An electrostatic chuck structure for wafer

Abstract

The present application discloses an electrostatic suction cup structure for a wafer, and the electrostatic suction cup structure for the wafer includes: an electrostatic suction cup, a pressurized conveying component, and an automatic cleaning component. In order to solve the problem in the prior art that, after the ordinary electrostatic suction cup structure performs fixed conveying processing on the wafer, foreign matter and oil pollution are easily left on the surface, which leads to a subsequent reduction in adsorption force, the automatic cleaning component designed in the present application automatically cleans the surface of the electrostatic suction cup. Furthermore, in order to solve the problem of wear caused by long-term friction between ordinary cleaning tools and the surface of the electrostatic suction cup, the present application can automatically perform pressurized spray cleaning on the electrostatic suction cup through the coordinated use of the pressurized conveying component and the automatic cleaning component. On the one hand, it improves the cleaning effect and avoids the adhesion of oil and impurities. On the other hand, it reduces manual cleaning operations and avoids wear and tear caused by manual operations.

Description

Technical Field

[0001] The present application relates to the technical field of electrostatic chucks, and in particular to an electrostatic chuck structure for a wafer. Background Art

[0002] During the wafer processing process, electrostatic chucks are required to fix and handle wafers in multiple key links. Electrostatic chucks firmly fix the wafers on their surface through the principle of electrostatic adsorption, ensuring that the wafers maintain a stable position and posture during the processing. Electrostatic chucks play a vital role in the wafer processing process. They run through multiple key links to ensure the stability and precision of the wafers during the processing. Electrostatic chucks are also required to fix the wafers during transportation and movement between different processing stations.

[0003] Electrostatic chucks are crucial in semiconductor processing; advantages:

[0004] 1) Uniform adsorption force;

[0005] 2) Less pollution;

[0006] 3) Can work in vacuum environment.

[0007] The key and difficulty of electrostatic chuck is temperature control.

[0008] Taking dry etching as an example, dry etching requires controlling the wafer at a specific temperature between 100°C and -70°C to maintain certain etching characteristics. This mainly relies on the following two methods:

[0009] 1) Increase gas convection between the wafer surface and the electrostatic chuck surface to dissipate heat (the cooling gas usually used in semiconductor processes is helium);

[0010] 2) Heat is dissipated through heat conduction on the surface of the electrostatic chuck.

[0011] While existing electrostatic chucks can achieve basic wafer adsorption and transfer functions, they exhibit significant drawbacks in practical applications. During continuous operation, contaminants such as microparticles formed by condensed process gases, resist residues, and metal deposits gradually accumulate on the chuck surface, reducing adsorption capacity. Furthermore, contaminants can undergo thermal dissociation during high-temperature processes (such as plasma etching), resulting in secondary contamination and the induction of wafer surface defects.

[0012] That is, the existing technology has the following technical problem: after the ordinary electrostatic chuck has been fixed, impurities may adhere to its surface and its adsorption capacity will be reduced. Therefore, to solve the above problem, an electrostatic chuck structure for wafers is proposed. Summary of the Invention

[0013] In this embodiment, an electrostatic chuck structure for a wafer is provided to solve the problem in the prior art that impurities may adhere to the surface of a common electrostatic chuck after adsorption and fixing, thereby reducing the adsorption capacity.

[0014] According to one aspect of the present application, there is provided an electrostatic chuck structure for a wafer, the electrostatic chuck structure for the wafer comprising:

[0015] An electrostatic chuck, wherein the electrostatic chuck is fixedly disposed at one end of the flip unit, the flip unit is fixedly disposed at the conveying unit, the conveying unit is used to drive the chuck to transport and move, and the flip unit is used to drive the chuck to flip;

[0016] An extrusion portion, the extrusion portion being fixedly disposed on a side of the conveying unit;

[0017] A pressurized delivery assembly, the pressurized delivery assembly being fixedly disposed on the upper surface of the fixed base, one side of the pressurized delivery assembly being in contact with the extrusion portion, and the pressurized delivery assembly being used for pressurizing and delivering the cleaning medium;

[0018] An automatic cleaning component is fixedly arranged on the upper surface of the fixed base, the automatic cleaning component is connected to the booster conveying component, and the automatic cleaning component is used to automatically release the cleaning medium to clean the electrostatic suction cup.

