Multifunctional semiconductor cavity processing equipment

Abstract

The invention belongs to the technical field of semiconductors, and discloses multifunctional semiconductor cavity processing equipment which comprises a bearing mechanism, the bearing mechanism comprises a shell, two opposite sides of the shell are fixedly connected with communication ports penetrating through the side walls of the shell, and the communication ports are communicated with the shell. A first venturi tube, a second venturi tube and a third venturi tube are sequentially and fixedly connected between the two communicating ports from left to right, and the throat portions of the first venturi tube, the second venturi tube and the third venturi tube are fixedly connected with vertical pipelines communicated with the interiors of the first venturi tube, the second venturi tube and the third venturi tube. According to the device, when a liquid pump drives liquid in a first venturi tube, a second venturi tube and a third venturi tube to flow, according to the Bernoulli principle, the liquid levels in three vertical pipelines can descend by different heights, and at the moment, a center disc, a first supporting ring and a second supporting ring are arranged in an ascending step shape from inside to outside; and at the moment, the wafers with different sizes fall into the bearing areas with different heights, so that the wafers with different sizes are stably supported.

Description

Technical Field

[0001] The invention belongs to the field of semiconductor technology, and in particular relates to a multifunctional semiconductor chamber processing device. Background Art

[0002] Semiconductor refers to a material whose electrical conductivity is between that of a conductor and an insulator at room temperature. Semiconductor materials are widely used in communication systems and electrical fields. Commonly used semiconductor materials include silicon, germanium, and gallium arsenide. In the production and processing of semiconductor materials, semiconductor chamber processing equipment is required. Existing semiconductor processing equipment still has some defects when used;

[0003] Although existing semiconductor processing devices can perform single-wafer chemical treatment on multiple wafers simultaneously during use, they cannot classify and process wafers of different sizes during actual use, and their scope of application is narrow. Moreover, existing semiconductor processing equipment cannot automatically remove the grinding fluid while switching the semiconductor support component during use, and their functionality is poor. Summary of the invention

[0004] The object of the present invention is to provide a multifunctional semiconductor chamber processing equipment to solve the problems raised in the above background technology.

[0005] In order to achieve the above-mentioned purpose, the present invention provides the following technical solutions: a multifunctional semiconductor chamber processing equipment, comprising a bearing mechanism, the bearing mechanism comprising a shell, a guide bevel ring is fixedly sleeved inside the top surface of the shell, a second support ring is slidably sleeved inside the guide bevel ring, a first support ring is slidably sleeved inside the second support ring, a center disk is slidably sleeved inside the first support ring, the opposite sides of the shell are fixedly connected to a connecting port penetrating the side wall thereof, a first venturi tube, a second venturi tube and a third venturi tube are fixedly connected between the two connecting ports from left to right in sequence, the throats of the first venturi tube, the second venturi tube and the third venturi tube are fixedly connected to a vertical pipe communicating with the inside thereof, a sliding rod is slidably connected inside the vertical pipe, the center disk is fixedly connected to the top end of the sliding rod in the middle, the top end of the sliding rod on the left is fixedly connected to a bearing ring, the top surface of the bearing ring is fixedly connected to the bottom surface of the second support ring, the side surface of the sliding rod on the right is fixedly connected to a bearing slide, and the top surface of the bearing slide is fixedly connected to the bottom surface of the first support ring.

[0006] Preferably, a sliding sleeve is fixedly connected to the bottom surface of the supporting ring, and the sliding sleeve is slidably connected to the vertical pipe on the right. A first sliding groove is opened on the side of the sliding sleeve, and one end of the supporting slide passes through the first sliding groove and is connected to the sliding rod on the right, and the middle part of the supporting slide is slidably connected to the middle vertical pipe.

[0007] Preferably, the throat diameters of the first venturi tube, the second venturi tube and the third venturi tube are different, the throat diameter of the first venturi tube is the largest, and the throat diameter of the second venturi tube is the smallest.

[0008] Preferably, the thickness of the center disk is greater than that of the first support ring and the second support ring, and the thickness of the first support ring is the same as that of the second support ring.

