Flushing system and flushing method for chemical mechanical grinding machine table

Abstract

The invention relates to a flushing system and a flushing method of a chemical mechanical grinding machine table. According to the flushing system, the outlet end of a grinding fluid unit is connected with the inlet end of a target pipeline, the outlet end of a first solution pipeline and the outlet end of a second solution pipeline, the grinding fluid unit comprises a first valve, the inlet end of the first solution pipeline is connected with a first solution supply end, and the inlet end of the second solution pipeline is connected with a second solution supply end; a second valve is arranged at the inlet end of the first solution pipeline, and a third valve is arranged at the inlet end of the second solution pipeline; fourth valves are arranged at the outlet ends of the first solution pipeline and the second solution pipeline; and when the controller receives a flushing instruction, the opening and closing states of the valve are controlled according to the preset duration. Thus, a set of passages for achieving flushing is constructed in advance, in the flushing process, manual pipeline connection by related personnel is not needed, and the risks of chemical splashing and pipeline connection errors are effectively avoided; and the flushing time is accurately controlled through the controller.

Description

Technical Field

[0001] The present disclosure relates to the field of semiconductor technology, and in particular to a rinsing system and a rinsing method for a chemical mechanical polishing machine. Background Art

[0002] Chemical Mechanical Polishing (CMP) is one of the most common and important planarization processes in semiconductor technology. To ensure the normal use of the chemical mechanical polishing machine, the corresponding pipelines of the chemical mechanical polishing machine need to be cleaned to remove the polishing liquid deposits in the pipelines and valves.

[0003] Currently, relevant personnel connect the pipeline for potassium hydroxide (KOH) input to the pipeline that needs to be cleaned for the first pipeline flushing, and then connect the pipeline for deionized water (DI) input to the pipeline that needs to be cleaned for the second pipeline flushing. However, this process requires manual connection and change of pipelines, which poses the risk of chemical splashing and incorrect pipeline connection. The entire flushing process takes a long time, and it is difficult for humans to accurately control the flushing time. Summary of the invention

[0004] The purpose of the present disclosure is to provide a flushing system and flushing method for a chemical mechanical polishing machine, so as to avoid the risks of chemical splashing and pipeline connection errors, and to accurately control the flushing time.

[0005] In order to achieve the above-mentioned object, the present disclosure provides a first aspect of a flushing system for a chemical mechanical polishing machine, comprising a polishing liquid unit, a target pipeline, a first solution pipeline, a second solution pipeline, a first valve, a second valve, a third valve, a fourth valve, a first solution supply end, a second solution supply end, and a controller;

[0006] The outlet end of the grinding liquid unit is connected to the inlet end of the target pipeline, the outlet end of the first solution pipeline, and the outlet end of the second solution pipeline. The grinding liquid unit includes a first valve for controlling the conduction state of the grinding liquid unit. The inlet end of the first solution pipeline is connected to the first solution supply end, and the inlet end of the second solution pipeline is connected to the second solution supply end.

[0007] The second valve is provided on the inlet end of the first solution pipeline, and the third valve is provided on the inlet end of the second solution pipeline; the fourth valve is provided on the outlet end of the first solution pipeline and the outlet end of the second solution pipeline;

[0008] The controller is connected to the second valve, the third valve and the fourth valve, and is used to control the switch status of the second valve, the third valve and the fourth valve according to a preset duration when a flushing instruction is received.

[0009] Optionally, the grinding liquid unit includes a filter, a supply pipeline and the first valve;

[0010] The filter and the first valve are arranged on the supply pipeline, and the supply pipeline is connected to the grinding liquid supply end and the inlet end of the target pipeline.

[0011] Optionally, the grinding liquid unit further includes a fifth valve disposed on the supply pipeline, and the fifth valve is connected to the controller.

[0012] Optionally, the flushing system includes N grinding liquid units and N target pipelines connected in a one-to-one correspondence.

[0013] Optionally, the first solution pipeline includes a first solution sub-pipeline and a common pipeline; the second solution pipeline includes a second solution sub-pipeline and a common pipeline, the outlet end of the common pipeline is connected to the target pipeline, the inlet end of the common pipeline is connected to the first solution sub-pipeline and the second solution sub-pipeline, and the fourth valve is arranged on the outlet end of the common pipeline.

[0014] Optionally, the second valve includes a plurality of sub-valves; and the third valve includes a plurality of sub-valves.

[0015] A second aspect of the present disclosure provides a method for flushing a chemical mechanical polishing machine, which is applied to a controller of a flushing system of the chemical mechanical polishing machine provided in the first aspect of the present disclosure, and the method comprises:

[0016] If a flushing instruction is received and the polishing liquid unit is in a non-conducting state, the second valve and the fourth valve are controlled to be opened, and the third valve is controlled to be in a closed state, so as to flush the target pipeline with the first solution;

[0017] In response to determining that the duration of flushing the target pipeline with the first solution reaches a first preset duration, controlling the second valve to close and controlling the third valve to open, so as to flush the target pipeline with the second solution;

[0018] In response to determining that the duration of flushing the target pipeline with the second solution reaches a second preset duration, the third valve and the fourth valve are controlled to close, thereby ending the flushing process.

