Device and method for detecting defects of semiconductor wafer

Abstract

The invention discloses a detection device for semiconductor wafer defects and a detection method thereof, and relates to the technical field of semiconductor wafer defects. A workbench is characterized in that a transmission assembly is arranged on the workbench, a vacuum assembly is arranged on the transmission assembly, and a sorting assembly is arranged on one side, close to the output end of the transmission assembly, of the workbench; the transmission assembly comprises a movable supporting disc, a plurality of first circular grooves are formed in the supporting disc, a bracket for bearing wafers is placed in each first circular groove, the vacuum assembly comprises a first shell, a first cavity is formed between the first shell and the workbench, four gates are arranged on the first shell in a sliding mode, and the first shell is provided with a second cavity. Four gates are arranged in the first cavity, the four gates divide the first cavity into a first cavity, a second cavity and a third cavity in sequence in the conveying direction of the conveying assembly, the first cavity, the second cavity and the third cavity are provided with vacuum environments, a positioning assembly is arranged in the first cavity, and a detection assembly is arranged in the second cavity.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor wafer defects, and specifically provides a detection device and a detection method for semiconductor wafer defects. Background Art

[0002] Before the etching process of a semiconductor wafer, it is necessary to detect whether there are defects on the semiconductor wafer, such as surface particles, metal residues, subsurface cracks, internal dislocations, stacking faults, etc. If the semiconductor wafer is not subjected to defect detection, the yield of the semiconductor wafer will be reduced.

[0003] In order to improve the yield of chips, corresponding equipment can be used to scan the entire map of the semiconductor wafer during the production process of the semiconductor wafer, and analyze abnormal patterns on the scanned image to locate the defect positions on the wafer that may cause abnormal operation.

[0004] Therefore, during the chip manufacturing process, multiple detection processes are set up to timely identify defects on the wafer surface. Among them, the detection of defects on the wafer surface can be achieved through manual or machine vision methods. Among them, in similar manual detection methods, the detection time is too long, the detection efficiency is low, and the obtained defect markings will also be misdetected and undetected due to some subjectivity.

[0005] Therefore, it is necessary to design a detection device and a detection method for semiconductor wafer defects that can improve the detection accuracy and efficiency of semiconductor wafers. Summary of the Invention

[0006] The purpose of the present invention is to provide a detection device and a detection method for semiconductor wafer defects to solve the problems raised in the above background art.

[0007] To solve the above technical problems, the present invention provides the following technical solution: A detection device for semiconductor wafer defects, including a workbench, on which a transmission component, a vacuum component, and a sorting component are arranged. The transmission component includes a movable support plate, and a plurality of circular grooves I are opened on the support plate. A socket for holding a wafer is placed in each circular groove I. The vacuum component includes a housing I, and a cavity I is formed between the housing I and the workbench. The cavity I is sequentially divided into a first cavity with a vacuum environment, a second cavity, and a third cavity along the transmission direction of the transmission component. A positioning component is arranged in the first cavity, a detection component is arranged in the second cavity, and a marking component is arranged in the third cavity; The detection component includes a block, and each circular groove 1 of the block is provided with a cavity 2, and the cavity 2 is provided with a rotatable industrial camera and an infrared camera, and the industrial camera and the infrared camera are both signal-connected to a processor, and an environmental adjustment component 1 is provided on the side of the input end of the industrial camera close to the workbench, and an environmental adjustment component 2 is provided in the cavity 2, and the environmental adjustment component 1 includes a shell 2, and the shell 2 is provided with a cavity 1, and the shell 2 is also provided with a cavity 2 perpendicular to the cavity 1, and the cavity 2 is communicated with the cavity 1, and the side of the cavity 2 away from the cavity 1 is fixedly connected with an irradiation lamp, and the junction of the cavity 2 and the cavity 1 is fixedly connected with a spectroscope, and the environmental adjustment component 2 includes an annular light source group, and the annular light source group includes a plurality of LED lamps with adjustable irradiation angles.

[0008] According to the above technical solution, the vacuum component is arranged on the transmission component, and the transmission component also includes five transmission tables, which are linearly arranged along the length direction of the workbench, and the middle three transmission tables are located in cavity one. A groove one is provided on the side of the transmission table away from the workbench, and the inner walls on both sides of the groove one that are opposite to each other are fixedly connected with conductive slide rails, and the support plate is slidably connected to the conductive slide rails.

[0009] According to the above technical solution, the upper and lower sides of the corresponding conductive slide rails on the support plate are fixedly connected with sliding brushes, and the side of the support plate away from the groove 1 is fixedly connected with a battery pack, and the battery pack is electrically connected to the sliding brush on the support plate; The support is provided with a second circular groove, in which a wafer is placed; The support plate is provided with a plurality of grooves 2 on both sides along the width direction, and the plurality of grooves 2 are linearly and evenly arranged along the length direction of the support plate, a pulley is rotatably connected in the groove 2, and the part of the pulley protruding from the groove 2 is located in the conductive slide rail, and the pulley cooperates with the conductive slide rail, and a drive motor is fixedly connected to the pulley corresponding to the side of the support plate close to the groove 1, and the output shaft of the drive motor passes through the inner wall of the groove 2 and is fixedly connected to the pulley, and the drive motor is electrically connected to the battery pack; A pressure sensor is provided on one side of each support plate facing the transmission direction, and the pressure sensor is connected to the drive motor signal; A metal circular plate capable of being magnetically attracted is fixedly connected to one side of the bracket close to the circular groove 1, and an electromagnetic suction piece capable of being controlled to be opened and closed is fixedly connected to the bottom of the circular groove 1, and the electromagnetic suction piece is electrically connected to the battery pack.

