Wafer edge grinding machine and edge grinding method

Abstract

The invention relates to the field of semiconductor manufacturing equipment, and discloses a wafer edge grinding machine and an edge grinding method.The wafer edge grinding machine comprises a base, and the base is provided with a wafer storage assembly, a wafer transfer assembly, a wafer detection assembly and a wafer edge grinding assembly; the wafer storage assembly is used for storing different wafers; the wafer edge grinding assembly comprises a coarse grinding assembly and a fine grinding assembly which are respectively used for performing coarse grinding treatment and fine grinding treatment on the wafer; the wafer transfer assembly comprises a first transfer assembly, a positioning platform and a second transfer assembly which are all used for transferring wafers; the wafer detection assembly comprises a thickness measurement system and an appearance detection system; the accurate grinding assembly and the rough grinding assembly are arranged together, the risk that defective products are generated due to the fact that wafers are clamped and transferred for multiple times is reduced, the yield of wafer edge grinding is improved, the thickness measuring system and the appearance detecting system are arranged around the positioning platform, rapid detection after wafer edge grinding is facilitated, and the production efficiency is improved. And the trouble of clamping the wafer into the detection assembly again and the risk of possibly damaging the wafer are avoided.

Description

Technical Field

[0001] The invention relates to the field of semiconductor manufacturing equipment, and in particular to a wafer edge grinding machine and an edge grinding method. Background Art

[0002] In the manufacturing process of semiconductor chips, the processing of wafer edges is crucial, which not only affects the chip packaging quality, but also directly relates to the chip's electrical performance and reliability. Traditional wafer edge grinding machines often use a single grinding head for operation, and require multiple clamping and chip transfers to complete the steps of rough grinding, fine grinding, cleaning, thickness measurement and inspection, which is not only inefficient, but also increases the risk of wafer damage. Summary of the invention

[0003] The technical problem to be solved by the present invention is: how to improve the efficiency and yield of wafer edge grinding. In order to solve the above technical problem, the present invention provides a wafer edge grinding machine, which has a first direction and a second direction perpendicular to each other, and comprises a base, wherein the base is provided with a wafer storage component, a wafer transfer component, a wafer detection component and a wafer edge grinding component in sequence along the first direction;

[0004] The wafer storage assembly includes a plurality of wafer boxes evenly distributed along an arc, and the wafer boxes are used to store wafers to be processed and processed wafers;

[0005] The wafer edge grinding assembly comprises a rough grinding assembly and a fine grinding assembly, wherein the rough grinding assembly and the fine grinding assembly are used for performing rough grinding and fine grinding on the wafer respectively;

[0006] The wafer transfer assembly comprises a first transfer assembly, a positioning platform and a second transfer assembly which are sequentially arranged along a first direction; the first transfer assembly is arranged in the wafer storage assembly and is used to transfer wafers between the positioning platform and a plurality of the wafer boxes, and the second transfer assembly is used to transfer wafers between the positioning platform, the rough grinding assembly and the fine grinding assembly;

[0007] The wafer inspection component comprises a thickness measurement system and an appearance inspection system, and the thickness measurement system and the appearance inspection system are respectively arranged on two sides of the positioning platform along the second direction.

[0008] Preferably, the plurality of wafer boxes are evenly distributed along an arc, and the rotation axis of the first transfer component coincides with the center of the arc; and the positioning platform is disposed on a side of the first transfer component away from the wafer boxes.

[0009] Preferably, the wafer storage assembly includes a first wafer box, a second wafer box and a third wafer box, and at least one of the first wafer box, the second wafer box and the third wafer box is provided; the first wafer box is used to store wafers to be edge-grinded, the second wafer box is used to store wafers that fail the edge-grinding inspection, and the third wafer box is used to store wafers that pass the edge-grinding inspection.

[0010] Preferably, the rough grinding assembly and the fine grinding assembly are symmetrically arranged along the axis of the wafer storage assembly.

