Cosmetic refrigeration pen

Abstract

The invention belongs to the technical field of semiconductor refrigeration, and particularly relates to a beauty refrigeration pen which comprises a pen point and a pen holder detachably connected with the pen point, a silica gel head is installed on the pen point, the pen point is provided with a cavity, a semiconductor refrigeration module is arranged in the cavity, a heat dissipation module is further arranged in the cavity, and the heat dissipation module comprises a first heat dissipation assembly and a second heat dissipation assembly. The first heat dissipation assembly comprises a heat dissipation cylinder and a plurality of heat conduction pieces, the heat dissipation cylinder is of a cylindrical hollow structure and is installed in the cavity, the upper end of the heat dissipation cylinder makes contact with the semiconductor refrigeration module, and the heat conduction pieces are distributed on the peripheral side of the heat dissipation cylinder in a circumferential array mode; the second heat dissipation assembly is arranged on the peripheral side of the heat dissipation cylinder, detachably connected with the side wall of the cavity and used for diffusing heat transferred to the heat conduction piece to the outer side of the pen point. The device can carry out accelerated heat dissipation on generated heat in the use process, the effect of sufficient heat dissipation is achieved, and continuous work and use are facilitated.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor refrigeration, and in particular relates to a beauty refrigeration pen. Background Art

[0002] The beauty pen is a kind of wrinkle-removing cosmetic invented by modern people for beauty treatment, mainly used for eye beauty care. It uses negative microwave ions to moderately stimulate the dermis tissue of the eye skin, promote the proliferation of collagen in the decaying skin, and activate the eye skin cells through rolling ball pressing, so that the skin care products can quickly penetrate into the deep layer of the skin, so as to smooth the eye wrinkles, reduce dark circles, improve eye bags, restore eye elasticity, and relieve fatigue.

[0003] As a tool for beauty care, the existing semiconductor beauty cooling pen usually uses cooling technology to achieve the effects of shrinking pores and tightening skin. Although it has certain convenience and effects, it also has some defects and problems in actual application. The core cooling technology of the beauty cooling pen is mainly to use semiconductor cooling chips to achieve cooling applications; semiconductor cooling chips will generate a certain amount of heat when working, and an effective heat dissipation system is required to prevent the system from overheating and affecting performance; most of the current beauty cooling pens have a complex internal structure, involving the coordination of multiple components such as temperature sensors and thermostats, which increases the burden of internal heat dissipation of the pen head, and its main heat dissipation method is to set heat dissipation holes for heat dissipation, resulting in poor heat diffusion and flow effects, poor heat dissipation effects, and the equipment is prone to heat up, which is not convenient for continuous work. Summary of the invention

[0004] In order to solve the problems existing in the prior art, the purpose of the present invention is to provide a beauty cooling pen, which can accelerate the heat dissipation of the heat generated during use, achieve the effect of sufficient heat dissipation, and facilitate continuous working use.

[0005] The technical solution of the present invention is: A beauty cooling pen comprises a pen head, wherein the pen head has a cavity, a semiconductor cooling module is arranged in the cavity, and a heat dissipation module for dissipating heat generated by the semiconductor cooling module is also arranged in the cavity, wherein the heat dissipation module comprises: A first heat dissipation component, comprising a heat dissipation tube and a plurality of heat conductive sheets, wherein the heat dissipation tube is a cylindrical hollow structure, the heat dissipation tube is installed in the cavity, and the upper end of the heat dissipation tube is in contact with the semiconductor refrigeration module, and the plurality of heat conductive sheets are arranged in a circumferential array on the circumference of the heat dissipation tube; The second heat dissipation component is arranged on the peripheral side of the heat dissipation tube and is detachably connected to the side wall of the cavity, and is used for diffusing the heat transferred to the heat conductive sheet to the outside of the pen tip.

[0006] Preferably, the second heat dissipation assembly includes a diffusion portion and an airflow acceleration portion, the diffusion portion is arranged between the airflow acceleration portion and the heat conductive plate, the diffusion portion is used to release the heat transferred to the heat conductive plate to the outside of the pen tip, and the airflow acceleration portion is used to accelerate the flow of heat.

