Laser-induced etching equipment and method capable of simultaneously preparing glass through holes with different apertures

Abstract

The invention relates to the technical field of laser-induced etching equipment, in particular to laser-induced etching equipment and a laser-induced etching method capable of simultaneously preparing glass through holes with different apertures. The laser-induced etching equipment capable of simultaneously preparing glass through holes with different apertures comprises a plurality of movable partition plates and an etching liquid suction device, the movable partition plates are used for being detachably arranged on a glass plate at intervals and forming a plurality of etching bins on the glass plate, and the etching bins are filled with etching liquid; one end of the etching liquid suction device is respectively communicated with the etching liquid in each etching bin, and simultaneously controls the suction and release processes of the etching liquid in each etching bin and the corresponding time to realize the simultaneous etching of the glass plates in the plurality of etching bins and the preparation of glass through holes with different hole diameters. The purpose of manufacturing the glass through holes with different hole diameters in the same glass plate at a time is achieved, and the manufacturing efficiency of the glass through holes is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of laser-induced etching equipment, and particularly to a laser-induced etching equipment and method capable of simultaneously fabricating glass through-holes with different pore diameters. Background Art

[0002] Glass is a material widely used in the fields of optics, electronics, biomedicine, and industrial manufacturing. Due to its high transparency, good mechanical strength, and chemical corrosion resistance, glass is commonly used as display screens, microfluidic chips, optical components, and high-precision structural materials. In these applications, glass micro-hole processing technology plays a crucial role. For example, in the fields of microfluidics, biomedical detection, and sensor manufacturing, the micro-hole structure on glass can precisely control fluid flow, optical transmittance, and signal transmission.

[0003] Laser-induced etching technology is an advanced method for glass micro-hole processing. This technology uses ultrafast lasers to selectively modify the interior of glass, and then removes the modified area through chemical etching to achieve high-precision glass through-hole processing. Compared with traditional mechanical drilling, ultrasonic machining, and plasma etching, laser-assisted induced etching has the advantages of high precision, no mechanical damage, and applicability to ultra-thin glass, becoming a research hotspot in the field of glass microfabrication in recent years.

[0004] Existing laser-induced etching technology has certain limitations in glass micro-hole processing. The current process usually can only fabricate through-holes with the same pore diameter on the same piece of glass, and it is impossible to form through-holes of different sizes in a single processing step. This is mainly because it is difficult to achieve regional difference control of laser energy distribution, modified area size, and chemical etching rate in the existing technology. Therefore, if through-holes with different pore diameters need to be processed on glass, additional steps are usually required, such as multiple laser exposures, step-by-step processing with different etching parameters, etc., which not only increases the process complexity and processing time, but also may lead to uneven pore diameters, reduced production efficiency, and decreased process stability. This limitation restricts the further application of laser-assisted induced etching technology in the fields of microfluidics, biomedicine, optical devices, etc. Summary of the Invention

[0005] The purpose of the present invention is to provide a laser-induced etching equipment capable of simultaneously fabricating glass through-holes with different pore diameters, so as to solve the problem that the existing laser-induced etching technology cannot form through-holes of different sizes in a single processing step.

[0006] To solve the above problems, the present invention proposes a laser-induced etching equipment capable of simultaneously fabricating glass through-holes with different pore diameters, and the technical solution adopted is: A laser-induced etching device capable of simultaneously fabricating glass vias with different pore sizes, comprising: a plurality of movable partitions and an etching solution suction device. The plurality of movable partitions are used to be detachably arranged at intervals on a glass plate to form a plurality of etching chambers on the glass plate, and the etching chambers are filled with etching solution; one end of the etching solution suction device is respectively communicated with the etching solution in each etching chamber, and simultaneously controls the suction and release processes of the etching solution in each etching chamber and the corresponding time to realize the simultaneous etching of the glass plates in the plurality of etching chambers and the fabrication of glass vias with different pore sizes.

[0007] Further, the etching solution suction device includes a plurality of suction conduits and a safety bottle. One end of the plurality of suction conduits is respectively communicated with the etching solution in each etching chamber, and the other ends are simultaneously communicated with the safety bottle.

