Lens driving device

Abstract

The invention belongs to the technical field of optical imaging equipment, and particularly relates to a lens driving device which comprises a base, a carrier, a frame, a cover plate and a circuit board, and AF balls are arranged between the side wall of the frame and the side wall of the base; the carrier is sleeved with the frame and can move in the X-axis direction and the Y-axis direction in a carrier containing cavity formed by the frame and the cover plate, an OIS ball is arranged between the bottom end of the carrier and the inner bottom end of the frame, and three magnets are installed on the carrier; and three coils are arranged on the circuit board, are respectively opposite to the three magnets and are matched with the three magnets to realize three-axis movement of the carrier. Through the ingenious design of the frame and the cover plate, the carrier can drive the frame to move in the Z-axis direction while moving in the X-axis direction and the Y-axis direction is not hindered, so that the OIS anti-shake operation of the lens is realized. The OIS balls and the AF balls are arranged, so that the friction force generated when the carrier moves can be reduced.

Description

Technical Field

[0001] The invention belongs to the technical field of optical imaging equipment, and in particular relates to a lens driving device. Background Art

[0002] With the development of technology, many electronic devices (such as smart phones or digital cameras) now have the function of taking photos or recording videos. These electronic devices are becoming more and more popular and are developing in the direction of convenient and lightweight designs to provide users with more choices.

[0003] Some electronic devices with camera or video recording functions are equipped with a lens driving device to drive optical components such as lenses to move, thereby achieving the functions of autofocus and optical image stabilization (OIS). Light can pass through the optical components to form an image on the photosensitive component.

[0004] The existing lens driving device usually includes an OIS coil group, a magnet group, a zoom coil and a carrier for mounting the lens to prevent the lens from shaking. Under the action of the OIS coil group and the magnet group, the carrier moves together with the lens in the X-axis and Y-axis directions. Under the action of the zoom coil and the magnet group, the carrier moves together with the lens in the Z-axis direction, thereby realizing the three-axis movement operation of the lens. However, when the carrier of the existing lens driving device moves in the X-axis and Y-axis directions, it is often difficult to move due to the large friction between the carrier and the base, and even difficult to move or shaking when moving, which seriously affects the three-axis movement of the lens. Summary of the invention

[0005] The present invention aims to solve the above technical problems and provides a lens driving device.

[0006] A lens driving device comprises a base, a carrier, a frame, a cover plate and a circuit board, wherein the frame is sleeved in the base, an AF ball is arranged between a side wall of the frame and a side wall of the base, and the frame is connected to the cover plate to form a carrier accommodating cavity;

[0007] The carrier is sleeved in the frame and can move in the carrier accommodating cavity in the X-axis direction and the Y-axis direction. An OIS ball is arranged between the bottom end of the carrier and the bottom end of the frame. Three magnets are installed on the carrier.

[0008] The circuit board is arranged on the outside of the base, and three coils are arranged on the circuit board. The three coils are respectively arranged opposite to the three magnets. The three coils cooperate with the three magnets to realize the movement of the carrier relative to the frame in the X-axis direction and the Y-axis direction, and the carrier drives the cover plate and the frame to move relative to the base in the Z-axis direction.

[0009] Optionally, the cover plate is located at the top of the carrier and the top of the frame, and the frame is snap-connected to the cover plate.

[0010] Optionally, the circuit board is an FPC board.

[0011] Optionally, an extension plate is provided on the circuit board, a first power-on point is provided on the extension plate, a frame built-in circuit is built-in the frame, the frame built-in circuit is connected to a second power-on point provided on one side of the top of the frame, the first power-on point is connected to the second power-on point and supplies power to the frame built-in circuit;

[0012] An X-axis transmitting electrode plate and an X-axis receiving electrode plate are arranged at the bottom end of the frame along the X-axis direction, and a Y-axis transmitting electrode plate and a Y-axis receiving electrode plate are arranged at the bottom end of the frame along the Y-axis direction. The X-axis transmitting electrode plate, the X-axis receiving electrode plate, the Y-axis transmitting electrode plate, and the Y-axis receiving electrode plate are respectively connected to the built-in circuit of the frame and are respectively connected to the first capacitor IC chip, and the first capacitor IC chip is used to monitor the capacitance value between the X-axis transmitting electrode plate and the X-axis receiving electrode plate, and the capacitance value between the Y-axis transmitting electrode plate and the Y-axis receiving electrode plate;

[0013] The bottom end of the carrier is provided with an X-axis metal plate corresponding to the X-axis transmitting electrode plate and the X-axis receiving electrode plate, and a Y-axis metal plate corresponding to the Y-axis transmitting electrode plate and the Y-axis receiving electrode plate.

[0014] Optionally, there are two X-axis receiving electrode plates, and the two X-axis receiving electrode plates are arranged side by side along the Y-axis direction.

[0015] Optionally, there are two Y-axis receiving electrode plates, and the two Y-axis receiving electrode plates are arranged side by side along the X-axis direction.

[0016] Optionally, when the carrier moves relative to the frame in the X-axis direction, the relative area between the X-axis metal plate and the X-axis transmitting electrode plate remains unchanged, and the relative area between the X-axis metal plate and the X-axis receiving electrode plate changes.

[0017] Optionally, when the carrier moves relative to the frame in the Y-axis direction, the relative area between the Y-axis metal plate and the Y-axis transmitting electrode plate remains unchanged, and the relative area between the Y-axis metal plate and the Y-axis receiving electrode plate changes.

