Conveying device for semiconductor processing detection

Abstract

The invention relates to the technical field of semiconductor processing, in particular to a conveying device for semiconductor processing detection, which comprises a chain plate conveying rack, a chain plate conveying belt is rotatably mounted on the chain plate conveying rack, a concave support frame is mounted above the chain plate conveying rack in a crossing manner, and detection equipment is fixedly mounted at the upper end of the concave support frame. A plurality of sets of supporting plates are installed on the chain plate conveying belt at equal intervals, the number of each set of supporting plates is two, and a rotating frame is rotatably installed between the two supporting plates of each set. The clamping mechanism drives the clamping assembly and the clamping assembly to move; a semiconductor element is placed between the two clamping mechanisms, then the two clamping mechanisms are loosened, and the two clamping mechanisms move close to each other under the action of the elastic force of the clamping spring.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, in particular to a conveying device for semiconductor processing detection. Background Art

[0002] Semiconductors are now widely used in our lives. Semiconductors refer to materials whose electrical conductivity at room temperature is between that of conductors and insulators. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, and high-power power conversion, and have a certain influence in commercial applications.

[0003] In order to ensure the quality after or during the processing of the semiconductor, it is necessary to inspect the semiconductor. During the inspection of the semiconductor, it is necessary to inspect the upper and lower sides of the semiconductor for surface defects such as scratches and particles. The existing semiconductor processing inspection equipment can only inspect one side of the semiconductor element at a time. After the inspection is completed, the semiconductor element needs to be manually turned over by the staff and then clamped and positioned. Only in this way can the inspection of the upper and lower sides of the semiconductor element be completed. The degree of automation is low, and each time the previous semiconductor element needs to be removed after inspection, and then a new semiconductor element needs to be replaced for inspection, which is inefficient. Summary of the invention

[0004] The object of the present invention is to provide a conveying device for semiconductor processing and inspection to solve the problems raised in the above-mentioned background technology.

[0005] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a conveying device for semiconductor processing and inspection, comprising a chain conveyor frame, a chain conveyor belt is rotatably installed on the chain conveyor frame, a concave support frame is cross-installed above the chain conveyor frame, and an inspection device is fixedly installed on the upper end of the concave support frame, a plurality of groups of support plates are equidistantly installed on the chain conveyor belt, the number of support plates in each group is two, a rotating frame is rotatably installed between the two support plates in each group, a rotating shaft and a driving column are respectively fixedly installed at both ends of the rotating frame, a circular hole is opened on the side of the support plate, and the rotating shaft and the driving column are respectively rotatably connected to the two circular holes, a clamping mechanism is symmetrically installed in the rotating frame, a semiconductor component is placed between the two clamping mechanisms, a docking joint is installed on one side of the concave support frame, the docking joint is clamped with the driving column below the concave support frame, and the docking joint is driven by the output shaft of a self-locking stepper motor fixedly installed on the side of the concave support frame.

[0006] Preferably, the clamping mechanism includes a guide light rod symmetrically fixedly connected to the inner side of the rotating frame in front and back directions, a concave clamping frame is symmetrically arranged between the two guide light rods, T-shaped grooves are symmetrically opened on the side surfaces of the concave clamping frame in front and back directions, and sliding sleeves are symmetrically fixedly connected to the front and rear ends of the concave clamping frame, and the sliding sleeves are sleeved on the adjacent guide light rods. Clamping springs are symmetrically sleeved at both ends of the guide light rods, and the two ends of the clamping springs are respectively abutted against the rotating frame and the sliding sleeve, and clamping components with adjustable clamping widths are installed in the two concave clamping frames, and locking mechanisms for locking the clamping components are installed in the two concave clamping frames.

[0007] Preferably, the clamping assembly includes a bidirectional transmission screw rotatably mounted in a concave clamping frame, an adjusting sleeve is fixedly sleeved in the middle position of the bidirectional transmission screw, gear rings are symmetrically fixedly sleeved at both ends of the adjusting sleeve on the bidirectional transmission screw, the locking mechanism is arranged on one side of the gear ring, rectangular screw sleeves are symmetrically sleeved at the threads at both ends of the bidirectional transmission screw, a T-shaped plate is installed on one side of the rectangular screw sleeve, an L-shaped clamping seat is fixedly installed on the side of the rectangular screw sleeve away from the T-shaped plate, and a clamping assembly for clamping and fixing semiconductor components is symmetrically installed in the L-shaped clamping seat.

[0008] Preferably, the T-shaped plate is clamped in the T-shaped slot, and the T-shaped plate is slidably connected to the T-shaped slot forward and backward, one end of the T-shaped plate passes through the T-shaped slot and is fixedly connected to the rectangular screw sleeve, and the rectangular screw sleeve is threadedly connected to the bidirectional transmission screw.

[0009] Preferably, an L-shaped lifting groove is provided on the inner side of the L-shaped clamping seat, and the clamping assembly includes an L-shaped clamping plate symmetrically installed in the L-shaped lifting groove, and a plurality of sliding rods are fixedly installed on the side away from each other of the two L-shaped clamping plates, and clamping springs are sleeved on the plurality of sliding rods, and the ends of the plurality of sliding rods away from the L-shaped clamping plates all pass through the L-shaped clamping seat and are fixedly sleeved with a limiting ring; The L-shaped clamping plate is slidably connected to the inner side wall of the L-shaped lifting groove, the sliding rod is slidably connected to the L-shaped clamping seat, and the two ends of the clamping spring are respectively in contact with the L-shaped clamping seat and the L-shaped clamping plate.

