Display module and manufacturing method thereof

Abstract

The invention relates to a display module and a manufacturing method thereof. The display module comprises an array substrate, an opposite substrate, a light-emitting device layer and a shielding structure. The array substrate comprises a frame area, and the frame area is provided with metal wires. The light-emitting device layer is arranged between the array substrate and the opposite substrate, and is arranged in an inward shrinkage manner relative to the edges of the array substrate and the opposite substrate; the shielding structure is arranged on the side face of the light-emitting device layer, fills a space formed by inward shrinkage of the light-emitting device layer relative to the array substrate and the opposite substrate, protrudes out of the edge of the array substrate and the edge of the opposite substrate and covers the side face of the array substrate and the side face of the opposite substrate, and the orthographic projection of the shielding structure on the array substrate covers the frame area. According to the display module, while the metal wires are effectively shielded, the packaging life of the display module can be prolonged, the risks of bubbles, cracks and the like are avoided, and the method is simple and low in cost.

Description

Technical Field

[0001] The present application relates to the field of display technologies, and in particular, to a display module and a manufacturing method thereof. Background Art

[0002] Metal traces are provided in the border area of an Organic Light Emitting Display (OLED) display module. In order to block these metal traces and avoid affecting the appearance of the display module, the border area of the display module is usually blackened. Currently, common blackening methods include setting a Black Matrix (BM) or black ink on the Color Filter (CF) side, etc. However, the water and oxygen resistance of the black BM is insufficient, which may cause the material properties to gradually degrade in a high humidity and high oxygen environment, thereby shortening the service life of the encapsulation structure. Printing ink on the color film substrate will cause a certain thickness step difference between the area where the ink is printed and the area where no ink is printed, resulting in problems such as bubbles and cracks, and there is also a risk of ink splashing into the pixel area. Summary of the Invention

[0003] Embodiments of the present application provide a display module and a manufacturing method thereof. While effectively blocking the metal traces, the display module can improve the encapsulation life of the display module, avoid risks such as bubbles and cracks, and the method is simple and low in cost.

[0004] The present application provides a display module, which includes:

[0005] An array substrate, including a pixel area and a border area located on at least one side of the pixel area, wherein metal traces are provided in the border area;

[0006] A counter substrate, disposed opposite to the array substrate;

[0007] A light-emitting device layer, disposed between the array substrate and the counter substrate and located in the pixel area, and the edge of the light-emitting device layer is recessed relative to the edges of the array substrate and the counter substrate; and

[0008] A shielding structure, disposed on the side of the light-emitting device layer, the shielding structure fills the space formed by the inward shrinkage of the light-emitting device layer relative to the array substrate and the counter substrate, protrudes beyond the edges of the array substrate and the counter substrate, and covers the sides of the array substrate and the counter substrate, wherein the orthographic projection of the shielding structure on the array substrate covers the border area.

[0009] In some embodiments, the shielding structure includes a first shielding portion and a second shielding portion. The first shielding portion is located in the space formed by the inward contraction of the light-emitting device layer relative to the array substrate and the counter substrate. The second shielding portion covers the side surfaces of the first shielding portion, the array substrate, and the counter substrate.

[0010] Wherein, the second shielding portion has opposite first and second ends in a first direction perpendicular to the array substrate. The first end is flush with the surface of the array substrate away from the light-emitting device layer, and the second end is flush with the surface of the counter substrate away from the light-emitting device layer.

[0011] In some embodiments, the side of the second shielding portion away from the light-emitting device layer is arc-shaped.

[0012] In some embodiments, the thickness of the first shielding portion in a second direction ranges from 0.2 mm to 2 mm, and the height of the first shielding portion in the first direction ranges from 0.07 mm to 0.27 mm.

[0013] The thickness of the second shielding portion in the second direction ranges from 0 mm to 0.1 mm, where the second direction is perpendicular to the first direction.

