Method, device and equipment for generating map of wafer after wafer expansion and storage medium
By calculating the Wafer external elliptical region of the wafer after expansion, cutting and die positioning, the accuracy of wafer map generation after expansion is solved, and high-precision map generation of wafer after expansion is achieved.
Patent Information
- Application Number
- CN202510173484.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-17
- Publication Date
- 2025-06-06
AI Technical Summary
It is difficult to accurately generate maps of wafers after expansion, because the position and angle offset of each wafer after cutting and expansion are different, and mainstream methods are not applicable.
By obtaining the Wafer image of the wafer after expansion, calculating the Wafer external ellipse region, cropping the image and positioning all dies, filtering the die outside the external ellipse region, calculating the dimension average of the length and width direction of the die, generating the target die, calculating the minimum external rectangle of the die area and completing the missing die, selecting the die in the intersection to generate a map map.
The accurate map generation of wafers after expansion is realized, the accuracy, versatility and robustness of the method are improved, and it is suitable for cutting the wafer after expansion.
Smart Images
Figure CN120109033A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of semiconductor technology, and in particular to a method, device, equipment and storage medium for generating a wafer map after wafer expansion. Background Art
[0002] Currently, the mainstream method of making maps is mostly for wafers before cutting. The spacing and angle of each die on the wafer before cutting are equal. The mainstream method first levels the wafer, then scans the entire wafer image, calculates the circular area of the wafer, calculates the spacing between the dies in the X and Y directions, and calculates the map of the wafer before cutting through equidistant movement and array.
[0003] After the wafer is cut and expanded, each die has different degrees of position and angle deviation, and the X and Y spacing and rotation angles between dies are not equal. The mainstream method of making maps is not suitable for wafers after cutting and expansion. Therefore, how to accurately generate maps for wafers after cutting and expansion is a technical problem that needs to be solved urgently.
[0004] The above contents are only used to assist in understanding the technical solution of the present invention and do not constitute an admission that the above contents are prior art. Summary of the invention
[0005] The main purpose of the present invention is to provide a method, device, equipment and storage medium for generating a map of a wafer after expansion, aiming to solve the technical problem in the prior art that a map cannot be accurately drawn for a wafer after expansion.
[0006] To achieve the above object, the present invention provides a method for generating a wafer map after wafer expansion, the method comprising the following steps:
[0007] Acquire a wafer image of the wafer after expansion, and calculate a wafer circumscribed elliptical area of the wafer after expansion according to the wafer image;
[0008] According to the elliptical area circumscribed by the wafer, the wafer image is cropped and all dies are located;
[0009] Filtering the original real die outside the elliptical area circumscribed by the wafer;
[0010] Calculate the average length and width dimensions of the original real die within the elliptical area circumscribed by the wafer to generate a target real die with the same size and direction;
[0011] Calculate the minimum enclosing rectangle of the die area that includes all target real dies, and complete all dies within the minimum enclosing rectangle to obtain the completed die area;
[0012] The die within the intersection of the supplementary die area and the wafer circumscribed elliptical area is selected, and the supplementary die and the target real die within the wafer circumscribed elliptical area are selected, and a wafer map after expansion is generated according to the selected die.
[0013] Preferably, the wafer image is cropped according to the elliptical area circumscribed by the wafer, and all dies are located, including:
[0014] Identifying the number of dies or die sizes in the wafer image;
[0015] When there are many dies in the wafer image or the die size is large, the wafer image is cropped according to the circumscribed elliptical area of the wafer, and all the dies are located by threshold matching, and connection domain, filling and opening and closing operations are performed on all the dies to remove interference.
[0016] Preferably, the wafer image is cropped according to the elliptical area circumscribed by the wafer, and all dies are located, including:
[0017] Identify whether the wafer image contains a die with a special pattern and a cutting path;
[0018] If included, the wafer image is cropped according to the elliptical area circumscribed by the wafer, and the die is located according to template matching, and all die areas are generated according to the coordinates matched by the template.
[0019] Preferably, filtering the original real die outside the elliptical area circumscribed by the wafer includes:
[0020] Calculate the characteristic data of all die areas, and screen the original real die areas according to the characteristic data;
[0021] Sort the original real Die area rows and columns;
[0022] The original real die outside the elliptical area circumscribed by the wafer is filtered.
