An ultrasonic cleaning device applicable to semiconductor wafers

Abstract

The present invention belongs to the technical field of semiconductor manufacturing, and particularly relates to an ultrasonic cleaning device suitable for semiconductor wafers, including a box body. A partition seat is fixedly connected inside the box body, and the inside of the box body is divided into a cleaning chamber and a recovery chamber by the partition seat; a fixing component is arranged in the cleaning chamber and is used for fixing the wafer to be cleaned; a first auxiliary mechanism, the first auxiliary mechanism includes a circulation part arranged at the upper end of the box body, and a linkage part is arranged on the circulation part; a driving mechanism is installed at the lower end of the box body and is used for the operation of other components; a second auxiliary mechanism, the second auxiliary mechanism includes a drying part arranged on the box body, an impurity removal part is arranged inside the recovery chamber, a transmission part is arranged at the lower end of the impurity removal part, and a cleaning part is also arranged at the impurity removal part. The present invention can achieve efficient and comprehensive cleaning, air drying of semiconductor wafers, and purification and reuse of the cleaning liquid.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor manufacturing, and particularly relates to an ultrasonic cleaning device suitable for semiconductor wafers. Background Art

[0002] During the manufacturing process of semiconductor wafers, strict cleaning steps are required to remove tiny particles and impurities on the surface to ensure their performance and reliability.

[0003] For example, in a Chinese patent: an ultrasonic cleaning device with a wafer attitude adjustment mechanism in CN114864449B. In this ultrasonic cleaning device with a wafer attitude adjustment mechanism, the driving gear drives the internal gear disk to rotate through the reduction gear, and its rotation speed will be reduced to avoid damage caused by too fast speed during the lifting and rotation of the cleaning basket. At this time, the internal gear disk drives the scroll shaft to rotate, further enabling the eccentric disk to drive the lifting plate to reciprocate up and down. At this time, the cleaning basket on the top of the supporting clamping plate can also reciprocate up and down. At this time, the driving bevel gear drives the driven bevel gear to rotate, further enabling the cleaning basket to rotate during the up and down movement, thereby achieving the effect of facilitating the improvement of cleaning uniformity and avoiding poor cleaning of the wafers on one side of the ultrasonic generating device.

[0004] For cleaning devices such as those in the above-mentioned comparative documents, although they can adjust the attitude of the wafers to achieve the purpose of comprehensively cleaning the wafers, there are still some deficiencies in actual use:

[0005] First of all, the wafers need to be placed in the cleaning basket for cleaning. However, the presence of the cleaning basket will inevitably block some areas of the wafers, or the wafers stacked on each other in the cleaning basket will also cause blockage, resulting in the generation of cleaning dead corners, thereby reducing the cleaning effect;

[0006] Secondly, after the cleaning process is completed, the wafers cannot be directly air-dried and need to be air-dried separately with the help of additional equipment. During the process of transferring the wafers to the air-drying equipment, contamination is likely to occur, affecting the cleanliness of the wafers;

[0007] Finally, for the used cleaning liquid, it cannot be effectively treated, which is not conducive to subsequent recycling and reuse. Summary of the Invention

[0008] The purpose of the present invention is to provide an ultrasonic cleaning device suitable for semiconductor wafers, which can achieve efficient, comprehensive cleaning, air-drying of semiconductor wafers, and purification and reuse of the cleaning liquid.

[0009] The technical solutions adopted by the present invention are specifically as follows:

[0010] An ultrasonic cleaning device applicable to semiconductor wafers, comprising a box body, wherein a partition seat is fixedly connected inside the box body, and the inside of the box body is divided into a cleaning chamber and a recovery chamber by the partition seat;

[0011] A fixing component, which is arranged in the cleaning chamber and is used for fixing the wafer to be cleaned;

[0012] A first auxiliary mechanism, which includes a circulation part arranged at the upper end of the box body, and a linkage part is arranged on the circulation part;

[0013] A driving mechanism, which is installed at the lower end of the box body and is used for the operation of other components;

[0014] A second auxiliary mechanism, which includes a drying part arranged on the box body, an impurity removing part is arranged inside the recovery chamber, a transmission part is arranged at the lower end of the impurity removing part, and a cleaning part is also arranged at the impurity removing part;

[0015] Under specific circumstances, the driving mechanism drives the drying part to operate, and drives the impurity removing part to operate through the transmission part. When the drying part operates, it dries the cleaned wafer, and when the impurity removing part operates, it removes some impurities in the cleaning liquid. In another case, the driving mechanism drives the cleaning part to operate.

[0016] In a preferred solution, the fixing component includes two clamping plates. A guiding column is fixedly connected to one of the clamping plates, and the other clamping plate is slidably connected to the guiding column. A first compression spring is sleeved on the upper end of the guiding column. Fixing frames are arranged in an array on both clamping plates, and the fixing frames on the upper and lower clamping plates correspond to each other. Limiting rods are rotatably connected in an array on the fixing frames, and sleeves are fixedly embedded in an array on the fixing frames. A resisting block is inserted into one end of the sleeve, and a second compression spring is fixedly connected between the resisting block and the sleeve. One column of the limiting rods on the lower plurality of fixing frames is connected together, and first linkage gears are installed at both ends. Chute grooves are opened on both sides of the cleaning chamber, and convex blocks are arranged at both ends of the lower clamping plate.