[0014] In some embodiments, the display module further includes an optical glue layer. The optical glue layer is disposed between the light-emitting device layer and the counter substrate, and the edge of the optical glue layer is set to be inwardly contracted relative to the edges of the array substrate and the counter substrate.

[0015] In the first direction, the height of the first shielding portion is equal to the sum of the thickness of the optical glue layer and the thickness of the light-emitting device layer.

[0016] In some embodiments, the thickness of the optical glue layer ranges from 0.05 mm to 0.2 mm.

[0017] In some embodiments, the counter substrate includes optical glass.

[0018] The display module further includes a polarizer, and the polarizer is disposed on the side of the optical glass away from the light-emitting device layer.

[0019] In some embodiments, the shielding structure is formed of a shielding material, and the shielding material includes a black ultraviolet curable glue.

[0020] In some embodiments, the display module further includes a heat dissipation layer, and the heat dissipation layer is disposed on the side of the array substrate away from the light-emitting device layer.

[0021] The present application also provides a method for manufacturing a display module, including:

[0022] Providing an array substrate, the array substrate includes a pixel region and a border region located on at least one side of the pixel region, and metal traces are provided in the border region;

[0023] Forming a light-emitting device layer above the array substrate;

[0024] Bonding a counter substrate above the light-emitting device layer, wherein the edge of the light-emitting device layer is set to be recessed relative to the array substrate and the counter substrate;

[0025] Coating a shielding material on the side surface of the light-emitting device layer to form a shielding structure, wherein the shielding structure fills the space formed by the light-emitting device layer being recessed relative to the array substrate and the counter substrate, protrudes beyond the edges of the array substrate and the counter substrate, and covers the side surfaces of the array substrate and the counter substrate, and the positive projection of the shielding structure on the array substrate covers the peripheral region.

[0026] The present application provides a display module and a method for manufacturing the same. The display module of the present application includes an array substrate and a counter substrate disposed opposite to each other, and a light-emitting device layer located between the array substrate and the counter substrate. The light-emitting device layer is set to be recessed relative to the array substrate and the counter substrate to form a recessed space. The present application forms a shielding structure by coating a shielding material on the side surface of the light-emitting device layer. The formed shielding structure fills the recessed space, protrudes beyond the edges of the array substrate and the counter substrate, and covers the side surfaces of the array substrate and the counter substrate, having a good sealing effect, capable of improving the encapsulation performance, avoiding risks such as bubbles and cracks, and the method is simple and low in cost. At the same time, the positive projection of the shielding structure on the array substrate covers the border region, and can effectively shield the metal traces in the border region. Description of the Drawings

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative efforts.

[0028] In order to more completely understand the present application and its beneficial effects, the following will be described in conjunction with the drawings, where the same reference numerals represent the same parts in the following description.

[0029] Figure 1 is a schematic structural diagram of a display module provided by the prior art;

[0030] Figure 2 is a schematic structural diagram of another display module provided by the prior art;

[0031] Figure 3 is a schematic structural diagram of a display module provided by an embodiment of the present application;

[0032] Figure 4 is a schematic diagram of step S1 of a method for manufacturing a display module provided by an embodiment of the present application;

[0033] Figure 5 is a schematic diagram of step S2 of a method for manufacturing a display module provided by an embodiment of the present application;

[0034] Figure 6 is a schematic diagram of step S3 of a method for manufacturing a display module provided by an embodiment of the present application;

[0035] Figure 7 is a schematic diagram of step S4 of a method for manufacturing a display module provided by an embodiment of the present application;

[0036] Figure 8 is a schematic diagram of step S5 of a method for manufacturing a display module provided by an embodiment of the present application.

[0037] Description of reference numerals:

[0038] 100, display module; 101, color filter substrate; 102, shielding layer; 110, array substrate; 120, light-emitting device layer; 130, counter substrate; 140, shielding structure; 141, first shielding portion; 142, second shielding portion; 1421, first end; 1422, second end; 150, optical adhesive layer; 160, polarizer; 170, heat dissipation layer. Detailed implementation manners

[0039] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts shall fall within the protection scope of the present application.

