Substrate processing apparatus

Abstract

A substrate processing apparatus (1) is provided with: a workpiece support unit (25) configured so as to be capable of supporting a workpiece (W); and a plurality of light sources (41, 42) that irradiate irradiation light (L1, L2) including vacuum ultraviolet light. The substrate processing apparatus is further provided with a light shielding plate (54), and the irradiation area of the irradiation light reaching the workpiece is limited by allowing the irradiation light to pass only through the opening portion of the light shielding plate (54). The substrate processing apparatus further includes a moving mechanism (70) that moves the workpiece support portion relative to the plurality of light sources such that an irradiated portion of the workpiece irradiated with the irradiation light varies over time. In such a substrate processing apparatus, the plurality of light sources are provided at mutually different positions in a direction intersecting with a moving direction in which the workpiece is moved by the moving mechanism by moving the workpiece support portion.

Description

Technical Field

[0001] The present disclosure relates to a substrate processing apparatus. Background Art

[0002] In Patent Document 1, an assist exposure apparatus is disclosed that improves the film pressing, line width accuracy, or in-plane uniformity of a resist pattern by irradiating ultraviolet light on a resist film formed on a substrate separately from an exposure process.

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2013-186191 Summary of the Invention

[0006] Problems to be Solved by the Invention

[0007] The present disclosure provides a technique capable of uniformly irradiating a substrate on which a resist film is formed with light including vacuum ultraviolet light.

[0008] Solutions to the Problems

[0009] A substrate processing apparatus according to one aspect of the present disclosure includes: a substrate support configured to support a substrate on which a resist film is formed; a plurality of light sources that irradiate irradiation light including vacuum ultraviolet light; a light shielding plate that allows the irradiation light to pass only through an opening portion of the light shielding plate, thereby restricting an irradiation area of the irradiation light reaching the substrate; and a moving mechanism that relatively moves the substrate support with respect to the plurality of light sources so that an irradiated portion of the substrate irradiated with the irradiation light changes over time, wherein the plurality of light sources are arranged at different positions in a direction intersecting a moving direction in which the substrate support is moved to move the substrate by the moving mechanism.

[0010] Effects of the Invention

[0011] According to the present disclosure, it is possible to uniformly irradiate a substrate on which a resist film is formed with light including vacuum ultraviolet light. Brief Description of the Drawings

[0012] Figure 1 is a diagram showing a substrate processing apparatus according to an exemplary embodiment.

[0013] Figure 2 is a diagram for explaining the movement of the substrate with respect to the irradiation area.

[0014] Figure 3 is a diagram for explaining an opening portion of the light shielding plate.

[0015] Figure 4 is a block diagram exemplifying a hardware configuration of a controller.

[0016] Figure 5 This is a diagram showing the structure related to the modified example. Detailed implementation manners

[0017] Hereinafter, the implementation manners will be described in detail with reference to the accompanying drawings. In the description, the same reference numerals are assigned to the same elements or elements having the same functions, and redundant descriptions are omitted.

[0018] [Structure of the substrate processing apparatus]

[0019] Figure 1 This is a schematic diagram (longitudinal cross-sectional side view) showing a first structural example of the substrate processing apparatus according to the present embodiment. Figure 1 The shown substrate processing apparatus 1 irradiates the workpiece W with light for processing. For example, the substrate processing apparatus 1 is configured to irradiate a resist film or a resist pattern formed on the surface of the workpiece W with light including vacuum ultraviolet light (VUV light: Vacuum Ultra Violet Light). By irradiating the light including vacuum ultraviolet light by the substrate processing apparatus 1, the sensitivity during the exposure of these resist films can be increased. In addition, by irradiating the light including vacuum ultraviolet light, the surface roughness of the resist pattern obtained through the exposure and development process can also be improved.

[0020] The workpiece as the processing object is, for example, a substrate, or a substrate in a state where a film and a circuit are formed by performing a predetermined process. As an example, the substrate included in the workpiece W is a wafer containing silicon. As an example, the workpiece W (substrate) is in a disk shape, but may also be a shape in which a part of the circle is cut off, or a shape other than a circle such as a polygon. The workpiece W as the processing object may be a glass substrate, a mask substrate, an FPD (Flat Panel Display), etc., or an intermediate obtained by performing a predetermined process on these substrates.

[0021] The substrate processing apparatus 1 has a function of irradiating the surface of the workpiece W with the processing irradiation lights L1 and L2. The irradiation light L1 is the light irradiated from the light source 41, and the irradiation light L2 is the light irradiated from the light source 42 (details will be described later). As an example, after forming a SOC film (Silicon-on-Carbon) on the substrate and an SOG film (Silicon-on-Glass) on the SOC film, and then forming a resist film, a resist pattern with a specified pattern is formed by performing an exposure and development process. The resist pattern is a mask pattern for etching the underlying SOC film and SOG film to form a pattern on these underlying films. The substrate processing apparatus 1 has, for example, the following function: improving the roughness of the surface of the resist pattern by irradiating the surface of the workpiece W on which the resist pattern is formed with the processing irradiation lights L1 and L2. In the present embodiment, the case where the substrate processing apparatus 1 irradiates the workpiece W after forming the resist film and before performing the exposure and development process with the irradiation lights L1 and L2 will be described.

