Electronic equipment, heat dissipation assembly and heat storage piece of heat dissipation assembly

Abstract

The invention provides electronic equipment, a heat dissipation assembly and a heat storage piece of the heat dissipation assembly. The heat storage sheet comprises a packaging shell and a phase change heat storage material, the overall appearance of the packaging shell is of a sheet-shaped structure, a sealing cavity is defined in the packaging shell, the phase change heat storage material is packaged in the sealing cavity, and the phase change heat storage material can be subjected to phase change after being heated so as to absorb heat. According to the heat storage sheet provided by the embodiment of the invention, the heat can be stored in the phase change heat storage material by utilizing the heat absorption phase change characteristic of the phase change heat storage material, so that the heat dissipation of a heating device is realized, the transient heat dissipation capability of the electronic equipment is improved, and the temperature rise rate of the electronic equipment in the use process is reduced.

Description

Technical Field

[0001] This application relates to the technical field of heat dissipation of electronic devices, and specifically relates to an electronic device, a heat dissipation component and a heat storage sheet thereof. Background Art

[0002] As mobile phones become thinner and lighter, the problem of heat generation in mobile phones becomes more prominent. Currently, the heat dissipation of mobile phones generally adopts the heat dissipation method of graphite sheets. Since graphite sheets have single-phase heat conduction, they can quickly achieve uniform temperature. However, after mobile phones become thinner and lighter, the heat sink of mobile phones decreases, and the temperature rise rate of mobile phones will accelerate during actual use. If the transient heat dissipation performance of a mobile phone is poor, users will feel the heat of the mobile phone faster. Therefore, how to solve the transient heat dissipation ability of electronic devices has become an urgent problem to be solved. Summary of the Invention

[0003] In a first aspect of an embodiment of this application, a heat storage sheet is provided. The heat storage sheet includes a packaging shell and a phase change heat storage material. The overall shape of the packaging shell is a sheet structure, and a sealed cavity is formed inside it. The phase change heat storage material is encapsulated in the sealed cavity, and the phase change heat storage material can undergo a phase change when heated, thereby absorbing heat.

[0004] In a second aspect, an embodiment of this application provides a heat dissipation component. The heat dissipation component includes a heat source device and the heat storage sheet in the above embodiment. The heat storage sheet is attached to the heat source device for dissipating heat from the heat source device.

[0005] In a third aspect, an embodiment of this application provides an electronic device. The electronic device includes a housing and the heat dissipation component in the above embodiment. The heat storage sheets of the heat dissipation component are respectively attached to the housing and the heat source device.

[0006] The heat storage sheet provided by the embodiment of this application can store heat in the phase change heat storage material by using the heat absorption phase change characteristic of the phase change heat storage material, thereby realizing heat dissipation of the heat generating device, improving the transient heat dissipation ability of the electronic device, and thus reducing the temperature rise rate during the use of the electronic device. Description of the Drawings

[0007] In order to more clearly illustrate the technical solutions in the embodiments of this application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of this application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0008] Figure 1 Figure 1 It is a schematic diagram of the overall structure of an embodiment of the heat storage sheet for an electronic device of this application;

[0009] Figure 2 is Figure 1 Schematic cross-sectional structure diagram of the heat storage sheet along A-A in the embodiment;

[0010] Figure 3 Schematic overall structure diagram of an embodiment of the electronic device of the present application;

[0011] Figure 4 is Figure 3 Schematic cross-sectional structure diagram of the electronic device along line B-B in the embodiment;

[0012] Figure 5 Schematic cross-sectional structure diagram of another embodiment of the electronic device of the present application;

[0013] Figure 6 Schematic cross-sectional structure diagram of still another embodiment of the electronic device of the present application;

[0014] Figure 7 Schematic cross-sectional structure diagram of yet another embodiment of the electronic device of the present application;

[0015] Figure 8 Schematic cross-sectional structure diagram of still another embodiment of the electronic device of the present application;

[0016] Figure 9 is Figure 8 Perspective schematic diagram of the heat dissipation part structure of the electronic device in the embodiment;

[0017] Figure 10 Schematic block diagram of the structural composition of an embodiment of the electronic device of the present application. Detailed implementation manners

[0018] The present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be specifically noted that the following embodiments are only used to illustrate the present application, but do not limit the scope of the present application. Similarly, the following embodiments are only partial embodiments of the present application rather than all embodiments. All other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present application.

[0019] The terms "first", "second", and "third" in the embodiments of the present application are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second", and "third" may explicitly or implicitly include at least one of such features. In the description of the present application, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined. All directional indications (such as up, down, left, right, front, back...) in the embodiments of the present application are only used to explain the relative positional relationship and movement conditions between components in a specific posture (as shown in the drawings). If the specific posture changes, the directional indications will also change accordingly. The terms "include" and "have" in the embodiments of the present application and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally further include unlisted steps or units, or may optionally further include other steps or components inherent to these processes, methods, products, or devices.

