of the powder application system to minimize powder accumulation and / or contamination. The powder application system cleaning device in the above examples, wherein the powder application system may include a spray chamber; and the powder application system cleaning device is configured to be implemented in the spray chamber. The powder application system cleaning device in the above examples, wherein the powder application system cleaning device is attached to the ceiling of the spray chamber. The powder application system cleaning device in the above examples, wherein the powder application system cleaning device is attached to the floor of the spray chamber. The powder application system cleaning device in the above examples, wherein the powder application system cleaning device is attached to one or more chamber walls of the spray chamber. The powder application system cleaning device in the above examples, wherein the powder application system cleaning device is attached to the ceiling of the spray chamber; wherein the powder application system cleaning device is attached to the floor of the spray chamber; and wherein the powder application system cleaning device is attached to one or more chamber walls of the spray chamber. The powder application system cleaning device in the above examples, wherein the powder application system may include a powder supply hopper; and wherein the powder application system cleaning device is configured to be implemented in the powder supply hopper. The powder application system cleaning device in the above examples, wherein the powder application system cleaning device is configured to be attached to the wall of the powder supply hopper. The powder application system cleaning device in the above examples, wherein the powder application system cleaning device is configured to be attached to the lid of the powder supply hopper. The powder application system cleaning device in the above examples, wherein the powder application system may include a powder feeding center; and wherein the powder application system cleaning device is configured to be implemented in the powder feeding center. The powder application system cleaning device in the above examples, wherein the powder application system may include a filtering device; and wherein the powder application system cleaning device is configured to be implemented in the filtering device. The powder application system cleaning device in the above examples may include: an ultrasonic horn; and an ultrasonic controller. The powder application system cleaning device in the above examples, wherein the ultrasonic horn is located on, in, and / or adjacent to components of the powder application system. The powder application system cleaning device in the above examples, wherein the ultrasonic horn is attached to the surface of the components of the powder application system by adhesives, welding, mechanical fasteners, and / or one or more magnets. The powder application system cleaning device in the above examples, wherein the ultrasonic controller is configured to provide energy to the powder application system cleaning device to provide a controllable ultrasonic frequency to the surface of the components. The powder application system cleaning device in the above examples, wherein the ultrasonic controller is configured to provide energy to the powder application system cleaning device to provide a varying or swept ultrasonic frequency to the surface of the components.The powder application system cleaning device in the above example, wherein the powder application system cleaning device is configured to apply ultrasonic energy to the surface of the components of the powder application system. The powder application system cleaning device in the above example, wherein the excitation device may include a piezoelectric transducer and / or a magnetostrictive transducer. The powder application system cleaning device in the above example, wherein the powder application system cleaning device may include a plurality of said powder application system cleaning devices. The powder application system cleaning device in the above example, wherein the powder application system cleaning device is configured to be attached to any part or component of the powder pipeline. The powder application system cleaning device in the above example, wherein the powder application system cleaning device is configured to be attached to the powder cyclone separator of the powder recovery system. The powder application system cleaning device in the above example, wherein the powder application system cleaning device is configured to be attached to the air intake duct of the powder recovery system.

[0092] One example includes: a powder application system cleaning device, comprising an excitation device. The powder application system cleaning device also includes an ultrasonic horn. The powder application system cleaning device further includes an ultrasonic controller. The powder application system cleaning device also includes the excitation device configured to apply ultrasonic energy to components of the powder application system, thereby minimizing powder accumulation and / or contamination.

