Module testing device
By building multiple array-distributed temperature sensors in the module test device, the problem of the existing heating test environment being easily disturbed is solved, and more accurate and stable temperature measurement is achieved, improving the overall quality of the test.
Patent Information
- Application Number
- CN202510107405.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-23
- Publication Date
- 2025-06-06
AI Technical Summary
The existing heating test environment is susceptible to random factors, which leads to high fluctuations in the thermal environment electrical test results of the power module.
A module testing device is designed with built-in temperature sensors distributed in multiple arrays. One end of the sensor is exposed to the preset position of the module to be tested to ensure uniform contact and accurate measurement.
With the built-in array temperature sensor, external interference is reduced, the accuracy and stability of the test are improved, and the temperature measurement of the module under test is accurate.
Smart Images
Figure CN120103093A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the technical field of semiconductor device testing, and more particularly, to a module testing device. Background Art
[0002] With the rapid development of semiconductor technology, power modules are increasingly used in electronic devices, and their performance and reliability have become key factors in the design of electronic systems. Power modules generate a lot of heat during operation. If the heat is not dissipated in a timely and effective manner, the temperature of the power module will rise, affecting its performance and life, and may even cause equipment failure. Therefore, power modules generally need to be electrically tested under heating conditions during the testing phase, and their performance and reliability under high temperature conditions are evaluated based on the obtained thermal test characteristic parameters, which has become an indispensable part of semiconductor device testing.
[0003] At present, the commonly used heating device for heating test includes a fixed heating bench, which performs electrical testing when heated to a certain temperature. This fixed heating bench is generally open, and the heating bench can confirm its own temperature by itself. However, when confirming the temperature of the power module under test, an additional temperature testing instrument is required. The position of each temperature measurement may be different, which increases the variables of the test. In addition, if the contact between the power module under test and the heating bench is poor, it will also interfere with the test. In summary, the currently commonly used heating test environment may be more likely to be interfered with by random factors, which will cause large random fluctuations in the thermal environment electrical test results of the power module. Summary of the invention
[0004] In view of the above problems, the purpose of the present disclosure is to provide a module testing device, which obtains accurate temperature data by contacting a built-in temperature sensor with a preset position of a module under test, reduces external interference, and improves test accuracy.
[0005] A module testing device provided according to an embodiment of the present disclosure includes:
[0006] A heating unit having a bearing surface; and
[0007] a temperature sensor, one end of which is exposed to the bearing surface and the other end of which extends in the heating unit along the thickness direction of the heating unit,
[0008] There are multiple temperature sensors distributed in an array, and one end of the temperature sensor exposed to the carrying surface can be evenly contacted with a preset position of the module under test, and the module includes a die and / or a chip.
[0009] Optionally, a display unit is further included, for displaying the temperature measured by the temperature sensor.
[0010] Optionally, a clamping portion is further included for fixing the module under test on the bearing surface.
[0011] Optionally, the clamping portion is in an inverted "L" shape and is fixed on both sides of the heating unit.
[0012] Optionally, the bearing surface has a plurality of grooves for accommodating a heat dissipation portion of the module under test, and the grooves can fit tightly with the heat dissipation portion.
[0013] Optionally, there are multiple temperature sensors, and the grooves and the temperature sensors are arranged alternately.
[0014] Optionally, one end of the temperature sensor exposed to the carrying surface is not in contact with the heating unit.
[0015] Optionally, the position of the temperature sensor may be changed according to a preset position of the module under test.
[0016] Optionally, it also includes:
[0017] a testing unit, used for testing the module located on the carrying surface; and
[0018] A substrate, wherein the heating unit is located on the substrate.
[0019] Optionally, the temperature sensor passes through the heating unit and extends into the substrate.
[0020] Optionally, the display unit is disposed in the substrate and is electrically connected to the temperature sensor via a wire.
[0021] The display screen of the display unit is exposed outside the substrate.
[0022] Optionally, a temperature control unit is further included to control the temperature of the heating unit.
[0023] Optionally, the temperature control unit is disposed in the substrate, and a control interface of the temperature control unit is exposed outside the substrate.
