Liquid ejecting apparatus and method, article manufacturing method, and substrate processing apparatus

Abstract

The present invention provides a liquid ejecting apparatus, a liquid ejecting method, an article manufacturing method, and a substrate processing apparatus, the liquid ejecting apparatus supplying a liquid onto a substrate, the liquid ejecting apparatus including: an ejecting unit having an ejecting portion that ejects the liquid onto the substrate; a body part for supporting the discharge unit; a measuring unit that measures the shape of the body unit; and a control unit for controlling the discharge of the discharge unit on the basis of the measurement value of the measurement unit.

Description

Technical Field

[0001] The invention relates to a liquid ejecting device, a liquid ejecting method, an article manufacturing method and a substrate processing device. Background Art

[0002] In recent years, when manufacturing various functional elements, attempts have been made to form patterns by applying a material of the functional element using a liquid ejecting device.

[0003] However, various display methods have been proposed for display devices, and in recent years, the development of display devices using organic EL elements has been booming. Since organic EL materials are expensive, it is desirable to use a liquid ejection device that has high material usage efficiency and can coat a large area at high speed.

[0004] The liquid ejection device controls the ejection timing of the liquid according to the flying speed of the liquid and the relative position of the liquid ejection head and the substrate. The flying speed of the liquid is adjusted so that the liquid lands at a target position relative to the substrate moving relative to the liquid ejection head.

[0005] However, due to the enlargement of the device, the device installation surface may deform over time. When the device installation surface deforms, deformation and posture changes occur in the main structure, thereby deforming the slide supported by the main structure, and the ejection surface of the liquid ejection head supported by the slide may be deformed. That is, since the relative position between the liquid ejection head and the substrate may change, there is a problem of reduced landing position accuracy.

[0006] Japanese Patent Application Publication No. 2020-510517 discloses a liquid ejecting device including a distance measuring unit for measuring the distance between a liquid ejecting head and a substrate and a unit for adjusting ejection parameters based on the measured distance.

[0007] However, in order to cope with the increase in size of the apparatus, a plurality of measurement points are required when measuring the relative position between the ejection head and the substrate, which leads to a problem that the measurement time increases. Summary of the invention

[0008] Therefore, an object of the present invention is to provide a liquid ejection device capable of correcting the landing position without increasing the measurement time.

[0009] In order to achieve the purpose, a liquid ejecting device as one embodiment of the present invention supplies liquid onto a substrate, and is characterized in that the liquid ejecting device comprises: a ejecting unit having an ejecting portion for ejecting the liquid onto the substrate; a main body portion for supporting the ejecting unit; a measuring portion for measuring a shape of the main body portion; and a control portion for controlling the ejection of the ejecting portion according to a measurement value of the measuring portion.

[0010] According to the present invention, it is possible to provide a liquid ejection device capable of correcting a landing position without increasing measurement time. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a diagram showing the liquid ejecting device according to the first embodiment.

[0012] Figure 2 It is a cross-sectional view showing the carriage of the liquid ejecting device according to the first embodiment.

[0013] Figure 3 It is a plan view showing the carriage of the liquid ejecting device according to the first embodiment.

[0014] Figure 4 Yes means Figures 5 to 8 The location of the cross-sectional view is shown in the figure.

[0015] Figure 5 It is a diagram showing distortion of the main body structure of the liquid ejecting device according to the first embodiment.

[0016] Figure 6 It is a diagram showing distortion of the main body frame of the liquid ejecting device according to the first embodiment.

[0017] Figure 7 It is a diagram showing distortion of the carriage structure of the liquid ejection device according to the first embodiment.

[0018] Figure 8 It is a diagram showing distortion of the liquid ejection surface of the liquid ejection device according to the first embodiment.

[0019] Fig. 9 This is a cross-sectional view of the liquid ejection device according to the first embodiment when the liquid ejection surface is twisted.

[0020] Fig.10 This is a diagram showing a landing position deviation caused by a height difference between a liquid discharge surface and a substrate in the liquid discharge device according to the first embodiment.

[0021] Fig.11 This is a cross-sectional view of the liquid ejection device according to the first embodiment when the liquid ejection surface is twisted.

