Electronic component inspection device and tray recovery device

Abstract

The invention provides an electronic component inspection apparatus and a tray recovery apparatus. When a tray arranged on the back side of an electronic component inspection device is recycled, an operator must recycle the tray, and the working efficiency is improved. The electronic component inspection device (1) is provided with storage trays (T1-T3) for storing inspected electronic components in an electronic component recovery area (CR) arranged on the back side of the electronic component inspection device (1). The electronic component inspection device (1) is provided with a tray recovery channel (41) and a tray conveying mechanism (50). The tray recovery channel (41) conveys the storage trays (T1-T3) to the front side of the electronic component inspection device (1). The tray conveying mechanism (50) holds the storage trays (T1-T3) arranged in the electronic component recovery area (CR) and conveys the storage trays (T1-T3) to the tray recovery channel (41).

Description

Technical Field

[0001] The present invention relates to an electronic component inspection apparatus and a tray recovery apparatus for recovering a storage tray storing inspected electronic components from an electronic component recovery area provided on the back side of the electronic component inspection apparatus. Background Art

[0002] In an electronic component inspection apparatus, after inspecting the electrical characteristics of electronic components, the inspected electronic components are stored in a tray. Here, an area for recovering the tray storing the inspected electronic components is provided in front of the electronic component inspection apparatus. In addition, inside the electronic component inspection apparatus, a tray storing the inspected electronic components is arranged in an area located on the back side of the electronic component inspection apparatus.

[0003] When recovering the tray arranged on the back side of the electronic component inspection apparatus, an operator can recover the tray by opening an access door provided on the side of the electronic component inspection apparatus.

[0004] Prior Art Documents

[0005] Patent Documents

[0006] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2022-77273 Summary of the Invention

[0007] Problems to be Solved by the Invention

[0008] When recovering the tray arranged on the back side of the electronic component inspection apparatus, as described above, an operator has to recover the tray, and there is room for improvement in terms of work efficiency.

[0009] Means for Solving the Problems

[0010] A first invention of the present application is an electronic component inspection apparatus in which a storage tray storing inspected electronic components is arranged in an electronic component recovery area provided on the back side of the electronic component inspection apparatus. The electronic component inspection apparatus has a tray recovery passage and a tray conveying mechanism. The tray recovery passage conveys the storage tray to the front side of the electronic component inspection apparatus. The tray conveying mechanism holds the storage tray arranged in the electronic component recovery area and conveys it onto the tray recovery passage.

[0011] The tray conveying mechanism can include a hand, a first guide rail, and a second guide rail. The hand holds the storage tray. The first guide rail extends from the electronic component recovery area to the tray recovery passage. The second guide rail moves along the first guide rail and moves the hand in the vertical direction.

[0012] In an electronic component inspection apparatus, a tray supply passage for supplying empty trays to an electronic component recovery area can be provided. Here, a tray conveyance mechanism can convey the empty trays supplied through the tray supply passage to the electronic component recovery area. The number of tray recovery passages can be set to be the same as the number of storage trays arranged in the electronic component recovery area.

[0013] In the electronic component inspection apparatus, a tray recovery mechanism for recovering the storage trays can be provided. Here, the tray recovery mechanism can include a guide rail, a mounting table, and a support member. The guide rail can be arranged along the tray recovery passage. The mounting table is located above the tray recovery passage and receives the storage trays from the tray conveyance mechanism. The support member moves along the guide rail and supports the mounting table.

[0014] A plurality of storage trays can be mounted on the mounting table. On the front side of the electronic component inspection apparatus with respect to the electronic component recovery area, an existing tray recovery passage for recovering the trays storing the electronic components is provided. Here, the tray recovery passage can be arranged in parallel with the existing tray recovery passage.

[0015] A second invention of the present application is a tray recovery device that is installed in an electronic component inspection apparatus for inspecting electronic components and recovers the storage trays storing the inspected electronic components from an electronic component recovery area provided on the back side of the electronic component inspection apparatus. The tray recovery device has a tray recovery passage and a tray conveyance mechanism. The tray recovery passage conveys the storage trays to the front side of the electronic component inspection apparatus. The tray conveyance mechanism holds the storage trays arranged in the electronic component recovery area and conveys them onto the tray recovery passage.