[0017] In a preferred solution, the circulation part includes square grooves. The two square grooves are respectively opened on the front and back sides of the box body. Sprayers are arranged in an array at the square grooves. A water pump is fixedly installed on the back of the box body. The water pumping end of the water pump is communicated with a water pumping pipeline, and the other end of the water pumping pipeline is communicated with the cleaning chamber. The water drainage end of the water pump is communicated with a water drainage pipeline, and the other end of the water drainage pipeline is communicated with one of the square grooves.

[0018] In a preferred embodiment, the linkage part includes a hollow shell which is connected to the pumping pipeline. A rotating rod is rotatably connected to the hollow shell through a sealed bearing, and the rotating rod extends into the cleaning cavity and is rotatably connected to the box body through a sealed bearing. One end of the rotating rod is connected with a second linkage gear, and the other end of the rotating rod is connected with a water wheel.

[0019] In a preferred embodiment, the driving mechanism includes a motor which is fixedly installed on the bottom surface of the box body. A large gear, a first cam and a second cam are installed on the output shaft of the motor.

[0020] In a preferred embodiment, the air drying part includes an air delivery pipe which is arranged in the recovery cavity and both ends of which extend to the outside of the box body. One end of the air delivery pipe is connected with an air inlet hood, the other end of the air delivery pipe is connected with an installation shell. A round rod is rotatably connected to the lower end of the installation shell through a sealed bearing. A fan blade is installed at the upper end of the round rod, a small gear is installed at the lower end of the round rod, a bipolar ionization module is installed in the installation shell, and two flow dividing pipes are communicated with the upper end of the installation shell and the other ends of the flow dividing pipes are communicated with the square groove.

[0021] In a preferred embodiment, the impurity removing part includes permanent magnetic plates. The two permanent magnetic plates are arranged on the front and back sides of the air delivery pipe and are fixedly connected to the inner wall of the recovery cavity by using support rods. Hollow cylinders are inlaid on the front and back sides of the box body. A filter screen and an activated carbon adsorption plate are fixedly connected to the inner wall of the hollow cylinder. A connecting rod is inserted into one end of the hollow cylinder. One end of the connecting rod is fixedly connected with a piston plate. A third compression spring is connected between the piston plate and the inner wall of the hollow cylinder.

[0022] In a preferred embodiment, the transmission part includes a movable rod which is slidably connected to a sleeve block on the bottom surface of the box body. One end of the movable rod is connected with a push rod. A support frame is fixedly connected to the side surface of the box body, and a dial rod is hinged to the support frame.

[0023] In a preferred embodiment, the cleaning part includes brush plates. The two brush plates are respectively arranged on the side surfaces of the two permanent magnetic plates. Moving rods are fixedly connected to both sides of the brush plates. A sliding sleeve is sleeved on the outer wall of the moving rod, and the sliding sleeve is fixedly connected to the inner wall of the recovery cavity by using a support rod. A spring is fixedly connected to one end of the moving rod, and the other end of the spring is fixedly connected to the sliding sleeve. A piston rod is fixedly connected between the two moving rods by using a support plate, and the piston rod is inserted into the box body in a piston type manner. One ends of the two piston rods are fixedly connected with a force receiving frame.

[0024] In a preferred embodiment, a liquid discharge pipe is arranged on the separation seat, and a solenoid valve is arranged on the liquid discharge pipe.

[0025] The technical effects achieved by the present invention are:

[0026] Through the design of the fixing components, especially the coordinated action of the upper and lower corresponding fixing frames, the present invention can firmly fix the wafer, and during the cleaning process, the wafer can rotate freely under the action of the linkage part, thereby ensuring that the surface of the wafer can be comprehensively and evenly cleaned. In addition, the design of the circulation part enables the cleaning liquid to flow continuously and rinse the wafer, further improving the cleaning efficiency and cleanliness;

[0027] In the present invention, the air drying part in the second auxiliary mechanism can be immediately started after the cleaning is completed to efficiently dry the wafer. Especially, due to the adoption of the bipolar ionization module, positive and negative ions will be generated when the air passes through the installation shell. These ions can neutralize the static charges on the surface of the wafer and in the air, preventing dust adsorption, thereby ensuring the cleanliness and cleaning state of the wafer. In addition, by utilizing the waste heat contained in the recycled cleaning liquid, the air can be further heated to form hot air. This method not only significantly improves the efficiency and effect of the drying process, but also realizes the efficient utilization of energy and reduces energy waste;

[0028] In the present invention, the impurity removal part includes a permanent magnet plate that can effectively adsorb ferromagnetic impurities, and an activated carbon adsorption plate that is specifically used to remove organic pollutants. The introduction of this dual filtration mechanism significantly improves the purification effect of the cleaning liquid. In addition, the design of the transmission part and the cleaning part ensures the automatic operation and maintenance of the entire system, greatly reducing the dependence on manual operation. Such a design not only contributes to environmental protection because it reduces waste generation and harmful substance emissions, but also can reduce production costs by improving resource utilization rate to achieve economic benefit improvement. The dual advantages of this system design reflect both the responsibility for the environment and the pursuit of economic benefits. Description of the Drawings