[0008] Further, the etching solution suction device further includes a plurality of control valves, which are respectively arranged on the plurality of suction conduits and are used to separately control the on and off of each suction conduit to realize the control of the suction and release time of the etching solution in each etching chamber.

[0009] Further, the safety bottle includes a plurality of suction inlets and a suction outlet. One end of the plurality of suction inlets is respectively communicated with the plurality of suction conduits in one-to-one correspondence, and the other end is simultaneously communicated with the suction outlet through the safety bottle.

[0010] Further, the plurality of movable partitions are detachably arranged at equal intervals on the glass plate, so that the plurality of etching chambers formed on the glass plate are of equal volume; at the same time, a sealing ring is arranged at the connection between the plurality of movable partitions and the glass plate.

[0011] Further, the etching solution suction device further includes a first harmful gas treatment device, which is arranged at one end of the safety bottle far away from the suction conduit and is used to treat the harmful gas volatilized from the etching solution.

[0012] Further, the laser-induced etching device further includes an end cap and an installation chamber. The end cap is installed above the installation chamber. A plurality of slots are arranged on the inner walls of both sides of the installation chamber, and the plurality of slots are arranged in one-to-one correspondence along the length direction of the inner walls of both sides for installing the movable partitions; Further, a plurality of first through holes are formed in the end cap, and the plurality of first through holes are respectively used for passing through the plurality of suction conduits; a second through hole is further arranged on the end cap, and an air conduit passes through the second through hole. One end of the air conduit is communicated with the etching chamber, and the other end is connected with a second harmful gas treatment device.

[0013] Further, the laser-induced etching device further includes a heating device, which is arranged at a position below the glass plate.

[0014] The present invention also provides a laser-induced etching method for simultaneously fabricating glass vias with different apertures. The technical solution adopted is as follows: A laser-induced etching method for simultaneously fabricating glass vias with different apertures, based on the above-mentioned laser-induced etching apparatus for simultaneously fabricating glass vias with different apertures, includes the following steps: Step 1: Clean and dry the glass plate to be processed. Step 2: Modify the glass plate with a laser to obtain multiple modified regions and multiple unmodified regions, and the modified regions and unmodified regions are arranged at intervals. Among them, the multiple modified regions are provided with preset vias having the same aperture. Step 3: Place the glass plate in Step 2 in the laser-induced etching apparatus, and multiple movable partitions are arranged at intervals in the unmodified regions on the glass plate to form multiple etching chambers. Step 4: Add etching solution to the multiple etching chambers. The etching solution suction device simultaneously controls the suction and release processes of the etching solution in each etching chamber to achieve simultaneous etching of the glass plates in the multiple etching chambers; at the same time, the etching solution suction device also separately controls the suction and release times of the etching solution in each etching chamber, thereby fabricating glass vias with different apertures. Step 5: Take out the glass plate, clean it, and dry it.

[0015] Compared with the prior art, the present application has the following beneficial effects: The present invention is an improved invention. The present invention provides a laser-induced etching apparatus for simultaneously fabricating glass vias with different apertures, which has a relatively simple structure. By using multiple movable partitions detachably arranged on the glass plate and separating different regions on the glass plate to form multiple etching chambers, at this time, due to the flexible setting of the movable partitions, they can be arbitrarily extracted or inserted, so that the size of the glass vias can be arbitrarily controlled; and the etching solution suction device simultaneously controls the suction and release processes of the etching solution in each etching chamber to achieve simultaneous etching of the glass plates in the multiple etching chambers; at the same time, by using the etching solution suction device to separately control the suction and release times of the etching solution in each etching chamber to fabricate glass vias with different apertures, the purpose of fabricating glass vias with different apertures on the same glass plate at one time is achieved, and double-sided etching of the glass plate is also realized, improving the production efficiency of the glass vias, enhancing the utilization rate of the glass plate, reducing the process complexity and processing time, and improving the production efficiency and process stability.