[0023] Preferably, calculating the characteristic data of all die regions and screening the original real die regions according to the characteristic data includes:
[0024] The characteristic data of all die areas are calculated, and the original real die areas are screened according to the characteristic data and the corresponding characteristic data error values.
[0025] Preferably, sorting the original real Die regions in rows and columns includes:
[0026] The original real Die area is sorted from top to bottom and from left to right according to the row and column intervals.
[0027] Preferably, after generating a wafer map after wafer expansion according to the selected die, the process further includes:
[0028] According to the selected die, control whether the wafer circumscribed elliptical area is filled with die, whether to pass into the shielded area or invalid die area, and output the corresponding result.
[0029] In addition, to achieve the above-mentioned purpose, the present invention further proposes a device for generating a wafer map after wafer expansion, the device for generating a wafer map after wafer expansion comprising:
[0030] A calculation module is used to obtain a wafer image of the wafer after the wafer is expanded, and calculate a wafer circumscribed elliptical area of the wafer after the wafer is expanded according to the wafer image;
[0031] A positioning module, used for cutting the wafer image according to the elliptical area circumscribed by the wafer, and positioning all dies;
[0032] A filtering module, used for filtering the original real die outside the elliptical area circumscribed by the wafer;
[0033] A generation module, used to calculate the average length and width dimensions of the original real die within the elliptical area circumscribed by the wafer, and generate a target real die with the same size and direction;
[0034] A completion module is used to calculate the minimum bounding rectangle of the die area containing all target real dies, and complete all dies in the minimum bounding rectangle to obtain a completed die area;
[0035] The generation module is also used to select the die within the intersection of the completed die area and the wafer circumscribed elliptical area, and select the supplementary die and the target real die within the wafer circumscribed elliptical area, and generate a wafer map after expansion according to the selected die.
[0036] In addition, to achieve the above-mentioned purpose, the present invention also proposes a device for generating a wafer map after expansion, wherein the device comprises a memory, a processor, and a program for generating a wafer map after expansion stored in the memory and executable on the processor, wherein the program for generating a wafer map after expansion is configured to implement the steps of the method for generating a wafer map after expansion as described above.
[0037] In addition, to achieve the above-mentioned purpose, the present invention also proposes a storage medium, on which a program for generating a wafer map after expansion is stored. When the program for generating a wafer map after expansion is executed by a processor, the steps of the method for generating a wafer map after expansion as described above are implemented.
[0038] In the present invention, a wafer image of the expanded wafer is obtained, and a wafer circumscribed elliptical area of the expanded wafer is calculated according to the wafer image. The wafer image is cropped according to the wafer circumscribed elliptical area, and all dies are located. The original real dies outside the wafer circumscribed elliptical area are filtered, and the missing dies can be filled and judged whether they are really missing. The unique sorting and filling method makes the method have high accuracy, versatility and robustness; the length and width dimensions of the original real dies within the wafer circumscribed elliptical area are calculated to generate a large For the target real die with consistent small directions, calculate the minimum enclosing rectangle of the die area containing all the target real dies, and complete all the dies in the minimum enclosing rectangle to obtain the completed die area, select the die within the intersection of the completed die area and the wafer circumscribed elliptical area, and select the supplemented die and the target real die within the wafer circumscribed elliptical area, and generate a wafer map after expansion based on the selected dies, and calculate the length, width, angle, and position coordinates of each die according to image segmentation, intelligent filling, and sorting, so it is more applicable to the wafer after cutting and expansion. BRIEF DESCRIPTION OF THE DRAWINGS
[0039] Figure 1 It is a structural schematic diagram of a device for generating a wafer map after wafer expansion in a hardware operating environment involved in an embodiment of the present invention;
[0040] Figure 2 It is a schematic diagram of the flow of the first embodiment of the method for generating a wafer map after wafer expansion of the present invention;
[0041] Figure 3 The wafer image of the wafer after wafer expansion in the first embodiment of the method for generating a map of the wafer after wafer expansion of the present invention;
[0042] Figure 4 The die is within the circumscribed elliptical area of the wafer in the first embodiment of the method for generating a wafer map after wafer expansion of the present invention;
[0043] Figure 5 The die outside the wafer circumscribed elliptical area in the first embodiment of the method for generating a wafer map after wafer expansion of the present invention;
[0044] Figure 6It is a structural block diagram of a first embodiment of a device for generating a wafer map after wafer expansion according to the present invention;
[0045] Figure 7 This is a structural block diagram of the first embodiment of the system for generating a wafer map after wafer expansion according to the present invention.
