A TFT display driver IC chip detection device

Abstract

The present invention belongs to the technical field of chip detection, and specifically relates to a detection device for a TFT display driving IC chip, including a device main body and a chip main body; an upper frame is fixedly installed on the top of the device main body, an XYZ motion platform is fixedly arranged on the top of the upper frame, a dispensing machine is arranged on the XYZ motion platform, and a glue guiding tube for discharging glue is threadedly connected to the bottom of the dispensing machine. The transportation mechanism includes two groups and is respectively used for transporting chips on the front and back surfaces. Specifically, the transportation mechanism includes a carrier table fixedly installed on the top of the device main body, an installation frame is fixedly arranged on the top of the carrier table, and a positioning block group is arranged on the installation frame. The present invention integrates multiple functions such as thermal conductivity detection, humidity sensitivity detection, and chemical compatibility detection, can comprehensively and accurately evaluate the performance of the chip, provides a scientific basis for optimizing the chip manufacturing process, and is more convenient to use.

Description

Technical Field

[0001] The invention belongs to the technical field of chip detection, in particular to a TFT display screen driver IC chip detection device. Background Art

[0002] With the rapid development of display technology, TFT (thin film transistor) displays are widely used in electronic devices such as smartphones, tablets, and TVs. As the core component of TFT displays, the performance of driver IC chips directly determines the display effect and reliability of the display. However, during the chip manufacturing process, material properties, process parameters, and environmental factors (such as temperature, humidity, and chemical environment) will have a significant impact on the performance of the chip. Therefore, how to effectively detect the key characteristics of the chip and optimize the manufacturing process has become a key issue in improving chip performance and reliability.

[0003] At present, traditional chip detection technology mainly focuses on electrical performance testing and functional verification, lacks systematic detection of chip material properties such as thermal conductivity, moisture sensitivity and chemical compatibility, and is not convenient to use. Therefore, a TFT display driver IC chip detection device is proposed to address the above problems. Summary of the invention

[0004] The purpose of the present invention is to solve the above technical problems by providing a TFT display screen driver IC chip detection device in view of the shortcomings of the prior art.

[0005] In view of the above technical problems, the following technical solutions are adopted: a TFT display screen driver IC chip detection device, comprising a device body and a chip body; an upper frame is fixedly installed on the top of the device body, an XYZ motion platform is fixedly arranged on the top of the upper frame, a glue dispenser is arranged on the XYZ motion platform, a glue guide tube for discharging glue is threadedly connected to the bottom of the glue dispenser, and a glue punch is slidably arranged on the inner side of the glue guide tube;

[0006] A transport mechanism, the transport mechanism includes two groups, and is used to transport the chips on the front and back sides respectively. Specifically, the transport mechanism includes a stage fixedly installed on the top of the equipment body, a mounting frame is fixedly arranged on the top of the stage, a positioning block is arranged on the mounting frame, a plurality of retention grooves are evenly provided on the positioning block, a rotating shaft 1 is rotatably provided on the plurality of retention grooves, a driven gear is fixedly provided on the rotating shaft 1, a conveyor belt is meshed on the driven gear, meshing teeth are evenly provided on the inner side of the conveyor belt, and the meshing teeth are meshed with the driven gear, a loading mechanism is evenly arranged on the conveyor belt, a ratchet mechanism is arranged at the connection of the two rotating shafts 1, and a receiving gear is fixedly installed on the rotating shaft 1 at the end;

[0007] Turning mechanism, the turning mechanism is located between the two transport mechanisms. Specifically, the turning mechanism includes a turning base fixedly installed on the top of the loading platform. A plurality of turning blocks corresponding to the conveyor belts are arranged on the top of the turning base. A receiving bar is fixedly connected to the top of the turning block. A U-shaped mounting frame is fixedly installed on the top of the receiving bar. A material suction component is arranged on the U-shaped mounting frame;

[0008] Detection mechanism, the detection mechanism is located outside the loading platform. Specifically, the detection mechanism includes an electric telescopic rod arranged on the equipment main body. A connecting seat is fixedly installed on the top of the electric telescopic rod. A rotating seat is rotatably arranged on the connecting seat. A loading edge is fixedly installed inside the rotating seat. A camera component, an electrical detection component and a temperature detection component are sequentially arranged on the loading edge;

[0009] The electrical detection component includes an electrical detection block arranged on the loading edge. A displacement block is slidably arranged on the top of the electrical detection block. A conductive probe is arranged on the top of the displacement block;

[0010] The loading mechanism includes an upper positioning clip and a lower positioning clip arranged outside the chip main body. The upper positioning clip is connected to the lower positioning clip. Conductive elastic sheets are arranged on the inner sides of the upper positioning clip and the lower positioning clip. Conductive bowls are arranged on a plurality of the conductive elastic sheets.

[0011] Preferably, a mounting frame is fixedly installed on the top of the loading platform. A limit bolt is threadedly installed on the mounting frame. A fixing nut is threadedly installed on the limit bolt;

[0012] Connecting arms are symmetrically arranged on the positioning block. The limit bolt is connected to the connecting arm.

