Wafer cleaning line and wafer cleaning method

Abstract

The invention discloses a wafer cleaning line, and relates to the technical field of wafer cleaning. The wafer cleaning line comprises a base, a cover body is arranged at the top of the base, a PLC is arranged on the outer side wall of the cover body, a cleaning mechanism is arranged at the top of the base, a material moving mechanism is arranged on the inner side wall of the cover body, and a gas pressurizing mechanism is arranged at the top of the base. According to the wafer cleaning method, bubbles can be formed in the cleaning liquid when the wafer is cleaned, impact force can be generated when the bubbles are broken, sufficient contact between the cleaning liquid and the surface of the wafer is facilitated, the cleaning liquid deeply permeates into tiny gaps and pits in the surface of the wafer to make more sufficient contact with pollutants, and the cleaning effect is improved; and the pressure of the gas can be adjusted, so that the size of the bubbles can be adjusted, the impact force generated when the bubbles are broken can be adjusted according to wafers with different hardness, and the cleaning effect is further improved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer cleaning, and specifically to a wafer cleaning line and a wafer cleaning method. Background Art

[0002] A wafer is the most basic and core raw material in the semiconductor manufacturing industry. A wafer is an ultra-thin, circular semiconductor material sheet, usually made of single crystal silicon (Silicon), and is used as a substrate for integrated circuits and other microelectronic devices. When a wafer cleaning line is cleaning, it is necessary to use a wafer carrier to place multiple wafers. The internal structure of the wafer carrier is simple, usually provided with partitions, which can conveniently store multiple wafers, and then use multiple tanks for cleaning, so that the wafers pass through an ultrasonic cleaning tank, a deionized water cleaning tank and an acetone cleaning tank, and then the wafers are dried to achieve the cleaning of the wafers.

[0003] Most of the current wafer cleaning lines use a loading and unloading mechanism to hoist and transfer the wafer carrier containing wafers into the cleaning tank for cleaning. Because the gap between wafers in the wafer carrier is very small, in order to improve the cleaning effect now, high-pressure air is input into the cleaning tank to form bubbles in the cleaning liquid, and the impact force generated by the bursting of the bubbles is used to clean the wafers. However, too large an impact force will cause damage to the wafers. The bubble generating device of the existing wafer cleaning line cannot control the size of the generated bubbles, it is difficult to adjust the impact force generated by the bursting of the bubbles, and it cannot adjust the impact force according to wafers of different hardnesses. Moreover, it cannot adjust the blowing direction of the bubbles. Because the wafers are placed densely in the wafer carrier, the impact force generated by the bursting of the bubbles is difficult to penetrate deeply into the tiny gaps and depressions on the wafer surface to contact the contaminants more fully, affecting the cleaning effect. Secondly, it cannot quickly burst the aggregated bubbles, so the impact force generated by the bursting of the bubbles will be too scattered, affecting the cleaning effect. Therefore, we propose a wafer cleaning line and a wafer cleaning method. Summary of the Invention

[0004] In order to solve the problem that the bubble generating device of the existing wafer cleaning line cannot control the size of the generated bubbles, it is difficult to adjust the impact force generated by the bursting of the bubbles, and it cannot adjust the impact force according to wafers of different hardnesses; the purpose of the present invention is to provide a wafer cleaning line and a wafer cleaning method.

[0005] To solve the above technical problems, the present invention adopts the following technical solutions: A wafer cleaning line includes a base, a cover body is provided on the top of the base, a PLC controller is provided on the outer side wall of the cover body, a cleaning mechanism is provided on the top of the base, a transfer mechanism is provided on the inner side wall of the cover body, and a gas pressurizing mechanism is provided on the top of the base.

[0006] Preferably, the gas pressurizing mechanism includes a hydraulic rod provided at the top of the base. A fixed frame is provided at the top of the hydraulic rod. A rotating rod is provided inside the fixed frame. One end of the rotating rod is connected to a bearing provided on the inner side wall of the fixed frame. A first motor is provided on the front side wall of the fixed frame. The output end of the first motor is connected to the other end of the rotating rod. A support plate is sleeved and installed on the outer wall of the rotating rod. Two exhaust pipes are provided on the outer side of the support plate. Four air outlet pipes are provided on the outer side walls of the two exhaust pipes. An adjusting mechanism is provided on the top of the support plate. A disturbing mechanism is provided at the bottom of the support plate. Two pressurizing cylinders are provided on the top of the support plate. A nitrogen tank is provided on the outer side wall of the base. A delivery pipe is provided at one end of the nitrogen tank. An air inlet pipe is provided at one end of the delivery pipe. Both ends of the air inlet pipe are respectively communicated with the interiors of the two pressurizing cylinders. Connecting pipes are provided on the left side walls of the two pressurizing cylinders. A first rotary joint is provided at one end of the connecting pipe. A communicating pipe is provided at one end of the first rotary joint. One end of the communicating pipe is communicated with the interior of the exhaust pipe. Piston heads are slidably connected inside the two pressurizing cylinders. Piston rods are provided on the outer side walls of the two piston heads. One end of the piston rod penetrates through the inner side wall of the pressurizing cylinder and extends to the outside. A first connecting rod is hinged at one end of the pressurizing cylinder. A first connecting block is hinged at one end of the first connecting rod. A second connecting rod is hinged at one end of the first connecting block. A third connecting rod is hinged at one end of the second connecting rod. A second connecting block is hinged at one end of the third connecting rod. A first rotating shaft is provided above the support plate. Two vertical plates are sleeved on the outer wall of the first rotating shaft. The bottoms of the two vertical plates are connected to the top of the support plate. One end of the first rotating shaft is hinged to one end of the third connecting rod. A second motor is provided on the top of the support plate. The output end of the second motor is connected with a driving pulley. A driven pulley is sleeved and installed on the outer wall of the first rotating shaft. A belt is sleeved on the outer walls of the driving pulley and the driven pulley.