[0016] The etching solution suction device includes a plurality of suction conduits and a safety bottle. One ends of the plurality of suction conduits are respectively communicated with the etching solution in each etching chamber, and the other ends are simultaneously communicated with the safety bottle. This structure is simple and convenient for realizing simultaneous suction of the etching solution in multiple etching chambers by one safety bottle.

[0017] The etching liquid suction device further includes a plurality of control valves, which are respectively arranged on a plurality of suction ducts and used to separately control the opening and closing of each suction duct to achieve the control of the suction and release time of the etching liquid in each etching chamber. The structure is simple and the control effect of the suction and release time of the etching liquid is good.

[0018] The safety bottle includes a plurality of suction inlets and one suction outlet. One ends of the plurality of suction inlets are respectively and correspondingly communicated with a plurality of suction ducts, and the other ends are simultaneously communicated to the suction outlet through the safety bottle. On the one hand, the safety bottle can store the suctioned etching liquid to prevent the etching liquid from entering the suction device and damaging the device; on the other hand, it is convenient to realize that one suction device simultaneously suctions the etching liquid in a plurality of etching chambers.

[0019] The plurality of movable partitions are detachably arranged at equal intervals on the glass plate, so that the plurality of etching chambers formed on the glass plate are of equal volume, which is convenient for realizing the preparation of glass through holes with different apertures; at the same time, sealing rings are arranged at the joints of the plurality of movable partitions and the glass plate, which can form a firm seal with the glass plate and avoid the back-and-forth flow of the etching liquid in different etching chambers.

[0020] The etching liquid suction device further includes a first harmful gas treatment device, which is arranged at one end of the safety bottle away from the suction duct and is used to treat the harmful gas volatilized from the etching liquid to prevent the harmful gas volatilized from the etching liquid from entering the suction device and causing device damage.

[0021] The laser-induced etching equipment further includes an end cover and an installation chamber. The end cover is installed above the installation chamber. A plurality of slots are arranged on the inner walls of both sides of the installation chamber, and the plurality of slots are correspondingly arranged along the length directions of the inner walls of both sides and are used for installing movable partitions, which is convenient for realizing the flexible setting of the movable partitions.

[0022] A plurality of first through holes are opened on the end cover, and the plurality of first through holes are respectively used for passing through a plurality of suction ducts; a second through hole is also arranged on the end cover, and an air duct passes through the second through hole. One end of the air duct is communicated with the etching chamber, and the other end is connected with a second harmful gas treatment device, which is used to maintain pressure balance during the suction process. At the same time, it is also to prevent the harmful gas volatilized from the etching liquid from entering the environment and endangering the human body.

[0023] The laser-induced etching equipment further includes a heating device, which is arranged at the lower position of the glass plate to facilitate providing the temperature conditions during the etching process. Brief Description of the Drawings

[0024] Figure 1 It is a schematic structural diagram of the laser-induced etching equipment capable of simultaneously preparing glass through holes with different apertures of the present invention; Figure 2 It is a top view of multiple etching chambers of a laser-induced etching device capable of simultaneously fabricating glass through-holes with different pore sizes according to the present invention; Figure 3 It is a schematic structural diagram of a safety bottle of a laser-induced etching device capable of simultaneously fabricating glass through-holes with different pore sizes according to the present invention; Figure 4 It is a schematic structural diagram of a glass plate after laser modification in a laser-induced etching method capable of simultaneously fabricating glass through-holes with different pore sizes according to the present invention; Figure 5 It is a schematic structural diagram of a glass plate after etching completion obtained by a laser-induced etching method capable of simultaneously fabricating glass through-holes with different pore sizes according to the present invention; In the figure, 1, suction pump; 2, first harmful gas treatment device; 3, safety bottle; 4, suction conduit; 5, control valve; 6, end cap, 7, movable partition; 8, etching solution; 9, glass plate; 10, heating sheet; 11, sealing ring; 12, second harmful gas treatment device; 13, slot; 14, installation chamber; 15, etching chamber; 16, suction inlet; 17, suction outlet; 18, preset through-hole; 19; glass through-hole. Specific Embodiments