[0040] Please refer to Figure 1 , Figure 1Schematic diagram of the structure of a display module provided for the prior art. The display module includes an array substrate 110 and a color filter substrate 101 which are oppositely arranged, and a light-emitting device layer 120 located between the array substrate 110 and the color filter substrate 101. Among them, the array substrate 110 includes a pixel region AA and a border region NA located on at least one side of the pixel region AA, and metal traces are provided in the border region NA. The display module sets a shielding layer 102 on the side of the color filter substrate 101 close to the array substrate 110 and corresponding to the border region NA to shield the metal traces. The shielding layer 102 is a black BM and is formed on the color filter substrate 101 through a photomask process. When using the black BM as the shielding layer 102, due to the poor water and oxygen barrier properties of the black BM material, the encapsulation effect will be affected, and further the life of the display module will be affected. Moreover, preparing the black BM as the shielding layer 102 on the side of the color filter substrate 101 requires a photomask process, increasing the production cost.

[0041] Please refer to Figure 2 , Figure 2 Schematic diagram of the structure of another display module provided for the prior art. The display module includes an array substrate 110 and a color filter substrate 101 which are oppositely arranged, and a light-emitting device layer 120 located between the array substrate 110 and the color filter substrate 101. Among them, the array substrate 110 includes a pixel region AA and a border region NA located on at least one side of the pixel region AA, and metal traces are provided in the border region NA. The display module sets a shielding layer 102 on the side of the color filter substrate 101 away from the array substrate 110 and corresponding to the border region NA to shield the metal traces. The shielding layer 102 is formed by printing ink on the color filter substrate 101. This method will form a certain thickness step difference on the surface of the color filter substrate 101, and bubbles will be generated at the edges after the subsequent attachment of the polarizer 160. In addition, due to reasons such as shell-shaped cracks at the edges of the color filter substrate 101, it is easy to cause the ink to fail to cover, resulting in the exposure of the edges of the color filter substrate 101. Moreover, since the shielding layer 102 is formed by an inkjet printing method, there is a risk of ink splashing onto the pixel region AA.

[0042] To solve the above problems, the present application provides a display module 100. Please refer to Figure 3, the display module 100 includes an array substrate 110, a light-emitting device layer 120, a counter substrate 130, and a shielding structure 140. The array substrate 110 includes a pixel region AA and a border region NA located on at least one side of the pixel region AA. The border region NA is provided with metal traces; the counter substrate 130 is disposed above the array substrate 110 and is disposed opposite to the array substrate 110; the light-emitting device layer 120 is disposed between the array substrate 110 and the counter substrate 130 and is located in the pixel region AA. The edge of the light-emitting device layer 120 is recessed with respect to the edges of the array substrate 110 and the counter substrate 130; the shielding structure 140 is disposed on the side surface of the light-emitting device layer 120. The shielding structure 140 fills the space B formed by the light-emitting device layer 120 being recessed with respect to the array substrate 110 and the counter substrate 130, and the shielding structure 140 protrudes from the edges of the array substrate 110 and the counter substrate 130 and covers the side surfaces of the array substrate 110 and the counter substrate 130. Among them, the orthographic projection of the shielding structure 140 on the array substrate 110 covers the border region NA.

[0043] In the present application, a part of the shielding structure 140 is filled in the space B formed by the light-emitting device layer 120 being recessed with respect to the array substrate 110 and the counter substrate 130, and the orthographic projection of the shielding structure 140 on the array substrate 110 covers the orthographic projection of the border region NA on the array substrate 110. Therefore, the shielding structure 140 can effectively shield the metal traces located in the border region NA. In addition, the shielding structure 140 covers the side surfaces of the array substrate 110 and the counter substrate 130. On the one hand, it can protect the edges of the array substrate 110 and the counter substrate 130; on the other hand, it can further improve the encapsulation effect and prevent water and oxygen from entering between the array substrate 110 and the light-emitting device layer 120, and between the counter substrate 130 and the light-emitting device layer 120, which may affect the lifespan of the light-emitting device layer 120; and, the shielding structure 140 can also shield the side surfaces of the array substrate 110 and the counter substrate 130 from light to avoid light leakage from the side surfaces of the array substrate 110 and the counter substrate 130.