[0019] Optionally, if a flushing instruction is received and the grinding liquid unit is in a non-conducting state, controlling the second valve and the fourth valve to be opened and controlling the third valve to be in a closed state comprises:

[0020] If a flushing instruction is received and the grinding liquid unit is in a non-conducting state, the third valve and the fourth valve are controlled to be opened, and the second valve is controlled to be in a closed state, so as to pre-flush the target pipeline with the second solution;

[0021] In response to determining that the duration of pre-flushing the target pipeline with the second solution reaches a target pre-flushing duration, the second valve is controlled to open and the third valve is controlled to close to flush the target pipeline with the first solution for a first preset duration.

[0022] Optionally, the flushing method further comprises:

[0023] obtaining a state of the first valve;

[0024] In response to receiving the flushing instruction, if the first valve is in an open state, a prompt message is generated, and the prompt message is used to remind the user to close the first valve.

[0025] Optionally, the flushing method further comprises:

[0026] obtaining a state of the fifth valve;

[0027] In response to receiving the flushing instruction, if the fifth valve is in an open state, the fifth valve is controlled to be closed.

[0028] Optionally, controlling the third valve and the fourth valve to close to end the flushing process includes:

[0029] When the third valve and the fourth valve are closed, obtaining the pH value of the most recently flushed liquid;

[0030] According to the pH value, it is determined whether the flushing process is completed.

[0031] Optionally, determining whether the flushing process is finished according to the pH value includes:

[0032] If the pH value does not exceed the preset pH value range, it is determined that the flushing process is finished.

[0033] Optionally, determining whether the flushing process is finished according to the pH value includes:

[0034] If the pH value exceeds the preset pH value range, the third valve and the fourth valve are controlled to open again to continue flushing the target pipeline with the second solution.

[0035] Optionally, the method further comprises:

[0036] If the re-flushing time reaches the preset compensation time, the third valve and the fourth valve are controlled to close, and the steps of obtaining the pH value of the most recently flushed liquid and determining whether the flushing process is ended based on the pH value are re-executed until it is determined that the flushing process is ended.

[0037] Optionally, the method further comprises:

[0038] If the number of the target pipelines is greater than the number threshold, grouping the target pipelines and the fourth valves corresponding to the target pipelines;

[0039] Each group of target pipelines is flushed in turn according to a preset order, wherein different solution supply ends provide flushing solutions to different groups of target pipelines at the same time, and each solution supply end provides flushing solution to a group of target pipelines at the same time.

[0040] In the above technical solution, by setting the first solution pipeline, the second solution pipeline, the first valve, the second valve, the third valve, and the fourth valve, a set of passages that can prevent solutions from backflowing and flushing the target pipeline can be pre-constructed between the first solution supply end and the target pipeline, and between the second solution supply end and the target pipeline, without the need for relevant personnel to manually connect the pipelines, effectively avoiding the risk of chemical splashing and pipeline connection errors. In addition, the controller can control the switch state of the second valve, the third valve, and the fourth valve within a preset time, to achieve precise control of the time for flushing the target pipeline with the first solution and the second solution, and to accurately control the flushing time.

[0041] Other features and advantages of the present disclosure will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present disclosure but do not constitute a limitation of the present disclosure. In the accompanying drawings:

[0043] Figure 1 Schematic diagram of a rinsing system for a chemical mechanical polishing machine provided by an exemplary embodiment of the present disclosure.

[0044] Figure 2 Schematic diagram of a rinsing system for a chemical mechanical polishing machine provided by an exemplary embodiment of the present disclosure.

[0045] Figure 3Schematic diagram of a rinsing system for a chemical mechanical polishing machine provided by an exemplary embodiment of the present disclosure.

[0046] Figure 4 The present invention is a flowchart of a method for rinsing a chemical mechanical polishing machine provided by an exemplary embodiment of the present invention.

[0047] Figure 5 The present invention is a flowchart of a method for rinsing a chemical mechanical polishing machine provided by an exemplary embodiment of the present invention.

[0048] Figure 6 is a block diagram of a controller provided by an exemplary embodiment of the present disclosure. DETAILED DESCRIPTION

[0049] The specific implementation of the present disclosure is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described herein is only used to illustrate and explain the present disclosure, and is not used to limit the present disclosure.

[0050] It should be noted that all actions of acquiring signals, information or data in the present disclosure are carried out in compliance with the relevant data protection laws and policies of the country where the device is located and with the authorization given by the owner of the corresponding device.

[0051] Figure 1 FIG. 1 is a schematic diagram of a rinsing system for a chemical mechanical polishing machine provided by an exemplary embodiment of the present disclosure. Figure 1 As shown, the flushing system includes a grinding liquid unit 10, a target pipeline 11, a first solution pipeline 12, a second solution pipeline 13, a first valve 21, a second valve 22, a third valve 23, a fourth valve 24, a first solution supply end 31, a second solution supply end 32 and a controller 40;

[0052] The outlet end of the grinding liquid unit 10 is connected to the inlet end of the target pipeline 11, the outlet end of the first solution pipeline 12, and the outlet end of the second solution pipeline 13. The grinding liquid unit 10 includes a first valve 21 for controlling the conduction state of the grinding liquid unit 10. The inlet end of the first solution pipeline 12 is connected to the first solution supply end 31, and the inlet end of the second solution pipeline 13 is connected to the second solution supply end 32.

