VCSEL chip metal etching device

Abstract

The application discloses a VCSEL chip metal etching equipment and relates to the technical field of chip metal etching equipment.The VCSEL chip metal etching equipment comprises a mainframe box, a soaking pool, a soaking assembly, a lifting driving assembly, a cover plate and an air suction grille.The soaking assembly is driven to move up and down and rotate by the lifting driving assembly, so that the wafer is soaked or rotated.The stirring fan blades can stir the etching liquid in the state of extending into the fan blade grooves, the etching liquid around the wafer can uniformly flow, the wafer surface can be more uniformly contacted with the etching liquid, and local over-etching or under-etching can be prevented.When the wafer is loaded, the stirring fan blades are retracted into the fan blade grooves, so that the wafer is prevented from being blocked or scratched by the stirring fan blades.The spring telescopic rods are arranged, the spring telescopic rods are retracted, wafer damage caused by excessive clamping force is avoided, the flexible pressing strips are made of flexible materials, and scratches between the wafer and the flexible pressing strips are prevented, so that double clamping protection of the wafer is achieved.

Description

Technical Field

[0001] This invention relates to the field of chip metal etching equipment technology, specifically a VCSEL chip metal etching equipment. Background Technology

[0002] In semiconductor manufacturing, microelectronics processes, and metal surface treatment, wet etching is a key surface treatment technology widely used in processes such as thin film removal, patterned metal, cleaning, and photoresist removal. Wet etching machines primarily remove material by immersing workpieces (such as wafers or metal substrates) in a chemical solution containing an etchant, utilizing the chemical reaction to precisely remove the material and achieve the desired processing effect. Currently, wet etching equipment is also used in the production of VCSEL chips.

[0003] Immersion wet etching machines, as a type of wet etching machine, have become commonly used equipment in industrial production. However, in long-term use, existing immersion etching machines still have many technical bottlenecks. For example, it is difficult to control the uniformity of etching during the immersion process, and over-etching or under-etching is prone to occur. Especially in mass production, it is difficult to control the precision of etching. In addition, the fixation of the wafer and the dynamic control of the etching solution temperature during the etching process are also important issues affecting the etching quality and efficiency of the etching machine at this stage. Summary of the Invention

[0004] The purpose of this invention is to provide a VCSEL chip metal etching device to solve the problems raised in the prior art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a VCSEL chip metal etching device, comprising a main unit, an immersion tank inside the main unit, a cover plate installed on the immersion tank, a lifting drive assembly installed on the main unit, an immersion assembly rotatably mounted on the lifting drive assembly, the immersion assembly being positioned corresponding to the immersion tank, an air suction grid on the main unit, a transparent baffle on the main unit, an infusion device installed inside the main unit, the infusion device being connected to the immersion tank, and an air extraction device installed inside the main unit.

[0006] The main unit is equipped with a control system that controls the entire etching equipment; an air extraction device that generates negative pressure through the air extraction grid to remove the vaporized etching solution; a liquid delivery device that introduces the etching solution into the immersion tank; a transparent baffle that shields the etching area to prevent the etching solution from splashing and spreading; and a loading and unloading device that places the pre-treated wafers on the immersion assembly or removes the etched wafers from the immersion assembly.

[0007] Furthermore, the lifting drive assembly includes a first electric telescopic rod, which is mounted on the main unit housing. A first connector is mounted on the output shaft of the first electric telescopic rod, an immersion assembly is rotatably mounted on the first connector, and a drive motor is mounted on the first connector. The output shaft of the drive motor is connected to the immersion assembly.

[0008] After the wafer is clamped and fixed, the output shaft of the first electric telescopic rod of the control system extends. This output shaft, via the first connector, drives the entire immersion assembly into the immersion tank filled with etching solution. The control system then activates the drive motor, whose output shaft rotates the immersion assembly. The immersion assembly causes the wafer to rotate in the etching solution, and the extended stirring blades agitate the solution, ensuring uniform flow around the wafer and more even contact between the wafer surface and the etching solution, preventing localized over-etching or under-etching. After etching is complete, the control system reverses the process, resetting the lifting drive assembly and the immersion assembly. Finally, the wafer is removed using the loading and unloading device, thus completing the batch etching of the wafers.