[0007] Preferably, the diffusion portion includes a plurality of heat sinks, which are evenly distributed on the circumference of the heat sink, and a plurality of mounting holes corresponding to the heat sinks are opened on the side wall where the pen tip is located in the cavity, and the mounting holes pass through the side wall of the cavity, and the heat sink includes a heat conducting plate and a plurality of heat dissipating fins, which are evenly distributed on the same side of the heat conducting plate, and the heat conducting plate is installed in the mounting hole, and the side of the heat conducting plate facing away from the heat dissipating fins is in contact with the heat conducting plate.

[0008] Preferably, the airflow acceleration unit includes a plurality of fans corresponding one-to-one to the heat conducting plates, the fans are mounted on the pen tip, and the fans are directly opposite to a side of the heat conducting plate having heat dissipation fins.

[0009] Preferably, the heat-conducting tube, the heat-conducting sheet, the heat-conducting plate and the heat-dissipating fins are all made of metal heat-conducting materials.

[0010] Preferably, the semiconductor refrigeration module comprises a plurality of layers of semiconductor refrigeration fins, which are arranged in a linear array along the axis of the heat dissipation tube, and the plurality of layers of semiconductor refrigeration fins are in a tower-shaped structure as a whole, and the semiconductor refrigeration fins of the bottom layer are in contact with the heat dissipation tube.

[0011] Preferably, the semiconductor refrigeration plate includes a conductor plate and a plurality of refrigeration units, the plurality of refrigeration units are evenly distributed on the conductor plate, the refrigeration units are composed of a plurality of N-type and P-type semiconductor materials arranged alternately, and the N-type and P-type semiconductor materials are electrically connected to the conductor plate.

[0012] Preferably, the conductor plate is in a disc shape, a plurality of the conductor plates are coaxially arranged, and the radii of the plurality of the conductor plates gradually increase toward one side of the heat dissipation tube.

[0013] Preferably, a heat dissipation plate is further arranged between the heat dissipation tube and the semiconductor refrigeration module, and a plurality of heat dissipation holes are opened on the heat dissipation plate, and the plurality of heat dissipation holes are distributed in a honeycomb shape.

[0014] Preferably, heat insulation cotton is arranged between the lower side of the heat dissipation cylinder and the lower side wall of the cavity.

[0015] Compared with the prior art, the beauty cooling pen of the present invention has the following beneficial effects: During use of the device, the heat generated by the semiconductor refrigeration module can be fully transferred to the heat conductive sheet by utilizing the heat dissipation tube, and then the heat can be quickly and evenly distributed through multiple heat conductive sheets on the periphery of the heat dissipation tube, so that the heat flows outward from multiple positions to prevent local overheating, and then the cooperation of the second heat dissipation component is utilized to accelerate the diffusion of the heat transferred to the heat conductive sheet to the outside of the cavity of the pen tip, so that the heat can be fully diffused, thereby improving the heat dissipation effect, thereby ensuring the efficient operation of the semiconductor refrigeration module and preventing overheating, and facilitating continuous working use. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a system diagram of the overall structure of the beauty cooling pen in an embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of a pen tip in an embodiment of the present invention; Figure 3 It is a structural schematic diagram of a pen holder in an embodiment of the present invention; Figure 4 A front view of a pen tip in an embodiment of the present invention; Figure 5 It is a right side view of the pen tip in the embodiment of the present invention; Figure 6 A longitudinal cross-sectional view of a beauty cooling pen according to an embodiment of the present invention; Figure 7 Schematic diagram of the internal structure of the pen cap in an embodiment of the present invention; Figure 8 It is a structural schematic diagram of a magnet assembly in an embodiment of the present invention; Fig. 9 It is a structural schematic diagram of a semiconductor refrigeration module in an embodiment of the present invention; Fig.10 A schematic diagram of the structure of a semiconductor refrigeration sheet in an embodiment of the present invention; Fig.11 is a schematic structural diagram of a first heat dissipation component in an embodiment of the present invention; Fig.12 A schematic diagram of the structure of a heat sink in an embodiment of the present invention; Fig.13 Schematic diagram of the structure of the fan in the embodiment of the present invention.