[0019] Furthermore, the conveying unit includes a rectangular guide rail shell, supporting feet, a movable seat, a servo motor A and a threaded rod. The supporting feet are fixedly connected to both sides of the bottom surface of the rectangular guide rail shell, and the supporting feet are fixedly arranged on the upper surface of the fixed base. The interior of the rectangular guide rail shell is provided with an inner cavity, and the movable seat is slidably connected to the inner cavity of the rectangular guide rail shell. The movable seat slides with the outer wall of the rectangular guide rail shell, and a threaded rod is rotatably connected between the side walls on both sides of the inner cavity of the rectangular guide rail shell. The threaded rod passes through the movable seat and is threadedly engaged with the movable seat. A servo motor A is fixedly installed at one end of the rectangular guide rail shell, and the output shaft end of the servo motor A extends into the inner cavity of the rectangular guide rail shell, and the output end of the servo motor A is fixedly connected to the threaded rod.

[0020] Furthermore, the flip unit includes a fixed bracket, a flip seat and a servo motor B. The fixed bracket is fixedly arranged on the upper surface of the movable seat. The upper end of the fixed bracket is rotatably connected to the flip seat. An electrostatic suction cup is fixedly arranged on the upper surface of the flip seat. The servo motor B is fixedly installed on the side wall of the fixed bracket. The output shaft end of the servo motor B extends to the rotating shaft of the flip seat and is fixedly connected to the rotating shaft of the flip seat.

[0021] Furthermore, the extrusion part includes a fixed sleeve rod, a movable sleeve rod, an extrusion block A and a control spring. The fixed sleeve rod is fixedly arranged at the side wall position of the movable seat, and the movable sleeve rod is slidably connected in the inner cavity of the fixed sleeve rod. One end of the control spring is fixedly connected to one side of the inner cavity of the fixed sleeve rod, and the other end of the control spring extends to the inner wall of the movable sleeve rod and is fixedly connected to the movable sleeve rod. The extrusion block A is fixedly connected to one end of the movable sleeve rod, and inclined surfaces are provided on both sides of the extrusion block A.

[0022] Furthermore, the boost delivery assembly includes a fixed support, a movable guide rod, an extrusion block B, a connecting plate, a fixed tripod, a fixed cylinder, a movable piston, a connecting guide rod and a boost spring. There are at least two boost delivery assemblies, and the fixed support is fixedly arranged on the upper surface of the fixed base. The upper end of the fixed support is slidably connected to the movable guide rod, and one end of the movable guide rod is fixedly connected to the extrusion block B, and a slope is provided on one side of the extrusion block B.

[0023] Furthermore, the other end of the movable guide rod is fixedly connected to a connecting plate, the fixed leg is fixedly arranged on the upper surface of the fixed base, the upper end side wall of the fixed leg is fixedly connected to a fixed cylinder, a movable piston is slidably connected in the inner cavity of the fixed cylinder, one side side wall of the movable piston is fixedly connected to one end of the connecting guide rod, the other end of the connecting guide rod passes through the inner cavity side wall of the fixed cylinder and extends outside the wall, one end of the connecting guide rod is fixedly connected to the connecting plate, one end of the boosting spring is fixedly connected to the side wall of the movable piston, and the other end of the boosting spring is fixedly connected to the inner cavity side wall of the fixed cylinder.

[0024] Furthermore, an input pipe is fixedly connected to one side of the inner cavity of the fixed cylinder, and an input one-way valve is installed on the input pipe. An output pipe is fixedly connected to one side of the inner cavity of the fixed cylinder, and an output one-way valve is installed on the output pipe. One end of the input pipe extends to the cleaning medium.

[0025] Furthermore, the cleaning medium is a liquid detergent, and the liquid detergent is isopropyl alcohol.

[0026] Furthermore, the cleaning medium is gas.

[0027] Furthermore, the automatic cleaning component includes a connecting bracket, a circular shell, a connecting tube A, a connecting tube B, a rotating shaft, blades, a fixed tube, a rotating sleeve and a duck-shaped nozzle. There are at least two automatic cleaning components, the connecting bracket is fixedly arranged on the upper surface of the fixed base, a circular shell is fixedly arranged on the side wall of the connecting bracket, a rotating shaft is rotatably connected at the center position of the inner cavity of the circular shell, blades are fixedly arranged on the arc-shaped wall of the rotating shaft, a connecting tube A is fixedly connected to the bottom side of the circular shell, the connecting tube A is communicated with the inner cavity of the circular shell, a connecting tube B is fixedly connected to the upper side of the circular shell, the connecting tube B is communicated with the inner cavity of the circular shell, and one end of the connecting tube A is fixedly connected to one end of the output tube.

