Light-emitting device, manufacturing method of display panel and display panel

Abstract

The invention belongs to the field of display, and particularly relates to a light-emitting device, a manufacturing method of a display panel and the display panel, the light-emitting device comprises a light-emitting diode, a cylinder part and a supporting part, and the light-emitting diode is arranged on the end face of the first end of the cylinder part; the orthographic projection of the light-emitting diode on the end face of the first end of the cylinder part is located in the end face of the first end of the cylinder part or coincides with the end face of the first end of the cylinder part, and the supporting part is arranged on the end face of the second end of the cylinder part. At least part of the orthographic projection of the supporting part on the end face of the second end of the cylinder part is located outside the end face of the second end of the cylinder part. When the light-emitting device is used for manufacturing the display panel, light-emitting devices of different sizes can be manufactured and positioned to different positions on the transfer substrate, and the light-emitting devices of different sizes can comprise light-emitting diodes of different light-emitting colors, so that simultaneous transfer of the light-emitting diodes of different light-emitting colors can be realized, and the production efficiency of the display panel is improved.

Description

Technical Field

[0001] This application belongs to the field of displays, and particularly relates to a light-emitting device, a method for manufacturing a display panel, and a display panel. Background Art

[0002] Mini / Micro LED display technology is a new generation of display technology, which has higher optoelectronic efficiency, higher brightness, higher contrast, and lower power consumption compared with the existing liquid crystal display technology. Moreover, it can also achieve flexible display by combining with a flexible substrate.

[0003] When manufacturing a Mini / Micro LED display panel, a mass transfer technology is required to transfer millions to tens of millions of Mini / Micro LEDs from a growth substrate to a driving substrate. The Mini / Micro LED display panel includes red Mini / Micro LEDs, green Mini / Micro LEDs, and blue Mini / Micro LEDs to achieve color (RGB) display.

[0004] In the prior art, Mini / Micro LEDs of different emission colors are fabricated using different semiconductor materials and different manufacturing processes, and Mini / Micro LEDs of different emission colors need to be transferred separately, which not only has a cumbersome process and takes a long time, but also reduces the overall production efficiency. Summary of the Invention

[0005] The purpose of this application is to provide a light-emitting device, a method for manufacturing a display panel, and a display panel to simultaneously transfer Mini / Micro LEDs of different emission colors, thereby improving the production efficiency of the display panel.

[0006] To achieve the above purpose, this application provides a light-emitting device, including a light-emitting diode, and the light-emitting device further includes:

[0007] A columnar part, the columnar part includes opposite first and second ends, the light-emitting diode is disposed on an end surface of the first end of the columnar part, and a positive projection of the light-emitting diode on the end surface of the first end of the columnar part is located within the end surface of the first end of the columnar part, or the positive projection of the light-emitting diode on the end surface of the first end of the columnar part coincides with the end surface of the first end of the columnar part;

[0008] A support part, the support part is disposed on an end surface of the second end of the columnar part, and at least a part of a positive projection of the support part on the end surface of the second end of the columnar part is located outside the end surface of the second end of the columnar part.

[0009] Optionally, the columnar part includes a cylinder, an elliptical cylinder, or a prism.

[0010] Optionally, the light-emitting diode includes a first electrode, a first semiconductor layer, and a second semiconductor layer stacked in sequence. The light-emitting diode further includes a second electrode, and the second electrode includes a first conductor portion. The first conductor portion connects the second semiconductor layer and the column portion. The orthographic projection of the first electrode on the end face of the first end of the column portion is located in the central region of the orthographic projection of the first conductor portion on the end face of the first end of the column portion.

[0011] Optionally, the second electrode further includes a second conductor portion and a conductive connection portion. The second conductor portion surrounds the first electrode, and the conductive connection portion connects the first conductor portion and the second conductor portion. The light-emitting diode further includes a first insulating layer and a light-emitting layer. The light-emitting layer is formed between the first semiconductor layer and the second semiconductor layer. The first insulating layer at least surrounds the first electrode, the first semiconductor layer, and the light-emitting layer, so that the first electrode, the first semiconductor layer, and the light-emitting layer are all insulated from the second electrode.

