A multi-functional semiconductor chamber processing apparatus

Abstract

The application belongs to the technical field of semiconductor and discloses a multifunctional semiconductor cavity type processing equipment, which comprises a bearing mechanism, the bearing mechanism comprises a shell, opposite sides of the shell are fixedly connected with communication ports penetrating through the side walls, a first venturi, a second venturi and a third venturi are fixedly connected in sequence from left to right between the two communication ports, and the throats of the first venturi, the second venturi and the third venturi are fixedly connected with vertical pipelines in communication with the interiors thereof. In the application, when a liquid pump drives the liquid in the first venturi, the second venturi and the third venturi to flow, according to Bernoulli's principle, the liquid levels in the three vertical pipelines will drop by different heights, at this time, the center disc, the first supporting ring and the second supporting ring are arranged in an ascending ladder shape from inside to outside, at this time, wafers of different sizes will fall into supporting areas of different heights, so that the wafers of different sizes are stably supported.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor technology, specifically a multifunctional semiconductor cavity processing device. Background Technology

[0002] Semiconductors are materials whose conductivity at room temperature is between that of conductors and insulators. Semiconductor materials are widely used in communication systems and electrical fields. Commonly used semiconductor materials include silicon, germanium, and gallium arsenide. In the production and processing of semiconductor materials, semiconductor cavity processing equipment is required. However, existing semiconductor processing equipment still has some defects in use.

[0003] While existing semiconductor processing devices can perform single-wafer chemical processing on multiple wafers simultaneously, they cannot classify wafers of different sizes for processing in actual use, resulting in a narrow range of applications. Furthermore, existing semiconductor processing equipment cannot automatically remove polishing slurry while switching semiconductor support components, making it less functional. Summary of the Invention

[0004] The purpose of this invention is to provide a multifunctional semiconductor cavity processing device to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a multifunctional semiconductor cavity processing device, comprising a support mechanism, the support mechanism comprising a housing, a guide inclined ring fixedly sleeved inside the top surface of the housing, a second support ring slidably sleeved inside the guide inclined ring, a first support ring slidably sleeved inside the second support ring, a central disc slidably sleeved inside the first support ring, and connecting ports through the side walls of the housing fixedly connected to opposite sides of the housing. A first venturi tube, a second venturi tube, and a third venturi tube are fixedly connected sequentially from left to right between the two connecting ports. Vertical pipes communicating with the interiors of the first, second, and third venturi tubes are fixedly connected to their throats. A sliding rod is slidably connected inside the vertical pipe. The central disc is fixedly connected to the top end of the middle sliding rod. A support ring is fixedly connected to the top end of the left sliding rod. The top surface of the support ring is fixedly connected to the bottom surface of the second support ring. A support carriage is fixedly connected to the side of the right sliding rod. The top surface of the support carriage is fixedly connected to the bottom surface of the first support ring.

[0006] Preferably, a sliding sleeve is fixedly connected to the bottom surface of the bearing ring, the sliding sleeve is slidably sleeved on the vertical pipe on the right, a first sliding groove is provided on the side of the sliding sleeve, one end of the bearing slide passes through the first sliding groove and is connected to the sliding rod on the right, and the middle part of the bearing slide is slidably sleeved on the middle vertical pipe.

[0007] Preferably, the throat diameters of the first, second, and third venturi tubes are different, with the first venturi tube having the largest throat diameter and the second venturi tube having the smallest throat diameter.

[0008] Preferably, the thickness of the central disk is greater than that of the first support ring and the second support ring, and the first support ring and the second support ring have the same thickness.

[0009] Preferably, the top surface of the guide inclined ring is an outwardly inclined surface, and multiple guide liquid grooves are provided on it. An inner liquid pipe is fixedly installed inside the outer shell, and the inner liquid pipe is connected to the guide liquid grooves.

[0010] Preferably, a filtration mechanism is fixedly installed on the left side of the supporting mechanism. The filtration mechanism includes a filter chamber and a liquid pump. The inlet of the liquid pump is connected to the outlet of the filter chamber. The outlet of the liquid pump is connected to the left-side communication port through a first pipe. A second pipe is fixedly connected to the left side of the outer shell. The second pipe connects the inner liquid pipe and the inlet of the filter chamber.

[0011] Preferably, a plurality of centrally symmetrical stepper motors are fixedly connected to the inner top surface of the housing, and the output shaft of the stepper motor passes through the top surface of the housing and is fixedly sleeved with a positioning plate.