[0022] In addition, in the substrate processing apparatus 1 according to the present embodiment, the case where the resist material for forming the resist pattern is a material suitable for EUV lithography using an EUV laser as an exposure light source will be described. In addition, EUV laser (Extreme Ultraviolet) is a laser having a wavelength of 13.5 nm. The workpiece W on which a resist film formed of the resist material is formed is irradiated with light including the above-described VUV light under specified conditions using the substrate processing apparatus 1. As a result, the sensitivity in the subsequent exposure process is improved. Moreover, the roughness of the surface of the resist when the resist pattern is formed by the exposure and development process is improved. In addition, the roughness of the surface of the pattern obtained by etching using the resist pattern as a mask can also be improved.

[0023] The respective parts of the substrate processing apparatus 1 will be described. As Figure 1 shown, the substrate processing apparatus 1 includes a housing 21, a workpiece support portion 25 (substrate support portion), a gas supply portion 30, a gas discharge portion 32, and an atmosphere adjustment portion 34. In addition, the substrate processing apparatus 1 includes a plurality (two in this case) of light sources 41 and 42, a light shielding plate 54, illuminometers 61 and 62, a moving mechanism 70, and a controller 100. Further, the substrate processing apparatus 1 may include a lamp shielding member (not shown) that switches the irradiation lights L1 and L2 between a state of reaching the workpiece W and a state of not reaching, and a light transmissive plate (not shown) that functions as a partition wall at a position below the lamp shielding member, etc. The illustrations of the above-described lamp shielding member and light transmissive plate and other structures are omitted in Figure 1 etc.

[0024] The housing 21 is, for example, a part of a vacuum chamber disposed in an atmospheric atmosphere, and is configured to accommodate a workpiece W transported by a transport mechanism (not shown). That is, the housing 21 functions as a processing chamber for performing processing related to the workpiece W inside.

[0025] In the substrate processing apparatus 1, processing is performed on the workpiece W in a state where the workpiece W is accommodated in the housing 21. A transfer port (not shown), which is an opening for transferring the workpiece W into and out of the housing 21, is formed in a side wall of the housing 21. For example, this transfer port is opened and closed by a gate valve (not shown).

[0026] The workpiece support portion 25 is a support portion configured to support the workpiece W (substrate) on which a resist film is formed. The workpiece support portion 25 supports a substantially central portion of the workpiece W horizontally disposed with the surface on which the resist pattern is formed facing upward, and holds the workpiece W, for example, by vacuum suction (holding is performed by the differential pressure between the pressure in the chamber).

[0027] The gas supply unit 30 is configured to supply an inert gas (e.g., argon, nitrogen, etc.) into the housing 21 via a through hole 21a formed in the housing 21. The gas supply unit 30 includes a gas source 30a, a valve 30b, and a pipe 30c. The gas source 30a stores the inert gas and functions as a supply source of the inert gas. The valve 30b operates based on an operation signal from the controller 100 to open and close the pipe 30c. The gas source 30a, the valve 30b, and the through hole 21a are connected in sequence from the upstream side in the pipe 30c.

[0028] The gas discharge unit 32 discharges gas from the housing 21 via a through hole 21b formed in the housing 21. The gas discharge unit 32 includes a vacuum pump 32a and a pipe 32c. The vacuum pump 32a is used to discharge gas from inside the housing 21. The pipe 32c connects the through hole 21b and the vacuum pump 32a.

[0029] The atmosphere adjustment unit 34 can adjust the inside of the housing 21 to an atmospheric atmosphere via a through hole 21c formed in the housing 21. The atmosphere adjustment unit 34 includes a valve 34b and a pipe 34c. The valve 34b operates based on an operation signal from the controller 100 to open and close the pipe 34c. The pipe 34c can connect the through hole 21c and the atmospheric atmosphere. That is, when the valve 34b is opened, the inside of the housing 21 is adjusted to an atmospheric atmosphere.

[0030] Light sources 41 and 42 respectively irradiate irradiation light containing vacuum ultraviolet light. The light sources 41 and 42 may also be housed, for example, in a housing (not shown) provided in the upper part of the housing 21. In addition, for example, the lighting of the light sources 41 and 42 may be switched between on and off by a switch (not shown) controlled by the controller 100. The light sources 41 and 42 are arranged at positions where a part of the irradiation portions on the workpiece W at the same time of the irradiation light L1 and L2 emitted from the respective light sources 41 and 42 overlap each other (refer to Figure 3 ). That is, a part of the irradiation ranges of the irradiation light L1 and L2 on the workpiece W overlap each other.