[0009] Furthermore, the soaking assembly includes a support assembly, on which several fixing rings are mounted, and fan-shaped rings are slidably mounted on the fixing rings. A clamping drive assembly is mounted on the support assembly and is slidably connected to the fixing rings. An automatic temperature control assembly is mounted on the fixing rings. The support assembly is rotatably connected to the first connecting member and is connected to the output shaft of the drive motor.

[0010] Furthermore, the bracket assembly includes a connecting plate, a second end plate is mounted on one end of the connecting plate, a second electric telescopic rod is mounted on the second end plate, the output shaft of the second electric telescopic rod is connected to the clamping drive assembly, a first end plate is mounted on the other end of the connecting plate, both the first end plate and the second end plate are rotatably connected to the first connecting member, both the first end plate and the second end plate are connected to the output shaft of the drive motor, and a fixing ring is mounted on the connecting plate.

[0011] Furthermore, the fixed ring is provided with a fan blade groove, a fitting groove, and a sliding hole. A second connecting piece is installed on the fixed ring, a transmission gear is rotatably installed on the second connecting piece, and brackets are symmetrically installed on the fixed ring.

[0012] Furthermore, the fan blade ring includes a ring plate, on which a plurality of stirring fan blades are mounted. A transmission block is provided on the ring plate, and a second transmission tooth is provided on the transmission block. The transmission block is slidably connected to the fitting groove. The transmission block is driven by meshing with the transmission gear through the second transmission tooth. The stirring fan blades are slidably connected to the fan blade groove.

[0013] Furthermore, the clamping drive assembly includes a transmission plate, which is connected to the output shaft of the second electric telescopic rod. Transmission rods are symmetrically mounted on the transmission plate, and the transmission rods pass through several sliding holes. The transmission rods are slidably connected to the fixed ring through the sliding holes. Several clamping components are mounted on the transmission rods, and the transmission rods are provided with first transmission teeth. The first transmission teeth mesh with the transmission gears for transmission. The clamping components are positioned corresponding to the fixed ring.

[0014] The control system controls the loading and unloading device to vertically place the pre-processed wafers onto the bracket of the fixing ring, ensuring that the surface of the wafer to be etched faces the first end plate. During this process, the stirring blades retract into their slots to prevent the wafers from being blocked or scratched during loading. Then, the second electric telescopic rod is activated. The output shaft of the second electric telescopic rod drives the transmission plate to retract, which in turn drives the clamping assembly to retract via the transmission rod. The clamping plates, through the spring telescopic rod, drive the flexible pressure strip to retract. The flexible pressure strip approaches the fixing ring and, in conjunction with the fixing ring, clamps and fixes several wafer edges. When the clamping force is too great, the spring telescopic rod can retract itself to prevent the entire clamping force from acting on the wafer and causing damage. The flexible pressure strip is made of flexible material to prevent scratching between it and the wafer.

[0015] As the transmission rod drives the clamping assembly to retract, it simultaneously drives the transmission gear to rotate through the first transmission tooth on it. The transmission gear drives the transmission block on the other side to slide linearly. The transmission block drives the entire fan ring to slide, so that the stirring fan blades on the fan ring gradually pass through and extend out of the fan blade groove from the initial state of being contracted in the fan blade groove, and become a stirring state. At this time, the ring blades are in contact with the fixed ring, and the transmission block is embedded in the fitting groove.

[0016] Furthermore, the clamping assembly includes a clamping plate mounted on a transmission rod, a spring telescopic rod mounted on the clamping plate, and a flexible pressure strip mounted on the spring telescopic rod. The flexible pressure strip is made of a flexible material.

[0017] Furthermore, the automatic temperature control component includes a heat-conducting shell, which is mounted on a fixed ring. An expansion shell is installed inside the heat-conducting shell, and a piston rod is slidably installed inside the expansion shell. An expansion medium is filled between the piston rod and the expansion shell. A sliding contact is installed on the piston rod. A heating column is installed inside the heat-conducting shell, and a fixed contact is installed at one end of the heating column. The sliding contact is slidably connected to the heating column.