[0053] A second valve 22 is provided at the inlet end of the first solution pipeline 12, and a third valve 23 is provided at the inlet end of the second solution pipeline 13; a fourth valve 24 is provided at the outlet end of the first solution pipeline 12 and the outlet end of the second solution pipeline 13;

[0054] The controller 40 is connected to the second valve 22 , the third valve 23 and the fourth valve 24 , and is used to control the switch states of the second valve 22 , the third valve 23 and the fourth valve 24 according to a preset duration when a flushing instruction is received.

[0055] For example, the grinding liquid unit 10 is used to introduce the grinding liquid provided by the grinding liquid supply end into the target pipeline 11. A first valve 21 is provided in the grinding liquid unit 10, and the conduction state of the grinding liquid unit 10 itself can be controlled by controlling the switch state of the first valve 21. Under normal conditions, the outlet end of the target pipeline 11 can be connected to the chemical mechanical polishing machine, and the inlet end of the grinding liquid unit 10 is connected to the grinding liquid supply end. At this time, the grinding liquid unit 10 is in a conduction state, that is, the first valve 21 is in an open state; the second valve 22, the third valve 23 and the fourth valve 24 are in a closed state, so that the grinding liquid can be prevented from flowing into the first solution pipeline 12 and the second solution pipeline 13, thereby preventing the grinding liquid from flowing into the first solution supply end 31 and the second solution supply end 32 after the second valve 22 and the third valve 23 are opened. Under normal conditions, the polishing liquid flows into the chemical mechanical polishing machine through the polishing liquid unit 10 and the target pipeline 11. However, as the polishing liquid continues to flow through the target pipeline 11, sediments will continue to adhere to the target pipeline 11, which may further cause scratches on the product.

[0056] In the flushing state, the grinding liquid unit 10 is in a non-conducting state, and the first valve 21 is in a closed state at this time to prevent the first solution or the second solution used for flushing from flowing back to the grinding liquid supply end. At this time, one of the second valve 22 or the third valve 23 is in an open state, and the other is in a closed state to prevent the first solution or the second solution from flowing back to each other; the fourth valve 24 is in an open state, so that the first solution or the second solution can flow into the target pipeline 11 to achieve flushing of the target pipeline 11. In this way, by controlling the opening state of each valve, flushing of the target pipeline 11 can be achieved while preventing the solutions from flowing back to each other.

[0057] Wherein, the first solution stored in the first solution supply unit may be a potassium hydroxide (KOH) solution, the second solution stored in the second solution supply unit may be deionized water (DI), and the first solution and the second solution may be collectively referred to as a flushing solution. The first valve 21 may be a manual valve, and the second valve 22, the third valve 23, and the fourth valve 24 may be pneumatic valves. The controller 40 may be connected to the first valve 21 to realize the collection of the state of the first valve 21. The controller 40 is connected to the second valve 22, the third valve 23, and the fourth valve 24, which can not only realize the collection of the valve state, but also realize the control of the valve opening, that is, control the switch state of the valve. When the controller 40 receives the flushing instruction, according to the preset duration, the opening or closing duration of the second valve 22, the third valve 23, and the fourth valve 24 is controlled to realize the precise control of the duration of the first solution and the second solution flushing the target pipeline 11, that is, the precise control of the flushing time.

[0058] In the above technical solution, by setting the first solution pipeline 12, the second solution pipeline 13, the first valve 21, the second valve 22, the third valve 23, and the fourth valve 24, a set of passages that can prevent solutions from backflowing and can flush the target pipeline 11 can be pre-constructed between the first solution supply end 31 and the target pipeline 11, and between the second solution supply end 32 and the target pipeline 11, without the need for relevant personnel to manually connect the pipelines, effectively avoiding the risk of chemical splashing and pipeline connection errors. In addition, the controller 40 can control the switch states of the second valve 22, the third valve 23, and the fourth valve 24 within a preset time, to achieve precise control of the duration of flushing the target pipeline 11 with the first solution and the second solution, and to accurately control the flushing time.

[0059] In an optional embodiment, the grinding liquid unit 10 may include a filter 101, a supply pipeline 102 and a first valve 21;

[0060] The filter 101 and the first valve 21 are disposed on the supply pipeline 102 , and the supply pipeline 102 is connected to the grinding liquid supply end and the inlet end of the target pipeline 11 .

[0061] For example, the inlet end of the supply pipeline 102 is connected to the grinding liquid supply end, and the outlet end of the supply pipeline 102 is connected to the inlet end of the target pipeline 11. The supply pipeline 102 is provided with a filter 101 and a first valve 21, wherein the filter 101 is used to perform preliminary filtering on the grinding liquid to prevent large particles of impurities from entering the target pipeline 11. The first valve 21 can be provided at the inlet end of the filter 101 (e.g. Figure 2 shown).

[0062] In an optional embodiment, the grinding liquid unit 10 may also be provided with a fifth valve 25 on the supply pipeline 102 , and the fifth valve 25 is connected to the controller 40 .