[0010] According to the above technical solution, four gates are slidably arranged on the first housing. The first cavity, the second cavity and the third cavity are formed by partitioning the cavity one by the four gates. The first housing is provided with sliding openings corresponding to the gates. The gates are matched with the sliding openings, and the gates are hermetically and movably connected to the workbench. A first connecting plate is fixedly connected to the side of the gate away from the workbench. On both sides of the first connecting plate along the length direction and close to the first housing, first hydraulic telescopic cylinders are arranged. The fixed ends of the first hydraulic telescopic cylinders are fixedly connected to the first housing, and the output ends of the first hydraulic telescopic cylinders are fixedly connected to the first connecting plate; Each of the gates is arranged between two adjacent transfer tables, and the middle three transfer tables are respectively located in the first cavity, the second cavity and the third cavity.

[0011] According to the above technical solution, the outer walls of both sides of the block along the width direction are fixedly connected to the inner wall of the second cavity. A corner motor is fixedly connected to the side of the block corresponding to the cavity two away from the workbench. The output shaft of the corner motor penetrates through the inner wall of the cavity two and is fixedly connected to a second connecting plate. The industrial camera and the infrared camera are respectively fixedly connected to both sides of the second connecting plate along the length direction and close to the workbench.

[0012] According to the above technical solution, the environmental adjustment component two further includes a support plate. The support plate is fixedly connected to the inner wall of the cavity two close to the workbench. The support plate is provided with a circular hole. The central axis of the circular hole is coaxially arranged with the central line of the cavity two. The annular light source group is arranged in the circular hole. The plurality of LED lights are evenly distributed in a circle with the central line of the cavity two as the center. A connecting column is fixedly connected to the side of each LED light away from the output end. The connecting column is rotatably connected to a connecting rod along its radial direction. Fixing rods are fixedly connected to both ends of the connecting rod along the axial direction. The fixing rods are fixedly connected to the inner wall of the circular hole on the side away from the connecting rod. A connecting block is hinged to the side of the connecting column away from the LED light. The upper parts of the sides of a plurality of the connecting blocks away from the connecting column are commonly fixedly connected to a connecting ring. An electric telescopic rod two is hinged to the side of the connecting ring away from the center of the circle. The fixed end of the electric telescopic rod two is hinged to the inner wall of the cavity two. The plurality of electric telescopic rods two are evenly distributed in a circle with the axis of the connecting ring as the center.

[0013] According to the above technical solution, the positioning component includes a plurality of electric telescopic rods one. Each of the electric telescopic rods one corresponds to a first circular groove. The electric telescopic rod one is located directly above the center of the first circular groove. The fixed end of the electric telescopic rod one is fixedly connected to the inner wall of the first cavity on the side away from the workbench, and the output end of the electric telescopic rod one is fixedly connected to an electric gripper; The marking component includes a robotic arm, the fixed end of the robotic arm is fixedly connected to the inner wall of the third cavity away from the workbench, the output end of the robotic arm is fixedly connected with a piezoelectric inkjet print head, and the input end pipeline of the piezoelectric inkjet print head penetrates through the inner wall of the third cavity and is connected with an ink cartridge; The sorting component is arranged on one side of the workbench close to the output end of the transmission component. The sorting component includes a manipulator, and the output end of the manipulator is fixedly connected with a camera, and the camera is in signal connection with a processor.

[0014] According to the above technical solution, a detection method for a semiconductor wafer defect detection device: S1: The wafer is transported by the support disk and moves into the first cavity for positioning; S2: The wafer after positioning is transported by the support disk from the first cavity into the second cavity for detection; S3: Under the ultra-high vacuum environment in the second cavity, the wafer is photographed and detected under bright field environment, dark field environment and infrared light, and analyzed and processed by the processor and pre-marked; S4: After the detection is completed, the wafer is transported by the support disk into the third cavity, and the corresponding wafer is color-marked by the marking component; S5: After the marking is completed, the wafer is transported by the support disk out of the third cavity and sorted by the sorting component.

[0015] According to the above technical solution, the specific steps of S3 are as follows: S31: The processor detects the wafers with particles and metal residues on the upper surface of the wafer and performs orange pre-marking; S32: The processor detects the wafers with micro-cracks on the subsurface of the wafer and performs red pre-marking; S33: The processor detects the wafers with dislocation and stacking fault problems inside the wafer and performs purple pre-marking.

[0016] According to the above technical solution, the specific steps of S5 are as follows: S51: For the wafers with only a single color mark, perform sorting processing corresponding to the corresponding color; S52: For the wafers with more than one color, perform sorting processing according to the priority order of purple, red, and orange; S53: The wafers sorted to the orange mark are recycled by the staff, re-cleaned and then subjected to secondary detection; S54: The wafers sorted to the red mark are repaired, re-cleaned by the staff and then subjected to secondary detection; S55: The wafers sorted to the purple mark are recycled and scrapped by the staff.