[0012] Optionally, the manufacturing material of the column portion includes photoresist or the column portion and the light-emitting diode are adhesively connected through the photoresist. The photoresist is an adhesive that can be debonded under light illumination conditions.

[0013] The present application further provides a method for manufacturing a display panel, including:

[0014] A plurality of the light-emitting devices, the plurality of the light-emitting devices including a first light-emitting device, a second light-emitting device, and a third light-emitting device. The light-emitting colors of the first light-emitting device, the second light-emitting device, and the third light-emitting device and the cross-sectional size of the column portion are different;

[0015] Providing a transfer substrate, the transfer substrate including a plurality of openings, the plurality of openings including a first opening, a second opening, and a third opening. The size of the first opening matches the cross-sectional size of the column portion of the first light-emitting device, the size of the second opening matches the cross-sectional size of the column portion of the second light-emitting device, and the size of the third opening matches the cross-sectional size of the column portion of the third light-emitting device;

[0016] Transferring the plurality of the light-emitting devices onto the transfer substrate, inserting the column portion of the light-emitting device into the corresponding opening, and hanging the light-emitting device on the transfer substrate through the support portion;

[0017] Transferring the light-emitting device onto the driving substrate through the transfer substrate, and binding the light-emitting diode to the binding end of the driving substrate;

[0018] Peeling the light-emitting diode from the column portion.

[0019] Optionally, the transfer substrate is tilted so that the light-emitting device can roll or slide on the transfer substrate.

[0020] Optionally, during the process of transferring a plurality of the light-emitting devices onto the transfer substrate such that the columnar portions of the light-emitting devices are inserted into the corresponding openings, the transfer substrate is vibrated.

[0021] Optionally, the material for making the columnar portion is photodecomposable glue, or the columnar portion and the light-emitting diode are adhesively connected through the photodecomposable glue, and the method for peeling the light-emitting diode from the columnar portion includes de-bonding the columnar portion and the light-emitting diode by light irradiation.

[0022] The present application also provides a display panel manufactured by the manufacturing method of the display panel described above.

[0023] The light-emitting device, the manufacturing method of the display panel, and the display panel disclosed in the present application have the following beneficial effects:

[0024] In the present application, the light-emitting device includes a light-emitting diode, a columnar portion, and a supporting portion. The light-emitting diode is disposed on the end face of the first end of the columnar portion, and the orthographic projection of the light-emitting diode on the end face of the first end of the columnar portion is located within the end face of the first end of the columnar portion, or the orthographic projection of the light-emitting diode on the end face of the first end of the columnar portion coincides with the end face of the first end of the columnar portion. The supporting portion is disposed on the end face of the second end of the columnar portion, and at least a part of the orthographic projection of the supporting portion on the end face of the second end of the columnar portion is located outside the end face of the second end of the columnar portion. When the light-emitting device is used to manufacture a display panel, light-emitting devices of different sizes can be manufactured and positioned at different positions on the transfer substrate. The light-emitting devices of different sizes may include light-emitting diodes of different light-emitting colors. Therefore, simultaneous transfer of light-emitting diodes of different light-emitting colors can be achieved, thereby improving the production efficiency of the display panel.

[0025] Other features and advantages of the present application will become apparent from the following detailed description, or will be partly learned through the practice of the present application.

[0026] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The drawings herein are incorporated into the specification and form a part of the specification, showing embodiments consistent with the present application, and are used together with the specification to explain the principles of the present application. Obviously, the drawings in the following description are only some embodiments of the present application, and those of ordinary skill in the art can obtain other drawings without creative efforts based on these drawings.

[0028] Figure 1 It is a schematic cross-sectional view of the light-emitting device in the first embodiment of the present application.

[0029] Figure 2 It is a schematic bottom view of the light-emitting device in the first embodiment of the present application.

[0030] Figure 3 It is a schematic plan view of the transfer substrate in the first embodiment of the present application.

[0031] Figure 4 It is a schematic cross-sectional view of the light-emitting diode in the first embodiment of the present application.