[0011] Preferably, the rough grinding assembly comprises a rough grinding drive structure, a rough grinding head and a first cleaning tank, the rough grinding drive structure comprises a plurality of first driving motors, the first driving motors are used to adjust the position of the rough grinding head and drive the rough grinding head to move to grind the wafer, and the first cleaning tank is used to clean the wafer after rough grinding;

[0012] The fine grinding assembly includes a fine grinding drive structure, a fine grinding head and a second cleaning tank. The fine grinding drive structure includes multiple second driving motors. The second driving motors are used to adjust the position of the fine grinding head and drive the fine grinding head to move to grind the wafer. The second cleaning tank is used to clean the wafer after fine grinding.

[0013] Preferably, the second transfer assembly includes a first robot arm and a second robot arm operating independently, and the first robot arm and the second robot arm rotate coaxially to transfer wafers between the positioning platform, the rough grinding head, the first cleaning tank, the fine grinding head and the second cleaning tank.

[0014] Preferably, the positioning platform includes a first adjustment mechanism, a positioning support column and a rotating motor, the first adjustment mechanism includes multiple first adjustment motors, the first adjustment mechanism is used to adjust the position of the positioning support column along the first direction, the second direction and the vertical direction, and the rotating motor is used to drive the positioning support column to rotate around its own axis.

[0015] Preferably, the appearance detection system comprises a second adjustment mechanism and an appearance detection device, the second adjustment mechanism comprises a plurality of second adjustment motors, and the second adjustment mechanism is used to adjust the position of the appearance detection device on the base.

[0016] Preferably, the thickness measuring system comprises a third adjusting mechanism and a thickness measuring device, the third adjusting mechanism comprises a plurality of third adjusting motors, and the third adjusting mechanism is used for the position of the thickness measuring device on the base.

[0017] The present invention also provides a wafer edge grinding method, comprising the following steps:

[0018] S1, the first transfer component takes out the wafer to be edge-grinded from the first wafer box and transfers it to the positioning platform, and the positioning platform performs a deflection correction process on the wafer to be edge-grinded on it, so that the wafer to be edge-grinded on the positioning platform is in the center of the transport position of the second transfer component;

[0019] S2, the second transfer assembly moves the wafer to be edge-grinded on the positioning platform to the rough grinding head, starts the rough grinding program, and the rough grinding head begins to perform preliminary grinding on the edge of the wafer;

[0020] S3, after the rough grinding is completed, the second transfer assembly transfers the rough ground wafer to the first cleaning tank for cleaning;

[0021] S4, the second transfer assembly moves the wafer after rough grinding and cleaning to the fine grinding head, starts the fine grinding program, and the fine grinding head begins to finely grind and polish the edge of the wafer;

[0022] S5, after fine grinding is completed, the second transfer assembly transfers the finely ground wafer to the second cleaning tank for cleaning;

[0023] S6, the second transfer assembly moves the wafer after fine grinding and cleaning to the positioning platform, and the thickness measuring device and the appearance inspection device simultaneously perform thickness inspection and appearance inspection on the wafer after grinding;

[0024] S7. The first transfer assembly transfers the qualified wafers to the third wafer box, and transfers the unqualified wafers to the second wafer box.

[0025] Compared with the prior art, the wafer edge grinding machine and edge grinding method provided in the embodiments of the present invention have the following beneficial effects:

[0026] In the present embodiment, a plurality of wafer boxes in the wafer storage assembly are arranged together in an arc shape, thereby facilitating the wafer transportation by the first transfer assembly, reducing the motion state and stroke of the first transfer assembly, and improving the transportation efficiency before and after the wafer edge grinding process; and in the present invention, the fine grinding assembly and the rough grinding assembly are arranged together, and the second transfer assembly can transfer the wafer between the rough grinding assembly, the fine grinding assembly and the positioning platform, thereby reducing the risk of defective products caused by multiple clamping and transfer of the wafer, and improving the yield rate of wafer edge grinding. The thickness measuring system and the appearance inspection system are arranged around the positioning platform, which also facilitates the rapid inspection of the wafer after edge grinding, and avoids the trouble of clamping the wafer to the inspection assembly again and the risk of possible damage to the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is a stereoscopic view of the present invention;

