Wafer level chip packaging equipment and packaging method

Abstract

The invention discloses wafer-level chip packaging equipment and packaging method.The wafer-level chip packaging equipment is applied to the technical field of chip packaging device.The wafer-level chip packaging equipment comprises a rack, a feeding and discharging mechanism, a clamping mechanism, a dispensing mechanism, a display mechanism and a detection assembly; the feeding and discharging mechanism, the clamping mechanism, the dispensing mechanism and the detection assembly are all arranged in the rack, the clamping mechanism is arranged in the middle of the feeding and discharging mechanism, the dispensing mechanism is arranged on the side, away from the display mechanism, of the clamping mechanism, and the detection assembly is in signal connection with the display mechanism; the dispensing mechanism comprises a second supporting frame, a three-axis moving seat and a dispensing assembly. The dispensing assembly comprises a shell, a mixing assembly, a glue source and a three-way valve, the shell is of a hollow structure, the mixing assembly is arranged in the shell, and the detection assembly comprises a temperature sensor, a camera and a temperature and humidity sensor.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging equipment, and in particular to a wafer-level chip packaging equipment and a packaging method. Background Art

[0002] Wafer-Level Packaging (WLP) technology, as an advanced packaging form, significantly reduces chip size, power consumption and production costs, and improves integration by completing packaging and testing at the wafer stage. It is widely used in consumer electronics, communications, automotive electronics and other fields.

[0003] In the wafer-level chip packaging process, the dispensing process is a key link to ensure the mechanical support of the packaging structure, sealing protection and solder joint reliability. However, traditional dispensing equipment relies on a fixed temperature and humidity environment for colloid coating. Environmental fluctuations can easily lead to changes in the rheological properties of the colloid, which in turn causes problems such as uneven glue volume, residual bubbles, and abnormal colloid flow. Frequent shutdowns and calibrations are required, affecting yield and production efficiency.

[0004] Therefore, it is necessary to provide a wafer-level chip packaging device and packaging method to solve the above problems. Summary of the invention

[0005] The object of the present invention is to provide a wafer-level chip packaging device and a packaging method, which can improve the packaging yield and production efficiency of wafer-level chip packaging to solve the problems raised in the above-mentioned background technology.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions: a wafer-level chip packaging device, comprising a frame, a loading and unloading mechanism, a clamping mechanism, a dispensing mechanism, a display mechanism and a detection component, wherein the display mechanism is arranged above one side of the frame, the loading and unloading mechanism, the clamping mechanism, the dispensing mechanism and the detection component are all arranged inside the frame, the clamping mechanism is arranged in the middle of the loading and unloading mechanism, the dispensing mechanism is arranged on a side of the clamping mechanism away from the display mechanism, and the detection component is connected to the display mechanism by signal; The dispensing mechanism includes a support frame with two and three axis moving seats and a dispensing assembly; The dispensing assembly comprises a shell, a mixing assembly, a glue source and a three-way valve, the shell is a hollow structure, and the mixing assembly is arranged inside the shell; The detection component includes a temperature sensor, a camera and a temperature and humidity sensor. The temperature sensor, camera and temperature and humidity sensor are all signal-connected to an acquisition and analysis module. The acquisition and analysis module is arranged inside the display mechanism. The acquisition and analysis module is used to perform analysis based on the temperature and shape of the glue during dispensing and the temperature and humidity inside the rack.

[0007] According to the above technical solution, the loading and unloading mechanism includes a rack, a loading assembly and a unloading assembly arranged on both sides of the rack, and a lateral material changing assembly arranged on the side of the rack away from the display mechanism; The feeding assembly comprises a biaxial movable seat 1, two sets of connecting seats 1 and a suction cup 1 arranged on the connecting seat 1, wherein the connecting seat 1 is fixed to a side of the biaxial movable seat 1 close to the lateral material changing assembly, and the suction cup 1 is fixed to the connecting seat 1; The structure of the unloading assembly is the same as that of the loading assembly and the connection method is the same. The unloading assembly includes a second dual-axis movable seat, two sets of second connecting seats and a second suction cup arranged on the second connecting seat.

[0008] According to the above technical scheme, the horizontal material changing assembly includes a support seat and a storage tray arranged above the support seat, the support seat is fixedly connected to the frame, the support seat is arranged between the loading assembly and the unloading assembly, two groups of slide grooves are arranged on the top of the support seat, two groups of slide rails are fixedly connected to the bottom of the support seat, a slider is slidably connected to the slide rail, the storage tray is fixedly connected to the slider, the connection between the slider and the storage tray is located in the slide groove, the slider is slidably connected to the support seat, and a drive one is arranged on the side of the support seat close to the unloading assembly, the output end of the drive one is connected to the support seat bearing, and the output end of the drive one is threadedly connected to the slider.

[0009] A photoelectric switch is fixedly connected to the bottom of the support seat, and a sensing sheet is fixedly connected to the side of the slider close to the photoelectric switch.