[0007] Preferably, a first adjusting rod is provided on the outer side wall of the first connecting block. A second adjusting rod is provided on the outer side wall of the second connecting block. A locking bolt is provided through the outer side wall of the second adjusting rod. A nut that is threadedly engaged with the locking bolt is provided on the outer side of the first adjusting rod.

[0008] Preferably, the adjusting mechanism includes a support base provided on the top of the support plate. The top of the support base is connected to the outer side wall of the pressurizing cylinder. A third motor is provided on the outer side wall of the support base. The output end of the third motor is connected with a half gear. One end of the exhaust pipe is connected to the outer side wall of the support plate through a first bearing. A toothed ring that is engaged with the half gear is sleeved and installed on the outer wall of the exhaust pipe.

[0009] Preferably, the perturbation mechanism includes an arc-shaped plate provided at the bottom of the support plate. A plurality of grooves are formed on the outer side wall of the arc-shaped plate. One end of each of the four air outlet pipes is provided with a second rotary joint. One end of each of the four second rotary joints is provided with a jet pipe. A gear is sleeved and installed on the outer wall of each of the four jet pipes. A rack meshing with the gear is provided on the left side of the support plate. One end of the rack is provided with a pressing rod matching with the groove. A support rod is provided on the outer side wall of the rack. A fixing rod is provided on the top of the exhaust pipe. A slider is sleeved on the outer wall of the fixing rod. One end of the support rod is connected to the outer side wall of the slider. Two fixing plates are sleeved and installed on the outer wall of the fixing rod. One end of each of the two fixing plates is connected to the outer side wall of the exhaust pipe. Two springs are sleeved on the outer wall of the fixing rod. The outer wall of the spring is sleeved with two springs. One end of each of the two springs is connected to the opposite side walls of the two fixing plates respectively. The other end of the two springs is connected to the left and right side walls of the slider.

[0010] Preferably, a plurality of perturbation pieces are provided on the outer side wall of the jet pipe, and the perturbation pieces are inclined upward.

[0011] Preferably, the plurality of grooves are arranged in an arc shape on the outer side wall of the arc-shaped plate, and the groove is in a semi-arc shape.

[0012] Preferably, the cleaning mechanism includes a cleaning seat provided on the top of the base. An ultrasonic cleaning tank, a deionized water cleaning tank and an acetone cleaning tank are formed on the top of the cleaning seat. A first conveying device and a second conveying device are respectively provided on the left and right sides of the top of the base. A flower basket is placed on the first conveying device.

[0013] Preferably, one-way valves are provided on the outer side walls of the connecting pipe and the air inlet pipe, and the connecting pipe and the air inlet pipe are made of hard plastic.

[0014] A wafer cleaning line and a wafer cleaning method include the following steps;

[0015] S1: Place the flower basket containing the wafers on the first conveying device. The first conveying device conveys the flower basket into the cover body. Then the material transfer mechanism transfers the flower basket into the ultrasonic cleaning tank, and then uses the deionized water cleaning tank and the acetone cleaning tank for cleaning. The material transfer mechanism can simultaneously transfer the flower baskets in different cleaning tanks, so that the flower baskets can be simultaneously moved into the corresponding cleaning tanks. Finally, the wafers are dried by the drying device, and the flower basket is removed from the cover body by the second conveying device;

[0016] S2: When the flower basket is being cleaned in the deionized water cleaning tank and the acetone cleaning tank, the first motor drives the rotating rod to rotate. The rotating rod drives the support plate to rotate to the horizontal position. Then, the hydraulic rod drives the fixed frame and the support plate to move downward. The air spraying pipe enters the chemical solution in the deionized water cleaning tank and the acetone cleaning tank. Then, the nitrogen gas in the nitrogen gas pipe enters the pressure cylinder through the delivery pipe and the air inlet pipe. The second motor drives the driving pulley to rotate. With the cooperation of the belt and the driven pulley, the first rotating shaft can be driven to rotate. The first rotating shaft drives the third connecting rod to rotate. The third connecting rod drives the second connecting rod to make a circular motion. The second connecting rod drives the first connecting rod to make a circular motion. The first connecting rod drives the piston rod to make a reciprocating motion. The piston rod drives the piston head to reciprocally extrude in the pressure cylinder. The piston head can pressurize the nitrogen gas entering the pressure cylinder. The nitrogen gas can enter the exhaust pipe through the connecting pipe and the communicating pipe, and then be ejected through the air spraying pipe, generating bubbles in the cleaning liquid. The rising and bursting of the bubbles will generate impact force, which helps the cleaning liquid to fully contact the surface of the wafer.