[0046] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0047] It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not used to limit the present invention.
[0048] Reference Figure 1 , Figure 1 The present invention is a schematic diagram of the structure of a device for generating a wafer map after wafer expansion in the hardware operating environment involved in an embodiment of the present invention.
[0049] like Figure 1 As shown, the device for generating a wafer map after wafer expansion may include: a processor 1001, such as a central processing unit (CPU), a communication bus 1002, a user interface 1003, a network interface 1004, and a memory 1005. Among them, the communication bus 1002 is used to realize the connection and communication between these components. The user interface 1003 may include a display screen (Display), and the user interface 1003 may also include a standard wired interface and a wireless interface. The wired interface of the user interface 1003 may be a USB interface in the present invention. The network interface 1004 may optionally include a standard wired interface and a wireless interface (such as a wireless fidelity (WIreless-FIdelity, WI-FI) interface). The memory 1005 may be a high-speed random access memory (Random Access Memory, RAM) memory, or a stable memory (Non-volatile Memory, NVM), such as a disk memory. The memory 1005 may also be a storage device independent of the aforementioned processor 1001.
[0050] Those skilled in the art will understand that Figure 1 The structure shown in the figure does not constitute a limitation on the device for generating a wafer map after wafer expansion, and may include more or fewer components than shown in the figure, or a combination of certain components, or a different arrangement of components.
[0051] like Figure 1 As shown, the memory 1005 as a computer storage medium may include an operating system, a network communication module, a user interface module, and a program for generating a wafer map after wafer expansion.
[0052] exist Figure 1 In the device for generating a wafer map after expansion shown, the network interface 1004 is mainly used to connect to a background server and perform data communication with the background server; the user interface 1003 is mainly used to connect to a user device; the device for generating a wafer map after expansion calls a program for generating a wafer map after expansion stored in the memory 1005 through the processor 1001, and executes a method for generating a wafer map after expansion provided in an embodiment of the present invention.
[0053] Based on the above hardware structure, an embodiment of the method for generating a wafer map after wafer expansion of the present invention is proposed.
[0054] Reference Figure 2 , a first embodiment of a method for generating a wafer map after wafer expansion of the present invention is proposed.
[0055] In a first embodiment, the method for generating a wafer map after wafer expansion comprises the following steps:
[0056] Step S10: obtaining a wafer image of the wafer after expansion, and calculating a wafer circumscribed elliptical area of the wafer after expansion according to the wafer image.
[0057] It should be noted that the execution subject of this embodiment is the device for generating the wafer map after wafer expansion, wherein the device for generating the wafer map after wafer expansion can be an electronic device such as a personal computer or a server, and this embodiment does not limit this. Calculate the wafer circumscribed ellipse area of the entire wafer after wafer expansion: Figure 3 As shown, Figure 3 The wafer image of the wafer after expansion is used. According to the gray value of the wafer in the wafer image after expansion, a binary threshold operation is performed, the area is filled, the domain is connected, the area with the largest area is calculated and screened, the contour is generated, and an ellipse is fitted to the contour to generate a wafer circumscribed ellipse area.
[0058] Step S20: cropping the wafer image according to the elliptical area circumscribed by the wafer, and locating all dies.
[0059] It is understandable that the cropped area is cropped according to the wafer circumscribed ellipse and the die area is obtained by threshold matching segmentation or template matching positioning of the die in the cropped image.
[0060] Furthermore, in this embodiment, the step S20 includes:
[0061] Identifying the number of dies or die sizes in the wafer image;
[0062] When there are many dies in the wafer image or the die size is large, the wafer image is cropped according to the circumscribed elliptical area of the wafer, and all the dies are located by threshold matching, and connection domain, filling and opening and closing operations are performed on all the dies to remove interference.
