Low-temperature adhesion transfer device and transfer method based on thermoelectric refrigeration

Abstract

The invention provides a low-temperature adhesion transfer device and method based on thermoelectric refrigeration, and belongs to the technical field of grabbing and transfer equipment. The low-temperature adhesion transfer device comprises a refrigeration part, a heat preservation cold water tank and a heat preservation hot water tank, and the heat preservation cold water tank and the heat preservation hot water tank communicate with the two ends of the refrigeration part correspondingly; the refrigeration part comprises a heat conduction plate, thermoelectric refrigeration sheets and a heat dissipation flow channel, the thermoelectric refrigeration sheets are uniformly distributed on the heat conduction plate, the heat dissipation flow channel is distributed on the thermoelectric refrigeration sheets, and the two ends of the heat dissipation flow channel are communicated with the multi-way pipe respectively. According to the refrigeration part, the thermoelectric refrigeration sheet serves as a refrigeration source, and refrigeration and heating at the two ends of the thermoelectric refrigeration sheet are effectively utilized through the heat preservation cold water tank and the heat preservation hot water tank; the cooling efficiency of the thermoelectric refrigeration sheet is higher through the heat dissipation flow channel; the thermoelectric refrigeration pieces which are evenly distributed can enable the refrigeration part to have high refrigeration uniformity and low thermal coupling performance, refrigeration is faster, and single-layer cut-parts can be grabbed more quickly with low energy consumption and high efficiency.

Description

Technical Field

[0001] The present invention belongs to the technical field of grasping and transferring devices, and particularly relates to a low-temperature adhesion transfer device and a transfer method based on thermoelectric refrigeration. Background Art

[0002] In the subcontracting process of garment industrial production, the stacking of cut pieces produced by a cutting table currently still relies on manual labor for cumbersome grasping and separation operations. The automation level of this link is insufficient, which constitutes a major obstacle to the further intelligent development of garment production. One of the core problems behind this is the softness and easy deformation characteristics of garment fabrics, which makes it difficult for rigid machinery to match the material when attempting to grasp.

[0003] In view of this situation, the existing automatic garment cut piece grasping devices on the market can be divided into grasping methods using air pressure adsorption, electrostatic adsorption grasping, needle punching fixation technology, and soft finger grasping methods according to their different grasping mechanisms. However, the above grasping methods have the following disadvantages, such as affecting the flatness requirements, damaging the cut pieces, having a relatively high grasping manufacturing cost, being prone to grasping multiple layers of cut pieces at one time, having a small adsorption area, a small adsorption force, and high requirements for the cut pieces.

[0004] Therefore, at present, it is considered to use the method of low-temperature adhesion to grasp and transfer the cut pieces, but there are still problems that the refrigeration time and power consumption of common refrigeration sources are not satisfactory. Summary of the Invention

[0005] The problem to be solved by the present invention is to provide a low-temperature adhesion transfer device and a transfer method based on thermoelectric refrigeration.

[0006] To solve the above technical problems, the technical solution adopted by the present invention is: a low-temperature adhesion transfer device based on thermoelectric refrigeration, which includes a refrigeration part, a heat preservation cold water tank, and a heat preservation hot water tank. The heat preservation cold water tank and the heat preservation hot water tank are respectively connected to both ends of the refrigeration part through water pipes; the refrigeration part includes a heat conduction plate, a thermoelectric refrigeration chip, a heat dissipation channel, a multi-way pipe, and a heat dissipation cover plate. The thermoelectric refrigeration chips are evenly distributed on the heat conduction plate, the heat dissipation channel is arranged on the thermoelectric refrigeration chips, both ends of the heat dissipation channel are respectively connected to the multi-way pipe, and the pipe orifice of one end of the multi-way pipe is the cold end water inlet; the pipe orifice of the multi-way pipe at the other end is the hot end water inlet.

[0007] Further, the heat dissipation channel is a parallel rectangular channel.

[0008] Further, the heat dissipation channel includes a covering channel and an embedded channel. The covering channel covers above the thermoelectric refrigeration chips, and the embedded channel is embedded in the gaps between the thermoelectric refrigeration chips.

[0009] Furthermore, a heat dissipation cover plate is provided above the heat dissipation channel, and the heat dissipation cover plate buckles the thermoelectric cooling sheet and the heat dissipation channel.

[0010] Furthermore, in order to facilitate connection with the robot as an end effector, a threaded opening is formed on the heat dissipation cover.