[0029] Figure 1 is the overall structural schematic diagram of the present invention;

[0030] Figure 2 is the bottom view of the overall structure of the present invention;

[0031] Figure 3 is the internal structural schematic diagram of the box body of the present invention;

[0032] Figure 4 is the present invention Figure 3 side sectional view;

[0033] Figure 5 is the structural schematic diagram of the linkage part of the present invention;

[0034] Figure 6 is the internal structural schematic diagram of the cleaning chamber of the present invention;

[0035] Figure 7 It is a schematic internal structure diagram of the recovery chamber of the present invention;

[0036] Figure 8 It is a partial structure schematic diagram of the air drying part of the present invention;

[0037] Figure 9 It is a connection schematic diagram of the impurity removal part and the transmission part of the present invention;

[0038] Figure 10 It is a schematic structure diagram of the permanent magnet plate of the present invention;

[0039] Figure 11 It is a schematic structure diagram of the fixing component of the present invention;

[0040] Figure 12 It is a schematic structure diagram of the fixing frame of the present invention;

[0041] Figure 13 It is the present invention Figure 12 cross-sectional view;

[0042] Figure 14 It is a connection schematic diagram of the cleaning part and the driving mechanism of the present invention;

[0043] Figure 15 It is a connection schematic diagram of the large gear, the first cam, the second cam and the motor output shaft of the present invention.

[0044] In the drawings, the list of components represented by each reference numeral is as follows:

[0045] 1. Box body; 11. Cleaning chamber; 12. Recovery chamber; 2. Partition seat; 3. Fixing component; 4. First auxiliary mechanism; 5. Driving mechanism; 6. Second auxiliary mechanism;

[0046] 31. Slide groove; 32. Clamping plate; 33. Guide post; 34. First compression spring; 35. Fixing frame; 36. Limiting rod; 37. Sleeve; 38. Contact block; 39. Second compression spring; 310. First linkage gear;

[0047] 41. Circulation part; 42. Linkage part;

[0048] 411. Square groove; 412. Sprinkler head; 413. Water pump; 414. Water extraction pipeline; 415. Drainage pipeline;

[0049] 421. Hollow shell; 422. Rotating rod; 423. Second linkage gear; 424. Water wheel;

[0050] 51. Motor; 52. Large gear; 53. First cam; 54. Second cam;

[0051] 61. Air drying part; 62. Impurity removal part; 63. Transmission part; 64. Cleaning part;

[0052] 611, air duct; 612, air inlet hood; 613, installation shell; 614, round rod; 615, fan blade; 616, pinion gear; 617, bipolar ionization module; 618, shunt pipe;

[0053] 621, permanent magnet plate; 622, hollow cylinder; 623, filter screen; 624, activated carbon adsorption plate; 625, connecting rod; 626, piston plate; 627, third compression spring;

[0054] 631, movable rod; 632, push rod; 633, support frame; 634, lever;

[0055] 641, brush plate; 642, moving rod; 643, sliding sleeve; 644, spring; 645, piston rod; 646, stress-bearing frame. Detailed implementation manners

[0056] To make the above objects, features and advantages of the present invention more obvious and understandable, the following detailed description of the specific implementation manners of the present invention will be given in conjunction with the accompanying drawings of the specification.

[0057] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may be implemented in other ways different from those described herein. Those skilled in the art may make similar extensions without departing from the connotation of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed below.

[0058] Secondly, the so-called "one embodiment" or "embodiment" herein refers to a specific feature, structure or characteristic that may be included in at least one implementation manner of the present invention. The phrase "in a preferred embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor is it an individual or alternative embodiment that is mutually exclusive with other embodiments.

[0059] Furthermore, the present invention will be described in detail with reference to the schematic diagrams. When detailing the embodiments of the present invention, for the convenience of explanation, the cross-sectional views showing the device structure will be enlarged locally out of the general scale, and the schematic diagrams are only examples and should not limit the scope of protection of the present invention herein. In addition, in actual production, three-dimensional spatial dimensions including length, width and depth should be included.

[0060] Please refer to the append Figures 1 to 4 and Figure 11 As shown, this embodiment provides an ultrasonic cleaning device applicable to semiconductor wafers, including a box body 1. A partition seat 2 is fixedly connected inside the box body 1. The inside of the box body 1 is divided into a cleaning chamber 11 and a recovery chamber 12 by the partition seat 2. A drain pipe is provided on the partition seat 2, and a solenoid valve is provided on the drain pipe;

[0061] A fixing component 3, which is disposed in the cleaning chamber 11 and is used to fix the wafer to be cleaned;

[0062] A first auxiliary mechanism 4, the first auxiliary mechanism 4 comprises a circulation part 41 arranged at the upper end of the box body 1, and a linkage part 42 is arranged on the circulation part 41;

[0063] A driving mechanism 5 is installed at the lower end of the box body 1 and is used for the operation of other components;

[0064] The second auxiliary mechanism 6 includes an air dryer 61 disposed on the box body 1, a cleaning part 62 is disposed inside the recovery chamber 12, a transmission part 63 is disposed at the lower end of the cleaning part 62, and a cleaning part 64 is also disposed at the cleaning part 62;

[0065] In certain cases, the air dryer 61 is driven to operate by the driving mechanism 5, and the impurity removal part 62 is driven to operate by the transmission part 63. When the air dryer 61 operates, it dries the cleaned wafers, and when the impurity removal part 62 operates, it removes some impurities in the cleaning solution. In another case, the cleaning part 64 is driven to operate by the driving mechanism 5.