[0028] Figure 2 is a top view of the present invention;

[0029] Figure 3 It is a simplified diagram of the structure layout of the present invention;

[0030] Figure 4 is a three-dimensional view of a wafer storage assembly of the present invention;

[0031] Figure 5 is a stereoscopic view of the positioning platform of the present invention;

[0032] Figure 6 is a three-dimensional view of the thickness measurement system of the present invention;

[0033] Figure 7 It is a stereoscopic view of the appearance inspection system of the present invention.

[0034] In the figure: 1. base;

[0035] 2. Wafer storage assembly; 21. First wafer box; 22. Second wafer box; 23. Third wafer box; 24. Wafer box positioning platform;

[0036] 3. Wafer transfer assembly; 31. First transfer assembly; 32. Positioning platform; 321. First adjustment mechanism; 322. Positioning support column; 323. Rotating motor; 33. Second transfer assembly; 331. First mechanical arm; 332. Second mechanical arm;

[0037] 4. Wafer inspection component; 41. Thickness measurement system; 411. Third adjustment mechanism; 412. Thickness measurement device; 42. Appearance inspection system; 421. Second adjustment mechanism; 422. Appearance inspection device;

[0038] 5. Wafer edge grinding assembly; 51. Rough grinding assembly; 511. Rough grinding drive structure; 512. Rough grinding head; 513. First cleaning tank; 52. Fine grinding assembly; 521. Fine grinding drive structure; 522. Fine grinding head; 523. Second cleaning tank. DETAILED DESCRIPTION

[0039] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0040] like Figures 1 to 3 As shown, a preferred embodiment of the present invention provides a wafer edge grinding machine, which has a first direction and a second direction perpendicular to each other, and includes a base 1, and the base 1 is provided with a wafer storage component 2, a wafer transfer component 3, a wafer detection component 4 and a wafer edge grinding component 5 in sequence along the first direction;

[0041] The wafer storage assembly 2 includes a plurality of wafer boxes evenly distributed along an arc, and the wafer boxes are used to store wafers to be processed and processed wafers;

[0042] The wafer edge grinding assembly 5 comprises a rough grinding assembly 51 and a fine grinding assembly 52, wherein the rough grinding assembly 51 and the fine grinding assembly 52 are used for rough grinding and fine grinding of the wafer respectively;

[0043] The wafer transfer assembly 3 includes a first transfer assembly 31, a positioning platform 32, and a second transfer assembly 33 which are sequentially arranged along a first direction; the first transfer assembly 31 is arranged in the wafer storage assembly 2 and is used to transfer wafers between the positioning platform 32 and a plurality of wafer boxes, and the second transfer assembly 33 is used to transfer wafers between the positioning platform 32, the rough grinding assembly 51, and the fine grinding assembly 52;

[0044] The wafer inspection assembly 4 includes a thickness measurement system 41 and an appearance inspection system 42 . The thickness measurement system 41 and the appearance inspection system 42 are respectively disposed on two sides of the positioning platform 32 along the second direction.

[0045] The first direction is the X direction, and the second direction is the Y direction.