[0011] Furthermore, a refrigeration component and a cold water tank water pump are provided inside the insulated cold water tank, and the cold water tank water pump is connected to the cold end water inlet of the multi-way pipe through a water pipe; a heating component and a hot water tank water pump are provided inside the insulated hot water tank, and the hot water tank water pump is connected to the hot end water inlet of the multi-way pipe through a water pipe.

[0012] The present invention also provides a transfer method of a low-temperature adhesion transfer device based on thermoelectric refrigeration, comprising the following steps: S1. When grabbing the cut pieces, the water pump of the cold water tank starts working after being powered on; at the same time, after the thermoelectric cooling piece is powered on, both ends start cooling and heating respectively. At this time, cold water continuously flows from the heat preservation cold water tank through the water pipe and then through the multi-pass pipe into the heat dissipation channel. The cold water exchanges heat with the heat dissipation channel to take away the heat generated by the hot end of the thermoelectric cooling piece. At the same time, the heat generated by the hot end of the thermoelectric cooling piece is also used to heat the cold water. After being heated by the thermoelectric cooling piece, the cold water enters the heat preservation hot water tank. When this process continues, the cooling end of the thermoelectric cooling piece continuously cools the heat conduction plate, and the robot moves to the corresponding cut piece position to achieve the grabbing effect. S2. When releasing the cut piece, the cold water tank pump is powered off, and the hot water tank pump is powered on and starts working. At this time, the thermoelectric cooling sheet is no longer working, but the temperature of the heat conduction plate is still low. The hot water flowing out of the hot water tank pump pushes out the cold water originally in the heat dissipation channel and continuously heats the thermoelectric cooling sheet. At the same time, the hot water flows into the insulation cold water tank after heat exchange through the thermoelectric cooling sheet. When this process continues, the robot moves to the corresponding cut piece position to achieve the release effect.

[0013] Due to the adoption of the above technical solution, the present invention has the following beneficial effects: The present invention utilizes low temperature adhesion to transfer the cut piece, which can effectively ensure the flatness of the transferred cut piece without damaging the cut piece.

[0014] The thermoelectric cooling sheet of the present invention has the advantages of large cooling capacity, fast cooling speed, light weight, high efficiency and low power consumption as a cooling source. It can realize single-layer cutting piece grabbing more quickly without damaging the cutting piece. Compared with other distribution methods, the thermoelectric cooling sheet is evenly distributed on the heat conduction plate, which can not only ensure the surface cooling uniformity of the cooling plate, but also better reduce the coupling thermal resistance.

[0015] Both the heat-insulated cold water tank and the heat-insulated hot water tank of the present invention are provided with water pumps. The two water pumps work alternately to make the water flows of the two temperatures flow back and forth, which not only utilizes the refrigeration property of the thermoelectric cooler, but also utilizes the heating property of the thermoelectric cooler; there are refrigeration components and heating components in the heat-insulated cold water tank and the heat-insulated hot water tank to maintain the temperature of the water tanks, which has a better heat dissipation effect and can effectively improve the refrigeration COP of the thermoelectric cooler.

[0016] The parallel type is adopted for the heat dissipation flow channel of the present invention, which can better disperse the water flow to each flow channel and ensure the heat dissipation uniformity.

[0017] The design of using different heat-conducting materials for the refrigeration part layer of the present invention can accelerate heat conduction and prevent energy loss. Brief Description of the Drawings

[0018] The present invention will be specifically described below with reference to the drawings and in combination with examples. The advantages and implementation manners of the present invention will become more obvious. The content shown in the drawings is only used for the explanation of the present invention and does not constitute any limitation to the present invention. In the drawings: Figure 1 is a schematic structural diagram of the present invention.

[0019] Figure 2 is a schematic structural diagram of the refrigeration part of the present invention.

[0020] Figure 3 is a schematic internal structural diagram of the refrigeration part of the present invention.

[0021] In the figure: 1, heat-conducting plate; 2, thermoelectric cooler; 3, heat dissipation flow channel; 4, multi-way pipe; 5, cold-end water inlet; 6, heat dissipation cover plate; 7, threaded port; 8, hot-end water inlet; 9, heat-insulated cold water tank; 10, cold water tank water pump; 11, water pipe; 12, heat-insulated hot water tank; 13, refrigeration component; 14, heating component; 15, hot water tank water pump; 16, covering flow channel; 17, embedded flow channel. Detailed Embodiment

[0022] As Figures 1 to 3 shown, a low-temperature adhesion transfer device based on thermoelectric refrigeration of the present invention includes a refrigeration part, a water pipe 11, a heat-insulated cold water tank 9 and a heat-insulated hot water tank 12. The heat-insulated cold water tank 9 and the heat-insulated hot water tank 12 are respectively connected to both ends of the refrigeration part through the water pipe 11.