[0063] It should be understood that threshold matching can be applied to dies with a large number of dies or very large sizes, and its speed is faster. According to the positioning speed, the die number threshold and the die size threshold are set. When the number of dies in the wafer image is greater than or equal to the die number threshold, threshold matching is used to locate all dies; or, when the die size in the wafer image is greater than or equal to the die size threshold, threshold matching is used to locate all dies. Threshold matching segmentation is to perform binary threshold processing on the wafer image by inputting the upper and lower limits of the gray value and the area size of the die, and then segmenting all die areas through connected domain and area screening.
[0064] It should be noted that the connection domain, filling and opening and closing operations remove interference, including: the connection domain breaks up all die areas, fills a single die area, and the opening and closing operations remove burrs and dirt interference on the edge of the cutting path die, thereby improving the quality of the generated wafer map.
[0065] When the number of dies in the wafer image is small or the die size is small, the die region can be obtained by arbitrarily selecting die threshold matching segmentation or template matching in the cropped image, and both methods can quickly locate the die region.
[0066] Step S30: filtering the original real die outside the elliptical area circumscribed by the wafer.
[0067] It should be understood that the intersection of all the die areas sorted and located and the elliptical area circumscribed by the wafer is calculated, such as Figure 4 As shown, Figure 4 For the die within the wafer circumscribed elliptical area, the die area within the wafer circumscribed elliptical area is selected, and the original real die outside the wafer circumscribed elliptical area is filtered out, such as Figure 5 As shown, Figure 5 The die outside the elliptical area of the wafer, Figure 5 The dies outside the elliptical area of the wafer are filtered out.
[0068] Furthermore, in this embodiment, step S30 includes:
[0069] Calculate the characteristic data of all die areas, and screen the original real die areas according to the characteristic data;
[0070] Sort the original real Die area rows and columns;
[0071] The original real die outside the elliptical area circumscribed by the wafer is filtered.
[0072] It should be noted that the feature data includes area, width, height, grayscale, texture features, etc. The area, width, height, grayscale, and texture features of all die areas are calculated, and the real die areas are screened according to the set error value.
[0073] Furthermore, in this embodiment, the characteristic data of all die regions are calculated, and the original real die regions are screened according to the characteristic data, including:
[0074] The characteristic data of all die areas are calculated, and the original real die areas are screened according to the characteristic data and the corresponding characteristic data error values.
[0075] In a specific implementation, a corresponding error value is pre-set for each feature data, that is, one or more feature data of the area, width, height, grayscale, and texture features of all die areas, and the real die area is screened according to the feature data and within the set error value range.
[0076] Furthermore, in this embodiment, the original real Die regions are sorted in rows and columns, including:
[0077] The original real Die area is sorted from top to bottom and from left to right according to the row and column intervals.
[0078] It should be understood that the row and column intervals may be the average intervals of each row or column, and the original real Die areas are sorted from top to bottom and from left to right according to the row and column intervals, which has higher accuracy.
[0079] Step S40: Calculate the average length and width dimensions of the original real die within the elliptical area circumscribed by the wafer to generate a target real die with the same size and direction.
[0080] It is understandable that the average length and width dimensions of the die are calculated, and the die area within the circumscribed elliptical area of the wafer is selected to generate a real die with consistent size and direction, which is the target real die, thereby improving versatility and robustness.
[0081] Step S50: Calculate the minimum bounding rectangle of the die area that includes all target real dies, and complete all dies within the minimum bounding rectangle to obtain a completed die area.
[0082] It should be noted that the die area containing all target real dies is connected, the minimum enclosing rectangle of the entire area is calculated, and the missing dies in the minimum enclosing rectangle are completed to obtain the completed die area. This embodiment is compatible with wafers of various sizes and dies of various sizes and patterns. The missing dies can be filled and it can be determined whether they are really missing. Its unique sorting and filling method makes the method have high accuracy, versatility and robustness.
[0083] Step S60: selecting a die within the intersection of the supplementary die area and the wafer circumscribed elliptical area, and selecting a supplementary die and a target real die within the wafer circumscribed elliptical area, and generating a wafer map after expansion according to the selected die.