[0009] Preferably, the top surface of the guide bevel ring is an outwardly inclined bevel and is provided with a plurality of guide liquid grooves. An inner liquid tube is fixedly provided inside the shell and is connected to the guide liquid grooves.

[0010] Preferably, a filtering mechanism is fixedly provided on the left side of the supporting mechanism, and the filtering mechanism includes a filtering chamber and a liquid pump, the liquid inlet of the liquid pump is connected to the liquid outlet end of the filtering chamber, the liquid outlet of the liquid pump is connected to the connecting port on the left side through a first pipe, and a second pipe is fixedly connected to the left side surface of the outer shell, and the second pipe connects the inner liquid pipe and the liquid inlet end of the filtering chamber.

[0011] Preferably, a plurality of centrosymmetrical stepper motors are fixedly connected to the inner top surface of the housing, and the output shafts of the stepper motors penetrate the top surface of the housing and are fixedly sleeved with a positioning plate.

[0012] Preferably, it also includes a polishing machine, which is a magnetorheological polishing device, the magnetorheological fluid input port of the polishing machine is connected to the connecting port on the right side, and the magnetorheological fluid output port of the polishing machine is connected to the filter bin.

[0013] The beneficial effects of the present invention are as follows:

[0014] 1. In the present invention, a plurality of venturi tubes with different throat diameters are used, so that when the liquid pump drives the liquid in the first venturi tube, the second venturi tube and the third venturi tube to flow, according to the Bernoulli principle, the liquid levels in the three vertical pipes will drop to different heights, so that the sliding rods in the three vertical pipes slide down to different heights. At this time, as the sliding rods descend, the center disk, the first support ring and the second support ring move downward. Because the thinner the throat of the venturi tube, the lower the liquid level in the vertical pipe connected to it when the liquid flows, so as the liquid level in the vertical pipe stops falling, the center disk , the first support ring and the second support ring are arranged in an ascending step shape from the inside to the outside. At this time, wafers of different sizes will fall into supporting areas of different heights, thereby stably supporting wafers of different sizes; at the same time, the device uses liquid to drive the central disk, the first support ring and the second support ring. Compared with the traditional motor to drive the corresponding components to move, the liquid drive avoids the vibration generated by the motor when it is working, thereby ensuring that when the wafer contacts the supporting structure, the supporting structure will not be subjected to periodic vibration, preventing the wafer from colliding with the supporting component due to vibration, thereby avoiding the side of the wafer from breaking and damaging the wafer.

[0015] 2. Secondly, the present invention uses magnetorheological fluid to drive the sliding rod in the vertical pipe to move up and down, thereby driving the center disk, the first support ring and the second support ring to move up and down, so as to support wafers of different sizes. At the same time, after the liquid pump extracts the magnetorheological fluid in the filter bin, these magnetorheological fluids pass through the first venturi, the second venturi and the third venturi. The change in flow rate makes the magnetic particles in the magnetorheological fluid and the carrier liquid fully mixed, thereby ensuring the magnetorheological fluid has a polishing effect on the wafer surface when it flows out from the liquid outlet pipe of the polishing machine.

[0016] 3. Finally, by setting up multiple center-symmetrical stepper motors and positioning plates, when the wafer is placed on the center disk, all the stepper motors are started synchronously. At this time, the stepper motor drives the positioning plate to rotate toward the center direction of the supporting mechanism, and as the positioning plate rotates, the positioning plate in contact with the wafer will push the wafer to move. After the wafer is pushed by multiple positioning plates, the center of the wafer and the center of the center disk are on the same vertical line, so that the wafer is centered, thereby avoiding processing errors caused by inaccurate wafer positioning during subsequent grinding, polishing and other processing of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0018] Figure 2 It is a top view of the carrying mechanism of the present invention;

[0019] Figure 3 It is a front cross-sectional view of the carrying mechanism of the present invention;

[0020] Figure 4 For the present invention Figure 3 The enlarged structural diagram at A in the middle;

[0021] Figure 5 It is a cross-sectional view of the housing of the present invention;

[0022] Figure 6 It is a schematic diagram of the cross-sectional structure of the center disk, the first supporting ring and the second supporting ring of the present invention;

[0023] Figure 7 It is a schematic cross-sectional structure diagram of the carrying ring, the sliding sleeve and the carrying sliding frame of the present invention.