[0032] Figure 5 It is a schematic structural view of the driving substrate of the display panel in the first embodiment of the present application.

[0033] Figure 6 It is a schematic view of the second conductor portion surrounding the first electrode in the first embodiment of the present application.

[0034] Figure 7 It is a schematic flow chart of the method for manufacturing the display panel in the second embodiment of the present application.

[0035] Figure 8 It is a schematic view of the light-emitting device transferred onto the transfer substrate in the second embodiment of the present application.

[0036] Figure 9 It is a schematic view of the light-emitting device inserted into the opening of the transfer substrate in the second embodiment of the present application.

[0037] Figure 10 It is a schematic view of the bonding of the light-emitting diode and the driving substrate in the second embodiment of the present application.

[0038] Figure 11 It is a schematic view of the light-emitting diode peeled off from the columnar portion in the second embodiment of the present application.

[0039] Figure 12 It is a schematic structural view of the display panel in the third embodiment of the present application.

[0040] Explanation of reference numerals:

[0041] 100, light-emitting device; 100a, first light-emitting device; 100b, second light-emitting device; 100c, third light-emitting device; 110, light-emitting diode; 111, first electrode; 112, first semiconductor layer; 113, second semiconductor layer; 114, second electrode; 1141, first conductor portion; 1142, second conductor portion; 1143, conductive connection portion; 115, light-emitting layer; 116, first insulating layer; 117, second insulating layer; 120, columnar portion; 130, support portion;

[0042] 200. Transfer substrate; 210a. First opening; 210b. Second opening; 210c. Third opening;

[0043] 300. Driving substrate; 310. Substrate; 320. Bonding end; 321. First connection electrode; 322. Second connection electrode. Detailed implementation manners

[0044] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in various forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this application will be more complete and comprehensive, and will fully convey the concept of the example embodiments to those skilled in the art.

[0045] In addition, the described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of the embodiments of this application. However, those skilled in the art will realize that the technical solutions of this application can be practiced without one or more of the specific details, or other methods, components, devices, steps, etc. can be adopted. In other cases, well-known methods, devices, implementations, or operations are not shown or described in detail to avoid obscuring aspects of this application.

[0046] The present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted here that the technical features involved in the various embodiments of the present application described below can be combined with each other as long as they do not conflict with each other. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present application and should not be construed as limiting the present application.

[0047] Embodiment 1

[0048] See Figure 1 and Figure 2 As shown, in this embodiment, the light-emitting device 100 includes a light-emitting diode 110, a columnar portion 120, and a support portion 130. The light-emitting diode 110 includes a mini light-emitting diode (Mini / Micro LED), and the size of the mini light-emitting diode is less than 200 micrometers.

[0049] The columnar part 120 includes opposite first and second ends. The light-emitting diode 110 is disposed on the end face of the first end of the columnar part 120. The orthographic projection of the light-emitting diode 110 on the end face of the first end of the columnar part 120 is located within the end face of the first end of the columnar part 120, or the orthographic projection of the light-emitting diode 110 on the end face of the first end of the columnar part 120 coincides with the end face of the first end of the columnar part 120. That is to say, the light-emitting diode 110 does not exceed the edge of the columnar part 120. It should be noted that after the light-emitting device 100 is transferred onto the driving substrate 300, the light-emitting diode 110 can be peeled off from the columnar part 120, and the driving substrate 300 and the light-emitting diode 110 form a display panel.

[0050] The support part 130 is disposed on the end face of the second end of the columnar part 120. At least part of the orthographic projection of the support part 130 on the end face of the second end of the columnar part 120 is located outside the end face of the second end of the columnar part 120. That is to say, the support part 130 protrudes relative to the edge of the columnar part 120.