[0024] One of the above technical solutions has the following beneficial effects:
[0025] By building multiple temperature sensors arranged in an array into the heating unit and exposing one end of each temperature sensor on the supporting surface of the module under test, so that they can evenly contact the preset position of the module under test, during the heating test of the module, the array temperature sensor can evenly and accurately measure the temperature at the preset position of the module, thereby reducing external interference and improving the accuracy of the test.
[0026] In some embodiments, the temperature measured by the temperature sensor is displayed through a display unit, so that the tester can easily grasp the current temperature of the module under test in real time and perform corresponding operations.
[0027] In some embodiments, the module under test is fixed on the carrying surface of the heating unit by an inverted "L"-shaped clamping portion, so that the module under test and the carrying surface are fully fitted. Compared with the adsorption-type fixation method on the plane angle limit, the vertical fixing of the module by the clamping portion is more stable. The full fit between the module under test and the carrying surface can improve the heating efficiency of the module. At the same time, it also ensures the full fit between the temperature sensor and the module under test, thereby improving the accuracy of temperature measurement.
[0028] In some embodiments, the bearing surface has a plurality of grooves for accommodating the heat dissipation part of the module under test, such as a pin-shaped heat dissipation part (Pin-Fin), so that the shape of the heating unit and the module under test is more matched, ensuring that the surface of the module under test is fully fitted with the bearing surface of the heating unit and the temperature sensor. At the same time, by matching the groove with the heat dissipation part of the module under test, it can also assist in limiting and fixing the module under test.
[0029] Furthermore, since the groove is in close contact with the heat dissipation part, the heating unit can also heat the heat dissipation part, and the heat dissipation part transfers the heat back to the inside of the module under test to heat the module under test, thereby increasing the heating area of the test device for the entire module under test and improving the heating speed.
[0030] It should be noted that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS
[0031] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings of the embodiments will be briefly introduced below. Obviously, the drawings in the following description only relate to some embodiments of the present disclosure, rather than limiting the present disclosure.
[0032] Figure 1 A schematic diagram of the three-dimensional structure when a module under test is placed on the module testing device in an embodiment of the present disclosure is shown.
[0033] Figure 2 Shown along Figure 1 Cross-sectional view taken along line AA.
[0034] Figure 3 A schematic diagram of the three-dimensional structure of the module testing device in the embodiment of the present disclosure when no module to be tested is placed on the device is shown.
[0035] Figure 4 A schematic diagram of the first angle explosion structure of the module testing device in an embodiment of the present disclosure is shown.
[0036] Figure 5 A schematic diagram of the exploded structure at a second angle of the module testing device in an embodiment of the present disclosure is shown.
[0037] Figure 6 Shows Figure 2 Schematic diagram of the connection between the module under test and the test unit. DETAILED DESCRIPTION
[0038] The present disclosure will be described in more detail below with reference to the accompanying drawings. In each of the drawings, the same elements are represented by similar reference numerals. For the sake of clarity, the various parts in the drawings are not drawn to scale. In addition, some well-known parts may not be shown. For the sake of simplicity, the semiconductor structure obtained after several steps can be described in one figure.
[0039] It should be understood that when describing the structure of a device, when a layer or a region is referred to as being "on" or "over" another layer or another region, it may mean that it is directly on the other layer or another region, or that other layers or regions are included between it and the other layer or another region. Furthermore, if the device is turned over, the layer or a region will be "below" or "beneath" another layer or another region.
[0040] If the purpose is to describe the situation of being directly on another layer or another area, this article will use expressions such as "directly on..." or "on... and adjacent to...".
[0041] Many specific details of the present disclosure are described below, such as device structure, materials, dimensions, processing technology and techniques, so as to more clearly understand the present disclosure. However, as those skilled in the art will appreciate, the present disclosure may not be implemented in accordance with these specific details.