[0063] For example, the fifth valve 25 can be set at the inlet end of the filter 101, or the fifth valve 25 can be set at the outlet end of the filter 101, which is not limited here. Preferably, the fifth valve 25 is set at the outlet end of the filter 101, and the distance between the fifth valve 25 and the filter 101 is less than the distance between the fourth valve 24 and the filter 101. Figure 2 In the plane direction shown, the vertical position of the fifth valve 25 is lower than the vertical position of the fourth valve 24. In this way, it is possible to prevent dirt in the filter from being washed to the end of the chemical mechanical polishing machine.

[0064] The fifth valve 25 may be a pneumatic valve, and the fifth valve 25 is connected to the controller 40, so that the controller 40 can not only collect the state of the fifth valve 25, but also control the switch state of the fifth valve 25. In this way, even if one of the fifth valve 25 or the first valve 21 in the grinding liquid unit 10 fails, it can be prevented that the flushing solution flows into the grinding liquid supply end in the flushing state, that is, by setting the fifth valve 25, the availability and safety of the flushing system can be further improved.

[0065] In an optional embodiment, the flushing system of the chemical mechanical polishing machine provided by the present disclosure may include N polishing liquid units 10 and N target pipelines 11 connected in a one-to-one correspondence.

[0066] For example, in the chemical mechanical polishing process, in order to improve the working efficiency, N polishing liquid units 10 and N target pipelines 11 may be provided. Figure 3 As shown, the outlet end of each supply pipeline 102 (ie, the outlet end of the polishing liquid unit 10 ) is connected to the first solution pipeline 12 , the second solution pipeline 13 and the corresponding target pipeline 11 .

[0067] In an optional embodiment, the first solution pipeline 12 includes a first solution sub-pipeline 121 and a common pipeline 14; the second solution pipeline 13 includes a second solution sub-pipeline 131 and a common pipeline 14;

[0068] The outlet end of the common pipeline 14 is connected to the target pipeline 11 , the inlet end of the common pipeline 14 is connected to the first solution sub-pipeline 121 and the second solution sub-pipeline 131 , and the fourth valve 24 is disposed on the outlet end of the common pipeline 14 .

[0069] Figure 3 As shown, the double-line arrow can be used to represent the common pipeline 14, the number of the fourth valves 24 can be the same as the number of the target pipelines 11, and the fourth valves 24 can be arranged at the outlet end of the common pipeline 14, that is, the fourth valve 24 is arranged at a position close to the target pipeline 11. In this way, by sharing the pipeline, the pipeline structure can be simplified, the materials used to build the flushing passage can be reduced, and the cost can be saved.

[0070] In an optional embodiment, the second valve 22 may include a plurality of sub-valves; and the third valve 23 may include a plurality of sub-valves.

[0071] For example, the second valve 22 may include two linked sub-valves, both of which may be pneumatic valves, and when the second valve 22 is normal, the switch states of the two are consistent. In this way, when the first solution pipeline 12 is in a non-conducting state, a double guarantee can be provided for it, and even if one of the two sub-valves fails, the backflow of other solutions can be avoided. The third valve 23 may also include two linked sub-valves, both of which may be pneumatic valves, and when the third valve 23 is normal, the switch states of the two are consistent, thereby avoiding the backflow of other solutions.

[0072] Figure 4 1 is a flow chart of a method for washing a chemical mechanical polishing machine provided by an exemplary embodiment of the present disclosure. The method is applied to the controller 40 in the washing system of the chemical mechanical polishing machine described in any of the above embodiments of the present disclosure, and the controller 40 may be a PLC module. Figure 4 As shown, the method may include S1001 to S1003.

[0073] S1001, if a flushing instruction is received and the polishing liquid unit is in a non-conducting state, the second valve and the fourth valve are controlled to be opened, and the third valve is controlled to be in a closed state, so as to flush the target pipeline with the first solution.

[0074] For example, the flushing instruction can be input into the controller 40 by relevant personnel. If the flushing instruction is received, it can be determined that the flushing process is started, that is, the system enters the flushing state. At least one valve in the grinding liquid unit 10 is in a closed state, so that the grinding liquid unit 10 is in a non-conducting state. If the controller 40 receives the flushing instruction and the grinding liquid unit 10 is in a non-conducting state, the controller 40 can issue an opening instruction to the actuators corresponding to the second valve 22 and the fourth valve 24 to control the second valve 22 and the fourth valve 24 to open. At this time, if the third valve 23 is already in a closed state, the third valve 23 is controlled to maintain the current state; if the third valve 23 is not in a closed state, the third valve 23 is controlled to close. In this way, the first solution, i.e., the KOH solution, can flow into the target pipeline 11 through the first solution pipeline 12 for flushing.

[0075] S1002, in response to determining that the duration of flushing the target pipeline 11 with the first solution reaches a first preset duration, controlling the second valve to close and controlling the third valve to open, so as to flush the target pipeline with the second solution.