[0018] Optionally, two of the three magnets are coated with a metal coating and are respectively an X-axis magnet and a Y-axis magnet. The X-axis magnet and the Y-axis magnet are exposed at the bottom of the carrier. The X-axis magnet serves as the X-axis metal plate and is arranged opposite to the X-axis transmitting electrode plate and the X-axis receiving electrode plate. The Y-axis magnet serves as the Y-axis metal plate and is arranged opposite to the Y-axis transmitting electrode plate and the Y-axis receiving electrode plate.

[0019] Optionally, a third power-on point is provided on the circuit board, a base built-in circuit is built-in the base, the base built-in circuit is connected to a fourth power-on point, and the third power-on point is connected to the fourth power-on point and supplies power to the base built-in circuit;

[0020] A Z-axis transmitting electrode plate and a Z-axis receiving electrode plate are arranged on the inner wall of one side of the base along the X-axis direction or the Y-axis direction, the Z-axis transmitting electrode plate and the Z-axis receiving electrode plate are respectively connected to the built-in circuit of the base and are respectively connected to the second capacitor IC chip, and the second capacitor IC chip is used to monitor the capacitance value between the Z-axis transmitting electrode plate and the Z-axis receiving electrode plate;

[0021] A Z-axis metal plate corresponding to the Z-axis transmitting electrode plate and the Z-axis receiving electrode plate is arranged on the side wall of the frame.

[0022] Optionally, there are two Z-axis receiving electrode plates, and the two Z-axis receiving electrode plates are arranged side by side along the Z-axis direction.

[0023] Optionally, one of the three magnets is coated with a metal layer and is a Z-axis magnet, the Z-axis magnet is exposed on the outer side wall of the frame, and the Z-axis magnet serves as the Z-axis metal plate and is arranged opposite to the Z-axis transmitting electrode plate and the Z-axis receiving electrode plate.

[0024] Optionally, when the carrier drives the cover plate and the frame to move relative to the base in the Z-axis direction, the relative area between the Z-axis metal plate and the Z-axis transmitting electrode plate remains unchanged and the relative area between the Z-axis metal plate and the Z-axis receiving electrode plate changes.

[0025] Optionally, an X-axis fixed electrode plate and a Y-axis fixed electrode plate are arranged at the bottom end of the frame, and the X-axis fixed electrode plate and the Y-axis fixed electrode plate are respectively connected to a third capacitor IC chip, and an X-axis movable electrode plate corresponding to the X-axis fixed electrode plate and a Y-axis movable electrode plate corresponding to the Y-axis fixed electrode plate are arranged at the bottom end of the carrier, and after the X-axis fixed electrode plate, the Y-axis fixed electrode plate, the X-axis movable electrode plate and the Y-axis movable electrode plate are energized, the third capacitor IC chip respectively monitors the capacitance value between the X-axis fixed electrode plate and the X-axis movable electrode plate, and the capacitance value between the Y-axis fixed electrode plate and the Y-axis movable electrode plate.

[0026] Optionally, there are two X-axis fixed electrode plates, and the two X-axis fixed electrode plates are arranged side by side along the X-axis direction.

[0027] Optionally, there are two Y-axis fixed electrode plates, and the two Y-axis fixed electrode plates are arranged side by side along the Y-axis direction.

[0028] Optionally, a Z-axis fixed electrode plate is arranged on the inner wall of one side of the base, and the Z-axis fixed electrode plate is connected to a fourth capacitor IC chip. A Z-axis movable electrode plate corresponding to the Z-axis fixed electrode plate is arranged on the side wall of the frame. After the Z-axis fixed electrode plate and the Z-axis movable electrode plate are energized, the fourth capacitor IC chip monitors the capacitance value between the Z-axis fixed electrode plate and the Z-axis movable electrode plate.

[0029] Optionally, there are two Z-axis fixed electrode plates, and the two Z-axis fixed electrode plates are arranged side by side along the Z-axis direction.

[0030] Optionally, the lens driving device further comprises a shell, which is detachably connected to the base and forms a hollow cavity, and the carrier, the frame and the cover are all arranged in the hollow cavity.

[0031] Beneficial effects: The present invention has at least one or more of the following advantages:

[0032] 1. The present invention, through the ingenious design of the frame and the cover plate, can drive the frame to move in the Z-axis direction when the carrier moves in the Z-axis direction without hindering the movement of the carrier in the X-axis and Y-axis directions, thereby realizing the OIS anti-shake operation of the lens.

[0033] In addition, the present invention can reduce the friction force when the carrier moves in the X-axis and Y-axis directions relative to the frame by arranging OIS balls between the carrier and the frame; the present invention can reduce the friction force when the frame moves in the Z-axis direction relative to the base by arranging AF balls between the frame and the base.

[0034] 2. The present invention can form a floating capacitor structure by combining an X / Y / Z-axis transmitting electrode plate, an X / Y / Z-axis receiving electrode plate, and an X / Y / Z-axis metal plate. When the X / Y / Z-axis metal plate moves with the carrier, the capacitance value between the X / Y / Z-axis transmitting electrode plate and the X / Y / Z-axis receiving electrode plate will change and be monitored by the corresponding capacitor IC chips. The moving position of the carrier in the X / Y / Z-axis direction can be monitored based on the change in capacitance value. This structure has the effect of a position sensor.