[0028] Furthermore, a fixed tube is fixedly connected to the upper end of the connecting bracket, a rotating sleeve is rotatably provided on one end of the fixed tube, a ball is rotatably provided on the inner wall of the rotating sleeve, the ball contacts the surface of the fixed tube, a duck-shaped nozzle is fixedly connected to one end of the rotating sleeve, and the connecting tube B is connected to the fixed tube.

[0029] Furthermore, a rotating wheel is rotatably connected to the side wall of the connecting bracket, and the rotating wheel is coaxially fixedly connected to the rotating shaft. A connecting wheel is fixedly provided on the arc-shaped wall of the rotating sleeve, and a connecting belt is sleeved between the connecting wheel and the rotating wheel.

[0030] Through the above-mentioned technical solution of the present application, in order to solve the problem in the prior art that ordinary electrostatic suction cup structures are prone to residual foreign matter and oil stains on the surface after fixed conveying processing of wafers, which leads to a subsequent reduction in adsorption force, the present application designs an automatic cleaning component. Through the setting of the automatic cleaning component, the surface of the electrostatic suction cup can be automatically cleaned when the electrostatic suction cup is reset and moved after processing and conveying. Furthermore, in order to avoid the wear problem caused by long-term friction between ordinary cleaning tools and the surface of the electrostatic suction cup, the present application designs a pressurized conveying component. Through the coordinated use of the pressurized conveying component and the automatic cleaning component, the electrostatic suction cup can be automatically pressurized and sprayed for cleaning. On the one hand, the cleaning effect is improved and the adhesion of oil and impurities is avoided. On the other hand, manual cleaning operations are reduced, avoiding wear and tear caused by manual operations. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0032] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the present application;

[0033] Figure 2 This is a schematic structural diagram of a conveying unit according to an embodiment of the present application;

[0034] Figure 3 This is a schematic diagram of the interior of a conveying unit according to an embodiment of the present application;

[0035] Figure 4 This is a schematic structural diagram of an extrusion portion according to an embodiment of the present application;

[0036] Figure 5 This is a schematic diagram of the interior of an extrusion portion according to an embodiment of the present application;

[0037] Figure 6 This is a schematic structural diagram of a pressurized delivery assembly according to an embodiment of the present application;

[0038] Figure 7 This is a schematic diagram of the connection of a fixed cylinder according to an embodiment of the present application;

[0039] Figure 8 This is a schematic diagram of the internal structure of a fixing cylinder according to an embodiment of the present application;

[0040] Figure 9 This is a schematic structural diagram of an automatic cleaning component according to an embodiment of the present application;

[0041] Figure 10 This is a schematic diagram of the interior of an automatic cleaning component according to an embodiment of the present application;

[0042] Figure 11 This is a schematic diagram of the connection of a rotating sleeve according to an embodiment of the present application.

[0043] Description of Reference Numerals

[0044] In the figure: 1. Fixed base; 2. Conveying unit; 201. Rectangular guide rail housing; 202. Supporting foot; 203. Moving seat; 204. Servo motor A; 205. Threaded rod; 3. Turning unit; 301. Fixed bracket; 302. Turning seat; 303. Servo motor B; 4. Electrostatic chuck; 5. Extrusion unit; 501. Fixed sleeve rod; 502. Moving sleeve rod; 503. Extrusion block A; 504. Control spring; 6. Pressurized conveying assembly; 601. Fixed support bracket; 602. Moving guide rod; 603. Extrusion block B; 60 4. Connecting plate; 605. Fixed tripod; 606. Fixed cylinder; 607. Moving piston; 608. Connecting guide rod; 609. Booster spring; 610. Input pipe; 611. Output pipe; 7. Automatic cleaning component; 701. Connecting bracket; 702. Round shell; 703. Connecting pipe A; 704. Connecting pipe B; 705. Rotating shaft; 706. Blade; 707. Fixed pipe; 708. Rotating sleeve; 709. Duck-type nozzle; 710. Connecting wheel; 711. Rotating wheel; 712. Connecting belt; 713. Ball. DETAILED DESCRIPTION

[0045] In order to enable those skilled in the art to better understand the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of this application.