[0010] According to the above technical solution, the clamping mechanism includes a support frame 1 and a temperature control disk, the support frame 1 is fixedly connected to the frame, the temperature control disk is fixed to the top of the support frame 1, the top of the support frame 1 is fixedly connected to a plurality of cylinders 1, the output end of the cylinder 1 is fixedly connected to a clamping block, and the bottom of the support frame 1 is provided with a heat source, and the heat source includes a heat source and a cold source; A heat medium channel and a cold medium channel are arranged inside the temperature control disk. The heat medium channel is connected to the heat source pipeline of the heat source, and the cold medium channel is fixedly connected to the cold source of the heat source. The heat medium channel and the cold medium channel are alternately arranged in a spiral shape.

[0011] According to the above technical solution, the support frame 2 is fixedly connected to the frame, the support frame 2 is arranged on the side of the clamping mechanism away from the display mechanism, the three-axis movable seat is fixed to the top of the support frame 2, the three-axis movable seat is fixedly connected to a cylinder, the output end of the cylinder is fixedly connected to a connecting seat 3, and the dispensing assembly is fixed on the connecting seat 3.

[0012] According to the above technical solution, one side of the shell is provided with glue inlet 1, glue inlet 2 and glue outlet in sequence from top to bottom, and a glue outlet head is provided at the bottom of the shell.

[0013] According to the above technical solution, the three-way valve includes two groups of outlets and one group of inlet, the two groups of outlets of the three-way valve are connected to the glue inlet one and the glue inlet two pipelines, a pump body one is arranged inside the glue source, the inlet of the three-way valve is connected to the pump body one pipeline, a temperature control part one is arranged on the pipeline connecting the glue inlet two and the three-way valve, the glue outlet is connected to the glue source pipeline, and a pump body two and a temperature control part two are arranged in sequence on the pipeline connecting the glue outlet and the glue source.

[0014] According to the above technical solution, the mixing assembly includes a servo motor, inner stirring blades, two groups of connecting rings and a plurality of outer stirring blades, the servo motor is fixed to the top of the shell, the output end of the servo motor is fixedly connected to the inner stirring blades, the inner stirring blades, connecting rings and outer stirring blades are all arranged inside the shell, the two groups of connecting rings are distributed at the top and bottom of the shell, the connecting rings are rotatably connected to the shell, the inner stirring blades are connected to a transmission part, and the transmission part is also connected to the connecting ring located at the top of the shell, a plurality of outer stirring blades are fixed between the two groups of connecting rings, and the bottom of the inner stirring blades is rotatably connected to the connecting ring located at the bottom of the shell.

[0015] According to the above technical solution, the temperature sensor and the camera are fixed to the bottom of the connecting seat 3, and the temperature and humidity sensor is fixed inside the frame, close to one side of the dispensing mechanism.

[0016] Compared with the prior art, the beneficial effects achieved by the present invention are: the present invention, by providing a loading and unloading mechanism, can simplify the complexity of the robot arm, realize the precise movement of the wafer in the horizontal and vertical directions, and improve the efficiency of wafer loading and unloading; By setting up a clamping mechanism, on the basis of realizing basic wafer clamping, the hot and cold sources can be dynamically switched according to the solidification state of the glue, and the rapid response and uniform control of the wafer temperature can be achieved by alternately introducing the hot and cold sources, avoiding the interference of the mixing of cold and hot media, and reducing temperature fluctuations; By setting up the dispensing mechanism and detection components, the uniformity of the glue temperature during dispensing can be improved. According to the shape of the glue after dispensing, the glue temperature and the temperature of the temperature control disk can be dynamically adjusted to reduce the impact of ambient temperature and humidity on dispensing. At the same time, the recycling of glue and self-cleaning of pipelines can be achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings: Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a partial structural schematic diagram of the present invention; Figure 3It is a schematic diagram of the internal part of the frame of the present invention; Figure 4 It is a left side cross-sectional schematic diagram of the internal structure of the frame of the present invention; Figure 5 is a top view and cross-sectional schematic diagram of the temperature control disk of the present invention; Figure 6 The present invention Figure 3 A schematic diagram of the enlarged structure of the middle A area; Figure 7 is a schematic cross-sectional view of a glue dispensing assembly of the present invention; Figure 8 It is a schematic diagram of the internal structure of the glue dispensing component of the present invention; Fig. 9 The present invention Figure 8 Schematic diagram of the enlarged structure of the middle B area; In the figure: 1. Frame; 2. Loading and unloading mechanism; 21. Storage rack; 22. Loading assembly; 221. Two-axis moving seat 1; 222. Connecting seat 1; 223. Suction cup 1; 23. Horizontal material changing assembly; 231. Support seat; 232. Slide; 233. Slide rail; 234. Sliding block; 235. Storage tray; 236. Drive 1; 237. Photoelectric switch; 238. Induction sheet; 24. Unloading assembly; 241. Two-axis moving seat 2; 242. Connecting seat 2; 243. Suction cup 2; 3. Clamping mechanism; 31. Support frame 1; 32. Cylinder 1; 33. Temperature control panel; 331. Heat medium channel; 332. Refrigerant channel; 34. Heat source; 4. Glue dispensing mechanism; 41. Support frame 2; 42. Three-axis moving seat; 43. Cylinder; 44. Connecting seat 3; 45. Glue dispensing assembly; 451. Shell; 452. Glue inlet 1; 453. Glue inlet 2; 454. Glue outlet; 455. Glue outlet; 456. Temperature control unit 1; 457. Pump body 2; 458. Temperature control unit 2; 46. Mixing assembly; 461. Servo motor; 462. Internal stirring blade; 463. Transmission unit; 464. Connecting ring; 465. External stirring blade; 47. Glue source; 471. Pump body 1; 5. Display mechanism; 6. Detection component; 61. Temperature sensor; 62. Camera. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] See also Figure 1-9 The present invention provides a technical solution: a wafer-level chip packaging device and a packaging method, comprising a frame 1, a loading and unloading mechanism 2, a clamping mechanism 3, a dispensing mechanism 4, a display mechanism 5 and a detection component 6, wherein the display mechanism 5 is arranged above one side of the frame 1, the loading and unloading mechanism 2, the clamping mechanism 3, the dispensing mechanism 4 and the detection component 6 are all arranged inside the frame 1, the clamping mechanism 3 is arranged in the middle of the loading and unloading mechanism 2, the dispensing mechanism 4 is arranged on the side of the clamping mechanism 3 away from the display mechanism 5, the detection component 6 is connected with the display mechanism 5 by signal, the loading and unloading mechanism 2 is used for loading and unloading wafers before and after dispensing, the clamping mechanism 3 is used for clamping wafers during dispensing, the dispensing mechanism 4 is used for dispensing glue on the clamped wafers, the display mechanism 5 is used for setting, controlling and displaying the dispensing steps, and the detection component 6 is used for detecting the picture and temperature during dispensing.

