Vapor chamber and radiator

Abstract

The invention provides a vapor chamber and a radiator, the vapor chamber comprises a top plate and a bottom plate, the top plate and the bottom plate are fixedly connected, a cavity is formed between the top plate and the bottom plate, and the cavity is used for being filled with a cooling medium and used for forming a vacuum environment; the top plate and / or the bottom plate are / is provided with at least one connecting hole, the connecting hole is communicated with the cavity, the connecting hole is used for being connected with a heat pipe, and at least one heat pipe is used for injecting liquid into the cavity. According to the vapor chamber and the radiator, the production process is simpler, the production efficiency is effectively improved, the production cost is reduced, and meanwhile the heat dissipation capacity is improved.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation devices, and in particular to a temperature homogenizing plate and a heat sink. Background Art

[0002] Most 3DVC heat sinks connect the VC (heat evaporation plate) cavity with the heat pipe through welding process to form an integrated cavity, which is filled with liquid working fluid and evacuated. The working fluid evaporates on the substrate surface close to the heat source end and condenses at the end far from the heat source. Driven by capillary force, gas-liquid two-phase circulation is realized, thereby achieving the effect of ideal uniform temperature heat dissipation.

[0003] In the process of implementing this application, the inventors found that there are at least the following problems in the prior art: most of the existing 3DVC heat sinks have the same temperature distribution plate 1 as Figure 1 As shown, a V-shaped notch (mounting groove 11) is provided on one side of the temperature equalizing plate 1, and a liquid injection tube 3 is welded at the notch. The provision of the V-shaped notch and the liquid injection tube 3 will increase the manufacturing difficulty of the temperature equalizing plate 1, reduce the production efficiency, and reduce the heat conduction area of ​​the temperature equalizing plate 1. In addition, the interference of the V-shaped notch will increase the difficulty of sealing the liquid injection tube 3. Summary of the invention

[0004] Based on this, the present application provides a temperature vaporizer and a heat sink to improve the problems of complex production process of the temperature vaporizer and high production cost in the prior art.

[0005] To achieve the above purpose, the technical solution of the embodiment of the present application is implemented as follows:

[0006] On the one hand, an embodiment of the present application provides a temperature equalizing plate, comprising a top plate and a bottom plate, wherein the top plate and the bottom plate are fixedly connected, and a cavity is formed between the top plate and the bottom plate, wherein the cavity is used to be filled with a cooling medium and to form a vacuum environment; at least one connecting hole is provided on the top plate and / or the bottom plate, wherein the connecting hole is connected to the cavity, and wherein the connecting hole is used to connect a heat pipe, and at least one of the heat pipes is used to inject liquid into the cavity.

[0007] In one of the embodiments, a temperature equalizing plate is characterized in that: it includes a top plate and a bottom plate, the top plate and the bottom plate are fixedly connected, and a cavity is formed between the top plate and the bottom plate, the cavity is used to fill with cooling medium and to form a vacuum environment; at least one connecting hole is provided on the top plate and / or the bottom plate, the connecting hole is used to connect a heat pipe, and the heat pipe is used as an injection pipe of the temperature equalizing plate.

[0008] In one embodiment, the top plate and the bottom plate are copper plates respectively.

[0009] In one of the embodiments, the connection hole is arranged on the side wall of the groove, or the connection hole is arranged on the top plate.

[0010] In one embodiment, the temperature equalizing plate further includes a capillary layer and a copper column disposed in the cavity, the capillary layer is disposed on the inner wall of the top plate and / or the bottom plate, and two ends of the copper column are respectively in contact with the top plate, the bottom plate and the capillary layer.

[0011] On the other hand, an embodiment of the present application provides a radiator, comprising at least one heat pipe and a temperature equalizing plate as described above, wherein the evaporation end of the heat pipe is connected to the connection hole, and the condensation end of at least one of the heat pipes serves as a liquid injection port of the temperature equalizing plate.

[0012] In one of the embodiments, the connection holes are respectively provided on the four side walls of the bottom plate, and each of the connection holes is respectively connected to the heat pipe.

[0013] In one of the embodiments, a plurality of connection holes are respectively provided on both sides of the cavity in the length direction, and each of the connection holes is respectively connected to the heat pipe.

[0014] In one of the embodiments, at least one of the heat pipes located on the same side of the cavity in the length direction serves as a liquid injection pipe.