[0031] As described later, the workpiece support portion 25 is moved by the moving mechanism 70, whereby the workpiece W is moved. The plurality of light sources 41 and 42 are arranged at different positions in a direction intersecting the moving direction MD in which the workpiece W is moved by moving the workpiece support portion 25 by the moving mechanism 70 (refer to Figure 2 ). In addition, in the present embodiment, the plurality of light sources 41 and 42 are arranged on the same line intersecting the moving direction MD of the workpiece W (refer to Figure 2 ).

[0032] The lamps in the light sources 41 and 42 irradiate light, for example, in a wavelength range of 115 nm to 400 nm. For the stability of the light source, the lamp is, for example, always lit. As an example, the light sources 41 and 42 irradiate light forming a continuous spectrum of 115 nm to 400 nm. The "light forming a continuous spectrum" only needs to include light including at least a part (for example, having a wavelength width of 10 nm or more) of a spectrum component continuous within the wavelength range of 100 nm to 200 nm (corresponding to the wavelength range of vacuum ultraviolet light (VUV light)).

[0033] In addition, the continuous spectrum means a spectrum continuously expanding within a specific wavelength range (in the present embodiment, a wavelength width of 10 nm or more), and is a spectrum different from a line spectrum (bright line spectrum) of a specific wavelength. In addition, as the light forming a continuous spectrum including a part of the wavelength range of 100 nm to 200 nm, light forming a continuous spectrum within the above-mentioned wavelength range of 115 nm to 400 nm may also be used. In addition, the light emitted from the light sources 41 and 42 does not need to be "light forming a continuous spectrum" in its entire wavelength range, and only needs to be set as light forming a continuous spectrum in at least a part of the range. As an example, the light emitted from the light sources 41 and 42 forms a continuous spectrum in a wavelength range overlapping with 100 nm to 200 nm (corresponding to the wavelength region of vacuum ultraviolet light (VUV light)), and thus the irradiated light effectively functions.

[0034] Vacuum ultraviolet light (VUV light) is generally set to light in the wavelength range of 10 nm to 200 nm. However, the light emitted from light sources 41 and 42 is also light on the longer wavelength side of 100 nm or more in VUV light, which can further enhance the effect of the processing performed by the substrate processing apparatus 1, that is, the effect of modifying the resist film. Since light on the shorter wavelength side (light with a wavelength shorter than 100 nm) hardly enters the inside of the resist film, it may be difficult to achieve the effect of modifying the entire resist film.

[0035] In addition, the main wavelength range of the light irradiated from light sources 41 and 42 is different from, for example, the wavelength of the light used in the exposure of the resist film. Regarding the wavelength of the light used in the exposure, for example, EUV laser (Extreme Ultraviolet) is a laser with a wavelength of 13.5 nm. When the substrate processing apparatus 1 uses light with the wavelength used in the exposure of the resist film, that is, EUV light, there is a possibility of performing an exposure process on the workpiece W at the timing of the processing performed by the substrate processing apparatus 1. Therefore, it is considered that by setting the main wavelength range of the light emitted from light sources 41 and 42 to 100 nm or more, the effect of light with a wavelength different from that of the exposure by EUV light can be obtained.

[0036] In addition, the light emitted from light sources 41 and 42 may contain, in addition to VUV light, near ultraviolet light (near ultraviolet rays) with a wavelength longer than that of VUV light. As another example, the light from light sources 41 and 42 can be configured to contain light in the band with a wavelength of 160 nm or less. In this way, the light emitted from light sources 41 and 42 contains at least light in the wavelength range defined as VUV light.

[0037] The lamps provided in light sources 41 and 42 can be, for example, deuterium lamps, configured to irradiate VUV light with a wavelength of 200 nm or less. The wavelength of the peak of the continuous spectrum can be, for example, 160 nm or less, or can be 150 nm or more. In addition, the wavelength of the peak in the spectral distribution of the light from light sources 41 and 42 is 248 nm or less, whereby the effect of the light in the wavelength range of VUV light contained in the light from light sources 41 and 42 is enhanced. The light from light sources 41 and 42 can also be light forming a continuous spectrum with multiple sub-peaks. The sub-peaks can be 248 nm or less, or can be, for example, 160 nm or less. In addition, the light from light sources 41 and 42 is not limited to a continuous spectrum, and includes, for example, light with one or more wavelengths in the wavelength range of 115 nm to 400 nm.

[0038] The wavelength range of the spectra of the light irradiated from light sources 41 and 42 is relatively wide. Therefore, the resist film on the workpiece W receives the energy of light of various wavelengths. As a result, various reactions occur on the surface of the resist film. Specifically, chemical bonds at various positions in the molecules constituting the resist film are broken, whereby the sensitivity of the resist film to exposure increases. Therefore, even a smaller exposure amount can be appropriately used for exposure. In addition, various compounds are generated by the breaking of the above chemical bonds, so the orientation of the molecules existing in the resist film before the light irradiation is eliminated. As a result, the surface free energy and the internal stress in the resist film decrease. That is, by using the light sources 41 and 42 as light sources, it is easy to increase the fluidity of the surface of the resist film. As a result, the improvement effect of the roughness of the surface when the resist pattern is formed can be enhanced.