[0017] Compared with the prior art, the beneficial effects achieved by the present invention are as follows: In the present invention, an environment adjustment component I and an environment adjustment component II are provided to form a bright-field environment and a dark-field environment for wafer detection, and an industrial camera is used to detect defects on the upper surface and the pressed surface of the wafer; By providing an infrared camera, defects inside the wafer are detected in an infrared environment; By providing a vacuum component and a transmission component, the wafers are batch-detected in a vacuum ring, thereby improving the detection accuracy and detection efficiency of the wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings are used to provide a further understanding of the present invention, and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention, and do not constitute a limitation to the present invention. In the drawings: Figure 1 is a schematic diagram of the overall structure of the present invention; Figure 2 is a partially sectional schematic diagram of the overall structure of the present invention; Figure 3 is a schematic diagram of the split structure of the support disk of the present invention; Figure 4 is a partially sectional schematic diagram of the detection component of the present invention; Figure 5 is a partial structural schematic diagram of the detection component of the present invention; Figure 6 is a schematic diagram of the split structure of the environment adjustment component II of the present invention; Figure 7 is a side sectional schematic diagram of the environment adjustment component I of the present invention; Figure 8 is a schematic diagram of the positioning component structure of the present invention; Figure 9 is a schematic diagram of the split of a single LED lamp and its related structure of the present invention; In the figure: 1, workbench; 2, transmission component; 3, vacuum component; 4, transfer table; 5, support disk; 6, first groove; 7, conductive slide rail; 8, battery pack; 9, second groove; 10, pulley; 11, drive motor; 12, first circular groove; 13, support; 14, second circular groove; 15, first housing; 16, gate; 17, sliding opening; 18, first connecting plate; 19, first hydraulic telescopic cylinder; 20, first cavity; 21, second cavity; 22, third cavity; 23, positioning component; 24, detection component; 25, round hole; 26, first electric telescopic rod; 27, electric gripper; 28, block; 29, second cavity; 30, corner motor; 31, second connecting plate; 32, industrial camera; 33, infrared camera; 34, first environmental adjustment component; 35, second housing; 36, first chamber; 37, second chamber; 38, irradiation lamp; 39, beam splitter; 40, second environmental adjustment component; 41, annular light source group; 42, LED lamp; 43, connecting column; 44, connecting rod; 45, fixed rod; 46, connecting block; 47, connecting ring; 48, second electric telescopic rod; 49, support plate. Detailed implementation

[0019] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0020] Please refer to Figures 1-9 , the present invention provides a technical solution: a detection device for semiconductor wafer defects, including a workbench 1, a transmission component 2 is arranged on the workbench 1, a vacuum component 3 is arranged on the transmission component 2, and a sorting component is arranged on one side of the workbench 1 close to the output end of the transmission component 2.

[0021] The transmission component 2 includes five transfer tables 4, and the five transfer tables 4 are linearly arranged along the length direction of the workbench 1. A plurality of support disks 5 are jointly arranged on the plurality of transfer tables 4.

[0022] The transfer table 4 is fixedly connected to the workbench 1. A first groove 6 is opened on one side of the transfer table 4 away from the workbench 1. Both inner walls of the first groove 6 opposite to each other are fixedly connected with conductive slide rails 7. The support disk 5 is slidably connected to the conductive slide rails 7; Sliding brushes are fixedly connected to both the upper and lower sides of the support disk 5 corresponding to the conductive slide rails 7. The sliding brushes are electrically connected to the conductive slide rails 7, so as to realize continuous power supply during the movement of the support disk 5.

[0023] Such as Figure 3A battery pack 8 is fixedly connected to the side of the support plate 5 that is away from the groove 1 6, and the battery pack 8 is electrically connected to the sliding brush on the support plate 5; A plurality of grooves 29 are provided on both sides of the support plate 5 along the width direction, and the plurality of grooves 29 are linearly and evenly arranged along the length direction of the support plate 5. A pulley 10 is rotatably connected in the groove 29, and the part of the pulley 10 protruding from the groove 29 is located in the conductive slide rail 7, and the pulley 10 cooperates with the conductive slide rail 7. A drive motor 11 is fixedly connected to the pulley 10 corresponding to the side of the support plate 5 close to the groove 1 6, and the output shaft of the drive motor 11 passes through the inner wall of the groove 29 and is fixedly connected to the pulley 10. The drive motor 11 is electrically connected to the battery pack 8, and the pulley 10 is driven to rotate by the drive motor 11, thereby driving the support plate 5 to move between the transmission platforms 4.

[0024] A pressure sensor is provided on one side of each support plate 5 facing the transmission direction, and the pressure sensor is connected to the drive motor 11 by signal. A plurality of circular grooves 12 are provided on one side of each support plate 5 away from the groove 6; A plurality of circular grooves 12 are arranged in a linear array, and a holder 13 for holding wafers is placed in each circular groove 12. A circular groove 2 14 is provided on the holder 13, and a wafer is placed in the circular groove 2 14. The circular groove 2 14 wraps and fixes the wafer. Wafers of different diameters are equipped with holders 13 of different sizes. A metal circular plate that can be magnetically attracted is fixedly connected to the side of the holder 13 close to the circular groove 12, and an electromagnetic suction piece that can be controlled to open and close is fixedly connected to the bottom of the circular groove 12. The electromagnetic suction piece is electrically connected to the battery pack 8, and the battery pack 8 can provide stable power supply to the electromagnetic suction piece.

[0025] like Figure 1 The vacuum component 3 includes a shell 15, which is sealed and fixedly connected to the workbench 1. A cavity 1 is formed between the shell 15 and the workbench 1. The cavity 1 is open at both ends along the length direction of the workbench 1. The transmission component 2 is partially arranged in the cavity 1. Specifically, the three middle transmission platforms 4 are located in the cavity 1.

[0026] Four gates 16 are slidably arranged on the shell 15 , and the four gates 16 are linearly and evenly arranged along the length direction of the shell 15 . The distance between two adjacent gates 16 is greater than the length of the support plate 5 , and each gate 16 is arranged between two adjacent transmission platforms 4 .