[0013] Preferably, the material suction component includes a turning block rotatably arranged inside the U-shaped mounting frame. A driving motor is fixedly arranged outside the U-shaped mounting frame. The output end of the driving motor is connected to the turning block. A suction nozzle is fixedly installed on the turning block. A suction unit is also arranged on the turning block.

[0014] Preferably, the suction unit includes a communication port fixedly arranged on the turning block. A flow pipe is fixedly connected to the communication port. A solenoid valve is fixedly arranged on the flow pipe. A converging pipe is fixedly connected to the solenoid valve. A vacuum pump is fixedly arranged outside the turning base. The vacuum pump is communicated with the converging pipe. The converging pipe, the flow pipe and the suction nozzle are communicated with each other.

[0015] Preferably, a flip groove is provided on the top of the flip base, a rotating shaft 2 is rotatably arranged inside the flip groove, a motor 3 is fixedly installed on the outer side of the flip base, an output end of the motor 3 is fixedly connected to the rotating shaft 2, and the flip block is fixedly arranged on the rotating shaft 2.

[0016] Preferably, the transport mechanism further comprises a second motor and a transmission gear fixedly arranged outside the positioning block, the output end of the second motor is connected to the transmission gear, a transmission chain is meshed on the transmission gear, and the transmission chain is meshed with the receiving gear.

[0017] Preferably, the camera assembly includes a high-definition camera fixedly arranged on the object-carrying edge, the temperature detection assembly includes a temperature sensor fixedly arranged on the object-carrying edge, a motor 1 is fixedly installed on the connecting seat, and an output end of the motor 1 is connected to the rotating seat;

[0018] An electric guide rail 1 is fixedly arranged on the top of the equipment body and outside the loading platform, a sliding block is slidably arranged on the electric guide rail 1, and the electric telescopic rod is fixedly arranged on the top of the sliding block.

[0019] Preferably, the conductive bowl is connected to the conductive probe, pins are evenly arranged on the chip body, and the pins are clamped and arranged on the inner side of the conductive bowl.

[0020] Preferably, a control panel is fixedly provided on the outer side of the upper frame, and the camera assembly, the electrical detection assembly and the temperature detection assembly are all electrically connected to the control panel.

[0021] Beneficial effects of the present invention:

[0022] (1) The present invention integrates multiple functions such as thermal conductivity detection, humidity sensitivity detection and chemical compatibility detection, which can comprehensively and accurately evaluate the performance of the chip, provide a scientific basis for optimizing the chip manufacturing process, and is more convenient to use.

[0023] (2) Through the implementation of the present invention, not only can the quality and reliability of the driver IC chip be effectively improved, but also the production cost can be reduced and the product competitiveness can be enhanced, which is of great significance for promoting the further development of TFT display technology.

[0024] (3) The present invention can realize automation and intelligence of chip detection.

[0025] (4) Through a variety of detection modes, defects and errors in the manufacturing process can be discovered in a timely manner, reducing the production of defective products, thereby improving the yield rate of the chip body. The detection data provides a basis for process improvement, helps optimize the manufacturing process, and improves production efficiency and product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0027] In the drawings:

[0028] Figure 1 is a schematic diagram of the overall structure of the present invention;

[0029] Figure 2 is a top view of the internal structure of the present invention;

[0030] Figure 3 is a bottom view of the internal structure of the present invention;

[0031] Figure 4 is a schematic diagram of the structure of the stage in the present invention;

[0032] Figure 5 is a schematic diagram of the structure of the mounting bracket in the present invention;

[0033] Figure 6 is a schematic diagram of the structure of the rotating base in the present invention;

[0034] Figure 7 is a schematic diagram of the structure of the flipping base in the present invention;

[0035] Figure 8 is a schematic diagram of the structure of the electrical detection block in the present invention;

[0036] Figure 9 is a schematic diagram of the structure of the flipping block in the present invention;

[0037] Figure 10 is a schematic diagram of the structure of the XYZ motion platform in the present invention;

[0038] Figure 11 is a schematic diagram of the structure of the dispensing machine in the present invention;

[0039] Figure 12 is a schematic diagram of the structure of the second motor in the present invention;

[0040] Figure 13 is a schematic diagram of the structure of the transmission gear in the present invention;

[0041] Figure 14 is a schematic diagram of the structure of the receiving gear in the present invention;

[0042] Figure 15 is a schematic diagram of the structure of the driven gear in the present invention;

[0043] Figure 16 It is a structural schematic diagram of the conveyor belt in the present invention;

[0044] Figure 17 It is a structural schematic diagram of the upper positioning clip in the present invention;

[0045] Figure 18 It is a schematic diagram of the structure of the conductive spring in the present invention.