[0010] Preferably, the locking mechanism includes a locking screw threadedly mounted on the side of the concave clamping frame, one end of the locking screw extends through the side of the concave clamping frame to the inner side thereof, and the end of the locking screw extending to the inner side of the concave clamping frame is rotatably connected to the connecting plate through a pin shaft, and the side of the concave clamping frame is symmetrically provided with guide grooves, the locking screw is arranged between the two guide grooves, and a guide plate is symmetrically fixedly connected to a side of the connecting plate close to the guide groove, the guide plate is slidably connected to the guide groove left and right, and a locking tooth block is symmetrically fixedly connected to a side of the connecting plate close to the gear ring, and the locking tooth block is clamped with the gear ring.

[0011] Preferably, a rectangular groove is formed through the side surface of one end of the driving column in the circular hole, a groove is formed on the inner side wall of the rectangular groove, a docking groove is formed on the end of the driving column away from the circular hole, a circular groove is formed on the inner side wall of the docking groove, and a clamping groove is formed symmetrically on the inner side wall of the circular hole in rotational contact with the driving column, a positioning mechanism is installed in the rectangular groove, and an unlocking mechanism for pressing the positioning mechanism is installed in the circular groove; The positioning mechanism includes an L-shaped card block symmetrically installed in a rectangular groove, the other end of the L-shaped card block extends into the groove, the two L-shaped card blocks are located in the groove and one side away from each other is cut to form an inclined surface, the two L-shaped card blocks are close to each other and the side is symmetrically opened with mounting holes, and a locking spring is installed between the two mounting holes.

[0012] Preferably, one end of the L-shaped block extends through the rectangular slot to the outside and is engaged with the slot, the two L-shaped blocks are slidably connected to the rectangular slot and the groove, and the two ends of the locking spring are respectively plugged into the mounting holes on the sides of the two L-shaped blocks.

[0013] Preferably, the unlocking mechanism includes a round rod installed in the circular groove, one end of the round rod passes through the circular groove and extends into the groove, the end of the round rod in the groove is fixedly connected to an extrusion block, a V-shaped pressing groove is provided on the side of the extrusion block away from the round rod, one end of the L-shaped clamping block is arranged in the V-shaped pressing groove, a return spring is sleeved on the end of the round rod in the circular groove, the end of the round rod away from the extrusion block is fixedly connected to a circular block, the circular block is in the circular groove, and a hemispherical seat is fixedly connected to the side of the circular block away from the round rod.

[0014] Preferably, the round rod is slidably connected to the driving column, the inner side wall of the V-shaped pressure groove contacts the inclined surface of the L-shaped block, the circular block is slidably connected to the circular groove, and the two ends of the reset spring are respectively abutted against the circular groove and the circular block.

[0015] Compared with the prior art, the invention has the following advantages: 1. During processing, first pull two clamping mechanisms in a rotating frame away from each other, so that the sliding sleeve slides along the guide light rod, and at the same time the sliding sleeve squeezes the clamping spring, and the clamping mechanism drives the clamping assembly and the clamping assembly to move; place the semiconductor element between the two clamping mechanisms, and then release the two clamping mechanisms, and under the action of the elastic force of the clamping spring, the two clamping mechanisms move closer to each other, and the two clamping mechanisms drive the two clamping assemblies to move closer to each other, and the clamping assembly drives the clamping assembly to move closer to the semiconductor element, and the four L-shaped clamping seats and four clamping assemblies are respectively clamped at the four end corners of the semiconductor element, so that the semiconductor element can be stably clamped and fixed firmly.

[0016] 2. The rotating frame and the semiconductor components are transported by the chain conveyor belt and the support plate, so that the semiconductor components are transported to the bottom of the detection equipment, and the detection equipment detects the upper side of the semiconductor components; the driving column on one side of the rotating frame rotates to the bottom of the inner side of the concave support frame, and the docking groove at the end of the driving column is engaged with the docking head; in the process of the docking head and the docking groove being engaged, the unlocking mechanism squeezes the positioning mechanism, so that one end of the two L-shaped blocks are respectively moved out of the two slots, so that the positioning mechanism releases the lock on the driving column, and then the driving column can rotate along the circular hole; the output shaft of the self-locking stepper motor rotates by half a circle, the output shaft drives the docking head to rotate 180 degrees, the driving column drives the rotating frame to rotate 180 degrees, and the rotating frame drives the semiconductor component to rotate 180 degrees through the clamping mechanism, the clamping assembly and the clamping assembly, thereby completing the flipping of the semiconductor component, so that the detection equipment can detect the other side of the semiconductor component, thereby completing the detection of the upper and lower sides of the semiconductor component. By clamping and fixing the semiconductor element once, detection of two sides can be achieved, and the semiconductor element can be automatically turned over, which greatly improves the detection efficiency.

[0017] 3. After the detection is completed, the chain conveyor belt drives the rotating frame and the semiconductor components to move away from the bottom of the detection equipment, so that the unlocking mechanism and the positioning mechanism are reset. At this time, the two L-shaped blocks are moved away from each other under the action of the locking spring force, and the ends of the two L-shaped blocks are inserted into the card slots, completing the locking of the drive column, so that the drive column cannot rotate along the round hole.