[0039] In addition, in the case where light including VUV light is irradiated from the light sources 41 and 42, when there is a deviation in the energy of the light received by the resist film on the workpiece W, the characteristics of the resist may deviate on the surface of the workpiece W irradiated with the VUV light. Therefore, it is required that the light including VUV light be irradiated as uniformly as possible over the entire surface of the workpiece W. In addition, when it is desired to adjust the characteristics of the resist film on the surface of the workpiece W by irradiating light from the light sources 41 and 42, sometimes the irradiation amount of the light is important. Therefore, in the substrate processing apparatus 1, a light amount adjustment mechanism is used to adjust the light amount. The light amount adjustment mechanism is configured to adjust the light amount of the irradiation lights L1 and L2 on the optical paths of the irradiation lights L1 and L2 irradiated from the light sources 41 and 42. The light amount adjustment mechanism is configured to include, for example, a lamp shielding member (not shown), a light transmissive plate (not shown), and a light shielding plate 54, etc.

[0040] An example of the use of the substrate processing apparatus 1 is to irradiate the film on the surface of the workpiece W with vacuum ultraviolet light as described above before exposure. However, in this case, sometimes a smaller light amount than the total light amount at the time of exposure is irradiated in order to suppress the deterioration of the film or the crosslinking reaction of the entire film. In order to reduce the light amount irradiated on the film on the surface of the workpiece W, it is preferable to set the irradiation ranges of the two light sources 41 and 42 to be wider than one diameter of the workpiece W when passing through this region as shown in the present embodiment. By doing so, while minimizing the number of light sources used, the intensity distribution in the irradiation regions of the two light sources 41 and 42 is adjusted, and the opening shape of the light shielding plate 54 and the moving speed of the workpiece W are appropriately set to desired values to facilitate the processing using uniform vacuum ultraviolet light. In addition, this one diameter is the diameter in the direction different from the moving direction of the workpiece W passing through the irradiation regions of the light sources 41 and 42. When specifically exemplified according to the present embodiment, it is Figure 2 the vertical direction (the direction substantially perpendicular to the moving direction of the workpiece W).

[0041] That is to say, when considering the case where the irradiation range of a light source is one diameter of the workpiece W, the overall irradiation intensity of the light is attenuated by adjusting the distance between the workpiece W and the light source and making the light pass through the light-transmitting plate. Moreover, the opening shape of the light-shielding plate 54 is adjusted corresponding to the irradiation intensity distribution of the light source, and there is no degree of freedom in the design of the opening shape, and the moving speed of the workpiece W (the passing speed in the irradiation area) for uniform processing may also be limited. In addition, when considering the case where the irradiation ranges of three or more light sources (when the irradiation ranges of each light source are made equal) are one diameter of the workpiece W, the required space for the corresponding configuration and the consumption number of expensive light sources also increase.

[0042] The illuminometer 61 measures the illuminance of the irradiation light L1. The illuminometer 61 is provided, for example, at a position corresponding to the optical axis center of the irradiation light L1 that irradiates the workpiece W. The illuminometer 62 measures the illuminance of the irradiation light L2. The illuminometer 62 is provided, for example, at a position corresponding to the optical axis center of the irradiation light L2 that irradiates the workpiece W. According to such illuminometers 61 and 62, the illuminance at the optical axis centers of the irradiation lights L1 and L2 can be measured, and the deterioration condition of the lamps of the light sources 41 and 42 themselves can be appropriately determined, etc.

[0043] The moving mechanism 70 relatively moves the workpiece support portion 25 with respect to the plurality of light sources 41 and 42 (specifically, with respect to the irradiation areas of the plurality of light sources 41 and 42) so that the irradiated portions of the workpiece W irradiated with the irradiation lights L1 and L2 change over time. The moving mechanism 70 includes a swing arm 71 and a drive unit 72.

[0044] The swing arm 71 is a rod-shaped member extending in the horizontal direction. One end thereof is fixed to the lower surface of the workpiece support portion 25 (the surface of the workpiece support portion 25 on the side opposite to the placement surface of the workpiece W), and the other end thereof is connected to the drive unit 72. The swing arm 71 is driven by the drive unit 72 and thus operates in a manner of drawing an arc track on the same horizontal plane. The drive unit 72 is, for example, an actuator with an electric motor as the power source. The drive unit 72 operates the swing arm 71 (operates in a manner of drawing an arc track on the same horizontal plane) based on the control signal of the controller 100.