[0093] The above examples may also include any one of the following examples or a combination of more than one example: The powder application system cleaning device in the above examples, wherein the excitation device is configured to provide a continuous, intermittent, and / or temporary release of ultrasonic energy to components of the powder application system to minimize powder accumulation and / or contamination. The powder application system cleaning device in the above examples, wherein the powder application system may include a spray chamber; and wherein the powder application system cleaning device is configured to be implemented in the spray chamber. The powder application system cleaning device in the above examples, wherein the powder application system cleaning device is attached to the ceiling of the spray chamber. The powder application system cleaning device in the above examples, wherein the powder application system cleaning device is attached to the floor of the spray chamber. The powder application system cleaning device in the above examples, wherein the powder application system cleaning device is attached to one or more chamber walls of the spray chamber. The powder application system cleaning device in the above examples, wherein the powder application system cleaning device is attached to the ceiling of the spray chamber; wherein the powder application system cleaning device is attached to the floor of the spray chamber; and wherein the powder application system cleaning device is attached to one or more chamber walls of the spray chamber. The powder application system cleaning device in the above examples, wherein the powder application system may include a powder supply hopper; and wherein the powder application system cleaning device is configured to be implemented in the powder supply hopper. The powder application system cleaning device in the above examples, wherein the powder application system cleaning device is configured to be attached to the wall of the powder supply hopper. The powder application system cleaning device in the above examples, wherein the powder application system cleaning device is configured to be attached to the lid of the powder supply hopper. The powder application system cleaning device in the above examples, wherein the powder application system may include a powder feeding center; and wherein the powder application system cleaning device is configured to be implemented in the powder feeding center. The powder application system cleaning device in the above examples, wherein the powder application system may include a filtering device; and wherein the powder application system cleaning device is configured to be implemented in the filtering device. The powder application system cleaning device in the above examples, wherein the ultrasonic horn is located on, in, and / or adjacent to components of the powder application system. The powder application system cleaning device in the above examples, wherein the ultrasonic horn is attached to the surface of the components of the powder application system by an adhesive, welding, mechanical fasteners, and / or one or more magnets. The powder application system cleaning device in the above examples, wherein the powder application system cleaning device is configured to apply ultrasonic energy to the surface of the components of the powder application system. The powder application system cleaning device in the above examples, wherein the excitation device may include a piezoelectric transducer and / or a magnetostrictive transducer. The powder application system cleaning device in the above examples, wherein the ultrasonic controller is configured to provide energy to the powder application system cleaning device to provide a controllable ultrasonic frequency to the surface of the components.The powder application system cleaning device in the above example, wherein the ultrasonic controller is configured to provide energy to the powder application system cleaning device to provide a varying or swept ultrasonic frequency to the surface of the component. The powder application system cleaning device in the above example, wherein the powder application system cleaning device may include a plurality of the powder application system cleaning devices. The powder application system cleaning device in the above example, wherein the powder application system cleaning device is configured to be attached to any part or component of the powder pipeline. The powder application system cleaning device in the above example, wherein the powder application system cleaning device is configured to be attached to the powder cyclone separator of the powder recovery system. The powder application system cleaning device in the above example, wherein the powder application system cleaning device is configured to be attached to the intake duct of the powder recovery system.

[0094] One example includes: a method that includes providing an excitation device. The method further includes configuring the excitation device to deliver ultrasonic energy to a component of a powder application system, thereby minimizing powder accumulation and / or contamination.

[0095] The above examples may also include any one or a combination of more than one of the following examples: The method in the above examples, wherein the excitation device is configured to provide continuous, intermittent, and / or transient ultrasonic energy application to components of the powder application system to minimize powder accumulation and / or contamination. The method in the above examples, wherein the powder application system may include a spray chamber; and wherein the powder application system cleaning device is configured to be implemented in the spray chamber. The method in the above examples, wherein the powder application system cleaning device is attached to the ceiling of the spray chamber. The method in the above examples, wherein the powder application system cleaning device is attached to the floor of the spray chamber. The method in the above examples, wherein the powder application system cleaning device is attached to one or more chamber walls of the spray chamber. The method in the above examples, wherein the powder application system cleaning device is attached to the ceiling of the spray chamber; wherein the powder application system cleaning device is attached to the floor of the spray chamber; and wherein the powder application system cleaning device is attached to one or more chamber walls of the spray chamber. The method in the above examples, wherein the powder application system may include a powder supply hopper; and wherein the powder application system cleaning device is configured to be implemented in the powder supply hopper. The method in the above examples, wherein the powder application system cleaning device is configured to be attached to the hopper wall of the powder supply hopper. The method in the above examples, wherein the powder application system cleaning device is configured to be attached to the lid of the powder supply hopper. The method in the above examples, wherein the powder application system may include a powder feeding center; and wherein the powder application system cleaning device is configured to be implemented in the powder feeding center. The method in the above examples, wherein the powder application system may include a filtering device; and wherein the powder application system cleaning device is configured to be implemented in the filtering device. The method in the above examples may include: an ultrasonic horn; and an ultrasonic controller. The method in the above examples, wherein the ultrasonic horn is located on, in, and / or adjacent to components of the powder application system. The method in the above examples, wherein the ultrasonic horn is attached to the surface of components of the powder application system by adhesives, welding, mechanical fasteners, and / or one or more magnets. The method in the above examples, wherein the ultrasonic controller is configured to provide energy to the powder application system cleaning device to provide a controllable ultrasonic frequency to the surface of the components. The method in the above examples, wherein the ultrasonic controller is configured to provide energy to the powder application system cleaning device to provide a varying or swept ultrasonic frequency to the surface of the components. The method in the above examples, wherein the powder application system cleaning device is configured to apply ultrasonic energy to the surface of components of the powder application system. The method in the above examples, wherein the excitation device may include a piezoelectric transducer and / or a magnetostrictive transducer. The method in the above examples, wherein the powder application system cleaning device may include a plurality of the powder application system cleaning devices. The method in the above examples, wherein the powder application system cleaning device is configured to be attached to any part or component of the powder pipeline.The method in the above example, wherein the powder application system cleaning device is configured to be attached to the powder cyclone separator of the powder recovery system. The method in the above example, wherein the powder application system cleaning device is configured to be attached to the intake duct of the powder recovery system.