[0046] Specifically, in the traditional scheme, the wafer grinder often adopts a single grinding head structure, and the wafer needs to be ground multiple times, so it is necessary to transfer the wafer between multiple grinders to achieve a better grinding effect, and after the wafer is edged, it is often necessary to transfer the wafer to different testing equipment through different mechanisms, which is not only complex in structure, but also in the process of wafer transportation, the repeated clamping and handling of the wafer is very easy to cause damage to the wafer, which greatly reduces the product yield after the wafer is edged. In this embodiment, first, a plurality of wafer boxes for storing different wafers are centrally arranged together, and these wafer boxes are arranged in an arc shape, so that the first transfer component 31 arranged in the wafer storage component 2 can realize the access operation of the wafers in all wafer boxes, which is not only more compact and simple in structure, and more reasonable in spatial layout, but also improves the fluency and coherence between various processes, and after the first transfer component 31 stores the wafer after edge grinding detection, it can take out the new wafer to be edged to the positioning platform 32, which reduces the transfer time and waiting time of multiple transfer mechanisms to transfer different wafers, and improves the efficiency of wafer transfer. The positioning platform 32 serves as the transfer position of the first transfer component 31 and the second transfer component 33. The thickness measuring system 41 and the appearance inspection system 42 are respectively arranged on both sides of the positioning platform 32, which can inspect the thickness and appearance of the wafer located on the positioning platform 32 during the wafer transfer, avoiding the trouble of clamping the wafer and transferring it to the inspection component for inspection in the traditional solution, which not only improves the efficiency of wafer inspection after edge grinding, but also reduces the risk of damage to the wafer after multiple clamping and transfer, thereby improving the yield of wafer production. Finally, the second transfer component 33 can transfer the wafer cyclically between the positioning platform 32, the rough grinding component 51 and the fine grinding component 52, avoiding the problem of multiple clamping of the wafer to different grinding equipment in the traditional solution, reducing the problem of low yield caused by multiple clamping of the wafer, improving the yield of the wafer product, and making the flow of the wafer in the rough grinding component 51 and the fine grinding component 52 smoother and more convenient, and also improving the edge grinding efficiency of the wafer.

[0047] like Figure 4 As shown, in some embodiments, multiple wafer boxes are evenly distributed along the arc, and the rotation axis of the first transfer component 31 coincides with the center of the arc; the positioning platform 32 is disposed on a side of the first transfer component 31 away from the wafer boxes.

[0048] Specifically, the centers of multiple wafer boxes are on the arc of the same circle, and the rotation axis of the first transfer component 31 also coincides with the center of this circle. In this way, the first transfer component 31 can more conveniently move between the wafer boxes and access wafers, thereby improving the smoothness of wafer access, making the wafer access rhythm more reasonable, and the wafer access efficiency higher.

[0049] In a special embodiment, the positioning platform 32 can be moved so that the distance from the center of the positioning platform 32 to the rotation axis of the first transfer component 31 is the same as the distance from the center of the wafer box to the rotation axis of the first transfer component 31. At this time, the first transfer component 31 can transfer the wafer between the wafer box and the positioning platform 32 more smoothly and efficiently.

[0050] In some embodiments, the wafer storage component 2 includes a first wafer box 21, a second wafer box 22 and a third wafer box 23, and at least one of the first wafer box 21, the second wafer box 22 and the third wafer box 23 is provided; the first wafer box 21 is used to store wafers to be edge-grinded, the second wafer box 22 is used to store wafers that fail the edge grinding inspection, and the third wafer box 23 is used to store wafers that pass the edge grinding inspection. In a specific embodiment, the wafer storage component 2 includes five wafer boxes, of which two first wafer boxes 21 are provided, one second wafer box 22 is provided, and two third wafer boxes 23 are provided. The five wafer boxes are evenly distributed on the wafer box positioning platform 24 and are in a semicircular arc shape. The first transfer component 31 can rotate to align with different wafer boxes, and then the end of the first transfer component 31 can extend into the wafer box to absorb the wafer to be edged or put down the wafer that has been edged. When the first transfer component 31 absorbs the wafer to be edged, the end of the first transfer component 31 will withdraw from the wafer box, and then rotate to above the positioning platform 32, and then the end of the first transfer component 31 drives the wafer down until the wafer is placed on the positioning platform 32. Correspondingly, for the wafers that have been inspected, the end of the first transfer component 31 will be lowered to the positioning platform 32 to absorb the wafer, and then the end of the first transfer component 31 will drive the wafer to a predetermined height, and then according to different inspection results, the end of the first transfer component 31 will rotate in front of different wafer boxes, and the end of the first transfer component 31 will drive the wafer to move to the inside of the corresponding wafer box and put down the wafer. It is best that the end of the first transfer component 31 exits the corresponding wafer box and moves to the first wafer box 21 to take out the new wafer to be edged. The entire wafer access process is more efficient and smooth, greatly improving the production cycle and production efficiency.