[0018] After the immersion assembly enters the immersion tank, the automatic temperature control assembly is immersed in the etching solution. The temperature of the etching solution is conducted to the expansion shell through the conductive outer shell. The expansion medium inside the expansion shell expands or contracts after exchanging heat with the outside. When the external temperature is low, the expansion medium releases heat and contracts, causing the piston rod to retract. The piston rod drives the sliding contact to slide away from the fixed contact on the heating column. At this time, when the power is turned on, the effective conductive length of the heating column increases, and the resistance increases. According to Ohm's law, the heat generated by the heating column increases. Since the automatic temperature control assembly rotates with the immersion assembly, the heating column heats the etching solution around the wafer evenly, thus ensuring the etching speed. When the external temperature is high, the expansion medium absorbs heat and expands, pushing the piston rod to extend. The piston rod drives the sliding contact to slide towards the fixed contact on the heating column. At this time, when the power is turned on, the effective conductive length of the heating column decreases. According to Ohm's law, the heat generated by the heating column decreases, preventing the heating column from overheating the surrounding etching solution, which could lead to etching solution denaturation or evaporation.

[0019] Furthermore, the sliding contact is provided with a first terminal, the fixed contact is provided with a second terminal, the heating column is made of high-resistance material, the piston rod is made of insulating material, the fixed contact and the sliding contact are made of conductive material, and the expansion medium is a medium with a high coefficient of thermal expansion.

[0020] The first and second terminals are connected to the power supply via wires. Since the heating column is made of a high-resistivity material, it generates heat when powered on.

[0021] Compared with the prior art, the beneficial effects of the present invention are:

[0022] 1. The second electric telescopic rod drives the clamping assembly on the transmission rod to retract, enabling the clamping assembly to clamp wafers in batches. At the same time, the transmission rod drives the clamping assembly to retract, and the first transmission tooth on it synchronously drives the transmission gear to rotate. The transmission gear drives the stirring blades on the fan ring to pass through the fan blade groove, so that the stirring blades extend. This realizes the function of batch clamping wafers and extending and positioning the stirring blades simultaneously through a single component, such as the transmission rod, saving components and making the structure simpler and more efficient.

[0023] 2. The expansion medium in the automatic temperature control component exchanges heat with the outside. Through the expansion and contraction of the expansion medium, the piston rod automatically drives the sliding contact to slide on the heating column. When the external temperature is low, the heat generation of the heating column increases, uniformly heating the etching solution around the wafer, thus ensuring the etching speed. When the external temperature is low, the heat generation of the heating column decreases, preventing the heating column from overheating the surrounding etching solution, which could lead to denaturation or volatilization of the etching solution. Ultimately, dynamic adjustment of the temperature of the etching solution around the wafer is achieved.

[0024] 3. By setting up a spring telescopic rod, the contraction of the spring telescopic rod itself is used to avoid excessive clamping force that could damage the wafer. The flexible clamping strip is made of flexible material to prevent it from scratching the wafer, thus achieving double clamping protection for the wafer.

[0025] 4. The lifting drive assembly moves the immersion assembly up and down and rotates, thereby immersing or rotating the wafer. Through the extension and retraction of the fan blade ring, the stirring fan blades, when extended from the fan blade groove, can stir the etching solution, ensuring uniform flow of the etching solution around the wafer and making the contact between the wafer surface and the etching solution more even, preventing localized over-etching or under-etching. When the wafer is being loaded, the stirring fan blades retract into the fan blade groove, preventing the wafer from being blocked or scratched during loading, thus protecting the wafer. Attached Figure Description

[0026] Figure 1 This is a perspective view of the etching equipment of the present invention;

[0027] Figure 2 This is a perspective view of the lifting drive assembly of the present invention;

[0028] Figure 3 This is a perspective view of the immersion component of the present invention;