[0024] In the figure: 1. bearing mechanism; 11. shell; 12. connecting port; 13. first venturi tube; 14. second venturi tube; 15. third venturi tube; 16. vertical pipeline; 17. sliding rod; 18. center disk; 19. first supporting ring; 110. second supporting ring; 111. bearing ring; 112. sliding sleeve; 113. first slide groove; 114. bearing slide; 115. guide bevel ring; 116. guide liquid groove; 117. inner liquid pipe; 118. stepping motor; 119. positioning plate; 2. filtering mechanism; 21. filtering chamber; 22. liquid pump; 23. first pipeline; 24. second pipeline; 3. polishing machine. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] like Figures 1 to 7 As shown, the embodiment of the present invention provides a multifunctional semiconductor chamber processing device, including a carrying mechanism 1, the carrying mechanism 1 includes a shell 11, a top surface of the shell 11 is fixedly sleeved with a guide bevel ring 115, the guide bevel ring 115 is slidably sleeved with a second support ring 110, the second support ring 110 is slidably sleeved with a first support ring 19, the first support ring 19 is slidably sleeved with a center disk 18, the two opposite sides of the shell 11 are fixedly connected to a communication port 12 that passes through the side wall thereof, and the first venturi tube 13, the second venturi tube 19 are fixedly connected to the two communication ports 12 from left to right in sequence. The first venturi tube 13, the second venturi tube 14 and the third venturi tube 15, the throats of the first venturi tube 13, the second venturi tube 14 and the third venturi tube 15 are all fixedly connected with a vertical pipe 16 communicating with the inside thereof, a sliding rod 17 is slidably connected in the vertical pipe 16, a center disk 18 is fixedly connected to the top end of the middle sliding rod 17, a bearing ring 111 is fixedly connected to the top end of the left sliding rod 17, the top surface of the bearing ring 111 is fixedly connected to the bottom surface of the second supporting ring 110, a bearing slide 114 is fixedly connected to the side surface of the right sliding rod 17, the top surface of the bearing slide 114 is fixedly connected to the bottom surface of the first supporting ring 19,

[0027] In the present invention, a plurality of venturi tubes with different throat diameters are used, so that when the liquid pump 22 drives the liquid in the first venturi tube 13, the second venturi tube 14 and the third venturi tube 15 to flow, according to the Bernoulli principle, the liquid levels in the three vertical pipes 16 will drop to different heights, so that the sliding rods 17 in the three vertical pipes 16 slide downward to different heights. At this time, as the sliding rods 17 descend, the center disk 18, the first support ring 19 and the second support ring 110 move downward. Because the thinner the throat of the venturi tube, the lower the internal liquid level height of the vertical pipe 16 connected thereto when the liquid flows, so as the liquid level in the vertical pipe 16 stops falling, this The center disk 18, the first support ring 19 and the second support ring 110 are arranged in an ascending staircase from the inside to the outside. At this time, wafers of different sizes will fall into supporting areas of different heights, thereby stably supporting wafers of different sizes. At the same time, the device uses liquid to drive the center disk 18, the first support ring 19 and the second support ring 110. Compared with the traditional motor to drive the corresponding components to move, the liquid drive avoids the vibration generated by the motor when it is working, thereby ensuring that when the wafer contacts the supporting structure, the supporting structure will not be subjected to periodic vibration, preventing the wafer from colliding with the supporting component due to vibration, thereby avoiding the side of the wafer from breaking and damaging the wafer.