[0022] Fig.12 This is a diagram showing a landing position deviation caused by a difference in discharge angle between a liquid discharge surface and a substrate in the liquid discharge device according to the first embodiment.

[0023] Fig.13 It is a top view showing the substrate stage of the liquid discharge device according to the first embodiment.

[0024] Fig.14 It is a diagram showing distortion of the main body structure of the liquid ejecting device according to the first embodiment.

[0025] Fig.15 It is a diagram showing the arrangement of sensors for measuring the distortion of the main body structure of the liquid ejecting device according to the first embodiment.

[0026] Fig.16 It is a diagram showing the arrangement of sensors for measuring the distortion of the main body structure of the liquid ejecting device according to the second embodiment. DETAILED DESCRIPTION

[0027] Hereinafter, the embodiments are described in detail with reference to the accompanying drawings. In addition, the following embodiments do not limit the invention involved in the claims. Although a plurality of features are described in the embodiments, not all of these features are necessary for the invention, and a plurality of features may be combined arbitrarily. Moreover, in the accompanying drawings, the same or similar structures are marked with the same reference numerals, and repeated descriptions are omitted.

[0028] In this specification and the accompanying drawings, directions are represented by an XYZ orthogonal coordinate system in which a surface parallel to the surface on which the substrate is configured is an XY plane. The directions in the XYZ coordinate system that are respectively parallel to the X-axis, the Y-axis, and the Z-axis are set as the X-direction, the Y-direction, and the Z-direction, and the rotation around the X-axis, the rotation around the Y-axis, and the rotation around the Z-axis are set as θX, θY, and θZ, respectively. Control and drive (movement) of the X-axis, the Y-axis, and the Z-axis refer to control or drive (movement) of the direction parallel to the X-axis, the direction parallel to the Y-axis, and the direction parallel to the Z-axis, respectively. In addition, control or drive of the θX axis, the θY axis, and the θZ axis refer to control or drive of rotation around an axis parallel to the X-axis, rotation around an axis parallel to the Y-axis, and rotation around an axis parallel to the Z-axis, respectively.

[0029] In recent years, when manufacturing various functional elements, attempts have been made to use liquid ejection devices to impart materials of functional elements to form patterns. Patterning using liquid ejection devices has the following advantages: high material utilization efficiency due to the ability to perform on-demand patterning; a non-vacuum process, so the manufacturing device is relatively small; and large areas can be coated at high speeds.

[0030] However, various display methods have been proposed for display devices, and in recent years, the development of display devices using organic EL elements has been booming. Since organic EL materials are expensive, it is desirable to use a liquid ejection device that has high material utilization efficiency and can coat a large area at high speed.

[0031] The liquid ejection device controls the ejection timing of the liquid according to the flying speed of the liquid and the relative position of the liquid ejection head and the substrate. The flying speed of the liquid is adjusted so that the liquid lands at the target position relative to the substrate moving relative to the liquid ejection head. Therefore, in order to maintain the landing position accuracy at a high precision, they need to be maintained constant.

[0032] However, due to the enlargement of the device, the device installation surface may deform over time. When the device installation surface deforms, for example, the main body structure supported by more than four legs (more than four parts) may deform and change its posture (distortion), the slide supported by the main body structure may deform, and the ejection surface of the liquid ejection head supported by the slide may deform. That is, since the relative position between the liquid ejection head and the substrate changes, there is a problem that the landing position accuracy is reduced.

[0033] Therefore, an object of the present invention is to provide a liquid ejection device that can be corrected without increasing the measurement time required for the correction.

[0034] <Structure of Liquid Ejection Device>

[0035] Hereinafter, preferred embodiments of the present invention will be described in detail based on the drawings.

[0036] Figure 1 FIG. 2 is a diagram showing the structure of a liquid ejection device 100 according to the first embodiment. Figure 1 In the embodiment, the main body structure (main body portion) 11 is supported on the device installation surface 10 by at least four supporting legs 13. A substrate stage 30 is arranged at the center of the main body structure 11.