[0046] It should be noted that the terms "first", "second", etc. in the specification of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present application described here. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0047] In this application, terms such as "upper," "lower," "left," "right," "front," "back," "top," "bottom," "inner," "outer," "center," "vertical," "horizontal," "transverse," and "longitudinal" indicate positions or locations based on the positions or locations shown in the accompanying drawings. These terms are primarily intended to better describe this application and its embodiments and are not intended to limit the devices, elements, or components indicated to having a specific orientation, or to being constructed or operated in a specific orientation.

[0048] Furthermore, some of the above terms may be used to express other meanings besides indicating a position or location. For example, the term "on" may also be used to indicate a dependency or connection in certain circumstances. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0049] Furthermore, the terms "installed," "disposed," "provided with," "connected," "connected," and "socketed" should be interpreted broadly. For example, they can refer to fixed connections, removable connections, or integral structures; mechanical connections or electrical connections; direct connections, indirect connections through an intermediary, or internal communication between two devices, elements, or components. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0050] See also Figure 1 As shown, an electrostatic chuck structure of a wafer, the electrostatic chuck structure of the wafer includes:

[0051] An electrostatic chuck 4 is fixedly mounted on one end of a flip unit 3. The flip unit 3 is fixedly mounted on a conveying unit 2. The conveying unit 2 is used to drive the chuck to move, and the flip unit 3 is used to drive the chuck to flip.

[0052] An extrusion portion 5, wherein the extrusion portion 5 is fixedly disposed on a side of the conveying unit 2;

[0053] A pressurized delivery component 6 is fixedly disposed on the upper surface of the fixed base 1 , one side of the pressurized delivery component 6 is in contact with the extrusion portion 5 , and the pressurized delivery component 6 is used for pressurizing and delivering the cleaning medium;

[0054] An automatic cleaning component 7, which is fixedly disposed on the upper surface of the fixed base 1 and is connected to the pressurized conveying component 6, and is used to automatically release a cleaning medium to clean the electrostatic chuck 4;

[0055] Through the above technical solution, through the setting of the automatic cleaning component 7, the surface of the electrostatic suction cup 4 can be automatically cleaned when the electrostatic suction cup is reset and moved after processing and transportation. In order to further avoid the wear problem caused by long-term friction between ordinary cleaning tools and the surface of the electrostatic suction cup, the present application designs a pressurized conveying component 6. Through the coordinated use of the pressurized conveying component 6 and the automatic cleaning component 7, the electrostatic suction cup 4 can be automatically pressurized and sprayed for cleaning. On the one hand, the cleaning effect is improved and the adhesion of oil and impurities is avoided. On the other hand, manual cleaning operations are reduced, and wear and tear caused by manual operations are avoided.

[0056] For further technical solutions, see Figure 2 and Figure 3 As shown, the conveying unit 2 includes a rectangular guide rail shell 201, a supporting foot 202, a movable seat 203, a servo motor A204 and a threaded rod 205. The supporting feet 202 are fixedly connected to both sides of the bottom surface of the rectangular guide rail shell 201. The supporting feet 202 are fixedly arranged on the upper surface of the fixed base 1. The interior of the rectangular guide rail shell 201 is provided with an inner cavity. The movable seat 203 is slidably connected to the inner cavity of the rectangular guide rail shell 201. The movable seat 203 slides with the outer wall of the rectangular guide rail shell 201. The threaded rod 205 is rotatably connected between the side walls on both sides of the inner cavity of the rectangular guide rail shell 201. The threaded rod 205 passes through the movable seat 203 and is threadedly engaged with the movable seat 203. The rectangular A servo motor A204 is fixedly installed at one end of the guide rail shell 201, and the output shaft end of the servo motor A204 extends into the inner cavity of the rectangular guide rail shell 201. The output end of the servo motor A204 is fixedly connected to the threaded rod 205. Through the present technical solution, the operation of the servo motor A204 can drive the threaded rod 205 to rotate, and the rotation of the threaded rod 205 can drive the movable seat 203 to move, thereby driving the electrostatic suction cup 4 to move, realizing the conveying and moving function of the electrostatic suction cup 4, so that the electrostatic suction cup 4 can fix the wafer and transport the wafer, thereby realizing the transfer processing of the wafer between different workstations, and realizing the function of automated processing;