[0066] In this embodiment, an ultrasonic generator is installed on the partition seat 2, and the vibration end of the ultrasonic generator is placed on the top of the partition seat 2. A drain pipe is provided on the partition seat 2, and an electromagnetic valve is provided on the drain pipe. An electric heating plate is installed on the inner wall of the cleaning chamber 11.

[0067] The ultrasonic generator and electric heating plate are both products currently available on the market. When selecting, the specifications and usage scenarios should be suitable, and the requirements of this application should be met as much as possible. The specific model specifications and installation methods are not limited here.

[0068] A top cover is arranged at the upper end of the box body 1, and a sewage pipe is arranged at the side.

[0069] Next, please refer to Figures 11 to 13 The fixing assembly 3 includes two clamping plates 32, one of which is fixedly connected to a guide column 33, and the other clamping plate 32 is slidably connected to the guide column 33, and the upper end of the guide column 33 is sleeved with a first compression spring 34, and the two clamping plates 32 are provided with fixing frames 35 in an array distribution, and the fixing frames 35 on the upper and lower clamping plates 32 correspond to each other, and the fixing frames 35 are provided with rotationally connected limit rods 36 in an array distribution, and the fixing frames 35 are also fixedly inlaid with sleeves 37 in an array distribution, and one end of the sleeve 37 is inserted with a resistance block 38, and a second compression spring 39 is fixedly connected between the resistance block 38 and the sleeve 37, and a row of limit rods 36 on the multiple fixing frames 35 below are connected to each other, and a first linkage gear 310 is installed at both ends, and a slide groove 31 is provided on both sides of the cleaning chamber 11, and bumps are provided at both ends of the lower clamping plate 32.

[0070] In this embodiment, the clamping plate 32 located above is pulled to move upward along the guide column 33 and compress the first compression spring 34. In this process, the two corresponding upper and lower fixing frames 35 will gradually move away from each other. Next, the wafer to be cleaned is placed on the lower fixing frame 35. Then, the upper clamping plate 32 is released, and it is allowed to drive the upper fixing frame 35 to move downward under the action of the reset force of the first compression spring 34. In this way, the wafer can be firmly fixed by the synergistic effect of the upper and lower corresponding fixing frames 35. On the fixing frame 35, the rotatably connected limiting rod 36 plays the role of supporting and limiting the wafer, ensuring that the wafer can rotate freely relative to the fixing frame 35. When the wafer is inserted into the fixing frame 35, it will contact the abutment blocks 38 on both sides of the fixing frame 35, causing the abutment blocks 38 on both sides to separate from each other. At this time, the second compression spring 39 will apply a reaction force to the abutment block 38 to ensure that the abutment block 38 can be in close contact with the wafer, thereby maintaining the vertical state of the wafer, which is beneficial to the cleaning process of the wafer. In order to further optimize the rotation of the wafer, a ball is provided at the end of the abutment block 38, so that the contact between the ball and the wafer will not cause any adverse effect on the rotation of the wafer. After a plurality of wafers are fixed on the fixing assembly 3, it is necessary to insert the protrusions at both ends of the lower clamping plate 32 into the slide groove 31 to complete the connection between the fixing assembly 3 and the housing 1. When the fixing assembly 3 is installed in the housing 1, the limit rod 36 on which the first linkage gear 310 is installed can be rotated to ensure that the first linkage gear 310 and the second linkage gear 423 can be correctly meshed after installation, thereby ensuring the smooth operation of the entire device.

[0071] Secondly, please also refer to Figure 3 and Figure 4 The circulation part 41 includes a square groove 411, and two square grooves 411 are respectively opened on the front and rear sides of the box body 1. Nozzles 412 are arranged in an array at the square grooves 411. A water pump 413 is fixedly installed on the back of the box body 1. The water pumping end of the water pump 413 is connected to a water pumping pipe 414, and the other end of the water pumping pipe 414 is connected to the cleaning chamber 11. The drainage end of the water pump 413 is connected to a drainage pipe 415, and the other end of the drainage pipe 415 is connected to one of the square grooves 411.

[0072] In this embodiment, first of all, an appropriate amount of cleaning liquid needs to be injected into the cleaning chamber 11 to ensure that the cleaning liquid covers the surface of the wafer to be cleaned. Subsequently, the top cover of the box body 1 is covered to prevent liquid leakage or contamination during the cleaning process. Next, the injected cleaning liquid is heated by controlling the electric heating plate to reach the ideal cleaning temperature. While heating, the ultrasonic generator is started, and the high-frequency vibration of the ultrasonic wave is used to effectively remove the fine particles and impurities on the surface of the wafer, so as to achieve deep cleaning. During the cleaning process, the water pump 413 is started, and the cleaning liquid at the bottom of the cleaning chamber 11 is continuously pumped out through the pumping pipeline 414. These cleaning liquids will then be discharged into the square groove 411 opened on the back of the box body 1 along the drainage pipeline 415. In order to further improve the cleaning effect, the cleaning liquid sprayed from the nozzle 412 will rinse the wafer to ensure the cleanliness of the wafer surface. Through this series of steps, the cleaning quality of the wafer can be significantly improved.