[0096] One example includes: a method that includes providing an excitation device. The method further includes providing an ultrasonic horn. The method further includes providing an ultrasonic controller. The method also includes configuring the excitation device to deliver ultrasonic energy to components of the powder application system, thereby minimizing powder accumulation and / or contamination.

[0097] The above examples may also include any one or a combination of more than one of the following examples: The method in the above examples, wherein the excitation device is configured to provide continuous, intermittent, and / or transient ultrasonic energy application to components of the powder application system to minimize powder accumulation and / or contamination. The method in the above examples, wherein the powder application system may include a spray chamber; and wherein the powder application system cleaning device is configured to be implemented in the spray chamber. The method in the above examples, wherein the powder application system cleaning device is attached to the ceiling of the spray chamber. The method in the above examples, wherein the powder application system cleaning device is attached to the floor of the spray chamber. The method in the above examples, wherein the powder application system cleaning device is attached to one or more chamber walls of the spray chamber. The method in the above examples, wherein the powder application system cleaning device is attached to the ceiling of the spray chamber; wherein the powder application system cleaning device is attached to the floor of the spray chamber; and wherein the powder application system cleaning device is attached to one or more chamber walls of the spray chamber. The method in the above examples, wherein the powder application system may include a powder supply hopper; and wherein the powder application system cleaning device is configured to be implemented in the powder supply hopper. The method in the above examples, wherein the powder application system cleaning device is configured to be attached to the hopper wall of the powder supply hopper. The method in the above examples, wherein the powder application system cleaning device is configured to be attached to the lid of the powder supply hopper. The method in the above examples, wherein the powder application system may include a powder feeding center; and wherein the powder application system cleaning device is configured to be implemented in the powder feeding center. The method in the above examples, wherein the powder application system may include a filtering device; and wherein the powder application system cleaning device is configured to be implemented in the filtering device. The method in the above examples, wherein the ultrasonic horn is located on, within, and / or adjacent to components of the powder application system. The method in the above examples, wherein the ultrasonic horn is attached to the surface of components of the powder application system by adhesives, welding, mechanical fasteners, and / or one or more magnets. The method in the above examples, wherein the powder application system cleaning device is configured to apply ultrasonic energy to the surface of components of the powder application system. The method in the above examples, wherein the excitation device may include a piezoelectric transducer and / or a magnetostrictive transducer. The method in the above examples, wherein the ultrasonic controller is configured to provide energy to the powder application system cleaning device to provide a controllable ultrasonic frequency to the surface of the components. The method in the above examples, wherein the ultrasonic controller is configured to provide energy to the powder application system cleaning device to provide a varying or swept ultrasonic frequency to the surface of the components. The method in the above examples, wherein the powder application system cleaning device may include a plurality of powder application system cleaning devices. The method in the above examples, wherein the powder application system cleaning device is configured to be attached to any part or component of the powder pipeline.The method in the above example, wherein the powder application system cleaning device is configured to be attached to the powder cyclone separator of the powder recovery system. The method in the above example, wherein the powder application system cleaning device is configured to be attached to the intake duct of the powder recovery system.

[0098] It should be understood that although terms such as first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, without departing from the scope of the present disclosure, the first element may be referred to as the second element, and similarly, the second element may be referred to as the first element. As used herein, the term "and / or" includes any and all combinations of one or more of the related listed items.