[0029] Figure 4 This is a perspective view of the automatic temperature control component of the present invention;

[0030] Figure 5 This is a perspective view of the clamping drive assembly of the present invention;

[0031] Figure 6 For the present invention Figure 5 A magnified view of a portion of region A in the middle;

[0032] Figure 7 For the present invention Figure 5 A magnified view of a portion of region B in the middle;

[0033] Figure 8 This is a perspective view of the fixing ring and the fan-shaped ring of the present invention;

[0034] Figure 9 For the present invention Figure 6 A magnified view of a portion of region C in the middle;

[0035] Figure 10 This is a perspective view of the fan-shaped ring of the present invention;

[0036] Figure 11 The three-dimensional shape of the fixing ring of the present invention Figure 1 ;

[0037] Figure 12 The three-dimensional shape of the fixing ring of the present invention Figure 2 .

[0038] In the diagram: 1. Main unit chassis; 2. Immersion tank; 3. Immersion assembly; 4. Lifting drive assembly; 5. Cover plate; 6. Suction grille; 41. First electric telescopic rod; 42. First connector; 43. Drive motor; 31. Bracket assembly; 32. Fixing ring; 33. Clamping drive assembly; 34. Fan blade ring; 35. Automatic temperature control assembly; 351. Heat-conducting shell; 352. Expansion shell; 353. Piston rod; 354. Sliding contact; 355. Heating column; 356. Fixing contact; 3541. First terminal; 3561. Second terminal. 331. Transmission plate; 332. Transmission rod; 333. Clamping assembly; 3321. First transmission gear; 321. Fan blade groove; 322. Sliding hole; 323. Bracket; 324. Fitting groove; 325. Transmission gear; 326. Second connecting piece; 341. Ring plate; 342. Stirring fan blade; 343. Transmission block; 3431. Second transmission gear; 3331. Clamping piece; 3332. Spring telescopic rod; 3333. Flexible pressure strip; 311. Second electric telescopic rod; 312. Connecting plate; 313. First end plate; 314. Second end plate. Detailed Implementation

[0039] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0040] like Figures 1-12 As shown, the present invention provides a technical solution for a VCSEL chip metal etching device: including a main unit 1, an immersion tank 2 inside the main unit 1, a cover plate 5 installed on the immersion tank 2, a lifting drive assembly 4 installed on the main unit 1, an immersion assembly 3 rotatably installed on the lifting drive assembly 4, the immersion assembly 3 being positioned corresponding to the immersion tank 2, an air suction grille 6 on the main unit 1, a transparent baffle on the main unit 1, an infusion device installed inside the main unit 1, the infusion device being connected to the immersion tank 2, and an air extraction device installed inside the main unit 1.

[0041] The main unit 1 is equipped with a control system, which controls the entire etching equipment; the air extraction device is used to generate negative pressure suction in the air extraction grid 6, thereby removing the vaporized etching liquid; the liquid delivery device is used to input the etching liquid into the immersion tank 2; the transparent baffle is used to shield the etching area to prevent the etching liquid from splashing and the vaporized etching liquid from spreading; the main unit 1 is also equipped with a loading and unloading device, which is used to place the pre-treated wafers on the immersion assembly 3, or to remove the etched wafers from the immersion assembly 3.

[0042] The lifting drive assembly 4 includes a first electric telescopic rod 41, which is mounted on the main unit housing 1. A first connector 42 is mounted on the output shaft of the first electric telescopic rod 41. An immersion assembly 3 is rotatably mounted on the first connector 42. A drive motor 43 is mounted on the first connector 42, and the output shaft of the drive motor 43 is connected to the immersion assembly 3.

[0043] The soaking assembly 3 includes a support assembly 31, on which a plurality of fixing rings 32 are mounted, and fan-shaped rings 34 are slidably mounted on the fixing rings 32. A clamping drive assembly 33 is mounted on the support assembly 31 and is slidably connected to the fixing rings 32. An automatic temperature control assembly 35 is mounted on the fixing rings 32. The support assembly 31 is rotatably connected to the first connecting member 42 and is connected to the output shaft of the drive motor 43.