[0084] In the specific implementation, select the die within the wafer circle area: fill in the missing die area and the wafer circle area to find the intersection, and select the die area within the wafer. Select the supplemented die and the real die within the wafer circle area: find the intersection of the die area within the wafer and the missing die area to get the supplemented die within the wafer circle area, and find the difference between the die area and the supplemented die to get the real die. Based on the selected die, generate a wafer map after expansion, specifically including: According to project requirements, 1. Select the real die area, that is, do not select the area where the die is missing, generate a map, and do not detect the area where the die is missing; 2. Select all die areas, that is, the real die area and the area where the die is missing, generate a map, and detect all valid die areas.
[0085] This embodiment does not need to input or calculate the X distance and Y distance between die areas, and does not fill the die area according to a fixed distance. Instead, the length, width, angle, and position coordinates of each die are calculated according to image segmentation, intelligent filling, and sorting. Therefore, it is more applicable to wafers after cutting and expansion.
[0086] In this embodiment, a wafer image of the wafer after expansion is obtained, and a wafer circumscribed elliptical area of the wafer after expansion is calculated according to the wafer image. According to the wafer circumscribed elliptical area, the wafer image is cropped, and all dies are located. The original real dies outside the wafer circumscribed elliptical area are filtered, and the missing dies can be filled and judged whether they are really missing. The unique sorting and filling method makes the method have high accuracy, versatility and robustness; the length and width dimensions of the original real dies within the wafer circumscribed elliptical area are calculated to generate For target real dies with consistent size and direction, calculate the minimum enclosing rectangle of the die area containing all target real dies, and complete all dies in the minimum enclosing rectangle to obtain the completed die area, select the die within the intersection of the completed die area and the wafer circumscribed elliptical area, and select the supplemented die and target real die within the wafer circumscribed elliptical area, generate a wafer map after expansion based on the selected dies, and calculate the length, width, angle, and position coordinates of each die according to image segmentation, intelligent filling, and sorting, so it is more applicable to wafers after cutting and expansion.
[0087] Continue to refer to Figure 2 Based on the first embodiment of the method described above, a second embodiment of the method for generating a wafer map after wafer expansion of the present invention is proposed.
[0088] In the second embodiment, the step S20 includes:
[0089] Identify whether the wafer image contains a die with a special pattern and a cutting path;
[0090] If included, the wafer image is cropped according to the elliptical area circumscribed by the wafer, and the die is located according to template matching, and all die areas are generated according to the coordinates matched by the template.
[0091] In the specific implementation, the template matching method is suitable for dies with special patterns and cutting paths, with fast matching speed and high accuracy. Template matching positioning is to create a DEI area matching template on the wafer, perform die template matching on the entire wafer image, and match all die areas. All die areas are generated according to the coordinates matched by the template.
[0092] When the wafer image does not contain a die with a special pattern or a cutting path, the die region can be obtained by arbitrarily selecting a die threshold matching segmentation or template matching positioning in the cut image, and both can quickly locate the die region.
[0093] The two embodiments provide two methods for locating the die area. The threshold matching method is applicable to dies with a large number of dies or very large dies, and its speed is relatively fast. The template matching method is applicable to dies with special patterns and cutting paths.
[0094] Furthermore, in this embodiment, after generating a wafer map after wafer expansion according to the selected die, the following steps are further included:
[0095] According to the selected die, control whether the wafer circumscribed elliptical area is filled with die, whether to pass into the shielded area or invalid die area, and output the corresponding result.
[0096] It should be noted that according to the die output results of multiple selections: you can control whether the wafer area is filled with die, whether to pass into the shielded area or invalid die area, and output different results. Specifically, according to project requirements, 1. Select the real die area, that is, do not select the area where the die is missing, generate a map, and do not detect the area where the die is missing. 2. Select all die areas, that is, the real die area and the area where the die is missing, generate a map, and detect all valid die areas. 3. Select the die area to be detected according to the shielded area, generate a map, and do not detect the shielded area.
[0097] The comprehensive result output includes: output of wafer circular area, real die area, filled die area, all areas of rectangular die, and whether all single die areas are dies.