[0045] Figure 2 FIG. is a diagram for explaining the movement of the workpiece W with respect to the irradiation areas IA of the irradiation lights L1 and L2. The irradiation area IA is the irradiation area of the irradiation lights L1 and L2 adjusted by the light-shielding plate 54 (details will be described later). As Figure 2As shown, the moving mechanism 70 relatively moves the workpiece support portion 25, i.e., the workpiece W, with respect to the irradiation regions IA of the plurality of light sources 41 and 42. More specifically, the moving mechanism 70 causes the workpiece support portion 25, i.e., the workpiece W, to repeatedly reciprocate on an arc track of a swing arm 71 centered on a specified center position CT. In this case, the moving mechanism 70 may also move the workpiece support portion 25 in such a manner that the moving direction MD is switched after the workpiece W has completely passed through the irradiation region IA based on a control signal from the controller 100. That is, the moving mechanism 70 moves the workpiece support portion 25 on the arc track, ends the forward path operation at the moment when the workpiece W placed on the workpiece support portion 25 has completely passed through the irradiation region IA, and causes the workpiece support portion 25 to perform a return path operation in a manner of moving back in the opposite direction. The moving mechanism 70 repeatedly performs such reciprocating operations.

[0046] Return Figure 1 , the light shielding plate 54 has a function as a light shielding member (mask) for adjusting the irradiation regions of the irradiation lights L1 and L2 irradiated from the light sources 41 and 42 (the reach ranges of the irradiation lights L1 and L2 on the surface of the workpiece W). The light shielding plate 54 includes an opening portion 54x through which the irradiation lights L1 and L2 pass (refer to Figure 2 ). The portion of the light shielding plate 54 other than the opening portion 54x is a light shielding portion 54y that does not allow the irradiation lights L1 and L2 to pass. As Figure 2 shown, the light shielding plate 54 allows the irradiation lights L1 and L2 to pass only through the opening portion 54x, thereby restricting (adjusting) the irradiation region IA of the irradiation lights L1 and L2 reaching the workpiece W.

[0047] Figure 3 is a diagram for explaining the opening portion 54x of the light shielding plate 54. As Figure 3 shown, the opening portion 54x of the light shielding plate 54 has a first opening 54a corresponding to the irradiation light L1 irradiated from the light source 41 and a second opening 54b corresponding to the irradiation light L2 irradiated from the light source 42. The first opening 54a allows only a part of the irradiation light L1 to pass, and the second opening 54b allows only a part of the irradiation light L2 to pass.

[0048] As Figure 3As shown, the opening portion 54x is formed to gradually expand in a direction (outer edge of the circular arc track) away from the center position CT of the circular arc track of the moving mechanism 70 when viewed from a direction intersecting the surface of the workpiece W. Specifically, at the opening portion 54x, the region on the center position CT side of the circular arc track in the second opening 54b is the narrowest opening region, and the second opening 54b gradually expands toward the region on the outer edge side of the circular arc track in the second opening 54b. In addition, at the opening portion 54x, the region of the first opening 54a continuous with the second opening 54b is set to have the same degree of opening region as the region of the second opening 54b continuous with this region. And at the opening portion 54x, the first opening 54a is formed to gradually expand from the region continuous with the second opening 54b toward the outer edge side of the circular arc track. The opening portion 54x formed with the first opening 54a and the second opening 54b is formed to gradually expand in a direction (outer edge of the circular arc track) away from the center position CT of the circular arc track based on the moving mechanism 70 as described above.

[0049] When the moving mechanism 70 moves the workpiece W at a prescribed angular velocity (moves on the circular arc track), on the workpiece W, the circumferential velocity on the outer edge side of the circular arc track is larger than the circumferential velocity on the center position CT side of the circular arc track. Regarding this, as described above, by forming the opening portion 54x to gradually expand from the center position CT of the circular arc track toward the outer edge of the circular arc track, it is possible to equalize the irradiation amounts on the center position CT side and the outer edge side of the circular arc track on the workpiece W.

[0050] The first opening 54a constituting the opening portion 54x is set to a contracted shape obtained by indenting so that the portion corresponding to the center (optical axis center) of the irradiation light L1 irradiated from the light source 41, that is, the center corresponding portion 54c, is recessed inward (toward the optical axis center). Similarly, the second opening 54b constituting the opening portion 54x is set to a contracted shape obtained by indenting so that the portion corresponding to the center (optical axis center) of the irradiation light L2 irradiated from the light source 42, that is, the center corresponding portion 54d, is recessed inward (toward the optical axis center). By forming the opening region close to the optical axis center small in this way, it is possible to suppress the irradiation amount at the optical axis center where the illuminance is high, and thus irradiate the workpiece W with light more uniformly.