[0015] In one of the embodiments, the radiator further includes a heat sink and a cold source, the heat sink is arranged on the temperature averaging plate and / or the heat pipe, and the cold source is used for exchanging heat with the temperature averaging plate.

[0016] The present application has at least the following beneficial effects: the temperature averaging plate and radiator provided by the present application are provided with connection holes on the top plate and / or bottom plate of the temperature averaging plate, and the heat pipes are connected through the connection holes, and the heat pipes are used as the injection pipes of the temperature averaging plate, so that there is no need to set up the injection pipes on the structure of the temperature averaging plate itself, and there is no need to groove the temperature averaging plate, so that the overall structure of the temperature averaging plate is simpler, and its production and manufacturing are easier, and the production efficiency is also improved. At the same time, there is no need to weld additional injection pipes, and there is no need to use injection pipes, which not only simplifies the production process and improves production efficiency, but also reduces the use of components and effectively reduces costs. In addition, since there is no need to groove the temperature averaging plate, the overall thermal conductivity area of ​​the temperature averaging plate is increased without changing the external dimensions of the temperature averaging plate itself, so that the temperature averaging plate improves the heat dissipation capacity under limited space conditions to meet higher heat dissipation requirements under small space conditions. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the structure of an existing conventional temperature equalizing plate.

[0018] Figure 2It is a schematic diagram of the three-dimensional structure of the radiator according to an embodiment of the present application.

[0019] Figure 3 This is a schematic diagram of the front structural view of the radiator according to an embodiment of the present application.

[0020] Figure 4 It is a schematic cross-sectional structure diagram of the heat sink according to an embodiment of the present application.

[0021] Figure 5 for Figure 4 A schematic diagram of the enlarged structure.

[0022] The meanings of the symbols in the accompanying drawings are as follows:

[0023] 1. Temperature balancing board; 11. Mounting slot; 12. Bottom plate; 13. Top plate; 14. Cavity; 15. Copper column; 16. Capillary layer; 2. Heat pipe; 21. Liquid injection port; 3. Liquid injection pipe. DETAILED DESCRIPTION

[0024] The technical solution of the present application is further elaborated in detail below in conjunction with the accompanying drawings and specific embodiments of the specification.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit the implementation of this application. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0026] In the description of the present application, it should be understood that the terms "center", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating positions or positional relationships, are based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present application. In the description of the present application, unless otherwise specified, "multiple" means two or more.

[0027] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0028] See also Figure 1 and Figure 2 The temperature equalizer 1 of the embodiment of the present application includes a top plate 13 and a bottom plate 12, the top plate 13 and the bottom plate 12 are fixedly connected, and a cavity 14 is formed between the top plate 13 and the bottom plate 12, and the cavity 14 is used to fill the cooling medium and to form a vacuum environment. At least one connecting hole (not shown) is provided on the top plate 13 and / or the bottom plate 12, and the connecting hole is connected to the cavity 14, and the connecting hole is used to connect the heat pipe 2, and the heat pipe 2 can be used as the injection pipe 3 of the temperature equalizer 1 to fill the cooling medium into the cavity 14.

[0029] The overall shape of the temperature balancing plate 1 of this embodiment is a rectangular parallelepiped. Since there is no need to set up a liquid injection tube 3 on the temperature balancing plate 1, the installation process of the liquid injection tube 3 is omitted, and the use of the liquid injection tube assembly is reduced, making the manufacture of the temperature balancing plate 1 simpler, improving production efficiency, and reducing production costs. At the same time, since there is no need to set up a liquid injection tube 3 on the body of the temperature balancing plate 1, there is no need to open a mounting groove 11 for installing the liquid injection tube 3 on the temperature balancing plate 1. When producing and processing the top plate 13 and the bottom plate 12, there is no need to add a grooving process, which improves processing efficiency and reduces processing difficulty. At the same time, the use of the original groove area can increase the heat conduction area of ​​the temperature balancing plate 1, so that the temperature balancing plate 1 has a better heat conduction effect.

[0030] Specifically, the materials of the top plate 13 and the bottom plate 12 are both copper plates. The top plate 13 is a flat plate, and a groove is provided on the inner side of the bottom plate 12. A cavity 14 is formed between the groove and the top plate 13. The top plate 13 is used to exchange heat with a cold source (such as a fan, a liquid cooling device), and the bottom plate 12 is used to exchange heat with a heat source (such as a server). Generally, when the bottom plate 12 is installed and fixed with the device to be cooled, it can be directly or indirectly in contact with the device to be cooled, with the bottom plate 12 side arranged downward and the top plate 13 side arranged upward.