[0046] Legend:

[0047] 100, equipment body; 101, upper frame; 102, control panel; 103, loading platform; 104, mounting frame; 105, limit bolt; 106, fixing nut; 200, electric guide rail 1; 201, sliding block; 202, electric telescopic rod; 203, connecting seat; 204, rotating seat; 205, motor 1; 206, loading edge; 207, temperature sensor; 208, high-definition camera; 209, electrical detection block; 2091, displacement block; 2092, conductive probe; 300, positioning block; 301, connecting arm; 302, motor 2; 303, transmission chain; 304, transmission gear; 305, retention groove; 306, rotating shaft 1; 3061, driven gear; 3062, ratchet mechanism; 3063, transmission gear; 3064, transmission gear; 3065, retention groove; 3066, rotation shaft 1; 3067, driven gear; 3068, ratchet mechanism; 3069, transmission gear; 310, transmission gear; 311, transmission gear; 312, transmission gear; 313, transmission gear; 314, transmission gear; 315, transmission gear; 316, transmission gear; 317, transmission gear; 318, transmission gear; 319, transmission gear; 320, transmission gear; 321, transmission gear; 322, transmission gear; 323, transmission gear; 324, transmission gear; 325, transmission gear; 326, transmission gear; 327, transmission gear; 328, transmission gear; 329, transmission gear; 330, transmission gear; 331, transmission gear; 332, transmission gear; 333, transmission gear; 334, transmission gear 063, receiving gear; 307, conveyor belt; 3071, meshing teeth; 400, chip body; 4001, pin; 401, upper positioning clip; 402, lower positioning clip; 403, conductive spring; 404, conductive bowl; 500, flip base; 501, flip notch; 502, rotating shaft two; 5021, flip block; 5022, receiving bar; 5023, U-shaped mounting bracket; 5024, driving motor; 503, motor three; 504, flipping block; 5041, suction nozzle; 5042, connecting port; 5043, circulation pipe; 5044, solenoid valve; 5045, confluence pipe; 5046, vacuum pump; 600, XYZ motion platform; 601, glue dispensing machine; 6011, glue guide tube; 6012, glue punching head. DETAILED DESCRIPTION

[0048] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0049] Specific examples are given below.

[0050] Example

[0051] See also Figures 1-18, the present invention provides a detection device for a TFT display driving IC chip, including a device main body 100 and a chip main body 400; a top frame 101 is fixedly installed on the top of the device main body 100, an XYZ motion platform 600 is fixedly arranged on the top of the top frame 101, a dispensing machine 601 is arranged on the XYZ motion platform 600, a glue guiding tube 6011 for discharging glue is threadedly connected to the bottom of the dispensing machine 601, and a glue flushing head 6012 is slidably arranged inside the glue guiding tube 6011;

[0052] A transport mechanism, there are two sets of transport mechanisms, and they are respectively used for transporting chips on the front and back sides. Specifically, the transport mechanism includes a carrier table 103 fixedly installed on the top of the device main body 100, an installation frame 104 is fixedly arranged on the top of the carrier table 103, a positioning block group 300 is arranged on the installation frame 104, a plurality of retaining grooves 305 are evenly opened on the positioning block group 300, a first rotating shaft 306 is rotatably arranged on each of the plurality of retaining grooves 305, a driven gear 3061 is fixedly arranged on the first rotating shaft 306, a conveyor belt 307 is meshed with the driven gear 3061, a plurality of meshing teeth 3071 are evenly opened inside the conveyor belt 307, the meshing teeth 3071 are meshed with the driven gear 3061, a loading mechanism is evenly arranged on the conveyor belt 307, a ratchet mechanism 3062 is arranged at the connection of the two first rotating shafts 306, and a receiving gear 3063 is fixedly installed on the first rotating shaft 306 at the end;

[0053] A flipping mechanism, the flipping mechanism is located between the two transport mechanisms. Specifically, the flipping mechanism includes a flipping base 500 fixedly installed on the top of the carrier table 103, a plurality of flipping blocks 5021 corresponding to the conveyor belt 307 are arranged on the top of the flipping base 500, a receiving strip 5022 is fixedly connected to the top of the flipping block 5021, and a U-shaped mounting frame 5023 is fixedly installed on the top of the receiving strip 5022, and a material suction component is arranged on the U-shaped mounting frame 5023;

[0054] A detection mechanism, the detection mechanism is located outside the carrier table 103. Specifically, the detection mechanism includes an electric telescopic rod 202 arranged on the device main body 100, a connection seat 203 is fixedly installed on the top of the electric telescopic rod 202, a rotating seat 204 is rotatably arranged on the connection seat 203, a load-bearing edge 206 is fixedly installed inside the rotating seat 204, and a camera component, an electrical detection component, and a temperature detection component are sequentially arranged on the load-bearing edge 206;

[0055] The electrical detection component includes an electrical detection block 209 arranged on the load-bearing edge 206, a displacement block 2091 is slidably arranged on the top of the electrical detection block 209, and a conductive probe 2092 is arranged on the top of the displacement block 2091;

[0056] The loading mechanism includes an upper positioning clip 401 and a lower positioning clip 402 arranged outside the chip body 400. The upper positioning clip 401 is connected to the lower positioning clip 402, and conductive elastic sheets 403 are arranged on the inner sides of both the upper positioning clip 401 and the lower positioning clip 402. Conductive bowls 404 are arranged on multiple conductive elastic sheets 403;