[0017] Description of reference numerals: 1. Pen tip; 11. Pen cap; 12. Handle; 2. Semiconductor refrigeration module; 21. Semiconductor refrigeration sheet; 211. Conductor plate; 212. Refrigeration unit; 3. Heat sink; 4. Heat conducting sheet; 5. Heat sink; 51. Heat conducting plate; 52. Heat sink fin; 6. Fan; 7. Thermal insulation cotton; 8. Heat sink; 9. Silicone hole; 10. Magnet assembly; 13. Pen stand. DETAILED DESCRIPTION

[0018] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0019] Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in the field without making any creative work shall fall within the scope of protection of the present invention.

[0020] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in the field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0021] See also Figures 1 to 13 As shown, in order to accelerate the heat dissipation of the heat generated during use, achieve the effect of sufficient heat dissipation, and facilitate continuous work and use, this embodiment provides a beauty cooling pen, including a pen head 1 and a pen holder 13 detachably connected to the pen head 1.

[0022] See also Figures 2 to 7 As shown, the pen tip 1 is the key to achieving the direct skin cooling beauty effect. The entire pen tip 1 is 540 mm high. According to the structure of the pen tip 1, the pen tip 1 can be divided into a pen cap 11 and a handle 12. The pen cap 11 and the handle 12 are connected by bolts, and the two are isolated by heat insulation cotton 7. The upper end of the pen cap 11 is similar to a trapezoid, and the lower end is in a rectangular shape. The pen cap 11 is composed of a silicone head, a silicone head fixing module, a semiconductor refrigeration module 2, a heat dissipation module, a circuit module and a battery module. The pen holder 13 is the heat dissipation and auxiliary function area of ​​the beauty cooling pen. It realizes dual heat dissipation technology through the heat dissipation copper pipe and water tank of the water cooling device and the fan 6 and heat sink 5 of the air cooling device, further improving the heat dissipation efficiency of the entire system and ensuring the stable operation and long-term stability of the equipment. The pen holder 13 is designed with a pen tip 1 plug-in device to ensure the correct alignment and stable connection between the pen tip 1 and the pen holder 13. The pen holder 13 is also provided with a battery module to provide necessary power support. At the same time, in order to ensure stable operation of the system, the pen tip 1 is also provided with a step-down module, which reduces the power supply voltage to a level suitable for the operation of the microcontroller and other electronic components.

[0023] See also Figures 6 to 8As shown, the silicone head fixing module is composed of a silicone hole 9 arranged in the middle of the top of the pen cap 11, and a magnet assembly 10 fixed inside the pen cap 11. The shape and size of the silicone hole 9 are designed to fit the silicone head tightly. The magnet assembly 10 is fixed in the pen cap 11 using hot melt adhesive. Its shape is similar to a basin and surrounds the silicone hole 9. When in use, the silicone head is inserted into the silicone hole 9, and the magnet assembly 10 is used to provide additional fixing suction for the silicone head, so that the silicone head can be stably installed on the pen head 1, ensuring that the silicone head will not loosen or shift during operation, and it is convenient for users to replace or clean the silicone head, and there is no need to worry about it falling off when the beauty cooling pen is working.