[0044] The bracket assembly 31 includes a connecting plate 312. A second end plate 314 is installed on one end of the connecting plate 312. A second electric telescopic rod 311 is installed on the second end plate 314. The output shaft of the second electric telescopic rod 311 is connected to the clamping drive assembly 33. A first end plate 313 is installed on the other end of the connecting plate 312. Both the first end plate 313 and the second end plate 314 are rotatably connected to the first connecting member 42. Both the first end plate 313 and the second end plate 314 are connected to the output shaft of the drive motor 43. A fixing ring 32 is installed on the connecting plate 312.

[0045] The fixed ring 32 is provided with a fan blade groove 321, a fitting groove 324, a sliding hole 322, a second connecting member 326, a transmission gear 325 rotatably mounted on the second connecting member 326, and brackets 323 symmetrically mounted on the fixed ring 32.

[0046] The fan blade ring 34 includes a ring plate 341, on which a plurality of stirring fan blades 342 are mounted. A transmission block 343 is provided on the ring plate 341, and a second transmission tooth 3431 is provided on the transmission block 343. The transmission block 343 is slidably connected to the fitting groove 324. The transmission block 343 is driven by meshing with the transmission gear 325 through the second transmission tooth 3431. The stirring fan blades 342 are slidably connected to the fan blade groove 321.

[0047] The clamping drive assembly 33 includes a transmission plate 331, which is connected to the output shaft of the second electric telescopic rod 311. Transmission rods 332 are symmetrically mounted on the transmission plate 331. The transmission rods 332 pass through several sliding holes 322 and are slidably connected to the fixed ring 32 through the sliding holes 322. Several clamping assemblies 333 are mounted on the transmission rods 332. The transmission rods 332 are provided with first transmission teeth 3321, which mesh with transmission gears 325 for transmission. The clamping assemblies 333 are positioned corresponding to the fixed ring 32.

[0048] The clamping assembly 333 includes a clamping piece 3331, which is mounted on a transmission rod 332. A spring telescopic rod 3332 is mounted on the clamping piece 3331, and a flexible pressure strip 3333 is mounted on the spring telescopic rod 3332. The flexible pressure strip 3333 is made of a flexible material.

[0049] The automatic temperature control assembly 35 includes a heat-conducting shell 351, which is mounted on a fixed ring 32. An expansion shell 352 is installed inside the heat-conducting shell 351. A piston rod 353 is slidably installed inside the expansion shell 352. An expansion medium is filled between the piston rod 353 and the expansion shell 352. A sliding contact 354 is installed on the piston rod 353. A heating column 355 is installed inside the heat-conducting shell 351. A fixed contact 356 is installed at one end of the heating column 355. The sliding contact 354 is slidably connected to the heating column 355.

[0050] The sliding contact 354 has a first terminal 3541, and the fixed contact 356 has a second terminal 3561. The heating column 355 is made of a high-resistivity material, the piston rod 353 is made of an insulating material, and the fixed contact 356 and the sliding contact 354 are made of conductive materials. The expansion medium is a medium with a high coefficient of thermal expansion. The first terminal 3541 and the second terminal 3561 are connected to the power supply via wires. Because the heating column 355 is made of a high-resistivity material, it generates heat when energized.

[0051] The working principle of the present invention is as follows: The control system controls the loading and unloading device to place the pre-treated wafer vertically on the bracket 323 of the fixing ring 32, so that the surface of the wafer to be etched faces the direction of the first end plate 313. During this period, the stirring blades 342 retract into the blade groove 321 to prevent the wafer from being blocked or scratched by the stirring blades 342 during loading. Then, the second electric telescopic rod 311 is activated. The output shaft of the second electric telescopic rod 311 drives the transmission plate 331 to retract. The transmission plate 331 drives the clamping assembly 333 to retract via the transmission rod 332. The clamping piece 3331 drives the flexible pressure strip 3333 to retract via the spring telescopic rod 3332. The flexible pressure strip 3333 approaches the fixing ring 32 and cooperates with the fixing ring 32 to clamp and fix several wafer edges. When the clamping force is too large, the spring telescopic rod 3332 can retract itself to avoid the clamping force being applied to the wafer and causing wafer damage. The flexible pressure strip 3333 is made of flexible material to prevent it from scratching the wafer.