[0051] In some embodiments, the rough grinding assembly 51 and the fine grinding assembly 52 are symmetrically arranged along the axis of the wafer storage assembly 2 .

[0052] Further, the rough grinding assembly 51 includes a rough grinding drive structure 511, a rough grinding head 512 and a first cleaning tank 513. The rough grinding drive structure 511 includes a plurality of first driving motors, the first driving motors are used to adjust the position of the rough grinding head 512 and drive the rough grinding head 512 to move to grind the wafer, and the first cleaning tank 513 is used to clean the wafer after rough grinding;

[0053] The fine grinding assembly 52 includes a fine grinding drive structure 521, a fine grinding head 522 and a second cleaning tank 523. The fine grinding drive structure 521 includes multiple second driving motors. The second driving motors are used to adjust the position of the fine grinding head 522 and drive the fine grinding head 522 to move to grind the wafer. The second cleaning tank 523 is used to clean the wafer after fine grinding.

[0054] Specifically, the symmetrical arrangement of the rough grinding assembly 51 and the fine grinding assembly 52 enables the first transfer assembly 31 to more smoothly rotate and transfer the wafer between the rough grinding assembly 51 and the fine grinding assembly 52, thereby improving the smoothness of the production rhythm and improving the transfer efficiency of the wafer during the edge grinding process. In addition, the fine grinding drive structure 521 is similar to the rough grinding drive structure 511, and both include multiple first drive motors and second drive motors, respectively. By installing multiple motors in different directions, the position of the fine grinding head 522 and the rough grinding head 512 in space can be adjusted, wherein the fine grinding drive structure 521 and the rough grinding drive structure 511 both include an xyz three-axis adjustment platform commonly used in the field of automation equipment, and the specific structure is not repeated here. Finally, the first cleaning tank 513 and the second cleaning tank 523 can both use high-pressure water mist spraying and rotary brushing to remove grinding residues on the surface of the wafer to ensure the smooth progress of subsequent inspection work.

[0055] In some embodiments, the second transfer assembly 33 includes an independently operated first robot arm 331 and a second robot arm 332, which rotate coaxially to transfer wafers between the positioning platform 32, the rough grinding head 512, the first cleaning tank 513, the fine grinding head 522 and the second cleaning tank 523.

[0056] Specifically, in this embodiment, the second transfer assembly 33 transfers the wafer between the positioning platform 32, the rough grinding head 512, the first cleaning tank 513, the fine grinding head 522 and the second cleaning tank 523 through a rotating mechanical arm. In a second preferred embodiment, the slide rails arranged along the first direction cooperate with the slider and the mechanical arm to transfer the wafer between the positioning platform 32, the rough grinding head 512, the first cleaning tank 513, the fine grinding head 522 and the second cleaning tank 523. The rotating mechanical arm in this embodiment can reduce the space occupancy rate of the equipment, improve the space utilization rate, and also can better improve the transfer efficiency of the wafer, thereby improving the wafer grinding efficiency.

[0057] Furthermore, in the present application, two robotic arms are provided, and the two robotic arms operate independently, and both can transfer wafers between the positioning platform 32, the rough grinding head 512, the first cleaning tank 513, the fine grinding head 522 and the second cleaning tank 523, so that rough grinding and fine grinding can be performed on two wafers at the same time, and the first transfer component 31 can also be staggered, the layout is more reasonable, the entire production rhythm is tighter, the production rhythm is faster and more orderly, and the grinding efficiency of the wafers is improved.