[0098] In this embodiment, it is identified whether the wafer image contains dies with special patterns and cutting paths. If so, the wafer image is cropped according to the circumscribed elliptical area of the wafer, and the die is located according to template matching. All die areas are generated according to the coordinates matched by the template. The template matching method is suitable for dies with special patterns and cutting paths, and can quickly locate the die, thereby improving the efficiency of generating the wafer map after expansion.
[0099] In addition, an embodiment of the present invention further proposes a storage medium, on which a program for generating a wafer map after expansion is stored. When the program for generating a wafer map after expansion is executed by a processor, the steps of the method for generating a wafer map after expansion as described above are implemented.
[0100] In addition, refer to Figure 6 The embodiment of the present invention further provides a device for generating a wafer map after wafer expansion, the device for generating a wafer map after wafer expansion comprising:
[0101] A calculation module 10 is used to obtain a wafer image of the wafer after the wafer is expanded, and calculate a wafer circumscribed elliptical area of the wafer after the wafer is expanded according to the wafer image;
[0102] A positioning module 20, used to crop the wafer image according to the elliptical area circumscribed by the wafer, and to locate all dies;
[0103] A filtering module 30, used for filtering the original real die outside the elliptical area circumscribed by the wafer;
[0104] A generating module 40 is used to calculate the average length and width dimensions of the original real die within the elliptical area circumscribed by the wafer, and generate a target real die with the same size and direction;
[0105] A completion module 50 is used to calculate a minimum bounding rectangle of a die area including all target real dies, and complete all dies within the minimum bounding rectangle to obtain a completed die area;
[0106] The generation module 40 is further used to select the die within the intersection of the supplementary die area and the wafer circumscribed elliptical area, and select the supplementary die and the target real die within the wafer circumscribed elliptical area, and generate a wafer map after expansion according to the selected die.
[0107] Other embodiments or specific implementations of the device for generating a wafer map after wafer expansion of the present invention may refer to the above-mentioned method embodiments and will not be described in detail here.
[0108] In addition, refer to Figure 7 Based on the first embodiment of the above method, the embodiment of the present invention further proposes a system for generating a wafer map after wafer expansion, the system for generating a wafer map after wafer expansion includes: Figure 1 The device 100 for generating a wafer map after expansion, a microscopic imaging module 200, and a high-precision motion platform 300 are shown; the device 100 for generating a wafer map after expansion is connected to the microscopic imaging module 200 and the high-precision motion platform 300 respectively, the microscopic imaging module 200 is arranged on the high-precision motion platform 300, and the device 100 for generating a wafer map after expansion controls the microscopic imaging module 200 to collect the field of view of the wafer to be detected. Usually, the wafer is placed on a chunk disk, the entire wafer is quickly scanned, and the wafer image of the wafer after expansion is obtained by scanning and saved, the chunk disk is placed on the high-precision motion platform 300, and the device 100 for generating a wafer map after expansion controls the movement of the high-precision motion platform 300 to realize the scanning of the entire wafer disk.
[0109] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or system including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or system. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or system including the element.
[0110] The serial numbers of the embodiments of the present invention are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments. In a unit claim that lists several means, several of these means may be embodied by the same hardware item. The use of the words first, second, and third, etc. does not indicate any order and these words may be interpreted as identifiers.
[0111] Through the description of the above implementation methods, those skilled in the art can clearly understand that the above-mentioned embodiment methods can be implemented by means of software plus a necessary general hardware platform, and of course by hardware, but in many cases the former is a better implementation method. Based on such an understanding, the technical solution of the present invention is essentially or the part that contributes to the prior art can be embodied in the form of a software product, which is stored in a storage medium (such as a read-only memory image (ROM) / random access memory (RAM), a magnetic disk, or an optical disk), and includes a number of instructions for a terminal device (which can be a mobile phone, a computer, a server, an air conditioner, or a network device, etc.) to execute the methods described in each embodiment of the present invention.
[0112] The above are only preferred embodiments of the present invention, and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.