[0044] In some embodiments, the shielding structure 140 can be formed by applying a shielding material to the side surface in the space B formed by the light-emitting device layer 120 being recessed with respect to the array substrate 110 and the counter substrate 130. The shielding material can be a material with adhesiveness. The shielding structure 140 is located between the array substrate 110 and the counter substrate 130 and uses a material with adhesiveness, so that the shielding structure 140 can be tightly adhered to the side surface of the light-emitting device layer 120, the array substrate 110, and the counter substrate 130, having a good sealing effect, and thus can improve the encapsulation performance. Compared with the prior art, the present application does not require a photomask process or a printing process on the side of the counter substrate 130, which will not affect the counter substrate 130 and will not cause problems such as bubbles and cracks.

[0045] In some embodiments, the light-blocking structure 140 is formed of a light-blocking material, which includes a black ultraviolet (UV) curable adhesive. That is, the light-blocking structure 140 can be formed by curing the black UV curable adhesive through UV irradiation. The black UV curable adhesive has good water and oxygen barrier properties, a light-shielding effect, and adhesiveness. The method of fabricating the light-blocking structure 140 using the black UV curable adhesive is simple and can be formed through a side coating process, with a relatively low cost.

[0046] Among them, the black UV curable adhesive can achieve its light-blocking effect by adding black components, such as black particles, black pigments, etc., to the UV curable adhesive.

[0047] In some embodiments, the Rockwell Hardness of the black UV curable adhesive is between 60 and 85, and can be optionally 60, 62, 64, 66, 68, 70, 72, 74, 76, 78, 80, 82, 85, so that the black UV curable adhesive can balance properties such as bonding strength and a certain degree of flexibility.

[0048] In some embodiments, the light transmittance of the black UV curable adhesive is less than or equal to 2%. The black UV curable adhesive has a low light transmittance to achieve a better effect of blocking metal traces and light shielding.

[0049] In the present application, please refer to Figure 3 , the light-blocking structure 140 includes a first light-blocking portion 141 and a second light-blocking portion 142 connected to the first light-blocking portion 141. The first light-blocking portion 141 is located within a space B formed by the light-emitting device layer 120 being recessed relative to the array substrate 110 and the counter substrate 130. The second light-blocking portion 142 covers the side surface of the first light-blocking portion 141, the side surface of the array substrate 110, and the side surface of the counter substrate 130.

[0050] In some embodiments, the second light-blocking portion 142 has opposite first and second ends 1421 and 1422 in a first direction Y perpendicular to the array substrate 110. The first end 1421 is flush with the surface of the array substrate 110 away from the light-emitting device layer 120, and the second end 1422 is flush with the surface of the counter substrate 130 away from the light-emitting device layer 120, so as to avoid problems such as glue overflow and ensure the side light-shielding effect.

[0051] In some embodiments, one side of the second light-blocking portion 142 away from the light-emitting device layer 120 is arc-shaped. Since the black ultraviolet curable glue is in a fluid state during the coating process and has the property of self-leveling, after being cured by ultraviolet light irradiation, the outer surface of the second light-blocking portion 142 is arc-shaped, and the radius of curvature of the arc is less than or equal to 0.5 mm. Since the outer surface of the second light-blocking portion 142 is arc-shaped, the second light-blocking portion 142 has the characteristics of being thick in the middle and thin at the ends. The thickness of the thickest part of the second light-blocking portion 142 does not exceed 0.1 mm, and the thickness of the thinnest part is between 0 mm and 0.1 mm, and 0.02 mm, 0.04 mm, 0.06 mm, 0.08 mm, 0.10 mm can be selected, which is beneficial to achieving the narrow border effect of the display module.