[0025] As cited in the background art, in the prior art, the laser-induced etching technology cannot form through-holes of different sizes in a single processing process. Therefore, the present invention provides a laser-induced etching device capable of simultaneously fabricating glass through-holes with different pore sizes, including: a plurality of movable partitions and an etching solution suction device. The plurality of movable partitions are used for detachably spacing and arranging on the glass plate to form a plurality of etching chambers on the glass plate, and the etching chambers are filled with etching solution; due to the flexible setting of the movable partitions, they can be randomly extracted or inserted, so that the size of the through-holes in the glass plate can be arbitrarily controlled; one end of the etching solution suction device is respectively communicated with the etching solution in each etching chamber, and the suction and release processes of the etching solution in each etching chamber are simultaneously controlled to realize the simultaneous etching of the glass plates in the plurality of etching chambers; at the same time, the etching solution suction device also controls the suction and release time of the etching solution in each etching chamber to fabricate glass through-holes with different pore sizes. The laser-induced etching device capable of simultaneously fabricating glass through-holes with different pore sizes in the present application achieves the purpose of fabricating glass through-holes with different pore sizes on the same glass plate at one time, also realizes double-sided etching of the glass plate, improves the production efficiency of the glass through-holes, enhances the utilization rate of the glass plate, reduces the process complexity and processing time, and improves the production efficiency and process stability.

[0026] Embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where like or similar reference numerals denote like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary and are intended to explain the present application, and should not be construed as limiting the present application.

[0027] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned accompanying drawings are used to distinguish similar objects and do not necessarily have to be used to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0028] Specific Embodiment 1 of the laser-induced etching device capable of simultaneously preparing glass through-holes with different pore sizes according to the present invention: In this embodiment, as Figure 1 、 Figure 2 and Figure 5As shown in the figure, a laser-induced etching device capable of simultaneously fabricating glass through-holes with different pore sizes includes a plurality of movable partitions 7 and an etching solution suction device. The plurality of movable partitions 7 are used to be detachably arranged at intervals on the glass plate 9 and form a plurality of etching chambers 15 on the glass plate 9. The etching solution 8 is contained in the etching chambers 15. Since the movable partitions 7 are detachably arranged on the glass plate 9, they can be flexibly arranged, and can be arbitrarily extracted or inserted, so that the size of the glass through-hole 19 can be arbitrarily controlled. One end of the etching solution suction device is respectively communicated with the etching solution 8 in each etching chamber 15, and simultaneously controls the suction and release processes of the etching solution 8 in each etching chamber 15 to realize the simultaneous etching of the glass plate 9 in the plurality of etching chambers 15; at the same time, the etching solution suction device also respectively controls the suction and release time of the etching solution 8 in each etching chamber 15 to fabricate glass through-holes 19 with different pore sizes. When in use, the etching solution suction device repeatedly sucks the etching solution 8 to wash the surface of the glass plate to enhance the etching effect. At the same time, the simultaneous etching of the glass plate 9 in the plurality of etching chambers 15 is realized, and at the same time, the double-sided etching of the glass plate can also be realized. It should be noted that during the process of sucking the etching solution 8, it is not necessary to suck away all the etching solution 8, and a little etching solution 8 should be left in the etching chamber 15 to ensure that the glass plate 9 is always wetted by the etching solution 8. The etching solution suction device controls different etching times for different etching chambers 15, and thus the sizes of the formed glass through-holes 19 are inconsistent. Among them, the etching solution 8 can be an acid (such as HF and its mixture), or an alkali (such as KOH and its mixture).