[0020] Specifically, Figure 2 and Figure 3 As shown, the loading and unloading mechanism 2 includes a rack 21, a loading assembly 22 and a unloading assembly 24 arranged on both sides of the rack 21, and a lateral material changing assembly 23 arranged on the side of the rack 21 away from the display mechanism 5. The rack 21 is used to place wafers before and after glue dispensing, the loading assembly 22 and the lateral material changing assembly 23 are used to load and unload wafers before and after glue dispensing, and the lateral material changing assembly 23 is used to drive the wafers to move between the loading assembly 22 and the unloading assembly 24; Further, such as Figure 2 As shown, the loading assembly 22 includes a dual-axis movable seat 221, two groups of connecting seats 222 and a suction cup 223 arranged on the connecting seat 222, the connecting seat 222 is fixed to the dual-axis movable seat 221 close to the side of the horizontal material replacement assembly 23, the connecting seat 222 is L-shaped, the suction cup 223 is fixed on the connecting seat 222, the suction cup 223 pipeline is connected to a dual-purpose air pump, the dual-axis movable seat 221 is a dual-drive, dual-output dual-axis movable seat, the dual-axis movable seat 221 is used to drive the two groups of suction cups 223 to move along the display mechanism 5 toward the dispensing mechanism 4 and move up and down, and the suction cup 223 is used to adsorb the wafer.

[0021] like Figure 3 As shown, the structure of the unloading component 24 is the same as the structure and connection method of the loading component 22. The unloading component 24 includes a dual-axis movable seat 241, two groups of connecting seats 242 and a suction cup 243 arranged on the connecting seat 242. The difference is that the bottom length of the connecting seat 242 is greater than the bottom length of the L-shaped connecting seat 1 222.

[0022] like Figure 3 and Figure 4As shown, the transverse material changing assembly 23 includes a support seat 231 and a storage tray 235 arranged above the support seat 231, the support seat 231 is fixedly connected to the frame 1, the support seat 231 is arranged between the loading assembly 22 and the unloading assembly 24, two groups of slide grooves 232 are arranged on the top of the support seat 231, two groups of slide rails 233 are fixedly connected to the bottom of the support seat 231, a slider 234 is slidably connected to the slide rail 233, the storage tray 235 is fixedly connected to the slider 234, the connection between the slider 234 and the storage tray 235 is located in the slide groove 232, and the slider 23 4 is slidably connected with the support seat 231. A drive 1 236 is arranged on one side of the support seat 231 close to the unloading assembly 24. The drive 1 236 is a motor screw drive structure. The drive 1 236 includes a motor drive end and a screw output end. The motor drive end is fixed on the support seat 231. The screw output end is connected to the bearing of the support seat 231. The screw output end is threadedly connected to the slider 234. The drive 1 236 is used to drive the slider 234 to move along the axial direction of the screw output end, thereby driving the placement plate 235 to move between the loading assembly 22 and the unloading assembly 24.

[0023] A photoelectric switch 237 is fixedly connected to the bottom of the support seat 231, and a sensor sheet 238 is fixedly connected to the slider 234 near the photoelectric switch 237. The photoelectric switch 237 and the sensor sheet 238 are used to ensure that the drive 236 drives the slider 234. When the slider 234 drives the placement plate 235 to move, the position of the placement plate 235 is accurate, thereby ensuring that the position of the subsequent wafer is fixed when glue is dispensed on the clamping mechanism 3.