[0028] Secondly, the present invention uses magnetorheological fluid to drive the sliding rod 17 in the vertical pipe 16 to move up and down, thereby driving the center disk 18, the first support ring 19 and the second support ring 110 to move up and down, so as to support wafers of different sizes. At the same time, after the liquid pump 22 extracts the magnetorheological fluid in the filter chamber 21, the magnetorheological fluid passes through the first venturi 13, the second venturi 14 and the third venturi 15. The change in flow rate makes the magnetic particles in the magnetorheological fluid and the carrier liquid fully mixed, thereby ensuring the magnetorheological fluid has a polishing effect on the wafer surface when it flows out from the liquid outlet pipe of the polishing machine 3.

[0029] Finally, by setting up multiple center-symmetrical stepper motors 118 and positioning plates 119, when the wafer is placed on the center disk 18, all the stepper motors 118 are started synchronously. At this time, the stepper motor 118 drives the positioning plate 119 to rotate toward the center direction of the supporting mechanism 1, and as the positioning plate 119 rotates, the positioning plate 119 in contact with the wafer will push the wafer to move. After the wafer is pushed by multiple positioning plates 119, the center of the wafer is on the same vertical line as the center of the center disk 18, so that the wafer is centered, thereby avoiding processing errors caused by inaccurate wafer positioning during subsequent grinding, polishing and other processing of the wafer.

[0030] The bottom surface of the carrying ring 111 is fixedly connected with a sliding sleeve 112, and the sliding sleeve 112 is slidably sleeved on the right vertical pipe 16. A first sliding groove 113 is provided on the side of the sliding sleeve 112. One end of the carrying slide 114 passes through the first sliding groove 113 and is connected to the right sliding rod 17. The middle part of the carrying slide 114 is slidably sleeved on the middle vertical pipe 16. The throat diameters of the first venturi tube 13, the second venturi tube 14 and the third venturi tube 15 are different. The throat diameter of the first venturi tube 13 is the largest, and the throat diameter of the second venturi tube 14 is the smallest.

[0031] According to the characteristics of the venturi tube, when the liquid in the venturi tube flows, the smaller the throat diameter of the venturi tube, the lower the liquid level in the vertical pipe 16 connected to the throat. According to the above characteristics, after the fluid in different venturi tubes flows, the top heights of the sliding rods 17 in the vertical pipes 16 connected thereto are different, so that the heights of the center disk 18, the first support ring 19 and the second support ring 110 are different, thereby forming a cavity structure to stably fix the wafer in the cavity to ensure that the wafer will not shake and interfere with the processing during subsequent processing.

[0032] The thickness of the central disk 18 is greater than that of the first support ring 19 and the second support ring 110. The thickness of the first support ring 19 and the second support ring 110 is the same. The top surface of the guide bevel ring 115 is an outwardly inclined bevel, and a plurality of guide liquid grooves 116 are provided thereon. An inner liquid pipe 117 is fixedly provided inside the housing 11, and the inner liquid pipe 117 is connected to the guide liquid groove 116.

[0033] When the wafer is being ground, as the magnetorheological fluid flows out of the liquid outlet pipe of the polishing machine 3, the magnetic material in the magnetorheological fluid will be attracted by the polishing wheel of the polishing machine 3, and as the polishing wheel rotates, the magnetorheological fluid grinds the top surface of the wafer, and the excess carrier fluid, stabilizer and other additives in the magnetorheological fluid will remain on the surface of the wafer. In the subsequent grinding process, these residual liquids will be washed to the side of the wafer by the subsequent magnetorheological fluid, thereby taking away the silicon crystal particles polished during the grinding process. After completion, as the magnetorheological fluid in the first venturi 13, the second venturi 14 and the third venturi 15 stops flowing, under the principle of communicating vessels, the three sliding rods 17 return to the initial state. At this time, because the thickness of the central disk 18 is greater than that of the other two support rings, the magnetorheological fluid on the central disk 18 rolls off the wafer and finally flows into the inner liquid tube 117 from the guide liquid groove 116 on the guide bevel ring 115, so that the residual magnetorheological fluid is recovered into the filter chamber 21 to prevent the magnetorheological fluid from being wasted.