[0016] In the tray recovery device of the second invention of the present application, the tray conveyance mechanism can include a hand, a first guide rail, and a second guide rail. The hand holds the storage trays. The first guide rail extends from the electronic component recovery area to the tray recovery passage. The second guide rail moves along the first guide rail and moves the hand in the vertical direction.

[0017] In the tray recovery device, a tray supply passage for supplying empty trays to the electronic component recovery area can be provided. Here, the tray conveyance mechanism can convey the empty trays supplied through the tray supply passage to the electronic component recovery area. The number of tray recovery passages can be set to be the same as the number of storage trays arranged in the electronic component recovery area.

[0018] In the tray recovery device, a tray recovery mechanism for recovering the storage trays can be provided. Here, the tray recovery mechanism can include a guide rail, a mounting table, and a support member. The guide rail can be arranged along the tray recovery passage. The mounting table is located above the tray recovery passage and receives the storage trays from the tray conveyance mechanism. The support member moves along the guide rail and supports the mounting table.

[0019] A plurality of storage trays can be placed on the placement table. A used tray recovery passage for recovering a tray containing electronic components is provided on the front side of the electronic component inspection device with respect to the electronic component recovery area. Here, the tray recovery passage can be arranged in parallel with the used tray recovery passage.

[0020] Advantages of the Invention

[0021] According to the present invention, by using the tray recovery passage and the tray conveying mechanism, the storage trays arranged on the back side of the electronic component inspection device can be automatically recovered. Description of the Drawings

[0022] Figure 1 It is a schematic diagram showing the structure of the electronic component inspection device of the first embodiment.

[0023] Figure 2 It is a perspective view showing the structure of the tray conveying mechanism.

[0024] Figure 3 It is a block diagram showing the structure for controlling the operation of the tray recovery and supply unit in the first embodiment.

[0025] Figure 4 It is a flowchart showing the process of recovering the tray to be replaced in the tray recovery and supply unit.

[0026] Figure 5 It is a flowchart showing the process of supplying an empty tray in the tray recovery and supply unit.

[0027] Figure 6 It is a schematic diagram showing the structure of the electronic component inspection device of the second embodiment.

[0028] Figure 7 It is a perspective view showing the structure of the tray recovery mechanism.

[0029] Figure 8 It is a block diagram showing the structure for controlling the operation of the tray recovery and supply unit in the second embodiment.

[0030] Figure 9 It is a diagram for explaining the operation of recovering a tray and replacing it with an empty tray.

[0031] Figure 10 It is a diagram for explaining the operation of recovering a tray and replacing it with an empty tray.

[0032] Figure 11 It is a diagram for explaining the operation of recovering a tray and replacing it with an empty tray.

[0033] Figure 12 It is a diagram for explaining the operation of recovering a tray and replacing it with an empty tray.

[0034] Figure 13 It is a diagram showing the operation of recycling a tray and replacing it with an empty tray.

[0035] Figure 14 It is a diagram showing the operation of recycling a tray and replacing it with an empty tray.

[0036] Figure 15 It is a diagram showing the operation of recycling a tray and replacing it with an empty tray.

[0037] Figure 16 It is a diagram showing the operation of recycling a tray and replacing it with an empty tray.

[0038] Figure 17 It is a diagram showing the operation of recycling a tray and replacing it with an empty tray.

[0039] Figure 18 It is a diagram showing the operation of recycling other trays and replacing them with empty trays.

[0040] Figure 19 It is a diagram showing the operation of recycling other trays and replacing them with empty trays.

[0041] Figure 20 It is a diagram showing the operation of recycling other trays and replacing them with empty trays.

[0042] Figure 21 It is a diagram showing the operation of recycling other trays and replacing them with empty trays.

[0043] Figure 22 It is a diagram showing the operation of recycling other trays and replacing them with empty trays.

[0044] Figure 23 It is a diagram showing the operation of recycling other trays and replacing them with empty trays.

[0045] Figure 24 It is a diagram showing the operation of recycling other trays and replacing them with empty trays.

[0046] Figure 25 It is a diagram showing the operation of recycling other trays and replacing them with empty trays.