[0035] 3. Since the X / Y / Z axis metal plate in the floating capacitor structure does not need to be energized, a magnet coated with a metal coating can be used to replace the metal plate, which can also achieve the technical effect of the floating capacitor. At this time, the X / Y / Z axis magnet cooperates with the corresponding coil to achieve X / Y / Z axis direction drive, and the X / Y / Z axis magnet cooperates with the X / Y / Z transmitting electrode plate and the X / Y / Z axis receiving electrode plate to achieve position monitoring in the X / Y / Z axis direction. By replacing the metal plate with the X / Y / Z axis magnet, the layout of the metal plate is reduced, and the overall layout of the device is simpler.

[0036] 4. The present invention realizes a conventional capacitor structure by combining an X / Y / Z fixed electrode plate and an X / Y / Z movable electrode plate, and can also realize position monitoring in the X / Y / Z axis direction. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 A structural schematic diagram of the present invention;

[0038] Figure 2 for Figure 1 AA section view;

[0039] Figure 3 for Figure 1 BB cross-sectional view;

[0040] Figure 4 for Figure 1 Exploded diagram of

[0041] Figure 5 for Figure 4 Further exploded diagram of;

[0042] Figure 6 for Figure 5 Further exploded view of the part;

[0043] Figure 7 An exploded view of the circuit board, base, frame and carrier of the present invention;

[0044] Figure 8 A diagram showing the positional relationship between the circuit board, the base and the frame of the present invention;

[0045] Fig. 9 for Figure 8 Exploded diagram of

[0046] Fig.10 A schematic diagram of the structure of the carrier of the present invention;

[0047] Fig.11 A structural schematic diagram of the framework of the present invention;

[0048] Fig.12 An exploded diagram of the circuit board, the built-in circuit of the base, the built-in circuit of the frame, the electrode plates and the metal plates;

[0049] Fig.13 for Fig.12 Schematic diagram from another angle;

[0050] Fig.14 (a) to (c) are three position relationship diagrams of the floating capacitor structure of the present invention;

[0051] Fig.15 (a) to (c) are three position relationship diagrams of the conventional capacitor structure of the present invention. DETAILED DESCRIPTION

[0052] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings so that the purpose, features and advantages of the present invention can be more clearly understood. It should be understood that the embodiments shown in the accompanying drawings are not intended to limit the scope of the present invention, but are only intended to illustrate the essential spirit of the technical solution of the present invention.

[0053] In the following description, certain specific details are set forth for the purpose of illustrating the various disclosed embodiments to provide a thorough understanding of the various disclosed embodiments. However, those skilled in the relevant art will recognize that the embodiments may be practiced without one or more of these specific details. In other cases, well-known devices, structures, and techniques associated with the present application may not be shown or described in detail to avoid unnecessarily obscuring the description of the embodiments.

[0054] References throughout the specification to "one embodiment" or "an embodiment" indicate that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, the appearances of "in one embodiment" or "in an embodiment" in various places throughout the specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any manner in one or more embodiments.

[0055] In the following description, in order to clearly show the structure and working mode of the present invention, many directional words will be used for description, but the words "front", "back", "left", "right", "outside", "inside", "outward", "inward", "up", "down", etc. should be understood as convenient terms and should not be understood as restrictive terms.

[0056] Reference Figures 1 to 13 The embodiment of the present invention provides a lens driving device, wherein a communicating lens through hole is provided in the middle of the lens driving device along the optical axis direction (Z axis direction). The lens driving device comprises a housing 10, a base 20, a carrier 30, a frame 40, a cover plate 50 and a circuit board 60.

[0057] The housing 10 is an optional structure, and the housing 10 and the base 20 are detachably connected to form a hollow cavity, and the carrier 30, the frame 40 and the cover 50 are all arranged in the hollow cavity. The housing 10 and the base 20 are preferably connected by snapping to form the hollow cavity.

[0058] The frame 40 is sleeved in the base 20, and the frame 40 is located below the cover plate 50. The frame 40 and the cover plate 50 are connected to form a carrier accommodating cavity. The carrier 30 is sleeved in the frame 40, that is, when the carrier 30 is located in the carrier accommodating cavity between the frame 40 and the cover plate 50, the bottom end of the carrier 30 contacts the frame 40 (when there is an OIS ball 74 between the carrier 30 and the frame 40, the carrier 40 indirectly contacts the frame 40 through the OIS ball 74) but does not have a hardware connection relationship, and the top end of the carrier 30 may have a gap with the cover plate 50, or may contact the cover plate 50 but does not have a hardware connection relationship, so that the carrier 30 can move in the X-axis direction and the Y-axis direction in the carrier accommodating cavity, and the carrier 30 can move in the Z-axis direction with the cover plate 50 and the frame 40 in the hollow cavity. A lens is arranged on the carrier 30, and the OIS anti-shake and automatic zoom operation of the lens are realized by the carrier 30 performing three-axis movement in the hollow cavity.

[0059] The carrier 30 realizes three-axis movement through a driving mechanism, and the driving mechanism includes three magnets 71 and three coils 72. The three magnets 71 are respectively an X-axis magnet, a Y-axis magnet, and a Z-axis magnet. Specifically, three magnets 71 are installed on the carrier 30, and the circuit board 60 is arranged on the outside of the base 20. Three coils 72 are arranged on the circuit board 60, and the three coils 72 are respectively arranged opposite to the three magnets 71. The three coils 72 cooperate with the three magnets 71 to realize the movement of the carrier 30 relative to the frame 40 in the X-axis direction and the Y-axis direction, and the carrier 30 drives the cover plate 50 and the frame 40 to move in the Z-axis direction relative to the base 20.

