Electrocoppering hanger stripping and hanging liquid medicine and stripping and hanging method

Abstract

The invention relates to the field of PCB manufacturing, and particularly discloses a stripping and hanging liquid medicine and a stripping and hanging method for an electro-coppering hanger. The stripping and hanging liquid medicine for the electrocoppering hanger comprises the following components in percentage by volume: 10-20% of an organic acid ester polymer, 1-4% of a sulfated compound, 20-40% of an organic amine compound and the balance of water, the stripping and hanging method for the electroplating copper hanger comprises the following steps: washing the electroplating hanger with water, and then cleaning the electroplating hanger with a dilute sulfuric acid solution; a stripping and hanging liquid medicine accounting for 15-25% of the capacity of the stripping and hanging groove, a dilute sulfuric acid solution accounting for 45-55% of the capacity of the stripping and hanging groove and a hydrogen peroxide solution accounting for 25-35% of the capacity of the stripping and hanging groove are added into the stripping and hanging groove, and the electroplating hanger is put into the stripping and hanging groove to be soaked and cleaned for 30-60 min; and washing the electroplating hanger again after stripping and hanging treatment. The stripping and hanging liquid medicine for the electro-coppering hanger has the advantages that the problem caused by smoke in the stripping and hanging process is avoided, and safety and stability are achieved; in addition, the stripping and hanging method has the advantages of being safe, free of smoke and efficient in stripping and hanging.

Description

Technical Field

[0001] The present application relates to the field of PCB manufacturing, and more specifically, to a stripping solution and a stripping method for an electroplated copper hanger. Background Art

[0002] With the vigorous development of the electronic technology industry, the importance of printed circuit boards (PCBs), as the core component of electronic products, has become increasingly prominent.

[0003] In the PCB manufacturing process, the electroplating process is crucial, and it has a direct impact on the quality and performance of the circuit board. When electroplating the PCB board, an electroplating hanger is required to clamp the PCB board. However, during the electroplating process, the clamping point of the electroplating fixture will also be plated with copper. Since these hangers need to be used repeatedly, the copper layer on the chuck of the electroplating fixture will gradually thicken with the increase in the number of uses. The thickened copper on the chuck will not only interfere with the electroplating conductivity and reduce the electroplating quality of the PCB board, but also damage the fixture.

[0004] To solve this problem, the prior art usually uses chemical stripping to treat the coating at the clamping point of the electroplating fixture, most of which uses high-concentration nitric acid for soaking. This method of using nitric acid to strip the hanger can indeed strip the copper layer on the chuck. However, in actual operation, high-concentration nitric acid will continue to evaporate during the soaking process, causing acid mist to be generated in the workshop on the production line. Acid mist is extremely harmful to the human body, and will have a strong irritation and corrosion effect on human skin and mucous membranes, seriously damaging the health of employees. Therefore, a method and solution for stripping copper electroplating that can replace nitric acid are needed to achieve environmental protection and harmlessness to the human body. Summary of the invention

[0005] In order to provide an environmentally friendly and harmless stripping solution and an electroplated copper stripping method, the present application provides an electroplated copper hanger stripping solution and a stripping method.

[0006] The present application provides a copper electroplating hanger stripping and hanging solution using the following technical solution: The invention discloses a stripping solution for electroplating copper hangers, the components of which include 10-20% of organic acid lipid polymer, 1-4% of sulfate compound, 20-40% of organic amine compound and the balance of water.

[0007] By adopting the above technical scheme, the stripping and hanging potion of the present application realizes a safe and smoke-free operating environment. During the entire stripping process, the operator's vision and breathing will not be affected by the smoke problem, which greatly reduces the risk of safety accidents caused by chemical smoke and ensures the safety and stability of workshop production. The organic acid lipid polymer, sulfate compound and organic amine compound in the potion formula cooperate with each other. The organic acid lipid polymer forms a complex with the surface of the copper layer, increasing the contact area and reaction activity between the copper layer and the potion. The sulfate compound provides a moderate acidic environment, which helps to accelerate the chemical reaction and promote the copper layer to dissolve or detach faster. The organic amine compound can adjust the pH and surface activity of the potion, further optimize the reaction conditions, and speed up the stripping and deplating speed. Compared with the traditional nitric acid soaking method, it can act more accurately on the copper plating layer, avoiding the time wasted due to the ineffective reaction or side effects that may exist in nitric acid on other materials, thereby realizing fast and effective stripping and deplating. The organic acid lipid polymer, sulfate compound and organic amine compound have good compatibility with each other in the proportion of the present application, and will not fail due to violent chemical reactions after one use. Under normal conditions of use, these ingredients can maintain relatively stable chemical properties, allowing the potion to be recycled multiple times.

[0008] Optionally, the peeling solution comprises 15% organic acid lipid polymer, 2% sulfate compound, 30% organic amine compound, and the balance is water.

[0009] Optionally, the organic acid lipid polymer component includes aniline, triethylamine and methylamine, and the aniline, triethylamine and methylamine are compounded in a volume ratio of (2-4):(5-7):1.