[0051] The display panel includes the light-emitting diode 110. When the light-emitting device 100 is used to manufacture the display panel, light-emitting devices 100 of different sizes can be manufactured. The light-emitting colors of the light-emitting diodes 110 of the light-emitting devices 100 of different sizes are different. The transfer substrate 200 includes openings of different sizes that match the columnar part 120. Therefore, light-emitting devices 100 of different sizes can be positioned at different positions on the transfer substrate 200, so that simultaneous transfer of light-emitting diodes 110 of different light-emitting colors can be achieved. When the light-emitting device 100 is used to manufacture the display panel, the specific method of transferring the light-emitting diode 110 onto the driving substrate 300 to form the display panel will be described in detail below.

[0052] In this embodiment, the light-emitting device 100 includes a light-emitting diode 110, a columnar part 120, and a support part 130. The light-emitting diode 110 is disposed on the end face of the first end of the columnar part 120. The orthographic projection of the light-emitting diode 110 on the end face of the first end of the columnar part 120 is located within the end face of the first end of the columnar part 120, or the orthographic projection of the light-emitting diode 110 on the end face of the first end of the columnar part 120 coincides with the end face of the first end of the columnar part 120. The support part 130 is disposed on the end face of the second end of the columnar part 120. At least part of the orthographic projection of the support part 130 on the end face of the second end of the columnar part 120 is located outside the end face of the second end of the columnar part 120. When the light-emitting device 100 is used to manufacture the display panel, light-emitting devices 100 of different sizes can be manufactured and positioned at different positions on the transfer substrate 200. The light-emitting devices 100 of different sizes can include light-emitting diodes 110 of different light-emitting colors. Therefore, simultaneous transfer of light-emitting diodes 110 of different light-emitting colors can be achieved, thereby improving the production efficiency of the display panel.

[0053] In some embodiments, the column part 120 includes a cylinder, an elliptic cylinder or a prism, and the prism includes a quadrangular prism, a pentagonal prism, a hexagonal prism, etc. The orthographic projection of the light-emitting diode 110 on the end face of the first end of the column part 120 may be circular or rectangular, etc., and the specific shape is not limited.

[0054] When the column part 120 is a cylinder, the orthographic projection of the light-emitting diode 110 on the end face of the first end of the column part 120 is circular. With such a design, the column part 120 can be more easily inserted into the opening of the transfer substrate 200, and it is not necessary to consider the circumferential alignment of the column part 120 and the opening on the transfer substrate 200, reducing the difficulty of transferring the light-emitting diode 110. When the column part 120 is an elliptic cylinder or a prism, the orthographic projection of the light-emitting diode 110 on the end face of the first end of the column part 120 may be rectangular. With such a design, the light-emitting diodes 110 can be arranged neatly along the row direction and the column direction on the display panel, avoiding inaccurate positioning of the light-emitting diodes 110 from affecting the pixel uniformity of the display panel.

[0055] In some embodiments, the light-emitting diode 110 includes a first electrode 111, a first semiconductor layer 112 and a second semiconductor layer 113 which are stacked in sequence. Among the first semiconductor layer 112 and the second semiconductor layer 113: one is an N-type doped semiconductor and the other is a P-type doped semiconductor. The light-emitting diode 110 further includes a second electrode 114, and the second electrode 114 includes a first conductor part 1141, and the first conductor part 1141 connects the second semiconductor layer 113 and the column part 120. The light-emitting diode 110 can be peeled off from the column part 120, that is, the second electrode 114 can be peeled off from the column part 120.

[0056] The orthographic projection of the first electrode 111 on the end face of the first end of the column part 120 is located in the central area of the orthographic projection of the first conductor part 1141 on the end face of the first end of the column part 120. That is to say, the edge area of the first conductor part 1141 surrounds the first electrode 111, as Figure 4 shown. For example, both the first electrode 111 and the first conductor part 1141 are cylinders, and the outer diameter of the first conductor part 1141 is greater than the outer diameter of the first electrode 111.

[0057] See Figure 5 shown, the display panel includes a driving substrate 300, and the driving substrate 300 includes a substrate 310, a driving circuit layer and a bonding end 320. The driving circuit layer and the bonding end 320 are formed on the substrate 310 in sequence. The bonding end 320 includes a first connection electrode 321 and a second connection electrode 322 which are arranged at intervals. As Figure 5 shown, the first connection electrode 321 is connected to the first electrode 111, and the second connection electrode 322 is connected to the edge area of the first conductor part 1141.