[0060] An AF ball 73 is disposed between the side wall of the frame 40 and the side wall of the base 20 , and an OIS ball 74 is disposed between the bottom end of the carrier 30 and the inner bottom end of the frame 40 .

[0061] The present invention, through the ingenious design of the frame 40 and the cover plate 50, can drive the frame 40 to move in the Z-axis direction while not hindering the carrier 30 from moving in the X-axis direction and the Y-axis direction, thereby realizing the OIS anti-shake operation of the lens. In addition, the present invention can reduce the friction force when the carrier moves in the X-axis direction and the Y-axis direction relative to the frame by arranging the OIS ball 74 between the carrier and the frame; the present invention can reduce the friction force when the frame moves in the Z-axis direction relative to the base by arranging the AF ball 73 between the frame and the base.

[0062] In one embodiment, AF ball grooves are respectively provided on the side walls of the frame 40 and the base 20. After the frame 40 is placed in the base 20, the AF ball grooves on the side walls of the frame 40 are opposite to the AF ball grooves on the side walls of the base 20 and are provided with AF balls 73.

[0063] In one embodiment, the number of AF balls 73 can be determined according to actual conditions. Preferably, one AF ball 73 is respectively disposed between the four corner positions of the side wall of the frame 40 and the four corner positions of the side wall of the base 20 .

[0064] In one embodiment, OIS ball grooves are respectively provided on the bottom end of the carrier 30 and the bottom end of the frame 40. After the carrier 30 is placed in the frame 40, the OIS ball groove at the bottom end of the carrier 30 is opposite to the OIS ball groove at the bottom end of the frame 40 and is provided with OIS balls 74.

[0065] In one embodiment, the number of the OIS balls 74 can be determined according to actual conditions. Preferably, an OIS ball 74 is disposed between each of the four corner positions at the bottom end of the carrier 30 and the four corner positions at the bottom end of the frame 40 .

[0066] In one embodiment, the cover plate 50 is located at the top of the carrier 30 and the top of the frame 40 , and the frame 40 and the cover plate 50 are snap-connected.

[0067] In specific implementation, a buckle or a bayonet can be provided at the bottom of the cover plate 50, and a bayonet or a buckle can be provided on the outer wall of the frame 40, and the two can be buckled on the bayonet to achieve a snap connection. Figure 6 As shown, a downwardly protruding snap-in ear is provided at the bottom end of the cover plate 50, a snap-in slot 51 is provided on the snap-in ear, a buckle 41 is provided on the outer wall of the frame 40 near the top, and the frame 40 and the cover plate 50 are snap-connected by buckling on the snap-in slot 51 through the buckle 41.

[0068] In one embodiment, the circuit board 60 is a FPC board.

[0069] The circuit board 60 is preferably disposed around the side wall of the base 20. Figure 6As shown, the circuit board 60 is a U-shaped structure.

[0070] In one embodiment, referring to Fig.12 and Fig.13 The circuit board 60 is provided with an extension board 61, and the extension board 61 is preferably an extension soft board of an FPC board structure. The extension board 61 is provided with a first power-on point 611.

[0071] Reference Fig.12 and Fig.13 The frame 40 has a built-in frame circuit 42, a second power-on point 421 is set on the top side of the frame 40, the built-in frame circuit 42 is connected to the second power-on point 421, the first power-on point 611 is connected to the second power-on point 421, and the circuit board 60 supplies power to the built-in frame circuit 42 through the first power-on point 611 and the second power-on point 421 in turn.

[0072] In a specific implementation, the number of the first power-on point 611 and the second power-on point 421 can be arranged according to the number of X / Y axis transmitting electrode plates and X / Y axis receiving electrode plates set in the frame built-in circuit 42. Fig.12 and Fig.13 As shown, five first energizing points 611 and five second energizing points 421 are provided, each X / Y axis receiving electrode plate is independently connected to a corresponding second energizing point 421 , and each X / Y axis transmitting electrode plate is commonly connected to a second energizing point 421 .

[0073] Reference Fig.12 and Fig.13 , an X-axis transmitting electrode plate 431 and an X-axis receiving electrode plate 432 are arranged at the bottom end of the frame 40 along the X-axis direction, and a Y-axis transmitting electrode plate 433 and a Y-axis receiving electrode plate 434 are arranged at the bottom end of the frame 40 along the Y-axis direction, and the X-axis transmitting electrode plate 431, the X-axis receiving electrode plate 432, the Y-axis transmitting electrode plate 433, and the Y-axis receiving electrode plate 434 are respectively connected to the frame built-in circuit 42 and powered by the frame built-in circuit 42. The X-axis transmitting electrode plate 431, the X-axis receiving electrode plate 432, the Y-axis transmitting electrode plate 433, and the Y-axis receiving electrode plate 434 are respectively connected to the first capacitor IC chip, and the first capacitor IC chip is used to monitor the capacitance value between the X-axis transmitting electrode plate 431 and the X-axis receiving electrode plate 432, and the capacitance value between the Y-axis transmitting electrode plate 433 and the Y-axis receiving electrode plate 434.

[0074] Reference Fig.12 and Fig.13 The bottom end of the carrier 30 is provided with an X-axis metal plate 311 corresponding to the X-axis transmitting electrode plate 431 and the X-axis receiving electrode plate 432 , and a Y-axis metal plate 312 corresponding to the Y-axis transmitting electrode plate 433 and the Y-axis receiving electrode plate 434 .