[0058] In addition, in a special embodiment, when the first robotic arm 331 and the second robotic arm 332 extend along the second direction, the first cleaning tank 513 is located directly below the first robotic arm 331, the second cleaning tank 523 is located directly below the second robotic arm 332, and the rough grinding head 512 and the fine grinding head 522 are located on the side of the second transfer assembly 33 away from the first transfer assembly 31.

[0059] like Figure 5 As shown, in some embodiments, the positioning platform 32 includes a first adjustment mechanism 321, a positioning support column 322 and a rotating motor 323. The first adjustment mechanism 321 includes a plurality of first adjustment motors. The first adjustment mechanism 321 is used to adjust the position of the positioning support column 322 along the first direction, the second direction and the vertical direction. The rotating motor 323 is used to drive the positioning support column 322 to rotate around its own axis. The first adjustment mechanism 321 in the positioning platform 32 is a three-axis adjustment platform, which can adjust the position of the positioning support column 322 in space, so that the wafer can be transferred between the first transfer assembly 31 and the second transfer assembly 33 more conveniently and safely, and the subsequent appearance inspection system 42 and the thickness measurement system 41 are also convenient for the inspection of the edge-grinded wafer. The inspection and transfer efficiency of the wafer is higher, and the trouble of clamping the wafer is eliminated. The inspection and transfer process of the wafer is safer and more reliable.

[0060] like Figure 6 and Figure 7 As shown, in some embodiments, the appearance detection system 42 includes a second adjustment mechanism 421 and an appearance detection device 422 , the second adjustment mechanism 421 includes a plurality of second adjustment motors, and the second adjustment mechanism 421 is used to adjust the position of the appearance detection device 422 on the base 1 .

[0061] Furthermore, the thickness measuring system 41 includes a third adjusting mechanism 411 and a thickness measuring device 412 . The third adjusting mechanism 411 includes a plurality of third adjusting motors. The third adjusting mechanism 411 is used to adjust the position of the thickness measuring device 412 on the base 1 .

[0062] Specifically, the second adjustment mechanism 421 and the third adjustment mechanism 411 are both common two-axis adjustment platforms, which can respectively adjust the positions of the appearance inspection device 422 and the thickness measuring device 412 on the base 1, thereby facilitating the appearance inspection device 422 and the thickness measuring device 412 to inspect the polishing condition of the wafer on the positioning platform 32.

[0063] The present invention also provides a wafer edge grinding method, comprising the following steps:

[0064] S1, the first transfer assembly 31 takes out the wafer to be edge-milled from the first wafer box 21 and transfers it to the positioning platform 32, and the positioning platform 32 performs a deflection correction process on the wafer to be edge-milled on it, so that the wafer to be edge-milled on the positioning platform 32 is located in the center of the transport position of the second transfer assembly 33;

[0065] S2, the second transfer assembly 33 transports the wafer to be edge-grinded on the positioning platform 32 to the rough grinding head 512, starts the rough grinding procedure, and the rough grinding head 512 begins to perform preliminary grinding on the edge of the wafer;

[0066] S3, after the rough grinding is completed, the second transfer assembly 33 transfers the rough ground wafer to the first cleaning tank 513 for cleaning;

[0067] S4, the second transfer assembly 33 transports the wafer after rough grinding and cleaning to the fine grinding head 522, starts the fine grinding process, and the fine grinding head 522 starts fine grinding and polishing the edge of the wafer;

[0068] S5, after fine grinding is completed, the second transfer assembly 33 transfers the finely ground wafer to the second cleaning tank 523 for cleaning;

[0069] S6, the second transfer assembly 33 transports the wafer after fine grinding and cleaning to the positioning platform 32, and the thickness measuring device 412 and the appearance inspection device 422 simultaneously perform thickness inspection and appearance inspection on the wafer after grinding;

[0070] S7 , the first transfer assembly 31 transfers the qualified wafers to the third wafer box 23 , and transfers the unqualified wafers to the second wafer box 22 .