[0058] The edge area of the first conductor portion 1141 surrounds the first electrode 111. When the light-emitting diode 110 is bonded to the driving substrate 300, only by aligning the first electrode 111 with the first connection electrode 321 can it be ensured that the second connection electrode 322 and the first conductor portion 1141 can be bonded, without worrying about the circumferential misalignment between the second connection electrode 322 and the first conductor portion 1141.

[0059] It should be noted that the light-emitting diode 110 may further include a light-emitting layer 115 and a first insulating layer 116. The light-emitting layer 115 is formed between the first semiconductor layer 112 and the second semiconductor layer 113. The first insulating layer 116 is disposed at least to surround the first electrode 111, the first semiconductor layer 112, and the light-emitting layer 115, so that the first electrode 111, the first semiconductor layer 112, and the light-emitting layer 115 are all insulated from the second electrode 114.

[0060] In some embodiments, the second connection electrode 322 may be disposed to surround the first connection electrode 321.

[0061] Since the distance between the first electrode 111 and the substrate 310 is relatively closer, and the distance between the first conductor portion 1141 and the substrate 310 is relatively farther, the height of the second connection electrode 322 needs to be greater than the height of the first connection electrode 321 to facilitate the bonding between the second connection electrode 322 and the first conductor portion 1141. The second connection electrode 322 is disposed to surround the first connection electrode 321, and the second connection electrode 322 can be used as a positioning structure to align the first electrode 111 with the first connection electrode 321.

[0062] In some embodiments, the second electrode 114 further includes a second conductor portion 1142 and a conductive connection portion 1143. The second conductor portion 1142 is disposed to surround the first electrode 111, and the conductive connection portion 1143 connects the first conductor portion 1141 and the second conductor portion 1142, as Figure 6 shown. It should be noted that a second insulating layer 117 may further be formed on the outer surface of the second electrode 114 to protect the light-emitting diode 110.

[0063] The second conductor portion 1142 is disposed to surround the first electrode 111, and the conductive connection portion 1143 connects the first conductor portion 1141 and the second conductor portion 1142. With this design, the height of the first connection electrode 321 can be equal to the height of the second connection electrode 322, thereby reducing the manufacturing cost of the driving substrate 300.

[0064] In some embodiments, the manufacturing material of the column portion 120 includes photoresist, and the photoresist is an adhesive that can be debonded under light illumination conditions.

[0065] The manufacturing material of the columnar part 120 is photodegradable glue. After the light-emitting diode 110 is transferred onto the driving substrate 300 and bonded to the bonding end 320, the columnar part 120 and the light-emitting diode 110 can be debonded by light irradiation, thereby realizing the peeling of the columnar part 120 and the light-emitting diode 110.

[0066] It should be noted that the manufacturing material of the columnar part 120 can be photodegradable glue, but is not limited thereto. The columnar part 120 can also be made of other organic materials or inorganic materials, and then the columnar part 120 and the light-emitting diode 110 are adhesively connected with photodegradable glue, which can be determined according to specific circumstances.

[0067] In other embodiments, the manufacturing material of the columnar part 120 can also be a photo-degradable material, which can gradually decompose under light irradiation conditions, thereby realizing the peeling of the columnar part 120 and the light-emitting diode 110. The manufacturing material of the columnar part 120 can also be an adhesive with reduced viscosity after heating or a material that gradually decomposes after heating. In addition, the manufacturing material of the columnar part 120 can also be an organic material or an inorganic material that has an etching selectivity with the manufacturing material of the light-emitting diode 110. After the light-emitting diode 110 is transferred onto the driving substrate 300 and bonded to the bonding end 320, part or all of the columnar part 120 is etched away, thereby realizing the peeling of the columnar part 120 and the light-emitting diode 110.

[0068] Embodiment 2

[0069] See Figures 7 to 11 As shown, the manufacturing method of the display panel in this embodiment includes steps S100 to S500.