[0075] The X-axis transmitting electrode plate 431, the X-axis receiving electrode plate 432, and the X-axis metal plate 311 can be combined to form a floating capacitor structure. In this structure, the X-axis metal plate 311 does not need to be powered on, which greatly saves the difficulty of wiring and facilitates installation operations. When the X-axis metal plate 311 moves with the carrier 30, the projection area between the X-axis metal plate 311 and the X-axis transmitting electrode plate 431, and the projection area between the X-axis metal plate 311 and the X-axis receiving electrode plate 432 change with the movement of the X-axis metal plate 311. Thereby, the capacitance value between the X-axis transmitting electrode plate 431 and the X-axis receiving electrode plate 432 will change and be monitored by the first capacitor IC chip. According to the change in its capacitance value, the moving position monitoring of the carrier 30 in the X-axis direction can be realized, and this structure plays the role of a position sensor.

[0076] Similarly, the combination of the Y-axis transmitting electrode plate 433, the Y-axis receiving electrode plate 434, and the Y-axis metal plate 312 forms a floating capacitor structure, which can monitor the moving position of the carrier in the Y-axis direction. In this structure, the Y-axis metal plate 312 does not need to be powered, which greatly saves the wiring difficulty and facilitates the installation operation.

[0077] In this embodiment, the positions of the transmitting electrode plate and the receiving electrode plate can be interchanged; the positions of the electrode plate and the metal plate can also be interchanged, which can also achieve the effect of position monitoring.

[0078] In one embodiment, the first capacitor IC chip is preferably disposed on the circuit board 60. There are a plurality of first energizing points 611 and second energizing points 421, and the first capacitor IC chip is connected to the X-axis transmitting electrode plate 431, the X-axis receiving electrode plate 432, the Y-axis transmitting electrode plate 433, and the Y-axis receiving electrode plate 434 through the first energizing points 611 and the second energizing points 421, respectively.

[0079] In one embodiment, referring to Fig.12 and Fig.13 There are two X-axis receiving electrode plates 432, and the two X-axis receiving electrode plates 432 are arranged side by side along the Y-axis direction.

[0080] In this embodiment, refer to Fig.14(a) to (c), taking the floating capacitor structure formed in the X-axis direction as an example, an electrode plate is located on the moving part, i.e., the carrier 30, as an X-axis metal plate 311, and three electrode plates are respectively located on the fixed part, i.e., the frame 40, as an X-axis transmitting electrode plate 431 and two X-axis receiving electrode plates 432. The shape of the electrode plate is not limited, and it can be changed. For example, the cross-section includes but is not limited to any one of a triangle, a trapezoid, a circle or an ellipse. Any central axis of each electrode plate is parallel to the preset motion path, and preferably the longest central axis of each electrode plate is parallel to the preset motion path. When the moving part moves along the preset motion path, i.e., the X-axis direction, the spatial overlap area between the X-axis metal plate 311 and the X-axis transmitting electrode plate 431 and the two X-axis receiving electrode plates 432 changes, resulting in a capacitance change between the X-axis transmitting electrode plate 431 and the two X-axis receiving electrode plates 432. Because the capacitance change corresponds to the movement amount one by one, it can be judged as the displacement amount.

[0081] In one embodiment, referring to Fig.12 and Fig.13 There are two Y-axis receiving electrode plates 434, and the two Y-axis receiving electrode plates 434 are arranged side by side along the X-axis direction.

[0082] In one embodiment, when the carrier 30 moves in the X-axis direction relative to the frame 40, the relative area between the X-axis metal plate 311 and the X-axis transmitting electrode plate 431 remains unchanged and the relative area between the X-axis receiving electrode plate 432 changes, so as to calculate the change in capacitance between the transmitting plate and the receiving plate.

[0083] In specific implementation, Fig.14 The X-axis transmitting electrode plate 431 in (a) to (c) is rotated 90 degrees, that is, the longest central axis of the X-axis transmitting electrode plate 431 is orthogonal to the preset motion path, so that the relative area between the X-axis metal plate 311 and the X-axis transmitting electrode plate 431 remains unchanged. The specification of the X-axis transmitting electrode plate 431 can also be made smaller, so that the X-axis metal plate 311 can fully cover the area range of the X-axis transmitting electrode plate 431 when moving, and the relative area between the X-axis metal plate 311 and the X-axis transmitting electrode plate 431 remains unchanged. Of course, other measures can also be used to achieve the purpose of keeping the relative area between the X-axis metal plate 311 and the X-axis transmitting electrode plate 431 unchanged.

[0084] In one embodiment, when the carrier 30 moves in the Y-axis direction relative to the frame 40, the relative area between the Y-axis metal plate 312 and the Y-axis transmitting electrode plate 433 remains unchanged and the relative area between the Y-axis receiving electrode plate 434 changes, so as to calculate the change in capacitance between the transmitting plate and the receiving plate.

[0085] In one embodiment, two of the three magnets 71 are coated with a metal coating and are respectively an X-axis magnet and a Y-axis magnet. The X-axis magnet and the Y-axis magnet are exposed at the bottom of the carrier 30. The X-axis magnet 71 is arranged as an X-axis metal plate 311 and is opposite to the X-axis transmitting electrode plate 431 and the X-axis receiving electrode plate 432. The Y-axis magnet 71 is arranged as a Y-axis metal plate 312 and is opposite to the Y-axis transmitting electrode plate 433 and the Y-axis receiving electrode plate 434.

[0086] In this embodiment, a magnet coated with a metal layer on the surface is used instead of a metal plate, which can also achieve the technical effect of a floating capacitor.