[0034] Among them, a filter mechanism 2 is fixedly arranged on the left side of the supporting mechanism 1, and the filter mechanism 2 includes a filter chamber 21 and a liquid pump 22. The liquid inlet of the liquid pump 22 is connected to the liquid outlet end of the filter chamber 21, and the liquid outlet of the liquid pump 22 is connected to the connecting port 12 on the left side through a first pipe 23. A second pipe 24 is fixedly connected to the left side of the shell 11, and the second pipe 24 connects the inner liquid pipe 117 and the liquid inlet end of the filter chamber 21.

[0035] After the liquid pump 22 extracts the magnetorheological fluid in the filter bin 21, it is transported by the liquid pump 22 and flows into the polishing machine 3 after passing through the first venturi 13, the second venturi 14 and the third venturi 15. In the process of changing the flow rate in the first venturi 13, the second venturi 14 and the third venturi 15, the magnetic particles in the magnetorheological fluid are distributed more evenly, thereby avoiding the problem of magnetic particles sedimentation after the liquid pump 22 extracts the magnetorheological fluid, resulting in poor polishing and grinding effects of the magnetorheological fluid.

[0036] The inner top surface of the housing 11 is fixedly connected with a plurality of centrally symmetrical stepper motors 118. The output shaft of the stepper motor 118 passes through the top surface of the housing 11 and is fixedly sleeved with a positioning plate 119.

[0037] The arrangement of multiple positioning plates 119 enables the positioning plates 119 to push the wafer after contacting the wafer after the multiple stepper motors 118 rotate synchronously at the same angle. Under the action of the multiple positioning plates 119, the wafer is positioned so that the center of the wafer is on the same vertical line as the center of the center disk 18, thereby ensuring the stability of the wafer during the subsequent grinding and polishing process.

[0038] It also includes a polishing machine 3 which is a magnetorheological polishing device. The magnetorheological fluid input port of the polishing machine 3 is connected to the connecting port 12 on the right, and the magnetorheological fluid output port of the polishing machine 3 is connected to the filter bin 21 .

[0039] Working principle:

[0040] When using this equipment to grind and polish the top surface of the wafer, first place the wafer on the center disk 18, then start the stepper motor 118 synchronously, so that the positioning plates 119 rotate toward the center part of the center disk 18, and after the positioning plates 119 contact the wafer, they push the wafer to move, and through the cooperation of multiple positioning plates 119, the wafer is centered at this time.

[0041] Then, the liquid pump 22 is started, so that the magnetorheological fluid in the first venturi 13, the second venturi 14 and the third venturi 15 begins to flow, and according to the characteristics of the venturi, the sliding rod 17 in the vertical pipe 16 begins to move downward, thereby causing the upper center disk 18, the first support ring 19 and the second support ring 110 to move downward to different heights, and as the sliding rod 17 stops moving, the center disk 18, the first support ring 19 and the second support ring 110 are arranged in a stepped manner, so that wafers of different sizes are located in different supporting positions.

[0042] After the top surface of the wafer is ground and polished using the polishing machine 3, the passage between the right connecting port 12 and the polishing machine 3 is disconnected. At this time, the liquid pump 22 continues to inject a certain amount of magnetorheological fluid into the first venturi 13, the second venturi 14 and the third venturi 15 until the magnetorheological fluid missing due to the drop in the liquid level in the three vertical pipes 16 is supplemented. Then the liquid pump 22 is turned off. At this time, as the liquid in the venturi stops flowing, under the communicating vessel effect, the center disk 18, the first support ring 19 and the second support ring 110 return to the starting position. At this time, the carrier liquid, stabilizer and other additives located on the center disk 18, the first support ring 19 and the wafer will flow along the guide liquid groove 116 on the guide bevel ring 115 to the filter chamber 21, thereby filtering out the silicon crystal particles in the magnetorheological fluid to prevent affecting the grinding and polishing effects in subsequent processing links.