[0047] Figure 26 It is a diagram showing a modified example of the tray recycling mechanism. Detailed implementation mode

[0048] (First implementation mode)

[0049] Use Figure 1 To explain the structure of the electronic component inspection device as the first implementation mode. In Figure 1In this case, the X-axis and the Y-axis are orthogonal directions, and the direction orthogonal to the X-axis and the Y-axis is defined as the Z-axis. Examples of the electronic components inspected by the electronic component inspection apparatus 1 include IC (Integrated Circuit) devices such as LSI (Large Scale Integration), CMOS (Complementary Metal Oxide Semiconductor), CCD (Charge Coupled Device), module ICs formed by encapsulating a plurality of modules, crystal devices, pressure sensors, inertial sensors, acceleration sensors, gyro sensors, and fingerprint sensors.

[0050] (Structure of the electronic component inspection apparatus 1)

[0051] The electronic component inspection apparatus 1 includes an inspection unit 1A and a tray recovery / supply unit 1B. In the present embodiment, the inspection unit 1A and the tray recovery / supply unit 1B are integrally formed, but they can also be separated into a device constituting the inspection unit 1A (electronic component inspection apparatus) and a device constituting the tray recovery / supply unit 1B (tray recovery / supply apparatus). In this case, the electronic component inspection system can be constituted by the device constituting the inspection unit 1A (electronic component inspection apparatus) and the device constituting the tray recovery / supply unit 1B (tray recovery / supply apparatus) connected to the device constituting the inspection unit 1A (electronic component inspection apparatus).

[0052] (Structure of the inspection unit 1A)

[0053] Hereinafter, the structure of the inspection unit 1A will be described.

[0054] In the first tray conveyance path 11, a tray T containing a plurality of electronic components in an uninspected state is disposed on the front side of the electronic component inspection apparatus 1. The tray T is conveyed through the first tray conveyance path 11 to the electronic component supply area DR, and each electronic component contained in the tray T is conveyed to the first reciprocating mechanism 13 by the electronic component conveyance mechanism 12. The first reciprocating mechanism 13 conveys the electronic components from the electronic component supply area DR to the inspection area IR.

[0055] After all the electronic components are conveyed from the tray T to the first reciprocating mechanism 13, the emptied tray T is conveyed from the first tray conveyance track 11 to the second tray conveyance track 15 by the tray conveyance mechanism 14. The second tray conveyance path 15 conveys the emptied tray T to the front side of the electronic component inspection apparatus 1. The third tray conveyance path 16 is disposed in parallel with the second tray conveyance path 15 and conveys the emptied tray T to the electronic component supply area DR. In addition, the third tray conveyance path 16 can also be omitted.

[0056] In the electronic component supply area DR, a heat pipe 17 for adjusting the temperature of the electronic components during inspection standby and a rotary table 18 for rotating the electronic components are arranged. Multiple electronic components can be placed on the heat pipe 17, and the temperature is adjusted to a temperature suitable for the inspection of the electronic components by heating or cooling the electronic components. In the present embodiment, two heat pipes 17 are provided, but it is not limited thereto. The electronic components can be conveyed from the heat pipe 17 to the first reciprocating mechanism 13, or the electronic components can be conveyed from the rotary table 18 to the first reciprocating mechanism 13.

[0057] After the first reciprocating mechanism 13 conveys the electronic components from the electronic component supply area DR to the inspection area IR, a test hand (not shown) conveys the electronic components from the first reciprocating mechanism 13 to the test socket 19. After taking out the electronic components from the first reciprocating mechanism 13, the first reciprocating mechanism 13 returns from the inspection area IR to the electronic component supply area DR. The first reciprocating mechanism 13 can heat or cool the electronic components placed on the first reciprocating mechanism 13. The electronic components whose temperature has been adjusted by the heat pipe 17 can be conveyed to the inspection area IR while maintaining the temperature adjustment state through the first reciprocating mechanism 13.

[0058] The test socket 19 arranged in the inspection area IR has a plurality of probes electrically connected to the terminals of the electronic components to inspect the electrical characteristics of the electronic components. Here, the test socket 19 can heat or cool the electronic components and can adjust the electronic components to a temperature suitable for inspection. The above-mentioned test hand presses the electronic components against the test socket 19. In addition, the test hand can heat or cool the electronic components and can maintain the temperature adjustment state of the electronic components.

[0059] In the electronic component recovery area CR, a plurality of inspected electronic components are recovered. When the inspection in the test socket 19 is completed, a test hand (not shown) conveys the electronic components from the test socket 19 to the second reciprocating mechanism 20. The second reciprocating mechanism 20 conveys the electronic components from the inspection area IR to the electronic component recovery area CR. In addition, a rotary table 21 for rotating the electronic components can be arranged in the electronic component recovery area CR.