[0018] 4. When it is necessary to clamp and fix semiconductor components of different widths, first release the locking tooth block in the locking mechanism from locking the gear ring; by rotating the adjustment sleeve forward or reversely, the two-way transmission screw drives the two rectangular screw sleeves on it to move closer or farther from each other, and the L-shaped clamping seat drives the clamping assembly to move synchronously when it moves, changing the distance between the two L-shaped clamping seats on the side of the two-way transmission screw, thereby changing the distance between the two clamping assemblies, so that the two L-shaped clamping seats and the two clamping assemblies can clamp and fix semiconductor components of different widths; when the adjustment is completed, the locking tooth block in the locking mechanism is engaged with the gear ring, thereby locking the gear ring. The clamping mechanism, clamping assembly and clamping assembly can realize the clamping and fixing of semiconductor components of different models, thereby improving the scope of application of the device, and the clamping and fixing of semiconductor components is simple and convenient, which greatly improves the work efficiency of installing and removing semiconductor components. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A perspective view of the structure of the conveying device for semiconductor processing and inspection of the present invention; Figure 2 It is a three-dimensional diagram of the structure of the rotating frame, the clamping mechanism, the clamping assembly and the clamping assembly of the present invention; Figure 3 It is a cross-sectional view of the rotating frame, the clamping mechanism, the clamping assembly, the clamping assembly and the driving column structure of the present invention; Figure 4 for Figure 3 A schematic diagram of the structure enlargement in the middle; Figure 5 It is a cross-sectional view of the support plate, concave support frame and driving column structure of the present invention; Figure 6 for Figure 5 A magnified schematic diagram of the structure at B in the middle; Figure 7 for Figure 5 A magnified schematic diagram of the structure at C in the middle; Figure 8 It is a three-dimensional diagram of the clamping mechanism, clamping assembly and clamping assembly structure of the present invention; Fig. 9 An exploded view of the clamping mechanism, clamping assembly and clamping assembly structure of the present invention; Fig.10 An exploded view of the L-shaped clamping seat and the clamping assembly structure of the present invention; Fig.11 It is an exploded view of the support plate, drive column, positioning mechanism and unlocking mechanism structure of the present invention.

[0020] In the figure: 1, chain conveyor frame; 11, chain conveyor belt; 12, concave support frame; 13, detection equipment; 14, joint; 2, support plate; 21, round hole; 22, slot; 3, rotating frame; 31, guide light rod; 32, semiconductor element; 4, concave clamping frame; 41, T-slot; 42, sliding sleeve; 43, guide groove; 44, clamping spring; 5, two-way transmission screw; 51, adjustment sleeve; 52, gear ring; 53, rectangular screw sleeve; 54, T-shaped plate; 55, L-shaped clamping seat; 56, L-shaped clamping plate; 57, sliding rod; 58, clamping spring; 6, locking screw; 61, connecting plate; 62, locking tooth block; 63, guide plate; 7, driving column; 71, rectangular groove; 72, groove; 73, circular groove; 74, docking groove; 8, L-shaped clamping block; 81, locking spring; 9, round rod; 91, extrusion block; 92, V-shaped pressure groove; 93, reset spring; 94, circular block; 95, hemispherical seat. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] See also Figures 1 to 11 The present invention provides a technical solution: a conveying device for semiconductor processing detection, comprising a chain plate conveyor frame 1, a chain plate conveyor belt 11 is rotatably installed on the chain plate conveyor frame 1, the chain plate conveyor belt 11 is driven by the motor shaft of a stepper motor, a concave support frame 12 is installed across the top of the chain plate conveyor frame 1, and a detection device 13 is fixedly installed on the upper end of the concave support frame 12, a plurality of groups of support plates 2 are equidistantly installed on the chain plate conveyor belt 11, the number of support plates 2 in each group is two, a rotating frame 3 is rotatably installed between the two support plates 2 in each group, and the two ends of the rotating frame 3 are respectively fixed A rotating shaft and a driving column 7 are fixedly installed, a circular hole 21 is opened on the side of the support plate 2, the rotating frame 3 is rotatably connected to the two support plates 2 through the rotating shaft and the driving column 7 respectively, the rotating shaft and the driving column 7 are rotatably connected to the two circular holes 21 respectively, a clamping mechanism is symmetrically installed in the rotating frame 3, a semiconductor element 32 is placed between the two clamping mechanisms, a docking joint 14 is installed on one side of the concave support frame 12, the docking joint 14 is clamped with the driving column 7 under the concave support frame 12, and the docking joint 14 is driven by the output shaft of a self-locking stepping motor fixedly installed on the side of the concave support frame 12.

[0023] The motor shaft of the stepper motor drives the chain conveyor 11 to rotate intermittently. After each rotation, the chain conveyor 11 stops for a period of time and then continues to rotate. Each time the chain conveyor 11 stops, a rotating frame 3 is just below the detection device 13. The rotating frame 3 drives the semiconductor component 32 to move to the bottom of the detection device 13 through the clamping mechanism, and so on and so forth, so that the detection device 13 can detect the semiconductor components 32 one by one.

[0024] See also Figure 2 , Figure 3 , Figure 5 , Figure 8 and Fig. 9 The clamping mechanism includes a guide light rod 31 symmetrically fixedly connected to the inner side of the rotating frame 3 in front and back directions, a concave clamping frame 4 is symmetrically arranged between the two guide light rods 31, and a T-shaped groove 41 is symmetrically opened on the side of the concave clamping frame 4 in front and back directions. The front and rear ends of the concave clamping frame 4 are symmetrically fixedly connected with a sliding sleeve 42, and the sliding sleeve 42 is sleeved on the adjacent guide light rod 31. The two ends of the guide light rod 31 are symmetrically sleeved with a clamping spring 44, and the two ends of the clamping spring 44 are respectively abutted against the rotating frame 3 and the sliding sleeve 42. A clamping assembly with an adjustable clamping width is installed in the two concave clamping frames 4, and a locking mechanism for locking the clamping assembly is installed in the two concave clamping frames 4.

[0025] The sliding sleeve 42 is slidably connected to the guide light rod 31, and the clamping spring 44 applies elastic force to the sliding sleeve 42; Under the action of the elastic force of the clamping spring 44, the two sliding sleeves 42 on the guide light rod 31 move closer to each other, and the sliding sleeve 42 drives the concave clamping frame 4 to move, so that the two concave clamping frames 4 move closer to each other, and the two concave clamping frames 4 drive the two clamping components to move relative to each other, and the semiconductor element 32 is clamped and fixed by the two clamping components.