[0031] The connection hole can be provided on the side wall of the groove, or the connection hole can be provided on the top plate 13. For example, when the connection hole is provided on the peripheral side wall of the bottom plate 12, the central axis of the heat pipe 2 after connection is parallel to the bottom plate 12. When the connection hole is provided on the top plate 13, the central axis of the heat pipe 2 after connection is perpendicular to the bottom plate 12. It is preferred that the connection hole is provided on the side wall of the groove.

[0032] like Figure 4 and Figure 5 As shown, in order to enhance the heat conduction and heat dissipation effect of the temperature equalizer 1, a capillary layer 16 and a copper column 15 may be provided in the cavity 14 of the temperature equalizer 1. The capillary layer 16 is provided on the inner wall of the top plate 13 and / or the bottom plate 12, and the two ends of the copper column 15 are respectively in contact with the top plate 13, the bottom plate 12 and the capillary layer 16. The capillary layer 16 may be provided only on the inner wall of the top plate 13 or the inner wall of the bottom plate 12, or may be provided on both the inner wall of the top plate 13 and the inner wall of the bottom plate 12. The capillary layer 16 may be, for example, a copper mesh.

[0033] When in use, the cooling medium in the temperature equalizing plate 1 exchanges heat with the heat source at the evaporation end (the side of the bottom plate 12), and after being heated and vaporized, it exchanges heat with the cold source at the condensation end (the side of the top plate 13) to be cooled and liquefied. The liquefied cooling medium flows back to the evaporation end through the capillary layer 16. In this way, the cooling medium continuously liquefies and vaporizes in a cycle in the cavity 14, taking away the heat of the heat source, thereby cooling the heat source.

[0034] like Figure 2 and Figure 3 As shown, an embodiment of the present application also provides a radiator, including a heat pipe 2 and the temperature equalizing plate 1 in the above embodiment, the evaporation end of the heat pipe 2 is connected to the connecting hole, and the condensation end of at least one heat pipe 2 serves as a liquid injection port 21 of the temperature equalizing plate 1.

[0035] Specifically, before the temperature equalizing plate 1 is filled with the cooling medium, the condensation end (the end away from the temperature equalizing plate 1) of the heat pipe 2 used as the liquid injection pipe 3 is not sealed. After the cooling medium is filled and the temperature equalizing plate 1 is evacuated, the heat pipe 2 is sealed. In order to facilitate the sealing operation of the heat pipe 2, the length of the liquid injection port 21 of the heat pipe 2 serving as the liquid injection pipe can be appropriately extended. In this embodiment, there is no obstacle at the end of the heat pipe 2 to be sealed, and the sealing operation will not be restricted by the space of other components, reducing the difficulty of sealing. In addition, the inner diameter of the heat pipe 2 is larger than the diameter of the traditional liquid injection pipe 3, which enhances the effect of evacuating the cavity 14 of the temperature equalizing plate 1, and makes it easier to extract the non-condensable gas in the cavity 14. The cross-sectional shape of the heat pipe 2 can be selected according to specific needs, such as Figure 2 As shown, the heat pipe 2 is connected to the side wall of the temperature equalizing plate 1. Since the thickness of the temperature equalizing plate 1 is relatively thin, in order to increase the cross-sectional area of ​​the heat pipe 2, the heat pipe 2 can be made into a rectangular cross-section. In other embodiments, heat pipe structures of other shapes such as a circular cross-section can also be selected. The heat pipe 2 can be made of oxygen-free copper, for example. The heat pipe 2 and the temperature equalizing plate 1 can be fixedly connected by welding.

[0036] Specifically, connection holes can be respectively provided on the side walls around the bottom plate 12, and each connection hole is respectively connected to a heat pipe 2, that is, heat pipes 2 are provided on all sides of the cavity 14. In the present embodiment, a plurality of connection holes are respectively provided on both sides in the length direction of the cavity 14, and each connection hole is respectively connected to a heat pipe 2. In the present embodiment, a plurality of heat pipes 2 are respectively provided on opposite sides of the cavity 14, and the number of heat pipes 2 can be comprehensively considered based on space, cost, and heat dissipation requirements. The more heat pipes 2 there are, the stronger the heat dissipation capacity of the radiator. In order to further improve the vacuuming effect of the cavity 14, one or more of the heat pipes 2 on the same side of the cavity 14 can be selected as the injection pipe 3, so that the heat pipes 2 on both sides of the cavity 14 can be used to vacuum the temperature equalizing plate 1 at the same time. Alternatively, the number and position of the heat pipes 2 used as the liquid injection pipes 3 (the heat pipes 2 used as the liquid injection pipes 3 are provided with the liquid injection ports 21, which are also used to evacuate the temperature homogenizing plate 1) can be selected according to the distance from the vacuum station of the vacuum equipment to form multiple vacuuming paths, thereby greatly shortening the time required for vacuuming and improving the vacuuming effect.