[0052] Further, the second light-blocking portion 142 may be a structure symmetric about the central plane (such as the dashed line OO shown in Figure 3 the figure) of the entire array substrate 110, light-emitting device layer 120, and counter substrate 130, so as to achieve the balance of the encapsulation and light-blocking functions of the second light-blocking portion 142.

[0053] In some embodiments, the thickness d1 of the first light-blocking portion 141 in the second direction X ranges from 0.2 mm to 2 mm, and 0.2 mm, 0.5 mm, 1.0 mm, 1.5 mm, 2.0 mm can be selected. The height h1 of the first light-blocking portion 141 in the first direction Y ranges from 0.07 mm to 0.27 mm, and 0.07 mm, 0.17 mm, 0.27 mm can be selected. The thickness d2 of the second light-blocking portion 142 in the second direction X ranges from 0 mm to 0.1 mm, and 0.02 mm, 0.04 mm, 0.06 mm, 0.08 mm, 0.1 mm can be selected, where the second direction X is perpendicular to the first direction Y. Making the size of the light-blocking structure 140 within the above range is convenient for filling the light-blocking material in the space B formed by the inner shrinkage of the edge of the light-emitting device layer 120 relative to the array substrate 110 and the counter substrate 130 and forming the light-blocking structure 140, ensuring the light-blocking effect of the light-blocking structure 140 on the metal traces and the encapsulation performance of the light-blocking structure 140, and at the same time achieving the narrow border effect.

[0054] In some embodiments, the display module 100 further includes an optical glue layer 150. The optical glue layer 150 is disposed between the light-emitting device layer 120 and the counter substrate 130. The edge of the optical glue layer 150 is disposed in an inwardly retracted manner relative to the array substrate 110 and the counter substrate 130. For example, the edge of the optical glue layer 150 is flush with the edge of the light-emitting device layer 120, but is not limited thereto. In the first direction Y, the height h1 of the first light-blocking portion 141 is equal to the sum of the thickness of the optical glue layer 150 and the thickness of the light-emitting device layer 120, that is, the height h1 of the first light-blocking portion 141 is determined by the thickness of the optical glue layer 150 and the thickness of the light-emitting device layer 120.

[0055] In some embodiments, the thickness range of the optical adhesive layer 150 is 0.05 mm to 0.20 mm, and 0.05 mm, 0.10 mm, 0.15 mm, and 0.20 mm are optional. A layer of optically clear adhesive (OCA) with a certain thickness is bonded between the light-emitting device layer 120 and the counter substrate 130, which can increase the space between the array substrate 110 and the counter substrate 130 in the direction perpendicular to the array substrate 110, so as to ensure that the space B formed by the edge of the light-emitting device layer 120 shrinking relative to the array substrate 110 and the counter substrate 130 is large enough, so as to facilitate coating a black ultraviolet curable adhesive in the shrunk space B to form a shielding structure 140, ensuring the stability, encapsulation, etc. of the shielding structure 140. On the other hand, the optical adhesive layer 150 can play a role in bonding the counter substrate 130 and the light-emitting device layer 120.

[0056] In some embodiments, the light-emitting device layer 120 includes a first electrode layer, an organic functional layer, a second electrode layer, and a thin film encapsulation (TFE) layer. The first electrode layer is disposed on the side of the array substrate 110 close to the counter substrate 130, and the first electrode layer can be an anode. Further, the light-emitting device layer 120 further includes a pixel definition layer, and the pixel definition layer includes a plurality of pixel openings. The organic functional layer is disposed on the side of the first electrode layer away from the array substrate 110 and is located within the pixel openings. The organic functional layer includes an organic light-emitting layer, and at least one of a hole injection layer, a hole transport layer, an electron injection layer, and an electron transport layer, etc. The second electrode layer is disposed on the side of the organic functional layer away from the first electrode layer, and the second electrode layer can be a cathode. The thin film encapsulation layer is disposed on the side of the second electrode layer close to the counter substrate 130 and covers the second electrode layer to achieve the encapsulation and protection of the first electrode layer, the organic functional layer, and the second electrode layer. Among them, the thin film encapsulation layer includes one or more encapsulation film layers, and the encapsulation film layer can be an inorganic film layer or an organic film layer. The specific structure of the above light-emitting device layer 120 can refer to the prior art and will not be limited here.