[0070] S100: Provide a plurality of light-emitting devices 100. The plurality of light-emitting devices 100 include a first light-emitting device 100a, a second light-emitting device 100b, and a third light-emitting device 100c. The light-emitting colors of the first light-emitting device 100a, the second light-emitting device 100b, and the third light-emitting device 100c and the cross-sectional dimensions of the columnar part 120 are different.

[0071] In this embodiment, the light-emitting device 100 can adopt the light-emitting device 100 disclosed in Embodiment 1. The light-emitting colors of the first light-emitting device 100a, the second light-emitting device 100b, and the third light-emitting device 100c are different. For example, the light-emitting diode 110 of the first light-emitting device 100a emits red light, the light-emitting diode 110 of the second light-emitting device 100b emits green light, and the light-emitting diode 110 of the third light-emitting device 100c emits blue light. The cross-sectional dimensions of the columnar part 120 of the first light-emitting device 100a, the second light-emitting device 100b, and the third light-emitting device 100c are different. For example, the cross-sectional dimension of the columnar part 120 of the second light-emitting device 100b is the smallest, and the cross-sectional dimension of the columnar part 120 of the third light-emitting device 100c is the largest.

[0072] The sizes of the light-emitting diodes 110 with different light-emitting colors may be different. For example, the size of the blue light-emitting diode 110 is the largest, and the size of the green light-emitting diode 110 is the smallest, but it is not limited thereto. The red light-emitting diode 110, the green light-emitting diode 110, and the blue light-emitting diode 110 may also be made to have the same size, which can be determined according to the specific situation.

[0073] S200: Provide a transfer substrate 200. The transfer substrate 200 includes a plurality of openings. The plurality of openings include a first opening 210a, a second opening 210b, and a third opening 210c. The size of the first opening 210a matches the cross-sectional size of the columnar portion 120 of the first light-emitting device 100a. The size of the second opening 210b matches the cross-sectional size of the columnar portion 120 of the second light-emitting device 100b. The size of the third opening 210c matches the cross-sectional size of the columnar portion 120 of the third light-emitting device 100c.

[0074] That is to say, the size of the opening of the transfer substrate 200 is equal to or slightly larger than the cross-sectional size of the columnar portion 120. The first light-emitting device 100a can be inserted into the first opening 210a and suspended on the transfer substrate 200 through the support portion 130 of the first light-emitting device 100a. The columnar portion 120 of the first light-emitting device 100a cannot be inserted into the second opening 210b, and the support portion 130 of the first light-emitting device 100a can pass through the third opening 210c. Correspondingly, the second light-emitting device 100b can be inserted into the second opening 210b and suspended on the transfer substrate 200 through the support portion 130 of the second light-emitting device 100b. The support portion 130 of the second light-emitting device 100b can pass through the first opening 210a and the third opening 210c; the third light-emitting device 100c can be inserted into the third opening 210c and suspended on the transfer substrate 200 through the support portion 130 of the third light-emitting device 100c. The columnar portion 120 of the third light-emitting device 100c cannot be inserted into the first opening 210a and the second opening 210b.

[0075] S300: Transfer a plurality of light-emitting devices 100 to the transfer substrate 200, insert the columnar portions 120 of the light-emitting devices 100 into the corresponding openings, and suspend them on the transfer substrate 200 through the support portions 130.

[0076] S400: Transfer the light-emitting devices 100 to the driving substrate 300 through the transfer substrate 200, and bond the light-emitting diodes 110 to the bonding ends 320 of the driving substrate 300.

[0077] S500: Peel the light-emitting diodes 110 from the columnar portions 120.

[0078] The light-emitting devices 100 of different sizes correspond one-to-one to the openings of different sizes on the transfer substrate 200. Therefore, the light-emitting devices 100 of different sizes can be transferred simultaneously, that is, the light-emitting diodes 110 of different light-emitting colors can be transferred simultaneously, thereby improving the production efficiency of the display panel. In addition, during the transfer process, the light-emitting devices 100 that do not successfully fall into the corresponding openings of the transfer substrate 200 or fall through the openings can be recycled and reused, avoiding chip waste and significantly reducing the production cost.