[0073] Secondly, please refer to again Figure 5 , the linkage part 42 includes a hollow shell 421, the hollow shell 421 is connected to the pumping pipeline 414, a rotating rod 422 is rotatably connected to the hollow shell 421 through a sealing bearing, and the rotating rod 422 extends into the cleaning chamber 11 and is rotatably connected to the box body 1 through a sealing bearing. One end of the rotating rod 422 is connected with a second linkage gear 423, and the other end of the rotating rod 422 is connected with a water wheel 424.

[0074] In this embodiment, during the cleaning process, the cleaning liquid will flow along the pumping pipeline 414, and when it flows through, it will generate a certain impact force on the water wheel 424. This impact force causes the rotating rod 422 to start rotating. The rotation of the rotating rod 422 will further drive the second linkage gear 423 connected thereto to start rotating. The second linkage gear 423 meshes with the first linkage gear 310 to form an effective transmission mechanism. As the first linkage gear 310 rotates, a limiting rod 36 on the fixing component 3 will also rotate accordingly. During the rotation of the limiting rod 36, a force is applied to the wafer, causing it to start rotating. In this way, the wafer can be comprehensively cleaned to ensure that no part is unable to be cleaned due to being fixed, thus completely avoiding the problem of cleaning dead corners.

[0075] Please refer to again Figure 2 , Figure 14 and Figure 15 , the driving mechanism 5 includes a motor 51, the motor 51 is fixedly installed on the bottom surface of the box body 1, and a large gear 52, a first cam 53 and a second cam 54 are installed on the output shaft of the motor 51.

[0076] Please refer to again Figure 3 , Figure 7 and Figure 8, the air drying section 61 includes an air duct 611 disposed within the recovery chamber 12 and extending outwardly from both ends of the housing 1. One end of the air duct 611 is connected to an air inlet hood 612, and the other end is connected to a mounting housing 613. The lower end of the mounting housing 613 is rotatably connected to a round rod 614 through a sealed bearing. The upper end of the round rod 614 is provided with a fan blade 615, and the lower end of the round rod 614 is provided with a small gear 616. A bipolar ionization module 617 is installed within the mounting housing 613. The upper end of the mounting housing 613 is communicated with two flow dividing pipes 618, and the other ends of the flow dividing pipes 618 are communicated with the square grooves 411.

[0077] In this embodiment, after the cleaning work is completed, we first need to open the solenoid valve to allow the cleaning liquid to flow smoothly along the drain pipe into the recovery chamber 12. After a period of drainage, ensure that the cleaning liquid in the cleaning chamber 11 is completely drained, and then close the solenoid valve. Next, start the motor 51, which will drive the large gear 52, the first cam 53, and the second cam 54 to start rotating. The large gear 52 and the small gear 616 are driven by a toothed belt, thereby causing the round rod 614 to start rotating. The rotation of the round rod 614 will drive the fan blade 615 to rotate, thus performing a blowing operation. At this time, the outside air will enter the air duct 611 along the air inlet hood 612 and then flow from the air duct 611 into the mounting housing 613. The air will be divided into two streams within the mounting housing 613 and enter the two square grooves 411 respectively along the two flow dividing pipes 618. Finally, the air is blown out from the nozzles 412 on the square grooves 411 to air-dry the wafer. In addition, since the recovered cleaning liquid still retains a certain temperature, when the air flows within the air duct 611, the waste heat of the cleaning liquid can be utilized by heat transfer. In this way, the air within the air duct 611 will be heated to form hot air, which air-dries the wafer, thereby further improving the drying effect. At the same time, when the air passes through the mounting housing 613, positive and negative ions will be generated by the bipolar ionization module 617. These ions move along with the air flow and finally blow onto the wafer and within the cleaning chamber 11, neutralizing the static charges on the surface of the wafer and in the air. In this way, static electricity can be effectively eliminated, preventing the residual static electricity on the wafer from adsorbing dust in the air after the wafer is taken out of the housing 1, thereby ensuring the cleanliness and cleaning state of the wafer.

[0078] It should be noted that one-way valves are installed at the connection ends of the shunt pipe 618 and the drainage pipe 415 with the square groove 411. The settings of these one-way valves have specific functions and purposes. For the one-way valve on the shunt pipe 618, its main function is to ensure that air can smoothly enter the square groove 411 through the shunt pipe 618, while preventing the medium in the square groove 411 from flowing back into the shunt pipe 618. At the same time, the one-way valve on the drainage pipe 415 also plays a similar role. It allows the cleaning liquid to pass through the drainage pipe 415 unidirectionally into the square groove 411, but at the same time prevents the medium in the square groove 411 from flowing back into the drainage pipe 415. For example, during actual operation, when injecting the cleaning liquid into the square groove 411 through the drainage pipe 415, due to the existence of the one-way valve, the cleaning liquid will smoothly enter the square groove 411 and will not flow back into the shunt pipe 618. Similarly, when injecting air into the square groove 411 through the shunt pipe 618, the air can enter the square groove 411 through the shunt pipe 618 and will not flow back through the drainage pipe 415. This design not only improves the efficiency of the system but also enhances the safety and reliability of the operation.