[0042] Figure 1 FIG. 1 shows a schematic diagram of a three-dimensional structure when a module under test is placed on a module testing device in an embodiment of the present disclosure. Figure 2 Shown along Figure 1 The cross-section taken along line AA. Figure 3 FIG. 1 shows a schematic diagram of a three-dimensional structure of a module testing device in an embodiment of the present disclosure when no module to be tested is placed on the module testing device. Figure 4 A schematic diagram of the exploded structure of the module testing device in the embodiment of the present disclosure is shown at a first angle. Figure 5 A schematic diagram of the exploded structure of the module testing device in the embodiment of the present disclosure is shown in FIG. Figure 6 Shows Figure 2 Schematic diagram of the connection between the module under test and the test unit, wherein the X-axis, Y-axis and Z-axis represent the length direction, width direction and thickness direction of the module under test or the heating unit respectively.
[0043] See also Figures 1 to 3 , the module under test 100 in the embodiment of the present disclosure is, for example, a power module, including a main body 110, a plurality of signal terminals 120, a needle-shaped piece 130 and a heat dissipation portion 140. Among them, the main body 110 is roughly a rectangular parallelepiped structure, and has a first surface and a second surface opposite to each other along the Z-axis direction. The needle-shaped piece 130 is distributed on the first surface of the main body 110, and the heat dissipation portion 140 is distributed on the second surface of the main body 110, wherein the heat dissipation portion 140 can be needle-shaped or can be other shapes. Along the Y-axis direction, a plurality of signal terminals 120 are distributed on both sides of the main body 110. The main body 110 includes a substrate, a plurality of dies (Die) and / or chips (Chip), a connection circuit between a plurality of dies / chips and the substrate and the signal terminals 120, and a packaging material. However, the power module 100 in the embodiment of the present disclosure can also be replaced by other modules that need to be electrically tested under heating conditions.
[0044] See also Figures 1 to 6 The module testing device in the embodiment of the present disclosure includes: a substrate 210, a heating unit 220, a temperature sensor 230, a clamping portion 240, a display unit 211, a temperature control unit 212 and a testing unit 250. The heating unit 220 includes a first heating unit 221 and a second heating unit 222, and the first heating unit 221 and the second heating unit 222 can be an integrated structure or a separate structure.
[0045] The first heating unit 221 is located on the substrate 210, and the second heating unit 222 is located on the first heating unit 221. The upper surface of the second heating unit 222 is a bearing surface for bearing the module under test 100, and the bearing surface has a plurality of grooves 201. When the module under test 100 is placed on the bearing surface, the second surface of the main body 110 of the module under test 100 contacts the bearing surface, and the heat dissipation portion 140 is accommodated in the groove 201. Optionally, the shape of the groove 201 matches the shape of the heat dissipation portion 140, so that the groove 201 and the heat dissipation portion 140 can be closely contacted and fitted. The heating unit 220 not only heats the main body 110 of the module under test 100 through the bearing surface, but also heats the heat dissipation portion 140 through the inner surface of the groove 201. The heat dissipation portion 140 transfers the heat back to the inside of the main body 110 of the module under test 100, thereby increasing the heating area of the test device for the entire module under test 100 and improving the heating speed.
[0046] In this embodiment, along the X-axis and Y-axis directions, the size of the substrate 210 is larger than the size of the first heating unit 221, and at least along the X-axis direction, the size of the first heating unit 221 is larger than the size of the second heating unit 222, so that the first heating unit 221 and the second heating unit 222 are stepped. The clamping portion 240 is in an inverted "L" shape, and is arranged on both sides of the first heating unit 221 along the X-axis direction, wherein one side of the inverted "L" shape is located on the step surface of the second heating unit 222, and the other side is located above the first heating unit 221, and has a preset distance from the bearing surface, and the preset distance can be adjusted according to the thickness of the module under test 100.
[0047] In some embodiments, the clamping portion 240 can move along the heating unit 221 to accommodate the modules under test 100 of different lengths or widths. For example, the clamping portion 240 and the heating unit 221 are connected to each other in a relatively slidable manner, and a guide rail can be provided on the heating unit 221, and the clamping portion 240 is provided on the guide rail. The clamping portion 240 can slide along the guide rail, and a locking portion can be provided between the clamping portion 240 and the heating unit 221. When the clamping portion 240 slides to a position for clamping the module under test 100, the clamping portion 240 is locked by the locking portion, so that the clamping portion 240 can fix the module under test 100.