[0026] See also Figure 2 , Figure 3 , Figure 5 , Figure 6 , Figures 8 to 10 The clamping assembly includes a bidirectional transmission screw 5 rotatably mounted in a concave clamping frame 4, an adjusting sleeve 51 is fixedly sleeved in the middle position of the bidirectional transmission screw 5, the bidirectional transmission screw 5 is a circular rod with left-handed threads and right-handed threads symmetrically opened at both ends, a gear ring 52 is symmetrically fixedly sleeved at both ends of the adjusting sleeve 51 on the bidirectional transmission screw 5, a locking mechanism is arranged on one side of the gear ring 52, rectangular screw sleeves 53 are symmetrically sleeved at the threads at both ends of the bidirectional transmission screw 5, a T-shaped plate 54 is installed on one side of the rectangular screw sleeve 53, an L-shaped clamping seat 55 is fixedly installed on the side of the rectangular screw sleeve 53 away from the T-shaped plate 54, and a clamping assembly for clamping and fixing the semiconductor element 32 is symmetrically installed in the L-shaped clamping seat 55.

[0027] Each time the output shaft of the self-locking stepper motor rotates one-half of a circle, the output shaft drives the docking head 14 to rotate 180 degrees, the docking head 14 drives the driving column 7 to rotate 180 degrees, the driving column 7 drives the rotating frame 3 to rotate 180 degrees, and the rotating frame 3 drives the rotating shaft to rotate synchronously, so that the rotating shaft and the driving column 7 rotate along the circular holes 21 of the two support plates 2 respectively, so that the rotating frame 3 can rotate stably; The rotating frame 3 drives the semiconductor element 32 to rotate 180 degrees through the clamping mechanism, the clamping assembly and the clamping assembly, thereby completing the flipping of the semiconductor element 32 , so that the detection device 13 can detect the upper and lower sides of the semiconductor element 32 .

[0028] The T-shaped plate 54 is clamped in the T-shaped slot 41 , and the T-shaped plate 54 is slidably connected to the T-shaped slot 41 in a forward and backward manner. One end of the T-shaped plate 54 passes through the T-shaped slot 41 and is fixedly connected to the rectangular screw sleeve 53 , and the rectangular screw sleeve 53 is threadedly connected to the bidirectional transmission screw 5 .

[0029] When the semiconductor element 32 is clamped and fixed, the concave clamping frame 4 drives the clamping assembly to approach the end of the semiconductor element 32. At this time, the concave clamping frame 4 drives the rectangular screw sleeve 53 to move through the bidirectional transmission screw 5, and the rectangular screw sleeve 53 drives the L-shaped clamping seat 55 to clamp on an end corner of the semiconductor element 32. At the same time, the L-shaped clamping seat 55 drives the clamping assembly to clamp on the upper and lower sides of an end corner of the semiconductor element 32. At the same time, an end corner of the semiconductor element 32 abuts against the L-shaped clamping seat 55, and the end corner of the semiconductor element 32 is clamped and fixed by the cooperation of the L-shaped clamping seat 55 and the clamping assembly; When the semiconductor element 32 is clamped, the four L-shaped clamping seats 55 and the four clamping components are clamped at the four end corners of the semiconductor element 32 respectively, so that the semiconductor element 32 can be firmly clamped and fixed stably.

[0030] When it is necessary to clamp and fix semiconductor components 32 of different widths, the adjusting sleeve 51 is rotated forward or reversely, and the adjusting sleeve 51 drives the bidirectional transmission screw 5 to rotate, and the bidirectional transmission screw 5 drives the two rectangular screw sleeves 53 thereon to move closer to or away from each other, and when the rectangular screw sleeve 53 moves, the L-shaped clamping seat 55 and the T-shaped plate 54 thereon are driven to move synchronously, and at this time, the T-shaped plate 54 slides along the T-shaped groove 41, so that the T-shaped plate 54 and the rectangular screw sleeve 53 can move stably; When the L-shaped clamping seat 55 moves, it drives the clamping assembly to move synchronously, changing the distance between the two L-shaped clamping seats 55 on the side of the bidirectional transmission screw 5, thereby changing the distance between the two clamping assemblies, so that the two L-shaped clamping seats 55 and the two clamping assemblies can clamp and fix semiconductor components 32 of different widths.

[0031] See also Figure 8 and Fig.10 An L-shaped lifting groove is provided on the inner side of the L-shaped clamping seat 55, and the clamping assembly includes an L-shaped clamping plate 56 symmetrically installed in the L-shaped lifting groove. A plurality of slide bars 57 are fixedly installed on the side away from each other of the two L-shaped clamping plates 56, and a clamping spring 58 is sleeved on the plurality of slide bars 57. The ends of the plurality of slide bars 57 away from the L-shaped clamping plates 56 penetrate the L-shaped clamping seat 55 and are fixedly sleeved with a limiting ring. The L-shaped clamping plate 56 is slidably connected to the inner wall of the L-shaped lifting groove, the sliding rod 57 is slidably connected to the L-shaped clamping seat 55, and the two ends of the clamping spring 58 are respectively in contact with the L-shaped clamping seat 55 and the L-shaped clamping plate 56.