[0010] By adopting the above technical scheme, the benzene ring structure in aniline can increase the stability of the polymer, so that it can continue to play a role in the stripping process. The amino group in aniline has a certain complexing ability and can form a complex with copper ions, thereby promoting the copper layer to fall off from the hanger, accelerating the stripping speed and improving the stripping efficiency. Triethylamine can adjust the pH of the potion, which is conducive to promoting the chemical reaction between copper and other components, making the copper layer easier to be stripped. At the same time, the structural characteristics of triethylamine make it possible to interact with aniline, methylamine and other components to synergistically enhance the stripping effect on the copper layer. The small molecular structure and active amino group of methylamine enable it to quickly participate in the reaction with the copper layer. It can react chemically with copper ions to generate compounds that are easily soluble in the potion, accelerate the dissolution of the copper layer, and can synergize with other amine substances to further optimize the processing capacity of the stripping potion for the copper layer. Aniline, triethylamine and methylamine cooperate with each other in a specific ratio to form a stable organic acid lipid polymer structure, which ensures that the polymer can continuously and stably play its stripping function in the stripping process and will not be easily decomposed or invalidated due to environmental factors.

[0011] Optionally, the aniline, triethylamine and methylamine are compounded in a volume ratio of 3:6:1.

[0012] Optionally, the sulfate compound includes aminosulfonic acid, cyclopropanesulfonic acid, aminosulfonic acid, alkyl sulfonate and aryl sulfonic acid, and the aminosulfonic acid, cyclopropanesulfonic acid, aminosulfonic acid, alkyl sulfonate and aryl sulfonic acid are compounded in a volume ratio of 6:(16-18):(18-20):7:(34-36).

[0013] By adopting the above technical scheme, aminosulfonic acid accounts for a higher proportion in the sulfate-based compounds, and it has strong acidity. In the stripping solution system, it can provide sufficient hydrogen ions for the chemical reaction and accelerate the reaction with the copper layer on the electroplated copper hanger. Its acidity helps to oxidize copper, making it easier to detach from the hanger surface, thereby improving the stripping speed and efficiency. The special structure of cyclopropanesulfonic acid gives it unique chemical activity. It can interact specifically with the surface of the copper layer, change the surface properties of the copper layer, and reduce the bonding force between copper and the hanger. This structural advantage helps to improve the efficiency of the entire stripping process and make the copper layer easier to be stripped under the action of the solution. In the sulfate-based compounds, cyclopropanesulfonic acid and other components such as aminosulfonic acid cooperate with each other. It can adjust the reactivity and selectivity of the solution, so that the solution acts more accurately on the copper plating layer during the stripping process, reduce the impact on other parts of the hanger, and improve the quality of stripping. Similar to aminosulfonic acid, aminosulfonic acid is also a strong acidic component. Its presence further increases the acidity of the solution, providing a more favorable chemical environment for the stripping of the copper layer. During the stripping process, aminosulfonic acid can undergo an oxidation-reduction reaction with copper, converting copper into soluble copper ions, thereby achieving the purpose of stripping. Alkyl sulfonates can reduce the surface tension of the solution. During the stripping process, it can make the solution better wet the surface of the electroplating copper hanger, ensure full contact between the solution and the copper layer, and improve the stripping effect. Due to its aromatic ring structure, aryl sulfonic acid has a special electronic effect and spatial structure, which helps to loosen the connection between the copper layer and the hanger. At the same time, the acidity of aryl sulfonic acid also provides favorable conditions for the reaction, accelerating the stripping of the copper layer.

[0014] Optionally, the aminosulfonic acid, cyclopropanesulfonic acid, aminosulfonic acid, alkylsulfonate and arylsulfonic acid are compounded in a volume ratio of 6:17:19:7:35.

[0015] Optionally, the organic amine compound includes β-olefin, propyl crotonate and maleic anhydride, and the β-olefin, propyl crotonate and maleic anhydride are compounded in a volume ratio of 3:5:10.

[0016] By adopting the above technical scheme, β-olefin accounts for a large proportion of organic amine compounds, and its double bond structure gives it a higher reactivity. In the peeling solution environment, this reactivity helps to promote interaction with the copper layer, thereby accelerating the stripping process of copper from the hanger and increasing the stripping speed. Propyl butyl acrylate can improve the interfacial properties between the solution and the copper layer. Its unique molecular structure can be adsorbed on the surface of the copper layer, reducing the interfacial tension between the copper layer and the hanger, making it easier for the copper layer to detach from the hanger. This adsorption effect also helps to form a microenvironment on the surface of the copper layer that is conducive to the reaction, promoting the continued stripping reaction. Maleic anhydride contains carbon-carbon double bonds and anhydride functional groups, which make it have strong chemical reactivity. During the stripping process, maleic anhydride reacts chemically with copper, forms a stable compound with copper ions through redox reactions, and promotes the dissolution and stripping of the copper layer.