[0099] It will be understood that when an element (such as a layer, region or substrate) is referred to as being "on" or extending "onto" another element, it can be directly on or directly extend onto the other element, or there may also be intervening elements. In contrast, when an element is referred to as being "directly on" or "directly extending onto" another element, there are no intervening elements. Similarly, it should be understood that when an element (such as a layer, region or substrate) is referred to as being "above" or extending "above" another element, it can be directly above or directly extend above the other element, or there may also be intervening elements. In contrast, when an element is referred to as being "directly above" or "directly extending above" another element, there are no intervening elements. It should also be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element, or there may also be intervening elements. In contrast, when an element is referred to as being "directly connected" or "directly coupled" to another element, there are no intervening elements.

[0100] Relative terms, such as "below" or "above" or "upper" or "lower" or "horizontal" or "vertical", may be used to describe the relationship between one element, layer or region and another element, layer or region, as shown in the drawings. It should be understood that these terms, as well as the terms discussed above, are intended to cover different orientations of the device other than the orientation shown in the drawings.

[0101] The terms used herein are for the purpose of describing particular aspects only and are not intended to limit the present disclosure. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising", when used herein, specify the presence of the stated features, integers, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof.

[0102] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will be further understood that the terms used herein should be interpreted as having a meaning that is consistent with their meaning in the specification and the relevant art, and will not be interpreted in an idealized or overly formal manner unless expressly so defined herein.

[0103] Many features and advantages of the present disclosure are apparent from the detailed description, and thus, the appended claims are intended to cover all such features and advantages of the present disclosure that fall within the true spirit and scope of the present disclosure. Further, since many modifications and variations will be readily apparent to those of ordinary skill in the art, it is not desired to limit the present disclosure to the exact construction and operation shown and described, and accordingly, all suitable modifications and equivalents that fall within the scope of the present disclosure may be employed.

Claims

1. A powder application system cleaning device, which is configured to be implemented in multiple components of a powder application system. The powder application system cleaning device comprises: an excitation device; and the excitation device is configured to emit ultrasonic energy to components of the powder application system, thereby minimizing powder accumulation and / or contamination.

2. The powder application system cleaning device according to claim 1, wherein the excitation device is configured to provide a continuous, intermittent, and / or temporary emission of ultrasonic energy to components of the powder application system, thereby minimizing powder accumulation and / or contamination.

3. The powder application system cleaning device according to claim 1, wherein the powder application system includes a spraying chamber; and wherein the powder application system cleaning device is configured to be implemented in the spraying chamber.

4. The powder application system cleaning device according to claim 1, wherein the powder application system includes a powder supply hopper; and wherein the powder application system cleaning device is configured to be implemented in the powder supply hopper.

5. The powder application system cleaning device according to claim 1, wherein the powder application system includes a powder feeding center; and wherein the powder application system cleaning device is configured to be implemented in the powder feeding center.

6. The powder application system cleaning device according to claim 1, wherein the powder application system includes a filtering device; and wherein the powder application system cleaning device is configured to be implemented in the filtering device.

7. The powder application system cleaning device according to claim 1, further comprises: an ultrasonic horn; and an ultrasonic controller.

8. The powder application system cleaning device according to claim 7, wherein the ultrasonic horn is located on, in, and / or adjacent to components of the powder application system.

9. The powder application system cleaning device according to claim 7, wherein the ultrasonic horn is attached to the surface of components of the powder application system by adhesive, by welding, by mechanical fasteners, and / or by one or more magnets.

10. The powder application system cleaning device according to claim 1, wherein the powder application system cleaning device is configured to apply ultrasonic energy to the surface of components of the powder application system.

11. The powder application system cleaning device according to claim 1, wherein the excitation device includes a piezoelectric transducer and / or a magnetostrictive transducer.

12. The powder application system cleaning device according to claim 7, wherein the ultrasonic controller is configured to provide energy to the powder application system cleaning device to provide a controllable ultrasonic frequency to the surface of components.

13. The powder application system cleaning device according to claim 7, wherein the ultrasonic controller is configured to provide energy to the powder application system cleaning device to provide a varying or swept ultrasonic frequency to the surface of components.

14. The powder application system cleaning device according to claim 1, wherein the powder application system cleaning device includes a plurality of said powder application system cleaning devices.

15. The powder application system cleaning device according to claim 3, wherein the powder application system cleaning device is attached to the ceiling of the spray chamber.