[0027] The housing 15 is provided with a sliding opening 17 corresponding to the gate 16, the gate 16 cooperates with the sliding opening 17, and the gate 16 is sealed and movably connected with the workbench 1; On the side of the gate 16 away from the workbench 1, a first connecting plate 18 is fixedly connected. On both sides of the first connecting plate 18 along the length direction and close to the first housing 15, a first hydraulic telescopic cylinder 19 is provided. The fixed end of the first hydraulic telescopic cylinder 19 is fixedly connected to the first housing 15, and the output end of the first hydraulic telescopic cylinder 19 is fixedly connected to the first connecting plate 18. The gate 16 is driven by the first hydraulic telescopic cylinder 19 to move up and down for opening and closing.

[0028] As Figure 2 , the four gates 16 evenly divide the first cavity. Therefore, the first cavity is sequentially divided into a first cavity 20, a second cavity 21, and a third cavity 22 along the transmission direction of the transmission component 2. The middle three transmission platforms 4 are respectively located in the first cavity 20, the second cavity 21, and the third cavity 22.

[0029] The wafers are transmitted by the transmission component 2 and pass through the first cavity 20, the second cavity 21, and the third cavity 22 in sequence, and are transmitted out from the output port of the third cavity 22.

[0030] Among them, both the first cavity 20 and the third cavity 22 are connected to an ion pump (to achieve high vacuum) through a pipeline, and the second cavity 21 is connected to a molecular pump (to achieve ultra-high vacuum) through a pipeline. Therefore, the vacuum pressure in the first cavity 20 and the third cavity 22 is between 10 -3 -10 -4 Torr (high vacuum); the vacuum pressure in the second cavity 21 is between 10 -6 -10 -7 Torr (ultra-high vacuum); Both the first cavity 20 and the third cavity 22 serve as buffer cavities for the second cavity 21, reducing the exposure time of the second cavity 21 and facilitating the maintenance of the vacuum pressure in the second cavity 21.

[0031] A positioning component 23 is arranged in the first cavity 20; a detection component 24 is arranged in the second cavity 21; a marking component is arranged in the third cavity 22.

[0032] As Figure 8 , the positioning component 23 includes a number of first electric telescopic rods 26. Each first electric telescopic rod 26 corresponds to a first circular groove 12, and the first electric telescopic rod 26 is directly above the center of the first circular groove 12; The fixed end of the first electric telescopic rod 26 is fixedly connected to the inner wall of the first cavity 20 away from the workbench 1, and the output end of the first electric telescopic rod 26 is fixedly connected to an electric gripper 27. The electric gripper 27 is a three-jaw gripper. The center of the carrier 13 on the first circular groove 12 is positioned by the electric gripper 27. After the positioning is completed, the electromagnetic suction plate is started to magnetically fix the metal circular plate on the carrier 13, so as to facilitate the subsequent detection work of the detection component 24 on the wafers.

[0033] AsFigure 4 The detection component 24 includes a block 28. The outer walls on both sides of the block 28 in the width direction are fixedly connected to the inner wall of the second cavity 21. The block 28 is provided with a second cavity 29 corresponding to each circular groove 12. The second cavity 29 is a cuboid cavity with an opening facing the workbench 1. The block 28 is fixedly connected with a corner motor 30 on the side away from the workbench 1 corresponding to the second cavity 29. The corner motor 30 is located in the second cavity 21; As Figure 5 shown, the output shaft of the corner motor 30 penetrates the inner wall of the second cavity 29 and is fixedly connected with a second connecting plate 31. On both sides of the second connecting plate 31 in the length direction and on the side close to the workbench 1, an industrial camera 32 and an infrared camera 33 are respectively fixedly connected. Both the industrial camera 32 and the infrared camera 33 are signal-connected to a processor.

[0034] The industrial camera 32 uses a global shutter CMOS camera. The industrial camera 32 is used to take pictures and detect wafers in bright field environment and dark field environment respectively; The bright field environment is used to detect crystal surface particles and metal residues, and the dark field environment is used to detect subsurface microcracks of wafers; The infrared camera 33 is used to take pictures and detect defects inside the wafer. The input ends of the industrial camera 32 and the infrared camera 33 are both vertically oriented towards the workbench 1.

[0035] The corner motor 30 can rotate the second connecting plate 31 by a specific angle. In this case, it is used for the reciprocating rotation work of 180° of the second connecting plate 31; In the initial state, the center of the input end of the industrial camera 32 is aligned with the center of the second cavity 29 in the vertical direction. After the industrial camera 32 finishes taking pictures, the corner motor 30 is used to control the rotation of the second connecting plate 31 to make the center of the input end of the infrared camera 33 aligned with the center of the second cavity 29 in the vertical direction, so as to complete the switching between the industrial camera 32 and the infrared camera 33.