[0017] S3: The included angle between the first adjusting rod and the second adjusting rod can be adjusted by using the locking bolt and the nut, thereby being able to adjust the distance between the first connecting block and the second connecting block. Thus, the rotation radius of the second connecting rod and the first connecting rod can be reduced, shortening the stroke of the piston rod driving the piston head in the pressure cylinder, changing the compression ratio, and being able to adjust the pressure of the output gas, thereby being able to adjust the size of the bubbles.

[0018] S4: The third motor drives the semi-gear to rotate. The semi-gear drives the toothed ring to rotate. With the cooperation of the first rotary joint, the toothed ring can drive the exhaust pipe to rotate. The exhaust pipe drives the air spraying pipe to rotate, thereby being able to change the direction of the bubbles being blown out. Thus, the direction of the rising and bursting of the bubbles will change, being able to improve the full contact between the cleaning liquid and the surface of the wafer and improve the cleaning effect.

[0019] S5: When the exhaust pipe rotates, the exhaust pipe drives the extrusion rod to rotate. The convex part of the arc-shaped plate can indirectly extrude the extrusion rod. The extrusion rod drives the rack to move. The rack drives the support rod and the slider to move on the outer wall of the fixed rod. The slider can extrude the spring. Thus, under the action of the spring elasticity, the rack can reciprocally move. The rack can drive the gear to rotate. With the cooperation of the second rotary joint, the gear drives the air spraying pipe to rotate. The air spraying pipe drives the disturbing piece to rotate. The disturbing piece can stir the cleaning liquid and at the same time can also break the generated bubbles, causing them to burst. Thus, the cleaning liquid can penetrate more deeply into the tiny gaps and depressions on the surface of the wafer to fully contact the pollutants, further improving the cleaning effect.

[0020] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0021] 1. The present invention is provided with a gas pressurizing mechanism, enabling the wafer of the present application to form bubbles in the cleaning liquid during cleaning. The bursting of the bubbles generates an impact force, which helps the cleaning liquid to come into full contact with the surface of the wafer, improving the cleaning effect.

[0022] 2. The present invention is provided with a first adjusting rod, a nut, a locking bolt and a second adjusting rod, enabling the present application to reduce the rotation radius of the second connecting rod and the first connecting rod, thereby shortening the stroke of the piston rod driving the piston head in the pressurizing cylinder, changing the compression ratio, and thus being able to adjust the pressure of the output gas, being able to adjust the size of the generated bubbles, and being able to adjust the impact force generated when the bubbles burst according to wafers of different hardnesses, further improving the cleaning effect.

[0023] 3. The present invention is provided with an adjusting mechanism, enabling the present application to adjust the blowing direction of the bubbles, and thus being able to adjust the bursting direction of the bubbles, promoting the cleaning liquid to penetrate deeply into the tiny gaps and depressions on the surface of the wafer to come into more full contact with the pollutants, further improving the cleaning effect.

[0024] 4. The present invention is provided with a disturbing mechanism, enabling the present application to quickly burst the aggregated bubbles, and being able to gather the bursting impact force of the bubbles, affecting the cleaning effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0026] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0027] Figure 2 It is a schematic diagram of the gas pressurizing mechanism structure of the present invention.

[0028] Figure 3 It is a schematic diagram of the pressurizing cylinder and piston structure of the present invention.

[0029] Figure 4 It is a schematic diagram of the first driving pulley and the first driven pulley structure of the present invention.

[0030] Figure 5 It is a schematic diagram of the disturbing mechanism structure of the present invention.

[0031] Figure 6 It is a schematic diagram of the arc-shaped plate structure of the present invention.

[0032] Figure 7 For the present inventionFigure 4 Schematic enlarged view of the structure at position A in the [device].

[0033] Figure 8 This is for the present invention Figure 5 Schematic enlarged view of the structure at position B in the [device].