[0029] Specifically, in this embodiment, as Figure 1 、 2 and shown in Figure 3, the etching solution suction device includes a plurality of suction conduits 4 and a safety bottle 3. One end of the plurality of suction conduits 4 is respectively communicated with the etching solution 8 in each etching chamber 15, and the other ends are simultaneously communicated with the safety bottle 3. Among them, the safety bottle 3 includes a plurality of suction inlets 16 and a suction outlet 17. One end of the plurality of suction inlets 16 is respectively communicated with the plurality of suction conduits 4 in a one-to-one correspondence, and the other ends are simultaneously communicated with the suction outlet 17 through the safety bottle 3; the suction conduit 4 is a polytetrafluoroethylene tube. The etching solution suction device further includes a suction pump 1, and the suction pump 1 is communicated with the suction outlet 17 of the safety bottle 3 to realize the suction function of the safety bottle 3. Here, the safety bottle 3 has two functions: one is to store the sucked etching solution 8 to prevent the etching solution 8 from entering the suction pump 1 and damaging the suction pump 1; the other is to serve as an "N-way joint", and through the safety bottle 3, a suction device can simultaneously suck the etching solution 8 in different etching chambers 15. The safety bottle 3 used in this embodiment is fabricated by 3D printing technology.

[0030] In other embodiments, the etching solution suction device includes a plurality of suction conduits 4 and a plurality of safety bottles 3. Each suction conduit 4 corresponds to one safety bottle 3, and the plurality of safety bottles 3 are correspondingly and uniformly connected to a suction pump 1 to enable one suction pump 1 to control a plurality of safety bottles 3 simultaneously, and further control the simultaneous etching of the glass plates 9 in a plurality of etching chambers 15 through the plurality of suction conduits 4. At this time, the types of the etching solutions 8 in different etching chambers 15 can be set differently.

[0031] Specific Embodiment 2 of the laser-induced etching device capable of simultaneously preparing glass through-holes with different pore diameters according to the present invention: Based on the above technical concept of the present invention, or on the basis of the specific embodiments of the present invention introduced above, another embodiment is provided below.

[0032] In this embodiment, as Figure 1 and Figure 2 shown, the etching solution suction device further includes a plurality of control valves 5. The plurality of control valves 5 are respectively arranged on the plurality of suction conduits 4 and are used to separately control the opening and closing of each suction conduit 4 to realize the control of the suction and release time of the etching solution 8 in each etching chamber 15. The role of the control valve 5 is crucial. At the beginning of etching, all the control valves 5 are in the fully open state. To form glass through-holes 19 with different pore diameters, different etching times are required. Generally speaking, the smaller the pore diameter, the shorter the etching time, and vice versa. When a glass through-hole 19 with a small pore diameter is required, when half of the total etching time is reached, the etching solution 8 in the corresponding etching chamber 15 is completely pumped into the safety bottle 3, and then the control valve 5 of the corresponding suction conduit 4 is closed. Then, continue to pump the etching solution 8 in other etching chambers 15 for etching. By controlling the etching time in different etching chambers 15 according to this operation, the production of glass through-holes 19 with different pore diameters can be completed.

[0033] In this embodiment, a plurality of movable partitions 7 are detachably and spaced at equal intervals on the glass plate 9, so that a plurality of etching chambers 15 formed thereon are of equal volume; at the same time, sealing rings 11 are arranged at the joints of the plurality of movable partitions 7 and the glass plate 9. The sealing rings 11 can form a firm seal with the glass plate 9, avoiding the back-and-forth flow of the etching solution 8 between different etching chambers 15. Among them, the sealing rings 11 are made of polytetrafluoroethylene materials.

[0034] In other embodiments, a plurality of movable partitions 7 can be detachably and spaced at unequal intervals on the glass plate 9, so that a plurality of etching chambers 15 formed thereon are of unequal volume.

[0035] Specific Embodiment 3 of the laser-induced etching device capable of simultaneously preparing glass through-holes with different pore diameters according to the present invention: Based on the above technical concept of the present invention, or based on the specific embodiments of the present invention introduced above, another embodiment is provided below.

[0036] In this embodiment, as Figure 1 and 2 shown, the etching solution suction device further includes a first harmful gas treatment device 2, and the first harmful gas treatment device 2 is arranged at one end of the safety bottle 3 away from the suction conduit 4 for treating the harmful gas volatilized from the etching solution 8, that is, the first harmful gas treatment device 2 is arranged between the safety bottle 3 and the suction pump 1 to prevent the harmful gas volatilized from the etching solution 8 from entering the suction pump 1 and causing equipment damage. Among them, the filler in the first harmful gas treatment device 2 can be adjusted according to the composition of the etching solution 8. That is, when the etching solution 8 is an acid, its filler is calcium oxide, calcium hydroxide, sodium bicarbonate, etc.; when the etching solution 8 is an alkali, its filler is aluminum sulfate, ferric sulfate, etc.