[0020] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in connection with the embodiments can be included in at least one embodiment of the present application. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive of other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0021] As used herein, "electronic device" (or simply "terminal") includes, but is not limited to, devices configured to receive / transmit communication signals via wired connections (such as via the Public Switched Telephone Network (PSTN), Digital Subscriber Line (DSL), digital cable, direct cable connection, and / or another data connection / network) and / or via wireless interfaces (such as for cellular networks, Wireless Local Area Networks (WLAN), digital television networks such as DVB-H networks, satellite networks, AM-FM broadcast transmitters, and / or another communication terminal). A communication terminal configured to communicate via a wireless interface may be referred to as a "wireless communication terminal", "wireless terminal", or "mobile terminal". Examples of mobile terminals include, but are not limited to, satellite or cellular telephones; personal communication system (PCS) terminals that may combine cellular radiotelephone with data processing, facsimile, and data communication capabilities; PDAs that may include radiotelephones, pagers, Internet / intranet access, web browsers, notepads, calendars, and / or Global Positioning System (GPS) receivers; and conventional laptop and / or palmtop receivers or other electronic devices including radiotelephone transceivers. A mobile phone is an electronic device configured with a cellular communication module.

[0022] In the conventional technical solution, a heat dissipation method that combines a graphite sheet and a VC liquid-cooled heat pipe is adopted. Since the graphite sheet has single-phase heat conduction and the VC heat pipe has two-phase heat conduction, the advantages of these two heat dissipation materials are both high thermal conductivity, which can quickly achieve uniform temperature. However, after the mobile phone is thinned and lightened, the heat sink of the mobile phone is reduced, and the temperature rise rate of the mobile phone will accelerate during actual use. If the transient heat dissipation performance of the heat dissipation device is poor, users will feel the heat of the mobile phone faster. Therefore, how to solve the transient heat dissipation ability of electronic devices has become an urgent problem to be solved.

[0023] In view of this, the embodiment of the present application first provides a heat storage sheet. Please refer to Figure 1 and Figure 2 , Figure 1 which is a schematic diagram of the overall structure of an embodiment of the heat storage sheet for an electronic device of the present application, Figure 2 and Figure 1 is a schematic cross-sectional structure of the heat storage sheet along A-A in the embodiment; it should be noted that the electronic device in the present application may include electronic devices with heat source devices such as mobile phones, tablet computers, laptop computers, wearable devices, etc. The heat storage sheet 100 for an electronic device includes a packaging shell 110 and a phase change heat storage material 120.

[0024] Specifically, the overall shape of the packaging shell 110 is a sheet structure, and the specific shape is not limited, and it can be a rectangle or an irregular shape, etc. A sealed cavity is formed by enclosing the inside of the packaging shell 110, and the phase change heat storage material 120 is encapsulated in the sealed cavity. The phase change heat storage material 120 can undergo a phase change when heated, and then absorb heat. For example, when heated by an external heat source, the phase change heat storage material 120 absorbs heat and changes from a solid state to a liquid state. During this phase change process, the heat storage material absorbs heat and the temperature does not rise, thereby reducing the temperature during the transient process.

[0025] Optionally, the phase change heat storage material 120 includes an organic phase change heat storage material or an inorganic phase change heat storage material. Among them, the organic phase change heat storage material may include any one or more of paraffin waxes or fatty acid compounds, etc. The inorganic phase change heat storage material includes any one or more of crystalline hydrated salts or molten salt compounds, etc.

[0026] Optionally, the material of the packaging shell 110 may include materials such as metals, metal alloys, metal oxides, polyimide resins, etc. that do not chemically react with the phase change heat storage material 120 and have a certain strength. For example, copper, aluminum alloy, etc.

[0027] The heat storage sheet provided by the embodiment of the present application can store heat in the phase change heat storage material by utilizing the endothermic phase change characteristic of the phase change heat storage material, thereby realizing the heat dissipation of the heating device, improving the transient heat dissipation ability of the electronic device, and reducing the temperature rise rate during the use of the electronic device.

[0028] In addition, the embodiment of the present application further provides a heat dissipation assembly, which includes a heat source device and a heat storage sheet. The heat storage sheet is attached to the heat source device for dissipating heat from the heat source device. For the specific structure of the heat dissipation assembly, please refer to the detailed description in the subsequent embodiment of the electronic device.

[0029] The embodiment of the present application further provides an electronic device. Please refer to Figure 3 and Figure 4 , Figure 3 which is a schematic diagram of the overall structure of an embodiment of the electronic device of the present application. Figure 4 It is Figure 3 a schematic cross-sectional structure diagram of the electronic device along the line B-B in the embodiment. Among them, the electronic device includes a housing 20 and a heat dissipation assembly 10. The heat storage sheets 100 of the heat dissipation assembly 10 are respectively attached to the housing 20 and the heat source device 200. Among them, the detailed structural features of the heat storage sheet 100 can be referred to the description of the foregoing embodiment.