[0024] In actual operation, the wafer is placed on the rack 21 by the robot, and the drive 236 starts forward rotation, and the driving slider 234 drives the placement plate 235 to move to the side of the lower material component 24. The lower material component 24 first transfers the wafer on the rack 21 to the placement plate 235; then, the drive 236 starts reverse rotation, and the driving slider 234 drives the placement plate 235 to move to the side of the upper material component 22; the loading component 22 first transfers the wafer on the placement plate 235 to the clamping mechanism 3; after the wafer on the clamping mechanism 3 is glued, the unloading component 24 transfers the wafer on the clamping mechanism 3 to the rack 21, and then the robot collects the wafers that have been glued.

[0025] It should be noted that when the wafer is being glued on the clamping mechanism 3, there are no wafers that need to be transferred on the unloading assembly 24. The robot places the wafer to be glued on the rack 21 again and transfers it to the placement plate 235 through the unloading assembly 24, ensuring that after the wafer is glued on the clamping mechanism 3, there are no wafers to be glued on the top of the rack 21, so that the rack 21 can hold the wafers that have been glued. At this time, the robot can also directly place the wafers to be glued after collecting the wafers that have been glued, thereby improving the glue efficiency in packaging.

[0026] Specifically, Figure 3-Figure 5 As shown, the clamping mechanism 3 includes a support frame 31 and a temperature control disk 33, the support frame 31 is fixedly connected to the frame 1, the temperature control disk 33 is fixed to the top of the support frame 31, a plurality of cylinders 32 are fixedly connected to the top of the support frame 31, a clamping block is fixedly connected to the output end of the cylinder 32, the cylinders 32 are arranged at equal intervals on the periphery of the temperature control disk 33, and a heat source 34 is arranged at the bottom of the support frame 31. The heat source 34 includes a heat source and a cold source. The cold source can be a refrigeration-related device, and the heat source can be a heating-related device; A heat medium channel 331 and a cold medium channel 332 are arranged inside the temperature control disk 33. The heat medium channel 331 is connected to the heat source pipeline of the heat source 34, and the cold medium channel 332 is fixedly connected to the cold source of the heat source 34. The heat medium channel 331 and the cold medium channel 332 are alternately arranged in a spiral shape. By alternately arranging the heat medium channel 331 and the cold medium channel 332, the temperature of the temperature control disk 33 is controlled, and the temperature of the wafer on the temperature control disk 33 is controlled in a direct contact manner, thereby avoiding the influence of ambient temperature changes on the wafer temperature. At the same time, the intervals between the heat medium channel 331 and the cold medium channel 332 can smoothly heat up and cool down the wafer.

[0027] In actual operation, when the wafer is transferred to the temperature control disk 33, the cylinder 1 32 extends, driving the clamping block to approach the center of the temperature control disk 33, so that the clamping block fixes the wafer on the temperature control disk 33; when the ambient temperature changes, when the temperature control disk 33 needs to be heated up, a heat source is introduced into the heat medium channel 331, and the cold medium channel 332 is closed; when the temperature control disk 33 needs to be cooled down, a cold source is introduced into the cold medium channel 332, and the heat medium channel 331 is closed, so as to control the temperature of the temperature control disk 33, which can reduce the impact of ambient temperature changes on the wafer during glue dispensing. At the same time, when the wafer glue dispensing temperature is high, the temperature of the temperature control disk 33 and the wafer on the temperature control disk 33 can be adjusted by controlling the heat source 34 to introduce a heat source into the heat medium channel 331 or a cold source into the cold medium channel 332.

[0028] Specifically, Figure 3 , Figure 6-9 As shown, the glue dispensing mechanism 4 includes a support frame 41, a three-axis movable seat 42 and a glue dispensing component 45. The support frame 41 is fixedly connected to the frame 1, and the support frame 41 is arranged on the side of the clamping mechanism 3 away from the display mechanism 5. The three-axis movable seat 42 is fixed to the top of the support frame 41. The three-axis movable seat 42 is fixedly connected to the cylinder 43, and the output end of the cylinder 43 is fixedly connected to the connecting seat 3 44. The connecting seat 3 44 is L-shaped, and the glue dispensing component 45 is fixed on the connecting seat 3 44. The three-axis movable seat 42 is used to drive the glue dispensing component 45 to move up and down, move along the setting direction of the feeding component 22, and move in a direction perpendicular to the setting direction of the feeding component 22.

[0029] Furthermore, the glue dispensing assembly 45 includes a shell 451, a mixing assembly 46, a glue source 47 and a three-way valve. The shell 451 is a hollow structure. The mixing assembly 46 is arranged inside the shell 451. One side of the shell 451 is provided with a glue inlet 452, a glue inlet 453 and a glue outlet 454 from top to bottom in sequence. A glue outlet head 455 is provided at the bottom of the shell 451. The three-way valve includes two groups of outlets and one group of inlet, the two groups of outlets of the three-way valve are connected with the glue inlet 1 452 and the glue inlet 2 453 by pipeline, a pump body 1 471 is arranged inside the glue source 47, the inlet of the three-way valve is connected with the pump body 1 471 by pipeline, a temperature control unit 1 456 is arranged on the pipeline connecting the glue inlet 2 453 and the three-way valve, the temperature control unit 1 456 is used for fine-tuning the temperature of the glue entering the shell 451 through the glue inlet 2 453, the glue outlet 454 is connected with the glue source 47 by pipeline, a pump body 2 457 and a temperature control unit 2 458 are arranged in sequence on the pipeline connecting the glue outlet 454 and the glue source 47, the temperature control unit 2 458 is used for adjusting the temperature of the glue flowing back to the glue source 47, and preventing the solidified glue from clogging the pump body 2 457.