[0048] In some embodiments, the clamping portion 240 may be a height-adjustable component to accommodate different thicknesses of the tested modules 100. The clamping portion 240 may be adjusted up and down and locked, thereby clamping the tested modules 100 of different thicknesses.
[0049] The temperature sensor 230 may be needle-shaped, with one end exposed to the bearing surface and the other end extending in the heating unit 220 along the Z-axis direction. In some specific embodiments, the temperature sensor 230 penetrates the heating unit 220 and extends into the substrate 210, wherein the first heating unit 221 and the second heating unit 222 both have a through hole 202, and the substrate 210 has a groove 203, and the through hole 202 and the groove 203 are both used to accommodate the temperature sensor 230. There are multiple temperature sensors 230, which are distributed in an array and are evenly contacted with the module 100, and the temperature of each position of the module 100 can be evenly measured, so that the measurement result is more accurate, the temperature of the module 100 is ensured to be uniform, and the accuracy of the test is improved. Among them, the groove 202 and the temperature sensor 230 are arranged in an alternating manner. Optionally, the temperature sensor 230 is a micro thermocouple probe or a surface thermocouple probe. In some other embodiments, the extension length of the temperature sensor 230 can be set as needed, for example, it only extends to the first heating unit 221.
[0050] In some preferred embodiments, one end of the temperature sensor 230 is flush with the bearing surface to ensure contact with the module under test 100 while providing a flat bearing surface.
[0051] In some optional embodiments, the size of the through hole 202 near the bearing surface is larger than the size of the temperature sensor 230, so that the end of the temperature sensor 230 exposed to the bearing surface does not contact the heating unit 220, thereby reducing the influence of the heating unit 220 on the temperature measurement result.
[0052] In some optional embodiments, the inner wall of the through hole 202 for accommodating the temperature sensor 230 may also be provided with a heat-insulating material, which isolates the heating unit 220 from the temperature sensor 230, so that the heat of the heating unit 220 cannot be transferred to the temperature sensor 230, thereby reducing the influence of the heating unit 220 on the temperature measurement result.
[0053] In some optional embodiments, the temperature sensor 230 is detachable or its position can be changed according to the position of the module under test 100 where the temperature needs to be measured. For example, the temperature sensor 230 is concentrated in the central area and / or edge area of the module under test 100.
[0054] The display unit 211 is disposed in the substrate 210, and is electrically connected to the temperature sensor 230 through a wire, and its display screen is exposed outside the substrate 210, and is used to display the temperature measured by each temperature sensor 230. This facilitates the tester to grasp the current temperature of the module under test 100 in real time and make corresponding operations.
[0055] The temperature control unit 212 is disposed in the substrate 210, and the control interface of the temperature control unit 212 is exposed on the outside of the substrate 210. The temperature control unit 212 is electrically connected to the temperature sensor 230, and can be used to control the temperature of the heating unit 220, that is, to perform heating or power-off operations according to the feedback of the temperature sensor 230. In the case of automatic testing, a main control unit 260 can also be provided in the test device, and the temperature data obtained by the temperature sensor 230 is fed back to the main control unit 260, and the main control unit 260 responds according to the temperature data, for example, controlling the test unit 250 to perform testing or controlling the temperature control unit 212 to perform heating or cooling operations.
[0056] During the test phase, the module under test 100 is placed on the carrying surface of the heating unit 220 and fixed with the clamping part 240, and the temperature of the heating unit 220 is adjusted by the temperature control unit 212. The end of the temperature sensor 230 exposed to the carrying surface contacts the preset position of the module under test 100, and the temperature of the module under test 100 is fed back to the display unit 211. When the temperature of the module 100 reaches the preset value, the probe in the test unit 250 is connected to the needle sheet 130 and the signal terminal 120, and the needle sheet 130 and the signal terminal 120 are connected to each target die / chip through the package conductive circuit. The electrical test needs to select multiple needle sheets 130 and / or signal terminals 120 for measurement at the same time according to the electrical function requirements.