[0012] Preferably, the device also includes a polishing machine, which is a magnetorheological polishing device. The magnetorheological fluid inlet of the polishing machine is connected to the communication port on the right side, and the magnetorheological fluid outlet of the polishing machine is connected to the filter chamber.

[0013] The beneficial effects of this invention are as follows:

[0014] 1. In this invention, by using multiple Venturi tubes with different throat diameters, when the liquid pump drives the liquid flow in the first, second, and third Venturi tubes, according to Bernoulli's principle, the liquid levels in the three vertical pipes will drop to different heights. This causes the sliding rods in the three vertical pipes to slide downwards to different heights. As the sliding rods descend, the central disk, the first support ring, and the second support ring move downwards. Because the narrower the throat of the Venturi tube, the lower the liquid level in the connected vertical pipe during liquid flow. Therefore, as the liquid level in the vertical pipe stops dropping, the central disk... The first and second support rings are arranged in an ascending stepped pattern from the inside out. At this time, wafers of different sizes will fall into the support areas at different heights, thus providing stable support for wafers of different sizes. At the same time, this device uses a liquid-driven central disk, first and second support rings. Compared with the traditional motor-driven movement of corresponding components, liquid drive avoids the vibration generated by the motor during operation. This ensures that when the wafer comes into contact with the support structure, the support structure will not be subjected to periodic vibration, preventing the wafer from colliding with the support components due to vibration, thereby avoiding side breakage and wafer damage.

[0015] 2. Secondly, this invention uses magnetorheological fluid to drive the sliding rod in the vertical pipe to move up and down, thereby driving the central disk, the first support ring, and the second support ring to move up and down, thus supporting wafers of different sizes. At the same time, after the liquid pump draws the magnetorheological fluid from the filter chamber, the flow rate of this magnetorheological fluid changes after passing through the first venturi tube, the second venturi tube, and the third venturi tube, so that the magnetic particles in the magnetorheological fluid are fully mixed with the carrier liquid, thereby ensuring the polishing effect of the magnetorheological fluid on the wafer surface when it flows out of the outlet pipe of the polishing machine.

[0016] 3. Finally, through the setting of multiple centrally symmetrical stepper motors and positioning plates, after the wafer is placed on the central disk, all the stepper motors are started synchronously. At this time, the stepper motors drive the positioning plates to rotate towards the center of the support mechanism. As the positioning plates rotate, the positioning plates in contact with the wafer will push the wafer to move. After the wafer is pushed by multiple positioning plates, the center of the wafer and the center of the central disk are on the same vertical line, thereby centering the wafer and avoiding processing errors caused by inaccurate wafer positioning during subsequent wafer grinding, polishing and other processing. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0018] Figure 2 This is a top view of the support mechanism of the present invention;

[0019] Figure 3 This is a front sectional view of the bearing mechanism of the present invention;

[0020] Figure 4 For the present invention Figure 3 Enlarged structural diagram at point A in the middle;

[0021] Figure 5 This is a cross-sectional view of the outer casing of the present invention;

[0022] Figure 6 This is a cross-sectional view of the central disk, the first support ring, and the second support ring of the present invention.

[0023] Figure 7 This is a cross-sectional structural diagram of the bearing ring, sliding sleeve, and bearing carriage of the present invention.

[0024] In the diagram: 1. Bearing mechanism; 11. Outer shell; 12. Connecting port; 13. First Venturi tube; 14. Second Venturi tube; 15. Third Venturi tube; 16. Vertical pipe; 17. Sliding rod; 18. Central disc; 19. First support ring; 110. Second support ring; 111. Bearing ring; 112. Sliding sleeve; 113. First slide groove; 114. Bearing slide frame; 115. Guide inclined ring; 116. Guide liquid groove; 117. Inner liquid pipe; 118. Stepper motor; 119. Positioning plate; 2. Filtration mechanism; 21. Filtration chamber; 22. Liquid pump; 23. First pipe; 24. Second pipe; 3. Polishing machine. Detailed Implementation

[0025] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0026] like Figures 1 to 7 As shown, this embodiment of the invention provides a multifunctional semiconductor cavity processing device, including a support mechanism 1. The support mechanism 1 includes a housing 11. A guide inclined ring 115 is fixedly sleeved inside the top surface of the housing 11. A second support ring 110 is slidably sleeved inside the guide inclined ring 115. A first support ring 19 is slidably sleeved inside the second support ring 110. A central disk 18 is slidably sleeved inside the first support ring 19. A connecting port 12 penetrating the sidewalls of the housing 11 is fixedly connected to both opposite sides of the housing 11. A first venturi tube 13 and a second venturi tube 14 are sequentially fixedly connected between the two connecting ports 12 from left to right. The throats of tube 14 and the third Venturi tube 15, the first Venturi tube 13, the second Venturi tube 14 and the third Venturi tube 15 are all fixedly connected to vertical pipes 16 that communicate with their interiors. A sliding rod 17 is slidably connected inside the vertical pipe 16. A central disc 18 is fixedly connected to the top of the middle sliding rod 17. A bearing ring 111 is fixedly connected to the top of the left sliding rod 17. The top surface of the bearing ring 111 is fixedly connected to the bottom surface of the second support ring 110. A bearing carriage 114 is fixedly connected to the side of the right sliding rod 17. The top surface of the bearing carriage 114 is fixedly connected to the bottom surface of the first support ring 19.