[0057] In some embodiments, the counter substrate 130 is optical glass. In this application, the display module 100 does not use a color filter substrate (CF) to encapsulate the light-emitting device layer 120, and only uses ordinary transparent optical glass to protect the light-emitting device layer 120. On the one hand, it reduces the complex process of the color filter substrate, reduces processes such as photomasks, further simplifies the process of the display module 100, and reduces the production cost. On the other hand, attaching the optical glass to the surface of the thin film encapsulation layer by means of OCA glue can obtain better optical performance.

[0058] In some embodiments, the display module 100 further includes a polarizer 160, which is disposed on the side of the optical glass away from the light-emitting device layer 120. In the present application, the polarizer 160 is placed on the surface of the optical glass, so that the display module 100 has better optical performance.

[0059] In some embodiments, the display module 100 further includes a heat dissipation layer 170, which is disposed on the side of the array substrate 110 away from the light-emitting device layer 120. Since heat is generated during the continuous light emission of the light-emitting device layer 120, the heat dissipation layer 170 disposed on the back of the array substrate 110 can dissipate heat from the light-emitting device layer 120 to ensure the performance and service life of the light-emitting device layer 120. The material of the heat dissipation layer 170 may be a metal with good heat dissipation effect, such as aluminum (Al), and of course other heat dissipation materials may also be used, which are not specifically limited herein.

[0060] The present application also provides a manufacturing method of the display module 100. Please refer to Figures 3 - 8 The manufacturing method of the display module 100 includes:

[0061] Providing an array substrate 110, the array substrate 110 includes a pixel region AA and a border region NA located on at least one side of the pixel region AA, and metal traces are provided in the border region NA;

[0062] Forming a light-emitting device layer 120 above the array substrate 110;

[0063] Bonding a counter substrate 130 above the light-emitting device layer 120, wherein the edge of the light-emitting device layer 120 is set to be recessed relative to the array substrate 110 and the counter substrate 130;

[0064] Coating a shielding material on the side surface of the light-emitting device layer 120 to form a shielding structure 140, wherein the formed shielding structure 140 fills the space B formed by the light-emitting device layer 120 being recessed relative to the array substrate 110 and the counter substrate 130, and the shielding structure 140 protrudes from the edges of the array substrate 110 and the counter substrate 130 and covers the side surfaces of the array substrate 110 and the counter substrate 130, and the positive projection of the shielding structure 140 on the array substrate 110 covers the border region NA.

[0065] Furthermore, the shielding material includes a black ultraviolet curable adhesive.

[0066] Specifically, please refer to Figures 3 - 8 The manufacturing method of the display module 100 includes:

[0067] S1. Please refer to Figure 4 Providing an array substrate 110, the array substrate 110 includes a pixel region AA and a border region NA located on at least one side of the pixel region AA, and metal traces are provided in the border region NA.

[0068] Among them, the array substrate 110 includes a substrate, thin film transistors arranged in an array on the substrate, metal traces, and the like.

[0069] S2. Please refer to Figure 5 , and form a light-emitting device layer 120 above the array substrate 110. The edge of the light-emitting device layer 120 is set to be recessed relative to the array substrate 110.