[0030] Optionally, the housing 20 in this embodiment may include a middle frame 21 and a rear cover 22. The middle frame 21 may further include a middle plate 211 and side frames 212 of an integral structure. The heat source device 200 in this embodiment may include at least one of a display screen 210 and a control circuit board 220 (on which devices such as a processor 221 and a shielding cover 222 are provided). The control circuit board 220 in this embodiment is used as the main heat source device and is connected to the rear cover 22 (i.e., the battery cover) through the heat storage sheet 100.

[0031] The 30 marked in the figure represents a battery. Among them, the battery 30 and the heat dissipation assembly 10 are both disposed in the accommodation cavity jointly enclosed by the middle plate 211, the side frames 212, and the rear cover 22.

[0032] Please refer to Figure 5 , Figure 5It is a schematic cross-sectional structure diagram of another embodiment of the electronic device of the present application. Among them, the electronic device in this embodiment may also include a housing 20 and a heat dissipation component 10. The heat storage fins 100 of the heat dissipation component 10 are respectively attached to the housing 20 and the heat source device 200. Optionally, the housing 20 in this embodiment may include a middle frame 21 and a rear cover 22. The middle frame 21 may further include a middle plate 211 and a side frame 212 of an integrated structure. The heat source device 200 in this embodiment may be a display screen 210 and a control circuit board 220 (on which devices such as a processor 221 and a shielding cover 222 are provided). The control circuit board 220 in this embodiment is connected to the rear cover 22 (i.e., the battery cover) through the heat storage fin 100, and the display screen 210 can be attached to the middle plate 211 through the heat storage fin 100.

[0033] Among them, 30 marked in the figure represents a battery. Among them, the battery 30 and the control circuit board 220 are both arranged in the accommodation cavity jointly enclosed by the middle plate 211, the side frame 212 and the rear cover 22; the display screen 210 is thermally conductively connected to the side of the middle plate 211 facing away from the battery through the heat storage fin 100.

[0034] Please refer to Figure 6 , Figure 6 It is a schematic cross-sectional structure diagram of still another embodiment of the electronic device of the present application. The electronic device in this embodiment may also include a housing 20 and a heat dissipation component 10. The heat storage fins 100 of the heat dissipation component 10 are respectively attached to the housing 20 and the heat source device 200. The housing 20 in this embodiment may include a middle frame 21 and a rear cover 22. The middle frame 21 may further include a middle plate 211 and a side frame 212 of an integrated structure. The heat source device 200 in this embodiment may be a display screen 210 and a control circuit board 220 (on which devices such as a processor 221 and a shielding cover 222 are provided).

[0035] Different from the foregoing embodiment, the heat dissipation component 10 in this embodiment further includes a heat conductive sheet 300, and the heat conductive sheet 300 is arranged between the heat source device 200 and the heat storage fin 100. Specifically, heat conductive sheets 300 may be arranged between the display screen 210 and the heat storage fin 100 and between the control circuit board 220 and the heat storage fin 100. Among them, the heat conductive sheet 300 may be a graphite sheet.

[0036] Please refer to Figures 7 to 9 , Figure 7 It is a schematic cross-sectional structure diagram of yet another embodiment of the electronic device of the present application, Figure 8 It is a schematic cross-sectional structure diagram of still another embodiment of the electronic device of the present application, Figure 9 It is Figure 8Perspective schematic diagram of the heat dissipation part structure of the electronic device in the embodiment; Different from the foregoing embodiments, the heat dissipation component 10 in this embodiment further includes a VC heat pipe 400, and the VC heat pipe 400 is disposed between the heat storage fin 100 and the housing. Specifically, it may be, for example, Figure 7 setting the VC heat pipe 400 between the heat storage fin 100 and the middle plate 211 as in the embodiment, or it may be, for example, Figure 8 also setting the VC heat pipe 400 between the heat storage fin 100 and the rear cover 22 at the same time as in

[0037] Among them, the VC heat pipe 400 is a heat equalizing structure with a heat conducting medium (such as water, oil, etc.) and a capillary structure sealed inside the shell. The detailed structure of the VC heat pipe 400 is within the understanding of those skilled in the art and will not be elaborated here.

[0038] On one side of the display screen 210, by adding a phase change heat storage fin, when the display screen 210 works, the heat can be quickly transferred to the middle frame and the VC heat pipe 400, and the heat pipe 400 undergoes a solid-liquid phase change to quickly spread the heat. The phase change heat storage fin 100 and the VC heat pipe 400 are in contact design. After the heat is transferred to the phase change heat storage fin 100 through the VC heat pipe 400 and the temperature reaches the phase change temperature point, the heat storage material sealed inside the phase change heat storage fin absorbs heat and undergoes a solid-liquid phase change. During the phase change process, the heat storage material continuously absorbs heat and the temperature does not rise until all the heat storage material undergoes a phase change and becomes liquid.

