3D VC radiator and preparation method thereof

Abstract

The invention relates to the technical field of radiators, in particular to a 3D VC radiator and a preparation method thereof.The 3D VC radiator comprises a shell composed of a VC upper cover and a VC lower cover; wherein the VC upper cover is provided with a heat dissipation surface, a plurality of hollow columnar bodies which are uniformly distributed are formed on the heat dissipation surface, the columnar bodies increase the heat dissipation area and replace a supporting structure in the shell, the VC upper cover and the VC lower cover are both made of oxygen-free high-thermal-conductivity copper, the columnar bodies are rhombic or in other preset geometrical shapes, and the VC lower cover is made of oxygen-free high-thermal-conductivity copper. The inner surface of the VC upper cover and the inner surface of the VC lower cover are provided with capillary structures, the inner side of the VC upper cover is provided with a plurality of rhombic, hexagonal or concentric circular columnar body arrays which are evenly distributed, the actually available heat dissipation area is increased, the heat dissipation fins serve as heat dissipation fins to increase the surface area, a traditional supporting structure is replaced, and the heat dissipation efficiency is improved. Double optimization of heat dissipation and mechanical strength is achieved, the internal structure is simplified, the columnar body and the upper cover are manufactured into a whole through precision machining, a welding interface is eliminated, and thermal resistance is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of heat sinks, and specifically to a 3D VC heat sink and a preparation method thereof. Background Art

[0002] Traditional heat dissipation solutions (such as aluminum extruded heat sinks, 2D heat spreader + heat pipe combination) usually use a multi-component welding structure to connect the heat pipe, heat spreader and fins through solder paste or brazing process. The thermal conductivity of the welding layer is low, and the multi-layer welding interface forms a thermal resistance bottleneck, resulting in a decrease in heat transfer efficiency. In addition, the welding point is prone to fatigue cracks under high-temperature thermal cycles, causing thermal contact failure and even causing the overall structure of the heat sink to loosen. The traditional 2D heat spreader relies on planar heat diffusion and is difficult to meet the needs of high-power density equipment for three-dimensional heat dissipation.

[0003] In order to optimize the heat dissipation effect, the heat conduction path is optimized through integrated structural design, and the integration of the heat pipe and the upper cover is achieved through diffusion welding to reduce the interface thermal resistance. However, there are still the following shortcomings: the combination of the heat pipe and the temperature spreader relies on a single heat conduction path, which makes it difficult to achieve efficient and uniform heat distribution in three-dimensional space; additional copper columns or copper powder columns are required to enhance the shell's pressure resistance, which increases the process complexity and material cost; the capillary structure of the heat pipe and the temperature spreader needs to be prepared step by step, and the interface compatibility may affect the working fluid reflux efficiency. Summary of the invention

[0004] The technical problem to be solved by the present application is to overcome the existing defects and provide a 3D VC heat sink and a preparation method thereof, which can effectively solve the problems in the background technology.

[0005] To achieve the above-mentioned purpose, the present application provides the following technical solutions: a 3D VC heat sink, comprising a shell composed of a VC upper cover and a VC lower cover; wherein the VC upper cover has a heat dissipation surface, the heat dissipation surface is a planar structure, and a reserved hole is provided on its outer side, and a plurality of evenly distributed hollow columns are provided on the inner side of the heat dissipation surface, the reserved holes are arranged corresponding to the hollow columns, and the middle position of the VC lower cover is a protruding cavity box for accommodating the heat dissipation component.

[0006] As a preferred technical solution of the present application, the columnar body is divided into a four-sided column and a middle column. The length of the middle column is longer than that of the four-sided column, and the middle column corresponds to the cavity box protruding from the VC lower cover.

[0007] As a preferred technical solution of the present application, the VC upper cover and the VC lower cover are both made of oxygen-free high thermal conductivity copper.

[0008] As a preferred technical solution of the present application, the shape of the columnar body is a rhombus, a hexagon or other predetermined geometric shapes.

[0009] As a preferred technical solution of the present application, the inner surfaces of the VC upper cover and the VC lower cover have a capillary structure.

[0010] A method for preparing a 3D VC heat sink comprises the following steps: S1: Align the VC upper cover and the VC lower cover, and align the middle column with the protruding cavity box of the VC lower cover; S2: Connecting the VC upper cover and the VC lower cover in S1 to form a sealed housing; S3: Evacuate the interior of the sealed housing formed by the VC upper cover and the VC lower cover, inject working fluid, and finally perform a sealing test.