[0070] Among them, the light-emitting device layer 120 includes a first electrode layer, a pixel definition layer, an organic functional layer, a second electrode layer, and a thin film encapsulation layer. Specifically, first, form a patterned first electrode layer above the array substrate 110; secondly, form a patterned pixel definition layer above the first electrode layer. The pixel definition layer includes a plurality of pixel openings; then, form an organic functional layer in the pixel openings; then, form a second electrode layer above the pixel definition layer and the organic functional layer; finally, form a thin film encapsulation layer above the pixel definition layer and the second electrode layer.

[0071] S3. Please refer to Figure 6 , and bond a counter substrate 130 above the light-emitting device layer 120. The counter substrate 130 is arranged opposite to the array substrate 110, and the edge of the light-emitting device layer 120 is set to be recessed relative to the array substrate 110 and the counter substrate 130.

[0072] Specifically, the counter substrate 130 is bonded to the thin film encapsulation layer through an optical adhesive layer 150. Among them, the edge of the optical adhesive layer 150 is set to be recessed relative to the array substrate 110 and the counter substrate 130. The thickness range of the optical adhesive layer 150 is 0.05 mm to 0.20 mm, and 0.05 mm, 0.10 mm, 0.15 mm, and 0.20 mm are optional. The counter substrate 130 is optical glass.

[0073] S4. Please refer to Figure 7 , and bond a polarizer 160 above the counter substrate 130.

[0074] S5. Please refer to Figure 8 , and coat a black ultraviolet curable adhesive on the side of the light-emitting device layer 120 by means of side coating. Among them, the black ultraviolet curable adhesive fills the space formed by the light-emitting device layer 120 being recessed relative to the array substrate 110 and the counter substrate 130, and the shielding structure 140 protrudes from the edges of the array substrate 110 and the counter substrate 130 and covers the sides of the array substrate 110 and the counter substrate 130. Then, cure it by ultraviolet light irradiation to form the shielding structure 140. The shielding structure 140 is bonded to the side of the light-emitting device layer 120, the array substrate 110, and the counter substrate 130. The orthographic projection of the shielding structure 140 on the array substrate 110 covers the border area NA.

[0075] In this embodiment, a black ultraviolet curable adhesive is coated at the edge of the light-emitting device layer 120 in a space formed by being recessed relative to the array substrate 110 and the counter substrate 130 by means of side coating to form a shielding structure 140. The process is simple and the cost is low. The shielding structure 140 can not only shield the metal traces but also improve the encapsulation performance. At the same time, in this embodiment, a thin-film encapsulation method is adopted. The optical glass is attached to the surface of the thin-film encapsulation layer by means of an OCA adhesive, and the polarizer 160 is placed on the surface of the optical glass, which can obtain better optical performance and can further reduce the cost.

[0076] The display module 100 provided in this application may be an organic light-emitting diode (OLED) display module, but is not limited thereto. The display module 100 can be applied to display devices such as mobile phones, tablets, computers, and TVs.

[0077] In summary, this application provides a display module and a manufacturing method thereof. The display module of this application includes an array substrate and a counter substrate disposed opposite to each other, and a light-emitting device layer located between the array substrate and the counter substrate. The light-emitting device layer is recessed relative to the array substrate and the counter substrate to form a recessed space B. In this application, a shielding structure is formed by side coating a shielding material on the side of the light-emitting device layer. The formed shielding structure fills the recessed space B, protrudes from the edges of the array substrate and the counter substrate, and covers the sides of the array substrate and the counter substrate, having a good sealing effect, which can improve the encapsulation performance, avoid risks such as bubbles and cracks, and the method is simple and the cost is low. At the same time, the orthographic projection of the shielding structure on the array substrate covers the border area, which can effectively shield the metal traces in the border area.

[0078] In the description of this application, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more features. In the description of this application, "a plurality" means two or more unless otherwise specifically defined.

[0079] In the above embodiments, the descriptions of the respective embodiments have their own emphases. For the parts not detailed in a certain embodiment, reference may be made to the relevant descriptions of other embodiments.

[0080] Among the embodiments, implementation manners and related technical features of this application, they can be combined and replaced with each other without conflict.