[0023] As Figure 2 and Figure 3 shown, the refrigeration part includes a heat-conducting plate 1, a thermoelectric cooler 2, a heat dissipation flow channel 3, a multi-way pipe 4 and a heat dissipation cover plate 6. Among them, the heat-conducting plate 1, as the part for transferring heat, is made of a material with high thermal conductivity (copper or aluminum in this embodiment).

[0024] The thermoelectric cooling chips 2 are evenly distributed on the heat conducting plate 1 (in this embodiment, there are nine thermoelectric cooling chips 2). The thermoelectric cooling chips 2 serve as the cooling source, with fast cooling speed and low power consumption. If the thermoelectric cooling chips 2 are unevenly distributed, after heat conduction through the heat conducting plate 1, the temperature difference on the lower surface of the cooling part is relatively large, and the distribution of ice formation is uneven, resulting in uneven adhesion force. Secondly, the uneven concentration of the thermoelectric cooling chips 2 will also cause a thermal coupling phenomenon among the thermoelectric cooling chips 2. Therefore, when the thermoelectric cooling chips 2 are powered on during grasping, due to their properties, the two ends of the thermoelectric cooling chips 2 start to cool and heat. When the temperature difference between the two ends of the thermoelectric cooling chips 2 is small, its refrigeration COP (refrigeration efficiency) is higher. Therefore, its heat dissipation has an important impact on its refrigeration efficiency.

[0025] The heat dissipation channels 3 are evenly distributed on the thermoelectric cooling chips 2. The heat dissipation channels 3 are parallel rectangular channels, and the heat at the hot end of the thermoelectric cooling chips 2 is taken away by water cooling. The heat dissipation channels 3 include a covering channel 16 and an embedded channel 17. The covering channel covers above the thermoelectric cooling chips 2, and the embedded channel is embedded in the gap between the thermoelectric cooling chips.

[0026] The heat dissipation channels 3 are made of materials with high thermal conductivity (copper or aluminum in this embodiment); to prevent heat loss when hot water flows through the heat dissipation channels 3 during release, a heat dissipation cover plate 6 is provided above the heat dissipation channels 3. The heat dissipation cover plate 6 is made of materials with relatively low thermal conductivity (plastic in this embodiment), and the heat dissipation cover plate 6 buckles the thermoelectric cooling chips 2 and the heat dissipation channels 3 inside.

[0027] Both ends of the heat dissipation channels 3 are respectively connected and communicated with a multi-way pipe 4. The multi-way pipe 4 combines the multiple parallel pipe orifices of the heat dissipation channels 3 into one orifice. The orifice of the multi-way pipe 4 at one end is the cold end water inlet 5; the orifice of the multi-way pipe 4 at the other end is the hot end water inlet 8.

[0028] To facilitate connection with the robot as an end effector, a threaded orifice 7 is opened on the heat dissipation cover plate 6.

[0029] A refrigeration component 13 (a water chiller in this embodiment) and a cold water tank water pump 10 are arranged inside the heat preservation cold water tank 9. The cold water tank water pump 10 is connected and communicated with the cold end water inlet 5 of the multi-way pipe 4 through a water pipe 11; a heating component 14 (a heating resistance wire in this embodiment) and a hot water tank water pump 15 are arranged inside the heat preservation hot water tank 12. The hot water tank water pump 15 is connected and communicated with the hot end water inlet 8 of the multi-way pipe 4 through a water pipe 11.

[0030] The transfer method of a low-temperature adhesion transfer device based on thermoelectric refrigeration according to the present invention includes the following steps: S1. When grasping the cut piece, the cold water tank water pump 10 starts to work after being powered on; at the same time, after the thermoelectric cooler 2 is powered on, cooling and heating start at both ends respectively. At this time, cold water continuously flows from the insulated cold water tank 9 through the water pipe 11, then through the multi-way pipe 4 and into the heat dissipation channel 3. The cold water exchanges heat with the heat dissipation channel 3 to take away the heat generated at the hot end of the thermoelectric cooler 2. At the same time, the heat generated at the hot end of the thermoelectric cooler 2 is also used to heat the cold water. After being heated by the thermoelectric cooler 2, the cold water enters the insulated hot water tank 12. When this process continues, the cooling end of the thermoelectric cooler 2 continuously cools the heat conducting plate 1, and the robot moves to the corresponding cut piece position to achieve the grasping effect.