[0060] In the electronic component recovery area CR, trays T1 to T3 for storing the inspected electronic components are arranged, and the electronic components are conveyed from the reciprocating mechanism 20 or the rotary table 21 to each of the trays T1 to T3 by the electronic component recovery mechanism 22. In the present embodiment, three trays T1 to T3 are arranged, and the trays T1 to T3 as the storage destinations of the electronic components can be determined according to the inspection results of the electronic components.

[0061] In the electronic component recycling area CR, three tray recycling channels (existing tray recycling channels) 23 are configured, and empty trays T can be configured in the tray recycling channels 23. The electronic component recycling mechanism 22 conveys electronic components from the reciprocating mechanism 20 or the rotary table 21 to the tray T on the tray recycling channel 23. When storing the inspected electronic components in the tray T, more specifically, when the tray T is full of inspected electronic components, the tray recycling channel 23 conveys the tray T to the front of the electronic component inspection device 1. In the present embodiment, three tray recycling channels 23 are provided, and the tray T serving as the storage destination of the electronic components can be determined among the trays T configured in the three tray recycling channels 23 according to the inspection results of the electronic components.

[0062] (Structure of the tray recycling and supply unit 1B)

[0063] Hereinafter, the structure of the tray recycling and supply unit 1B will be described.

[0064] In the tray recycling and supply unit 1B, three tray recycling channels 41 and one tray supply channel 42 are configured. The tray recycling channels 41 and the tray supply channel 42 are arranged side by side in the X direction. In addition, the tray recycling channels 41 are arranged side by side with the tray recycling channels 23.

[0065] The number of tray recycling channels 41 is set to be the same as the number of trays T1 to T3 configured in the electronic component recycling area CR of the inspection unit 1A. In the present embodiment, since three trays T1 to T3 are configured in the electronic component recycling area CR, three tray recycling channels 41 are provided. In addition, the total number of trays configured in the electronic component recycling area CR is not limited to three. The tray supply channel 42 is used to supply an empty tray Te to the electronic component recycling area CR.

[0066] The tray conveying mechanism 50 holds each of the trays T1 to T3 configured in the electronic component recycling area CR and conveys them to each tray recycling channel 41. Here, each tray recycling channel 41 corresponds to each of the trays T1 to T3 configured in the electronic component recycling area CR, and the tray recycling channel 41 serving as the conveying destination of the trays T1 to T3 is changed according to the trays T1 to T3. The specific structure of the tray conveying mechanism 50 will be described later.

[0067] An empty tray Te can be configured at the first end of the tray supply channel 42 (the end on the front side of the electronic component inspection device 1), and the tray Te is conveyed through the tray supply channel 42 to the second end of the tray supply channel 42 (the end on the back side of the electronic component inspection device 1). The tray conveying mechanism 50 holds the tray Te conveyed to the second end of the tray supply channel 42, and in the electronic component recycling area CR, the trays T1 to T3 are recycled and the tray Te is conveyed to an idle position.

[0068] (Structure of the tray conveying mechanism 50)

[0069] Next, Figure 2 the structure of the tray conveying mechanism 50 will be described.

[0070] The tray conveying mechanism 50 has a first guide rail 51 extending in the X direction, a second guide rail 52 extending in the Z direction, and a hand 53 for holding the tray T. As Figure 1 shown, a part of the first guide rail 51 extends to the electronic component recovery area CR of the inspection unit 1A.

[0071] The second guide rail 52 is connected to the first guide rail 51 and moves in the X direction along the first guide rail 51 by the drive of the first guide rail 51. The hand 53 is connected to the second guide rail 52 and moves in the Z direction along the second guide rail 52 by the drive of the second guide rail 52. The structure for holding the tray T by the hand 53 can be appropriately determined. For example, a pair of claw portions for holding both ends of the tray T are provided on the hand 53, and the tray T can be held by rotating the pair of claw portions.

[0072] (Operation of the tray recovery and supply unit 1B)

[0073] In the tray recovery and supply unit 1B, as Figure 3 shown, the drives of the tray conveying mechanism 50, the tray recovery passage 41, and the tray supply passage 42 are controlled by the controller 100. The operation of the tray recovery and supply unit 1B will be described using Figure 4 and Figure 5 the flowcharts shown.