[0036] An environmental adjustment component 34 is arranged on the side of the input end of the industrial camera 32 close to the workbench 1; As Figure 7 shown, the environmental adjustment component 34 includes a second housing 35. The second housing 35 is a "T"-shaped three-way pipe shell. The second housing 35 is provided with a first cavity 36. The first cavity 36 is vertically arranged. The two ends of the first cavity 36 in the vertical direction are open. The first cavity 36 is coaxially arranged with the input end of the industrial camera 32. The second housing 35 is fixedly connected with the input end of the industrial camera 32 on the side close to the industrial camera 32 corresponding to the first cavity 36; The second housing 35 is further provided with a second cavity 37. The second cavity 37 is perpendicular to the first cavity 36. The second cavity 37 is communicated with the first cavity 36. A lighting lamp 38 is fixedly connected to the side of the second cavity 37 away from the first cavity 36; A beam splitter 39 is fixedly connected to the junction of the second cavity 37 and the first cavity 36. The beam splitter 39 is inclined, and the included angle between the beam splitter 39 and the central axis of the first cavity 36 is 45°, and the receiving surface faces the side of the second cavity 37; The output end of the irradiation lamp 38 irradiates light on the beam splitter 39 at a horizontal angle. The beam splitter 39 reflects the incident light at a vertical angle onto the wafer. The wafer receives the light and reflects the direct light in the incident direction. The reflected direct light directly passes through the beam splitter 39 and is mapped to the input end of the industrial camera 32. The industrial camera 32 takes a picture and transmits the taken picture to the processor for analysis and detection, thereby completing the photographing and detection of the wafer in a bright field environment.

[0037] Such as Figure 6 , an environmental adjustment component two 40 is arranged in the second cavity 29. The environmental adjustment component two 40 includes a support plate 49. The support plate 49 is fixedly connected to one side of the inner wall of the second cavity 29 close to the workbench 1. The support plate 49 is provided with a round hole 25. The central axis of the round hole 25 is coaxially arranged with the central line of the second cavity 29. An annular light source group 41 is arranged in the round hole 25. The annular light source group 41 includes a plurality of LED lights 42. The plurality of LED lights 42 are evenly distributed in a circle with the central line of the second cavity 29 as the center. The LED lights 42 irradiate towards the center of the wafer; A connecting column 43 is fixedly connected to one side of each LED light 42 away from the output end. The connecting column 43 is rotationally connected with a connecting rod 44 in the radial direction. Fixing rods 45 are fixedly connected to both ends of the connecting rod 44 along the axial direction. The fixing rods 45 are fixedly connected to the inner wall of the round hole 25 on the side away from the connecting rod 44. A connecting block 46 is hinged to the side of the connecting column 43 away from the LED light 42. The upper parts of the sides of the plurality of connecting blocks 46 away from the connecting column 43 are commonly fixedly connected with a connecting ring 47. One side of the connecting ring 47 away from the center of the circle is hinged with a plurality of electric telescopic rods two 48. The fixed ends of the electric telescopic rods two 48 are hinged to the inner wall of the second cavity 29. The plurality of electric telescopic rods two 48 are evenly distributed in a circle with the axis of the connecting ring 47 as the center; According to the diameter of the wafer, the angle at which the output end of the LED light 42 irradiates the wafer is controlled by the telescopic output end of the electric telescopic rod two 48.

[0038] After the wafer completes the photographing and detection in the bright field environment, control the irradiation lamp 38 to turn off, turn on the LED lights 42 of the annular light source group 41, and make the LED lights 42 of the annular light source group 41 irradiate the wafer at a specific inclined angle. After the wafer receives the light, it vertically reflects scattered light. The reflected scattered light directly passes through the beam splitter 39 and is mapped to the input end of the industrial camera 32. The industrial camera 32 takes a picture and transmits the taken picture to the processor for analysis and detection, thereby completing the photographing and detection of the wafer in a dark field environment.

[0039] After the industrial camera 32 finishes photographing and detecting the wafer in the bright-field environment and the dark-field environment, the corner motor 30 is started to rotate the infrared camera 33 to a position concentric with the center of the wafer. The infrared camera 33 detects the wafer through infrared imaging. The infrared light penetrates the silicon-based material of the wafer to detect internal crystal defects of the wafer, including but not limited to dislocations, stacking faults and other problems.

[0040] The marking component includes a robotic arm. The fixed end of the robotic arm is fixedly connected to the inner wall of the third cavity 22 away from the workbench 1. The output end of the robotic arm is fixedly connected with a piezoelectric inkjet print head. The nozzle diameter of the piezoelectric inkjet print head is not greater than 10 microns. The input pipeline of the piezoelectric inkjet print head penetrates the inner wall of the third cavity 22 and is connected with an ink cartridge. The ink cartridge is provided with three-color semiconductor special ink, and the piezoelectric inkjet print head is used to perform color marking processing on the defective wafer.

[0041] The sorting component includes a manipulator. The output end of the manipulator is fixedly connected with a camera. The camera is signal-connected to the processor. The manipulator sorts the wafers with color markings through the camera.

[0042] In this embodiment, a plurality of holders 13 loaded with wafers are correspondingly placed in the first circular groove 12 of the support disk 5. The drive motor 11 is started, and the pulley 10 rolls along the conductive slide rail 7. The gate 16 on the side of the first cavity 20 away from the second cavity 21 is opened. The support disk 5 moves from the current support platform to the support platform in the first cavity 20 and enters the first cavity 20. The gate 16 closes quickly after the support disk 5 moves into the first cavity 20; When the pressure sensor on one side of the support disk 5 detects that one side of the support disk 5 abuts against the side wall of the gate 16 between the first cavity 20 and the second cavity 21, the drive motor 11 stops running, and the support disk 5 stops moving, so as to position the support disk 5 in the first cavity 20; Subsequently, the output end of the first electric telescopic rod 26 is controlled to extend, so that the electric gripper 27 performs central positioning on the holder 13, making the holder 13 coaxial with the first circular groove 12. Subsequently, the electromagnetic suction plate is started to magnetically fix the holder 13.

[0043] After the magnetic fixation is completed, the gate 16 between the first cavity 20 and the second cavity 21 is opened, and at the same time the drive motor 11 is started. The gate 16 closes quickly after the support disk 5 moves into the second cavity 21, so that the wafer is in a super-vacuum environment. While eliminating oxidation interference, in subsequent photographing and detection, air scattering can be reduced and the imaging contrast of the photo can be improved.