[0051] As Figure 3 shown, the portions of the first opening 54a and the second opening 54b corresponding to the overlapping portion of the irradiation lights L1 and L2 are set to a contracted shape obtained by indenting inward. In this way, by forming the opening region of the overlapping portion of the irradiation lights L1 and L2 small, it is possible to suppress the irradiation amount at the overlapping portion of the irradiation lights L1 and L2 where the illuminance is high, and thus irradiate the workpiece W with light more uniformly.

[0052] The irradiation regions of the irradiation lights L1 and L2 divided by the opening portion 54x are set such that the irradiated portions of the workpiece W irradiated with the irradiation lights L1 and L2 include the center Wc of the workpiece W and the peripheral end positions of the workpiece W. The peripheral end positions of the workpiece here are the first peripheral end position W1 and the second peripheral end position W2 located on the side opposite to the first peripheral end position W1 with the center Wc of the workpiece W interposed therebetween.

[0053] The controller 100 controls each structure included in the substrate processing apparatus 1. The controller 100 is constituted by one or more control computers. Figure 4 is a block diagram illustrating the hardware configuration of the controller 100. For example, the controller 100 has Figure 4 the circuit 120 shown. The circuit 120 includes one or more processors 121, a memory 122, a storage device 123, and an input / output port 124. The storage device 123 has, for example, a computer-readable storage medium such as a hard disk. The storage medium stores a program for causing the substrate processing apparatus 1 to execute a prescribed substrate processing process. The storage medium may also be a non-volatile semiconductor memory, a removable medium such as a magnetic disk and an optical disk. The memory 122 temporarily stores the program loaded from the storage medium of the storage device 123 and the operation results of the processor 121. The processor 121 cooperates with the memory 122 to execute the above program, thereby constituting the above respective functional modules. The input / output port 124 inputs and outputs electrical signals to and from each part controlled by the controller 100 in accordance with an instruction from the processor 121.

[0054] In addition, the hardware configuration of the controller 100 is not necessarily limited to constituting each functional module by a program. For example, each functional module of the controller 100 may also be constituted by a dedicated logic circuit or an ASIC (Application Specific Integrated Circuit) obtained by integrating the dedicated logic circuit.

[0055] Next, the operation and effects of the substrate processing apparatus 1 according to the present embodiment will be described.

[0056] The substrate processing apparatus 1 according to this embodiment includes: a workpiece support portion 25 configured to support a workpiece W on which a resist film is formed; and a plurality of light sources 41, 42 that irradiate irradiation light L1 including vacuum ultraviolet light. In addition, the substrate processing apparatus 1 further includes a light shielding plate 54, and only the irradiation light L1, L2 passes through the opening portion 54x of the light shielding plate 54, thereby restricting the irradiation regions of the irradiation light L1, L2 reaching the workpiece W. In addition, the substrate processing apparatus 1 further includes a moving mechanism 70 that relatively moves the workpiece support portion 25 with respect to the plurality of light sources 41, 42 so that the irradiated portions of the workpiece W irradiated with the irradiation light L1, L2 change over time. In such a substrate processing apparatus 1, the plurality of light sources 41, 42 are disposed at different positions in a direction intersecting the moving direction in which the workpiece W is moved by moving the workpiece support portion 25 by the moving mechanism 70.

[0057] In the substrate processing apparatus 1 according to this embodiment, the state is set in which the irradiation regions of the irradiation light L1, L2 emitted from the plurality of light sources 41, 42 are restricted by the light shielding plate 54. Moreover, in this state, the workpiece support portion 25 (i.e., the workpiece W) is moved by the moving mechanism 70 so that the irradiated portion on the workpiece W changes over time. In this way, by moving the workpiece W to change the irradiated portion on the workpiece W, vacuum ultraviolet light can be uniformly irradiated in the moving direction of the workpiece W. In addition, by disposing the plurality of light sources 41, 42 at different positions in a direction intersecting the moving direction of the workpiece W, vacuum ultraviolet light can be uniformly irradiated not only in the moving direction of the workpiece W but also in a direction intersecting the moving direction of the workpiece W. As described above, according to the substrate processing apparatus 1 according to this embodiment, vacuum ultraviolet light can be uniformly irradiated in the moving direction of the workpiece W and in a direction intersecting the moving direction, so that light including vacuum ultraviolet light can be uniformly irradiated over a wide range of the workpiece W.

[0058] The plurality of light sources 41, 42 may also be disposed at positions where a part of the irradiation portions of the irradiation light L1, L2 emitted from the respective light sources 41, 42 overlap each other at the same time. In this way, by providing an overlapping range for the irradiation light L1, L2 from the plurality of light sources 41, 42, for example, the light can be overlapped in a region where the illuminance is low (the outer region when viewed from the optical axis center). Therefore, it is possible to suppress the deviation of the illuminance of the irradiation portion by using the plurality of light sources 41, 42. As a result, light including vacuum ultraviolet light can be irradiated more uniformly on the workpiece W.