[0032] Initially, the two L-shaped pressing plates 56 are not in contact with each other and a gap is left; When the semiconductor component 32 is clamped and fixed, the end corners of the semiconductor component 32 are inserted into the L-shaped lifting groove of the L-shaped clamping seat 55, and the two sides of the end corners of the semiconductor component 32 abut against the two inner walls of the L-shaped lifting groove; at this time, the end corners of the semiconductor component 32 push the two L-shaped clamping plates 56 away from each other, and the L-shaped clamping plates 56 drive the sliding rod 57 to slide along the L-shaped clamping seat 55, and the L-shaped clamping plates 56 squeeze the clamping springs 58. Under the action of the elastic force of the clamping springs 58, the two L-shaped clamping plates 56 cooperate to clamp and fix the end corners of the semiconductor component 32.

[0033] See also Figure 2 , Figure 3 , Figure 8 and Fig. 9 The locking mechanism includes a locking screw 6 threadedly installed on the side of the concave clamping frame 4, one end of the locking screw 6 passes through the side of the concave clamping frame 4 and extends to the inner side thereof, and the end of the locking screw 6 extending to the inner side of the concave clamping frame 4 is rotatably connected to the connecting plate 61 through a pin shaft, and the side of the concave clamping frame 4 is symmetrically provided with guide grooves 43, and the locking screw 6 is arranged between the two guide grooves 43. A guide plate 63 is symmetrically fixedly connected to the connecting plate 61 on one side close to the guide groove 43, and the guide plate 63 is slidably connected to the guide groove 43 left and right, and a locking tooth block 62 is symmetrically fixedly connected to the one side of the connecting plate 61 close to the gear ring 52, and the locking tooth block 62 is clamped with the gear ring 52.

[0034] The locking tooth block 62 is a rectangular block with a plurality of teeth on one side, and the side of the rectangular block close to the gear ring 52 is a curved surface, and a plurality of teeth are formed on one side of the curved surface of the rectangular block; The locking tooth block 62 in the locking mechanism is engaged with the gear ring 52, so that the gear ring 52 is locked. At this time, the gear ring 52 cannot rotate. When the gear ring 52 cannot rotate, the two-way transmission screw 5 also cannot rotate. At this time, the two rectangular screw sleeves 53 on the two-way transmission screw 5 cannot move forward and backward, thereby keeping the positions of the L-shaped clamping seat 55 and the clamping assembly unchanged, so that the L-shaped clamping seat 55 and the clamping assembly can firmly clamp and fix the semiconductor element 32.

[0035] When it is necessary to clamp and fix semiconductor components 32 of different widths, it is necessary to rotate and adjust the bidirectional transmission screw 5; first, the locking screw 6 is screwed outward along the concave clamping frame 4, and the locking screw 6 drives the connecting plate 61 to move away from the gear ring 52 through the pin shaft, and the connecting plate 61 drives the locking tooth block 62 away from the gear ring 52, so that the locking tooth block 62 releases the lock on the gear ring 52, and at this time, the adjusting sleeve 51 can be rotated as needed, thereby driving the bidirectional transmission screw 5 to rotate; When the adjustment is completed, the locking screw 6 is screwed inward along the concave clamping frame 4. The locking screw 6 drives the connecting plate 61 to move close to the gear ring 52 through the pin shaft. The connecting plate 61 drives the locking tooth block 62 to move close to the gear ring 52, so that the locking tooth block 62 is engaged with the gear ring 52, thereby locking the gear ring 52.

[0036] See also Figures 3 to 5 , Figure 7 and Fig.11 A rectangular groove 71 is formed through the side surface of one end of the driving column 7 in the circular hole 21, a groove 72 is formed on the inner wall of the rectangular groove 71, a docking groove 74 is formed on the end of the driving column 7 away from the circular hole 21, a circular groove 73 is formed on the inner wall of the docking groove 74, and a clamping groove 22 is formed symmetrically on the inner wall of the circular hole 21 that is in rotational contact with the driving column 7, a positioning mechanism is installed in the rectangular groove 71, and an unlocking mechanism for pressing the positioning mechanism is installed in the circular groove 73; When the rotating frame 3 and the driving column 7 rotate to the lower part of the inner side of the concave support frame 12, the docking groove 74 at the end of the driving column 7 is engaged with the docking head 14; The driving column 7 is formed by two semicircular columns symmetrically connected up and down; The positioning mechanism includes an L-shaped block 8 symmetrically installed in a rectangular groove 71, the other end of the L-shaped block 8 extends into the groove 72, and the two L-shaped blocks 8 are located in the groove 72. One side away from each other is cut to form an inclined surface, and the two inclined surfaces are distributed in an eight-shaped shape. The two L-shaped blocks 8 are symmetrically provided with mounting holes on one side close to each other, and a locking spring 81 is installed between the two mounting holes.

[0037] One end of the L-shaped block 8 extends through the rectangular groove 71 to the outside and is engaged with the groove 22. The two L-shaped blocks 8 are slidingly connected with the rectangular groove 71 and the groove 72. The two ends of the locking spring 81 are respectively plugged into the mounting holes on the sides of the two L-shaped blocks 8. The locking spring 81 applies elastic force to the two L-shaped blocks 8.

[0038] The unlocking mechanism includes a round rod 9 installed in the circular groove 73, one end of the round rod 9 passes through the circular groove 73 and extends into the groove 72, the end of the round rod 9 in the groove 72 is fixedly connected to an extrusion block 91, a V-shaped pressing groove 92 is provided on the side of the extrusion block 91 away from the round rod 9, one end of the L-shaped clamping block 8 is arranged in the V-shaped pressing groove 92, a return spring 93 is sleeved on the end of the round rod 9 in the circular groove 73, the end of the round rod 9 away from the extrusion block 91 is fixedly connected to a circular block 94, the circular block 94 is in the circular groove 73, and a hemispherical seat 95 is fixedly connected to the side of the circular block 94 away from the round rod 9.