[0081] The above are only the preferred embodiments of the present application and do not impose any formal restrictions on the present application. However, any simple modifications, equivalent changes, and decorations made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application still fall within the scope of the technical solution of the present application.

Claims

1. A display module, characterized in that: include: An array substrate, comprising a pixel area and a frame area located at least on one side of the pixel area, wherein the frame area is provided with metal wiring; An opposing substrate, arranged opposite to the array substrate; a light emitting device layer, arranged between the array substrate and the counter substrate and located in the pixel region, wherein the edge of the light emitting device layer is arranged to be inwardly contracted relative to the edges of the array substrate and the counter substrate; as well as A shielding structure is arranged on the side of the light-emitting device layer, the shielding structure fills the space formed by the light-emitting device layer being retracted relative to the array substrate and the opposing substrate, and protrudes from the edge of the array substrate and the edge of the opposing substrate, and covers the side of the array substrate and the side of the opposing substrate, wherein the orthographic projection of the shielding structure on the array substrate covers the border area.

2. The display module according to claim 1, characterized in that: The shielding structure comprises a first shielding portion and a second shielding portion, wherein the first shielding portion is located in a space formed by the light emitting device layer being retracted relative to the array substrate and the opposing substrate, and the second shielding portion covers a side surface of the first shielding portion, a side surface of the array substrate and a side surface of the opposing substrate; The second shielding portion has a first end and a second end opposite to each other in a first direction perpendicular to the array substrate, the first end is flush with a surface of the array substrate away from the light-emitting device layer, and the second end is flush with a surface of the opposing substrate away from the light-emitting device layer.

3. The display module according to claim 2, characterized in that: A side of the second shielding portion away from the light emitting device layer is arc-shaped.

4. The display module according to claim 2, characterized in that: The thickness of the first shielding portion in the second direction ranges from 0.2 mm to 2 mm, and the height of the first shielding portion in the first direction ranges from 0.07 mm to 0.27 mm; The thickness of the second shielding portion in the second direction is in a range of 0 mm to 0.1 mm, wherein the second direction is perpendicular to the first direction.

5. The display module according to claim 2, characterized in that: The display module further comprises an optical adhesive layer, which is arranged between the light emitting device layer and the opposing substrate, and the edge of the optical adhesive layer is arranged to be inwardly contracted relative to the edges of the array substrate and the opposing substrate; In the first direction, the height of the first shielding portion is equal to the sum of the thickness of the optical adhesive layer and the thickness of the light emitting device layer.

6. The display module according to claim 5, characterized in that: The thickness of the optical adhesive layer ranges from 0.05 mm to 0.2 mm.

7. The display module according to any one of claims 1 to 6, characterized in that: The shielding structure is formed by a shielding material, and the shielding material includes black ultraviolet light curing glue.

8. The display module according to any one of claims 1 to 6, characterized in that: The counter substrate comprises optical glass; The display module further comprises a polarizer, and the polarizer is arranged on a side of the optical glass away from the light-emitting device layer.

9. A method for manufacturing a display module, characterized in that: include: An array substrate is provided, the array substrate comprising a pixel area and a frame area located at least on one side of the pixel area, the frame area being provided with metal wiring; forming a light emitting device layer above the array substrate; Laminating an opposing substrate above the light-emitting device layer, wherein an edge of the light-emitting device layer is set inward relative to the array substrate and the opposing substrate; A shielding material is coated on the side of the light-emitting device layer to form a shielding structure, wherein the shielding structure fills the space formed by the light-emitting device layer being retracted relative to the array substrate and the opposing substrate, protrudes from the edge of the array substrate and the edge of the opposing substrate, and covers the side of the array substrate and the side of the opposing substrate, and the orthographic projection of the shielding structure on the array substrate covers the peripheral area.

10. The method for manufacturing a display module according to claim 9, characterized in that: The shielding material includes black ultraviolet light curing glue.

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