[0024] See also Figure 6 and Figure 7 As shown, a cavity for installing a semiconductor refrigeration module 2 and a heat dissipation module is provided inside the pen cap 11. The semiconductor refrigeration module 2 is installed in the cavity of the pen cap 11 near the magnet assembly 10, and its cooling end cools the silicone head. The heat dissipation module is arranged in the cavity and is used to ensure the efficient operation of the refrigeration plate and prevent overheating. The circuit device has a built-in intelligent control circuit. The specific intelligent control circuit uses a single-chip microcomputer of model STM32 as the core of the whole system, which is responsible for receiving temperature data from the temperature sensor. The temperature sensor is arranged on the silicone hole 9 and the semiconductor refrigeration module 2, and converts these analog signals into digital signals through the temperature transmitter for processing. At the same time, the single-chip microcomputer is also responsible for controlling the semiconductor refrigeration plate 21 to realize the refrigeration function of the beauty refrigeration pen, and can dynamically adjust the refrigeration intensity of the semiconductor refrigeration module 2, bringing users an accurate and comfortable beauty care experience. In addition, it is also equipped with a battery device to extend the use time of the pen head 1. The entire pen head 1 part has been considered for safety, including the use of high temperature resistant materials, the setting of overheating protection mechanisms, etc., to ensure that all electronic components meet safety standards. In addition, the shape design of the pen head 1 conforms to the principle of ergonomics, ensuring the user's comfortable grip and convenient operation during use. In addition, a display screen and a knob are also provided on the pen head 1. The display screen is used to provide real-time information to the user, such as temperature display or working status, while the knob is used to adjust the temperature of the control device refrigeration. The single chip will adjust the working state of the semiconductor refrigeration sheet 21 according to the user's settings. The design of the entire system takes into account integration, thermal management, user-friendly interface, safety and power management to ensure that the beauty cooling pen is both efficient and safe.

[0025] See also Figure 6 , Figure 7 and Fig.11As shown, the heat dissipation module is used to dissipate the heat generated by the semiconductor refrigeration module 2. The specific heat dissipation module includes a first heat dissipation component and a second heat dissipation component. The first heat dissipation component includes a heat dissipation tube 3 and a plurality of heat conductive sheets 4. The heat dissipation tube 3 is a cylindrical hollow structure. The heat dissipation tube 3 is installed in the cavity, and the upper end of the heat dissipation tube 3 is in contact with the semiconductor refrigeration module 2. The plurality of heat conductive sheets 4 are arranged in a circular array on the circumference of the heat dissipation tube 3. When the equipment is running, the heat dissipation tube 3 can evenly disperse the heat generated by the semiconductor refrigeration module 2 to the plurality of heat conductive sheets 4 to prevent local overheating and ensure the efficient operation of the equipment. Its shape and size are carefully designed to maximize the heat dissipation area and reduce thermal resistance, while meeting the requirements of product volume and weight restrictions.

[0026] See also Figure 7 , Fig.12 and Fig.13 As shown, the second heat dissipation component is arranged on the peripheral side of the heat dissipation tube 3 and is detachably connected to the side wall of the cavity. Specifically, the second heat dissipation component includes a diffusion part and an airflow acceleration part, the diffusion part is arranged between the airflow acceleration part and the heat conductive sheet 4, the diffusion part includes a plurality of heat dissipation sheets 5, the plurality of heat dissipation sheets 5 are evenly distributed on the peripheral side of the heat dissipation tube 3, and the side wall where the pen tip 1 is located in the cavity is provided with a plurality of mounting holes corresponding to the heat dissipation sheets 5, the mounting holes penetrate the side wall of the cavity, the heat dissipation sheets 5 include a heat conductive plate 51 and a plurality of heat dissipation fins 52, the plurality of heat dissipation fins 52 are evenly distributed on the same side of the heat conductive plate 51, the heat conductive plate 51 is installed in the mounting hole, and the side of the heat conductive plate 51 facing away from the heat dissipation fins 52 is in contact with the heat conductive sheet 4. The structural design of the heat dissipation sheet 5 is intended to improve the efficiency of heat dissipation by increasing the heat dissipation area, and is used to release the heat transferred to the heat conductive sheet 4 to the outside of the pen tip 1. During design, the heat sink 5 has a plurality of heat dissipation fins 52 on the side facing away from the heat conducting sheet 4. The heat dissipation fins 52 are arranged at a certain interval to optimize air flow and provide sufficient surface area to promote convection heat transfer. The design of the heat dissipation fins 52 will consider their geometric shape, size and arrangement to balance heat dissipation efficiency and mechanical strength. Generally, the heat dissipation fins 52 are mainly copper sheets in a rectangular array, and the heat dissipation fins 52 can be in a rectangular plate shape or a wavy shape.