[0017] In a second aspect, the present application provides a method for stripping a copper electroplating hanger, which adopts the following technical solution: A method for stripping and hanging an electroplated copper hanger comprises the following steps: Washing 1: Place the electroplating rack into the washing tank and wash it with water for 50-70 seconds; Pickling: Place the electroplating rack into the pickling tank and clean the electroplating rack with dilute sulfuric acid solution for 50-70 seconds; Stripping: Add 15-25% of the stripping solution, 55-65% of the dilute sulfuric acid solution and 25-35% of the hydrogen peroxide solution into the stripping tank, put the electroplating hanger into the stripping tank, and soak and clean for 30-60 minutes; Washing 2: Place the electroplating rack into the washing tank and wash with water for 100-140 seconds.

[0018] By adopting the above technical solution, the electroplating hanger is placed in a water washing tank for cleaning, which can effectively remove most of the loose impurities, dust and electroplating tank liquid residues attached to the hanger surface. This step creates a relatively clean surface condition for subsequent pickling and stripping operations, avoids interference of impurities with subsequent treatment processes, and ensures the stability of subsequent treatment effects. Using a dilute sulfuric acid solution to clean the electroplating hanger can remove the oxide layer on the hanger surface and some impurities that are not completely removed in the water washing step. At the same time, the pickling effect of dilute sulfuric acid can activate the hanger surface and increase its surface energy, which is conducive to the contact and reaction between the subsequent stripping solution and the hanger surface, thereby improving the stripping efficiency. A specific proportion of stripping solution, dilute sulfuric acid solution and hydrogen peroxide solution are added to the stripping tank, and this combination forms an efficient stripping system. The mixed solution of sulfuric acid and hydrogen peroxide reacts with copper as a strong oxidant to oxidize copper into copper ions to achieve stripping. The stripping solution needle can further enhance this reaction effect and speed up the stripping speed. Furthermore, when sulfuric acid and hydrogen peroxide react with copper to release a large amount of heat and the temperature of the liquid medicine rises sharply, which can easily lead to boiling and splashing, the ingredients in the peeling solution can keep the peeling process stable. It effectively suppresses the abnormal and violent reaction of the liquid medicine, avoids the risk of injury to operators caused by splashing liquid medicine, and ensures the safety of operators during the peeling process without affecting the peeling speed. The peeling method of the present application is safe and smokeless. Compared with the traditional method of using high-concentration nitric acid and other volatile substances that produce harmful smoke, this solution will not pollute the environment during the peeling process, nor will it endanger the health of operators.

[0019] Optionally, the concentration of the dilute sulfuric acid solution in the pickling step is 1-3%.

[0020] By adopting the above technical solution, a dilute sulfuric acid solution with a concentration of 1-3% has sufficient acidity to dissolve some metal oxides on the surface of the electroplating rack. The dilute sulfuric acid of this concentration can also micro-etch the surface of the rack, causing certain changes in the microstructure of the rack surface and increasing the surface roughness. In this way, the contact area between the rack surface and the stripping solution can be increased, the chemical reaction rate between the stripping solution and the rack surface can be increased, and the subsequent stripping process can be carried out more smoothly. If the sulfuric acid concentration is too high, it will cause serious corrosion to the pickling tank itself. The dilute sulfuric acid concentration of 1-3% is relatively low. While being able to meet the pickling requirements, it is less corrosive to the pickling tank, reducing the loss of the pickling tank and extending the service life of the pickling tank.

[0021] Optionally, in the stripping step, the mass concentration of the sulfuric acid solution is 4-6%, and the mass concentration of the hydrogen peroxide solution is 28-32%.

[0022] By adopting the above technical solution, a mass concentration of 4-6% can provide a moderate acidic environment for the chemical reaction, which helps to promote the oxidation reaction of copper and makes it easier for copper to be converted into copper ions, thereby accelerating the stripping process. Within this concentration range, sulfuric acid can synergize with hydrogen peroxide to enhance the oxidation capacity, while not causing excessive corrosion to the hanger or other equipment due to excessive acidity. The mass concentration of hydrogen peroxide of 28-32% ensures that it has sufficient oxidation capacity in the solution. During the stripping process, it can synergize with sulfuric acid to oxidize copper into soluble copper ions, thereby achieving the stripping of the copper layer from the hanger. A higher concentration ensures that there is a sufficient amount of hydrogen peroxide to participate in the reaction, improve the stripping efficiency, and shorten the stripping time.

[0023] In summary, this application has the following beneficial effects: 1. The stripping and deplating solution of the present application can realize a safe and smoke-free operating environment, reduce the risk of safety accidents caused by chemical smoke, and ensure the safety and stability of workshop production. In its formula, organic acid lipid polymers, sulfate compounds and organic amine compounds cooperate with each other. The former forms a complex with the surface of the copper layer to increase the contact area and reaction activity, the sulfate compounds provide an acidic environment to accelerate the chemical reaction, and the organic amine compounds adjust the pH and surface activity to optimize the reaction conditions, thereby accelerating the stripping and deplating speed. Compared with the traditional nitric acid immersion method, it can act more accurately on the copper plating layer to achieve fast and effective stripping and deplating. At the same time, these components have good compatibility at a specific ratio, the chemical properties are relatively stable, and the solution can be recycled many times.