[0076] For example, the first preset time can be pre-set based on actual needs, for example, it can be set to 10 minutes. KOH can react chemically with the particles attached to the target pipeline 11 to dissolve the particles attached to the pipeline. If the duration of flushing the target pipeline 11 with the KOH solution reaches the first preset time, it can be determined that the particles attached to the target pipeline 11 have been basically dissolved by KOH and flow away with the flow of the solution. At this time, the controller 40 can issue corresponding instructions to the actuators corresponding to the second valve 22 and the third valve 23 to control the second valve 22 to close and control the third valve 23 to open. At this time, the fourth valve 24 is still in the opening device, and the second solution, i.e., DI, flows into the target pipeline 11 through the second solution pipeline 13 for flushing. In this way, the acid-base state in the target pipeline 11 is changed by DI, ensuring that the residual substances after the particles are dissolved can be completely taken away, and the target pipeline 11 is restored to a neutral pH value, so as to avoid the KOH solution flowing to the polishing pad (PAD) to cause contamination when resuming production, or the relevant personnel accidentally contacting the KOH solution, resulting in a safety accident.

[0077] S1003, in response to determining that the duration of flushing the target pipeline 11 with the second solution reaches the second preset duration, the third valve 23 and the fourth valve 24 are controlled to close, and the flushing process ends.

[0078] For example, the second preset time length can be pre-set based on actual needs, for example, it can be set to 30 minutes. The second preset time length is greater than the first preset time length. If the duration of flushing the target pipeline 11 by DI this time reaches the second preset time length, it can be determined that there is no residual material after the dissolution of the particles in the target pipeline 11, and the adjustment of the acid-base state of the target pipeline 11 has been completed, that is, the pH value of the target pipeline 11 is close to the pH value of DI, and the inside of the target pipeline 11 is in a neutral state, and the flushing process can be ended. At this time, the controller 40 can issue a closing instruction to the actuators corresponding to the third valve 23 and the fourth valve 24 to control the closure of the third valve 23 and the fourth valve 24, thereby realizing the end of the flushing process.

[0079] In the above technical scheme, the target pipeline 11 is first flushed with KOH solution, and then flushed with DI. In this way, the flushing effect can be improved by flushing the target pipeline 11 twice; by setting the preset time, the flushing time of the target pipeline 11 can be accurately controlled, thereby improving the degree of automation of the flushing system and reducing the demand for manpower.

[0080] In an optional embodiment, if Figure 5 As shown, in S1001, if a flushing instruction is received and the grinding liquid unit is in a non-conducting state, controlling the second valve and the fourth valve to be opened and controlling the third valve to be in a closed state may include:

[0081] S10011, if a flushing instruction is received and the grinding liquid unit is in a non-conducting state, the third valve and the fourth valve are controlled to be opened, and the second valve is controlled to be in a closed state, so as to pre-flush the target pipeline with the second solution;

[0082] S10012, in response to determining that the duration of pre-flushing the target pipeline 11 with the second solution reaches the target pre-flushing duration, controlling the second valve to open and the third valve to close, so as to flush the target pipeline with the first solution for a first preset duration.

[0083] For example, if the controller 40 receives a flushing instruction and the grinding liquid unit 10 is in a non-conducting state, the controller 40 may issue an opening instruction to the actuators corresponding to the third valve 23 and the fourth valve 24 to control the third valve 23 and the fourth valve 24 to open. At this time, if the second valve 22 is already in a closed state, the second valve 22 is controlled to maintain the current state; if the second valve 22 is not in a closed state, the second valve 22 is controlled to close. In this way, before the KOH solution flows into the target pipeline 11 through the first solution pipeline 12 for flushing, the target pipeline 11 can be pre-flushed through DI first, so that the particles with a lower degree of attachment on the target pipeline 11 are taken away by DI flushing, and then the particles with a higher degree of attachment on the target pipeline 11 are dissolved by KOH.

[0084] The target pre-rinsing time can be pre-set based on actual needs, for example, it can be set to 5 minutes. If the time for pre-rinsing the target pipeline 11 by DI this time reaches the target pre-rinsing time, it can be determined that the particles with a low degree of attachment on the target pipeline 11 have basically been washed away with the water flow, and it is difficult to deal with particles with a high degree of attachment by continuing to use DI for flushing. At this time, the controller 40 can control the second valve 22 to open and the third valve 23 to close, so that the KOH solution flows into the target pipeline 11 through the first solution pipeline 12 for flushing for a first preset time. That is, in the flushing method of the chemical mechanical grinding machine provided in the present disclosure, the target pipeline 11 can be flushed three times, including pre-rinsing by DI, flushing by KOH solution, and flushing by DI again. In this way, the amount of KOH used can be further reduced and the flushing effect can be ensured.

[0085] In an optional embodiment, the method for rinsing a chemical mechanical polishing machine provided by the present disclosure may further include:

[0086] Obtaining the state of the first valve 21;

[0087] In response to receiving the flushing instruction, if the first valve 21 is in an open state, a prompt message is generated, and the prompt message is used to remind the user to close the first valve 21 .

[0088] For example, the first valve 21 may be a manual valve, which may be opened manually by relevant personnel. For example, when a flushing instruction is received, if it is detected that the first valve 21 is in an open state, a prompt message for closing the first valve 21 may be generated. For example, the prompt message may be displayed on a display screen of the controller 40, or may be sent to a remote terminal device bound to the controller 40. In this way, relevant personnel may be reminded in time, and the polishing liquid unit 10 may be in a non-conducting state by closing the first valve 21.