[0079] The bipolar ionization module 617 uses products already publicly available on the market. When selecting a model, it should be ensured that the specifications and usage scenarios are suitable, and models that meet the requirements of this application should be selected as much as possible. Specific model specifications and installation methods are not limited here.

[0080] Please refer to again Figure 4 、 Figure 7 、 Figure 9 and Figure 10 In addition, the impurity removal part 62 includes permanent magnet plates 621. Two permanent magnet plates 621 are arranged on the front and back sides of the air delivery pipe 611 and are fixedly connected to the inner wall of the recovery chamber 12 by support rods. Hollow cylinders 622 are inlaid on both the front and back sides of the box body 1. A filter screen 623 and an activated carbon adsorption plate 624 are fixedly connected to the inner wall of the hollow cylinder 622. One end of the hollow cylinder 622 is plugged with a connecting rod 625. One end of the connecting rod 625 is fixedly connected to a piston plate 626. A third compression spring 627 is connected between the piston plate 626 and the inner wall of the hollow cylinder 622.

[0081] Please refer to again Figure 2 and Figure 9 In addition, the transmission part 63 includes a movable rod 631. The movable rod 631 is slidably connected to a sleeve block on the bottom surface of the box body 1. One end of the movable rod 631 is connected to a push rod 632. A support frame 633 is fixedly connected to the side surface of the box body 1. A lever 634 is hinged on the support frame 633.

[0082] In this embodiment, when the first cam 53 reaches a certain angle during rotation, it contacts the movable rod 631, thereby pushing the two movable rods 631 to move in opposite directions. The movement of these two movable rods 631 drives the two push rods 632 to move away from each other. As the push rods 632 move, they push the lever 634 to rotate around the end of the support frame 633. At this time, the upper end portion of the lever 634 begins to act on the connecting rod 625, causing the connecting rod 625 to move into the interior of the hollow cylinder 622. The movement of the connecting rod 625 drives the piston plate 626 to move accordingly, thereby squeezing out the cleaning liquid in the hollow cylinder 622. At the same time, this movement also causes the third compression spring 627 to be stretched. When the first cam 53 no longer contacts the movable rod 631, the restoring force of the third compression spring 627 will cause the piston plate 626 and the connecting rod 625 to return to their initial positions. During the reset process of the piston plate 626, the cleaning liquid will be sucked back into the hollow cylinder 622. In addition, during the reset process of the connecting rod 625, it will also drive the push rod 632 and the movable rod 631 back to their starting positions, thus forming a cycle of continuously pumping and discharging liquid. During this process, the cleaning liquid will flow through the activated carbon adsorption plate 624, which can effectively adsorb impurities in the cleaning liquid. During the liquid discharge process, the movement of the liquid causes the liquid on both sides to surge towards the middle, which helps to mix the cleaning liquid in the recovery chamber 12 and prevent the temperature of the cleaning liquid near the air duct 611 from decreasing, thereby avoiding affecting the heating effect on the air. At the same time, during the process of the cleaning liquid surging towards the middle, it will contact the permanent magnet plate 621, which can adsorb ferromagnetic impurities in the cleaning liquid, further improving the purification effect of the cleaning liquid and facilitating subsequent recovery and utilization. To prevent particulate impurities from entering the hollow cylinder 622 and adhering to the activated carbon adsorption plate 624, affecting its performance, a filter screen 623 is specially provided at the end of the hollow cylinder 622. The function of the filter screen 623 is to intercept particulate impurities and ensure that they do not enter the interior of the hollow cylinder 622.

[0083] Please refer to again Figure 4 and Figure 14 As shown in FIGS. and, the cleaning section 64 includes a brush plate 641. The two brush plates 641 are respectively arranged on the sides of the two permanent magnet plates 621. Both sides of the brush plate 641 are fixedly connected with movable rods 642. A sliding sleeve 643 is sleeved on the outer wall of the movable rod 642, and the sliding sleeve 643 is fixedly connected with the inner wall of the recovery chamber 12 through a support rod. One end of the movable rod 642 is fixedly connected with a spring 644, and the other end of the spring 644 is fixedly connected with the sliding sleeve 643. A piston rod 645 is fixedly connected between the two movable rods 642 by a support plate, and the piston rod 645 is pistonally inserted into the piston 1 of the box body. One end of the two piston rods 645 is fixedly connected with a force-bearing frame 646.

[0084] In this embodiment, when cleaning the inside of the box body 1, it is first necessary to inject clean water from the upper end of the box body 1 for flushing. Subsequently, the solenoid valve needs to be opened so that the water in the cleaning process can flow smoothly to the recovery chamber 12. Then, the second cam 54 starts to rotate through the drive of the motor 51. When the second cam 54 rotates to a specific position, it will apply pressure to the force frame 646, causing the force frame 646 to move to the right. This rightward movement of the force frame 646 will drive the piston rod 645, the moving rod 642 and the brush plate 641 to move together. In this process, the brush plate 641 will apply pressure to the impurities adsorbed on the permanent magnetic plate 621 and scrape them off. At the same time, due to the presence of the spring 644, when the second cam 54 no longer applies pressure to the force frame 646, the spring 644 will cause the brush plate 641 to move to the left due to its own reset force. Through this reciprocating motion, the brush plate 641 can effectively remove the impurities on the permanent magnetic plate 621, and discharge them out of the box body 1 together with the water flow during cleaning. The reciprocating cycle of this process ensures the cleaning effect inside the box body 1.