[0039] On one side of the rear cover 22, by setting the phase change heat storage fin 100, the VC heat pipe 400 and the heat conducting sheet 300, the heat in this direction can be absorbed, the heat transfer rate of the rear shell can be reduced, and the temperature experience of the rear shell can be improved.

[0040] In the electronic device of the embodiment of the present application, by setting a heat dissipation structure in cooperation with a phase change heat storage fin, a VC heat pipe and a heat conducting sheet, the temperature rise rate during the use of the electronic device can be effectively reduced, and the heat experience during the short-term use of the electronic device is greatly improved.

[0041] Please refer to Figure 10 , Figure 10It is a schematic block diagram of the structural composition of an embodiment of the electronic device of the present application. The electronic device can be a mobile phone, a tablet computer, a laptop computer, a wearable device, etc. In this embodiment, the mobile phone is taken as an example. The structure of the electronic device may include an RF circuit 910, a memory 920, an input unit 930, a display unit 940 (which can be the display screen 210 in the above embodiment), a sensor 950, an audio circuit 960, a wifi module 970, a processor 980 (which can be the processor 221 in the foregoing embodiment), and a power supply 990 (which can be the battery 30 in the foregoing embodiment), etc. Among them, the RF circuit 910, the memory 920, the input unit 930, the display unit 940, the sensor 950, the audio circuit 960, and the wifi module 970 are respectively connected to the processor 980; the power supply 990 is used to supply electrical energy to the entire electronic device 10.

[0042] Specifically, the RF circuit 910 is used to receive and transmit signals; the memory 920 is used to store data instruction information; the input unit 930 is used to input information, and specifically may include a touch panel 931 and other input devices 932 such as operation buttons; the display unit 940 may include a display panel 941, etc.; the sensor 950 includes an infrared sensor, a laser sensor, etc., and is used to detect user proximity signals, distance signals, etc.; the speaker 961 and the microphone (or microphone) 962 are connected to the processor 980 through the audio circuit 960 and are used to receive and transmit sound signals; the wifi module 970 is used to receive and transmit wifi signals, and the processor 980 is used to process the data information of the electronic device. For the specific structural features of the electronic device, please refer to the relevant descriptions in the above embodiments and will not be introduced in detail here.

[0043] In the electronic device of this embodiment, by setting a heat dissipation structure in cooperation with a phase change heat storage sheet, a VC heat sink, and a heat conduction sheet, the temperature rise rate during the use of the electronic device can be effectively reduced, and the heat experience during the short-term use of the electronic device is greatly improved.

[0044] The above are only some embodiments of the present application, and thus do not limit the protection scope of the present application. Any equivalent device or equivalent process transformation made using the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present application.

Claims

1. A heat storage sheet, characterized in that: The heat storage sheet includes a packaging shell and a phase change heat storage material. The overall shape of the packaging shell is a sheet structure, and a sealed cavity is formed inside the packaging shell. The phase change heat storage material is packaged in the sealed cavity. The phase change heat storage material can undergo phase change after being heated, thereby absorbing heat.

2. The heat storage sheet according to claim 1, characterized in that: The phase change heat storage material includes an organic phase change heat storage material or an inorganic phase change heat storage material.

3. The heat storage sheet according to claim 2, characterized in that: The organic phase change heat storage material includes any one or more of paraffin or fatty acid compounds.

4. The heat storage sheet according to claim 2, characterized in that: The inorganic phase change heat storage material includes any one or more of crystalline hydrated salts or molten salt compounds.

5. The heat storage sheet according to claim 1, characterized in that: The material of the packaging shell includes any one of metal, metal alloy, metal oxide and polyimide resin.

6. A heat dissipation component, characterized in that: The heat dissipation assembly includes a heat source device and the heat storage sheet according to any one of claims 1 to 5, wherein the heat storage sheet is arranged in close contact with the heat source device to dissipate heat from the heat source device.

7. An electronic device, characterized in that: The electronic device comprises a housing and the heat dissipation assembly according to claim 6, wherein the heat storage sheet of the heat dissipation assembly is respectively attached to the housing and the heat source device.

8. The electronic device according to claim 7, characterized in that: The heat dissipation assembly further includes a heat conductive sheet, which is arranged between the heat source device and the heat storage sheet.

9. The electronic device according to claim 8, characterized in that: The heat dissipation assembly further includes a VC heat spreader, which is disposed between the heat storage sheet and the shell.

10. The electronic device according to claim 7, characterized in that: The heat source device includes at least one of a display screen and a control circuit board.

Images