[0034] In the figure: 1, base; 2, cover body; 3, gas pressurizing mechanism; 300, nitrogen tank; 301, delivery pipe; 302, intake pipe; 303, pressurizing cylinder; 304, connecting pipe; 305, exhaust pipe; 306, support plate; 307, hydraulic rod; 308, first motor; 309, fixing bracket; 310, first rotary joint; 311, connecting pipe; 312, piston head; 313, piston rod; 314, first connecting rod; 315, vertical plate; 316, first rotating shaft; 317, second motor; 318, driving pulley; 319, belt; 320, driven pulley; 321, first connecting block; 322, second connecting rod; 323, third connecting rod; 324, second connecting block; 325, first adjusting rod; 326, nut; 327, locking bolt; 328, second adjusting rod; 329, outlet pipe; 4, material transfer mechanism; 5, cleaning mechanism; 500, cleaning base; 501, ultrasonic cleaning tank; 502, deionized water cleaning tank; 503, acetone cleaning tank; 504, first conveying device; 505, flower basket; 506, second conveying device; 6, adjusting mechanism; 600, support base; 601, third motor; 602, semi-gear; 603, toothed ring; 7, disturbing mechanism; 700, arc plate; 701, extrusion rod; 702, gear; 703, rack; 704, disturbing piece; 705, air spray pipe; 706, second rotary joint; 707, support rod; 708, groove; 709, fixing rod; 710, fixing plate; 711, slider; 712, spring. Detailed implementation manners

[0035] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0036] Embodiment: As Figures 1-8 shown, the present invention provides a wafer cleaning line, including a base 1, a cover body 2 is provided on the top of the base 1, a PLC controller is provided on the outer side wall of the cover body 2, a cleaning mechanism 5 is provided on the top of the base 1, a material transfer mechanism 4 is provided on the inner side wall of the cover body 2, and a gas pressurizing mechanism 3 is provided on the top of the base 1.

[0037] The gas pressurizing mechanism 3 includes a hydraulic rod 307 provided at the top of the base 1. A fixed frame 309 is provided at the top of the hydraulic rod 307. A rotating rod is provided inside the fixed frame 309. One end of the rotating rod is connected to a bearing provided on the inner side wall of the fixed frame 309. A first motor 308 is provided on the front side wall of the fixed frame 309. The output end of the first motor 308 is connected to the other end of the rotating rod. A support plate 306 is sleeved and installed on the outer wall of the rotating rod. Two exhaust pipes 305 are provided on the outside of the support plate 306. Four air outlet pipes 329 are provided on the outer side walls of the two exhaust pipes 305. An adjusting mechanism 6 is provided on the top of the support plate 306. A disturbing mechanism 7 is provided at the bottom of the support plate 306. Two pressurizing cylinders 303 are provided on the top of the support plate 306. A nitrogen tank 300 is provided on the outer side wall of the base 1. One end of the nitrogen tank 300 is provided with a delivery pipe 301. One end of the delivery pipe 301 is provided with an inlet pipe 302. Both ends of the inlet pipe 302 are respectively communicated with the interiors of the two pressurizing cylinders 303. A connecting pipe 311 is provided on the left side wall of each of the two pressurizing cylinders 303. One end of the connecting pipe 311 is provided with a first rotary joint 310. One end of the first rotary joint 310 is provided with a communicating pipe 304. One end of the communicating pipe 304 is communicated with the interior of the exhaust pipe 305. Piston heads 312 are slidably connected inside the two pressurizing cylinders 303. Piston rods 313 are provided on the outer side walls of the two piston heads 312. One end of the piston rod 313 penetrates through the inner side wall of the pressurizing cylinder 303 and extends to the outside. One end of the pressurizing cylinder 303 is hinged with a first connecting rod 314. One end of the first connecting rod 314 is hinged with a first connecting block 321. One end of the first connecting block 321 is hinged with a second connecting rod 322. One end of the second connecting rod 322 is hinged with a third connecting rod 323. One end of the third connecting rod 323 is hinged with a second connecting block 324. A first rotating shaft 316 is provided above the support plate 306. Two vertical plates 315 are sleeved on the outer wall of the first rotating shaft 316. The bottoms of the two vertical plates 315 are both connected to the top of the support plate 306. One end of the first rotating shaft 316 is hinged with one end of the third connecting rod 323. A second motor 317 is provided on the top of the support plate 306. The output end of the second motor 317 is connected with a driving pulley 318. A driven pulley 320 is sleeved and installed on the outer wall of the first rotating shaft 316. A belt 319 is sleeved on the outer walls of the driving pulley 318 and the driven pulley 320.

[0038] By adopting the above technical solution, when the wafer is being cleaned, bubbles can be formed in the cleaning liquid. The bursting of the bubbles will generate an impact force, which helps the cleaning liquid to fully contact the surface of the wafer, enabling the cleaning liquid to deeply penetrate into the tiny gaps and depressions on the surface of the wafer and contact the contaminants more fully.

[0039] A first adjusting rod 325 is provided on the outer side wall of the first connecting block 321. A second adjusting rod 328 is provided on the outer side wall of the second connecting block 324. A locking bolt 327 penetrates through the outer side wall of the second adjusting rod 328. A nut 326 that is in threaded cooperation with the locking bolt 327 is provided on the outside of the first adjusting rod 325.