[0085] It should be noted that the large gear 52, the first cam 53 and the second cam 54 are all connected to the output shaft of the motor 51 through a pawl-ratchet structure. Specifically, the large gear 52, the first cam 53 and the second cam 54 are all rotatably connected to the output shaft of the motor 51 through a bearing, and the ratchet is fixedly connected to the output shaft of the motor 51, and the large gear 52, the first cam 53 and the second cam 54 are all fixedly connected with a ring, and a pawl is hinged on the ring, and a reset spring is connected between the pawl and the ring. When the pawl and the ratchet are successfully engaged, the output shaft of the motor 51 will drive the corresponding structure connected thereto to rotate synchronously during the rotation process. For example, when the motor 51 performs a reverse operation, the first cam 53 and the large gear 52 will rotate accordingly, thereby air-drying the wafer and filtering the cleaning liquid; and when the motor 51 performs a forward operation, it will drive the second cam 54 to rotate, and then drive the cleaning unit 64 to perform the corresponding cleaning work.

[0086] It should be noted that the pawl-ratchet structure is common knowledge in the prior art and will not be described in detail here.

[0087] The working principle of the present invention is:

[0088] Cleaning stage:

[0089] By injecting cleaning liquid into the cleaning chamber 11 and heating it to a suitable temperature using an electric heating plate, the ultrasonic generator is started to remove tiny particles and impurities on the surface of the wafer using its high-frequency vibration. At the same time, the water pump 413 draws the cleaning liquid through the pumping pipe 414 and rinses the wafer through the drainage pipe 415 and the nozzle 412.

[0090] Wafer rotation mechanism:

[0091] During the cleaning process, when the cleaning liquid flows through the pumping pipeline 414, it impacts the water wheel 424, prompting the rotating rod 422 to rotate, driving the operation of the gear system connected thereto (the second linkage gear 423 and the first linkage gear 310), thereby causing the limiting rod 36 on the fixing assembly 3 to rotate, and further causing the wafer to rotate to ensure thorough cleaning.

[0092] Air-drying stage:

[0093] After the cleaning is completed, the cleaning liquid is discharged through the drain pipe, and the motor 51 is started to drive the fan blade 615 to rotate to generate a blowing operation. The air is introduced into the nozzle 412 in the square groove 411 after passing through the bipolar ionization module 617 to air-dry the wafer. The hot air helps to improve the drying effect, and at the same time, the ionized air can neutralize static electricity.

[0094] Cleaning liquid purification and internal cleaning of the box 1:

[0095] The transmission part 63 pushes the moving parts (the moving rod 631, the push rod 632, etc.) through the cam system (the first cam 53) to realize the pumping and draining processes of the cleaning liquid. During this period, impurities are removed through the activated carbon adsorption plate 624 and the permanent magnet plate 621. In addition, the cleaning part 64 removes the impurities adsorbed on the permanent magnet plate 621 through the reciprocating movement of the brush plate 641 to keep the inside of the box 1 clean.

[0096] Special design:

[0097] The design of the check valve ensures that air and cleaning liquid do not flow backward (the check valve is located at the connection of the shunt pipe 618, the drain pipe 415 and the square groove 411), enhancing the efficiency and safety of the system; the ratchet-pawl structure enables the motor 51 to drive different functional components (the large gear 52, the first cam 53 and the second cam 54) respectively according to needs, realizing the flexibility of multi-functional operation.

[0098] The above is only the preferred embodiment of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present invention. The structures, devices and operation methods not specifically described and explained in the present invention, unless otherwise specified and limited, are implemented according to the conventional means in the art.