16. The powder application system cleaning device according to claim 3, wherein the powder application system cleaning device is attached to the floor of the spray chamber.

17. The powder application system cleaning device according to claim 3, wherein the powder application system cleaning device is attached to one or more chamber walls of the spray chamber.

18. The powder application system cleaning device according to claim 3, wherein the powder application system cleaning device is attached to the ceiling of the spray chamber; wherein the powder application system cleaning device is attached to the floor of the spray chamber; and wherein the powder application system cleaning device is attached to one or more chamber walls of the spray chamber.

19. The powder application system cleaning device according to claim 4, wherein the powder application system cleaning device is configured to be attached to the wall of the powder supply hopper.

20. The powder application system cleaning device according to claim 4, wherein the powder application system cleaning device is configured to be attached to the lid of the powder supply hopper.

21. The powder application system cleaning device according to claim 1, wherein the powder application system cleaning device is configured to be attached to any part or component of the powder pipeline.

22. The powder application system cleaning device according to claim 1, wherein the powder application system cleaning device is configured to be attached to the powder cyclone separator of the powder recovery system.

23. The powder application system cleaning device according to claim 1, wherein the powder application system cleaning device is configured to be attached to the intake pipe of the powder recovery system.

24. A powder application system cleaning device, the powder application system cleaning device being configured to be implemented in a plurality of components of a powder application system, the powder application system cleaning device comprising: an excitation device; an ultrasonic horn; an ultrasonic controller; and the excitation device is configured to apply ultrasonic energy to the components of the powder application system, thereby minimizing powder accumulation and / or contamination.

25. The powder application system cleaning device according to claim 24, wherein the excitation device is configured to provide a continuous, intermittent, and / or temporary application of ultrasonic energy to the components of the powder application system, thereby minimizing powder accumulation and / or contamination.

26. The powder application system cleaning device according to claim 24, wherein the powder application system includes a spray chamber; and wherein the powder application system cleaning device is configured to be implemented in the spray chamber.

27. The powder application system cleaning device according to claim 24, wherein the powder application system includes a powder supply hopper; and wherein the powder application system cleaning device is configured to be implemented in the powder supply hopper.

28. The powder application system cleaning device according to claim 24, wherein the powder application system includes a powder supply center; and wherein the powder application system cleaning device is configured to be implemented in the powder supply center.

29. The powder application system cleaning device according to claim 24, wherein the powder application system includes a filtering device; and wherein the powder application system cleaning device is configured to be implemented in the filtering device.

30. The powder application system cleaning device according to claim 24, wherein the ultrasonic horn is located on, in, and / or adjacent to a component of the powder application system.

31. The powder application system cleaning device according to claim 24, wherein the ultrasonic horn is attached to the surface of a component of the powder application system by an adhesive, by welding, by mechanical fasteners, and / or by one or more magnets.

32. The powder application system cleaning device according to claim 24, wherein the powder application system cleaning device is configured to apply ultrasonic energy to the surface of a component of the powder application system.

33. The powder application system cleaning device according to claim 24, wherein the excitation device includes a piezoelectric transducer and / or a magnetostrictive transducer.

34. The powder application system cleaning device according to claim 24, wherein the ultrasonic controller is configured to supply energy to the powder application system cleaning device to provide a controllable ultrasonic frequency to the surface of the component.

35. The powder application system cleaning device according to claim 24, wherein the ultrasonic controller is configured to supply energy to the powder application system cleaning device to provide a varying or swept ultrasonic frequency to the surface of the component.

36. The powder application system cleaning device according to claim 24, wherein the powder application system cleaning device includes a plurality of the powder application system cleaning devices.

37. The powder application system cleaning device according to claim 26, wherein the powder application system cleaning device is attached to the ceiling of the spray booth.

38. The powder application system cleaning device according to claim 26, wherein the powder application system cleaning device is attached to the floor of the spray booth.

39. The powder application system cleaning device according to claim 26, wherein the powder application system cleaning device is attached to one or more walls of the spray booth.

40. The powder application system cleaning device according to claim 26, wherein the powder application system cleaning device is attached to the ceiling of the spray booth; wherein the powder application system cleaning device is attached to the floor of the spray booth; and wherein the powder application system cleaning device is attached to one or more walls of the spray booth.

41. The powder application system cleaning device according to claim 27, wherein the powder application system cleaning device is configured to be attached to the wall of the powder supply hopper.