[0030] It should be noted that a one-way valve is provided at the glue outlet 455 to prevent air from entering during backflow, and the temperature control unit 1 456 and the pump body 2 457 can both control the temperature rise and fall of the glue.

[0031] In actual operation, the outlet of the three-way valve connected to the glue inlet 1 452 is opened, the outlet connected to the glue inlet 2 453 is closed, and the pump body 1 471 is started to pump the glue inside the glue source 47 into the shell 451 through the glue inlet 1 452; when there is a small deviation between the dispensing temperature and the set temperature, the outlet of the three-way valve connected to the glue inlet 1 452 is closed, the outlet connected to the glue inlet 2 453 is opened, and the temperature control unit 1 456 is started to fine-tune the glue entering the shell through the glue inlet 2 453. The temperature of the glue inside 451; when the glue outlet 455 is blocked or dispensing needs to be stopped, the pump body 471 stops running, the outlet of the three-way valve connected to the glue inlet 452 and the outlet connected to the glue inlet 453 are closed, and the pump body 457 is started. Since the bottom of the glue outlet 455 is open, the glue inside the shell 451 can flow back to the glue source 47 after the pump body 471 is started, thereby achieving the effect of cleaning the inside of the shell 451 and avoiding blockage of the glue outlet 455.

[0032] Further, the mixing assembly 46 includes a servo motor 461, an inner stirring blade 462, two groups of connecting rings 464 and a plurality of outer stirring blades 465, the servo motor 461 is fixed to the top of the shell 451, the output end of the servo motor 461 is fixedly connected to the inner stirring blade 462, the inner stirring blade 462, the connecting ring 464 and the outer stirring blade 465 are all arranged inside the shell 451, the two groups of connecting rings 464 are distributed at the top and bottom of the shell 451, the connecting ring 464 is rotatably connected to the shell 451, the inner stirring blade 462 is connected to a transmission part 463, the transmission part 463 is a planetary gear transmission structure, the transmission part 463 is also connected to the connecting ring 464 located at the top of the shell 451, a plurality of outer stirring blades 465 are fixed between the two groups of connecting rings 464, the bottom of the inner stirring blade 462 is rotatably connected to the connecting ring 464 located at the bottom of the shell 451, and the spiral directions of the inner stirring blade 462 and the outer stirring blade 465 are opposite; In actual operation, the servo motor 461 starts to rotate forward, driving the inner stirring blades 462 to rotate forward, thereby stirring the glue in the middle part of the shell 451. While the servo motor 461 rotates forward, it drives the connecting ring 464 to reverse through the connected transmission part 463, thereby driving the outer stirring blades 465 to stir the glue on the inner edge part of the shell 451. Since the spiral directions of the inner stirring blades 462 and the outer stirring blades 465 are opposite, convection can be formed when the inner stirring blades 462 and the outer stirring blades 465 rotate, thereby enhancing the uniformity of mixing of the glue inside the shell 451, which is beneficial to ensuring the subsequent glue dispensing effect, thereby ensuring the packaging quality of the wafer.

[0033] Specifically, Figure 6 As shown, the detection component 6 includes a temperature sensor 61, a camera 62 and a temperature and humidity sensor. The temperature sensor 61 and the camera 62 are fixed at the bottom of the connecting seat 3 44. The temperature sensor 61 is used to detect the temperature of the glue on the wafer during glue dispensing. The temperature and humidity sensor is fixed inside the frame 1, close to the side of the glue dispensing mechanism 4. The camera 62 is used to photograph the shape of the glue on the wafer during glue dispensing. The temperature sensor 61, the camera 62 and the temperature and humidity sensor are all signal-connected to a collection and analysis module. The collection and analysis module is arranged inside the display mechanism 5. The collection and analysis module is used to perform analysis based on the temperature of the glue, the shape of the glue and the temperature and humidity inside the frame 1 during glue dispensing.

[0034] Wafer-level chip packaging method: Step 1: The robot places the wafer to be glued on the rack 21, and the loading assembly 22 and the unloading assembly 24 transfer the wafer to be glued to the clamping mechanism 3, and the clamping mechanism 3 fixes and clamps the wafer to be glued; Step 2: Control the glue dispensing mechanism 4 to dispense glue to the wafer clamped on the clamping mechanism 3. The collection and analysis module obtains the glue temperature, glue shape and temperature and humidity inside the rack 1, and adjusts the glue temperature entering the shell 451 and the temperature of the temperature control disk 33 according to the acquired data.

[0035] It should be noted that the initial state of the glue dispensing component 45 during glue dispensing is that the outlet of the three-way valve connected to the glue inlet 1 452 is open, and the outlet connected to the glue inlet 2 453 is closed, and the mixing component 46 remains in the driving state to stir and mix the glue inside the shell 451.

[0036] Step 2-1: Obtain the glue temperature, the temperature and humidity inside the rack 1, and the glue shape.