[0039] The side of the circular block 94 away from the round rod 9 is flush with the inner side wall of the docking groove 74 or is located in the circular groove 73 , that is, the circular block 94 is always located in the circular groove 73 , and the hemispherical seat 95 is arranged in the docking groove 74 .

[0040] The round rod 9 is slidably connected to the driving column 7, the inner wall of the V-shaped pressure groove 92 contacts the inclined surface of the L-shaped block 8, the circular block 94 is slidably connected to the circular groove 73, and the two ends of the return spring 93 are respectively in contact with the circular groove 73 and the circular block 94, and the return spring 93 applies an elastic force to the circular block 94.

[0041] When the driving column 7 moves toward the inner side of the concave support frame 12, the docking groove 74 at the end of the driving column 7 is stuck on the docking head 14; During the process of the docking joint 14 and the docking groove 74 being engaged, the docking joint 14 contacts the hemispherical seat 95. At this time, the hemispherical seat 95 is squeezed by the docking joint 14, so that the hemispherical seat 95 shrinks into the circular groove 73, and the hemispherical seat 95 drives the circular block 94 to move into the circular groove 73. The circular block 94 squeezes the return spring 93, and at the same time, the circular block 94 drives the squeezing block 91 to move along the groove 72 close to the rectangular groove 71 through the round rod 9; When the extrusion block 91 moves, the two inner side walls of the V-shaped pressing groove 92 slide along the inclined surfaces of the two L-shaped blocks 8 respectively. At the same time, the V-shaped pressing groove 92 squeezes the two L-shaped blocks 8, so that the two L-shaped blocks 8 move closer to each other. The two L-shaped blocks 8 squeeze the locking springs 81. At the same time, one end of the two L-shaped blocks 8 moves out of the two grooves 22 respectively, so that the positioning mechanism releases the lock on the driving column 7, thereby allowing the driving column 7 to rotate along the circular hole 21.

[0042] Working principle: During processing, first pull the two clamping mechanisms in a rotating frame 3 away from each other, so that the sliding sleeve 42 slides along the guide light rod 31, and at the same time the sliding sleeve 42 squeezes the clamping spring 44, and the clamping mechanism drives the clamping assembly and the clamping assembly to move; The semiconductor element 32 is placed between the two clamping mechanisms, and then the two clamping mechanisms are released. Under the action of the elastic force of the clamping spring 44, the two clamping mechanisms move closer to each other, and the two clamping mechanisms drive the two clamping assemblies to move closer to each other. The clamping assemblies drive the clamping assemblies to move closer to the semiconductor element 32, so that the four L-shaped clamping seats 55 are clamped at the four end corners of the semiconductor element 32. When the end corner of the semiconductor component 32 is inserted into the L-shaped lifting groove of the L-shaped clamping seat 55, the two sides of the end corner of the semiconductor component 32 abut against the two inner side walls of the L-shaped lifting groove. At this time, the end corner of the semiconductor component 32 pushes the two L-shaped clamping plates 56 away from each other, and the L-shaped clamping plates 56 squeeze the clamping spring 58. Under the action of the elastic force of the clamping spring 58, the two L-shaped clamping plates 56 cooperate to clamp and fix the end corner of the semiconductor component 32; the four L-shaped clamping seats 55 and the four clamping assemblies cooperate to clamp the four end corners of the semiconductor component 32 respectively, so that the semiconductor component 32 can be stably clamped and fixed firmly; The two ends of the chain conveyor belt 11 are respectively a loading area and an unloading area. When the chain conveyor belt 11 stops moving, new semiconductor components 32 to be tested are continuously installed in the rotating frame 3 in the loading area, and the semiconductor components 32 tested in the rotating frame 3 are continuously unloaded in the unloading area, and so on.

[0043] The rotating frame 3 after loading is transported by the chain plate conveyor belt 11 and the support plate 2. The rotating frame 3 drives the semiconductor element 32 to move synchronously by the clamping mechanism, the clamping assembly and the clamping assembly, until the semiconductor element 32 is transported to the bottom of the detection device 13. At this time, the chain plate conveyor belt 11 stops again for a period of time, and the detection device 13 detects the upper side of the semiconductor element 32. When the rotating frame 3 and the semiconductor element 32 move downwardly toward the detection device 13, the driving column 7 on one side of the rotating frame 3 rotates to the lower side of the inner side of the concave support frame 12, and the docking groove 74 at the end of the driving column 7 is engaged with the docking head 14; During the process of the docking head 14 and the docking groove 74 being clamped, the hemispherical seat 95 is squeezed by the docking head 14, so that the hemispherical seat 95 and the circular block 94 move into the circular groove 73, and the circular block 94 squeezes the return spring 93. At the same time, the circular block 94 drives the squeezing block 91 to move along the groove 72 close to the rectangular groove 71 through the round rod 9; The two inner side walls of the V-shaped groove 92 on the extrusion block 91 slide along the inclined surfaces of the two L-shaped blocks 8 respectively. At the same time, the V-shaped groove 92 squeezes the two L-shaped blocks 8, so that the two L-shaped blocks 8 move closer to each other. The two L-shaped blocks 8 squeeze the locking springs 81. At the same time, one ends of the two L-shaped blocks 8 move out of the two grooves 22 respectively, so that the positioning mechanism releases the lock on the driving column 7, thereby allowing the driving column 7 to rotate along the circular hole 21.

[0044] The output shaft of the self-locking stepper motor rotates half a circle, the output shaft drives the docking joint 14 to rotate 180 degrees, the docking joint 14 drives the driving column 7 to rotate 180 degrees, the driving column 7 drives the rotating frame 3 to rotate 180 degrees, and the rotating frame 3 drives the semiconductor element 32 to rotate 180 degrees through the clamping mechanism, the clamping assembly and the clamping assembly, thereby completing the flipping of the semiconductor element 32, so that the detection equipment 13 can detect the other side of the semiconductor element 32, thereby completing the detection of the upper and lower sides of the semiconductor element 32.