[0044] When the pressure sensor on one side of the support plate 5 detects that one side of the support plate 5 is against the side wall of the gate 16 between the second cavity 21 and the third cavity 22, the driving motor 11 is stopped and the support plate 5 stops moving, thereby positioning the support plate 5 in the second cavity 21; The focal length of the industrial camera 32 is effectively adjusted according to the diameter of the wafer, and the irradiation lamp 38 is turned on at the same time. The output end of the irradiation lamp 38 irradiates light to the beam splitter 39 at a horizontal angle. The beam splitter 39 reflects the incident light at a vertical angle on the wafer. The wafer receives the light and reflects the direct light in the incident direction. The reflected direct light passes directly through the beam splitter 39 and is mapped to the input end of the industrial camera 32. The industrial camera 32 takes pictures and transmits the taken pictures to the processor for analysis and detection.

[0045] The processor is equipped with a defect feature database, which stores the geometric, texture, and spectral features of various defects. The processor searches and compares the defect feature database based on the information in the photo to analyze whether the wafer has defects in a bright field environment. In a bright field environment, defect detection on wafers is to detect the presence or absence of particles and metal residues on the wafer surface. Therefore, the processor can retrieve and compare the data items on surface particles and metal residues in the defect detection database, and perform corresponding pre-marking. The pre-marking color is orange. After the photo is taken, the illumination lamp 38 is turned off, and the LED lamp 42 of the ring light source group 41 is turned on, so that the LED lamp 42 of the ring light source group 41 illuminates the wafer at a specific tilt angle. After receiving the light, the wafer vertically reflects scattered light, and the reflected scattered light directly passes through the beam splitter 39 and is mapped to the input end of the industrial camera 32. The industrial camera 32 takes the photo, and transmits the taken photo to the processor for analysis and detection; Similarly, the processor searches and compares the defect feature database based on the information in the photo to analyze whether the wafer has defects in the dark field environment; In a dark field environment, defect detection on wafers is performed to detect the presence or absence of microcracks on the wafer sub-surface. Therefore, the processor can retrieve and compare data items about sub-surface microcracks in the defect detection database and perform corresponding pre-marking. The pre-marking color is red.

[0046] After the industrial camera 32 completes the photographic inspection of the wafer in the bright field environment and the dark field environment, the LED light 42 of the ring light source group 41 is turned off, and then the angle motor 30 is started to rotate the infrared camera 33 to a position concentric with the center of the wafer, and the infrared camera 33 photographs and inspects the wafer through infrared imaging, and the infrared light of the infrared camera 33 penetrates the silicon-based material of the wafer to photograph and inspect the crystal defects inside the wafer, and the photographed photos are transmitted to the processor for analysis and inspection; The processor retrieves and compares the defect feature database based on the information of the photo, so as to analyze whether there are defects on the wafer under infrared light; Under infrared light, the defect detection performed on the wafer is to detect whether there are features such as dislocations and stacking faults inside the wafer. Therefore, the processor can retrieve and compare the data items regarding internal dislocations, stacking faults, etc. in the defect detection database, and perform corresponding pre-marking, and the pre-marking color is purple.

[0047] Finally, the processor does not perform pre-marking on the wafers that have no defects in all three detections.

[0048] After the detection is completed, the corner motor 30 is started again, and the industrial camera 32 is rotated to a position coaxial with the center of the wafer to complete the reset, and preparations are made to detect the wafers on the next set of support disks 5.

[0049] Open the gate 16 between the second cavity 21 and the third cavity 22, and at the same time start the driving motor 11 to run. The gate 16 closes quickly after the support disk 5 moves into the third cavity 22; When the pressure sensor on one side of the support disk 5 detects that one side of the support disk 5 abuts against the side wall of the gate 16 on the side of the third cavity 22 far from the second cavity 21, stop the driving motor 11 from running, and the support disk 5 stops moving, so as to position the support disk 5 in the third cavity 22.

[0050] After the positioning is completed, according to the marking information of the processor, control the output end of the robotic arm to move to the corresponding wafer, and mark the wafer with the corresponding color through the piezoelectric inkjet print head.

[0051] After the marking is completed, open the gate 16 on the side of the third cavity 22 far from the second cavity 21, and at the same time start the driving motor 11 to run. The gate 16 closes quickly after the support disk 5 moves out of the third cavity 22; And the robotic hand of the sorting component sorts and clamps the marked wafers through the camera; the specific clamping method is as follows: When there is only a single color mark on the wafer, perform sorting processing corresponding to the corresponding color; When there is more than one color on the wafer, perform sorting processing according to the priority order of purple, red, and orange.

[0052] The wafers sorted to the orange mark are recycled by the staff for re-cleaning and then subjected to secondary detection; The wafers sorted to the red mark are repaired by the staff, re-cleaned and then subjected to secondary detection; The wafers sorted to the purple mark are recycled and scrapped by the staff.

[0053] After the sorting is completed, the driving motor 11 is started again, and the support disk 5 drives the defect-free wafers to move along the conductive slide rail 7 to the side away from the vacuum assembly 3 for the next process.