[0037] Specifically, the acquisition and analysis module first obtains the glue shape, which mainly includes the width of the glue when dispensing along the set route and whether there are bubbles. The actual width of the glue is recorded as d, and the standard width range set in the acquisition and analysis module is d 1 -d 2 , d 1 is the minimum width of glue, d 2 It is the maximum width of the glue. When the actual width of the glue is within the standard width range and there are no bubbles, the dispensing width meets the production requirements.

[0038] The acquisition and analysis module obtains the temperature detected by the temperature sensor 61 during dispensing, and the temperature and humidity sensor obtains the temperature and humidity of the internal environment of the rack 1. The glue temperature is recorded as t, the temperature inside the rack 1 is recorded as T, and the humidity inside the rack 1 is recorded as RH.

[0039] The collection and analysis module is set with the glue standard temperature range, the temperature difference threshold between the glue temperature and the internal temperature of rack 1, and the humidity threshold. The glue standard temperature range is recorded as t 1 -t 2 , t 1 is the lowest temperature allowed for glue during dispensing, t 2 is the maximum temperature allowed for glue during dispensing. The standard temperature range of glue is used to determine whether the temperature during dispensing will affect the shape of the glue. The temperature difference threshold is recorded as ΔT, and ΔT is the maximum temperature difference allowed during normal dispensing. The actual difference between the glue temperature and the internal ambient temperature of rack 1 is recorded as Δt, Δt=tT. The temperature difference threshold is used to determine whether the large temperature difference affects the solidification speed of the glue under the set humidity environment, thereby affecting the shape of the glue dispensing. The humidity threshold is recorded as RH', and the humidity threshold is the maximum humidity allowed during normal dispensing. The humidity threshold is used to determine whether the dispensing quality is affected by the high humidity inside rack 1.

[0040] Step 2-2: The acquisition and analysis module performs data analysis and judgment.

[0041] Case 1: In d∈[d1 , d 2 ] and there are no bubbles in the glue, the dispensing process of the packaging device is normal, and the subsequent dispensing operation can be continued according to the relevant temperature parameters of the dispensing at this time. All other situations are abnormal; Case 2: In d [d 1 , d 2 ], it is the temperature abnormality during the dispensing process of the packaging device; Case 2-1: When d<d 1 When the glue is dispensed, it solidifies quickly, resulting in a small width of the glue after dispensing; If at this time t∈[t 1 , t 2 ], the glue dispensing temperature is normal. When Δt≤ΔT, the ambient temperature in the rack 1 is normal. At this time, the small glue width is caused by the low temperature of the wafer itself. The heat source of the heat source 34 is controlled to pass a small amount into the hot medium channel 331, and the cold medium channel 332 is closed. Since the heat source input is small at this time, the temperature control disk 33 can be slowly heated up, thereby increasing the temperature of the wafer and promoting the flow of glue dispensed on the wafer; when Δt>ΔT, the small glue width is caused by the low ambient temperature inside the rack 1. The heat source of the heat source 34 is controlled to pass a large amount into the hot medium channel 331, and the cold medium channel 332 is closed, and the temperature control disk 33 is heated up. Since the heat source input is large at this time, the temperature control disk 33 can be quickly heated up, thereby increasing the temperature of the wafer and the glue on the wafer, which is beneficial to promote the flow of glue dispensed and expand the width of the glue after solidification; If t<t 1 , it is caused by low dispensing temperature. At this time, it is not affected by the temperature difference between the glue temperature and the internal ambient temperature of the frame 1. The outlet of the three-way valve connected to the glue inlet 452 is closed, and the outlet connected to the glue inlet 453 is opened. The temperature control unit 456 is started to heat the glue entering the shell 451 through the glue inlet 453. At the same time, the mixing component 46 continues to mix and stir the glue inside the shell 451. If t>t 2 , because the dispensing temperature is high, the small glue width is caused by the large temperature difference between the glue and the wafer, and is not affected by the temperature difference between the glue temperature and the ambient temperature in the rack 1. The outlet of the three-way valve connected to the glue inlet 452 is still opened, and the outlet connected to the glue inlet 453 is closed. At the same time, the heat source of the heat source 34 is controlled to pass into the heat medium channel 331 in large quantities, and the cold medium channel 332 is closed, so as to quickly heat up the temperature control disk 33 to promote the flow of glue dispensed on the wafer.