[0024] 2. The method of the present application can remove most of the loose impurities, dust and electroplating tank liquid residues on the surface of the hanger by water washing, create clean conditions for pickling and stripping, and ensure the stability of subsequent treatment effects; pickling can remove the oxide layer and remaining impurities and activate the surface of the hanger, thereby improving the stripping efficiency; the stripping solution, dilute sulfuric acid solution and hydrogen peroxide solution in the stripping tank form an efficient stripping system, sulfuric acid and hydrogen peroxide react with copper to achieve stripping, and the stripping solution enhances the reaction effect and speeds up the reaction. At the same time, it can keep the stripping process stable when the reaction produces heat violently and the solution is in danger of boiling and splashing, thereby ensuring the safety of the operators and the stripping speed. In addition, this method is safe and smokeless, and compared with the traditional high-concentration nitric acid method, it will not pollute the environment or harm the health of the operators.

[0025] 3. The method of the present application can dissolve metal oxides on the surface of the hanger, micro-etch the surface of the hanger to increase the roughness, increase the contact area with the stripping solution, and increase the reaction rate to facilitate stripping through the 1-3% concentration of dilute sulfuric acid solution in the pickling step. The concentration is relatively low, which can reduce corrosion to the pickling tank while meeting the pickling requirements and extend its service life. In the stripping step, the 4-6% mass concentration of sulfuric acid solution can provide a moderately acidic environment to promote copper oxidation and accelerate stripping, and synergize with hydrogen peroxide to enhance the oxidation capacity without excessively corroding the hanger, etc. The 28-32% mass concentration of hydrogen peroxide has sufficient oxidation capacity to cooperate with sulfuric acid to achieve copper layer stripping and improve stripping efficiency. DETAILED DESCRIPTION

[0026] The present application is further described in detail below in conjunction with the examples. It is particularly noted that if no specific conditions are specified in the following examples, the experiments are carried out according to conventional conditions or the conditions recommended by the manufacturer. Unless otherwise specified, the raw materials used in the following examples can be obtained from common commercial sources.

[0027] Preparation Example 1 Preparation of a stripping solution for electroplating copper hangers: 30 L of aniline (McLean's reagent A801024), 60 L of triethylamine (McLean's reagent T818772) and 10 L of methylamine (Merck's reagent 534102) were added to a stirring tank and stirred to obtain an organic acid lipid polymer; 6 L aminosulfonic acid (Merck reagent 86040), 17 L cyclopropanesulfonic acid (Jinjinle Chemical Co., Ltd., purity 95%), 19 L aminosulfonic acid (McLean reagent S817496), 7 L sodium dodecylsulfonate (Wuhan Jixinyibang Biotechnology Co., Ltd.) and 35 L benzenesulfonic acid (Merck reagent 12635) were measured and mixed in a clean container to obtain a sulfate compound; 6 L of 1-butene (Merck reagent 603333), 10 L of propyl crotonate (Merck reagent 604038) and 20 L of maleic anhydride (Merck reagent 63200) were measured and stirred in a clean container to obtain an organic amine compound; 15 L of organic acid lipid polymer, 2 L of sulfate compound, 30 L of organic amine compound and 53 L of water were mixed in a stirring tank at a speed of 300 r / min for 15 min to obtain a stripping solution for electroplating copper hangers.

[0028] Preparation Example 2 The preparation of a stripping solution for electroplating copper hangers is different from that of Preparation Example 1 in that: 10 L of organic acid lipid polymer, 1 L of sulfate compound, 20 L of organic amine compound and 69 of water were mixed in a stirring tank at a speed of 300 r / min for 15 min to obtain a stripping solution for electroplating copper hangers.

[0029] Preparation Example 3 The preparation of a stripping solution for electroplating copper hangers is different from that of Preparation Example 1 in that: 20 L of organic acid lipid polymer, 4 L of sulfate compound, 40 L of organic amine compound and 46 L of water were mixed in a stirring tank at a speed of 300 r / min for 15 min to obtain a stripping solution for electroplating copper hangers.

[0030] Preparation Example 4 The preparation of a stripping solution for electroplating copper hangers is different from that of Preparation Example 1 in that 20 L of aniline, 50 L of triethylamine and 10 L of methylamine are added to a stirring tank and stirred to obtain an organic acid lipid polymer.

[0031] Preparation Example 5 The preparation of a stripping solution for electroplating copper hangers is different from that of Preparation Example 1 in that 40 L of aniline, 70 L of triethylamine and 10 L of methylamine are added to a stirring tank and stirred to obtain an organic acid lipid polymer.

[0032] Preparation Example 6 The preparation of a stripping solution for electroplating copper hangers is different from that of Preparation Example 1 in that 6 L of aminosulfonic acid, 16 L of cyclopropanesulfonic acid, 18 L of aminosulfonic acid, 7 L of alkyl sulfonate and 34 L of arylsulfonic acid are measured and mixed in a clean container to obtain a sulfate compound.