[0037] In this embodiment, the laser-induced etching equipment further includes an end cap 6 and an installation chamber 14. The end cap 6 is installed above the installation chamber 14. A plurality of slots 13 are provided on the inner walls of both sides of the installation chamber 14, and the plurality of slots 13 are arranged in one-to-one correspondence along the length direction of the inner walls of both sides for installing the movable partition 7. During use, the glass plate 9 is inserted above the bottom surface of the installation chamber 14, and both ends of the movable partition 7 are inserted into the corresponding slots 13 on the inner walls of both sides. A plurality of first through holes are provided on the end cap 6, and the plurality of first through holes are respectively used for passing through the plurality of suction conduits 4. A second through hole is also provided on the end cap 6, and an air conduit passes through the second through hole. One end of the air conduit is communicated with the etching chamber 15, and the other end is connected to a second harmful gas treatment device 12. The air conduit is a polytetrafluoroethylene tube. The second through hole is used to maintain pressure balance during the suction process. At the same time, the second harmful gas treatment device 12 effectively prevents the harmful gas volatilized from the etching solution 8 from entering the environment and endangering the human body. Among them, the filler in the second harmful gas treatment device 12 can also be adjusted according to the composition of the etching solution 8. That is, when the etching solution 8 is an acid, its filler is calcium oxide, calcium hydroxide, sodium bicarbonate, etc.; when the etching solution 8 is an alkali, its filler is aluminum sulfate, ferric sulfate, etc.

[0038] In this embodiment, the laser-induced etching equipment further includes a heating device, and the heating device is arranged below the glass plate 9, that is, the heating device is arranged below the bottom surface of the installation chamber 14. Among them, the heating device is a heating sheet 10. The heating sheet 10 is used for heating during the etching process to provide the temperature condition during the etching process; when heating is not required, the heating sheet 10 can not be started.

[0039] Specific Embodiment 1 of the Laser-Induced Etching Method of the Present Invention for Simultaneously Preparing Glass Through-Holes with Different Apertures: The present application also provides a laser-induced etching method for simultaneously fabricating glass through-holes with different apertures, based on the above-mentioned laser-induced etching equipment for simultaneously fabricating glass through-holes with different apertures, as Figure 4 and Figure 5 shown, which includes the following steps: Step 1: Clean and dry the glass plate 9 to be processed: Step 2: Modify the glass plate 9 with a laser to obtain multiple modified regions and multiple unmodified regions, and the modified regions and unmodified regions are arranged at intervals. Among them, multiple modified regions are preset with preset through-holes 18 of the same aperture: Step 3: Place the glass plate 9 in Step 2 into the laser-induced etching equipment, and multiple movable partitions 7 are arranged at intervals in the unmodified regions on the glass plate 9 to form multiple etching chambers 15; Step 4: Add etching solution 8 into multiple etching chambers 15, and the etching solution suction device simultaneously controls the suction and release processes of the etching solution 8 in each etching chamber 15 to achieve simultaneous etching of the glass plate 9 in multiple etching chambers 15; meanwhile, the etching solution suction device also separately controls the suction and release times of the etching solution 8 in each etching chamber 15, thereby fabricating glass through-holes 19 with different apertures; Step 5: Take out the glass plate 9 and clean and dry it.