[0040] By adopting the above technical solution, the included angle between the first adjusting rod 325 and the second adjusting rod 328 can be adjusted by using the locking bolt 327 and the nut 326, so that the distance between the first connecting block 321 and the second connecting block 324 can be adjusted, thereby reducing the rotation radius of the second connecting rod 322 and the first connecting rod 314, shortening the stroke of the piston rod 313 driving the piston head 312 in the pressure cylinder 303, changing the compression ratio, and adjusting the pressure of the output gas, so as to adjust the size of the bubbles.

[0041] The adjusting mechanism 6 includes a support seat 600 provided on the top of the support plate 306. The top of the support seat 600 is connected to the outer side wall of the pressure cylinder 303. A third motor 601 is provided on the outer side wall of the support seat 600. The output end of the third motor 601 is connected with a semi-gear 602. One end of the exhaust pipe 305 is connected to the outer side wall of the support plate 306 through a first bearing. A toothed ring 603 meshing with the semi-gear 602 is sleeved and installed on the outer wall of the exhaust pipe 305.

[0042] By adopting the above technical solution, the direction of the bubble ejection can be adjusted, so that the direction of the bubble rupture can be adjusted, which can further promote the cleaning liquid to penetrate deeply into the tiny gaps and depressions on the surface of the wafer and contact the pollutants more fully.

[0043] The disturbing mechanism 7 includes an arc-shaped plate 700 provided at the bottom of the support plate 306. A plurality of groups of grooves 708 are formed on the outer side wall of the arc-shaped plate 700. One end of each of the four air outlet pipes 329 is provided with a second rotary joint 706. One end of each of the four second rotary joints 706 is provided with an air injection pipe 705. Gears 702 are sleeved and installed on the outer walls of the four air injection pipes 705. A rack 703 meshing with the gears 702 is provided on the left side of the support plate 306. One end of the rack 703 is provided with a pressing rod 701 matching with the grooves 708. A support rod 707 is provided on the outer side wall of the rack 703. A fixing rod 709 is provided on the top of the exhaust pipe 305. A slider 711 is sleeved on the outer wall of the fixing rod 709. One end of the support rod 707 is connected to the outer side wall of the slider 711. Two fixing plates 710 are sleeved and installed on the outer wall of the fixing rod 709. One end of each of the two fixing plates 710 is connected to the outer side wall of the exhaust pipe 305. Two springs 712 are sleeved on the outer wall of the fixing rod 709. The two springs 712 are sleeved with the two springs 712. One end of each of the two springs 712 is respectively connected to the opposite side walls of the two fixing plates 710. The other ends of the two springs 712 are connected to the left and right side walls of the slider 711.

[0044] By adopting the above technical solution, the aggregated bubbles can be quickly ruptured, and the rupture impact force of the bubbles can be concentrated together to improve the cleaning effect.

[0045] The outer wall of the air jet pipe 705 is provided with multiple groups of disturbance vanes 704, and the disturbance vanes 704 are arranged to incline upward.

[0046] By adopting the above technical solution, the bubbles ejected from the air jet pipe 705 move upward. When the disturbance vanes 704 rotate, they can break the aggregated bubbles and also disturb the cleaning liquid.

[0047] Multiple groups of grooves 708 are arranged in an arc shape on the outer wall of the arc-shaped plate 700, and the grooves 708 are arranged in a semi-arc shape.

[0048] By adopting the above technical solution, in the initial state, the extrusion rod 701 is located in the groove 708. When the exhaust pipe 305 rotates, the protruding part of the arc-shaped plate 700 can extrude the extrusion rod 701.

[0049] The cleaning mechanism 5 includes a cleaning base 500 provided on the top of the base 1. The top of the cleaning base 500 is provided with an ultrasonic cleaning tank 501, a deionized water cleaning tank 502, and an acetone cleaning tank 503. The left and right sides of the top of the base 1 are respectively provided with a first conveying device 504 and a second conveying device 506, and a flower basket 505 is placed on the first conveying device 504.

[0050] By adopting the above technical solution, the wafers in the flower basket 505 can be cleaned.

[0051] Check valves are provided on the outer walls of both the connecting pipe 304 and the intake pipe 302, and the connecting pipe 304 and the intake pipe 302 are made of rigid plastic.

[0052] By adopting the above technical solution, the check valves are provided to avoid gas backflow and ensure the stability of bubble generation.