[0033] Preparation Example 7 The preparation of a stripping solution for electroplating copper hangers is different from that of Preparation Example 1 in that 6 L of aminosulfonic acid, 18 L of cyclopropanesulfonic acid, 20 L of aminosulfonic acid, 7 L of alkyl sulfonate and 36 L of arylsulfonic acid are measured and mixed in a clean container to obtain a sulfate compound.

[0034] Preparation Example 8 The preparation of a stripping solution for electroplating copper hangers is different from that of Preparation Example 1 in that: 33 L of aniline, 34 L of triethylamine and 33 L of methylamine were added to a stirring tank and stirred to obtain an organic acid lipid polymer.

[0035] Preparation Example 9 The preparation of a stripping solution for electroplating copper hangers is different from that of Preparation Example 1 in that: 16.8 L of aminosulfonic acid, 16.8 L of cyclopropanesulfonic acid, 16.8 L of aminosulfonic acid, 16.8 L of alkylsulfonate and 16.8 L of arylsulfonic acid were measured and mixed in a clean container to obtain a sulfate compound.

[0036] Preparation Example 10 The preparation of a stripping solution for electroplating copper hangers is different from that of Preparation Example 1 in that: 12 L of β-olefin, 12 L of propyl crotonate and 12 L of maleic anhydride were measured and stirred in a clean container to obtain an organic amine compound.

[0037] Preparation Example 11 The preparation method of stripping solution for electroplating copper hanger is different from that of Preparation Example 1 in that no organic acid lipid polymer is added.

[0038] Preparation Example 12 The preparation method of a stripping solution for electroplating copper hangers is different from that of Preparation Example 1 in that no sulfate-based compound is added.

[0039] Preparation Example 13 The preparation method of a stripping solution for electroplating copper hangers is different from that of Preparation Example 1 in that no organic amine compound is added.

[0040] Example 1 A method for stripping and hanging an electroplated copper hanger: Washing 1: Place the electroplating rack in the washing tank, immerse it in water, start the equipment to shake, and wash the electroplating rack with water for 60 seconds; Pickling: Place the electroplating rack in the pickling tank, immerse it in the pickling solution, start the equipment to shake, and clean the electroplating rack with a 2% mass concentration of dilute sulfuric acid solution for 60 seconds; Stripping: add 20% of the stripping solution into the stripping tank, then add 5% of the dilute sulfuric acid solution and 30% of the hydrogen peroxide solution, and put the electroplating rack into the stripping tank. Start the equipment and shake it, immerse the electroplating rack completely in the liquid, and wash it for 45 minutes. The stripping solution is prepared by Preparation Example 1. Washing 2: Place the electroplating rack into the washing tank, turn on the equipment to shake, and wash with water for 120 seconds.

[0041] Example 2 A method for stripping an electroplated copper hanger: The method is different from Example 1 in that the stripping solution in the stripping step is prepared by Preparation Example 2.

[0042] Example 3 A method for stripping an electroplated copper hanger: The difference from Example 1 is that the stripping solution in the stripping step is prepared by Preparation Example 3.

[0043] Example 4 A method for stripping an electroplated copper hanger: The method is different from Example 1 in that the stripping solution in the stripping step is prepared by Preparation Example 4.

[0044] Example 5 A method for stripping an electroplated copper hanger: The method is different from Example 1 in that the stripping solution in the stripping step is prepared by Preparation Example 5.

[0045] Example 6 A method for stripping an electroplated copper hanger: The method is different from Example 1 in that the stripping solution in the stripping step is prepared by Preparation Example 6.

[0046] Example 7 A method for stripping an electroplated copper hanger: The difference from Example 1 is that the stripping solution in the stripping step is prepared by Preparation Example 7.

[0047] Example 8 A method for stripping an electroplated copper hanger: The method is different from Example 1 in that the stripping solution in the stripping step is prepared by Preparation Example 8.

[0048] Example 9 A method for stripping an electroplated copper hanger: The method is different from Example 1 in that the stripping solution in the stripping step is prepared by Preparation Example 9.

[0049] Example 10 A method for stripping an electroplated copper hanger: The method is different from Example 1 in that the stripping solution in the stripping step is prepared by Preparation Example 10.

[0050] Embodiment 11 A method for stripping a copper electroplating rack: The method is different from Example 1 in that a dilute sulfuric acid solution with a mass concentration of 1% is used to clean the electroplating rack in the pickling step.

[0051] Example 12 A method for stripping a copper electroplating rack: The method is different from Example 1 in that a dilute sulfuric acid solution with a mass concentration of 3% is used to clean the electroplating rack in the pickling step.

[0052] Example 13 A method for stripping a copper electroplating rack: The method is different from Example 1 in that a dilute sulfuric acid solution with a mass concentration of 5% is used to clean the electroplating rack in the pickling step.