[0042] Case 2-2: When d>d 2 When the glue is dispensed, it solidifies slowly, resulting in a large width of glue after dispensing; If at this time t∈[t 1 , t2 ], the glue dispensing temperature is normal. When Δt≤ΔT, the ambient temperature in the rack 1 is normal. At this time, the wide glue width is caused by the high ambient temperature. The cold source of the heat source 34 is controlled to pass a small amount of cold source into the cold medium channel 332, and the hot medium channel 331 is closed. Since the cold source is small at this time, the temperature control disk 33 can cool down slowly, thereby inhibiting the flow of glue for glue dispensing; when Δt>ΔT, the ambient temperature is low, and the wide glue width is caused by the high temperature of the wafer itself. The cold source of the heat source 34 is controlled to pass a large amount of cold source into the cold medium channel 332, and the hot medium channel 331 is closed. Since the cold source is large at this time, the temperature control disk 33 can cool down quickly, which is beneficial to inhibiting the flow of glue for glue dispensing; If t<t 1 , because the dispensing temperature is low, at this time only the high temperature of the wafer itself can cause the glue width to be large, so the outlet of the three-way valve connected to the glue inlet 1 452 is still kept open, and the outlet connected to the glue inlet 2 453 is closed, and at the same time, the cold source of the heat source 34 is controlled to flow into the cold medium channel 332 in large quantities, and the hot medium channel 331 is closed, so as to cool the temperature control disk 33 and inhibit the flow of glue for dispensing; If t>t 1 , because the dispensing temperature is high, at this time the width of the glue is not affected by the temperature difference between the glue temperature and the internal ambient temperature of the frame 1, the outlet of the three-way valve connected to the glue inlet 452 is closed, and the outlet connected to the glue inlet 453 is opened, and the temperature control unit 456 is started to cool the glue entering the shell 451 through the glue inlet 453, thereby reducing the glue temperature inside the shell 451.

[0043] Case 3: When there are bubbles in the glue, if RH≤RH', it is caused by gas mixed in the glue dispensing component 45 and the glue source 47; if RH>RH', it is because the humidity inside the rack 1 is high. During the glue solidification process, the moisture in the air condenses on the wafer and is then wrapped by the flowing glue, thereby forming bubbles. The collection and analysis module issues an alarm and dehumidification processing is required.

[0044] It should be noted that, if in the above situation, after adjusting the glue temperature in the shell 451 for multiple times, the glue width is still not within the set standard range or the glue outlet 455 is blocked, the outlet of the three-way valve connected to the glue inlet 452 is controlled to be closed, and the outlet connected to the glue inlet 453 is controlled to be closed, and the pump body 457 is controlled to start heating and the pump body 471 is controlled to start, so that the glue inside the shell 451 flows back to the glue source 47, and the glue temperature inside the glue source 47 is adjusted. The specific number of adjustments allowed is set manually; in order to improve the quality and efficiency of glue dispensing in the packaging device, an abnormal situation counting threshold is set in the collection and analysis module and the abnormal situations are classified and counted. When the count value reaches the counting threshold, the corresponding control operation is performed to increase the control adjustment frequency during glue dispensing, thereby ensuring the glue dispensing quality and improving the packaging efficiency.

[0045] Step 3: Control the unloading component 24 to unload the wafers after dispensing, and collect them by the robot.

[0046] Through the above steps, the temperature and shape of the wafer during gluing, as well as the temperature and humidity inside the rack 1 can be monitored in real time. The glue temperature inside the shell 451 and the temperature of the temperature control disk 33 are adjusted according to the obtained gluing temperature and shape to ensure that the final wafer has a good gluing effect, thereby ensuring the packaging quality of the wafer.

[0047] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0048] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A wafer-level chip packaging device, comprising a frame (1), a loading and unloading mechanism (2), a clamping mechanism (3), a dispensing mechanism (4), a display mechanism (5) and a detection component (6), characterized in that: The display mechanism (5) is arranged above one side of the frame (1); the loading and unloading mechanism (2), the clamping mechanism (3), the dispensing mechanism (4), and the detection component (6) are all arranged inside the frame (1); the clamping mechanism (3) is arranged in the middle of the loading and unloading mechanism (2); the dispensing mechanism (4) is arranged on a side of the clamping mechanism (3) away from the display mechanism (5); and the detection component (6) is connected to the display mechanism (5) by signal. The glue dispensing mechanism (4) comprises a second support frame (41), a three-axis movable seat (42) and a glue dispensing component (45); The glue dispensing component (45) comprises a shell (451), a mixing component (46), a glue source (47) and a three-way valve; the shell (451) is a hollow structure, and the mixing component (46) is arranged inside the shell (451); The detection component (6) comprises a temperature sensor (61), a camera (62) and a temperature and humidity sensor, wherein the temperature sensor (61), the camera (62) and the temperature and humidity sensor are all connected to a signal acquisition and analysis module, and the acquisition and analysis module is arranged inside the display mechanism (5).

2. The wafer-level chip packaging device according to claim 1, characterized in that: The loading and unloading mechanism (2) comprises a storage rack (21), a loading assembly (22) and a unloading assembly (24) arranged on both sides of the storage rack (21), and a transverse material changing assembly (23) arranged on a side of the storage rack (21) away from the display mechanism (5); The loading assembly (22) comprises a biaxial movable seat (221), two sets of connecting seats (222) and a suction cup (223) arranged on the connecting seat (222), wherein the connecting seat (222) is fixed to a side of the biaxial movable seat (221) close to the lateral material changing assembly (23), and the suction cup (223) is fixed to the connecting seat (222); The structure of the unloading assembly (24) is the same as the structure and connection method of the loading assembly (22). The unloading assembly (24) comprises a second dual-axis movable seat (241), two sets of second connecting seats (242) and a second suction cup (243) arranged on the second connecting seat (242).