42. The powder application system cleaning device according to claim 27, wherein the powder application system cleaning device is configured to be attached to the lid of the powder supply hopper.

43. The powder application system cleaning device according to claim 24, wherein the powder application system cleaning device is configured to be attached to any part or component of the powder pipeline.

44. The powder application system cleaning device according to claim 24, wherein the powder application system cleaning device is configured to be attached to the powder cyclone separator of the powder recovery system.

45. The powder application system cleaning device according to claim 24, wherein the powder application system cleaning device is configured to be attached to the intake duct of the powder recovery system.

46. A method of implementing a powder application system cleaning device in multiple components of a powder application system, the method of implementing the powder application system cleaning device comprises: providing an excitation device; and configuring the excitation device to emit ultrasonic energy to components of the powder application system, thereby minimizing powder accumulation and / or contamination.

47. The method of implementing a powder application system cleaning device according to claim 46, wherein the excitation device is configured to provide a continuous, intermittent, and / or temporary emission of ultrasonic energy to components of the powder application system, thereby minimizing powder accumulation and / or contamination.

48. The method of implementing a powder application system cleaning device according to claim 46, wherein the powder application system includes a spray booth; and wherein the powder application system cleaning device is configured to be implemented in the spray booth.

49. The method of implementing a powder application system cleaning device according to claim 46, wherein the powder application system includes a powder supply hopper; and wherein the powder application system cleaning device is configured to be implemented in the powder supply hopper.

50. The method of implementing a powder application system cleaning device according to claim 46, wherein the powder application system includes a powder feeding center; and wherein the powder application system cleaning device is configured to be implemented in the powder feeding center.

51. The method of implementing a powder application system cleaning device according to claim 46, wherein the powder application system includes a filtering device; and wherein the powder application system cleaning device is configured to be implemented in the filtering device.

52. The method of implementing a powder application system cleaning device according to claim 46, further comprises: an ultrasonic horn; and an ultrasonic controller.

53. The method of implementing a powder application system cleaning device according to claim 52, wherein the ultrasonic horn is located on, in, and / or adjacent to components of the powder application system.

54. The method of implementing a powder application system cleaning device according to claim 52, wherein the ultrasonic horn is attached to the surface of components of the powder application system by an adhesive, by welding, by mechanical fasteners, and / or by one or more magnets.

55. A method of implementing a powder application system cleaning device according to claim 46, wherein the powder application system cleaning device is configured to apply ultrasonic energy to the surface of a component of the powder application system.

56. A method of implementing a powder application system cleaning device according to claim 46, wherein the excitation device includes a piezoelectric transducer and / or a magnetostrictive transducer.

57. A method of implementing a powder application system cleaning device according to claim 52, wherein the ultrasonic controller is configured to supply energy to the powder application system cleaning device to provide a controllable ultrasonic frequency to the surface of the component.

58. A method of implementing a powder application system cleaning device according to claim 52, wherein the ultrasonic controller is configured to supply energy to the powder application system cleaning device to provide a varying or swept ultrasonic frequency to the surface of the component.

59. A method of implementing a powder application system cleaning device according to claim 46, wherein the powder application system cleaning device includes a plurality of the powder application system cleaning devices.

60. A method of implementing a powder application system cleaning device according to claim 48, wherein the powder application system cleaning device is attached to the ceiling of the spray chamber.

61. A method of implementing a powder application system cleaning device according to claim 48, wherein the powder application system cleaning device is attached to the floor of the spray chamber.

62. A method of implementing a powder application system cleaning device according to claim 48, wherein the powder application system cleaning device is attached to one or more chamber walls of the spray chamber.

63. A method of implementing a powder application system cleaning device according to claim 48, wherein the powder application system cleaning device is attached to the ceiling of the spray chamber; wherein the powder application system cleaning device is attached to the floor of the spray chamber; and wherein the powder application system cleaning device is attached to one or more chamber walls of the spray chamber.

64. A method of implementing a powder application system cleaning device according to claim 49, wherein the powder application system cleaning device is configured to be attached to the hopper wall of the powder supply hopper.

65. A method of implementing a powder application system cleaning device according to claim 49, wherein the powder application system cleaning device is configured to be attached to the lid of the powder supply hopper.

66. A method of implementing a powder application system cleaning device according to claim 46, wherein the powder application system cleaning device is configured to be attached to any part or component of the powder pipeline.