[0037] The substrate stage 30 includes a Y stage 24, an X stage 23, and a Z stage 22 arranged on the main body structure 11. The Y stage 24 can move in the Y direction relative to the main body structure 11, the X stage 23 can move in the X direction relative to the main body structure 11, and the Z stage 22 can move in the Z direction relative to the main body structure 11. The substrate 20 is placed and held on the substrate holding portion 21 arranged on the Z stage 22. The position of the substrate stage 30 is measured by a reflective mirror 25 and an interferometer (laser interferometer) 26 arranged on the Z stage 22, and positioning control is performed by a substrate stage control portion (not shown).

[0038] A carriage 5 is arranged on the upper part of the main body structure 11 in the vertical direction (Z direction) via the main body frame 2. A plurality of liquid ejection heads (ejection parts) 1 arranged two-dimensionally in the XY plane are supported by the carriage structure (support member) 9, and a plurality of liquid ejection heads 1 and the carriage structure 9 constitute an ejection unit. The carriage structure 9 has a mechanism that can be raised and lowered (moved in the Z direction) by the motor 4 via the ball screw 7. In this specification, it is described that a plurality of liquid ejection heads 1 each having a ejection hole are provided on the carriage 5, but the present invention is not limited to this. The present invention can also be applied to a device having only one liquid ejection head 1, and can also have the same effect.

[0039] The liquid ejection head 1 ejects liquid by a piezoelectric method in which a voltage is input to an ejection energy generating element (piezoelectric element) to eject the liquid as liquid droplets. Specifically, the liquid ejection head 1 has a liquid ejection surface facing the substrate 20 during the ejection process, and ejects liquid droplets from each ejection hole (nozzle) provided on the liquid ejection surface. Alternatively, the liquid ejection head 1 may eject the liquid by a thermal method in which the liquid is heated and ejected as liquid droplets.

[0040] The ejection control unit (control unit) not shown in the figure is composed of a computer having a processor such as a CPU (Central Processing Unit) and a storage unit such as a memory, and controls the liquid ejection head 1. The ejection control unit can also be composed of a PLD (abbreviation of Programmable Logic Device) such as an FPGA (abbreviation of Field Programmable Gate Array), or an ASIC (abbreviation of Application Specific Integrated Circuit), or a general-purpose computer embedded with a program, or a combination of all or part of them.

[0041] Figure 2 1 is a cross-sectional view of the carriage 5 in the liquid ejection device 100 according to the first embodiment. The carriage structure 9 is moved in the Z direction via the carriage driving unit 3 by the motor 4 and the ball screw 7 connected to the motor 4, and its position is controlled. Figure 2 This is a state in which the carriage structure 9 is seated on the seat portion 6 located on the main body frame 2, and is a position in which the liquid ejecting head 1 ejects liquid.

[0042] Figure 3 It is a plan view of the carriage 5 in the liquid ejection device 100 according to the first embodiment. Figure 3 The carriage structure 9 is shown in a state where it is seated on the seating portions 6 located at four points on the main body frame 2 .

[0043] <Displacement of the landing position of the liquid caused by deformation>

[0044] Next, refer to Figures 4 to 12 The following describes the deviation of the landing position of the liquid caused by the deformation of the liquid ejection device 100.

[0045] Figure 4 The liquid ejection device 100 of the first embodiment is shown in FIG. Figures 5 to 8 The schematic diagram of the XY cross section shown in FIG. 5 is a diagram showing the positions of the respective Z directions of 50a, 50b, 50c, and 50d. When the device installation surface 10 is deformed, in the lower cross section 50a of the main body structure 11 supported by the support legs 13 at more than four points, Figure 5 That kind of deformation.

[0046] Figure 5 The figures show distortion of the lower cross section 50a of the main body structure 11 of the liquid ejection device 100 according to the first embodiment. (a) shows a cross-sectional view when the lower cross section 50a of the main body structure 11 is not deformed, and (b) shows a cross-sectional view when it is deformed.

[0047] When the device installation surface 10 is deformed, Figure 4 While the lower section 50a of the main body structure 11 is deformed, a deformation is generated in the section 50b of the main body frame 2 at the upper part of the main body structure 11. Figure 6 That kind of deformation.