[0045] By clamping and fixing the semiconductor element 32 once, detection of two sides can be achieved, and the semiconductor element 32 can be automatically turned over, which greatly improves the detection efficiency.

[0046] After the detection is completed, the chain conveyor belt 11 drives the rotating frame 3 and the semiconductor element 32 to move away from the bottom of the detection device 13. At this time, the docking groove 74 at the end of the driving column 7 is separated from the docking head 14. Under the action of the elastic force of the reset spring 93, the circular block 94 and the hemispherical seat 95 move outward along the circular groove 73 to reset. The circular block 94 drives the extrusion block 91 to move into the groove 72 through the round rod 9, so that the extrusion block 91 is reset. At this time, the two L-shaped blocks 8 are moved away from each other by the elastic force of the locking spring 81 , and the ends of the two L-shaped blocks 8 are inserted into the slots 22 , thus completing the locking of the drive column 7 , so that the drive column 7 cannot rotate along the circular hole 21 .

[0047] When it is necessary to unload the semiconductor element 32 in the rotating frame 3, the clamping mechanisms only need to be pushed away from each other so that the two clamping components move away from each other. The clamping components drive the clamping components to move, so that the semiconductor element 32 can be easily removed and the unloading of the semiconductor element 32 is completed.

[0048] When it is necessary to clamp and fix semiconductor components 32 of different widths, firstly, the locking screw 6 is screwed outward along the concave clamping frame 4, and the locking screw 6 drives the connecting plate 61 to move away from the gear ring 52 through the pin shaft, and the connecting plate 61 drives the locking tooth block 62 to move away from the gear ring 52, so that the locking tooth block 62 releases the lock on the gear ring 52; By rotating the adjustment sleeve 51 forward or reversely, the adjustment sleeve 51 drives the bidirectional transmission screw 5 to rotate, and the bidirectional transmission screw 5 drives the two rectangular screw sleeves 53 thereon to move closer to or away from each other. When the rectangular screw sleeve 53 moves, it drives the L-shaped clamping seat 55 and the T-shaped plate 54 thereon to move synchronously. When the L-shaped clamping seat 55 moves, it drives the clamping assembly to move synchronously, thereby changing the distance between the two L-shaped clamping seats 55 on the side of the bidirectional transmission screw 5, thereby changing the distance between the two clamping assemblies, so that the two L-shaped clamping seats 55 and the two clamping assemblies can clamp and fix semiconductor components 32 of different widths.

[0049] When the adjustment is completed, the locking screw 6 is screwed inward along the concave clamping frame 4. The locking screw 6 drives the connecting plate 61 to move close to the gear ring 52 through the pin shaft. The connecting plate 61 drives the locking tooth block 62 to move close to the gear ring 52, so that the locking tooth block 62 is engaged with the gear ring 52, thereby locking the gear ring 52.

[0050] The clamping mechanism, clamping assembly and clamping assembly can realize the clamping and fixing of semiconductor components 32 of different models, thereby improving the application range of the device. The clamping and fixing of the semiconductor components 32 is simple and convenient, which greatly improves the work efficiency of installing and removing the semiconductor components 32.

[0051] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A conveying device for semiconductor processing and testing, comprising a chain conveyor frame (1), characterized in that: A chain conveyor belt (11) is rotatably mounted on the chain conveyor frame (1), a concave support frame (12) is mounted across the top of the chain conveyor frame (1), and a detection device (13) is fixedly mounted on the upper end of the concave support frame (12). A plurality of groups of support plates (2) are equidistantly mounted on the chain conveyor belt (11), each group of support plates (2) has two support plates, and a rotating frame (3) is rotatably mounted between the two support plates (2) in each group, and a rotating shaft and a driving column (7) are fixedly mounted at both ends of the rotating frame (3). A circular hole (21) is opened on the side of (2), and the rotating shaft and the driving column (7) are rotatably connected to the two circular holes (21) respectively. A clamping mechanism is symmetrically installed in the rotating frame (3), and a semiconductor element (32) is placed between the two clamping mechanisms. A docking head (14) is installed on one side of the concave support frame (12), and the docking head (14) is clamped with the driving column (7) located below the concave support frame (12). The docking head (14) is driven by the output shaft of a self-locking stepping motor fixedly installed on the side of the concave support frame (12).

2. A conveying device for semiconductor processing and inspection according to claim 1, characterized in that: The clamping mechanism comprises a guide light rod (31) symmetrically fixedly connected to the inner side of the rotating frame (3) in front and back directions; a concave clamping frame (4) is symmetrically arranged between the two guide light rods (31); a T-shaped slot (41) is symmetrically opened on the side of the concave clamping frame (4) in front and back directions; a sliding sleeve (42) is symmetrically fixedly connected to the front and rear ends of the concave clamping frame (4); the sliding sleeve (42) is sleeved on the adjacent guide light rod (31); a clamping spring (44) is symmetrically sleeved at the two ends of the guide light rod (31); the two ends of the clamping spring (44) are respectively abutted against the rotating frame (3) and the sliding sleeve (42); a clamping assembly with adjustable clamping width is installed in the two concave clamping frames (4); and a locking mechanism for locking the clamping assembly is installed in the two concave clamping frames (4).