[0057] The flip unit 3 includes a fixed bracket 301, a flip seat 302 and a servo motor B303. The fixed bracket 301 is fixedly arranged on the upper surface of the movable seat 203. The upper end of the fixed bracket 301 is rotatably connected to the flip seat 302. The upper surface of the flip seat 302 is fixedly provided with an electrostatic suction cup 4. The side wall of the fixed bracket 301 is fixedly installed with a servo motor B303. The output shaft end of the servo motor B303 extends to the rotating shaft of the flip seat 302 and is fixedly connected to the rotating shaft of the flip seat 302. Through the present technical solution, the operation of the servo motor B303 can drive the flip seat 302 to flip, thereby driving the electrostatic suction cup 4 to flip, realizing the flipping function of the electrostatic suction cup 4. When the electrostatic suction cup 4 is moved and transported, it needs to be reset. During the reset movement, the servo motor B303 drives the flip seat 302 to flip, so that the electrostatic suction cup 4 flips to be perpendicular to the ground, thereby facilitating automatic cleaning of the surface.

[0058] For specific technical solutions, please refer to Figure 4 and Figure 5As shown, the extrusion part 5 includes a fixed sleeve rod 501, a movable sleeve rod 502, an extrusion block A503 and a control spring 504. The fixed sleeve rod 501 is fixedly arranged at the side wall position of the movable seat 203. The movable sleeve rod 502 is slidably connected in the inner cavity of the fixed sleeve rod 501. One end of the control spring 504 is fixedly connected to one side of the inner cavity of the fixed sleeve rod 501. The other end of the control spring 504 extends to the inner wall of the movable sleeve rod 502 and is fixedly connected to the movable sleeve rod 502. The extrusion block A503 is fixedly connected to one end of the movable sleeve rod 502. Both sides of the extrusion block A503 are provided with inclined surfaces. Through this technical solution, when the movable seat 203 moves, the extrusion part 5 can be driven to move at the same time, thereby moving the extrusion block A503.

[0059] As a preferred technical solution, please refer to Figure 6 、 Figure 7 and Figure 8 As shown, the booster delivery assembly 6 includes a fixed support frame 601, a movable guide rod 602, an extrusion block B603, a connecting plate 604, a fixed tripod 605, a fixed cylinder 606, a movable piston 607, a connecting guide rod 608 and a booster spring 609. There are at least two of the booster delivery assemblies 6. The fixed support frame 601 is fixedly arranged on the upper surface of the fixed base 1. The upper end of the fixed support frame 601 is slidably connected to the movable guide rod 602. One end of the movable guide rod 602 is fixedly connected to the extrusion block B603. An inclined surface is provided on one side of the extrusion block B603. Through the present technical solution, when the electrostatic suction cup 4 moves, the extrusion block A503 can be driven to move synchronously. The movement of the extrusion block A503 can contact the inclined surface of the extrusion block B603 and continuously push the extrusion block B603 to move, thereby driving the movable guide rod 602 to move.

[0060] The other end of the movable guide rod 602 is fixedly connected to a connecting plate 604, the fixed leg 605 is fixedly arranged on the upper surface of the fixed base 1, the upper end side wall of the fixed leg 605 is fixedly connected to a fixed cylinder 606, a movable piston 607 is slidably connected in the inner cavity of the fixed cylinder 606, and one end of the connecting guide rod 608 is fixedly connected to the side wall of one side of the movable piston 607, the other end of the connecting guide rod 608 passes through the inner cavity side wall of the fixed cylinder 606 and extends to the outside of the wall, and one end of the connecting guide rod 608 is fixed between the connecting plate 604 The side wall of the movable piston 607 is fixedly connected with one end of a pressure-boosting spring 609, and the other end of the pressure-boosting spring 609 is fixedly connected to the side wall of the inner cavity of the fixed cylinder 606. Through the present technical solution, when the extrusion block A503 contacts the extrusion block B603 and continuously pushes the extrusion block B603 to move, the movement of the extrusion block B603 can drive the moving guide rod 602 to move, thereby pushing the connecting plate 604 to move through the continuous movement of the moving guide rod 602, and then driving the connecting guide rod 608 to move, thereby The moving piston 607 moves, causing the moving piston 607 to move to the right in the inner cavity of the fixed cylinder 606. At the same time, the movement of the moving piston 607 will continue to squeeze the boost spring 609, causing the boost spring 609 to continuously contract and accumulate elastic potential energy. When the extrusion block A503 pushes the extrusion block B603 to move to the position of the fixed support 601, the extrusion block B603 cannot continue to move due to the limiting effect of the fixed support 601. At this time, since the inclined surface of the extrusion block A503 fits together with the inclined surface of the extrusion block B603, continuous extrusion will cause the extrusion block A503 to move to the right. The pressing block A503 moves inward, thereby causing the movable sleeve rod 502 to retract into the inner cavity of the fixed sleeve rod 501, causing the extrusion block A503 to continue to move and finally separate from the extrusion block B603. At this time, since the extrusion block B603 has lost the limiting effect of the extrusion block A503 and the booster spring 609 is also at its maximum contraction, the booster spring 609 will immediately release the accumulated elastic potential energy, pushing the movable piston 607 to move rapidly. Through this technical solution, the electrostatic chuck 4 automatically drives the movable piston 607 to move and push back quickly during the movement process;