[0052] As the transmission rod 332 drives the clamping assembly 333 to retract, it simultaneously drives the transmission gear 325 to rotate through the first transmission tooth 3321 on it. The transmission gear 325 drives the transmission block 343 on the other side to slide linearly. The transmission block 343 drives the entire fan blade ring 34 to slide, so that the stirring fan blades 342 on the fan blade ring 34 gradually pass through and extend out of the fan blade groove 321 from the initial state of being retracted in the fan blade groove 321, and become a stirring state. At this time, the ring blades 341 are in contact with the fixed ring 32, and the transmission block 343 is embedded in the fitting groove 324.

[0053] After the wafer is clamped and fixed, the output shaft of the first electric telescopic rod 41 of the control system extends. The output shaft of the first electric telescopic rod 41 drives the entire immersion assembly 3 to sink into the immersion pool 2 filled with etching solution through the first connector 42. The control system activates the drive motor 43, and the output shaft of the drive motor 43 drives the immersion assembly 3 to rotate. The immersion assembly 3 drives the wafer to rotate in the etching solution. The extended stirring blades 342 stir the etching solution to ensure that the etching solution flows evenly around the wafer, making the contact between the wafer surface and the etching solution more uniform and preventing local over-etching or under-etching. After etching is completed, the control system reverses the previous operation to reset the lifting drive assembly 4 and the immersion assembly 3. Finally, the wafer is removed using the loading and unloading device, thus completing the batch etching of the wafer.

[0054] After the immersion component 3 enters the immersion pool 2, the automatic temperature control component 35 is immersed in the etching solution. The temperature of the etching solution is conducted to the expansion shell 352 through the heat-conducting shell 351. The expansion medium inside the expansion shell 352 expands or contracts after exchanging heat with the outside. When the external temperature is low, the expansion medium releases heat and contracts, causing the piston rod 353 to retract. The piston rod 353 drives the sliding contact 354 to slide away from the fixed contact 356 on the heating column 355. At this time, when the power is turned on, the effective conductive length of the heating column 355 increases, and the resistance increases. According to Ohm's law, the heat generated by the heating column 355 increases. Since the automatic temperature control component 35 rotates with the immersion component 3, the heating column 355 will uniformly heat the etching solution around the wafer, thereby ensuring the etching speed. When the external temperature is high, the expansion medium absorbs heat and expands, pushing the piston rod 353 to extend. The piston rod 353 drives the sliding contact 354 to slide towards the fixed contact 356 on the heating column 355. At this time, when the power is turned on, the effective conductive length of the heating column 355 decreases. According to Ohm's law, the heat generated by the heating column 355 decreases, preventing the heating column 355 from overheating the surrounding etching solution, which could cause the etching solution to denature or evaporate.

[0055] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A VCSEL chip metal etching apparatus, characterized in that: The etching equipment includes a main unit (1), an immersion tank (2) inside the main unit (1), a cover plate (5) installed on the immersion tank (2), a lifting drive assembly (4) installed on the main unit (1), an immersion assembly (3) rotatably installed on the lifting drive assembly (4), the immersion assembly (3) being positioned corresponding to the immersion tank (2), an air suction grille (6) on the main unit (1), a transparent baffle on the main unit (1), an infusion device installed inside the main unit (1), the infusion device being connected to the immersion tank (2), and an air extraction device installed inside the main unit (1). The lifting drive assembly (4) includes a first electric telescopic rod (41), which is mounted on the main unit (1). A first connector (42) is mounted on the output shaft of the first electric telescopic rod (41), and a drive motor (43) is mounted on the first connector (42). The soaking assembly (3) includes a support assembly (31), on which a plurality of fixing rings (32) are mounted, and a fan-shaped ring (34) is slidably mounted on the fixing rings (32). A clamping drive assembly (33) is mounted on the support assembly (31), and the clamping drive assembly (33) is slidably connected to the fixing rings (32). An automatic temperature control assembly (35) is mounted on the fixing rings (32). The support assembly (31) is rotatably connected to the first connecting member (42), and the support assembly (31) is connected to the output shaft of the drive motor (43).