[0087] In one embodiment, referring to Fig.12 and Fig.13 A third power-on point 621 is provided on the circuit board 60, a base built-in circuit 21 is built in the base 20, the base built-in circuit 21 is connected to the fourth power-on point 211, the third power-on point 621 is connected to the fourth power-on point 211, and the circuit board 60 supplies power to the base built-in circuit 21 through the third power-on point 621 and the fourth power-on point 211 in turn.

[0088] In a specific implementation, the number of the third power-on point 621 and the fourth power-on point 211 can be arranged according to the number of the Z-axis transmitting electrode plates 221 and the Z-axis receiving electrode plates 222 set in the base built-in circuit 21. Fig.12 and Fig.13 As shown, three third energizing points 621 and three fourth energizing points 211 are provided, and the Z-axis transmitting electrode 221 and the two Z-axis receiving electrode plates 222 are respectively connected to one fourth energizing point 211 .

[0089] Reference Fig.12 and Fig.13 A Z-axis transmitting electrode plate 221 and a Z-axis receiving electrode plate 222 are arranged on the inner wall of one side of the base 20 along the X-axis direction or the Y-axis direction. The Z-axis transmitting electrode plate 221 and the Z-axis receiving electrode plate 222 are respectively connected to the base built-in circuit 21 and powered by the base built-in circuit 21. The Z-axis transmitting electrode plate 221 and the Z-axis receiving electrode plate 222 are respectively connected to the second capacitor IC chip, and the second capacitor IC chip is used to monitor the capacitance value between the Z-axis transmitting electrode plate 221 and the Z-axis receiving electrode plate 222.

[0090] Reference Fig.12 and Fig.13 A Z-axis metal plate 441 corresponding to the Z-axis transmitting electrode plate 221 and the Z-axis receiving electrode plate 222 is arranged on the side wall of the frame 40 .

[0091] Similarly, the combination of the Z-axis transmitting electrode plate 221, the Z-axis receiving electrode plate 222, and the Z-axis metal plate 441 forms a floating capacitor structure, which can monitor the moving position of the carrier in the Z-axis direction. In this structure, the Z-axis metal plate 441 does not need to be powered, which greatly saves wiring difficulty and facilitates installation operations.

[0092] In this embodiment, the positions of the transmitting electrode plate and the receiving electrode plate can be interchanged; the positions of the electrode plate and the metal plate can also be interchanged, which can also achieve the effect of position monitoring.

[0093] In specific implementation, the Z-axis transmitting electrode plate 221 and the Z-axis receiving electrode plate 222 are arranged side by side according to their positions on the side wall of the base 20. When the Z-axis transmitting electrode plate 221 and the Z-axis receiving electrode plate 222 are arranged on the side wall whose length direction is the X-axis direction, they are arranged side by side along the X-axis direction. Fig.12 and Fig.13 As shown, the Z-axis transmitting electrode plate 221 and the Z-axis receiving electrode plate 222 are arranged on the side wall whose length direction is the Y-axis direction, and are arranged side by side along the Y-axis direction.

[0094] In one embodiment, the second capacitor IC chip is preferably disposed on the circuit board 60. There are multiple third power points 621 and fourth power points 211, and the second capacitor IC chip is connected to the Z-axis transmitting electrode plate 221 and the Z-axis receiving electrode plate 222 through each third power point 621 and fourth power point 211.

[0095] In one embodiment, there are two Z-axis receiving electrode plates 222 , and the two Z-axis receiving electrode plates 222 are arranged side by side along the Z-axis direction.

[0096] In one embodiment, one of the three magnets 71 is coated with a metal coating and is a Z-axis magnet 71 . The Z-axis magnet 71 is exposed on the outer wall of the frame. The Z-axis magnet 71 serves as a Z-axis metal plate 441 and is arranged opposite to the Z-axis transmitting electrode plate 221 and the Z-axis receiving electrode plate 222 .

[0097] In this embodiment, a magnet coated with a metal layer on the surface is used instead of a metal plate, which can also achieve the technical effect of a floating capacitor.

[0098] In one embodiment, when the carrier 30 drives the cover plate 50 and the frame 40 to move relative to the base 20 in the Z-axis direction, the relative area between the Z-axis metal plate 441 and the Z-axis transmitting electrode plate 221 remains unchanged and the relative area between the Z-axis receiving electrode plate 222 changes, so as to calculate the change in capacitance between the transmitting plate and the receiving plate.

[0099] In one embodiment, an X-axis fixed electrode plate and a Y-axis fixed electrode plate are disposed at the bottom end of the frame 40, and the X-axis fixed electrode plate and the Y-axis fixed electrode plate are respectively connected to the third capacitor IC chip, and an X-axis movable electrode plate corresponding to the X-axis fixed electrode plate and a Y-axis movable electrode plate corresponding to the Y-axis fixed electrode plate are disposed at the bottom end of the carrier 30. After the X-axis fixed electrode plate, the Y-axis fixed electrode plate, the X-axis movable electrode plate, and the Y-axis movable electrode plate are powered on, the third capacitor IC chip respectively monitors the capacitance value between the X-axis fixed electrode plate and the X-axis movable electrode plate, and the capacitance value between the Y-axis fixed electrode plate and the Y-axis movable electrode plate.

[0100] In this embodiment, the X / Y-axis fixed electrode plate and the X / Y-axis movable electrode plate need to be energized, and a conventional capacitor structure is formed between the energized X / Y-axis fixed electrode plate and the X / Y-axis movable electrode plate. When the X / Y-axis movable electrode plate moves, the capacitance value between the two changes, thereby achieving a position monitoring effect.