[0061] An input pipe 610 is fixedly connected to one side of the inner cavity of the fixed cylinder 606, and an input one-way valve is installed on the input pipe 610. An output pipe 611 is fixedly connected to one side of the inner cavity of the fixed cylinder 606, and an output one-way valve is installed on the output pipe 611. One end of the input pipe 610 extends to the cleaning medium, and the cleaning medium is a liquid detergent, and the liquid detergent is isopropyl alcohol. The cleaning medium is a gas. According to the present technical solution, when the movable piston 607 moves to the right in the inner cavity of the fixed cylinder 606, the cleaning medium can be absorbed through the input pipe 610. When the elastic potential energy of the booster spring 609 is released, the cleaning medium is sucked in by the input pipe 610. At the same time, the movable piston 607 can be pushed to move quickly. The quick movement of the movable piston 607 can make the cleaning medium in the inner cavity of the fixed cylinder 606 pressurized and output, and the cleaning medium is output through the output pipe 611. When the output cleaning medium is a liquid detergent, the oil stains on the surface of the electrostatic suction cup 4 can be effectively dissolved and cleaned. When the output cleaning medium is a gas, the particulate impurities on the surface of the electrostatic suction cup 4 can be fully blown clean. The pressurized cleaning makes the cleaning effect better and the cleaning more thorough. It can be seen from the above description that the function of automatic pressurized cleaning can be realized in the process of resetting the electrostatic suction cup 4.

[0062] For further technical solutions, see Figure 9 、 Figure 10 and Figure 11 As shown, the automatic cleaning component 7 includes a connecting bracket 701, a circular shell 702, a connecting pipe A703, a connecting pipe B704, a rotating shaft 705, a blade 706, a fixed pipe 707, a rotating sleeve 708 and a duck-shaped nozzle 709. There are at least two automatic cleaning components 7. The connecting bracket 701 is fixedly arranged on the upper surface of the fixed base 1. The circular shell 702 is fixedly arranged on the side wall of the connecting bracket 701. The rotating shaft 705 is rotatably connected to the center position of the inner cavity of the circular shell 702. The blade 706 is fixedly arranged on the arc wall of the rotating shaft 705. A connecting pipe A703 is fixedly connected to the bottom side of 702, and the connecting pipe A703 is communicated with the inner cavity of the circular shell 702. A connecting pipe B704 is fixedly connected to the upper side of the circular shell 702, and the connecting pipe B704 is communicated with the inner cavity of the circular shell 702. One end of the connecting pipe A703 is fixedly connected to one end of the output pipe 611. Through this technical solution, when the pressurized cleaning medium is transported and moved through the circular shell 702, the blade 706 can be pushed to rotate, and the rotation of the blade 706 can drive the rotating shaft 705 to rotate, realizing the function of automatic rotation;

[0063] The upper end of the connecting bracket 701 is fixedly connected to a fixed tube 707, and a rotating sleeve 708 is sleeved and rotatably provided at one end of the fixed tube 707. A ball 713 is fitted and rotatably provided on the inner wall of the rotating sleeve 708, and the ball 713 is in contact with the surface of the fixed tube 707. A duck-shaped nozzle 709 is fixedly connected to one end of the rotating sleeve 708, and the connecting tube B704 is connected to the fixed tube 707. According to the technical solution, when the cleaning medium with boosted output is delivered to the duck-shaped nozzle 709, it can be pressurized and ejected through the duck-shaped nozzle 709, thereby achieving the function of automatically boosting and spraying cleaning on the surface of the electrostatic chuck;