[0027] See also Figure 2 , Figure 7 and 13As shown, the airflow acceleration part in the second heat dissipation assembly includes a fan 6 corresponding to a plurality of heat conducting plates 51 one by one, and the fan 6 is mounted on the pen tip 1, and the fan 6 is directly opposite to the side of the heat conducting plate 51 having the heat dissipation fins 52. Preferably, the number of fans 6 is generally two, which are respectively located on the front and back sides of the pen tip 1 and are effectively fixed by screw holes located at the four corners. When in use, the fan 6 accelerates the flow of air and heat by forced convection, and quickly takes away the heat generated by the semiconductor refrigeration module 2 and transferred to the heat conducting plate 4 through the heat dissipation tube 3, thereby improving the heat dissipation efficiency of the entire system.

[0028] Preferably, in order to ensure high efficiency of heat dissipation, the heat-conducting tube, the heat-conducting sheet 4 , the heat-conducting plate 51 and the heat-dissipating fins 52 are all made of metal heat-conducting materials, and copper is preferably used.

[0029] Furthermore, the heat insulation cotton 7 is located below the heat dissipation tube 3, specifically between the lower side of the heat dissipation tube 3 and the lower side wall of the cavity, and its main function is to reduce the heat transfer from the pen cap 11 to other parts of the beauty cooling pen, especially the grip 12 area held by the user. This can prevent high temperature from affecting the operation of the circuit device, and prevent the user from feeling uncomfortable during use, thereby improving the comfort of use.

[0030] See also Figure 7 , Fig. 9 and Fig.10 As shown, in order to ensure the cooling effect while maintaining a good heat dissipation effect. The semiconductor refrigeration module 2 is composed of a multi-layer semiconductor refrigeration sheet 21, which is located directly below the magnet assembly 10 and directly above the heat dissipation tube 3. The multi-layer semiconductor refrigeration sheet 21 is linearly arrayed along the axial direction of the heat dissipation tube 3, and the multi-layer semiconductor refrigeration sheet 21 is a tower-shaped structure as a whole, and the bottom semiconductor refrigeration sheet 21 is in contact with the heat dissipation tube 3. The basic component unit of the semiconductor refrigeration sheet 21 is a semiconductor thermocouple, and the material constituting the semiconductor thermocouple is an N-type semiconductor and a P-type semiconductor. Specifically, the semiconductor refrigeration sheet 21 includes a conductor plate 211 and a plurality of refrigeration units 212, the conductor plate 211 is disc-shaped, and a plurality of conductor plates 211 are coaxially arranged, and the radius of a plurality of conductor plates 211 gradually increases toward the side of the heat dissipation tube 3, and a plurality of refrigeration units 212 are evenly distributed on the conductor plate 211, and the refrigeration unit 212 is composed of a plurality of N-type and P-type semiconductor materials arranged alternately, and the N-type and P-type semiconductor materials are electrically connected to the metal conductor plate 211, forming an efficient thermoelectric refrigeration system. The device adopts a tower-shaped multi-layer semiconductor refrigeration plate 21 structure, so that two adjacent semiconductor refrigeration plates 21 form a larger heat dissipation space, so that the heat dissipated by the hot surface of the semiconductor refrigeration plate 21 can reach 2-5 times the heat absorbed by the cold surface, thereby improving the overall heat dissipation effect of the multi-layer semiconductor refrigeration plate 21.

[0031] See also Figure 7As shown, a heat sink 8 is provided between the heat sink 3 and the semiconductor refrigeration module 2 . The heat sink 8 is provided with a plurality of heat dissipation holes, which are distributed in a honeycomb shape, and can more evenly disperse the heat on each heat conducting sheet 4 .