Claims

1. An ultrasonic cleaning device applicable to semiconductor wafers, characterized in that: It comprises a box body (1), wherein a partition seat (2) is fixedly connected to the interior of the box body (1), and the interior of the box body (1) is divided into a cleaning chamber (11) and a recovery chamber (12) by the partition seat (2); A fixing component (3), the fixing component (3) being arranged in the cleaning chamber (11) and being used to fix the wafer to be cleaned; A first auxiliary mechanism (4), the first auxiliary mechanism (4) comprising a circulation part (41) arranged at the upper end of the box body (1), and a linkage part (42) being arranged on the circulation part (41); A driving mechanism (5), the driving mechanism (5) being mounted at the lower end of the housing (1) and used for the operation of other components; a second auxiliary mechanism (6), the second auxiliary mechanism (6) comprising an air pipe (61) arranged on the box body (1), a debris removal part (62) being arranged inside the recovery chamber (12), a transmission part (63) being arranged at the lower end of the debris removal part (62), and a cleaning part (64) being further arranged at the debris removal part (62); The driving mechanism (5) drives the air drying unit (61) or the cleaning unit (64) to operate, and the transmission unit (63) drives the impurity removal unit (62) to operate, the air drying unit (61) air-dries the cleaned wafers when operating, and the impurity removal unit (62) removes some impurities in the cleaning solution when operating; The fixing assembly (3) comprises two clamping plates (32), one of which is fixedly connected to a guide column (33), and the other clamping plate (32) is slidably connected to the guide column (33), the upper end of the guide column (33) is sleeved with a first compression spring (34), the two clamping plates (32) are both provided with fixing frames (35) distributed in an array, the fixing frames (35) are provided with rotationally connected limit rods (36) distributed in an array, the fixing frames (35) are also fixedly inlaid with sleeves (37) distributed in an array, one end of the sleeve (37) is plugged with a resistance block (38), and the resistance block (38) and the sleeve (37) are connected in an array. A second compression spring (39) is fixedly connected therebetween, a row of limit rods (36) on the plurality of fixing frames (35) below are connected to each other, and first linkage gears (310) are installed at both ends, sliding grooves (31) are provided on both sides of the cleaning chamber (11), and bumps are provided at both ends of the clamping plate (32) below; The cleaning part (64) includes a brush plate (641). Both of the two brush plates (641) are arranged in the recovery chamber (12). Both sides of the brush plate (641) are fixedly connected with moving rods (642). A sliding sleeve (643) is sleeved on the outer wall of the moving rod (642), and the sliding sleeve (643) is fixedly connected with the inner wall of the recovery chamber (12) through a support rod. One end of the moving rod (642) is fixedly connected with a spring (644), and the other end of the spring (644) is fixedly connected with the sliding sleeve (643). A piston rod (645) is fixedly connected between the two moving rods (642) by a support plate, and the piston rod (645) is inserted into the box body (1) in a piston manner. One end of each of the two piston rods (645) is fixedly connected with a stress frame (646).

2. The ultrasonic cleaning device applicable to semiconductor wafers according to claim 1, characterized in that: The circulation part (41) includes a square groove (411). The two square grooves (411) are respectively opened on the front and rear sides of the box body (1). Nozzles (412) are arranged in an array at the square groove (411). A water pump (413) is fixedly installed on the back of the box body (1). The water pumping end of the water pump (413) is communicated with a water pumping pipe (414), and the other end of the water pumping pipe (414) is communicated with the cleaning chamber (11). The water drainage end of the water pump (413) is communicated with a water drainage pipe (415), and the other end of the water drainage pipe (415) is communicated with one of the square grooves (411).

3. The ultrasonic cleaning device applicable to semiconductor wafers according to claim 2, characterized in that: The linkage part (42) includes a hollow shell (421). The hollow shell (421) is communicated with the water pumping pipe (414). A rotating rod (422) is rotatably connected to the hollow shell (421) through a sealed bearing, and the rotating rod (422) extends into the cleaning chamber (11) and is rotatably connected to the box body (1) through a sealed bearing. One end of the rotating rod (422) is connected with a second linkage gear (423), and the other end of the rotating rod (422) is connected with a water wheel (424).

4. An ultrasonic cleaning device applicable to semiconductor wafers according to claim 1, wherein: The driving mechanism (5) includes a motor (51). The motor (51) is fixedly installed on the bottom surface of the box body (1). A large gear (52), a first cam (53) and a second cam (54) are installed on the output shaft of the motor (51).

5. An ultrasonic cleaning device applicable to semiconductor wafers according to claim 2, characterized in that: The air drying part (61) includes an air duct (611). The air duct (611) is arranged in the recovery chamber (12) and extends to the outside of the box body (1) at both ends. One end of the air duct (611) is connected with an air inlet hood (612). The other end of the air duct (611) is connected with an installation shell (613). A round rod (614) is rotatably connected to the lower end of the installation shell (613) through a sealed bearing. A fan blade (615) is installed at the upper end of the round rod (614). A small gear (616) is installed at the lower end of the round rod (614). A bipolar ionization module (617) is installed in the installation shell (613). Two shunt pipes (618) are communicated with the upper end of the installation shell (613), and the other end of the shunt pipe (618) is communicated with the square groove (411).

6. The ultrasonic cleaning device applicable to semiconductor wafers according to claim 5, characterized in that: The impurity removal part (62) includes permanent magnet plates (621). Two of the permanent magnet plates (621) are arranged on the front and rear sides of the air delivery pipe (611) and are fixedly connected to the inner wall of the recovery cavity (12) by support rods. Hollow cylinders (622) are inlaid on the front and rear sides of the box body (1). A filter screen (623) and an activated carbon adsorption plate (624) are fixedly connected to the inner wall of the hollow cylinder (622). One end of the hollow cylinder (622) is inserted with a connecting rod (625). One end of the connecting rod (625) is fixedly connected to a piston plate (626). A third compression spring (627) is connected between the piston plate (626) and the inner wall of the hollow cylinder (622).

7. An ultrasonic cleaning device applicable to semiconductor wafers according to claim 1, characterized in that: The transmission part (63) includes a movable rod (631). The movable rod (631) is slidably connected to the sleeve block on the bottom surface of the box body (1). One end of the movable rod (631) is connected to a push rod (632). A support frame (633) is fixedly connected to the side surface of the box body (1). A lever (634) is hinged on the support frame (633).

8. An ultrasonic cleaning device applicable to semiconductor wafers according to claim 1, characterized in that: A drain pipe is arranged on the separation seat (2), and a solenoid valve is arranged on the drain pipe.

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