[0053] Embodiment 14 A method for stripping an electroplated copper hanger: The method is different from Example 1 in that the mass concentration of the sulfuric acid solution in the stripping step is 4%.

[0054] Embodiment 15 A method for stripping an electroplated copper hanger: The method is different from Example 1 in that the mass concentration of the sulfuric acid solution in the stripping step is 6%.

[0055] Example 16 A method for stripping an electroplated copper hanger: The method is different from Example 1 in that the mass concentration of the sulfuric acid solution in the stripping step is 3%.

[0056] Embodiment 17 A method for stripping an electroplated copper hanger: The method is different from Example 1 in that the mass concentration of the sulfuric acid solution in the stripping step is 7%.

[0057] Embodiment 18 A method for stripping a copper electroplating hanger: The method is different from Example 1 in that the mass concentration of the hydrogen peroxide solution in the stripping step is 28%.

[0058] Embodiment 19 A method for stripping an electroplating copper rack: The method is different from Example 1 in that the mass concentration of the hydrogen peroxide solution in the stripping step is 32%.

[0059] Embodiment 20 A method for stripping a copper electroplating hanger: The method is different from Example 1 in that the mass concentration of the hydrogen peroxide solution in the stripping step is 26%.

[0060] Embodiment 21 A method for stripping an electroplating copper hanger: The method is different from Example 1 in that the mass concentration of the hydrogen peroxide solution in the stripping step is 34%.

[0061] Embodiment 22 A method for stripping an electroplated copper hanger: The method is different from Example 1 in that in the stripping step, 20% of the stripping solution, 60% of the dilute sulfuric acid solution and 20% of the hydrogen peroxide solution are added into the stripping tank.

[0062] Embodiment 23 A method for stripping an electroplated copper hanger: The method is different from Example 1 in that in the stripping step, 20% of the stripping solution, 40% of the dilute sulfuric acid solution and 40% of the hydrogen peroxide solution are added into the stripping tank.

[0063] Comparative Example 1 A method for stripping an electroplated copper hanger: The method is different from Example 1 in that no pickling step is performed.

[0064] Comparative Example 2 A method for stripping an electroplated copper hanger: The method is different from Example 1 in that no stripping solution is added in the stripping step.

[0065] Comparative Example 3 A method for stripping an electroplated copper hanger: The difference from Example 1 is that the stripping solution is prepared by Preparation Example 11.

[0066] Comparative Example 4 A method for stripping an electroplated copper hanger: The difference from Example 1 is that the stripping solution is prepared by Preparation Example 12.

[0067] Comparative Example 5 A method for stripping an electroplated copper hanger: The difference from Example 1 is that the stripping solution is prepared by Preparation Example 13.

[0068] Detection Methods When the peeling and hanging step is performed in the embodiment / comparative example, observe whether smoke, irritating gas, liquid boiling, liquid splashing, etc. are generated in the peeling and hanging tank. Use a gas detector to detect whether harmful gas is generated in the peeling and hanging tank.

[0069] A uniform standard workpiece is subjected to a peeling treatment according to the process of the embodiment / comparative example, and after completion, its effective peeling area is checked to calculate the peeling rate.

[0070] According to the process of the embodiment / comparative example, a uniform 10cm*10cm standard workpiece is stripped and hung, and the stripping and hanging groove is uniformly 20cm*10*15cm. The standard workpieces are processed in sequence. When the stripping and hanging area of ​​the electroplated copper on the surface of the workpiece is less than 90%, it is recorded as unqualified, and the number of qualified workpieces that can be processed in the same stripping and hanging liquid is counted.