[0101] In this embodiment, the X-axis fixed electrode plate, the Y-axis fixed electrode plate, the X-axis fixed electrode plate, and the Y-axis fixed electrode plate can be powered by a circuit board by sequentially powering the built-in circuit of the frame through the first power-on point and the second power-on point.

[0102] In this embodiment, the power supply of the X-axis moving electrode plate and the Y-axis moving electrode plate can be implemented by using the power supply method in the prior art.

[0103] In one embodiment, there are two X-axis fixed electrode plates, and the two X-axis fixed electrode plates are arranged side by side along the X-axis direction.

[0104] In this embodiment, refer to Fig.15 (a) to (c), taking the conventional capacitor structure formed in the X-axis direction as an example, one electrode plate is located on the moving part, i.e., the carrier 30, as the X-axis moving electrode plate 313, and the two electrode plates are located on the fixed part, i.e., the frame 40, as the X-axis fixed electrode plate 435. The shape of the electrode plate is not limited, and it can be changed. For example, the cross-section includes but is not limited to any one of a triangle, a trapezoid, a circle or an ellipse. Any central axis of each electrode plate is parallel to the preset motion path, and preferably the longest central axis of each electrode plate is parallel to the preset motion path. When the X-axis moving electrode plate 313 moves along the preset motion path, i.e., the X-axis direction, the spatial overlap area between the X-axis moving electrode plate 313 and the X-axis fixed electrode plate 435 changes, resulting in a capacitance change between the X-axis moving electrode plate 313 and the X-axis fixed electrode plate 435. Because the capacitance change corresponds to the movement amount one by one, it can be judged as the displacement amount.

[0105] In one embodiment, there are two Y-axis fixed electrode plates, and the two Y-axis fixed electrode plates are arranged side by side along the Y-axis direction.

[0106] In one embodiment, a Z-axis fixed electrode plate is provided on the inner wall of one side of the base 20, and the Z-axis fixed electrode plate is connected to the fourth capacitor IC chip. A Z-axis movable electrode plate corresponding to the Z-axis fixed electrode plate is provided on the side wall of the frame 40. After the Z-axis fixed electrode plate and the Z-axis movable electrode plate are powered on, the fourth capacitor IC chip monitors the capacitance value between the Z-axis fixed electrode plate and the Z-axis movable electrode plate.

[0107] In one embodiment, there are two Z-axis fixed electrode plates, and the two Z-axis fixed electrode plates are arranged side by side along the Z-axis direction.

[0108] In one embodiment, referring to Figure 6 Three coil avoidance openings 23 communicating with each other inside and outside are arranged on the side wall of the base 20 . When the circuit board 60 is arranged outside the base 20 , the three coils 72 are respectively located in a corresponding coil avoidance opening 23 .

[0109] Reference Figure 6 , Figure 7 , Fig. 9 and Fig.11 Three magnet avoidance openings 45 communicating with each other are arranged on the side wall of the frame 40 . When the carrier 30 is located in the frame 40 , the three magnets 71 are located in a corresponding magnet avoidance opening 45 .

[0110] The above design of this embodiment, such as Figure 2 and Figure 3 As shown, when the magnet 71 and the coil 72 are facing each other, there is no other obstruction between the two, so that the coil 72 can cooperate with the magnet 71 stably to achieve the purpose of three-axis movement after being energized.

[0111] The preferred embodiments of the present invention have been described in detail above, but it should be understood that after reading the above teachings of the present invention, those skilled in the art may make various changes or modifications to the present invention. These equivalent forms also fall within the scope defined by the appended claims of this application.

Claims

1. A lens driving device, characterized in that: It includes a base, a carrier, a frame, a cover plate and a circuit board, wherein the frame is sleeved in the base, an AF ball is arranged between the side wall of the frame and the side wall of the base, and the frame is connected with the cover plate to form a carrier accommodating cavity; The carrier is sleeved in the frame and can move in the carrier accommodating cavity in the X-axis direction and the Y-axis direction. An OIS ball is arranged between the bottom end of the carrier and the bottom end of the frame. Three magnets are installed on the carrier. The circuit board is arranged on the outside of the base, and three coils are arranged on the circuit board. The three coils are respectively arranged opposite to the three magnets. The three coils cooperate with the three magnets to realize the movement of the carrier relative to the frame in the X-axis direction and the Y-axis direction, and the carrier drives the cover plate and the frame to move relative to the base in the Z-axis direction.

2. The lens driving device according to claim 1, wherein: The cover plate is located at the top of the carrier and the top of the frame, and the frame is connected to the cover plate by snapping; And / or, the circuit board is an FPC board; And / or, the lens driving device further comprises a shell, the shell is detachably connected to the base and forms a hollow cavity, and the carrier, the frame and the cover are all arranged in the hollow cavity.