[0074] Figure 4 The process shown is the process of recovering the trays T1 to T3 arranged in the electronic component recovery area CR, Figure 5 and the process shown is the process of conveying the empty tray Te to the electronic component recovery area CR. By performing the process shown in Figure 4 and then performing the process shown in Figure 5 in the electronic component recovery area CR, each tray T1 to T3 containing electronic components can be replaced with the empty tray Te. Figure 4 and Figure 5 The process shown is performed by the controller 100 shown in Figure 3 .

[0075] Figure 4 The process shown in Figure 4The processing shown here. Here, whether the trays T1 to T3 are full can be determined by counting the number of electronic components conveyed to each tray T by the electronic component recycling mechanism 22 that constitutes the inspection unit 1A. In addition, when starting Figure 4 the processing shown, the tray conveying mechanism 50 is in a standby state. When the tray conveying mechanism 50 is in a standby state, for example, the hand 53 can be stopped at a position corresponding to the tray supply passage 42.

[0076] In step S101, the controller 100 moves the second guide rail 52 along the first guide rail 51 by driving the first guide rail 51. Specifically, the second guide rail 52 is moved from the standby position (for example, a position corresponding to the tray supply passage 42) to a position corresponding to the replacement target trays T1 to T3 arranged in the electronic component recycling area CR.

[0077] In step S102, the controller 100 moves the hand 53 downward along the second guide rail 52 by driving the second guide rail 52, and then holds the replacement target trays T1 to T3 by the hand 53.

[0078] In step S103, the controller 100 conveys the trays T1 to T3 held by the hand 53 to the tray recycling passage 41 by driving the tray conveying mechanism 50. Specifically, the controller 100 moves the hand 53 upward along the second guide rail 52 while holding the replacement target trays T1 to T3 by driving the second guide rail 52. Then, the controller 100 moves the second guide rail 52 along the first guide rail 51 from the electronic component recycling area CR to the tray recycling supply unit 1B by driving the first guide rail 51.

[0079] After the second guide rail 52 moves to the tray recycling passage 41 corresponding to the replacement target trays T1 to T3, the controller 100 moves the hand 53 downward along the second guide rail 52 by driving the second guide rail 52. The holding of the trays T1 to T3 is released by the hand 53, and the trays T1 to T3 are placed on the tray recycling passage 41.

[0080] In step S104, the controller 100 conveys the trays T1 to T3 from the back side to the front side of the electronic component inspection device 1 by driving the tray recycling passage 41. Thus, the replacement target trays T1 to T3 can be taken out from the front of the electronic component inspection device 1.

[0081] Next, Figure 5 the processing shown starts when Figure 4 the processing shown ends and an empty tray Te is placed on the tray supply passage 42. Specifically, the controller 100 ends Figure 4 the processing shown and starts when it is detected that a tray Te is placed on the tray supply passage 42.Figure 5 The processing shown. Whether the tray Te is placed on the tray supply passage 42 can be determined using various sensors (such as optical sensors).

[0082] In step S201, the controller 100 conveys the tray Te from the front side to the back side of the electronic component inspection device 1 by driving the tray supply passage 42.

[0083] In step S202, the controller 100 holds the tray Te placed on the tray supply passage 42 by driving the tray conveyance mechanism 50. Specifically, the controller 100 moves the second guide rail 52 to a position corresponding to the tray supply passage 42 by driving the first guide rail 51. Then, after the controller 100 drives the second guide rail 52 to move the hand 53 downward along the second guide rail 52, the hand 53 holds the tray Te.

[0084] In step S203, the controller 100 conveys the tray Te held by the hand 53 to the electronic component recovery area CR by driving the tray conveyance mechanism 50. Specifically, the controller 100 drives the second guide rail 52 to move the hand 53 upward along the second guide rail 52 while holding the tray Te. Then, the controller 100 drives the first guide rail 51 to move the second guide rail 52 from the tray recovery supply section 1B to the electronic component recovery area CR along the first guide rail 51.

[0085] In the electronic component recovery area CR, after the second guide rail 52 moves to the target position for arranging the tray Te (the position where the trays T1 to T3 recovered by the Figure 4 processing shown are arranged), the controller 100 drives the second guide rail 52 to move the hand 53 downward along the second guide rail 52. The holding of the tray Te is released by the hand 53, thereby arranging the tray Te at the target position in the electronic component recovery area CR.