Claims
1. A method for generating a wafer map after wafer expansion, characterized in that: The method for generating a wafer map after wafer expansion comprises the following steps: Acquire a wafer image of the wafer after expansion, and calculate a wafer circumscribed elliptical area of the wafer after expansion according to the wafer image; According to the elliptical area circumscribed by the wafer, the wafer image is cropped and all dies are located; Filtering the original real die outside the elliptical area circumscribed by the wafer; Calculate the average length and width dimensions of the original real die within the elliptical area circumscribed by the wafer to generate a target real die with the same size and direction; Calculate the minimum enclosing rectangle of the die area that includes all target real dies, and complete all dies within the minimum enclosing rectangle to obtain the completed die area; The die within the intersection of the supplementary die area and the wafer circumscribed elliptical area is selected, and the supplementary die and the target real die within the wafer circumscribed elliptical area are selected, and a wafer map after expansion is generated according to the selected die.
2. The method for generating a wafer map after wafer expansion according to claim 1, characterized in that: According to the elliptical area circumscribed by the wafer, the wafer image is cropped and all dies are located, including: Identifying the number of dies or die sizes in the wafer image; When there are many dies in the wafer image or the die size is large, the wafer image is cropped according to the circumscribed elliptical area of the wafer, and all the dies are located by threshold matching, and connection domain, filling and opening and closing operations are performed on all the dies to remove interference.
3. The method for generating a wafer map after wafer expansion according to claim 1, characterized in that: According to the elliptical area circumscribed by the wafer, the wafer image is cropped and all dies are located, including: Identify whether the wafer image contains a die with a special pattern and a cutting path; If included, the wafer image is cropped according to the elliptical area circumscribed by the wafer, and the die is located according to template matching, and all die areas are generated according to the coordinates matched by the template.
4. The method for generating a wafer map after wafer expansion according to claim 1, characterized in that: Filter the original real die outside the elliptical area of the wafer, including: Calculate the characteristic data of all die areas, and screen the original real die areas according to the characteristic data; Sort the original real Die area rows and columns; The original real die outside the elliptical area circumscribed by the wafer is filtered.
5. The method for generating a wafer map after wafer expansion according to claim 4, characterized in that: Calculate the characteristic data of all die areas, and screen the original real die areas according to the characteristic data, including: The characteristic data of all die areas are calculated, and the original real die areas are screened according to the characteristic data and the corresponding characteristic data error values.
6. The method for generating a wafer map after wafer expansion according to claim 4, characterized in that: Sort the original real Die area rows and columns, including: The original real Die area is sorted from top to bottom and from left to right according to the row and column intervals.
7. The method for generating a wafer map after wafer expansion according to any one of claims 1 to 6, characterized in that: After generating the wafer map after expansion according to the selected die, it also includes: According to the selected die, control whether the wafer circumscribed elliptical area is filled with die, whether to pass into the shielded area or invalid die area, and output the corresponding result.
8. A device for generating a wafer map after wafer expansion, characterized in that: The device for generating a wafer map after wafer expansion comprises: A calculation module, used for acquiring a wafer image of the wafer after the wafer is expanded, and calculating a wafer circumscribed elliptical area of the wafer after the wafer is expanded according to the wafer image; A positioning module, used for cutting the wafer image according to the elliptical area circumscribed by the wafer, and positioning all dies; A filtering module, used for filtering the original real die outside the elliptical area circumscribed by the wafer; A generation module, used to calculate the average length and width dimensions of the original real die within the elliptical area circumscribed by the wafer, and generate a target real die with the same size and direction; A completion module is used to calculate the minimum bounding rectangle of the die area containing all target real dies, and complete all dies in the minimum bounding rectangle to obtain a completed die area; The generation module is also used to select the die within the intersection of the completed die area and the wafer circumscribed elliptical area, and select the supplementary die and the target real die within the wafer circumscribed elliptical area, and generate a wafer map after expansion according to the selected die.
9. A device for generating a wafer map after wafer expansion, characterized in that: The device for generating a wafer map after expansion includes: a memory, a processor, and a program for generating a wafer map after expansion stored in the memory and executable on the processor. When the program for generating a wafer map after expansion is executed by the processor, the steps of the method for generating a wafer map after expansion as described in any one of claims 1 to 7 are implemented.
10. A storage medium, characterized in that: The storage medium stores a program for generating a wafer map after wafer expansion, and when the program for generating a wafer map after wafer expansion is executed by a processor, the steps of the method for generating a wafer map after wafer expansion as described in any one of claims 1 to 7 are implemented.