[0054] A detection method for a detection device for semiconductor wafer defects: S1: The support disk 5 transports the wafer into the first cavity 20 for positioning. S2: The support disk 5 transports the wafer after positioning from the first cavity 20 into the second cavity 21 for detection. S3: Under the ultra-high vacuum environment in the second cavity 21, the wafer is photographed and detected under bright field environment, dark field environment and infrared light, and analyzed and processed by the processor for pre-marking. S4: After the detection is completed, the support disk 5 transports the wafer into the third cavity 22, and the marking component performs color marking on the corresponding wafer. S5: After the marking is completed, the support disk 5 transports the wafer out of the third cavity 22 and is sorted by the sorting component.

[0055] S31: The wafers with particles or metal residues detected on the upper surface of the wafer by the processor are pre-marked in orange. S32: The wafers with micro-cracks detected in the subsurface of the wafer by the processor are pre-marked in red. S33: The wafers with problems such as dislocations and stacking faults detected inside the wafer by the processor are pre-marked in purple.

[0056] S51: For the wafers with only a single color mark, they are sorted according to the corresponding color. S52: For the wafers with more than one color, they are sorted according to the priority order of purple, red, and orange. S53: The wafers sorted with orange marks are recycled by the staff, re-cleaned and then subjected to secondary detection. S54: The wafers sorted with red marks are repaired by the staff, re-cleaned and then subjected to secondary detection. S55: The wafers sorted with purple marks are recycled and scrapped by the staff.

[0057] It should be noted that in this document, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device.

[0058] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A semiconductor wafer defect detection device, characterized in that: The invention comprises a workbench (1), wherein a transmission component (2), a vacuum component (3) and a sorting component are arranged on the workbench (1), wherein the transmission component (2) comprises a movable support plate (5), wherein a plurality of circular grooves (12) are provided on the support plate (5), wherein a holder (13) for holding a wafer is placed in each of the circular grooves (12), wherein the vacuum component (3) comprises a shell (15), wherein a cavity (1) is formed between the shell (15) and the workbench (1), wherein the cavity (1) is sequentially divided into a first cavity (20), a second cavity (21) and a third cavity (22) with a vacuum environment along the transmission direction of the transmission component (2), wherein a positioning component (23) is arranged in the first cavity (20), a detection component (24) is arranged in the second cavity (21), and a marking component is arranged in the third cavity (22); The detection component (24) comprises a block (28), wherein the block (28) is provided with a second cavity (29) corresponding to each circular groove (12), wherein the second cavity (29) is provided with a rotatable and switchable industrial camera (32) and an infrared camera (33), wherein the industrial camera (32) and the infrared camera (33) are both signal-connected to a processor, wherein an input end of the industrial camera (32) is provided with an environmental adjustment component (34) on a side close to the workbench (1), wherein an environmental adjustment component (40) is provided in the second cavity (29), wherein the environmental adjustment component (34) comprises a housing ( 35), the shell body 2 (35) is provided with a cavity 1 (36), the shell body 2 (35) is further provided with a cavity 2 (37) perpendicular to the cavity 1 (36), the cavity 2 (37) is communicated with the cavity 1 (36), a side of the cavity 2 (37) away from the cavity 1 (36) is fixedly connected to an irradiation lamp (38), a junction of the cavity 2 (37) and the cavity 1 (36) is fixedly connected to a beam splitter (39), the environment adjustment component 2 (40) comprises an annular light source group (41), the annular light source group (41) comprises a plurality of LED lamps (42) with adjustable irradiation angles.

2. The semiconductor wafer defect detection device according to claim 1, characterized in that: The vacuum component (3) is arranged on the transmission component (2), and the transmission component (2) further comprises five transmission platforms (4), the five transmission platforms (4) are linearly arranged along the length direction of the workbench (1), and the middle three transmission platforms (4) are located in cavity 1. A groove 1 (6) is provided on a side of the transmission platform (4) away from the workbench (1), and conductive slide rails (7) are fixedly connected to inner walls of the groove 1 (6) on both sides opposite to each other, and the support plate (5) is slidably connected to the conductive slide rails (7).

3. The semiconductor wafer defect detection device according to claim 2, characterized in that: Sliding brushes are fixedly connected to the upper and lower sides of the support plate (5) corresponding to the conductive slide rail (7); a battery pack (8) is fixedly connected to the side of the support plate (5) away from the groove 1 (6); and the battery pack (8) is electrically connected to the sliding brushes on the support plate (5); The support seat (13) is provided with a second circular groove (14), and a wafer is placed in the second circular groove (14); The support plate (5) is provided with a plurality of grooves (9) on both sides along the width direction, and the plurality of grooves (9) are linearly and evenly arranged along the length direction of the support plate (5); a pulley (10) is rotatably connected in the groove (9); a portion of the pulley (10) protruding from the groove (9) is located in the conductive slide rail (7); the pulley (10) cooperates with the conductive slide rail (7); a drive motor (11) is fixedly connected to the pulley (10) on a side of the support plate (5) close to the groove (6); an output shaft of the drive motor (11) passes through the inner wall of the groove (9) and is fixedly connected to the pulley (10); and the drive motor (11) is electrically connected to the battery pack (8); A pressure sensor is provided on one side of each support plate (5) facing the transmission direction, and the pressure sensor is connected to the drive motor (11) via a signal. A metal circular plate capable of being magnetically attracted is fixedly connected to one side of the bracket (13) close to the circular groove one (12), and an electromagnetic suction piece capable of being controlled to be opened and closed is fixedly connected to the bottom of the circular groove one (12), and the electromagnetic suction piece is electrically connected to the battery pack (8).