[0089] In an optional embodiment, the method for rinsing a chemical mechanical polishing machine provided by the present disclosure may further include:

[0090] Get the state of the fifth valve 25;

[0091] In response to receiving the flushing instruction, if the fifth valve 25 is in an open state, the fifth valve 25 is controlled to be closed.

[0092] For example, the fifth valve 25 may be a pneumatic valve, and its on / off state may be controlled by the controller 40. If the fifth valve 25 is in an open state, the controller 40 may control the fifth valve 25 to be closed, so that the polishing liquid unit 10 is in a non-conducting state.

[0093] In this way, based on the first valve 21 and the fifth valve 25 , double guarantee can be provided to ensure that the grinding liquid unit 10 is in a non-conducting state.

[0094] In an optional embodiment, in S13, controlling the third valve 23 and the fourth valve 24 to close, and ending the flushing process may include:

[0095] When the third valve 23 and the fourth valve 24 are closed, the pH value of the latest flushed liquid is obtained;

[0096] According to the pH value, it is determined whether the flushing process is completed.

[0097] For example, the action of obtaining the pH value of the most recently flushed liquid can be performed while closing the third valve 23 and the fourth valve 24, or after closing the third valve 23 and the fourth valve 24, and there is no limitation here. The pH value of the most recently flushed liquid can be obtained through a pre-set pH value automatic monitoring system, or the pH value of the most recently flushed liquid can be tested by relevant personnel, and the test results can be input into the controller 40. According to the pH value of the most recently flushed liquid, it can be determined whether the pH value of the target pipeline 11 is close to the pH value of DI, and then it can be determined whether the flushing process is completed.

[0098] Specifically, determining whether the flushing process is finished according to the pH value may include:

[0099] If the pH value does not exceed the preset pH value range, it is determined that the flushing process is completed;

[0100] If the pH value exceeds the preset pH value range, the third valve 23 and the fourth valve 24 are controlled to open again to continue flushing the target pipeline 11 with the second solution.

[0101] For example, the preset pH range can be pre-set according to the pH value of DI. If the pH value does not exceed the preset pH range, it can be determined that the acid-base state of the target pipeline 11 is close to neutral, and at this time, it can be determined that the flushing process is finished to avoid wasting DI.

[0102] If the pH value exceeds the preset pH value range, it can be determined that the pH value of the target pipeline 11 is not close to the pH value of DI, that is, the acid-base state of the target pipeline 11 is not close to neutral, and the duration of flushing the target pipeline 11 through DI is insufficient before closing the third valve 23 and the fourth valve 24. At this time, the controller 40 can control the third valve 23 and the fourth valve 24 to open again to continue flushing the target pipeline 11 through DI.

[0103] In an optional embodiment, the flushing method provided by the present disclosure may also include:

[0104] If the re-flushing time reaches the preset compensation time, the third valve 23 and the fourth valve 24 are controlled to close, and the steps of obtaining the pH value of the latest flushed liquid and determining whether the flushing process is completed based on the pH value are re-executed until the flushing process is determined to be completed.

[0105] The preset compensation time can be set based on actual needs. For example, it can be set to 5 minutes. If the time since the last time the pH value was obtained reaches the preset compensation time, that is, the time for re-flushing through DI reaches the preset compensation time, it can be determined that the target pipeline 11 has been flushed again through DI for a period of time. In order to avoid excessive flushing of the target pipeline 11 through DI, resulting in waste of DI, the third valve 23 and the fourth valve 24 can be controlled to close again, and the above-mentioned steps of obtaining the pH value of the latest flushed liquid and determining whether the flushing process is over according to the pH value are re-executed until the flushing process is determined to be over. In this way, it can be avoided that the acid-base state in the target pipeline 11 does not reach neutral after the flushing process is ended, thereby increasing the service life of the flushing system.

[0106] In an optional embodiment, the method for rinsing a chemical mechanical polishing machine provided by the present disclosure may further include:

[0107] If the number of target pipelines 11 is greater than the number threshold, the target pipelines 11 and the fourth valves 24 corresponding to the target pipelines 11 are grouped and processed;

[0108] Each group of target pipelines 11 is flushed in turn according to a preset order, wherein different solution supply ends provide flushing solutions to different groups of target pipelines 11 at the same time, and each solution supply end provides flushing solution to a group of target pipelines 11 at the same time.

[0109] For example, the quantity threshold value can be preset based on the actual supply capacity of the solution supply end, for example, it can be set to 3, and each solution supply end provides flushing solution to a group of target pipelines 11 at the same time to avoid a decrease in flushing capacity. Assuming that the number of target pipelines 11 is 6, these target pipelines 11 can be divided into two groups, specifically, the first target pipeline 11, the second target pipeline 11 and the third target pipeline 11, and the fourth valve 24 adjacent to these pipelines can be divided into the first group; the fourth target pipeline 11, the fifth target pipeline 11 and the sixth target pipeline 11, and the fourth valve 24 adjacent to these pipelines can be divided into the second group.