[0071] Specifically, during the entire operation process, the first transfer component 31 takes out the wafer to be edge-grinded from the first wafer box 21 and places it on the positioning support column 322 of the positioning platform 32, and then the positioning support column 322 moves to the transport position of the second transfer component 33, and the first robot arm 331 in the second transfer component 33 sucks the wafer to be edge-grinded to the rough grinding head 512 for grinding. At the same time, the first transfer component 31 will suck the second wafer to be ground to the positioning support column 322 of the positioning platform 32, and the second robot arm 332 in the second transfer component 33 will suck the second wafer to be edge-grinded and stand by. When the first robot arm 331 transfers the first wafer to be rough-grinded to the first cleaning tank 513, the second robot arm 332 will move the second wafer to be edge-grinded. The first wafer is moved to the rough grinding head 512 for rough grinding, and then the first robot arm 331 drives the first wafer to move to the fine grinding head 522 and the second cleaning tank 523 in sequence for fine grinding box cleaning. After cleaning, the wafer is transferred by the first robot arm 331 to the positioning platform 32 for thickness and appearance inspection. After the inspection is completed, the first transfer component will transfer the wafer to the second wafer box 22 or the third wafer box 23 according to the inspection result, and take out the third wafer to be edged and place it on the positioning platform 32. The first robot arm 331 then absorbs the third wafer to be edged for edge grinding, and the first transfer component 31 takes away the second wafer that has completed edge grinding and inspection and transports it to the corresponding wafer box. This reciprocating process can achieve efficient and fast wafer edge grinding.

[0072] In summary, an embodiment of the present invention provides a wafer edge grinding machine, which realizes continuous rough grinding, fine grinding, detection and storage of multiple wafers by setting the positions of multiple wafer boxes and the positions and structures of the first transfer component 31, the positioning platform 32 and the second transfer component 33, greatly shortening the detection time between various processes in wafer edge grinding, and by optimizing the layout of each device, reducing the number of wafer clamping times and the time for handling and transfer, and improving the rhythm of wafer edge grinding, so that the entire wafer edge grinding process is smoother and more efficient, with less damage to the wafer and a higher wafer yield.

[0073] The above are only preferred embodiments of the present invention. It should be pointed out that, for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principles of the present invention. These improvements and substitutions should also be regarded as the scope of protection of the present invention.

Claims

1. A wafer edge grinding machine having a first direction and a second direction perpendicular to each other, characterized in that: It comprises a base, on which a wafer storage component, a wafer transfer component, a wafer detection component and a wafer edge grinding component are sequentially arranged along a first direction; The wafer storage assembly includes a plurality of wafer boxes evenly distributed along an arc, and the wafer boxes are used to store wafers to be processed and processed wafers; The wafer edge grinding assembly comprises a rough grinding assembly and a fine grinding assembly, wherein the rough grinding assembly and the fine grinding assembly are used for performing rough grinding and fine grinding on the wafer respectively; The wafer transfer assembly comprises a first transfer assembly, a positioning platform and a second transfer assembly which are sequentially arranged along a first direction; the first transfer assembly is arranged in the wafer storage assembly and is used to transfer wafers between the positioning platform and a plurality of the wafer boxes, and the second transfer assembly is used to transfer wafers between the positioning platform, the rough grinding assembly and the fine grinding assembly; The wafer inspection component comprises a thickness measurement system and an appearance inspection system, and the thickness measurement system and the appearance inspection system are respectively arranged on two sides of the positioning platform along the second direction.

2. The wafer edge grinding machine according to claim 1, characterized in that: The plurality of wafer boxes are evenly distributed along an arc, and the rotation axis of the first transfer component coincides with the center of the arc; the positioning platform is arranged on a side of the first transfer component away from the wafer boxes.