[0037] The heat sink of this embodiment further includes a heat sink (not shown) and a cold source (not shown), the heat sink is provided on the temperature averaging plate 1 and / or the heat pipe 2, and the cold source is used to exchange heat with the temperature averaging plate 1. The heat sink may be, for example, a heat sink fin, a fin, etc., and the cold source may be, for example, a fan, a cold plate, etc.

[0038] The temperature-averaging plate and radiator provided in the embodiment of the present application reduce the process of welding the injection tube required for conventional radiators, effectively reduce production costs, and improve production efficiency. Using the heat pipe as the injection tube effectively reduces the difficulty of sealing the injection tube, improves production efficiency and the reliability of the sealing. At the same time, the heat pipe with a large diameter is used to evacuate the temperature-averaging plate, which effectively improves the efficiency of vacuuming and enhances the effect of vacuuming. The installation of the injection tube is cancelled on the temperature-averaging plate, and the setting of the installation groove for installing the injection tube is cancelled, which reduces the processing difficulty of the temperature-averaging plate, increases the heat conduction area of ​​the temperature-averaging plate, and enhances the heat dissipation effect of the radiator. The above design can effectively improve the heat dissipation capacity of the radiator, avoid overheating of the heat dissipation device, and enable it to perform its performance stably. The temperature-averaging plate and radiator product structure of the embodiment of the present application are highly applicable, do not affect the original appearance of the product, and effectively improve the heat dissipation capacity without increasing the volume of the radiator.

[0039] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0040] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A temperature equalizing plate, characterized in that: It includes a top plate and a bottom plate, the top plate and the bottom plate are fixedly connected, and a cavity is formed between the top plate and the bottom plate, the cavity is used to fill with cooling medium and to form a vacuum environment; at least one connecting hole is provided on the top plate and / or the bottom plate, the connecting hole is connected to the cavity, the connecting hole is used to connect a heat pipe, and at least one of the heat pipes is used to inject liquid into the cavity.

2. The temperature equalizing plate according to claim 1, characterized in that: The top plate is a flat plate, the inner side of the bottom plate is provided with a groove, the cavity is formed between the groove and the top plate, the top plate is used for heat exchange with a cold source, and the bottom plate is used for heat exchange with a hot source.

3. The temperature equalizing plate according to claim 1, characterized in that: The top plate and the bottom plate are copper plates respectively.

4. The temperature equalizing plate according to claim 2, characterized in that: The connection hole is arranged on the side wall of the groove, or the connection hole is arranged on the top plate.

5. The temperature equalizing plate according to claim 1, characterized in that: It also includes a capillary layer and a copper column arranged in the cavity. The capillary layer is arranged on the inner wall of the top plate and / or the bottom plate. The two ends of the copper column are respectively in contact with the top plate, the bottom plate and the capillary layer.

6. A radiator, characterized in that: It comprises at least one heat pipe and a temperature homogenizing plate as described in any one of claims 1 to 5, wherein the evaporation end of the heat pipe is connected to the connection hole, and the condensation end of at least one of the heat pipes serves as a liquid injection port of the temperature homogenizing plate.

7. The heat sink according to claim 6, characterized in that: The connecting holes are respectively arranged on the side walls around the bottom plate, and each of the connecting holes is respectively connected to the heat pipe.

8. The heat sink according to claim 6, characterized in that: A plurality of connection holes are respectively arranged on both sides of the cavity in the length direction, and each of the connection holes is respectively connected to the heat pipe.

9. The heat sink according to claim 6, characterized in that: At least one of the heat pipes located on the same side of the cavity in the length direction serves as a liquid injection pipe.

10. The radiator according to any one of claims 6 to 9, characterized in that: It also includes a heat sink and a cold source. The heat sink is arranged on the temperature averaging plate and / or the heat pipe, and the cold source is used for exchanging heat with the temperature averaging plate.

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