3. A conveying device for semiconductor processing and inspection according to claim 2, characterized in that: The clamping assembly comprises a bidirectional transmission screw (5) rotatably mounted in a concave clamping frame (4); an adjusting sleeve (51) is fixedly sleeved in the middle position of the bidirectional transmission screw (5); gear rings (52) are symmetrically fixedly sleeved at both ends of the adjusting sleeve (51) on the bidirectional transmission screw (5); the locking mechanism is arranged on one side of the gear ring (52); rectangular screw sleeves (53) are symmetrically sleeved at the threads at both ends of the bidirectional transmission screw (5); a T-shaped plate (54) is mounted on one side of the rectangular screw sleeve (53); an L-shaped clamping seat (55) is fixedly mounted on the side of the rectangular screw sleeve (53) away from the T-shaped plate (54); and a clamping assembly for clamping and fixing the semiconductor element (32) is symmetrically mounted in the L-shaped clamping seat (55) from top to bottom.

4. A conveying device for semiconductor processing and inspection according to claim 3, characterized in that: The T-shaped plate (54) is clamped in the T-shaped slot (41), and the T-shaped plate (54) is slidably connected to the T-shaped slot (41) in a forward and backward manner. One end of the T-shaped plate (54) passes through the T-shaped slot (41) and is fixedly connected to the rectangular screw sleeve (53). The rectangular screw sleeve (53) is threadedly connected to the bidirectional transmission screw rod (5).

5. A conveying device for semiconductor processing and inspection according to claim 3, characterized in that: An L-shaped lifting groove is provided on the inner side of the L-shaped clamping seat (55), and the clamping assembly includes an L-shaped clamping plate (56) symmetrically installed in the L-shaped lifting groove, and a plurality of sliding rods (57) are fixedly installed on the side away from each other of the two L-shaped clamping plates (56), and a clamping spring (58) is sleeved on the plurality of sliding rods (57), and the ends of the plurality of sliding rods (57) away from the L-shaped clamping plates (56) pass through the L-shaped clamping seat (55) and are fixedly sleeved on a limiting ring; The L-shaped clamping plate (56) is slidably connected to the inner side wall of the L-shaped lifting groove, the sliding rod (57) is slidably connected to the L-shaped clamping seat (55), and the two ends of the clamping spring (58) are respectively in contact with the L-shaped clamping seat (55) and the L-shaped clamping plate (56).

6. A conveying device for semiconductor processing and inspection according to claim 3, characterized in that: The locking mechanism comprises a locking screw (6) threadedly mounted on the side of the concave clamping frame (4), one end of the locking screw (6) passes through the side of the concave clamping frame (4) and extends to the inner side thereof, the end of the locking screw (6) extending to the inner side of the concave clamping frame (4) is rotatably connected to the connecting plate (61) through a pin shaft, the side of the concave clamping frame (4) is symmetrically provided with guide grooves (43), the locking screw (6) is arranged between the two guide grooves (43), a side of the connecting plate (61) close to the guide groove (43) is symmetrically fixedly connected to the guide plate (63), the guide plate (63) is slidably connected to the guide groove (43) left and right, and a side of the connecting plate (61) close to the gear ring (52) is symmetrically fixedly connected to the locking tooth block (62), the locking tooth block (62) is clamped with the gear ring (52).

7. A conveying device for semiconductor processing and inspection according to claim 1, characterized in that: A rectangular groove (71) is formed through the side surface of one end of the driving column (7) in the circular hole (21), a groove (72) is formed on the inner wall of the rectangular groove (71), a docking groove (74) is formed on the end of the driving column (7) away from the circular hole (21), a circular groove (73) is formed on the inner wall of the docking groove (74), and a clamping groove (22) is symmetrically formed on the inner wall of the circular hole (21) in rotational contact with the driving column (7), a positioning mechanism is installed in the rectangular groove (71), and an unlocking mechanism for pressing the positioning mechanism is installed in the circular groove (73); The positioning mechanism comprises an L-shaped card block (8) symmetrically mounted in a rectangular groove (71), the other end of the L-shaped card block (8) extending into the groove (72), the two L-shaped card blocks (8) being located in the groove (72) on one side away from each other and having inclined surfaces cut away, the two L-shaped card blocks (8) being located on one side close to each other and having mounting holes symmetrically opened, and a locking spring (81) being mounted between the two mounting holes.

8. A conveying device for semiconductor processing and inspection according to claim 7, characterized in that: One end of the L-shaped clamping block (8) passes through the rectangular groove (71) and extends to the outside and is clamped with the clamping groove (22). The two L-shaped clamping blocks (8) are slidably connected with the rectangular groove (71) and the groove (72). The two ends of the locking spring (81) are respectively plugged into the mounting holes on the sides of the two L-shaped clamping blocks (8).

9. A conveying device for semiconductor processing and inspection according to claim 7, characterized in that: The unlocking mechanism comprises a round rod (9) installed in the circular groove (73), one end of the round rod (9) passes through the circular groove (73) and extends into the groove (72), one end of the round rod (9) in the groove (72) is fixedly connected to an extrusion block (91), a side of the extrusion block (91) away from the round rod (9) is provided with a V-shaped pressing groove (92), one end of the L-shaped clamping block (8) is arranged in the V-shaped pressing groove (92), one end of the round rod (9) in the circular groove (73) is sleeved with a return spring (93), one end of the round rod (9) away from the extrusion block (91) is fixedly connected to a circular block (94), the circular block (94) is in the circular groove (73), and a side of the circular block (94) away from the round rod (9) is fixedly connected to a hemispherical seat (95).

10. A conveying device for semiconductor processing and inspection according to claim 9, characterized in that: The round rod (9) is slidably connected to the driving column (7), the inner side wall of the V-shaped pressing groove (92) contacts the inclined surface of the L-shaped clamping block (8), the circular block (94) is slidably connected to the circular groove (73), and the two ends of the return spring (93) are respectively in contact with the circular groove (73) and the circular block (94).

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