[0043] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0044] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A multifunctional semiconductor chamber processing device, comprising a carrying mechanism (1), wherein the carrying mechanism (1) comprises a housing (11), characterized in that: A guide bevel ring (115) is fixedly sleeved inside the top surface of the outer shell (11), a second support ring (110) is slidably sleeved inside the guide bevel ring (115), a first support ring (19) is slidably sleeved inside the second support ring (110), a center disk (18) is slidably sleeved inside the first support ring (19), and the opposite sides of the outer shell (11) are fixedly connected to a connecting port (12) penetrating the side wall thereof, and a first venturi tube (13), a second venturi tube (14) and a third venturi tube (15) are fixedly connected between the two connecting ports (12) from left to right in sequence, the first venturi tube (13), the second venturi tube (14) and the third venturi tube (15) being fixedly connected in sequence. The throats of the first and second venturi tubes (14) and the third venturi tube (15) are fixedly connected to a vertical pipe (16) communicating with the interior thereof, a sliding rod (17) is slidably connected inside the vertical pipe (16), the central disc (18) is fixedly connected to the top end of the middle sliding rod (17), the top end of the left sliding rod (17) is fixedly connected to a bearing ring (111), the top surface of the bearing ring (111) is fixedly connected to the bottom surface of the second supporting ring (110), the side surface of the right sliding rod (17) is fixedly connected to a bearing slide (114), the top surface of the bearing slide (114) is fixedly connected to the bottom surface of the first supporting ring (19).

2. The multifunctional semiconductor chamber processing equipment according to claim 1, characterized in that: The bottom surface of the bearing ring (111) is fixedly connected with a sliding sleeve (112), and the sliding sleeve (112) is slidably connected to the right vertical pipe (16). The side of the sliding sleeve (112) is provided with a first sliding groove (113), and one end of the bearing slide (114) passes through the first sliding groove (113) and is connected to the right sliding rod (17), and the middle part of the bearing slide (114) is slidably connected to the middle vertical pipe (16).

3. The multifunctional semiconductor chamber processing equipment according to claim 2, characterized in that: The throat diameters of the first venturi tube (13), the second venturi tube (14) and the third venturi tube (15) are different, the throat diameter of the first venturi tube (13) is the largest, and the throat diameter of the second venturi tube (14) is the smallest.

4. The multifunctional semiconductor chamber processing equipment according to claim 3, characterized in that: The thickness of the central disc (18) is greater than that of the first supporting ring (19) and the second supporting ring (110), and the thickness of the first supporting ring (19) and the second supporting ring (110) are the same.

5. The multifunctional semiconductor chamber processing equipment according to claim 4, characterized in that: The top surface of the guide bevel ring (115) is an outwardly inclined bevel and is provided with a plurality of guide liquid grooves (116). An inner liquid tube (117) is fixedly provided inside the outer shell (11), and the inner liquid tube (117) is connected to the guide liquid grooves (116).

6. The multifunctional semiconductor chamber processing equipment according to claim 5, characterized in that: A filter mechanism (2) is fixedly arranged on the left side of the supporting mechanism (1), and the filter mechanism (2) comprises a filter chamber (21) and a liquid pump (22), the liquid inlet of the liquid pump (22) is connected to the liquid outlet of the filter chamber (21), the liquid outlet of the liquid pump (22) is connected to the left communication port (12) via a first pipe (23), and a second pipe (24) is fixedly connected to the left side surface of the housing (11), and the second pipe (24) communicates with the inner liquid pipe (117) and the liquid inlet of the filter chamber (21).

7. The multifunctional semiconductor chamber processing equipment according to claim 6, characterized in that: A plurality of centrally symmetrical stepping motors (118) are fixedly connected to the inner top surface of the housing (11), and the output shafts of the stepping motors (118) penetrate the top surface of the housing (11) and are fixedly sleeved with a positioning plate (119).

8. The multifunctional semiconductor chamber processing equipment according to claim 7, characterized in that: It also comprises a polishing machine (3), which is a magnetorheological polishing device, wherein the magnetorheological fluid input port of the polishing machine (3) is connected to the connecting port (12) on the right side, and the magnetorheological fluid output port of the polishing machine (3) is connected to the filter bin (21).

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