[0011] As a preferred technical solution of the present application, before connecting the VC upper cover and the VC lower cover, a step of forming a capillary structure on the inner surface of the VC upper cover and / or the VC lower cover is also included.

[0012] As a preferred technical solution of the present application, the step of forming the capillary structure includes sintering the inner surface of the VC upper cover and / or the VC lower cover.

[0013] As a preferred technical solution of the present application, the step of connecting the VC upper cover and the VC lower cover is to fix them by welding.

[0014] As a preferred technical solution of the present application, the VC upper cover and the VC lower cover form a sealed shell with a pressure of 10 -3 Pa-10 -5 Pa.

[0015] Compared with the prior art: the present application increases the actual available heat dissipation area by setting a plurality of evenly distributed diamond-shaped, hexagonal or concentric circular columnar arrays on the inner side of the VC upper cover, which not only increases the surface area as a heat dissipation fin, but also adopts an integrated columnar design without the need for an additional supporting structure or a traditional supporting structure, thereby achieving dual optimization of heat dissipation and mechanical strength, simplifying the internal structure, and integrating the columnar body and the upper cover through precision machining to eliminate the welding interface and reduce thermal resistance. The columnar body height and capillary structure density are differentiatedly designed according to the heat source distribution (such as the middle column corresponding to the CPU) to achieve efficient heat conduction from the center to the edge; the protruding cavity box of the VC lower cover directly contacts the heat source with the middle column to form a directional heat conduction channel, which significantly improves the heat dissipation stability under high load, and the protruding cavity box in the middle position of the VC lower cover is suitable for heat dissipation of high-power electronic components such as the CPU, which helps to maintain the stability and durability of the radiator under high load conditions. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is an illustration of the structure of this application Figure 1 ; Figure 2 This is the main view of this application; Figure 3 This is an illustration of the structure of this application Figure 2 ; Figure 4 It is a VC upper cover diagram with a diamond-shaped column; Figure 5 It is a VC cover diagram with a hexagonal prism; Figure 6 It is a VC cover diagram with a cylindrical body.

[0017] In the figure: 1. VC upper cover, 2. VC lower cover, 3. reserved hole, 4. columnar body, 41. four-sided column, 42. middle column, 5. cavity box. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application (for the convenience of description and understanding, the following is Figure 2 All other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0019] See also Figure 1-3 The present application provides a technical solution: a 3D VC heat sink, comprising a shell consisting of a VC upper cover 1 and a VC lower cover 2; wherein the VC upper cover 1 has a heat dissipation surface, and the heat dissipation surface is a planar structure.

[0020] The planar heat dissipation surface of the VC upper cover 1 can quickly absorb and conduct the heat generated inside the electronic device. Since the oxygen-free high thermal conductivity copper material is used, the heat dissipation surface has extremely high thermal conductivity efficiency.

[0021] A reserved hole 3 is arranged on the outer side thereof, and a plurality of evenly distributed hollow columnar bodies 4 are arranged on the inner side of the heat dissipation surface. The reserved holes 3 are arranged corresponding to the hollow columnar bodies 4 .

[0022] The multiple evenly distributed hollow columns 4 on the inner side of the VC cover 1 effectively increase the heat dissipation area, optimize the heat diffusion path, so that the heat can be transferred from the heat source to the heat dissipation surface more quickly, and the heat diffusion to the surrounding environment can be accelerated by the increased surface area.

[0023] More specifically, the columnar body 4 is in the shape of a rhombus, a hexagon or other predetermined geometric shapes.

[0024] By adopting a diamond, hexagon or other predetermined geometric shapes, the heat dissipation area can be increased, which helps to further improve the heat dissipation efficiency, thereby optimizing the overall heat dissipation performance.

[0025] Specifically, the columnar body 4 is used to increase the heat dissipation area and replace the supporting structure inside the shell.

[0026] Since traditional radiators usually require complex internal support structures to ensure their strength and stability, the columnar body 4 in the present application can not only serve as a heat dissipation element, but also play a supporting role, reducing the need for additional support structures.

[0027] The traditional heat sink has more welding points due to the welding of multiple units, which increases the thermal resistance of the overall product and affects the heat dissipation efficiency. The columnar body 4 can reduce the welding requirements, reduce the thermal resistance and improve the heat dissipation efficiency.

[0028] The middle of the VC lower cover 2 is a protruding cavity box 5 .

[0029] The cavity box 5 is used to place the CPU, which is arranged corresponding to the middle column 42. The middle column 42 is in direct contact with the CPU, ensuring that heat can be directly and efficiently conducted from the heat source to the core area of ​​the radiator, thereby improving the heat dissipation effect, helping to maintain the overall stability and durability of the radiator in high-power applications, and ensuring the normal operation of the CPU under high-load heat dissipation intensity.