[0079] In some embodiments, in step S300, the transfer substrate 200 is inclined so that the light-emitting devices 100 can roll or slide on the transfer substrate 200.

[0080] The light-emitting devices 100 can roll or slide on the transfer substrate 200, which can prevent the light-emitting devices 100 that do not fall into the openings from accumulating on the transfer substrate 200.

[0081] In some embodiments, during the process of transferring a plurality of light-emitting devices 100 onto the transfer substrate 200 and inserting the columnar portions 120 of the light-emitting devices 100 into the corresponding openings, the transfer substrate 200 is vibrated.

[0082] Vibrating the transfer substrate 200 can align the columnar portions 120 with the corresponding openings and insert them into the openings, improving the transfer speed of the light-emitting diodes 110.

[0083] It should be noted that in step S300, the transfer substrate 200 can be inclined and vibrated. With such a design, the inclination angle of the transfer substrate 200 can be reduced, which can prevent the light-emitting devices 100 from rolling or sliding on the transfer substrate 200 too fast and affecting the speed at which the light-emitting devices 100 are inserted into the corresponding openings.

[0084] In some embodiments, the manufacturing material of the columnar portion 120 is photodegradable glue, or the columnar portion 120 and the light-emitting diode 110 are adhesively connected through photodegradable glue. The method of peeling the light-emitting diode 110 from the columnar portion 120 includes making the columnar portion 120 and the light-emitting diode 110 de-adhere through light irradiation.

[0085] The photodegradable glue is an adhesive that can de-adhere under light irradiation conditions. After the light-emitting diode 110 is transferred onto the driving substrate 300 and bonded to the bonding end 320, making the columnar portion 120 and the light-emitting diode 110 de-adhere through light irradiation can achieve the peeling of the columnar portion 120 and the light-emitting diode 110.

[0086] It should be noted that the columnar part 120 and the light-emitting diode 110 can be connected or peeled off through photo-sensitive glue, but it is not limited to this. The material for making the columnar part 120 can also be an adhesive with reduced viscosity after heating or a material that gradually decomposes after heating. In addition, the material for making the columnar part 120 can also be an organic material or an inorganic material that has etching selectivity with the material for making the light-emitting diode 110. After the light-emitting diode 110 is transferred to the driving substrate 300 and bonded to the bonding end 320, part or all of the columnar part 120 is etched away, so as to realize the peeling of the columnar part 120 and the light-emitting diode 110.

[0087] Embodiment 3

[0088] This application also provides a display panel, which is manufactured by using the manufacturing method of the display panel disclosed in Embodiment 2. Refer to Figure 12 As shown, the display panel includes a driving substrate 300 and a light-emitting diode 110 bonded to the driving substrate 300. The driving substrate 300 includes a substrate 310, a driving circuit layer, and a bonding end 320. The pixel driving circuit in the driving circuit layer can drive the light-emitting diode 110 to emit light, so as to realize the display of the picture.

[0089] In the manufacture of the display panel in this embodiment, since the light-emitting devices 100 of different sizes correspond to the openings of different sizes on the transfer substrate 200 one by one, the light-emitting devices 100 of different sizes can be transferred simultaneously, that is, the light-emitting diodes 110 of different light-emitting colors can be transferred simultaneously, thereby improving the production efficiency of the display panel. In addition, during the transfer process, the light-emitting devices 100 that do not successfully fall into the corresponding openings of the transfer substrate 200 or fall through the openings can be recycled for repeated use, avoiding chip waste and significantly reducing the production cost.

[0090] The terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of this application, "a plurality of" means two or more, unless otherwise specifically defined.

[0091] In this application, unless otherwise clearly specified and limited, the terms "assembly", "connection", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection, an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific situations.

[0092] In the description of this specification, the descriptions referring to terms such as "some embodiments" and "exemplarily" mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of this application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0093] Although the embodiments of this application have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limitations on this application. Those of ordinary skill in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application. Therefore, any changes or modifications made in accordance with the claims and the description of this application shall fall within the scope covered by the patent of this application.