3. The lens driving device according to claim 1 or 2, characterized in that: An extension plate is provided on the circuit board, a first power-on point is provided on the extension plate, a frame-built-in circuit is built in the frame, the frame-built-in circuit is connected to a second power-on point provided on one side of the top of the frame, the first power-on point is connected to the second power-on point and supplies power to the frame-built-in circuit; An X-axis transmitting electrode plate and an X-axis receiving electrode plate are arranged at the bottom end of the frame along the X-axis direction, and a Y-axis transmitting electrode plate and a Y-axis receiving electrode plate are arranged at the bottom end of the frame along the Y-axis direction. The X-axis transmitting electrode plate, the X-axis receiving electrode plate, the Y-axis transmitting electrode plate, and the Y-axis receiving electrode plate are respectively connected to the built-in circuit of the frame and are respectively connected to the first capacitor IC chip, and the first capacitor IC chip is used to monitor the capacitance value between the X-axis transmitting electrode plate and the X-axis receiving electrode plate, and the capacitance value between the Y-axis transmitting electrode plate and the Y-axis receiving electrode plate; The bottom end of the carrier is provided with an X-axis metal plate corresponding to the X-axis transmitting electrode plate and the X-axis receiving electrode plate, and a Y-axis metal plate corresponding to the Y-axis transmitting electrode plate and the Y-axis receiving electrode plate.

4. The lens driving device according to claim 3, characterized in that: There are two X-axis receiving electrode plates, and the two X-axis receiving electrode plates are arranged side by side along the Y-axis direction; And / or, there are two Y-axis receiving electrode plates, and the two Y-axis receiving electrode plates are arranged side by side along the X-axis direction; And / or, when the carrier moves relative to the frame in the X-axis direction, the relative area between the X-axis metal plate and the X-axis transmitting electrode plate remains unchanged and the relative area between the X-axis metal plate and the X-axis receiving electrode plate changes; And / or, when the carrier moves relative to the frame in the Y-axis direction, the relative area between the Y-axis metal plate and the Y-axis transmitting electrode plate remains unchanged and the relative area between the Y-axis metal plate and the Y-axis receiving electrode plate changes; And / or, two of the three magnets are coated with metal coatings and are respectively an X-axis magnet and a Y-axis magnet, the X-axis magnet and the Y-axis magnet are exposed at the bottom of the carrier, the X-axis magnet serves as the X-axis metal plate and is arranged opposite to the X-axis transmitting electrode plate and the X-axis receiving electrode plate, and the Y-axis magnet serves as the Y-axis metal plate and is arranged opposite to the Y-axis transmitting electrode plate and the Y-axis receiving electrode plate.

5. The lens driving device according to claim 1 or 2, characterized in that: The circuit board is provided with a third power point, the base is built with a base built-in circuit, the base built-in circuit is connected to a fourth power point, and the third power point is connected to the fourth power point and supplies power to the base built-in circuit; A Z-axis transmitting electrode plate and a Z-axis receiving electrode plate are arranged on the inner wall of one side of the base along the X-axis direction or the Y-axis direction, the Z-axis transmitting electrode plate and the Z-axis receiving electrode plate are respectively connected to the built-in circuit of the base and are respectively connected to the second capacitor IC chip, and the second capacitor IC chip is used to monitor the capacitance value between the Z-axis transmitting electrode plate and the Z-axis receiving electrode plate; A Z-axis metal plate corresponding to the Z-axis transmitting electrode plate and the Z-axis receiving electrode plate is arranged on the side wall of the frame.

6. The lens driving device according to claim 5, characterized in that: There are two Z-axis receiving electrode plates, and the two Z-axis receiving electrode plates are arranged side by side along the Z-axis direction; And / or, when the carrier drives the cover plate and the frame to move relative to the base in the Z-axis direction, the relative area between the Z-axis metal plate and the Z-axis transmitting electrode plate remains unchanged and the relative area between the Z-axis metal plate and the Z-axis receiving electrode plate changes; And / or, one of the three magnets is coated with a metal layer and is a Z-axis magnet, the Z-axis magnet is exposed on the outer wall of the frame, and the Z-axis magnet serves as the Z-axis metal plate and is arranged opposite to the Z-axis transmitting electrode plate and the Z-axis receiving electrode plate.

7. The lens driving device according to claim 1 or 2, characterized in that: An X-axis fixed electrode plate and a Y-axis fixed electrode plate are arranged at the bottom end of the frame, and the X-axis fixed electrode plate and the Y-axis fixed electrode plate are respectively connected to a third capacitor IC chip; an X-axis movable electrode plate corresponding to the X-axis fixed electrode plate and a Y-axis movable electrode plate corresponding to the Y-axis fixed electrode plate are arranged at the bottom end of the carrier; after the X-axis fixed electrode plate, the Y-axis fixed electrode plate, the X-axis movable electrode plate and the Y-axis movable electrode plate are powered on, the third capacitor IC chip respectively monitors the capacitance value between the X-axis fixed electrode plate and the X-axis movable electrode plate, and the capacitance value between the Y-axis fixed electrode plate and the Y-axis movable electrode plate.

8. The lens driving device according to claim 7, wherein: There are two X-axis fixed electrode plates, and the two X-axis fixed electrode plates are arranged side by side along the X-axis direction; And / or, there are two Y-axis fixed electrode plates, and the two Y-axis fixed electrode plates are arranged side by side along the Y-axis direction.

9. The lens driving device according to claim 1 or 2, characterized in that: A Z-axis fixed electrode plate is arranged on the inner wall of one side of the base, and the Z-axis fixed electrode plate is connected to the fourth capacitor IC chip. A Z-axis movable electrode plate corresponding to the Z-axis fixed electrode plate is arranged on the side wall of the frame. After the Z-axis fixed electrode plate and the Z-axis movable electrode plate are energized, the fourth capacitor IC chip monitors the capacitance value between the Z-axis fixed electrode plate and the Z-axis movable electrode plate.

10. The lens driving device according to claim 9, wherein: There are two Z-axis fixed electrode plates, and the two Z-axis fixed electrode plates are arranged side by side along the Z-axis direction.

Images