[0030] Furthermore, the columnar body 4 is divided into a quadrilateral column 41 and a middle column 42 . The length of the middle column 42 is longer than that of the quadrilateral column 41 , and the middle column 42 corresponds to the cavity box 5 protruding from the VC lower cover 2 .

[0031] The four-sided columns 41 in the columnar body 4 are evenly distributed around the inner side of the VC upper cover 1 , mainly used to increase the overall heat dissipation area, ensuring that heat can be evenly transferred from the heat source to the entire heat dissipation surface and quickly dissipated through these columns 4 .

[0032] The middle column 42 is located at the center of the four-sided column 41, and its length is higher than the four-sided column 41. This height difference is for better correspondence with the CPU in the protruding cavity box 5 on the VC lower cover 2, so as to achieve more efficient heat conduction, so that heat can be quickly concentrated and conducted from the heat source to the area, further improving the heat diffusion efficiency.

[0033] Furthermore, the VC upper cover 1 and the VC lower cover 2 are both made of oxygen-free copper with high thermal conductivity.

[0034] Oxygen High Thermal Conductivity Copper has excellent thermal conductivity and can conduct heat from one point to another quickly and efficiently.

[0035] Furthermore, the inner surfaces of the VC upper cover 1 and the VC lower cover 2 have a capillary structure.

[0036] The capillary structure in the VC upper cover 1 and the VC lower cover 2 refers to tiny grooves or holes formed on the surface of the material. This microstructure can promote the circulation of liquid through capillary action (that is, the phenomenon that liquid automatically rises in small pipes). A porous capillary layer is formed by sintering copper powder. In the 3D VC radiator, this structure helps the coolant move more efficiently inside, thereby improving the overall heat dissipation performance.

[0037] Due to the existence of the capillary structure, the coolant can be distributed over a wider area and can absorb and release heat faster, allowing the heat to be quickly transferred from the heat source to the entire radiator and then dissipated, greatly improving the heat conduction efficiency. Embodiment 1

[0038] refer to Figure 4 This embodiment provides a 3D VC heat sink, including a shell composed of a VC upper cover 1 and a VC lower cover 2. The VC upper cover 1 has a heat dissipation surface, and a plurality of evenly distributed diamond-shaped hollow columns 4 are formed on the heat dissipation surface. These columns 4 not only increase the heat dissipation area, but also replace the supporting structure inside the shell, simplifying the internal structure.

[0039] The housing of this embodiment is made of oxygen-free high thermal conductivity copper, which has excellent thermal conductivity. The inner surfaces of the VC upper cover 1 and the VC lower cover 2 both have a capillary structure formed by sintering, which helps the circulation of the working fluid.

[0040] During the manufacturing process, firstly, a VC upper cover 1 and a corresponding VC lower cover 2 having a heat dissipation surface forming a plurality of evenly distributed rhombus-shaped hollow columns 4 are provided, then, a capillary structure is formed on the inner surfaces of the VC upper cover 1 and the VC lower cover 2 by sintering treatment, then, the VC upper cover 1 and the VC lower cover 2 are connected by welding to form a sealed shell, and finally, the interior of the shell is evacuated, a working fluid such as pure water is injected, and finally a sealing test is performed.

[0041] This 3D VC heat sink has a simple structure, high heat dissipation efficiency, and a mature and reliable manufacturing process. Embodiment 2

[0042] refer to Figure 5 This embodiment provides an improved 3D VC heat sink. Compared with the first embodiment, a plurality of equally distributed hexagonal hollow columns 4 are formed on the heat dissipation surface of this embodiment. This structure provides a larger heat dissipation area and a more uniform support force distribution.

[0043] Similarly, the shell of this embodiment is also made of oxygen-free high thermal conductivity copper. The difference is that the inner surfaces of the VC upper cover 1 and the VC lower cover 2 have a capillary structure formed by chemical corrosion. The capillary structure formed by this method is more delicate and uniform.

[0044] During the manufacturing process, firstly, a VC upper cover 1 and a VC lower cover 2 having a heat dissipation surface forming a plurality of evenly distributed hexagonal hollow columns 4 are provided, then, a capillary structure is formed on the inner surfaces of the VC upper cover 1 and the VC lower cover 2 by a chemical etching method, then, the VC upper cover 1 and the VC lower cover 2 are connected by electron beam welding to form a sealed shell, and finally, the interior of the shell is evacuated through a tiny filling port, a working fluid such as alcohol is injected, and a laser sealing test is performed.