2. The VCSEL chip metal etching equipment according to claim 1, characterized in that: The bracket assembly (31) includes a connecting plate (312), a second end plate (314) is installed on one end of the connecting plate (312), a second electric telescopic rod (311) is installed on the second end plate (314), the output shaft of the second electric telescopic rod (311) is connected to the clamping drive assembly (33), a first end plate (313) is installed on the other end of the connecting plate (312), the first end plate (313) and the second end plate (314) are both rotatably connected to the first connector (42), the first end plate (313) and the second end plate (314) are both connected to the output shaft of the drive motor (43), and the fixing ring (32) is installed on the connecting plate (312).

3. The VCSEL chip metal etching equipment according to claim 2, characterized in that: The fixed ring (32) is provided with a fan blade groove (321), the fixed ring (32) is provided with a fitting groove (324), the fixed ring (32) is provided with a sliding hole (322), the fixed ring (32) is provided with a second connecting member (326), the second connecting member (326) is rotatably mounted with a transmission gear (325), and the fixed ring (32) is symmetrically mounted with brackets (323).

4. The VCSEL chip metal etching equipment according to claim 3, characterized in that: The fan blade ring (34) includes a ring plate (341), on which a plurality of stirring fan blades (342) are mounted. A transmission block (343) is provided on the ring plate (341), and a second transmission tooth (3431) is provided on the transmission block (343). The transmission block (343) is slidably connected to the fitting groove (324). The transmission block (343) is driven by meshing with the transmission gear (325) through the second transmission tooth (3431). The stirring fan blades (342) are slidably connected to the fan blade groove (321).

5. The VCSEL chip metal etching equipment according to claim 4, characterized in that: The clamping drive assembly (33) includes a transmission plate (331), which is connected to the output shaft of the second electric telescopic rod (311). A transmission rod (332) is symmetrically installed on the transmission plate (331). The transmission rod (332) passes through several sliding holes (322). The transmission rod (332) is slidably connected to the fixed ring (32) through the sliding holes (322). A number of clamping assemblies (333) are installed on the transmission rod (332). A first transmission tooth (3321) is provided on the transmission rod (332). The first transmission tooth (3321) meshes with the transmission gear (325) for transmission. The clamping assembly (333) is positioned corresponding to the fixed ring (32).

6. The VCSEL chip metal etching equipment according to claim 5, characterized in that: The clamping assembly (333) includes a clamping piece (3331) mounted on a transmission rod (332). A spring telescopic rod (3332) is mounted on the clamping piece (3331), and a flexible pressure strip (3333) is mounted on the spring telescopic rod (3332). The flexible pressure strip (3333) is made of a flexible material.

7. The VCSEL chip metal etching equipment according to claim 1, characterized in that: The automatic temperature control component (35) includes a heat-conducting shell (351), which is mounted on a fixing ring (32). An expansion shell (352) is installed inside the heat-conducting shell (351). A piston rod (353) is slidably installed inside the expansion shell (352). An expansion medium is filled between the piston rod (353) and the expansion shell (352). A sliding contact (354) is installed on the piston rod (353). A heating column (355) is installed inside the heat-conducting shell (351). A fixed contact (356) is installed at one end of the heating column (355). The sliding contact (354) is slidably connected to the heating column (355).

8. The VCSEL chip metal etching equipment according to claim 7, characterized in that: The sliding contact (354) is provided with a first terminal (3541), the fixed contact (356) is provided with a second terminal (3561), the heating column (355) is made of high resistance material, the piston rod (353) is made of insulating material, the fixed contact (356) and the sliding contact (354) are made of conductive material, and the expansion medium is a medium with a high coefficient of thermal expansion.

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