[0071] Table 1 Observation records of the peeling process Stripping process Example 1 No harmful gas, no obvious smoke, no irritating gas, no boiling Example 2 No harmful gas, no obvious smoke, no irritating gas, no boiling Example 3 No harmful gas, no obvious smoke, no irritating gas, no boiling Example 4 No harmful gas, no obvious smoke, no irritating gas, no boiling Example 5 No harmful gas, no obvious smoke, no irritating gas, no boiling Example 6 No harmful gas, no obvious smoke, no irritating gas, no boiling Example 7 No harmful gas, no obvious smoke, no irritating gas, no boiling Example 8 No harmful gas, no obvious smoke, no irritating gas, no boiling Example 9 No harmful gas, no obvious smoke, no irritating gas, no boiling Example 10 No harmful gas, no obvious smoke, no irritating gas, no boiling Embodiment 11 No harmful gas, no obvious smoke, no irritating gas, no boiling Example 12 No harmful gas, no obvious smoke, no irritating gas, no boiling Example 13 No harmful gas, no obvious smoke, no irritating gas, no boiling Embodiment 14 No harmful gas, no obvious smoke, no irritating gas, no boiling Embodiment 15 No harmful gas, no obvious smoke, no irritating gas, no boiling Example 16 No harmful gas, no obvious smoke, no irritating gas, no boiling Embodiment 17 No harmful gas, no obvious smoke, no irritating gas, no boiling Embodiment 18 No harmful gas, no obvious smoke, no irritating gas, no boiling Embodiment 19 No harmful gas, no obvious smoke, no irritating gas, no boiling Embodiment 20 No harmful gas, no obvious smoke, no irritating gas, no boiling Embodiment 21 No harmful gas, no obvious smoke, no irritating gas, no boiling Embodiment 22 No harmful gas, no obvious smoke, no irritating gas, no boiling Embodiment 23 No harmful gas, no obvious smoke, no irritating gas, no boiling Comparative Example 1 No harmful gas, no obvious smoke, no irritating gas, no boiling Comparative Example 2 Produces irritating gas and liquid boils Table 2 Statistics of peeling rate and number of qualified products Stripping rate / % Number of qualified workpieces Example 1 99.64 49 Example 2 98.15 45 Example 3 98.84 46 Example 4 98.35 44 Example 5 98.67 46 Example 6 99.12 47 Example 7 98.31 45 Example 8 96.43 43 Example 9 95.58 42 Example 10 96.11 45 Embodiment 11 99.10 47 Example 12 97.64 42 Example 13 98.50 47 Embodiment 14 98.01 45 Embodiment 15 98.29 48 Example 16 98.12 44 Embodiment 17 99.31 48 Embodiment 18 97.93 44 Embodiment 19 99.17 49 Embodiment 20 97.61 42 Embodiment 21 99.36 49 Embodiment 22 98.39 45 Embodiment 23 98.22 47 Comparative Example 1 95.02 32 Comparative Example 2 88.13 28 Comparative Example 3 94.33 38 Comparative Example 4 95.27 42 Comparative Example 4 94.65 40 Combining Example 1 and Comparative Example 1 and Table 1-2, it can be seen that Example 1 includes a pickling step, the peeling rate reaches 99.64%, and the number of qualified workpieces is 49; Comparative Example 1 does not perform a pickling step, the peeling rate drops to 95.02%, and the number of qualified workpieces decreases to 32. This shows that the pickling step plays an important role in improving the peeling effect. Pickling can remove the oxide layer and impurities on the surface of the hanger, activate the surface of the hanger, increase the contact and reaction between the peeling solution and the hanger surface, thereby improving the peeling efficiency and quality.

[0072] Combining Example 1 and Comparative Example 2 and Tables 1-2, it can be seen that in Example 1, peeling and hanging liquid is added in the peeling and hanging step, the peeling and hanging process is smooth, there is no irritating gas and boiling phenomenon, the peeling and hanging rate is high (99.64%), and the number of qualified workpieces is large; in Comparative Example 2, no peeling and hanging liquid is added in the peeling and hanging step, irritating gas and liquid boiling occur, the peeling and hanging rate drops sharply to 88.13%, and the number of qualified workpieces is also reduced to 28. This shows that the peeling and hanging liquid can effectively suppress abnormal and violent reactions, avoid liquid splashing, and improve the peeling and hanging efficiency. The peeling and hanging liquid of the present application can achieve a safe and smokeless operating environment, reduce the risk of safety accidents caused by chemical smoke, and ensure the safety and stability of workshop production. At the same time, the liquid can be recycled many times.

[0073] Combining Example 1 and Comparative Examples 3-5 and Tables 1-2, it can be seen that the peeling solution of Example 1 contains organic acid lipid polymers, sulfate compounds and organic amine compounds, and the peeling rate and the number of qualified workpieces are at a high level; Comparative Example 3 lacks organic acid lipid polymers, Comparative Example 4 lacks sulfate compounds, and Comparative Example 5 lacks organic amine compounds, and the peeling rate and the number of qualified workpieces are reduced. This shows that the three components in the peeling solution cooperate with each other, and the lack of any one component will have an adverse effect on the peeling effect, and they work together to ensure good peeling performance.

[0074] It can be seen from Examples 1-10 and Tables 1-2 that in Examples 1-11, by changing the ratio of the components of the peeling solution (such as the amount of organic acid lipid polymers, sulfate compounds and organic amine compounds) or the ratio of its internal components (such as the ratio of aniline, triethylamine and methylamine in the organic acid lipid polymer), the overall peeling process can still maintain a safe state without harmful gases, obvious smoke, irritating gases and boiling. This shows that when the formula ratio of the peeling solution changes within a certain range, although it will affect the peeling effect, it will not change its basic characteristics of safety and environmental protection. At the same time, the formula ratio of the present application can achieve a better peeling effect. If it exceeds the ratio range of the peeling solution components of the present application, the peeling effect will be significantly reduced.

[0075] Combining Example 1 and Examples 11-23 with Table 1-2, it can be seen that a dilute sulfuric acid solution with a concentration of 1-3% has sufficient acidity to dissolve some metal oxides on the surface of the electroplating rack.