[0057] It should be noted that the device main body 100 is the entire carrier of this device and is used for the detection process during chip processing. Its internal includes a common power supply system and wires, which are all mature existing technologies and will not be elaborated in this article. The chip body 400 is the main body to be detected by this device. Specifically, it is a TFT display driver IC chip. The working space of this device is formed by the upper frame 101 fixedly installed on the top of the device main body 100 and the device main body 100. The specific detection of the chip body 400 is carried out on the inner sides of both. The XYZ motion platform 600 fixedly arranged on the top of the upper frame 101 is a mature existing technology and will not be elaborated in this article. In this invention, it is mainly used to drive the dispensing machine 601 to perform dispensing treatment on the surface of the chip body 400. The dispensing machine 601 arranged on the XYZ motion platform 600 is used for the dispensing work of this device. The glue guiding tube 6011 for discharging glue, which is threadedly connected to the bottom of the dispensing machine 601, discharges glue during the dispensing process. At the same time, a flushing head 6012 slidably arranged inside the glue guiding tube 6011 scrapes the previous detection glue inside it during the dispensing process to prevent different glues from mixing and affecting the detection effect of the chip body 400;

[0058] It should be noted that the transportation mechanism is used to achieve dynamic detection during the detection of the chip body 400, which is beneficial to improving the detection efficiency of the chip body 400. In addition, since the transportation mechanism includes two groups and is respectively used to convey chips on both the front and back sides, the detection of the chip body 400 can be made more comprehensive, and the front and back sides of the chip body 400 can be detected. Specifically, the carrier table 103 fixedly installed on the top of the equipment body 100 is used to carry the mounting frame 104, the mounting frame 104 fixedly arranged on the top of the carrier table 103 is used to load and support the positioning block 300, the positioning block 300 arranged on the mounting frame 104 is used to open the retention groove 305, and can carry the first rotating shaft 306. During operation, the first rotating shaft 306 rotates inside the retention groove 305. The opening of the retention groove 305 is also beneficial to ensuring the working space of the driven gear 3061 and enabling it to rotate normally. The first rotating shafts 306 rotatably arranged on multiple retention grooves 305 are used to carry the driven gears 3061. Through the meshing of the driven gears 3061 with the conveyor belt 307, the first rotating shaft 306 drives the conveyor belt 307 to rotate during rotation, and the conveyor belt 307 can simultaneously drive the loading mechanism to move. The chip body 400 is embedded inside the loading mechanism to achieve dynamic dispensing of the chip body 400;

[0059] The driven gear 3061 fixedly arranged on the first rotating shaft 306 is used to drive the conveyor belt 307 to rotate. The conveyor belt 307 engaged with the driven gear 3061 is used to load the chip body 400 and the loading mechanism. During the detection of the chip body 400, the chip body 400 and the loading mechanism can be flipped together through the flipping mechanism. The loading mechanism uniformly arranged on the conveyor belt 307 is used to limit the chip body 400, which is beneficial to the subsequent dispensing detection work and electrical detection links of the chip body 400. The ratchet mechanism 3062 arranged at the connection of the two first rotating shafts 306 can make all the first rotating shafts 306 and the driven gears 3061 rotate clockwise when the first rotating shaft 306 rotates clockwise. If one of the conveyor belts 307 in this device fails, one conveyor belt 307 can be stopped separately for maintenance. The specific implementation principle is that a ratchet mechanism 3062 with the same rotatable direction is arranged between every two first rotating shafts 306. When one of the conveyor belts 307 does not work, the corresponding driven gear 3061 needs to be stopped. At this time, press the conveyor belt 307. The ratchet mechanism 3062 is similar to a ratchet and cannot rotate clockwise, but can rotate counterclockwise. This is a unidirectional motion mechanism. And when the positions of the chip body 400 and the loading mechanism shift on the conveyor belt 307, the dispensing detection position of the chip becomes more adaptable. The receiving gear 3063 is fixedly installed on the end first rotating shaft 306;

[0060] It should be noted that the flipping mechanism realizes the flipping of the chip body 400 and the loading mechanism, making the detection of the chip body 400 more comprehensive. The flipping mechanism is located between the two transportation mechanisms. Specifically, the flipping mechanism includes a flipping base 500 fixedly installed on the top of the load platform 103 for loading the flipping block 5021. The flipping block 5021 has a rotatable relative relationship with the flipping base 500 without driving force. A plurality of flipping blocks 5021 corresponding to the conveyor belt 307 arranged on the top of the flipping base 500 are used to rotate together when the second rotating shaft 502 rotates and are used to load the receiving strip 5022. The receiving strip 5022 fixedly connected to the top of the flipping block 5021 is used to load the U-shaped mounting frame 5023 and can make the U-shaped mounting frame 5023 rotate together with the receiving strip 5022. The U-shaped mounting frame 5023 fixedly installed on the top of the receiving strip 5022 is used to load the suction component and drive the suction component to rotate. At the same time, the suction component can rotate by itself within the U-shaped mounting frame 5023, thus realizing the overall flipping work of the chip body 400 and the loading mechanism;