[0110] The two groups of target pipelines 11 can be flushed in sequence according to a preset order. Different solution supply ends can provide flushing solutions for different groups of target pipelines 11 at the same time. For example, when the first group of target pipelines 11 are flushed with KOH, the second group of target pipelines 11 can be flushed with DI for the first time; when the first group of target pipelines 11 are flushed with DI for the second time, the second group of target pipelines 11 can be flushed with KOH. In this way, the flushing time can be shortened and the flushing efficiency can be improved.

[0111] Figure 6 FIG. 4 is a block diagram of a controller 40 according to an exemplary embodiment. Figure 6 As shown, the controller 40 may include: a processor 701 and a memory 702. The controller 40 may also include one or more of a multimedia component 703, an input / output (I / O) interface 704, and a communication component 705.

[0112] The processor 701 is used to control the overall operation of the controller 40 to complete all or part of the steps in the above-mentioned chemical mechanical polishing machine rinsing method. The memory 702 is used to store various types of data to support the operation of the controller 40, and these data may include, for example, instructions for any application or method operated on the controller 40, and application-related data, such as contact data, sent and received messages, pictures, audio, video, etc. The memory 702 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (Static Random Access Memory, referred to as SRAM), electrically erasable programmable read-only memory (Electrically Erasable Programmable Read-Only Memory, referred to as EEPROM), erasable programmable read-only memory (Erasable Programmable Read-Only Memory, referred to as EPROM), programmable read-only memory (Programmable Read-Only Memory, referred to as PROM), read-only memory (Read-Only Memory, referred to as ROM), magnetic memory, flash memory, magnetic disk or optical disk. The multimedia component 703 may include a screen and an audio component. The screen may be, for example, a touch screen, and the audio component is used to output and / or input audio signals. For example, the audio component may include a microphone for receiving external audio signals. The received audio signal may be further stored in the memory 702 or sent through the communication component 705. The audio component also includes at least one speaker for outputting audio signals. The I / O interface 704 provides an interface between the processor 701 and other interface modules, and the other interface modules may be keyboards, mice, buttons, etc. These buttons may be virtual buttons or physical buttons. The communication component 705 is used for wired or wireless communication between the controller 40 and other devices. Wireless communication, such as Wi-Fi, Bluetooth, Near Field Communication (NFC), 2G, 3G, 4G, NB-IOT, eMTC, or other 5G, etc., or a combination of one or more of them, is not limited here. Therefore, the corresponding communication component 705 may include: Wi-Fi module, Bluetooth module, NFC module, etc.

[0113] In an exemplary embodiment, the controller 40 can be implemented by one or more application specific integrated circuits (ASIC), digital signal processors (DSP), digital signal processing devices (DSPD), programmable logic devices (PLD), field programmable gate arrays (FPGA), controllers, microcontrollers, microprocessors or other electronic components to execute the above-mentioned chemical mechanical polishing machine rinsing method.

[0114] In another exemplary embodiment, a computer-readable storage medium including program instructions is also provided, and when the program instructions are executed by a processor, the steps of the above-mentioned chemical mechanical polishing machine station rinsing method are implemented. For example, the computer-readable storage medium can be the above-mentioned memory 702 including program instructions, and the above-mentioned program instructions can be executed by the processor 701 of the controller 40 to complete the above-mentioned chemical mechanical polishing machine station rinsing method.

[0115] In another exemplary embodiment, a computer program product is also provided. The computer program product includes a computer program executable by a programmable device, and the computer program has a code portion for executing the above-mentioned rinsing method for a chemical mechanical polishing machine when executed by the programmable device.

[0116] The preferred embodiments of the present disclosure are described in detail above in conjunction with the accompanying drawings; however, the present disclosure is not limited to the specific details in the above embodiments. Within the technical concept of the present disclosure, a variety of simple modifications can be made to the technical solution of the present disclosure, and these simple modifications all fall within the protection scope of the present disclosure.

[0117] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present disclosure will not further describe various possible combinations.

[0118] In addition, various embodiments of the present disclosure may be arbitrarily combined, and as long as they do not violate the concept of the present disclosure, they should also be regarded as the contents disclosed by the present disclosure.

Claims

1. A flushing system for a chemical mechanical polishing machine. It is characterized in that It comprises a grinding liquid unit (10), a target pipeline (11), a first solution pipeline (12), a second solution pipeline (13), a first valve (21), a second valve (22), a third valve (23), a fourth valve (24), a first solution supply end (31), a second solution supply end (32) and a controller (40); The outlet end of the grinding liquid unit (10) is connected to the inlet end of the target pipeline (11), the outlet end of the first solution pipeline (12), and the outlet end of the second solution pipeline (13); the grinding liquid unit (10) comprises a first valve (21) for controlling the conduction state of the grinding liquid unit (10); the inlet end of the first solution pipeline (12) is connected to the first solution supply end (31); and the inlet end of the second solution pipeline (13) is connected to the second solution supply end (32); The second valve (22) is provided at the inlet end of the first solution pipeline (12), and the third valve (23) is provided at the inlet end of the second solution pipeline (13); the fourth valve (24) is provided at the outlet end of the first solution pipeline (12) and the outlet end of the second solution pipeline (13); The controller (40) is connected to the second valve (22), the third valve (23) and the fourth valve (24) and is used to control the switch states of the second valve, the third valve and the fourth valve according to a preset duration when a flushing instruction is received.