[0048] Figure 6 The figures show distortion of the cross section 50b of the main body frame 2 in the liquid ejection device 100 according to the first embodiment. (a) shows a cross-sectional view when the cross section 50b of the main body frame 2 is not deformed, and (b) shows a cross-sectional view when it is deformed.

[0049] Next, when the main frame 2 is deformed, Figure 4 The upper section 50c of the carriage structure 9 shown produces Figure 7 That kind of deformation.

[0050] Figure 7 The figures show distortion of the upper cross section 50c of the carriage structure 9 in the liquid ejection device 100 of the first embodiment. (a) shows a cross-sectional view of the upper cross section 50c of the carriage structure 9 without deformation, and (b) shows a cross-sectional view of the upper cross section 50c of the carriage structure 9 with deformation.

[0051] Furthermore, when the carriage structure 9 is deformed, Figure 4 The liquid ejection surface 50d of the liquid ejection head 1 on the carriage structure shown generates Figure 8 That kind of deformation.

[0052] Figure 8 The figures show distortion of the liquid ejection surface 50 d of the liquid ejection device 100 according to the first embodiment. (a) shows a cross-sectional view when the liquid ejection surface 50 d is not deformed, and (b) shows a cross-sectional view when the liquid ejection surface 50 d is deformed.

[0053] Fig. 9 1 is a cross-sectional view of the liquid ejection surface 50d in the liquid ejection device 100 of the first embodiment when the liquid ejection surface 50d is distorted. (a) is a top view of the liquid ejection surface 50d (viewed from the Z direction). In addition, at this time, the XZ cross-sectional views at the cross sections A, B, and C are as follows: Fig. 9In the cross section A, the distance (relative position difference) between the substrate 20 and the liquid ejection surface 50d increases as the substrate moves in the positive direction of the X axis, and decreases as the substrate moves in the negative direction of the X axis.

[0054] In the cross section B, the interval between the substrate 20 and the liquid ejection surface 50d does not change at any position in the X-axis direction. On the other hand, in the cross section C, the interval between the substrate 20 and the liquid ejection surface 50d decreases as it moves in the positive direction of the X-axis, and the interval between the substrate 20 and the liquid ejection surface 50d increases as it moves in the negative direction of the X-axis.

[0055] Fig.10 FIG. 5 is a diagram for explaining the landing position deviation caused by the distance between the liquid discharge surface 50d of the liquid discharge device 100 according to the first embodiment and the substrate 20. Figure 8 (b) The case of deformation like that.

[0056] Fig.10 (a) shows a position (hereinafter also referred to as landing position) where the liquid 60 ejected from the liquid ejection surface 50d lands on the substrate 20 moving in the direction of the arrow relative to the liquid ejection surface 50d. Fig.10 In the illustration of FIG. 5 , in order to confirm the influence of the distance (the spacing in the Z direction) between the liquid ejection surface 50 d and the substrate 20 , it is assumed that the liquid from the ejection holes of the liquid ejection surface 50 d is ejected at the same time in parallel with the Z direction. Fig.10 As shown in (a), due to the relative position difference between the liquid discharge surface 50d and the substrate 20, the landing positions of the liquid 60 in each of the sections A and C are deviated from the ideal landing positions indicated by the parallel lines.

[0057] Fig.10 (b) shows the position where the liquid 60 ejected from the liquid ejection surface 50d lands on the substrate 20 that is moving in the arrow direction opposite to (a) relative to the liquid ejection surface 50d. As shown here, if the liquid 60 is ejected from the liquid ejection surface 50d while the substrate 20 moves in the direction opposite to (a), the deviation from the ideal landing position tends to be opposite to (a).

[0058] Fig.11 This is a cross-sectional view showing a state in which distortion occurs in the liquid ejection surface 50d of the liquid ejection device 100 according to the first embodiment. Fig.11 (a) is a top view of the liquid ejection surface 50d (viewed from the Z direction). In addition, at this time, the YZ cross-sectional views of the cross sections D, E, and F are as follows: Fig.11In section D, the ejection angle is uniformly offset in the negative direction of the Y axis compared to the designed landing position, in section E, the liquid ejection surface 50d is parallel to the substrate D, and in section F, the ejection angle is uniformly offset in the positive direction of the Y axis compared to the designed landing position.