[0053] A wafer cleaning line and a wafer cleaning method include the following steps;

[0054] S1: Place the flower basket 505 containing wafers on the first conveying device 504. The first conveying device 504 conveys the flower basket 505 into the cover 2, and then the material transfer mechanism 4 transfers the flower basket 505 into the ultrasonic cleaning tank 501, and then uses the deionized water cleaning tank 502 and the acetone cleaning tank 503 for cleaning. The material transfer mechanism 4 can simultaneously transfer the flower baskets 505 in different cleaning tanks, so that the flower baskets 505 can be simultaneously moved into the corresponding cleaning tanks. Finally, the wafers are dried by the drying device, and the second conveying device 506 moves the flower basket 505 out of the cover 2;

[0055] S2: When the flower basket 505 is being cleaned in the deionized water cleaning tank 502 and the acetone cleaning tank 503, the first motor 308 drives the rotating rod to rotate. The rotating rod drives the support plate 306 to rotate to the horizontal position. Then, the hydraulic rod 307 drives the fixing frame 309 and the support plate 306 to move downward. The air spraying pipe 705 enters the chemical solution in the deionized water cleaning tank 502 and the acetone cleaning tank 503. Then, the nitrogen gas in the nitrogen gas pipe 300 enters the pressure cylinder 303 through the delivery pipe 301 and the air inlet pipe 302. The second motor 317 drives the driving pulley 318 to rotate. With the cooperation of the belt 319 and the driven pulley 320, the first rotating shaft 316 can be driven to rotate. The first rotating shaft 316 drives the third connecting rod 323 to rotate. The third connecting rod 323 drives the second connecting rod 322 to perform a circular motion. The second connecting rod 322 drives the first connecting rod 314 to perform a circular motion. The first connecting rod 314 drives the piston rod 313 to perform a reciprocating motion. The piston rod 313 drives the piston head 312 to reciprocally extrude in the pressure cylinder 303. The piston head 312 can pressurize the nitrogen gas entering the pressure cylinder 303. The nitrogen gas can enter the exhaust pipe 305 through the connecting pipe 311 and the communicating pipe 304, and then be ejected through the air spraying pipe 705, generating bubbles in the cleaning liquid. The rising and bursting of the bubbles will generate an impact force, which helps the cleaning liquid to fully contact the surface of the wafer;

[0056] S3: The angle between the first adjusting rod 325 and the second adjusting rod 328 can be adjusted by using the locking bolt 327 and the nut 326, so that the distance between the first connecting block 321 and the second connecting block 324 can be adjusted, thereby reducing the rotation radius of the second connecting rod 322 and the first connecting rod 314, shortening the stroke of the piston rod 313 driving the piston head 312 in the pressure cylinder 303, changing the compression ratio, and being able to adjust the pressure of the output gas, thereby being able to adjust the size of the bubbles;

[0057] S4: The third motor 601 drives the semi-gear 602 to rotate. The semi-gear 602 drives the gear ring 603 to rotate. With the cooperation of the first rotary joint 310, the gear ring 603 can drive the exhaust pipe 305 to rotate. The exhaust pipe 305 drives the air spraying pipe 705 to rotate, thereby being able to change the direction of the bubbles being blown out. Thus, the direction of the bubbles rising and bursting will change, being able to improve the full contact between the cleaning liquid and the surface of the wafer and improve the cleaning effect;

[0058] S5: When the exhaust pipe 305 rotates, the exhaust pipe 315 drives the extrusion rod 701 to rotate. The convex part of the arc-shaped plate 700 can indirectly extrude the extrusion rod 701. The extrusion rod 701 drives the rack 703 to move. The rack 703 drives the support rod 707 and the slider 711 to move on the outer wall of the fixed rod 709. The slider 711 can extrude the spring 712. Thus, under the action of the elastic force of the spring 712, the rack 703 can reciprocate. The rack 703 can drive the gear 702 to rotate. With the cooperation of the second rotary joint 706, the gear 702 drives the air injection pipe 705 to rotate. The air injection pipe 705 can drive the disturbance piece 704 to rotate. The disturbance piece 704 can stir the cleaning liquid and at the same time can also destroy the generated bubbles and make them burst. Thus, the cleaning liquid can penetrate more deeply into the tiny gaps and depressions on the surface of the wafer to fully contact the pollutants, further improving the cleaning effect.

[0059] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and its equivalent technologies, the present invention also intends to include these modifications and variations.

Claims

1. A wafer cleaning line, comprising a base (1), a cover (2) being provided on the top of the base (1), and a PLC controller being provided on the outer side wall of the cover (2), characterized in that: The top of the base (1) is provided with a cleaning mechanism (5), the inner side wall of the cover body (2) is provided with a material moving mechanism (4), and the top of the base (1) is provided with a gas pressurizing mechanism (3).