[0059] The irradiation area can also be set such that the irradiated portion on the workpiece W at least at a certain moment includes the center Wc of the workpiece W, the first circumferential end position W1 on the workpiece W, and the second circumferential end position W2 located on the opposite side of the center Wc of the workpiece W across the center Wc of the workpiece W. In this way, by making the irradiated portion of the moving workpiece W at a certain moment include the center Wc of the workpiece W and both ends (the first circumferential end position W1 and the second circumferential end position W2), the workpiece W can be irradiated more uniformly with light containing vacuum ultraviolet light.

[0060] The moving mechanism 70 can also cause the workpiece support portion 25 to repeatedly reciprocate on an arc track centered on a specified position. By causing the workpiece support portion 25 to perform a reciprocating motion on the arc track, the required space can be suppressed, for example, compared with the case of rotating the workpiece support portion 25.

[0061] The moving mechanism 70 can also move the workpiece support portion 25 in such a manner that the moving direction is switched after the workpiece W has completely passed through the irradiation area. In this way, by causing the workpiece W to turn back after completely passing through the irradiation area, it is possible to suppress the irradiation spot caused by acceleration and deceleration during turning back, which is a problem in the case of turning back during passage through the irradiation area.

[0062] The opening portion 54x of the light shielding plate 54 can also be formed to gradually expand in a direction away from the center of the arc track when viewed from a direction intersecting the surface of the workpiece W supported by the workpiece support portion 25. By forming the opening portion 54x in this way, the irradiation amount can be made uniform on the center side and the outer side of the arc track.

[0063] It can also be that the center corresponding portions 54c, 54d corresponding to the centers (optical axis centers) of the light of the respective light sources of the plurality of light sources 41, 42 in the opening portion 54x of the light shielding plate 54 are indented inward. Thereby, it is possible to suppress the irradiation amount at the optical axis center where the illuminance is high, and thus irradiate the workpiece W more uniformly with light containing vacuum ultraviolet light.

[0064] The substrate processing apparatus 1 according to the present embodiment has been described above, but the substrate processing apparatus according to one aspect of the present disclosure is not limited thereto.

[0065] For example, in the above embodiment, it has been described that the plurality of light sources 41, 42 are provided on the same line intersecting the moving direction of the workpiece W (that is, provided at the same position in the moving direction), but it is not limited thereto. Figure 5 It is a diagram illustrating the structure according to the modification example. As Figure 5As shown, it is also possible that a plurality of light sources 141 and 142 are arranged at different positions in the moving direction of the workpiece W. With such a structure, compared with the case where a plurality of light sources are arranged at the same position in the moving direction, space can be saved in the direction crossing the moving direction. Therefore, for example, the design freedom of other devices such as the structure related to cooling can be improved.

[0066] In addition, in Figure 5 the structure shown, it is also possible to arrange the positions of the plurality of light sources 141 and 142 such that the irradiation portions (the irradiation portions on the workpiece W) of the irradiation light emitted from each of the plurality of light sources 141 and 142 at the same time do not overlap. In this way, by adopting a structure in which the irradiation portions of the plurality of light sources 141 and 142 do not interfere with each other, the opening portion 154x of the light shielding plate 154 can be made into a simple shape, and thus the design of the opening portion 154x can be easily performed. Specifically, the opening portions 154x corresponding to the respective light sources 141 and 142, that is, the first opening 154a and the second opening 154b, can be designed independently without considering the irradiation light of each other.

[0067] Moreover, in Figure 5 the structure shown, a certain position on the workpiece W moved by the moving mechanism can also sequentially pass through the irradiation regions of the irradiation light passing through the mutually independent first opening 154a and second opening 154b. That is, the plurality of light sources 141 and 142 can also be arranged such that a part of the region on the moving workpiece W becomes the irradiation portion of the irradiation light emitted from one light source 141 and then becomes the irradiation portion of the irradiation light emitted from the other light source 142. Even in a structure where the irradiation portions of the plurality of light sources 141 and 142 do not overlap at the same time, the workpiece W can be uniformly irradiated with light by adjusting the cumulative irradiation amount obtained by accumulating the irradiation amounts at different times.

[0068] Finally, various exemplary embodiments included in the present disclosure are described in [E1] to [E10] below.

[0069] [E1] A substrate processing apparatus, comprising:

[0070] a substrate support portion that can support a substrate on which a resist film is formed; a plurality of light sources that irradiate irradiation light including vacuum ultraviolet light; and a light shielding plate that allows the irradiation light to pass only through the opening portion of the light shielding plate, thereby restricting the irradiation region of the irradiation light reaching the substrate. The substrate processing apparatus further includes a moving mechanism that relatively moves the substrate support portion with respect to the plurality of light sources so that the irradiated portion of the substrate irradiated with the irradiation light changes over time. The plurality of light sources are arranged at different positions in a direction crossing the moving direction in which the substrate support portion is moved by the moving mechanism to move the substrate.