[0086] According to the present embodiment, the trays T1 to T3 arranged in the electronic component recovery area CR can be automatically recovered by the tray recovery supply section 1B. In addition, by the tray recovery supply section 1B, an empty tray Te can be supplied to the position where the recovered trays T1 to T3 are arranged.

[0087] (Second Embodiment)

[0088] Use Figure 6The structure of the electronic component inspection apparatus 1 according to the present embodiment will be described. In the present embodiment, the same components as those described in the first embodiment are denoted by the same reference numerals, and detailed descriptions thereof are omitted. In the present embodiment, the structure of the inspection unit 1A is the same as that of the first embodiment. The structure of the tray recovery and supply unit 1C in the present embodiment is different from the structure of the tray recovery and supply unit 1B in the first embodiment. Hereinafter, the points different from the first embodiment will be mainly described.

[0089] (Structure of the tray recovery and supply unit 1C)

[0090] In the tray recovery and supply unit 1C, a tray conveyance mechanism 50 and a tray recovery mechanism 60 described in the first embodiment are provided. In the present embodiment, one tray recovery passage 41 and one tray supply passage 42 are arranged in the tray recovery and supply unit 1C.

[0091] Figure 7 A perspective view showing the tray recovery mechanism 60. The tray recovery mechanism 60 has a guide rail 61 extending in the Y direction, a mounting table 62 for mounting the tray T, and a support member 63 for supporting the mounting table 62. As Figure 6 shown, the guide rail 61 is arranged along the tray recovery passage 41 and the tray supply passage 42, and is arranged at a position adjacent to the tray supply passage 42.

[0092] The base end portion of the support member 63 is connected to the guide rail 61, and the support member 63 can move in the Y direction along the guide rail 61. The mounting table 62 is fixed to the front end portion of the support member 63, and the mounting table 62 moves together with the support member 63. The mounting table 62 is located above the tray recovery passage 41 and the tray supply passage 42, and two trays T can be arranged and configured on the mounting table 62.

[0093] (Operation of the tray recovery and supply unit 1C)

[0094] In the tray recovery and supply unit 1C, as Figure 8 shown, the driving of the tray conveyance mechanism 50, the tray recovery passage 41, the tray supply passage 42, and the tray recovery mechanism 60 is controlled by the controller 100. In the present embodiment, the processes shown in Figure 4 and Figure 5 are also performed.

[0095] Here, in the process of step S103 shown in Figure 4 the trays T1 to T3 to be replaced are conveyed to the tray recovery passage 41, but in the present embodiment, the trays T1 to T3 to be replaced are conveyed to the tray recovery passage 41 or the mounting table 62 of the tray recovery mechanism 60. In addition, in Figure 4In the process of step S104 shown, the trays T1 to T3 to be replaced are conveyed from the back side to the front side of the electronic component inspection apparatus 1 by driving the tray recovery passage 41. However, in the present embodiment, the trays T1 to T3 to be replaced are conveyed from the back side to the front side of the electronic component inspection apparatus 1 by driving the tray recovery passage 41 or the tray recovery mechanism 60.

[0096] In the present embodiment, by using the tray recovery passage 41 and the mounting table 62, it is possible to recover the three trays T1 to T3 arranged in the electronic component recovery area CR. Here, for the three trays T1 to T3, it is possible to pre-assign the trays recovered by the tray recovery passage 41 and the trays recovered by the mounting table 62. For example, it is possible to pre-determine that the tray T1 is recovered by the tray recovery passage 41, and the trays T2 and T3 are recovered by the mounting table 62.

[0097] Next, use Figures 9 to 25 The operations of the tray conveyance mechanism 50 and the tray recovery mechanism 60 will be specifically described. Hereinafter, the operations of recovering the tray T1 and replacing it with an empty tray Te and recovering the tray T2 and replacing it with an empty tray Te will be described.

[0098] First, use Figures 9 to 17 The operation of recovering the tray T1 and replacing it with an empty tray Te will be described.

[0099] In Figure 9 , in the tray conveyance mechanism 50, by moving the second guide rail 52 along the first guide rail 51, the hand 53 is moved above the tray T1. Next, as Figure 10 shown, by moving the hand 53 downward along the second guide rail 52, the tray T1 is held by the hand 53.