[0059] Fig.12 1 is a diagram showing the landing position deviation caused by the difference in discharge angle between the liquid discharge surface 50d of the liquid discharge device 100 according to the first embodiment and the substrate 20. Figure 8 (b), as a result of the landing of the liquid 60 ejected during the relative movement of the substrate 20 moving relative to the liquid ejection surface 50d, as shown in FIG. Fig.12 As shown in (a), the landing position of the liquid 60 at each of the sections A and C is deviated from the ideal landing position due to the influence of the discharge angle of the liquid discharge surface 50d relative to the substrate 20. Fig.12 As shown in (b), even if the substrate 20 is oriented toward Fig.12 (a) When the opposite direction is moved, the ejection is performed. Fig.10 The liquid ejection surface 50d and the substrate 20 are affected by the relative position difference between the ejection surface 50d and the substrate 20, and the landing position is different from that of the liquid ejection surface 50d. Fig.12 (a) The same tilt is always offset.

[0060] In addition, Fig.12 In the explanatory diagram of , in order to confirm the influence of the self-parallel deviation (tilt) of the liquid ejection surface 50d and the substrate 20 in the YZ cross section, the distance between each ejection hole and the substrate 20 as a result of the tilt is depicted as unchanged. In addition, the liquid from the ejection holes of the liquid ejection surface 50d is ejected at the same time.

[0061] Thus, under the influence of the deformation of the main body structure 11 caused by the temporal deformation of the device installation surface 10, the landing position is shifted due to the relative position difference between the liquid ejection surface 50d and the substrate 20 and the ejection angle difference.

[0062] Fig.13 FIG. 2 is a top view showing a substrate stage 30 of the liquid ejection device 100 according to the first embodiment. The substrate stage 30 is configured to be movable relative to the main structure 11, that is, according to the measurement value of the interferometer 26, as shown in FIG. Fig.13 As shown in (a), the main body structure 11 is positioned and controlled by a substrate stage control unit (control unit) not shown.

[0063] The substrate stage control unit may be composed of, for example, a PLD (Programmable Logic Device) such as FPGA (Field Programmable Gate Array), an ASIC (Application Specific Integrated Circuit), a general-purpose computer with an embedded program, or a combination of all or part of them.

[0064] However, if Fig.13 As shown in (b), due to the deformation and change in posture of the main structure 11, the main structure 11 changes from the original posture 41 to the posture 41'. As a result, the position of the interferometer 26 on the main structure 11 is offset, and the substrate stage 30 that should have been positioned and controlled at the substrate stage control position 31 is positioned and controlled at the substrate stage control position 31'. As a result, the position of the substrate 20 moves on the XY plane relative to the liquid ejection surface 50d, or a relative position offset occurs in the rotation direction. Here, the relative position offset on the XY plane is explained, but the relative position offset in the Z-axis direction may also occur due to the deformation and change in posture of the main structure 11.

[0065] <Measurement of deformation (posture)>

[0066] Next, refer to Fig.14 , Fig.15 The measurement of the deformation amount (posture) of the liquid ejection device 100 (main body structure 11 ) will be described.

[0067] Fig.14 1 is a diagram showing the distortion of the main body structure 11 of the liquid ejection device 100 of the first embodiment. As described above, the shape of the main body structure 11 is deformed by the deformation of the device setting surface 10 over time. Or a change in posture occurs. In addition, at the same time, the main body frame 2 is deformed, and then the slide structure 9 is deformed, whereby the liquid ejection surface 50d of the liquid ejection head 1 is finally deformed. Due to the deformation of the liquid ejection surface 50d, the landing position of the liquid is offset. Therefore, by indirectly measuring the deformation of the shape of the main body structure 11 and the change in posture, the deformation of the liquid ejection surface 50d can be inferred.