[0076] It can be seen from Example 1 and Example 10-23 and Table 1-2 that Example 11-23 changes the concentration of the dilute sulfuric acid solution in the pickling step or the concentration and ratio of the sulfuric acid solution and the hydrogen peroxide solution in the stripping step. As can be seen from Table 1, these changes have basically no effect on the safety of the stripping process, and there is still no harmful gas, no obvious smoke, etc. From Table 2, the stripping rate and the number of qualified workpieces have certain changes. The dilute sulfuric acid solution with a concentration of 1-3% has sufficient acidity to dissolve some metal oxides on the surface of the electroplating rack. The dilute sulfuric acid of this concentration can also micro-etch the surface of the rack, so that the microstructure of the surface of the rack changes to a certain extent and the surface roughness is increased. In this way, the contact area between the rack surface and the stripping solution can be increased, the chemical reaction rate between the stripping solution and the rack surface can be increased, and the subsequent stripping process can be carried out more smoothly. If the sulfuric acid concentration is too high, it will cause serious corrosion to the pickling tank itself. The concentration of 1-3% dilute sulfuric acid is relatively low. While being able to meet the pickling requirements, it is less corrosive to the pickling tank, reduces the loss of the pickling tank, and extends the service life of the pickling tank. The mass concentration of 4-6% can provide a moderate acidic environment for the chemical reaction, which helps to promote the oxidation reaction of copper, making it easier for copper to be converted into copper ions, thereby accelerating the stripping process. Within this concentration range, sulfuric acid can synergize with hydrogen peroxide to enhance the oxidation ability, and at the same time will not cause excessive corrosion to the hanger or other equipment due to excessive acidity. The mass concentration of hydrogen peroxide of 28-32% ensures that it has sufficient oxidation ability in the solution. During the stripping process, it can synergize with sulfuric acid to oxidize copper into soluble copper ions, thereby realizing the stripping of the copper layer from the hanger. A higher concentration ensures that there is a sufficient amount of hydrogen peroxide to participate in the reaction, improve the stripping efficiency, and shorten the stripping time. Within the process range of this application, excellent stripping effects can be achieved, and exceeding the scope of this application will reduce the stripping effect.

[0077] This specific embodiment is merely an explanation of the present application and is not a limitation of the present application. After reading this specification, those skilled in the art may make modifications to the present embodiment without any creative contribution as needed, but such modifications are protected by the patent law as long as they are within the scope of the claims of the present application.

Claims

1. A stripping and hanging solution for electroplating copper hangers, characterized in that: The components thereof include 10-20% of organic acid lipid polymer, 1-4% of sulfate compound, 20-40% of organic amine compound and the balance of water by volume percentage.

2. The electroplating copper rack stripping solution according to claim 1, characterized in that: The peeling and hanging liquid comprises, by volume, 15% of organic acid lipid polymer, 2% of sulfate compound, 30% of organic amine compound, and the balance of water.

3. The electroplating copper rack stripping solution according to claim 1, characterized in that: The organic acid lipid polymer component comprises aniline, triethylamine and methylamine, and the aniline, triethylamine and methylamine are compounded in a volume ratio of (2-4):(5-7):

1.

4. The electroplating copper rack stripping solution according to claim 3, characterized in that: The aniline, triethylamine and methylamine are compounded in a volume ratio of 3:6:

1.

5. The electroplating copper rack stripping solution according to claim 1, characterized in that: The sulfate compounds include aminosulfonic acid, cyclopropanesulfonic acid, aminosulfonic acid, alkyl sulfonate and aryl sulfonic acid, and the aminosulfonic acid, cyclopropanesulfonic acid, aminosulfonic acid, alkyl sulfonate and aryl sulfonic acid are compounded in a volume ratio of 6:(16-18):(18-20):7:(34-36).

6. The electroplating copper rack stripping solution according to claim 5, characterized in that: The aminosulfonic acid, cyclopropanesulfonic acid, aminosulfonic acid, alkylsulfonate and arylsulfonic acid are compounded in a volume ratio of 6:17:19:7:

35.

7. The electroplating copper rack stripping solution according to claim 1, characterized in that: The organic amine compound comprises beta-olefin, propyl crotonate and maleic anhydride, and the beta-olefin, propyl crotonate and maleic anhydride are compounded in a volume ratio of 3:5:

10.

8. A method for stripping and hanging a copper electroplating hanger according to claim 1, characterized in that: The following steps are involved: One-time water washing: wash the electroplating rack with water; Pickling: Clean the electroplating rack with dilute sulfuric acid solution for 50-70s; Stripping: Add 15-25% of the stripping solution, 45-55% of the dilute sulfuric acid solution and 25-35% of the hydrogen peroxide solution into the stripping tank, put the electroplating hanger into the stripping tank, and soak and clean for 30-60 minutes; Secondary water washing: Wash the electroplating rack with water again.

9. The method for stripping and hanging a copper electroplating hanger according to claim 8, characterized in that: The concentration of the dilute sulfuric acid solution in the pickling step is 1-3%.

10. The method for stripping and hanging an electroplating copper hanger according to claim 8, characterized in that: In the stripping step, the mass concentration of the dilute sulfuric acid solution is 4-6%, and the mass concentration of the hydrogen peroxide solution is 28-32%.