[0061] It should be noted that the testing mechanism conducts comprehensive testing on the chip body 400 of this device. However, the testing mechanism does not perform the testing of the chip body 400 independently. Instead, it cooperates with the dispensing machine 601 to conduct testing during the dispensing process on the chip body 400. Specifically, this device can implement at least three modes of testing for the chip body 400:

[0062] The first mode is the thermal conductivity testing of the chip body 400. In this mode, first inject silicone inside the dispensing machine 601, start the dispensing machine 601, and the dispensing machine 601 dots the silicone on the chip body 400 through the glue guiding tube 6011. At the same time, start the testing mechanism and make the testing mechanism rotate so that the temperature detection component on the testing mechanism corresponds to the chip body 400, record its temperature, and transmit the data to the control panel 102 to evaluate the heat dissipation ability of the chip body 400.

[0063] The second mode is the chemical compatibility testing of the chip body 400. In this mode, first inject acidic glue inside the dispensing machine 601. Common acidic glues include acrylic glue, polyurethane glue, or cyanoacrylate glue. Start the dispensing machine 601, and the dispensing machine 601 dots the acidic glue on the chip body 400 through the glue guiding tube 6011. At the same time, start the testing mechanism and make the testing mechanism rotate so that the camera component on the testing mechanism corresponds to the chip body 400, capture the outer image, and transmit the image to the control panel 102 to evaluate the corrosion degree of the chip body 400. In this mode, only sampling testing is carried out.

[0064] The third mode is the moisture sensitivity testing of the chip body 400. In this mode, first inject polyurethane glue inside the dispensing machine 601. Polyurethane glue has a strong ability to absorb moisture and humidity. When it comes into contact with the chip body 400, it can cause moisture to quickly condense on the pins 4001 and the main body part of the chip body 400. Start the dispensing machine 601, and the dispensing machine 601 dots the polyurethane glue on the chip body 400 and the pins 4001 through the glue guiding tube 6011. At the same time, moisture gathers around the main body and pins 4001 of the chip body 400. In this state, through the testing mechanism, make the testing mechanism rotate so that the electrical testing component on the testing mechanism rotates to a position corresponding to the chip body 400, and start the electric telescopic rod 202 to make the conductive probe 2092 on the electrical testing component conduct electricity with the pins 4001, thereby testing the resistance of the pins 4001, and transmit the testing data to the control panel 102 for evaluation. In this mode, only sampling testing is carried out.

[0065] Through multiple detection modes, defects and errors in the manufacturing process can be detected in a timely manner, reducing the generation of defective products, thereby improving the yield rate of the chip body 400. The detection data provides a basis for process improvement, helps optimize the manufacturing process, and improves production efficiency and product quality. In addition, through detection and analysis, the design of the chip body 400 can be optimized to improve key performance indicators such as its computing speed, energy efficiency ratio, and stability;

[0066] Specifically, the detection mechanism includes an electric telescopic rod 202 provided on the equipment body 100 for controlling the lifting of the rotating seat 204 and the load-bearing edge 206, facilitating subsequent detection work. A connecting seat 203 fixedly installed at the top of the electric telescopic rod 202 is used to connect the electric telescopic rod 202 and the rotating seat 204. The rotating seat 204 rotatably provided on the connecting seat 203 is used to load the load-bearing edge 206. The load-bearing edge 206 fixedly installed inside the rotating seat 204 is used to load the camera assembly, the electrical detection assembly, and the temperature detection assembly, and can drive the camera assembly, the electrical detection assembly, and the temperature detection assembly to rotate to correspond to the position of the chip body 400;

[0067] Furthermore, the electrical detection assembly includes an electrical detection block 209 provided on the load-bearing edge 206 for loading the displacement block 2091, and the displacement block 2091 can adjust the spacing in the electrical detection block 209, so as to be able to adapt to the position of the pins 4001 on the chip body 400, facilitating the detection of the chip body 400. The displacement block 2091 slidably provided on the top of the electrical detection block 209 is used to load the conductive probe 2092. The conductive probe 2092 provided on the top of the displacement block 2091 is used to contact the pins 4001, thereby realizing the detection of the chip body 400;

[0068] Furthermore, the loading mechanism includes an upper positioning clip 401 and a lower positioning clip 402 provided outside the chip body 400 for fixing the chip body 400. The structures and sizes of the upper positioning clip 401 and the lower positioning clip 402 are the same. After being reversed together with the chip body 400, they are placed on the conveyor belt 307 after the chip body 400 is flipped. Conductive elastic sheets 403 are provided on the inner sides of both the upper positioning clip 401 and the lower positioning clip 402, which are elastic and made of conductive metal. Conductive bowls 404 are provided on multiple conductive elastic sheets 403 and are placed on the conductive elastic sheets 403, having the same material and performance as the conductive elastic sheets 403. In addition, the conductive bowls 404 are cylindrical, which can facilitate the insertion of the conductive probes 2092, facilitating the detection of the chip body 400.