[0068] For example, Fig.14 As shown, the displacement in the Y-axis direction at the position of the motor 4 formed on the carriage 5 is suitable for measuring the deformation of the shape and the change (distortion) of the posture of the main body structure 11 with higher sensitivity. In the structure of this embodiment, the position of the motor 4 formed on the upper part of the carriage 5 is a position away from the device installation surface 10, and the distortion of the main body structure 11 caused by the influence of the sinking of the device installation surface 10 can be measured as a more significant displacement. Fig.15 This is a diagram showing the arrangement of a sensor (measuring unit) for measuring the distortion of the main body structure 11 of the liquid ejection device 100 according to the first embodiment. Fig.15 (a) is a top view (XY plane view) of the carriage 5, Fig.15 (b) is a front view (XZ plane view). The sensor (measurement unit) measures the shape of the main body structure 11 . In other words, the sensor (measurement unit) measures the posture of the main body structure 11 .

[0069] Here, members 72 and 73 are extended from both sides of the column portion that configures the ball screws 7 arranged on the left and right sides of the carriage 5 to the vicinity of the center, and the encoder head 70 and the scale 71 that constitute the measuring portion (length measuring sensor) are arranged on the end faces close to each other to measure the displacement in the Y-axis direction. By measuring the displacement amount measured here and the deviation amount from the ideal arrangement when the liquid is ejected and landed on the substrate 20, the correction amount can be calculated without directly measuring the shape of the liquid ejection surface 50d or the relative position to the substrate 20.

[0070] <Correction method for landing position deviation>

[0071] Next, the correction method is described. As described above, as the main reasons for the landing position deviation of the liquid 60 relative to the substrate 20, the deformation of the liquid ejection surface 50d caused by the shape deformation and posture change of the main structure 11 and the influence on the positioning control of the substrate stage 30 can be listed. As a correction method for these landing position deviations, it can be implemented by controlling the liquid ejection or by controlling the substrate stage.

[0072] Liquid ejection control includes a method of changing the waveform (voltage) input to the ejection energy generating element (piezoelectric element) included in the liquid ejection head 1 and a method of controlling the timing of ejecting liquid. If these liquid ejection control methods are used, for example Fig.10 As shown, the direction of the landing position deviation caused by the relative movement direction of the substrate 20 can be set for each discharge nozzle and each relative movement of the substrate stage 30, so the landing position can be corrected.

[0073] In addition, about Fig.13 The components of uniform movement and rotation of the substrate stage 30 as shown can also be handled by correcting the positioning control of the substrate stage 30 in the scanning direction corresponding to the substrate stage 30 by liquid ejection control. In the non-scanning direction, it can be handled by correcting the positioning control of the substrate stage 30.

[0074] As described above, in the liquid ejection device 100 of this embodiment, by measuring the deformation and posture change of the main body structure 11, the landing position deviation can be corrected without increasing the measurement time of the relative position between the liquid ejection surface 50d and the substrate 20.

[0075] In this embodiment, the correction of the landing position deviation of the liquid supply device with respect to the liquid ejection head 1 having multiple ejection holes is illustrated, but it is not limited to this and can be applied to the liquid supply device with a liquid ejection head having more than one ejection hole to achieve the same effect.

[0076] In the liquid supply device of the illustrated embodiment, the main body structure 11 is supported by the support legs 13 at four or more points relative to the device installation surface 10, but the present invention is not limited to this structure. By obtaining in advance the relationship between the landing position deviation and the deformation amount of the main body structure 11 represented by the measurement value of the measuring unit, the present invention can be applied regardless of the shape of the support legs 13 relative to the device installation surface 10, and the effects of the present invention can be achieved.

[0077] <Second Embodiment>

[0078] Next, based on Fig.16 The posture measurement of the main body structure 11 according to the second embodiment will be described. Fig.16 1 is a diagram showing a main body structure 11 and a liquid level gauge 80 for posture measurement according to a second embodiment. In the first embodiment, an encoder head 70 and a scale 71 are arranged on the upper part of the left and right columns of the slide 5, but in the second embodiment, at least two liquid level gauges 80 are arranged on the main body structure 11, and the deformation amount or posture change amount of the main body structure 11 is calculated based on the respective measurement values. By measuring the measurement value at this time and the deviation amount from the ideal configuration when the liquid is ejected and landed on the substrate 20 in advance, the correction amount can be calculated even if the shape of the liquid ejection surface 50d and the relative position to the substrate 20 are not directly measured. In addition, a strain gauge or an inclination sensor can be used instead of the liquid level gauge 80 to measure the posture change amount or deformation amount of the main body structure 11. Here, the liquid level gauge 80 is arranged on the main body structure 11, but it can also be measured at any position on the slide 5, or it can be measured on the main body frame 2.