[0057] One of the above technical solutions has the following beneficial effects:
[0058] By building multiple temperature sensors arranged in an array into the heating unit and exposing one end of each temperature sensor on the supporting surface of the module under test, so that they can evenly contact the preset position of the module under test, during the heating test of the module, the array temperature sensor can evenly and accurately measure the temperature at the preset position of the module, thereby reducing external interference and improving the accuracy of the test.
[0059] In some embodiments, the temperature measured by the temperature sensor is displayed through a display unit, so that the tester can easily grasp the current temperature of the module under test in real time and perform corresponding operations.
[0060] In some embodiments, the module under test is fixed on the carrying surface of the heating unit by an inverted "L"-shaped clamping portion, so that the module under test and the carrying surface are fully fitted. Compared with the adsorption-type fixation method on the plane angle limit, the vertical fixing of the module by the clamping portion is more stable. The full fit between the module under test and the carrying surface can improve the heating efficiency of the module. At the same time, it also ensures the full fit between the temperature sensor and the module under test, thereby improving the accuracy of temperature measurement.
[0061] In some embodiments, the bearing surface has a plurality of grooves for accommodating the heat dissipation part of the module under test, such as a pin-shaped heat dissipation part (Pin-Fin), so that the shape of the heating unit and the module under test is more matched, ensuring that the surface of the module under test is fully fitted with the bearing surface of the heating unit and the temperature sensor. At the same time, by matching the groove with the heat dissipation part of the module under test, it can also assist in limiting and fixing the module under test.
[0062] Furthermore, since the groove is in close contact with the heat dissipation part, the heating unit can also heat the heat dissipation part, and the heat dissipation part transfers the heat back to the inside of the module under test to heat the module under test, thereby increasing the heating area of the test device for the entire module under test and improving the heating speed.
[0063] The embodiments of the present disclosure are described above. However, these embodiments are for illustrative purposes only and are not intended to limit the scope of the present disclosure. The scope of the present disclosure is defined by the appended claims and their equivalents. Without departing from the scope of the present disclosure, a person skilled in the art may make a variety of substitutions and modifications, which should all fall within the scope of the present disclosure.
Claims
1. A module testing device, comprising: A heating unit having a bearing surface; as well as a temperature sensor, one end of which is exposed to the bearing surface and the other end of which extends in the heating unit along the thickness direction of the heating unit, There are multiple temperature sensors distributed in an array, and one end of the temperature sensor exposed to the carrying surface can be evenly contacted with a preset position of the module under test. 2 . The module testing device according to claim 1 , further comprising a clamping portion for fixing the module under test on the bearing surface.
3. The module testing device according to claim 2, wherein: The clamping portion is in an inverted "L" shape and is arranged on both sides of the heating unit.
4. The module testing device according to claim 1, wherein: The bearing surface has a plurality of grooves for accommodating the heat dissipation part of the module under test, and the grooves can be closely fitted with the heat dissipation part.
5. The module testing device according to claim 4, wherein: The plurality of temperature sensors are arranged alternately with the plurality of grooves.
6. The module testing device according to claim 1, wherein: One end of the temperature sensor exposed to the carrying surface is not in contact with the heating unit.
7. The module testing device according to claim 1, wherein: The position of the temperature sensor can be changed according to the preset position of the module under test.
8. The module testing device according to any one of claims 1 to 7, further comprising: A testing unit, used for testing the module located on the carrying surface; as well as a substrate, the heating unit being located on the substrate, Wherein, the temperature sensor passes through the heating unit and extends into the substrate.
9. The module testing device according to claim 8, further comprising a display unit, which is disposed in the substrate and is electrically connected to the temperature sensor through a wire. in, The display screen of the display unit is exposed outside the substrate.
10. The module testing device according to claim 8, further comprising a temperature control unit for controlling the temperature of the heating unit. in, The temperature control unit is disposed in the substrate, and a control interface of the temperature control unit is exposed outside the substrate.