[0040] Specifically, the laser-induced etching method for simultaneously fabricating glass through-holes with different apertures includes the following steps: First, clean and dry the glass plate 9 to be processed; Second, place the glass plate 9 on the displacement platform and use a laser to modify the glass plate 9. In this process, write a program to control the movement of the displacement platform, put the preset through-holes 18 with different final apertures together to form a group, and obtain multiple modified regions; then widen the distance between different groups to leave multiple unmodified regions; Next, insert the above-mentioned glass plate 9 into the laser-induced etching equipment for simultaneously fabricating glass through-holes 19 with different apertures, and insert the corresponding movable partition 7 into the slot 13 according to the requirements of different aperture sizes. At this time, the unmodified regions left in the above steps coincide with the positions of the movable partitions 7, so as to separate different groups of glass through-holes 19 with the movable partitions 7 to form different etching chambers 15; Then, add the pre-prepared etching solution 8 into the etching chamber 15, cover the end cap 6, the suction catheter 4 passes through one end of the end cap 6 and extends into the etching solution 8, and the other end is connected to the safety bottle 3. Use the suction pump 1 to repeatedly suck the etching solution 8 to wash the surface of the glass plate 9 to enhance the etching effect; meanwhile, according to the sizes of different glass through-holes 19, control the suction of the etching solution 8 in the corresponding etching chamber 15 through the control valve 5 to complete the simultaneous fabrication of glass through-holes 19 with different apertures in the front area of the glass plate 9; Next, after the etching of the entire front area of the glass plate 9 is completed, all the etching solution 8 is pumped out and retained in the safety bottle 3. The glass plate 9 is taken out, turned over, and then reinserted into the laser-induced etching equipment. Then, all the etching solution 8 is poured back into the multiple etching chambers 15, and the etching solution 8 is continuously sucked and flushed against the surface of the glass plate 9 to start and complete the etching of the other side of the glass plate 9; Finally, the glass plate 9 is taken out for cleaning and drying.

[0041] Through the above description of the specific embodiments of the laser-induced etching equipment for simultaneously fabricating glass through-holes with different apertures of the present invention, it can be seen that the laser-induced etching equipment for simultaneously fabricating glass through-holes with different apertures of the present invention includes: a plurality of movable partitions and an etching solution suction device. The plurality of movable partitions are used for detachably spacing and arranging on the glass plate to form a plurality of etching chambers on the glass plate, and the etching chambers are filled with the etching solution; due to the flexible setting of the movable partitions, they can be arbitrarily extracted or inserted, so that the size of the through-holes of the glass plate can be arbitrarily controlled; one end of the etching solution suction device is respectively communicated with the etching solution in each etching chamber, and the suction and release processes of the etching solution in each etching chamber are simultaneously controlled to realize the simultaneous etching of the glass plates in the plurality of etching chambers; at the same time, the etching solution suction device also controls the suction and release time of the etching solution in each etching chamber to fabricate glass through-holes with different apertures. The laser-induced etching equipment for simultaneously fabricating glass through-holes with different apertures of the present application achieves the purpose of fabricating glass through-holes with different apertures on the same glass plate at one time, improves the fabrication efficiency of the glass through-holes, enhances the utilization rate of the glass plate, reduces the process complexity and processing time, and improves the production efficiency and process stability.

[0042] The above is only a preferred embodiment of the present invention and is not intended to limit the present invention. The patent protection scope of the present invention is subject to the claims. All equivalent structural changes made by using the description and drawings of the present invention should be included in the protection scope of the present invention by the same token.

Claims

1. A laser induced etching device capable of simultaneously preparing glass through holes with different apertures, characterized in that: include: A plurality of movable baffles (7) and an etching liquid (8) suction device, wherein the plurality of movable baffles (7) are arranged at intervals on a glass plate (9) in a detachable manner and form a plurality of etching chambers (15) on the glass plate (9), wherein the etching chambers (15) are filled with etching liquid (8); one end of the etching liquid suction device is respectively connected to the etching liquid (8) in each etching chamber (15), and the suction and release process of the etching liquid (8) in each etching chamber (15) and the corresponding time are simultaneously controlled to achieve simultaneous etching of the glass plates (9) in the plurality of etching chambers (15) and preparation of glass through holes (19) with different apertures.

2. The laser induced etching device capable of simultaneously preparing through-glass holes with different apertures according to claim 1, characterized in that: The etching liquid suction device comprises a plurality of suction conduits (4) and a safety bottle (3), wherein one end of the plurality of suction conduits (4) is respectively connected to the etching liquid (8) in each etching chamber (15), and the other end is simultaneously connected to the safety bottle (3).