[0064] The side wall of the connecting bracket 701 is rotatably connected to a rotating wheel 711, and the rotating wheel 711 is coaxially fixedly connected to the rotating shaft 705. A connecting wheel 710 is fixedly provided on the arc wall of the rotating sleeve 708, and a connecting belt 712 is sleeved and connected between the connecting wheel 710 and the rotating wheel 711. Through the present technical solution, when the rotating shaft 705 rotates, the rotation of the rotating shaft 705 can drive the rotating wheel 711 to rotate, so that the rotation of the rotating wheel 711 can drive the connecting belt 712 to move, and then drive the connecting wheel 710 to rotate, so that the rotation of the connecting wheel 710 can drive the rotating sleeve 708 to rotate, and then drive the duck-type nozzle 709 to rotate, so that the automatic rotation function of the duck-type nozzle 709 can be realized, so that while the cleaning medium is pressurized and sprayed, the rotating spray brushing is automatically performed, so that the spray brushing cleaning effect is better and more sufficient, and the oil stains and foreign matter on the surface of the electrostatic suction cup 4 can be effectively cleaned.

[0065] The circuits, electronic components and modules involved are all existing technologies and can be fully implemented by those skilled in the art. Needless to say, the content protected by this application does not involve improvements to software and methods.

[0066] The above description is merely a preferred embodiment of the present application and is not intended to limit the present application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. An electrostatic chuck structure for a wafer, characterized by: The electrostatic chuck structure of the wafer includes: An electrostatic suction cup (4), wherein the electrostatic suction cup (4) is fixedly arranged at one end of the flip unit (3), the flip unit (3) is fixedly arranged at the conveying unit (2), the conveying unit (2) is used to drive the suction cup to transport and move, and the flip unit (3) is used to drive the suction cup to flip; An extrusion portion (5), the extrusion portion (5) being fixedly arranged on a side of the conveying unit (2); A pressurized delivery component (6), the pressurized delivery component (6) is fixedly arranged on the upper surface of the fixed base (1), one side of the pressurized delivery component (6) is in contact with the extrusion portion (5), and the pressurized delivery component (6) is used for pressurized delivery of the cleaning medium; An automatic cleaning component (7), the automatic cleaning component (7) being fixedly arranged on the upper surface of the fixed base (1), the automatic cleaning component (7) being connected to the pressurized conveying component (6), and the automatic cleaning component (7) being used for automatically releasing a cleaning medium to clean the electrostatic chuck (4); The conveying unit (2) comprises a rectangular guide rail shell (201), supporting feet (202), a movable seat (203), a servo motor A (204) and a threaded rod (205), wherein the supporting feet (202) are fixedly connected to both sides of the bottom surface of the rectangular guide rail shell (201), the supporting feet (202) are fixedly arranged on the upper surface of the fixed base (1), an inner cavity is arranged inside the rectangular guide rail shell (201), and the movable seat (203) is slidably connected to the inner cavity of the rectangular guide rail shell (201), and the movable seat (203) is connected to the rectangular guide rail shell. The outer walls of the rectangular guide rail housing (201) are slidably engaged with each other, and a threaded rod (205) is rotatably connected between the side walls on both sides of the inner cavity of the rectangular guide rail housing (201). The threaded rod (205) passes through the movable seat (203) and is threadedly engaged with the movable seat (203). A servo motor A (204) is fixedly installed at one end of the rectangular guide rail housing (201), and the output shaft end of the servo motor A (204) extends into the inner cavity of the rectangular guide rail housing (201). The output end of the servo motor A (204) is fixedly connected to the threaded rod (205); The extrusion portion (5) comprises a fixed sleeve rod (501), a movable sleeve rod (502), an extrusion block A (503) and a control spring (504); the fixed sleeve rod (501) is fixedly arranged at a side wall position of the movable seat (203); the movable sleeve rod (502) is slidably connected in the inner cavity of the fixed sleeve rod (501); one end of the control spring (504) is fixedly connected to one side of the inner cavity of the fixed sleeve rod (501); the other end of the control spring (504) extends to the inner wall of the movable sleeve rod (502) and is fixedly connected to the movable sleeve rod (502); one end of the movable sleeve rod (502) is fixedly connected to the extrusion block A (503); and both sides of the extrusion block A (503) are provided with inclined surfaces.

2. The electrostatic chuck structure for a wafer according to claim 1, wherein: The flip unit (3) comprises a fixed bracket (301), a flip seat (302) and a servo motor B (303), wherein the fixed bracket (301) is fixedly arranged on the upper surface of the movable seat (203), the flip seat (302) is rotatably connected to the upper end of the fixed bracket (301), an electrostatic suction cup (4) is fixedly arranged on the upper surface of the flip seat (302), and the servo motor B (303) is fixedly installed on the side wall of the fixed bracket (301), and the output shaft end of the servo motor B (303) extends to the rotating shaft of the flip seat (302) and is fixedly connected to the rotating shaft of the flip seat (302).