4. The semiconductor wafer defect detection device according to claim 3, characterized in that: Four gates (16) are slidably arranged on the shell (15); the first cavity (20), the second cavity (21) and the third cavity (22) are formed by the four gates (16) dividing the cavity (1); a sliding opening (17) is provided on the shell (15) corresponding to the gate (16); the gate (16) cooperates with the sliding opening (17); the gate (16) is sealed and movably connected to the workbench (1); a connecting plate (18) is fixedly connected to the side of the gate (16) away from the workbench (1); a hydraulic telescopic cylinder (19) is arranged on both sides of the connecting plate (18) along the length direction and on the side close to the shell (15); a fixed end of the hydraulic telescopic cylinder (19) is fixedly connected to the shell (15); and an output end of the hydraulic telescopic cylinder (19) is fixedly connected to the connecting plate (18); Each gate (16) is arranged between two adjacent transmission platforms (4), and the three transmission platforms (4) in the middle are respectively located in the first cavity (20), the second cavity (21) and the third cavity (22).

5. The semiconductor wafer defect detection device according to claim 4, characterized in that: The outer walls of the block (28) on both sides along the width direction are fixedly connected to the inner wall of the second cavity (21); the block (28) is fixedly connected to a corner motor (30) on the side of the second cavity (29) away from the workbench (1); the output shaft of the corner motor (30) passes through the inner wall of the second cavity (29) and is fixedly connected to the second connecting plate (31); the industrial camera (32) and the infrared camera (33) are respectively fixedly connected to the two sides of the second connecting plate (31) along the length direction and on the side close to the workbench (1).

6. The semiconductor wafer defect detection device according to claim 5, characterized in that: The second environmental adjustment component (40) further comprises a support plate (49), the support plate (49) being fixedly connected to a side of the inner wall of the second cavity (29) close to the workbench (1), the support plate (49) being provided with a circular hole (25), the central axis of the circular hole (25) being coaxially arranged with the center line of the second cavity (29), the annular light source group (41) being arranged in the circular hole (25), the plurality of LED lamps (42) being evenly distributed in a circle with the center line of the second cavity (29) as the center, each of the LED lamps (42) being fixedly connected to a connecting column (43) on a side away from the output end, the connecting column (43) being rotatably connected to a connecting rod (44) along its radial direction, the connecting rod (44) are fixedly connected to fixing rods (45) at both ends along the axial direction, the side of the fixing rod (45) away from the connecting rod (44) is fixedly connected to the inner wall of the circular hole (25), the side of the connecting column (43) away from the LED lamp (42) is hingedly connected to a connecting block (46), the upper parts of the sides of a plurality of connecting blocks (46) away from the connecting column (43) are commonly fixedly connected to a connecting ring (47), the side of the connecting ring (47) away from the center of the circle is hingedly connected to a plurality of electric telescopic rods (48), the fixed end of the electric telescopic rod (48) is hingedly connected to the inner wall of the cavity (29), and the plurality of electric telescopic rods (48) are evenly distributed on the circumference of a circle with the axis of the connecting ring (47) as the center of the circle.

7. The semiconductor wafer defect detection device according to claim 6, characterized in that: The positioning assembly (23) comprises a plurality of electric telescopic rods (26), each of the electric telescopic rods (26) corresponding to a circular groove (12), the electric telescopic rod (26) being located directly above the center of the circular groove (12), the fixed end of the electric telescopic rod (26) being fixedly connected to the inner wall of the first cavity (20) on a side away from the workbench (1), and the output end of the electric telescopic rod (26) being fixedly connected to the electric clamp (27); The marking component comprises a mechanical arm, wherein a fixed end of the mechanical arm is fixedly connected to an inner wall of a side of the third cavity (22) away from the workbench (1), an output end of the mechanical arm is fixedly connected to a piezoelectric inkjet print head, and an input end pipeline of the piezoelectric inkjet print head passes through the inner wall of the third cavity (22) and is connected to an ink cartridge; The sorting component is arranged on a side of the workbench (1) close to the output end of the transmission component (2), and the sorting component comprises a manipulator, the output end of the manipulator is fixedly connected to a camera, and the camera is connected to a processor signal.

8. The detection method for a semiconductor wafer defect detection device according to claim 7, characterized in that: S1: The wafer is carried by the support plate (5) and moved into the first cavity (20) for positioning; S2: The wafer after positioning is carried by the support plate (5) from the first cavity (20) into the second cavity (21) for inspection; S3: photographing and testing the wafer in a bright field environment, a dark field environment, and infrared light in an ultra-vacuum environment of the second cavity (21), and performing analysis and pre-marking by a processor; S4: After the detection is completed, the support plate (5) carries the wafer into the third cavity (22), and the marking component performs color marking on the corresponding wafer; S5: After the marking is completed, the wafer is carried out of the third cavity (22) by the support plate (5) and sorted by the sorting component.

9. The detection method for a semiconductor wafer defect detection device according to claim 8, characterized in that: The specific steps of S3 are as follows: S31: The processor detects wafers with particles and metal residues on the upper surface of the wafer and performs orange pre-marking; S32: The processor detects wafers with micro cracks on the wafer sub-surface and performs red pre-marking; S33: The processor detects wafers with dislocation and stacking fault problems inside the wafer and performs purple pre-marking.

10. The detection method for a semiconductor wafer defect detection device according to claim 8, characterized in that: The specific steps of S5 are as follows: S51: For wafers with only a single color mark, sorting is performed according to the corresponding color; S52: For wafers with more than one color, sorting is performed according to the priority order of purple, red, and orange; S53: Wafers sorted to orange marks are collected by staff for re-cleaning and secondary inspection; S54: The wafers sorted to the red mark are repaired and cleaned by the staff and then tested again; S55: Wafers sorted to purple marks will be recycled and scrapped by staff.

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