3. The laser induced etching device capable of simultaneously preparing through-glass holes with different apertures according to claim 2, characterized in that: The etching liquid suction device further comprises a plurality of control valves (5), wherein the plurality of control valves (5) are respectively arranged on a plurality of suction conduits (4) and are used to individually control the opening and closing of each suction conduit (4) to achieve control of the suction and release time of the etching liquid (8) in each etching chamber (15).

4. The laser induced etching device capable of simultaneously preparing through-glass holes with different apertures according to claim 2, characterized in that: The safety bottle (3) comprises a plurality of suction inlets (16) and a suction outlet (17); one end of the plurality of suction inlets (16) is connected to a plurality of suction ducts (4) in a one-to-one correspondence, and the other end is simultaneously connected to the suction outlet (17) via the safety bottle (3).

5. The laser induced etching device capable of simultaneously preparing through-glass holes with different apertures according to claim 1, characterized in that: The plurality of movable partitions (7) are detachably arranged at equal intervals on the glass plate (9), so that the plurality of etching chambers (15) formed on the glass plate (9) are arranged with equal volumes; at the same time, sealing rings (11) are arranged at the connection between the plurality of movable partitions (7) and the glass plate (9).

6. The laser induced etching device capable of simultaneously preparing through-glass holes with different apertures according to claim 2, characterized in that: The etching liquid suction device further comprises a first harmful gas treatment device (2), wherein the first harmful gas treatment device (2) is arranged on an end of the safety bottle (3) away from the suction conduit (4) and is used to treat harmful gases volatilized from the etching liquid (8).

7. The laser induced etching device capable of simultaneously preparing through-glass holes with different apertures according to claim 1, characterized in that: The laser induced etching device further comprises an end cover (6) and an installation chamber (14), wherein the end cover (6) is installed above the installation chamber (14), and a plurality of slots (13) are provided on inner walls on both sides of the installation chamber (14), wherein the plurality of slots (13) are arranged in a one-to-one correspondence along the length direction of the inner walls on both sides and are used for installing a movable partition (7).

8. The laser induced etching device capable of simultaneously preparing through-glass holes with different apertures according to claim 7, characterized in that: The end cover (6) is provided with a plurality of first through holes, the plurality of first through holes being used to pass through a plurality of suction ducts (4) respectively; the end cover (6) is also provided with a second through hole, an air duct passing through the second through hole, one end of the air duct being connected to the etching chamber (15), and the other end being connected to a second harmful gas treatment device (12).

9. The laser induced etching device capable of simultaneously preparing through-glass holes with different apertures according to claim 1, characterized in that: The laser induced etching equipment further comprises a heating device, wherein the heating device is arranged below the glass plate (9).

10. A laser induced etching method for simultaneously preparing glass through holes with different apertures, characterized in that: The laser induced etching device capable of simultaneously preparing glass through holes with different apertures according to any one of claims 1 to 9 comprises the following steps: Step 1: Clean and dry the glass plate (9) to be processed: Step 2: Using laser to modify the glass plate (9) to obtain a plurality of modified regions and a plurality of unmodified regions, wherein the modified regions and the unmodified regions are arranged at intervals, wherein the plurality of modified regions are preset with preset through holes (18) having the same aperture: Step 3: placing the glass plate (9) in step 2 in a laser induced etching device, wherein a plurality of movable partitions (7) are arranged at intervals on the unmodified areas on the glass plate (9) to form a plurality of etching chambers (15); Step 4: adding etching liquid (8) to a plurality of etching chambers (15), and the etching liquid suction device simultaneously controls the suction and release process of the etching liquid (8) in each etching chamber (15) to achieve simultaneous etching of the glass plates (9) in the plurality of etching chambers (15); at the same time, the etching liquid suction device also controls the suction and release time of the etching liquid (8) in each etching chamber (15), thereby preparing glass through holes (19) with different apertures; Step 5: Remove the glass plate (9) for cleaning and drying.

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