[0079] <Implementation Method of Article Manufacturing Method>

[0080] The article manufacturing method in the embodiment of the present invention is suitable for a substrate processing device for manufacturing articles such as panels for displays such as organic EL or micro devices such as semiconductor devices or elements with fine structures. The article manufacturing method of this embodiment includes: a supply process of supplying liquid to a substrate using the above-mentioned liquid supply device (liquid supply method); a processing process of processing the substrate supplied with liquid in the supply process; and a process of manufacturing an article from the substrate processed in the processing process. In addition, the article manufacturing method includes other well-known processes (firing, cooling, cleaning, oxidation, film formation, evaporation, doping, flattening, etching, resist stripping, cutting, bonding, packaging, etc.). Compared with previous methods, the article manufacturing method of this embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article.

Claims

1. A liquid ejection device for supplying liquid onto a substrate, characterized in that: The liquid ejection device comprises: a spray unit having a spray portion for spraying the liquid toward the substrate; A main body portion, supporting the ejection unit; A measuring part, for measuring the shape of the main body; as well as The control unit controls the ejection of the ejection unit based on the measurement value of the measuring unit.

2. The liquid ejection device according to claim 1, characterized in that: The measuring unit measures the posture of the main body.

3. The liquid ejection device according to claim 1, characterized in that: The measuring part measures a shape of a supporting member that supports the ejection unit.

4. The liquid ejection device according to claim 1, characterized in that: The measuring unit is composed of any one of a length measuring sensor, a liquid level gauge, a strain gauge, and a tilt sensor.

5. The liquid ejection device according to claim 1, characterized in that: The control unit controls a timing of ejecting the liquid from the ejection unit based on the measurement value of the measurement unit.

6. The liquid ejection device according to claim 1, characterized in that: The control unit controls a speed at which the liquid is ejected from the ejection unit based on the measurement value of the measurement unit.

7. The liquid ejection device according to claim 6, characterized in that: The control unit controls a waveform of a voltage for ejecting the liquid from the ejection unit based on the measurement value of the measurement unit.

8. The liquid ejection device according to claim 1, characterized in that: The liquid ejection device includes a substrate stage, which is supported by the main body, holds the substrate and is movable relative to the ejection portion. The control unit controls the position of the substrate stage based on the measurement value of the measuring unit.

9. The liquid ejection device according to claim 1, characterized in that: The discharge unit includes a plurality of discharge parts for discharging the liquid toward the substrate.

10. The liquid ejection device according to claim 1, characterized in that: The main body is supported by a mounting surface on which the liquid ejecting device is placed.

11. The liquid ejection device according to claim 10, characterized in that: The main body is supported at four or more locations on a mounting surface on which the liquid ejecting device is placed.

12. A liquid ejecting method, comprising: using a liquid ejecting device that supplies the liquid onto a substrate using an ejecting portion that ejects the liquid onto the substrate, wherein: measuring the shape of a main body portion supporting the ejection unit having the ejection portion, The liquid ejection device is controlled based on the measured value of the shape so as to correct a deviation in a landing position of the liquid ejected from the ejection portion on the substrate.

13. A method for manufacturing an article, characterized in that: The article manufacturing method comprises: a supplying step of supplying the liquid onto the substrate using the liquid ejecting method according to claim 12; a processing step of processing the substrate to which the liquid is supplied in the supplying step; and A manufacturing step is to manufacture an article from the substrate processed in the processing step.

14. A substrate processing device for processing a substrate, characterized in that: The substrate processing device comprises: a substrate stage for holding and moving the substrate; and The liquid ejecting device according to any one of claims 1 to 11, which ejects liquid onto the substrate held by the substrate stage.

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