[0027] In this invention, by using multiple Venturi tubes with different throat diameters, when the liquid pump 22 drives the liquid flow in the first Venturi tube 13, the second Venturi tube 14, and the third Venturi tube 15, according to Bernoulli's principle, the liquid level in the three vertical pipes 16 will drop to different heights. This causes the sliding rods 17 in the three vertical pipes 16 to slide downwards to different heights. As the sliding rods 17 descend, the central disk 18, the first support ring 19, and the second support ring 110 move downwards. Because the narrower the throat of the Venturi tube, the lower the liquid level in the connected vertical pipe 16 during liquid flow. Therefore, as the liquid level in the vertical pipe 16 stops descending, this... The central disk 18, the first support ring 19, and the second support ring 110 are arranged in an ascending stepped pattern from the inside out. At this time, wafers of different sizes will fall into the support areas at different heights, thus providing stable support for wafers of different sizes. At the same time, this device uses liquid to drive the central disk 18, the first support ring 19, and the second support ring 110. Compared with the traditional motor-driven movement of corresponding components, liquid drive avoids the vibration generated by the motor during operation, thus ensuring that the support structure is not subjected to periodic vibration when the wafer comes into contact with it. This prevents the wafer from colliding with the support components due to vibration, thereby avoiding side breakage and wafer damage.

[0028] Secondly, the present invention uses magnetorheological fluid to drive the sliding rod 17 in the vertical pipe 16 to move up and down, thereby driving the central disk 18, the first support ring 19 and the second support ring 110 to move up and down, thereby supporting wafers of different sizes. At the same time, after the liquid pump 22 draws the magnetorheological fluid from the filter chamber 21, the flow rate of the magnetorheological fluid changes after passing through the first venturi tube 13, the second venturi tube 14 and the third venturi tube 15, so that the magnetic particles in the magnetorheological fluid are fully mixed with the carrier liquid, thereby ensuring the polishing effect of the magnetorheological fluid on the wafer surface when the magnetorheological fluid flows out of the outlet pipe of the polishing machine 3.

[0029] Finally, with multiple centrally symmetrical stepper motors 118 and positioning plates 119, all stepper motors 118 are started synchronously after the wafer is placed on the central disk 18. At this time, the stepper motors 118 drive the positioning plates 119 to rotate towards the center of the support mechanism 1. As the positioning plates 119 rotate, the positioning plates 119 in contact with the wafer will push the wafer to move. After the wafer is pushed by multiple positioning plates 119, the center of the wafer and the center of the central disk 18 are on the same vertical line, thereby centering the wafer and avoiding processing errors caused by inaccurate wafer positioning during subsequent grinding, polishing and other processing.

[0030] The bottom surface of the bearing ring 111 is fixedly connected to a sliding sleeve 112, which is slidably fitted onto the vertical pipe 16 on the right. A first groove 113 is provided on the side of the sliding sleeve 112. One end of the bearing slide 114 passes through the first groove 113 and is connected to the sliding rod 17 on the right. The middle part of the bearing slide 114 is slidably fitted onto the middle vertical pipe 16. The throat diameters of the first venturi tube 13, the second venturi tube 14, and the third venturi tube 15 are different, with the first venturi tube 13 having the largest throat diameter and the second venturi tube 14 having the smallest throat diameter.

[0031] Based on the characteristics of the Venturi tube, when the liquid flows in the Venturi tube, the smaller the diameter of the throat of the Venturi tube, the lower the liquid level in the vertical pipe 16 connected to the throat. According to the above characteristics, after the fluid flows in different Venturi tubes, the top height of the sliding rod 17 in the vertical pipe 16 connected to it is different, which makes the height of the central disk 18, the first support ring 19 and the second support ring 110 different, thus forming a cavity structure to stably fix the wafer in the cavity, so as to ensure that the wafer will not shake and interfere with the processing in subsequent processing.