[0100] Next, with the hand 53 holding the tray T1, after moving the hand 53 upward along the second guide rail 52, the second guide rail 52 is moved along the first guide rail 51, whereby as Figure 11 shown, the hand 53 is stopped above the tray recovery passage 41. Here, the mounting table 62 is retracted to the front side of the electronic component inspection apparatus 1 so as not to interfere with the hand 53. And, as Figure 12 shown, after moving the hand 53 downward along the second guide rail 52, the holding of the tray T1 by the hand 53 is released, whereby as Figure 13 shown, the hand 53 releases the holding of the tray T1, thereby placing the tray T1 on the tray recovery passage 41.

[0101] Next, by driving the tray recovery passage 41, as Figure 14As shown, the tray T1 moves from the back side to the front side of the electronic component inspection device 1. In addition, by driving the tray supply passage 42, an empty tray Te is transported from the front side to the back side of the electronic component inspection device 1. When the tray Te reaches the back side of the electronic component inspection device 1, as shown in FIG. Figure 15 As shown, the hand 53 moves downward along the second guide rail 52, thereby holding the tray Te.

[0102] After the hand 53 moves upward along the second guide rail 52 while holding the tray Te, the second guide rail 52 moves along the first guide rail 51, thereby Figure 16 As shown in FIG. 1 , the hand 53 stops above the area where the tray T1 is placed. Then, the hand 53 moves downward along the second guide rail 52 to release the holding of the tray Te. Figure 17 As shown in FIG. 1 , the tray Te is arranged in the electronic component collection area CR. The tray Te is used as the tray T1.

[0103] Next, use Figures 18 to 25 The operation of collecting the tray T2 and replacing it with the empty tray Te will be described.

[0104] like Figure 18 As shown, after the second guide rail 52 moves along the first guide rail 51 to a position corresponding to the tray T2 arranged in the electronic component collection area CR, the hand 53 moves downward along the second guide rail 52, thereby the hand 53 holds the tray T2. Figure 19 As shown, the hand 53 moves upward along the second guide rail 52 while holding the tray T2.

[0105] Next, when the second guide rail 52 moves along the first guide rail 51 toward the tray recovery channel 41, as shown in FIG. Figure 20 As shown in FIG. 1 , the hand 53 holding the tray T2 stops above the mounting table 62. Here, the mounting table 62 of the tray recovery mechanism 60 is on standby at the receiving position for receiving the tray T2. Figure 21 As shown, the hand 53 releases the tray T2 and places it on the stage 62. While the tray T2 is placed on the stage 62, the tray supply passage 42 is driven to move the empty tray Te from the front to the back of the electronic component inspection apparatus 1.

[0106] Next, the support member 63 moves along the guide rail 61, so that the mounting table 62 moves from the back side to the front side of the electronic component inspection device 1. Figure 22As shown, when the mounting table 62 moves to the front of the electronic component inspection device 1, the mounting table 62 is located above the tray T1 recovered by the tray recovery passage 41 and the empty tray Te arranged in the tray supply passage 42. In addition, by moving the second guide rail 52 along the first guide rail 51, the hand 53 stops above the tray Te conveyed by the tray supply passage 42.

[0107] Next, the hand 53 moves downward along the second guide rail 52, whereby as Figure 23 shown, the tray Te on the tray supply passage 42 is held. Then, as Figure 24 shown, the hand 53 moves upward along the second guide rail 52 while holding the tray Te. After the hand 53 moves upward, the second guide rail 52 moves along the first guide rail 51, whereby the hand 53 stops above the area where the tray T2 is arranged in the electronic component recovery area CR. Then, as Figure 25 shown, the hand 53 moves downward along the second guide rail 52 to release the holding of the tray Te, whereby the tray Te can be arranged in the area where the tray T2 is arranged. Thus, the tray T2 containing the electronic components can be replaced with the empty tray Te, and the tray Te can be used as the tray T2.

[0108] According to the present embodiment, similarly to the first embodiment, it is possible to perform recovery while distinguishing the trays T1 to T3 containing electronic components. Here, by using the mounting table 62, it is not necessary to arrange three tray recovery passages 41 corresponding to the trays T1 to T3 in the horizontal direction, and the electronic component inspection device 1 can be miniaturized in the X direction.

[0109] (Modification of the second embodiment)

[0110] In the present embodiment, one mounting table 62 is provided in the tray recovery mechanism 60, but it is not limited thereto. For example, as Figure 26 shown in the tray recovery mechanism 60, two mounting tables 62 can be provided for the support member 63. Thus, the trays T1 to T3 containing electronic components can be distributed to the tray recovery passage 41 and the two mounting tables 62.