67. A method of implementing a powder application system cleaning device according to claim 46, wherein the powder application system cleaning device is configured to be attached to the powder cyclone separator of the powder recovery system.

68. A method of implementing a powder application system cleaning device according to claim 46, wherein the powder application system cleaning device is configured to be attached to the intake pipe of the powder recovery system.

69. A method of implementing a powder application system cleaning device in multiple components of a powder application system, the method of implementing the powder application system cleaning device comprises: providing an excitation device; providing an ultrasonic horn; providing an ultrasonic controller; and configuring the excitation device to deliver ultrasonic energy to components of the powder application system, thereby minimizing powder accumulation and / or contamination.

70. The method of implementing a powder application system cleaning device according to claim 69, wherein the excitation device is configured to provide a continuous, intermittent, and / or transient delivery of ultrasonic energy to components of the powder application system, thereby minimizing powder accumulation and / or contamination.

71. The method of implementing a powder application system cleaning device according to claim 69, wherein the powder application system includes a spray booth; and wherein the powder application system cleaning device is configured to be implemented in the spray booth.

72. The method of implementing a powder application system cleaning device according to claim 69, wherein the powder application system includes a powder supply hopper; and wherein the powder application system cleaning device is configured to be implemented in the powder supply hopper.

73. The method of implementing a powder application system cleaning device according to claim 69, wherein the powder application system includes a powder feeding center; and wherein the powder application system cleaning device is configured to be implemented in the powder feeding center.

74. The method of implementing a powder application system cleaning device according to claim 69, wherein the powder application system includes a filtering device; and wherein the powder application system cleaning device is configured to be implemented in the filtering device.

75. The method of implementing a powder application system cleaning device according to claim 69, wherein the ultrasonic horn is located on, in, and / or adjacent to components of the powder application system.

76. The method of implementing a powder application system cleaning device according to claim 69, wherein the ultrasonic horn is attached to the surface of components of the powder application system by an adhesive, by welding, by mechanical fasteners, and / or by one or more magnets.

77. The method of implementing a powder application system cleaning device according to claim 69, wherein the powder application system cleaning device is configured to deliver ultrasonic energy to the surface of components of the powder application system.

78. The method of implementing a powder application system cleaning device according to claim 69, wherein the excitation device includes a piezoelectric transducer and / or a magnetostrictive transducer.

79. The method of implementing a powder application system cleaning device according to claim 69, wherein the ultrasonic controller is configured to supply energy to the powder application system cleaning device to provide a controllable ultrasonic frequency to the surface of components.

80. A method of implementing a powder application system cleaning device according to claim 69, wherein the ultrasonic controller is configured to provide energy to the powder application system cleaning device to provide a varying or swept ultrasonic frequency to the surface of the component.

81. A method of implementing a powder application system cleaning device according to claim 69, wherein the powder application system cleaning device includes a plurality of the powder application system cleaning devices.

82. A method of implementing a powder application system cleaning device according to claim 71, wherein the powder application system cleaning device is attached to the ceiling of the spray chamber.

83. A method of implementing a powder application system cleaning device according to claim 71, wherein the powder application system cleaning device is attached to the floor of the spray chamber.

84. A method of implementing a powder application system cleaning device according to claim 71, wherein the powder application system cleaning device is attached to one or more chamber walls of the spray chamber.

85. A method of implementing a powder application system cleaning device according to claim 71, wherein the powder application system cleaning device is attached to the ceiling of the spray chamber; wherein the powder application system cleaning device is attached to the floor of the spray chamber; and wherein the powder application system cleaning device is attached to one or more chamber walls of the spray chamber.

86. A method of implementing a powder application system cleaning device according to claim 72, wherein the powder application system cleaning device is configured to be attached to the hopper wall of the powder supply hopper.

87. A method of implementing a powder application system cleaning device according to claim 72, wherein the powder application system cleaning device is configured to be attached to the lid of the powder supply hopper.

88. A method of implementing a powder application system cleaning device according to claim 69, wherein the powder application system cleaning device is configured to be attached to any part or component of the powder pipeline.

89. A method of implementing a powder application system cleaning device according to claim 69, wherein the powder application system cleaning device is configured to be attached to the powder cyclone of the powder recovery system.

90. A method of implementing a powder application system cleaning device according to claim 69, wherein the powder application system cleaning device is configured to be attached to the intake pipe of the powder recovery system.

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