[0032] The central disc 18 is thicker than the first support ring 19 and the second support ring 110. The first support ring 19 and the second support ring 110 have the same thickness. The top surface of the guide inclined ring 115 is an outwardly inclined surface, and multiple guide liquid grooves 116 are formed on it. An inner liquid pipe 117 is fixedly installed inside the outer shell 11, and the inner liquid pipe 117 is connected to the guide liquid grooves 116.

[0033] During the wafer polishing process, as the magnetorheological fluid flows out of the outlet pipe of the polishing machine 3, the magnetic materials inside the fluid are attracted by the polishing wheel. As the wheel rotates, the fluid polishes the top surface of the wafer. Excess carrier fluid, stabilizers, and other additives remain on the wafer surface. In subsequent polishing processes, these residual fluids are washed to the sides of the wafer by the remaining fluid, carrying away the silicon particles removed during polishing. Then, during further polishing... After completion, as the magnetorheological fluid in the first Venturi tube 13, the second Venturi tube 14, and the third Venturi tube 15 stops flowing, the three sliding rods 17 return to their initial state under the principle of communicating vessels. At this time, because the thickness of the central disk 18 is greater than that of the other two support rings, the magnetorheological fluid on the central disk 18 rolls off the wafer and eventually flows into the inner liquid pipe 117 from the guide liquid groove 116 on the guide inclined ring 115, so that the residual magnetorheological fluid is recycled into the filter chamber 21 to prevent the magnetorheological fluid from being wasted.

[0034] A filter mechanism 2 is fixedly installed on the left side of the supporting mechanism 1. The filter mechanism 2 includes a filter chamber 21 and a liquid pump 22. The inlet of the liquid pump 22 is connected to the outlet of the filter chamber 21, and the outlet of the liquid pump 22 is connected to the left-side connecting port 12 through a first pipe 23. A second pipe 24 is fixedly connected to the left side of the outer casing 11. The second pipe 24 connects the inner liquid pipe 117 and the inlet of the filter chamber 21.

[0035] After the liquid pump 22 draws the magnetorheological fluid from the filter chamber 21, it is transported by the liquid pump 22 and flows into the polishing machine 3 after passing through the first Venturi tube 13, the second Venturi tube 14 and the third Venturi tube 15. During the process of changing the flow rate in the first Venturi tube 13, the second Venturi tube 14 and the third Venturi tube 15, the magnetic particles in the magnetorheological fluid are more evenly distributed, thereby avoiding problems such as the deposition of magnetic particles after the liquid pump 22 draws the magnetorheological fluid, which would lead to poor polishing and grinding effects of the magnetorheological fluid.

[0036] The inner top surface of the outer casing 11 is fixedly connected to multiple centrally symmetrical stepper motors 118. The output shafts of the stepper motors 118 pass through the top surface of the outer casing 11 and are fixedly sleeved with positioning plates 119.

[0037] The arrangement of multiple positioning plates 119 allows the wafer to be pushed after the multiple stepper motors 118 rotate synchronously at the same angle. Under the action of the multiple positioning plates 119, the wafer is positioned so that the center of the wafer is on the same vertical line as the center of the central disk 18, ensuring the stability of the wafer in the subsequent grinding and polishing process.

[0038] It also includes a polishing machine 3, which is a magnetorheological polishing device. The magnetorheological fluid inlet of the polishing machine 3 is connected to the communication port 12 on the right side, and the magnetorheological fluid outlet of the polishing machine 3 is connected to the filter chamber 21.

[0039] Working principle:

[0040] When using this equipment to grind and polish the top surface of a wafer, the wafer is first placed on the central disk 18. Then, the stepper motor 118 is started synchronously, causing the positioning plates 119 to rotate toward the center of the central disk 18. After the positioning plates 119 come into contact with the wafer, they will push the wafer to move. With the cooperation of multiple positioning plates 119, the wafer is centered at this time.

[0041] Then, the liquid pump 22 is started, which causes the magnetorheological fluid in the first Venturi tube 13, the second Venturi tube 14 and the third Venturi tube 15 to start flowing. According to the characteristics of the Venturi tube, the sliding rod 17 in the vertical pipe 16 begins to move downward, which causes the upper central disk 18, the first support ring 19 and the second support ring 110 to move down at different heights. As the sliding rod 17 stops moving, the central disk 18, the first support ring 19 and the second support ring 110 are arranged in a stepped manner, so that wafers of different sizes are located in different support positions.