[0071] [E2] The substrate processing apparatus according to [E1], wherein

[0072] A plurality of light sources are arranged at positions where the irradiation portions of the irradiation light emitted from the respective light sources at the same time partially overlap each other.

[0073] [E3] The substrate processing apparatus according to [E1] or [E2], wherein

[0074] The irradiation area is set such that the irradiation portion at least at a certain moment includes the center of the substrate, the first peripheral end position on the substrate, and the second peripheral end position on the side opposite to the first peripheral end position across the center of the substrate.

[0075] [E4] The substrate processing apparatus according to any one of [E1] to [E3], wherein

[0076] The moving mechanism repeatedly reciprocates the substrate support portion on an arc track centered on a specified position.

[0077] [E5] The substrate processing apparatus according to [E4], wherein

[0078] The moving mechanism moves the substrate support portion in such a manner that the moving direction is switched after the substrate has completely passed through the irradiation area.

[0079] [E6] The substrate processing apparatus according to any one of [E1] to [E5], wherein

[0080] The opening portion of the light shielding plate is formed to gradually expand in a direction away from the center of the arc track when viewed from a direction intersecting the surface of the substrate supported by the substrate support portion.

[0081] [E7] The substrate processing apparatus according to any one of [E1] to [E6], wherein

[0082] The portions of the opening portion of the light shielding plate corresponding to the centers of the light of the respective light sources among the plurality of light sources are indented inward.

[0083] [E8] The substrate processing apparatus according to any one of [E1] to [E7], wherein

[0084] The plurality of light sources are arranged at different positions in the moving direction of the substrate.

[0085] [E9] The substrate processing apparatus according to [E8], wherein

[0086] The plurality of light sources are arranged at positions where the irradiation portions of the irradiation light emitted from the respective light sources at the same time do not overlap each other.

[0087] [E10]The substrate processing apparatus according to [E9], wherein,

[0088] A plurality of light sources are arranged such that a part of an area on a moving substrate becomes an irradiated portion of irradiation light emitted from one light source and then becomes an irradiated portion of irradiation light emitted from another light source.

[0089] Description of reference numerals

[0090] 1: Substrate processing apparatus; 25: Workpiece support portion (substrate support portion); 41, 42, 141, 142: Light sources; 54, 154: Light shielding plates; 54x, 154x: Opening portions; 70: Moving mechanism; IA: Irradiation area; L1, L2: Irradiation light; MD: Moving direction; W: Workpiece (substrate); W1, W2: Peripheral end positions; Wc: Center.

Claims

1. A substrate processing apparatus, comprising: a substrate support portion configured to support a substrate having a resist film formed thereon; a plurality of light sources that irradiate irradiation light including vacuum ultraviolet light; a light shielding plate that allows the irradiation light to pass only through an opening portion of the light shielding plate, thereby restricting an irradiation region of the irradiation light reaching the substrate; and a moving mechanism that relatively moves the substrate support portion with respect to the plurality of light sources so that an irradiated portion of the substrate irradiated with the irradiation light changes over time, wherein the plurality of light sources are disposed at different positions in a direction intersecting a moving direction in which the substrate support portion is moved to move the substrate by the moving mechanism.

2. The substrate processing apparatus according to claim 1, wherein the plurality of light sources are disposed at positions where irradiation portions of the irradiation light emitted from the respective light sources at the same time partially overlap each other.

3. The substrate processing apparatus according to claim 1, wherein the irradiation region is set such that the irradiated portion at least at a certain moment includes the center of the substrate, a first peripheral end position on the substrate, and a second peripheral end position located on the opposite side of the center of the substrate from the first peripheral end position.

4. The substrate processing apparatus according to any one of claims 1 to 3, wherein the moving mechanism repeatedly reciprocates the substrate support portion on an arc track centered on a specified position.

5. The substrate processing apparatus according to claim 4, wherein the moving mechanism moves the substrate support portion in such a manner that the moving direction is switched after the substrate has completely passed through the irradiation region.

6. The substrate processing apparatus according to claim 4, wherein the opening portion of the light shielding plate is formed to gradually expand in a direction away from the center of the arc track when viewed from a direction intersecting the surface of the substrate supported by the substrate support portion.

7. The substrate processing apparatus according to claim 6, wherein a portion of the opening portion of the light shielding plate corresponding to the center of the light of each of the plurality of light sources is indented inward.

8. The substrate processing apparatus according to any one of claims 1 to 3, wherein the plurality of light sources are disposed at different positions in the moving direction of the substrate.

9. The substrate processing apparatus according to claim 8, wherein the plurality of light sources are disposed at positions where the irradiation portions of the irradiation light emitted from the respective light sources at the same time do not overlap each other.

10. The substrate processing apparatus according to claim 9, wherein the plurality of light sources are arranged such that a part of the region on the moving substrate becomes an irradiated portion of the irradiation light emitted from another light source after becoming an irradiated portion of the irradiation light emitted from one light source.

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