[0031] S2. When releasing the cut piece, the cold water tank water pump 10 is powered off, and the hot water tank water pump 15 starts to work after being powered on. At this time, the thermoelectric cooler 2 stops working, but the temperature of the heat conducting plate 1 is still relatively low. The hot water flowing out of the hot water tank water pump 15 ejects the cold water originally in the heat dissipation channel 3 and continuously heats the thermoelectric cooler 2. At the same time, the hot water exchanges heat through the thermoelectric cooler 2 and flows into the insulated cold water tank 9. When this process continues, the robot moves to the corresponding cut piece position to achieve the release effect.

[0032] To improve the grasping and releasing speed, the insulated cold water tank 9 and the insulated hot water tank 12 can be respectively equipped with a refrigeration component 13 and a heating component 14 to increase the temperature difference between the insulated cold water tank 9 and the insulated hot water tank 12 to improve the efficiency.

[0033] The above has described the embodiments of the present invention in detail, but the content described is only the preferred embodiments of the present invention and cannot be considered as limiting the scope of implementation of the present invention. All equivalent changes and improvements made according to the scope of the present invention should still fall within the scope covered by the present invention.

Claims

1. A low-temperature adhesion transfer device based on thermoelectric cooling, characterized in that: It includes a refrigeration part, an insulated cold water tank and an insulated hot water tank, the insulated cold water tank and the insulated hot water tank are respectively connected with the two ends of the refrigeration part; the refrigeration part includes a heat conduction plate, a thermoelectric cooling sheet and a heat dissipation channel, the thermoelectric cooling sheet is evenly distributed on the heat conduction plate, the heat dissipation channel is arranged on the thermoelectric cooling sheet, the two ends of the heat dissipation channel are respectively connected with multi-way pipes, the pipe mouth of the multi-way pipe at one end is the cold end water inlet; the pipe mouth of the multi-way pipe at the other end is the hot end water inlet.

2. The low-temperature adhesion transfer device based on thermoelectric cooling according to claim 1, characterized in that: The heat dissipation channels are parallel rectangular channels.

3. The low-temperature adhesion transfer device based on thermoelectric cooling according to claim 1, characterized in that: The heat dissipation channel includes a covering channel and an embedded channel. The covering channel covers the top of the thermoelectric cooling sheet, and the embedded channel is embedded in the gap between the thermoelectric cooling sheets.

4. The low-temperature adhesion transfer device based on thermoelectric cooling according to claim 1, characterized in that: A heat dissipation cover plate is provided above the heat dissipation flow channel, and the heat dissipation cover plate buckles the thermoelectric cooling sheet and the heat dissipation flow channel.

5. The low-temperature adhesion transfer device based on thermoelectric cooling according to claim 4, characterized in that: The heat dissipation cover plate is provided with a threaded opening.

6. The low-temperature adhesion transfer device based on thermoelectric cooling according to claim 1, characterized in that: The insulated cold water tank is provided with a refrigeration component and a cold water tank water pump, and the cold water tank water pump is connected to the cold end water inlet of the multi-way pipe through a water pipe; the insulated hot water tank is provided with a heating component and a hot water tank water pump, and the hot water tank water pump is connected to the hot end water inlet of the multi-way pipe through a water pipe.

7. A transfer method of a low-temperature adhesion transfer device based on thermoelectric cooling, which is implemented by the low-temperature adhesion transfer device based on thermoelectric cooling according to any one of claims 1 or 6, characterized in that: The following steps are involved: S1. When grabbing the cut pieces, the water pump of the cold water tank starts working after being powered on; at the same time, after the thermoelectric cooling piece is powered on, both ends start cooling and heating respectively, and the cold water continuously enters the heat dissipation channel from the heat preservation cold water tank through the multi-pass pipe. The cold water exchanges heat with the heat dissipation channel, takes away the heat generated by the hot end of the thermoelectric cooling piece, and also uses the heat generated by the hot end of the thermoelectric cooling piece to heat the cold water. After being heated by the thermoelectric cooling piece, the cold water enters the heat preservation hot water tank, and the cooling end of the thermoelectric cooling piece continuously cools the heat conduction plate, and the robot moves to the corresponding cut piece position to achieve the grabbing effect; S2. When releasing the cut piece, the cold water tank pump is powered off, and the hot water tank pump is powered on and starts working. The thermoelectric cooling plate stops working, and the hot water flowing out of the hot water tank pump pushes out the cold water originally in the heat dissipation channel and continuously heats the thermoelectric cooling plate. At the same time, the hot water flows into the insulation cold water tank after heat exchange through the thermoelectric cooling plate, and is moved to the corresponding cutting piece position by the robot to realize the release effect.

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