[0069] Furthermore, as Figure 4 and Figure 5As shown in the figure, an installation frame 104 is fixedly installed on the top of the carrier table 103. A limit bolt 105 is threadedly installed on the installation frame 104, and a fixing nut 106 is threadedly installed on the limit bolt 105;

[0070] Connecting arms 301 are symmetrically arranged on the positioning block 300, and the limit bolt 105 is connected to the connecting arm 301;

[0071] It should be noted that during operation, the installation frame 104 fixedly installed on the top of the carrier table 103 is used to transfer and support the positioning block 300, which is more conducive to the rotation of the chip body 400 driven by the conveyor belt 307. The limit bolt 105 threadedly installed on the installation frame 104 is used for the stable connection between the installation frame 104 and the positioning block 300, so that the positioning block 300 is suspended. The fixing nut 106 threadedly installed on the limit bolt 105 is used for locking after the limit bolt 105 is connected to the positioning block 300, ensuring the stability of the device during use. The connecting arms 301 symmetrically arranged on the positioning block 300 are used for the connection between the positioning block 300 and the installation frame 104.

[0072] Furthermore, as Figure 7 and Figure 9 shown, the suction component includes a turning block 504 rotatably arranged inside the U-shaped installation frame 5023. A driving motor 5024 is fixedly arranged outside the U-shaped installation frame 5023. The output end of the driving motor 5024 is connected to the turning block 504. A suction nozzle 5041 is fixedly installed on the turning block 504, and a suction unit is also arranged on the turning block 504;

[0073] It should be noted that during operation, the turning block 504 rotatably arranged inside the U-shaped installation frame 5023 is used to load the suction nozzle 5041, and it has a cavity inside to facilitate the transmission of vacuum, so as to ensure the suction and discharge of the suction nozzle 5041. The suction nozzle 5041 fixedly installed on the turning block 504 is used to suck the chip body 400. The suction unit also arranged on the turning block 504 is used for the transmission of vacuum, so as to facilitate the displacement and turning of the chip body 400.

[0074] Furthermore, as Figure 7 and Figure 9 shown, the suction unit includes a communication port 5042 fixedly arranged on the turning block 504. A flow pipe 5043 is fixedly connected to the communication port 5042. An electromagnetic valve 5044 is fixedly arranged on the flow pipe 5043. A converging pipe 5045 is fixedly connected to the electromagnetic valve 5044. A vacuum pump 5046 is fixedly arranged outside the turning base 500. The vacuum pump 5046 is communicated with the converging pipe 5045. The converging pipe 5045, the flow pipe 5043 and the suction nozzle 5041 are communicated with each other;

[0075] It should be noted that, during operation, the connecting port 5042 fixedly arranged on the turning block 504 is used to connect the turning block 504 and the circulation tube 5043 to ensure vacuum transportation inside the two, the circulation tube 5043 fixedly connected on the connecting port 5042 is used to transport vacuum, and the solenoid valve 5044 fixedly arranged on the circulation tube 5043 is used to open and close the vacuum transportation inside the circulation tube 5043. When the vacuum transportation stops, the suction nozzle 5041 realizes the discharge action after the chip body 400 is flipped, and the confluence tube 5045 fixedly connected on the solenoid valve 5044 is used to transport vacuum, and the vacuum pump 5046 fixedly arranged on the outside of the turning base 500 is used to transport the vacuum inside the confluence tube 5045.

[0076] Further, such as Figure 5 and Figure 7 As shown, a flip notch 501 is provided on the top of the flip base 500, a second rotating shaft 502 is rotatably provided inside the flip notch 501, a third motor 503 is fixedly installed on the outer side of the flip base 500, an output end of the third motor 503 is fixedly connected to the second rotating shaft 502, and a flip block 5021 is fixedly provided on the second rotating shaft 502;

[0077] It should be noted that, during operation, the rotating shaft 2 502 arranged to rotate on the inner side of the flip slot 501 is used to load the flip block 5021, and the flip block 5021 rotates therewith to realize the flipping of the chip body 400, and the motor 3 503 fixedly installed on the outer side of the flip base 500 is used to drive the rotation of the rotating shaft 2 502, the output end of the motor 3 503 is fixedly connected to the rotating shaft 2 502, and the flip block 5021 is fixedly set on the rotating shaft 2 502.

[0078] Further, such as Figures 12-16 As shown, the transport mechanism also includes a second motor 302 and a transmission gear 304 fixedly arranged outside the positioning block 300, the output end of the second motor 302 is connected to the transmission gear 304, the transmission gear 304 is meshed with a transmission chain 303, and the transmission chain 303 is meshed with a receiving gear 3063;

[0079] It should be noted that during operation, the second motor 302 fixedly arranged outside the positioning block 300 is used to drive the rotation of the transmission gear 304. The transmission gear 304 is used to connect the second motor 302 and the conveyor chain 303. When the second motor 302 is started, the second motor 302 can drive the transmission gear 304 to rotate, the transmission gear 304 drives the conveyor chain 303 to rotate, the conveyor chain 303 drives the receiving gear 3063 to rotate, the receiving gear 3063 drives the first rotating shaft 306 to rotate, the first rotating shaft 306 drives the driven gear 3061 to rotate, and the driven gear 3061 drives the conveyor belt 307 to rotate, thereby realizing the transportation of the chip body 400 on the conveyor belt 307. The conveyor chain 303 engaged with the transmission gear 304 is used to connect the transmission gear 304 and the receiving gear 3063.