[0042] After the top surface of the wafer is ground and polished using polishing machine 3, the passage between the right connecting port 12 and polishing machine 3 is disconnected. At this time, the liquid pump 22 continues to inject a certain amount of magnetorheological fluid into the first Venturi tube 13, the second Venturi tube 14 and the third Venturi tube 15 until the magnetorheological fluid missing due to the drop in the liquid level in the three vertical pipes 16 is replenished. Then the liquid pump 22 is turned off. At this time, as the liquid in the Venturi tube stops flowing, under the communicating vessel effect, the central disk 18, the first support ring 19 and the second support ring 110 return to the starting position. At this time, the carrier liquid, stabilizer and other additives on the central disk 18, the first support ring 19 and the wafer will flow along the guide liquid groove 116 on the guide inclined ring 115 to the filter chamber 21, thereby filtering out the silicon crystal particles in the magnetorheological fluid and preventing them from affecting the grinding and polishing effect in subsequent processing stages.

[0043] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0044] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A multifunctional semiconductor cavity processing device, comprising a support mechanism (1), said support mechanism (1) including a housing (11), characterized in that: A guide bevel ring (115) is fixedly sleeved inside the top surface of the outer shell (11). A second support ring (110) is slidably sleeved inside the guide bevel ring (115). A first support ring (19) is slidably sleeved inside the second support ring (110). A central disc (18) is slidably sleeved inside the first support ring (19). A connecting port (12) penetrating through its sidewall is fixedly connected to both opposite sides of the outer shell (11). The two connecting ports (12) are fixedly connected sequentially from left to right. A first Venturi tube (13), a second Venturi tube (14), and a third Venturi tube (15) are fixedly connected. Each of the throats of the first Venturi tube (13), the second Venturi tube (14), and the third Venturi tube (15) is fixedly connected to a vertical pipe (16) communicating with its interior. A sliding rod (17) is slidably connected inside the vertical pipe (16). A central disc (18) is fixedly connected to the top of the middle sliding rod (17), and the top of the left sliding rod (17) is fixedly connected to... A bearing ring (111) is provided, the top surface of which is fixedly connected to the bottom surface of the second support ring (110). A bearing slide (114) is fixedly connected to the side of the sliding rod (17) on the right side, the top surface of which is fixedly connected to the bottom surface of the first support ring (19). A sliding sleeve (112) is fixedly connected to the bottom surface of the bearing ring (111), and the sliding sleeve (112) is slidably fitted onto the vertical pipe (16) on the right side. The side is provided with a first groove (113). One end of the bearing slide (114) passes through the first groove (113) and is connected to the right sliding rod (17). The middle part of the bearing slide (114) is slidably sleeved on the middle vertical pipe (16). The throat diameters of the first venturi tube (13), the second venturi tube (14) and the third venturi tube (15) are different. The throat diameter of the first venturi tube (13) is the largest, and the throat diameter of the second venturi tube (14) is the smallest.

2. The multifunctional semiconductor cavity processing device according to claim 1, characterized in that: The thickness of the central disk (18) is greater than that of the first support ring (19) and the second support ring (110), and the first support ring (19) and the second support ring (110) have the same thickness.

3. The multifunctional semiconductor cavity processing device according to claim 2, characterized in that: The top surface of the guide inclined ring (115) is an outward inclined surface, and multiple guide liquid grooves (116) are provided on it. An inner liquid pipe (117) is fixedly installed inside the outer shell (11), and the inner liquid pipe (117) is connected to the guide liquid grooves (116).

4. The multifunctional semiconductor cavity processing device according to claim 3, characterized in that: A filter mechanism (2) is fixedly installed on the left side of the bearing mechanism (1). The filter mechanism (2) includes a filter chamber (21) and a liquid pump (22). The inlet of the liquid pump (22) is connected to the outlet of the filter chamber (21). The outlet of the liquid pump (22) is connected to the left-side connecting port (12) through a first pipe (23). A second pipe (24) is fixedly connected to the left side of the outer shell (11). The second pipe (24) connects the inner liquid pipe (117) and the inlet of the filter chamber (21).

5. A multifunctional semiconductor cavity processing device according to claim 4, characterized in that: Multiple centrally symmetrical stepper motors (118) are fixedly connected to the inner top surface of the outer shell (11). The output shaft of the stepper motor (118) passes through the top surface of the outer shell (11) and is fixedly sleeved with a positioning plate (119).

6. The multifunctional semiconductor cavity processing device according to claim 5, characterized in that: It also includes a polishing machine (3), which is a magnetorheological polishing device. The magnetorheological fluid inlet of the polishing machine (3) is connected to the communication port (12) on the right side, and the magnetorheological fluid outlet of the polishing machine (3) is connected to the filter chamber (21).

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