[0111] In Figure 26 the shown tray recovery mechanism 60, when the trays T1 to T3 are placed on the lower mounting table 62, the hand 53 holding the trays T1 to T3 is stopped at a position corresponding to between the upper mounting table 62 and the lower mounting table 62. Moreover, by moving the support member 63, the hand 53 holding the trays T1 to T3 can be made to enter between the upper mounting table 62 and the lower mounting table 62, and the trays T1 to T3 can be placed on the lower mounting table 62.

[0112] In addition, the mounting table 62 can mount one tray T, or can mount a plurality of trays T arranged in the X direction. Further, the mounting table 62 can also be arranged in three or more in the Z direction.

[0113] Description of Reference Numerals:

[0114] 1 Electronic component inspection device

[0115] 1A Inspection unit

[0116] 1B, 1C Tray recovery and supply unit

[0117] 11 First tray conveying path

[0118] 12 Electronic component conveying mechanism

[0119] 13 First reciprocating mechanism

[0120] 14 Tray conveying mechanism

[0121] 15 Second tray conveying path

[0122] 16 Third tray conveying path

[0123] 17 Heat sink

[0124] 18 Rotary table

[0125] 19 Test socket

[0126] 20 Reciprocating mechanism

[0127] 21 Rotary table

[0128] 22 Electronic component recovery mechanism

[0129] 23 Tray recovery path

[0130] 41 Tray recovery path

[0131] 42 Tray supply path

[0132] 50 Tray conveying mechanism

[0133] 51 First guide rail

[0134] 52 Second guide rail

[0135] 53 Hand

[0136] 60 Tray recovery mechanism

[0137] 61 Guide rail

[0138] 62 Mounting table

[0139] 63 Support member

[0140] 100 Controller

[0141] CR Electronic Component Recycling Area

[0142] DR Electronic Component Supply Area

[0143] IR Inspection Area

[0144] T, T1, T2, T3, Te Trays

Claims

1. An electronic component inspection device, wherein a storage tray for storing inspected electronic components is arranged in an electronic component collection area provided on the back side of the electronic component inspection device, wherein: The electronic component inspection device comprises: a tray recovery passage for conveying the storage tray toward the front side of the electronic component inspection device; and The tray conveying mechanism holds the storage tray disposed in the electronic component collection area and conveys the storage tray to the tray collection passage.

2. The electronic component inspection device according to claim 1, characterized in that: The pallet conveying mechanism comprises: A hand holding the storage tray; a first guide rail extending from the electronic component recovery area to the tray recovery channel; and The second guide rail moves along the first guide rail and moves the hand in the up-down direction.

3. The electronic component inspection device according to claim 1, characterized in that: A tray supply channel is provided for supplying empty trays to the electronic component recycling area. The tray conveying mechanism conveys the empty tray supplied from the tray supply passage to the electronic component collection area.

4. The electronic component inspection device according to claim 1, characterized in that: The tray collection passages are provided in the same number as the storage trays arranged in the electronic component collection area.

5. The electronic component inspection device according to claim 1, characterized in that: A tray recovery mechanism is provided for recovering the storage tray. The pallet recovery mechanism comprises: A guide rail is arranged along the pallet recovery path; a loading platform, located above the tray recovery channel, receiving the storage tray from the tray conveying mechanism; and The supporting member moves along the guide rail and supports the mounting table.

6. The electronic component inspection device according to claim 5, characterized in that: The mounting table can mount a plurality of the storage trays.

7. The electronic component inspection device according to claim 1, characterized in that: An existing tray collection passage for collecting trays storing the electronic components is provided on the front side of the electronic component inspection device relative to the electronic component collection area. The tray recovery channel is arranged in parallel with the existing tray recovery channel.

8. A tray recovery device, installed in an electronic component inspection device for inspecting electronic components, recovering a storage tray containing inspected electronic components from an electronic component recovery area provided on the back side of the electronic component inspection device, characterized in that: The pallet recovery device comprises: a tray recovery passage for conveying the storage tray toward the front side of the electronic component inspection device; and The tray conveying mechanism holds the storage tray disposed in the electronic component collection area and conveys the storage tray to the tray collection passage.

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