[0080] Further, as Figure 5 and Figure 6 shown, the imaging component includes the high-definition camera 208 fixedly arranged on the load-bearing edge 206, the temperature detection component includes the temperature sensor 207 fixedly arranged on the load-bearing edge 206, the first motor 205 is fixedly installed on the connecting seat 203, and the output end of the first motor 205 is connected to the rotating seat 204;

[0081] On the top of the equipment main body 100 and outside the loading platform 103, the first electric guide rail 200 is fixedly arranged. A sliding block 201 is slidably arranged on the first electric guide rail 200, and the electric telescopic rod 202 is fixedly arranged on the top of the sliding block 201;

[0082] It should be noted that during operation, the high-definition camera 208 fixedly arranged on the load-bearing edge 206 is used to capture the image of the chip body 400 after dispensing and transmit it to the control panel 102 for detection and evaluation. The temperature sensor 207 fixedly arranged on the load-bearing edge 206 is used to detect the temperature of the chip body 400 after dispensing and transmit the detected data to the control panel 102 for evaluation, so as to judge the chip performance. The first motor 205 fixedly installed on the connecting seat 203 is used to drive the rotating seat 204 to rotate;

[0083] The first electric guide rail 200 fixedly arranged on the top of the equipment main body 100 and outside the loading platform 103 is used to drive the sliding block 201 to perform horizontal displacement. The sliding block 201 slidably arranged on the first electric guide rail 200 is used to connect the electric telescopic rod 202 and can drive the electric telescopic rod 202 to rotate together.

[0084] Further, as Figure 8 and Figure 18As shown, the conductive bowl 404 is connected to the conductive probe 2092. The chip body 400 is uniformly provided with pins 4001, and the pins 4001 are clamped inside the conductive bowl 404.

[0085] It should be noted that during operation, the conductive bowl 404 is connected to the conductive probe 2092. The pins 4001, which are part of the chip body 400 and are uniformly arranged on the chip body 400, are clamped inside the conductive bowl 404, thereby realizing the electrical connection between the pins 4001 and the conductive bowl 404.

[0086] Furthermore, as Figure 1 and Figure 6 shown, a control panel 102 is fixedly arranged on the outer side of the upper frame 101. The camera assembly, the electrical detection assembly, and the temperature detection assembly are all electrically connected to the control panel 102.

[0087] It should be noted that during operation, the control panel 102 fixedly arranged on the outer side of the upper frame 101 is used for data collection and evaluation of the detection mechanism, to judge the performance of the chip body 400, and can also optimize the production process of the chip body 400 according to the detected data.

[0088] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by terms such as "front and back", "left and right", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention.

[0089] Of course, in this technical solution, those skilled in the art should understand that the term "one" should be understood as "at least one" or "one or more". That is, in one embodiment, the number of an element can be one, while in other embodiments, the number of this element can be multiple. The term "one" should not be construed as a limitation on the quantity.

[0090] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by those skilled in the art under the technical disclosure of the present invention should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Claims

1. A TFT display screen driver IC chip detection device, comprising a device body (100) and a chip body (400); characterized in that: An upper frame (101) is fixedly mounted on the top of the device body (100), an XYZ motion platform (600) is fixedly arranged on the top of the upper frame (101), a glue dispenser (601) is arranged on the XYZ motion platform (600), a glue guide tube (6011) for discharging glue is threadedly connected to the bottom of the glue dispenser (601), and a glue punch (6012) is slidably arranged on the inner side of the glue guide tube (6011); A transport mechanism, the transport mechanism comprises two groups, and is used to transport the chips on the front and back sides respectively. Specifically, the transport mechanism comprises a loading platform (103) fixedly mounted on the top of the device body (100), a mounting frame (104) fixedly arranged on the top of the loading platform (103), a positioning block (300) arranged on the mounting frame (104), a plurality of retention grooves (305) evenly arranged on the positioning block (300), a plurality of retention grooves (305) are rotatably arranged on each of the plurality of retention grooves (305), and a rotation axis (306) is rotatably arranged on the rotation axis (306). A driven gear (3061) is fixedly arranged on the rotating shaft (306), a conveyor belt (307) is meshed on the driven gear (3061), meshing teeth (3071) are evenly arranged on the inner side of the conveyor belt (307), the meshing teeth (3071) mesh with the driven gear (3061), a loading mechanism is evenly arranged on the conveyor belt (307), a ratchet mechanism (3062) is arranged at the connection between the two rotating shafts (306), and a receiving gear (3063) is fixedly installed on the rotating shaft (306) at the end; A turning mechanism, the turning mechanism being located between the two transport mechanisms, specifically, the turning mechanism comprising a turning base (500) fixedly mounted on the top of the loading platform (103), a plurality of turning blocks (5021) corresponding to the conveyor belt (307) being arranged on the top of the turning base (500), a receiving bar (5022) being fixedly connected to the top of the turning block (5021), a U-shaped mounting frame (5023) being fixedly mounted on the top of the receiving bar (5022), and a material suction assembly being arranged on the U-shaped mounting frame (5023); A detection mechanism, the detection mechanism is located outside the object carrier (103), specifically, the detection mechanism comprises an electric telescopic rod (202) arranged on the device body (100), a connecting seat (203) is fixedly installed on the top of the electric telescopic rod (202), a rotating seat (204) is rotatably arranged on the connecting seat (203), a loading edge (206) is fixedly installed on the inner side of the rotating seat (204), and a camera component, an electrical detection component and a temperature detection component are sequentially arranged on the loading edge (206); The electrical detection component comprises an electrical detection block (209) arranged on the object-carrying edge (206), a displacement block (2091) being slidably arranged on the top of the electrical detection block (209), and a conductive probe (2092) being arranged on the top of the displacement block (2091); The loading mechanism comprises an upper positioning clip (401) and a lower positioning clip (402) arranged on the outside of the chip body (400), the upper positioning clip (401) is connected to the lower positioning clip (402), and conductive spring sheets (403) are arranged on the inner sides of the upper positioning clip (401) and the lower positioning clip (402), and a conductive bowl (404) is arranged on a plurality of the conductive spring sheets (403).