2. A wafer cleaning line as claimed in claim 1, characterized in that: The gas pressurizing mechanism (3) comprises a hydraulic rod (307) provided on the top of the base (1), a fixed frame (309) provided on the top of the hydraulic rod (307), a rotating rod provided inside the fixed frame (309), one end of the rotating rod being connected to a bearing provided on the inner wall of the fixed frame (309), a first motor (308) being provided on the front wall of the fixed frame (309), an output end of the first motor (308) being connected to the other end of the rotating rod, a support plate (306) being sleeved and mounted on the outer wall of the rotating rod, two groups of exhaust pipes (305) being provided on the outer side of the support plate (306), four groups of air outlet pipes (329) being provided on the outer side walls of the two groups of exhaust pipes (305), and a regulating mechanism (329) being provided on the top of the support plate (306). The support plate (306) has a structure (6), a disturbance mechanism (7) is provided at the bottom, two groups of pressurizing cylinders (303) are provided at the top of the support plate (306), a nitrogen tank (300) is provided on the outer wall of the base (1), a delivery pipe (301) is provided at one end of the nitrogen tank (300), an air intake pipe (302) is provided at one end of the delivery pipe (301), both ends of the air intake pipe (302) are respectively connected to the inside of the two groups of pressurizing cylinders (303), the left side walls of the two groups of pressurizing cylinders (303) are provided with connecting pipes (311), one end of the connecting pipes (311) is provided with a first rotating joint (310), one end of the first rotating joint (310) is provided with a connecting pipe (304), and the connecting pipe ( One end of the two pressure cylinders (303) is connected to the inside of the exhaust pipe (305), and a piston head (312) is slidably connected in the two groups of the pressure cylinders (303). The outer walls of the two groups of the piston heads (312) are provided with piston rods (313). One end of the piston rod (313) passes through the inner wall of the pressure cylinder (303) and extends to the outside. One end of the pressure cylinder (303) is hingedly provided with a first connecting rod (314), one end of the first connecting rod (314) is hingedly provided with a first connecting block (321), one end of the first connecting block (321) is hingedly provided with a second connecting rod (322), one end of the second connecting rod (322) is hingedly provided with a third connecting rod (323), and one end of the third connecting rod (323) is hingedly provided with a second connecting rod (314). A block (324) is provided above the support plate (306), and two groups of vertical plates (315) are sleeved on the outer wall of the first rotating shaft (316), and the bottoms of the two groups of vertical plates (315) are connected to the top of the support plate (306), one end of the first rotating shaft (316) is hinged to one end of the third connecting rod (323), and a second motor (317) is provided on the top of the support plate (306), and a driving pulley (318) is connected to the output end of the second motor (317), and a driven pulley (320) is sleeved and installed on the outer wall of the first rotating shaft (316), and belts (319) are sleeved on the outer walls of the driving pulley (318) and the driven pulley (320).

3. A wafer cleaning line as claimed in claim 2, characterized in that: A first adjusting rod (325) is provided on the outer wall of the first connecting block (321), a second adjusting rod (328) is provided on the outer wall of the second connecting block (324), a locking bolt (327) is passed through the outer wall of the second adjusting rod (328), and a nut (326) threadedly matched with the locking bolt (327) is provided on the outer side of the first adjusting rod (325).

4. A wafer cleaning line as claimed in claim (2), characterized in that: The regulating mechanism (6) comprises a support seat (600) provided on the top of the support plate (306), the top of the support seat (600) being connected to the outer wall of the pressurizing cylinder (303), the outer wall of the support seat (600) being provided with a third motor (601), the output end of the third motor (601) being connected to a half gear (602), one end of the exhaust pipe (305) being connected to the outer wall of the support plate (306) via a bearing, and the outer wall of the exhaust pipe (305) being sleeved with a gear ring (603) meshing with the half gear (602).

5. A wafer cleaning line as claimed in claim 2, characterized in that: The disturbance mechanism (7) comprises an arc-shaped plate (700) provided at the bottom of the support plate (306), the outer wall of the arc-shaped plate (700) is provided with a plurality of groups of grooves (708), one end of the four groups of the outlet pipes (329) is provided with a second rotary joint (706), one end of the four groups of the second rotary joints (706) is provided with an injection pipe (705), the outer walls of the four groups of the injection pipes (705) are sleeved and mounted with a gear (702), the left side of the support plate (306) is provided with a rack (703) meshing with the gear (702), one end of the rack (703) is provided with an extrusion rod (701) matched with the groove (708), the outer wall of the rack (703) is provided with a support rod (707), and the exhaust pipe ( A fixing rod (709) is provided at the top of the exhaust pipe (305), and a sliding block (711) is sleeved on the outer wall of the fixing rod (709), one end of the support rod (707) is connected to the outer wall of the sliding block (711), and two groups of fixing plates (710) are sleeved and installed on the outer wall of the fixing rod (709), one end of the two groups of fixing plates (710) are connected to the outer wall of the exhaust pipe (305), and two groups of springs (712) are sleeved on the outer wall of the fixing rod (709), and two groups of springs (712) are sleeved on the outer wall of the spring (712), one end of the two groups of springs (712) are respectively connected to the opposite side walls of the two groups of fixing plates (710), and the other end of the two groups of springs (712) are connected to the left and right side walls of the sliding block (711).

6. A wafer cleaning line as claimed in claim 5, characterized in that: The outer side wall of the air injection pipe (705) is provided with a plurality of groups of disturbance plates (704), and the disturbance plates (704) are arranged to be inclined upward.

7. A wafer cleaning line as claimed in claim 5, characterized in that: A plurality of groups of the grooves (708) are arranged in an arc shape on the outer side wall of the arc plate (700), and the grooves (708) are arranged in a semi-arc shape.