3. The wafer-level chip packaging device according to claim 2, characterized in that: The transverse material changing assembly (23) comprises a support seat (231) and a storage tray (235) arranged above the support seat (231); the support seat (231) is fixedly connected to the frame (1); the support seat (231) is arranged between the loading assembly (22) and the unloading assembly (24); two groups of slide grooves (232) are arranged on the top of the support seat (231); two groups of slide rails (233) are fixedly connected to the bottom of the support seat (231); and sliders are slidably connected to the slide rails (233). (234), the storage tray (235) is fixedly connected to the slider (234), the connection between the slider (234) and the storage tray (235) is located in the slide groove (232), the slider (234) is slidably connected to the support seat (231), a drive one (236) is provided on the side of the support seat (231) close to the blanking component (24), the output end of the drive one (236) is connected to the bearing of the support seat (231), and the output end of the drive one (236) is threadedly connected to the slider (234); A photoelectric switch (237) is fixedly connected to the bottom of the support seat (231), and a sensing sheet (238) is fixedly connected to the side of the slider (234) close to the photoelectric switch (237).

4. The wafer-level chip packaging device according to claim 3, characterized in that: The clamping mechanism (3) comprises a support frame (31) and a temperature control disk (33), wherein the support frame (31) is fixedly connected to the frame (1), the temperature control disk (33) is fixed to the top of the support frame (31), a plurality of cylinders (32) are fixedly connected to the top of the support frame (31), a clamping block is fixedly connected to the output end of the cylinder (32), and a heat source (34) is arranged at the bottom of the support frame (31), wherein the heat source (34) comprises a heat source and a cold source; A heat medium channel (331) and a cold medium channel (332) are arranged inside the temperature control disk (33); the heat medium channel (331) is connected to the heat source pipeline of the heat source (34); the cold medium channel (332) is fixedly connected to the cold source of the heat source (34); the heat medium channel (331) and the cold medium channel (332) are alternately arranged in a spiral shape.

5. The wafer-level chip packaging device according to claim 4, characterized in that: The second support frame (41) is fixedly connected to the frame (1); the second support frame (41) is arranged on a side of the clamping mechanism (3) away from the display mechanism (5); the three-axis movable seat (42) is fixedly connected to the top of the second support frame (41); the three-axis movable seat (42) is fixedly connected to a cylinder (43); the output end of the cylinder (43) is fixedly connected to a connecting seat three (44); and the dispensing assembly (45) is fixed to the connecting seat three (44).

6. The wafer-level chip packaging device according to claim 5, characterized in that: One side of the shell (451) is provided with a first glue inlet (452), a second glue inlet (453) and a glue outlet (454) in sequence from top to bottom, and a glue outlet head (455) is provided at the bottom of the shell (451).

7. The wafer-level chip packaging device according to claim 6, characterized in that: The three-way valve comprises two groups of outlets and one group of inlet, the two groups of outlets of the three-way valve are connected to the first glue inlet (452) and the second glue inlet (453) pipelines, a pump body (471) is arranged inside the glue source (47), the inlet of the three-way valve is connected to the pump body (471) pipeline, a temperature control unit (456) is arranged on the pipeline connecting the second glue inlet (453) and the three-way valve, the glue outlet (454) is connected to the glue source (47) pipeline, and a pump body (457) and a temperature control unit (458) are arranged in sequence on the pipeline connecting the glue outlet (454) and the glue source (47).

8. The wafer-level chip packaging device according to claim 7, characterized in that: The mixing assembly (46) comprises a servo motor (461), inner stirring blades (462), two groups of connecting rings (464) and a plurality of outer stirring blades (465); the servo motor (461) is fixed to the top of the housing (451); the output end of the servo motor (461) is fixedly connected to the inner stirring blades (462); the inner stirring blades (462), the connecting rings (464) and the outer stirring blades (465) are all arranged inside the housing (451); the two groups of connecting rings (464) are arranged at At the top and bottom of the shell (451), the connecting ring (464) is rotatably connected to the shell (451); the inner stirring blade (462) is connected to a transmission part (463); the transmission part (463) is also connected to the connecting ring (464) located at the top of the shell (451); a plurality of the outer stirring blades (465) are fixed between the two groups of connecting rings (464); and the bottom of the inner stirring blade (462) is rotatably connected to the connecting ring (464) located at the bottom of the shell (451).

9. The wafer-level chip packaging device according to claim 8, characterized in that: The temperature sensor (61) and the camera (62) are fixed to the bottom of the third connecting seat (44), and the temperature and humidity sensor is fixed inside the frame (1), close to one side of the dispensing mechanism (4).

10. A packaging method for a wafer-level chip packaging device, implemented based on the wafer-level chip packaging device according to claim 9, characterized in that: The packaging method of the wafer-level chip packaging device is as follows: Step 1: The robot places the wafer to be glued on the rack (21), and the loading assembly (22) and the unloading assembly (24) transfer the wafer to be glued to the clamping mechanism (3), and the clamping mechanism (3) fixes and clamps the wafer to be glued; Step 2: Controlling the glue dispensing mechanism (4) to dispense glue to the wafer clamped on the clamping mechanism (3), the collection and analysis module obtains the glue temperature, glue shape and the temperature and humidity inside the rack (1), and adjusts the temperature of the glue entering the shell (451) and the temperature of the temperature control plate (33) according to the obtained data; Step 3: Control the unloading component (24) to unload the wafers after dispensing, and collect them by the robot.

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