3. The electrostatic chuck structure for a wafer according to claim 1, wherein: The boost delivery assembly (6) comprises a fixed support frame (601), a movable guide rod (602), an extrusion block B (603), a connecting plate (604), a fixed foot frame (605), a fixed cylinder (606), a movable piston (607), a connecting guide rod (608) and a boost spring (609). The boost delivery assembly (6) comprises at least two, the fixed support frame (601) being fixedly arranged on the upper surface of the fixed base (1), the upper end of the fixed support frame (601) being slidably connected to the movable guide rod (602), one end of the movable guide rod (602) being fixedly connected to the extrusion block B (603), and one side of the extrusion block B (603) being provided with an inclined surface.

4. The electrostatic chuck structure for a wafer according to claim 3, wherein: The other end of the movable guide rod (602) is fixedly connected to a connecting plate (604), the fixed leg (605) is fixedly arranged on the upper surface of the fixed base (1), the upper end side wall of the fixed leg (605) is fixedly connected to a fixed cylinder (606), the inner cavity of the fixed cylinder (606) is slidably connected to a movable piston (607), one end of a connecting guide rod (608) is fixedly connected to a side wall of one side of the movable piston (607), the other end of the connecting guide rod (608) passes through the inner cavity side wall of the fixed cylinder (606) and extends to the outside of the wall, one end of the connecting guide rod (608) is fixedly connected to the connecting plate (604), one end of a boosting spring (609) is fixedly connected to the side wall of the movable piston (607), and the other end of the boosting spring (609) is fixedly connected to the inner cavity side wall of the fixed cylinder (606).

5. The electrostatic chuck structure for a wafer according to claim 3, wherein: An input pipe (610) is fixedly connected to one side of the inner cavity of the fixed cylinder (606), and an input one-way valve is installed on the input pipe (610). An output pipe (611) is fixedly connected to one side of the inner cavity of the fixed cylinder (606), and an output one-way valve is installed on the output pipe (611). One end of the input pipe (610) extends to the cleaning medium.

6. The electrostatic chuck structure for a wafer according to claim 1, wherein: The automatic cleaning component (7) comprises a connecting bracket (701), a circular shell (702), a connecting pipe A (703), a connecting pipe B (704), a rotating shaft (705), a blade (706), a fixed pipe (707), a rotating sleeve (708) and a duck-shaped nozzle (709). The automatic cleaning component (7) comprises at least two, the connecting bracket (701) being fixedly arranged on the upper surface of the fixed base (1), the circular shell (702) being fixedly arranged on the side wall of the connecting bracket (701), and the inner cavity of the circular shell (702) A rotating shaft (705) is rotatably connected at the center position, and a blade (706) is fixedly provided on the arc-shaped wall of the rotating shaft (705). A connecting pipe A (703) is fixedly connected to the bottom side of the circular shell (702), and the connecting pipe A (703) is communicated with the inner cavity of the circular shell (702). A connecting pipe B (704) is fixedly connected to the upper side of the circular shell (702), and the connecting pipe B (704) is communicated with the inner cavity of the circular shell (702). One end of the connecting pipe A (703) is fixedly connected to one end of the output pipe (611).

7. The electrostatic chuck structure for a wafer according to claim 6, wherein: The upper end of the connecting bracket (701) is fixedly connected to a fixed tube (707), one end of the fixed tube (707) is sleeved and rotatably provided with a rotating sleeve (708), the inner wall of the rotating sleeve (708) is fitted with a ball (713) for rotation, the ball (713) is in contact with the surface of the fixed tube (707), one end of the rotating sleeve (708) is fixedly connected to a duck-shaped nozzle (709), and the connecting tube B (704) is connected to the fixed tube (707).

8. The electrostatic chuck structure for a wafer according to claim 6, wherein: A rotating wheel (711) is rotatably connected to the side wall of the connecting bracket (701), and the rotating wheel (711) is coaxially fixedly connected to the rotating shaft (705). A connecting wheel (710) is fixedly provided on the arc-shaped wall of the rotating sleeve (708), and a connecting belt (712) is sleeved and connected between the connecting wheel (710) and the rotating wheel (711).

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