8. A wafer cleaning line as claimed in claim 1, characterized in that: The cleaning mechanism (5) comprises a cleaning seat (500) provided on the top of the base (1); an ultrasonic cleaning tank (501), a deionized cleaning tank (502) and an acetone cleaning tank (503) are provided on the top of the cleaning seat (500); a first conveying device (504) and a second conveying device (506) are provided on the left and right sides of the top of the base (1), respectively; a flower basket (505) is placed on the first conveying device (504).

9. A wafer cleaning line as claimed in claim 8, characterized in that: The outer side walls of the connecting pipe (304) and the air inlet pipe (302) are both provided with one-way valves, and the connecting pipe (304) and the air inlet pipe (302) are made of hard plastic.

10. A wafer cleaning line and a wafer cleaning method according to any one of claims 1 to 9, characterized in that: The steps include: S1: placing a flower basket (505) containing wafers on a first conveying device (504), the first conveying device (504) conveys the flower basket (505) into the cover body (2), then the material transfer mechanism (4) moves the flower basket (505) into an ultrasonic cleaning tank (501), and then uses a deionized cleaning tank (502) and an acetone cleaning tank (503) for cleaning. The material transfer mechanism (4) can simultaneously transfer the flower baskets (505) in different cleaning tanks, so that the flower baskets (505) can be moved to corresponding cleaning tanks at the same time. Finally, the drying device is used to dry the wafers, and the second conveying device (506) moves the flower basket (505) out of the cover body (2); S2: When the flower basket (505) is being cleaned in the deionized cleaning tank (502) and the acetone cleaning tank (503), the first motor (308) drives the rotating rod to rotate, and the rotating rod drives the support plate (306) to rotate to a horizontal position, and then the hydraulic rod (307) drives the fixed frame (309) and the support plate (306) to move downward, and the jet pipe (705) enters the chemical solution in the deionized cleaning tank (502) and the acetone cleaning tank (503), and then the nitrogen in the nitrogen pipe (300) enters the pressurizing cylinder (303) through the delivery pipe (301) and the air inlet pipe (302), and the second motor (317) drives the driving pulley (318) to rotate, and can drive the first rotating shaft (316) under the cooperation of the belt (319) and the driven pulley (320). The first rotating shaft (316) drives the third connecting rod (323) to rotate, the third connecting rod (323) drives the second connecting rod (322) to make a circular motion, the second connecting rod (322) drives the first connecting rod (314) to make a circular motion, the first connecting rod (314) drives the piston rod (313) to make a reciprocating motion, the piston rod (313) drives the piston head (312) to reciprocate in the pressurizing cylinder (303), the piston head (312) can pressurize the nitrogen entering the pressurizing cylinder (303), the nitrogen can enter the exhaust pipe (305) through the connecting pipe (311) and the connecting pipe (304), and then be ejected through the injection pipe (705), which can generate bubbles in the cleaning liquid, the rise and bursting of the bubbles will generate impact force, which helps the cleaning liquid to fully contact with the wafer surface; S3: The locking bolt (327) and the nut (326) can be used to adjust the angle between the first adjusting rod (325) and the second adjusting rod (328), so that the distance between the first connecting block (321) and the second connecting block (324) can be adjusted, thereby reducing the rotation radius of the second connecting rod (322) and the first connecting rod (314), thereby shortening the stroke of the piston rod (313) driving the piston head (312) in the pressurizing cylinder (303), changing the compression ratio, and adjusting the pressure of the output gas, thereby adjusting the size of the bubbles; S4: The third motor (601) drives the half gear (602) to rotate, and the half gear (602) drives the gear ring (603) to rotate. Under the cooperation of the first rotary joint (310), the gear ring (603) can drive the exhaust pipe (305) to rotate, and the exhaust pipe (305) drives the jet pipe (705) to rotate, thereby changing the direction of the bubble blowing, so that the direction of the bubble rising and bursting will change, which can improve the full contact between the cleaning liquid and the wafer surface and improve the cleaning effect; S5: When the exhaust pipe (305) rotates, the exhaust pipe (315) drives the extrusion rod (701) to rotate, and the protrusion of the arc plate (700) can indirectly squeeze the extrusion rod (701), and the extrusion rod (701) drives the rack (703) to move, and the rack (703) drives the support rod (707) and the slider (711) to move on the outer wall of the fixed rod (709), and the slider (711) can squeeze the spring (712), so that the rack (703) is moved under the action of the elastic force of the spring (712). The rack (703) can move back and forth, and the gear (702) can drive the gear (702) to rotate. With the cooperation of the second rotating joint (706), the gear (702) can drive the jet pipe (705) to rotate. The jet pipe (705) can drive the disturbance plate (704) to rotate. The disturbance plate (704) can stir the cleaning liquid and destroy the generated bubbles to make them burst, so that the cleaning liquid can penetrate deeper into the tiny gaps and depressions on the surface of the wafer to fully contact with the pollutants, thereby further improving the cleaning effect.

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