2. The flushing system according to claim 1, It is characterized in that The grinding liquid unit (10) comprises a filter (101), a supply pipeline (102) and the first valve (21); The filter (101) and the first valve (21) are arranged on the supply pipeline (102), and the supply pipeline (102) is connected to a grinding liquid supply end and an inlet end of the target pipeline (11).

3. The flushing system according to claim 2, It is characterized in that The grinding liquid unit (10) further comprises a fifth valve (25) arranged on the supply pipeline (102), and the fifth valve (25) is connected to the controller.

4. The flushing system according to claim 2, It is characterized in that The flushing system comprises N grinding liquid units (10) and N target pipelines (11) connected in a one-to-one correspondence.

5. The flushing system according to claim 1, It is characterized in that The first solution pipeline (12) comprises a first solution sub-pipeline (121) and a common pipeline (14); the second solution pipeline (13) comprises a second solution sub-pipeline (131) and a common pipeline (14); the outlet end of the common pipeline (14) is connected to the target pipeline (11); the inlet end of the common pipeline (14) is connected to the first solution sub-pipeline (121) and the second solution sub-pipeline (131); and the fourth valve (24) is arranged on the outlet end of the common pipeline (14).

6. The flushing system according to claim 1, It is characterized in that The second valve (22) includes a plurality of sub-valves; the third valve (23) includes a plurality of sub-valves.

7. A method for flushing a chemical mechanical polishing machine. It is characterized in that A controller (40) applied to a flushing system according to any one of claims 1 to 5, wherein the flushing method comprises: If a flushing instruction is received and the grinding liquid unit (10) is in a non-conducting state, the second valve (22) and the fourth valve (24) are controlled to be opened, and the third valve (23) is controlled to be in a closed state, so as to flush the target pipeline (11) with the first solution; In response to determining that the duration of flushing the target pipeline (11) with the first solution reaches a first preset duration, controlling the second valve (22) to close and controlling the third valve (23) to open, so as to flush the target pipeline (11) with the second solution; In response to determining that the duration of flushing the target pipeline (11) with the second solution reaches a second preset duration, the third valve (23) and the fourth valve (24) are controlled to close, thereby terminating the flushing process.

8. The flushing method according to claim 7, It is characterized in that If a flushing instruction is received and the grinding liquid unit (10) is in a non-conducting state, the second valve (22) and the fourth valve (24) are controlled to be opened, and the third valve (23) is controlled to be in a closed state, comprising: If a flushing instruction is received and the grinding liquid unit (10) is in a non-conducting state, the third valve (23) and the fourth valve (24) are controlled to be opened, and the second valve (22) is controlled to be in a closed state, so as to pre-flush the target pipeline (11) with the second solution; In response to determining that the duration of pre-flushing the target pipeline (11) with the second solution reaches a target pre-flushing duration, the second valve (22) is controlled to open and the third valve (23) is controlled to close, so as to flush the target pipeline (11) with the first solution for a first preset duration.

9. The flushing method according to claim 7, It is characterized in that The flushing method further comprises: Acquiring the state of the first valve (21); In response to receiving the flushing instruction, if the first valve (21) is in an open state, a prompt message is generated, wherein the prompt message is used to remind the user to close the first valve (21).

10. The flushing method according to claim 7, It is characterized in that The flushing method further comprises: Acquiring the state of the fifth valve (25); In response to receiving the flushing instruction, if the fifth valve (25) is in an open state, the fifth valve (25) is controlled to be closed.

11. The flushing method according to claim 7, It is characterized in that The controlling the third valve (23) and the fourth valve (24) to close and ending the flushing process comprises: When the third valve (23) and the fourth valve (24) are closed, obtaining the pH value of the most recently flushed liquid; According to the pH value, it is determined whether the flushing process is completed.

12. The flushing method according to claim 11, It is characterized in that Determining whether the flushing process is finished according to the pH value includes: If the pH value does not exceed the preset pH value range, it is determined that the flushing process is finished.

13. The flushing method according to claim 11, It is characterized in that Determining whether the flushing process is finished according to the pH value includes: If the pH value exceeds the preset pH value range, the third valve (23) and the fourth valve (24) are controlled to open again to continue flushing the target pipeline (11) with the second solution.

14. The flushing method according to claim 13, It is characterized in that The method further comprises: If the duration of the re-flushing reaches the preset compensation duration, the third valve (23) and the fourth valve (24) are controlled to close, and the steps of obtaining the pH value of the most recently flushed liquid and determining whether the flushing process is completed based on the pH value are re-executed until it is determined that the flushing process is completed.

15. The flushing method according to claim 7, It is characterized in that The method further comprises: If the number of the target pipelines (11) is greater than a number threshold, grouping the target pipelines (11) and the fourth valves (24) corresponding to the target pipelines (11); Each group of target pipelines (11) is flushed in turn according to a preset sequence, wherein different solution supply ends provide flushing solutions to different groups of target pipelines (11) at the same time, and each solution supply end provides flushing solution to a group of target pipelines (11) at the same time.

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