[0032] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A beauty cooling pen, comprising a pen head (1), wherein the pen head (1) has a cavity, wherein a semiconductor cooling module (2) is arranged in the cavity, and wherein: The cavity is also provided with a heat dissipation module for dissipating heat generated by the semiconductor refrigeration module (2), the heat dissipation module comprising: A first heat dissipation component, comprising a heat dissipation tube (3) and a plurality of heat conductive sheets (4), wherein the heat dissipation tube (3) is a cylindrical hollow structure, the heat dissipation tube (3) is installed in the cavity, and the upper end of the heat dissipation tube (3) is in contact with the semiconductor refrigeration module (2), and the plurality of heat conductive sheets (4) are arranged in a circumferential array on the circumference of the heat dissipation tube (3); A second heat dissipation component is arranged on the peripheral side of the heat dissipation cylinder (3) and is detachably connected to the side wall of the cavity, and is used to diffuse the heat transferred to the heat conducting sheet (4) toward the outside of the pen tip (1).

2. A beauty cooling pen according to claim 1, characterized in that: The second heat dissipation component comprises a diffusion part and an airflow acceleration part, the diffusion part is arranged between the airflow acceleration part and the heat conducting plate (4), the diffusion part is used to release the heat transferred to the heat conducting plate (4) to the outside of the pen tip (1), and the airflow acceleration part is used to accelerate the flow of heat.

3. A beauty cooling pen according to claim 2, characterized in that: The diffusion portion comprises a plurality of heat sinks (5), the plurality of heat sinks (5) are evenly distributed around the circumference of the heat sink tube (3), and a plurality of mounting holes corresponding to the heat sinks (5) are opened on the side wall where the pen tip (1) is located in the cavity, the mounting holes penetrate the side wall of the cavity, the heat sink (5) comprises a heat conducting plate (51) and a plurality of heat dissipating fins (52), the plurality of heat dissipating fins (52) are evenly distributed on the same side of the heat conducting plate (51), the heat conducting plate (51) is installed in the mounting holes, and the side of the heat conducting plate (51) facing away from the heat dissipating fins (52) contacts the heat conducting plate (4).

4. A beauty cooling pen according to claim 3, characterized in that: The airflow acceleration unit comprises a fan (6) corresponding one-to-one to the plurality of heat conducting plates (51); the fan (6) is mounted on the pen tip (1), and the fan (6) is directly opposite to a side of the heat conducting plate (51) having a heat dissipation fin (52).

5. The beauty cooling pen according to claim 3, characterized in that: The heat-conducting tube, the heat-conducting sheet (4), the heat-conducting plate (51) and the heat-dissipating fins (52) are all made of metal heat-conducting materials.

6. A beauty cooling pen according to claim 1, characterized in that: The semiconductor refrigeration module (2) comprises a plurality of layers of semiconductor refrigeration sheets (21), the plurality of layers of semiconductor refrigeration sheets (21) being arranged in a linear array along the axial direction of the heat dissipation tube (3), and the plurality of layers of semiconductor refrigeration sheets (21) being in a tower-shaped structure as a whole, and the semiconductor refrigeration sheets (21) at the bottom layer being in contact with the heat dissipation tube (3).

7. A beauty cooling pen according to claim 6, characterized in that: The semiconductor refrigeration sheet (21) comprises a conductor plate (211) and a plurality of refrigeration units (212), wherein the plurality of refrigeration units (212) are evenly distributed on the conductor plate (211), and the refrigeration units (212) are composed of a plurality of N-type and P-type semiconductor materials arranged alternately, and the N-type and P-type semiconductor materials are electrically connected to the conductor plate (211).

8. The beauty cooling pen according to claim 7, characterized in that: The conductor plate (211) is in the shape of a disk, a plurality of the conductor plates (211) are coaxially arranged, and the radius of the plurality of conductor plates (211) gradually increases towards one side of the heat dissipation tube (3).

9. The beauty cooling pen according to claim 1, characterized in that: A heat dissipation plate (8) is further provided between the heat dissipation cylinder (3) and the semiconductor refrigeration module (2), and a plurality of heat dissipation holes are provided on the heat dissipation plate (8), and the plurality of heat dissipation holes are distributed in a honeycomb shape.

10. The beauty cooling pen according to claim 1, characterized in that: Heat insulation cotton (7) is provided between the lower side of the heat dissipation cylinder (3) and the lower side wall of the cavity.

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