Claims

1. A light emitting device, characterized in that: The light emitting device comprises a light emitting diode, and the light emitting device further comprises: A column portion, the column portion comprises a first end and a second end opposite to each other, the light emitting diode is arranged on an end surface of the first end of the column portion, an orthographic projection of the light emitting diode on the end surface of the first end of the column portion is located within the end surface of the first end of the column portion, or an orthographic projection of the light emitting diode on the end surface of the first end of the column portion coincides with the end surface of the first end of the column portion; A support portion is arranged on the end surface of the second end of the column portion, and at least a part of the orthographic projection of the support portion on the end surface of the second end of the column portion is located outside the end surface of the second end of the column portion.

2. The light emitting device according to claim 1, characterized in that: The column part includes a cylinder, an elliptical cylinder or a prism.

3. The light emitting device according to claim 1, characterized in that: The light-emitting diode includes a first electrode, a first semiconductor layer, and a second semiconductor layer stacked in sequence. The light-emitting diode also includes a second electrode. The second electrode includes a first conductor portion, the first conductor portion connects the second semiconductor layer and the column portion, and the orthographic projection of the first electrode on the end surface of the first end of the column portion is located in the central area of ​​the orthographic projection of the first conductor portion on the end surface of the first end of the column portion.

4. The light emitting device according to claim 3, characterized in that: The second electrode also includes a second conductor portion and a conductive connecting portion, the second conductor portion is arranged around the first electrode, and the conductive connecting portion connects the first conductor portion and the second conductor portion. The light-emitting diode also includes a first insulating layer and a light-emitting layer, the light-emitting layer is formed between the first semiconductor layer and the second semiconductor layer, and the first insulating layer is at least arranged around the first electrode, the first semiconductor layer and the light-emitting layer, so that the first electrode, the first semiconductor layer and the light-emitting layer are all insulated from the second electrode.

5. The light emitting device according to claim 1, characterized in that: The column part is made of a material including photo-solvent adhesive or the column part and the light-emitting diode are bonded and connected via the photo-solvent adhesive, and the photo-solvent adhesive is an adhesive that can be debonded under light conditions.

6. A method for manufacturing a display panel, characterized in that: include: Providing a plurality of light-emitting devices according to any one of claims 1 to 5, wherein the plurality of light-emitting devices include a first light-emitting device, a second light-emitting device and a third light-emitting device, and the first light-emitting device, the second light-emitting device and the third light-emitting device have different light-emitting colors and different cross-sectional dimensions of the column parts; Providing a transfer substrate, the transfer substrate comprising a plurality of openings, the plurality of openings comprising a first opening, a second opening and a third opening, the size of the first opening matching the cross-sectional size of the column portion of the first light-emitting device, the size of the second opening matching the cross-sectional size of the column portion of the second light-emitting device, and the size of the third opening matching the cross-sectional size of the column portion of the third light-emitting device; Transferring the plurality of light-emitting devices to the transfer substrate, inserting the column parts of the light-emitting devices into the corresponding openings, and suspending the light-emitting devices on the transfer substrate through the support parts; Transferring the light-emitting device to a driving substrate via the transfer substrate, and binding the light-emitting diode to a binding end of the driving substrate; The light emitting diode is peeled off from the column portion.

7. The method for manufacturing a display panel according to claim 6, characterized in that: The transfer substrate is tilted so that the light emitting device can roll or slide on the transfer substrate.

8. The method for manufacturing a display panel according to claim 6 or 7, characterized in that: In the process of transferring the plurality of light-emitting devices onto the transfer substrate so that the columnar parts of the light-emitting devices are inserted into the corresponding openings, the transfer substrate is vibrated.

9. The method for manufacturing a display panel according to claim 6, wherein: The column part is made of photoresist or the column part and the light-emitting diode are bonded and connected by the photoresist. The method for peeling the light-emitting diode from the column part includes debonding the column part and the light-emitting diode by irradiating light.

10. A display panel, characterized in that: The display panel is manufactured by the method for manufacturing a display panel according to any one of claims 6 to 9.

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