[0045] The heat sink of this embodiment performs excellently in high-power heat dissipation applications of electronic equipment and is particularly suitable for situations where space is limited. Embodiment 3

[0046] refer to Figure 6 This embodiment provides a 3D VC heat sink suitable for high-power electronic devices. A plurality of evenly distributed concentric circular columns 4 are formed on the heat dissipation surface of this embodiment. This design allows heat to be evenly diffused from the center to the surroundings.

[0047] The shell of this embodiment is also made of oxygen-free high thermal conductivity copper, but the surface of the copper material is silver-plated to further improve the thermal conductivity. The inner surfaces of the VC upper cover 1 and the VC lower cover 2 have a fine capillary structure grid formed by laser micromachining.

[0048] In the manufacturing process, firstly, cold forging is used to manufacture the VC upper cover 1 and the corresponding VC lower cover 2 with concentric circular hollow columnar bodies 4. Then, laser micromachining technology is used to form a capillary structure grid on the inner surface of the VC upper cover 1 and the VC lower cover 2. Next, vacuum brazing technology is used to connect the VC upper cover 1 and the VC lower cover 2 to form a shell. Finally, a special filling system is used to extract a high vacuum of less than 10 -5 Pa, injecting the degassed working fluid nanofluid and passing the mechanical compression sealing test.

[0049] The 3D VC heat sink of this embodiment has extremely high heat conduction efficiency and can meet the heat dissipation requirements of high-performance computing systems, high-power LED lamps and new energy vehicle electronic components.

[0050] The above three embodiments demonstrate different designs and manufacturing methods of the 3D VC heat sink in different application scenarios. A suitable implementation scheme can be selected according to actual needs. The shape is not limited to the above three embodiments and can be improved according to actual needs.

[0051] Although the embodiments of the present application have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A 3D VC heat sink, comprising a shell consisting of a VC upper cover (1) and a VC lower cover (2); wherein the VC upper cover (1) has a heat dissipation surface, the heat dissipation surface is a planar structure, and a reserved hole (3) is provided on the outer side thereof, characterized in that: A plurality of evenly distributed hollow columns (4) are provided on the inner side of the heat dissipation surface, the reserved holes (3) are arranged corresponding to the hollow columns (4), and the middle portion of the VC lower cover (2) is a protruding cavity box (5) for accommodating the heat dissipation component.

2. The 3D VC heat sink according to claim 1, characterized in that: The columnar body (4) is divided into a four-sided column (41) and a middle column (42); the middle column (42) is longer than the four-sided column (41), and the middle column (42) corresponds to the cavity box (5) protruding from the VC lower cover (2).

3. A 3D VC heat sink according to claim 1 or 2, characterized in that: The VC upper cover (1) and the VC lower cover (2) are both made of oxygen-free high-thermal conductivity copper.

4. The 3D VC heat sink according to claim 2, characterized in that: The shape of the column (4) is a rhombus, a hexagon or other predetermined geometric shapes.

5. The 3D VC heat sink according to claim 1, characterized in that: The inner surfaces of the VC upper cover (1) and the VC lower cover (2) have a capillary structure.

6. A method for preparing a 3D VC heat sink, characterized in that: The preparation of the 3DVC heat sink according to any one of claims 1 to 5 comprises the following steps: S1: Align the VC upper cover (1) and the VC lower cover (2), and align the middle column (42) with the protruding cavity box (5) of the VC lower cover (2); S2: Connecting the VC upper cover (1) and the VC lower cover (2) in S1 to form a sealed housing; S3: evacuating the interior of the sealed housing formed by the VC upper cover (1) and the VC lower cover (2), injecting working fluid, and finally conducting a sealing test.

7. The method for preparing a 3D VC heat sink according to claim 6, characterized in that: Before the VC upper cover (1) and the VC lower cover (2) are connected, a step of forming a capillary structure on the inner surface of the VC upper cover (1) and / or the VC lower cover (2) is also included.

8. The method for preparing a 3D VC heat sink according to claim 7, characterized in that: The step of forming the capillary structure comprises sintering the inner surface of the VC upper cover (1) and / or the VC lower cover (2).

9. The method for preparing a 3D VC heat sink according to claim 6, characterized in that: The step of connecting the VC upper cover (1) and the VC lower cover (2) is to fix them by welding.

10. The method for preparing a 3D VC heat sink according to claim 6, characterized in that: The VC upper cover (1) and the VC lower cover (2) form a sealed housing with a pressure of 10 -3 Pa-10 -5 Pa.

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