2. A TFT display screen driver IC chip detection device according to claim 1, characterized in that: A mounting frame (104) is fixedly mounted on the top of the loading platform (103); a limit bolt (105) is threadedly mounted on the mounting frame (104); and a fixing nut (106) is threadedly mounted on the limit bolt (105); The positioning assembly block (300) is symmetrically provided with connecting arms (301), and the limiting bolts (105) are connected to the connecting arms (301).

3. A TFT display screen driver IC chip detection device according to claim 1, characterized in that: The material suction assembly comprises a material turning block (504) rotatably arranged on the inner side of a U-shaped mounting frame (5023); a driving motor (5024) is fixedly arranged on the outer side of the U-shaped mounting frame (5023); an output end of the driving motor (5024) is connected to the material turning block (504); a suction nozzle (5041) is fixedly installed on the material turning block (504); and a suction unit is also arranged on the material turning block (504).

4. A TFT display screen driver IC chip detection device according to claim 3, characterized in that: The suction unit comprises a connecting port (5042) fixedly arranged on the turning block (504), a circulation pipe (5043) fixedly connected to the connecting port (5042), a solenoid valve (5044) fixedly arranged on the circulation pipe (5043), a confluence pipe (5045) fixedly connected to the solenoid valve (5044), a vacuum pump (5046) fixedly arranged on the outer side of the turning base (500), the vacuum pump (5046) being connected to the confluence pipe (5045), and the confluence pipe (5045) and the circulation pipe (5043) being connected to the suction nozzle (5041).

5. A TFT display screen driver IC chip detection device according to claim 1, characterized in that: A flip notch (501) is provided on the top of the flip base (500), a second rotating shaft (502) is rotatably arranged inside the flip notch (501), a third motor (503) is fixedly installed on the outside of the flip base (500), an output end of the third motor (503) is fixedly connected to the second rotating shaft (502), and the flip block (5021) is fixedly arranged on the second rotating shaft (502).

6. A TFT display screen driver IC chip detection device according to claim 1, characterized in that: The transport mechanism further comprises a second motor (302) and a transmission gear (304) fixedly arranged outside the positioning block (300); the output end of the second motor (302) is connected to the transmission gear (304); a transmission chain (303) is meshed on the transmission gear (304); and the transmission chain (303) is meshed with the receiving gear (3063).

7. A TFT display screen driver IC chip detection device according to claim 1, characterized in that: The camera assembly comprises a high-definition camera (208) fixedly mounted on the object-carrying edge (206); the temperature detection assembly comprises a temperature sensor (207) fixedly mounted on the object-carrying edge (206); a motor 1 (205) is fixedly mounted on the connecting seat (203); and an output end of the motor 1 (205) is connected to the rotating seat (204); An electric guide rail 1 (200) is fixedly arranged on the top of the device body (100) and outside the loading platform (103); a sliding block (201) is slidably arranged on the electric guide rail 1 (200); and the electric telescopic rod (202) is fixedly arranged on the top of the sliding block (201).

8. A TFT display screen driver IC chip detection device according to claim 1, characterized in that: The conductive bowl (404) is connected to the conductive probe (2092), and pins (4001) are evenly arranged on the chip body (400), and the pins (4001) are clamped and arranged on the inner side of the conductive bowl (404).

9. A TFT display screen driver IC chip detection device according to claim 1, characterized in that: A control panel (102) is fixedly arranged on the outer side of the upper frame (101), and the camera assembly, the electrical detection assembly and the temperature detection assembly are all electrically connected to the control panel (102).

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