3. The wafer edge grinding machine according to claim 2, characterized in that: The wafer storage assembly includes a first wafer box, a second wafer box and a third wafer box, and at least one of the first wafer box, the second wafer box and the third wafer box is provided; the first wafer box is used to store wafers to be edge-grinded, the second wafer box is used to store wafers that fail the edge-grinding inspection, and the third wafer box is used to store wafers that pass the edge-grinding inspection.

4. The wafer edge grinding machine according to claim 1, characterized in that: The rough grinding assembly and the fine grinding assembly are symmetrically arranged along the axis of the wafer storage assembly.

5. The wafer edge grinding machine according to claim 1, characterized in that: The rough grinding assembly comprises a rough grinding drive structure, a rough grinding head and a first cleaning tank, wherein the rough grinding drive structure comprises a plurality of first driving motors, wherein the first driving motors are used to adjust the position of the rough grinding head and drive the rough grinding head to move to grind the wafer, and the first cleaning tank is used to clean the wafer after rough grinding; The fine grinding assembly includes a fine grinding drive structure, a fine grinding head and a second cleaning tank. The fine grinding drive structure includes multiple second driving motors. The second driving motors are used to adjust the position of the fine grinding head and drive the fine grinding head to move to grind the wafer. The second cleaning tank is used to clean the wafer after fine grinding.

6. The wafer edge grinding machine according to claim 5, characterized in that: The second transfer assembly includes a first robot arm and a second robot arm that operate independently, and the first robot arm and the second robot arm rotate coaxially to transfer wafers between the positioning platform, the rough grinding head, the first cleaning tank, the fine grinding head and the second cleaning tank.

7. The wafer edge grinding machine according to claim 1, characterized in that: The positioning platform includes a first adjustment mechanism, a positioning support column and a rotating motor. The first adjustment mechanism includes multiple first adjustment motors. The first adjustment mechanism is used to adjust the position of the positioning support column along a first direction, a second direction and a vertical direction. The rotating motor is used to drive the positioning support column to rotate around its own axis.

8. The wafer edge grinding machine according to claim 1, characterized in that: The appearance detection system includes a second adjustment mechanism and an appearance detection device. The second adjustment mechanism includes a plurality of second adjustment motors. The second adjustment mechanism is used to adjust the position of the appearance detection device on the base.

9. The wafer edge grinding machine according to claim 1, characterized in that: The thickness measuring system comprises a third adjusting mechanism and a thickness measuring device. The third adjusting mechanism comprises a plurality of third adjusting motors. The third adjusting mechanism is used for positioning the thickness measuring device on the base.

10. A wafer edge grinding method, using the wafer edge grinding machine according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1, the first transfer component takes out the wafer to be edge-grinded from the first wafer box and transfers it to the positioning platform, and the positioning platform performs a deflection correction process on the wafer to be edge-grinded on it, so that the wafer to be edge-grinded on the positioning platform is in the center of the transport position of the second transfer component; S2, the second transfer assembly moves the wafer to be edge-grinded on the positioning platform to the rough grinding head, starts the rough grinding program, and the rough grinding head begins to perform preliminary grinding on the edge of the wafer; S3, after the rough grinding is completed, the second transfer assembly transfers the rough ground wafer to the first cleaning tank for cleaning; S4, the second transfer assembly moves the wafer after rough grinding and cleaning to the fine grinding head, starts the fine grinding program, and the fine grinding head begins to finely grind and polish the edge of the wafer; S5, after fine grinding is completed, the second transfer assembly transfers the finely ground wafer to the second cleaning tank for cleaning; S6, the second transfer assembly moves the wafer after fine grinding and cleaning to the positioning platform, and the thickness measuring device and the appearance inspection device simultaneously perform thickness inspection and appearance inspection on the wafer after grinding; S7. The first transfer assembly transfers the qualified wafers to the third wafer box, and transfers the unqualified wafers to the second wafer box.

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